Electrical and electronic articles comprising polyamide compositions

Abstract

Described herein are electrical articles comprising polyamides (PA). As described in detail below, the polyamides (PA) are semi-aromatic polyamides derived from the polycondensation of an aliphatic diamine, terephthalic acid, and bis(aminoalkyl)cyclohexane or cyclohexanedicarboxylic acid. Surprisingly, it has been discovered that incorporating a cycloaliphatic diamine, bis(aminoalkyl)cyclohexane, or a cycloaliphatic dicarboxylic acid, cyclohexanedicarboxylic acid, into a polyamide provides a polymer composition (PC) with significantly improved comparative tracking index (CTI) retention after heat aging compared to a similar polyamide derived solely from an aliphatic diamine and terephthalic acid. Due, at least in part, to the improved CTI retention, polyamides (PA) may be desirably incorporated into articles that will be exposed to high temperatures during use and that benefit from high CTI performance.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 63 / 021,104, filed May 7, 2020, and European Patent Application Publication No. 20178778.5, filed June 8, 2020, both of which are incorporated herein by reference.

[0002] The present invention relates to electronic and electrical articles comprising polyamide compositions. [Background technology]

[0003] Semi-aromatic polyamides are traditionally used in the manufacture of electrical and electronic products because polyamides are very good insulators. However, in high-heat applications (e.g., automotive applications where components are located in the engine bay), the articles are exposed to high temperatures. Over time, the comparative tracking index ("CTI") performance of such articles deteriorates to undesirable levels. Summary of the Invention

[0004] In a first aspect, the present invention relates to an electrical or electronic article comprising a polymer composition (PC) comprising a polyamide (PA) and glass fibers. The polyamide (PA) comprises a diamine component (A) comprising 20 mol % to 95 mol % of C4-C 12and 5 mol% to 80 mol% of a bis(aminoalkyl)cyclohexane, where the mol% is based on the total number of moles of each diamine monomer in the diamine component; and dicarboxylic acid component (B), where the mol% is based on the total number of moles of each dicarboxylic acid monomer in the dicarboxylic acid component. In some embodiments, the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane, preferably 1,3-bis(aminomethyl)cyclohexane. In some embodiments, the dicarboxylic acid component (B) comprises 1 mol% to 70 mol% of a cyclohexanedicarboxylic acid, preferably 1,4-cyclohexanedicarboxylic acid, based on the total number of moles of each dicarboxylic acid in the dicarboxylic acid component. In some embodiments, the polymer composition (PC) further comprises a halogen-free flame retardant. In some embodiments, the polymer composition (PC) further comprises an acid scavenger.

[0005] In some embodiments, the electrical or electronic article further comprises a comparative tracking index ("CTI") of at least 750V after 2,800 hours of heat aging, measured according to ASTM D3638.

[0006] In some embodiments, the electrical or electronic article comprises a component selected from the group consisting of a resistor, a capacitor, a transistor, a diode, and an integrated circuit. In some embodiments, the article is an all-electric vehicle component or a hybrid electric vehicle component. In some embodiments, the component is selected from the group consisting of a high voltage connector, an insulated gate bipolar transistor power module, a power inverter, a fast charger, a high voltage bus bar, a high voltage terminal, a high voltage separator, a gearbox housing, a light detection and ranging device housing, and a camera housing.

[0007] In a further aspect, the present invention relates to a method of manufacturing an electrical or electronic article, comprising extruding a polymer composition (PC) to form at least a portion of the electrical or electronic article. DETAILED DESCRIPTION OF THE INVENTION

[0008] Described herein are electrical articles comprising polyamides (PA). As described in detail below, the polyamides (PA) are semi-aromatic polyamides derived from the polycondensation of an aliphatic diamine, terephthalic acid, a bis(aminoalkyl)cyclohexane, and, optionally, cyclohexanedicarboxylic acid. Surprisingly, it has been discovered that incorporating specific combinations of cycloaliphatic diamines, bis(aminoalkyl)cyclohexane or bis(aminoalkyl)cyclohexane, and cycloaliphatic dicarboxylic acid, cyclohexanedicarboxylic acid, into polyamides provides polymer compositions (PCs) with significantly improved comparative tracking index (CTI) retention after heat aging compared to similar polyamides that do not contain the bis(aminoalkyl)cyclohexane and cyclohexanedicarboxylic acid. Due, at least in part, to the improved CTI retention, polyamides (PAs) may be desirably incorporated into articles that will be exposed to high temperatures during use and that benefit from high CTI performance.

[0009] In this application, any description, even if made in connection with a particular embodiment, is applicable to and interchangeable with other embodiments of the present disclosure. When an element or component is referred to as being included in and / or selected from a list of recited elements or components, in the relevant embodiments expressly contemplated by this application, the element or component can be any one of the individually recited elements or components, or can be selected from a group consisting of any two or more of the explicitly recited elements or components; any element or component recited in a list of elements or components can be omitted from such list; and any recitation herein of numerical ranges by endpoints should be understood to include all numerical values ​​included within the recited ranges, as well as the endpoints of the ranges and equivalents thereof.

[0010] Unless specifically limited otherwise, the terms "alkyl" and derivative terms such as "alkoxy," "acyl," and "alkylthio," as used herein, include within their scope straight-chain, branched-chain, and cyclic moieties. Examples of alkyl groups are methyl, ethyl, 1-methylethyl, propyl, 1,1-dimethylethyl, and cyclopropyl. Unless specifically stated otherwise, each alkyl and aryl group may be unsubstituted or may be substituted with halogen, hydroxy, sulfo, C1-C6 alkoxy, C1-C6 alkylthio, C1-C6 acyl, formyl, cyano, C6-C6 alkyl, or C6-C6 alkylthio. 15 Aryloxy or C6-C 15 The term "halogen" or "halo" includes fluorine, chlorine, bromine, and iodine, with fluorine being preferred.

