Cutting device and method for manufacturing cut products

Abstract

To provide a cutting device capable of suppressing worsening of responsiveness and the occurrence of overshooting in flow rate control of process water, and a method for manufacturing a cut product.SOLUTION: The cutting device receives process water supplied from an external water supply facility of the cutting device. The cutting device comprises: a cutting unit; a supply unit; a detection unit; an adjustment unit; and a control unit. The cutting unit cuts an article to be cut. The supply unit directly or indirectly supplies the process water supplied from the water supply facility to at least one of the article and the cutting unit. The detection unit detects the flow rate of the process water supplied by the supply unit. The adjustment unit adjusts the flow rate of the process water supplied by the supply unit. The control unit executes both feedforward control for controlling the adjustment unit on the basis of an external factor and a feedback control for controlling the adjustment unit so that the detection result can approach a target value on the basis of the detection result of the detection unit before cutting of the article.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cutting device and a method for producing a cut product. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2002-313753 (Patent Document 1) discloses a dicing device. In this dicing device, a workpiece is processed by a processing unit, and cutting water is supplied to the processing unit during processing of the workpiece. The amount of cutting water supplied to the processing unit is regulated by a flow rate regulator. In this dicing device, fluctuations in the flow rate of the cutting water are suppressed by controlling the flow rate regulator using a detection signal from a flow rate sensor that detects the flow rate of the cutting water as a feedback signal (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-313753 Summary of the Invention [Problem to be solved by the invention]

[0004] In the dicing machine disclosed in Patent Document 1, the flow rate of cutting water (an example of process water) supplied to the processing section is affected by disturbance factors (for example, fluctuations in water pressure in the water supply equipment that supplies cutting water to the dicing machine). Depending on the disturbance factors, response to cutting water flow rate control can deteriorate, causing overshoot. Patent Document 1 does not disclose any means for solving such problems.

[0005] The present invention has been made to solve such problems, and its purpose is to provide a cutting device and a method for manufacturing cut products that can suppress deterioration of responsiveness and the occurrence of overshoot in flow rate control of process water. [Means for solving the problem]

[0006] A cutting device according to one aspect of the present invention receives a supply of process water from a water supply facility external to the cutting device. The cutting device includes a cutting unit, a supply unit, a detection unit, an adjustment unit, and a control unit. The cutting unit cuts the object to be cut. The supply unit directly or indirectly supplies the process water supplied from the water supply facility to at least one of the object to be cut and the cutting unit. The detection unit detects the flow rate of the process water supplied by the supply unit. The adjustment unit adjusts the flow rate of the process water supplied by the supply unit. The control unit performs both feedforward control, which controls the adjustment unit based on external disturbance factors before cutting the object to be cut, and feedback control, which controls the adjustment unit based on the detection result by the detection unit so that the detection result approaches a target value.

[0007] A method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the cutting device, and includes a step of cutting an object to be cut using the cutting device. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a cutting device and a method for manufacturing a cut product that can suppress deterioration of responsiveness and occurrence of overshoot in flow rate control of process water. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view schematically showing the cutting device. [Figure 2] FIG. 2 is a diagram schematically illustrating a configuration of a flow path for process water in the cutting device. [Figure 3] FIG. 1 is a diagram schematically illustrating a hardware configuration of a computer. [Figure 4] FIG. 10 is a diagram showing an example of transition of the flow rate of cutting water in a supply unit when feedback control is performed. [Figure 5] FIG. 10 is a control block diagram relating to control of the flow rate of cutting water in the supply unit. [Figure 6] FIG. 10 is a diagram illustrating an example of a correction value table. [Figure 7] FIG. 10 is a diagram showing an example of transition of the flow rate of cutting water in a supply unit when both feedback control and feedforward control are performed. [Figure 8] 10 is a flowchart illustrating an example of a processing procedure in feedback control. [Figure 9] 10 is a flowchart illustrating an example of a processing procedure in feedforward control. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that the same or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn schematically with objects appropriately omitted or exaggerated.

[0011] [1. Configuration] <1-1. Overall configuration of the cutting device> FIG. 1 is a plan view schematically showing a cutting apparatus 1 according to the present embodiment. The cutting apparatus 1 is configured to cut a package substrate (an example of an object to be cut) to separate the package substrate into a plurality of electronic components (package components (an example of a cut product)). In the package substrate, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin. Note that the object to be cut does not necessarily have to be a package substrate, and may be, for example, a substrate (including a wafer) that is not sealed with resin.

[0012] Examples of package substrates include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package) package substrate, an LED (Light Emitting Diode) package substrate, and a QFN (Quad Flat No-leaded) package substrate.

