Resin material supply mechanism, resin molding device, and manufacturing method

Abstract

A resin material supply mechanism, a resin molding device, and a manufacturing method are provided that can reduce dust falling onto the transport path of a resin material containing frame. [Solution] A resin material supply mechanism that supplies resin material to a cavity using a planar member, and is equipped with an inner frame portion 61 that has a through hole 63 that penetrates from top to bottom and that abuts against the planar member to form a space into which the resin material is poured by the through hole 63 and the planar member, an outer frame portion 62 that supports the inner frame portion on its inner surface so that it can be raised and lowered, and a dust suppression portion 70 that suppresses dust from entering the gap between the inner frame portion 61 and the outer frame portion 62.

Description

[Technical Field]

[0001] The present invention relates to a resin material supply mechanism, a resin molding device, and a manufacturing method. [Background technology]

[0002] There have been conventional resin molding devices that use a resin molding technique based on a compression molding method. For example, as described in Patent Document 1, a conventional resin molding device supplies a resin material to a cavity formed in a lower mold and covered with a release film, and heats and melts the resin to produce a molten resin.

[0003] In this type of resin molding apparatus, a release film is applied to an XY table, and a resin supply mechanism having a resin material storage frame is placed on the release film. The resin material is supplied into a space defined by the through-holes in the resin material storage frame and the release film. The resin material storage frame has an outer frame (referred to as a "periphery" in Patent Document 1) and an inner frame (referred to as an "elevating member" in Patent Document 1) supported on the outer frame so that it can be raised and lowered. The inner frame is configured to freely fall and contact the release film. This configuration ensures that the lower surface of the inner frame and the release film are in close contact with each other, preventing the resin material from entering between the lower surface of the resin material storage frame and the upper surface of the release film. In this state, the resin supply mechanism is transported above the cavity together with the release film and resin material, thereby supplying the resin material to the cavity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-222760 Summary of the Invention [Problem to be solved by the invention]

[0005] In this type of resin supply mechanism, gaps are formed so as to penetrate from the top to the bottom of the outer frame and the inner frame. In conventional resin supply mechanisms, there is a risk that dust may enter the gap between the outer frame and the inner frame, pass through the gap between the outer frame and the inner frame, and fall below the transport path of the resin material containing frame.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a resin material supply mechanism, a resin molding device, and a manufacturing method that can reduce dust falling below the transport path of the resin material containing frame. [Means for solving the problem]

[0007] One embodiment of the cutting device according to the present disclosure is a resin material supply mechanism that supplies resin material to a cavity using a planar member, and is equipped with an inner frame portion that has a through hole that penetrates vertically and that abuts against the planar member to form a space into which the resin material is poured by the through hole and the planar member, an outer frame portion that supports the inner frame portion on its inner surface so that it can be raised and lowered, and a dust suppression portion that suppresses dust from entering the gap between the inner frame portion and the outer frame portion.

[0008] One embodiment of a resin molding apparatus according to the present disclosure includes the above-mentioned resin material supply mechanism, an upper mold, a lower mold opposite the upper mold, the cavity provided in the lower mold, and a mold clamping mechanism that clamps a molding mold having at least the upper mold and the lower mold, and the resin material supply mechanism supplies the resin material to the cavity using the planar member.

[0009] One embodiment of the manufacturing method according to the present disclosure is a method for manufacturing a resin molded product using the above-mentioned resin molding apparatus, and includes a step of supplying the resin material to the planar member, and a step of supplying the resin material to the cavity using the planar member. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic diagram illustrating a resin molding device. [Figure 2] 10A and 10B are diagrams illustrating a covering step and a contact step in the resin supply module. [Figure 3] 10A and 10B are diagrams illustrating a charging process and a transport process in the resin supply module. [Figure 4] 10A and 10B are diagrams illustrating an operation of supplying a resin material to a lower die cavity in a resin molding module. [Figure 5] 10A and 10B are diagrams illustrating the resin sealing operation in the resin molding module. [Figure 6] FIG. 2 is a plan view illustrating the configuration of a dust prevention unit. [Figure 7] 10A and 10B are diagrams illustrating a configuration of a resin material supply mechanism according to another embodiment. [Figure 8] 10A and 10B are diagrams illustrating a configuration of a resin material supply mechanism according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Embodiments of a resin material supply mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product according to the present disclosure will be described in detail below with reference to the drawings. Note that the embodiments described below are examples for explaining the resin material supply mechanism, the resin molding apparatus, and the method for manufacturing a resin molded product, and are not intended to limit the resin material supply mechanism, the resin molding apparatus, and the method for manufacturing a resin molded product to these embodiments. Therefore, the resin material supply mechanism, the resin molding apparatus, and the method for manufacturing a resin molded product according to the present disclosure can be implemented in various forms without departing from the spirit thereof.

[0012] Substrates (molding objects) with semiconductor chips (hereinafter sometimes referred to as "chips") fixed thereto are resin-encapsulated and used as electronic components (resin molded products). Techniques for resin-encapsulating substrates include the compression method (compression molding) and the transfer method. One compression method is a resin-encapsulating method in which liquid resin or powdered resin is supplied to a release film, the release film is placed on the lower die of a molding die, and the object to be molded is immersed in the molten liquid resin or powdered resin on the release film to form a resin mold. Examples of electronic elements include resistor elements and capacitor elements in addition to semiconductor chips.