[0011] The term "aryl" refers to a phenyl, indanyl, or naphthyl group. An aryl group can contain one or more alkyl groups, in which case it is sometimes referred to as "alkylaryl"; for example, it can be composed of a cycloaromatic group and two C1-C6 groups (e.g., methyl or ethyl). An aryl group can also contain one or more heteroatoms, such as N, O, or S, in which case it is sometimes referred to as "heteroaryl"; these heteroaromatic rings can be fused to other aromatic systems. Such heteroaromatic rings include, but are not limited to, furanyl, thienyl, pyrrolyl, pyrazolyl, imidazolyl, triazolyl, isoxazolyl, oxazolyl, thiazolyl, isothiazolyl, pyridyl, pyridazyl, pyrimidyl, pyrazinyl, and triazinyl ring structures. Aryl or heteroaryl substituents can be unsubstituted or substituted with halogen, hydroxy, C1-C6 alkoxy, sulfo, C1-C6 alkylthio, C1-C6 acyl, formyl, cyano, C6-C6 alkyl, or C6-C6 alkyl. 15 Aryloxy or C6-C 15It may be substituted with one or more substituents selected from, but not limited to, aryl, provided that the substituents are sterically compatible and chemical bonding and strain energy rules are satisfied.

[0012] It has been surprisingly discovered that incorporating a cycloaliphatic diamine, bis(aminoalkyl)cyclohexane, or a cycloaliphatic dicarboxylic acid, cyclohexanedicarboxylic acid, into a polyamide provides a polymer composition (PC) with significantly improved CTI retention after heat aging relative to a similar polyamide derived solely from an aliphatic diamine and terephthalic acid. CTI retention can be calculated according to the following formula: CTI / CTI, where CTI is the CTI after heat aging and CTI is the CTI before heat aging ("as molded"). Heat aging refers to heating the polymer composition (PC) in an oven (air atmosphere) at a selected temperature for a selected time. In some embodiments, the polymer composition (PC) has a CTI of 750 V after heat aging at 120° C. for 2800 hours. In some embodiments, additionally or alternatively, the polymer composition (PC) has a CTI of 750 V after heat aging at 150° C. for 2800 hours. CTI can be measured as described in the Examples section.

[0013] Polyamide (PA) The polymer composition (PC) contains a polyamide (PA). The polyamide (PA) contains: (1) 20 mol % to 95 mol % of C4 to C6 12The present invention relates to a polymer composition derived from the polycondensation of monomers in a reaction mixture comprising: (1) a diamine component (A) comprising an aliphatic diamine and 5 mol% to 80 mol% of a bis(aminoalkyl)cyclohexane, where the mol% is based on the total number of moles of each diamine monomer in the diamine component; and (2) a dicarboxylic acid component (B) comprising 30 mol% to 100 mol% of terephthalic acid and 0 mol% to 70 mol%, preferably 1 mol% to 70 mol%, of cyclohexanedicarboxylic acid, where the mol% is based on the total number of moles of each dicarboxylic acid monomer in the dicarboxylic acid component. Surprisingly, it has been discovered that incorporating a bis(aminoalkyl)cyclohexane or a specific combination of a bis(aminoalkyl)cyclohexane and a cyclohexanedicarboxylic acid into a semi-aromatic polyamide provides a polymer composition (PC) with improved CTI. The polyamides described herein have a glass transition temperature ("Tg") of at least 145°C, a melting temperature ("Tm") of at least 295°C, and a heat of fusion ("ΔH") of at least 30 J / g. f ").

[0014] Diamine component (A) The diamine component (A) contains 20 mol % to 95 mol % of C4 to C 12 All diamines in the reaction mixture are included, including aliphatic diamines and 5 mole % to 80 mole % of bis(aminoalkyl)cyclohexanes. When referring to the concentration of monomers in diamine component (A), it is understood that the concentration is relative to the total number of moles of all diamines in diamine component (A), unless otherwise specified.

[0015] In some embodiments, C4 to C 12 The aliphatic diamine has the following formula: H2N-R1-NH2(1) (Wherein R'1 is C4 to C 12 Alkyl groups, preferably C6 to C 10 alkyl group) In some embodiments, C4 to C 12The aliphatic diamine is selected from the group consisting of 1,4-diaminobutane (putrescine), 1,5-diaminopentane (cadaverine), 2-methyl-1,5-diaminopentane, hexamethylenediamine (or 1,6-diaminohexane), 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, and 1,12-diaminododecane. Preferably, the aliphatic diamine is selected from the group consisting of C4 to C6 12 The aliphatic diamine is selected from the group consisting of 1,6-diaminohexane, 3-methylhexamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, and 1,10-diaminodecane. Preferably, the aliphatic diamine is selected from the group consisting of C4 to C6 12 Aliphatic diamines are C5-C 10 It is an aliphatic diamine or a C5 to C9 aliphatic diamine. Most preferably, the C4 to C9 aliphatic diamine is 1,6-diaminohexane.

[0016] In some embodiments, C6 to C 12 The concentration of the aliphatic diamine is 25 mol% to 95 mol%, 30 mol% to 95 mol%, 35 mol% to 95 mol%, 40 mol% to 95 mol%, 45 mol% to 95 mol%, or 50 mol% to 95 mol%. 12 The concentration of the aliphatic diamine is 20 mol% to 90 mol%, 25 mol% to 90 mol%, 30 mol% to 90 mol%, 35 mol% to 90 mol%, 40 mol% to 90 mol%, 45 mol% to 90 mol%, or 50 mol% to 90 mol%.

[0017] Bis(aminoalkyl)cyclohexanes have the following formula: [ka] (Wherein R2 and R3 are C1 to C 10 independently selected from alkyl; R i is selected at each occurrence from the group consisting of alkyl, aryl, alkali or alkaline earth metal sulfonate, alkyl sulfonate, and quaternary ammonium; and i is an integer from 0 to 10. The -R3-NH2 group is disposed relative to the meta (1,3-) or para (1,4-) position. Preferably, i is 0, and R2 and R3 are both -CH2-. Most preferably, the bis(aminoalkyl)cyclohexane is selected from 1,3-bis(aminomethyl)cyclohexane ("1,3-BAC") and 1,4-bis(aminomethyl)cyclohexane ("1,4-BAC"). Of course, the bis(aminoalkyl)cyclohexane can be in the cis or trans conformation. Thus, the diamine component (A) can contain only cis-bis(aminoalkyl)cyclohexane, only trans-bis(aminoalkyl)cyclohexane, or a mixture of cis- and trans-bis(aminoalkyl)cyclohexanes.

[0018] In some embodiments, the concentration of the bis(aminoalkyl)cyclohexane is 5 mol% to 75 mol%, 5 mol% to 70 mol%, 5 mol% to 65 mol%, 5 mol% to 60 mol%, 5 mol% to 55 mol%, or 5 mol% to 50 mol%. In some embodiments, the concentration of the bis(aminoalkyl)cyclohexane is 10 mol% to 75 mol%, 10 mol% to 70 mol%, 10 mol% to 65 mol%, 10 mol% to 60 mol%, 10 mol% to 55 mol%, or 10 mol% to 50 mol%, or 20 mol% to 40 mol%.

