MLPC plated electrode multi-terminal capacitor

Abstract

To reduce the ESR and improve the parallel effect in the smaller volume in a MLPC with multiple electroplated terminals.SOLUTION: A MLPC with multiple electroplated terminals includes a case and a multilayer core 5. The case includes a bottom case 101 and a top case. An accommodating cavity is provided in the bottom case, and a through hole 1011 is provided in the bottom surface of the accommodating cavity. The multilayer core is hermetically sealed in the accommodating cavity of the case. An anode lead-out part 6 and a cathode lead-out part 7 for leading out electrodes are respectively provided at both ends of the bottom of the accommodating cavity, the anode lead-out part and the cathode lead-out part passing through the case. A positive plated terminal and a first negative plated terminal 3 formed by electroplating are respectively provided at both outer ends of the case. A second negative plated terminal formed by electroplating is provided at the through hole of the bottom of the case. The inner side of the second negative plated terminal passes through the through hole to be connected to a conductive adhesive on a surface of a multilayer core cathode area.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to the technical field of capacitors, and more particularly to MLPC plated layer type multi-terminal capacitors. [Background technology]

[0002] MLPC conductive polymer multilayer capacitors are primarily used in consumer electronics products such as laptops, mobile phones, and network communications. As electronic components become thinner worldwide, the size of capacitor products is also changing. Traditional MLPC capacitors are packaged using EME epoxy molding compound, with lead frames used to extend the positive and negative terminals from the core. The exposed lead frames are then bent to form the positive and negative terminals. For conventional MLPC capacitors with a height D2 of 1.9mm or 1.4mm, the lead frames are welded to the pole pieces and then bent. MLPC capacitors have a sufficiently thick EME package to prevent damage to the capacitor body when bending the pins. When the total height of a capacitor is limited to 1.0mm or 1.2mm, using a bent lead frame results in a capacitor body that is too thin, which can damage the capacitor body when bending the pins. Therefore, due to process and size limitations, it is impossible to manufacture ultra-thin capacitors in micro-scale, and multilayer capacitors with thicknesses of less than 0.8mm are not possible. Bending the lead frame occupies a certain amount of space, increasing the thickness of the capacitor and affecting the product's structure and characteristics, making it impossible to mass-produce thin capacitors. Furthermore, in conventional multilayer capacitors, the positive and negative electrodes are connected via the lead frame, with the positive electrode welded and the negative electrode glued with silver paste and then drawn out. Thinning capacitors imposes limitations on product thickness and design, resulting in poor parallel effect and traditional equivalent series resistance that cannot meet industry demand. Therefore, how to improve the parallel effect, increase capacitance, and reduce capacitor ESR and resistance in a smaller volume has become a problem that needs to be solved. Summary of the Invention

[0003] To solve the above technical problems, the present invention provides an MLPC plated layer electrode (electrode formed by electroplating) multi-terminal capacitor. By forming the positive and negative electrode terminal structures as lead electrodes by electroplating, the product can be made thinner and the parallel current of the negative electrode can be shunted. This improves the parallel effect of the capacitor and reduces the equivalent series resistance, solving the problem of limited pin bending and poor parallel effect after the capacitor is thinned.

[0004] The present invention solves the technical problem by the following technical means. An MLPC plated-layer electrode multi-terminal capacitor including a case and a laminated core, the case consisting of a bottom case and a top case, a chamber provided in the bottom case, a through-hole provided in the bottom surface of the chamber, the laminated core sealed within the chamber of the case, and an anode lead-out portion and a cathode lead-out portion provided at both ends of the bottom of the chamber, which pass through the case and serve to lead out electrodes. The capacitor further includes a positive plated terminal, a first negative plated terminal, and a second negative plated terminal; the positive electrode plating terminal and the first negative electrode plating terminal are formed on outer surfaces of both ends of the case by electroplating, the positive electrode plating terminal is electrically connected to the anode lead-out portion, and the first negative electrode plating terminal is electrically connected to the cathode lead-out portion; the second negative electrode plated terminal is formed on the outer bottom surface of the case by electroplating, and the second negative electrode plated terminal is electrically connected to the laminated core through the through hole; The positive electrode plating terminal, the first negative electrode plating terminal, and the second negative electrode plating terminal are provided with an interval therebetween.

[0005] Furthermore, one end of the laminated core is a cathode region, the other end is an anode region, a conductor is filled in the gap between the surface of the cathode region and the inner wall of the accommodating chamber, a fixing adhesive is filled on the side and top surfaces of the conductor, and the second negative electrode plating terminal is connected to the conductor.

