Resin composition and printed circuit board containing the same

Abstract

A resin composition according to one embodiment of the present application comprises an epoxy resin; a curing agent including a cyanate ester resin and a phenolic resin; inorganic particles including silica particles; and a curing accelerator, the weight ratio of the cyanate ester resin to the phenolic resin being 95:5 to 40:60, and the curing accelerator simultaneously including an imidazole compound and a metal compound.

Description

[Technical Field]

[0001] This application claims the benefit of the filing date of Korean Patent Application No. 10-2022-0147208, filed with the Korean Intellectual Property Office on November 7, 2022, the entire contents of which are incorporated herein by reference.

[0002] The present application relates to a resin composition and a printed circuit board including the same. [Background technology]

[0003] Typically, double-sided printed circuit boards are based on copper clad laminate (CCL), which is made by laminating copper foil on both sides of an insulating material. Holes are drilled to connect electrical signals to the copper foil on both sides, and the copper foil on both sides is connected by a plating layer using electrolytic copper plating. After that, a UV-sensitive dry film is applied to form the circuit and selectively patterned by UV irradiation. This is then etched to form a circuit pattern on the copper foil on both sides, and a photoimagable solder resist (PSR) is applied for insulation. The double-sided printed circuit board can be manufactured through a process of performing surface treatment such as gold plating on the surface on which the final components will be mounted.

[0004] In addition, a multilayer printed circuit board is the same as a double-sided board up to the circuit formation stage, but after forming the circuit pattern, instead of applying PSR on it, it can be manufactured by laminating one prepreg and one copper foil on top of each other and then heating and pressing them. Therefore, the multilayer printed circuit board refers to a build-up board in which PCBs are formed in multiple layers.

[0005] In this case, the multilayer printed circuit board can be manufactured by forming via holes that electrically connect the inner layer circuit patterns and the outer layer circuit patterns through laser processing and forming plating layers on the inner surfaces of the via holes. Thereafter, if necessary, a solder resist layer can be further formed on the plating layer as a protective layer, or more outer layers can be further formed.

[0006] In this technical field, in order to improve the quality of multilayer printed circuit boards, there is a demand for insulating layers that not only have excellent adhesion to the conductor wiring that constitutes the conductive layer, but also have excellent chemical resistance. Summary of the Invention [Problem to be solved by the invention]

[0007] The present application seeks to provide a resin composition and a printed circuit board including the same. [Means for solving the problem]

[0008] One embodiment of the present application is Epoxy resins; a hardener containing a cyanate ester resin and a phenolic resin; Inorganic particles, including silica particles; and Contains a curing accelerator, the weight ratio of the cyanate ester resin to the phenolic resin is 95:5 to 40:60; The present invention provides a resin composition, wherein the curing accelerator contains both an imidazole compound and a metal compound.

[0009] Another embodiment of the present application provides a printed circuit board comprising the above-mentioned resin composition or a cured product thereof. [Effects of the Invention]

[0010] A resin composition according to an embodiment of the present application can have excellent cured physical properties by using a cyanate ester-based resin and a phenol-based resin in a specific weight ratio as a curing agent and a curing accelerator containing both an imidazole-based compound and a metal-based compound. Furthermore, an insulating film manufactured using the resin composition according to an embodiment of the present application can have an appropriate surface roughness by desmearing, and is therefore characterized by excellent copper foil adhesion.

[0011] Therefore, by using the resin composition according to one embodiment of the present application, it is possible to manufacture a multilayer printed circuit board having excellent wiring adhesion, chemical resistance, and the like. DETAILED DESCRIPTION OF THE INVENTION

[0012] The present application will now be described in more detail.

[0013] In this application, when a member is said to be located "on" another member, this includes not only when the member is in contact with the other member, but also when there is another member between the two members.

[0014] In this application, when a part is said to "comprise" a certain element, this means that it can further include other elements, but not excluding other elements, unless otherwise specified.

[0015] A method for manufacturing multilayer printed circuit boards (MLPCs) that alternately stacks conductor layers and insulating films has been developed and is currently used for semiconductor packaging. The manufacturing process for such multilayer printed circuit boards involves vacuum laminating a build-up insulating film onto an inner layer circuit, followed by the following steps: precure, drilling, desmear, electroless plating, electrolytic plating, postcure, and outer layer circuit formation. The desmear process removes smears using an acidic solution and also corrodes the surface of the insulating film to a certain extent, creating surface roughness that enhances adhesion with the copper foil layer that will be formed later.

