Processing water supply device

Abstract

To supply at low operation cost, processing water in which carbon dioxide is mixed.SOLUTION: A processing water supply device for supplying processing water to a processing unit arranged in a processing device, is provided, including: a processing water supply path to which a processing water supply source is connected at an upstream side and the processing unit is connected at a downstream side; a dispersion outflow portion which is provided in the middle of the processing water supply path and causes the processing water supplied from the upstream side, to flow out while dispersing the processing water into a space; and a processing water reception portion which is arranged in the middle of the processing water supply path, receives the processing water dispersed into the space from the dispersion outflow portion and flows the received processing water to the downstream side of the processing water supply path. In the space, carbon dioxide in the space is dissolved in the processing water having flown out into the space from the dispersion outflow portion, and the processing water reception portion receives the processing water in which the carbon dioxide is dissolved.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing water supplying device that supplies processing water used in a processing device that processes workpieces such as semiconductor wafers to the processing device. [Background technology]

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones and computers, multiple intersecting dividing lines are set on the surface of a wafer made of a semiconductor such as silicon. Devices such as integrated circuits (ICs) and large-scale integrated circuits (LSIs) are formed in each area defined by the dividing lines on the surface of the wafer. The wafer is then ground from the backside to thin the wafer, and divided along the dividing lines to obtain individual device chips.

[0003] Dividing a workpiece such as a wafer is performed, for example, by a cutting device having a cutting blade. The cutting device cuts the workpiece by rotating the cutting blade to cut into the workpiece along the intended dividing line. The cutting blade used to divide the workpiece includes, for example, an annular base made of aluminum or the like, and a grinding wheel part electroplated with nickel on the outer periphery of the base (see, for example, Patent Document 1).

[0004] When a workpiece is cut with a cutting blade, the workpiece is partially removed and the grinding wheel of the cutting blade is worn away, generating chips. Furthermore, processing heat is generated at the contact point between the grinding wheel of the cutting blade and the workpiece. Therefore, while the workpiece is being cut, processing water (cutting water) such as pure water is supplied to the grinding wheel and the workpiece, and the processing water removes the chips and processing heat.

[0005] However, when a workpiece such as a silicon wafer is cut with a cutting blade, static electricity is generated, which may cause electrostatic damage to devices formed on the workpiece. Therefore, in order to remove static electricity generated during processing of the workpiece, a processing device has been put into practical use in which carbon dioxide (CO2) is mixed into the processing water supplied to the cutting blade, etc., and the processing water has a reduced resistivity (see Patent Documents 2 and 3). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-87282 [Patent Document 2] Japanese Patent Application Publication No. 8-130201 [Patent Document 3] Japanese Patent Application Publication No. 11-300184 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in conventional techniques, it was necessary to prepare a carbon dioxide cylinder as a supply source of carbon dioxide to be mixed into the processing water. When the carbon dioxide cylinder became empty, it was necessary to replace the cylinder. Therefore, a considerable cost was continuously incurred to supply the processing water mixed with carbon dioxide to the cutting blade, etc.

[0008] The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing water supply device that can supply processing water mixed with carbon dioxide at low operating costs. [Means for solving the problem]

[0009] According to one aspect of the present invention, a processing water supply device for supplying processing water to a processing unit disposed in a processing apparatus includes a processing water supply path connected to a processing water supply source on the upstream side and to the processing unit on the downstream side for supplying processing water to the processing unit, a dispersion and outflow section provided in the processing water supply path for dispersing the processing water supplied from the upstream side into space while discharging it, and a processing water receiving section provided in the processing water supply path for receiving the processing water dispersed into space from the dispersion and outflow section and for discharging the received processing water downstream of the processing water supply path, The space is surrounded by an outer wall, the dispersion and outflow section and the processing water receiving section are disposed inside the outer wall, an air intake port is formed in the outer wall to connect the space with the outside of the outer wall, and a filter is disposed in the air intake port to remove foreign matter in the air that passes through the air intake port and flows into the space, A processing water supply device is provided in which, in the space, carbon dioxide in the space dissolves in the processing water that flows out from the dispersion outflow section into the space, and the processing water receiving section receives the processing water in which carbon dioxide has been dissolved.

