Insert and automated mounting test system for testing semiconductor products in an upright position

Abstract

To provide an insert and a test system that can minimize a footprint of a semiconductor product in a test state by testing the semiconductor product in a standing state.SOLUTION: An automatic mounting test system that tests a semiconductor product in a standing state can include: a test tray which includes a plurality of inserts and has tray grooves into which the respective inserts are inserted; a hander which loads a free insert with a semiconductor product to be tested and removes the semiconductor product having been tested from the insert; a tester which includes a plurality of socket modules which face one of the respective inserts with the test tray seated; and a rack master which carries the test tray between the handler and the tester.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an insert and test system for testing semiconductor products in an upright position. [Background technology]

[0002] Semiconductor products that have undergone manufacturing processes undergo a grade evaluation through prescribed tests before being released to the market. These tests are conducted by mounting the semiconductor product on a test system with a main board and transmitting test signals to the semiconductor product. Various signals are used depending on the characteristics of the semiconductor product, and the thermal environment in which the test is conducted can also be varied. The results of these tests can be classified as A / B / C / D, or as pass / fail / retest, or in various other ways.

[0003] An automated test system including a handler is used to automate the testing of large numbers of semiconductor products. In this case, a dedicated tray is used to transport and test a large number of semiconductor products at once. The tray is roughly shaped like a straight plate and has grooves arranged in multiple rows and / or columns. One insert is inserted into each groove. Each semiconductor product is loaded into one of the inserts and moved along with the tray inside the test system for testing.

[0004] In this case, the semiconductor product is mounted by electrically connecting the terminals of the test equipment to the terminals formed on the semiconductor product. Therefore, devices with terminals located on the side of the semiconductor product, such as LPC AMs and DIMMs (dual in-line memory modules), are placed sideways on the test equipment for mounting. In this case, the sideways position means that the side where the terminals are formed faces the bottom.

[0005] However, devices such as LPC-A MCUs and dual in-line memory modules (DIMMs) typically have a length that is much longer than the height of their sides. Therefore, when such devices are laid flat, the footprint they occupy is maximized. The method of arranging devices to maximize their footprint when mounted on a tester acts as a factor limiting the number of devices that can be tested at one time by the tester. Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to provide an insert and a test system that can minimize the footprint of a semiconductor product in a test state by testing the semiconductor product in an upright state.

[0007] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned herein will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] To solve the above problem, one embodiment of the present invention provides an automated mounting test system for testing semiconductor products in an upright position, including a test tray including a plurality of inserts and having tray grooves into which each of the inserts is inserted; a handler that loads semiconductor products to be tested into the empty inserts and removes the tested semiconductor products with the inserts; a tester including a plurality of socket modules each facing one of the inserts when the test tray is seated; and a rack master that transports the test tray between the handler and the tester.

[0009] The insert may include an insert housing inserted into the tray groove, an insert block supporting the semiconductor product in a standing posture so that one side of the semiconductor product is exposed to the tray groove, and a moving block connected to the insert block and movable within the insert housing.

[0010] The socket module may include a socket block that is received in an empty space of the tray groove when the test tray is seated on the tester, and a connector that is positioned on one side of the socket block, configured to transmit and receive signals for testing with the semiconductor products, and that is brought into close contact with one side of the semiconductor products as the moving block advances to be electrically connected to the semiconductor products.

[0011] The insert may further include a support block that is retractably mounted within the insert housing to push the moving block toward the insertion block and is positioned on the back side of the semiconductor product while contacting the moving block.

[0012] The insert may further include a push switch that protrudes from the insert housing and moves down by an external force to move an end of the support block toward the insertion block.

[0013] The support block may have a forward guide inclined surface that contacts the push switch and increases in height as it approaches the insertion block.

[0014] The forward guide inclined surface may include a first inclined surface that induces movement of the support block as the support block approaches the moving block, and a second inclined surface that induces movement of the support block as the support block pushes the moving block and has a steeper inclination than the first inclined surface.

[0015] The support block may have a device alignment hole that is aligned with a through hole formed in the semiconductor product when the semiconductor product is supported by the insertion block.

[0016] The insertion blocks may be provided in a pair, arranged symmetrically to each other, and each of the insertion blocks may have an insertion slot extending in the vertical direction so that the semiconductor products are inserted closely from above.

[0017] The insert may further include a holding member protruding into the insertion slot, and a device-holding elastic member elastically supporting the holding member within the insertion block.

[0018] The socket block may include a block alignment pin extending parallel to the direction in which the insert block approaches in order to guide the insert block in the forward and backward directions.

[0019] The connector may include device alignment pins that extend parallel to the block alignment pins and are inserted into through holes formed in the semiconductor product to align the semiconductor product.

[0020] The socket module may further include a seating plate on which the insert housing is seated and from which housing alignment pins protrude upward and are inserted into the insert housing during the seating of the insert housing.

[0021] The seating plate may have a block receiving groove formed therein, the groove receiving the lower end of the insertion block when the insert housing is seated thereon, and extending in the direction of advancement and retreat of the insertion block.

[0022] According to one embodiment of the present invention for solving the above problem, an insert for testing a semiconductor product in an upright position may include an insert housing inserted into a tray groove formed in a test tray, an insert block that supports the semiconductor product so that one side of the semiconductor product is exposed to the tray groove and supports the semiconductor product in a standing posture, and a moving block connected to the insert block and movable within the insert housing.

[0023] Other details of the invention are included in the detailed description and drawings. [Effects of the Invention]

[0024] According to the embodiment of the present invention, at least the following effects are obtained.

[0025] The number of semiconductor products that can be tested within the same test space can be maximized.

[0026] By maximizing the number of semiconductor products that can be tested at one time, the test time for a large number of semiconductor products can be effectively reduced.

