device

Abstract

To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50. The first sealing member 20 includes a first film 22 made of a film as a base, and a conductive part 266 made of a conductor. The device 10 includes a sealed space 18. The sealed space 18 is surrounded by the first sealing member 20 and the second sealing member 30, and is blocked from the outside of the device 10. The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18. A first contact 48 of the first circuit member 40 and a second contact 58 of the second circuit member 50 are in contact with each other as being pressed against each other. The second circuit member 50 includes a connection electrode 59. The conductive part 266 is in contact with the connection electrode 59 inside the sealed space 18 and is exposed to the outside of the device 10.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a device having a circuit member encapsulated by a film. [Background technology]

[0002] For example, Patent Document 1 discloses a device that can be made thinner.

[0003] Referring to Fig. 17, Patent Document 1 discloses a semiconductor chip built-in module (device) 90. The device 90 includes a thermosetting resin composition (sealing resin) 92 and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so as to embed the circuit member 94 therein. Thereafter, the surface of the sealing resin 92 is polished, thereby thinning the device 90. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-332654 Summary of the Invention [Problem to be solved by the invention]

[0005] There is a demand for devices equipped with circuit components to be even thinner.

[0006] Therefore, an object of the present invention is to provide a new device that can be made thinner. [Means for solving the problem]

[0007] The present invention provides a first device, A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base and a conductive portion made of a conductor; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed within the sealed space; the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; The conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device. Provide the device.

[0008] The present invention provides a first device as a second device, The first film has a main opening formed therein, the main opening extends through the first film; The conductive portion closes the main opening. Provide the device.

[0009] The present invention also provides a third device, the first device, comprising: the first sealing member includes a sub-member in addition to the first film, The first film has a main opening formed therein, the main opening extends through the first film; the sub-member includes a fixed portion and the conductive portion, The secondary member has a secondary opening formed therein, the secondary opening penetrates the fixed portion, the conductive portion closes the sub-opening, The fixed portion located around the sub-opening is fixed to the first film over the entire periphery. Provide the device.

[0010] The present invention provides a fourth device, the third device, comprising: the first film has an outer surface; The outer surface is located outside the sealed space, The fixed portion of the secondary member is fixed to the outer surface. Provide the device.

[0011] The present invention provides a fifth device, the third device, comprising: the first film has an inner surface; The inner surface is located inside the sealed space, The fixed portion of the secondary member is fixed to the inner surface. Provide the device.

[0012] The present invention provides a sixth device, which is any one of the third to fifth devices, The fixed portion of the sub-member is made of a film. Provide the device.

[0013] The present invention provides a seventh device, which is any one of the first to sixth devices, The second sealing member has a second film as a base. Provide the device.

[0014] The present invention provides, as an eighth device, A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base and a conductive gel; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed within the sealed space; the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; The conductive gel has a conductive portion, The conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device. Provide the device. [Effects of the Invention]

[0015] In the device of the present invention, the first sealing member and the second sealing member are stacked on top of each other with the first circuit member and the second circuit member (hereinafter simply referred to as "circuit member") sandwiched therebetween. The first sealing member is formed using a film as a base. Furthermore, each of the circuit members has no structural restrictions other than the fact that it has contacts and connection electrodes. In other words, the circuit member of the present invention has a simple structure and can be formed from a variety of materials. For example, the circuit member may be an insulating film on which a conductor pattern having contacts and connection electrodes is formed. In this case, the thickness of the entire device can be made extremely thin. In other words, the present invention can provide a new device that can be made thin. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view of a device according to an embodiment of the present invention, with dashed lines depicting the outline of a hidden main aperture in a first film and the boundary of a contact area formed between a first sealing member and a second sealing member; [Figure 2]2 is a perspective view of the device of FIG. 1 with the first sealing member removed, with the outline of the hidden main opening in the first film and the boundary of the contact area depicted by dashed lines; [Figure 3] 2 is a top view of the first sealing member of the device of FIG. 1, with the hidden main opening in the first film outlined in dashed lines. [Figure 4] 4 is a bottom view of the first sealing member of FIG. 3, with the hidden outline of the secondary member and the air valve drawn in dashed lines; [Figure 5] This is a cross-sectional view schematically showing the device of Fig. 1 taken along line VV. This drawing is intended to show the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 6] 2 is an exploded perspective view showing the device of FIG. 1, with a portion of the first film (encircled by a dashed line) and a portion of the second film (encircled by a dashed line) drawn on an enlarged scale. [Figure 7] 7 is an exploded perspective view of the air valve of the device of FIG. 6, with the valve of the air valve open. [Figure 8] 2 is a side view of the device of FIG. 1 during manufacture. [Figure 9] This is a cross-sectional view of the device in the process of being manufactured, taken along line VV in Figure 1. This figure is intended to show the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. The side of the vacuum device is also depicted. [Figure 10] This is a cross-sectional view showing a modification of the device in Fig. 5. This drawing is intended to show a schematic internal structure of the device, and the size and arrangement of each member do not match the actual size and arrangement. [Figure 11] This is a cross-sectional view showing another modified example of the device in Fig. 5. This drawing is intended to schematically show the internal structure of the device, and the size and arrangement of each member do not correspond to the actual size and arrangement. [Figure 12] 12 is a top view of the first sealing member of the device of FIG. 11, with the hidden outline of the secondary member drawn in dashed lines. [Figure 13]13 is a bottom view of the first sealing member of FIG. 12, with the outline of the hidden main opening in the first film and the hidden outline of the air valve drawn in dashed lines. [Figure 14] 2 is a perspective view showing a modification of the device of FIG. 1. The boundary of the contact area formed between the first sealing member and the second sealing member is drawn by a dashed line. [Figure 15] 15 is a cross-sectional view schematically showing the device of Fig. 14 taken along line XV-XV. This drawing is intended to show the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 16] FIG. 2 is a perspective view of another variation of the device of FIG. 1, with dashed lines depicting the outline of the hidden main opening in the first film and the boundary of the contact area formed between the first and second sealing members. [Figure 17] FIG. 1 is a cross-sectional view showing the device of Patent Document 1. DETAILED DESCRIPTION OF THE INVENTION

[0017] Referring to FIG. 1, device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, device 10 can operate independently without being physically attached to another electronic device (not shown). For example, device 10 is attached near the subject's heart to measure the subject's electrocardiogram and transmit the measurement results to another electronic device. That is, device 10 can be used as an electronic device that measures biometric information such as electrocardiogram. However, the present invention is not limited to this and can be applied to devices with various functions.

