Dicing die bonding sheet and method for manufacturing semiconductor device

Abstract

To provide a dicing die bonding sheet with film adhesive that can suppress residual film adhesive in the support film when picking up a semiconductor chip with film adhesive, and a method for manufacturing semiconductor devices using this sheet.SOLUTION: A dicing die bonding sheet (101) has a support film (11) and a thermosetting film adhesive (13) laminated in direct contact on one side of the support film (11), and the film adhesive (13) of the dicing bonding sheet (101) contains an acrylic resin (a) having carboxy groups.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a dicing die bonding sheet and a method for manufacturing a semiconductor device. [Background technology]

[0002] A semiconductor chip is typically die-bonded to the circuit-forming surface of a substrate using a film-like adhesive (sometimes called a "die-bonding film") provided on the backside of the semiconductor chip. Then, if necessary, one or more additional semiconductor chips are stacked on top of the semiconductor chip, wire-bonded, and the entire assembly is sealed with resin to produce a semiconductor package. The desired semiconductor device is then manufactured using this semiconductor package.

[0003] Semiconductor chips having a film adhesive on the backside are produced, for example, by dividing a semiconductor wafer having a film adhesive on the backside and cutting the film adhesive. A widely used method for dividing a semiconductor wafer into semiconductor chips in this way is, for example, dicing the semiconductor wafer together with the film adhesive using a dicing blade. In this case, the film adhesive before cutting is used as a dicing die bonding sheet, which is laminated and integrated with a support sheet used to fix the semiconductor wafer during dicing. After dicing, the semiconductor chips having the film adhesive on the rear surface after cutting (semiconductor chips with film adhesive) are separated from the support sheet and picked up.

[0004] For example, Patent Document 1 discloses a dicing / die bonding sheet (corresponding to the dicing / die bonding sheet) consisting of a substrate, a wire-embedded layer releasably laminated on the substrate, a heat-resistant insulating film laminated on the wire-embedded layer, and an adhesive layer (corresponding to the film-like adhesive) formed on the heat-resistant insulating film. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-53240 Summary of the Invention [Problem to be solved by the invention]

[0006] In conventional dicing die bonding sheets, when a semiconductor chip with a film-like adhesive is separated from a support film that does not have a pressure-sensitive adhesive layer on the side that comes into direct contact with the film-like adhesive and picked up, the film-like adhesive may not adhere to the semiconductor chip, and some of the film-like adhesive may remain on the support film. If such residual film-like adhesive occurs frequently, it not only causes process problems but also increases the manufacturing costs of semiconductor devices.

[0007] The present invention aims to provide a dicing die bonding sheet comprising a support film and a thermosetting film-like adhesive laminated in direct contact on one side of the support film, wherein the film-like adhesive can be prevented from remaining on the support film when a semiconductor chip with the film-like adhesive is picked up, and a method for manufacturing a semiconductor device using the same. [Means for solving the problem]

[0008] The present invention has the following aspects. [1] A dicing die bonding sheet comprising a support film and a thermosetting film-like adhesive laminated on one surface of the support film in direct contact therewith, The film-like adhesive is a dicing die bonding sheet containing an acrylic resin (a) having a carboxy group. [2] The dicing die bonding sheet according to [1], wherein the film-like adhesive contains 10 to 30 mass % of the acrylic resin (a) relative to 100 mass % of the film-like adhesive. [3] The dicing die bonding sheet according to [1] or [2], wherein the film-like adhesive has a content of structural units having a carboxyl group of 1% by mass or more relative to 100% by mass of the acrylic resin (a). [4] The dicing / die bonding sheet according to any one of [1] to [3], wherein the film-like adhesive contains a thermosetting component (b). [5] The dicing / die bonding sheet according to any one of [1] to [4], wherein the supporting film is made of a polyolefin. [6] The dicing / die bonding sheet according to any one of [1] to [5], wherein the film-like adhesive is substantially free of inorganic filler (d).

[0009] [7] A dicing die bonding sheet according to any one of [1] to [6], comprising a thermoset product of the film-like adhesive measuring 2 mm x 2 mm and 20 μm thick, a copper plate having a thickness of 500 μm provided over the entire surface of one side of the thermoset product, and a silicon chip having a thickness of 350 μm provided over the entire surface of the other side of the thermoset product, wherein a first test piece is prepared in which the side of the thermoset product and the side of the silicon chip are aligned, and when a force is applied at a speed of 200 μm / s in a direction parallel to one side of the thermoset product simultaneously to the aligned portions of the side of the thermoset product and the side of the silicon chip in the first test piece while the copper plate is fixed, the maximum value of the force applied until the thermoset product is destroyed, the thermoset product peels off from the copper plate, or the thermoset product peels off from the silicon chip is 60 N / 2 mm□ or more.

[0010] [8] A step of attaching the back surface of a semiconductor wafer to the exposed surface of the film-like adhesive of the dicing die bonding sheet according to any one of [1] to [7]; a step of producing semiconductor chips by dividing the semiconductor wafer, and cutting the film adhesive along the division points of the semiconductor wafer to produce semiconductor chips with a film adhesive; a step of separating the semiconductor chip with the film-like adhesive from the support film and picking it up; A method for manufacturing a semiconductor device, comprising a step of die-bonding the picked-up semiconductor chip with a film-like adhesive to a circuit-forming surface of a substrate by means of the film-like adhesive in the semiconductor chip with a film-like adhesive. [Effects of the Invention]

[0011] According to the present invention, a dicing die bonding sheet is provided which comprises a support film and a thermosetting film-like adhesive laminated in direct contact on one side of the support film, and which is capable of suppressing the film-like adhesive from remaining on the support film when a semiconductor chip with the film-like adhesive is picked up, and a method for manufacturing a semiconductor device using the same is provided. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a cross-sectional view schematically showing a dicing die bonding sheet according to one embodiment of the present invention. [Figure 2] FIG. 10 is a cross-sectional view schematically showing a dicing die bonding sheet according to another embodiment of the present invention. [Figure 3] FIG. 10 is a cross-sectional view schematically showing a dicing die bonding sheet according to still another embodiment of the present invention. [Figure 4A] 1A to 1C are cross-sectional views schematically illustrating a part of a method for manufacturing a semiconductor device according to an embodiment of the present invention. [Figure 4B] 1A to 1C are cross-sectional views schematically illustrating a part of a method for manufacturing a semiconductor device according to an embodiment of the present invention. [Figure 4C] 1A to 1C are cross-sectional views schematically illustrating a part of a method for manufacturing a semiconductor device according to an embodiment of the present invention. [Figure 4D] 1A to 1C are cross-sectional views schematically illustrating a part of a method for manufacturing a semiconductor device according to an embodiment of the present invention. [Figure 5] FIG. 2 is a cross-sectional view for schematically explaining a method for measuring the adhesive strength of a thermoset film adhesive. DETAILED DESCRIPTION OF THE INVENTION

[0013] ◇Dicing die bonding sheet A dicing die bonding sheet according to one embodiment of the present invention comprises a support film and a thermosetting film-like adhesive laminated on one surface of the support film in direct contact therewith.

[0014] A dicing die bonding sheet having such a support film is used by attaching the side of the film adhesive opposite to the side having the support film (sometimes referred to as the "first side" in this specification) to the back surface of a semiconductor wafer.

[0015] <<Film adhesive>> The film-like adhesive contains an acrylic resin (a) having a carboxy group. In the dicing die bonding sheet according to the embodiment, the film-like adhesive contains an acrylic resin (a) having a carboxy group. Therefore, when a semiconductor chip with the film-like adhesive is detached from the support film and picked up during the manufacture of a semiconductor device, the film-like adhesive can be prevented from remaining on the support film. A film-like adhesive containing an acrylic resin (a) having a carboxy group has relatively high polarity. The high polarity of the film-like adhesive reduces the adhesion between the support film and the thermosetting film-like adhesive laminated directly on one side of the support film. As a result, it is believed that the film-like adhesive can be prevented from remaining on the support film.

[0016] It is preferable that the film-like adhesive be applied to the polished surface of a silicon wafer with a polishing grade of #2000, and then the peel force when the film-like adhesive is peeled off from the silicon wafer at a peel rate of 300 mm / min and a peel angle of 180° is less than 1.4 N / 25 mm.

[0017] Since the film-like adhesive contains an acrylic resin (a) having a carboxy group, the polarity is relatively high. The adhesion between the semiconductor wafer and the thermosetting film-like adhesive is kept low due to the high polarity of the film-like adhesive. As a result, the peel force between the film-like adhesive and the silicon wafer can be reduced, and even once attached to the backside of the semiconductor wafer, it can be cleanly peeled off from the semiconductor wafer. In other words, it is thought that the film-like adhesive can have excellent reworkability for the semiconductor wafer.

[0018] In this specification, the surface of a semiconductor wafer or semiconductor chip on which circuits are formed is referred to as the "circuit-forming surface," and the surface opposite to the circuit-forming surface is referred to as the "back surface." A structure comprising a semiconductor chip and a film adhesive provided on its back surface is referred to as a "semiconductor chip with a film adhesive." In this specification, the surface of the substrate on which the circuit is formed is also referred to as the "circuit forming surface." The dicing die bonding sheet of this embodiment allows die bonding to the circuit formation surface of the substrate in a good condition by means of its film-like adhesive.

