Heat dissipation device and communication device

Abstract

The present application provides a heat dissipation apparatus and a communication device. The heat dissipation apparatus (3) includes a housing (31) and a heat sink assembly (32). The housing (31) includes a housing cavity for housing a heating component (2). The heating component (2) is inserted into the housing cavity along a first direction. The heat sink assembly (32) includes a heat sink (321), a support (322), a sliding component (323) and a linkage part (324). The support (322) is fixed to the housing (31). The heat sink (321) is connected to the support (322) by using the sliding component (323). The housing (31) includes a first side (311) and a second side (312) facing each other, and the heat sink is disposed on the first side (311). The sliding component (323) includes an inclined slot (3231) and a sliding block (3232). The inclined slot (3231) gradually approaches the second side (312) of the receiving part (31) along a first direction. One end of the linkage part (324) is attached to the heat sink (321), and the other end is disposed in the receiving cavity. When the heating component (2) is inserted into the receiving cavity, the linkage part (324) is triggered to drive the heat sink (321) to move along the first direction. The sliding block (3232) slides against the inclined slot (3231) to drive the heat sink (321) to move toward the second side (312). When the heating component (2) is fully inserted into the receiving part (31), the heat sink (321) is attached to the heating component (2). This helps to reduce the thermal contact resistance between the heat sink (321) and the heating component (2).

Description

[Technical Field]

[0001] (Reference to Related Application) This application claims priority to Chinese Patent Application No. 202110300084.0, entitled "HEAT DISSIPATION APPARATUS AND COMMUNICATION DEVICE," filed with the State Intellectual Property Office of China on March 22, 2021, which is incorporated herein by reference in its entirety.

[0002] (Technical field) The present application relates to the field of electronic device technology, and in particular to heat dissipation devices and communication devices. [Background technology]

[0003] Various electronic components are disposed in a communication device. The electronic components include electronic components that generate or produce heat during operation (hereinafter referred to as heating components for short). To ensure the normal operation of the aforementioned heating components, a heat sink needs to be used to conduct the heat generated by the heating components. When electronic components are used, several pluggable heating components are usually used. For example, optical module components need to be plugged in and unplugged in many communication devices and require heat dissipation. For another example, several hard disks also need to be plugged in and unplugged in a server and also require heat dissipation.

[0004] An optical module is used as an example. In the prior art, a heat sink is usually mounted above the optical module. Due to the pluggable structure of the optical module, the heat sink is usually attached using a clip or elastically attached using a spring screw or the like. During the process of plugging the optical module, the optical module needs to overcome the buckling force of the clip or spring screw to lift the heat sink. The buckling force allows the heat sink to be attached to the optical module for heat dissipation. In the prior art, to ensure that the optical module can be plugged into the optical cage of the optical module, the buckling force cannot be set too large. Otherwise, problems may occur such as the optical module being unable to be plugged in or the optical module being damaged. However, if the buckling force is insufficient, the adhesion effect between the heat sink and the optical module is poor. As a result, the thermal contact resistance between the optical module and the heat sink is large, and the heat dissipation effect of the heat sink is poor. Summary of the Invention

[0005] The present application provides a heat dissipation apparatus and a communication device that reduces the thermal contact resistance between the heat dissipator and the heating component, improves the heat transfer performance between the heat dissipator and the heating component, reduces the difficulty of plugging and unplugging the heating component, and facilitates plugging and unplugging the heating component.

[0006] According to a first aspect, the present application provides a heat dissipation device. The heat dissipation device is configured to receive a plug-in heating component and dissipate heat for the heating component. Specifically, the heat dissipation device includes a housing and a heat sink assembly. The housing includes a housing cavity that houses the heating component. The heating component is inserted into the housing cavity, and the heating component may be fixed to the housing. For ease of description, the direction in which the heating component is inserted into the housing cavity may be considered as the first direction.

[0007] The heat sink assembly includes a heat sink, a support, a sliding component, and a linkage part. The support is fixed to the housing, and the heat sink is connected to the support using the sliding component. The housing includes a first side and a second side facing each other along a second direction. The heat sink is disposed on the first side of the housing. The second side is equal to the side of the housing that is away from the heat sink. The second direction is perpendicular to the first direction. The sliding component includes an inclined slot and a sliding block. The inclined slot gradually approaches the second side of the housing along the first direction. Therefore, under the inductive effect of the inclined slot, when the heat sink moves in the first direction, it simultaneously moves in a direction closer to the second side, i.e., the heat sink may move diagonally downward. One end of the linkage part is attached to the heat sink, and the other end is disposed within the housing cavity. When the heating component is inserted into the housing cavity, the heating component triggers the linkage portion, which then drives the heat sink to move along the first direction. In this case, the sliding block slides along the inclined slot, driving the heat sink to move toward the second side, i.e., toward the heating component. When the heating component is fully inserted into the housing, the heat sink is attached to the heating component. In this solution, when the heating component is not inserted into the housing, the gap between the heat sink and the second side is large, even greater than the thickness of the heating component along the second direction. Horizontal friction between the heating component and the heat sink is not easily generated. In this case, the heating component can be easily inserted into the housing. This reduces the difficulty of inserting and removing the heating component and helps users insert and remove the heating component. When the heating component is fully inserted into the housing, the heat sink and the heating component can be tightly attached. This helps to reduce the thermal contact resistance between the heat sink and the heating component, and improve the heat transfer performance between the heat sink and the heating component.

[0008] When the sliding components are particularly arranged, the inclined slots are arranged on the heat sink, and the sliding blocks are arranged on the support. Alternatively, in another embodiment, the inclined slots are arranged on the support, and the sliding blocks are arranged on the heat sink. The specific method of arranging the sliding components is not limited in this application. In addition, the cross section of the sliding blocks may be a circle, an ellipse, a polygon, etc. This is also not limited in this application.

[0009] The support and housing of the heat dissipation device may be an integrated structure. For example, techniques such as sheet metal or injection molding may be used to form the housing and support into an integrated frame structure. Alternatively, the housing and support may be fixedly connected to form the integrated structure by methods such as welding, riveting, threaded connection, or clamping.

[0010] When the heat dissipation device is particularly arranged, a first reset member may be further arranged between the heat dissipation device and the support. The first reset member has a reset force along the second direction. Specifically, the first reset member is configured to drive the heat dissipation device to move in a direction away from the second side when the heating component is removed from the accommodating cavity. In this solution, under the action of the first reset member, the heat dissipation device may move in a direction away from the second side when the heating component is removed from the accommodating cavity. In other words, the heat dissipation device moves in a direction away from the second side along the inclined slot. Therefore, when the heating component is inserted or removed, the distance between the heat dissipation device and the second side is large to reduce the difficulty of inserting or removing the heating component.

[0011] In another technical solution, the heat dissipation device may further include a second reset member disposed between the heat dissipation device and the support. The second reset member has a reset force moving away from the first direction. Specifically, when the heating component is removed from the accommodating cavity, the second reset member is configured to drive the heat dissipation device to move away from the direction in which the heating component is inserted. In this solution, under the action of the second reset member, when the heating component is removed from the accommodating cavity, the heat dissipation device may move toward a direction away from the second side surface. In other words, specifically, the heat dissipation device moves toward a direction away from the second side surface along the inclined slot. Therefore, when the heating component is inserted or removed, the distance between the heat dissipation device and the second side surface is large to reduce the difficulty of inserting or removing the heating component.