[0018] Referring to FIG. 2 together with FIG. 1, device 10 of the present embodiment includes a circuit structure 12 and a sealing member 14. Circuit structure 12 is a component that enables device 10 to function as an electronic device. For example, circuit structure 12 includes an electronic circuit (not shown) for receiving an electrical signal (hereinafter referred to as a "biological signal") resulting from the subject's electrocardiogram, an electronic circuit (not shown) for measuring the electrocardiogram based on the acquired biochemical signal, and an electronic circuit (not shown) for transmitting the measurement results to another electronic device (not shown). Sealing member 14 houses the entire circuit structure 12 inside and protects it from the external environment. That is, circuit structure 12 is sealed inside sealing member 14.

[0019] The circuit structure 12 of this embodiment includes a first circuit member 40 and a second circuit member 50. The sealing member 14 of this embodiment includes a first sealing member 20 and a second sealing member 30. That is, the device 10 includes the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50. Referring to FIG. 8 together with FIGS. 1 and 2, the four members of the device 10 (the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50) are stacked in the vertical direction (Z direction) and assembled into one device 10. The device 10 of this embodiment includes only the above-mentioned four members. However, the present invention is not limited to this, and the device 10 may further include other members in addition to the above-mentioned four members.

[0020] Each component of the device 10 of this embodiment will be described below.

[0021] 6, the first sealing member 20 of this embodiment is formed using the first film 22, which is an insulating film, as a base. In other words, the first sealing member 20 has the first film 22 made of a film as a base. The first film 22 of this embodiment is a thin rectangular sheet and is flexible. The thickness of the first film 22 is, for example, about 0.01 to 0.5 mm. The first film 22 extends parallel to a horizontal plane (sheet surface: XY plane) perpendicular to the Z direction. The first film 22 has a periphery 229 in the XY plane.

[0022] 3 and 4, the first film 22 has an outer surface 232 and an inner surface 234. The outer surface 232 is the upper surface (the surface on the +Z side) of the first film 22. The inner surface 234 is the lower surface (the surface on the -Z side) of the first film 22.

[0023] The first film 22 of this embodiment has two layers: a melting layer 146 that melts when heated, and a non-melting layer 148 that does not melt when heated. The melting layer 146 is located below the non-melting layer 148. For example, the melting layer 146 is made of polyethylene, and the non-melting layer 148 is made of nylon. This structure allows the melting layer 146 to be fused to the melting layer of another member while maintaining the non-melting layer 148. However, the present invention is not limited to this. For example, the first film 22 may have only one non-melting layer 148, or may have three or more layers.

[0024] A main opening 244 and a valve opening 248 are formed in the first film 22. In this embodiment, the main opening 244 and the valve opening 248 each have a small circular shape in the XY plane and penetrate the first film 22 in the Z direction. The diameter of the main opening 244 is, for example, 0.5 mm or less. The main opening 244 and the valve opening 248 can be formed by a method such as laser irradiation. However, the present invention is not limited to this. For example, the shape and size of the main opening 244 and the valve opening 248 in the XY plane are not particularly limited.

[0025] 1 and 6, the first sealing member 20 of this embodiment includes, in addition to the first film 22, a sub-member 26 and an air valve 28.

[0026] The sub-member 26 of this embodiment is a thin, circular, flexible sheet. The sub-member 26 includes a thin adherend portion 262 made of a resin such as polyethylene terephthalate (PET) or polyurethane (PU), and a thin conductive portion 266 made of a conductor such as metal. That is, the first sealing member 20 includes the adherend portion 262 made of a film and the thin-film conductive portion 266.

[0027] In this embodiment, the thickness of each of the fixed portion 262 and the conductive portion 266 is, for example, approximately 0.01 to 0.5 mm. A sub-opening 264 is formed in the sub-member 26. The sub-opening 264 has a small circular shape in the XY plane. The diameter of the sub-opening 264 is, for example, 0.5 mm or less. The sub-opening 264 penetrates the fixed portion 262 in the Z direction. However, the sub-opening 264 is completely filled with the conductive portion 266. In other words, the conductive portion 266 extends completely across the entire sub-opening 264 in the XY plane, blocking the sub-opening 264. The conductive portion 266 is exposed upward (in the +Z direction) and downward (in the -Z direction). That is, the sub-member 26 is formed to be conductive in the Z direction.

[0028] The sub-component 26 of this embodiment can be produced, for example, as follows. First, a film having a thickness of approximately 0.01 to 0.5 mm is produced from a resin such as PET or PU. Next, sub-openings 264 having a diameter of 0.5 mm or less are formed in the film by a method such as laser irradiation. As a result, the fixed portions 262 are formed. Next, a suitable mask and doctor blade are used to fill the sub-openings 264 with a conductive paste from one side of the film. Next, the film is heated to harden the conductive paste. Next, a suitable mask and doctor blade are used to fill the sub-openings 264 with a conductive paste from the other side of the film. Next, the film is heated to harden the conductive paste. By the above-mentioned two heating processes, the conductive portions 266 are formed from the conductive paste.

[0029] The sub-member 26 of this embodiment is fabricated as described above and has the structure described above. However, the present invention is not limited to this. For example, the conductive portion 266 may be formed by plating or inkjet printing. The conductive portion 266 may be formed by laminating a metal foil on the upper or lower surface of the fixed portion 262 so as to cover the entire sub-opening 264. The conductive portion 266 may partially protrude downward. Furthermore, the shape and size of the sub-member 26 are not particularly limited.