[0019] The semiconductor chip with a film adhesive produced using the dicing die bonding sheet of this embodiment is adhered (die-bonded) to the circuit-forming surface of the substrate by the film adhesive therein. Furthermore, the film adhesive is finally thermally cured. Therefore, the thermoset film adhesive is required to have sufficient adhesive strength to the object to be adhered.

[0020] The degree of adhesive strength of the thermoset film-like adhesive can be determined, for example, by preparing a first test piece comprising a thermoset film-like adhesive measuring 2 mm x 2 mm and 20 μm thick, a 500 μm thick copper plate provided over the entire surface of one side of the thermoset film, and a 350 μm thick silicon chip provided over the entire surface of the other side of the thermoset film, with the side of the thermoset film and the side of the silicon chip aligned; and, with the copper plate fixed, applying a force at a speed of 200 μm / s to the aligned portions of the side of the thermoset film and the side of the silicon chip in the first test piece in a direction parallel to one side of the thermoset film at the same time, using as an indicator the maximum value of the force (i.e., adhesive strength) applied until the thermoset film is destroyed, peeled from the copper plate, or peeled from the silicon chip.

[0021] FIG. 5 is a cross-sectional view for schematically explaining a method for measuring the adhesive strength of the thermoset product of the film-like adhesive. In addition, the drawings used in the following explanation may show enlarged essential parts for the sake of convenience in order to make the features of the present invention easier to understand, and the dimensional ratios of each component may not necessarily be the same as in reality.

[0022] When measuring the adhesive strength, a first test piece 99 is prepared. The first test piece 99 is composed of a thermoset product 90 of a film-like adhesive, a copper plate 91 provided on the entire surface of one side 90b of the thermoset product 90 (sometimes referred to as the "second side" in this specification), and a silicon chip 92 provided on the entire surface of the other side 90a of the thermoset product 90 (sometimes referred to as the "first side" in this specification).

[0023] The first surface 90a and the second surface 90b of the thermoset film adhesive 90 have a rectangular (square) planar shape. The size of the thermoset material 90 (the size of the first surface 90a and the second surface 90b) is 2 mm×2 mm, and the thickness of the thermoset material 90 is 20 μm.

[0024] The copper plate 91 has a thickness of 500 μm, and the silicon chip 92 has a thickness of 350 μm.

[0025] In the first test piece 99, the side 90c of the thermoset film adhesive 90 and the side 92c of the silicon chip 92 are aligned; for example, in this cross section, in a direction parallel to the first surface 90a or the second surface 90b of the thermoset film adhesive 90, the position of the side 90c of the thermoset film adhesive 90 and the position of the side 92c of the silicon chip 92 coincide.

[0026] It is preferable that at least the portion of the side surface 92c of the silicon chip 92 that is aligned with the side surface 90c of the thermoset film adhesive 90 is flat. The size of the contact surface of the silicon chip 92 with the thermoset material 90 may be equal to or larger than the size of the first surface 90a of the thermoset material 90, and is preferably the same. The planar shape of the surface of the silicon chip 92 that comes into contact with the thermoset material 90 is preferably rectangular, and may be, for example, square, and is preferably the same as the planar shape of the first surface 90 a of the thermoset material 90 . As will be described later in the examples, when forming the thermoset material 90 by cutting and curing a film-like adhesive (not shown) and forming silicon chips 92 by dividing a silicon wafer (not shown), a process can be adopted in which these cutting and dividing steps are carried out continuously.In this case, the contact surface of the silicon chip 92 with the thermoset material 90 and the first surface 90a of the thermoset material 90 can be made the same size and shape, and it is also easy to align the side surface 90c of the thermoset material 90 with the side surface 92c of the silicon chip 92.

[0027] The size of the contact surface of the copper plate 91 with the thermoset product 90 of the film-like adhesive may be equal to or larger than the size of the second surface 90b of the thermoset product 90, and is preferably larger. The planar shape of the copper plate 91's contact surface with the thermoset material 90 is not particularly limited as long as the copper plate 91 can cover the entire second surface 90b of the thermoset material 90, and may be, for example, rectangular.

[0028] When measuring the adhesive strength, with the copper plate 91 fixed, a force P is simultaneously applied to the aligned portions of the side surface 90c of the thermoset film adhesive 90 in the first test piece 99 and the side surface 92c of the silicon chip 92 in a direction parallel to one surface (the first surface 90a or the second surface 90b) of the thermoset film 90 at a speed of 200 μm / s. Here, the case where the force P is applied to the aligned portions is shown using a pressing means 8. In order to measure the adhesive strength with higher accuracy, it is preferable that the portion where the pressure means 8 applies the force is flat, and it is more preferable that the pressure means 8 is plate-shaped. The pressing means 8 may be made of, for example, metal.

[0029] As described above, when the force P is simultaneously applied to the thermoset film adhesive 90 and the silicon chip 92 , it is preferable that the pressing means 8 is not brought into contact with the copper plate 91 .

[0030] In this embodiment, a force P is applied to the aligned portion between the side surface 90c of the thermosetting film adhesive 90 and the side surface 92c of the silicon chip 92, and the maximum value of the force P applied until the thermosetting film 90 is destroyed or peels off from the copper plate 91 is used as the adhesive strength of the thermosetting film 90.

[0031] The maximum value of the force (i.e., adhesive strength) of the thermoset film adhesive is preferably 60N / 2mm□ or more, more preferably 80N / 2mm□ or more, and may be, for example, 100N / 2mm□ or more, 120N / 2mm□ or more, or 140N / 2mm□ or more.

[0032] There is no particular upper limit to the adhesive strength. For example, a film-like adhesive having an adhesive strength of 300 N / 2 mm□ or less can be more easily produced.

[0033] The adhesive strength may be any value within a range set by arbitrarily combining any of the above-mentioned lower limit values ​​and upper limit values. For example, in one embodiment, the adhesive strength is preferably 60 to 300 N / 2 mm□, more preferably 80 to 300 N / 2 mm□, and may be, for example, any of 100 to 300 N / 2 mm□, 120 to 300 N / 2 mm□, and 140 to 300 N / 2 mm□. However, these are just examples of the adhesive strength.

[0034] In this embodiment, the thermoset product of the film-like adhesive in the first test piece that defines the adhesive strength is a thermoset product obtained by heat-treating a thermosetting film-like adhesive at 160°C for 1 hour.

[0035] In this specification, the unit "N / 2mm□" is synonymous with "N / (2mm×2mm)".

[0036] The adhesive strength can be adjusted by adjusting the types or amounts of the components contained in the thermosetting film-like adhesive. For example, the adhesive strength can be adjusted over a wide range by adjusting the types or amounts of the acrylic resin (a), thermosetting component (b), inorganic filler (d), coupling agent (e), etc., which will be described later, in the thermosetting film-like adhesive.

[0037] The film-like adhesive may consist of one layer (single layer), or may consist of two or more layers, and when it consists of multiple layers, these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited. The film-like adhesive is preferably one that consists of one layer.

[0038] In this specification, not limited to the case of film-like adhesives, "multiple layers may be the same or different from one another" means "all layers may be the same, all layers may be different, or only some layers may be the same," and further, "multiple layers are different from one another" means "at least one of the constituent materials and thicknesses of each layer is different from one another."

[0039] The thickness of the film adhesive is not particularly limited, but is preferably 1 to 50 μm, more preferably 3 to 40 μm, and particularly preferably 5 to 30 μm. When the thickness of the film adhesive is equal to or greater than the lower limit, the initial adhesive strength of the film adhesive to the adherend (semiconductor wafer, semiconductor chip) becomes higher. When the thickness of the film adhesive is equal to or less than the upper limit, the film adhesive can be cut more easily in the semiconductor chip manufacturing process described below, and the amount of chips generated from the film adhesive can be further reduced. Here, "thickness of the film adhesive" means the thickness of the entire film adhesive; for example, the thickness of a film adhesive consisting of multiple layers means the total thickness of all layers that make up the film adhesive.

[0040] The film-like adhesive can be formed using an adhesive composition containing constituent materials such as an acrylic resin (a) and a solvent, etc. For example, the adhesive composition can be applied to a surface on which the film-like adhesive is to be formed, and then dried as necessary, to form the film-like adhesive at the desired location. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components in the film-like adhesive. In this specification, "room temperature" means a temperature that is not particularly cooled or heated, i.e., an ordinary temperature, and examples thereof include a temperature of 15 to 25°C.

[0041] The adhesive composition may be applied by a known method, for example, a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, a screen coater, a Mayer bar coater, or a kiss coater.

[0042] The drying conditions for the adhesive composition are not particularly limited, but when the adhesive composition contains a solvent as described below, it is preferable to heat-dry it. The adhesive composition containing a solvent is preferably dried, for example, at 70 to 130°C for 10 seconds to 5 minutes. The components contained in the film-like adhesive and adhesive composition will be described in detail below.

[0043] <Acrylic resin (a)> The acrylic resin (a) is not limited as long as it has a carboxyl group. By using a dicing die bonding sheet provided with a film adhesive containing the acrylic resin (a), transfer defects can be prevented when the semiconductor chip with the film adhesive is separated from the support film and picked up. By using a film adhesive containing an acrylic resin (a) having a carboxy group, it is possible to increase the polarity of the film adhesive compared to conventional film adhesives, which is thought to prevent excessive adhesion to non-polar substrate films. Furthermore, by adjusting the composition of the acrylic resin (a), it is possible to easily achieve excellent adhesion to substrates of the thermoset product obtained by heat-curing the film adhesive.

