Upper mold, resin molding device, and method for manufacturing resin molded product

Abstract

To provide an upper mold capable of preventing a release film used for the upper mold from wrinkling and deflecting.SOLUTION: An upper mold comprises: an upper mold main block for holding a molding object; an upper mold base for supporting the upper mold main block; a first film pressing part for pressing a release film for a lower mold disposed on the lower mold from above; a second film pressing part disposed above the first film pressing part, and pressing a release film for an upper mold disposed on the upper mold main block from above; and a connection part for connecting the first film pressing part and the second film pressing part, and holding them onto the upper mold base.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to techniques for an upper mold, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] Some resin molding devices for producing resin molded products use a release film in the cavity of the lower mold. For example, Patent Document 1 discloses a resin molding device in which a release film is loaded into the molding die together with the resin. In the resin molding device described in Patent Document 1, the release film is adsorbed and fixed in suction grooves formed on the outside of the cavity of the lower mold and in the gaps between the blocks that make up the lower mold, and is further fixed to the lower mold by a film holder provided on the upper mold when the molds are clamped. This allows the release film to be fixed to the lower mold without wrinkles or flexing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-187340 Summary of the Invention [Problem to be solved by the invention]

[0004] In resin molding devices, a release film may be used not only on the lower mold having a cavity but also on the upper mold that holds the object to be molded. For example, when overmolding is performed to seal not only the lower surface of the object to be molded but also the side surface with resin, or to prevent damage to the object to be molded, a release film may also be used on the upper mold. When a release film is used on the upper mold, it is necessary to prevent the release film from wrinkling and bending.

[0005] The present invention has been made in consideration of the above-described circumstances, and the problem to be solved by the present invention is to provide an upper mold, a resin molding apparatus, and a method for manufacturing a resin molded product that are capable of preventing wrinkles and warping of a release film used in the upper mold. [Means for solving the problem]

[0006] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the upper mold of the present invention comprises an upper mold main block on which the object to be molded is held, an upper mold base that supports the upper mold main block, a first film holding portion that holds down from above the lower mold release film that is placed on the lower mold, a second film holding portion that is placed above the first film holding portion and holds down from above the upper mold release film that is placed on the upper mold main block, and a connecting portion that connects the first film holding portion and the second film holding portion and holds them to the upper mold base.

[0007] Furthermore, the resin molding apparatus according to the present invention comprises the upper mold, a lower mold having a cavity and arranged opposite the upper mold, a supply roll arranged below the upper mold around which one end of the upper mold release film is wound and which can supply the upper mold to the upper mold, a take-up roll around which the other end of the upper mold release film is wound and which can take up the upper mold release film, and a lifting mechanism which can raise and lower the supply roll and the take-up roll in the vertical direction.

[0008] In addition, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a step of holding the molded object on the upper mold main block via the upper mold release film, and a step of clamping the upper mold and the lower mold. [Effects of the Invention]

[0009] According to the present invention, it is possible to prevent the release film used in the upper mold from wrinkling and bending. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic plan view showing the overall configuration of a resin molding apparatus according to an embodiment; [Figure 2] FIG. 2 is a front cross-sectional schematic view showing the configuration of the molding die portion of the molding module. [Figure 3] Bottom view showing the upper mold. [Figure 4] (a) Bottom perspective view of the upper mold. (b) Enlarged view of part A. [Figure 5] FIG. [Figure 6] FIG. 2 is a front cross-sectional schematic view showing the state in which the upper mold release film and the substrate are adsorbed to the upper mold. [Figure 7] A schematic front cross-sectional view showing how the lower and upper dies are clamped together. [Figure 8] Schematic front cross-sectional view showing the upper and lower dies being opened. DETAILED DESCRIPTION OF THE INVENTION

[0011] In the following explanation, the directions indicated by arrows U, D, L, R, F, and B in the figure will be defined as upward, downward, leftward, rightward, forward, and backward, respectively.

[0012] <Overall configuration of resin molding device 1> First, the configuration of a resin molding apparatus 1 according to this embodiment will be described with reference to FIG. 1. The resin molding apparatus 1 performs resin molding using a compression molding method. The resin molding apparatus 1 can resin-encapsulate electronic elements, such as semiconductor chips, fixed to a pre-molded substrate Wa, which is an object to be molded, to produce a resin molded product. The pre-molded substrate Wa can be a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate. The pre-molded substrate Wa may or may not be wired. In the embodiment described below, a circular pre-molded substrate Wa is used, but the shape of the pre-molded substrate Wa is not particularly limited. For example, a rectangular substrate can also be used as the pre-molded substrate Wa.

[0013] The resin molding apparatus 1 mainly comprises a molding unit 10, a substrate unit 20, a resin supply unit 30, a rail 40, a control unit 50, and the like. The substrate unit 20, the molding unit 10, and the resin supply unit 30 are arranged in a line from left to right. The rail 40 is arranged to extend in the direction in which the units are lined up (left-right direction). The molding unit 10, the substrate unit 20, and the resin supply unit 30 are detachable from the adjacent units. Furthermore, the number of each unit can be increased or decreased as needed.

[0014] The molding unit 10 resin-seals electronic elements such as semiconductor chips fixed to a pre-molded substrate Wa within a cavity C to form a molded substrate Wb. The molding unit 10 includes a molding die consisting of an upper die 120 (see FIG. 2) and a lower die 110, and a heating means (not shown) for heating and melting the granular resin R. The pre-molded substrate Wa can be adsorbed and fixed to the lower surface of the upper die 120 with the surface on which the electronic elements are fixed facing downward. The lower die 110 is provided with a cavity C capable of containing the granular resin R.

