Storage Media Module

Abstract

This storage medium module comprises: a substrate having a first plane and a second plane that is on the reverse side from the first plane; a first connector that is mounted on the first plane of the substrate and detachably connected to an electric apparatus; and a second connector that is mounted on the first plane so as to be set apart from the first connector in the longitudinal direction of the substrate, a storage medium being connected to the second connector. The substrate includes a flexible first section that extends between the first and second connectors, the first section being configured to be bent.

Description

[Technical Field]

[0001] The present disclosure relates to storage media modules. [Background technology]

[0002] Some storage media, such as SSDs (solid state drives) and HDDs (hard disk drives), on which various information is recorded, are built into electronic devices. For example, Patent Document 1 discloses a memory unit equipped with a memory card or the like and built into a mobile device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-288565 Summary of the Invention

[0004] In recent years, there has been a demand for a storage medium module having a recording medium on which such information is recorded that can be detachably attached to an electronic device, while preventing the storage medium module from being damaged.

[0005] Therefore, an object of the present disclosure is to provide a storage medium module that is detachable from an electronic device and that is less likely to be damaged.

[0006] A storage medium module according to the present disclosure includes a substrate having a first surface and a second surface opposite to the first surface, a first connector mounted on the first surface of the substrate and detachably connected to an electronic device, and a second connector mounted on the first surface and spaced apart from the first connector in the longitudinal direction of the substrate and connected to a storage medium. The substrate includes a flexible first portion extending between the first connector and the second connector, the first portion being curved.

[0007] According to an embodiment of the present disclosure, a storage medium module can be provided that is detachable from an electronic device and that is less likely to be damaged. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic perspective view of an electronic device to which a storage medium module according to an embodiment of the present disclosure is attached. [Figure 2] 2 is a schematic perspective view showing a state in which a storage medium module is housed in a module housing section in the electronic device shown in FIG. 1. FIG. [Figure 3] 2 is an enlarged view of a module housing section of the electronic device shown in FIG. 1. FIG. [Figure 4] FIG. 1 is a schematic perspective view of a storage medium module according to an embodiment of the present disclosure. [Figure 5] FIG. 5 is a schematic exploded view of the storage medium module shown in FIG. [Figure 6] 5 is a schematic top perspective view of the storage medium module shown in FIG. 4, with the module housing omitted. FIG. [Figure 7] 5 is a schematic side view of the storage medium module shown in FIG. 4, with the module housing omitted. FIG. [Figure 8] FIG. 8 is an enlarged view of a part of FIG. 7. [Figure 9] 5 is a schematic perspective view from below of the storage medium module shown in FIG. 4, with the module housing omitted. FIG. [Figure 10] 5A to 5C are diagrams illustrating the operation of the storage medium module shown in FIG. 4 when the storage medium module is attached to an electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Background to this disclosure) In recent years, there has been a growing demand for safer handling of storage media containing confidential information. Therefore, electronic devices with built-in storage media must be stored securely. However, storing the entire electronic device requires a large storage space and poses problems such as the inability to take the electronic device outside the company.

[0010] Therefore, the inventors considered making a storage medium module with a storage medium attached detachable from an electronic device so that the storage medium can be managed separately from the electronic device. For example, a method of externally connecting a module to an electronic device via a connection cable such as USB has already been adopted as a storage medium module detachably attached to an electronic device. However, connecting a module externally via USB or the like is not suitable for electronic devices that require waterproof and dustproof properties. Therefore, the inventors considered a storage medium module that can be detachably stored inside an electronic device.

[0011] In developing a storage media module that can be removably stored in such electronic devices, the inventors discovered a new problem in that when the storage media module is inserted or removed from the electronic device, the storage media module is damaged by the impact of inserting or removing the connector of the storage media module.

[0012] As a result of intensive research into solving these problems, the inventors discovered a storage medium module that can be detachably installed within an electronic device and has a configuration that can reduce the risk of damage, leading to the present disclosure.

[0013] A storage medium module of a first aspect of the present disclosure comprises a substrate having a first surface and a second surface opposite the first surface, a first connector mounted on the first surface of the substrate and detachably connected to an electronic device, and a second connector mounted on the first surface at a distance from the first connector in the longitudinal direction of the substrate and to which a storage medium is connected, wherein the substrate includes a flexible first portion extending between the first connector and the second connector, and the first portion is curved.

[0014] This configuration allows the storage medium to be removed from the electronic device and managed separately from the electronic device. Furthermore, this configuration allows the first portion to absorb a portion of an external force applied to the storage medium module, thereby reducing the force transmitted to the second connector or the storage medium module.

[0015] The storage medium module according to the second aspect of the present disclosure may further include a buffer member on the second surface, the buffer member being positioned so as to overlap the second connector when viewed in the thickness direction of the board.

[0016] With this configuration, part of the force applied to the second connector in the thickness direction from the second surface is absorbed by the buffer member, thereby reducing the force transmitted to the second connector and the storage medium module.