[0013] The cutting device 1 is configured to inspect each of the plurality of individual electronic components. In the cutting device 1, an image of each electronic component is captured and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as either a "good product" or a "defective product."

[0014] In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is singulated into a plurality of electronic components S1 by a cutting device 1. Hereinafter, of the two surfaces of the package substrate P1, the resin-sealed surface will be referred to as the mold surface, and the surface opposite the mold surface will be referred to as the ball / lead surface. Note that when the object to be cut is a substrate that is not resin-sealed, the surface facing upward at the time of cutting (cut surface) corresponds to the ball / lead surface in this embodiment, and the surface opposite the cut surface corresponds to the mold surface in this embodiment.

[0015] As shown in FIG. 1, the cutting apparatus 1 includes, as its components, a cutting module A1 and an inspection and storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured plurality of electronic components S1 and then store the electronic components S1 in a tray. In the cutting apparatus 1, each component is detachable and replaceable with respect to the other components.

[0016] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a transport unit .

[0017] The substrate supply unit 3 pushes out the package substrates P1 one by one from a magazine M1 that accommodates a plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrate P1 is positioned with the ball / lead surface facing upward.

[0018] The positioning unit 4 positions the package substrate P1 by placing the package substrate P1 pushed out from the substrate supply unit 3 on the rail portion 4a. Thereafter, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0019] The cutting table 5 holds the package substrate P to be cut. Here, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the package substrate P1 transported by the positioning unit 4 by suction from below. The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in the figure. The movement mechanism 5c can move the holding member 5a along the Y axis in the figure.

[0020] The spindle unit 6 cuts the package substrate P1 to separate the package substrate P1 into a plurality of electronic components S1. Here, a cutting device 1 having a twin-spindle configuration with two spindle units 6 is shown as an example. The spindle units 6 are movable along the X-axis and Z-axis in the figure. However, the cutting device 1 may also have a single-spindle configuration with one spindle unit 6.

[0021] The spindle unit 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, dividing the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotating shaft 6c while being sandwiched between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts. The first flange is also referred to as a rear flange, and the second flange is also referred to as an outer flange.

[0022] The spindle unit 6 is provided with cutting water nozzles (supply units 100, 110 (Figure 2)), cooling water nozzles (supply units 102, 112), and scrap-blowing water nozzles (supply units 120, 122). The cutting water nozzles spray cutting water toward the blade 6a, which rotates at high speed. The cooling water nozzles spray cooling water toward the vicinity of the cutting location of the package substrate P1. The scrap-blowing water nozzles spray scrap-blowing water to blow away cutting chips and the like. Each of the cutting water, cooling water, and scrap-blowing water is an example of process water.

[0023] After the cutting table 5 picks up the package substrate P1, the first position confirmation camera 5d captures an image of the package substrate P1 and confirms the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. The mark indicates, for example, the cutting position of the package substrate P1.

[0024] The cutting table 5 then moves toward the spindle unit 6 along the Y-axis in the figure. After the cutting table 5 moves below the spindle unit 6, the cutting table 5 and the spindle unit 6 are moved relative to each other to cut the package substrate P1. Thereafter, if necessary, the package substrate P1 is imaged by a second position confirmation camera 6b provided on the spindle unit 6 to confirm the position and other details of the package substrate P1. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

[0025] After cutting of the package substrate P1 is completed, the cutting table 5 moves away from the spindle unit 6 along the Y-axis in the figure while holding the singulated electronic components S1. During this movement, the first cleaner 5e cleans and dries the top surfaces (ball / lead surfaces) of the electronic components S1. This cleaning may be performed, for example, by directly spraying cleaning water onto the top surfaces of the electronic components S1, or by supplying cleaning water to the top surfaces of the electronic components S1 using a brush or the like. The cleaning water used by the first cleaner 5e is an example of process water. Furthermore, although the cutting device 1 is provided with two first cleaners 5e aligned in the X-axis direction in the figure, the number of first cleaners 5e is not limited to this.

[0026] The transport unit 7 picks up the electronic component S1 held on the cutting table 5 from above and transports the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the underside (mold surface) of the electronic component S1. This cleaning may be performed, for example, by directly spraying cleaning water onto the underside of the electronic component S1, or by supplying cleaning water to the underside of the electronic component S1 using a brush or the like. The cleaning water used by the second cleaner 7a is an example of process water.

[0027] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. The first optical inspection camera 12 may be provided in the cutting module A1.

[0028] The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. The inspection table 11 can also be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by suction.