[0015] The molding unit 10 also includes a film mechanism 170 for supplying the upper mold release film F to the upper mold 120. The film mechanism 170 includes a supply roll 171 that pays out the long upper mold release film F to the upper mold 120, and a take-up roll 172 that takes up the upper mold release film F from the upper mold 120.

[0016] The substrate unit 20 supplies the pre-molding substrate Wa to the molding unit 10 and carries out the molded substrate Wb molded in the molding unit 10. The substrate unit 20 includes a substrate loader 21, a pre-molding substrate accommodating section 22, a molded substrate accommodating section 23, and a robot arm mechanism 24. The substrate loader 21 supplies the pre-molding substrate Wa to the molding unit 10 and carries out the molded substrate Wb molded in the molding unit 10 from the molding unit 10. The substrate loader 21 is arranged on rails 40.

[0017] The resin supply unit 30 supplies granular resin R at a uniform thickness onto the lower mold release film 33, and supplies the lower mold release film 33 on which the granular resin R has been arranged into the cavity C of the molding die. The resin supply unit 30 includes a long release film 33a wound in a roll, a grip 34 that grips the tip of the long release film 33a and pulls it out, a film cutting mechanism 36 that cuts the long release film 33a to a required length and separates it, a mounting table 35 on which the long release film 33a is placed, and a linear feeder 37 that is a supply mechanism for the granular resin R.

[0018] The resin supply unit 30 also has an integrated resin loader 31 and post-processing mechanism 32. The resin loader 31 can place a circular frame 38 on a lower mold release film 33 that has been pulled out onto a mounting table 35. The resin loader 31 can also supply granular resin R that has been supplied to the inside of the circular frame 38 that has been placed on the lower mold release film 33 into the cavity C of the molding die in that state. The post-processing mechanism 32 is an integrated unit consisting of an upper mold surface cleaner and a release film removal mechanism that is located below the upper mold surface cleaner. The resin loader 31 and post-processing mechanism 32 are arranged on rails 40.

[0019] The control unit 50 is disposed at any position (in the illustrated example, at the front of the resin molding apparatus 1) of the resin molding apparatus 1. The control unit 50 can control the operation of each of the above-mentioned units in order to resin-seal the electronic elements fixed to the pre-molding substrate Wa to obtain the molded substrate Wb.

[0020] Next, the configuration of the molding unit 10 will be described with reference to Figures 2 to 5. Note that the cross-sectional view shown in Figure 2 is a schematic representation of the molding unit 10 for the purpose of explanation, and does not strictly depict the shape, arrangement, etc. of each part. In the following description, the pre-molding substrate Wa and the molded substrate Wb may be referred to as substrate W without distinction.

[0021] The molding unit 10 includes a molding die including a lower die 110 and an upper die 120, and is mainly composed of a lower die base 130, an upper die base 160, a lower die main block 140, an upper die main block 150, The apparatus is equipped with a pressure reducing mechanism 60, a film mechanism 170, a lower die film holding section 180, an upper die film holding section 190, a connecting section 200, and the like.

[0022] 2 supports a lower die main block 140. The lower die base 130 is formed in a plate shape having an appropriate width in the vertical direction. The lower die base 130 has a suction path 111 formed therein.

[0023] The suction path 111 is an air suction path for sucking air in. The suction path 111 is formed to connect the upper surface of the lower die base 130 to the outside.

[0024] The lower die base 130 is held by a lower die holder (not shown) of the molding unit 10, and a die clamping mechanism (not shown) is provided below the lower die holder. The die clamping mechanism can clamp and open the die by raising and lowering the lower die main block 140 via the lower die base 130. The die clamping mechanism may be a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, or the like.

[0025] The upper die base 160 is held by an upper die holder (not shown) of the molding unit 10, and the upper die holder supports the upper die main block 150. The upper die base 160 mainly includes an upper member 161, a lower member 162, an alignment block 163, an outer suction path 164, an inner suction path 165, etc.

[0026] The upper member 161 shown in Figures 2, 4, and 5 constitutes the upper portion of the upper mold base 160. Of Figures 4(a) and 4(b), the upper mold release film F is not shown in Figure 4(a). The upper member 161 is formed in a plate shape having an appropriate width in the vertical direction. The upper member 161 is formed in a substantially rectangular shape when viewed from the vertical direction. As shown in Figure 5, the upper member 161 has an upper recess 161a formed therein.

[0027] The upper recess 161a is formed on the lower surface of the upper member 161. The upper recess 161a has an appropriate depth in the vertical direction. The upper recess 161a is formed so that its cross section when viewed from the vertical direction is circular. A plurality of upper recesses 161a are formed at positions corresponding to the connecting portion 200 described later.

[0028] The lower member 162 constitutes the lower portion of the upper die base 160. The lower member 162 is formed in the shape of a plate having an appropriate width in the vertical direction. When viewed from the vertical direction, the lower member 162 is formed in the same shape (approximately rectangular) as the upper member 161. The lower member 162 is fixed to the lower surface of the upper member 161. A lower through-hole 162a is formed in the lower member 162.

[0029] The lower through-holes 162a are formed so as to penetrate the lower member 162 in the vertical direction. The lower through-holes 162a are formed so that their cross-sectional shape when viewed from the vertical direction is circular. The inner diameter of the lower part of the lower through-hole 162a is smaller than the inner diameter of the upper part. A plurality of lower through-holes 162a are formed at positions corresponding to the upper recesses 161a. Specifically, the lower through-holes 162a are formed at positions facing the upper recesses 161a in the vertical direction.