[0011] Preferably, the outer wall is formed with an exhaust port connecting the space with the outside of the outer wall, and one or both of the air intake port and the exhaust port are provided with a blower that introduces air into the space from the air intake port and exhausts the air from the space through the exhaust port. [Effects of the Invention]

[0012] A processing water supply device according to one aspect of the present invention includes a dispersion outlet section and a processing water receiving section provided along a processing water supply path. The processing water flows out of the dispersion outlet section while being dispersed into a space and is received in the processing water receiving section. During this process, the processing water comes into contact with the air in the space, and carbon dioxide in the space dissolves into the processing water. In the area where the processing equipment connected to the processing water supply device is located, carbon dioxide is generated by human activity and the operation of other equipment. Carbon dioxide generated in the area where the processing equipment is located and carbon dioxide present in the atmosphere dissolve into the processing water.

[0013] Therefore, the processing water supply device according to one aspect of the present invention does not require a carbon dioxide cylinder, and there is no need to replace a carbon dioxide cylinder, so that processing water mixed with carbon dioxide can be supplied to the processing equipment at low operating costs. Moreover, since carbon dioxide generated in the area where the processing equipment is installed can be collected, greenhouse gas emissions can be reduced, and the processing water supply device also contributes to environmental issues.

[0014] Therefore, the present invention provides a processing water supplying device that can supply processing water mixed with carbon dioxide at low operating costs. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 2 is a perspective view schematically showing a processing device. [Figure 2] FIG. 2 is a perspective view schematically showing a workpiece being machined by a machining unit. [Figure 3] 1 is a cross-sectional view schematically illustrating a processing water supply device according to an example. [Figure 4] FIG. 10 is a cross-sectional view schematically showing a processing water supplying device according to another example. [Figure 5] FIG. 10 is a cross-sectional view schematically showing a processing water supplying device according to yet another example. DETAILED DESCRIPTION OF THE INVENTION

[0016] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. The processing water supply device according to this embodiment supplies processing water such as pure water to a processing device that processes a workpiece such as a semiconductor wafer. Fig. 1 is a perspective view that schematically shows the processing device that processes the workpiece, and Fig. 2 is a perspective view that schematically shows the workpiece being processed in a processing unit of the processing device. First, the workpiece 1 will be described.

[0017] The workpiece 1 is a wafer made of, for example, Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor material, or a wafer made of a composite oxide such as LT (lithium tantalate) or LN (lithium niobate).

[0018] Alternatively, the workpiece 1 may be a substantially disk-shaped substrate made of a material such as sapphire, glass, or quartz. Examples of the glass include alkali glass, alkali-free glass, soda-lime glass, lead glass, borosilicate glass, and quartz glass. Alternatively, the workpiece 1 may be a package substrate formed by arranging multiple device chips vertically and horizontally and sealing them with resin. The following description will be given taking the case where the workpiece 1 is a semiconductor wafer as an example, but the workpiece 1 is not limited to this.

[0019] The surface 1a of the workpiece 1 is partitioned by a plurality of mutually intersecting planned division lines 3. Devices 5 such as ICs and LSIs are formed in each of the areas partitioned by the planned division lines 3 on the surface 1a of the workpiece 1. There are no restrictions on the type, number, arrangement, etc. of the devices 5.

[0020] When the workpiece 1 is processed along the planned dividing lines 3, dividing grooves or other cutting marks 13 are formed, and the workpiece 1 is divided, individual device chips each including a device 5 can be formed. Before the workpiece 1 is divided, the workpiece 1 is ground from the back surface 1b side to thin it, and the back surface 1b side is further polished and flattened. When the workpiece 1 is then divided, thin device chips can be manufactured. In this way, the workpiece 1 having multiple devices 5 on the front surface 1a side can be processed using various processing equipment.

[0021] Hereinafter, a processing apparatus 2 that cuts a workpiece 1 will be described as a processing apparatus 2 that receives processing water from the processing water supply apparatus according to this embodiment and processes the workpiece 1 using the processing water. That is, the processing apparatus 2 will be described below taking as an example a case where the processing apparatus 2 is a cutting apparatus. However, the processing apparatus 2 to which processing water is supplied from the processing water supply apparatus according to this embodiment is not limited to a cutting apparatus.

[0022] When the workpiece 1 is carried into the processing device 2, an adhesive tape 9 is attached in advance to cover the opening of a ring frame 7 made of metal or the like, and is then stuck to the back surface 1b of the workpiece 1. Then, the workpiece 1 is carried into the processing device 2 as a frame unit 11 in which the workpiece 1, adhesive tape 9, and ring frame 7 are integrated, and processed. The individual device chips formed by dividing the workpiece 1 are supported by the adhesive tape 9 and then picked up from the adhesive tape 9.