[0017] In a storage medium module of a third aspect of the present disclosure, the substrate has one end in the longitudinal direction and another end opposite the one end, the first connector and the second connector are arranged at a distance from the one end and the other end, the second connector is arranged at a position closer to the other end than the first connector, the substrate includes a second portion extending between the one end and the first connector, and is bent between the one end and the second connector with the second surface facing inward, at least a portion of the first portion and at least a portion of the second portion are arranged in a position overlapping when viewed from the thickness direction of the substrate, and the buffer member may be arranged on the second surface of the second portion.

[0018] With this configuration, the first portion and the buffer member absorb part of the force applied from outside the storage medium module, thereby reducing the force transmitted to the second connector and the storage medium module.

[0019] In the storage medium module according to the fourth aspect of the present disclosure, wiring for transmitting high-speed signals may be provided on the first surface of the first portion.

[0020] With this configuration, the transmission distance of high-speed signals can be shortened, and high-speed signal transmission performance can be ensured.

[0021] In the storage medium module according to the fifth aspect of the present disclosure, the first connector may include a low-speed signal pin and a high-speed signal pin that is positioned closer to the second connector than the low-speed signal pin.

[0022] With this configuration, the transmission distance of high-speed signals can be shortened, and high-speed signal transmission performance can be ensured.

[0023] In a storage medium module of a sixth aspect of the present disclosure, the substrate may be a flexible printed circuit board, and the storage medium module may include a reinforcing plate arranged on the second surface in a position overlapping the storage medium and the second connector when viewed in the thickness direction of the substrate.

[0024] With this configuration, the second connector and the storage medium are held stably.

[0025] In the storage medium module according to the seventh aspect of the present disclosure, the longitudinal direction of the substrate may be a direction in which the storage medium module is attached to and detached from the electronic device, and the first portion may be curved in a thickness direction of the substrate.

[0026] With this configuration, for example, when attaching or detaching the storage medium module to or from the electronic device, the first part can absorb part of the force applied to the storage medium module via the first connector, thereby reducing the force transmitted to the second connector or the storage medium module.

[0027] In the storage medium module of the eighth aspect of the present disclosure, the first portion may include a first curved portion that curves in a direction from the second surface toward the first surface, a second curved portion that connects to the first curved portion and curves in a direction from the second connector toward the first connector, and a third curved portion that connects to the second curved portion and curves in a direction from the first surface toward the second surface.

[0028] With this configuration, when an external force is applied to the storage medium module, the first portion can absorb part of the force, thereby reducing the force transmitted to the second connector and the storage medium module.

[0029] A ninth storage medium module of the present disclosure may further include a module housing that supports the substrate.

[0030] With this configuration, the board is supported by the module housing, and the storage medium module can be easily attached to and detached from the electronic device.

[0031] An electronic device according to a tenth aspect of the present disclosure may include the storage medium module according to any one of the first to tenth aspects.

[0032] This configuration allows the storage medium to be stored separately from the electronic device. This configuration also allows information to be shared among multiple electronic devices via the storage medium module. This configuration also allows a single electronic device to process data stored on multiple storage media.

[0033] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In each drawing, elements are exaggerated for ease of explanation.

[0034] As used herein, terms such as "first," "second," etc. are used for descriptive purposes only and should not be understood as expressing or implying the relative importance or ranking of technical features. Features qualified as "first" and "second" expressly or imply the inclusion of one or more of such features.

[0035] In the accompanying drawings, the X1, Y1, and Z1 directions respectively indicate the width, depth, and height directions of the electronic device 1. In the accompanying drawings, the X2, Y2, and Z2 directions respectively indicate the length, width, and thickness directions of the storage medium module 100, the module housing 20, and the substrate 50.

[0036] (Embodiment 1) (Overall configuration of electronic device) Fig. 1 is a schematic perspective view of an electronic device 1 to which a storage medium module 100 according to an embodiment of the present disclosure is attached. As shown in Fig. 1, the electronic device 1 is a notebook personal computer (laptop PC). The electronic device 1 includes a first housing 2 and a second housing 3. The first housing 2 and the second housing 3 each have a thin, box-like outer shell and are rectangular in shape.

[0037] As shown in FIG. 1 , the first housing 2 and the second housing 3 are connected via a hinge 7. The hinge 7 rotatably connects the first housing 2 and the second housing 3. The hinge 7 allows the first housing 2 and / or the second housing 3 to rotate, switching the electronic device 1 between an open state and a closed state. The "open state" refers to a state in which the first housing 2 and the second housing 3 are separated, exposing the display unit 4 and the input interfaces 5 and 6. The "closed state" refers to a state in which the first housing 2 and the second housing 3 are disposed opposite each other, the display unit 4 and the input interfaces 5 and 6 face each other, and the display unit 4 and the input interfaces 5 and 6 are not exposed.

[0038] The first housing 2 and the second housing 3 are made of a metal material, for example, a magnesium alloy.

[0039] (1st cabinet) The first housing 2 houses a display unit 4. The display unit 4 is, for example, a liquid crystal display. The display surface of the display unit 4 is exposed from the first housing 2. The first housing 2 also houses a camera, an antenna, and the like.

