jig

Abstract

To provide a jig which can suppress interference with a part of a plating tank when being installed in the plating tank.SOLUTION: A jig for holding a printed wiring board includes: a carrier bar; a first leg member extending substantially vertical to the carrier bar; a second leg member extending substantially vertical to the carrier bar; a first cover member covering the end of the first leg member; and a second cover member covering the end of the second leg member. The printed wiring board is held by the first leg member and the second leg member, and the first cover member and the second cover member are made gradually thinner toward the tip.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a jig for holding a printed wiring board. [Background technology]

[0002] Patent Document 1 discloses a workpiece holder having a header member, a first flexible leg extending from a first end of the header member, and a second flexible leg extending from a second end of the header member. The workpiece holder holds the workpiece by means of a seal strip provided on the first flexible leg and a seal strip provided on the second flexible leg. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2019-527473 Summary of the Invention

[0004] [Problem of Patent Document 1] The technology of Patent Document 1 forms an electroplating film on a workpiece using a workpiece holder. When the workpiece holder is immersed in a plating bath, the ends of the first and second flexible legs may collide with the plating bath. If they collide, the ends of the first and second flexible legs may be damaged. [Means for solving the problem]

[0005] The jig of the present invention is a jig for holding a printed wiring board, and includes a carrier bar, a first leg member extending substantially perpendicular to the carrier bar, a second leg member extending substantially perpendicular to the carrier bar, a first cover member covering an end of the first leg member, and a second cover member covering an end of the second leg member. The printed wiring board is held by the first leg member and the second leg member, and the first cover member and the second cover member are gradually thinner toward their tips.

[0006] In the jig according to an embodiment of the present invention, the end of the first leg member is covered by a first cover member, and the end of the second leg member is covered by a second cover member. This prevents damage to the end of the first leg member and the end of the second leg member. Furthermore, the first cover member and the second cover member are gradually thinner toward the tip. This allows the jig to smoothly enter the plating tank. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a perspective view schematically illustrating a jig and a printed wiring board held by the jig according to the embodiment. [Figure 2] FIG. 2 is a front view schematically showing the jig and the printed wiring board held by the jig according to the embodiment. [Figure 3] FIG. 2 is a top view schematically showing the jig of the embodiment. [Figure 4] FIG. 2 is a right side view schematically showing the jig of the embodiment. [Figure 5] An explanatory diagram of part V in Figure 4. [Figure 6] FIG. 10 is an explanatory diagram schematically showing a second holding mechanism of the second leg member and a printed wiring board sandwiched between the second holding mechanisms. [Figure 7] FIG. 2 is a perspective view schematically showing a plating tank having a jig and a guide member according to an embodiment. [Figure 8] FIG. 4 is an explanatory diagram schematically showing a second cover member and a second guide block. DETAILED DESCRIPTION OF THE INVENTION

[0008] [Embodiment] 1 to 4 schematically show a jig 2 according to an embodiment. FIG. 1 is a perspective view, FIG. 2 is a front view, FIG. 3 is a top view, and FIG. 4 is a right side view. The jig 2 according to the embodiment holds both ends of a printed wiring board 4. The jig 2 holding the printed wiring board 4 is placed in a plating tank, whereby electrolytic plating is applied to the printed wiring board 4.

[0009] 1, the jig 2 has a carrier bar 10, a first leg member 21, and a second leg member 22. The printed wiring board 4 is held by the first leg member 21 and the second leg member 22.

[0010] The carrier bar 10 is formed in an elongated shape. The entire surface of the carrier bar 10 is covered with a resin coating. As shown in FIGS. 1 and 3, two conveying sections 14 are formed on the upper surface 10A of the carrier bar 10. The jig 2 is conveyed via the conveying sections 14 by a conveying device (not shown).

[0011] As shown in Figures 1 and 2, the first leg member 21 extends from the first end 11 of the carrier bar 10. The first leg member 21 extends approximately perpendicular to the lower surface 10B of the carrier bar 10. The first leg member 21 is formed to be elongated. The first leg member 21 has a first holding mechanism 31 for holding one end of the printed wiring board 4. The first holding mechanism 31 is provided along the length of the first leg member 21. The end (lower end) of the first leg member 21 is covered with a first cover member 41. The first cover member 41 is made of resin.