[0030] The alignment block 163 shown in Figures 2 to 4 is used to align the substrate loader 21 (see Figure 1) and the upper main block 150. The alignment block 163 is formed in a substantially rectangular parallelepiped shape. The alignment block 163 is fixed to the lower surface of the lower member 162. A plurality of alignment blocks 163 are arranged around the upper main block 150. In this embodiment, as shown in Figures 3 and 4, the alignment blocks 163 are arranged in four locations around the upper main block 150. The alignment blocks 163 are arranged at equal intervals with respect to the center of the upper main block 150 when viewed from the bottom. Alignment recesses 163a are formed in the alignment block 163.

[0031] The alignment recess 163a is formed on the lower surface of the alignment block 163. The alignment recess 163a has an appropriate depth in the vertical direction.

[0032] The outer suction paths 164 shown in Fig. 2 are air suction paths for sucking air when the upper mold release film F is suctioned by the suction grooves 151 formed in the upper mold main block 150. The outer suction paths 164 are formed to connect the lower surface of the upper mold base 160 (lower member 162) to the outside. A plurality of outer suction paths 164 are formed at positions facing the outer peripheral end of the upper mold main block 150 in the up-down direction. The lower parts of the outer suction paths 164 are connected to the connection holes 152 of the upper mold main block 150.

[0033] The inner suction path 165 is an air suction path for sucking air when the substrate W is suctioned by the inner suction holes 153 formed in the upper mold main block 150. The inner suction path 165 is formed to connect the lower surface of the upper mold base 160 (lower member 162) to the outside. The inner suction path 165 is formed more inward than the outer suction path 164 in the horizontal direction. The lower parts of the inner suction paths 165 are connected to each other. Furthermore, the lower parts of the inner suction paths 165 are connected to the inner suction holes 153 of the upper mold main block 150.

[0034] The lower die main block 140 forms the lower part of the molding die and also forms the cavity C. The lower die main block 140 mainly comprises a bottom member 141, a side member 142, an elastic member 143, and the like.

[0035] The bottom surface member 141 forms the bottom surface of the cavity C. The bottom surface member 141 is formed in a circular shape when viewed from above. The bottom surface member 141 is formed to have an appropriate vertical width. The bottom surface member 141 is placed in a state where it is placed on the central portion of the lower die base 130. The bottom surface member 141 has a suction path 141a formed therein.

[0036] The suction path 141a is an air suction path for sucking air when the lower mold release film 33 (see FIG. 1) is suctioned to the lower mold main block 140. The suction path 141a is formed to connect the side surface and the underside of the bottom member 141. The suction path 141a of the lower mold main block 140 is connected to the suction path 111 of the lower mold base 130. The suction path 141a can suck air through a minute gap between the bottom member 141 and the side member 142, and through suction grooves (not shown) and suction paths (not shown) formed in the bottom member 141, which will be described later.

[0037] The side surface member 142 surrounds the bottom surface member 141 from the sides. The side surface member 142 is frame-shaped and formed to have an appropriate vertical width. A hollow portion is formed in the side surface member 142, penetrating the center of the side surface member 142 from top to bottom. The hollow portion of the side surface member 142 is formed in a shape that generally matches the outer shape of the bottom surface member 141 in a plan view.

[0038] In this way, the side member 142 is formed in the shape of a circular frame in a plan view. The bottom member 141 is placed in the hollow portion of the side member 142. The side member 142 is placed on the lower mold base 130 via the elastic member 143. The upper surface of the side member 142 is located higher than the upper surface of the bottom member 141. The side member 142, the bottom member 141, and the upper mold main block 150 define a cavity C for resin molding. Furthermore, a suction groove (not shown) for the lower mold release film 33 is formed on the upper surface of the side member 142, and a suction path (not shown) is formed from this suction groove to the side of the hollow portion of the side member 142.

[0039] The elastic member 143 is disposed between the side member 142 and the lower die base 130. The elastic member 143 is formed, for example, by a compression coil spring that can expand and contract in the vertical direction.

[0040] The upper main block 150 forms the upper part of the mold and holds the object to be molded (substrate W). The upper main block 150 is formed in a circular shape when viewed from the bottom. The upper main block 150 is formed to have an appropriate vertical width. The upper main block 150 is fixed to the center part of the lower surface of the upper base 160. The lower surface of the upper main block 150 is an adsorption surface that can adsorb the object to be molded. The upper main block 150 is formed with adsorption grooves 151, connection holes 152, and inner adsorption holes 153.

[0041] 2 to 4 are used to adsorb the upper mold release film F. The adsorption grooves 151 are formed on the lower surface of the upper mold main block 150. The adsorption grooves 151 are formed so as to extend along the outer periphery of the upper mold main block 150. The adsorption grooves 151 are formed in a substantially annular shape when viewed from the bottom.

[0042] 2 connects the outer suction path 164 of the upper mold base 160 and the suction groove 151. The connection hole 152 is formed so as to penetrate the upper mold main block 150 from top to bottom. The lower part of the connection hole 152 is connected to the suction groove 151. The upper part of the connection hole 152 is connected to the outer suction path 164 of the upper mold base 160. A plurality of connection holes 152 are formed along the suction groove 151.

[0043] 2 to 4 are for sucking the substrate W. The inner suction holes 153 are formed so as to penetrate the upper mold main block 150 from top to bottom. A plurality of inner suction holes 153 are formed inside the suction grooves 151 in the horizontal direction. The tops of the inner suction holes 153 are connected to the inner suction paths 165 of the upper mold base 160.