[0016] As the resin composition for the build-up insulating film, a composition in which an epoxy resin and a phenolic hardener were filled with silica particles as an inorganic filler was used in the initial products, but in response to the increasing demand for low dielectric properties and low CTE, products using a cyanate ester hardener in an epoxy resin were developed.

[0017] However, although the cured products of the epoxy resin and cyanate ester resin have advantages such as low CTE and high heat resistance, when used alone, there is a problem that desired surface roughness cannot be achieved through a desmear process.

[0018] Therefore, the present application aims to provide a resin composition that not only has excellent curing properties but also can form a desired surface roughness even after a desmear process, and a printed circuit board including the same.

[0019] A resin composition according to one embodiment of the present application comprises an epoxy-based resin; a curing agent including a cyanate ester-based resin and a phenol-based resin; inorganic particles including silica particles; and a curing accelerator, wherein the weight ratio of the cyanate ester-based resin to the phenol-based resin is 95:5 to 40:60, and the curing accelerator simultaneously includes an imidazole-based compound and a metal-based compound.

[0020] In one embodiment of the present application, the epoxy resin preferably has two or more epoxy groups in one molecule. More specifically, the epoxy resin may include one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, naphthalene epoxy resin, anthracene epoxy resin, biphenyl epoxy resin, tetramethylbiphenyl epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A novolac epoxy resin, bisphenol S novolac epoxy resin, biphenyl novolac epoxy resin, naphthol novolac epoxy resin, naphtholphenol co-condensed novolac epoxy resin, naphthol-cresol co-condensed novolac epoxy resin, aromatic hydrocarbon formaldehyde resin, modified phenol resin epoxy resin, triphenylmethane epoxy resin, tetraphenylethane epoxy resin, dicyclopentadiene-phenol addition reaction epoxy resin, phenol aralkyl epoxy resin, naphthol aralkyl epoxy resin, etc.

[0021] Among these, from the viewpoints of heat resistance, insulation reliability, and adhesion, it is more preferable that the epoxy resin contains one or more of bisphenol A type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, epoxy resin having a butadiene structure, and the like.

[0022] In one embodiment of the present application, the curing agent includes a cyanate ester-based resin and a phenol-based resin.

[0023] The cyanate ester resin may include at least one selected from novolac-type (phenol novolac-type, alkylphenol novolac-type, etc.) cyanate ester-type resins, dicyclopentadiene-type cyanate ester-type resins, bisphenol-type (bisphenol A-type, bisphenol F-type, bisphenol S-type, bisphenol M-type, etc.) cyanate ester-type resins, and prepolymers of these resins partially converted to triazine.

[0024] More specifically, the cyanate ester resins include bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethyl The resin composition may include one or more selected from the group consisting of bifunctional cyanate resins such as 1,3-bis(4-cyanatophenyl-1-(methylethylidene))benzene, bis(4-cyanatophenyl)thioether, and bis(4-cyanatophenyl)ether; polyfunctional cyanate resins derived from phenol novolac, cresol novolac, and phenolic resins containing a dicyclopentadiene structure; and prepolymers of these cyanate resins partially converted to triazine.

[0025] The weight average molecular weight of the cyanate ester resin may be, but is not limited to, 500 g / mol to 4,500 g / mol, or 600 g / mol to 3,000 g / mol.

[0026] In the present application, the weight average molecular weight can be measured by gel permeation chromatography (GPC) (polystyrene equivalent).

[0027] The phenolic resin may be a novolac-type phenolic resin, which is a compound having a phenol skeleton or a naphthol skeleton and has excellent heat resistance, water resistance, etc. More specifically, the phenolic resin may be a novolac resin such as a phenol novolac resin, a bisphenol A novolac resin, a cresol novolac resin, a phenol-modified xylene resin, an alkylphenol resin, or a phenol-modified melamine resin.