[0019] As noted above, in some embodiments, the diamine component (A) comprises one or more additional diamines. The additional diamines may be C4 to C6 12In some embodiments, one, more, or all of the additional diamines are represented by Formula (1), each different from the other, and each having a C4 to C6 alkyl group. 12 In some embodiments, each additional diamine is different from the aliphatic diamine. In some embodiments, each additional diamine is selected from the group consisting of 1,2 diaminoethane, 1,2-diaminopropane, propylene-1,3-diamine, 1,3 diaminobutane, 1,4-diaminobutane, 1,5-diaminopentane, 2-methyl-1,5-diaminopentane, 1,6-diaminohexane, 3-methylhexamethylenediamine, 2,5 dimethylhexamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, The diamine component is selected from the group consisting of 1,7-diaminoheptane, 1,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 1,13-diaminotridecane, 2,5-bis(aminomethyl)tetrahydrofuran, and N,N-bis(3-aminopropyl)methylamine. This category also includes alicyclic diamines such as isophoronediamine, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, and bis-p-aminocyclohexylmethane. In some embodiments, the diamine component does not include alicyclic diamines other than bis(aminoalkyl)cyclohexane. As used herein, the absence of a monomer (e.g., a bis(aminoalkyl)cyclohexane) means that the concentration of the monomer in the corresponding component (e.g., a diamine component (A)) is less than 1 mol %, preferably less than 0.5 mol %, more preferably less than 0.1 mol %, even more preferably less than 0.05 mol %, and most preferably less than 0.01 mol %.

[0020] Dicarboxylic acid component (B) Dicarboxylic acid component (B) includes all dicarboxylic acids in the reaction mixture, including 30 mol % to 100 mol % terephthalic acid and 0 mol % to 70 mol %, preferably 1 mol % to 70 mol % cyclohexanedicarboxylic acid. When referring to the concentration of monomers in dicarboxylic acid component (B), it will be understood that the concentration is relative to the number of moles of all dicarboxylic acids in dicarboxylic acid component (A), unless otherwise specified.

[0021] In some embodiments, the concentration of terephthalic acid is 35 mol% to 100 mol%, 35 mol% to 100 mol%, 40 mol% to 100 mol%, 45 mol% to 100 mol%, or 50 mol% to 100 mol%. In some embodiments, the concentration of terephthalic acid is 30 mol% to 99 mol%, 35 mol% to 99 mol%, 40 mol% to 99 mol%, 45 mol% to 99 mol%, or 50 mol% to 99 mol%. In some embodiments, the concentration of terephthalic acid is 30 mol% to 95 mol%, 35 mol% to 97 mol%, 40 mol% to 97 mol%, 45 mol% to 97 mol%, or 50 mol% to 97 mol%.

[0022] Cyclohexanedicarboxylic acid has the following formula: [ka] (In the formula, R j is selected from the group consisting of alkyl, aryl, alkali or alkaline earth metal sulfonates, alkyl sulfonates, and quaternary ammonium; and j is an integer from 0 to 10. The explicit -COOH group is relatively positioned at the meta (1,3-) or para (1,4-) positions, preferably at the para position. Preferably, the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid ("CHDA") (j is 0). Of course, the cyclohexanedicarboxylic acid can be in the cis or trans conformation. Thus, the dicarboxylic acid component (B) can contain only cis-cyclohexanedicarboxylic acid, only trans-cyclohexanedicarboxylic acid, or a mixture of cis- and trans-cyclohexanedicarboxylic acids.

[0023] In some embodiments, the concentration of cyclohexanedicarboxylic acid is between 1 mol% and 70 mol%, between 1 mol% and 65 mol%, between 1 mol% and 60 mol%, between 1 mol% and 55 mol%, or between 1 mol% and 50 mol%.

[0024] As noted above, in some embodiments, dicarboxylic acid component (B) comprises one or more additional dicarboxylic acids. Each additional dicarboxylic acid is different from each other and different from terephthalic acid and cyclohexanedicarboxylic acid. In some embodiments, one, more, or all of the additional dicarboxylic acids are represented by formula (3), each different from each other and different from cyclohexanedicarboxylic acid.

[0025] In some embodiments, the one or more additional dicarboxylic acids are C4-C 12 The dicarboxylic acids are independently selected from the group consisting of aliphatic dicarboxylic acids, aromatic dicarboxylic acids, and alicyclic dicarboxylic acids. 10 Examples of aliphatic dicarboxylic acids include, but are not limited to, succinic acid [HOOC-(CH2)2-COOH], glutaric acid [HOOC-(CH2)3-COOH], 2,2-dimethyl-glutaric acid [HOOC-C(CH3)2-(CH2)2-COOH], adipic acid [HOOC-(CH2)4-COOH], 2,4,4-trimethyl-adipic acid [HOOC-CH(CH3)-CH2-C(CH3)2-CH2-COOH], pimelic acid [HOOC-(CH2)5-COOH], suberic acid [HOOC-(CH2)6-COOH], azelaic acid [HOOC-(CH2)7-COOH], sebacic acid [HOOC-(CH2)8-COOH], 1,12-dodecanedioic acid [HOOC-(CH2) 10 -COOH].

[0026] Examples of desirable aromatic dicarboxylic acids include, but are not limited to, phthalic acids such as isophthalic acid (IA), naphthalenedicarboxylic acids (e.g., naphthalene-2,6-dicarboxylic acid), 4,4'-bibenzoic acid, 2,5-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,2-bis(4-carboxyphenyl)propane, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 2,2-bis(4-carboxyphenyl)ketone, 4,4'-bis(4-carboxyphenyl)sulfone, 2,2-bis(3-carboxyphenyl)propane, 2,2-bis(3-carboxyphenyl)hexafluoropropane, 2,2-bis(3-carboxyphenyl)ketone, and bis(3-carboxyphenoxy)benzene.

[0027] Examples of suitable alicyclic dicarboxylic acids include, but are not limited to, cyclopropane-1,2-dicarboxylic acid, 1-methylcyclopropane-1,2-dicarboxylic acid, cyclobutane-1,2-dicarboxylic acid, tetrahydrofuran-2,5-dicarboxylic acid, and 1,3-adamantanedicarboxylic acid.