[0040] (Second housing) The second housing 3 houses an input interface. The input interface is, for example, a keyboard 5 and a touchpad 6. The input interface is exposed from the surface of the second housing 3. In this specification, the keyboard 5 and the touchpad 6 may be referred to as the input interfaces 5, 6. The second housing 3 also houses circuits such as a CPU and memory.

[0041] In this specification, the surface of the second housing 3 on which the input interface is exposed is also referred to as the top surface of the second housing 3. The surface of the second housing 3 opposite the top surface is also referred to as the bottom surface of the second housing 3. The surface connecting the top surface and bottom surface is also referred to as the side surface 3A of the second housing 3. In addition, the side of the side surface 3A of the second housing 3 that connects to the first housing 2 is also referred to as the back surface of the second housing 3, and the surface opposite the back surface is also referred to as the front surface of the second housing 3.

[0042] 2 is a schematic perspective view showing a state in which a storage medium module 100 is stored in a module storage unit 10. As shown in FIG. 2, the second housing 3 further includes a module storage unit 10 that stores the storage medium module 100. The white arrow along the X1 direction shown in FIG. 2 indicates the direction in which the storage medium module 100 is removed from the electronic device 1. In this embodiment, the module storage unit 10 is provided on, for example, a side surface 3A of the second housing 3.

[0043] (Module storage section) 2, the module storage unit 10 includes an opening 11 for attaching and detaching the storage medium module 100, and a lid 17 for opening and closing the opening 11. The opening 11 is provided, for example, on a side surface 3A of the second housing 3. The lid 17 is connected to the second housing 3 via, for example, a hinge.

[0044] FIG. 3 is an enlarged view of the module storage section 10. As shown in FIG. 3, the module storage section 10 is defined by the inner walls of the second housing 3. The inner walls defining the module storage section 10 include, for example, a first inner wall 12A, a second inner wall 12B, a third inner wall 12C, a fourth inner wall 12D, and a fifth inner wall 12E. The first inner wall 12A is an inner wall close to the top surface of the second housing 3. The third inner wall 12C faces the first inner wall 12A and is an inner wall close to the bottom surface of the second housing 3. The second inner wall 12B is an inner wall close to the front surface of the second housing 3. The fourth inner wall 12D faces the second inner wall 12B and is an inner wall close to the back surface of the second housing 3. The fifth inner wall 12E is the innermost inner wall of the second housing 3 when viewed from the opening 11. In this specification, the expression "opposing" two inner walls means that the two inner walls are arranged facing each other, and is not limited to the two inner walls being arranged in parallel.

[0045] More specifically, the first to fourth inner walls 12A to 12D each have one end close to the side surface 3A of the second housing 3 and the other end far from the side surface 3A of the second housing 3 in the X1 direction, and extend in the X1 direction. The fifth inner wall 12E extends in the Y1 direction. In the Y1-Z1 cross section of the module storage section 10, the first to fourth inner walls 12A to 12D have a substantially rectangular shape.

[0046] The module storage section 10 may include members other than the inner walls of the second housing 3. Furthermore, the first inner wall 12A to the fifth inner wall 12E are not limited to flat surfaces, and may include steps, irregularities, etc.

[0047] 3, the module storage unit 10 includes a module connection terminal 13. The module connection terminal 13 is connected to the first connector 30 of the storage medium module 100 when the storage medium module 100 is stored in the module storage unit 10.

[0048] The module connection terminal 13 includes a terminal 14 for high-speed signals, a terminal 15 for low-speed signals, and a first support member 16. A high-speed signal is, for example, a signal of 5 Gbps (2.5 GHz) or more. A high-speed signal is, for example, a signal such as PCI Express, USB, or HDMI (registered trademark). A low-speed signal is a signal slower than a high-speed signal, for example, a signal less than 5 Gbps (2.5 GHz). A low-speed signal is, for example, a signal such as I2C or an SSD detection signal. The module connection terminal 13 is arranged, for example, on the fifth inner wall 12E.

[0049] The first support member 16 supports the terminals 14 for high-speed signals and the terminals 15 for low-speed signals. The first support member 16 extends in the depth direction Y1. The first support member 16 has a first guide portion 16A at each end in the depth direction Y1. The first guide portions 16A are used to guide the storage medium module 100 when the storage medium module 100 is attached to or detached from the module storage unit 10.

[0050] The first guide portion 16A protrudes, for example, from the fifth inner wall 12E toward the opening 11 in the width direction X1. The first guide portion 16A is, for example, a pin. The first guide portion 16A has, for example, a columnar shape such as a quadrangular prism. The first guide portion 16A may have a pointed tip.

[0051] The high-speed signal terminal 14 and the low-speed signal terminal 15 are provided, for example, on the fifth inner wall 12 E. The high-speed signal terminal 14 is provided above the low-speed signal terminal 15 .

[0052] Each of the high-speed signal terminal 14 and the low-speed signal terminal 15 may include multiple pins. In this case, the multiple pins of the high-speed signal terminal 14 and the multiple pins of the low-speed signal terminal 15 are arranged, for example, at equal intervals in the depth direction Y1. The multiple pins of the high-speed signal terminal 14 are provided above the multiple pins of the low-speed signal terminal 15.