[0044] In order to more easily achieve the above-described effects of the dicing die bonding sheet of this embodiment, the content of the structural unit having a carboxyl group relative to 100% by mass of the acrylic resin (a) is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, even more preferably 1.5% by mass or more, and particularly preferably 2.0% by mass or more. The content of the structural unit having a carboxyl group relative to 100% by mass of the acrylic resin (a) may be 4.5% by mass or less, 4.0% by mass or less, 3.5% by mass or less, or 3.0% by mass or less.

[0045] In the acrylic resin (a), examples of the monomer of the structural unit having a carboxy group include acrylic acid, methacrylic acid, and itaconic acid.

[0046] In addition to the above, examples of monomers constituting the acrylic resin (a) include (meth)acrylic acid ester monomers or derivatives thereof. Examples include alkyl (meth)acrylates in which the alkyl group has 1 to 18 carbon atoms, specifically methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Examples of (meth)acrylates having a cyclic skeleton include cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and imide (meth)acrylate. Examples of functional group-containing monomers include hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and 2-hydroxypropyl (meth)acrylate, each of which has a hydroxyl group; and glycidyl (meth)acrylate, each of which has an epoxy group. As the acrylic resin, an acrylic polymer containing a structural unit having a hydroxyl group is preferred because it has good compatibility with the curable component described below. The acrylic polymer may also be copolymerized with vinyl acetate, acrylonitrile, styrene, etc. However, from the viewpoint of environmental consideration, it is preferable that the acrylic polymer does not substantially contain acrylonitrile.

[0047] The acrylic resin (a) may be a polymer or oligomer component that can be considered to be formed by the polymerization reaction of a polymerizable compound. The acrylic resin (a) imparts film-forming properties, flexibility, etc. to the film-like adhesive, and also improves the adhesiveness (applicability) to the object to be adhered, such as a semiconductor chip.

[0048] The weight average molecular weight of the acrylic resin (a) is preferably 10,000 to 1,000,000, more preferably 200,000 to 800,000, and even more preferably 400,000 to 800,000.

[0049] The adhesive composition and film-like adhesive may contain only one type of acrylic resin (a), or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0050] In the dicing die bonding sheet of this embodiment, the content of the acrylic resin (a) is preferably 10 to 30 mass %, more preferably 12 to 25 mass %, and particularly preferably 14 to 20 mass %, relative to 100 mass % of the film-like adhesive. When the content of the acrylic resin (a) is equal to or greater than the lower limit, the structure of the film-like adhesive becomes more stable, making it easier to achieve the effects described above. When the content of the acrylic resin (a) is equal to or less than the upper limit, the adhesiveness of the film-like adhesive becomes good.

[0051] [Thermosetting component (b)] The thermosetting component (b) has thermosetting properties and is a component for thermally curing the film-like adhesive. The thermosetting component (b) contained in the adhesive composition and film-like adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0052] Examples of the thermosetting component (b) include epoxy-based thermosetting resins, polyimide resins, and unsaturated polyester resins.

[0053] (epoxy thermosetting resin) Among these, the thermosetting component (b) is preferably an epoxy-based thermosetting resin composed of an epoxy resin (b1) and a thermosetting agent (b2). The adhesive composition and film-like adhesive may contain only one type of epoxy thermosetting resin, or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0054] <Epoxy resin (b1)> Examples of the epoxy resin (b1) include known epoxy resins, such as polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and its hydrogenated products, o-cresol novolac epoxy resins, dicyclopentadiene epoxy resins, biphenyl epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, and phenylene skeleton epoxy resins. In this specification, the epoxy resin (b1) refers to a curable, i.e., uncured, epoxy resin.

[0055] The number average molecular weight of the epoxy resin (b1) is not particularly limited, but from the viewpoints of the curability of the film-like adhesive and the strength and heat resistance of the thermoset film-like adhesive, it is preferably 300 to 30,000, more preferably 400 to 10,000, and particularly preferably 500 to 3,000.

[0056] The epoxy equivalent of the epoxy resin (b1) is preferably 100 to 1000 g / eq, more preferably 150 to 800 g / eq.

[0057] The epoxy resin (b1) contained in the adhesive composition and film-like adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0058] The content of the epoxy resin (b1) is preferably 40 to 65 mass %, more preferably 46 to 60 mass %, and particularly preferably 48 to 58 mass %, relative to 100 mass % of the film-like adhesive.

[0059] The epoxy resin (b1) may be an epoxy resin that is liquid at room temperature, or may be an epoxy resin that is solid at room temperature.

[0060] In the dicing die bonding sheet of this embodiment, the content of the epoxy resin that is liquid at room temperature is preferably 2 to 20 mass %, more preferably 3 to 18 mass %, and particularly preferably 4 to 16 mass %, relative to 100 mass % of the film-like adhesive. When the content of the epoxy resin that is liquid at room temperature is equal to or greater than the lower limit, die bonding to the circuit formation surface at low temperatures becomes easy, and when the content of the epoxy resin (b1) is equal to or less than the upper limit, the shape stability of the film-like adhesive becomes good.

[0061] <Thermal curing agent (b2)> The thermosetting agent (b2) is a curing agent for the epoxy resin (b1). The combination of the epoxy resin (b1) and the thermosetting agent (b2) functions as an epoxy-based thermosetting resin (sometimes referred to as "epoxy-based thermosetting resin (b)" in this specification). The epoxy thermosetting resin (b) contained in the adhesive composition and film-like adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0062] Examples of the thermosetting agent (b2) include compounds having two or more functional groups per molecule that can react with epoxy groups. Examples of the functional groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, and anhydride groups of acid groups. Phenolic hydroxyl groups, amino groups, and anhydride groups of acid groups are preferred, and phenolic hydroxyl groups or amino groups are more preferred.

[0063] Among the heat curing agents (b2), examples of phenolic curing agents having a phenolic hydroxyl group include polyfunctional phenolic resins, biphenols, novolac-type phenolic resins, dicyclopentadiene-type phenolic resins, and aralkyl-type phenolic resins. Among the heat curing agents (b2), examples of amine-based curing agents having an amino group include dicyandiamide (DICY).

[0064] The heat curing agent (b2) may have an unsaturated hydrocarbon group. Examples of the thermosetting agent (b2) having an unsaturated hydrocarbon group include a compound in which some of the hydroxyl groups of a phenolic resin are substituted with a group having an unsaturated hydrocarbon group, and a compound in which a group having an unsaturated hydrocarbon group is directly bonded to the aromatic ring of a phenolic resin. The unsaturated hydrocarbon group in the thermosetting agent (b2) is the same as the unsaturated hydrocarbon group in the epoxy resin having an unsaturated hydrocarbon group described above.

[0065] When a phenol-based curing agent is used as the heat-curing agent (b2), it is preferable that the heat-curing agent (b2) has a high softening point or glass transition temperature, since this makes it easier to adjust the adhesive strength of the film-like adhesive.

[0066] Of the thermosetting agents (b2), for example, the number average molecular weight of resin components such as polyfunctional phenolic resins, novolac-type phenolic resins, dicyclopentadiene-type phenolic resins, and aralkyl-type phenolic resins is preferably 300 to 30,000, more preferably 400 to 10,000, and particularly preferably 500 to 3,000. Of the thermosetting agents (b2), the molecular weight of the non-resin components such as biphenol and dicyandiamide is not particularly limited, but is preferably 60 to 500, for example. The heat curing agent (b2) is preferably represented by the following general formula (1), more specifically, an o-cresol novolac resin.

[0067] [ka]

[0068] In general formula (1), n ​​is an integer of 1 or more, and may be, for example, 2 or more, 4 or more, or 6 or more. The upper limit of n is not particularly limited as long as it does not impair the effects of the present invention. For example, an o-cresol novolak resin in which n is 10 or less is easier to produce or obtain.

[0069] In general formula (1), the bonding position of the methylene group (-CH2-) linking the o-cresol-diyl groups (-C6H4(-OH)(-CH3)-) to these o-cresol-diyl groups is not particularly limited.

[0070] As is clear from general formula (1), the thermosetting agent (b2) preferably has a structure in which a methyl group is bonded to the carbon atom (a carbon atom constituting the benzene ring skeleton) adjacent to the carbon atom to which a phenolic hydroxyl group is bonded in a phenolic resin, and has steric hindrance near the phenolic hydroxyl group. It is presumed that the thermosetting agent (b2) has such steric hindrance, which suppresses its reactivity during storage. It is presumed that the use of such a thermosetting agent (b2) suppresses the reaction of the components contained in the film-like adhesive, such as curable components, during storage, and suppresses changes in its properties. It is presumed that the use of such a film-like adhesive and a semiconductor chip will result in a highly reliable semiconductor package. A film-like adhesive using the thermosetting agent (b2) represented by general formula (1) has high storage stability and can be stored at room temperature. For the same reason, the adhesive composition also has high storage stability and can be stored at room temperature.

[0071] The adhesive composition and film-like adhesive may contain one type of thermosetting agent (b2), or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0072] The content of the thermosetting agent (b2) is preferably 10 to 50 mass%, more preferably 15 to 45 mass%, and particularly preferably 20 to 40 mass%, relative to 100 mass% of the film-like adhesive. When the content of the thermosetting agent (b2) is equal to or greater than the lower limit, curing of the film-like adhesive proceeds more easily. When the content of the thermosetting agent (b2) is equal to or less than the upper limit, the moisture absorption rate of the film-like adhesive is reduced, and the reliability of the semiconductor package obtained using the film-like adhesive is further improved.

