Processing Equipment Unit

Abstract

To reduce vibration transmitted from a suction device to a processing device when the suction device is disposed in the processing device such as a grinding device.SOLUTION: A processing device unit includes: a processing device including a chuck table which suctions and holds a workpiece, and a processing unit which processes the workpiece suctioned and held by the chuck table; a suction device which supplies a negative pressure to the chuck table; a first base which supports the processing device; and a second base that supports the suction device. The second base has, at a bottom part thereof, multiple leg parts that are disposed so as to penetrate through through-holes provided in the first base without contacting with the first base, and are each capable of extending and contracting. The second base can be supported by the first base by reducing a protruding length of each of the multiple leg parts when the processing and suction devices are transported. The second base stands by itself without contacting with the first base by extending the protruding length of each of the multiple leg parts when the processing and suction devices are installed on a floor surface.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a processing device unit that includes a processing device including a chuck table that suction-holds a workpiece and a processing unit that processes the workpiece held by the chuck table, and a suction device that supplies negative pressure to the chuck table. [Background technology]

[0002] In the manufacturing process of semiconductor device chips, after forming multiple devices on the surface of a wafer such as a single crystal silicon substrate, the back side of the wafer is ground to thin the semiconductor device chips that are ultimately manufactured to the desired thickness.

[0003] A grinding machine is used to thin the wafer. The grinding machine has a disk-shaped chuck table that can rotate while holding the wafer by suction. The chuck table has a disk-shaped frame body, and a disk-shaped porous plate is fixed in a disk-shaped recess formed in the center of the frame body.

[0004] The upper surface of the frame and the upper surface of the porous plate are substantially flush with each other and function as a holding surface for holding the wafer by suction. A suction device such as a vacuum pump, which is provided separately from the grinding device, is connected to the porous plate via a pipe (see, for example, Patent Document 1). The negative pressure generated by the suction device is transmitted to the porous plate via the pipe.

[0005] Grinding devices and suction devices are usually sold, transported, installed, etc., independently as separate devices, but when using a grinding device, a suction device is also required. Packing and transporting the grinding device and suction device separately is more time-consuming than packing and transporting them together, and furthermore, when starting up the grinding device, connection work is required to properly connect the grinding device and suction device with pipes, electrical wiring, etc.

[0006] In contrast, if the suction device is placed inside the grinding device and fixed to the grinding device, and then the grinding device and the suction device are properly connected with pipes, electrical wiring, etc., and then packaged and transported, the connection work can be omitted and the packaging work can be reduced.

[0007] However, when the suction device is placed inside the grinding device and operated while fixed to the grinding device, the vibrations generated by the suction device are transmitted to the grinding device, causing problems such as cracking and chipping in the wafers being ground by the grinding device. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-124701 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made in view of the above problems, and has an object to reduce vibrations transmitted from a suction device to a processing device such as a grinding device when the suction device is disposed inside the processing device. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a processing device unit comprising: a processing device including a chuck table that suction-holds a workpiece and a processing unit that processes the workpiece suction-held by the chuck table; a suction device that supplies negative pressure to the chuck table; a first base that supports the processing device; and a second base that supports the suction device, wherein the second base has a plurality of extendable feet on its bottom that are arranged to pass through through holes provided in the first base without contacting the first base; when transporting the processing device and the suction device, the second base can be supported by the first base by shortening the protruding length of each of the plurality of feet; and when placing the processing device and the suction device on a floor surface, the protruding length of each of the plurality of feet can be extended so that the second base can stand on its own without contacting the first base.

[0011] Preferably, each of the plurality of legs has a shaft portion on which a spiral groove is formed, and the protruding length of each shaft portion can be changed by rotating each shaft portion.

[0012] Preferably, the processing unit has a spindle and processes the workpiece held by suction on the chuck table with a processing tool attached to the spindle, or has a laser beam irradiation unit and processes the workpiece by irradiating a laser beam onto the workpiece held by suction on the chuck table. [Effects of the Invention]

[0013] A processing device unit according to one aspect of the present invention includes a first base supporting a processing device and a second base supporting a suction device. The second base has a plurality of extendable legs on its bottom.