[0044] The decompression mechanism 60 shown in FIG. 2 is for sucking air and reducing the pressure of each part. The decompression mechanism 60 can be configured with, for example, a decompression pump. The decompression mechanism 60 is connected to the lower mold base 130 and the upper mold base 160 via air suction paths configured with appropriate hoses or the like. Specifically, the decompression mechanism 60 is connected to the suction path 111 of the lower mold base 130 and the outer suction path 164 and inner suction path 165 of the upper mold base 160. The decompression mechanism 60 can independently suck air from the suction path 111, the outer suction path 164, and the inner suction path 165.

[0045] The film mechanism 170 is for supplying the upper mold release film F to the upper mold main block 150. The film mechanism 170 mainly includes a supply roll 171, a take-up roll 172, an elevating mechanism 173, and the like.

[0046] The supply roll 171 is for supplying the upper mold release film F to the upper mold main block 150. An unused upper mold release film F is wound around the supply roll 171. The supply roll 171 is arranged in front of the upper mold base 160 with its rotation axis facing the left-right direction. The supply roll 171 can be rotated by a drive mechanism (not shown). As shown in FIG. 3, the upper mold release film F is formed in a longitudinal shape with its longitudinal direction facing the front-rear direction. The width of the upper mold release film F in the short side direction (left-right direction) is formed to be approximately constant over the entire longitudinal direction.

[0047] The take-up side roll 172 is used to wind and collect the upper mold release film F that has been used in the upper mold main block 150. The take-up side roll 172 is arranged on the rear side of the upper mold base 160 with its rotation axis facing in the left-right direction. The take-up side roll 172 can be rotated by a drive mechanism (not shown). The upper mold release film F that has been used in the upper mold main block 150 is wound around the take-up side roll 172.

[0048] As described above, a single longitudinally formed upper-mold release film F is wound around the supply-side roll 171 and the take-up-side roll 172. As shown in FIG. 3, a middle portion of the upper-mold release film F is disposed below the upper-mold main block 150 so as to face the upper-mold main block 150 in the vertical direction. As will be described later, the pre-molded substrate Wa needs to be adsorbed onto the upper-mold main block 150. For this reason, a plurality of adsorption through-holes Fa are formed in the upper-mold release film F to enable air to be sucked (see FIG. 2). In this embodiment, the upper-mold release film F is disposed so as to face the alignment block 163 in the vertical direction. As will be described later, the alignment recesses 163a of the alignment block 163 need to be fitted with the alignment protrusions 21a of the substrate loader 21. For this reason, alignment through-holes Fb are formed in advance in the upper-mold release film F at positions facing the alignment block 163.

[0049] In this embodiment, an example is shown in which the upper mold release film F is supplied in the front-to-rear direction by the supply side roll 171 and the take-up side roll 172, but the supply direction of the upper mold release film F is not limited to this and can be changed as desired.

[0050] 2 is for vertically raising and lowering the supply-side roll 171 and the take-up-side roll 172. The lifting mechanisms 173 are provided on the supply-side roll 171 and the take-up-side roll 172. The lifting mechanisms 173 can raise and lower the supply-side roll 171 and the take-up-side roll 172 by any desired amount using a drive mechanism (not shown).

[0051] The lower-mold film holding portion 180 shown in Figures 2 to 5 is for pressing downward the lower-mold release film 33 for the lower-mold main block 140. As shown in Figures 3 and 4, the lower-mold film holding portion 180 is formed to have a circular ring shape when viewed from the bottom. The lower-mold film holding portion 180 is arranged so as to surround the upper-mold main block 150 from the outside when viewed from the bottom. Furthermore, the lower-mold film holding portion 180 is arranged more inward than the alignment block 163 when viewed from the bottom.

[0052] The upper-die film holding portion 190 shown in Figures 2 to 5 is for pressing the upper-die release film F downward. The upper-die film holding portion 190 is arranged above the lower-die film holding portion 180. As shown in Figures 3 and 4, the upper-die film holding portion 190 is formed to have approximately the same shape as the lower-die film holding portion 180 in a bottom view. Specifically, the upper-die film holding portion 190 is formed to have an annular shape in a bottom view. The upper-die film holding portion 190 is arranged to surround the upper-die main block 150 from the outside in a bottom view. Furthermore, the upper-die film holding portion 190 is arranged more inward than the alignment block 163 in a bottom view. In this way, the upper-die film holding portion 190 is arranged to be located between the alignment block 163 and the upper-die main block 150 in a bottom view.

[0053] The connecting portion 200 shown in FIGS. 3 to 5 is for connecting the lower-mold film holding portion 180 and the upper-mold film holding portion 190 to the upper main block 150 (more specifically, for connecting them to the upper main block 150 via the upper base 160). As shown in FIG. 3, the connecting portion 200 connects the vicinity of both the left and right ends of the lower-mold film holding portion 180 and the upper-mold film holding portion 190 to the upper main block 150. Specifically, the connecting portion 200 is arranged outward of the upper-mold release film F in the width direction (left-right direction) of the upper-mold release film F arranged below the upper main block 150. The width direction of the upper-mold release film F is the direction perpendicular to the supply direction of the upper-mold release film F and the thickness direction of the upper-mold release film F. In this embodiment, the width direction of the upper-mold release film F corresponds to the left-right direction. In this embodiment, four connecting portions 200 are provided on each of the left and right sides of the upper mold release film F.

[0054] As shown in FIG. 5, the connecting portion 200 mainly includes a holding portion 210, a fastening portion 220, a first adjusting member 230, a second adjusting member 240, an elastic member 250, and the like.