[0023] Next, the processing device 2 will be described. As shown in Fig. 1, the processing device 2 has a base 4 that supports each component. An opening 8 is formed in a front corner 6 of the base 4, and within this opening 8 is provided a cassette support table 10 that is raised and lowered by a lifting mechanism (not shown). A cassette 12 that stores multiple workpieces 1 is mounted on the upper surface of the cassette support table 10. For ease of explanation, only the outline of the cassette 12 is shown by a two-dot chain line in Fig. 1.

[0024] A rectangular opening 14 is formed on the side of the cassette support table 10 so that its longitudinal direction is along the X-axis direction (front-rear direction, processing feed direction). Inside the opening 14, there are a ball screw type X-axis movement mechanism (not shown), a table cover 16 that covers the top of the X-axis movement mechanism, and a dustproof / waterproof cover 18. The X-axis movement mechanism includes an X-axis movement table (not shown) covered by a table cover 16, and moves this X-axis movement table in the X-axis direction.

[0025] A chuck table 20, which holds the workpiece 1 by suction, is provided on the upper surface of the X-axis moving table so as to be exposed from the table cover 16. The chuck table 20 is connected to a rotary drive source (not shown), such as a motor, and rotates around a rotation axis that is roughly parallel to the Z-axis direction (vertical direction). The chuck table 20 is also moved in the X-axis direction together with the X-axis moving table by an X-axis moving mechanism. At this time, the dustproof and drip-proof cover 18 expands and contracts in accordance with the movement of the chuck table 20.

[0026] The upper surface of the chuck table 20 is a holding surface 22 that holds the workpiece 1 by suction. The holding surface 22 is formed roughly parallel to the X-axis direction and the Y-axis direction, and is connected to a suction source (not shown) such as an ejector via a suction path (not shown) or the like provided inside the chuck table 20. A plurality of clamps 24 are provided around the periphery of the chuck table 20 to grip the ring frame 7 that supports the workpiece 1 from all sides.

[0027] In addition, a transport unit (not shown) that transports the workpiece 1 to the chuck table 20 and the like is disposed in an area adjacent to the opening 14. The workpiece 1 accommodated in the cassette 12 is pulled out of the cassette 12 by the transport unit and transported to the chuck table 20.

[0028] Then, the ring frame 7 supporting the workpiece 1 via the adhesive tape 9 is gripped by the clamp 24. Furthermore, the suction source connected to the chuck table 20 is activated to apply negative pressure to the workpiece 1 from the holding surface 22 via the adhesive tape 9. Then, the workpiece 1 is held by suction on the chuck table 20.

[0029] A support structure 28 that supports a processing unit (cutting unit) 26 that cuts the workpiece 1 is disposed on the upper surface of the base 4 so as to protrude above the opening 14. An indexing feed unit 30a that moves the processing unit 26 along the indexing feed direction (Y-axis direction) and an elevating unit 30b that raises and lowers the processing unit 26 along the Z-axis direction are provided on the upper front surface of the support structure 28.

[0030] The indexing feed unit 30a is provided with a pair of Y-axis guide rails 32 that are arranged on the front surface of the support structure 28 and are parallel to the Y-axis direction. A Y-axis moving plate 34 is slidably attached to the Y-axis guide rails 32. A nut portion (not shown) is provided on the back surface (rear surface) of the Y-axis moving plate 34, and a Y-axis ball screw 36 that is parallel to the Y-axis guide rails 32 is threadedly engaged with this nut portion.

[0031] A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 36. When the Y-axis pulse motor rotates the Y-axis ball screw 36, the Y-axis moving plate 34 moves in the Y-axis direction along the Y-axis guide rail 32.

[0032] An elevation unit 30b is provided on the surface (front surface) of the Y-axis moving plate 34. The elevation unit 30b includes a pair of Z-axis guide rails 38 that are fixed to the surface of the Y-axis moving plate 34 and are parallel to the Z-axis direction. A Z-axis moving plate 40 is slidably attached to the Z-axis guide rails 38.