[0027] The effects of the present invention are not limited to the above-mentioned examples, and various other effects are included within the present specification. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a schematic overall perspective view of a test system according to an embodiment of the present invention; [Figure 2] 1 is a diagram illustrating a schematic diagram of a test tray and a tester module according to an embodiment of the present invention. [Figure 3] FIG. 1 is a top view of a test tray according to an embodiment of the present invention. [Figure 4] 1 is a top view of a tester module according to an embodiment of the present invention; [Figure 5]1 is a schematic perspective view of a socket module according to an embodiment of the present invention; [Figure 6] FIG. 1 is a diagram showing an initial state of an insert according to an embodiment of the present invention. [Figure 7] 10A and 10B are diagrams showing a pressurized state of an insert according to an embodiment of the present invention. [Figure 8] FIG. 2 is a cross-sectional view of an insert according to an embodiment of the present invention in an initial state. [Figure 9] 1 is a diagram illustrating the state inside the insert in an initial state according to an embodiment of the present invention. FIG. [Figure 10] FIG. 2 is a cross-sectional view of an insert according to an embodiment of the present invention in a pressurized state. [Figure 11] 1 is a diagram showing the state inside the insert in a pressurized state according to an embodiment of the present invention. FIG. [Figure 12] 10A and 10B are diagrams illustrating a holding structure of a semiconductor product by an insert block according to an embodiment of the present invention. [Figure 13] 1 is a diagram showing a semiconductor product housed in an insert according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0029] The advantages and features of the present invention, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various different forms. The present embodiments are provided solely to complete the disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art. The present invention is defined only by the claims.

[0030] Furthermore, the embodiments described herein are described with reference to cross-sectional views and / or schematic diagrams that are ideal exemplary views of the present invention. Therefore, the shapes of the exemplary views may be modified due to manufacturing techniques and / or tolerances. Also, in each drawing shown in the present invention, each component may be slightly enlarged or reduced in size for the convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0031] The term "semiconductor product" as used below refers to a semiconductor product having terminals for transmitting and receiving signals arranged on its side, and may include both finished and semi-finished products. For example, the semiconductor product may be a DIMM or an LPCAM. Here, the "side" may refer to the widest two sides of a thin, plate-shaped semiconductor product. For example, the side may be the side on which a semiconductor element to be attached to the semiconductor product is located.

[0032] It should be noted that the directions of up / down / front / rear / left / right mentioned below are merely used to facilitate understanding of the positions of other elements by placing one reference point, and the present invention is not limited to such directions. For example, it is clear that the invention may be installed and / or operated in directions different from those described below in the course of actual use, and the present invention is to be construed as including such embodiments.

[0033] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings illustrating an insert and a test system for testing semiconductor products in an upright position according to embodiments of the present invention.

[0034] Fig. 1 is a schematic overall perspective view of a test system according to an embodiment of the present invention. The example shown in Fig. 1 is an exemplary form of a test system 1 according to an embodiment of the present invention, and the present invention is not limited to the form shown in Fig. 1. That is, Fig. 1 shows one rack master 400 and eight testers 500 arranged corresponding to one handler 100, but the number of rack masters 400 and testers 500 for one handler 100 can be changed in various ways depending on the user's environment.

[0035] As shown in FIG. 1, a test system 1 according to an embodiment of the present invention can include a handler 100, a rack master 400, and a tester 500.

[0036] The handler 100 may be configured to load semiconductor products to be tested into empty inserts and to remove tested semiconductor products from the inserts. Semiconductor products to be tested may be supplied from the outside to the inside of the handler 100, and the tested semiconductor products may be transferred to the handler 100 after being tested by the tester 500. A transport module for transporting the semiconductor products may be disposed inside the handler 100 so that the semiconductor products can be transported appropriately. For example, the handler 100 may include a stacker, a pick-and-place unit, a table, etc. to support logistics using user trays and test trays.

[0037] Here, the user tray may be a tray on which semiconductor products are loaded when semiconductor products are supplied to the handler 100 before being tested or when semiconductor products that have completed testing are transported to the outside. The test tray may be a tray on which semiconductor products are transported to be tested. A plurality of inserts may be positioned in the test tray so as to be arranged corresponding to the socket arrangement of the tester 500. The semiconductor products may be moved while being loaded on the inserts, tested, and then returned to the handler 100 while being loaded on the test tray.

[0038] The pick-and-place unit of the handler 100 can be used to load semiconductor products loaded on a user tray into inserts in a test tray, transfer the semiconductor products loaded on the inserts to the user tray, and sort the semiconductor products by grade during the process of transferring them to the user tray. For example, the semiconductor products can be sorted into good, bad, or re-inspection, or can be further subdivided and sorted as needed. The handler 100 can include multiple pick-and-place units to facilitate various logistics processes.

[0039] The loader 200 is a unit that receives user trays and semiconductor products from the outside and supplies them to the handler 100. The loader 200 can be implemented in various configurations as needed. The user trays and semiconductor products supplied to the loader 200 can be supplied by automated equipment or by an operator.

[0040] The loader 200 may be disposed in close contact with the handler 100 to shorten the semiconductor product transport path between the handler 100 and the loader 200. A pick-and-place unit and / or a transport module equivalent thereto may be disposed at the portion of the handler 100 in close contact with the loader 200 to feed semiconductor products and / or user trays prepared inside the loader 200 into the handler 100. Exemplarily, the loader 200 may prepare semiconductor products on user trays in units of one lot, and the handler 100 may insert at least a portion of one lot into the inserts of a test tray so that each insert is filled with semiconductor products. At this time, the handler 100 may complete testing, and an empty test tray from which all semiconductor products have been removed may be moved to the loader 200 in advance to wait.