[0014] When transporting the processing device and the suction device, the second base can be supported by the first base by shortening the protruding length of each foot of the second base. On the other hand, when placing the processing device and the suction device on the floor, the protruding length of each foot of the second base can be extended so that the second base can stand on its own without contacting the first base.

[0015] Furthermore, the feet of the second base placed on the floor are positioned to pass through the through holes formed in the first base without contacting the first base, thereby reducing vibrations transmitted from the suction device to the processing device. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. [Figure 2] FIG. 2 is a perspective view of a first base and a second base. [Figure 3] 10 is a partial cross-sectional side view of the vicinity of the through hole of the first base. FIG. [Figure 4] FIG. 2 is a partially cross-sectional side view of a suction device and the like installed on a floor surface. [Figure 5] 10 is a perspective view of the first base and the second base when the grinding device and the suction device are transported together. FIG. [Figure 6] 1 is a side view, partially in section, of a suction device supported by a first base. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0017] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view of a grinding device unit (processing device unit) 2. The X-axis direction (left-right direction), Y-axis direction (front-rear direction), and Z-axis direction (grinding feed direction, up-down direction, height direction) shown in Fig. 1 are perpendicular to one another.

[0018] The grinding device unit 2 has a grinding device (processing device) 4 for grinding (processing) a wafer (workpiece) 11. Each component of the grinding device 4 is supported by a first base 6 formed by assembling frameworks 6a into a rectangular parallelepiped shape.

[0019] The sides and top of the first base 6 are provided with exterior covers, door sections, etc. to form a housing, but in Figure 1, the exterior covers, door sections, etc. provided on approximately the upper half of the first base 6 are omitted.

[0020] Foot portions 6b are provided at each of the four corners of the bottom of the first base 6. Foot portions 6b have a shaft portion 6c with a spiral groove formed on the side. A disk-shaped pedestal portion 6d is fixed to the bottom of shaft portion 6c, and is in contact with floor surface A of a room such as a clean room.

[0021] The shaft 6c is rotatably coupled to a screw hole (not shown) formed in the framework 6a. By rotating the shaft 6c, the height of the first base 6 with respect to the floor surface A can be adjusted. The number of the feet 6b may be four or more.

[0022] A horizontal articulated robot arm 8 for transporting wafers 11 is provided on the front side (one side in the Y-axis direction) of the rectangular parallelepiped first space defined by the first base 6. Cassette placement areas 10a and 10b are present on both sides of the robot arm 8 in the X-axis direction.

[0023] A cassette 12a capable of accommodating one or more wafers 11 is placed on the cassette placement area 10a, and a cassette 12b capable of accommodating one or more wafers 11 is also placed on the cassette placement area 10b.

[0024] The wafer 11 has a predetermined diameter (for example, about 200 mm) and is mainly made of single crystal silicon. On the front surface of the wafer 11, a plurality of planned dividing lines (streets) are set in a lattice pattern.

[0025] In each of the rectangular regions partitioned by the plurality of planned dividing lines, a device (not shown) such as an IC (Integrated Circuit) is formed. In contrast, no device is formed on the back side of the wafer 11.

[0026] There are no restrictions on the type, number, shape, structure, size, arrangement, etc. of devices formed on the wafer 11. The wafer 11 does not have to have any devices formed on it. There are also no restrictions on the type, material, size, shape, structure, etc. of the wafer 11.

[0027] An alignment mechanism 14 is provided on the rear side (the other side in the Y-axis direction) of the cassette 12a. The wafers 11 accommodated in the cassette 12a are transported to the alignment mechanism 14 by the robot arm 8, and are positioned at a predetermined position by the alignment mechanism 14.

[0028] A base end of a loading arm 16 that transports the wafer 11 is provided at a position adjacent to the alignment mechanism 14 in the X-axis direction. The loading arm 16 has a suction pad at its tip that holds the wafer 11 by suction.

[0029] The loading arm 16 holds the wafer 11, which has been aligned by the alignment mechanism 14, by suction with a suction pad, and then rotates around a rotation axis located at the base end to transport the wafer 11 to a chuck table 18 located at the loading / unloading position B.