[0033] A nut portion (not shown) is provided on the back surface (rear surface) of Z-axis moving plate 40, and a Z-axis ball screw 42 parallel to Z-axis guide rail 38 is threadedly engaged with this nut portion. A Z-axis pulse motor 44 is connected to one end of Z-axis ball screw 42. When Z-axis pulse motor 44 rotates Z-axis ball screw 42, Z-axis moving plate 40 moves in the Z-axis direction along Z-axis guide rail 38.

[0034] A processing unit 26 that cuts the workpiece 1 held by the chuck table 20, and an imaging unit (camera unit) 46 that images the upper surface of the workpiece 1 held by the chuck table 20 are fixed to the lower part of the Z-axis moving plate 40. When the indexing feed unit 30a moves the Y-axis moving plate 34 in the Y-axis direction, the processing unit 26 and the imaging unit 46 are indexed and fed. When the lifting unit 30b moves the Z-axis moving plate 40 in the Z-axis direction, the processing unit 26 and the imaging unit 46 move up and down.

[0035] 2 includes a perspective view that schematically shows the processing unit (cutting unit) 26. The processing unit 26 has an annular cutting blade 48, and cuts the workpiece 1 with the cutting blade 48. The processing unit 26 has a spindle housing 50 that rotatably accommodates the base end side of a spindle (not shown) that forms a rotation axis parallel to the Y-axis direction.

[0036] A rotary drive source such as a motor that rotates the spindle is housed inside the spindle housing 50, and operating this rotary drive source causes the spindle to rotate. An annular cutting blade (processing tool) 48 is fixed to the tip of the spindle. The cutting blade 48 can be rotated by rotating the spindle. The cutting blade 48 has a grinding wheel portion that includes a circular binder made of a metal material, a resin material, or the like, and abrasive grains made of diamond or the like dispersed and fixed in the binder.

[0037] The Z-axis moving plate 40 is moved to lower the cutting blade 48 to a predetermined height, and the processing feed unit (X-axis moving mechanism) is operated to process and feed the chuck table 20, bringing the grinding wheel portion of the rotating cutting blade 48 into contact with the workpiece 1, thereby cutting the workpiece 1. When the workpiece 1 is cut along the planned division lines 3, processing marks (division grooves) 13 are formed in the workpiece 1. When processing marks 13 are formed along all of the planned division lines 3 on the workpiece 1, the workpiece 1 is divided into individual device chips.

[0038] When the cutting blade 48 cuts the workpiece 1, cutting chips and processing heat are generated from the grinding wheel and the workpiece 1. Therefore, while the cutting blade 48 is cutting the workpiece 1, processing water (cutting water) made of pure water or the like is supplied to the cutting blade 48 and the workpiece 1. The cutting water removes the cutting chips and processing heat.

[0039] 2, the processing unit 26 further includes a blade cover 52 that covers the cutting blade 48, and a processing water supply nozzle 54 connected to the blade cover 52. In addition, a processing water jetting nozzle (not shown) that jets processing water onto the cutting blade 48 is provided inside the blade cover 52. The processing water is supplied to the cutting blade from the processing water supply nozzle 54 and the processing water jetting nozzle.

[0040] The blade cover 52 incorporates a liquid supply path whose end leads to the processing water supply nozzle 54 or the processing water spray nozzle, and the start point of the liquid supply path is provided with a connection part 62. The end of the processing water supply path of the processing water supply device according to this embodiment is connected to the connection part 62, and processing water is supplied from the processing water supply device.

[0041] 1 captures an image of the surface 1a of the workpiece 1 held by the chuck table 20. The imaging unit 46 includes an imaging element such as a CCD camera or a CMOS sensor. The captured image obtained by the imaging unit 46 is used to position the processing unit 26 so as to process a predetermined location. In addition, by obtaining a captured image showing the processed area of ​​the workpiece 1, the quality of the processing results can be evaluated.

[0042] A cleaning unit 56 for cleaning the processed workpiece 1 is provided behind the opening 14 of the base 4. The processed workpiece 1 is transported from the chuck table 20 to the cleaning unit 56 by a transport unit (not shown).

[0043] The cleaning unit 56 includes a spinner table 58 that holds the workpiece 1 by suction within a cylindrical cleaning space. Also, above the spinner table 58, a spray nozzle 60 is arranged that sprays a cleaning fluid (typically a two-fluid mixture of water and air) toward the workpiece 1. The workpiece 1 can be cleaned by rotating the spinner table 58 that holds the workpiece 1 and spraying the cleaning fluid from the spray nozzle 60. The workpiece 1 cleaned in the cleaning unit 56 is stored in a cassette 12 by, for example, a transport unit (not shown).