[0041] The unloader 300 may be a unit where semiconductor products that have completed testing wait before being transported to the outside. The unloader 300 may be implemented in various configurations as needed. Empty user trays may be stored in the unloader 300, and such empty user trays may be supplied by automated equipment or by an operator. Similar to the loader 200, the unloader 300 may be disposed in close contact with the handler 100 so as to shorten the semiconductor product transfer path between the handler 100 and the unloader 300. A pick-and-place unit and / or a transport module corresponding thereto may be disposed in the portion of the handler 100 that is in close contact with the unloader 300 to transfer tested semiconductor products to user trays prepared inside the unloader 300.

[0042] In the unloader 300, multiple semiconductor products can be sorted by grade assigned according to the test results. The non-defective semiconductor products are loaded by grade onto user trays arranged inside the unloader 300 and then transported to the outside for subsequent processing. Furthermore, defective semiconductor products may be loaded together with non-defective products onto a different user tray and then discarded. Similarly, re-inspection grade semiconductor products may be loaded onto the same user tray, and then this user tray may be transferred back to the loader 200.

[0043] The rack master 400 may be a unit that transfers test trays between the handler 100 and each tester 500. In the test system 1 according to an embodiment of the present invention, the rack master 400 may have a shape that extends along the longitudinal direction of the handler 100. That is, the rack master 400, the loader 200, and the unloader 300 may be positioned closely to one side of the handler 100. Furthermore, the loader 200 and the unloader 300 may be positioned symmetrically with respect to each other with the rack master 400 in between. Therefore, according to an embodiment of the present invention, the loading operation of the loader 200, the transporting operation of the rack master 400, and / or the unloading operation of the unloader 300 can be performed in a chain reaction on one side of the handler 100. Furthermore, according to an embodiment of the present invention, the loader 200 and the unloader 300 are closely attached to both sides of the rack master 400, thereby shortening the transport distance of semiconductor products within the handler 100.

[0044] The front end of the rack master 400 in the longitudinal direction may be closely attached to the handler 100. The front end of the rack master 400 may serve as a test tray exchange between the handler 100 and the rack master 400. The rear end of the rack master 400 extends in the longitudinal direction, and the length of the rack master 400 may be determined according to the number of testers 500 to be installed. The greater the number of testers 500, the longer the length of the rack master 400 may be.

[0045] Testers 500 may be selectively arranged in a multi-tiered configuration to reduce the length of rack master 400. In such cases, rack master 400 may be configured to transport test trays vertically as well as longitudinally. Similarly, testers 500 may be symmetrically arranged on both sides of rack master 400 to reduce the length of rack master 400.

[0046] The rack master 400 is configured to receive test trays for testing from the handler 100 and deliver them to the testers 500 that can receive the test trays or to the testers 500 in a set order. The rack master 500 is also driven to remove test trays that have been tested from the testers 500 and deliver them to the handler 100 again.

[0047] Therefore, from the perspective of one test tray, the circulation path within the system is as follows: First, the test tray is positioned near the loader 200 from the handler 100, and then semiconductor products waiting in the loader 200 are loaded onto an empty insert. The test tray is then transported from inside the handler 100 to the rack master 400, and then transferred by the rack master 400 to the tester 500. Once a series of tests are completed in the tester 500, the test tray is again transported by the rack master 400 to the handler 100, and then transferred in the direction of the unloader 300. Once all the semiconductor products loaded on it have been removed by the unloader 300, the test tray is again moved to a position adjacent to the loader 200, and the above process is repeated.

[0048] The tester 500 is configured to be able to exchange test trays with the rack master 400 and can be a unit for evaluating the performance of semiconductor products. More specifically, the tester 500 can provide a predetermined temperature environment with the supplied test tray attached to the socket. For example, the tester 500 can test whether semiconductor products operate normally in an environment ranging from -40 degrees Celsius to +130 degrees Celsius. A detailed description of the tester 500 will be given later.

[0049] In this case, since an embodiment of the present invention includes multiple testers 500, the multiple testers 500 may be set to different test conditions as needed. For example, some of the multiple testers 500 may be set to test semiconductor products in a high-temperature environment, while other testers 500 may be set to test semiconductor products in a low-temperature environment. Alternatively, some of the multiple testers 500 may be set to test different types of semiconductor products.

[0050] Based on the above description, a test tray and a tester module according to one embodiment of the present invention will be described below with reference to Fig. 2. Fig. 2 is a diagram schematically illustrating a test tray and a tester module according to one embodiment of the present invention.

[0051] The tester module 2000 may be a module that provides a space in the tester 500 (see FIG. 1) for the test tray 1000 to sit in. The test tray 1000 may be transported to a position above the test module 2000 by a transport module located inside the tester 500, and then seated on the tester module 2000 while aligned with the tester module 2000. In this case, although not shown, the tester 500 may include a push module for closely contacting the test tray 1000 to the upper surface of the tester module 2000. The push module may press downward on the frame of the test tray 1000 to closely contact the tester module 2000.

[0052] Meanwhile, a plurality of socket modules 2100 may be protruded from the upper surface of the test module 200, each of which faces one of the inserts 1100 when the test tray 1000 is placed thereon. When the test tray 1000 is placed on the test module 200, each socket module 2100 may face a corresponding insert 1100 while being accommodated in a groove formed in the test tray 1000.

[0053] The socket modules 2100 may be provided in the same number as the inserts 1100 inserted into the test tray 1000. When the test tray 1000 is aligned above the test module 200 as shown in FIG. 2, each socket module 2100 is located in front of the corresponding insert 1100, and can be accommodated in the empty space in front of the insert 1100 as the test tray 1000 descends.

[0054] A test tray 1000 according to one embodiment of the present invention will be described in detail below with reference to Fig. 3. Fig. 3 is a top view of a test tray according to one embodiment of the present invention.

[0055] 3, the test tray 1000 may be configured to include a tray body 1200 and inserts 1100. A plurality of inserts 1100 may be attached to the tray body 1200. In this case, the plurality of inserts 1100 may be loosely attached to the tray body 1200 and may be able to swing while attached.