[0030] In this embodiment, the diameter of the main opening 244 of the first film 22 is smaller than the diameter of the fixed portion 262 of the sub-member 26 and larger than the diameter of the conductive portion 266 of the sub-member 26. The fixed portion 262 in this embodiment is fixed to the outer surface 232 so as to surround the main opening 244 in the XY plane. In other words, the fixed portion 262 located around the sub-opening 264 is fixed to the first film 22 around the entire periphery of the main opening 244. The fixed portion 262 is in close contact with the outer surface 232 and seals the edge of the main opening 244 around the entire periphery in the XY plane. In other words, the sub-member 26 completely blocks the main opening 244, blocking the flow of air through the main opening 244.

[0031] In the present embodiment, the fixed portion 262 is fixed to the outer surface 232 of the first film 22 by a fixing member such as an adhesive. However, the present invention is not limited to this. For example, with reference to FIG. 6 , the first film 22 may further include a melting layer (not shown) on the non-melting layer 148. The fixed portion 262 may include a melting layer (not shown) and a non-melting layer (not shown). The melting layer of the fixed portion 262 may be located below the fixed portion 262. According to the above-described modified example, the fixed portion 262 can be fixed to the outer surface 232 of the first film 22 by thermally welding the melting layer of the fixed portion 262 and the melting layer of the first film 22 together.

[0032] 3 and 4, the outer edge of the fixed portion 262 in the XY plane is located outside the main opening 244 in the XY plane. Meanwhile, the inner edge of the fixed portion 262 in the XY plane is located inside the main opening 244 in the XY plane. That is, the conductive portion 266 in the present embodiment is located inside the main opening 244 in the XY plane. The conductive portion 266 thus positioned can move up and down while partially elastically deforming the fixed portion 262. In particular, when the fixed portion 262 is made of PU, the fixed portion 262 is easily elastically deformed. However, the present invention is not limited to this. For example, the size relationship in the XY plane between the fixed portion 262, the main opening 244, and the conductive portion 266 can be variously modified as needed.

[0033] 6 and 7, the air valve 28 of this embodiment includes a shielding portion 282 made of a thin insulating film and a base portion 286 made of an insulator. As shown in FIG. 7, a through hole 288 is formed in the base portion 286. The through hole 288 penetrates the base portion 286 in the Z direction. The shielding portion 282 is formed with five valves 284 and five notches 285 corresponding to the valves 284, respectively. Each of the notches 285 penetrates the shielding portion 282 in the Z direction. The valves 284 and the notches 285 are located inside the outer periphery of the shielding portion 282 in the XY plane.

[0034] 7 together with FIG. 6, the shielding portion 282 is adhered and fixed to the upper surface of the base 286. In particular, the outer periphery of the shielding portion 282 in the XY plane is firmly attached to the upper surface of the base 286 over the entire periphery. On the other hand, the inside of the outer periphery of the shielding portion 282 in the XY plane can be separated from the upper surface of the base 286. In other words, a passage through which air can pass can be formed between each of the cutouts 285 and the passage holes 288. The lower surface of the base 286 is adhered and fixed to the first film 22 such that the passage holes 288 are connected to the valve openings 248 of the first film 22.

[0035] 1 together with FIG. 7, air valve 28 can transition between an open state (the state shown in FIG. 7) in which each valve 284 is spaced apart from its corresponding notch 285, and a closed state (the state shown in FIG. 1) in which each valve 284 completely covers its corresponding notch 285. When air valve 28 is in the open state, an air passage is formed between the inside and outside of device 10 via air valve 28. On the other hand, when air valve 28 is in the closed state, the inside of device 10 is completely isolated from the outside of device 10.

[0036] As will be described later, air valve 28 is used to evacuate the inside of device 10 when fabricating device 10. Air valve 28 in this embodiment has a structure suitable for this application. However, the present invention is not limited to this. For example, the structure of air valve 28 is not particularly limited as long as air can be removed from the inside of device 10 using air valve 28. Furthermore, the inside of device 10 may be evacuated without providing air valve 28. In other words, air valve 28 may be provided as needed.

[0037] Referring to FIG. 6, the second sealing member 30 of this embodiment is formed using a second film 32, which is an insulating film, as a base. In other words, the second sealing member 30 includes the second film 32, which is made of a film, as a base. The second film 32 of this embodiment is made of the same material as the first film 22 and has the same structure as the first film 22. For example, the second film 32 is a thin, rectangular sheet that is flexible. The second film 32 extends parallel to the XY plane. The second film 32 has a periphery 329 in the XY plane. However, the present invention is not limited to this. For example, the second sealing member 30 may include a rigid (i.e., rigid and less flexible) circuit board as a base, instead of the second film 32.

[0038] The second film 32 (or rigid circuit board) of the present embodiment, like the first film 22, has two layers: a melting layer 146 that melts when heated and a non-melting layer 148 that does not melt when heated. The melting layer 146 is located on the non-melting layer 148. This structure allows the two melting layers 146 to be heat-sealed to each other while maintaining the non-melting layers 148 of the first film 22 and the second film 32. However, the present invention is not limited to this, and each of the first film 22 and the second film 32 may have a structure corresponding to the manufacturing method of the device 10. For example, the first film 22 and the second film 32 may be fixed to each other with a fixing member such as an adhesive. In this case, each of the first film 22 and the second film 32 may have only one layer, the non-melting layer 148. On the other hand, each of the first film 22 and the second film 32 may have three or more layers.

[0039] 2 and 6, the second sealing member 30 of this embodiment includes, in addition to the second film 32, an additional film 38 made of an insulating film. The additional film 38 has an uneven portion 382. As will be described later, the uneven portion 382 is provided to maintain a passage through which air can pass when the inside of the device 10 is evacuated. More specifically, the additional film 38 has a large number of protrusions 384. Each of the protrusions 384 is a deformable protrusion that protrudes upward. The protrusions 384 are formed uniformly and continuously over the entire additional film 38 in the XY plane. With the above-described structure, a passage through which air can pass is formed between two adjacent protrusions 384. The shape and size of the protrusions 384 are not particularly limited as long as a passage through which air can pass is formed.