[0012] In certain embodiments, only the first reset member or the second reset member may be disposed for the heat dissipation device. Alternatively, both the first reset member and the second reset member may be disposed. The first reset member may be a resilient structure such as a spring, an elastic strip, or a spring plate, or may be a drive structure such as a lever that must be configured with a drive device. This is not a limitation in the present application. Similarly, the second reset member may be a resilient structure such as a spring, an elastic strip, or a spring plate, or may be a drive structure such as a lever that must be configured with a drive device. This is not a limitation in the present application.

[0013] In another technical solution, the second reset member may be an elastic heat-conducting strip, one end of which is connected to the heat sink and the other end of which is connected to the support, and the elastic heat-conducting strip may conduct heat from the heat sink to improve the heat dissipation effect of the heat dissipation device.

[0014] In order to further improve the heat dissipation effect of the heat dissipation device, the support connected to the elastic heat conductive strip is a heat conductive part of the support, in this case, the heat can be further conducted to the heat conductive part, further increasing the heat dissipation area and improving the heat dissipation effect of the heat dissipation device.

[0015] The surface of the heat sink, which is attached to the heating component, further includes a flexible heat conductive layer, which is flexible to a certain extent and can be tightly packed between the heat sink and the heating component, thereby improving the thermal connection effect between the heat sink and the heating component, reducing the thermal resistance and further improving the heat dissipation effect of the heat sink on the heating component.

[0016] In addition, the heat conduction protrusions are located at positions on the heat sink that are attached to the heating component. When the heating component is fully inserted into the receiving cavity, the heat conduction protrusions are attached to the heating component. This solution can reduce the probability of structural interference and help improve the integration of the heat dissipation device.

[0017] When the sliding components are specifically arranged, the heat dissipation device may include multiple groups of sliding components, which are symmetrically arranged on both sides of the heat dissipation device, and the symmetry axes of the multiple groups of sliding components are parallel to the first direction. In this solution, the multiple groups of sliding components are arranged so that the sliding process of the heat dissipation device is stable.

[0018] The specific structure of the linkage portion is not limited. In a specific technical solution, the linkage portion may be a fixed protrusion. The fixed protrusion is fixed to a surface of the heat sink that faces the second side. The fixed protrusion extends into the housing. When the heating component is inserted into the housing, the heating component abuts against the fixed protrusion, driving the fixed protrusion to move along the first direction. As the heat sink is further driven to move toward the heating component, the heat sink abuts against the heating component.

[0019] The fixed protrusions may be fixedly mounted on the heat sink, and may be connected and fixed in ways such as welding, riveting, clamping, etc. Alternatively, the fixed protrusions and the heat sink may be of an integrated structure to simplify the structure of the heat sink assembly and simplify the assembly technique of the heat dissipation device.

[0020] The heating component includes an abutment portion that abuts against the fixed protrusion, and is located at an end of the heating component that faces the first direction. When the heating component is fully inserted into the receiving cavity, the abutment portion abuts against the fixed protrusion. In this solution, the heating component can be protected from being damaged by the fixed protrusion. This ensures the service life of the heating component. For example, the abutment portion includes a structure such as a steel plate or steel block.

[0021] The specific number of the housing sections in the heat dissipation device is not limited. For example, the heat dissipation device may include at least two housing sections. In the at least two housing sections, a heat dissipator assembly may be disposed correspondingly for some of the housing sections, and no heat dissipator assembly may be disposed for some of the housing sections. Alternatively, one heat dissipator assembly may be disposed correspondingly for each housing section. This is not limited in the present application. Specifically, the selection may be made based on the actual application scenario of the heat dissipation device.

[0022] When the at least two housings are specifically arranged, the at least two housings may be arranged side by side along a third direction. The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction. Alternatively, the at least two housings may be arranged in a stacked manner along the second direction. In this case, the heat sink assembly may be arranged in the area between the housings. Indeed, alternatively, one heat sink assembly may be arranged correspondingly for each housing.

[0023] In the technical solution of the present application, the specific arrangement method of the at least two receiving parts and the corresponding arrangement of the heat sink assembly may be selected based on the actual product requirements, which is not limited in the present application.

[0024] When the heat dissipation device includes at least two housings, adjacent housings are fixed to form an integrated structure. In other words, the at least two housings may be designed as an integrated structure. The integrated structure in this specification may be an integrally formed structure, or may be an integrated structure obtained through connection in a manner such as welding, clamping, or screw connection. This is not limited in this application. In this solution, the distance between the housings is small. This helps improve the integration degree (integration degree) of the heat dissipation device and improves the overall strength of the heat dissipation device, so that the heat dissipation device is not easily deformed.

[0025] Indeed, in other embodiments, the receptacle may be positioned separately, in other words, the location of the receptacle may be positioned based on where the heating component is actually located.

[0026] When the heat dissipation device includes at least two heat dissipation device assemblies, the supports of the at least two heat dissipation device assemblies may be of an integrated structure to improve the integrity of the heat dissipation device and simplify the assembly technique of the heat dissipation device. Alternatively, adjacent portions of the supports of the at least two heat dissipation assemblies may be of an integrated structure. For example, when the support includes two side panels facing each other along the third direction, the heat dissipator is disposed between the two side panels, and the adjacent side panels of the two adjacent heat dissipators are of an integrated structure, thereby simplifying the structure of the heat dissipation device. Alternatively, when the support further includes a tail support, the tail support of the heat dissipation assembly may be of an integrated structure.

[0027] Additionally, when at least two housings are arranged in a row along the third direction, the support includes side panels arranged on both sides of the radiator along the third direction. The side panels of two adjacent radiators are fixedly connected to the housings by using buckles. Because the housings include fastening portions and the side panels are fastened to the fastening portions by using buckles, the radiator assembly can be considered to be fixed on the housings.

[0028] According to a second aspect, the present application further provides a communication device. The communication device includes a heating component and a heat dissipation device according to any one of the above technical solutions. The heating component is inserted into the housing of the heat dissipation device. This solution provides good heat dissipation effect of the heating component, which helps improve the operating effect and service life of the heating component. In addition, the process of inserting and removing the heating component is easy.

[0029] In certain embodiments, the specific type of the heating component is not limited in this application, for example, the heating component may include any type, such as an optical module, a chip, a circuit module, or a card module. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a schematic diagram of a partial structure of a communication device according to an embodiment of the present application;

[0031] [Figure 2] 1 is a schematic diagram of a structure of a heat dissipation device on a side surface according to an embodiment of the present application;

[0032] [Figure 3] 1 is a schematic diagram of a first structure of a heat dissipation device on a side surface in use according to an embodiment of the present application;

[0033] [Figure 4] 1 is a schematic diagram of a first structure of a heat dissipation device on a plan view in use according to an embodiment of the present application;

[0034] [Figure 5] FIG. 10 is a schematic diagram of a second structure of a heat dissipation device on a side surface in use according to an embodiment of the present application.

