Substrate break detection device and substrate break detection method

Abstract

Provided are a substrate division detection device and a substrate division detection method that, after dividing a substrate in a state held on a holding film into a plurality of chip materials, can detect and assess for each dividing line whether the substrate in the state held on the holding film is reliably divided into chip materials.　The present invention is a device (3) that, after a substrate (1) in a state held on a holding film (9) is divided into a plurality of chip materials (2), detects the division success or failure of the substrate, and has: an extrusion member (4) that is deployed to face one main surface of the substrate, and extrudes chip materials divided into a plurality from one main surface; an illumination means (5) that is deployed to face the other main surface of the substrate, and irradiates an illumination light (IL) on the extruded chip materials (2); an imaging means (6) that is deployed to the other main surface side of the substrate, and that captures the reflected light (SL) reflected on the extruded chip materials; and a division detection means (7) that detects division success or failure of the substrate using the image captured by the imaging means.

Description

[Technical Field]

[0001] The present invention relates to a technique for detecting whether a substrate has been successfully divided into a plurality of chips after the substrate has been divided into a plurality of chips. [Background technology]

[0002] Conventionally, when dividing a substrate such as a brittle material substrate, there are methods in which scribe lines are formed on the substrate in a scribing process, and then the substrate is divided along the scribe lines in a breaking process, or methods in which the substrate is divided by cutting (dicing) with a dicing blade. The scribing process involves setting the substrate in a scribing device and using a scribing tool to form scribe lines in a grid pattern on the substrate, or using laser irradiation to form scribe lines (including modified layers, grooves, etc.) in a grid pattern along the dividing lines. In the breaking process, the substrate is set in a breaking device, for example, with the side on which the scribe lines are formed facing downward, and a blade (breaking blade) is pressed against the upper surface of the substrate from directly above the scribe lines to press the back surface of the scribe lines. Vertical cracks are created, and the substrate is divided along the scribe lines to produce multiple chips (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2017-212451 Summary of the Invention [Problem to be solved by the invention]

[0004] Although most substrates after being divided into multiple chips by breaking or dicing are divided into multiple chips, there are rare cases where the substrate has portions that are not divided. Until now, when the multiple chips were separated, that is, even when the substrate was divided into individual pieces, there were some chips that were not separated. For example, this could be a state where two or more chips were not separated.

[0005] This substrate was attached to the center of an adhesive film stretched across a dicing ring (annular ring component) (the opposite side (back side) was protected with a protective sheet if necessary), so it was impossible to see the parts of the substrate that were not cut unless these were removed. For this reason, there is a demand for technology that can detect whether a substrate is separated after breaking while it is assembled with a holding member such as a dicing ring or adhesive film (or in some cases, a protective sheet), i.e., before the substrate is removed from the adhesive film (before it is separated into each chip material).As such a technology, a means of detecting the separation state by expanding the adhesive film has been proposed, but this detects the substrate as a whole, making it difficult to reliably detect the separation state at each separation line.

[0006] Therefore, in consideration of the above problems, the present invention aims to provide a substrate breakage detection device and a substrate breakage detection method that can detect and determine for each breakage line whether a substrate held by a holding film has been reliably divided into chip materials after the substrate is divided into multiple chip materials while held by the holding film. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention provides the following technical means. The substrate breakage detection device of the present invention is a device that detects whether a substrate held by a holding film has been successfully divided after the substrate has been divided into a plurality of chip materials, and is characterized by having an extrusion member that is arranged opposite the main surface of the substrate and extrudes the substrate from the main surface, an illumination means that is arranged opposite the main surface of the substrate and irradiates illumination light onto the extruded portion of the substrate, an imaging means that images reflected light reflected by the extruded portion of the substrate or transmitted light that has passed through a gap formed in the extruded portion of the substrate, and a breakage detection means that uses the image taken by the imaging means to detect whether the substrate has been successfully divided. In addition, in the substrate breakage detection device of the present invention, the extrusion member is arranged to face one main surface of the substrate and extrudes the break line portion between adjacent chip materials, the lighting means is arranged to face one or the other main surface of the substrate and irradiates the break line portion with illumination light, and the imaging means is arranged on the main surface of the substrate opposite to the main surface facing the lighting means and images the transmitted light that has passed through the gap formed in the extruded break line portion. If the gap is detected as a single line and a line image of the transmitted light is detected in which the gap is shining at a predetermined brightness or above, it is determined that the division process was successful, and if the gap is detected as a line image of the transmitted light in which the gap is shining discontinuously or at a brightness below the predetermined brightness, it is determined that an undivided portion exists on the substrate. The extrusion member has light-transmitting properties, the illumination means irradiates the illumination light onto the extrusion member from one main surface side or the other main surface side of the substrate, and the imaging means images the transmitted light that has passed through the extrusion member and the gap from the side of the substrate opposite to the illumination means. The extrusion member includes the illumination means, and the imaging means images the transmitted light that has passed through the extrusion member and the gap from the side of the substrate opposite to the extrusion means.

[0008] Preferably, the extrusion member is an elongated member that extrudes from the substrate a plurality of the chip materials arranged in a line along the extrusion member or a dividing line portion between a plurality of the chip materials arranged in two adjacent lines. 。

[0014] Preferably, in the substrate breakage detection device described above, when the extrusion member is extruded to detect breakage of the substrate along the X-axis direction breakage line of the substrate that has been divided along the X-axis direction and the Y-axis direction orthogonal to the X-axis direction, the extrusion member is arranged along the X-axis direction and extruded to extrude the chip materials lined up in a row in the X-axis direction or the breakage line portion between two adjacent rows of chip materials, and detects breakage of the breakage line on both or one side of the extruded chip materials or the extruded breakage line portion, and then the substrate and the extrusion member are moved relatively in the Y-axis direction, and the extrusion member is extruded to extrude the chip materials lined up in an adjacent row or the adjacent breakage line portion, When detecting the breakage of the dividing lines on both or one side of the extruded chip material or the dividing line of the extruded dividing line portion, and similarly detecting the breakage of the dividing line in the Y-axis direction, the extrusion member is arranged along the Y-axis direction and extruded to extrude the chip material arranged in a row in the Y-axis direction or the dividing line portion between two adjacent rows of chip material, detect the breakage of the dividing lines on both or one side of the extruded chip material or the dividing line of the extruded dividing line portion, and then move the substrate and the extrusion member relative to each other in the X-axis direction to detect the breakage of the dividing lines on both or one side of the chip material arranged in an adjacent row or the dividing line of the adjacent dividing line portion.

[0016] In addition, the substrate separation detection method of the present invention is a method for detecting whether the substrate has been successfully separated after separating the substrate held by a holding film into multiple chip materials, and is characterized by performing the following steps (a) to (d) in order. (a): Arranged so as to face one main surface of the substrate , having translucency The extruded member is divided into multiple parts. Mutually The separation line between adjacent chip materials is pushed out from the substrate. (b): Extruded Before Illumination light is irradiated from the illumination means onto the dividing line portion. The substrate is pressed against the extrusion member from one main surface side or the other main surface side. Irradiate. (c) : Pushed out Before The light transmitted through the gap formed in the dividing line portion is from the opposite side of the substrate from the illumination means via the pushing member An image is taken by the imaging means. (d) A separation detection means detects whether the substrate has been successfully separated using the image acquired by the imaging means.