[0040] 1 together with FIG. 2, the first film 22 and the second film 32 in this embodiment are overlapped with each other so that the positions of the peripheries 229 and 329 in the XY plane are aligned with each other. However, the present invention is not limited to this. For example, the size of the first film 22 in the XY plane and the size of the second film 32 in the XY plane may be different from each other. The shapes of the first film 22 and the second film 32 are not limited to rectangular and can be modified as necessary.

[0041] Referring to FIG. 6, the first circuit member 40 of this embodiment includes a first substrate 42 and a first conductive pattern 44. The first substrate 42 of this embodiment is a rectangular, thin sheet made of insulating film and is flexible. The first substrate 42 extends parallel to the XY plane. The first conductive pattern 44 is formed on the first substrate 42. More specifically, the first conductive pattern 44 is made of a conductor such as copper, and is formed on the lower surface of the first substrate 42 by a forming method such as silver ink printing or etching.

[0042] The second circuit member 50 of this embodiment has a second substrate 52 and a second conductive pattern 54. The second substrate 52 of this embodiment is a rectangular, thin sheet made of insulating film and is flexible. The second substrate 52 extends parallel to the XY plane. The second conductive pattern 54 is formed on the second substrate 52. More specifically, the second conductive pattern 54 is made of a conductor such as copper, and is formed on the upper surface of the second substrate 52 by a forming method such as silver ink printing or etching.

[0043] The first circuit member 40 and the second circuit member 50 of the present embodiment each have the structure described above. However, the present invention is not limited to this. For example, each of the first circuit member 40 and the second circuit member 50 may be provided with one or more electronic components. One of the first circuit member 40 and the second circuit member 50 may be a single electronic component. Each of the first base 42 and the second base 52 may be a rigid circuit board. As long as each of the first conductor pattern 44 and the second conductor pattern 54 is made of a conductor, there are no particular limitations on the method of forming each of the first conductor pattern 44 and the second conductor pattern 54.

[0044] The first conductor pattern 44 of the present embodiment has a first contact 48. The second conductor pattern 54 of the present embodiment has a second contact 58 and a connection electrode 59. That is, the first circuit member 40 has the first contact 48, and the second circuit member 50 has the second contact 58 and the connection electrode 59. With reference to FIGS. 2 and 5, in the assembled device 10, the first contact 48 and the second contact 58 are in contact with each other. With reference to FIG. 5, in the assembled device 10, the connection electrode 59 and the conductive portion 266 are in contact with each other. That is, the first conductor pattern 44 and the second conductor pattern 54 are electrically connected to each other and can be electrically connected to the outside of the device 10 via the conductive portion 266.

[0045] The first conductor pattern 44 and the second conductor pattern 54 shown in FIG. 6 are abstract conductor patterns for simply explaining the present invention and do not have any specific function. In other words, even if the illustrated first contact 48 and second contact 58 come into contact with each other, the device 10 does not function as an electronic device. However, in reality, the first conductor pattern 44 and the second conductor pattern 54 have an electronic circuit (not shown) formed therein that can measure, for example, the electrocardiogram of the subject. Referring to FIG. 1, this electronic circuit can acquire a biosignal resulting from the electrocardiogram of the subject from the conductive portion 266.

[0046] 2, according to the present embodiment, the number of each of the first contacts 48 and the second contacts 58 is one. Also, the number of each of the connection electrodes 59 and the conductive portions 266 is one. However, the present invention is not limited to this. For example, the number of each of the first contacts 48 and the second contacts 58 may be two or more. Also, the number of each of the connection electrodes 59 and the conductive portions 266 may be two or more. In the assembled device 10, it is sufficient that the first contacts 48 are in contact with the second contacts 58, respectively, and the connection electrodes 59 are in contact with the conductive portions 266, respectively.

[0047] The device 10 of this embodiment will be described in more detail below.

[0048] 1 and 2, the first film 22 of the present embodiment has a first inner portion 222 and a first outer portion 224. The first outer portion 224 of the present embodiment has a first sealing portion 226 and a first contact portion 228. The first inner portion 222 is located inside the first outer portion 224 in the XY plane. In other words, the first outer portion 224 is a portion of the first film 22 that surrounds the first inner portion 222.

[0049] 2, the second film 32 of the present embodiment has a second inner portion 322 and a second outer portion 324. The second outer portion 324 of the present embodiment has a second sealing portion 326 and a second contact portion 328. The second inner portion 322 is located inside the second outer portion 324 in the XY plane. In other words, the second outer portion 324 is a portion of the second film 32 that surrounds the second inner portion 322.

[0050] 1 and 2, the first inner portion 222 of the first film 22 and the second inner portion 322 of the second film 32 are portions that house the circuit structure 12 in the device 10 and are separated from each other. Meanwhile, the first sealed portion 226 and the second sealed portion 326 of the present embodiment are connected to each other to form the seal mark 16. According to the present embodiment, the first sealed portion 226 and the second sealed portion 326 are connected to each other by thermal sealing. That is, the seal mark 16 of the present embodiment is a mark left by welding the first sealed portion 226 and the second sealed portion 326 to each other by heating. However, the present invention is not limited thereto, and the first sealed portion 226 and the second sealed portion 326 can be connected by various methods, such as high frequency, ultrasonic waves, laser, or adhesive.

[0051] The seal mark 16 in this embodiment is formed around the entire periphery of the first seal portion 226 and the second seal portion 326. The seal mark 16 surrounds the entire periphery of the first contact portion 228 and the second contact portion 328 in the XY plane. However, the present invention is not limited to this, and the seal mark 16 may be formed in a necessary location depending on the manufacturing method of the device 10. For example, the seal mark 16 may be formed partially, or may not be formed at all.