[0073] The content of the epoxy thermosetting resin (b) consisting of the epoxy resin (b1) and the thermosetting agent (b2) relative to 100% by mass of the film-like adhesive is preferably 60 to 85% by mass, more preferably 65 to 85% by mass, and particularly preferably 65 to 80% by mass. When the content of the epoxy thermosetting resin (b) is equal to or greater than the lower limit, bonding properties are improved and the effects are more easily achieved. When the content of the thermosetting agent (b2) is equal to or less than the upper limit, storage stability is improved.

[0074] In the dicing die bonding sheet of this embodiment, the content of the thermosetting component (b) per 100 parts by mass of the acrylic resin (a) is preferably greater than 400 parts by mass, more preferably 410 parts by mass or more, and even more preferably 420 parts by mass or more. By increasing the content of the thermosetting component (b), the heat resistance and adhesive strength of the thermoset product of the film-like adhesive are improved, thereby further improving the reliability of the semiconductor package. The content of the thermosetting component (b) per 100 parts by mass of the acrylic resin (a) may be 700 parts by mass or less, 600 parts by mass or less, or 500 parts by mass or less.

[0075] In terms of further enhancing the above-mentioned effects, the softening point of the thermosetting agent (b2) may be, for example, any one of 64°C or more and 130°C or less, 68°C or more and 130°C or less, 72°C or more and 130°C or less, and 76°C or more and 130°C or less, any one of 60°C or more and 120°C or less, 60°C or more and 110°C or less, 60°C or more and 100°C or less, and 60°C or more and 90°C or less, or any one of 64°C or more and 120°C or less, 68°C or more and 110°C or less, 72°C or more and 100°C or less, and 76°C or more and 90°C or less.

[0076] A film-like adhesive containing an acrylic resin (a) and an epoxy-based thermosetting resin (b) is thermosetting, and preferably also pressure-sensitive. A film-like adhesive that has both thermosetting and pressure-sensitive adhesive properties can be applied to various adherends by gently pressing it against them in the uncured state. Alternatively, the film-like adhesive may be softened by heating so that it can be applied to various adherends. Upon curing, the film-like adhesive ultimately becomes a thermoset product with high impact resistance, and this thermoset product can retain sufficient adhesive properties even under harsh conditions of high temperature and high humidity.

[0077] In order to improve various physical properties, the film adhesive may contain, in addition to the acrylic resin (a) and the epoxy-based thermosetting resin (b), other components not included in these components, as necessary. Examples of other components contained in the film-like adhesive include a curing accelerator (c), an inorganic filler (d), a coupling agent (e), an energy ray-curable resin (g), a photopolymerization initiator (h), and a general-purpose additive (i). Among these, preferred other components include the curing accelerator (c) and the coupling agent (e).

[0078] In this specification, the term "energy ray" refers to an electromagnetic wave or a charged particle beam that has an energy quantum, and examples thereof include ultraviolet rays, radioactive rays, and electron beams. Ultraviolet light can be irradiated using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, etc. An electron beam generated by an electron beam accelerator or the like can be irradiated. In this specification, "energy ray curable" means a property of being cured by irradiation with energy rays, and "non-energy ray curable" means a property of not being cured even when irradiated with energy rays.

[0079] <Curing accelerator (c)> The curing accelerator (c) is a component for adjusting the curing rate of the adhesive composition and the film-like adhesive. Preferred examples of the curing accelerator (c) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles (imidazoles in which one or more hydrogen atoms are substituted with groups other than hydrogen atoms) such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines (phosphines in which one or more hydrogen atoms are substituted with organic groups) such as tributylphosphine, diphenylphosphine, and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate.

[0080] The adhesive composition and film-like adhesive may contain only one type of curing accelerator (c), or two or more types, and when two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0081] When a curing accelerator (c) is used, the content of the curing accelerator (c) in the adhesive composition and film-like adhesive is preferably 0.01 to 5 parts by mass, and more preferably 0.1 to 2 parts by mass, per 100 parts by mass of the epoxy thermosetting resin (b) (i.e., the total content of the epoxy resin (b1) and the thermosetting agent (b2)). When the content of the curing accelerator (c) is equal to or greater than the lower limit, the effects of using the curing accelerator (c) are more pronounced. When the content of the curing accelerator (c) is equal to or less than the upper limit, for example, the highly polar curing accelerator (c) is more effectively inhibited from migrating and segregating to the adhesive interface with the adherend in the film-like adhesive under high temperature and high humidity conditions, thereby further improving the reliability of semiconductor packages obtained using the film-like adhesive.

[0082] <Inorganic filler (d)> By including the inorganic filler (d), the thermal expansion coefficient of the film adhesive can be easily adjusted, and by optimizing this thermal expansion coefficient for the object to which the film adhesive is attached, the reliability of the semiconductor package obtained using the film adhesive can be further improved. Furthermore, by including the inorganic filler (d), the film adhesive can reduce the moisture absorption rate of the thermoset product of the film adhesive and improve heat dissipation properties.

[0083] Preferred examples of the inorganic filler (d) include powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, and the like; beads obtained by spheronizing these inorganic fillers; surface-modified products of these inorganic fillers; single-crystal fibers of these inorganic fillers; and glass fibers. Among these, the inorganic filler (d) is preferably silica, alumina, or a surface-modified product thereof.

[0084] The average particle size of the inorganic filler (d) is not particularly limited, but is preferably 10 to 300 nm, more preferably 20 to 150 nm, and even more preferably 30 to 100 nm. When the average particle size of the inorganic filler (d) is within this range, the effects of using the inorganic filler (d) can be fully obtained, and the storage stability of the film-like adhesive can be further improved. In this specification, unless otherwise specified, the term "average particle size" refers to the particle size at 50% of the integrated value in the particle size distribution curve obtained by the laser diffraction scattering method (D 50 ) value.

[0085] The adhesive composition and film-like adhesive may contain one type of inorganic filler (d) or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0086] When an inorganic filler (d) is used, the ratio of the content of the inorganic filler (d) to the total content of all components other than the solvent in the adhesive composition (i.e., the ratio of the content of the inorganic filler (d) to the total mass of the film-like adhesive in the film-like adhesive) is preferably 2 to 15 mass%, more preferably 4 to 12 mass%, and particularly preferably 6 to 10 mass%. When the content of the inorganic filler (d) is within this range, it becomes easier to adjust the thermal expansion coefficient. However, to further reduce transfer defects, the content of the inorganic filler (d) is preferably low. The ratio of the content of the inorganic filler (d) to the total content of all components other than the solvent in the adhesive composition (i.e., the ratio of the content of the inorganic filler (d) to the total mass of the film-like adhesive in the film-like adhesive) is preferably 0 to 2 mass%, more preferably 0 to 1 mass%, and particularly preferably 0 to 1 mass%, and it is particularly preferred that the adhesive composition is substantially free of inorganic filler (d). It is believed that by reducing the content of inorganic filler (d), it is possible to prevent a decrease in the cohesive strength of the film-like adhesive, and as a result, it is possible to prevent the occurrence of transfer defects.

[0087] <Coupling agent (e)> By including a coupling agent (e), the film adhesive has improved adhesion and adhesion to the adherend. Furthermore, by including a coupling agent (e), the film adhesive has improved water resistance without impairing heat resistance in the thermoset product. The coupling agent (e) has a functional group capable of reacting with an inorganic or organic compound.

[0088] The coupling agent (e) is preferably a compound having a functional group capable of reacting with a functional group possessed by the acrylic resin (a), the epoxy thermosetting resin (b), or the like, and more preferably a silane coupling agent. Preferred examples of the silane coupling agent include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, and 3-(2-aminoethylamino)propyltrimethoxysilane. Examples of the organosiloxane include vinylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazole silane, and oligomeric or polymeric organosiloxanes.

[0089] The coupling agent (e) contained in the adhesive composition and film-like adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0090] When a coupling agent (e) is used, the content of the coupling agent (e) in the adhesive composition and film-like adhesive is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass, per 100 parts by mass of the total content of the acrylic resin (a) and the epoxy thermosetting resin (b). When the content of the coupling agent (e) is at or above the lower limit, the effects of using the coupling agent (e), such as improved dispersibility of the inorganic filler (d) in the resin and improved adhesion of the film-like adhesive to the adherend, are more significantly achieved. When the content of the coupling agent (e) is at or below the upper limit, outgassing is further suppressed.

[0091] <Crosslinking agent (f)> When using a resin such as the acrylic resin (a) described above that has a functional group such as a vinyl group, (meth)acryloyl group, amino group, hydroxyl group, carboxyl group, or isocyanate group that can bond with other compounds, the adhesive composition and film-like adhesive may contain a crosslinking agent (f) that bonds the functional group with other compounds to cause crosslinking. Crosslinking with the crosslinking agent (f) makes it possible to adjust the initial adhesive strength and cohesive strength of the film-like adhesive.

[0092] Examples of the crosslinking agent (f) include organic polyvalent isocyanate compounds, organic polyvalent imine compounds, metal chelate crosslinking agents (crosslinking agents having a metal chelate structure), and aziridine crosslinking agents (crosslinking agents having an aziridinyl group).

