A multi-layered interleaved circuit board

Abstract

The utility model belongs to circuit board technical field especially is a kind of multilayer formula interlaced circuit board, including first circuit board and second circuit board, the below of first circuit board is provided with second circuit board, the top of first circuit board is fixedly connected with electronic component, the top of first circuit board is respectively provided with mounting hole around, the right side top of first circuit board is fixedly connected with power interface, the front and back of first circuit board is respectively provided with conducting wire belt, the front and back top of first circuit board is respectively provided with electricity connection hole, the top of first circuit board is provided with isolation component around.The utility model passes through first circuit board, second circuit board, power interface, electronic component, guide tape, electricity connection hole, realizes the two-way communication and collaborative work between two circuit boards, and can prevent electronic component from being damaged or circuit connection unstable due to external force shaking.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a multi-layer overlapping circuit board. Background Technology

[0002] With the continuous advancement of technology, electronic devices are developing towards miniaturization, thinner and lighter designs, and higher performance. For example, portable electronic devices such as smartphones, tablets, and wearable devices need to integrate more functions and electronic components within a limited space to meet users' demands for multifunctionality, high speed, and convenience. Multilayer overlapping circuit boards, by stacking multiple circuit boards together, can effectively save space and improve the integration of electronic devices, making them an important technical means to address this need.

[0003] The existing technology has the following defects or problems: The existing technology disclosed in CN221901083U provides a multi-layer overlapping circuit board, which relates to the field of circuit boards. A multi-layer overlapping circuit board includes a first circuit board assembly and a second circuit board assembly. The first circuit board assembly includes a first circuit board, and the second circuit board assembly includes a second circuit board. The present invention can fix the first circuit board and the second circuit board through connecting posts and connecting grooves. Multiple first circuit boards and multiple second circuit boards can be overlapped and fixedly connected. Moreover, the signal shielding layer of the present invention can prevent interference between the first circuit board and the adjacent second circuit board. Furthermore, the conductivity between adjacent first circuit boards and second circuit boards can be achieved through the cooperation of conductive terminals and conductive grooves.

[0004] During use, the aforementioned devices struggle to achieve bidirectional communication and collaborative operation between the two circuit boards, leading to communication protocol mismatches or data packet loss, which in turn slows down command response and affects real-time performance. Furthermore, in existing technologies, some multi-layered overlapping circuit boards are susceptible to damage to electronic components or unstable circuit connections due to external force, and it is difficult to shield against electromagnetic signal leakage generated during circuit board operation.

[0005] It should be noted that the above content falls within the inventor's technical knowledge and does not necessarily constitute prior art. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a multi-layered overlapping circuit board, which solves the current problems.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a multi-layer overlapping circuit board, comprising a first circuit board and a second circuit board, wherein the second circuit board is disposed below the first circuit board, an electronic component is fixedly connected to the top of the first circuit board, mounting holes are respectively opened around the top of the first circuit board, a power interface is fixedly connected to the top right side of the first circuit board, conductive strips are respectively disposed on the front and rear sides of the first circuit board, power connection holes are respectively opened at the top of the front and rear sides of the first circuit board, and an isolation component is disposed around the top of the first circuit board.

[0008] As a preferred embodiment of the present invention, the isolation assembly includes multiple connecting posts, with limiting plates fixedly connected to the bottom ends of the multiple connecting posts respectively. An isolation ring II is sleeved on the bottom end of each connecting post, a shielding plate is provided at the top end of the isolation ring II, and an isolation ring I is provided at the top end of the shielding plate.

[0009] As a preferred embodiment of this utility model, grooves are respectively provided on the front and rear sides of the first circuit board and the second circuit board, and the outer sides of the two conductive strips are in contact with the inner walls of the grooves.

[0010] As a preferred embodiment of this utility model, the bottom ends of the two conductive strips on their adjacent sides are respectively fixedly connected to the front and rear ends of the second circuit board.

[0011] As a preferred embodiment of this utility model, electronic components are fixedly connected to the top ends of the first circuit board and the second circuit board respectively, and the bottom end of the power interface is fixedly connected to the top right side of the first circuit board.

[0012] As a preferred embodiment of this utility model, the bottom outer ends of the plurality of connecting posts are in contact with the inner walls of the four corners of the second circuit board, and the top ends of the connecting posts are in contact with the inner walls of the four corners of the first circuit board.

[0013] As a preferred embodiment of this utility model, the bottom ends of the plurality of second isolation rings are in contact with the top end of the second circuit board, and the top ends of the plurality of first isolation rings are in contact with the bottom end of the first circuit board.