[0053] (Storage media module) Fig. 5 is a schematic exploded view of the storage medium module 100. As shown in Fig. 5, the storage medium module 100 includes a module housing 20 and a substrate 50 that is housed within and supported by the module housing 20. A first connector 30 and a second connector 40 are mounted on the substrate 50.

[0054] The storage medium module 100 has a generally rectangular parallelepiped shape with a longitudinal direction X2, a lateral direction Y2, and a thickness direction Z2. The storage medium module 100 is attached to and detached from the electronic device 1 with the longitudinal direction X2 aligned with the width direction X1 of the electronic device 1. In other words, the longitudinal direction X2 of the storage medium module 100 is the direction in which it is attached to and detached from the electronic device 1.

[0055] In the first embodiment, the direction of attachment / detachment to / from the electronic device 1 is the longitudinal direction X2 of the storage medium module 100, but this is not limited to this. For example, the storage medium module according to the present disclosure may have a shape in which the longitudinal direction and the lateral direction of the storage medium module according to the first embodiment are reversed.

[0056] (Module housing) Figure 4 is a schematic perspective view of the storage medium module 100. As shown in Figure 4, a module housing 20 defines the outer periphery of the storage medium module 100. The module housing 20 has a substantially rectangular parallelepiped shape with a longitudinal direction X2, a lateral direction Y2, and a thickness direction Z2 that are respectively the same as the longitudinal direction X2, lateral direction Y2, and thickness direction Z2 of the storage medium module 100. The module housing 20 has an opening 21 at one end in the longitudinal direction X2. A first connector 30 is exposed from the opening 21.

[0057] 5, the module housing 20 may include, for example, a first module housing 22 and a second module housing 23, and may contain the substrate 50 by sandwiching the substrate 50 between the first module housing 22 and the second module housing 23. In this case, the first module housing 22 and the second module housing 23 are fixed to each other with screws or the like, for example, with the substrate 50 sandwiched therebetween.

[0058] The module housing 20 is made of a material such as a magnesium alloy.

[0059] (substrate) FIG. 6 is a schematic top perspective view of the storage medium module 100, with the module housing 20 omitted. FIG. 7 is a schematic side view of the storage medium module 100, with the module housing 20 omitted. As shown in FIGS. 6 and 7, the substrate 50 is a thin, plate-like member. A first connector 30 and a second connector 40 are mounted on the substrate 50 at a distance from each other. The substrate 50 includes a first portion 55 extending between the first connector 30 and the second connector 40. The first portion 55 is flexible. The entire substrate 50 may be a flexible member. In this case, however, portions other than the first portion 55 are made rigid using, for example, a reinforcing plate. The substrate 50 is, for example, a flexible printed circuit board.

[0060] The substrate 50 has a first surface 51 and a second surface 52 located opposite the first surface 51. The substrate 50 has a longitudinal direction X2, a lateral direction Y2, and a thickness direction Z2 that are respectively the same as the longitudinal direction X2, lateral direction Y2, and thickness direction Z2 of the storage medium module 100. Therefore, the longitudinal direction X2 of the substrate 50 is the direction in which the storage medium module 100 is attached to and detached from the electronic device 1.

[0061] 7, the substrate 50 has a first end 53 in the longitudinal direction X2 and a second end 54 located opposite the first end 53 in the longitudinal direction X2. The substrate 50 is bent with the second surface 52 facing inward at a position between the first end 53 and the second end 54 and closer to the first end 53 than the second end 54. The detailed shape of the substrate 50 will be described later.

[0062] As shown in FIG. 7 , the first connector 30 and the second connector 40 are mounted on a first surface 51 of a substrate 50. The first connector 30 and the second connector 40 are spaced apart from each other in the longitudinal direction X2 of the substrate 50. The first connector 30 and the second connector 40 are disposed at a distance from a first end 53 and a second end 54 of the substrate 50, respectively. The second connector 40 is disposed closer to the second end 54 than the first connector 30. In other words, the first connector 30 and the second connector 40 are disposed at a distance from the first end 53 and the second end 54 of the substrate 50, respectively. The distance of the second connector 40 from the first end 53 is greater than the distance of the first connector 30 from the first end 53. Here, the distance refers to the length along the first surface 51 of the substrate 50.

[0063] The substrate 50 includes, in addition to the first portion 55, a second portion 56, a third portion 57, and a fourth portion 58. The second portion 56 extends between the first connector 30 and the first end 53. The third portion 57 connects the first portion 55 and the second portion 56, and the first connector 30 is mounted on the third portion 57. The fourth portion 58 connects to the first portion 55 and extends between the first portion 55 and the second end 54. The second connector 40 is mounted on the fourth portion 58. That is, the substrate 50 includes, in order from the second end 54 to the first end 53, the fourth portion 58, the first portion 55, the third portion 57, and the second portion 56.

[0064] The substrate 50 is bent with the second surface 52 facing inward between the first end 53 and the second connector 40. At least a part of the first portion 55 and at least a part of the second portion 56 are arranged in overlapping positions when viewed from the thickness direction Z2 of the substrate 50.