[0044] When the workpiece 1 is cut by the processing device (cutting device) 2, static electricity is generated, which may cause electrostatic damage to devices 5 and the like formed on the workpiece 1. Static electricity is also generated and causes problems when processing the workpiece 1 with processing devices other than cutting devices. Therefore, in order to remove the static electricity that is generated while processing the workpiece 1, carbon dioxide is mixed into the processing water supplied to the processing tool such as the cutting blade 48, and processing water with a reduced resistivity is supplied to the processing tool.

[0045] However, in conventional technology, a carbon dioxide cylinder had to be prepared as a supply source of carbon dioxide to be mixed with the processing water. When the carbon dioxide cylinder became empty, the cylinder had to be replaced. Therefore, a considerable cost was continually incurred to supply the processing water mixed with carbon dioxide to processing tools such as the cutting blade 48. Therefore, the processing water supply device according to this embodiment supplies the processing water mixed with carbon dioxide to the processing device 2 with low operating costs.

[0046] Next, the processing water supply device 64 according to this embodiment will be described. Fig. 3 is a cross-sectional view schematically showing an example of the processing water supply device 64. Fig. 1 is a perspective view schematically showing the processing water supply device 64 connected to the processing device 2. However, the processing water supply device 64 does not have to be provided externally to the processing device 2. In other words, the processing device 2 may have the processing water supply device 64 built in. The processing water supply device 64 supplies processing water to the processing unit 26 arranged in the processing device 2.

[0047] The processing water supply device 64 has, for example, a housing 64a that houses various components, and is connected to a processing water supply source 66 through an upstream pipe 68, and is also connected to the processing device 2 through a downstream pipe 70. The housing 64a may be formed with an air vent 74 that allows air to flow in and out between the inside and outside, and the air vent 74 may be provided with a filter to remove dust and the like.

[0048] The processing water supply source 66 is a facility in the device chip factory where the processing apparatus 2 is installed, and is a pure water tank for storing pure water or a pure water generator for generating pure water from city water. Alternatively, the processing water supply device 64 is a pure water recycling device disposed near or inside the processing apparatus 2 for purifying the processing water, cooling water, etc. used in the processing apparatus 2 to regenerate pure water.

[0049] 3 is a cross-sectional view schematically illustrating the internal configuration of a housing 64a of an example processing water supply device 64. The processing water supply device 64 has a liquid supply path 72a connected to the processing water supply source 66 through an upstream pipe 68 and a liquid supply path 72b connected to the processing unit 26 of the processing apparatus 2 through a downstream pipe 70. The liquid supply paths 72a and 72b form a processing water supply path 72. That is, the processing water supply path 72 is a path through which processing water supplied from the processing water supply source 66 is supplied to the processing unit 26 of the processing apparatus 2.

[0050] The processing water supply device 64 includes a dispersion / outflow section 78 provided at the end of the liquid supply path 72a, i.e., provided midway along the processing water supply path 72. The dispersion / outflow section 78 causes processing water 80 supplied from the upstream side of the processing water supply path 72 to flow out while dispersing the water into the space 76. The dispersion / outflow section 78 is, for example, a shower nozzle having a plurality of outlets (not shown) formed on the underside thereof and communicating with an internal space (not shown). The processing water 80 sent to this internal space through the liquid supply path 72a flows out from the outlets while being dispersed into the space 76.

[0051] The processing water supply device 64 also includes a processing water receiver 82 provided at the start of the liquid supply path 72b, i.e., provided midway along the processing water supply path 72. The processing water receiver 82 is, for example, a water tank containing the space 76, and the liquid supply path 72b is connected to the lower side surface thereof. The processing water receiver 82 receives and stores the processing water 80 dispersed into the space 76 from the dispersion outlet 78. The processing water 80 received by the processing water receiver 82 flows into the liquid supply path 72b, i.e., downstream of the processing water supply path 72. A pump for flowing the processing water 80 may be provided in the liquid supply path 72b.

[0052] The upper end of the tank-shaped processing water receiving portion 82 is open, and the processing water receiving portion 82 is not isolated from the external area where the processing water supply device 64 and the processing device 2 are placed. For example, the housing 64a of the processing water supply device 64 is formed with a vent hole 74 (see FIG. 1) that communicates with the inside and outside of the housing 64a, and gas can enter and exit through this vent hole 74. In other words, the space 76 is connected to this external area, and gas can move freely between the space 76 and the external area.