[0030] A disk-shaped turntable 20 is provided behind the loading arm 16. A rotation drive source (not shown), such as a motor, is connected to the bottom of the turntable 20. The rotation drive source rotates the turntable 20 around a rotation axis that is approximately parallel to the Z-axis direction.

[0031] Three chuck tables 18, each of which holds a wafer 11 by suction, are arranged on the turntable 20 at approximately equal intervals along the circumferential direction of the turntable 20. Each chuck table 18 is positioned at a loading / unloading position B, a rough grinding position C, and a finish grinding position D by the rotation of the turntable 20.

[0032] For example, one chuck table 18 positioned at the carry-in / carry-out position B can be positioned at the rough grinding position C by rotating the turntable 20 clockwise by 120 degrees when viewed from above.

[0033] The chuck table 18 is then positioned at the finish grinding position D by rotating the turntable 20 an additional 120 degrees clockwise when viewed from above, and then returned to the loading / unloading position B by rotating the turntable 20 240 degrees counterclockwise when viewed from above.

[0034] The chuck table 18 has a disk-shaped frame made of non-porous ceramics. A disk-shaped recess is formed in the upper part of the frame, and a disk-shaped porous plate made of porous ceramics and having an outer diameter substantially the same as the inner diameter of the recess is fixed in the recess.

[0035] The porous plate is connected to a suction device 52 (described later) via a flow path (not shown) formed in the frame and a pipe (not shown) connected to the frame. Negative pressure generated by the suction device 52 is transmitted to the porous plate.

[0036] The upper surface of the porous plate and the upper surface of the frame are substantially flush with each other, and function as a holding surface that suction-holds the wafer 11. The holding surface has a conical shape that protrudes slightly from the periphery toward the center. However, the amount of protrusion of the holding surface is extremely small, for example, 20 μm.

[0037] The rotation axis of the chuck table 18 is slightly tilted with respect to the Z-axis direction, and a part of the holding surface and a grinding surface defined by the lower surfaces of a plurality of grinding wheels (described later) are disposed substantially parallel to each other. A rotation drive source (not shown) such as a motor is connected to the rotation axis, and the chuck table 18 can rotate around this rotation axis.

[0038] A pillar-shaped first support structure 22a is provided behind the rough grinding position C, and a first grinding feed unit 24a is provided on the front side of the first support structure 22a. Similarly, a pillar-shaped second support structure 22b is provided behind the finish grinding position D, and a second grinding feed unit 24b is provided on the front side of the second support structure 22b.

[0039] Each of the first grinding feed unit 24a and the second grinding feed unit 24b includes a pair of guide rails 26 arranged generally parallel to the Z-axis direction. A moving plate 28 is attached to the pair of guide rails 26 so as to be slidable along the guide rails 26.

[0040] A nut portion (not shown) is provided on the rear side of the movable plate 28, and a screw shaft 30 arranged generally parallel to the guide rail 26 is rotatably connected to this nut portion via a plurality of balls (not shown).

[0041] A motor 32 such as a stepping motor is connected to the upper end of the screw shaft 30. When the motor 32 rotates the screw shaft 30, the moving plate 28 moves along the Z-axis direction.

[0042] A rough grinding unit (processing unit) 34a for performing rough grinding on the wafer 11 is fixed to the front side of the moving plate 28 of the first grinding feed unit 24a. Similarly, a finish grinding unit (processing unit) 34b for performing finish grinding on the wafer 11 is fixed to the front side of the moving plate 28 of the second grinding feed unit 24b.

[0043] The rough grinding unit 34a and the finish grinding unit 34b each have a cylindrical spindle housing 36. Inside the spindle housing 36, a part of a columnar spindle 36a arranged along the Z-axis direction is accommodated.

[0044] A motor (not shown), such as a servo motor, is provided near the upper end of the spindle 36a. The lower end of the spindle 36a protrudes downward beyond the lower end of the spindle housing 36.

[0045] The center of the upper surface of a disk-shaped mount 42 is fixed to the lower end of the spindle 36a. A rough grinding wheel (machining tool) 44a is attached to the lower surface side of the mount 42 of the rough grinding unit 34a. The rough grinding wheel 44a includes an annular base having approximately the same diameter as the mount 42.