[0055] Holding portion 210 is for holding lower die film holding portion 180 and upper die film holding portion 190 relative to upper die base 160. Holding portion 210 mainly includes a shaft portion 211, a flange portion 212, and the like.

[0056] The shaft portion 211 is a generally cylindrical portion whose axial direction is oriented in the vertical direction. The flange portion 212 is a circular plate-like portion formed to extend horizontally from the upper end of the shaft portion 211. The diameter of the flange portion 212 is larger than the inner diameter of the lower portion of the lower through-hole 162a formed in the lower member 162. The shaft portion 211 of the holder 210 is inserted into the lower through-hole 162a from above. Because the diameter of the flange portion 212 is larger than the inner diameter of the lower portion of the lower through-hole 162a, the holder 210 is held by the lower member 162. The holder 210 can move up and down along the lower through-hole 162a and the upper recess 161a.

[0057] The fastening portion 220 is used to fix the lower-die film holding portion 180 and the upper-die film holding portion 190 to the holding portion 210. The fastening portion 220 is formed by a fastener such as a bolt that can be fixed to the holding portion 210. The fastening portion 220 is inserted from below into the lower-die film holding portion 180 and the upper-die film holding portion 190, as well as into the first adjustment member 230, which will be described later. The upper end of the fastening portion 220 is fastened to the lower portion of the holding portion 210. This fixes the lower-die film holding portion 180 and the upper-die film holding portion 190 to the holding portion 210.

[0058] The first adjustment member 230 is used to adjust the gap between the lower-mold film holding portion 180 and the upper-mold film holding portion 190. The first adjustment member 230 is disposed between the lower-mold film holding portion 180 and the upper-mold film holding portion 190. The first adjustment member 230 is formed in an annular shape. By disposing the first adjustment member 230 between the lower-mold film holding portion 180 and the upper-mold film holding portion 190, the lower-mold film holding portion 180 and the upper-mold film holding portion 190 can be disposed with a gap therebetween. In addition, by appropriately changing the thickness (width in the vertical direction) of the first adjustment member 230, the gap between the lower-mold film holding portion 180 and the upper-mold film holding portion 190 can be adjusted. In this embodiment, the thickness of the first adjustment member 230 is set so that a gap large enough to allow the upper-mold release film F to pass between the lower-mold film holding portion 180 and the upper-mold film holding portion 190 is formed.

[0059] The second adjustment member 240 is used to adjust the vertical positions of the lower-die film holding portion 180 and the upper-die film holding portion 190. The second adjustment member 240 is disposed within the lower through-hole 162a, below the flange 212 of the holding portion 210. The second adjustment member 240 is formed in an annular shape. The shaft 211 of the holding portion 210 is inserted into the second adjustment member 240. By disposing the second adjustment member 240 below the flange 212, the holding portion 210 can be disposed in the lower member 162 in a state where it is slightly lifted upward. In addition, by appropriately changing the thickness (vertical width) of the second adjustment member 240, the position (lowest position) of the holding portion 210 when it has moved all the way down can be adjusted. In this embodiment, the thickness of the second adjustment member 240 is set so that when the holding portion 210 is lowered to the lowest position relative to the lower member 162, the lower surface of the upper mold film holding portion 190 is positioned slightly lower than the lower surface (adsorption surface) of the upper mold main block 150.

[0060] The elastic member 250 applies a downward force to the holding portion 210. The elastic member 250 is formed of, for example, a compression coil spring. The elastic member 250 is disposed above the flange portion 212 of the holding portion 210. The elastic member 250 is disposed between the upper recess 161a and the flange portion 212 in a state where it is compressed in the vertical direction. This allows the elastic member 250 to constantly apply a downward force to the holding portion 210.

[0061] The following describes a method for manufacturing a resin molded product using the resin molding apparatus 1 configured as described above. The control unit 50 controls the operation of each unit of the resin molding apparatus 1, thereby manufacturing the resin molded product.

[0062] First, in the molding unit 10 shown in Figures 1 and 2, an unused upper mold release film F unwound from the supply side roll 171 is placed below the upper mold main block 150. At this time, the upper mold release film F is placed so as to pass between the lower mold film holding portion 180 and the upper mold film holding portion 190, as shown in Figures 2 to 4. Furthermore, when placing the upper mold release film F below the upper mold main block 150, the vertical positions of the supply side roll 171 and the take-up side roll 172 are adjusted by the lifting mechanism 173 so that the upper mold release film F does not interfere with the lower mold film holding portion 180 and the upper mold film holding portion 190.

[0063] Next, as shown in Fig. 6, the upper mold release film F is adsorbed into the suction grooves 151 of the upper mold main block 150 by the pressure reducing mechanism 60. At this time, before adsorption, the supply side roll 171 and the take-up side roll 172 are slightly lifted upward by the lifting mechanism 173. As a result, the upper mold film pressing section 190 presses the upper mold release film F downward between the supply side roll 171 and the take-up side roll 172 and the upper mold main block 150. By pressing the upper mold release film F with the upper mold film pressing section 190 in this way, it is possible to prevent wrinkles and warping from occurring in the upper mold release film F adsorbed to the upper mold main block 150.

[0064] In particular, in this embodiment, wrinkles and warping are likely to occur starting from the alignment through holes Fb due to the formation of the alignment through holes Fb in the upper-die release film F. In the resin molding apparatus 1, by arranging the upper-die film holding portion 190 on the upper-die main block 150 side of the alignment through holes Fb, it is possible to effectively prevent wrinkles and warping from being transmitted to the upper-die main block 150 side.