[0017] The extrusion member is a long member that presses and extrudes a plurality of the chip materials arranged in a line along the extrusion member or a dividing line portion between a plurality of the chip materials arranged in two adjacent lines from the substrate, the illumination means irradiates the extruded chip materials or the dividing line portion with the illumination light, the imaging means images reflected light that reflects the extruded chip materials or the dividing line portion or transmitted light that passes through a gap formed in the extruded dividing line portion, and the division detection means performs the following step (d-1 )of line cormorant. (d-1) :before When the imaging means images the transmitted light that has passed through the gap formed in the dividing line portion, if the division detection means detects a line image of the transmitted light in which the gap is in the shape of a single line and shines with a predetermined brightness or above, it determines that the division process has been successful, and if the imaging means detects a line image of the transmitted light in which the gap shines discontinuously or with a brightness below the predetermined brightness, it determines that an undivided portion exists on the substrate.

[0018] Preferably, the pushing member has light transmissivity, the illumination means irradiates the pushing member with the illumination light from one main surface side or the other main surface side of the substrate, and the imaging means images the transmitted light that has passed through the gap via the pushing member from the side of the substrate opposite to the illumination means. 。

[0019] Preferably, in the above-mentioned method for detecting breakage of a substrate, when the extrusion member is used to extrude the chip material or the breakage line portion from the substrate to detect breakage of the breakage lines on both sides or one side of the chip material lined up in a row in the X-axis direction of the substrate or the breakage line between the chip materials lined up in two adjacent rows of the substrate, the extrusion member is extruded while moving the substrate and the extrusion member relative to each other in the Y-axis direction to detect breakage of each breakage line, and when the extrusion member is used to detect breakage of the breakage lines on both sides or one side of the chip material lined up in a row in the Y-axis direction perpendicular to the X-axis direction of the substrate or the breakage line between the chip materials lined up in two adjacent rows of the substrate, the extrusion member is extruded while moving the substrate and the extrusion member relative to each other in the X-axis direction to detect breakage of each breakage line. [Effects of the Invention]

[0020] According to the present invention, after dividing a substrate held by a holding film into a plurality of chip materials, it is possible to detect and determine whether the substrate has been reliably divided into chip materials while the substrate is held by the holding film for each dividing line. According to the present invention, when detecting division of the lines on both sides of the chip materials, it is possible to detect division for each two adjacent dividing lines. [Brief explanation of the drawings]

[0021] [Figure 1A] 1 is a side view schematically showing an example of a substrate break detection device according to the present invention. [Figure 1B] 1 is a side view schematically showing an example of a substrate break detection device according to the present invention. [Figure 1C] 1 is a side view schematically showing an example of a substrate break detection device according to the present invention. [Figure 2A] 1 is a plan view schematically showing an example of a substrate break detection device according to the present invention. [Figure 2B] 1 is a plan view schematically showing an example of a substrate break detection device according to the present invention. [Figure 2C] 1 is a plan view schematically showing an example of a substrate break detection device according to the present invention. [Figure 3] 10 is an image showing an example of a substrate being divided. [Figure 4] 10 is an image showing an example of an undivided substrate. [Figure 5] FIG. 10 is a diagram schematically showing an XY map summarizing the success or failure of dividing a substrate. [Figure 6] 10 is an image showing an example of a substrate being divided. [Figure 7] 10 is an image showing an example of a substrate being divided. DETAILED DESCRIPTION OF THE INVENTION

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a substrate break detection device and a substrate break detection method according to the present invention will be described with reference to the drawings. The embodiment described below is an example of a specific embodiment of the present invention, and the configuration of the present invention is not limited to this specific example. The present invention is applicable to substrates 1 made of various materials, such as brittle material substrates (glass, ceramics, silicon, silicon carbide, etc.), plastic plate materials, and laminated substrates made of layers of various materials. The present invention is also applicable to transparent, semi-transparent, and opaque substrates 1.

[0023] The sizes of the substrate 1 and the chip material 2 vary depending on the intended use. That is, the materials, sizes, and other configurations of the substrate 1 and the chip material 2 vary depending on the customer's request (purpose). In this embodiment, a substrate 1 having a diameter of 300 mm is used, and the chip material 2 is cut into pieces having a size of 0.2 mm. The size of the chip material 2 is often, for example, about 0.2 mm to 10 mm.

[0024] First, the scribing process and the breaking process will be briefly described. In the scribing process, substrate 1, whose backside is attached to the center portion of adhesive sheet 9 stretched across the inside of dicing ring 8 (disk-shaped ring member 8), is placed on the table of a scribing device with adhesive sheet 9 facing downward, and a scribing tool attached to the tip of a scribe head arranged above the table is used to form scribe lines (in the X-axis direction and Y-axis direction) on the surface of substrate 1. In other words, with the backside of substrate 1 attached to adhesive sheet 9, scribe lines are formed in a grid pattern on the surface.

[0025] The substrate 1, on which scribe lines are formed in a grid pattern, has its back surface (lower surface) attached to the center of an adhesive sheet 9 stretched over the inside of a dicing ring 8 (disk-shaped ring member 8), and with scribe lines formed on the front surface (upper surface), a protective film (not shown) is placed on the opposite upper surface (upper surface) as needed, and is usually broken with the top and bottom surfaces inverted. That is, the substrate 1 to be broken is set in a state where it is assembled with holding members such as the dicing ring 8, adhesive sheet 9 (holding film), and protective film. That is, the substrate 1 to be broken is set in a state where it is assembled with holding members such as the dicing ring 8, adhesive sheet 9 (holding film), and protective film.

[0026] In the breaking process, the dicing ring 8 with the substrate 1 assembled is placed on the annular table of the breaking device with the side on which the scribe lines are formed facing downwards. A blade is placed on the upper side so as to match the scribe lines formed on the substrate 1, and a pair of receiving blades are placed on both sides of the lower side of the substrate 1 in a position opposite the blade. With the receiving blades supporting both sides of the scribe lines from the front side of the substrate 1 directly or via an adhesive sheet 9, the blade presses against the scribe lines from the back side of the substrate 1 via a protective film (not shown).

[0027] That is, the blade is lowered and pressed against the top surface of the substrate 1 from directly above the scribe line, pressing against the back side of the scribe line. This causes a vertical crack to form, and the substrate 1 is separated along the scribe line to form a plurality of chip materials 2 (individual pieces). In other words, after the breaking process, the substrate 1 is held by the adhesive sheet 9 in a state where it is divided into a plurality of chip materials 2 separated in a grid pattern. It is preferable to peel off the protective film on the front side of the substrate 1 after breaking and before detecting the separation, but this does not have to be done. In other words, with this reflected light type substrate 1 separation detection device 3, it may not be necessary to peel off the protective film in some cases.

[0028] 1A and 2A are schematic diagrams illustrating an outline of a break detection device 3 for a substrate 1 according to the present invention. As shown in Figures 1A and 2A, the substrate 1 separation detection device 3 of the present invention forms a scribe line, breaks the substrate 1, and separates it into multiple chip materials 2. Then, it uses a squeegee bar 4 (extrusion member 4) to push up the line of chip materials 2 so as to lift the multiple separated chip materials 2 from the back surface (adhesive sheet 9 side) of the substrate 1. Illumination light IL is irradiated onto the surfaces of the lifted line of chip materials 2 from an illumination means 5 disposed above. The light reflected (specularly reflected light SL) from the surfaces of the chip materials 2 is captured by an imaging means 6 (camera) disposed above. While scanning the squeegee bar 4 in this manner, the specularly reflected light SL reflected from the surfaces of the multiple chip materials 2 separated in a grid pattern on the substrate 1 is captured to obtain an image. The image is processed by a separation detection means 7 to detect whether the chip materials 2 (individual pieces) have been separated or not (to determine the unseparated portions of the chip materials 2).