[0006] The anode lead-out portion has one end connected to the anode region and the other end passing through the case to be connected to the positive electrode plating terminal, the cathode lead-out portion has one end connected to the cathode region and the other end passing through the case to be connected to the first negative electrode plating terminal, and the second negative electrode plating terminal includes a flat portion, a bent portion, and a recessed portion, the flat portion being attached to the outer bottom surface of the bottom case, the bent portions being attached to both outer surfaces of the bottom case, and the recessed portions being attached to the conductor and the inner wall of the through hole.

[0007] Furthermore, the through hole is located in the center of the bottom case, and the second negative electrode plated terminal further includes a protrusion extending along one side of the flat portion and toward the first negative electrode plated terminal, and the width of the protrusion is greater than the width of the flat portion.

[0008] Furthermore, the through hole is filled with a conductor, the second negative electrode plating terminal extends along the inner wall of the through hole to the conductor, and the shape of the through hole is one of a circle, an ellipse, and a polygon.

[0009] Advantages and Positive Effects of the Invention 1. The present invention provides an MLPC plated layer type electrode multi-terminal capacitor, in which the positive and negative electrode terminal structures are formed as lead-out electrodes on the surface of the case by electroplating, thereby achieving a thin product. The common lead-out of the negative electrode multi-terminals improves the parallel effect of the capacitor and reduces the effect of equivalent series resistance. This solves the problem of limited pin bending and poor parallel effect after the capacitor is thinned. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram of the top surface three-dimensional structure of the present invention. [Figure 2] 1 is a schematic diagram of a bottom three-dimensional structure of the present invention. [Figure 3] FIG. 1 is a schematic diagram of a locally cleaved conformation of the present invention. [Figure 4] 2 is a schematic diagram of the three-dimensional structure of the bottom case of the present invention. FIG. [Figure 5]FIG. 2 is a cross-sectional view of the present invention taken along the X-axis. [Figure 6] FIG. 2 is a cross-sectional view of the present invention taken along the Y-axis. [Figure 7] FIG. 7 is an enlarged schematic view of the A region in FIG. 6 according to the present invention. [Figure 8] 7 is an enlarged schematic view of another embodiment of the part A in FIG. 6 of the present invention. FIG.

[0011] Explanation of symbols 1, case; 2, positive electrode plated terminal; 3, first negative electrode plated terminal; 4, second negative electrode plated terminal; 5, laminated core; 6, anode lead-out portion; 7, cathode lead-out portion; 8, conductor; 9, fixing adhesive; 10, filler; 101, bottom case; 102, top case; 401, flat portion; 402, folded portion; 403, recessed portion; 404, protrusion portion; 501, anode region; 502, cathode region; 503, insulating adhesive; 1011, through hole; 1012, housing chamber. DETAILED DESCRIPTION OF THE INVENTION

[0012] The embodiments of the present invention will be described in more detail with reference to the drawings: Hereinafter, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and does not in any way limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without any creative effort also fall within the protection scope of the present invention.

[0013] In describing the present invention, orientations or positional relationships indicated by terms such as "both sides," "above," "below," "top," "bottom," "inside," "outside," etc., are based on the orientations or positional relationships shown in the drawings and are intended to simplify the present invention and description, and are not intended to indicate or imply that the devices or components referenced have a particular orientation, or that they are required to be constructed or operate in a particular orientation, and should not be understood as limiting the present invention. In describing the present invention, unless otherwise specified, "plurality" means two or more. Also, the term "comprises" and any variations thereof means "comprises at least."

[0014] In describing the present invention, the terms "first", "second", etc. are used to indicate distinction and not to denote chronological order.

[0015] In the description of the present invention, unless otherwise specified, the terms "formed," "connected," and "coupled" should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, an integrally molded connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or internal communication between two components. Those skilled in the art can specifically understand the specific meanings of the above terms in the present invention.

[0016] The embodiments of the present invention will be described in more detail with reference to the drawings: Hereinafter, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and does not in any way limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without any creative effort also fall within the protection scope of the present invention.