[0056] The tray body 1200 may be a plate-like structure having a plurality of tray grooves 1210 formed therein, into which the inserts 1100 may be inserted. In this case, the tray grooves 1210 may be formed to correspond to the number of socket modules 2100 (see FIG. 2) included in the tester module 2000 (see FIG. 2) and the arrangement of the socket modules 2100 on the tester module 2000. In addition, the size of the tray grooves 1210 is formed larger than the bottom surface of the inserts 1100, so that the tray grooves 1210 have a clearance when the inserts 1100 are inserted into the tray grooves 1210.

[0057] The insert 1100 is shaped so as to be insertable into the tray groove 1210, and is attached to the tray body 1200 so as to be in close contact with the rear end side of the tray groove 1210. This leaves an empty space in the tray groove 1210 in front of the insert 1100, and the above-mentioned socket module 2100 can be accommodated in this space.

[0058] The test module 2000 and the socket module 2100 according to one embodiment of the present invention will be described in detail below with reference to FIGS.

[0059] 4 is a top view of a tester module according to an embodiment of the present invention. As shown in FIG. 4, a socket module 2100 is formed on the top surface of the tester module 2000 to correspond to the number and positions of the inserts in the tester tray.

[0060] The socket modules 2100 are accommodated in the spare space of the tray groove when the test tray is seated on the tester, and are electrically connected to the semiconductor products when the push switch (described later) is pushed while the push module presses the test tray. Each socket module 2100 can send and receive test signals to and from the electrically connected semiconductor products and transmit responses from the semiconductor products to the tester.

[0061] Continuing with the description, Fig. 5 is a schematic perspective view of a socket module according to an embodiment of the present invention. As shown in Fig. 5, a socket module 2100 according to an embodiment of the present invention may include a socket block 2110, a seating plate 2120, and a connector 2130.

[0062] The socket block 2110 is a block-shaped member accommodated in the remaining space of the tray groove and is provided to support the front of the connector 2130. That is, the socket block 2110 acts as a reinforcement member that supports the front of the connector 2130, and can prevent the connector 2130 from being damaged by the force of the insert being tightly attached. In addition, a circuit for connecting the connector 2130 to the main board of the tester can be provided inside the socket block 2110.

[0063] Block alignment pins 2112 extending forward may be protruded from both ends of the socket block 2110. The block alignment pins 2112 may protrude in a direction parallel to the direction in which an insert block (described later) approaches. The overall length of the socket block 2110, including the length of the block alignment pins 2112, may be shorter than the length of the clearance space of the tray groove described above. This is to prevent the block alignment pins 2112 from colliding with the insert when the socket block 2110 is inserted into the clearance space.

[0064] A connector 2130 for transmitting and receiving signals for testing while electrically connected to a semiconductor product may be disposed on the front surface of the socket block 2110. The connector 2130 may be formed primarily in a plate shape, or a connection means for electrically connecting to the semiconductor product may be provided at a portion that contacts the terminals of the semiconductor product. The connection means may be implemented in various conventional ways, e.g., a pogo pin, a conductive rubber pad, or the like. The semiconductor product may be moved forward by the insert and brought into close contact with the connector 1230. Pressurization of the insert maintains the semiconductor product in contact with the connector 1230, thereby maintaining an electrical connection between the connector 1230 and the semiconductor product during testing.

[0065] Similar to the block alignment pins 2112, the connector 2130 may have device alignment pins 2132 protruding forward. The device alignment pins 2132 are inserted into through holes formed in a semiconductor product attached to the insert, and can align the semiconductor product with respect to the connector 2130. In this case, the device alignment pins 2132 extend parallel to the block alignment pins 2112, but may have a smaller width or inner diameter than the block alignment pins 2112. Furthermore, the device alignment pins 2132 may protrude into the external space a shorter length than the block alignment pins 2112 so that the block alignment pins 2112 and the insert interact first.

[0066] The seating plate 2120 may be a plate-like member that provides a surface on which the insert housing is seated. Housing alignment pins 2124 may protrude upward from both widthwise ends of the seating plate 2120. The housing alignment pins 2124 may be inserted into the corresponding inserts during the test tray seating process and guide the inserts in a downward direction. More specifically, the housing alignment pins 2124 may be inserted into the insert housings (described below) and guide the seating position of the inserts during the insertion process. To this end, the insert housings may have grooves formed on their bottom surfaces that penetrate along the height direction so that the housing alignment pins 2124 can be inserted into them. Because the inserts are loosely attached to the tray body, the inserts may swing relative to the tray body and be seated in the correct seating position by the housing alignment pins 2124.

[0067] A block receiving groove 2122 may be formed on the upper surface of the seating plate 2120 to receive the lower end of an insertion block (described later) when the insert is seated. The block receiving groove 2122 may be formed by recessing the upper surface of the seating plate 2120 along the path along which the pair of insertion blocks advance or retreat. The pair of insertion blocks may advance or retreat while leaning one side against the side wall that forms the block receiving groove 2122.

[0068] An insert 1100 according to one embodiment of the present invention will be described below with reference to Fig. 6 to Fig. 11. First, Fig. 6 is a diagram showing the initial state of the insert according to one embodiment of the present invention. In contrast, Fig. 7 is a diagram showing the pressurized state of the insert according to one embodiment of the present invention.

[0069] 6 and 7, an insert 1100 according to one embodiment of the present invention may include an insert housing 1110, an insertion block 1120, a support block 1130, a moving block 1150, and a push switch 1140.

[0070] The insert housing 1110 is a component that forms the basic framework of the insert 1100, and can be shaped to be insertable into the tray groove. As described above, the insert housing 1110 is attached in close contact with the rear end of the tray groove. Such an insert housing 1110 can be shaped like a rectangular parallelepiped with a long width.