[0013] [Configuration of Resin Molding Device] FIG. 1 shows a schematic diagram of a resin molding apparatus 1. The resin molding apparatus 1 in this embodiment employs a compression system and includes a resin supply module 2, multiple (three in this embodiment) resin molding modules 3, a substrate supply module 4, and a control unit 5. The resin supply module 2, the multiple resin molding modules 3, and the substrate supply module 4 can be independently attached or detached. While the resin molding modules 3 in this embodiment are three, the apparatus may be configured with two or fewer or four or more modules, and an optimal number can be selected depending on the production volume. The Z direction in FIG. 1 corresponds to the vertical direction of the resin molding apparatus 1, the X direction corresponds to the arrangement direction of the resin supply module 2, the resin molding module 3, and the substrate supply module 4, and the Y direction corresponds to the direction perpendicular to the X and Z directions (the depth direction of each module). In the X, Y, and Z directions in FIG. 1, the arrows point in the +X, +Y, and +Z directions, respectively, and the opposite directions to the arrows point in the -X, -Y, and -Z directions, respectively.

[0014] The control unit 5 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 5 controls the operation of the resin molding apparatus 1 by causing the processor to execute a control program stored in the storage device. The operation of the resin molding apparatus 1 described below is performed based on operation commands from the control unit 5, unless otherwise specified. In the following description, explanations of the operation commands from the control unit 5 will be omitted in principle, and the operation commands from the control unit 5 will be explained as necessary.

[0015] The substrate supply module 4 is provided with a pre-molded substrate supply section 41 that supplies pre-molded substrates Sa, a molded substrate storage section 42 that stores molded substrates Sb (an example of the "resin molded product" of the present invention), a substrate placement section 43 that transfers pre-molded substrates Sa and molded substrates Sb, and a substrate transport mechanism 44 that transports pre-molded substrates Sa and molded substrates Sb. The substrate placement section 43 moves in the Y direction within the substrate supply module 4. The substrate transport mechanism 44 moves in the X and Y directions in the substrate supply module 4 and the resin molding module 3, respectively.

[0016] Each of the three resin molding modules 3 is provided with a lower mold LM that can be raised and lowered, and an upper mold UM that is arranged opposite the lower mold LM. The upper mold UM and lower mold LM are included in the molding mold M. Each of the resin molding modules 3 has a mold clamping mechanism 35 (circular portion indicated by a two-dot chain line) that clamps and opens the upper mold UM and lower mold LM. The lower mold LM and upper mold UM are clamped and opened by moving relatively by the mold clamping mechanism 35. The lower mold LM has a lower mold cavity MC (corresponding to the "cavity" of the present invention) into which a release film F (an example of the "planar member" of the present invention) and a resin material R (see Figure 3) are supplied. The unmolded substrate Sa becomes a molded substrate Sb by being resin-sealed with the resin material R.

[0017] The resin supplying module 2 is provided with an XY table 21, a release film supplying mechanism 22 that supplies a release film F onto the XY table 21, a cleaning mechanism 23 that cleans the lower surface and inner surface of the resin material containing frame 60 (described later), a resin containing section 24 that includes the resin material containing frame 60 and the release film F, a containing frame transport mechanism 25 that transports the resin material containing frame 60, a feeding mechanism 26 that feeds resin material R into the resin containing section 24, and a resin transport mechanism 27 that transports the resin containing section 24 or the resin material containing frame 60. The XY table 21 moves in the X and Y directions within the resin supplying module 2.

[0018] [Configuration of Resin Material Supply Mechanism] Next, the configuration of the resin material supply mechanism 6 that supplies the resin material R to the release film F used in resin molding will be described. As shown in the upper and lower diagrams of FIG. 2, the resin material supply mechanism 6 has a resin material containing frame 60. The resin material containing frame 60 has an inner frame portion 61 and an outer frame portion 62. The inner frame portion 61 is made of a metal member and has through holes 63 that run through it from top to bottom. The outer frame portion 62 is also made of a metal member and is provided on its underside with a holding portion 64 that holds the release film F.

[0019] A lower edge 61a is formed on the edge of the lower end portion of the inner frame portion 61 on the through-hole 63 side. The lower edge 61a is configured to extend downward further than the lower end portion of the inner frame portion 61 other than the portion where the lower edge 61a is formed. With this configuration, the lower end of the lower edge 61a becomes the lower end of the inner frame portion 61. The inner surface of the through-hole 63 is preferably processed to form fine irregularities on the surface by, for example, blasting or the like, or is coated so as to make it difficult for dust to adhere, but this is not limited to this.