[0029] The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (ball / lead surface and mold surface) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each positioned near the inspection table 11 so as to capture images above.

[0030] The first optical inspection camera 12 captures an image of the mold surface of the electronic component S1 being transported to the inspection table 11 by the transport unit 7. The transport unit 7 then places the electronic component S1 on a holding member of the inspection table 11. After the holding member picks up the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the electronic component S1 is imaged by the second optical inspection camera 13.

[0031] An inspected electronic component S1 is placed on the placement unit 14. The placement unit 14 is movable along the Y axis in the drawing. The inspection table 11 places the inspected electronic component S1 on the placement unit 14.

[0032] The extraction unit 15 transfers the electronic components S1 placed in the placement unit 14 to a tray. The electronic components S1 are sorted into "good products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to a good product tray 15a or a defective product tray 15b based on the results of the sorting. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. When the good product tray 15a and the defective product tray 15b are each filled with electronic components S1, they are replaced with new trays.

[0033] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, for example.

[0034] The computer 50 controls the operation of each part of, for example, the cutting module A1 and the inspection and storage module B1, for example, the board supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction unit 15, and the monitor 20. The configuration of the computer 50 will be described in detail later.

[0035] <1-2. Process water flow path configuration> As described above, process water is used in each of the spindle unit 6, the first cleaner 5e, and the second cleaner 7a in the cutting device 1. The process water is supplied to each part of the cutting device 1 from a water supply facility 400 (FIG. 2) outside the cutting device 1.

[0036] 2 is a diagram schematically illustrating the configuration of the flow path of the process water in the cutting apparatus 1. As shown in FIG. 2, each of the supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140 is connected to the water supply system 400 through a common pipe PL1. The pipe PL1 branches at a branch point PO1, and each branch is connected to one of the supply units. Each of the supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140 is configured to directly or indirectly supply the process water supplied from the water supply system 400 to at least one of the workpiece (including the package substrate P1 and the electronic component S1) and the blade 6a.

[0037] Each of the supply units 100, 102 is provided on one of the spindle units 6. The supply unit 100 is composed of a nozzle for cutting water, and the supply unit 102 is composed of a nozzle for cooling water. The supply unit 102 includes a first nozzle 104 and a second nozzle 106. The first nozzle 104 is also called a standard nozzle and is used when spraying cooling water onto a standard-sized workpiece. The second nozzle 106 is also called a fork nozzle and is used when spraying cooling water onto a workpiece smaller than the standard size. The size of the supply port in the second nozzle 106 is smaller than the size of the supply port in the first nozzle 104.

[0038] Each of the supply units 110, 112 is provided on the other spindle unit 6. The supply unit 110 is composed of a nozzle for cutting water, and the supply unit 112 is composed of a nozzle for cooling water. The supply unit 112 includes a first nozzle 114 and a second nozzle 116. The first nozzle 114 is also called a standard nozzle and is used when spraying cooling water onto a standard-sized workpiece. The second nozzle 116 is also called a fork nozzle and is used when spraying cooling water onto a workpiece smaller than the standard size. The size of the supply port in the second nozzle 116 is smaller than the size of the supply port in the first nozzle 114.

[0039] Each of the supply units 120 and 122 is configured with a nozzle for scrap-blowoff water. The supply unit 120 is provided on one spindle unit 6, and the supply unit 122 is provided on the other spindle unit 6. Each of the supply units 130, 132, and 140 is configured with a nozzle for cleaning water. The supply unit 130 is provided on one first cleaner 5e, and the supply unit 132 is provided on the other first cleaner 5e. The supply unit 140 is provided on the second cleaner 7a.

[0040] A flow rate sensor SE10 and a pressure meter 410 are arranged on the flow path from the water supply equipment 400 to the branch point PO1. The flow rate sensor SE10 is configured to detect the amount (water volume) of process water supplied from the water supply equipment 400 to the cutting device 1. The pressure meter 410 is configured to detect the pressure (water pressure) of the process water supplied from the water supply equipment 400 to the cutting device 1.

[0041] A solenoid valve 300, a proportional control valve 200, and a flow sensor SE1 are arranged in this order on the flow path from the branch point PO1 to the supply unit 100. The solenoid valve 300 is configured to be able to open and close under control of a computer 50. The proportional control valve 200 is configured to be able to adjust its opening under control of the computer 50. By adjusting the opening of the proportional control valve 200, the flow rate of the process water (cutting water) supplied to the supply unit 100 can be controlled. The flow sensor SE1 is configured to detect the flow rate of the process water supplied to the supply unit 100.