[0065] Fig. 8 is an enlarged view of a portion of Fig. 7. With reference to Figs. 7 and 8, the first portion 55 to the fourth portion 58 will be described in detail in order from the portion closest to the second end 54, and the shape of the substrate 50 will be described in further detail.

[0066] 7, the fourth portion 58 is connected to the second end 54. The fourth portion 58 extends in the longitudinal direction X2 of the substrate 50. The second connector 40 is mounted on the first surface 51 of the fourth portion 58 at a position close to the first portion 55.

[0067] 8, the first portion 55 is connected to the fourth portion 58. The first portion 55 is curved in the thickness direction Z2. For example, the first portion 55 is curved in the thickness direction Z2 of the substrate 50 from the second surface 52 to the first surface 51. At least a portion of the first portion 55 may be curved.

[0068] The first portion 55 includes, for example, a first curved portion 55A, a second curved portion 55B, and a third curved portion 55C. The first curved portion 55A curves in a direction from the second surface 52 toward the first surface 51. The second curved portion 55B connects to the first curved portion 55A and curves in a direction from the second connector 40 toward the first connector 30. The third curved portion 55C connects to the second curved portion 55B and curves in a direction from the first surface 51 toward the second surface 52.

[0069] The third portion 57 is connected to the first portion 55. The third portion 57 extends, for example, in the thickness direction Z2 of the substrate 50. The third portion 57 is connected to the third curved portion 55C of the first portion 55, for example.

[0070] The second portion 56 is connected to the third portion 57. The second portion 56 is also connected to the first end 53. The second portion 56 is curved, for example, in a direction from the first connector 30 toward the second connector 40. The second portion 56 also includes a portion that extends in the longitudinal direction X2 of the substrate 50 and connects to the first end 53, for example.

[0071] At least a portion of the second portion 56 is disposed in a position overlapping at least a portion of the first portion 55 when viewed in the thickness direction Z2 of the substrate 50. Another at least a portion of the second portion 56 may be disposed in a position overlapping at least a portion of the fourth portion 58 when viewed in the thickness direction Z2 of the substrate 50. For example, a part of the portion of the substrate 50 extending in the length direction X2 is disposed in a position overlapping at least a portion of the fourth portion 58 when viewed in the thickness direction Z2 of the substrate 50.

[0072] (Wiring provided on the board) Wiring for transmitting electrical signals between the first connector 30 and the second connector 40 is provided on the first surface 51 and the second surface 52 of the substrate 50.

[0073] Specifically, wiring for transmitting high-speed signals is provided on the first surface 51 of the first portion 55. Wiring for transmitting low-speed signals is provided on the first surface 51 and / or the second surface 52 of the second portion 56. The wiring for transmitting high-speed signals may also be provided on the second surface 52 of the first portion 55. The wiring for transmitting low-speed signals may also be provided on the first surface 51 and / or the second surface 52 of the first portion 55. The wiring for transmitting low-speed signals may further be provided inside the substrate 50.

[0074] The wiring that transmits high-speed signals electrically connects the first high-speed signal pin 31 of the first connector 30 to the second high-speed signal pin of the second connector 40. The wiring that transmits low-speed signals electrically connects the first low-speed signal pin 32 of the first connector 30 to the second low-speed signal pin of the second connector 40. The length of the wiring that transmits high-speed signals from the first connector 30 to the second connector 40 is shorter than the length of the wiring that transmits low-speed signals from the first connector 30 to the second connector 40.

[0075] The first surface 51 and / or the second surface 52 of the third portion 57 and the first surface 51 and / or the second surface 52 of the fourth portion 58 are also provided with wiring for transmitting high-speed signals and wiring for transmitting low-speed signals as appropriate.

[0076] (1st connector) The first connector 30 can be detachably connected to the module connection terminal 13 of the electronic device 1. For example, the first connector 30 is inserted into the module connection terminal 13 and connected to the module connection terminal 13. FIG. 9 is a schematic perspective view of the storage medium module 100 from below, with the module housing 20 omitted. As shown in FIGS. 6 and 9, the first connector 30 includes a first high-speed signal pin 31, a first low-speed signal pin 32, and a second support member 33.

[0077] The second support member 33 extends in the short-side direction Y2 of the substrate 50. The second support member 33 has a protrusion 35 on each end in the short-side direction Y2 of the substrate 50. The protrusions 35 extend in the longitudinal direction X2. The two protrusions 35 have second guide portions 34 on the inner sides facing each other.

[0078] The second guide portion 34 is, for example, a recess formed inside the protrusion 35. The second guide portion 34 guides the storage medium module 100 when the storage medium module 100 is attached to or detached from the electronic device 1. Specifically, the second guide portion 34 accommodates the first guide portion 16A of the module connection terminal 13 and guides the storage medium module 100 when the storage medium module 100 is attached to or detached from the electronic device 1.

[0079] The first high-speed signal pin 31 and the first low-speed signal pin 32 are mounted on the first surface 51 of the third portion 57. The first high-speed signal pin 31 and the first low-speed signal pin 32 are disposed, for example, between two protrusions 35 of the second support member 33. The first high-speed signal pin 31 and the first low-speed signal pin 32 are connected to the high-speed signal terminal 14 and the low-speed signal terminal 15 of the module connection terminal 13, respectively.