[0014] Compared with the prior art, the present invention provides a multi-layer overlapping circuit board, which has the following advantages:

[0015] 1. A multi-layered overlapping circuit board, comprising a first circuit board, a second circuit board, a power interface, electronic components, a guide strip, and power connection holes. The power interface transmits electrical energy to the circuit system of the first circuit board. The electronic components on the first circuit board start working after receiving electrical energy. Simultaneously, the first circuit board needs to interact with the second circuit board for data exchange and power transmission. The first circuit board is connected to the conductive strip through the power connection holes on the front and rear sides, transmitting the signals and power to be transmitted to the second circuit board through the conductive strip. After receiving the signals and power from the first circuit board, the second circuit board can also feed back the processed signals to the first circuit board through the conductive strip, realizing bidirectional communication and collaborative work between the two circuit boards.

[0016] 2. A multi-layered overlapping circuit board, comprising connecting posts, a first circuit board, a second circuit board, a shielding plate, and an isolation ring. The connecting posts provide a stable physical connection between the first and second circuit boards, ensuring that the two circuit boards maintain a fixed relative position in the overlapping state, preventing damage to electronic components or unstable circuit connections due to external force shaking. The shielding plate can prevent electromagnetic signals generated during circuit board operation from leaking out, ensuring the normal operation of electronic components on the circuit board, and improving the anti-interference capability and signal transmission quality of the circuit system. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the first circuit board structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the electronic component structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the connecting column structure of this utility model.

[0021] In the diagram: 1. First circuit board; 2. Second circuit board; 3. Electronic components; 4. Mounting holes; 5. Power interface; 6. Conductive strip; 7. Power connection hole; 8. Connecting post; 9. Limiting plate; 10. Isolation ring one; 11. Isolation ring two; 12. Shielding plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0023] Please see Figure 1-4 In this embodiment: a multi-layered overlapping circuit board includes a first circuit board 1 and a second circuit board 2. Electronic components 3 are fixedly connected to the top of the first circuit board 1 and the second circuit board 2 respectively. Grooves are respectively opened on the front and rear sides of the first circuit board 1 and the second circuit board 2. The outer sides of two conductive wire strips 6 are in contact with the inner walls of the grooves. The second circuit board 2 is arranged below the first circuit board 1. Electronic components 3 are fixedly connected to the top of the first circuit board 1. Mounting holes 4 are respectively opened around the top of the first circuit board 1. A power interface 5 is fixedly connected to the top right side of the first circuit board 1. The bottom end of the power interface 5 is fixedly connected to the top right side of the first circuit board 1. Conductive wire strips 6 are respectively arranged on the front and rear sides of the first circuit board 1. The bottom ends of the two adjacent sides of the two conductive wire strips 6 are respectively fixedly connected to the front and rear ends of the second circuit board 2. Power connection holes 7 are respectively opened on the top of the front and rear sides of the first circuit board 1. Isolation components are arranged around the top of the first circuit board 1.

[0024] In this embodiment, when an external power source is connected to the first circuit board 1 through the power interface 5, the power interface 5 transmits electrical energy to the circuit system of the first circuit board 1. After receiving electrical energy, the electronic components 3 on the first circuit board 1 begin to work, performing corresponding circuit functions, signal processing, and data calculation. At the same time, the first circuit board 1 needs to interact with the second circuit board 2 for data exchange and power transmission. At this time, the conductive strip 6 plays a role. The first circuit board 1 is connected to the conductive strip 6 through the power connection holes 7 on the front and rear sides, and the signals and power to be transmitted to the second circuit board 2 are conducted to the second circuit board 2 through the conductive strip 6. After receiving the signals and power from the first circuit board 1, the electronic components 3 on the second circuit board 2 also begin to work, performing corresponding processing and calculation. The second circuit board 2 can also feed back the processed signals to the first circuit board 1 through the conductive strip 6, realizing bidirectional communication and collaborative work between the two circuit boards. Example 2

[0025] like Figure 1 - Figure 4 As shown, the isolation assembly includes multiple connecting posts 8. The bottom outer edges of the multiple connecting posts 8 are in contact with the inner walls of the four corners of the second circuit board 2, and the top edges of the connecting posts 8 are in contact with the inner walls of the four corners of the first circuit board 1. Limiting plates 9 are fixedly connected to the bottom edges of the multiple connecting posts 8 respectively. Isolation rings 2 11 are sleeved on the bottom outer edges of the connecting posts 8. The bottom edges of the multiple isolation rings 2 11 are in contact with the top edges of the second circuit board 2. A shielding plate 12 is provided at the top edge of the isolation rings 2 11. An isolation ring 10 is provided at the top edge of the shielding plate 12. The top edges of the multiple isolation rings 10 are in contact with the bottom edge of the first circuit board 1.