[0020] In this embodiment, the outer peripheral surface of the inner frame portion 61 is provided with a recessed portion 65 that recesses inward along the entire circumference. Furthermore, the inner peripheral surface of the outer frame portion 62 is provided with a protruding portion 66 that protrudes toward the recessed portion 65 of the inner frame portion 61 along the entire circumference. The recessed portion 65 is configured to allow the protruding portion 66 to fit within it. The inner frame portion 61 is supported by the outer frame portion 62 by the protruding portion 66 fitting within the recessed portion 65. The vertical length of the protruding portion 66 is configured to be shorter than the distance from the top to the bottom of the recessed portion 65. In other words, the protruding portion 66 is configured to be movable up and down in the space between the top and bottom of the recessed portion 65. With this configuration, the outer frame portion 62 supports the inner frame portion 61 on its inner surface so that it can move up and down. Furthermore, in this embodiment, the protruding portion 66 is formed with a groove 67 that extends along the outer peripheral surface of the inner frame portion 61. The grooves 67 are provided with cylindrical rollers 68 that extend in the extension direction of the grooves 67 and are fitted into the grooves 67. The grooves 67 and the rollers 68 are configured so that a portion of the rollers 68 protrudes from the grooves 67, and the portion of the rollers 68 that protrudes from the grooves 67 contacts the outer frame 62. With this configuration, as the convex portions 66 move up and down relative to the concave portions 65, the rollers 68 rotate around an axis extending in the extension direction, allowing the inner frame 61 to smoothly rise and fall relative to the outer frame 62. Furthermore, because a portion of the rollers 68 protrudes from the grooves 67, the vertically extending surfaces of the convex portions 66 and the vertically extending surfaces of the concave portions 65 can be maintained apart, making it possible to avoid damage caused by rubbing between them and more suitably allowing the inner frame 61 to rise and fall relative to the outer frame 62.

[0021] As shown in the upper diagram of FIG. 2, when the inner frame portion 61 moves downward relative to the outer frame portion 62, the height position of the lower surface of the inner frame portion 61 is configured to be lower than the height position of the lower surface of the outer frame portion 62 on which the holding portion 64 is provided. With this configuration, as shown in the lower diagram of FIG. 2 and FIG. 3, when the release film F is attached to the lower surface of the outer frame portion 62, the inner frame portion 61 moves downward relative to the outer frame portion 62 due to its own weight, and the lower surface of the inner frame portion 61 abuts against the upper surface of the release film F. Because the inner frame portion 61 is configured to be able to abut against the release film F in this way, the lower surface of the inner frame portion 61 and the release film F are closely attached to each other. When the inner frame portion 61 abuts against the release film F, the space surrounded by the through-hole 63 of the inner frame portion 61 and the release film F constitutes a resin material containing portion S into which the resin material R is introduced. Here, the release film F is made of a deformable film material. When the release film F is held on the lower surface of the outer frame portion 62, the upper surface of the portion of the release film F surrounded by the through-holes 63 of the inner frame portion 61 is flat.

[0022] 3, a feeding mechanism 26 is provided to feed resin material R into the resin material storage section S. In this embodiment, granular resin is used as the resin material R, but other types of resin may also be used, such as powder, granular, or paste-like resin, or resin that is liquid at room temperature (liquid resin).

[0023] [Configuration of Dust Suppression Unit] As shown in FIGS. 2 and 3 , the resin material supply mechanism 6 further includes a dust suppression unit 70 that suppresses dust from entering the gap G between the inner frame 61 and the outer frame 62. In this embodiment, the dust suppression unit 70 includes a lid 71 that covers the gap G between the inner frame 61 and the outer frame 62 from above. Covering the upper end of the gap G with the lid 71 makes it difficult for dust to enter the gap G. This prevents dust that enters the gap G and passes downward through the gap G from falling from the lower end of the gap G. As a result, it is possible to reduce dust falling downward along the transport path of the resin material containing frame 60. As shown in FIG. 6 , in this embodiment, the lid 71 is composed of two members. Each of the two members is U-shaped in a plan view, and the two members are combined to form a rectangular frame. In this embodiment, the two members are composed of plate-shaped metal members. However, this is not limited thereto and may be composed of, for example, a resin member or a glass member.

[0024] The two lid bodies 71 are fastened to the upper surface of the outer frame portion 62 with multiple bolts Bo. As shown in Figures 2 and 3, the upper end portion of the inner frame portion 61 is formed with an upper edge portion 61b that is the edge on the through-hole 63 side, and a step portion 61c having a surface positioned lower than the upper surface of the upper edge portion 61b. The lid body 71 is configured to cover the upper side of the gap G between the inner frame portion 61 and the outer frame portion 62 and the upper side of the step portion 61c of the inner frame portion 61.

[0025] Furthermore, a dust containing section 72 configured to contain dust that has entered the gap G between the inner frame section 61 and the outer frame section 62 is provided in a portion of the inner frame section 61 above the recess 65. As shown in FIG. 6 , in this embodiment, the dust containing section 72 is configured as a groove that surrounds the outer periphery of the through-hole 63 in the inner frame section 61. With this configuration, dust that has entered between the inner frame section 61 and the lid body 71 is contained in the dust containing section 72. In this embodiment, as shown in FIG. 2 and other figures, the dust containing section 72 is formed on the upper surface of the step section 61c of the inner frame section 61. In other words, the dust containing section 72 is formed in a portion that is located closer to the upper edge section 61b of the inner frame section 61 than the gap G between the inner frame section 61 and the outer frame section 62. In other words, the dust containing section 72 is located midway along the path that dust that has entered between the upper edge section 61b and the lid body 71 takes to reach the gap G. As a result, dust that has entered between the lid body 71 and the inner frame portion 61 is accommodated (falls) in the dust accommodation portion 72, making it difficult for the dust to reach the gap G. With such a configuration, it is possible to reduce the chance that the dust that has entered the gap G will fall downward along the conveyance path of the resin material accommodation frame 60. In addition, because it is difficult for the dust to reach the gap G, the dust is prevented from adhering to the rollers 68.