[0042] In addition to the above-mentioned solenoid valve 300, a proportional control valve 202, a flow sensor SE2, and a three-port solenoid valve 302 are arranged in this order on the flow path from the branch point PO1 to the supply unit 102. The proportional control valve 202 is configured to be able to adjust its opening under control of the computer 50. By adjusting the opening of the proportional control valve 202, the flow rate of the process water (cooling water) supplied to the supply unit 102 can be controlled. The flow sensor SE2 is configured to detect the flow rate of the process water supplied to the supply unit 102. The three-port solenoid valve 302 is configured to switch between the first nozzle 104 and the second nozzle 106 to which the process water is supplied under control of the computer 50.

[0043] A solenoid valve 310, a proportional control valve 210, and a flow rate sensor SE3 are arranged in this order on the flow path from the branch point PO1 to the supply unit 110. The solenoid valve 310 is configured to be able to open and close under control of the computer 50. The proportional control valve 210 is configured to be able to adjust its opening under control of the computer 50. By adjusting the opening rate of the proportional control valve 210, the flow rate of the process water (cutting water) supplied to the supply unit 110 can be controlled. The flow rate sensor SE3 is configured to detect the flow rate of the process water supplied to the supply unit 110.

[0044] In addition to the above-mentioned solenoid valve 310, a proportional control valve 212, a flow sensor SE4, and a three-port solenoid valve 312 are arranged in this order on the flow path from the branch point PO1 to the supply unit 112. The proportional control valve 212 is configured to be able to adjust its opening under control of the computer 50. By adjusting the opening of the proportional control valve 212, the flow rate of the process water (cooling water) supplied to the supply unit 112 can be controlled. The flow sensor SE4 is configured to detect the flow rate of the process water supplied to the supply unit 112. The three-port solenoid valve 312 is configured to switch between the first nozzle 114 and the second nozzle 116 to which the process water is supplied under control of the computer 50.

[0045] A solenoid valve 320, a flow sensor SE5, and a variable needle throttle valve 322 are arranged in this order on the flow path from branch point PO1 to the supply unit 120. The solenoid valve 320 is configured to be able to open and close under control of the computer 50. The flow sensor SE5 is configured to detect the flow rate of the process water (waste removal water) supplied to the supply unit 120. The variable needle throttle valve 322 is configured to manually receive an instruction from an operator to adjust the flow rate of the process water. The flow rate of the process water supplied to the supply unit 120 is adjusted by the operator operating the variable needle throttle valve 322.

[0046] A solenoid valve 330, a flow sensor SE6, and a variable needle throttle valve 332 are arranged in this order on the flow path from branch point PO1 to the supply unit 122. The solenoid valve 330 is configured to be able to open and close under control of the computer 50. The flow sensor SE6 is configured to detect the flow rate of the process water (waste removal water) supplied to the supply unit 122. The variable needle throttle valve 332 is configured to manually receive an instruction from an operator to adjust the flow rate of the process water. The flow rate of the process water supplied to the supply unit 122 is adjusted by the operator's operation of the variable needle throttle valve 332.

[0047] A solenoid valve 340, a flow sensor SE7, and a variable needle throttle valve 342 are arranged in this order on the flow path from branch point PO1 to the supply unit 130. The solenoid valve 340 is configured to be able to open and close under control of the computer 50. The flow sensor SE7 is configured to detect the flow rate of the process water (cleaning water) supplied to the supply unit 130. The variable needle throttle valve 342 is configured to manually receive an instruction from an operator to adjust the flow rate of the process water. The flow rate of the process water supplied to the supply unit 130 is adjusted by the operator operating the variable needle throttle valve 342.

[0048] A solenoid valve 350, a flow sensor SE8, and a variable needle throttle valve 352 are arranged in this order on the flow path from branch point PO1 to the supply unit 132. The solenoid valve 350 is configured to be able to open and close under control of the computer 50. The flow sensor SE8 is configured to detect the flow rate of the process water (cleaning water) supplied to the supply unit 132. The variable needle throttle valve 352 is configured to manually receive an instruction from an operator to adjust the flow rate of the process water. The flow rate of the process water supplied to the supply unit 132 is adjusted by operating the variable needle throttle valve 352 by the operator.