[0035] [Figure 6] FIG. 10 is a schematic diagram of a second structure of a heat dissipation device in plan view in use according to an embodiment of the present application;

[0036] [Figure 7] 10 is a schematic diagram of a third structure of a heat dissipation device on a plan view in use according to an embodiment of the present application;

[0037] [Figure 8] FIG. 10 is a schematic diagram of a third structure of a heat dissipation device on a side view in use according to an embodiment of the present application.

[0038] [Figure 9] FIG. 10 is a schematic diagram of a fourth structure of a heat dissipation device on a side view in use according to an embodiment of the present application.

[0039] [Figure 10] FIG. 10 is a schematic diagram of a fifth structure of a heat dissipation device on a side view in use according to an embodiment of the present application.

[0040] [Figure 11] 1 is a schematic diagram of a structure of a heat dissipation device on a back view according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0041] (Explanation of symbols) 1. Housing 2. Heating component 3. Heat dissipation apparatus 31 Accommodating part 311 first side surface 312 second side surface 32 heat dissipator assembly 321 heat dissipator 3211 flexible heat conducting layer 3212 heat conducting protrusion 3213 liquid inlet 3214 liquid outlet 322 support 3221 support body 3222 tail support 3223 Side panel 323 sliding component 3231 oblique slot 3232 sliding block 324 Linkage part 325 first resetting member 326 Second resetting member 327 Elastic strip 4. Circuit board 5. Buckle

[0042] The terms used in the following embodiments are intended merely to describe particular embodiments, but are not intended to limit the present application. As used in this specification and the appended claims of this application, the singular terms "one," "a," and "this" are also intended to include expressions such as "one or more," unless the context clearly dictates otherwise.

[0043] References herein to "embodiments," "particular embodiments," and the like indicate that one or more embodiments of the present application include the particular configuration, structure, or feature described with reference to the embodiment. The terms "including," "having," and variations thereof all mean "including but not limited to," unless specifically emphasized otherwise.

[0044] In communication devices, heat dissipation of plug-in heating components has become an increasing concern. Existing plug-in heating components include various types, including optical modules, chips, circuit modules, card modules, etc. However, with regard to heat dissipation of plug-in heating components, conventional heat dissipation devices still have problems such as large thermal resistance, insufficient heat dissipation effect, or inconvenient plugging and unplugging, and are unable to meet the requirements. Because the heat dissipation problems of plug-in heating components are the same or similar, for ease of description, the following mainly uses optical modules as an example to describe the heat dissipation problems of existing heating components in detail. It should be understood that other related or similar heating components that require heat dissipation also have the same or similar problems.

[0045] Currently, in network communication services, optical modules are integrated modules for converting optical signals to and from electrical signals. They play an important role in the optical fiber communication process and are widely used. When used in optical fiber communication, optical modules generate a large amount of heat. To ensure the normal operation of optical modules, the heat generated by the optical modules needs to be conducted and dissipated in a timely manner. With the development of communication technology, communication speeds are accelerating, the density of service ports is increasing, and the communication speed of optical modules is continuously increasing. In addition, optical modules occupy less space, their power consumption is continuously increasing, and optical modules generate more heat. Therefore, the requirements for optical modules regarding heat dissipation are becoming increasingly high. In particular, it is very important to solve the heat dissipation problem of high-power optical modules in a small space.

[0046] In the prior art, for heat dissipation methods of high-power pluggable heating components, the heat sink and metal housing of the heating component are attached and pressed tightly together using clips. At the attachment point (dry contact point) between the heat sink and the heating component, the outer surfaces of both the heat sink and the heating component have flatness tolerances and manufacturing roughness, so the heat sink and the heating component are not tightly attached. Microscopically, the contact occurs at localized points between the contacting metals. There is a gap between the contacting surfaces, and a large amount of air exists in the gap. As a result, problems such as high thermal resistance between the heat sink and the heating component, insufficient thermal conduction, and insufficient heat dissipation capacity occur. In addition, there is a phenomenon in which the contact pressure is unstable or uncontrollable between the existing heat sink and the heating component. As a result, the contact between the heat sink and the heating component is insufficient, affecting heat dissipation performance.

[0047] In view of this, the technical solution of the embodiments of the present application provides a heat dissipation device and a communication device including a heat dissipation device, to reduce the thermal contact resistance between the heat dissipation device and the heating component, improve the heat transfer performance between the heat dissipation device and the heating component, reduce the difficulty of plugging and unplugging, and facilitate plugging and unplugging the heating component.

[0048] The heat dissipation device and the communication device including the heat dissipation device in the present application will be described in more detail by using specific embodiments with reference to the accompanying drawings. It should be noted that in the embodiments of the present application, the same reference numbers indicate the same components or the same parts. For the same parts in the embodiments of the present application, only one part or component with the reference number may be used as an example in the drawings. It should be understood that the reference number can also be applied to other same parts or components.

[0049] FIG. 1 is a schematic diagram of a partial structure of a communication device according to an embodiment of the present application. As shown in FIG. 1, the communication device includes a housing 1, a heating component 2, and a heat dissipation device 3. The heating component 2 and the heat dissipation device 3 are arranged on the housing 1. The heating component 2 and the heat dissipation device 3 are not necessarily directly connected. For example, the heat dissipation device 3 may be fixed to a circuit board 4, and the heating component 2 is plugged into the heat dissipation device 3, so that the heating component 2 is electrically connected to the heat dissipation device 3. The heating component 2 and the heat dissipation device 3 may be arranged on the housing 1 using the circuit board 4. The heat dissipation device 3 includes a housing 31 for housing the heating component 2, which is plugged into the housing 31 of the heat dissipation device 3. Therefore, the heat sink 321 of the heat dissipation device 3 dissipates heat for the heating component 2 to ensure the normal operation of the heating component 2.

[0050] In the technical solution of the present application, a specific type of communication device is not limited in the present application, and a device capable of signal transmission may be referred to as a communication device. For example, the communication device may include a computing device (e.g., a server), a network device (e.g., a switch), a storage device (e.g., a storage array), or a vehicle-mounted device (e.g., a vehicle-mounted sound box or a vehicle-mounted navigator). A communication device including a plug-in heating component falls within the protection scope of the technical solution of the present application.

[0051] Specifically, the heating component 2 is a pluggable or plug-in heating component 2. The heating component 2 can be plugged into and unplugged from the receiving portion 31 of the heat dissipation device 3. The specific structure of the heat dissipation device 3 will be described in detail below with reference to the accompanying drawings, and will not be described in detail here. In the communication device, a unique heat dissipation device 3 is arranged, so that the heat dissipation effect of the heating component 2 can be improved and the heat dissipation requirements of the heating component 2 can be met. In addition, plugging and unplugging is convenient and labor-saving, and the heating component 2 can be easily plugged and unplugged.