[0026] [Operation of Resin Material Supply Mechanism] 2 to 4, the operation of supplying resin material R to the lower mold cavity MC using the resin material supply mechanism 6 will be described. FIGS. 2 and 3 will describe the operation of supplying resin onto a release film F in the resin supply module 2. The upper diagram in FIG. 2 shows the coating process. In the coating process, a long release film F supplied from a release film supply mechanism 22 (see FIG. 1) is coated onto the XY table 21. After coating with the release film F, the release film F is adsorbed onto the XY table 21 by an adsorption mechanism (not shown). The release film F is cut, leaving only the necessary portion of the release film F.

[0027] The frame transport mechanism 25 is used to move the resin material storage frame 60 above the XY table 21 and stop it. This movement of the resin material storage frame 60 may be performed simultaneously with the coating process, or may be performed before or after the coating process. At this time, the upper surfaces of the recesses 65 of the inner frame 61 abut against the upper surfaces of the protrusions 66 of the outer frame 62, and the inner frame 61 is positioned at its lowest position relative to the outer frame 62. Furthermore, the lower surface (lower end) of the lid 71 is positioned at a height lower than the upper surface (upper end) of the upper edge 61b of the inner frame 61. Here, in this embodiment, the edge of the lid 71 facing the upper edge 61b is configured to be able to abut against the upper edge 61b. This configuration is preferable in that it can reduce the intrusion of dust between the lid 71 and the upper edge 61b, but is not limited thereto. For example, the edge facing the upper edge 61b may be configured to be spaced apart from the upper edge 61b. After the covering step, the abutting step is carried out.

[0028] The lower diagram in FIG. 2 shows the contact step. In the contact step, the containing frame transport mechanism 25 lowers the resin material containing frame 60 toward the XY table 21. As the resin material containing frame 60 descends, the lower surface of the inner frame portion 61 first comes into contact with the release film F. As the resin material containing frame 60 further descends, the outer frame portion 62 also descends. At this time, the descent of the inner frame portion 61, which is in contact with the release film F, is stopped, so the upper surfaces of the convex portions 66 of the outer frame portion 62 move away from the upper surfaces of the concave portions 65 of the inner frame portion 61, and the outer frame portion 62 descends relative to the inner frame portion 61. As the resin material containing frame 60 further descends, the lower surface of the outer frame portion 62 comes into contact with the release film F, and the descent of the resin material containing frame 60 ends here. At this time, in this embodiment, the surface of the lid body 71 facing the upper surface of the stepped portion 61c is configured to abut against the upper surface of the stepped portion 61c. Such a configuration is preferable in that it makes it possible to reduce the intrusion of dust from between the lid body 71 and the step portion 61c, but is not limited to this. For example, a configuration may be adopted in which a gap is formed between the surface facing the upper surface of the step portion 61c and the upper surface of the step portion 61c. After the abutting step, a resin pouring step is carried out.

[0029] The upper diagram in FIG. 3 shows the resin charging process. Here, with the resin material containing frame 60 placed on the release film F, the lower opening of the through-hole 63 of the inner frame portion 61 is covered from below by the release film F. As a result, the space surrounded by the through-hole 63 of the inner frame portion 61 and the release film F becomes the resin material containing portion S into which the resin material R is charged. In the resin charging process, a predetermined amount of resin material R is charged from the charging mechanism 26 into the resin material containing portion S. In this embodiment, granular resin is used as the resin material R. After the resin charging process, a conveying process is carried out. The dust includes, for example, resin with a particle size sufficiently smaller than that of the granular resin. In this case, a large amount of dust floats while the resin material R is being charged from the charging mechanism 26.

[0030] The lower diagram in Figure 3 shows the conveying process. In the conveying process, first, the XY table 21 releases the release film F from suction. Furthermore, the release film F is sucked using the holding portion 64 provided on the outer frame portion 62 of the resin material containing frame 60, so that the release film F is adsorbed to the underside of the outer frame portion 62. In this state, the resin containing portion 24 is lifted and raised by the resin conveying mechanism 27. As the resin containing portion 24 rises, the inner frame portion 61 moves downward relative to the outer frame portion 62 along the inner surface of the outer frame portion 62 due to its own weight. The inner frame portion 61 moves downward relative to the outer frame portion 62 until the lower end of the lower edge portion 61a abuts against the release film F, and then stops. The resin material R is conveyed on the release film F while remaining contained in the area surrounded by the through-holes 63 of the inner frame portion 61, i.e., the resin material containing portion S. By doing so, the inner frame portion 61 prevents the resin material R from moving from the resin material storage portion S toward the outside (outer frame portion 62). In other words, it is possible to prevent the resin material R from getting between the lower surface of the inner frame portion 61 and the upper surface of the release film F when the lower surface of the inner frame portion 61 and the release film F are in close contact with each other. Therefore, the resin material R stored in the resin material storage portion S can be stably transported by the resin transport mechanism 27 without the resin material R adhering to the lower surface of the inner frame portion 61. The transport process transports the resin material R toward the lower mold cavity MC.