[0028] In one embodiment of the present application, the weight ratio of the cyanate ester-based resin to the phenol-based resin may be 95:5 to 40:60, 90:10 to 40:60, or 88:12 to 45:55. If the content of the cyanate ester-based resin is less than 40 wt % based on the total weight of the cyanate ester-based resin and the phenol-based resin, it is not preferable because the cyanate ester-based resin's advantages, such as low dielectric dissipation factor (Df), low CTE, and high heat resistance, cannot be obtained. Furthermore, if the content of the phenol-based resin is less than 5 wt %, it is not preferable because it may be difficult to achieve the desired surface shape through a desmear process.

[0029] In one embodiment of the present application, the weight ratio of the epoxy-based resin to the curing agent may be 60:40 to 20:80, 60:40 to 30:70, or 55:45 to 35:65. When the epoxy-based resin to curing agent weight ratio is satisfied, excellent heat resistance and mechanical properties can be obtained while maintaining low dielectric tangent and low CTE. If the epoxy-based resin content exceeds 60 wt% based on the total weight of the epoxy-based resin and curing agent, a high degree of curing cannot be achieved through heat treatment, making it difficult to obtain excellent dielectric properties and desired cured physical properties. Furthermore, if the curing agent content exceeds 80 wt%, excessive self-crosslinking, in which the cyanate ester-based resin is linked to each other through a triazine structure, may occur, which may result in brittle fracture, making the film more susceptible to cracking after curing.

[0030] In one embodiment of the present application, the inorganic particles include silica particles.

[0031] In one embodiment of the present application, the inorganic particles include only silica particles, and do not include any other inorganic particles other than the silica particles.

[0032] The average particle size of the silica particles may be 0.3 μm or less, 0.2 μm or less, or 0.05 μm or more.

[0033] When silica having an average particle size of 0.3 μm or less or 0.2 μm or less is used as the inorganic particles, it has been difficult to obtain the desired surface roughness by desmearing in the past. However, according to one embodiment of the present application, by satisfying the above-mentioned specific weight ratio of cyanate ester-based resin:phenol-based resin, the desired surface roughness can be obtained by desmearing.

[0034] In conventional wet desmearing, the surface of a resin composition is etched to a certain thickness, resulting in protrusions of inorganic particles or depressions caused by the dropping of inorganic particles. The degree of cure of the resin composition and the size of the inorganic particles are key factors in determining the surface roughness. Typically, when inorganic particles with an average particle size exceeding 0.3 μm are used, a surface roughness of Ra 200 nm or more can be easily achieved by appropriately adjusting the degree of cure of the resin composition so that the surface is well etched by the desmearing. However, when silica with an average particle size of 0.3 μm or less or 0.2 μm or less is used, even if the resin composition is well etched, it is difficult to achieve a surface roughness of Ra 200 nm or more due to the small size of the inorganic particles.

[0035] Meanwhile, when a cyanate ester-based resin and a phenol-based resin are mixed and used at a specific weight ratio as in one embodiment of the present application, the etching rates of the two resins with respect to the desmear solution differ due to differences in curing speed and chemical resistance of the two resins with respect to the epoxy. As a result, non-uniform etching of the surface layer is induced during the desmear process, and a surface roughness of 200 nm or more can be formed regardless of the size of the inorganic particles.

[0036] In one embodiment of the present application, the resin composition may further contain a thermoplastic resin to improve the mechanical strength, film formability, etc. of the cured product. The thermoplastic resin may include one or more selected from phenoxy resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, polyvinyl acetal resin, polyvinyl butyral resin, polyether ether ketone resin, and polyester resin. The thermoplastic resin more preferably includes a phenoxy resin.

[0037] The weight average molecular weight of the thermoplastic resin may be, but is not limited to, 5,000 g / mol to 200,000 g / mol.

[0038] In one embodiment of the present application, the resin composition includes a curing accelerator for efficiently curing the epoxy resin, the curing agent, etc., and the curing accelerator includes both an imidazole-based compound and a metal-based compound. In addition, the curing accelerator may further include one or more selected from an amine-based compound and an organic phosphine-based compound in addition to the imidazole-based compound and the metal-based compound.

[0039] The imidazole-based compound can accelerate the curing reaction of the phenol-based resin in the curing agent, and the metal-based compound can accelerate the curing reaction of the cyanate ester-based resin in the curing agent. That is, since the resin composition according to one embodiment of the present application contains a cyanate ester-based resin and a phenol-based resin as curing agents, if either one of the imidazole-based compound and the metal-based compound is not included as the curing accelerator, the desired surface roughness effect cannot be achieved.