[0052] Referring to FIG. 5 , as described below, after the first seal portion 226 and the second seal portion 326 are connected to each other, the inside of the device 10 is evacuated. According to the present embodiment, during evacuation, the first contact portion 228 and the second contact portion 328 come into contact with each other at the contact region 17 due to a difference in air pressure. As a result, a sealed space 18 is formed in the device 10. The sealed space 18 is surrounded by the first inner portion 222 and the second inner portion 322. The contact region 17 of the present embodiment seamlessly surrounds the first inner portion 222 and the second inner portion 322 all around in the XY plane. However, the present invention is not limited thereto, and the contact region 17 may be formed in a necessary location depending on the manufacturing method of the device 10. For example, the contact region 17 may be formed partially or not at all.

[0053] The sealed space 18 formed as described above is surrounded by the first sealing member 20 and the second sealing member 30 and is isolated from the outside of the device 10. According to this embodiment, the first seal portion 226 and the second seal portion 326 are firmly connected to each other. In addition, the contact area 17 is located inside the seal mark 16 in the XY plane, blocking the flow of air between the inside and outside of the sealed space 18. In other words, the air pressure inside the sealed space 18 is maintained at a low pressure lower than atmospheric pressure.

[0054] The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18, which is maintained at the above-mentioned low pressure. The first contact 48 and the second contact 58 are pressed against each other and in contact inside the sealed space 18. More specifically, a contact force is generated between the first contact 48 and the second contact 58 due to the air pressure difference between the inside and outside of the sealed space 18. The first contact 48 and the second contact 58 are pressed against each other due to this air pressure difference, thereby reliably maintaining contact between the first contact 48 and the second contact 58.

[0055] To summarize the above explanation, in the device 10 of this embodiment, the first sealing member 20 and the second sealing member 30 are stacked so as to be in contact with each other, with the first circuit member 40 and the second circuit member 50 (hereinafter simply referred to as "circuit members") sandwiched between them. Each of the first sealing member 20 and the second sealing member 30 of this embodiment is formed using a film as a base.

[0056] Furthermore, each of the circuit members has no structural restrictions other than the fact that it has a contact (first contact 48 or second contact 58) and a connection electrode 59. That is, the circuit member of this embodiment has a simple structure and can be formed from a variety of materials. For example, the circuit member may be an insulating film on which a conductor pattern (first conductor pattern 44 or second conductor pattern 54) having the contact and connection electrode 59 is formed. In this case, the overall thickness of the device 10 can be made extremely thin. That is, this embodiment can provide a new device 10 that can be made thinner.

[0057] According to this embodiment, the connection between the first seal portion 226 and the second seal portion 326 and the contact between the first contact portion 228 and the second contact portion 328 reliably maintains the airtightness of the sealed space 18. However, the present invention is not limited to this embodiment. For example, the first seal portion 226 and the second seal portion 326 may partially surround the first contact portion 228 and the second contact portion 328 in the XY plane. Furthermore, the first seal portion 226 and the second seal portion 326 may partially surround the first inner portion 222 and the second inner portion 322 in the XY plane.

[0058] According to this embodiment, by cutting off the first seal portion 226 and the second seal portion 326, the first circuit member 40 and the second circuit member 50 can be easily removed from the sealed space 18. That is, according to this embodiment, the members can be easily separated, recovered, and reused.

[0059] According to the present embodiment, the conductive portion 266 is in contact with the connection electrode 59 inside the sealed space 18 and is partially exposed to the outside of the device 10. Specifically, the outer surface 232 of the first film 22 is located outside the sealed space 18. The fixed portion 262 of the sub-member 26 is fixed to the outer surface 232 arranged in this manner. The conductive portion 266 and the connection electrode 59 are pressed against each other due to the air pressure difference between the inside and outside of the sealed space 18, thereby reliably maintaining contact between the conductive portion 266 and the connection electrode 59.

[0060] If such a conductive portion 266 were not provided, an electronic circuit (not shown) formed on the first conductor pattern 44 and the second conductor pattern 54 would need to acquire the subject's biosignal without contacting the subject (i.e., in a non-contact manner). However, it is difficult to accurately acquire a weak biosignal in a non-contact manner. On the other hand, according to the present embodiment, the biosignal can be reliably acquired by bringing the conductive portion 266 into contact with the subject's skin.

[0061] It is preferable that the first sealing member 20 and the second sealing member 30 each have high oxygen barrier properties. More specifically, it is preferable that the first film 22 and the second film 32 (or the rigid circuit board) each have a layer made of a material with high oxygen barrier properties (high-oxygen barrier material). This layer structure can reduce oxidation of the metal members of the circuit structure 12.

[0062] For example, the high-oxygen barrier material may be linear low density polyethylene (LLDPE). More specifically, the high-oxygen barrier material may be PET / Al / PE, which is a laminate of polyethylene terephthalate, aluminum, and polyethylene, ON / PE, which is a laminate of biaxially oriented nylon and polyethylene, PET / EVOH / PE, which is a laminate of polyethylene terephthalate, polyvinyl chloride, and polyethylene, or a laminate of a transparent high-barrier film and polyethylene. The transparent high-barrier film may be SiOx-deposited PET (polyethylene terephthalate) or aluminum oxide-deposited PET (polyethylene terephthalate).

[0063] In this embodiment, the first sealing member 20 and the second sealing member 30 each preferably have high water vapor barrier properties in addition to high oxygen barrier properties. More specifically, the first film 22 and the second film 32 (or rigid circuit boards) each preferably have a layer made of a material with high water vapor barrier properties (high water vapor barrier material). This layer structure can make the circuit structure 12 waterproof. For example, the high water vapor barrier material may be a material in which a sheet of ON / PE, OPP (biaxially oriented polypropylene), PET, or the like is coated with PVDC (polyvinylidene chloride).