[0029] In other words, the substrate 1 breakage detection device 3 of the present invention is a device 3 that detects whether the substrate 1 has been successfully broken after the substrate 1, which is assembled on a holding member such as a dicing ring 8, adhesive sheet 9, or protective film, is broken along a scribe line and divided into multiple chip materials 2, and includes a squeegee bar 4 that pushes up the chip materials 2 to be irradiated from below (the adhesive sheet 9 side), an illumination means 5 that irradiates illumination light IL onto the surface of the pushed-up substrate 1, an imaging means 6 that images the reflected light (specularly reflected light SL) reflected by the substrate 1, and a breakage detection means 7 that detects whether the substrate 1 has been successfully broken based on the imaging results (image) obtained by the imaging means 6.

[0030] The dicing ring 8 (holding member) that holds the substrate 1 divided into a plurality of chip materials 2 is arranged on a table (for example, a circular table) that serves as a moving means, and the table moves back and forth in one direction. In this embodiment, the table on which the dicing ring 8 that holds the substrate 1 is arranged moves back and forth by approximately ±200 mm.

[0031] As shown in FIG. 1A, the squeegee bar 4 (extrusion member 4) is disposed below the substrate 1 (facing one main surface (for convenience, also referred to as the back surface of the substrate 1)). The squeegee bar 4 pushes up the chip material 2 to be irradiated (scanned) from among the multiple divided chip materials 2, so as to raise it up from the back surface of the substrate 1 (the adhesive sheet 9 side). In detail, the squeegee bar 4 is a long member that simultaneously pushes up from below (the adhesive sheet 9 side) multiple chip materials 2 (the chip materials 2 in the "first row" that are the subject of the determination of whether or not they will be cut) that are lined up in a row along the longitudinal direction of the squeegee bar 4.

[0032] The tip of the squeegee bar 4 is rounded to prevent damage to the tip material 2. The radius of the tip of the squeegee bar 4 depends on the material, size, and other configuration of the tip material 2, but is preferably 0.1 mm to 4 mm. However, the tip of the squeegee bar 4 may also be a small flat surface (trapezoidal in cross section). The squeegee bar 4 may also be roller-shaped. In this embodiment, the amount of lift of the squeegee bar 4 is approximately 5 mm. The opening angle α of the tip of the squeegee bar 4 is preferably 90°. The length of the squeegee bar 4, the radius of the tip, the opening angle α of the tip, the amount of lift, etc. can be changed as appropriate depending on the material, size, etc. of the tip material 2.

[0033] The squeegee bar 4 is preferably made of a material with sliding properties, as it moves smoothly on the back surface (adhesive sheet 9) of the substrate 1. Furthermore, the squeegee bar 4 is preferably made of a non-reflective material (for example, a colored, non-glossy material such as black) so as not to affect imaging. The squeegee bar 4 may be made of a material such as zirconia, plastic, metal, or rubber. Furthermore, the timing at which the squeegee bar 4 is pushed out may be at regular intervals (for each row of chip material 2) or may be constantly pushed out. In other words, the timing at which the squeegee bar 4 is pushed out while scanning may be intermittent or may be constantly pushed out.

[0034] As shown in FIG. 1A, the lighting means 5 is disposed above the substrate 1 (facing the other main surface (for convenience, also referred to as the surface of the substrate 1)). The lighting means 5 irradiates illumination light IL onto the surface of the chip material 2 pushed up by the squeegee bar 4. In detail, the lighting means 5 irradiates illumination light IL onto a plurality of chip materials 2 pushed up by the squeegee bar 4 and arranged in a row along their longitudinal direction (the chip materials 2 in the "first row" that are the subject of the division success or failure test).

[0035] The device (illumination light IL) of the illumination means 5 is not particularly limited (for example, visible light, etc.). In this embodiment, an LED bar (white) is used as the illumination means 5. However, for the illumination light IL, a light source with little brightness unevenness is preferred. Furthermore, with regard to the irradiation angle, it is preferable to irradiate from a position that is not significantly inclined relative to the surface of the chip material 2 pushed up by the squeegee bar 4. In this embodiment, the illumination light IL is irradiated from a position diagonally above 80 degrees relative to the surface (horizontal direction) of the chip material 2. It is more preferable to irradiate the illumination light IL from directly above (vertical direction) the chip material 2 in the "first row" to be irradiated.

[0036] The vertical distance between the lighting means 5 and the chip material 2 is a predetermined distance. In other words, the distance can be changed as appropriate depending on the material of the chip material 2, the size of the device 3, etc. 1A, the imaging means 6 is disposed above the substrate 1 (so as to face the other main surface). The imaging means 6 captures an image of light reflected by the chip material 2 pushed up by the squeegee bar 4. The reflected light captured by the imaging means 6 is preferably specularly reflected light SL.

[0037] Specifically, the imaging means 6 images the specularly reflected light SL, which is illumination light IL from the illumination means 5 and is reflected by the surface of the row of chip materials 2 pushed up by the squeegee bar 4. In other words, the imaging means 6 images the specularly reflected light SL, which is reflected by the surface of the "first row" of chip materials 2 that is the subject of the division success / failure determination. Preferably, the imaging means 6 is arranged coaxially with the illumination means 5 in order to image the specularly reflected light SL. However, the arrangement positions of the imaging means 6, squeegee bar 4, and illumination means 5 are not limited to those described above, as long as they are positions where the specularly reflected light SL can be accurately imaged.

[0038] Furthermore, the chip materials 2 may be imaged for each row, or the entire substrate 1 may be imaged. In this embodiment, the chip materials 2 are imaged by the imaging means 6 for each row. The device (camera) of the imaging means 6 is not particularly limited. For example, an area camera or a line sensor camera may be used as the imaging means 6. In this embodiment, a wide-angle lens camera is used as the imaging means 6. The vertical distance between the imaging means 6 and the chip material 2 (substrate 1) is set to a predetermined distance. In other words, the distance between the imaging means 6 and the chip material 2 (substrate 1) can be changed as appropriate depending on the material of the chip material 2 (substrate 1), the size of the device, etc.

[0039] In the substrate 1 breakage detection device 3 of this embodiment, with the squeegee bar 4 pushed up, the chip materials 2 arranged in the X-axis direction of the substrate 1 assembled on a holding member such as a dicing ring 8, adhesive sheet 9, or protective film are moved, and with the squeegee bar 4 pushed up, the chip materials 2 arranged in the Y-axis direction, which is perpendicular to the X-axis direction, of the substrate 1 assembled on the holding member are moved.

[0040] For example, the squeegee bar 4 may be pushed up to move the substrate 1 assembled to the holding member (such as the dicing ring 8) in the X-axis direction, and then the squeegee bar 4 may be pushed up to move the substrate 1 assembled to the holding member in the Y-axis direction, which is perpendicular to the X-axis direction. That is, the squeegee bar 4 pushes up a row of chip materials 2 from the adhesive sheet 9 side, illumination light IL is irradiated from the illumination means 5 onto the surface of the chip materials 2, and the specularly reflected light SL reflected from the surface of the chip materials 2 is imaged by the imaging means 6. The dicing ring 8 is moved in one direction (the direction in which it can be scanned) and the squeegee bar 4 scans each row of the chip materials 2 lined up in the X-axis direction of the substrate 1. In this manner, the squeegee bar 4 scans each row of all chip materials 2 in the X-axis direction. The specularly reflected light SL reflected from the surface of the chip materials 2 is imaged.