[0031] FIG. 4 illustrates the operation of supplying resin material R to the lower mold cavity MC of the resin molding module 3. The upper diagram of FIG. 4 shows the resin lowering process. First, as shown in the upper diagram of FIG. 4, the resin conveying mechanism 27 is used to move the resin storage section 24 to a predetermined position above the lower mold LM and stop it. In this state, the release film F and resin material R are pressed downward a predetermined distance by the weight of the inner frame portion 61. The lower mold LM has a lower mold cavity MC into which the resin material R and release film F are supplied. Here, the lower mold LM has a base block LM1, a frame-shaped side block LM2 provided on the base block LM1, and a cavity block LM3 arranged within the side block LM2. The lower mold cavity MC is composed of the side block LM2 and the cavity block LM3. The lower mold cavity MC is sized so that the lower edge portion 61a of the inner frame portion 61 can be inserted into the lower mold cavity MC.

[0032] The middle diagram in Figure 4 shows the resin supplying process. In this process, resin material R is supplied into the lower mold cavity MC. The resin transport mechanism 27 lowers the resin accommodation section 24, supplying the release film F and resin material R together into the lower mold cavity MC. The resin accommodation section 24 stops descending when the lower surface of the inner frame section 61 (excluding the lower edge 61a) and the lower surface of the outer frame section 62 abut against the upper surface of the side block LM2. The depth d1 of the lower mold cavity MC is configured to be deeper (longer) than the difference d2 in height between the contact position where the lower end of the lower edge 61a of the inner frame section 61 abuts against the release film F and the holding section 64. Therefore, the portion of the release film F where the resin material R is placed is separated from the bottom surface of the lower mold cavity MC (the upper surface of the cavity block LM3). This configuration makes it possible to prevent the resin material R from being melted by the highly heated cavity block LM3 when it is in contact with the resin material storage frame 60 (inner frame portion 61), and the molten resin material R from adhering to the resin material storage frame 60 (inner frame portion 61).

[0033] The lower diagram in Figure 4 shows the resin heating process. The suction by the holding unit 64 attached to the outer frame 62 of the resin material containing frame 60 is stopped, the release film F is released from its suction to the outer frame 62, and the release film F is sucked by the suction unit 31 attached to the lower mold LM. At this time, the release film F, which had been separated from the bottom surface of the lower mold cavity MC (the upper surface of the cavity block LM3), is held by the lower mold LM so that it is in contact with the bottom surface of the lower mold cavity MC. This causes the resin material R to be heated by the cavity block LM3, which is heated by a heater (not shown). The release film F is then released from its suction to the outer frame 62, and the resin material containing frame 60 is raised by the resin conveying mechanism 27. The release film F and resin material R are left in the lower mold LM and the lower mold cavity MC. In other words, the resin material R on the release film F is supplied to the lower mold cavity MC. The resin conveying mechanism 27 places the raised resin material containing frame 60 on a table (not shown) of the resin supply module 2. The resin material containing frame 60 placed on the table will be used in the subsequent supply process of the resin material R.

[0034] 5 illustrates the configuration of the molding die M in the resin molding module 3 and the resin sealing operation. The upper diagram in FIG. 5 shows the pre-molded substrate lowering process. A pre-molded substrate Sa, to which chips and the like are fixed, is attached to the lower surface of the upper die UM, which is arranged opposite the lower die LM. A sealing member or the like may be provided between the lower surface of the upper die UM and the upper surface of the lower die LM to isolate the lower die cavity MC from the outside air when the die is clamped.

[0035] The lower diagram of FIG. 5 shows the mold clamping process. The upper mold UM and the lower mold LM are heated by a heater (not shown), and the temperatures of the upper mold UM and the lower mold LM are maintained at a constant temperature, for example, 185°C. The thermosetting resin material R supplied to the lower mold cavity MC is heated by the lower mold LM, and the resin material R becomes molten. The mold clamping mechanism 35 (see FIG. 1) clamps the upper mold UM and the lower mold LM, which form the molding mold M. In this embodiment, the lower mold LM rises to clamp the mold. Specifically, as the lower mold LM rises, the pre-molded substrate Sa abuts against the side block LM2. As the lower mold LM further rises against the biasing force of the spring member Sp, chips and other components fixed to the pre-molded substrate Sa are immersed in the molten resin material R in the lower mold cavity MC. In this mold clamped state, the upper mold UM and the lower mold LM continue to heat the molten resin material R, causing the molten resin material R in the lower mold cavity MC to harden. That is, with the pre-molded substrate Sa and the release film F having the resin material R placed between the upper mold UM and the lower mold LM, the mold M is clamped and resin-sealed. As a result, the chips and the like fixed to the pre-molded substrate Sa are resin-sealed with the resin material R in the lower mold cavity MC to become the molded substrate Sb (see Figure 1). Resin molding is achieved by resin-sealing.

[0036] [Another embodiment] Hereinafter, another embodiment in which the above embodiment is modified will be exemplified.