[0046] A plurality of roughly rectangular parallelepiped rough grinding wheels are arranged at roughly equal intervals around the periphery of the annular base on the underside of the annular base. The rough grinding wheels are formed by fixing abrasive grains made of diamond, cBN (cubic boron nitride), or the like with a binder such as metal, resin, or vitrified.

[0047] A finish grinding wheel (machining tool) 44b is attached to the underside of the mount 42 of the finish grinding unit 34b. The finish grinding wheel 44b is substantially the same as the rough grinding wheel 44a.

[0048] However, on the annular base of the finish grinding wheel 44b, multiple finish grinding stones, each having an average grain size smaller than the average grain size of the abrasive grains of the rough grinding stone, are arranged at approximately equal intervals along the circumferential direction of the annular base.

[0049] Directly below each of the rough grinding unit 34a and the finish grinding unit 34b, a grinding water supply nozzle (not shown) for supplying grinding water such as pure water is provided. Also, near each of the chuck tables 18 arranged at the rough grinding position C and the finish grinding position D, a thickness measuring device 46 for measuring the thickness of the wafer 11 during grinding is provided.

[0050] When rough grinding is performed, first, the front surface side of the wafer 11 is suction-held by the chuck table 18 arranged at the carry-in / carry-out position B. Then, the turntable 20 is rotated to move the chuck table 18 to the rough grinding position C.

[0051] The rough grinding unit 34a is fed downward while rotating the chuck table 18 and the spindle 36a of the rough grinding unit 34a at predetermined rotational speeds. When the grinding surface defined by the lower surfaces of the multiple rough grinding wheels rotating around the spindle 36a comes into contact with the backside of the wafer 11, the backside is roughly ground by the rough grinding wheel 44a.

[0052] During the rough grinding, grinding water is supplied to the processing area where the wafer 11 and the rough grinding wheel come into contact. After the rough grinding, the chuck table 18 is moved from the rough grinding position C to the finish grinding position D.

[0053] Thereafter, the finish grinding unit 34b is fed downward for processing while the chuck table 18 and the spindle 36a of the finish grinding unit 34b are rotated at predetermined rotational speeds.

[0054] When the grinding surface defined by the lower surfaces of the multiple finish grinding wheels rotating around the spindle 36a comes into contact with the back side of the wafer 11, the back side is finish-ground by the finish grinding wheel 44b. During the finish grinding, grinding water is supplied to the processing area where the wafer 11 and the finish grinding wheels come into contact.

[0055] An unloading arm 48 is provided at a position adjacent to the loading arm 16 in the X-axis direction. The unloading arm 48 has a suction pad that holds the wafer 11 by suction.

[0056] The unloading arm 48 holds the wafer 11 on the chuck table 18 placed at the carry-in / carry-out position B by suction using a suction pad after finish grinding, and transports the wafer 11 to the cleaning unit 50.

[0057] The cleaning unit 50 has a spinner table that holds the wafer 11 by suction. A cleaning nozzle that supplies pure water and an air nozzle that supplies dry air are provided near the spinner table. The wafer 11 that has been subjected to spinner cleaning and drying in the cleaning unit 50 is transported by the robot arm 8 and stored back in the cassette 12a.

[0058] A negative pressure is supplied to the suction pads of the chuck table 18, the loading arm 16, and the unloading arm 48 from a suction device 52. The suction device 52 has a suction source (not shown) such as a vacuum pump that generates negative pressure.

[0059] The suction source is generally a fluid machine that generates negative pressure by rotating a rotor, vane, etc., so operating the suction source vibrates the suction device 52. Each component of the suction device 52 is supported by a second base 54 formed by assembling frameworks 54a into a rectangular parallelepiped shape (see FIG. 2).

[0060] 2 is a perspective view of the first base 6 and the second base 54. The rectangular parallelepiped second space defined by the second base 54 is smaller than the first space defined by the first base 6. The second base 54 is disposed at the lower front portion of the first space of the first base 6.

