Conductive filler with improved microwave shielding performance

Abstract

An electrically conductive composite powder is provided for microwave shielding applications. The electrically conductive composite powder has a density of 5 g / cm 3 and an intermediate layer covering the particle core, the intermediate layer having a dielectric constant of 5.90×10 at 20° C. -8 The conductive composite powder has a high electrical conductivity exceeding ohm·m, and further includes an outer layer deposited on the intermediate layer, the outer layer comprising a material with high oxidation and corrosion resistance, exhibiting a galvanic potential in seawater of greater than -0.2 V as measured by ASTM G82. This conductive composite powder exhibits excellent microwave shielding performance and is substantially less expensive than conventional Ag / Ni shields. The conductive composite powder can be used over a wide microwave frequency range.

Description

[Technical Field]

[0001] This application claims priority to U.S. Provisional Application No. 63 / 116,434, filed November 20, 2020, the disclosure of which is incorporated herein by reference in its entirety.

[0002] Background of the Invention 1. Field of Disclosure The illustrated embodiments relate generally to conductive fillers with improved microwave shielding properties. In particular, the illustrated embodiments relate to nickel-coated graphite (Ni / C) based conductive fillers with absorption properties for improved shielding performance. [Background technology]

[0003] 2. Background information During normal operation, electronic devices generate unwanted electromagnetic energy, known as electromagnetic interference (EMI), which can disrupt the operation of nearby electronic devices. To minimize EMI-related problems, conductive materials can be used to shield the EMI. Conductive materials with improved EMI shielding performance above 50 gigahertz (GHz) would be desirable for automotive radar and future 5G and 6G devices. Conventional shields for reducing EMI can be constructed from conductive materials with silver-coated nickel (Ag / Ni) powder. While these Ag / Ni shields can be effective in reducing EMI, they are expensive and heavy materials that are difficult to synthesize into polymers.

[0004] Alternative shields constructed with conductive materials containing Ni / C would be cheaper and lighter, but their shielding performance would degrade above 50 GHz. Conductive materials containing Ni / C exhibit reduced shielding performance above 50 GHz because their shielding performance depends on permeability, which exhibits dispersion as frequency increases. More specifically, the permeability of nickel decreases from 200 to 1-10 in the GHz range. Therefore, new conductive materials are needed to improve EMI shielding performance.

[0005] overview Desirable shielding performance of conductive materials generally requires either high electrical conductivity or high magnetic permeability. Conventional shields constructed of conductive materials with silver-coated nickel powder can be used to suppress EMI in the GHz range due to the high electrical conductivity of silver. Electrically, copper and silver behave similarly. Copper, unlike silver, has poor corrosion and oxidation resistance, making it unsuitable for use as a conductive material. Summary of the Invention [Means for solving the problem]

[0006] The illustrated embodiment of the present disclosure relates to a conductive composite powder. In the illustrated embodiment, the core of the particle is coated with an intermediate layer, and an outer layer is deposited on the intermediate layer. In the embodiment, the core of the particle has a low density of more than 10 ratio In another embodiment, the intermediate layer comprises a material having a high electrical conductivity. In yet another embodiment, the outer layer comprises a material having high corrosion and oxidation resistance.

[0007] A preferred embodiment of the present disclosure relates to a nickel-coated graphite (Ni / C)-based conductive filler. In the illustrated embodiment, it is preferable to add at least one copper layer to the Ni / C-based conductive filler. The addition of the copper layer increases the shielding performance of the Ni / C-based conductive filler to an effectiveness similar to that of conventional Ag / Ni shields, while substantially reducing costs. The nickel in the Ni / C-based conductive filler acts as a corrosion- and oxidation-resistant layer that protects the copper from corrosion.

