electronic machinery

Abstract

To provide a light-emitting device excellent in portability. A highly browsable light-emitting device is provided. A highly portable and highly browsable light-emitting device is provided.SOLUTION: A flexible light-emitting panel is supported by a plurality of housings provided apart from each other, and the light-emitting device can be folded by bending the light-emitting panel to such an extent that surfaces of adjacent housings are in contact with each other. Further, part or the whole of the housings is magnetized, whereby two adjacent housings are fixed to each other by magnetic force when the light-emitting device is used in a folded state.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] One aspect of the present invention relates to a light-emitting device. In particular, an electroluminescent (EL) The present invention relates to a light-emitting device utilizing the luminescence phenomenon. The present invention relates to a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. One aspect of the present invention relates to a product, a method, or a manufacturing method. , manufacture, or composition of matter. Therefore, the technical field of one embodiment of the present invention disclosed in this specification is specifically related to semiconductor devices, Display devices, light-emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices, input / output devices , their driving methods, or their manufacturing methods can be cited as examples.

[0003] In this specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. Refers to devices in general, including semiconductor elements such as transistors, semiconductor circuits, arithmetic units, and memory The device is one aspect of a semiconductor device. Optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices The device may include a semiconductor device. [Background technology]

[0004] In recent years, light-emitting devices and display devices are expected to be used in a variety of applications, and diversification is required. are.

[0005] For example, in light-emitting devices and display devices for mobile devices, thinness and light weight are essential. It is also required to be resistant to breakage.

[0006] Light-emitting devices (also called EL elements) that utilize the EL phenomenon have become a promising solution for LCD devices. Since no backlight is required, it is easy to make it thin and lightweight. It also responds quickly to input signals. It has the characteristics of being able to be driven by a low-voltage DC power supply, and is used in light-emitting devices and display devices. Applications to this are being considered.

[0007] For example, Patent Document 1 discloses a film substrate on which transistors and other switching elements are mounted. A flexible active matrix light emitting device equipped with an organic EL element is disclosed. do. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-174153 Summary of the Invention [Problem to be solved by the invention]

[0009] In recent years, the amount of information displayed has increased by enlarging the display area of ​​the display device, and the list of displayed information has On the other hand, for mobile device applications, the display area needs to be enlarged. If the number of documents is increased, portability will decrease, and the need for improved display visibility and high It was difficult to achieve both high portability and high reliability.

[0010] An object of one embodiment of the present invention is to provide a light-emitting device or the like that is highly portable. Another object is to provide a light emitting device or the like that is easy to see. Another object of the present invention is to provide a light-emitting device or the like that is excellent in visibility and visibility. One of the goals is to provide facilities such as

[0011] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It will be clear from the description of the specification, etc. that there are other problems than those mentioned above. It is possible to extract it. [Means for solving the problem]

[0012] One embodiment of the present invention is a flexible light-emitting panel and a light-emitting device that supports the light-emitting panel and is provided in parallel. and a plurality of housings each spaced apart from one another, each housing having a light-emitting panel folded therein. This is a light-emitting device in which two opposing housings are fixed magnetically when bent.

[0013] Each of the plurality of housings has a ferromagnetic material, and the ferromagnetic material is disposed on the top and bottom surfaces of the housing. The top surfaces of two adjacent enclosures are provided with opposite magnetic poles. They are preferably arranged in their respective housings with the poles facing each other.

[0014] Alternatively, each of the plurality of housings is strongly secured so that the magnetic poles face the upper and lower surfaces of the housing. A first housing having a magnetic material, or a second housing having a soft magnetic material that can be magnetized by a ferromagnetic material. The first and second housings are arranged alternately, and the light-emitting panel is folded. The first and second housings that face each other when bent are fixed together magnetically. It is preferable.

[0015] The soft magnetic material may be Fe, Fe-Ni alloy, Fe-Si-Al alloy, or Fe-Co alloy. It is preferable that the metal oxide contains one or more selected from the group consisting of metals, metals, and gold.

[0016] The ferromagnetic material may be an isotropic ferrite magnet, an anisotropic ferrite magnet, or a neodymium magnet. , samarium-cobalt magnet, and alnico magnet.

[0017] In addition, when the light-emitting panel is folded, if the two opposing housings are fixed, The adhesive force between the two housings is preferably 0.1 kgf or more and 2.0 kgf or less.