[0040] When the curing accelerator contains both an imidazole-based compound and a metal-based compound, the etching rates of the imidazole-based compound and the metal-based compound with respect to the epoxy resin may differ depending on the difference in curing speed, chemical resistance, etc. As a result, non-uniform etching of the surface layer may be induced during the desmear process, and a surface roughness of 200 nm or more may be formed regardless of the size of the inorganic particles.

[0041] However, if the curing accelerator contains only one of the imidazole-based compound and the metal-based compound, the film may be prone to cracking after curing, and the surface may be over-etched during desmearing, resulting in whitening, which is not preferable.

[0042] The imidazole compounds include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2' -methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2- These may include one or more of phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, and the like.

[0043] Examples of the metal compounds include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. The organometallic complexes may include one or more of cobalt(II) acetylacetonate, cobalt(III) acetylacetonate, copper(II) acetylacetonate, zinc(II) acetylacetonate, iron(III) acetylacetonate, nickel(II) acetylacetonate, and manganese(II) acetylacetonate. The organometallic salts may include one or more of zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0044] Examples of the amine compounds include triethylamine, tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylamino-methyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene.

[0045] The content of the curing accelerator may be 0.01% by weight to 5% by weight based on the total weight of the nonvolatile content of the resin composition.

[0046] In one embodiment of the present application, the resin composition may further include additives known in the art, including, but not limited to, one or more additives selected from the group consisting of a leveling agent, a wetting agent, and an antistatic agent.

[0047] In one embodiment of the present application, the resin composition can be applied to a printed circuit board. More specifically, the resin composition can be applied to an insulating film of a printed circuit board. The insulating film can be used as an interlayer insulating material in a multilayer printed circuit board.

[0048] Another embodiment of the present application provides a printed circuit board comprising the above resin composition or a cured product thereof.

[0049] The printed circuit board may be a multilayer printed circuit board, and the number of layers included in the multilayer printed circuit board is not limited. For example, the multilayer printed circuit board may have a structure of 2 to 20 layers depending on the purpose and application of the multilayer printed circuit board. [Example]

[0050] Hereinafter, the present application will be described in detail with reference to examples in order to specifically explain the present application. However, the examples of the present application can be modified in various different forms, and the scope of the present application should not be construed as being limited to the examples described below. The examples of the present application are provided to more completely explain the present application to those skilled in the art.

[0051] <Example>

[0052] Example 1 70 parts by weight of bisphenol-based epoxy resin (YD-128, KUKDO Chemical), 30 parts by weight of phenol novolac epoxy resin (YDPN-639, KUKDO Chemical), 84 parts by weight of dicyclopentadiene bisphenol-based cyanate ester resin (75% non-volatile MEK solution, CO3CS, TECHIA), 24 parts by weight of biphenyl-based phenolic resin (GPH-65, Nippon Kayaku), 360 parts by weight of silica slurry with an average particle size of 0.18 μm (60% non-volatile MEK solution, K180SX-CM3, ADMATECHS), 20 parts by weight of phenoxy resin (YP-50, KUKDO Chemical), and 110 parts by weight of MEK (methyl ethyl ketone) were mixed and stirred at 250 rpm using a mechanical stirrer for 3 hours.

[0053] Next, 1.0 part by weight of an imidazole-based curing accelerator (2PHZ-PW, Shikoku Chemicals Corporation) and 0.05 part by weight of a metal-based curing accelerator, cobalt(II) acetylacetonate (TCI), were diluted to a concentration of 10% in MEK and added. The mixture was then uniformly dispersed in a high-speed rotating mixer to prepare a coating solution.

[0054] The prepared coating solution was coated on a 38 μm thick PET film using an applicator and then dried at 100° C. for 8 minutes to prepare an insulating film with a thickness of 25 μm.

[0055] <Example 2> An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that 98 parts by weight of a novolac-type cyanate ester resin (MEK solution with 75% non-volatile components, CO5CS, TECHIA) and 12 parts by weight of a biphenyl-based phenolic resin (GPH-65, Nippon Kayaku) were added as the cyanate ester resin in Example 1.