[0008] In an exemplary embodiment, the graphite core has a lower density than silver and nickel, allowing powders of the Ni / C-based conductive filler to be produced with a density 30% lower than conventional Ag / Ni conductive materials. In another exemplary embodiment, the Ni / C-based conductive filler includes a particulate graphite core, a copper layer coating the particulate graphite core, and a nickel layer deposited on the copper layer. In the exemplary embodiment, the copper coating layer disposed under the nickel layer in the Ni / C-based conductive filler improves shielding performance above 40 GHz.

[0009] The Ni / C-based conductive filler of the present disclosure addresses issues with conventional Ag / Ni shields, including their high cost and high density. Additionally, copper offers similar shielding performance to silver with the same coating thickness because its electrical conductivity is only 4% lower than that of silver. However, nickel exhibits higher corrosion and oxidation resistance than copper, so the nickel coating protects the copper from corrosion and produces particles with higher corrosion and oxidation resistance. Therefore, the Ni / C-based conductive filler of the present disclosure improves microwave shielding performance in the 40 to 300 GHz range. Preferably, the Ni / C-based conductive filler of the present disclosure improves microwave shielding performance in the 40 to 100 GHz range. More preferably, the Ni / C-based conductive filler of the present disclosure improves microwave shielding performance in the 40 to 100 GHz range.

[0010] The application file contains at least one drawing executed in color. Copies of this patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

[0011] The present disclosure will be further described in the following detailed description, by way of non-limiting examples of preferred embodiments thereof, with reference to the several drawings in which: [Brief explanation of the drawings]

[0012] [Figure 1] 1A and 1B are diagrams illustrating cross sections of conductive fillers according to various embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0013] Detailed Description 1 shows a cross section of a conductive filler 100 according to various embodiments. In FIG. 1, the conductive filler 100 includes a core particle 110, an intermediate layer 120 coated on the core particle 110, and an outer layer 130 deposited on the intermediate layer 120.

[0014] The conductive filler 100 can be produced by coating a core particle 110 having an average particle size (D50) of 0.01 to 100 μm with an intermediate layer 120, for example, by plating, autoclaving, or a gas phase technique (e.g., CVD). Preferably, the average particle size (D50) of the core particle 110 is 5 to 20 μm.

[0015] In embodiments, the core particle 110 has a low density and ratio It is formed using a material with a high dielectric constant and low electrical resistance. In an embodiment, the conductive filler 100 is embedded in a resin. In an embodiment, Ni / Cu / C is mixed with silicone rubber in a weight ratio of 60 / 30 to produce a conductive adhesive or extrusion gasket, which will provide shielding performance of over 100 dB in the range of 40 to 100 GHz.

[0016] Preferably, the core particle 110 is formed using a low density material to match the density of the resin in the final composite particle. In one embodiment, the density of the material used for the core is 5 g / cm 3 In a preferred embodiment, the density of the material used for the core is 3 g / cm 3 In a more preferred embodiment, the density of the material used for the core is less than 2.5 g / cm 3 Some specific examples of materials suitable for the core in this disclosure have a density of less than 2.266 g / cm 3 Graphite, which has a density of 3.21 g / cm 3 Silicon carbide (SiC) has a density of 4.23 g / cm 3Examples of suitable crystalline silicon include, but are not limited to, titania (TiO2) having a density of 1000 .mu.m.sup.

[0017] In embodiments, the core particles 110 are greater than 10 ratio It has a dielectric constant that increases the shielding effectiveness of the core through absorption of incident electromagnetic waves. ratio The dielectric constant is a dimensionless property and is defined as the ratio of the magnetic permeability of a material to the magnetic permeability in a vacuum. ratio The dielectric constant is equal to or greater than 2. In a preferred embodiment, the core particle 110 ratio The dielectric constant is 10 or more. ratio The dielectric constant is 10 or more. Specific examples of the core particle 110 include: ratio graphite, with a dielectric constant of 10-15; ratio Titanium dioxide with a dielectric constant between 80 and 100, and ratio It comprises silicon carbide, which has a dielectric constant of up to 10. In a preferred embodiment, the core particle 110 is made of graphite.