[0018] In any of the above configurations, the light-emitting panels are arranged so that adjacent housings are alternately stacked. When the device is folded, one of the two outermost housings is The first state is folded to the top, and the second state is folded to the bottom. It is preferable that the structure be reversibly deformable between the state of (a) and the state of (b).

[0019] In this specification, the term "light emitting device" refers to a display device using a light emitting element as well as a light source (illumination Also, connectors, such as FPC (Flexible Printed Circuit) are used for light-emitting devices. printed circuit) or TCP (Tape Carrier Packet modules with a TCP (transmission control) attached, and modules with a printed wiring board attached to the TCP COG (Chip On Glass) method on a substrate on which a module or light emitting element is formed A module in which an IC (integrated circuit) is directly mounted may be included in a light-emitting device. do. [Effects of the Invention]

[0020] According to one embodiment of the present invention, a light-emitting device with excellent portability can be provided. Alternatively, a light emitting device with excellent portability and visibility can be provided. Note that the effects of one embodiment of the present invention are not limited to these. Depending on the circumstances, the effect may be different from those mentioned above. be. [Brief explanation of the drawings]

[0021] [Figure 1] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 2] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 3] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 4] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 5] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 6] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 7] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 8] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 9] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 10] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 11] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 12] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 13] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 14] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 15]1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 16] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 17] 1A to 1C illustrate examples of electronic devices. [Figure 18] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 19] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0023] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0024] In each figure described in this specification, the size, layer thickness, or area of ​​each component is The figures may be exaggerated for clarity and are not necessarily limited to that scale. stomach.

[0025] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0026] (Embodiment 1) In this embodiment, a light-emitting device according to one embodiment of the present invention will be described with reference to drawings.

[0027] A light-emitting device according to one embodiment of the present invention includes a plurality of flexible light-emitting panels provided at a distance from each other. The light emitting device has a structure in which the light emitting device is supported by two adjacent housings. It is possible to bend the light-emitting panel in the area where the surface of the adjacent housing faces the surface of the other housing. The light-emitting device can be folded by bending the light-emitting panel. The light device is highly portable when folded and has a wide, seamless emitting surface when unfolded. The optical area (display area) provides excellent visibility of the display.

[0028] Furthermore, the light-emitting device of one embodiment of the present invention can be made to have a magnetic field by imparting magnetic fields to a part or the entire housing. When the light emitting device is folded and used, the two adjacent housings are fixed together by magnetic force. Therefore, no mechanical fixture is required to secure the housings together. This reduces the number of parts required and simplifies the design.

[0029] In addition, since magnetic force is used to secure the two housings together, it is difficult to fold them from the unfolded state. When transforming the light-emitting device into a flat state, simply bend the light-emitting panel and bring the adjacent housings closer together. This generates an attractive force, which allows the light-emitting device to be semi-automatically transformed into a predetermined shape. When the light emitting device is transformed from an unfolded state to a folded state, the light emitting device may be oriented in an unintended direction. It can prevent the light panel from bending or twisting, reducing damage to the light-emitting panel. On the other hand, for example, if a user bends the light-emitting panel so that the two housings come into contact, and then fixes the housings, In the case of a configuration where the light-emitting panel connecting the two housings is fixed using a fixture, the specification limit is reached. The light-emitting panel may bend to the following radius or twist in an unintended direction. There is a risk that the light emitting panel may be damaged due to such factors.

[0030] Also, since the magnetic attraction is inversely proportional to the square of the distance between the two bodies, When transforming it into its unfolded state, do not insert your fingers or other objects between the two fixed housings. By leaving a small gap, the two housings can be easily separated. There is no need to pull the two connected housings apart by pulling them in opposite directions. This can cause problems such as the light-emitting panel connecting the two housings being accidentally pulled and damaged. You can suppress the condition.

[0031] The light-emitting panel of the light-emitting device according to one embodiment of the present invention can be bent in either an inward or outward direction. It is possible.

[0032] In this specification, the case where the light emitting surface of the light emitting panel is bent inward is referred to as "inward bending." ", and when the light-emitting surface of the light-emitting panel is bent outward, it is called "outward bending." The light-emitting surface of a panel or a light-emitting device refers to the surface from which light from a light-emitting element is extracted.