[0053] Here, carbon dioxide is emitted from people and some of the equipment in the area outside where the processing equipment 2, etc. is placed. In addition, carbon dioxide enters the factory, etc. where the processing equipment 2 is installed from the outside. Therefore, carbon dioxide generated in the area where the processing equipment 2 is placed and carbon dioxide present in the atmosphere enter the space 76 of the processing water supply device 64, and this carbon dioxide comes into contact with and dissolves in the processing water 80 that has dispersed and flowed out into the space 76.

[0054] That is, when the processing water 80 supplied from the processing water supply source 66 is discharged from the dispersion discharge section 78 while being dispersed throughout the space 76, the processing water receiving section 82 receives the processing water 80 with carbon dioxide dissolved therein. Therefore, the processing water 80 with carbon dioxide dissolved therein is stored in the processing water receiving section 82, and the processing water 80 with carbon dioxide dissolved therein is supplied to the processing unit 26 of the processing device 2 through the liquid transfer path 72b of the processing water supply path 72 and the downstream piping 70.

[0055] In this way, the processing water supply device 64 according to this embodiment can generate processing water 80 containing dissolved carbon dioxide without using a carbon dioxide cylinder and supply it to the processing device 2. This eliminates the need for carbon dioxide exchange, and allows the processing water 80 containing carbon dioxide to be supplied to the processing device 2 at low operating costs. Furthermore, since carbon dioxide, a greenhouse gas, can be reduced, the processing water supply device 64 also contributes to environmental issues.

[0056] Fig. 4 is a cross-sectional view schematically showing another example of a processing water supplying device 84. As shown in Fig. 4, in the processing water supplying device 84, a space 88 through which processing water 94 disperses and flows out is surrounded by a box-shaped outer wall 86. A dispersion and outflow section 92 and a processing water receiving section 96 are disposed inside the outer wall 86.

[0057] The box-shaped outer wall 86 may be a housing corresponding to the housing 64a of the processing water supply device 64 shown in Fig. 1, or may be a separate body housed in the housing 64a. The outer wall 86 surrounds the space 88, thereby preventing the processing water 94 from scattering to the outside and preventing foreign matter from entering the processing water 94 from the outside.

[0058] The processing water supply device 84 has a liquid supply path 90a connected to the processing water supply source 66 through the upstream piping 68 shown in Fig. 1, and a liquid supply path 90b connected to the processing unit 26 of the processing device 2 through the downstream piping 70 shown in Fig. 1. The liquid supply paths 90a and 90b constituting the processing water supply path each penetrate the outer wall 86.

[0059] A dispersion and outflow section 92 is connected to the end of the liquid supply path 90a, and the dispersion and outflow section 92 disperses processing water 94 supplied from the upstream side of the processing water supply path into the space 88 while discharging the processing water 94. A processing water receiving section 96 is connected to the start point of the liquid supply path 92b, and receives and stores the processing water 94 dispersed into the space 88 from the dispersion and outflow section 92. The processing water 94 received by the processing water receiving section 96 flows into the liquid supply path 90b, i.e., the downstream side of the processing water supply path.

[0060] Here, an air intake port 98 is formed in the outer wall 86, connecting the space 88 with the outside of the outer wall 86, and carbon dioxide flows into the interior of the outer wall 86 together with air through the air intake port 98. A filter 102 is disposed in the air intake port 98, which removes foreign matter from the air that passes through the air intake port 98 and flows into the space 88. In the space 88, the air comes into contact with the dispersed and discharged processing water 94, and the carbon dioxide in the air is absorbed by the processing water 94.

[0061] Furthermore, the outer wall 86 is formed with an exhaust port 100 that connects the space 88 with the outside of the outer wall 86, and the air that has absorbed carbon dioxide in the space 88 flows out to the outside of the outer wall 86 through the exhaust port 100. Therefore, while the air travels through the space 88 inside the outer wall 86 from the intake port 98 to the exhaust port 100, carbon dioxide contained in the air is absorbed into the processing water 94.

[0062] In addition, a blower (ventilation fan) 104 may be provided at one or both of the air intake port 98 and the exhaust port 100, which draws air into the space 88 from the air intake port 98 and exhausts the air from the space 88 through the exhaust port 100. When the blower 104 is provided, carbon dioxide continues to be taken into the interior of the outer wall 86 together with the air.