[0017] 1 to 8, the MLPC plated-layer electrode multi-terminal capacitor includes a case 1 and a laminated core 5. The case 1 is composed of a bottom case 101 and a top case 102. The bottom case 101 is provided with a housing chamber 1012, and a through-hole 1011 is provided in the bottom surface of the housing chamber 1012. The laminated core 5 is sealed in the housing chamber 1012 of the case 1. An anode lead-out portion 6 and a cathode lead-out portion 7 are provided at both ends of the bottom of the housing chamber 1012, respectively, which penetrate into the case 1 and lead out the electrodes. The capacitor further includes a positive plated terminal 2, a first negative plated terminal 3, and a second negative plated terminal 4. The positive plated terminal 2 The positive electrode plated terminal 2 is electrically connected to the anode lead-out portion 6, the first negative electrode plated terminal is electrically connected to the cathode lead-out portion 7, the second negative electrode plated terminal 4 is formed on the outer bottom surface of the case 1 by electroplating, and the second negative electrode plated terminal 4 is electrically connected to the laminated core 5 via a through hole 1011, and the positive electrode plated terminal 2, the first negative electrode plated terminal 3, and the second negative electrode plated terminal 4 are arranged at intervals.

[0018] In this embodiment, one end of the laminated core 5 is a cathode region 502, and the other end is an anode region 501; a conductor 8 is filled in the gap between the surface of the cathode region 502 and the inner wall of the accommodation chamber 1012; a fixing adhesive 9 is filled between the side and top surfaces of the conductor 8 and the inner wall; and the second negative electrode plating terminal 4 is connected to the conductor 8. One end of the anode lead-out portion 6 is connected to the anode region 501, and the other end passes through the case 1 and is connected to the positive electrode plating terminal 2. One end of the cathode lead-out portion 7 is connected to the cathode region 502, and the other end passes through the case 1 and is connected to the first negative electrode plating terminal 3.

[0019] As shown in Figures 3 and 4, the case 1 is composed of a bottom case 101 and a top case 102, and the bottom case 101 has a receiving chamber 1012. In this embodiment, the receiving chamber 1012 is rectangular. Specifically, the shape and size of the receiving chamber 1012 are rectangular grooves that fit the laminated core 5. To assemble the capacitor, silver slurry is first applied to multiple single-pole cathodes, the single-pole cathodes are stacked, and the anodes are welded to obtain the laminated core 5. Then, a conductor 8 is applied to the outer surface of the cathode region 502 of the laminated core 5. The conductor 8 can be silver paste or a conductive adhesive. In this embodiment, the conductor 8 is specifically silver paste. The laminated core 5 is hermetically sealed in the receiving chamber 1012 of the case 1. The gap between the surface of the cathode region 502 of the laminated core 5 and the inner wall of the receiving chamber 1012 is filled with the conductor 8. A fixing adhesive 9 is filled around the outside of the conductor 8. During assembly, the laminated core 5 coated with silver paste is mounted in the housing chamber 1012, and the gap between the outer surface of the laminated core 5 and the inner wall of the housing chamber 1012 is filled with a fixing adhesive 9 to fix the laminated core 5 in the housing chamber 1012. The top case 102 then covers and seals the upper opening of the housing chamber 1012 so that the bottom case 101 and the top case 102 are joined together. This maintains an airtight seal within the housing chamber 1012. Filling the inner wall of the case 1 with the fixing adhesive 9 prevents external water vapor from entering the laminated core 5 and damaging its conductive polymer layer, improving the stability of the capacitor. In another embodiment, an inert gas may be injected into the internal gap to improve the stability. In some embodiments, the case 1 may be integrally injection molded to seal the laminated core 5 and obtain a multilayer capacitor.

[0020] In this embodiment, the anode lead 6 and the cathode lead 7 are made of one of copper foil, aluminum foil, and silver foil, preferably copper foil. The inside of the anode lead 6 and the anode region 501 are connected by applying silver slurry or electrically connected by welding, and are led out as an anode. The inside of the cathode lead 7 and the outer surface of the laminated core 5 are electrically connected by connecting them with silver slurry, and are led out as a cathode.

[0021] In this embodiment, the exposed ends of the anode lead 6 and the exposed ends of the cathode lead 7 on the surface of the case 1 are electroplated to form a positive electrode terminal 2 and a first negative electrode terminal 3, each having a specific shape. The positive electrode terminal 2 and the first negative electrode terminal 3 obtained by electroplating are connected to the anode lead 6 and the cathode lead 7, respectively, to form positive and negative electrode lead electrodes. The positive electrode terminal 2 and the first negative electrode terminal 3 formed by electroplating are bonded together to cover the outer surfaces of both ends of the case 1. The thickness of the positive and negative electrode terminals formed by electroplating can be freely set according to actual needs and is not limited by the terminal thickness. This allows for a thinner capacitor, thereby overcoming the limited bending size constraints of the positive and negative terminals of conventional multilayer capacitors. Electrode terminals of any thickness can be designed for any size of multilayer capacitor, reducing the thickness of the electrode terminals without changing the overall height of the capacitor, increasing the number of capacitor pole pieces, and improving capacitance, achieving the design effects of lightness, thinness, and large capacity.