[0071] Meanwhile, the insert housing 1110 can be divided into an upper housing 1111 and a lower housing 1112. The lower housing 1112 has an internal space and is configured to accommodate most of the other components of the insert 1100 in the internal space. The upper housing 1111 can be coupled to the top surface of the lower housing 1111 to serve as a lid for the lower housing 1112.

[0072] Grooves into which the above-mentioned block alignment pins can be inserted may be formed in the lengthwise direction on the front surface of the lower housing 1112. Grooves into which the above-mentioned housing alignment pins can be inserted may be formed in the heightwise direction on the bottom surface of the lower housing 1112. Meanwhile, an opening through which the push switch 1140 is inserted may be formed in the center of the top surface of the upper housing 1111.

[0073] The insert block 1120 supports the semiconductor product so that the side of the semiconductor product is exposed to the tray groove. In this case, the insert block 1120 can support the semiconductor product in a standing posture. In this case, the standing posture can be a posture in which the side of the semiconductor product on which the terminals are formed faces forward. For example, the standing posture can be a posture in which the semiconductor product is standing upright, approximately perpendicular to the ground.

[0074] In this case, the insert blocks 1120 may be provided in a pair symmetrically spaced apart from each other at the front end of the lower housing 1111. The pair of insert blocks 1120 may be configured to hold together a semiconductor product inserted between them. The semiconductor product may descend from the upper side of the insert 1100 and be inserted between the pair of insert blocks 1120. The pair of insert blocks 1120 may share and support the lower left and right ends of the inserted semiconductor product.

[0075] The moving block 1150 is formed to be movable from inside the insert housing 1110 toward or away from the insert block 1120, thereby allowing the insert block 1120 to move relative to the insert housing 1110. For this purpose, the moving block 1150 can be integrally connected to the insert block 1120 by conventionally known fastening means. For example, the moving block 1150 can be connected to the insert block 1120 via fasteners.

[0076] The moving blocks 1150 are provided in pairs to correspond to each insert block 1120, and can move forward and backward in the space between the upper housing 1111 and the lower housing 1112. In the initial state, the moving blocks 1150 are accommodated to their maximum extent inside the lower housing 1112 as shown in Fig. 6, and when changed to a pressurized state, they protrude forward from the lower housing 1112 as shown in Fig. 7, moving the insert blocks 1120 forward.

[0077] The support block 1130 is configured to move forward in response to an external force applied by the push switch 1140, and in the process of moving forward, it can push the moving block 1150 forward. That is, the moving block 1150 is pressed forward by the advancing support block 1130 and can move forward together with the support block 1130. For this purpose, the support block 1130 can be configured to be movable forward and backward within the lower housing 1112.

[0078] The support block 1130 advances independently until the push switch 1140 is pressed to a certain depth. Once the push switch 1140 is pressed beyond that depth, the support block 1130 abuts against the moving block 1150 and advances together. As shown in FIG. 7 , when the support block 1130 and the moving block 1150 abut against each other, the front surface of the support block 1130 may be positioned slightly rearward of the center of the insertion block 1120. In this state, the front surface of the support block 1130 is positioned adjacent to the rear of the semiconductor product inserted into the insertion block 1120. More specifically, in this state, the front surface of the support block 1130 may be positioned slightly rearward of the insertion slot, which will be described later. In this case, the support block 1130 does not directly contact the semiconductor product, but rather serves to prevent the back surface of the semiconductor product from being excessively bent or shaken and damaged during movement or testing. Alternatively, the support block 1130 may directly contact the semiconductor product and support the semiconductor product during testing.

[0079] Meanwhile, device alignment holes 1134 may be formed on the front surface of the support block 1130 to align with the through holes of the semiconductor product inserted into the insertion block 1120. The device alignment holes 1134 may be formed by recessing the front surface of the support block 1130 rearward along the longitudinal direction. As the insertion block 1120 advances, the device alignment pins of the socket module may pass through the through holes of the semiconductor product and then be finally received in the device alignment holes 1134.

[0080] The push switch 1140 may be disposed in the insert housing 1110 so as to be retractable through an opening in the upper housing 1111. In the initial state shown in FIG. 6, the upper end of the push switch 1140 may protrude outside the insert housing 1110 through the opening, and the lower end may be housed inside the lower housing 1112. In the pressurized state shown in FIG. 7, the push switch 1140 is housed to its maximum extent in the lower housing 1112, and the support block 1130, moving block 1150, and insert block 1120 move forward based on an external force that moves the push switch 1140 downward. At this time, the pressurization of the push switch 1140 may be achieved by a push module provided in the tester.

[0081] The initial state of an insert according to one embodiment of the present invention will be described in detail below with reference to Figures 8 and 9. Figure 8 is a cross-sectional view of an insert according to one embodiment of the present invention in the initial state. In contrast, Figure 9 is a view showing the state inside the insert according to one embodiment of the present invention in the initial state.

[0082] Before describing the initial state, each component of the insert will be further described.

[0083] First, the push switch 1140 can include a switch body 1141 and a pressure wheel 1142. The switch body 1141 can be a roughly rectangular parallelepiped member that can be projected from and retracted into the opening of the upper housing 1111.

[0084] At least one pressure wheel 1142 may be a disc-shaped member rotatably attached to the lower end of the switch body 1141. The pressure wheel 1142 contacts the rear end of the support block 1130 and can transmit an external force to the rear end of the support block 1130. When the switch body 1141 is lowered by an external force, the pressure wheel 1142 rolls on the surface of the support block 1130 and can smoothly push the rear end of the support block 1130 forward. At this time, to ensure a predetermined friction performance between the support block 1130 and the pressure wheel 1142, the portion of the pressure wheel 1142 that contacts the support block 1130 may be made of a material with high friction.