[0041] The dicing ring 8 is also moved in one direction (the scannable direction) to scan the squeegee bar 4 for each row of the chip materials 2 lined up in the Y-axis direction of the substrate 1. In this manner, the squeegee bar 4 is scanned for each row of all chip materials 2 in the Y-axis direction. The specularly reflected light SL reflected from the surfaces of the chip materials 2 is imaged. When capturing an image of the specularly reflected light SL, it is advisable to first capture an image in one direction (for example, the X-axis direction), then rotate the dicing ring 8 (substrate 1) by 90° and capture an image in the other direction (for example, the Y-axis direction). However, the scanning order may be either the X-axis direction or the Y-axis direction.

[0042] Regarding the timing of scanning the squeegee bar 4, the dicing ring 8 (substrate 1) may be moved in one direction (a scannable direction) while the squeegee bar 4 is kept pushed up, and the specularly reflected light SL reflected from the chip materials 2 may be captured. Furthermore, when the dicing ring 8 (substrate 1) is being moved in one direction, the squeegee bar 4 may be raised intermittently for each row of chip materials 2, pushing up that row of chip materials 2, and the specularly reflected light SL reflected from that chip material 2 may be captured.

[0043] In this way, the image acquired by the imaging means 6 is supplied to the division detection means 7 where image processing is performed. The separation detection means 7 detects whether the substrate 1 has been separated successfully using the image acquired by the imaging means 6. In more detail, the separation detection means 7 analyzes the line image of the specularly reflected light SL on the surface of the chip material 2 captured by the imaging means 6, i.e., determines whether the specularly reflected light SL has a predetermined width and brightness or greater, and determines whether the substrate 1 has been separated into a plurality of chip materials 2 (individual pieces).

[0044] The brightness of the specularly reflected light SL may be set in consideration of the substrate 1 (for example, material, etc.), the performance of the illumination means 5 and the imaging means 6 (for example, the intensity of the illumination light IL, the imaging range, etc.). By processing the image, the division detection means 7, for example, when it detects a line image of specularly reflected light SL that is a single continuous stripe along the squeegee bar 4 with the same width as the width of the chip material 2 in the ``first row'' that is the subject of division success or failure and that shines with a predetermined brightness or higher, determines that the substrate 1 has been reliably separated into multiple chip materials 2 in the ``first row'' that was imaged, and that the division process has been successful.

[0045] The division detection means 7 determines that there is an undivided portion on the substrate 1 when, through image processing, it detects the presence of a portion that is different from the light of the specular reflected light SL (less than a predetermined brightness) of the width of the "first column" that is the subject of the division success / failure determination (see the arrow in Figure 2A). That is, when the division detection means 7 detects, through image processing, for example, a line image of specular reflected light SL that is discontinuous along the squeegee bar 4 (for example, there are areas where the specular reflected light SL is darker than the irradiated light IL), or a line image of specular reflected light SL that has a wider portion (for example, two or more widely shining portions) than the width of the chip material 2 in the "first row" that is the subject of division success or failure, it determines that the portion in question is an undivided portion of the substrate 1.

[0046] 3 and 4 show line images (experimental results) of the surface of a row of chip materials 2 obtained by capturing the specularly reflected light SL, and show an example of whether the substrate 1 was successfully divided. As shown in Figure 3, if the chip material 2 (individual pieces) of the "first row" that is the subject of the division success / failure test is divided reliably, for example, the specular reflected light SL will appear as a line image that shines in a single stripe (a horizontal stripe in Figure 3) with a width equal to the width of the chip material 2. In other words, as shown in Figure 3, if a line image is obtained in which only the "first row" is lit, image analysis will detect that the division process of the substrate 1 was successful.

[0047] 4, when there is an undivided portion on the substrate 1, for example, in addition to the specular reflected light SL indicating the chip material 2 in the "first row" that is the subject of the division success or failure, a line image is formed in which the portion indicating the chip material 2 in the "second row" adjacent to the "first row" is also illuminated (two or more rows are illuminated). In other words, the specular reflected light SL is illuminated in a line image that is wider than the width of the "first row."

[0048] Furthermore, if there are dark areas in the line image (discontinuous lines, less than a predetermined brightness), this indicates that there are undivided areas in the substrate 1. In other words, as shown in Figures 4 and 2A, if an image of a line indicating the "first column" and other lines (wide lines or lines with light and dark areas) is obtained, the image analysis will detect that there are undivided areas in the substrate 1. 5, the result of determining whether the substrate 1 has been successfully divided by image processing may be output to, for example, an XY map or the like and saved as a past record. As a specific example, for example, a portion of the substrate 1 that is difficult to divide may be identified.

[0049] That is, when detecting a division along the X-axis direction of a substrate 1 held by a holding film (adhesive sheet 9, protective film, etc.) and divided along division lines in the X-axis direction and the Y-axis direction, which is perpendicular to the X-axis direction, the squeegee bar 4 is pushed out and positioned along the X-axis direction to push out chip materials 2 lined up in the X-axis direction, and division along the division lines on both sides or one side of the chip materials 2 is detected. Then, the substrate 1 and the squeegee bar 4 are moved relative to each other in the Y-axis direction, and the squeegee bar 4 is pushed out to push out adjacent chip materials 2 lined up in the Y-axis direction, and division along the division lines on both sides or one side of the chip materials 2 is detected. Similarly, when detecting a division along the Y-axis direction of a substrate 1 held by a holding film (adhesive sheet 9, protective film, etc.), the squeegee bar 4 is positioned along the Y-axis direction to push out chip materials 2 lined up in the Y-axis direction, and division along the lines on both sides or one side of the chip materials 2 is detected. Thereafter, the substrate 1 and the squeegee bar 4 are moved relative to each other in the X-axis direction to detect breakage of the dividing lines on both sides or one side of adjacent chip materials 2 lined up in a row. When detecting breakage of the dividing lines on both sides of the chip materials 4, the substrate 1 and the squeegee bar 4 are moved relative to each other in the X-axis and Y-axis directions by a distance equivalent to two rows of chip materials 2 lined up in a row, and when detecting breakage of the dividing line on one side, the substrate 1 and the squeegee bar 4 are moved relative to each other with the squeegee bar 4 pushed out (in contact with the substrate 1 or a holding film (adhesive sheet 9, protective film, etc.)).

[0050] As described above, the substrate 1 separation detection device 3 of the present invention breaks the substrate 1, which is assembled on a holding member such as a dicing ring 8, adhesive sheet 9, or protective film, along the scribe line to separate it into multiple chip materials 2, then pushes up a row of chip materials 2 (substrate 1) with a squeegee bar 4, irradiates illumination light IL from illumination means 5 toward the chip materials 2, captures specular reflection light SL reflected by the chip materials 2 with imaging means 6, and analyzes the captured line image with separation detection means 7, thereby detecting and determining for each separation line whether the substrate 1 has been reliably separated along the scribe line (whether it has been reliably separated into chip materials 2) while held on a holding film (adhesive sheet 9, protective film, etc.). According to the present invention, separation can be detected for each pair of adjacent separation lines.