[0064] Each of the first sealing member 20 and the second sealing member 30 may have various barrier properties such as a high oxygen barrier property and a high water vapor barrier property, as well as a nitrogen barrier property, etc. That is, each of the first sealing member 20 and the second sealing member 30 preferably has a high barrier property according to the application.

[0065] The device 10 (see FIG. 1) of this embodiment is manufactured through four steps: a preparation step, an arrangement step, a sealing step, and a vacuuming step. However, the present invention is not limited to this, and the manufacturing method of the device 10 can be modified as necessary. An example of the manufacturing method of the device 10 of this embodiment will be described below.

[0066] Referring to FIG. 8, first, in a preparation step, the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50 are prepared.

[0067] Next, in the arrangement step, the first sealing member 20, the first circuit member 40, the second circuit member 50, and the second sealing member 30 are stacked one on top of the other in this order from top to bottom along the Z direction. At this time, the first circuit member 40 and the second circuit member 50 are arranged so that the first contact 48 and the second contact 58 face each other in the Z direction. Also, they are arranged so that the conductive portion 266 and the connection electrode 59 face each other in the Z direction. The additional film 38 is positioned at the middle of the second film 32 in the XY plane. The first circuit member 40 and the second circuit member 50 are positioned at the middle of the additional film 38 in the XY plane. Also, the first film 22 and the second film 32 are arranged so that the two melt layers 146 (see FIG. 6) face each other in the Z direction.

[0068] Next, in the sealing process, the first film 22 and the second film 32 are heat-sealed. Specifically, portions of the two melt layers 146 located on the outer peripheries of the first film 22 and the second film 32 in the XY plane are welded to each other by heat sealing. Referring to FIG. 9 , as a result of the heat sealing, a device 10 having a seal mark 16 is formed. The internal space of the device 10 is surrounded by the first sealing member 20 and the second sealing member 30, and is isolated from the outside of the device 10 except for the air valve 28.

[0069] Next, in the evacuation process, the inside of the device 10 is evacuated. According to the present embodiment, the air inside the device 10 is removed using an instrument 80 and an air valve 28. The instrument 80 of the present embodiment is a syringe-type piston pump. The instrument 80 includes a syringe 82 and a plunger 84. The lower end of the syringe 82 has a ring shape that corresponds to the outer periphery of the shielding portion 282 of the air valve 28 in the XY plane.

[0070] In the evacuation process, first, the lower end of syringe 82 is pressed against the upper surface of shielding portion 282. Next, plunger 84 is pulled upward. At this time, air valve 28 is opened, and an air passage is formed between the inside of device 10 and the inside of syringe 82. Air inside device 10 is drawn into syringe 82 through passage hole 288 and notch 285 (see FIG. 7 ) of air valve 28. As a result, the air pressure inside device 10 gradually decreases. When the air pressure inside device 10 reaches a low pressure close to a vacuum, the evacuation by instrument 80 is stopped.

[0071] 5 together with FIG. 9, when the evacuation is stopped, valve 284 (see FIG. 7) of air valve 28 closes notch 285 (see FIG. 7) due to the pressure difference between the air pressure inside device 10 and atmospheric pressure, and air valve 28 is closed. As a result, the air pressure inside device 10 is maintained at a low pressure. That is, a low-pressure sealed space 18 that is isolated from the outside is formed in device 10. First contact 48 and second contact 58 are pressed against each other and come into contact with each other due to the pressure difference between the inside and outside of sealed space 18. Similarly, conductive portion 266 and connection electrode 59 are pressed against each other and come into contact with each other due to the pressure difference between the inside and outside of sealed space 18.

[0072] When a vacuum is drawn, the first film 22 and the second film 32 tend to adhere to each other, forming a contact area such as the contact area 17. If the additional film 38 were not provided, the contact area between the first film 22 and the second film 32 would also tend to form inside the sealed space 18. That is, the contact area may block the air passage between the air valve 28 and the contact areas such as the first contact 48. In this case, the air pressure in the space where the first contact 48 and the second contact 58 are located may not be sufficiently reduced, and the first contact 48 and the second contact 58 may not be in reliable contact. Similarly, the connection electrode 59 may not be in reliable contact with the conductive portion 266.

[0073] On the other hand, the additional film 38 of this embodiment is located between the first film 22 and the second film 32, and therefore prevents direct contact between the first film 22 and the second film 32. Furthermore, because the additional film 38 has the uneven portion 382, ​​even if the first film 22 and the second film 32 come into indirect contact via the additional film 38, the air passage via the air valve 28 is maintained. As a result, the first contact 48 and the second contact 58 are in reliable contact with each other. Similarly, the conductive portion 266 and the connection electrode 59 are in reliable contact with each other.

[0074] The additional film 38 in this embodiment is an embossed film separate from the second film 32 and is disposed on top of the second film 32. The concave-convex portion 382 is formed over the entire upper and lower surfaces of the additional film 38. However, the present invention is not limited to this. For example, the additional film 38 may be adhered and fixed to the upper surface of the second film 32. The concave-convex portion 382 may be formed only on the upper surface of the additional film 38. The concave-convex portion 382 may also be formed on the second film 32 by embossing the second film 32. In this case, the additional film 38 does not need to be provided. That is, the second sealing member 30 may include only the second film 32 having the concave-convex portion 382.

[0075] The additional film 38 in this embodiment forms the second sealing member 30 together with the second film 32. However, the present invention is not limited to this. For example, the additional film 38 may form the first sealing member 20 together with the first film 22. More specifically, the additional film 38 may be disposed below the first film 22. Also, the first film 22 may be embossed to form an uneven portion 382 on the first film 22. In this case, the additional film 38 does not need to be provided.

[0076] According to the manufacturing method of this embodiment, the first contact 48 and the second contact 58 are in secure contact with each other without using a fixing member such as an adhesive. Similarly, the conductive portion 266 and the connection electrode 59 are in secure contact with each other without using a fixing member such as an adhesive. Therefore, when the device 10 is no longer needed, the device 10 can be disassembled simply by cutting off the first outer portion 224 and the second outer portion 324. Furthermore, the first circuit member 40 and the second circuit member 50 can be sealed inside the low-pressure sealed space 18, thereby reducing deterioration of the metal members due to oxidation, etc.