[0037] (1) In the above embodiment, an example has been described in which the outer peripheral surface of the inner frame portion 61 is provided with recesses 65 recessed inward, and the inner peripheral surface of the outer frame portion 62 is provided with protrusions 66 protruding toward the recesses 65 of the inner frame portion 61. However, the present invention is not limited to the above embodiment. For example, as shown in Fig. 7, a configuration may be adopted in which the inner frame portion 61 is provided with protrusions 81 protruding toward the outer frame portion 62, and the outer frame portion 62 is provided with recesses 82 configured to allow the protrusions 81 to fit into.

[0038] (2) In the above embodiment, the dust collection section 72 is formed on the upper surface of the stepped portion 61c of the inner frame portion 61, but the present invention is not limited to the above embodiment. For example, as shown in FIG. 8 , the dust collection section 72 may be formed on the upper surface of the protrusion 66 of the outer frame portion 62. The dust collection section 72 may also be formed on the surface of the outer frame portion 62 that contacts the lower surface of the lid body 71. Furthermore, the dust collection section 72 may also be formed on both the inner frame portion 61 and the outer frame portion 62.

[0039] (3) In the above embodiment, the lid 71 is fastened to the upper surface of the outer frame 62 by the bolts Bo, but the present invention is not limited to the above embodiment. For example, the lid 71 may be fastened to the upper surface of the inner frame 61 by the bolts Bo.

[0040] (4) Although the lid body 71 is configured by two members and is configured to form a rectangular frame by combining the two lid bodies 71 in the above example, the present invention is not limited to the above embodiment. For example, the lid body 71 may be configured by a single rectangular frame body, or may be configured by three or more members.

[0041] (5) In the above embodiment, the lid 71 is provided so as to surround the outer periphery of the through-hole 63 as shown in Fig. 6, but the present invention is not limited to the above embodiment. For example, the lid 71 may be provided only on a portion of the inner frame 61 shown in Fig. 6 that extends along the long side, or may be provided only on a portion of the inner frame 61 that extends along the short side.

[0042] (6) In the above embodiment, the outer peripheral surface of the inner frame portion 61 is provided with a recess 65 recessed inward along the entire circumference, and the inner peripheral surface of the outer frame portion 62 is provided with a protrusion 66 protruding toward the recess 65 of the inner frame portion 61 along the entire circumference. However, the present invention is not limited to the above embodiment. The recess 65 may be provided on a portion of the outer peripheral surface of the inner frame portion 61, and the protrusion 66 may be provided on a portion of the inner peripheral surface of the outer frame portion 62. For example, the recess 65 and the protrusion 66 may be provided only on portions of the inner frame portion 61 and the outer frame portion 62 extending along the long sides shown in FIG. 6, or only on portions of the inner frame portion 61 and the outer frame portion 62 extending along the short sides.

[0043] (7) In the above embodiment, the dust collection section 72 is configured as a groove surrounding the outer periphery of the through-hole 63 in the inner frame section 61. However, the present invention is not limited to the above embodiment. For example, the dust collection section 72 may be provided only in the portion of the inner frame section 61 that extends along the long side, or only in the portion of the inner frame section 61 that extends along the short side, as shown in FIG. 6 . Furthermore, the dust collection section 72 may be configured as a bowl-shaped depression that is recessed downward, or may be configured as a cylindrical hole.

[0044] (8) In the above embodiment, the resin material storage frame 60 is transported using the storage frame transport mechanism 25 in the covering process and the abutting process, and the resin storage section 24 or the resin material storage frame 60 is transported using the resin transport mechanism 27 in the transport process, resin lowering process, resin supply process, and resin heating process. However, the present invention is not limited to the above embodiment, and the resin storage section 24 or the resin material storage frame 60 may be transported using the same transport device in any of the processes.

[0045] (9) In the above embodiment, the resin accommodation unit 24 includes the resin material accommodation frame 60 and the release film F. However, the resin accommodation unit 24 may include a flat heat sink (an example of a "planar member" of the present invention) in addition to the resin material accommodation frame 60 and the release film F. In this case, the resin material accommodation frame 60 holds the heat sink on its underside. The resin material accommodation frame 60 holding the heat sink is placed on the release film F. As a result, the heat sink is placed on the release film F, and the resin material accommodation frame 60 is placed on the heat sink. In this manner, the resin accommodation unit 24 is realized using the resin material accommodation frame 60, the release film F, and the heat sink. In this case, the resin material R is supplied onto the heat sink. The lower mold LM of the molding mold M is clamped with the release film F, the heat sink, and the resin material R placed on it. The heat sink is made of, for example, a metal with high thermal conductivity. The heat sink is exposed on the molded substrate Sb, and heat generated within the molded substrate Sb is dissipated via the heat sink. In a configuration in which the resin containing portion 24 is realized using the resin material containing frame 60, the release film F, and the heat sink, the heat sink functions as a planar member.

[0046] (10) In the above embodiment, the inner frame 61 is provided with the grooves 67 and rollers 68, but the present invention is not limited to the above embodiment. For example, as shown in Fig. 8, the outer frame 62 may be provided with the grooves 67 and rollers 68, or the outer frame 62 may not be provided with the grooves 67 and rollers 68.

[0047] The configurations disclosed in the above embodiments (including other embodiments, the same applies hereinafter) can be applied in combination with configurations disclosed in other embodiments, unless a contradiction arises. Furthermore, the embodiments disclosed in this specification are merely examples, and the present invention is not limited to these, and can be modified as appropriate within the scope of the purpose of the present invention.