[0028] In some embodiments where the polyamide (PA) comprises one or more additional dicarboxylic acids, the total concentration of the one or more additional dicarboxylic acids is 20 mole % or less.

[0029] Polyamide (PA) repeating unit The polyamide (PA) formed from the polycondensation of the monomers in the diamine and dicarboxylic acid components described above may be represented by the following formula: [ka] The repeating unit R is represented by PA1 and R PA2 and when cyclohexanedicarboxylic acid is present in the dicarboxylic acid component (B), the dicarboxylic acid component (B) contains a cyclohexanedicarboxylic acid represented by the following formula: [ka] (In the formula, R1~R3, Ri , R j , i and j are as defined above) The repeating unit R is represented by PA3 and R PA4 Those skilled in the art will recognize that the repeating unit R PA1 C4~C 12 Formed by polycondensation of aliphatic diamine and terephthalic acid, it has the repeating unit R PA3 C4~C 12 Formed by polycondensation of aliphatic diamine and cyclohexanedicarboxylic acid, the repeating unit R PA2 is formed by polycondensation of bis(aminoalkyl)cyclohexane with terephthalic acid, and the repeating unit R PA4 It will be appreciated that R is formed from the polycondensation of a bis(aminoalkyl)cyclohexane with a cyclohexanedicarboxylic acid. In some embodiments, R is -(CH)- m where m is 5 to 10, preferably 5 to 9, and most preferably 6. Additionally or alternatively, in some embodiments, R2 and R3 are both —CH2— and i and j are both zero. In some embodiments, the bis(aminealkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane, and the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid.

[0030] In some embodiments, the repeating unit R PA1 and R PA2 In some embodiments where optional cyclohexanedicarboxylic acid is present in dicarboxylic acid component (B), the total concentration of repeating units R PA1 ~R PA4is at least 50 mol%, at least 60 mol%, at least 70 mol%, at least 80 mol%, at least 90 mol%, at least 95 mol%, at least 97 mol%, at least 98 mol%, at least 99 mol%, or at least 99.5 mol%. When referring to mole % of a repeat unit, it will be understood that the concentration is relative to the total number of repeat units in the indicated polymer, unless otherwise specified.

[0031] Polyamide (PA) is a semi-crystalline polyamide. As used herein, a semi-crystalline polyamide has a heat of fusion ("ΔH") of at least 5 Joules per gram ("J / g"). f In some embodiments, the polyamides (PA) described herein have a ΔH of at least 30 J / g or at least 35 J / g. f Additionally or alternatively, in some embodiments, the polyamide (PA) has a ΔH of 60 J / g or less, or 55 J / g or less. f In some embodiments, the polyamide (PA) has a ΔH of 30 J / g to 60 J / g, or 35 J / g to 60 J / g, or 30 J / g to 55 J / g, or 35 J / g to 55 J / g. f ΔH f can be measured according to ASTM D3418 using a heating rate of 20°C / min.

[0032] The polyamide (PA) has a Tg of at least 145° C., preferably at least 150° C. In some embodiments, the polyamide (PA) has a Tg of 190° C. or less, 180° C. or less, or 170° C. or less. In some embodiments, the polyamide (PA) has a Tg of 145° C. to 190° C., 145° C. to 180° C., 145° C. to 170° C., 150° C. to 190° C., 150° C. to 180° C., or 150° C. to 170° C. The Tg can be measured according to ASTM D3418.

[0033] The polyamide (PA) has a Tm of at least 295° C., preferably at least 300° C. In some embodiments, the polyamide (PA) has a Tm of 360° C. or less, 350° C. or less, or 340° C. or less. In some embodiments, the polyamide (PA) has a Tm of 295° C. to 360° C., 295° C. to 350° C., 295° C. to 340° C., 300° C. to 360° C., 300° C. to 350° C., or 300° C. to 340° C. Tm can be measured according to ASTM D3418.

[0034] In some embodiments, the polyamide (PA) has a number average molecular weight ("Mn") ranging from 1,000 g / mol to 40,000 g / mol, e.g., from 2,000 g / mol to 35,000 g / mol, from 4,000 to 30,000 g / mol, or from 5,000 g / mol to 20,000 g / mol. The number average molecular weight Mn can be measured by gel permeation chromatography (GPC) using ASTM D5296 with polystyrene standards.

[0035] The polyamides (PA) described herein can be prepared by any conventional method adapted to the synthesis of polyamides and polyphthalamides. Preferably, the polyamides (PA) are prepared by reacting (heating) the monomers in the presence of less than 60% by weight, preferentially less than 50% by weight, of water to a temperature of at least Tm+10°C, where Tm is the melting temperature of the polyamide (PA), where the weight percentages are relative to the total weight of the reaction mixture.

[0036] The polyamides (PA) described herein can be prepared, for example, by thermal polycondensation (also referred to as polycondensation or condensation) of aqueous solutions of monomers and comonomers. In one embodiment, the polyamides (PA) comprise at least C4 to C6 copolymers in the reaction mixture. 12The polyamide (PA) is formed by reacting an aliphatic diamine, a bis(aminoalkyl)cyclohexane, terephthalic acid, and, if present in the dicarboxylic acid component (B), cyclohexanedicarboxylic acid. In some embodiments, the total number of moles of diamine in the reaction mixture is substantially equimolar to the total number of moles of dicarboxylic acid in the reaction mixture. As used herein, substantially equimolar means a value that is ±15% of the indicated number of moles. For example, in relation to the diamine and dicarboxylic acid concentrations in the reaction mixture, the total number of moles of diamine in the reaction mixture is ±15% of the total number of moles of dicarboxylic acid in the reaction mixture. The polyamide (PA) is a monofunctional molecule capable of reacting with an amine moiety or a carboxylic acid moiety and may contain a chain limiter used to control the molecular weight of the polyamide (PA). For example, the chain limiter can be acetic acid, propionic acid, benzoic acid, and / or benzylamine. A catalyst can also be used. Examples of catalysts are phosphorous acid, ortho-phosphoric acid, meta-phosphoric acid, alkali metal hypophosphites such as sodium hypophosphite, and phenylphosphinic acid. Stabilizers such as phosphites can also be used.

[0037] Polymer Composition (PC) The polymer composition (C) comprises a polyamide (PA) and one or more optional components selected from the group consisting of reinforcing agents and additives, including, but not limited to, toughening agents, plasticizers, colorants, pigments (e.g., black pigments such as carbon black and nigrosine), antistatic agents, dyes, lubricants (e.g., linear low-density polyethylene, calcium stearate, magnesium stearate, or sodium montanate), heat stabilizers, light stabilizers, flame retardants (both halogen-free and halogen-containing flame retardants), nucleating agents, antioxidants, acid scavengers, and other processing aids.