[0052] In this embodiment of the present application, the specific positions of the heat dissipation device 3 and the heating component 2 in the communication device, the connection between the heat dissipation device 3, the heating component 2, and another component, etc. are not limited. Therefore, details will not be described herein. In addition, those skilled in the art will understand that the communication device may include multiple components arranged inside the device to provide a user with required functions. This is not particularly limited in the present application. Those skilled in the art may adjust the position, specific structure, etc. of each component based on actual requirements.

[0053] In certain embodiments, the type of heating component 2 is not limited, and the heating component 2 can be any electronic component that generates heat. In other words, the heat dissipation device 3 can be adapted to different heating components 2 for heat dissipation, and the product has good universality, thereby solving the heat dissipation optimization problem for different modules. In addition, the heat dissipation device 3 can further meet the heat dissipation requirements of modules of different sizes without affecting the universality of the heat dissipation structure; only the size of the heat dissipation device 3 needs to be appropriately adjusted. Specifically, in some embodiments, the heating component 2 can be a heating component 2 such as an optical module, a chip (also called a chip card), a card module (also called a card), or a circuit module. The heat dissipation device 3 in the technical solution of the present application can alleviate the problems of many existing types of heating components 2, such as high thermal resistance, insufficient heat dissipation effect, high insertion / removal resistance, and the inconvenience of inserting and removing the components during heat dissipation.

[0054] By using the heat dissipation device 3 provided in this embodiment of the present application, there is no need to improve the specific structure of the heating component 2. In other words, the problems of existing plug-in heating components 2, such as high thermal resistance, insufficient heat dissipation effect, high plug-in / unplug resistance, and the inconvenience of plugging and unplugging during heat dissipation, can be alleviated. In addition, the heat dissipation device 3 has good universality and high flexibility, and can be applied to the heat dissipation requirements of different modules without affecting the universality of the heat dissipation structure.

[0055] It should be noted that the heating component 2 shown in the accompanying drawings of the embodiments of the present application may be, but is not limited to, an optical module. Alternatively, the structural principle of the heat dissipation device 3 may be implemented in any other type of heating component 2 that is appropriately arranged, such as a chip, a card, or a circuit module. The following describes the heat dissipation device 3 and the heating component 2 in detail with reference to the accompanying drawings. Those skilled in the art will understand that the principles of the present invention can be applied to any appropriately arranged heating component 2. In addition, for the sake of clarity and conciseness, descriptions of well-known functions and structures may be omitted.

[0056] FIG. 2 is a schematic diagram of a structure of a heat dissipation device according to an embodiment of the present application. FIG. 3 is a schematic diagram of a first structure of a heat dissipation device on a side in use according to an embodiment of the present application. As shown in FIGS. 2 and 3 , an embodiment of the present application provides a heat dissipation device 3 configured to dissipate heat for a heating component 2, and particularly applicable to heat dissipation for a pluggable heating component 2. The heat dissipation device 3 includes a receiving portion 31 and a heat sink assembly 32. The receiving portion 31 includes a receiving cavity for receiving the heating component 2. The heating component 2 is inserted into the receiving cavity along a first direction X. In other words, the first direction X referred to in this embodiment of the present application is the insertion direction of the heating component 2. The receiving portion 31 may specifically be a structure such as a card slot, a slot, a receiving groove, or a light cage. This is not limited in this application.

[0057] As shown in FIG. 3 , the heat sink assembly 32 includes a heat sink 321, a support 322, a sliding component 323, and a linkage 324. The heat sink 321 is slidably connected to the support 322 by using the sliding component 323, and the support 322 is fixed to the housing 31, so that the heat sink 321 can dissipate heat for the heating component 2. The housing 31 includes a first side 311 and a second side 312 facing each other along a second direction Y. The heat sink 321 is disposed on the first side 311. The second direction Y is perpendicular to the first direction X. Note that the first side 311 and the second side 312 do not necessarily have a specific structure, and this specification mainly refers to their positional relationship. In other words, along the second direction Y, the side of the accommodation portion 31 facing the heat sink 321 is the first side 311, and the side away from the heat sink 321 is the second side 312. The heating component 2 may be located between the first side 311 and the second side 312. In the state shown in FIG. 3 , the second side 312 is understood to be the bottom surface of the accommodation portion 31, and the first side 311 is understood to be the top surface of the accommodation portion 31. Specifically, the sliding component 323 includes an inclined slot 3231 and a sliding block 3232. The sliding block 3232 and the inclined slot 3231 are adaptively and slidingly connected. In other words, the sliding block 3232 may slide within the inclined slot 3231 relative to the inclined slot 3231, driving the heat sink 321 to move along the extension direction of the inclined slot 3231 relative to the support 322. When the inclined slot 3231 is particularly positioned, the inclined slot 3231 gradually approaches the second side surface 312 along the first direction X. In other words, the inclined slot 3231 is inclined downward along the insertion direction of the heating component 2. Therefore, when the sliding block 3232 slides within the inclined slot 3231 in the first direction X, the heat sink 321 may move toward the second side surface 312 and gradually approach the heating component 2 inside the accommodation portion 31.

[0058] One end of the linkage portion 324 of the heat sink assembly 32 is attached to the heat sink 321, and the other end is located within the receiving cavity. When the heating component 2 is inserted into the receiving cavity, the linkage portion 324 is triggered. The linkage portion 324 drives the heat sink 321 to move along the first direction X, causing the sliding block 3232 of the sliding component 323 to slide against the inclined slot 3231. The heat sink 321 is driven to move toward the second side surface 312, gradually approaching the heating component 2 located within the receiving portion 31. By appropriately setting the structure and size of the linkage portion 324, the heat sink 321 is attached to the heating component 2 when the heating component 2 is fully inserted into the receiving portion 31.

[0059] In the technical solution of the present application, the heat dissipation device 3 may have a guiding effect on the movement of the heat sink 321 by using the inclined slot 3231. The linkage part 324 is arranged so that the heat sink 321 may move as the heating component 2 is inserted. In this way, during the insertion process of the heat sink 321, the linkage part 324 drives and moves the heat sink 321, and the heat sink 321 moves diagonally downward under the guidance of the inclined slot 3231. In other words, when the heating component 2 is only inserted into the receiving part 31, there is a gap (or low friction) between the heat sink 321 and the heating component 2. When the heating component 2 is inserted, the gap between the heat sink 321 and the heating component 2 becomes smaller until the heat sink 321 contacts the heating component 2. Therefore, compared with the prior art, this solution can reduce the sliding friction between the heating component 2 and the heat dissipation component 321 during the movement process, making insertion and removal more labor-saving and convenient. In addition, this solution does not require consideration of the problem of the heating component 2 being unable to be inserted into the receiving part 31 or the problem of the heating component 2 being damaged due to the large friction during the insertion process of the heating component 2. In this way, the heat sink 321 may move obliquely downward when the heating component 2 is inserted. The heat sink 321 is attached to the heating component 2 with large pressure under the cooperation of the sliding component 323 and the linkage part 324. In this way, the heat sink 321 is closely abutted against, closely attached to, or in close contact with the surface of the heating component 2, which reduces the thermal contact resistance between the heat sink 321 and the heating component 2, improves the heat transfer performance between the heat sink 321 and the heating component 2, improves the heat dissipation capacity, and enhances the heat dissipation effect of the heating component 2.