[0051] In summary, the present invention is a technology for detecting whether a substrate 1 assembled with a holding member such as a dicing ring 8, an adhesive sheet 9, or a protective film is broken along a scribe line and separated into multiple chip materials 2, and then the separation of the substrate 1 is successful. A long squeegee bar 4 arranged below the substrate 1 pushes up the chip materials 2, which have been divided into multiple pieces and lined up in a row, from below (the adhesive sheet 9 side). Illumination light IL is irradiated onto the surfaces of the row of chip materials 2 that have been pushed up from lighting means 5 arranged above the substrate 1. Regularly reflected light SL reflected from the surfaces of the pushed-up chip materials 2 is imaged by imaging means 6 arranged above the substrate 1.

[0052] That is, a squeegee bar 4 is used to push up one row (the "first row" that is the target for determining whether or not the cutting is successful) of chip material 2 from the adhesive sheet 9 side, illumination light IL is irradiated from the lighting means 5 onto the surface of the chip material 2 in the "first row," and the specularly reflected light SL reflected by the surface of the chip material 2 in the "first row" is imaged by the imaging means 6. To carry out the above, the dicing ring 8 is moved in one direction, and the chip materials 2 lined up in the X-axis direction of the substrate 1 are scanned row by row with the squeegee bar 4. In this manner, the squeegee bar 4 is scanned row by row for all of the chip materials 2 in the X-axis direction. The specularly reflected light SL reflected from the surfaces of the chip materials 2 is imaged.

[0053] Furthermore, the dicing ring 8 is moved in one direction, and the squeegee bar 4 scans each row of the chip materials 2 lined up in the Y-axis direction of the substrate 1. In this manner, the squeegee bar 4 scans each row of all the chip materials 2 in the Y-axis direction. The specularly reflected light SL reflected from the surface of the chip materials 2 is imaged. When imaging the specularly reflected light SL, it is advisable to rotate the dicing ring 8 (substrate 1) by 90° using, for example, a moving means, and image the X-axis and Y-axis directions.

[0054] That is, in the method for detecting breakage of a substrate 1 of the present invention, when chip material 2 is pushed out from the substrate 1 with a squeegee bar 4 and a break is detected on both sides or one side of the lines of chip material 2 arranged in a row in the X-axis direction on the substrate 1 held by a holding film (adhesive sheet 9, protective film, etc.), the squeegee bar 4 is pushed out while moving the substrate 1 and the squeegee bar 4 relative to each other in the Y-axis direction to detect the breakage of each line, and when chip material 2 is pushed out from the substrate 1 and the holding film (adhesive sheet 9, protective film, etc.) and a break is detected on both sides or one side of the lines of chip material 2 arranged in a row in the Y-axis direction perpendicular to the X-axis direction on the substrate 1 held by a holding film (adhesive sheet 9, protective film, etc.), the squeegee bar 4 is pushed out while moving the substrate 1 and the squeegee bar 4 relative to each other in the X-axis direction to detect the breakage of each line.

[0055] The separation detection means 7 processes the line image acquired by the imaging means 6 to detect whether the substrate 1 has been successfully separated. That is, by processing the image, the division detection means 7, for example, when it detects a line image of specularly reflected light SL that shines in a continuous stripe (of a predetermined brightness or greater) along the longitudinal direction of the squeegee bar 4 with the same width as the width of the chip material 2 of the "first row" that is the subject of division success or failure, determines that the substrate 1 has been reliably separated into multiple chip materials 2 (individual pieces) for that "first row" and that the division process has been successful (see Figure 3).

[0056] On the other hand, if the division detection means 7 detects, through image processing, for example, a line image of specularly reflected light SL that is discontinuous along the squeegee bar 4 (for example, a dark area or other area with a brightness less than a predetermined value), or a line image of specularly reflected light SL that has a portion wider than the width of the chip material 2 in the "first row" (for example, two or more sheets (second row), a wide, shining portion, etc.), it determines that an undivided portion exists on the substrate 1 (see Figures 2A, 4, etc.).

[0057] The results of the determination of whether the substrate 1 has been successfully divided by these image processing operations are output to, for example, an XY map, and are saved as past records in order to grasp, for example, the locations on the substrate 1 that are difficult to divide (see FIG. 5). As described above, the substrate 1 breakage detection device 3 of the present invention is a device that detects whether the substrate 1 has been successfully broken after the substrate 1 held by a holding film 9 has been broken into a plurality of chip materials 2, and is characterized by having an extrusion member 4 (squeegee bar 4) that is arranged opposite the main surface of the substrate 1 and pushes the substrate 1 from the main surface, an illumination means 5 that is arranged opposite the main surface of the substrate 1 and irradiates the extruded portion of the substrate 1 with illumination light IL, an imaging means 6 that images reflected light (e.g., specular reflection light SL) reflected by the extruded portion of the substrate 1 or transmitted light TL that has passed through the gap G formed in the extruded portion of the substrate 1, and a breakage detection means 7 that uses the image captured by the imaging means 6 to detect whether the substrate 1 has been successfully broken.

[0058] In detail, the substrate 1 breakage detection device 3 of the present invention is an apparatus that detects whether the substrate 1 has been successfully broken after the substrate 1 held by a holding film 9 has been broken into a plurality of chip materials 2, and is characterized by having an extrusion member 4 (squeegee bar 4) that is arranged opposite one main surface of the substrate 1 and extrudes the plurality of broken chip materials 2 or the break line portion between adjacent chip materials 2 from one main surface, an illumination means 5 that is arranged opposite the other main surface of the substrate 1 and irradiates illumination light IL onto the extruded chip materials 2 or the break line portion, or an illumination means 5 that is arranged opposite one main surface of the substrate 1 and irradiates illumination light IL onto the extruded break line portion, an imaging means 6 that is arranged on the other main surface of the substrate 1 and images reflected light (e.g., specular reflection light SL) reflected by the extruded chip materials 2 or the break line portion or transmitted light TL that has passed through the gap G formed in the extruded break line portion, and a breakage detection means 7 that uses the image taken by the imaging means 6 to detect whether the substrate 1 has been successfully broken.

[0059] For example, when capturing an image of transmitted light TL, an extrusion member 4 is arranged to face the back surface (one of the main surfaces) of the substrate 1, an illumination means 5 is arranged below the substrate 1 and almost directly below the extrusion member 4, and an imaging means 6 (camera) is arranged above the substrate 1 in a position facing the illumination means 5 (see Figure 1C, etc.). Preferably, the following should be done:

[0060] The extrusion member 4 is a long member that extrudes from the substrate 1 a plurality of chip materials 2 arranged in a row along the extrusion member 4 or a dividing line portion between a plurality of chip materials 2 arranged in two adjacent rows. 1B, 1C, etc., by pushing up the cutting line portion of the substrate 1 with the extrusion member 4, the chip materials 2 are separated to form a gap G with a certain width. Specifically, the squeegee bar 4 pushes up from below between the chip materials 2 in a "first row" lined up in a row and the chip materials 2 in a "second row" adjacent to the "first row" in the longitudinal direction, separating the "first row" and "second row" to form a linear gap G (slit).