[0049] A solenoid valve 360, a needle adjustment valve 362, and a flow sensor SE9 are arranged in this order on the flow path from branch point PO1 to supply unit 140. Solenoid valve 360 ​​is configured to be openable and closable under control of computer 50. Needle adjustment valve 362 is configured to manually receive an instruction from an operator to adjust the flow rate of the process water. The needle adjustment valve 362 allows for more accurate flow rate adjustment of the process water than when a needle variable throttle valve (e.g., needle variable throttle valves 322, 332, 342, 352) is used. The flow rate of the process water supplied to supply unit 140 is adjusted by the operator operating needle adjustment valve 362. Flow sensor SE9 is configured to detect the flow rate of the process water (cleaning water) supplied to supply unit 140. In this way, in cutting device 1, process water is supplied to each supply unit from a common water supply facility 400.

[0050] <1-3. Computer hardware configuration> Fig. 3 is a diagram schematically illustrating the hardware configuration of computer 50. As shown in Fig. 3, computer 50 includes a control unit 70, an input / output I / F (interface) 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0051] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

[0052] The input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input / output I / F 90 is used to send data from the computer 50 to each component in the cutting device 1 and to receive data sent from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from a user (operator). The reception unit 95 is configured, for example, with some or all of a touch panel, a keyboard, a mouse, and a microphone.

[0053] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store, for example, a control program 81. The control program 81 is executed by the control unit 70 to realize various operations of the cutting device 1. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 then controls each component by having the CPU 72 interpret and execute the control program 81 loaded into the RAM 74.

[0054] [2. Suppression of the effects of external disturbances on process water flow control] As described above, for example, when cutting the package substrate P1, cutting water and cooling water (one example of process water) are sprayed toward the package substrate P1. The flow rate of the process water (hereinafter also referred to as "cutting water, etc.") sprayed toward the package substrate P1 when cutting the package substrate P1 affects the quality of the electronic components S1 to be manufactured. In order to prevent a deterioration in the quality of the electronic components S1, it is important to control the flow rate of the cutting water, etc. The same can be said for both cutting water and cooling water, so the following explanation will focus on cutting water.

[0055] For example, feedback control may be performed to maintain the flow rate of cutting water at a predetermined set value (target value). For example, in feedback control to bring the amount of cutting water supplied by the supply unit 100 (FIG. 2) closer to the target value, the opening of the proportional control valve 200 is adjusted based on the detection result of the flow rate sensor SE1 so that the detection result of the flow rate sensor SE1 approaches the target value.

[0056] 4 is a diagram showing an example of a transition in the amount of cutting water supplied when feedback control is performed, in which the horizontal axis represents time and the vertical axis represents the amount of cutting water supplied.

[0057] For example, when supply unit 100 is not affected by disturbance factors (when process water is supplied at the expected flow rate to the flow path from water supply equipment 400 to supply unit 100 (FIG. 2)), the amount of cutting water supplied in supply unit 100 changes according to the change L1 (theoretical value). When focusing on the amount of cutting water supplied in supply unit 100, disturbance factors are factors that affect the amount of process water supplied to the flow path from water supply equipment 400 to supply unit 100.

[0058] Examples of disturbance factors include the water pressure in water supply equipment 400, the amount of process water supplied from water supply equipment 400, the state of water supply by water supply equipment 400 to equipment (not shown) other than cutting device 1, the type of nozzle (standard nozzle or fork nozzle) used in supply units 102 and 112, and the number of supply units that simultaneously supply process water in a group including supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140. For example, if the number of supply units that simultaneously supply process water increases, the supply units will compete for the process water flowing through pipe PL1, which will affect the amount of process water supplied to the flow path from water supply equipment 400 to supply unit 100.

[0059] When feedback control is performed, for example, if supply unit 100 is affected by an external disturbance and process water is supplied to the flow path from water supply equipment 400 to supply unit 100 at a flow rate lower than expected, the supply amount of cutting water in supply unit 100 will change according to change L2. In other words, the responsiveness of the cutting water flow rate control will deteriorate, and it will take a longer time for the supply amount of cutting water to reach the target value.

[0060] On the other hand, when feedback control is performed, for example, if supply unit 100 is affected by an external disturbance and process water is supplied to the flow path from water supply equipment 400 to supply unit 100 at a flow rate greater than expected, the supply amount of cutting water in supply unit 100 will change according to change L3. That is, an overshoot occurs in the flow rate control of cutting water, causing the supply amount of cutting water to temporarily exceed the target value.

[0061] The cutting device 1 according to the first embodiment is devised to prevent these problems from occurring. Specifically, in the cutting device 1, feedforward control is performed in addition to feedback control in controlling the flow rate of cutting water and the like. In feedforward control, an adjustment unit (e.g., proportional control valve 200) is controlled based on disturbance factors before cutting of the workpiece. Similar control is performed in each of the supply units 100, 102, 110, and 112, so the following description will representatively focus on the flow rate control of cutting water in supply unit 100.