[0038] In some embodiments, the polyamide (A) concentration in the polymer composition (PC) is at least 20 wt%, at least 30 wt%, or at least 40 wt%. In some embodiments, the polyamide (PA) concentration in the polymer composition (PC) is 85 wt% or less, 80 wt% or less, or 70 wt% or less. In some embodiments, the polyamide (PA) concentration in the polymer composition (PC) is 20 wt% to 85 wt%, 30 wt% to 80 wt%, or 40 wt% to 70 wt%. As used herein, weight percent is based on the total weight of the polymer composition, unless otherwise specified.

[0039] In some embodiments, the polymer composition (PC) does not include a reinforcing agent. A wide selection of reinforcing agents, also called reinforcing fibers or fillers, can be added to the polymer composition (PC). In some embodiments, the reinforcing agent is selected from mineral fillers (including but not limited to talc, mica, kaolin, calcium carbonate, calcium silicate, magnesium carbonate, etc.), glass fibers, carbon fibers, synthetic polymer fibers, aramid fibers, aluminum fibers, titanium fibers, magnesium fibers, boron carbide fibers, rock wool fibers, steel fibers, and wollastonite.

[0040] Generally, the reinforcing agent is a fibrous or particulate reinforcing agent. Fibrous filler refers to a material having a length, width, and thickness in which the average length is significantly greater than both the width and thickness. Generally, such materials have an aspect ratio, defined as the average ratio between the length and the largest of the width and thickness, of at least 5, at least 10, at least 20, or at least 50. In some embodiments, the fibrous reinforcing agent (e.g., glass fiber or carbon fiber) has an average length of 3 mm to 50 mm. In some such embodiments, the fibrous reinforcing agent has an average length of 3 mm to 10 mm, 3 mm to 8 mm, 3 mm to 6 mm, or 3 mm to 5 mm. In alternative embodiments, the fibrous reinforcing agent has an average length of 10 mm to 50 mm, 10 mm to 45 mm, 10 mm to 35 mm, 10 mm to 30 mm, 10 mm to 25 mm, or 15 mm to 25 mm. The average length of the fibrous reinforcing agent can be interpreted as the average length of the fibrous reinforcing agent before incorporation into the polymer composition (PC), or it can be interpreted as the average length of the fibrous reinforcing agent in the polymer composition (PC).

[0041] Among fibrous reinforcing materials, glass fiber is preferred. Glass fiber is a silica-based glass compound containing several metal oxides that can be tailored to yield various types of glass. The primary oxide is silica in the form of silica sand, while other oxides, such as calcium, sodium, and aluminum, are incorporated to lower the melting temperature and prevent crystallization. Glass fiber can be added as endless fibers or chopped glass fibers. Glass fibers generally have an equivalent diameter of 5 to 20 μm, preferably 5 to 15 μm, and more preferably 5 to 10 μm. All glass fiber types, such as A, C, D, E, M, S, R, and T glass fibers (as described in Additives for Plastics Handbook, 2nd ed., John Murphy, chapter 5.2.3, pages 43-48), or any mixture thereof or mixtures thereof, can be used.

[0042] E-, R-, S-, and T-glass fibers are well known in the art. They are described, inter alia, in Fiberglass and Glass Technology, Wallenberger, Frederick T.; Bingham, Paul A. (Eds.), 2010, XIV, chapter 5, pages 197-225. R-, S-, and T-glass fibers consist essentially of oxides of silicon, aluminum, and magnesium. In particular, they typically contain 62-75 wt. % SiO2, 16-28 wt. % Al2O3, and 5-14 wt. % MgO. On the other hand, R-, S-, and T-glass fibers contain less than 10 wt. % CaO.

[0043] In some embodiments, the glass fiber is a high modulus glass fiber. The high modulus glass fiber has a modulus of elasticity of at least 76, preferably at least 78, more preferably at least 80, and most preferably at least 82 GPa, as measured in accordance with ASTM D2343. Examples of high modulus glass fibers include, but are not limited to, S-, R-, and T-glass fibers. Commercially available sources of high modulus glass fibers are S-1 and S-2 glass fibers provided by Taishan and AGY, respectively.

[0044] The morphology of the glass fibers is not particularly limited. As noted above, the glass fibers may have a circular cross-section ("round glass fibers") or a non-circular cross-section ("flat glass fibers"). Non-limiting examples of suitable flat glass fibers include glass fibers having oval, elliptical, and rectangular cross-sections. In some embodiments in which the polymer composition comprises flat glass fibers, the flat glass fibers have a cross-sectional longest dimension of at least 15 μm, preferably at least 20 μm, more preferably at least 22 μm, and even more preferably at least 25 μm. Additionally or alternatively, in some embodiments, the cross-sectional longest dimension of the flat glass fibers is at most 40 μm, preferably at most 35 μm, more preferably at most 32 μm, and even more preferably at most 30 μm. In some embodiments, the cross-sectional diameter of the flat glass fibers is in the range of 15 to 35 μm, preferably 20 to 30 μm, and more preferably 25 to 29 μm. In some embodiments, the flat glass fibers have a cross-sectional minimum diameter of at least 4 μm, preferably at least 5 μm, more preferably at least 6 μm, and even more preferably at least 7 μm. Additionally or alternatively, in some embodiments, the cross-sectional minimum diameter of the flat glass fibers is at most 25 μm, preferably at most 20 μm, more preferably at most 17 μm, and even more preferably at most 15 μm. In some embodiments, the cross-sectional minimum diameter of the flat glass fibers is in the range of 5 to 20 μm, preferably 5 to 15 μm, and more preferably 7 to 11 μm.

[0045] In some embodiments, the aspect ratio of the flat glass fibers is at least 2, preferably at least 2.2, more preferably at least 2.4, and even more preferably at least 3. The aspect ratio is defined as the ratio of the longest diameter in a cross-section of the glass fiber to the shortest diameter in the same cross-section. Additionally or alternatively, in some embodiments, the aspect ratio of the flat glass fibers is at most 8, preferably at most 6, and more preferably at most 4. In some embodiments, the aspect ratio of the flat glass fibers is 2 to 6, preferably 2.2 to 4. In some embodiments in which the glass fibers are round glass fibers, the aspect ratio of the glass fibers is less than 2, preferably less than 1.5, more preferably less than 1.2, even more preferably less than 1.1, and most preferably less than 1.05. Of course, those skilled in the art will understand that, by definition, the aspect ratio cannot be less than 1, regardless of the morphology of the glass fiber (e.g., round or flat).