[0061] The illumination means 5 irradiates the extruded chip materials 2 arranged in a line or the dividing line portions between the chip materials 2 with illumination light IL. For example, as shown in FIG. 1B, illumination light IL is emitted from an illumination means 5 disposed above the gap G. Alternatively, as shown in FIG. 1C, illumination light IL is emitted from an illumination means 5 disposed below the gap G. The light emitted by the illumination light IL into the gap G is linear and has a length approximately equal to the length of the squeegee bar 4. Preferably, the illumination means 5 is disposed so as to be aligned with the gap G on a vertical axis, and the vertical distance from the chip material 2 (substrate 1) is a predetermined distance. Preferably, the illumination means 5 is an LED bar (white), and a light source with little brightness unevenness is used for the illumination light IL.

[0062] The imaging means 6 captures an image of light reflected from the chip material 2 or the dividing line portion, or light TL transmitted through the gap G formed in the dividing line portion. For example, as shown in FIG. 1B, the reflected light from the dividing line is imaged by the imaging means 6 arranged above. Alternatively, as shown in FIG. 1C, the transmitted light TL passing through the gap G is imaged by the imaging means 6 arranged above. The imaging means 6 preferably images the transmitted light TL passing through the linear gap G from directly above. The imaging means 6 is preferably an area camera or a line sensor camera. The imaging means 6, the squeegee bar 4, and the illumination means 5 are preferably arranged coaxially in the vertical (perpendicular) direction, and the vertical distance between the imaging means 6 and the chip material 2 (substrate 1) is preferably a predetermined distance. Furthermore, the locations of the imaging means 6, the squeegee bar 4, and the illumination means 5 are not limited to those described above, as long as they are positioned so that the transmitted light TL can be accurately captured. That is, the illumination means 5 and the imaging means 6 may be arranged in reverse (the imaging means 6 is arranged on the extrusion means 4 side, and the illumination means 5 is arranged on the opposite side).

[0063] The separation detection means 7 is configured to make the determinations shown in (d-1) to (d-3) below. (d-1): When the imaging means 6 captures the "light reflected from the chip material 2", the breakage detection means 7 makes a determination as follows. As shown in Figures 1A, 3, etc., when the division detection means 7 detects a line image of reflected light that shines in the form of a single continuous stripe along the extrusion member 4 with the same width as the chip material 2, it determines that the division process along the line on both sides or one side of the aligned chip material 2 has been successful; and when the division detection means 7 detects a line image of reflected light that is discontinuous along the extrusion member 4, or a line image of reflected light that has a wider portion than the width of the chip material 2, as shown in Figure 2A, it is configured to determine that an undivided portion exists in the portion of the line on both sides or one side of the aligned chip material 2 that intersects with the wider portion. (d-2): When the imaging means 6 captures the "light reflected from the dividing line portion," the division detection means 7 makes a determination as follows.

[0064] As shown in Figures 1B, 6, etc., the separation detection means 7 is configured to determine that the separation process along the separation line portion is successful if it does not detect reflected light from the chip material 2 along the extrusion member 4 at the separation line portion, and to determine that an unseparated portion exists at the separation line portion if it detects reflected light from the chip material 2 along the extrusion member 4 as shown in Figure 2B. For example, as shown in Figure 6, when detecting separation into chip material 2 using surface reflection (analyzing specularly reflected light), if the chip material 2 appears dark on the image, the chip material 2 pushed out by the squeegee bar 4 is tilted, forming gaps G between the chip materials 2, and the specularly reflected light reflected by the chip material 2 does not reach the camera 6, so it is determined that the separation process into chip material 2 was successful.

[0065] On the other hand, as shown in Figure 2B, if the chip materials 2 above and below the squeegee bar 4 appear bright in the image, it is determined that there is no gap G between the chip materials 2, and therefore an undivided portion exists on the substrate 1. In this way, the chip materials 2 are observed row by row, and scanned with the squeegee bar 4 twice in total, at 0° and 90°. (d-3): When the imaging means 6 captures the "transmitted light TL that has passed through the gap G" formed in the separation line portion, the separation detection means 7 makes a determination as follows.

[0066] As shown in Figures 1C, 7, etc., the division detection means 7 is configured to determine that the division process has been successful if it detects a line image of transmitted light TL in which the gap G is in the form of a single line and shines at a predetermined brightness or above, and to determine that an undivided portion exists in the substrate 1 if it detects a line image of transmitted light TL in which the gap G shines discontinuously or has a brightness below the predetermined brightness, as shown in Figure 2C.

[0067] For example, when analyzing the transmitted light TL that has passed through the gap G, the division detection means 7 analyzes the line image of the transmitted light TL captured by the imaging means 6, i.e., determines whether the transmitted light TL is a continuous line (not intermittent) and has a predetermined brightness or higher, and thereby determines whether the substrate 1 has been divided into multiple chip materials 2 (individual pieces). As shown in Figure 7, the division detection means 7 performs image processing to determine that the division process into the chip material 2 has been successful if it detects a line image of transmitted light TL that is a single continuous line and shines at a predetermined brightness or above, and determines that there is an undivided portion in the substrate 1 if it detects a line image of transmitted light TL that shines discontinuously, or a line image of transmitted light TL in which the entire line or part of the line is less than the predetermined brightness, as shown in Figure 2C.

[0068] Preferably, in the above-mentioned substrate 1 breakage detection device 3, when the extrusion member 4 is extruded to detect breakage of the substrate 1 along the X-axis direction breakage line in the X-axis direction and the Y-axis direction orthogonal to the X-axis direction, the extrusion member 4 is arranged along the X-axis direction and extruded to extrude the chip materials 2 lined up in a row in the X-axis direction or the breakage line portion between two adjacent rows of chip materials 2, and detects breakage of the breakage line on both or one side of the extruded chip materials 2 or the extruded breakage line portion, and then the substrate 1 and the extrusion member 4 are moved relatively in the Y-axis direction, and the extrusion member 4 is extruded to extrude the adjacent chip materials 2 lined up in a row or the adjacent breakage line portion, and When detecting the breakage of the dividing line on both or one side of the extruded chip material 2 or the dividing line of the extruded dividing line portion, and similarly when detecting the breakage of the dividing line in the Y-axis direction, the extrusion member 4 is arranged along the Y-axis direction and extruded to extrude the chip material 2 lined up in a row in the Y-axis direction or the dividing line portion between two adjacent chip materials lined up in two rows, and detects the breakage of the dividing line on both or one side of the extruded chip material 2 or the dividing line of the extruded dividing line portion, and then the substrate 1 and the extrusion member 4 are moved relative to each other in the X-axis direction to detect the breakage of the dividing line on both or one side of the chip material 2 lined up in an adjacent row or the dividing line of the adjacent dividing line portion.

[0069] Preferably, the extrusion member 4 is translucent (transparent), the illumination means 5 irradiates the extrusion member 4 with illumination light IL from one main surface side or the other main surface side of the substrate 1, and the imaging means 6 images the transmitted light TL that has passed through the gap G via the extrusion member 4 from the side opposite the illumination means 5 of the substrate 1. Preferably, the pushing member 4 is provided with an illumination means 5, and the imaging means 6 is adapted to capture an image of transmitted light TL that has passed through the gap G from the pushing member 4, from the opposite side of the substrate 1 to the pushing member 4.

[0070] In addition, the method for detecting the division of a substrate 1 according to the present invention is a method for detecting whether the substrate 1 has been successfully divided after dividing the substrate 1 held by a holding film 9 into a plurality of chip materials 2, and is characterized by being carried out in order according to the steps (a) to (d) shown below. (a): The substrate 1 is pushed out by a push-out member 4 disposed so as to face the main surface of the substrate 1 . (b): Illumination light IL is irradiated from illumination means 5 onto the extruded portion of substrate 1 . (c): The imaging means 6 captures an image of the reflected light (for example, specularly reflected light SL) reflected by the extruded portion or the transmitted light TL transmitted through the gap G formed in the extruded portion. (d): The separation detection means 7 uses the image acquired by the imaging means 6 to detect whether the substrate 1 has been successfully separated.