[0063] The exhaust port 100 may be provided with a filter that prevents the processing water 94 from scattering from the exhaust port 100 and removes foreign matter from the air that flows back through the exhaust port 100 and into the space 88. Alternatively, the exhaust port 100 may be provided with a check valve that prevents the backflow of air instead of a filter.

[0064] The filter 102 disposed in the intake port 98 and the filter disposed in the exhaust port 100 may be a HEPA filter or a ULPA filter. If boron contamination in the processing water 94 is a problem, a filter using PTFE (polytetrafluoroethylene) as a filter material may be used instead of a HEPA filter, etc. However, the filter is not limited to these.

[0065] Fig. 5 is a cross-sectional view schematically illustrating a processing water supplying apparatus 106 according to yet another example of the present embodiment. The processing water supplying apparatus 106 shown in Fig. 5 has a space 110 surrounded by an outer wall 108 that also functions as a processing water receiving section 118, and a dispersion and outflow section 114 housed inside the outer wall 108. A liquid supply path 112a penetrating the outer wall 108 is connected to the dispersion and outflow section 114, and a liquid supply path 112b is connected to the lower side surface of the outer wall 108 that functions as the processing water receiving section 118. The outer wall 108 may function as a housing for the processing water supplying apparatus 106.

[0066] The outer wall 108 is provided with an intake port 122 provided with a filter 126 and an exhaust port 124 provided with a filter 128. One or both of the intake port 122 and the exhaust port 124 may be provided with a blower (ventilation fan).

[0067] A plurality of spherical fillers 120 are accommodated in a processing water receiving section 118, which is the bottom of the outer wall 108. The fillers 120 are formed of a material such as glass, metal, ceramics, or resin. The shape of the fillers 120 does not need to be a perfect sphere, and the surface does not need to be spherical. The surface of the fillers 120 may have recesses or protrusions, and the fillers 120 may be shaped like rocks. Some of the fillers 120 are exposed at a position higher than the surface of the processing water 116 stored in the processing water receiving section 118.

[0068] When the filler 120 is accommodated in the processing water receiving section 118, the processing water 116 dispersed into the space 110 from the dispersion outlet section 114 collides with the filler 120 and falls downward along the surface of the filler 120. During this process, the processing water 116 comes into contact with the air in the space 110 on the surface of the filler 120 and absorbs carbon dioxide from the air.

[0069] When the processing water receiving section 118 does not contain the filler 120, the processing water 116 falling through the space 110 comes into contact with carbon dioxide in the space 110 and absorbs carbon dioxide during the limited time it takes to fall through the space 110. In contrast, when the processing water receiving section 118 contains the filler 120, the processing water 116 comes into contact with air over a relatively long time and over a relatively wide surface area of ​​the filler 120. As a result, the carbon dioxide in the air is more efficiently absorbed into the processing water 116.

[0070] As described above, in the processing water supply devices 64, 84, 106 according to the present embodiment, the processing water 80, 94, 116 absorbs carbon dioxide in the air as it disperses and flows out from the dispersion and outflow sections 78, 92, 114 into the spaces 76, 88, 110 and falls. Therefore, the processing water supply devices 64, 84, 106 can supply the processing water 80, 94, 116 mixed with carbon dioxide to the processing device 2 at low operating costs without using a carbon dioxide cylinder.

[0071] The present invention is not limited to the above-described embodiment and can be implemented with various modifications. For example, in the above-described embodiment, carbon dioxide is mixed into the processing water 80, 94, 116 without using a carbon dioxide cylinder, but one aspect of the present invention is not limited to this. That is, in the processing water supply device according to one aspect of the present invention, a carbon dioxide cylinder may be used as needed.

[0072] If the amount of carbon dioxide in the air present in the space 76, 88, 110 is insufficient, it is conceivable that a sufficient amount of carbon dioxide will not be taken up into the processing water 80, 94, 116 simply by dispersing and flowing out from the dispersion and outflow section 78, 92, 114 into the space 76, 88, 110 and dropping. Therefore, in the processing water supply device 64, 84, 106 according to one embodiment of the present invention, the amount of carbon dioxide taken up into the processing water 80, 94, 116 may be evaluated downstream of the processing water receiving section 82, 96, 118 of the processing water supply path.