[0018] In embodiments, core particle 110 has low electrical resistance due to enhanced absorption of incident electromagnetic waves by the core material. In some embodiments, core particle 110 has an electrical resistivity of 10 ohm-m or less. Graphite, titanium dioxide, and silicon carbide each have a resistivity of 5×10 -4 In a preferred embodiment, the core particle 110 has an electrical resistivity in the range of about 5×10 -4 It has a low electrical resistivity of ohm·m.

[0019] In an embodiment, the thickness of the intermediate layer 120 is 0.05 to 10 μm, for example, 1 to 2 μm. Preferably, the thickness of the intermediate layer 120 is 1 to 2 μm.

[0020] In embodiments, the intermediate layer 120 is generally described as a material having improved electrical conductivity compared to nickel. -8 ohm m The electrical resistivity ofIn a preferred embodiment, the intermediate layer 120 comprises a material having a conductivity of 3.36×10 -8 ohm m The electrical resistivity of In a more preferred embodiment, the intermediate layer 120 comprises a material having a conductivity of 1.68×10 -8 Electrical resistivity of ohm·m or less It includes materials that have electrical conductivity. Exemplary materials for intermediate layer 120 include Cu, Al, Zn, and W. In a preferred embodiment, intermediate layer 120 is copper.

[0021] The outer layer 130 is deposited on the intermediate layer 120 using, for example, plating, autoclave, or vapor phase techniques. In one embodiment, a relatively thin outer layer 130 in the range of 100 nm to 1 μm can be used to reduce the density and therefore weight of the composite particles. In another embodiment, increasing the thickness of the outer layer 130 to 100 nm to 4 μm can provide effective shielding over the low frequency and GHz ranges. Preferably, the thickness of the outer layer 130 is in the range of 100 nm to 2 μm.

[0022] In some embodiments, outer layer 130 is generally formed using a corrosion-resistant alloy material that has improved corrosion resistance compared to copper. In one embodiment, corrosion resistance is further improved by depositing a relatively thin corrosion-resistant alloy (CRA) on intermediate layer 120. In one embodiment, the CRA layer deposited as outer layer 130 has a galvanic potential in seawater that is superior to that of nickel, as measured by ASTM G82. In some embodiments, the electrochemical potential of the alloy used in outer layer 130 is −0.2 V or greater vs. Ag / AgCl. In some embodiments, the electrochemical potential of the alloy used in outer layer 130 is −0.1 V or greater vs. Ag / AgCl.

[0023] Some non-limiting alloy materials that can be used for the outer layer 130 include, but are not limited to, nickel, nickel-chromium alloys, NiMo, NiSi alloys, and tungsten. In a preferred embodiment, the outer layer 130 is nickel. In some embodiments, the outer layer 130 is formed by a pack diffusion process. In one embodiment, a nickel silicon layer is formed by pack diffusion of Si into a Ni layer. In one embodiment, a relatively thin nickel silicon (NiSi) layer in the range of 100 nm to 500 nm is formed by pack diffusion of nickel into a Si layer.

[0024] In some embodiments, the conductive filler 100 is provided with improved corrosion resistance without the use of expensive, well-known corrosion-resistant elements. In one embodiment, the use of silver is specifically avoided. In another embodiment, gold is specifically avoided. In yet another embodiment, platinum is specifically avoided.

[0025] Furthermore, because the invention is disclosed herein in at least a manner that enables the invention to be made and used through the disclosure of certain exemplary embodiments, for reasons of simplicity or efficiency, for example, the invention can be practiced in the absence of any additional elements or additional structure not specifically disclosed herein.