[0071] In detail, the method for detecting the division of a substrate 1 according to the present invention is a method for detecting whether the substrate 1 has been successfully divided after dividing the substrate 1 held by a holding film 9 into a plurality of chip materials 2, and is characterized by being carried out in order according to the steps (a) to (d) shown below. (a): A push-out member 4 disposed so as to face one main surface of the substrate 1 pushes out the chip material 2 divided into a plurality of pieces or the division line portion between adjacent chip materials 2 from the substrate 1. (b): Illumination light IL is irradiated from the illumination means 5 onto the extruded chip material 2 or the parting line portion. (c): The imaging means 6 captures the reflected light (e.g., specularly reflected light SL) reflected by the extruded chip material 2 or the dividing line portion, or the transmitted light TL that passes through the gap G formed in the dividing line portion. (d): The separation detection means 7 uses the image acquired by the imaging means 6 to detect whether the substrate 1 has been successfully separated.

[0072] For example, when capturing an image of transmitted light TL, an extrusion member 4 is arranged to face the back surface (one of the main surfaces) of the substrate 1, an illumination means 5 is arranged below the substrate 1 and almost directly below the extrusion member 4, and an imaging means 6 (camera) is arranged above the substrate 1 in a position facing the illumination means 5 (see Figure 1C, etc.). Preferably, the following should be done:

[0073] The extrusion member 4 is a long member, and the extrusion member 4 presses a plurality of chip materials 2 arranged in a row along the extrusion member 4 or a dividing line portion between a plurality of chip materials 2 arranged in two adjacent rows, and extrudes them from the substrate 1. 1B, 1C, etc., by pushing up the cutting line portion of the substrate 1 with the extrusion member 4, the chip materials 2 are separated to form a gap G with a certain width. Specifically, the squeegee bar 4 pushes up from below between the chip materials 2 in a "first row" lined up in a row and the chip materials 2 in a "second row" adjacent to the "first row" in the longitudinal direction, separating the "first row" and "second row" to form a linear gap G (slit).

[0074] The lighting means 5 irradiates the extruded chip material 2 or the cutting line portion with illumination light IL. For example, as shown in FIG. 1B, illumination light IL is emitted from an illumination means 5 disposed above the gap G. Alternatively, as shown in FIG. 1C, illumination light IL is emitted from an illumination means 5 disposed below the gap G. The light emitted by the illumination light IL into the gap G is linear and has a length approximately equal to the length of the squeegee bar 4. Preferably, the illumination means 5 is disposed so as to be aligned with the gap G on a vertical axis, and the vertical distance from the chip material 2 (substrate 1) is a predetermined distance. Preferably, the illumination means 5 is an LED bar (white), and a light source with little brightness unevenness is used for the illumination light IL.

[0075] The imaging means 6 captures an image of the light reflected from the extruded chip material 2 or the dividing line portion, or the light TL transmitted through the gap G formed in the extruded dividing line portion. For example, as shown in FIG. 1B, the reflected light from the dividing line is imaged by the imaging means 6 arranged above. Alternatively, as shown in FIG. 1C, the transmitted light TL passing through the gap G is imaged by the imaging means 6 arranged above. The imaging means 6 preferably images the transmitted light TL passing through the linear gap G from directly above. The imaging means 6 is preferably an area camera or a line sensor camera. The imaging means 6, the squeegee bar 4, and the illumination means 5 are preferably arranged coaxially in the vertical (perpendicular) direction, and the vertical distance between the imaging means 6 and the chip material 2 (substrate 1) is preferably a predetermined distance. Furthermore, the locations of the imaging means 6, the squeegee bar 4, and the illumination means 5 are not limited to those described above, as long as they are positioned so that the transmitted light TL can be accurately captured. That is, the illumination means 5 and the imaging means 6 may be arranged in reverse (the imaging means 6 is arranged on the extrusion means 4 side, and the illumination means 5 is arranged on the opposite side). (d): The division detection means 7 makes the determination as in steps (d-1) to (d-3) shown below. (d-1): When the imaging means 6 captures the "light reflected from the chip material 2", the breakage detection means 7 makes a determination as follows.

[0076] As shown in Figures 1A, 3, etc., when the division detection means 7 detects a line image of reflected light that shines in a continuous stripe along the extrusion member 4 with a width the same as the width of the chip material 2, it determines that the division process has been successful.When the division detection means 7 detects a line image of reflected light that is discontinuous along the extrusion member 4, or a line image that has a wider portion than the width of the chip material 2, as shown in Figure 2A, it determines that an undivided portion exists in the substrate 1. (d-2): When the imaging means 6 captures the "light reflected from the dividing line portion," the division detection means 7 makes a determination as follows.

[0077] As shown in Figures 1B, 6, etc., if the division detection means 7 does not detect reflected light from the chip material 2 along the extrusion member 4 at the division line portion, it determines that the division process along the division line portion is successful, and if it detects reflected light from the chip material 2 along the extrusion member 4 as shown in Figure 2B, it determines that an undivided portion exists at the division line portion. For example, when detecting division into chip material 2 using surface reflection, if the chip material 2 appears dark on the image as shown in Figure 6, the chip material 2 pushed out by the squeegee bar 4 is tilted, forming gaps G between the chip materials 2, and the specularly reflected light reflected by the chip material 2 does not reach the camera 6, so it is determined that the division process into chip material 2 was successful.

[0078] On the other hand, as shown in Figure 2B, if the chip materials 2 above and below the squeegee bar 4 appear bright in the image, it is determined that there is no gap G between the chip materials 2, and therefore an undivided portion exists on the substrate 1. In this way, the chip materials 2 are observed row by row, and scanned with the squeegee bar 4 twice in total, at 0° and 90°. (d-3): When the imaging means 6 captures the "transmitted light TL that has passed through the gap G" formed in the separation line portion, the separation detection means 7 makes a determination as follows.

[0079] As shown in Figures 1C, 7, etc., if the division detection means 7 detects a line image of transmitted light TL in which the gap G is in the form of a single line and shines at a predetermined brightness or above, it determines that the division process has been successful.If the division detection means 7 detects a line image of transmitted light TL in which the gap G shines discontinuously or has a brightness below the predetermined brightness, as shown in Figure 2C, it determines that an undivided portion exists in the substrate 1. For example, when analyzing the transmitted light TL that has passed through the gap G, the division detection means 7 analyzes the line image of the transmitted light TL captured by the imaging means 6, i.e., determines whether the transmitted light TL is a continuous line (not intermittent) and has a predetermined brightness or higher, and thereby determines whether the substrate 1 has been divided into multiple chip materials 2 (individual pieces).

[0080] As shown in Figure 7, the division detection means 7 performs image processing to determine that the division process into the chip material 2 has been successful if it detects a line image of transmitted light TL that is a single continuous line and shines at a predetermined brightness or above, and determines that there is an undivided portion in the substrate 1 if it detects a line image of transmitted light TL that shines discontinuously, or a line image of transmitted light TL in which the entire line or part of the line is less than the predetermined brightness, as shown in Figure 2C.