[0080] The first high-speed signal pin 31 is disposed closer to the second connector 40 than the first low-speed signal pin 32. This means that the distance between the first high-speed signal pin 31 and the second connector 40 is shorter than the distance between the first low-speed signal pin 32 and the second connector 40. Here, the distance refers to the length along the first surface 51 of the substrate 50.

[0081] The first high-speed signal pins 31 and the first low-speed signal pins 32 may each include a plurality of pins. In this case, for example, the plurality of first high-speed signal pins 31 and the plurality of first low-speed signal pins 32 are each arranged at equal intervals in the short-side direction Y2 of the substrate 50. The plurality of first high-speed signal pins 31 are arranged closer to the second connector 40 than the plurality of first low-speed signal pins 32. In other words, the distance between the plurality of first high-speed signal pins 31 and the second connector 40 is shorter than the distance between the plurality of first low-speed signal pins 32 and the second connector 40.

[0082] 6 and 9, the first high-speed signal pin 31 and the first low-speed signal pin 32 each include, for example, contact portions 31A and 32A that come into contact with the module connection terminals 13 of the electronic device 1, and mounting portions 31B and 32B that are continuous with the contact portions 31A and 32A. The mounting portions 31B and 32B are mounted on the substrate 50 by, for example, soldering. The contact portions 31A and 32A each protrude from the first surface 51 of the substrate 50 and extend in the longitudinal direction X2 of the substrate 50. An insulating member, for example, may be sandwiched between the contact portion 31A of the first high-speed signal pin 31 and the contact portion 32A of the first low-speed signal pin 32 to prevent electrical connection therebetween.

[0083] (Second connector) 6, the second connector 40 includes a third support member 41. The third support member 41 contains second high-speed signal pins (not shown) and second low-speed signal pins (not shown). The third support member 41 is made of an insulating material.

[0084] One end of the second high-speed signal pin and one end of the second low-speed signal pin are mounted on the substrate 50 by, for example, soldering, and are electrically connected to the high-speed signal wiring or the low-speed signal wiring. The other end of the second high-speed signal pin is connected to a high-speed signal terminal (not shown) of the storage medium 60. The other end of the second low-speed signal pin is connected to a low-speed signal terminal (not shown) of the storage medium 60.

[0085] (storage medium) The storage medium 60 is, for example, an SSD or an HDD. The storage medium 60 includes a terminal for high-speed signals and a terminal for low-speed signals. The storage medium 60 may be permanently connected to the second connector 40, or may be detachably connected to the second connector 40.

[0086] (reinforcement plate) 7, the reinforcing plate 70 extends along the longitudinal direction X2 of the substrate 50. The reinforcing plate 70 is disposed on the second surface 52 of the substrate 50 at a position overlapping the second connector 40 and the storage medium 60 when viewed in the thickness direction Z2 of the substrate 50. The reinforcing plate 70 is disposed on the second surface 52 of the fourth portion 58 of the substrate 50, for example.

[0087] The reinforcing plate 70 may be arranged in a range wider than the range overlapping with the second connector 40 and the storage medium 60 when viewed from the thickness direction Z2 of the substrate 50. The reinforcing plate 70 may be arranged in at least a part of the range overlapping with the second connector 40 and the storage medium 60 when viewed from the thickness direction Z2 of the substrate 50. For example, the reinforcing plate 70 may be arranged in a range overlapping with the central portion of the second connector 40 in the short-side direction Y2 of the substrate 50 and the central portion of the storage medium 60 in the short-side direction Y2 of the substrate 50.

[0088] The reinforcing plate 70 is, for example, a rigid, thin plate-like member. The reinforcing plate 70 is fixed to the substrate 50 with, for example, screws. The reinforcing plate 70 is made of, for example, glass epoxy resin.

[0089] (Buffer material) The buffer member 80 is disposed on the second surface 52 at a position overlapping the second connector 40 when viewed in the thickness direction Z2 of the substrate 50.

[0090] The buffer member 80 is disposed on the second surface 52 of the second portion 56, for example, as shown in FIG. 7 . That is, the substrate 50 is bent so that the second surface 52 of the second portion 56 is disposed on the buffer member 80. In this case, the buffer member 80 may be disposed, for example, by being sandwiched between the reinforcing plate 70 and the second surface 52 of the second portion 56. The buffer member 80 may also be disposed on the second surface 52 of the fourth portion 58. In this case, the buffer member 80 may be disposed by being sandwiched between the reinforcing plate 70 and the second surface 52 of the fourth portion 58. Furthermore, the buffer member 80 may be disposed by being sandwiched between the reinforcing plate 70 and the second surface 52 of the fourth portion 58, and between the reinforcing plate 70 and the second surface 52 of the second portion 56. The buffer member 80 is fixed to the second portion 56, the reinforcing plate 70, or the fourth portion 58, for example, by an adhesive or the like.