[0060] Therefore, the support 322, the sliding component 323, and the linkage 324 are coordinately arranged in the heat dissipation device 3 so that the heat sink 321 is in close contact with the surface of the heating component 2. This effectively reduces the thermal contact resistance between the heat sink 321 and the heating component 2, improving the heat transfer performance between the heat sink 321 and the heating component 2. Heat is more effectively dissipated by the heating component 2. In addition, during the insertion and removal process of the heating component 2, there is no sliding friction movement on the thermally conductive mating surfaces of the heat sink 321 and the heating component 2, so the insertion and removal is smooth and labor-saving, and the contact pressure is stable and controllable.

[0061] When the sliding component 323 is particularly positioned, in one embodiment, the inclined slot 3231 may be positioned on the heat sink 321, and the sliding block 3232 may be positioned on the support 322. Alternatively, in another embodiment, the inclined slot 3231 may be positioned on the support 322, and the sliding block 3232 may be positioned on the heat sink 321. In conclusion, one of the inclined slot 3231 and the sliding block 3232 is positioned on the heat sink 321, and the other is positioned on the support 322. However, the heat sink 321 may move diagonally by using the sliding connection between the sliding block 3232 and the inclined slot 3231 of the sliding component 323. The specific positions at which the inclined slot 3231 and the sliding block 3232 are positioned are not limited in this application.

[0062] Still referring to FIG. 3 , the heat dissipation device 3 may further include a first reset member 325. The first reset member 325 is disposed between the heat sink 321 and the support 322. When the heating component 2 is removed from the accommodating cavity, the first reset member 325 is configured to drive the heat sink 321 to move in a direction away from the second side surface 312. In other words, the first reset member 325 may provide a force to the heat sink 321 in a direction away from the second side surface 312 along the second direction Y. As the first reset member 325 drives the heat sink 321 to move in a direction away from the heating component 2 along the second direction Y, the sliding block 3232 slides against the inclined slot 3231. When the heating component 2 is not inserted into the accommodating portion 31, a gap exists between the heat sink 321 and the second side surface 312, allowing the heating component 2 to be smoothly inserted into the accommodating portion 31. When the heating component 2 is removed from the accommodating portion 31 , the first reset member 325 drives the heat sink 321 to be separated from the heating component 2 , so that the heating component 2 can be removed from the accommodating portion 31 smoothly.

[0063] In a specific embodiment, the first reset member 325 may be a spring-like elastic member. When the heating component 2 is fully inserted into the housing 31, the elastic member is in an energy-storing state. When the heating component 2 is removed from the housing 31, the elastic member releases energy to drive the heating component 2 to move away from the second side surface 312. The structure of the first reset member 325 in this solution is simple. Indeed, in another embodiment, the first reset member 325 may alternatively be a lever-like structure, which will not be listed one by one in this specification.

[0064] Still referring to FIG. 3 , the heat dissipation device 3 may further include a second reset member 326. The second reset member 326 is disposed between the heat sink 321 and the support 322. When the heating component 2 is removed from the accommodating cavity, the second reset member 326 is configured to drive the heat sink 321 to move away from the first direction X. In other words, the second reset member 326 may provide a force to the heat sink 321 along the direction in which the heating component 2 is removed. As the second reset member 326 drives the heat sink 321 to move toward the direction in which the heating component 2 is removed, the sliding block 3232 slides against the inclined slot 3231. When the heating component 2 is not inserted into the accommodating portion 31, a gap exists between the heat sink 321 and the second side surface 312, allowing the heating component 2 to be smoothly inserted into the accommodating portion 31. When the heating component 2 is removed from the accommodating portion 31, the second reset member 326 drives the heat sink 321 to be separated from the heating component 2, so that the heating component 2 can be smoothly removed from the accommodating portion 31.

[0065] In a specific embodiment, the support 322 includes a support body 3221 and a tail support 32222. The sliding component 323 is connected between the support body 3221 and the heat sink 321. The second reset member 326 is connected between the heat sink 321 and the tail support 32222. This is not limited in the present application. Specifically, the tail support 3222 and the support body 3221 may be an integrated structure. Alternatively, the tail support 32222 may be fixedly connected to the support body 3221. For example, in the embodiment shown in FIG. 2, the tail support 32222 is fixedly connected to the support body 3221. For example, the tail support 3222 may be fixedly connected to the support body 3221 in a manner such as welding, riveting, clamping, or a screw connection. Alternatively, the tail support 32222 and the support body 3221 may be of a split structure, with the tail support 32222 fixed to the housing 31. Indeed, the tail support 32222 may be fixedly connected to the support body 3221 in a manner such as welding, riveting, clamping, or a screw connection.

[0066] In a specific embodiment, the second reset member 326 may be an elastic member such as a spring plate. When the heating component 2 is fully inserted into the housing 31, the elastic member is in an energy-storing state. When the heating component 2 is removed from the housing 31, the elastic member releases energy to drive the heating component 2 to move in a direction away from the second side 312. The structure of the second reset member 326 in this solution is simple. In another embodiment, the second reset member 326 may alternatively be a lever-like structure, which will not be listed one by one in this specification.

[0067] FIG. 4 is a schematic diagram of a first structure of the heat dissipation device in use from a top view according to an embodiment of the present application. FIG. 5 is a schematic diagram of a second structure of the heat dissipation device in use from a side view according to an embodiment of the present application. As shown in FIGS. 4 and 5 , in this embodiment of the present application, the heat dissipation device 3 may further include an elastic strip 327. The elastic strip 327 serves as a reset member. One end is connected to the heat sink 321, and the other end is connected to the support 322. The elastic strip 327 may provide a force to the heat sink 321 along the extension direction of the inclined slot 3231. Specifically, the force may be understood as a diagonally upward force so that the sliding block 3232 slides relative to the inclined slot 3231. The elastic strip 327 may directly reset the heat sink 321 to a diagonally upward position, in other words, a position where the sliding block 3232 abuts the upper part of the inclined slot 3231. The reset force of the elastic strip 327 extends along the direction of the inclined slot 3231, thereby reducing the friction between the sliding block 3232 and the inclined slot 3231, thereby reducing the friction between the sliding block 3232 and the inclined slot 3231 and increasing the service life of the sliding component 323. When the heating component 2 is not inserted into the housing 31, the elastic strip 327 can create a gap between the heat sink 321 and the second side surface 312, so that the heating component 2 can be smoothly inserted into the housing 31. When the heating component 2 is removed from the housing 31, the elastic strip 327 drives the heat sink 321 to be separated from the heating component 2, so that the heating component 2 can be smoothly removed from the housing 31.

[0068] Specifically, the elastic strip 327 may be an elastic heat-conducting strip, one end of which is connected to the heat sink 321 and the other end of which is connected to the support 322. In this solution, the elastic heat-conducting strip is connected to the heat sink 321 to dissipate heat from the heat sink 321, thereby improving the heat dissipation effect of the heat sink 321.