[0061] The sides and top of the second base 54 are also provided with exterior covers, doors, etc. that constitute the housing, but these are omitted from Fig. 2. Feet 54b are provided at each of the four corners of the bottom of the second base 54. Each foot 54b is positioned so as to pass through a through-hole 6e provided in the framework 6a of the first base 6 (see Fig. 3).

[0062] Fig. 3 is a partial cross-sectional side view of the vicinity of the through-hole 6e of the first base 6. As shown in Fig. 3, the diameter of the through-hole 6e is larger than the diameter of the shaft portion 54c of the foot portion 54b, and the shaft portion 54c can be inserted into the through-hole 6e without coming into contact with the framework 6a (i.e., the first base 6).

[0063] A spiral groove is formed on the side of the shaft 54c, and the shaft 54c is rotatably coupled to a screw hole (not shown) formed in the framework 54a. By rotating the shaft 54c, the protruding length 54e of the shaft 54c relative to the framework 54a can be changed.

[0064] A disk-shaped base 54d that contacts the floor A of a room such as a clean room is fixed to the bottom of the shaft 54c. Each base 54d is located below each framework 6a. For example, when an operator rotates the base 54d with a tool, the shaft 54c rotates and the protruding length 54e expands or contracts.

[0065] 4 is a partially cross-sectional side view of the suction device 52 and other components installed on floor A. When installing the grinding device 4 and the suction device 52 on floor A, the feet 6b of the grinding device 4 are placed on floor A, and the protruding lengths 54e of the shafts 54c are extended as shown in FIG.

[0066] As a result, the suction device 52 is supported by the feet 54b on the floor surface A. In particular, the second base 54 is free-standing without contacting the first base 6.

[0067] Furthermore, the framework 54a and outer cover of the second base 54 do not contact the framework 6a and outer cover of the first base 6, and the shaft portion 54c of the second base 54 does not contact the framework 6a of the first base 6 at the through hole 6e.

[0068] Therefore, even if the suction device 52 is operated, the vibration transmitted from the suction device 52 to the grinding device 4 can be reduced compared to when the second base 54 is in contact with the first base 6.

[0069] In contrast, when transporting the grinding device 4 and the suction device 52, the protruding length 54e of each shaft portion 54c of the second base 54 is shortened, thereby raising the pedestal portion 54d from the floor surface A and supporting the second base 54 on the first base 6.

[0070] FIG. 5 is a perspective view of the first base 6 and the second base 54 when the grinding device 4 and the suction device 52 are transported together, and FIG. 6 is a partially cross-sectional side view of the suction device 52 supported by the first base 6.

[0071] In this embodiment, the grinding device 4 and the suction device 52 can be packed and transported together with the two properly connected by pipes, electrical wiring, etc., which has the advantage of eliminating the need for connection work and reducing the effort required for packing. Note that the transmission of vibrations via pipes, electrical wiring, etc. is sufficiently small and negligible compared to the magnitude of the vibrations transmitted when the frameworks 6a, 54a are in contact with each other.

[0072] The grinding device unit 2 has a control unit (not shown) that controls the operations of the grinding device 4 and the suction device 52. The control unit is configured by a computer including, for example, a processor (processing device) represented by a CPU (Central Processing Unit) and a memory (storage device).

[0073] The storage device includes a main storage device such as a dynamic random access memory (DRAM), a static random access memory (SRAM), or a read-only memory (ROM), and an auxiliary storage device such as a flash memory, a hard disk drive, or a solid-state drive. The auxiliary storage device stores predetermined software. The functions of the control unit are realized by operating the processing device and other components in accordance with this software.

[0074] As described above, in the grinding device unit 2 of this embodiment, when transporting the grinding device 4 and the suction device 52, the second base 54 is supported by the first base 6 by shortening the protruding length 54e of each shaft portion 54c, and the suction device 52 is supported by the first base 6 of the grinding device 4.

[0075] In contrast, when the grinding device 4 and the suction device 52 are installed on the floor surface A, by extending the protruding length 54e of each shaft portion 54c, the second base 54 can stand independently from the first base 6 without contacting the first base 6. Therefore, vibrations transmitted from the suction device 52 to the grinding device 4 can be reduced.