[0093] Examples of the organic polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, and alicyclic polyisocyanate compounds (hereinafter, these compounds may be collectively referred to as "aromatic polyisocyanate compounds, etc."); trimers, isocyanurates, and adducts of the aromatic polyisocyanate compounds, etc.; and isocyanate-terminated urethane prepolymers obtained by reacting the aromatic polyisocyanate compounds, etc. with polyol compounds. The "adduct" refers to a reaction product of the aromatic polyisocyanate compound, aliphatic polyisocyanate compound, or alicyclic polyisocyanate compound with a low-molecular-weight active hydrogen-containing compound such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, or castor oil. Examples of the adduct include the xylylene diisocyanate adduct of trimethylolpropane, as described below. Furthermore, the term "isocyanate-terminated urethane prepolymer" refers to a prepolymer having a urethane bond and an isocyanate group at the end of the molecule.

[0094] More specific examples of the organic polyisocyanate compound include 2,4-tolylene diisocyanate; 2,6-tolylene diisocyanate; 1,3-xylylene diisocyanate; 1,4-xylylene diisocyanate; diphenylmethane-4,4'-diisocyanate; diphenylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4,4'-diisocyanate; dicyclohexylmethane-2,4'-diisocyanate; a compound in which one or more of tolylene diisocyanate, hexamethylene diisocyanate, and xylylene diisocyanate are added to all or some of the hydroxyl groups of a polyol such as trimethylolpropane; lysine diisocyanate, and the like.

[0095] Examples of the organic polyvalent imine compound include N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylolmethane-tri-β-aziridinylpropionate, and N,N'-toluene-2,4-bis(1-aziridinecarboxamide)triethylenemelamine.

[0096] When an organic polyisocyanate compound is used as the crosslinking agent (f), it is preferable to use a hydroxyl group-containing polymer as the acrylic resin (a). When the crosslinking agent (f) has an isocyanate group and the acrylic resin (a) has a hydroxyl group, a crosslinked structure can be easily introduced into the film-like adhesive by the reaction between the crosslinking agent (f) and the acrylic resin (a).

[0097] The adhesive composition and film-like adhesive may contain one type of crosslinking agent (f) or two or more types, and when two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0098] The content of crosslinking agent (f) is preferably 0 to 5 parts by mass, more preferably 0.1 to 3 parts by mass, and even more preferably 0.2 to 1 part by mass, per 100 parts by mass of the content of acrylic resin (a). When the content of crosslinking agent (f) is equal to or greater than the lower limit, the effect of using crosslinking agent (f) is more pronounced. When the content of crosslinking agent (f) is equal to or less than the upper limit, the storage stability of the film-like adhesive is further improved.

[0099] <Energy ray curable resin (g)> The adhesive composition and the film-like adhesive may contain an energy ray-curable resin (g). By containing the energy ray-curable resin (g), the film-like adhesive can change its properties by irradiation with energy rays.

[0100] <General-purpose additives (i)> The general-purpose additive (i) may be a known one and may be selected arbitrarily depending on the purpose, and is not particularly limited. Preferred general-purpose additives (i) include, for example, plasticizers, antistatic agents, antioxidants, colorants (dyes, pigments), gettering agents, etc.

[0101] The adhesive composition and film-like adhesive may contain only one type of general-purpose additive (i), or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily. The content of the general-purpose additive (i) in the adhesive composition and film-like adhesive is not particularly limited and may be appropriately selected depending on the purpose.

[0102] <Solvent> The adhesive composition preferably further contains a solvent, as this provides good handleability. The solvent is not particularly limited, but preferred examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; and amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone. The adhesive composition may contain only one type of solvent, or two or more types of solvents. When two or more types of solvents are contained, the combination and ratio thereof can be selected arbitrarily.

[0103] The solvent contained in the adhesive composition is preferably toluene, methyl ethyl ketone, or the like, from the viewpoint of enabling the components contained in the adhesive composition to be mixed more uniformly.

[0104] <Method of manufacturing adhesive composition> The adhesive composition can be obtained by blending the components that make up the adhesive composition. The order of addition of the components when blending is not particularly limited, and two or more components may be added simultaneously. When a solvent is used, the solvent may be mixed with any of the ingredients other than the solvent to pre-dilute the ingredients, or the solvent may be mixed with any of the ingredients other than the solvent without pre-diluting these ingredients.

[0105] The method for mixing the components during blending is not particularly limited, and may be appropriately selected from known methods such as a method of mixing by rotating a stirrer or stirring blades, a method of mixing using a mixer, or a method of mixing by adding ultrasound. The temperature and time for adding and mixing each component are not particularly limited as long as the components do not deteriorate, and may be adjusted appropriately. A temperature of 15 to 30°C is preferred.

[0106] <<Support film>> In the dicing die bonding sheet, the support film functions to fix the semiconductor wafer and support the film adhesive during dicing, and fixes the semiconductor wafer via the film adhesive during dicing. The support film does not have a pressure-sensitive adhesive layer on the side that comes into direct contact with the film adhesive. The support film may consist of one layer (single layer) or two or more layers. When the support film consists of multiple layers, the constituent materials and thicknesses of these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as it does not impair the effects of the present invention. The support film is preferably one layer.

[0107] The support film is in the form of a sheet or film, and examples of the constituent material thereof include various resins. Examples of the resin include polyolefins such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE), polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resins; ethylene-based copolymers (copolymers obtained using ethylene as a monomer) such as ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, and ethylene-norbornene copolymer; vinyl chloride-based resins (resins obtained using vinyl chloride as a monomer) such as polyvinyl chloride and vinyl chloride copolymers; Examples of the polyester include polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalenedicarboxylate, polyesters such as wholly aromatic polyesters in which all structural units have aromatic cyclic groups, copolymers of two or more of the above polyesters, poly(meth)acrylic acid esters, polyurethanes, polyurethane acrylates, polyimides, polyamides, polycarbonates, fluororesins, polyacetals, modified polyphenylene oxides, polyphenylene sulfides, polysulfones, and polyether ketones. Further, examples of the resin include polymer alloys such as mixtures of the polyester and other resins. The polymer alloys of the polyester and other resins preferably contain a relatively small amount of resin other than polyester. Examples of the resin include crosslinked resins in which one or more of the resins exemplified above are crosslinked; and modified resins such as ionomers using one or more of the resins exemplified above.

[0108] The resin constituting the support film may be one type only, or two or more types, and when two or more types are used, the combination and ratio thereof can be selected arbitrarily.

[0109] The thickness of the support film is preferably 50 to 300 μm, more preferably 60 to 150 μm. When the thickness of the support film is in this range, the flexibility of the dicing die bonding sheet and its attachability to a semiconductor wafer or semiconductor chip are further improved. Here, "thickness of the support film" means the thickness of the entire support film; for example, the thickness of a support film consisting of multiple layers means the total thickness of all layers that make up the support film.

[0110] The support film preferably has a high thickness precision, i.e., a thickness variation that is suppressed regardless of the location. Among the above-mentioned constituent materials, materials that can be used to form such a support film with a high thickness precision include, for example, polyolefin, polyethylene terephthalate, ethylene-vinyl acetate copolymer, etc., and polyolefin is preferred.

[0111] In addition to the main constituent materials such as the resin, the support film may contain various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers).

[0112] The support film may be transparent or opaque, may be colored depending on the purpose, and may have other layers vapor-deposited thereon.

[0113] In order to improve adhesion to the film-like adhesive that is laminated on top of the support film in direct contact with it, the support film may have its surface subjected to roughening treatment such as sandblasting or solvent treatment, or oxidation treatment such as corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, or hot air treatment. The surface of the support film may be treated with a primer. The support film may also have an antistatic coating layer; a layer that prevents the support film from adhering to other sheets or to the adsorption table when the dicing die bonding sheets are stacked and stored; etc.

[0114] The support film can be produced by a known method. For example, a support film containing a resin can be produced by molding a resin composition containing the resin.

[0115] In order to improve the pick-up property of the dicing die bonding sheet, it is preferable that the peeling force of the support film is in an appropriate range. Generally, the peel strength between a film adhesive and a support film varies depending on the material of the film adhesive and the material of the support film that comes into contact with it. The peel strength between the film adhesive and the support film can be measured as follows. A dicing die bonding sheet was cut into a 25mm x 250mm rectangle. A 25mm x 250mm dicing die bonding sheet film adhesive was placed on the surface of a polystyrene plate hard support with double-sided tape attached. A 2kg rubber roller was then rolled back and forth across the laminate at 23°C and 50% relative humidity, affixing the dicing die bonding sheet to the hard support via the double-sided tape. After leaving the laminate in the same environment at 23°C and 50% relative humidity for 30 minutes, a Shimadzu Corporation AG-IS universal tensile tester was used to measure the peel force (N / 25mm) when the support film of the dicing die bonding sheet was peeled from the film adhesive at a speed of 300mm / min and an angle of 180°.

[0116] The support film peeling force measured in this manner is preferably 0.01 to 0.2 N / 25 mm, more preferably 0.06 to 0.18 N / 25 mm, and particularly preferably 0.10 to 0.16 N / 25 mm.

[0117] Next, an example of the dicing die bonding sheet of this embodiment will be described below with reference to the drawings.

[0118] FIG. 1 is a cross-sectional view schematically showing a dicing die bonding sheet according to one embodiment of the present invention.

[0119] The dicing die bonding sheet 101 shown here includes a support film 11 and a film-like adhesive 13 on the support film 11. The support film 11 consists of only a single layer and does not include a pressure-sensitive adhesive layer on the side that comes into direct contact with the film-like adhesive. In other words, the dicing die bonding sheet 101 has a configuration in which the film-like adhesive 13 is laminated in direct contact on one surface 11a (sometimes referred to as the "first surface" in this specification) of the support film 11. The dicing die bonding sheet 101 also includes a release film 15 on the film-like adhesive 13.