[0085] Meanwhile, the support block 1130 can be divided into a front block 1131 and a rear block 1132. Referring to Figures 8 and 9, the front block 1131 can be a substantially straight plate-like member, and the rear block 1132 can be a substantially triangular prism having a partially curved section. The front block 1131 and the rear block 1132 can be fastened to each other with a fastener and move together.

[0086] Alternatively, the front block 1131 may be assembled to the rear block 1132 so that it can move forward and backward relative to the rear block 1132 while assembled to the rear block 1132. In this case, a known elastic member may be disposed between the front block 1131 and the rear block 1132. The known elastic member may be, for example, a coil spring. This allows the magnitude of the force that the front block 1131 applies to the semiconductor product when it is in close contact with the connector to be adjusted according to the situation.

[0087] For example, under normal circumstances, the elastic member may provide an elastic force in a direction that presses the front block 1131 forward to tightly seal the semiconductor product to the socket module. The semiconductor product may be uniformly pressed by the front block 1131 and brought into uniform contact with the connector. This allows the semiconductor product to maintain stable contact with the connector throughout the test process. Meanwhile, if the pressure applied due to incorrect installation or insertion of the semiconductor product is excessively set, the elastic force between the front block 1131 and the rear block 1132 may act primarily in a direction that pushes the rear block 1132 backward. This reduces the magnitude of the force acting on the semiconductor product to a level lower than the set force, thereby preventing excessive pressure from being applied to the semiconductor product and the socket module.

[0088] A forward guide inclined surface 1133 may be formed at a portion of the rear block 1132 where the push switch 1140 contacts, the inclination of which increases as it approaches the insertion block 1120. The forward guide inclined surface 1133 guides the external force acting from the pressure wheel 1142 to the support block 1130 to generate a component directed forward from the contact surface while the pressure wheel 1142 is descending.

[0089] The forward guide inclined surface 1133 includes a first inclined surface 1133a and a second inclined surface 1133b. First, the first inclined surface 1133a can cause the movement of the support block 1130 as the support block 1130 approaches the moving block 1150. Also, the second inclined surface 1133b can cause the movement of the support block 1130 as the support block 1130 moves further forward after the support block 1130 and the moving block 1150 come into contact with each other.

[0090] The first inclined surface 1133a may have a relatively gentle slope without a large change in slope. In contrast, the second inclined surface 1133b may have a steeper slope than the first inclined surface 1133a, and the slope may become larger as it moves away from the first inclined surface 1133a. To this end, the second inclined surface 1133b may be formed as a curved surface whose slope becomes larger as it moves away from the first inclined surface 1133a. In this case, a steeper slope may mean that the slope is closer to a vertical line.

[0091] This inclination allows the support block 1130 to approach the moving block 1150 relatively quickly, but to move at a slower speed once it comes into contact with and applies pressure to the moving block 1150. This is because the insertion block 1120 moves along with the moving block 1150 from the section where the moving block 1150 moves, and the movement speed of the support block 1130 is gradually reduced, thereby moving the insertion block 1120 at a slower speed. As a result, according to an embodiment of the present invention, the semiconductor product is attached to the socket module relatively slowly, minimizing damage to the semiconductor product and the socket module during the attachment process.

[0092] In the above example, the forward guide inclined surface 1133 is divided into two inclined surfaces having different slopes, but the present invention is not necessarily limited to such an embodiment. For example, the forward guide inclined surface 1133 may be formed of only one of the first inclined surface 1133a and the second inclined surface 1133b. Alternatively, the forward guide inclined surface 1133 may be formed of a single inclined surface having a slope different from the first inclined surface 1133a and the second inclined surface 1133b. Alternatively, the forward guide inclined surface 1133 may be divided into a greater number of inclined surfaces.

[0093] Meanwhile, the insert may further include a shaft 1161 for guiding the forward and backward movement of the moving block 1150. The shaft 1161 may extend longitudinally from the inside of the lower housing 1121, and both ends may be fixed to the inner walls of the lower housing 1121.

[0094] Furthermore, although not shown, the insert may include an initial state restoration elastic member that provides a restoring force to maintain the initial state in the absence of external force. The initial state restoration elastic member is disposed between the front surface of the moving block 1150 and the inner wall of the lower housing 1112, and can elastically support the moving block 1150 rearward. As an example, the initial state restoration elastic member may be provided as a helical spring or in a similar form.

[0095] The initial state of the insert according to one embodiment of the present invention will be described below with reference to Figures 8 and 9. In the initial state, the pressure wheel 1142 of the push switch 1140 may contact the front end of the first inclined surface 1133a. Referring to Figure 9, in this state, the moving block 1150 and the support block 1130 may be spaced apart without contacting each other.

[0096] Furthermore, in the initial state, the insert block 1120 can be maximally attached to the insert housing 1110. At this time, the upper housing 1111 and the lower housing 1112 may not protrude above the insert block 1120. More specifically, the upper housing 1111 and the lower housing 1112 may not protrude above the portion of the insert block 1120 where the insert slot 1122 is located. This is to prevent the insert housing 1110 from interfering with the semiconductor product when it is initially inserted into the insert block 1120. That is, the insert slot 1122 is not blocked by the insert housing 1110 even in the initial state.

[0097] Furthermore, in the initial state, the support block 1130 can be accommodated to the maximum extent inside the lower housing 1112. Therefore, the support block 1130 can be positioned furthest from the insert block 1120 in the initial state. At this time, the front block 1131 can be positioned inside the lower housing 1112, and the rear block 1132 can be in contact with the inner wall of the lower housing 1112. The support of the rear block 1132 by the inner wall of the lower housing 1112 prevents the rear block 1132 from being pushed backward by the elastic force of the initial state restoration elastic member.

[0098] Thereafter, when the push switch 1140 is pressed, the pressure wheel 1142 descends, causing the first inclined surface 1133a to move forward. When the pressure wheel 1142 reaches or near the boundary between the first inclined surface 1133a and the second inclined surface 1133b, the support block 1130 and the moving block 1150 come into contact with each other, and the front surface of the front block 1131 is positioned behind the insertion slot 1122.