[0056] Example 3 An insulating film was produced using the same content ratio and manufacturing method as in Example 1, except that 56 parts by weight of dicyclopentadiene bisphenol-based cyanate ester resin (MEK solution with 75% non-volatile components, CO3CS, TECHIA) and 48 parts by weight of biphenyl-based phenolic resin (GPH-65, Nippon Kayaku) were added.

[0057] Example 4 An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that 153 parts by weight of dicyclopentadiene bisphenol-based cyanate ester resin (MEK solution with 75% non-volatile components, CO3CS, TECHIA) and 24 parts by weight of biphenyl-based phenolic resin (GPH-65, Nippon Kayaku) were added.

[0058] <Comparative Example 1> In the above Example 1, an insulating film was produced using the same content ratio and manufacturing method as in Example 1, except that 112 parts by weight of a novolac-type cyanate ester resin (MEK solution with 75% non-volatile components, CO5CS, TECHIA) was added as the cyanate ester resin, and no biphenyl-based phenolic resin (GPH-65, Nippon Kayaku) was added.

[0059] <Comparative Example 2> An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that 28 parts by weight of dicyclopentadiene bisphenol-based cyanate ester resin (MEK solution with 75% non-volatile components, CO3CS, TECHIA) and 72 parts by weight of biphenyl-based phenol resin (GPH-65, Nippon Kayaku) were added.

[0060] <Comparative Example 3> An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that the dicyclopentadiene bisphenol-based cyanate ester resin was not added and 97 parts by weight of a biphenyl-based phenolic resin (GPH-65, Nippon Kayaku) was added.

[0061] <Comparative Example 4> An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that 94 parts by weight of dicyclopentadiene bisphenol-based cyanate ester resin (MEK solution with 75% non-volatile components, CO3CS, TECHIA) and 4 parts by weight of biphenyl-based phenolic resin (GPH-65, Nippon Kayaku) were added.

[0062] <Comparative Example 5> An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that the imidazole-based curing accelerator was not added and only a metal-based curing accelerator was added.

[0063] <Comparative Example 6> An insulating film was manufactured using the same content ratio and manufacturing method as in Example 1, except that no metal-based curing accelerator was added as the curing accelerator, and only an imidazole-based curing accelerator was added.

[0064] <Experimental Example 1> The properties of the insulating films produced in the above Examples and Comparative Examples were evaluated and are shown in the following Table 1. The properties shown in Table 1 were evaluated by the following methods.

[0065] <Coefficient of thermal expansion (CTE)> After the insulating film was thermally cured at 190°C for 90 minutes, the thermal expansion coefficient was measured in the range of 25°C to 120°C using a TMA (thermos mechanical analyzer).

[0066] <Surface roughness (Ra, nm)> 1) Desmearing The insulating film was laminated onto a CCL (copper clad laminate) substrate using a vacuum pressure laminator at a temperature of 100°C and a pressure of 0.7 MPa for 30 seconds, and then pre-cured in a hot air oven at 100°C for 30 minutes and then at 170°C for 30 minutes.

[0067] Next, the support film (PET film) of the insulator was peeled off to expose the insulating layer, and then a desmear treatment was carried out using Atotech's Securiganth MV series treatment solution in three stages: swelling solution treatment (60°C, 5 minutes), oxidation solution treatment (80°C, 20 minutes), and neutralization solution treatment (50°C, 4 minutes).

[0068] 2) Measurement of surface roughness (Ra, nm) The surface of the desmeared insulating layer was measured five times per sample using an optical profiler (Nanoview 3D surface profiler NV-2700, Nanosystem), and the arithmetic mean roughness (Ra) was calculated as the average value.

[0069] <Copper foil adhesion> 1) Copper plating Copper plating was carried out in two stages: electroless chemical copper plating and electrolytic copper plating. Electroless chemical copper plating was carried out using Atotech's Printoganth MV product, with a plating thickness of 0.5 μm to 1.0 μm. After plating, the substrate was dried in a hot air oven at 150°C for 30 minutes.

[0070] The copper electroplating was carried out using Expt Inpro SAP6 chemicals from Atotech so that the plating thickness was about 20 μm, and after the plating, the plate was heat-treated in a hot air oven at 190° C. for 1 hour.