[0062] 5 is a control block diagram related to the control of the flow rate of cutting water in the supply unit 100. As shown in FIG. 5, the control unit 70 includes a subtraction unit 710, a feedback control unit 720, a multiplication unit 730, and a feedforward control unit 740.

[0063] The flow rate sensor SE1 detects the amount of cutting water supplied by the supply unit 100. The subtraction unit 710 calculates the difference between a detection value indicated by the detection result of the flow rate sensor SE1 and a target value for the amount of cutting water supplied by the supply unit 100. Information indicating this target value (target value information) is stored, for example, in the storage unit 80 (FIG. 3). Based on the calculation result of the subtraction unit 710, the feedback control unit 720 generates a command value that instructs the opening of the proportional control valve 200 so that the detection result of the flow rate sensor SE1 approaches the target value, and outputs the generated command value. For example, the opening of the proportional control valve 200 is controlled according to the voltage applied to the proportional control valve 200, and the command value generated by the feedback control unit 720 indicates a voltage value.

[0064] The feedforward control unit 740 acquires information related to the above-mentioned disturbance elements (disturbance element information). The feedforward control unit 740 acquires, for example, information related to the open / closed state of each of the solenoid valves 300, 310, 320, 330, 340, 350, and 360, and information related to the connection state of the three-port solenoid valves 302 and 312. Based on this, the feedforward control unit 740 determines the usage state of each supply unit. The feedforward control unit 740 generates a correction value for correcting the command value generated by the feedback control unit 720, for example, based on the usage state of each supply unit.

[0065] Fig. 6 is a diagram showing an example of the correction value table 500. The correction value table 500 is stored, for example, in the storage unit 80. As shown in Fig. 6, in the correction value table 500, a provisional correction value is associated with each combination of the open / closed state of each of the solenoid valves 300, 310, 320, 330, 340, 350, and 360 and the type of nozzle used in each of the supply units 102 and 112. In other words, in the correction value table 500, a provisional correction value is associated with each combination of supply units that simultaneously supply process water in a group including the supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140.

[0066] 6, the feedforward control unit 740 identifies a provisional correction value associated with the determined combination of usage states of each supply unit by referring to the correction value table 500. The feedforward control unit 740 corrects the provisional correction value based on, for example, other disturbance factors (e.g., the water pressure of the water supply system 400, the amount of process water supplied from the water supply system 400, and the state of water supply by the water supply system 400 to devices other than the cutting device 1), and outputs the corrected correction value. For example, if the water pressure of the water supply system 400 is lower than expected, the provisional correction value is corrected so that the opening of the proportional control valve 200 is increased.

[0067] Multiplication unit 730 multiplies the command value output by feedback control unit 720 by the correction value output by feedforward control unit 740. The calculation result (corrected command value) by multiplication unit 730 is output to proportional control valve 200, and the opening degree of proportional control valve 200 is adjusted.

[0068] 7 is a diagram showing an example of the transition of the flow rate of cutting water in the supply unit 100 when both feedback control and feedforward control are performed. Referring to FIG. 7, the horizontal axis represents time and the vertical axis represents the amount of cutting water supplied. When both feedback control and feedforward control are performed, the amount of cutting water supplied in the supply unit 100 transitions according to transition L4. In this way, by performing both feedback control and feedforward control, deterioration of responsiveness and the occurrence of overshoot in the flow rate control of cutting water (process water) are suppressed.

[0069] [3. Operation] As described above, the control unit 70 performs both feedback control and feedforward control. In the cutting device 1, similar control (feedback control and feedforward control) is performed on the flow rate of the process water in each of the supply units 100, 102, 110, and 112. The following describes the flow rate control of the process water in the supply unit 100 as a representative example.

[0070] 8 is a flowchart showing an example of a processing procedure in feedback control. The processing shown in this flowchart is repeatedly executed by the feedback control unit 720 of the control unit 70 while the supply unit 100 is supplying process water.

[0071] 8, feedback control unit 720 determines whether the detection result by flow sensor SE1 is the target value (step S100). If it is determined that the detection result by flow sensor SE1 is not the target value (NO in step S100), feedback control unit 720 generates a new command value so that the flow rate of cutting water approaches the target value (step S110).

[0072] For example, if the detection result by the flow sensor SE1 does not reach the target value, a command value is generated to increase the opening of the proportional control valve 200, while if the detection result by the flow sensor SE1 exceeds the target value, a command value is generated to decrease the opening of the proportional control valve 200.