[0099] Hereinafter, the pressurized state of the insert according to one embodiment of the present invention will be described with reference to FIGS.

[0100] Fig. 10 is a cross-sectional view of an insert according to an embodiment of the present invention in a pressurized state, while Fig. 11 is a diagram expressing the state inside the insert according to an embodiment of the present invention in a pressurized state.

[0101] 10 and 11, in the pressurized state according to one embodiment of the present invention, the switch body 1141 is accommodated to its maximum extent inside the insert housing 1110, thereby causing the support block 1130 to move forward to its maximum extent. During the process of switching to the pressurized state, the forward movement speed of the support block 1130 gradually decreases due to the inclination of the second inclined surface 1133b.

[0102] While switching to the pressurized state, the moving block 1150 overcomes the elastic force of the initial state restoration elastic member due to the pressure applied by the support block 1130 and moves forward along the shaft 1161. When the moving block 1150 comes into close contact with the inner wall of the lower housing 1112 and no longer moves forward, the switch to the pressurized state is completed.

[0103] A protruding pin 1135 protruding toward the rear of the moving block 1150 may be formed on the front surface of the rear block 1132 so that the support block 1130 can advance straight toward the moving block 1150 and push the moving block 1150 in a linear direction. The protruding pin 1135 may protrude at a perpendicular angle from the front surface of the rear block 1132 so as to be parallel to the advancing and retreating direction of the rear block 1132. Correspondingly, a pin receiving groove 1155 (see FIG. 9 ) may penetrate the moving block 1150 in the longitudinal direction at a portion opposite the protruding pin 1135, into which the protruding pin 1135 can be received and moved forward and backward. The inner diameter of the pin receiving groove 1155 may be set to be slightly larger than that of the protruding pin 1135.

[0104] When the push switch 1140 is pressed, the support block 1130 advances, causing the protruding pin 1135 to first enter the pin receiving groove 1155. For example, the protruding pin 1135 can be inserted into the pin receiving groove 1155 and advance while the push switch 1140 pushes the first inclined surface 1133a of the support block 1130. When the rear end of the protruding pin 1135 is fully received in the pin receiving groove 1135, the front surface of the rear block 1132 can contact the rear surface of the moving block 1150. In other words, when the pressure wheel 1142 comes into contact with the second inclined surface 1133b, the protruding pin 1135 can be fully inserted into the pin receiving groove 1155.

[0105] Meanwhile, the protruding pin 1135 is longer than the pin receiving groove 1155 and can be protruded out of the moving block 1150 when pressed. This may be to make it easier to restore the insert to its initial state by applying pressure to the protruding pin 1135 from the outside when the push switch 1140 cannot be restored to its original position due to deterioration of the initial state restoration elastic member or other reasons.

[0106] In addition, the front block 1131 is positioned at the rear of the insertion slot 1122 under pressure, preventing excessive shaking of the semiconductor product as the insertion block 1120 advances. To prevent damage to devices installed in the center of the semiconductor product as the front block 1131 advances, it is necessary to prevent contact between the devices and the front block 1131. To achieve this, the front surface of the front block 1131 is recessed rearward in the center relative to the frame. Devices coupled to the semiconductor product can face the recessed portion of the front block 1131 when the semiconductor product is housed in the insertion block 1120. Therefore, when the front block 1131 advances to its maximum extent, the frame of the semiconductor product is supported by the frame portion protruding from the front block 1131, and the devices installed in the semiconductor product can be housed in the recessed portion of the front block 1131. The depth of the recessed portion of the front block 1131 can be set so that the front block 1131 does not come into direct contact with the devices of the semiconductor product even when the front block 1131 advances to its maximum extent.

[0107] Hereinafter, a method for accommodating semiconductor products in an insert according to one embodiment of the present invention will be described with reference to FIGS.

[0108] Fig. 12 is a diagram illustrating a structure for holding semiconductor products by an insert block according to an embodiment of the present invention, while Fig. 13 is a diagram illustrating a semiconductor product housed in an insert according to an embodiment of the present invention.

[0109] 12, the inserting blocks 1120 may have inserting slots 1122 extending vertically (heightwise) so that semiconductor products can be inserted from above. More specifically, the inserting slots 1122 may be formed on opposing surfaces of the pair of inserting blocks 1120 and extend primarily along the height direction. In this case, the lower end of the inserting slot 1122 may be bent at an angle perpendicular to the height direction and extend further horizontally (widthwise). The left or right end of the semiconductor product may be accommodated in the portion of the inserting slot 1122 extending vertically, and the lower end may be accommodated in the portion extending horizontally.

[0110] Meanwhile, the insert may include a holding member 1121 that protrudes into the insertion slot 1122 to stably hold the semiconductor product. The holding member 1121 may be disposed inside an arrangement groove 1124 that penetrates the insert block 1120 in the longitudinal direction to meet the insertion slot 1122. In this case, the holding member 1121 may be disposed mainly inside the arrangement groove 1124, or its front end may protrude into the insertion slot 1122.

[0111] A support end 1123 may be disposed at the rear end of the arrangement groove 1124. The support end 1123 may be disposed to support the rear end of the device-holding elastic member. The device-holding elastic member may be provided to elastically support the holding member 1121 in the forward direction inside the insertion block 1120. For example, the device-holding elastic member may be a helical spring whose front end is connected to the holding member 1121 and whose rear end is connected to the support end 1123.

[0112] When a semiconductor product is inserted into the insertion slot 1122, the holding member 1121 overcomes the elastic force and can move backward toward the arrangement groove 1124. At this time, the holding member 1121 tries to move forward due to the elastic force, so the semiconductor product is held in the insertion slot 1122 without being shaken by the holding member 1121. At this time, the upper surface of the holding member 1121 is curved so that the holding member 1121 can be smoothly pushed backward after coming into contact with the semiconductor product during the process of inserting the semi-finished product into the insertion slot 1122.