[0091] Furthermore, the buffer members 80 may be arranged in an area wider than the area overlapping with the second connector 40 when viewed from the thickness direction Z2 of the substrate 50. The buffer members 80 may be arranged in at least a part of the area overlapping with the second connector 40 when viewed from the thickness direction Z2 of the substrate 50. For example, the buffer members 80 may be arranged in stripes in the area overlapping with the second connector 40, or may be arranged scattered throughout that area.

[0092] The buffer member 80 is an elastic member and is made of a material such as rubber or sponge.

[0093] (operation) FIG. 10 is a diagram showing the operation of the storage medium module 100 when the storage medium module 100 is attached to the electronic device 1. As shown in FIG.

[0094] When the storage medium module 100 is inserted into the module storage unit 10 of the electronic device 1 along the longitudinal direction X2 (i.e., the width direction X1 of the electronic device 1), the first guide portion 16A of the module connection terminal 13 is received in the second guide portion 34 of the first connector 30. This guides the storage medium module 100. When the storage medium module 100 is further inserted into the module storage unit 10, the first connector 30 is inserted into the module connection terminal 13, and the storage medium module 100 is attached to the electronic device 1. At this time, as shown in FIG. 10 , for example, the third portion 57 bends in the longitudinal direction X2 of the board 50 in the direction from the first connector 30 to the second connector 40. Furthermore, the curved shape of the first portion 55 of the board 50 changes. This change relieves the stress applied to the first connector 30 when the storage medium module 100 is attached to the electronic device 1, and the force of this stress transmitted to the second connector 40 is reduced. The board 50 then returns to its original shape.

[0095] Furthermore, when the storage medium module 100 attached to the electronic device 1 is pulled along the longitudinal direction X2 in a direction to remove it from the module storage unit 10 of the electronic device 1, for example, the third portion 57 of the substrate 50 bends in the longitudinal direction X2 from the second connector 40 toward the first connector 30. The curved shape of the first portion 55 of the substrate 50 also changes. Thereafter, the substrate 50 returns to its original shape.

[0096] Furthermore, even when an external force is applied to the storage medium module 100 other than when the storage medium module 100 is attached to or detached from such electronic device 1, the first portion 55 may change its curved shape. An example of an external force being applied to the storage medium module 100 is when the electronic device 1 to which the storage medium module 100 is attached is dropped, and a force is applied from the electronic device 1 to the storage medium module 100. Another example is when the storage medium module 100 removed from the electronic device 1 is dropped, and an external force is applied to the storage medium module 100.

[0097] (effect) The storage medium module 100 configured as described above has a first connector 30 that is detachably connected to an electronic device, and the first portion 55 is curved. This allows the storage medium module 100 to be detachably attached to the electronic device 1. Furthermore, the storage medium module 100 can be removed from the electronic device 1 for storage. Furthermore, when the storage medium module 100 is attached to or detached from the electronic device 1, the curved shape of the first portion 55 changes. This change allows the first portion 55 to absorb part of the force applied to the storage medium module 100 via the first connector 30. As a result, damage to the storage medium module 100 is suppressed. Damage to the storage medium module 100 may, for example, be damage to the storage medium module 100 itself. Also, for example, damage to the second connector 40 may occur when the second connector 40 is detached from the substrate 50 due to a force transmitted to the second connector 40 via the first connector 30 and the first portion 55. Furthermore, damage to the storage medium 60 may occur when part of the force transmitted to the second connector 40 is transmitted to the storage medium 60.

[0098] In the storage medium module 100 configured as described above, when a force is applied to the storage medium module 100 from the electronic device 1, for example, when the electronic device 1 to which the storage medium module 100 is attached is dropped, the first portion 55 can absorb a portion of the force. In particular, when a force is applied to the storage medium module 100 along the longitudinal direction X2 of the substrate 50, the first portion 55 can absorb the force. Specifically, the curved shape of the flexible first portion 55 changes, thereby absorbing a portion of the force. This prevents the storage medium module 100 from being damaged.

[0099] In the storage medium module 100 configured as described above, when an external force is applied to the storage medium module 100, for example, by dropping the storage medium module 100 after removing it from the electronic device 1, the first portion 55 can absorb part of the force. For example, when the storage medium module 100 is dropped with the first connector 30 facing downwards, causing a force to be applied to the storage medium module 100 along the longitudinal direction X2 of the board 50, the first portion 55 can absorb the force. Specifically, the curved shape of the flexible first portion 55 changes, thereby absorbing part of the force. This prevents the storage medium module 100 from being damaged.

[0100] In the storage medium module 100 configured as described above, the buffer member 80 can absorb the force applied from the second surface 52 to the second connector 40 in the thickness direction Z2 of the board 50.

[0101] For example, when force is applied to the storage medium module 100 from the electronic device 1, such as when the electronic device 1 to which the storage medium module 100 is attached is dropped, the buffer member 80 can absorb part of the force. In particular, the buffer member 80 can absorb force applied from the electronic device 1 to the board 50 in the thickness direction Z2 of the board 50 via the module housing 20. This prevents the storage medium module 100 from being damaged.

[0102] Furthermore, when force is applied to the storage medium module 100, for example, by dropping the storage medium module 100 after removal from the electronic device 1, the buffer member 80 can absorb part of the force. In particular, the buffer member 80 can absorb force applied from the electronic device 1 to the board 50 in the thickness direction Z2 of the board 50 via the module housing 20. This prevents the storage medium module 100 from being damaged.