[0081] Preferably, in the above-mentioned method for detecting breakage of a substrate 1, when detecting breakage of the chip material 2 or the breakage line portion from the substrate 1 using the extrusion member 4, the extrusion member 4 is pushed out while moving the substrate 1 and the extrusion member 4 relative to each other in the Y-axis direction, and when detecting breakage of the breakage line on both or one side of the chip material 2 arranged in a row in the X-axis direction of the substrate 1, or the breakage line between two adjacent rows of chip material 2, the extrusion member 4 is pushed out while moving the substrate 1 and the extrusion member 4 relative to each other in the X-axis direction, and the breakage of each breakage line is detected.

[0082] It should be noted that the embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. In particular, in the embodiments disclosed herein, matters not explicitly stated, such as operating conditions, control conditions, dimensions and weights of components, etc., do not deviate from the scope of what a person skilled in the art would normally do, and are matters that a person skilled in the art would easily be able to imagine.

[0083] The technology (device 3 and method) for detecting breakage of substrate 1 according to the present invention is preferably installed in an inspection line that inspects substrate 1 after it has been broken and divided into a plurality of chip materials 2. Also, for example, it may be housed in a breaking device that divides substrate 1, or it may be housed in a device that integrates the scribing process and breaking process. [Explanation of symbols]

[0084] 1 board 2 Chip material 3. Breakage detection device 4 Squeegee bar (extrusion member) 5 Lighting means 6. Imaging Method 7. Disconnection detection method 8 Dicing Ring 9 Adhesive sheet (holding film) IL illumination light SL Specular reflection light G Gap TL transmitted light

Claims

1. An apparatus for detecting whether a substrate held by a holding film has been successfully cut into a plurality of chips, the apparatus comprising: a push-out member disposed opposite to the main surface of the substrate and pushing out the substrate from the main surface; an illumination means disposed opposite to the main surface of the substrate and configured to irradiate the extruded portion of the substrate with illumination light; an imaging means for imaging light reflected by the extruded portion of the substrate or light transmitted through a gap formed in the extruded portion of the substrate; a cutting detection means for detecting whether the substrate has been cut successfully or not by using the image captured by the imaging means, the extrusion member is disposed so as to face one main surface of the substrate and extrudes a separation line portion between adjacent chip materials; The lighting means is disposed so as to face one main surface or the other main surface of the substrate, and irradiates the dividing line portion with illumination light; and the imaging means is disposed on a main surface of the substrate opposite to the main surface facing the illumination means, and images transmitted light that has passed through a gap formed in the extruded dividing line portion; If the gap is detected as a line image of the transmitted light that shines with a predetermined brightness or more, it is determined that the segmentation process has been successful. When the gap is discontinuously illuminated or a line image of the transmitted light having a brightness less than a predetermined value is detected, it is determined that an undivided portion exists in the substrate, the extrusion member is translucent, the illumination means irradiates the extrusion member with the illumination light from one main surface side or the other main surface side of the substrate, The imaging means images the transmitted light that has passed through the push-out member and the gap from the opposite side of the substrate to the illumination means. A substrate break detection device characterized by:

2. The substrate break detection device described in claim 1, characterized in that the extrusion member is a long member that extrudes from the substrate a plurality of chip materials arranged in a row along the extrusion member or a break line portion between a plurality of chip materials arranged in two adjacent rows.

3. the extrusion member is provided with the lighting means; The imaging means images the transmitted light that has passed through the gap from the pushing member from the opposite side of the substrate to the pushing member.

3. The substrate breakage detection device according to claim 1, wherein the substrate breakage detection device is a detection device for detecting a breakage of a substrate.

4. 2. The substrate break detection device according to claim 1, When detecting a division line in the X-axis direction of the substrate that has been divided along division lines in the X-axis direction and the Y-axis direction perpendicular to the X-axis direction by pushing out the extrusion member, the extrusion member is disposed along the X-axis direction and pushed out to push out the chip materials lined up in a row in the X-axis direction or the division line portion between two adjacent rows of chip materials, and the division lines on both or one side of the extruded chip materials or the extruded division line portion are detected; Then, the substrate and the extrusion member are moved relative to each other in the Y-axis direction, the extrusion member is pushed out to extrude the adjacent chip materials lined up in a row or the adjacent dividing line portion, and dividing lines on both sides or one side of the extruded chip materials or the dividing line of the extruded dividing line portion are detected; Similarly, when detecting a break in a dividing line in the Y-axis direction, the extrusion member is arranged along the Y-axis direction and pushed out to push out the chip materials lined up in a row in the Y-axis direction or the dividing line portion between two adjacent rows of chip materials, and detects the break in the dividing line on both or one side of the extruded chip materials or the extruded dividing line portion, Thereafter, the substrate and the extrusion member are moved relative to each other in the X-axis direction, and the separation of the separation line on both sides or one side of the adjacent chip materials arranged in a row or the separation line of the adjacent separation line portion is detected. A substrate break detection device characterized by:

5. A method for detecting whether a substrate held by a holding film has been successfully divided into a plurality of chips, the method comprising: A method for detecting breakage in a substrate, comprising the steps of: (a) detecting a breakage in a substrate; (a): A translucent extrusion member is disposed opposite one main surface of the substrate and extrudes the separation line portions between adjacent chip materials that have been separated into multiple pieces from the substrate. (b) Illumination light is applied from an illumination means to the extrusion member along the extruded dividing line portion from one main surface side or the other main surface side of the substrate. (c) The transmitted light that has passed through the gap formed in the extruded dividing line portion is imaged by an imaging means from the opposite side of the substrate from the illumination means via the extrusion member. (d) A separation detection means detects whether the substrate has been successfully separated or not using the image acquired by the imaging means.

6. the extrusion member is an elongated member that presses the plurality of chip materials arranged in a line along the extrusion member or the separation line portion between the plurality of chip materials arranged in two adjacent lines along the extrusion member, thereby extruding the chip materials from the substrate; the illumination means irradiates the extruded chip material or the cutting line portion with the illumination light; the imaging means images reflected light reflected from the extruded chip material or the dividing line portion, or transmitted light passing through a gap formed in the extruded dividing line portion, 6. The method for detecting a break in a substrate according to claim 5, wherein the break detection means performs the following step (d-1): (d-1): When the imaging means captures an image of transmitted light that has passed through the gap formed in the dividing line portion, The separation detection means If the gap is detected as a line image of the transmitted light that shines with a predetermined brightness or more, it is determined that the segmentation process has been successful. If the gap is discontinuously illuminated or a line image of the transmitted light with a brightness less than a predetermined value is detected, it is determined that an undivided portion exists on the substrate.

7. 7. The method for detecting breakage in a substrate according to claim 5 or 6, When the extrusion member is used to extrude the chip material or the dividing line portion from the substrate, and to detect a division of the dividing line on both sides or one side of the chip material arranged in a row in the X-axis direction on the substrate, or a division line between the chip materials arranged in two adjacent rows, the extrusion member is extruded while moving the substrate and the extrusion member relatively in the Y-axis direction, and the division of each dividing line is detected; When detecting a break in the dividing lines on both sides or one side of the chip materials arranged in a row in the Y-axis direction orthogonal to the X-axis direction on the substrate, or a break in the dividing line between the chip materials arranged in two adjacent rows, the substrate and the extrusion member are moved relatively in the X-axis direction while the extrusion member is pushed out, and the break in each dividing line is detected. A method for detecting breakage in a substrate.

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