[0069] Still referring to Figures 4 and 5, in a specific embodiment, one end of the elastic heat-conducting strip is connected to the surface of the heat sink 321, and the other end is connected to the tail support 3222 of the support 322. The tail support 32222 may alternatively be a thermally conductive tail support 3222. In other words, the other end of the elastic heat-conducting strip is connected to the thermally conductive portion of the support 322. Therefore, the heat of the heat sink 321 can be transferred to the thermally conductive tail support 322 of the support 322 by using the elastic heat-conducting strip, which may further improve the heat dissipation area and improve the heat dissipation effect of the heat sink 321.

[0070] In order to improve the heat transfer efficiency between the heat sink 321 and the heating component 2, reduce the thermal resistance, and improve the heat dissipation capability, at least the surface of the heat sink 321 that is attached to the heating component 2 includes a flexible thermally conductive layer 3211. The flexible thermally conductive layer 3211 may be fixed to the surface of the heat sink 321 in a bonding manner. The flexible thermally conductive layer 3211 may enable the heat sink 321 to be closely attached to the heating component 2 to aid in heat transfer.

[0071] The flexible thermally conductive layer 3211 is disposed on the heat sink 321. If there is a large horizontal friction between the heating component 2 and the heat sink 321 during insertion and removal of the heating component 2, the flexible thermally conductive layer 3211 will be easily punctured or worn. In addition, wrinkles will easily form on the flexible thermally conductive layer 3211, reducing the adhesive effect between the heat sink 321 and the heating component 2. If the adhesive positive pressure between the heat sink 321 and the heating component 2 is small, the flexible thermally conductive layer 321 will have poor filling performance and limited heat conduction ability, and the flexibility of the flexible thermally conductive layer 321 will not be fully realized. In addition, the coefficient of friction of the flexible thermally conductive layer 3211 is large. The frictional resistance of the heating component 2 is large when the heating component 2 is inserted or removed, requiring a large force to insert or remove the heating component 2, resulting in laborious insertion and removal. However, when the technical solution of the present application is used, the heat sink 321 moves toward the heating component 2 only when the heating component 2 is inserted, so that the heat sink 321 comes into contact with the heating component 2. In this case, excessive horizontal friction is not easily generated between the heat sink 321 and the heating component 2 during the process of inserting the heating component 2. In other words, horizontal friction is not easily generated between the heat sink 321 and the flexible thermally conductive layer 321, thereby reducing the probability of the flexible thermally conductive layer 321 being worn and facilitating the insertion of the heating component 2 into the receiving portion 31. In addition, when the heating component 2 is fully inserted into the receiving portion 31 of the heat dissipation device 3, a large positive pressure may be generated between the heat sink 321 and the heating component 2. In this way, the flexible thermally conductive layer 3211 may have good filling performance and good thermal conductivity, so that the thermal resistance may be further reduced and the heat dissipation effect may be improved.

[0072] 5 , the heat sink 321 further includes heat conductive protrusions 3212. When the heating component 2 is fully inserted into the accommodating cavity, the heat conductive protrusions 3212 are attached to the heating component 2. In this solution, specifically, the heat conductive protrusions 3212 may be attached to the heating portion of the heating component 2 so that the heat generated by the heating component 2 is dissipated. The heat conductive protrusions 3212 are arranged to reduce structural interference between the heat sink 321 and the accommodating portion 31 and to increase the heat dissipation area of ​​the heat sink 321.

[0073] The first side 311 of the receiving portion 31 further includes an opening for attaching the heat conducting protrusion 3212 to the heating component 2. Thus, the heat conducting protrusion 3212 extends into the opening, so that the heat conducting protrusion 3212 is attached to the heating component 2. When the opening is particularly positioned, the area of ​​the opening is larger than the area of ​​the heat conducting protrusion 3212 to help the heat sink 321 move along the first direction X.

[0074] Still referring to FIG. 5 , when the linkage portion 324 of the heat dissipation device 3 is particularly arranged, the linkage portion 324 may be a fixed protrusion. The fixed protrusion is fixed to a surface of the heat sink 321 facing the second side surface 312. When the heat sink 321 includes a heat-conducting protrusion 3212, the height of the fixed protrusion is greater than the height of the heat-conducting protrusion 3212. When the heating component 2 is inserted into the accommodating portion 31, the end of the heating component 2 facing the first direction X may abut against the fixed protrusion, driving the heat sink 321 to move in the first direction X. In this solution, the structure of the fixed protrusion is highly reliable. Therefore, when the heating component 2 is fully inserted into the accommodating portion 31, the heating component 2 may apply a large force to the heat sink 321 by using the fixed protrusion, so that the heat sink 321 is closely attached to the heating component 2. In addition, the structure of the linkage part 324 in this solution is simple, and the heat sink assembly 32 is convenient to manufacture and assemble.

[0075] In certain embodiments, the fixed protrusions and the heat sink 321 may be of an integrated structure, which can improve the reliability of the connection between the fixed protrusions and the heat sink 321 and simplify the structure of the heat sink assembly 32.

[0076] In order to align with the fixed protrusion, an end of the heating component 2 facing the first direction X includes an abutting portion. When the heating component 2 is fully inserted into the accommodating cavity, the abutting portion abuts against the fixed protrusion to drive the heat sink 321 to abut against the heating component 2. Specifically, the abutting portion has high strength and can withstand large pressure to protect the heating component 2, so that the heating component 2 is not damaged when the heating component 2 abuts against the fixed protrusion.

[0077] Referring to FIG. 4 , the support 322 of the heat sink assembly 32 includes two side panels 3223 arranged opposite each other along a third direction Z. The third direction Z is perpendicular to the first direction X and the second direction Y. The heat sink 321 is disposed between the two side panels 3223, and the sliding component 323 is disposed between the side wall of the heat sink 321 and the side panel 3223. Thus, the heat sink 321 moves relative to the support 322. This solution facilitates inserting the heating component 2 into the housing 31 or removing the heating component 2 from the housing 31, and facilitates positioning the sliding component 323 without affecting the movement of the heating component 2 or the heat sink 321. The structure is compact and the design is appropriate.

[0078] Still referring to FIG. 4 , the heat dissipation device 3 may include multiple groups of sliding components 323. The multiple groups of sliding components 323 are symmetrically arranged on both sides of the heat sink 321, and the symmetry axes M of the multiple groups of sliding components 323 are parallel to the first direction X. In this embodiment, the multiple groups of sliding components 323 cooperate with each other to improve the reliability of the movement of the heat dissipation device 3. In addition, the surface parallel effect of the adhesion between the heat sink 321 and the heating component 2 can be further maintained, which improves the reliability of the adhesion between the heat sink 321 and the heating component 2, thereby improving the heat dissipation effect of the heat sink 321.