[0076] In addition, the structures, methods, etc. according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention. For example, instead of the grinding device 4, a polishing device, a cutting tool device, a cutting device, or a laser processing device (none of which are shown) may be adopted as the processing device unit.

[0077] (Variation 1) A case where a polishing device is used as the processing device will be described. The polishing device has a polishing unit (processing unit). Components of the polishing device, such as the polishing unit and chuck table, are supported by the above-mentioned first base 6. The polishing unit has a spindle arranged along the Z-axis direction.

[0078] A rotation drive source such as a motor is provided near the upper end of the spindle, and a disc-shaped grinding wheel is attached to the lower end of the spindle via a disc-shaped mount. In other words, the grinding wheel (machining tool) is attached to the spindle via the mount.

[0079] The grinding wheel has a disk-shaped platen that contacts the mount. A polishing pad is fixed to the underside of the platen. The polishing pad includes abrasive grains made of diamond or the like and a pad portion made of foamed resin, nonwoven fabric, or the like for securing the abrasive grains.

[0080] When polishing the wafer 11, first, one side of the wafer 11 is suction-held by a disk-shaped chuck table. Then, the other side of the wafer 11 is polished by rotating the chuck table and lowering the polishing wheel rotating around the spindle at a predetermined processing feed rate.

[0081] (Variation 2) Next, a case where a tool cutting device is used as the processing device will be described. The tool cutting device has a tool cutting unit (processing unit). Components of the tool cutting device, such as the tool cutting unit and the chuck table, are supported by the first base 6 described above.

[0082] The tool cutting unit has a spindle arranged along the Z-axis direction. A rotary drive source such as a motor is provided near the upper end of the spindle, and a disk-shaped tool wheel is attached to the lower end of the spindle via a disk-shaped mount.

[0083] That is, the bite wheel (machining tool) is attached to the spindle via a mount. The bite wheel has a disk-shaped base, and a cutting blade made of diamond or the like is fixed to the underside of the base.

[0084] The chuck table of the tool cutting device has a substantially flat holding surface that is arranged substantially parallel to the XY plane, and is configured to be moved along the X-axis by a ball screw type movement mechanism.

[0085] When cutting the wafer 11 with a tool, first, one side of the wafer 11 is held by suction on a disk-shaped chuck table. Then, the height position of the cutting blade of the tool wheel, which rotates around the spindle, is set to a predetermined height.

[0086] Then, the chuck table is moved in the X-axis direction from the outside of the cutting unit to directly below the cutting unit, thereby cutting the other surface of the wafer 11 with the cutting tool.

[0087] (Variation 3) Next, a case where a cutting device is used as the processing device will be described. The cutting device has a cutting unit (processing unit). Components of the cutting device, such as the cutting unit and chuck table, are supported by the first base 6 described above.

[0088] The cutting unit is configured to be capable of indexing along the Y-axis direction and cutting along the Z-axis direction. The cutting unit has a spindle disposed along the Y-axis direction.

[0089] A rotary drive source such as a motor is provided near the base end of the spindle, and a cutting blade with an annular cutting edge is attached to the tip end of the spindle via a cylindrical mount. In other words, the cutting blade (machining tool) is attached to the spindle via the mount.

[0090] The cutting blade may be a hub type or a hubless type (so-called washer type). The cutting blade has an annular cutting edge. The cutting edge is formed by fixing abrasive grains made of diamond, cBN, or the like with a bonding material such as metal, resin, or vitrified.

[0091] The chuck table of the cutting device also has a substantially flat holding surface that is arranged substantially parallel to the XY plane. The chuck table is configured to be able to be fed for processing along the X-axis direction by a ball screw type movement mechanism.

[0092] When cutting the wafer 11, first, one surface of the wafer 11 is suction-held by a disk-shaped chuck table, and then the lower end of the cutting blade, which rotates around the spindle, is positioned at a predetermined height.

[0093] In this state, the chuck table is processed and fed relative to the cutting blade to cut the wafer 11. By cutting, half-cut grooves that do not reach from the other surface (top surface) to one surface (bottom surface) and full-cut grooves that reach from the other surface to one surface are formed in the wafer 11.