[0065] 1, the control unit 50 drives the robot arm mechanism 24 to take out the pre-molded substrate Wa from the pre-molded substrate accommodation section 22, turn it over, and place it on the substrate loader 21 with the surface on which the electronic elements are fixed facing downward. The substrate loader 21 moves along the rails 40 to transport the pre-molded substrate Wa to the molding unit 10.

[0066] As shown in FIG. 6, the substrate loader 21 is formed with an alignment protrusion 21a that protrudes upward. The alignment protrusion 21a is formed at a position corresponding to the alignment block 163 (alignment recess 163a) of the upper mold base 160. The substrate loader 21 can align the pre-molded substrate Wa with respect to the upper mold main block 150 by fitting the alignment protrusion 21a into the alignment recess 163a of the upper mold base 160. At this time, the alignment protrusion 21a is fitted into the alignment recess 163a via the alignment through hole Fb of the upper mold release film F. With the substrate loader 21 aligned with the upper mold main block 150, the pre-molded substrate Wa is sucked into the inner suction hole 153 of the upper mold main block 150 by the pressure reduction mechanism 60. After the pre-molded substrate Wa is held by the upper mold main block 150, the substrate loader 21 retreats from the molding unit 10.

[0067] 1, a grip 34 holds the leading end of a rolled long release film 33a and pulls out the lower mold release film 33 onto a mounting table 35. A film cutting mechanism 36 then cuts the pulled out lower mold release film 33. A circular frame 38 is placed on the cut lower mold release film 33 by the resin loader 31. The lower mold release film 33 is then attached to the underside of the circular frame 38, thereby forming a recessed storage section inside the circular frame 38. Granular resin R is supplied to this recessed storage section at a uniform thickness from a linear feeder 37.

[0068] Resin loader 31 holds the recessed accommodating portion supplied with granular resin R. Resin loader 31 moves along rails 40 to transport the recessed accommodating portion from resin supply unit 30 to molding unit 10 and place the recessed accommodating portion on lower main block 140.

[0069] 7, the decompression mechanism 60 sucks air through the suction path 141a of the lower main block 140, and the lower release film 33 is drawn into the cavity C together with the granular resin R thereon. After the circular frame 38 is removed from the lower main block 140 by the resin loader 31, the granular resin R is heated and melted by the heating means.

[0070] Next, as shown in FIG. 7, the mold clamping mechanism raises the lower mold base 130 toward the upper mold main block 150. As a result, the lower mold film holding portion 180 provided on the upper mold base 160 comes into contact with the lower mold release film 33 provided on the lower mold main block 140 from above. With the lower mold film holding portion 180 holding down the lower mold release film 33 from above in this manner, the cavity C is evacuated by a decompression mechanism (not shown). At this time, as the pressure on the cavity C side decreases, the suction force of the lower mold release film 33 via the lower mold main block 140 decreases. However, because the lower mold film holding portion 180 presses down the lower mold release film 33 from above, it is possible to prevent the lower mold release film 33 from floating up from the lower mold main block 140.

[0071] In this state, the lower mold base 130 is further raised and the mold is clamped, thereby immersing the electronic elements of the pre-molded substrate Wa in the molten granular resin R (molten resin). At this time, the lower mold film holding portion 180 is pushed upward by the lower mold main block 140, but the elastic member 250 contracts vertically, causing the lower mold film holding portion 180 and the upper mold film holding portion 190 to also move upward. Therefore, the mold clamping is not hindered by the lower mold film holding portion 180 and the upper mold film holding portion 190.

[0072] After a certain period of time has passed, the molten resin solidifies, and resin molding is performed on the pre-molding substrate Wa, thereby obtaining a molded substrate Wb (a resin-encapsulated molded product of electronic elements). In this embodiment, as shown in Fig. 8, overmolding is performed to cover the side surfaces of the substrate W with resin. When covering the side surfaces of the substrate W with resin in this manner, by providing an upper mold release film F on the upper main block 150 as in this embodiment, it is possible to prevent the resin from adhering to the upper main block 150.

[0073] After the resin has solidified, the lower mold base 130 is lowered to open the mold. When the lower mold main block 140 descends, the elastic member 250 expands, causing the lower mold film holding portion 180 provided on the lower mold base 130 to also descend together with the lower mold main block 140. As shown in FIG. 8, with the lower mold main block 140 lowered by a certain amount, air is temporarily supplied from the pressure reducing mechanism 60 to the suction path 141a of the lower mold main block 140. This allows the lower mold release film 33 to be peeled off from the molded substrate Wb. At this time, because the lower mold release film 33 is held down by the lower mold film holding portion 180, it is possible to prevent the lower mold release film 33 from scattering.

[0074] Thereafter, the lower die base 130 is further lowered. The substrate loader 21 shown in FIG. 1 transports the molded substrate Wb from the molding unit 10 to the substrate unit 20. The robot arm mechanism 24 removes the molded substrate Wb from the substrate loader 21 and turns the molded substrate Wb upside down so that the resin-sealed side faces upward. The robot arm mechanism 24 then stores the molded substrate Wb in the molded substrate storage section 23.

[0075] After the molded substrate Wb is removed from the molding unit 10, the portion of the upper-mold release film F that has been used for resin molding is taken up by the take-up roll 172 shown in Figure 2. At the same time, an unused portion of the upper-mold release film F is supplied to the upper-mold main block 150. After the molded substrate Wb is removed from the molding unit 10, the lower surface of the upper-mold main block 150 can also be cleaned by an upper-mold surface cleaner of the post-processing mechanism 32. After the molded substrate Wb is removed from the molding unit 10, the lower-mold release film 33 that is no longer needed is removed from the lower-mold main block 140 by a release film removal mechanism.