[0046] In some embodiments, the concentration of reinforcing agent (e.g., glass or carbon fiber) in the polymer composition (PC) is at least 10 wt%, at least 15 wt%, or at least 20 wt%. In some embodiments, the concentration of reinforcing agent in the polymer composition (PC) is 70 wt% or less, 60 wt% or less, or 50 wt% or less. In some embodiments, the concentration of reinforcing agent in the polymer composition (PC) is 10 wt% to 70 wt%, 15 wt% to 60 wt%, or 20 wt% to 50 wt%.

[0047] In some embodiments, the polymer composition (PC) comprises a toughening agent. The toughening agent is generally a polymer with a low Tg, for example, having a Tg below room temperature, below 0°C, or even below -25°C. As a result of its low Tg, the toughening agent is typically elastomeric at room temperature. The toughening agent may be a functionalized polymer backbone.

[0048] The polymer backbone of the toughening agent may be selected from elastomeric backbones comprising polyethylene and copolymers thereof, such as ethylene-butene; ethylene-octene; polypropylene and copolymers thereof; polybutene; polyisoprene; ethylene-propylene-rubber (EPR); ethylene-propylene-diene monomer rubber (EPDM); ethylene-acrylate rubber; butadiene-acrylonitrile rubber, ethylene-acrylic acid (EAA), ethylene-vinyl acetate (EVA); acrylonitrile-butadiene-styrene rubber (ABS); block copolymer styrene ethylene butadiene styrene (SEBS); block copolymer styrene butadiene styrene (SBS); core-shell elastomers of the methacrylate-butadiene-styrene (MBS) type or mixtures of one or more of the above.

[0049] If the toughening agent is functionalized, backbone functionalization can occur by copolymerization of monomers containing the functionalization or by grafting the polymer backbone with additional components.

[0050] Specific examples of functionalized toughening agents are, inter alia, terpolymers of ethylene, acrylic esters and glycidyl methacrylate, copolymers of ethylene and butyl ester acrylate; copolymers of ethylene, butyl ester acrylate and glycidyl methacrylate; ethylene-maleic anhydride copolymers; EPR grafted with maleic anhydride; styrene copolymers grafted with maleic anhydride; SEBS copolymers grafted with maleic anhydride; styrene-acrylonitrile copolymers grafted with maleic anhydride; ABS copolymers grafted with maleic anhydride.

[0051] In some embodiments, the concentration of the toughening agent in the polymer composition (PC) is at least 1 wt%, at least 2 wt%, or at least 3 wt%. In some embodiments, the concentration of the toughening agent in the polymer composition (PC) is no more than 20 wt%, no more than 15 wt%, or no more than 10 wt%. In some embodiments, the concentration of the toughening agent in the polymer composition (PC) is between 1 wt% and 20 wt%, between 2 wt% and 15 wt%, or between 3 wt% and 10 wt%.

[0052] As mentioned above, the polymer composition (PC) is desirably incorporated into electrical and electronic articles that are exposed to high temperatures in their intended use environment (e.g., in or near an engine bay). Accordingly, in some embodiments, a flame retardant is desirably incorporated into the polymer composition (PC) in the event of overvoltage or other combustion sources (e.g., in automotive or aerospace engine bay applications). Furthermore, for similar reasons, the flame retardant is preferably a halogen-free flame retardant.

[0053] In some embodiments, the halogen-free flame retardant is an organophosphorus compound selected from the group consisting of phosphine salts (phosphinates), diphosphine salts (diphosphinates), and condensation products thereof. Preferably, the organophosphorus compound is selected from the group consisting of phosphinates of formula (I), diphosphinates of formula (II), and condensation products thereof: [ka] (wherein R1 and R2 are the same or different, and each of R1 and R2 is hydrogen or a linear or branched C1-C6 alkyl group or an aryl group; R3 is a linear or branched C1-C6 alkyl group or an aryl group; 10 Alkylene group, C6-C 10 an arylene group, an alkyl-arylene group, or an aryl-alkylene group; M is selected from calcium ions, magnesium ions, aluminum ions, zinc ions, titanium ions, and combinations thereof; m is an integer of 2 or 3; n is an integer of 1 or 3; and x is an integer of 1 or 2).

[0054] Preferably, R1 and R2 are independently selected from methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, n-pentyl, and phenyl; R3 is selected from methylene, ethylene, n-propylene, isopropylene, n-butylene, tert-butylene, n-pentylene, n-octylene, n-dodecylene, phenylene, naphthylene, methylphenylene, ethylphenylene, tert-butylphenylene, methylnaphthylene, ethylnaphthylene, tert-butylnaphthylene, phenylmethylene, phenylethylene, phenylpropylene, and phenylbutylene; and M is selected from aluminum ions and zinc ions.

[0055] Phosphinates are preferred as the organic phosphorus compound.Suitable phosphinates are described in U.S. Patent No. 6,365,071, which is incorporated herein by reference.Particularly preferred phosphinates are aluminum phosphinate, calcium phosphinate and zinc phosphinate.Excellent results have been obtained with aluminum phosphinate.Among aluminum phosphinates, aluminum ethylmethyl phosphinate and aluminum diethyl phosphinate, and combinations thereof, are preferred.Excellent results have been obtained particularly when aluminum diethyl phosphinate is used.

[0056] In some embodiments, the concentration of the halogen-free flame retardant in the polymer composition (PC) is at least 5 wt% or at least 7 wt%. In some embodiments, the concentration of the halogen-free flame retardant in the polymer composition (PC) is 20 wt% or less or 15 wt% or less. In some embodiments, the concentration of the halogen-free flame retardant in the polymer composition (PC) is 5 wt% to 20 wt%, 7 wt% to 20 wt%, 5 wt% to 15 wt%, or 7 wt% to 15 wt%.