[0026] In this embodiment, the connecting post 8 firmly supports the first circuit board 1, maintaining a stable overlapping structure with the second circuit board 2, providing a stable physical environment for the normal operation of the electronic component 3. The limiting plate 9 ensures the fixed position of the connecting post 8, preventing the circuit board structure from loosening due to external forces. The first isolation ring 10 and the second isolation ring 11, with their insulation properties, cut off the electrical path between the circuit board and the connecting post 8, preventing current leakage and short circuits. The shielding plate 12 plays a crucial role in electromagnetic protection. When there is an external electromagnetic interference source, the shielding plate 12 can reflect or absorb the interference signal, preventing it from entering the circuit board and affecting the operation of the electronic component 3. At the same time, the electromagnetic signals generated by the circuit board during operation are also blocked by the shielding plate 12, preventing them from radiating outward and avoiding interference with other surrounding electronic devices. Through the coordinated work of the isolation components and the main structure of the circuit board, the multi-layer overlapping circuit board can operate stably in a complex electromagnetic environment, ensuring the accuracy of signal transmission and the reliability of power supply.

[0027] The working principle and usage process of this utility model are as follows: When an external power source is connected to the first circuit board 1 through the power interface 5, the electronic components 3 on the first circuit board 1 begin to work and execute corresponding circuit functions. The first circuit board 1 and the second circuit board 2 transmit signals and power through the conductive wire strip 6. During this process, the connecting post 8 stably supports the first circuit board 1, maintaining a stable overlapping structure with the second circuit board 2, providing a stable physical environment for the normal operation of the electronic components 3. The limiting plate 9 ensures that the position of the connecting post 8 is fixed, preventing the circuit board structure from loosening due to external forces. The first isolation ring 10 and the second isolation ring 11, with their insulation properties, cut off the electrical path between the circuit board and the connecting post 8, preventing current leakage and short circuits.

[0028] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multilayer overlapping circuit board, characterized in that: The circuit includes a first circuit board (1) and a second circuit board (2). The second circuit board (2) is disposed below the first circuit board (1). An electronic component (3) is fixedly connected to the top of the first circuit board (1). Mounting holes (4) are respectively opened around the top of the first circuit board (1). A power interface (5) is fixedly connected to the top right side of the first circuit board (1). Conductive strips (6) are respectively disposed on the front and rear sides of the first circuit board (1). Power connection holes (7) are respectively opened on the top of the front and rear sides of the first circuit board (1). An isolation component is disposed around the top of the first circuit board (1).

2. The multilayer overlapping circuit board according to claim 1, characterized in that: The isolation assembly includes multiple connecting posts (8), with limit plates (9) fixedly connected to the bottom ends of the multiple connecting posts (8), and an isolation ring II (11) sleeved on the bottom end of the connecting post (8). A shielding plate (12) is provided at the top end of the isolation ring II (11), and an isolation ring I (10) is provided at the top end of the shielding plate (12).

3. The multilayer overlapping circuit board according to claim 1, characterized in that: The first circuit board (1) and the second circuit board (2) have grooves on their front and rear sides respectively, and the outer sides of the two conductive strips (6) are in contact with the inner wall of the grooves.

4. A multilayer overlapping circuit board according to claim 1, characterized in that: The bottom ends of the two conductive strips (6) on their adjacent sides are fixedly connected to the front and rear ends of the second circuit board (2), respectively.

5. A multilayer overlapping circuit board according to claim 1, characterized in that: Electronic components (3) are fixedly connected to the top of the first circuit board (1) and the second circuit board (2), respectively, and the bottom of the power interface (5) is fixedly connected to the top right side of the first circuit board (1).

6. A multilayer overlapping circuit board according to claim 2, characterized in that: The bottom outer ends of the multiple connecting posts (8) are in contact with the inner walls of the four corners of the second circuit board (2), and the top ends of the connecting posts (8) are in contact with the inner walls of the four corners of the first circuit board (1).

7. A multilayer overlapping circuit board according to claim 2, characterized in that: The bottom ends of the plurality of isolation rings two (11) are in contact with the top end of the second circuit board (2), and the top ends of the plurality of isolation rings one (10) are in contact with the bottom end of the first circuit board (1).

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