[0022] In an alternative embodiment, the shape of the through holes 1011 may be one or a combination of a circle, an ellipse, a polygon, etc. In this embodiment, the shape of the through holes is elliptical, and the number of the through holes 1011 is not limited.

[0023] In one embodiment, a portion of the conductor 8 seals the opening of the through-hole 1011, and the entire interior of the through-hole 1011 is filled with the conductor 8. The conductor 8 is drawn out through the through-hole 1011, thereby increasing the current conduction area, reducing impedance, increasing electron flow, improving parallel current extraction of the negative electrode, and increasing ripple current. An extraction electrode, i.e., the second negative electrode plated terminal 4, is formed at the opening of the through-hole 1011 by electroplating. The negative electrode extraction (output) of the entire capacitor is formed by the parallel joint output of the first negative electrode plated terminal 3 and the second negative electrode plated terminal 4. The second negative electrode plated terminal 4 is formed by electroplating. The second negative electrode plated terminal 4 includes a flat portion 401 and a bent portion 402. The flat portion 401 is attached to the outer surface of the bottom of the bottom case 101 and is directly connected to the conductor 8 filled in the through-hole 1011. The bent portions 402 are attached to the outer surfaces of both sides of the bottom case 101. In another embodiment, the through-hole 1011 is not filled with the conductor 8. In this case, the second negative electrode plating terminal 4 further includes a recessed portion 403. The recessed portion 403 is connected to the flat portion 401. The recessed portion 403 of the second negative electrode plating terminal 4 extends along the inner wall of the through-hole 1011 to the conductor 8. In some embodiments, the outside of the recessed portion 403 is electrically connected to the conductor 8, and the inside of the recessed portion 403 is electrically connected to the filler 10. Here, the filler 10 is filled into the inside of the recessed portion 403 in a fitted manner. The filler 10 is made of a material with high heat dissipation properties, which improves heat dissipation and enhances heat dissipation. The filler 10 is made of a highly conductive material such as silver, gold, or copper. Filling with a good conductor reduces resistivity and improves heat dissipation due to parallel current derivation of the negative electrode.

[0024] Specifically, the second negative electrode terminal 4 is formed by electroplating. The shape of the second negative electrode terminal 4 is not limited. The flat portion 401 of the second negative electrode terminal 4 is attached to the outer surface of the bottom of the bottom case 101. The flat portion 401 is connected to the conductor 8 in the receiving chamber 1012 via the recessed portion 403 and the through-hole 1011 to form a negative electrode lead. The negative electrode lead of the entire capacitor is formed by the joint output of the first negative electrode terminal 3 and the second negative electrode terminal, which increases the parallel effect of the capacitor and reduces the equivalent series resistance of the multilayer capacitor. The positive electrode terminal 2, the first negative electrode terminal 3, and the second negative electrode terminal 4 are formed by electroplating, which overcomes traditional size constraints and reduces the height of the capacitor to 0.3-1.0 mm. Forming the electrode terminals by electroplating in this way enables a thinner capacitor design, replaces traditional bent electrode terminals, and reduces the equivalent series resistance by combining them in parallel with the plated terminals.

[0025] The outside of the second negative electrode plated terminal 4 extends to the surface of the bottom of the case 1. The positive electrode plated terminal 2, the first negative electrode plated terminal 3, and the second negative electrode plated terminal 4 are each attached to the surface of the case 1 and formed integrally with the case 1.

[0026] In this embodiment, the through hole 1011 is located in the center of the bottom surface of the bottom case 101. The second negative electrode plated terminal 4 further includes a protrusion 404 extending along one side of the flat portion 401 and facing the first negative electrode plated terminal 3. The width of the protrusion 404 is greater than the width of the flat portion 401. The provision of the protrusion 404 reduces inductance, improves high ripple current resistance, increases the heat dissipation area, improves heat dissipation efficiency, increases the welding area, and improves stability.