[0094] (Variation 4) Next, a case where a laser processing device is used as the processing device will be described. The laser processing device has a laser beam irradiation unit (processing unit). Components of the cutting device, such as the laser beam irradiation unit and the chuck table, are supported by the first base 6 described above.

[0095] The laser beam irradiation unit includes a laser oscillator having, for example, Nd:YAG, Nd:YVO4, or the like as a laser medium. The laser oscillator emits a pulsed laser beam having a wavelength that is transmitted through the wafer 11 (for example, 1064 nm when the wafer 11 is a silicon single crystal wafer).

[0096] The laser beam may be converted to a predetermined harmonic through a nonlinear optical crystal, for example, to a wavelength that is absorbed by the wafer 11 (355 nm if the wafer 11 is a silicon single crystal wafer).

[0097] The laser beam irradiation unit includes an irradiation head having a focusing lens, and the laser beam is irradiated from the irradiation head onto the wafer 11 so as to be focused at a height position corresponding to the wafer 11 held by suction on the holding surface of the chuck table.

[0098] The chuck table has a substantially flat holding surface that is disposed substantially parallel to the XY plane, and is configured to be capable of machining feed along the X-axis direction and indexing feed along the Y-axis direction by a ball screw type movement mechanism.

[0099] When laser processing is performed on the wafer 11, first, one surface of the wafer 11 is suction-held by a disk-shaped chuck table. Then, the focal point of the laser beam is positioned inside the wafer 11 or near the other surface of the wafer 11.

[0100] In this state, the chuck table is moved toward the focal point to perform laser processing on the wafer 11. If the laser beam has a wavelength that transmits through the wafer 11, a modified region with reduced mechanical strength is formed near the focal point, and if the laser beam has a wavelength that absorbs the wafer 11, the region near the focal point is ablated. [Explanation of symbols]

[0101] 2: Grinding device unit (processing device unit), 4: Grinding device (processing device) 6: first base, 6a: framework, 6b: foot, 6c: shaft, 6d: base, 6e: through hole 8: Robot arm 10a, 10b: cassette placement area, 12a, 12b: cassette 11: Wafer (workpiece) 14: Alignment mechanism, 16: Loading arm 18: Chuck table, 20: Turntable 22a: first support structure, 22b: second support structure 24a: First grinding feed unit, 24b: Second grinding feed unit 26: Guide rail, 28: Moving plate, 30: Screw shaft, 32: Motor 34a: Rough grinding unit (processing unit) 34b: Finish grinding unit (processing unit) 36: Spindle housing, 36a: Spindle, 42: Mount 44a: Rough grinding wheel, 44b: Finish grinding wheel 46: Thickness measuring device, 48: Unloading arm, 50: Cleaning unit 52:Suction device 54: second base, 54a: framework, 54b: foot, 54c: shaft, 54d: pedestal 54e: Projection length A: Floor surface, B: Loading / unloading position, C: Rough grinding position, D: Finish grinding position

Claims

1. A processing device unit, a processing device including a chuck table that suction-holds a workpiece, and a processing unit that processes the workpiece suction-held by the chuck table; a suction device that supplies negative pressure to the chuck table; a first base supporting the processing device; a second base supporting the suction device; Equipped with the second base has a plurality of extendable legs at its bottom, the legs being arranged to pass through through holes formed in the first base without contacting the first base; When the processing device and the suction device are transported, the second base can be supported by the first base by shortening the protruding length of each of the plurality of feet, When the processing device and the suction device are installed on a floor surface, the protruding length of each of the plurality of feet is extended so that the second base can stand on its own without contacting the first base.

2. Each of the plurality of legs has a shaft portion on which a spiral groove is formed, 2. The processing device unit according to claim 1, wherein the length of projection of each shaft portion can be changed by rotating each shaft portion.

3. The processing unit comprises: A machine having a spindle, and machining the workpiece held by suction on the chuck table with a machining tool attached to the spindle; or 3. The processing device unit according to claim 1, further comprising a laser beam irradiation unit, which processes the workpiece held by suction on the chuck table by irradiating the workpiece with a laser beam.

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