[0073] For example, the processing water supply device 64, 84, 106 may be provided with a resistivity meter that measures the resistivity of the processing water 80, 94, 116 downstream of the processing water receiving section 82, 96, 118 in the processing water supply path. If the resistivity of the processing water 80, 94, 116 measured by the resistivity meter exceeds a predetermined threshold, the supply of the processing water 80, 94, 116 to the processing device 2 may be stopped. Alternatively, in this case, carbon dioxide may be supplied from a carbon dioxide cylinder to the processing water 80, 94, 116 stored in the processing water receiving section 82, 96, 118.

[0074] Even when a carbon dioxide cylinder is used, it is sufficient to supplement the carbon dioxide that is insufficient in the processing water 80, 94, 116, so the amount of carbon dioxide supplied from the carbon dioxide cylinder can be relatively small.

[0075] In the above embodiment, the processing water 80, 94, 116 mixed with carbon dioxide received in the processing water receiving sections 82, 96, 118 is supplied to the processing device 2, but this aspect of the present invention is not limited to this. That is, in one aspect of the present invention, the processing water 80, 94, 116 mixed with carbon dioxide does not have to be directly supplied to the processing device 2.

[0076] For example, the processing water supply device 64, 84, 106 according to one embodiment of the present invention may be provided with a temperature adjustment mechanism, such as a heater or Peltier element, inside or outside the housing 64a for adjusting the temperature of the processing water 80, 94, 116. Also, a filter for removing contaminants from the processing water 80, 94, 116 may be provided inside or outside the housing 64a.

[0077] The processing water 80, 94, 116 may have its temperature adjusted by a temperature adjustment mechanism and may have contaminants and the like removed by a filter before being supplied to the processing device 2. In this case, the processing water 80, 94, 116 of a quality suitable for the processing performed by the processing device 2 can be supplied to the processing device 2.

[0078] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0079] 1 Workpiece 1a surface 1b back side 3 Planned division line 5 Devices 7 Ring Frame 9 adhesive tape 11 Frame Unit 13 Machining marks 2 Processing equipment 4 Foundation 6 Corner 8 aperture 10 Cassette support stand 12 cassettes 14 Aperture 16 Table Cover 18 Dustproof and water-resistant cover 20 Chuck table 22 Holding surface 24 Clamp 26 Processing Unit 28 Support structure 30a Indexing feed unit 30b Lifting unit 32,38 Guide rail 34,40 Moving plate 36,42 Ball screw 44 Z-axis pulse motor 46 Imaging unit 48 Cutting Blade 50 Spindle housing 52 Blade Cover 54 Processing water supply nozzle 56 Cleaning Unit 58 Spinner Table 60 spray nozzle 62 Connection 64,84,106 Processing water supply equipment 64a case 66 Processing water supply source 68 Upstream piping 70 Downstream piping 72 Processing water supply route 72a, 72b, 90a, 90b, 112a, 112b Liquid transfer path 72b Liquid transport path 74 Ventilation 76,88,110 space 78,92,114 Dispersion outlet 80,94,116 Processed water 82,96,118 Processing water receiving section 86,108 exterior walls 98,122 Air intake 100,124 Exhaust port 102,126,128 filters 104 Blower 120 Filling material

Claims

1. A processing water supply device that supplies processing water to a processing unit disposed in a processing device, a processing water supply path connected to a processing water supply source on an upstream side and connected to the processing unit on a downstream side for supplying processing water to the processing unit; a dispersion and outflow section provided in the processing water supply path, through which the processing water supplied from the upstream side flows out while being dispersed into a space; a processing water receiving section that is provided in the processing water supply path, receives the processing water dispersed in the space from the dispersion outlet section, and causes the received processing water to flow downstream of the processing water supply path, The space is surrounded by an outer wall, The dispersion and outflow section and the processing water receiving section are disposed inside the outer wall, an air intake port connecting the space to the outside of the outer wall is formed in the outer wall; a filter is provided in the air intake port to remove foreign matter from the air that passes through the air intake port and flows into the space; In the space, the carbon dioxide in the space is dissolved in the processing water that flows out from the dispersion outflow portion into the space, The processing water supply device is characterized in that the processing water receiving section receives the processing water in which carbon dioxide is dissolved.

2. an exhaust port connecting the space to the outside of the outer wall is formed in the outer wall; 2. The processing water supply device according to claim 1, wherein one or both of the air intake port and the air exhaust port are provided with a blower that introduces air into the space through the air intake port and exhausts the air from the space through the air exhaust port.

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