[0026] It should be noted that the above examples are provided for illustrative purposes only and should not be construed as limiting the invention in any way. While the invention has been described with reference to exemplary embodiments, it is understood that the words used herein are words of description and illustration, rather than words of limitation. Changes may be made within the purview of the appended claims, as herein described and amended, without departing from the scope and spirit of the invention in its aspects. While the invention has been described herein with reference to particular means, materials and embodiments, the invention is not intended to be limited to the details disclosed herein, but rather, the invention extends to all functionally equivalent structures, methods and uses within the scope of the appended claims.

Claims

1. 1. A conductive composite powder for improving EMI shielding performance, comprising: 5 g / cm ３ a particle core formed from a material having a low density of less than 10 and a high dielectric constant of 10 or greater; an intermediate layer covering the core of the particle so as to be in contact with the core of the particle, the intermediate layer having a viscosity of 5.90 x 10 at 20°C －８ The conductive composite powder further comprises: a high electrical conductivity of an electrical resistivity of ohm-m or less; the intermediate layer is a material having improved electrical conductivity compared to nickel; an outer layer deposited on the intermediate layer, the outer layer comprising a material having high corrosion and oxidation resistance comparable to one of Ni or better, with a galvanic potential in seawater of greater than −0.2 V as measured by ASTM G82; The core of the particles has an average particle size (D50) of 0.01 to 100 μm.

2. 2. The conductive composite powder according to claim 1, wherein the core of the particle is at least one selected from the group consisting of graphite, titanium dioxide, and silicon carbide.

3. The conductive composite powder according to claim 1 , wherein the intermediate layer is copper.

4. The conductive composite powder according to claim 1, wherein the intermediate layer has a thickness of 0.05 to 4 μm.

5. The conductive composite powder according to claim 4, wherein the intermediate layer has a thickness of 1 to 2 μm.

6. The conductive composite powder according to claim 1, wherein the outer layer has a thickness of 100 to 500 nm.

7. The conductive composite powder of claim 1 , wherein the intermediate layer is applied by plating, autoclave, or vapor phase techniques.

8. The conductive composite powder of claim 1 , wherein the outer layer is applied by plating, autoclaving, or vapor phase techniques.

9. The conductive composite powder of claim 1 , wherein the outer layer is provided by pack diffusion of one or more elements into the outer layer.

10. 1. A nickel-coated graphite (Ni / C) based conductive material for improving EMI shielding performance, the nickel-coated graphite (Ni / C) based conductive material comprising: a graphite core of the particle; a copper layer coated on the graphite core of the particle so as to contact the core of the particle; a nickel layer deposited on the copper layer; The graphite core of the particles has an average particle size (D50) of 0.01 to 100 μm, and the nickel-coated graphite (Ni / C) based conductive material.

11. The nickel-coated graphite-based conductive material according to claim 10, wherein the copper layer has a thickness of 0.05 to 4 μm.

12. The nickel-coated graphite-based conductive material according to claim 11, wherein the copper layer has a thickness of 1 to 2 μm.

13. 1. A method for producing a conductive composite powder, the method comprising: 5.90 x 10 at 20°C －８ An intermediate layer having a high conductivity of an electrical resistivity of ohm-m or less is formed at a concentration of 5 g / cm ３ providing an intermediate layer on and in contact with a core of a particle comprising a material having a low density of less than 10 and a dielectric constant of 10 or greater, wherein the intermediate layer is a material having improved electrical conductivity compared to nickel; depositing an outer layer on the intermediate layer, the outer layer comprising a material having high oxidation and corrosion resistance, with a galvanic potential in seawater of greater than −0.2 V as measured by ASTM G82; The core of said particles has an average particle size (D50) of 0.01 to 100 μm.

14. 14. The method of claim 13, wherein the intermediate layer is provided on the core of the particle by plating, autoclaving, or gas phase techniques.

15. The method of claim 13 , wherein the outer layer is deposited on the intermediate layer by plating, autoclave, or vapor phase techniques.

16. The method of claim 13 , wherein the outer layer is deposited over the intermediate layer by pack diffusion of one or more elements into the intermediate layer.

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