[0113] Continuing with the explanation with reference to Fig. 13, as shown in Fig. 13, the semiconductor product D is attached to the insert 1100 while being hugged by a pair of insertion blocks 1120. The semiconductor product D can be inserted into or removed from the insert 1100 by a pick-and-place device possessed by a handler or the like. Such pick-and-place devices are known in various forms and will not be described further. For example, the semiconductor product D can be moved above the insert 1100 so as to be positioned between the pair of insertion slots 1120, and then lowered to be attached to the insert 1100.

[0114] At this time, the side of the semiconductor product D on which the terminals are formed may be exposed to the space in front of the insert 1100. Meanwhile, when the insert 1100 is seated in the test equipment, a socket module may be disposed in front of the semiconductor product D. When the push switch 1140 is pressed by the push module of the tester, the semiconductor product D may move forward along the moving block 1150 and the insertion block 1120. When the insert 1100 is completely switched to the pressurized state, the side of the semiconductor product D may be brought into close contact with the connector of the socket module. The insert 1100 maintains the pressurized state while the semiconductor product D is being tested, and may be switched back to the initial state when the test is completed. Thereafter, the test tray is removed by the rack master and moved to the handler, and the semiconductor products D inserted in the insert 1100 may be finally removed and sorted by grade.

[0115] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and not limiting. The scope of the present invention is defined by the claims that follow rather than the above detailed description, and all modifications and variations that fall within the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present invention. [Explanation of symbols]

[0116] 1: Test system 100: Handler 200: Loader 300: Unloader 400: Rack Master 500: Tester 1000: Test tray 1100: Insert 1110: Insert housing 1111: Upper housing 1112: Lower housing 1120: Insertion block 1121: Holding member 1122: Insertion slot 1123: Support end 1124: Placement groove 1130: Support block 1131: Front block 1132: Rear block 1133: Forward guidance slope 1133a: 1st slope 1133b:Second slope 1134: Device alignment hole 1135: ejector pin 1140: Push switch 1141: Switch body 1142: Pressure wheel 1150: Moving Block 1155: Pin receiving groove 1161: Shaft 1200: Tray body 1210: Tray groove 2000: Tester module 2100: Socket module 2110: Socket block 2112: Block alignment pin 2120: Seating plate 2122: Block receiving groove 2124: Housing alignment pin 2130: Connector 2132: Device alignment pin

Claims

1. a test tray including a plurality of inserts, each having a tray groove into which the insert is inserted; a handler for loading semiconductor products to be tested into empty inserts and removing the tested semiconductor products from the inserts; a tester including a plurality of socket modules each facing one of the inserts when the test tray is seated thereon; a rack master that carries the test tray between the handler and the tester; The insert is an insert housing inserted into the tray groove; an insert block that supports the semiconductor product such that one side of the semiconductor product is exposed to the tray groove and supports the semiconductor product in a standing posture; a moving block connected to the insertion block and provided inside the insert housing so as to be movable forward and backward; The socket module includes: a socket block that is accommodated in the empty space of the tray groove when the test tray is seated on the tester; a connector positioned on one side of the socket block, configured to transmit and receive signals for testing with the semiconductor product, and brought into close contact with the one side of the semiconductor product as the moving block advances, thereby electrically connecting with the semiconductor product.

2. The insert is 2. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 1, further comprising a support block that is retractable within the insert housing to push the moving block toward the insertion block, and that is positioned on the back side of the semiconductor product while in contact with the moving block.

3. The insert is 3. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 2, further comprising a push switch that protrudes above the insert housing and moves down by an external force to advance an end of the support block toward the insertion block.

4. The support block is 4. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 3, further comprising a forward guide inclined surface that contacts the push switch and increases in height as it approaches the insertion block.

5. The forward guide inclined surface is a first inclined surface that induces movement of the support block as the support block approaches the moving block; 5. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 4, further comprising: a second inclined surface that causes movement of the support block when the support block pushes the moving block and has a steeper inclination than the first inclined surface.

6. The support block is 3. The automated mounting and testing system for testing a semiconductor product in an upright position according to claim 2, wherein the semiconductor product has device alignment holes that are aligned with through holes formed in the semiconductor product when the semiconductor product is supported by the insertion block.

7. The insert blocks are provided in pairs, which are symmetrically arranged with respect to each other, 2. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 1, wherein each of said insertion blocks has an insertion slot extending in a vertical direction so that said semiconductor products are inserted closely from above.

8. The insert is a holding member protruding into the insertion slot; 8. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 7, further comprising: an elastic device-holding member for elastically supporting said holding member inside said insertion block.

9. The socket block 2. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 1, further comprising a block alignment pin extending parallel to the direction in which said insertion block approaches so as to guide the insertion block in a forward and backward direction.

10. The connector comprises:

10. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 9, further comprising device alignment pins extending parallel to the block alignment pins and inserted into through holes formed in the semiconductor product to align the semiconductor product.

11. The socket module includes:

2. The automated mounting and testing system for testing semiconductor products in an upright position according to claim 1, further comprising a seating plate on which the insert housing is seated and on which housing alignment pins protrude upward and are inserted into the insert housing during the seating process.

12. The seating plate has:

12. An automated mounting and testing system for testing semiconductor products in an upright position as described in claim 11, wherein the insert housing accommodates the lower end of the insertion block when seated, and a block accommodation groove is formed extending along the forward and backward direction of the insertion block.

13. an insert housing that is inserted into a tray groove formed in the test tray; an insert block supporting the semiconductor product in a standing position while one side of the semiconductor product is exposed to the tray groove; a moving block connected to the insertion block and arranged to be movable back and forth within the insert housing;

Images