[0073] On the other hand, if it is determined in step S100 that the detection result by flow sensor SE1 is the target value (YES in step S100), feedback control unit 720 maintains the command value (step S120). Feedback control unit 720 outputs the command value generated in step S110 or the command value maintained in step S120 (step S130).

[0074] 9 is a flowchart showing an example of a processing procedure in feedforward control. The processing shown in this flowchart is repeatedly executed by the feedforward control unit 740 of the control unit 70 while the supply unit 100 is supplying process water.

[0075] 9, feedforward control unit 740 determines whether or not a disturbance factor that affects the amount of process water supplied to the flow path from water supply equipment 400 to supply unit 100 has been detected (step S200). If it is determined that a disturbance factor has not been detected (NO in step S200), the process proceeds to return.

[0076] On the other hand, if it is determined that a disturbance element has been detected (YES in step S200), feedforward control unit 740 generates a correction value according to the detected disturbance element (step S210), and outputs the generated correction value (step S220).

[0077] As described above, in the control unit 70, the command value generated by the feedback control unit 720 is multiplied by the correction value generated by the feedforward control unit 740 to calculate the corrected command value. The control unit 70 adjusts the flow rate of cutting water in the supply unit 100 by controlling the proportional control valve 200 based on the corrected command value.

[0078] [4. Features] As described above, in the cutting device 1 according to this embodiment, the control unit 70 performs both feedforward control, which controls the adjustment unit (e.g., proportional control valve 200) based on disturbance factors before cutting the workpiece, and feedback control, which controls the adjustment unit based on the detection result of the detection unit (e.g., flow sensor SE1) so that the detection result approaches a target value. According to the cutting device 1, the adjustment unit is separately adjusted in accordance with disturbance factors, so that deterioration of responsiveness and occurrence of overshoot in flow control of cutting water (process water) can be suppressed.

[0079] The cutting device 1 is an example of a "cutting device" in the present invention. The water supply equipment 400 is an example of a "water supply equipment" in the present invention. The blade 6a is an example of a "cutting unit" in the present invention. The package substrate P1 is an example of an "object to be cut" in the present invention. Each of the supply units 100, 102, 110, and 112 is an example of a "supply unit" in the present invention. Each of the flow sensors SE1, SE2, SE3, and SE4 is an example of a "detection unit" in the present invention. Each of the proportional control valves 200, 202, 210, and 212 is an example of an "adjustment unit" in the present invention. The control unit 70 is an example of a "control unit" in the present invention. The supply units 120, 122, 130, 132, and 140 are an example of at least a part of the "plurality of other supply units" in the present invention. The memory unit 80 is an example of a "memory unit" in the present invention.

[0080] 5. Other Embodiments The concept of the above embodiment is not limited to the embodiment described above. An example of another embodiment to which the concept of the above embodiment can be applied will be described below.

[0081] <5-1> In the above embodiment, examples of disturbance factors include the water pressure in water supply equipment 400, the amount of process water supplied from water supply equipment 400, the supply status of water by water supply equipment 400 to equipment other than cutting device 1, the type of nozzles used in supply units 102 and 112, and the number of supply units that simultaneously supply process water in a group including supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140. Then, a corrected correction value is generated by correcting the provisional correction value determined according to the combination of the usage status of each supply unit based on other disturbance factors (e.g., the water pressure in water supply equipment 400, the amount of process water supplied from water supply equipment 400, and the supply status of water by water supply equipment 400 to equipment other than cutting device 1). However, the method of generating the correction value is not limited to this.

[0082] For example, the provisional correction value managed in correction value table 500 may be used as the correction value as is. Alternatively, the correction value may be generated based on at least a portion of the water pressure in water supply system 400, the amount of process water supplied from water supply system 400, the state of water supply by water supply system 400 to devices other than cutting device 1, the type of nozzle used in supply units 102 and 112, and the number of supply units simultaneously supplying process water in a group including supply units 100, 102, 110, 112, 120, 122, 130, 132, and 140.

[0083] <5-2> Furthermore, the flow rate of the process water in each of the supply units 120, 122, 130, 132, and 140 may be adjusted by a proportional control valve instead of a variable needle throttle valve or a needle adjustment valve. In this case, the opening of each proportional control valve may be adjusted by performing both feedback control and feedforward control, similar to the proportional control valve 200.

[0084] <5-3> Furthermore, in the above embodiment, the cutting device 1 includes nine supply units, but the number of supply units included in the cutting device 1 is not limited to this. The cutting device 1 only needs to include at least one supply unit in which the flow rate of the process water is adjusted by a proportional control valve.