[0048] [Summary of the above embodiment] The resin material supply mechanism 6, the resin molding device 1, and the manufacturing method described in the above embodiment will be outlined below.

[0049] <1> One aspect of the resin material supply mechanism (6) is a resin material supply mechanism (6) that supplies a resin material (R) to a cavity (MC) using a planar member (F), and is provided with an inner frame portion (61) that has a through hole (63) that penetrates vertically and that abuts against the planar member (F) to form a space into which the resin material (R) is poured by the through hole (63) and the planar member (F), an outer frame portion (62) that supports the inner frame portion (61) on its inner surface so that it can be raised and lowered, and a dust suppression portion (70) that suppresses dust from entering the gap (G) between the inner frame portion (61) and the outer frame portion (62).

[0050] The resin material supply mechanism (6) of this embodiment is provided with a dust suppression portion (70) that suppresses dust from entering the gap (G) between the inner frame portion (61) and the outer frame portion (62). The gap (G) between the inner frame portion (61) and the outer frame portion (62) of this resin material supply mechanism (6) is formed so as to penetrate from the top to the bottom of the inner frame portion (61) and the outer frame portion (62). Therefore, the dust suppression portion (70) can reduce dust from entering the gap (G) between the inner frame portion (61) and the outer frame portion (62). As a result, the amount of dust passing through the gap (G) can be reduced, and the amount of dust falling below the transport path of the resin material container frame (60) can be reduced, making it possible to prevent the area below the transport path from becoming dirty.

[0051] <2> the above <1> In the resin material supply mechanism (6) described above, it is preferable that the dust suppression portion (70) has a lid (71) that covers the gap (G) between the inner frame portion (61) and the outer frame portion (62) from above.

[0052] According to this, the dust suppression part (70) is configured with a lid (71) that covers from above the gap (G) between the inner frame part (61) and the outer frame part (62). The simple configuration of the lid (71) makes it possible to reduce dust that gets into the gap (G) between the inner frame part (61) and the outer frame part (62), which is useful for reducing the number of steps and costs involved in attaching the lid (71).

[0053] <3> the above <1> or <2> In the resin material supply mechanism (6) described above, it is preferable that a dust storage section (72) is provided in either or both of the inner frame section (61) and the outer frame section (62) and configured to be able to store dust.

[0054] This allows, for example, dust that has entered the gap (G) between the inner frame portion (61) and the outer frame portion (62) to be accommodated in the dust accommodation portion (72). This configuration makes it possible to reduce the amount of dust that moves toward the gap (G) and passes through the gap (G). As a result, it is possible to reduce the amount of dust that passes through the gap (G) and falls below the conveyance path of the resin material accommodation frame (60).

[0055] <4> the above <3> In the resin material supply mechanism (6) described in the above, it is preferable that the outer frame portion (62) has a convex portion (66) protruding toward the inner frame portion (61), the inner frame portion (61) has a concave portion (65) configured to allow the convex portion (66) to enter, the dust collection portion (72) is provided in a portion of the inner frame portion (61) above the concave portion (65), and when the upper surface of the convex portion (66) abuts against the upper surface of the concave portion (65), the lower end of the dust suppression portion (70) is located at a height position lower than the upper end of the inner frame portion (61).

[0056] This makes it possible to realize a configuration in which the outer frame portion (62) supports the inner frame portion (61) so that it can be raised and lowered, using a simple configuration in which the convex portions (66) of the outer frame portion (62) fit into the concave portions (65) of the inner frame portion (61). When the upper surfaces of the convex portions (66) abut the upper surfaces of the concave portions (65), the inner frame portion (61) is positioned at its lowest position relative to the outer frame portion (62). At this time, because the lower end of the dust suppression portion (70) is positioned at a height lower than the upper end of the inner frame portion (61), the dust suppression portion (70) can prevent dust from entering the gap (G) between the inner frame portion (61) and the outer frame portion (62) even when the inner frame portion (61) is positioned at its lowest position relative to the outer frame portion (62).

[0057] <5> the above <1> from <4> In the resin material supply mechanism (6) described in any one of the above, it is preferable that the outer frame portion (62) has a holding portion (64) that holds the planar member (F), and when the inner frame portion (61) is lowered relative to the outer frame portion (62), the lower end of the inner frame portion (61) is positioned lower than the height position of the holding portion (64) of the outer frame portion (62).

[0058] As a result, the lower end of the inner frame portion 61 is configured to be located lower than the height position of the holding portion 64 of the outer frame portion 62. With this configuration, when the planar member F is held by the holding portion 64, the lower end of the inner frame portion 61 abuts against the upper surface of the planar member F. As a result, the lower end of the inner frame portion 61 and the upper surface of the planar member F are in close contact with each other, making it possible to prevent the resin material R introduced into the space defined by the through-hole 63 and the planar member F from moving out of the space.

[0059] <6> One embodiment of the resin molding device (1) is the above <1> from <5> The molding die (M) is provided with a resin material supply mechanism (6) described in any one of the above, an upper mold (UM), a lower mold (LM) arranged opposite the upper mold (UM), the cavity (MC) arranged in the lower mold (LM), and a mold clamping mechanism (35) that clamps a molding die (M) having at least the upper mold (UM) and the lower mold (LM), and the resin material supply mechanism (6) supplies the resin material (R) to the cavity (MC) using the planar member (F).