[0079] The connection method between the support 322 and the housing 31 is not limited. The support 322 and the housing 31 may be of an integrated structure. In other words, the support 322 and the housing 31 may be understood as two parts of one component. Specifically, the support 322 may be a part of the housing 31. For example, the integration may be implemented by a method such as insert injection molding using a mold. In this way, the structural design is simple, and the connection is stable and reliable, which helps to improve the integrity of the heat dissipation device and the overall strength. Alternatively, the support 322 and the housing 31 may be of a divided structure. In other words, the support 322 and the housing 31 are separate and independent components. In this case, the support 322 and the housing 31 are connected to one component by a method such as clamping, screw connection, riveting, thread connection, or welding. For example, the support 322 may be clamped to the receiving part 31 by using a buckle, or may be riveted to the receiving part 31, or may be bent and pressed against the receiving part 31. In this way, it is convenient to process and manufacture the support 322 and the receiving part 31 separately, which reduces manufacturing difficulties, improves connection reliability, and makes operation convenient. It should be understood that the method of connecting the support 322 to the receiving part 31 is not limited to this embodiment of the present application, and includes, but is not limited to, several connection methods mentioned above that are not listed one by one in this specification.

[0080] In certain embodiments, the specific structure and type of the heat sink 321 in the heat sink assembly 32 are not limited. For example, the heat sink 321 may be a solid heat sink 321 or a metal heat sink formed through injection molding. FIG. 6 is a schematic diagram of a second structure of a heat sink device in use from a top view according to an embodiment of the present application. In the embodiment shown in FIG. 6, the heat sink 321 may alternatively be a liquid-cooled heat sink. The liquid-cooled heat sink includes a liquid inlet 3213 and a liquid outlet 3214. The coolant enters the inner cavity of the liquid-cooled heat sink through the liquid inlet 3213 and exits the liquid-cooled heat sink through the liquid outlet 3214 after heat exchange, thereby achieving coolant circulation. When the liquid-cooled heat sink is specifically positioned, a structure such as a support 322 needs to avoid the liquid inlet 3213 and the liquid outlet 3214 of the liquid-cooled heat sink.

[0081] 7 is a schematic diagram of a third structure of a heat dissipation device in a top view during use according to an embodiment of the present application. FIG. 8 is a schematic diagram of a third structure of a heat dissipation device in a side view during use according to an embodiment of the present application. As shown in FIGS. 7 and 8, the heat dissipation device 3 includes at least two housings 31 and at least one heat sink assembly 32. The heat dissipation device 3 is mainly applicable to a heating component 2 having multiple plugs or an electronic component 2 having multiple heating components 2, or when there are multiple heating components 2 and the heating components 2 are arranged at high density, so as to improve the integration degree of the device and help implement miniaturization of the device.

[0082] In a specific embodiment, the number of heat sink assemblies 32 may be less than the number of housing sections 31. Housing sections 31 without heat sink assemblies 32 may house components that are not easily heated, or may be configured with a common heat sink. This is not limited to this application. In another embodiment, as shown in FIGS. 7 and 8, one heat sink assembly 32 is disposed for each housing section 31, so that the heat sink assembly 32 can house many heating components 2 and achieve a good heat dissipation effect.

[0083] In a specific embodiment, the arrangement of the at least two housings 31 in the heat dissipation device 3 is not limited. For example, in one embodiment, as shown in FIGS. 7 and 8, the at least two housings 31 are arranged side by side along the third direction Z. FIG. 9 is a schematic diagram of a fourth structure of the heat dissipation device in a side view during use according to an embodiment of the present application. FIG. 10 is a schematic diagram of a fifth structure of the heat dissipation device in a side view during use according to an embodiment of the present application. As shown in FIGS. 9 and 10, in another embodiment, the at least two housings 31 are arranged along the second direction Y in a stacked manner, and the heat sink assembly 32 is disposed between any two adjacent housings 31. FIG. 11 is a schematic diagram of the structure of the heat dissipation device in a rear view according to an embodiment of the present application. See FIG. 11. In another embodiment, the housings 31 may alternatively be arranged along the second direction Y in a stacked manner when arranged side by side along the third direction Z. The manner in which the receiving portion 31 is arranged in each heat dissipation device 3 is not limited, and users may select a suitable manner in which the receiving portion 31 is arranged based on actual product requirements.

[0084] See Figures 7 and 9. In a specific embodiment, the housings 31 of the heat dissipation device 3 may be fixed to an integrated structure. Specifically, the structure may be an integrally formed structure. In other words, the multiple housings 31 are an integrally formed structure. Alternatively, methods such as riveting, welding, or screwing may be used on the housings 31 so that the multiple housings 31 are fixedly connected. This solution helps improve the integrity of the heat dissipation device 3, and the reliability of the entire structure is good. It is less likely to be deformed or damaged.

[0085] Additionally, the support 322 of the heat dissipation assembly 32 may alternatively be an integrated structure. Indeed, the support 322 may be an integrally formed structure, for example, a sheet metal part. Alternatively, the support 322 may be fixed within the integrated structure. For example, a fixed connection may be implemented in a manner such as riveting, welding, or a screw connection. This solution helps improve the integrity of the heat dissipation device 3, and the reliability of the entire structure is good. It is less susceptible to deformation and damage.

[0086] In yet another embodiment, the support 322 and the housing 31 of the heat dissipation assembly 32 may alternatively be an integrated structure, which improves the reliability of the overall structure and simplifies the assembly craft of the heat dissipation device 3.

[0087] Still referring to Fig. 7, the support 322 of the heat sink 32 includes side panels 3223 arranged on two sides of the heat sink 321 along the third direction Z, and the two side panels 3223 of adjacent heat sinks 32 are fixedly connected by using the buckles 5. In addition, there is a side wall between adjacent housing portions 31, and the two side panels 3223 are fixed to the side wall by using the buckles 5, so the heat sink assembly 32 may be considered to be fixedly attached on the housing portion 31.

[0088] 8, the at least two housings 31 may be independent of each other and separately assembled on the circuit board 4 or the connection board. The supports 322 of the heat sink assemblies 32 corresponding to the respective housings 31 are fixed to the housings 31, respectively.

[0089] As shown in FIG. 7 or FIG. 8 , when the heat dissipation device 3 includes at least two radiator assemblies 32, adjacent components of the supports of the radiator assemblies 32 may have an integrated structure. Indeed, the supports of the radiator assemblies 32 may have an integrated structure or may be fixedly connected to form an integrated structure. For example, in the embodiment shown in FIG. 7 , the two side panels 3223 of adjacent radiator assemblies 32 may have an integrated structure so that the radiator assemblies 32 and the housing 31 can be easily attached. In addition, referring to FIGS. 7 and 8 , adjacent tail supports 32222 of the radiator assemblies 32 have an integrated structure. Specifically, the tail supports 322222 of all the radiator assemblies 32 may have an integrated structure. This solution helps improve the integrity of the heat dissipation device 3 and reduce the installation process of the heat dissipation device 3.

[0090] See Fig. 9. In a specific embodiment, when at least two housings 31 are arranged in a stacked manner along the second direction Y, a radiator assembly 32 may be arranged only between any two adjacent housings 31. No radiator assembly 32 may be arranged for the top housing 31, or the radiator assembly 32 may be arranged in a different manner. In the embodiment shown in Fig. 10, one radiator assembly 32 may be arranged for each housing 31. In other words, a radiator assembly 32 is also arranged for the top housing 31.