[0012] As shown in Figures 1, 2, and 4, the second leg member 22 extends from the second end 12 opposite the first end 11 of the carrier bar 10. The second leg member 22 extends approximately perpendicular to the lower surface 10B of the carrier bar 10. The second leg member 22 is formed in an elongated shape. The second leg member 22 has a second holding mechanism 32 for holding the other end of the printed wiring board 4. The second holding mechanism 32 is provided along the length of the second leg member 22. The end (lower end) of the second leg member 22 is covered with a second cover member 42. The second cover member 42 is made of resin.

[0013] 5 is an explanatory diagram of portion V in FIG. 4. As shown in FIG. 5, the second cover member 42 covers the end of the second leg member 22. The thickness of the second cover member 42 gradually decreases toward the tip 84. The "thickness" is the length in the left-right direction in FIG. 5. As shown in FIG. 5, the second cover member 42 tapers toward the tip 84. The thickness T42 of the tip 84 of the second cover member 42 is formed to be equal to or smaller than the thickness T22 of the second leg member 22.

[0014] The first cover member 41 has a similar configuration to the second cover member 42. That is, the first cover member 41 covers the end of the first leg member 21. The thickness of the first cover member 41 gradually decreases toward the tip 83. The first cover member 41 tapers toward the tip 83. The thickness T41 of the tip 83 of the first cover member 41 is formed to be equal to or smaller than the thickness T21 of the first leg member 21.

[0015] FIG. 6 schematically illustrates the second holding mechanism 32 and the printed wiring board 4 sandwiched between the second holding mechanism 32. The second holding mechanism 32 holds the edge of the printed wiring board 4. As shown in FIG. 6, the second holding mechanism 32 has a pair of flexible members 52A and 52B. The flexible members 52A and 52B are formed of flexible insulating members. The flexible members 52A and 52B incorporate conductive members. The edge of the printed wiring board 4 is held by sandwiching both sides of the edge of the printed wiring board 4 between the flexible members 52A and 52B. Conductive contacts 54A and 54B are exposed from the inside of the tips of the flexible members 52A and 52B. The contacts 54A and 54B are connected to conductive members incorporated in the flexible members 52A and 52B. When the edge of the printed wiring board 4 is held, the contacts 54A and 54B come into contact with the conductive layer (seed layer) on the surface of the printed wiring board 4. Therefore, a current can be passed through the second leg member 22 to the conductive layer (seed layer) of the printed wiring board 4.

[0016] The first holding mechanism 31 has the same configuration as the second holding mechanism 32 shown in Fig. 6. The first holding mechanism 31 and the second holding mechanism 32 hold the printed wiring board 4 in the same manner.

[0017] Fig. 7 shows the jig 2 and plating tank 70 of the embodiment. Fig. 7 shows only the upper part of the plating tank 70. A first guide member 71 that guides the first leg member 21 of the jig 2 and a second guide member 72 that guides the second leg member 22 are provided on the inner wall of the plating tank 70. The first guide member 71 and the second guide member 72 face each other.

[0018] The first guide member 71 includes a first guide block 71A and a first guide rail 71B. The first guide block 71A is provided above the plating tank 70. The first guide block 71A is a block member having a groove for guiding the first leg member 21 into the plating tank 70. The first guide rail 71B is provided below the first guide block 71A. The first guide rail 71B guides the first leg member 21 into the plating tank 70.

[0019] The second guide member 72 includes a second guide block 72A and a second guide rail 72B. The second guide block 72A is provided above the plating tank 70. The second guide block 72A has a groove for guiding the second leg member 22 into the plating tank 70. The second guide rail 72B is provided below the second guide block 72A. The second guide rail 72B guides the second leg member 22 into the plating tank 70.

[0020] When electrolytic plating is formed on a printed wiring board 4 using the jig 2 of this embodiment, the following steps are performed. Both ends of the printed wiring board 4 are sandwiched between the first leg member 21 and the second leg member 22 of the jig 2. This causes the printed wiring board 4 to be held by the jig 2. A transport device holds the jig 2. The transport device is not shown. The transport device transports the jig 2 to above the plating tank 70. The transport device immerses the printed wiring board 4 held by the jig 2 into the plating solution in the plating tank 70. At this time, the first leg member 21 is guided, starting from the first cover member 41 at the lower end, by the grooves of the first guide block 71A and the first guide rail 71B. The second leg member 22 is guided, starting from the second cover member 42 at the lower end, by the grooves of the second guide block 72A and the second guide rail 72B.