[0103] The storage medium module 100 configured as described above has wiring for transmitting high-speed signals provided on the first surface 51 of the first portion 55, and the distance from the first high-speed signal pin 31 to the second connector 40 is shorter than the distance from the first low-speed signal pin 32 to the second connector 40. This allows the storage medium module 100 to shorten the transmission distance of high-speed signals, ensuring excellent high-speed signal transmission performance.

[0104] The storage medium module 100 configured as described above includes a reinforcing plate 70 on the second surface 52 of the flexible substrate 50 at a position that overlaps the second connector 40 and the storage medium 60 when viewed from the thickness direction Z2 of the substrate 50. This allows the storage medium module 100 to stably hold the second connector 40 and the storage medium 60.

[0105] In the storage medium module 100 configured as described above, the flexible substrate 50 is supported by the module housing 20. This allows the storage medium module 100 to be easily attached to and detached from the electronic device 1.

[0106] The storage medium module 100 configured as described above is attachable to and detachable from the electronic device via the first connector 30. This allows the storage medium 60 to be stored separately from the electronic device 1. Furthermore, this allows information to be shared between multiple electronic devices 1 via the storage medium module 100. This also allows one electronic device 1 to process data stored in multiple storage media 60 via the storage medium module 100.

[0107] In the storage medium module 100 configured as described above, rubber can be used as the material for the buffer member 80. This reduces the manufacturing cost of the storage medium module 100. Furthermore, for example, when disposing of the storage medium module 100, the buffer member 80 can be reused in another device or for another purpose.

[0108] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as being included within the scope of the present disclosure as defined by the appended claims unless they depart therefrom. [Industrial Applicability]

[0109] The storage medium module of the present disclosure is applicable to, for example, electronic devices (such as laptop PCs and tablet PCs) because it can safely store storage media. [Explanation of symbols]

[0110] 1 Electronic equipment 2. First enclosure 3 Second enclosure 3A side 4 Display section 5 Keyboard 6 Touchpad 7 Hinge part 10 Module storage area 11 Aperture 12A~12E 1st inner wall~5th inner wall 13 Module connection terminal 14 High-speed signal terminals 15 Terminal for low-speed signals 16 First support member 16A First guide section 17 Lid 20 module housing 21 Aperture 22 First module housing 23 Second module housing 30 First Connector 31 First high-speed signal pin 32 First low-speed signal pin 33 Second support member 34 Second guide section 40 Second Connector 41 third support member 50 boards 51 Page 1 52 2nd page 53 1st end 54 2nd end 55 Part 1 55A First curved section 55B Second curved part 55C Third curved part 56 Part 2 57 Part 3 58 Part 4 60 Storage medium 70 Reinforcement plate 80 Cushioning material 100 Storage Media Module

Claims

1. a substrate having a first surface and a second surface opposite the first surface; a first connector disposed at one end of the substrate and detachably connected to an electronic device; a second connector disposed on the first surface and spaced apart from the first connector in the longitudinal direction of the board, the second connector being connected to a storage medium; Equipped with the substrate includes a first portion that extends between the first connector and the second connector and has flexibility; The first portion is curved.

2. The storage medium module according to claim 1 , further comprising a buffer member on the second surface, the buffer member being arranged at a position overlapping the second connector when viewed in the thickness direction of the board.

3. the substrate has one end in the longitudinal direction and another end opposite to the one end, the first connector and the second connector are disposed apart from the one end and the other end, the second connector is disposed closer to the other end than the first connector, the substrate includes a second portion extending between the one end and the first connector, and is bent between the one end and the second connector with the second surface facing inward; at least a part of the first portion and at least a part of the second portion are disposed at positions overlapping each other when viewed in the thickness direction of the substrate, The storage medium module according to claim 2 , wherein the buffer member is disposed on the second surface of the second portion.

4. 2. The storage medium module according to claim 1, wherein said first surface of said first portion is provided with wiring for transmitting high-speed signals.

5. 5. The storage medium module according to claim 1, wherein the first connector includes a low-speed signal pin and a high-speed signal pin that is positioned closer to the second connector than the low-speed signal pin.

6. the substrate is a flexible printed circuit board, 5. A storage medium module according to claim 1, further comprising a reinforcing plate arranged on the second surface in a position overlapping the storage medium and the second connector when viewed in the thickness direction of the substrate.

7. the longitudinal direction of the substrate is a direction in which the storage medium module is attached to and detached from the electronic device, The storage medium module according to claim 1 , wherein the first portion is curved in a thickness direction of the substrate.

8. The first portion is a first curved portion curved in a direction from the second surface toward the first surface; a second curved portion connected to the first curved portion and curved in a direction from the second connector toward the first connector; a third curved portion connected to the second curved portion and curved in a direction from the first surface toward the second surface; 5. The storage medium module of claim 1, comprising:

9. The storage medium module according to claim 1 , further comprising a module housing that supports the substrate.

10. An electronic device comprising the storage medium module according to any one of claims 1 to 4.

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