[0057] In some embodiments, the polymer composition (PC), most preferably in embodiments incorporating a halogen-free flame retardant, further comprises an acid scavenger. Acid scavengers include, but are not limited to, silicone; silica; boehmite; metal oxides such as aluminum oxide, calcium oxide, iron oxide, titanium oxide, manganese oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, cobalt oxide, bismuth oxide, chromium oxide, tin oxide, antimony oxide, nickel oxide, copper oxide, and tungsten oxide; metal powders such as aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, tin, antimony, nickel, copper, and tungsten; and metal salts such as barium metaborate, zinc carbonate, magnesium carbonate, calcium carbonate, and barium carbonate. In some embodiments where the polymer composition (PC) includes an acid scavenger, the acid scavenger concentration is 0.01 wt % to 5 wt %, 0.05 wt % to 4 wt %, 0.08 wt % to 3 wt %, 0.1 wt % to 2 wt %, 0.1 wt % to 1 wt %, 0.1 wt % to 0.5 wt %, or 0.1 wt % to 0.3 wt %.

[0058] In some embodiments, the total additive concentration in the polymer composition (PC) is at least 0.1 wt%, at least 0.2 wt%, or at least 0.3 wt%. In some embodiments, the total additive concentration in the polymer composition (PC) is 20 wt% or less, 15 wt% or less, 10 wt% or less, 7 wt% or less, or 5 wt% or less. In some embodiments, the total additive concentration in the polymer composition (PC) is 0.1 wt% to 20 wt%, 0.1 wt% to 15 wt%, 0.1 wt% to 10 wt%, 0.2 wt% to 7 wt%, or 0.3 wt% to 5 wt%.

[0059] In some embodiments, the polymer composition (PC) further comprises one or more additional polymers, in some such embodiments, at least one of the additional polymers is a semi-crystalline or amorphous polyamide, such as an aliphatic polyamide, a semi-aromatic polyamide, or more typically a polyamide obtained by polycondensation between an aromatic or aliphatic saturated diacid and an aliphatic saturated or aromatic primary diamine, a lactam, an amino acid, or a mixture of these different monomers.

[0060] Preparation of polymer composition (PC) The present invention further relates to a method for producing a polymer composition (PC), which method comprises melt blending a polyamide (PA) with one or more optional components (e.g., reinforcing agents and additives).

[0061] Any melt-blending method can be used to mix the polymeric and non-polymeric components involved in the present invention. For example, the polymeric and non-polymeric components can be fed into a melt mixer such as a single-screw or twin-screw extruder, a stirrer, a single-screw or twin-screw kneader, or a Banbury mixer. The addition step can be simultaneous addition of all components or batchwise stepwise addition. When the polymeric and non-polymeric ingredients are added gradually in a batchwise manner, a portion of the polymeric and / or non-polymeric ingredients is added first and then melt-mixed with the remaining polymeric and non-polymeric ingredients added thereafter until a well-mixed composition is obtained. When the reinforcing agent has a long physical form (e.g., long glass fibers and continuous fibers), stretch extrusion or pultrusion can be used to prepare the reinforced composition.

[0062] Articles and uses The present invention also relates to articles comprising the polymer composition (PC). Due at least in part to the improved CTI after heat aging, the polymer composition (PC) is desirably incorporated into any article that is exposed to high temperatures and that would benefit from high CTI performance.

[0063] In some embodiments, the article is an electronic or electrical article. Electronic and electrical articles include electrical or electronic components, respectively. Such components include discrete devices or physical entities within an electronic or electrical system used to affect electrons or electric fields. In some embodiments, the component is selected from semiconductor devices, such as, but not limited to, transistors, diodes, integrated circuits, and optoelectronic devices; display components, such as, but not limited to, filament lamps, cathode ray tubes, liquid crystal display components, plasma display components, and organic light-emitting display components; discharge components, such as, but not limited to, vacuum tubes; gas discharge tubes and ignition devices; power sources, such as, but not limited to, batteries, fuel cells, power supplies, photovoltaic devices, thermoelectric generators, generators, piezoelectric generators, and Van de Graaff generators; resistors; capacitors; magnetic induction devices; memristors; transducers; sensors; detectors; piezoelectric devices; electrical terminals; electrical connectors; electrical switches; sockets; and circuit breakers. In some embodiments, the electronic or electrical article is a housing for the aforementioned components or a substrate on which any of the aforementioned components are mounted.

[0064] In some embodiments, the electronic or electrical article is an all-electric or hybrid vehicle component, hi some such embodiments, the all-electric or hybrid vehicle component is selected from the group consisting of high voltage connectors, including, but not limited to, fast chargers, voltage bus bars, high voltage terminals, high voltage separators, gearbox housings, light detection and ranging device housings, camera housings, insulated gate bipolar transistor power modules, power inverters, and traction motor components.

[0065] In some embodiments, articles can be molded from polymer composition (PC) by any process suitable for thermoplastics, such as extrusion, injection molding, blow molding, rotational molding, or compression molding. Polymer composition (C) can also be used to overmold preformed shapes to build hybrid structures.

[0066] In some embodiments, the article is printed from the polymer composition (PC), for example by a process comprising a step of extrusion of the polymer composition (PC) in the form of a filament or in this case a step of laser sintering of the polymer composition (PC) in the form of a powder.

[0067] The present invention also relates to a method of manufacturing a three-dimensional (3D) object in an additive manufacturing system, the method comprising providing a part material comprising a polymer composition (PC) and printing layers of the three-dimensional object from the part material.

[0068] The polymer composition (PC) can therefore be in the form of a thread or filament used in a 3D printing process, such as fused filament manufacturing, also known as fused deposition modeling ("FDM").

[0069] The polymer composition (PC) may also be in the form of a powder, such as a substantially spherical powder, used in 3D printing processes, such as selective laser sintering (SLS).

[0070] Polymer Compositions (PC) and Articles of Use The present invention relates to the polymer composition (PC) as described above and to the use of the polymer composition (PC) or the article for manufacturing an article. The present invention also relates to the use of the polymer composition (PC) for 3D printing an object. [Example]

[0071] This example demonstrates the synthesis, thermal and mechanical performance of polyamides.