[0077] Referring to FIG. 9 , according to the manufacturing method of this embodiment, a vacuum can be easily drawn using a simple tool 80. The vacuum can be drawn repeatedly using the tool 80. For example, even if the air pressure in the sealed space 18 increases while the device 10 is in use, the tool 80 can be used to draw a vacuum again. As a result, while the device 10 is in use, the contact force between the first contact 48 and the second contact 58 can be maintained, and the contact force between the conductive portion 266 and the connection electrode 59 can also be maintained. However, the present invention is not limited to this, and the manufacturing method of the device 10 can be modified as necessary.

[0078] For example, the structure of the tool 80 is not particularly limited as long as it can draw a vacuum. Instead of using the tool 80 shown in the figure, a nozzle may be inserted into the device 10 and a vacuum may be drawn using the nozzle. In this case, there is no need to provide the air valve 28. A commercially available tabletop vacuum packaging machine (not shown) may also be used for sealing and drawing a vacuum. Furthermore, referring to FIG. 8, the components of the device 10 may be placed in a vacuum chamber (not shown) and vacuumed while being heat sealed. In this case, there is no need to provide the additional film 38. There is also no need to provide the other components with the uneven portion 382. However, from the viewpoint of easily manufacturing the device 10, it is preferable to use a commercially available, simple tool such as the tool 80 (see FIG. 9).

[0079] According to the manufacturing method of this embodiment, the sub-member 26 is fixed to the first film 22 in the preparation step. However, the present invention is not limited to this. For example, the sub-member 26 may be fixed to the first film 22 by thermal welding after the evacuation step is completed. However, from the viewpoint of reliably evacuating the inside of the device 10, the manufacturing method of this embodiment is preferred.

[0080] In addition to the modifications already described, this embodiment can be further modified in various ways as described below.

[0081] 10 with FIG. 5, device 10A according to the first modification includes second sealing member 30, which is the same as device 10. On the other hand, device 10A includes first sealing member 20A, first circuit member 40A, and second circuit member 50A, which are different from first sealing member 20, first circuit member 40, and second circuit member 50 of device 10.

[0082] The first sealing member 20A includes a first film 22A similar to the first film 22, and also includes the same sub-member 26 and air valve 28 as the first sealing member 20. The first film 22A has a main opening 244A similar to the main opening 244. However, the main opening 244A is located above the first circuit member 40A.

[0083] The second circuit member 50A has the same structure as the second circuit member 50, except that it does not include the connection electrode 59. On the other hand, the first circuit member 40A includes the connection electrode 49A. More specifically, the first circuit member 40A includes a first base 42A and a first conductor pattern 44A. The first base 42A has a via hole formed therein, penetrating the first base 42A from top to bottom. The connection electrode 49A is formed on the upper surface of the first base 42A and is connected to the first conductor pattern 44A on the lower surface via the via hole. The sub-member 26 is fixed to the outer surface 232 of the first film 22A so as to cover the main opening 244A. The conductive portion 266 of the sub-member 26 contacts the connection electrode 49A of the first conductor pattern 44A, instead of the connection electrode 59 of the second conductor pattern 54.

[0084] Except for the above-mentioned differences, device 10A has the same structure as device 10 and functions in the same way as device 10. That is, this modification also provides the same effects as the above-mentioned embodiment.

[0085] As can be understood from the above description, the first circuit member 40A may include the connection electrode 49A, and the second circuit member 50 may include the connection electrode 59. Alternatively, the first circuit member 40A may include the connection electrode 49A, and the second circuit member 50 may include the connection electrode 59. In other words, it is sufficient that at least one of the first circuit member and the second circuit member includes a connection electrode.

[0086] Comparing FIG. 11 with FIG. 5, device 10B according to the second modified example includes the same second sealing member 30, first circuit member 40, and second circuit member 50 as device 10. On the other hand, device 10B includes a first sealing member 20B that is different from the first sealing member 20 of device 10. First sealing member 20B includes the same first film 22, sub-member 26, and air valve 28 as first sealing member 20. However, an inner surface 234 of first film 22 is located inside sealed space 18. Adhesion target portion 262 of sub-member 26 is fixed to the thus-arranged inner surface 234 with a fixing member such as an adhesive.

[0087] Except for the above-described differences, device 10B has a similar structure to device 10 and functions similarly to device 10. For example, referring to FIGS. 11 to 13, fixed portion 262 located around sub-opening 264 is fixed to first film 22 around the entire periphery of main opening 244. Conductive portion 266 contacts connection electrode 59 inside sealed space 18 and is partially exposed to the outside of device 10. Conductive portion 266 and connection electrode 59 are pressed against each other due to the air pressure difference between the inside and outside of sealed space 18, thereby reliably maintaining contact between conductive portion 266 and connection electrode 59. In other words, this modification also provides the same effects as the above-described embodiment and first modification.

[0088] The fixed portion 262 of this modified example may include a melting layer (not shown) and a non-melting layer (not shown). The melting layer of the fixed portion 262 may be located above the fixed portion 262. In this case, the fixed portion 262 may be heat-sealed to the melting layer 146 of the first film 22 (see FIG. 6).

[0089] 1 and 5, device 10C according to the third modification includes the same second sealing member 30, first circuit member 40, and second circuit member 50 as device 10. On the other hand, device 10C includes a first sealing member 20C that is different from the first sealing member 20 of device 10. The first sealing member 20C includes the same first film 22 and air valve 28 as the first sealing member 20. On the other hand, first sealing member 20C does not include sub-member 26. Instead of conductive portion 266 of sub-member 26, first sealing member 20C includes conductive portion 246C.