[0085] <5-4> Furthermore, in the above embodiment, the control unit 70 may update the temporary correction values ​​managed in the correction value table 500, for example, based on the detection results of a flow sensor (e.g., flow sensor SE1) after performing feedforward control using the temporary correction values ​​managed in the correction value table 500. That is, the control unit 70 may update the correction values ​​associated with the combinations of supply units that simultaneously supply process water, for example, based on the detection results of the flow sensors. This can further improve the accuracy of the correction values ​​managed in the correction value table 500.

[0086] <5-5> In the above-described embodiment, each supply unit may supply not only process water but also two fluids, process water and air. By discharging air together with the process water, the discharge pressure of the process water can be increased.

[0087] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0088] Furthermore, the above-described embodiment is merely an example of the present invention in all respects. Various improvements and modifications can be made to the above-described embodiment within the scope of the present invention. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment. [Explanation of symbols]

[0089] 1 cutting device, 3 substrate supply unit, 4 positioning unit, 4a rail unit, 5 cutting table, 5a holding member, 5b rotation mechanism, 5c moving mechanism, 5d first position confirmation camera, 5e first cleaner, 6 spindle unit, 6a blade, 6b second position confirmation camera, 6c rotation axis, 7 conveying unit, 7a second cleaner, 11 inspection table, 12 first optical inspection camera, 13 second optical inspection camera, 14 placement unit, 15 extraction unit, 15a tray for good products, 15b tray for defective products, 20 monitor, 50 computer, 70 control unit, 72 CPU, 74 RAM, 76 ROM, 80 memory unit, 81 control program, 90 input / output I / F, 100, 102, 110, 112, 120, 122, 130, 132, 140 supply unit, 104, 114 First nozzle, 106, 116 Second nozzle, 200, 202, 210, 212 Proportional control valve, 300, 310, 320, 330, 340, 350, 360 Solenoid valve, 302, 312 Three-port solenoid valve, 322, 332, 342, 352 Needle variable throttle valve, 362 Needle adjustment valve, 400 Water supply equipment, 410 Pressure gauge, 500 Correction value table, 710 Subtraction unit, 720 Feedback control unit, 730 Multiplication unit, 740 Feedforward control unit, A1 Cutting module, B1 Inspection and storage module, L1-L4 Transition, M1 Magazine, P1 Package board, PL1 Pipe, PO1 Branch point, S1 Electronic components, SE1-SE10 Flow sensors.

Claims

1. A cutting device that receives a supply of process water from a water supply facility external to the cutting device, a cutting unit that cuts the object to be cut; a supply unit that directly or indirectly supplies process water supplied from the water supply facility to at least one of the object to be cut and the cutting unit; a detection unit that detects the flow rate of the process water supplied by the supply unit; an adjusting unit that adjusts the flow rate of the process water supplied by the supply unit; a control unit that performs both feedforward control to control the adjustment unit based on a disturbance factor before cutting of the object to be cut, and feedback control to control the adjustment unit based on a detection result by the detection unit so that the detection result approaches a target value; a plurality of other supply units each different from the supply unit; Each of the plurality of other supply units directly or indirectly supplies process water to at least one of the object to be cut and the cutting unit; the supply unit and each of the plurality of other supply units are configured to receive a supply of process water from the common water supply facility; The disturbance factor includes a water supply status from the water supply facility to devices other than the cutting device.

2. The cutting device of claim 1 , wherein the disturbance factors further include at least one of a water pressure in the water supply facility and an amount of process water supplied from the water supply facility.

3. The size of the supply port of the process water in the supply unit can be changed, 3. The cutting device according to claim 1, wherein the disturbance factors further include a size of the supply port used to supply process water.

4. 4. The cutting device according to claim 1, wherein at least some of the other supply units of the plurality of other supply units clean the object to be cut by directly or indirectly supplying process water to the object to be cut.

5. The cutting device according to claim 1 , wherein the disturbance factors further include the number of supply units that simultaneously supply process water in a group including the supply unit and the plurality of other supply units.

6. a storage unit configured to store a correction value for each combination of supply units that simultaneously supply process water among a set including the supply unit and the plurality of other supply units; The cutting device according to claim 1 , wherein the control unit performs the feedforward control using the correction value associated with the combination.

7. The cutting device according to claim 6 , wherein the control unit updates the correction value associated with the combination based on a detection result by the detection unit.

8. A method for manufacturing a cut product using the cutting device according to any one of claims 1 to 7, A method for manufacturing a cut product, comprising the step of cutting the object to be cut using the cutting device.

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