[0076] As described above, in the resin molding apparatus 1 according to this embodiment, the upper mold film holding portion 190, which is held on the upper mold main block 150 side together with the lower mold film holding portion 180, can prevent wrinkles and deflections in the upper mold release film F. This can prevent molding defects from occurring.

[0077] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0078] For example, the configuration (shape, arrangement, number, etc.) of each part of the resin molding apparatus 1 described in this embodiment is not particularly limited, and can be changed as desired.

[0079] Furthermore, in this embodiment, the upper-die film holding portion 190 is formed in a circular ring shape, but the present invention is not limited to this and can be formed in any shape. For example, the upper-die film holding portion 190 can also be formed in a rectangular ring shape. Furthermore, it is preferable that the upper-die film holding portion 190 has a shape that corresponds to the shape of the pre-molding substrate Wa held in the upper-die main block 150 (the outer shape of the upper-die main block 150 when viewed from the bottom).

[0080] Furthermore, in this embodiment, the upper-die film holding portion 190 is formed in a ring shape that surrounds the upper-die main block 150 in a bottom view, but the present invention is not limited to this. For example, the upper-die film holding portion 190 may be divided so that at least a portion is interrupted. Note that, when an alignment through-hole Fb is formed in the upper-die release film F as in this embodiment, it is preferable to configure the upper-die film holding portion 190 so that it is positioned at least between the alignment through-hole Fb and the upper-die main block 150.

[0081] Furthermore, similar to upper-die film holding portion 190, there are no particular limitations on the shape of lower-die film holding portion 180. Furthermore, the shapes of upper-die film holding portion 190 and lower-die film holding portion 180 (for example, the shapes when viewed from the bottom) do not necessarily have to be the same.

[0082] Furthermore, in this embodiment, an example has been shown in which the upper-mold release film F is arranged so as to face the alignment block 163 in the up-down direction, but the present invention is not limited to this. For example, it is also possible to arrange the alignment block 163 on the outside in the width direction of the upper-mold release film F so that the upper-mold release film F does not face the alignment block 163. In this case, there is no need to form alignment through holes Fb in the upper-mold release film F, and therefore the occurrence of wrinkles and warping can be suppressed.

[0083] In addition, in this embodiment, an example has been shown in which the pre-cut lower mold release film 33 is placed on the lower mold main block 140, but the present invention is not limited to this. For example, similar to the upper mold release film F, it is also possible to use a rolled, elongated release film 33a without cutting it.

[0084] In addition, although the present embodiment illustrates a resin molding apparatus 1 that performs resin molding by compression molding, the present invention is not limited to this and can also be applied to a resin molding apparatus that performs resin molding by, for example, transfer molding. Also, in the present embodiment, granular resin is used, but liquid resin or sheet-like resin can also be used.

[0085] <Additional Notes> The upper mold 120 of the first aspect of the present disclosure is an upper mold main block 150 for holding an object to be molded; an upper die base 160 supporting the upper die main block 150; a first film pressing portion (lower mold film pressing portion 180) that presses the lower mold release film 33 placed on the lower mold 110 from above; A second film holding portion (upper mold film holding portion 190) is arranged above the first film holding portion and holds down the upper mold release film F arranged on the upper mold main block 150 from above; a connecting portion (200) that connects the first film holding portion and the second film holding portion and holds them on the upper mold base (160); It is equipped with the following. The upper mold 120 according to the first aspect of the present disclosure can prevent wrinkling and bending of the release film used in the upper mold 120. That is, not only the release film used in the lower mold 110, but also the release film used in the upper mold 120 can be arranged without wrinkling or bending. Furthermore, the connecting portion 200 can hold the first film holding portion together with the second film holding portion. This allows the first film holding portion and the second film holding portion to be provided in a small space and with a small number of parts.

[0086] In the upper mold 120 of the second side according to the first side, The connecting portion 200 is arranged on the outer side in the width direction of the rectangular upper mold release film F, which is placed on a part of the surface of the upper mold main block 150 on which the molded object is held. According to the upper mold 120 of the second aspect of the present disclosure, the connecting portion 200 can be arranged so as not to interfere with the upper mold release film F.

[0087] In the upper mold 120 of the third side according to the first or second side, The connecting portion 200 is a holding portion 210 that holds the first film holding portion and the second film holding portion on the upper die base 160; a first adjustment member (230) that can adjust the gap between the first film pressing portion and the second film pressing portion; It is equipped with the following. According to upper mold 120 of the third aspect of the present disclosure, the distance between the first film holding portion and the second film holding portion can be easily and appropriately adjusted by first adjustment member 230. For example, by replacing first adjustment member 230 with one having different dimensions, the distance between the first film holding portion and the second film holding portion can be easily adjusted.

[0088] In the upper mold 120 of the fourth side according to the first to third side faces, The connecting portion 200 is arranged so as to be movable in the up and down direction relative to the upper mold base 160, The lower surface of the second film pressing portion can be positioned lower than the lower surface of the upper main block 150 when the connecting portion 200 is moved downward. According to the upper mold 120 of the fourth aspect of the present disclosure, the second film pressing portion can be brought into appropriate contact with the upper mold release film F. This makes it possible to appropriately prevent the upper mold release film F from wrinkling and bending.