[0072] The raw materials used to form the samples are as follows: - Polyamide 1 ("PA1"): PA6T / 6I (from Solvay Specialty Polymers USA, LLC; Tg=125°C, Tm=310°C) - Polyamide 1 ("PA2"): PA6T / 6I / 66 (from Solvay Specialty Polymers USA, LLC; Tg=125°C, Tm=310°C) - Polyamide 2 ("PA3"): PA6, T / 1,3-BAC, T / 6, CHDA / 1,3-BAC, CHDA (Tg=165°C, Tm=330°C)), synthesized from: - Hexamethylenediamine (70% by weight, from Ascend Performance Materials) - 1,3-bis(aminomethyl)cyclohexane (from Mitsubishi Gas Chemical Company) - Terephthalic Acid (from Flint Hills Resources) - 1,4-Cyclohexanedicarboxylic acid (from Eastman Chemical Company) - Nucleating agent: Talc (Mistron Vapor, from Imerys) - Reinforcing filler: Glass fiber: Chopped E-glass fiber (Chop Vantage® HP 3610, from Nippon Electric Glass) - Pigment: Black pigment (from Clariant) - Halogen-free flame retardant ("HFFR"): organic phosphorus salt (aluminum diethylphosphinate) (Exolit® OP1230, from Clariant) - Stabilizer: Calcium oxide (from Mississippi Lime Company)

[0073] Example 1 – Synthesis of PA1 PA1 was synthesized using a process in an autoclave reactor equipped with a distillation line equipped with a pressure-control valve. Specifically, the reactor was charged with 179.3 g of 70% hexamethylenediamine, 102.4 g of 1,3-bis(aminomethyl)cyclohexane, 266.4 g of terephthalic acid, 30.7 g of 1,4-cyclohexanedicarboxylic acid, 206 g of deionized water, 2.2 g of glacial acetic acid, and 0.2 g of phosphoric acid. The reactor was sealed, purged with nitrogen, and heated to 260 °C. The evolved water vapor was slowly released to maintain an internal pressure of 120 psig. The temperature was increased to 320 °C. The reaction mixture was held at 320 °C, and the reactor pressure was reduced to atmospheric pressure. After an additional 20 minutes, the polymer was removed from the reactor.

[0074] Example 2 - Electrical Performance This example demonstrates the electrical performance of the polymer composition.

[0075] To demonstrate mechanical performance, polymer compositions were formed by melt blending polymer resins (either PPA1, PPA2, or PPA3) with various additives in an extruder. The polymer compositions were then molded into test samples, and the CTI was tested before ("as molded") and after heat aging. Heat aging involved heating the samples at temperatures of 120°C or 150°C for 250, 668, or 2800 hours. CTI was measured according to ASTM D3638. Tables 1 and 2 show sample parameters and tensile properties, respectively. "E" in the tables indicates an example, and "CE" indicates a counterexample. All values ​​in Table 1 are reported in weight percent.

[0076] [Table 1]

[0077] [Table 2]

[0078] Referring to Table 2, the samples formed from PA3 had significantly improved CTI compared to the samples formed from CE1 and CE2. For example, after 28,000 hours of heat aging at 150°C, sample E1 still had a CTI of 750V, while the CTIs of samples CE1 and CE2 were 300V and 400V, respectively.

[0079] The above-described embodiments are intended to be illustrative and not limiting. Additional embodiments are within the concept of the present invention. In addition, while the present invention has been described with reference to specific embodiments, those skilled in the art will recognize that changes in form and detail may be made without departing from the spirit and scope of the present invention. Any incorporation by reference of the above documents is limited so that no subject matter contrary to the express disclosure herein is incorporated.

Claims

1. semi-crystalline polyamide (PA), - Glass fiber and 1. An electrical or electronic article comprising a polymer composition (PC) comprising: said polyamide (PA) a diamine component (A), 20 mol % to 95 mol % C ４ ~C １２ an aliphatic diamine, - 5 mol % to 80 mol % of bis(aminoalkyl)cyclohexanes; wherein the mole percents are based on the total moles of each diamine in the diamine component; a dicarboxylic acid component (B), - 50% to 99% by moles of terephthalic acid, - 1 mol % to 50 mol % of cyclohexanedicarboxylic acid; wherein the mole percent is based on the total moles of each dicarboxylic acid in the dicarboxylic acid component.

1. An electrical or electronic article derived from the polycondensation of monomers in a reaction mixture comprising:

2. Said C ４ ~C １２ 2. The electrical or electronic article of claim 1, wherein the aliphatic diamine is selected from the group consisting of 1,4-diaminobutane, 1,5-diaminopentane, 2-methyl-1,5-diaminopentane, 1,6-diaminohexane, 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1,9-diaminononane, 2-methyl-1,8-diaminooctane, 5-methyl-1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, and 1,12-diaminododecane.

3. The electrical or electronic article of claim 1, wherein the C 4 to C 12 aliphatic diamine is 1,6-diaminohexane.

4. 3. The electrical or electronic article according to claim 1, wherein the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane.

5. 5. The electrical or electronic article according to any one of claims 1 to 4, wherein the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane, and the cyclohexanedicarboxylic acid is 1,4-cyclohexanedicarboxylic acid.

6. 6. The electrical or electronic article according to any one of claims 1 to 5, wherein the concentration of polyamide (PA) in the polymer composition (PC) is from 20% to 85% by weight.

7. 7. The electrical or electronic article according to any one of claims 1 to 6, wherein the glass fibre concentration in the polymer composition (PC) is between 10% and 70% by weight.

8. An electrical or electronic article according to any one of claims 1 to 7, wherein said polymer composition (PC) further comprises a halogen-free flame retardant.

9. An electrical or electronic article according to any one of claims 1 to 8, wherein said polymer composition (PC) further comprises an acid scavenger.

10. 10. The electrical or electronic article of any one of claims 1 to 9, further comprising a comparative tracking index ("CTI") of at least 750V measured according to ASTM D3638 after 2,800 hours of heat aging.

11. An electrical or electronic article according to any one of claims 1 to 10, which is exposed to air at a temperature of 120°C.

12. An electrical or electronic article according to any one of the preceding claims, comprising a component selected from the group consisting of a resistor, a capacitor, a transistor, a diode and an integrated circuit.

13. 13. An electrical or electronic article according to any one of claims 1 to 12 which is an all-electric or hybrid-electric vehicle component.

14. 14. The electrical or electronic article of claim 13, wherein the component is selected from the group consisting of a high voltage connector, an insulated gate bipolar transistor power module, a power inverter, a fast charger, a high voltage bus bar, a high voltage terminal, a high voltage separator, a gearbox housing, a light detection and ranging device housing, and a camera housing.

15. The electrical or electronic product according to any one of claims 1 to 14, wherein the polyamide (PA) has a glass transition temperature (Tg) of at least 145°C, a melting temperature (Tm) of at least 295°C and a heat of fusion (ΔH f ) of at least 30 J / g.

16. A method for manufacturing an electrical or electronic article according to any one of claims 1 to 15, comprising extruding said polymer composition (PC) to form at least part of said electrical or electronic article.

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