[0060] In the resin molding apparatus (1) of this embodiment, it is possible to supply the resin material (R) to the cavity (MC) using the resin material supply mechanism (6) having the above-mentioned effects.

[0061] <7> the above <6> In the resin molding apparatus (1) described above, the outer frame portion (62) has a holding portion (64) that holds the planar member (F), and when the inner frame portion (61) abuts against the planar member (F) while the holding portion (64) is holding the planar member (F), the lower end of the inner frame portion (61) is configured to be located at an abutment position that is lower than the height position of the holding portion (64) of the outer frame portion (62), and the depth (d1) of the cavity (MC) is preferably configured to be deeper than the difference in height between the holding portion (64) and the abutment position.

[0062] With this, when the resin material (R) is supplied to the cavity (MC) using the resin material supply mechanism (6) with the planar member (F) held by the holding portion (64), the lower end of the inner frame portion (61) is separated from the cavity (MC). As a result, when the resin material (R) is present in the space defined by the through-holes (63) of the inner frame portion (61) and the planar member (F), it is possible to prevent the resin material (R) from melting due to heating by the cavity (MC).

[0063] <8> One embodiment of the manufacturing method is the above <6> or <7> The method for manufacturing a resin molded product using the resin molding apparatus (1) described above includes a step of supplying the resin material (R) to the planar member (F), and a step of supplying the resin material (R) to the cavity (MC) using the planar member (F).

[0064] In the manufacturing method of this embodiment, it is possible to manufacture a resin molded product using the resin molding device (1) having the above-mentioned effects. [Industrial Applicability]

[0065] The present disclosure can be used in a resin material supply mechanism, a resin molding device, and a manufacturing method. [Explanation of symbols]

[0066] 1:Resin molding equipment 6:Resin material supply mechanism 35: Mold clamping mechanism 61: Inner frame 62: Outer frame 63: Through hole 64: Holding part 65: Recess 66: Convex part 70 :Dust suppression part 71: Lid 72: Dust collection section 81: Convex part 82: Recess G: Gap M: Molding mold MC: Lower mold cavity (cavity) LM: Lower mold UM: Upper mold R: Resin material F: Release film (flat surface) Sb: Molded substrate (plastic molded product)

Claims

1. A resin material supply mechanism that supplies a resin material to a cavity using a planar member, an inner frame portion having a through hole penetrating vertically and abutting against the planar member to define a space into which the resin material is poured by the through hole and the planar member; an outer frame portion that supports the inner frame portion on an inner surface thereof so that the inner frame portion can be raised and lowered; a dust suppression portion that suppresses dust from entering a gap between the inner frame portion and the outer frame portion; a dust collection section provided in either or both of the inner frame section and the outer frame section, the dust collection section being configured to be able to collect dust;

2. The resin material supply mechanism according to claim 1 , wherein the dust suppression section has a lid that covers the gap between the inner frame section and the outer frame section from above.

3. the outer frame portion has a protrusion protruding toward the inner frame portion, the inner frame portion has a recess configured so that the protrusion can fit therein, the dust storage section is provided in a portion of the inner frame section above the recessed section, The resin material supply mechanism according to claim 1 , wherein when the upper surface of the convex portion abuts against the upper surface of the concave portion, the lower end of the dust suppression portion is located at a height position lower than the upper end of the inner frame portion.

4. the outer frame portion has a holding portion that holds the planar member, 2. The resin material supply mechanism according to claim 1, wherein when the inner frame portion is lowered relative to the outer frame portion, the lower end of the inner frame portion is positioned below the height position of the holding portion of the outer frame portion.

5. The resin material supply mechanism according to any one of claims 1 to 4; an upper mold, a lower mold provided opposite to the upper mold, the cavity provided in the lower mold, and a mold clamping mechanism that clamps a molding mold having at least the upper mold and the lower mold, The resin material supply mechanism is a resin molding device that supplies the resin material to the cavity using the planar member.

6. A molding die comprising: a resin material supply mechanism that supplies resin material to a cavity using a planar member; an upper mold; a lower mold that is disposed opposite the upper mold; the cavity that is disposed in the lower mold; and a mold clamping mechanism that clamps a molding die having at least the upper mold and the lower mold; The resin material supply mechanism includes: an inner frame portion having a through hole penetrating vertically and abutting against the planar member to define a space into which the resin material is poured by the through hole and the planar member; an outer frame portion that supports the inner frame portion on an inner surface thereof so that the inner frame portion can be raised and lowered; a dust suppression portion that suppresses dust from entering a gap between the inner frame portion and the outer frame portion, the outer frame portion has a holding portion that holds the planar member, when the inner frame portion is in contact with the planar member in a state in which the holding portion is holding the planar member, a lower end of the inner frame portion is positioned at an abutment position of the outer frame portion that is lower than a height position of the holding portion, A resin molding device configured so that the depth of the cavity is greater than the difference in height between the holding portion and the abutting position.

7. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 5, supplying the resin material to the planar member; and supplying the resin material to the cavity using the planar member.

8. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 6, supplying the resin material to the planar member; and supplying the resin material to the cavity using the planar member.

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