[0120] In the dicing die bonding sheet 101, a film-like adhesive 13 is laminated on the first surface 11a of the support film 11, and a jig adhesive layer 16 is laminated on a portion of the surface 13a of the film-like adhesive 13 opposite the side having the support film 11 (sometimes referred to as the "first surface" in this specification), i.e., the area near the peripheral portion, and a release film 15 is laminated on the surface of the first surface 13a of the film-like adhesive 13 on which the jig adhesive layer 16 is not laminated, and on the surface 16a (top and side surfaces) of the jig adhesive layer 16 that is not in contact with the film-like adhesive 13.

[0121] The jig adhesive layer 16 may be, for example, a single-layer structure containing an adhesive component, or a multi-layer structure in which layers containing adhesive components are laminated on both sides of a core sheet.

[0122] With the release film 15 removed, the dicing die bonding sheet 101 is used by attaching the back surface of a semiconductor wafer (not shown) to the first surface 13a of the film-like adhesive 13, and further attaching the upper surface of the surface 16a of the jig adhesive layer 16 to a jig such as a ring frame.

[0123] FIG. 2 is a cross-sectional view schematically showing a dicing die bonding sheet according to another embodiment of the present invention. In FIG. 2 and subsequent figures, the same components as those shown in the figures already described are given the same reference numerals as in the figures already described, and detailed description thereof will be omitted. The dicing die bonding sheet 102 shown here is the same as the dicing die bonding sheet 101 shown in Fig. 1 except that it does not have the jig adhesive layer 16. That is, in the dicing die bonding sheet 102, a film-like adhesive 13 is laminated on the first surface 11a of the support film 11, and a release film 15 is laminated over the entire first surface 13a of the film-like adhesive 13. In other words, the dicing die bonding sheet 102 is configured by laminating the support film 11, the film-like adhesive 13, and the release film 15 in this order in the thickness direction.

[0124] As with the dicing die bonding sheet 101 shown in Figure 1, the dicing die bonding sheet 102 shown in Figure 2 is used by removing the release film 15, and then attaching the back surface of a semiconductor wafer (not shown) to a central area of ​​the first surface 13a of the film-like adhesive 13, and further attaching an area near the periphery of the film-like adhesive 13 to a jig such as a ring frame.

[0125] FIG. 3 is a cross-sectional view schematically showing a dicing / die bonding sheet according to still another embodiment of the present invention. The dicing die bonding sheet 103 shown here includes a support film 11, and a film-like adhesive 23 and a jig adhesive layer 16 are provided on the support film 11. The dicing die bonding sheet 103 has a configuration in which the film-like adhesive 23 is laminated on the first surface 11a of the support film 11.

[0126] The dicing die bonding sheet 103 has a film adhesive 23 laminated on a portion of the first surface 11a of the support film 11, i.e., on the central region. Furthermore, the dicing die bonding sheet 103 has a jig adhesive layer 16 laminated on an area of ​​the first surface 11a of the support film 11 near the periphery of the film adhesive 23, where the film adhesive 23 is not laminated. A release film 15 is laminated on the jig adhesive layer 16 and the film adhesive 23.

[0127] When the dicing die bonding sheet 103 is viewed from above on the release film 15 side, the film-like adhesive 23 has a smaller surface area than the support film 11 and has a shape such as a circle. The support film 11 and the jig adhesive layer 16 may be punched out so as to form a circle concentric with the film-like adhesive 23.

[0128] The dicing die bonding sheet 103 is used with the upper surface of the jig adhesive layer 16 attached to a jig such as a ring frame.

[0129] Thus, the dicing die bonding sheet is preferably one that includes a jig adhesive layer, regardless of the form of the support film and the film-like adhesive. The dicing die bonding sheet that includes a jig adhesive layer may be one that includes a jig adhesive layer on a film-like adhesive, as shown in Fig. 1, or one that includes a jig adhesive layer on a support film in a region near the periphery of the film-like adhesive, as shown in Fig. 3.

[0130] The dicing die bonding sheet of this embodiment is not limited to that shown in Figures 1 to 3, and may have some of the configurations shown in Figures 1 to 3 changed or deleted, or may have other configurations added to those described above, within the scope that does not impair the effects of the present invention.

[0131] In the dicing die bonding sheet, a gap may be formed between the release film and the layer that is in direct contact with the release film. Furthermore, in the dicing die bonding sheet, the size and shape of each layer can be adjusted as desired depending on the purpose.

[0132] ◇Semiconductor device manufacturing method The method for manufacturing a semiconductor device of this embodiment includes the steps of: attaching the back surface of a semiconductor wafer to the exposed surface of the film-like adhesive of the dicing die bonding sheet of the above-described embodiment; a step of producing semiconductor chips by dividing the semiconductor wafer, and cutting the film adhesive along the division points of the semiconductor wafer to produce semiconductor chips with a film adhesive; a step of separating the semiconductor chip with the film-like adhesive from the support film and picking it up; The method includes a step of die-bonding the picked-up semiconductor chip with a film-like adhesive to the circuit-forming surface of the substrate by means of the film-like adhesive in the semiconductor chip with a film-like adhesive.

[0133] <Step of attaching the backside of the semiconductor wafer to the exposed surface of the film adhesive> In the process of attaching the back surface of a semiconductor wafer to the exposed surface of the film-like adhesive, for example, the side of the film-like adhesive in the dicing die bonding sheet opposite the support film side (i.e., the first side) is attached to the back surface of the semiconductor wafer, thereby producing a laminate comprising a semiconductor wafer and the dicing die bonding sheet attached to the back surface of the semiconductor wafer by the film-like adhesive in the dicing die bonding sheet. This process can be carried out in the same manner as the conventional method of attaching a dicing die bonding sheet to the back surface of a semiconductor wafer, except that a dicing die bonding sheet according to one embodiment of the present invention described above is used instead of a conventional dicing die bonding sheet.

[0134] <Process for producing semiconductor chips with film adhesive> In the process of producing semiconductor chips with a film-like adhesive, the order in which the semiconductor wafers in the laminate are divided (semiconductor chip production) and the film-like adhesive in the laminate are cut is not particularly limited, and the order may be divided into semiconductor wafers and then cut into film-like adhesive, or may be cut into film-like adhesive and then divided into semiconductor wafers, or may be simultaneous divided into semiconductor wafers and cut into film-like adhesive. Furthermore, when the division of the semiconductor wafers and the cutting of the film-like adhesive are not simultaneous divided into semiconductor wafers and then cut into film-like adhesive, the division of the semiconductor wafers and the cutting of the film-like adhesive may be carried out continuously or in stages.

[0135] The division of the semiconductor wafer and the cutting of the film adhesive can both be carried out by known methods. For example, the semiconductor wafer can be divided and the film adhesive can be cut continuously by dicing methods such as blade dicing, laser dicing using laser irradiation, or water dicing using water spraying containing an abrasive, etc. However, this is just one example of a method for dividing a semiconductor wafer and a method for cutting a film adhesive.

[0136] The film adhesive is cut along the division points of the semiconductor wafer, but in this case, when the film adhesive is cut after the semiconductor wafer is divided, the film adhesive is cut along the division points of the semiconductor wafer, i.e., along the peripheral edges of the semiconductor chips. On the other hand, when the film adhesive is cut before the semiconductor wafer is divided or when the film adhesive is cut simultaneously with the division of the semiconductor wafer, the film adhesive is cut along the planned division points of the semiconductor wafer.

[0137] In the process of producing semiconductor chips with a film-like adhesive, a semiconductor chip assembly with a film-like adhesive is produced, which is configured by holding a plurality of semiconductor chips with a film-like adhesive on the support film, each of the semiconductor chips having a semiconductor chip and the film-like adhesive provided on the back surface of the semiconductor chip after cutting. In the semiconductor chip assembly with a film-like adhesive, a plurality of semiconductor chips with a film-like adhesive are held (fixed) in an aligned state on the single support film that constitutes the dicing die bonding sheet.

[0138] <Picking up process> In the picking up step, the semiconductor chips with the film adhesive in the semiconductor chip assembly with the film adhesive can be picked up by separating them from the support film using a known method. In this process, by using the dicing die bonding sheet according to one embodiment of the present invention described above, even if the support film does not have an adhesive layer for direct contact with the film adhesive, it is possible to prevent the film adhesive from remaining on the support film when picking up the semiconductor chip with the film adhesive.

[0139] <Die bonding process> In the die bonding step, the semiconductor chip with the film adhesive after picking up can be die bonded to the circuit formation surface of the substrate by the film adhesive therein using a known method.

[0140] After the die bonding process, the semiconductor package and semiconductor device can be manufactured using the same method as conventional methods. For example, if necessary, one or more semiconductor chips can be stacked on the die-bonded semiconductor chip, followed by wire bonding. Next, the film adhesive is thermally cured, and the entire assembly is sealed with resin. Through these processes, a semiconductor package can be produced. Then, the desired semiconductor device can be manufactured using this semiconductor package.

[0141] 4A to 4D are cross-sectional views for schematically explaining a method for manufacturing a semiconductor device according to this embodiment, which show a manufacturing method using the dicing die bonding sheet 101 shown in FIG.