[0027] When mounting a capacitor on a PCB, in addition to the positive terminal 2 and the first negative terminal 3, a second negative terminal 4 is welded to the PCB. The parallel routing of the second negative terminal 4 reduces the equivalent series resistance of the multilayer capacitor, while welding the second negative terminal 4 to the PCB improves the capacitor's stability and heat dissipation performance. The positive terminal 2, the first negative terminal 3, and the second negative terminal 4 are all formed by electroplating. The thickness of the electroplated positive and negative terminals can be freely set according to actual needs, not limited by the thickness of the multilayer capacitor. This allows for thinner multilayer capacitors, thereby overcoming the limited bending size constraints of the positive and negative terminals of conventional multilayer capacitors. This allows for the design of electrode terminals of any thickness, reducing the thickness of the electrode terminals without changing the overall height of the capacitor, increasing the capacitor pole pieces, and improving capacitance, achieving the design effects of lightness, thinness, and large capacity.

[0028] It should be noted that the examples described in the present invention are illustrative and not limiting. Therefore, the present invention is not limited to the examples described in the specific embodiments. Any other embodiments obtained by those skilled in the art based on the technical means of the present invention are all within the protection scope of the present invention.

Claims

1. An MLPC plated layer type electrode multi-terminal capacitor including a case (1) and a laminated core (5), The case (1) is composed of a bottom case (101) and a top case (102), the bottom case (101) is provided with a storage chamber (1012), a through-hole (1011) is provided in the bottom surface of the storage chamber (1012), the laminated core (5) is sealed in the storage chamber (1012) of the case (1), and an anode lead-out portion (6) and a cathode lead-out portion (7) that penetrate into the case (1) are provided at both ends of the bottom of the storage chamber (1012), The capacitor further includes a positive electrode plating terminal (2), a first negative electrode plating terminal (3), and a second negative electrode plating terminal (4); The positive electrode plating terminal (2) and the first negative electrode plating terminal (3) are formed on the outer surfaces of both ends of the case (1) by electroplating, respectively, and the positive electrode plating terminal (2) is electrically connected to the anode lead-out portion (6), and the first negative electrode plating terminal is electrically connected to the cathode lead-out portion (7). The second negative electrode plated terminal (4) is formed on the outer bottom surface of the case (1) by electroplating, and the second negative electrode plated terminal (4) is electrically connected to the laminated core (5) via the through hole (1011); The positive electrode plating terminal (2), the first negative electrode plating terminal (3), and the second negative electrode plating terminal (4) are provided at intervals, One end of the laminated core (5) is a cathode region (502), and the other end is an anode region (501). A conductor (8) is filled in the gap between the surface of the cathode region (502) and the inner wall of the storage chamber (1012). A fixing adhesive (9) is filled between the side and top surfaces of the conductor (8) and the inner wall. The second negative electrode plating terminal (4) is connected to the conductor (8). The second negative electrode plating terminal (4) comprises a flat portion (401), a bent portion (402), and a recessed portion (403), the flat portion (401) being attached to the outer bottom surface of the bottom case (101), the bent portion (402) being attached to both outer surfaces of the bottom case (101), and the recessed portion (403) being attached to the conductor (8) and the inner wall of the through hole (1011).

2. 2. The MLPC plated layer type electrode multi-terminal capacitor according to claim 1, wherein one end of the anode lead-out portion (6) is connected to the anode region (501), the other end of the anode lead-out portion (6) passes through the case (1) and is connected to the positive plated terminal (2), and one end of the cathode lead-out portion (7) is connected to the cathode region (502), the other end of the cathode lead-out portion (7) passes through the case (1) and is connected to the first negative plated terminal (3).

3. 2. The MLPC plated layer type electrode multi-terminal capacitor of claim 1, wherein the through hole (1011) is located in the center of the bottom case (101), the second negative electrode plating terminal (4) further includes a protrusion (404) extending along one side of the flat portion (401) and toward the first negative electrode plating terminal (3), and the width of the protrusion (404) is greater than the width of the flat portion (401).

4. 2. The MLPC plated layer type electrode multi-terminal capacitor according to claim 1, wherein the recessed portion (403) is connected to the flat portion (401), the recessed portion (403) extends along the inner wall of the through hole (1011) to the conductor (8), and the outside of the recessed portion (403) is electrically connected to the conductor (8).

5. 5. The MLPC plated layer type electrode multi-terminal capacitor according to claim 4, wherein a filler (10) is fitted inside the recess (403), and the filler (10) has heat dissipation and conductivity.

6. 2. The MLPC plated layer type electrode multi-terminal capacitor according to claim 1, wherein the second negative electrode plated terminal (4) extends to the conductor (8) along the inner wall of the through hole (1011).

7. 2. The MLPC plated layer type electrode multi-terminal capacitor according to claim 1, wherein the through holes (1011) have a circular, elliptical or polygonal shape.

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