[0071] 2) Evaluation of copper foil adhesion The 90-degree peel strength of the copper plating layer was measured using a Texture Analyzer (TA-XT Plus) from Stable Micro Systems, Inc. If the measured peel strength was 0.45 kgf / cm or more, the copper foil adhesion was judged to be good, and if it was less than 0.45 kgf / cm, the copper foil adhesion was judged to be poor.

[0072] [Table 1]

[0073] As shown in the above results, Examples 1 to 4 showed a low thermal expansion coefficient of 40 ppm / °C or less and good copper foil adhesion. However, in the cases of Comparative Examples 1 and 4, although a low thermal expansion coefficient of 33 to 34 ppm / °C was shown, the surface roughness (Ra) after desmearing was 200 nm or less and the copper foil adhesion was also poor. Furthermore, in the cases of Comparative Examples 2 and 3, the thermal expansion coefficient was relatively high and the copper foil adhesion was also poor.

[0074] In addition, when only a metal-based compound was used as a curing accelerator as in Comparative Example 5, the film was prone to cracking after curing, making it impossible to prepare a sample, and the surface was over-etched during desmear treatment, resulting in whitening.In addition, when only an imidazole-based compound was used as a curing accelerator as in Comparative Example 6, the thermal expansion coefficient was relatively high, and the surface was over-etched during desmear treatment, resulting in whitening.

[0075] Therefore, a resin composition according to an embodiment of the present application can have excellent cured physical properties by using a cyanate ester-based resin and a phenol-based resin in a specific weight ratio as a curing agent and a curing accelerator containing both an imidazole-based compound and a metal-based compound. Furthermore, an insulating film manufactured using the resin composition according to an embodiment of the present application can have an appropriate surface roughness by desmearing, and is therefore characterized by excellent copper foil adhesion.

[0076] Furthermore, by using the resin composition according to one embodiment of the present application, it is possible to produce a multilayer printed circuit board having excellent wiring adhesion, chemical resistance, and the like.

Claims

1. Epoxy resins; a curing agent comprising a cyanate ester resin and a phenolic resin; Inorganic particles including silica particles; and Contains a curing accelerator, The weight ratio of the cyanate ester resin and the phenolic resin (cyanate ester the ratio of the copolymer (polysiloxane resin: phenolic resin) is 95:5 to 40:60; the curing accelerator contains an imidazole compound and a metal compound at the same time, and the silica particles have an average particle size of 0.3 μm or less; The phenolic resin includes a novolac phenolic resin. Resin composition.

2. The weight ratio of the epoxy resin to the curing agent (epoxy resin:curing agent) was 60:4 The resin composition according to claim 1, wherein the ratio is 0 to 20:

80.

3. The cyanate ester resin may be a novolac type cyanate ester resin, a dicyclo Pentadiene-type cyanate ester resin, bisphenol-type cyanate ester resin and prepolymers in which these are partially triazine-modified. The resin composition according to claim 1, wherein

4. The metal compounds include cobalt (II) acetylacetonate, cobalt (III) acetylacetonate, and the like. Cetylacetonate, Copper(II) acetylacetonate, Zinc(II) acetylacetonate acetylacetonate, iron(III) acetylacetonate, nickel(II) acetylacetonate, Calcium(II) acetylacetonate, zinc octoate, tin octoate, zinc naphthenate One selected from lead, cobalt naphthenate, tin stearate and zinc stearate The resin composition according to claim 1, comprising at least one of:

5. The resin composition may be a phenoxy resin, a polyimide resin, a polyamide-imide resin, a polyethylene resin, or the like. Etherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether Polyether resin, polycarbonate resin, polyether ether ketone resin, polyester resin , one or more selected from polyvinyl acetal resin and polyvinyl butyral resin The resin composition according to claim 1, further comprising a thermoplastic resin of the formula:

6. The resin composition contains one or more additives selected from the group consisting of a leveling agent, a wetting agent, and an antistatic agent. The resin composition according to claim 1, further comprising:

7. The resin composition according to claim 1, which is for use in a printed circuit board.

8. A printed circuit comprising the resin composition according to any one of claims 1 to 7 or a cured product thereof. substrate.

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