[0021] 8, in this embodiment, the second cover member 42 tapers toward the tip 84. The thickness T42 of the tip 84 of the second cover member 42 is formed to be equal to or smaller than the thickness T22 of the second leg member 22 (FIG. 5). Therefore, the second cover member 42 and the second leg member 22 are smoothly guided by the grooves of the second guide block 72A.

[0022] In this embodiment, the first cover member 41 tapers toward the tip 83. The thickness T41 of the tip 83 of the first cover member 41 is formed to be equal to or smaller than the thickness T21 of the first leg member 21 (FIG. 5). Therefore, the first cover member 41 and the first leg member 21 are smoothly guided into the grooves of the first guide block 71A.

[0023] This places the jig 2 in the plating tank 70. The first leg member 21 is held in the plating tank 70 by the first guide member 71. The second leg member 22 is held in the plating tank 70 by the second guide member 72. The lower surface 10B of the carrier bar 10 contacts the upper surface of the first guide block 71A and the upper surface of the second guide block 72A. The lower surface 10B of the carrier bar 10 is placed on the first guide block 71A and the second guide block 72A. This causes the printed wiring board 4 to be immersed in the plating solution. The transport device releases the jig 2.

[0024] An electric current is passed through the conductive layer (seed layer) on the surface of printed wiring board 4 via first leg member 21, first holding mechanism 31, second leg member 22, and second holding mechanism 32. Electrolytic plating is applied to printed wiring board 4. After the electrolytic plating process is completed, the transport device picks up jig 2 again. The transport device transports jig 2 to the next working position.

[0025] In the embodiment, the end of the first leg member 21 is covered by the first cover member 41, and the end of the second leg member 22 is covered by the second cover member 42. This prevents damage to the end of the first leg member 21 and the end of the second leg member 22. Furthermore, the first cover member 41 and the second cover member 42 are gradually thinner toward the tips 83 and 84, so that the jig 2 can be smoothly inserted into the plating tank 70.

[0026] [Another Example 1 of the embodiment] In the first modified example of the embodiment, the surfaces of the first cover member 41 and the second cover member 42 are curved toward the tips 83 and 84 .

[0027] [Second Alternative Embodiment] In the second modified embodiment, the thickness of a tip 83 of the first cover member 41 is greater than the thickness of the first leg member 21, and the thickness of a tip 84 of the second cover member 42 is greater than the thickness of the second leg member 22. The first cover member 41 and the second cover member 42 become thinner toward the tips 83, 84.

[0028] [Example 3 of the embodiment] In the third modified embodiment, the first leg member 21 and the second leg member 22 extend from a portion of the carrier bar 10 other than the end portion. [Explanation of symbols]

[0029] 2: Jig 4: Printed wiring board 10: Career Bar 11:First end 12:Second end 21:First leg member 22:Second leg member 41: First cover member 42: Second cover member 70: Plating tank 71: First guide member 71A: First guide block 72: Second guide member 72A: Second guide block 83: Tip (of first cover member) 84: Tip (of second cover member)

Claims

1. A jig for holding a printed wiring board, the jig comprising: a carrier bar; a first leg member extending substantially perpendicular to the carrier bar; a second leg member extending substantially perpendicular to the carrier bar; a first cover member covering an end of the first leg member; and a second cover member covering an end of the second leg member, the first leg member is a member that is guided by a groove of a first guide block and a first guide rail that are provided on a first guide member that is provided on an inner wall of the plating tank, the second leg member is a member that is guided by a second guide block and a groove of a second guide rail that are provided on a second guide member that is provided on the inner wall, A jig characterized in that the printed wiring board is held by the first leg member and the second leg member, and the first cover member and the second cover member are gradually thinner toward their tips.

2. A jig as described in Claim 1, characterized in that the first cover member tapers toward the tip, and the second cover member tapers toward the tip.

3. A jig as described in claim 1, characterized in that the thickness of the tip of the first cover member is less than or equal to the thickness of the first leg member, and the thickness of the tip of the second cover member is less than or equal to the thickness of the second leg member.

4. A jig as described in claim 1, characterized in that the first leg member extends from a first end of the carrier bar, and the second leg member extends from a second end of the carrier bar opposite the first end.

5. A jig as described in claim 1, characterized in that the printed wiring board is held by clamping both ends of the printed wiring board between the first leg member and the second leg member.

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