[0089] In the upper mold 120 of the fifth side according to the fourth side, The connecting part 200 further includes a second adjusting member 240 that can adjust the lowest position to which the connecting part 200 is moved most downward relative to the upper main block 150 . According to upper mold 120 of the fifth aspect of the present disclosure, the vertical position of the second film holding portion can be easily and appropriately adjusted by second adjustment member 240. For example, by replacing second adjustment member 240 with one having different dimensions, the amount of protrusion of the second film holding portion from the suction surface of upper mold main block 150 can be easily adjusted.

[0090] In the upper mold 120 of the sixth side according to the first to fifth sides, The apparatus further includes an alignment unit (alignment block 163) for aligning the upper mold main block 150 with a transfer device (substrate loader 21) for transferring the molding object, The second film pressing portion is disposed between the alignment portion and the upper main block 150 in a bottom view. The upper mold 120 according to the sixth aspect of the present disclosure can effectively prevent wrinkles and warping of the upper mold release film F. That is, when through holes or the like are formed in the upper mold release film F according to the alignment portion, wrinkles and warping may occur starting from these through holes. It is possible to effectively prevent the wrinkles and warping starting from these through holes from being transmitted to the upper mold main block 150 side.

[0091] In the upper mold 120 of the seventh side according to the first to sixth sides, The second film holding portion has the same shape as the first film holding portion when viewed from the bottom. According to upper mold 120 of the seventh aspect of the present disclosure, the first film holding portion and the second film holding portion can be arranged in a space-saving manner.

[0092] A resin molding apparatus 1 according to an eighth aspect of the present disclosure includes: Upper molds 120 for the first to seventh sides; a lower mold 110 having a cavity C, which is disposed opposite the upper mold 120; a supply roll 171 around which one end of the upper mold release film F is wound and which is disposed below the upper mold 120 and can supply the upper mold release film F to the upper mold 120; a take-up roll 172 around which the other end of the upper mold release film F is wound and which can take up the upper mold release film F; a lifting mechanism 173 capable of lifting the supply side roll 171 and the take-up side roll 172 in the vertical direction; It is equipped with the following. According to the resin molding apparatus 1 of the eighth aspect of the present disclosure, by adjusting the vertical positions of the supply roll 171 and the take-up roll 172 with the lifting mechanism 173, it is possible to prevent interference between the upper-mold release film F and other components. For example, when the upper-mold release film F is supplied to the upper mold 120 and when the upper-mold release film F is collected from the upper mold 120, it is possible to avoid interference of the upper-mold release film F with other components. Furthermore, by bringing the upper-mold release film F into contact with the upper-mold film pressing portion 190, it is possible to effectively prevent wrinkling and bending of the upper-mold release film F.

[0093] A method for producing a resin molded product according to a ninth aspect of the present disclosure includes: A method for manufacturing a resin molded product using the resin molding apparatus 1 of the eighth aspect, a step of holding the object to be molded on the upper mold main block 150 via the upper mold release film F; a step of clamping the upper mold 120 and the lower mold 110; It includes: According to the method for manufacturing a resin molded product of the ninth aspect of the present disclosure, it is possible to prevent wrinkling and bending of the release film used in the upper mold. [Explanation of symbols]

[0094] 1 Resin molding equipment 21 Board Loader 33 Lower mold release film 110 Lower mold 120 Upper mold 150 Upper main block 160 Upper base 163 Alignment Block 171 Supply Roll 172 Winding side roll 173 Lifting mechanism 180 Lower die film holder 190 Upper die film holder 200 Connection part 210 Holding part 230 First adjustment member 240 Second adjustment member

Claims

1. an upper mold main block that holds an object to be molded; an upper die base supporting the upper die main block; a first film pressing portion that presses a lower mold release film that is placed on the lower mold from above; a second film holding portion that is disposed above the first film holding portion and that holds down an upper mold release film that is disposed on the upper mold main block from above; a connecting portion that connects the first film holding portion and the second film holding portion and holds them on the upper mold base; An upper mold equipped with:

2. The connecting portion is arranged on the outer side in the width direction of the rectangular upper mold release film that is arranged on a part of the surface of the upper mold main block on which the molding object is held. The upper mold according to claim 1 .

3. The connecting portion is a holding portion that holds the first film holding portion and the second film holding portion on the upper mold base; a first adjustment member that can adjust the gap between the first film pressing portion and the second film pressing portion; Equipped with The upper mold according to claim 1 .

4. the connecting portion is arranged to be movable in the up and down direction relative to the upper mold base, a lower surface of the second film pressing portion can be positioned lower than a lower surface of the upper die main block when the connecting portion is moved downward; The upper mold according to claim 1 .

5. The connecting portion further includes a second adjustment member that adjusts the lowest position at which the connecting portion is moved most downwardly relative to the upper main block. The upper mold according to claim 4.

6. Further, an alignment unit is provided for aligning the upper mold main block with a conveying device that conveys the molding object, The second film pressing portion is disposed between the alignment portion and the upper main block in a bottom view. The upper mold according to claim 1 .

7. The second film holding portion has the same shape as the first film holding portion when viewed from the bottom. The upper mold according to claim 1 .

8. An upper mold according to any one of claims 1 to 7; a lower mold having a cavity and disposed opposite the upper mold; a supply roll around which one end of the upper mold release film is wound and which is disposed below the upper mold and can supply the upper mold release film to the upper mold; a take-up roll around which the other end of the upper mold release film is wound and which can take up the upper mold release film; a lifting mechanism capable of lifting the supply-side roll and the take-up-side roll in a vertical direction; A resin molding device comprising:

9. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 8, a step of holding the object to be molded on the upper mold main block via the upper mold release film; a step of clamping the upper mold and the lower mold; A method for producing a resin molded product comprising the steps of:

Images