[0091] It is apparent that those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. This application intends to cover these modifications and variations of this application, provided that they fall within the scope of protection defined by the following claims and their equivalents.

Claims

1. a housing including a housing cavity for housing a heating component; a heat sink assembly including a heat sink, a support, a sliding component, and a linkage portion; The heating component is inserted into the receiving cavity along a first direction; the support is fixed to the receiving part, and the heat sink is slidably connected to the support by using the sliding component, the sliding component including a compatible inclined slot and a sliding block, the inclined slot being disposed on the heat sink and the sliding block being disposed on the support, or the inclined slot being disposed on the support and the sliding block being disposed on the heat sink, one end of the linkage part being attached on the heat sink and the other end of the linkage part being disposed in the receiving cavity, the receiving cavity including a first side surface and a second side surface facing each other along a second direction, the heat sink being located on the first side surface, the inclined slot gradually approaching the second side surface along the first direction, the second direction being perpendicular to the first direction; When the heating component is inserted into the receiving cavity, the linkage portion is triggered to drive the heat sink to move along the first direction, and the sliding block slides against the inclined slot to drive the heat sink to move toward the second side, and when the heating component is fully inserted into the receiving portion, the heat sink is attached to the heating component; a first reset member disposed between the heat sink and the support in the second direction, the first reset member configured to drive the heat sink to move in a direction away from the second side when the heating component is removed from the accommodating cavity; one end of the first reset member is connected to the heat sink, and the other end of the first reset member is connected to the support; Heat dissipation device.

2. 2. The heat dissipation device of claim 1, wherein a second reset member is further disposed between the heat sink and the support, and the second reset member is configured to drive the heat sink to move away from the first direction when the heating component is removed from the accommodating cavity.

3. a housing including a housing cavity for housing a heating component; a heat sink assembly including a heat sink, a support, a sliding component, and a linkage portion; The heating component is inserted into the receiving cavity along a first direction; the support is fixed to the receiving part, and the heat sink is slidably connected to the support by using the sliding component, the sliding component including a compatible inclined slot and a sliding block, the inclined slot being disposed on the heat sink and the sliding block being disposed on the support, or the inclined slot being disposed on the support and the sliding block being disposed on the heat sink, one end of the linkage part being attached on the heat sink and the other end of the linkage part being disposed in the receiving cavity, the receiving cavity including a first side surface and a second side surface facing each other along a second direction, the heat sink being located on the first side surface, the inclined slot gradually approaching the second side surface along the first direction, the second direction being perpendicular to the first direction; When the heating component is inserted into the receiving cavity, the linkage portion is triggered to drive the heat sink to move along the first direction, and the sliding block slides against the inclined slot to drive the heat sink to move toward the second side, and when the heating component is fully inserted into the receiving portion, the heat sink is attached to the heating component; a second reset member disposed between the heat sink and the support, the second reset member configured to drive the heat sink to move away from the first direction when the heating component is removed from the accommodating cavity; the second reset member is an elastic thermally conductive strip, one end of the elastic thermally conductive strip is connected to the heat sink, and the other end of the elastic thermally conductive strip is connected to the support; Heat dissipation device.

4. The heat dissipation device according to claim 3 , wherein the other end of the elastic thermally conductive strip is connected to a thermally conductive portion of the support.

5. The heat dissipation device according to any one of claims 1 to 4, wherein at least the surface of the heat dissipator that is attached to the heating component comprises a flexible heat-conducting layer.

6. The heat dissipation device according to any one of claims 1 to 5, wherein the heat sink includes heat conductive protrusions, and the heat conductive protrusions are attached to the heating component when the heating component is fully inserted into the accommodating cavity.

7. 7. The heat dissipation device according to claim 1, comprising a plurality of groups of sliding components, the plurality of groups of sliding components being symmetrically arranged on both sides of the heat dissipation device, and the symmetry axes of the plurality of groups of sliding components being parallel to the first direction.

8. The heat dissipation device according to any one of claims 1 to 7, wherein the linkage portion is a fixed protrusion, and the fixed protrusion is fixed to a surface of the heat sink that faces in the direction of the second side surface.

9. The heat dissipation device according to claim 8 , wherein the fixed protrusion and the heat sink are of an integrated structure.

10. 10. The heat dissipation device of claim 8 or 9, wherein an end of the heating component facing the first direction includes an abutment portion, and the abutment portion abuts against the fixed protrusion when the heating component is fully inserted into the accommodating cavity.

11. The heat dissipation device according to any one of claims 1 to 10, comprising at least two housings and at least one heat dissipation assembly.

12. The heat dissipation device according to claim 11 , wherein one heat dissipation assembly is disposed for each housing.

13. 13. The heat dissipation device according to claim 11 or 12, wherein the at least two accommodating sections are arranged side by side along a third direction, the third direction being perpendicular to the first direction, and the third direction being perpendicular to the second direction.

14. a housing including a housing cavity for housing a heating component; a heat sink assembly including a heat sink, a support, a sliding component, and a linkage portion; A heat dissipation device, The heating component is inserted into the receiving cavity along a first direction; the support is fixed to the receiving part, and the heat sink is slidably connected to the support by using the sliding component, the sliding component including a compatible inclined slot and a sliding block, the inclined slot being disposed on the heat sink and the sliding block being disposed on the support, or the inclined slot being disposed on the support and the sliding block being disposed on the heat sink, one end of the linkage part being attached on the heat sink and the other end of the linkage part being disposed in the receiving cavity, the receiving cavity including a first side surface and a second side surface facing each other along a second direction, the heat sink being located on the first side surface, the inclined slot gradually approaching the second side surface along the first direction, the second direction being perpendicular to the first direction; When the heating component is inserted into the receiving cavity, the linkage portion is triggered to drive the heat sink to move along the first direction, and the sliding block slides against the inclined slot to drive the heat sink to move toward the second side, and when the heating component is fully inserted into the receiving portion, the heat sink is attached to the heating component; The heat dissipation device further includes at least two housings and at least one heat sink assembly; the at least two receiving portions are arranged side by side along a third direction, the third direction being perpendicular to the first direction and the third direction being perpendicular to the second direction; the support includes side panels disposed on both sides of the heat sink along the third direction, and the side panels of two adjacent heat sinks are fixedly connected to the receiving portion by using buckles. Heat dissipation device.

15. The heat dissipation device according to any one of claims 12 to 14, wherein the at least two housings are arranged in a stacked manner along the second direction, and the heat dissipation assembly is arranged between any two adjacent housings.

16. The heat dissipation device according to any one of claims 11 to 15, wherein two adjacent housings are fixed in an integrated structure.

17. The heat dissipation device according to any one of claims 11 to 16, wherein the supports of the at least two heat dissipation assemblies are of integral construction.

18. 18. The heat dissipation device of claim 17, wherein adjacent portions of the supports of the at least two heat dissipation assemblies are of unitary construction.

19. A communication device comprising a heating component and a heat dissipation device according to any one of claims 1 to 18, wherein the heating component is inserted into the housing of the heat dissipation device.

20. The communication device of claim 19 , wherein the heating component comprises a light module, a chip, a circuit module, or a card module.

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