[0142] 4A shows a laminate 119A obtained in the bonding step. The laminate 119A includes a semiconductor wafer 9 and a dicing die bonding sheet 101 provided on the back surface 9b of the semiconductor wafer 9. 4B shows a semiconductor chip assembly 119B with a film-like adhesive obtained in the process of producing a semiconductor chip with a film-like adhesive. The semiconductor chip assembly 119B with a film-like adhesive is composed of a semiconductor chip 9′ and a plurality of semiconductor chips 139′ with a film-like adhesive, each of which includes a cut film-like adhesive 130 provided on the back surface 9b′ of the semiconductor chip 9′, held on a support film 11. FIG. 4C shows the state in which, in the pick-up step, the semiconductor chip 139' with the film-like adhesive is picked up by being separated from the support film 11 in the direction of arrow I using a separating means 7. An example of the separating means 7 is a vacuum collet. Note that the separating means 7 is not shown in cross section here. Remaining film-like adhesive 130 is suppressed on the first surface 11a of the support film 11. FIG. 4D shows a state in which the semiconductor chip 9' has been die-bonded to the circuit formation surface 5a of the substrate 5 with a film adhesive 130 in the die-bonding step.

[0143] 4A to 4D show a method for manufacturing a semiconductor device using dicing die bonding sheet 101, but similar products can be obtained when other dicing die bonding sheets 102 to 103 and the like are used. [Example]

[0144] The present invention will be described in more detail below with reference to specific examples, although the present invention is not limited to the examples shown below.

[0145] <Monomer> In the present examples and comparative examples, the full names of the monomers abbreviated are shown below. MA: methyl acrylate BA: n-butyl acrylate MMA: methyl methacrylate AA: acrylic acid HEA: 2-hydroxyethyl acrylate GMA: Glycidyl methacrylate

[0146] <Raw materials for manufacturing adhesive composition> In the present examples and comparative examples, the raw materials used in producing the adhesive compositions are shown below.

[0147] [Acrylic resin (a)] (a)-1: Acrylic resin (weight average molecular weight: 800,000, glass transition temperature: −42° C.) obtained by copolymerizing BA (84 parts by mass), MMA (8 parts by mass), AA (3 parts by mass), and HEA (5 parts by mass). (a)-2: Acrylic resin (weight average molecular weight: 800,000, glass transition temperature: −44° C.) obtained by copolymerizing BA (86 parts by mass), MMA (8 parts by mass), AA (1 part by mass), and HEA (5 parts by mass). (a)-3: An acrylic resin (weight average molecular weight: 800,000, glass transition temperature: −49° C.) obtained by copolymerizing BA (85 parts by mass) and HEA (15 parts by mass). (a)-4: Acrylic resin (weight average molecular weight: 800,000, glass transition temperature: −28° C.) obtained by copolymerizing BA (55 parts by mass), MA (10 parts by mass), GMA (20 parts by mass), and HEA (15 parts by mass).

[0148] [Epoxy resin (b1)] (b1)-1: o-cresol novolac epoxy resin (manufactured by Nippon Kayaku Co., Ltd., "EOCN-102S," epoxy equivalent: 205 to 217 g / eq, softening point: 55 to 77°C) (b1)-2: Trishydroxyphenylmethane type epoxy resin ("EPPN-502H" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 167 g / eq, softening point 54°C, molecular weight 1200) (b1)-3: Liquid bisphenol F epoxy resin (Mitsubishi Chemical Corporation, YL983U, epoxy equivalent: 165-175 g / eq) (b1)-4: Liquid bisphenol A epoxy resin (Mitsubishi Chemical Corporation "jER828", epoxy equivalent 184-194 g / eq) [Thermal curing agent (b2)] (b2)-1: o-cresol novolak resin (DIC Corporation, "Phenolite (registered trademark) KA-1160", hydroxyl group equivalent 117 g / eq, softening point 80°C, n in general formula (1): 6 to 7) [Curing accelerator (c)] (c)-1: 2-phenyl-4,5-dihydroxymethylimidazole ("Curezol (registered trademark) 2PHZ-PW" manufactured by Shikoku Chemicals Corporation, melting point 137 to 147°C)

[0149] [Inorganic filler (d)] (d)-1: Spherical silica modified with epoxy groups ("Admanano (registered trademark) YA050C-MKK" manufactured by Admatechs Co., Ltd., average particle size 50 nm) [Coupling agent (e)] (e)-1: Oligomeric silane coupling agent having epoxy, methyl, and methoxy groups ("X-41-1056" manufactured by Shin-Etsu Silicones Co., Ltd., epoxy equivalent: 280 g / eq) [Crosslinking agent (f)] (f)-1: Trimethylolpropane tolylene diisocyanate trimer adduct (Toyochem Co., Ltd. "BHS8515")

[0150] [Example 1] <<Manufacturing of film adhesives>> <Production of Adhesive Composition> Acrylic resin (a)-1 (18 parts by weight), epoxy resin (b1)-1 (40 parts by weight), epoxy resin (b1)-2 (10 parts by weight), epoxy resin (b1)-3 (6 parts by weight), thermosetting agent (b2)-1 (24 parts by weight), curing accelerator (c)-1 (0.3 parts by weight), coupling agent (e)-1 (1.0 part by weight), and crosslinking agent (f)-1 (0.7 parts by weight) were dissolved or dispersed in methyl ethyl ketone and stirred at 23°C to obtain an adhesive composition with a total concentration of all the above components of 50% by weight. Note that the amounts of all components other than methyl ethyl ketone shown here are the amounts of the target product, excluding solvent components.

[0151] <Production of film adhesive> A release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) was prepared, in which one side of a polyethylene terephthalate (PET) film had been treated with silicone for release. The adhesive composition obtained above was applied to the release-treated surface of the release film, and the film was dried by heating at 100°C for 1 minute to form a film adhesive with a thickness of 20 μm, and a film adhesive sheet was obtained in which the release film and film adhesive were laminated.

[0152] <<Dicing die bonding sheet manufacturing>> A polyolefin film (Fanclea (registered trademark) LLD#80, thickness 80 μm, manufactured by Gunze Ltd.) was attached to the exposed surface of the film adhesive of the film adhesive sheet. This resulted in a dicing die bonding sheet consisting of the polyolefin film (support film), film adhesive, and release film laminated in this order in the thickness direction.

[0153] <Peel force measurement> (peel-off tape) A dicing tape (Adwill (registered trademark), D-841, manufactured by Lintec Corporation) having a UV-curable adhesive layer laminated on a substrate was prepared as a peel tape.

[0154] (Method for measuring peel strength) The exposed surface of the adhesive layer of the peel tape was bonded to the exposed surface of the film-like adhesive of the dicing die bonding sheet. The resulting laminate was cut to a width of 25 mm and a length of 25 cm, and the support film of the dicing die bonding sheet was peeled off to expose the surface of the film-like adhesive, which was used as a test piece for peel force measurement. The exposed surface of the film-like adhesive of the test piece was attached to the polished surface of a silicon wafer (#2000, thickness: 350 μm), and UV irradiation was performed from the base side of the peel tape (illuminance: 230 mW / cm 2 , Light intensity: 190mJ / cm 2 ). Using a universal tensile tester (Shimadzu Corporation, Autograph AG-IS), the peel tape after UV irradiation was peeled off from the silicon wafer at a peel angle of 180° and a peel speed of 0.3 m / min, and the peel strength [N / 25 mm] of the film adhesive from a 6-inch silicon wafer was measured in accordance with JIS Z0237:2009. In this case, the peel strength of the film adhesive from the silicon wafer was originally measured on the surface of the film adhesive that comes into contact with the substrate, but this peel strength is the same as the peel strength of the surface of the film adhesive that comes into contact with the silicon wafer.

[0155] <Reworkability test> As in the above, a dicing tape (Adwill (registered trademark), D-841, manufactured by Lintec Corporation) was prepared as a peeling tape. Using a laminator (MCK Corporation, MCL-650), the film adhesive surface of the dicing die bonding sheet was attached to the polished surface of a 6-inch silicon wafer (#2000, thickness: 350 μm) at 60°C and a speed of 0.3 m / min. The support film of the dicing die bonding sheet was peeled off, and the adhesive layer of the release tape was attached to the exposed film adhesive with a squeegee. This resulted in a laminate consisting of the release tape substrate, adhesive layer, film adhesive, and silicon wafer stacked in this order in the thickness direction. This laminate was irradiated with UV light (illuminance: 230 mW / cm) from the substrate side of the release tape. 2 , Light intensity: 190mJ / cm2 ). The laminate after UV irradiation was placed on the suction table of a tape mounter (RAD-2500 manufactured by Lintec Corporation) and fixed by suction. The peel tape after UV irradiation was then peeled off at a peel angle of 180° and a peel speed of 0.3 m / min, and the reworkability was evaluated according to the following three-level criteria.

[0156] (Reworkability evaluation) A: The film adhesive could be peeled off from the silicon wafer, and no film adhesive remained on the silicon wafer. B: A film-like adhesive remained on a part of the silicon wafer. C: A film-like adhesive remained on the entire silicon wafer.

[0157] <Evaluation of the effect of suppressing the residue of film adhesive when picking up> [Manufacturing silicon chips with film adhesive] The release film was removed from the dicing die bonding sheet obtained immediately after production. The dicing die bonding sheet was attached to the back surface (polished surface) of a silicon wafer (diameter 200 mm, thickness 350 μm) with a #2000 polished surface on the back surface, using a tape attachment device ("Adwill (registered trademark) RAD2500" manufactured by Lintec Corporation) while heating to 60°C, using the film-like adhesive. At the same time, a ring frame, which serves as a dicing jig, was attached to the outer periphery of the silicon wafer via a jig adhesive layer cut to the size of the ring frame. This resulted in a laminate consisting of a support film, a film-like adhesive, and a silicon wafer stacked in this order in the thickness direction.