[0090] Like the conductive portion 266, the conductive portion 246C is made of a conductor such as metal and is formed in the same manner as the conductive portion 266. The conductive portion 246C closes the main opening 244 of the first film 22. The conductive portion 246C extends across the entire main opening 244 in the XY plane and completely closes the main opening 244. In other words, the conductive portion 246C blocks the flow of air through the main opening 244.

[0091] Except for the above-mentioned differences, device 10C has a similar structure to device 10 and functions similarly to device 10. For example, referring to FIG. 15 , conductive portion 246C is in contact with connection electrode 59 inside sealed space 18 and is partially exposed to the outside of device 10. Conductive portion 246C and connection electrode 59 are pressed against each other due to the air pressure difference between the inside and outside of sealed space 18, thereby reliably maintaining contact between conductive portion 246C and connection electrode 59. In other words, this modification also provides the same effects as the above-mentioned embodiment, first modification, and second modification.

[0092] In addition to the modifications already described, this embodiment can be further modified in various ways.

[0093] 6, for example, the periphery 229 of the first film 22 and the periphery 329 of the second film 32 may be connected to each other at the rear end (the end on the -X side) in the front-to-rear direction (X direction). In other words, the first film 22 and the second film 32 may each be part of a single folded flat sheet. Furthermore, the periphery 229 of the first film 22 and the periphery 329 of the second film 32 may be connected to each other except for the rear end. In other words, the first film 22 and the second film 32 may each be part of a single bag-shaped sheet.

[0094] The rear end of the bag-shaped sheet described above may be provided with an openable and closable zipper. In this case, after closing the zipper and drawing a vacuum, the first film 22 and the second film 32 may be heat-sealed at a portion located in front of (on the +X side of) the air valve 28. After heat-sealing, the portion where the air valve 28 is provided may be cut off.

[0095] The first circuit member 40 may be a member integral with the first sealing member 20, and the second circuit member 50 may be a member integral with the second sealing member 30. For example, the first base 42 may be adhered and fixed to the lower surface of the first film 22, and the first conductor pattern 44 may be formed on the lower surface of the first film 22. The second circuit member 50 may be provided on the additional film 38. For example, the second base 52 may be adhered and fixed to the upper surface of the additional film 38, and the second conductor pattern 54 may be formed on the upper surface of the additional film 38. If the second sealing member 30 does not include the additional film 38, the second base 52 may be adhered and fixed to the upper surface of the second film 32, and the second conductor pattern 54 may be formed on the upper surface of the second film 32.

[0096] 16 together with FIGS. 9 to 11, as described above, the method for forming the conductive portion 266 of the sub-member 26 is not particularly limited. For example, the sub-member 26 may be a conductive gel 26D (see the device 10D in FIG. 16). In other words, the first sealing members 20, 20A, and 20B may include the conductive gel 26D instead of the sub-member 26. The conductive gel 26D is conductive, flexible, and adhesive, and is suitable for direct application to the human body. Furthermore, when the conductive gel 26D is used, it is not necessary to form the sub-opening 264. The portion of the conductive gel 26D that covers the main openings 244 and 244A functions as the conductive portion 266, and the portion of the conductive gel 26D that is fixed to the first film 22 and 22A functions as the fixed portion 262. That is, the conductive gel 26D includes the fixed portion 262 and the conductive portion 266, similar to the sub-member 26, and functions similarly to the sub-member 26. [Explanation of symbols]

[0097] 10, 10A, 10B, 10C, 10D devices 12 Circuit structure 14 Sealing member 146 Molten layer 148 Non-melting layer 16 Seal marks 17 Contact area 18 Sealed space 20,20A,20B,20C 1st sealing member 22,22A 1st film 222 1st inner part 224 First outer part 226 First seal part 228 1st contact part 229 Periphery 232 External surface 234 Inner surface 244,244A Main opening 246C Continuity part 248 Valve opening 26 Secondary part 26D Conductive Gel 262 Fixed part 264 Secondary opening 266 Conductive part 28 Air valve 282 Shielding part 284 Valve 285 Notch 286 base 288 Passing hole 30 Second sealing member 32 Second Film 322 Second inner part 324 Second outer part 326 Second seal part 328 2nd contact part 329 Periphery 38 Additional Films 382 Uneven part 384 protrusion 40, 40A First circuit member 42,42A 1st base 44, 44A First conductor pattern 48 First Contact 49A connecting electrode 50,50A Second circuit member 52 Second base 54 Second conductor pattern 58 Second Contact 59 Connecting electrode 80 Equipment 82 Syringe 84 Plunger

Claims

1. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base, and a thin-film conductive portion made of a conductor; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed inside the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; The conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device. device.

2. 10. The device of claim 1, The first film has a main opening formed therein, the main opening extends through the first film; The conductive portion closes the main opening. device.

3. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base and a conductive portion made of a conductor; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed inside the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; the conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device; the first sealing member includes a sub-member in addition to the first film, The first film has a main opening formed therein, the main opening extends through the first film; the sub-member includes a fixed portion and the conductive portion, The secondary member has a secondary opening formed therein, the secondary opening penetrates the fixed portion, the conductive portion closes the sub-opening, The fixed portion located around the sub-opening is fixed to the first film over the entire periphery. device.

4. 4. The device of claim 3, the first film has an outer surface; The outer surface is located outside the sealed space, The fixed portion of the secondary member is fixed to the outer surface. device.

5. 4. The device of claim 3, the first film has an inner surface; The inner surface is located inside the sealed space, The fixed portion of the secondary member is fixed to the inner surface. device.

6. A device according to any one of claims 3 to 5, The fixed portion of the sub-member is made of a film. device.

7. A device according to any one of claims 1 to 6, The second sealing member has a second film as a base. device.

8. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the first sealing member includes a first film as a base and a conductive gel; The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed inside the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other inside the sealed space, At least one of the first circuit member and the second circuit member includes a connection electrode; The conductive gel has a conductive portion, The conductive portion is in contact with the connection electrode inside the sealed space and is partially exposed to the outside of the device. device.

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