[0158] The resulting laminate was then diced using a dicing machine (DISCO Corporation, DFD6361) to divide the silicon wafer and cut the film adhesive continuously, yielding silicon chips measuring 2 mm x 2 mm. The dicing was performed at a dicing blade speed of 30 mm / s and a rotation speed of 30,000 rpm, cutting the dicing die bonding sheet to a depth of 20 μm from the adhesive surface of the substrate (i.e., the entire thickness of the adhesive film and a depth of 20 μm from the adhesive surface of the substrate). A DISCO Z05-SD2000-D1-90 CC dicing blade was used. As a result of the above, a group of silicon chips with film-like adhesive was produced using a dicing die bonding sheet, in which multiple silicon chips with film-like adhesive were fixed in an aligned state on a support film by the film-like adhesive, each silicon chip comprising a silicon chip and a film-like adhesive provided on the back surface of the silicon chip.

[0159] [Evaluation of the effect of suppressing film adhesive residue when picked up] Using a pick-up die bonding device (Canon Machinery's "BESTEM D-510"), 100 silicon chips with film adhesive from the group of silicon chips with film adhesive obtained above were picked up by detaching them from the support film under the following pick-up conditions: This pick-up was performed on 100 silicon chips with film adhesive, and one silicon chip with film adhesive was pushed up from the film adhesive side with one pin.

[0160] (Pickup conditions) Push-up height: 200 μm Push-up speed: 20mm / s Expanded amount: 4mm Pickup load: 1N

[0161] Next, the pickup locations on the support film were observed using a digital microscope (Keyence VHX-1000), and the number of locations where film-like adhesive remaining was counted, and the effect of suppressing film-like adhesive remaining at the time of pickup was evaluated according to the following criteria. The results are shown in Table 1. In Table 1, the number in parentheses in the corresponding column indicates the number of locations where the above-mentioned film-like adhesive remained. (Evaluation criteria) A: There were 5 or fewer locations where the film adhesive remained, demonstrating an excellent effect in suppressing the remaining adhesive. B: The film adhesive remained in 6 to 30 places, which was good. C: There were 31 or more locations where the film-like adhesive remained, and the sample was poor.

[0162] <Measurement of adhesive strength of thermoset film adhesive> [Preparation of the first test piece] The silicon chip with the film-like adhesive from the group of silicon chips with the film-like adhesive was picked up by separating it from the support film. Then, using a manual die bonder (CAMMAX Precima's "EDB65"), the entire exposed surface of the film-like adhesive in the silicon chip with the film-like adhesive (the surface opposite the silicon chip) was pressed onto the surface of a copper plate (500 μm thick), thereby die-bonding the silicon chip with the film-like adhesive to the copper plate. The die-bonding was performed by applying a force of 2.45 N (250 gf) for 3 seconds to the silicon chip with the film-like adhesive, which had been heated to 125°C, in a direction perpendicular to the contact surface with the copper plate. Next, the copper plate after die bonding was heated at 160° C. for 1 hour to thermally cure the film-like adhesive on the copper plate. In this manner, a first test piece 99 was produced, which was configured by laminating a copper plate, a thermoset film adhesive, and a silicon chip in this order in the thickness direction.

[0163] [Measurement of adhesive strength of thermoset film adhesive] Using a bond tester (Dage "Series 4000"), a force was simultaneously applied to the aligned portions of the side of the thermoset film adhesive and the side of the silicon chip in the first test piece 99 obtained above at a speed of 200 μm / s in a direction parallel to one side of the thermoset film. A stainless steel plate-shaped pressure device was used to apply the force, and the tip of the pressure device on the copper plate side was adjusted to a height of 7 μm from the surface of the copper plate on which the silicon chip was mounted, so that the pressure device did not come into contact with the copper plate. The maximum force applied until the thermoset film broke or peeled from the copper plate was measured, and this measurement value was used as the adhesive strength (N / 2 mm□) of the thermoset film. The adhesive strength of the thermoset film adhesive was also evaluated according to the following criteria. The results are shown in Table 1. (Evaluation criteria) A: The adhesive strength of the thermoset product was 101N / 2mm□ or more, which was excellent. B: The adhesive strength of the thermosetting product was 51 to 100 N / 2 mm□ or more, which was good. C: The adhesive strength of the thermosetting product was 50N / 2mm□ or less, which was poor.

[0164] <<Production of film adhesives and dicing die bonding sheets, and evaluation of film adhesives>> [Examples 2 to 4, Comparative Examples 1 and 2] Except for changing the types and amounts of the components used in producing the adhesive composition so that the types and contents of the components contained in the adhesive composition were as shown in Tables 1 and 2, a film adhesive and a dicing die bonding sheet were produced in the same manner as in Example 1, and the film adhesive was evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2.

[0165] In Tables 1 and 2, the notation "-" in the column for the contained component means that the adhesive composition does not contain that component.

[0166] [Table 1]

[0167] [Table 2]

[0168] As is clear from the above results, the dicing die bonding sheets of Examples 1 to 4 were able to suppress the remaining film adhesive on the support film when picking up the silicon chip with the film adhesive. In particular, the dicing die bonding sheets of Examples 1 to 3 were excellent in the effect of suppressing the remaining film adhesive. Furthermore, the film adhesives in the dicing die bonding sheets of Examples 1 to 4 had a peel strength of less than 1.4 N / 25 mm from the silicon wafer, and were excellent in reworkability. Furthermore, in Examples 1 to 4, the adhesive strength of the thermoset film-like adhesive was 51 N / 2 mm□ or more, which was sufficient. In particular, in Examples 1 to 4, the adhesive strength of the thermoset film-like adhesive was 111 N / 2 mm□ or more, which was excellent. The dicing die bonding sheets of Comparative Examples 1 and 2 were unable to prevent the film adhesive from remaining on the support film when the silicon chip with the film adhesive was picked up. In Comparative Example 2, the adhesive strength of the thermoset film adhesive was 34 N / 2 mm square, which was insufficient. [Industrial Applicability]

[0169] The present invention can be used in the manufacture of semiconductor devices. [Explanation of symbols]

[0170] 11···Support film, 11a···First surface of support film, 13, 23···Film-like adhesive, 101, 102, 103···Dicing die bonding sheet, 90···Thermosetting product of film-like adhesive, 90a···First surface of thermosetting product of film-like adhesive, 90b···Second surface of thermosetting product of film-like adhesive, 90c···Side surface of thermosetting product of film-like adhesive, 91···Copper plate, 92···Silicon chip, 92c···Side surface of silicon chip, 99···First test piece

Claims

1. A dicing die bonding sheet comprising a support film and a thermosetting film-like adhesive laminated on one surface of the support film in direct contact therewith, The film adhesive contains an acrylic resin (a) having a carboxy group, The dicing die bonding sheet, wherein the film adhesive has a content of the acrylic resin (a) of 10 to 30 mass % relative to 100 mass % of the film adhesive.

2. 2. The dicing die bonding sheet according to claim 1, wherein the film-like adhesive contains a structural unit having a carboxy group in an amount of 1% by mass or more relative to 100% by mass of the acrylic resin (a).

3. The dicing die bonding sheet according to claim 1 or 2, wherein the film-like adhesive contains a thermosetting component (b).

4. 4. The dicing / die bonding sheet according to claim 1, wherein the supporting film is made of a polyolefin.

5. 5. The dicing die bonding sheet according to claim 1, wherein the film-like adhesive is substantially free of an inorganic filler (d).

6. A dicing die bonding sheet comprising a support film and a thermosetting film-like adhesive laminated on one surface of the support film in direct contact therewith, The film adhesive contains an acrylic resin (a) having a carboxy group, A dicing die bonding sheet comprising: a thermoset product of the film-like adhesive measuring 2 mm x 2 mm and 20 μm thick; a copper plate having a thickness of 500 μm and provided over the entire surface of one side of the thermoset product; and a silicon chip having a thickness of 350 μm and provided over the entire surface of the other side of the thermoset product; wherein a first test piece is prepared in which the side of the thermoset product and the side of the silicon chip are aligned; and, with the copper plate fixed, when a force is applied to the aligned portions of the side of the thermoset product and the side of the silicon chip in the first test piece at a speed of 200 μm / s in a direction parallel to one side of the thermoset product, the maximum force applied until the thermoset product is destroyed, peeled off from the copper plate, or peeled off from the silicon chip is 60 N / 2 mm□ or more.

7. A process of attaching the back surface of a semiconductor wafer to the exposed surface of a film-like adhesive of a dicing die bonding sheet comprising a support film and a thermosetting film-like adhesive laminated on one surface of the support film in direct contact therewith; a step of producing semiconductor chips by dividing the semiconductor wafer, and cutting the film adhesive along the division points of the semiconductor wafer to produce semiconductor chips with a film adhesive; a step of separating the semiconductor chip with the film-like adhesive from the support film and picking it up; a step of die-bonding the picked-up semiconductor chip with a film-like adhesive to a circuit-forming surface of a substrate by means of the film-like adhesive in the semiconductor chip with a film-like adhesive, The film-like adhesive comprises an acrylic resin (a) having a carboxy group.

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