[0033] In the light-emitting device according to one embodiment of the present invention, the light-emitting surface of the light-emitting panel faces inward when the light-emitting device is folded. By bending the light emitting surface in this way, scratches and dirt can be prevented from getting on the light emitting surface during transportation. For example, this is suitable for carrying the light emitting device in a pocket or bag.

[0034] When using the light-emitting device of one embodiment of the present invention, it is possible to provide a seamless, wide light-emitting device in an unfolded state. The entire light-emitting area may be used, or the light-emitting panel may be bent so that the light-emitting surface faces outward. A portion of the light-emitting area may be used. The portion of the light-emitting area that is folded inward and hidden from the user. By making the light region a non-light emitting region, the power consumption of the light emitting device can be reduced.

[0035] [Configuration example] An example of the configuration of a light-emitting device according to one embodiment of the present invention will be described below. It has a flexible light-emitting panel supported by the body, and by bending the light-emitting panel in two places, This will be explained using an example of a light-emitting device that can be transformed from an unfolded state to a folded state. Reveal.

[0036] FIG. 1(A) shows the light emitting device 100 in an unfolded state. FIG. 1(B) shows the light emitting device 100 in an unfolded state. 1 shows the light emitting device 100 in the process of changing from one folded state to the other. (C) shows the light emitting device 100 in a folded state. FIG.

[0037] The light emitting device 100 includes a flexible light emitting panel 101. has a plurality of housings (housings 111, 112, and 113). The housings are spaced apart from one another. In the following description, the housings 111, 112, and 113 are distinguished from one another. When describing common matters without distinction, it may be referred to simply as the housing.

[0038] Each housing only needs to support the light-emitting panel 101, and the housing is located on the light-emitting surface side or the light-emitting surface of the light-emitting panel. It is sufficient that the light source is provided on at least one of the opposite sides (also called the lower side or back side). 2, the outer periphery of the light-emitting surface of the light-emitting panel 101 and the opposite side of the light-emitting surface of the light-emitting panel In this way, the housing that supports both sides of the light-emitting panel 101 is By using a housing having such a structure, the mechanical strength is increased, and damage to the light emitting device 100 can be prevented. Cut.

[0039] Each housing may be rigid, or the housing itself may be deformable in response to a twisting or bending force. Each housing is made of a material that is at least less flexible than the light-emitting panel 101. It is also possible to use an elastic body such as hard rubber for the frame. Materials that can make up the body include plastic, metals such as aluminum, stainless steel, and Alloys such as titanium alloys, rubbers such as silicone rubber, etc. can be used.

[0040] 1 and 2, the outer periphery of the light-emitting surface of light-emitting panel 101 and the light-emitting surface It is preferable to provide a protective layer 102 to support the other side of the light-emitting panel 101. Even if the mechanical strength is low, the protective layer 102 increases the mechanical strength at the curved portion. In this case, the protective layer 102 is provided so as to cover the entire light-emitting panel 101. However, it is sufficient to provide it at least in the area between the two housings, which is the curved area. As shown in FIG. 2, the light-emitting panel 101 is sandwiched between two protective layers 102. By arranging the light emitting panel 101 so that it is positioned at the center in the thickness direction, When the filter 101 and the protective layer 102 are bent inward or outward, the light-emitting panel 101 This can minimize the stress.

[0041] Of the two protective layers 102, the one on the light-emitting surface side is positioned so as to overlap the light-emitting area of ​​the light-emitting panel 101. It is preferable that the light emitting device has an opening in the position so as to cover the periphery of the light emitting panel 101. Alternatively, a protective layer 102 having a light-transmitting material at a position overlapping the light-emitting region may be used. For example, a protective layer may be formed by covering wiring and a driving circuit located at the edge of the light-emitting panel 101. By providing 102, it is possible to physically protect these, and also to shield the wiring and drive circuit from light. This prevents deterioration, and furthermore, the wiring and drive circuitry can be visually confirmed, and the quality of the light-emitting device itself can be checked. This can prevent the aesthetic appearance from being impaired.

[0042] The protective layer 102 may be made of, for example, plastic, rubber, metal, alloy, or the like.

[0043] If plastic, rubber, titanium alloy, etc. are used for the protective layer 102 or the housing, the light-emitting device This is preferable because the device is lightweight and not easily damaged.

[0044] It is also preferable to use a highly tough material for the protective layer 102 and the housing. It is possible to realize a light emitting device that has excellent impact resistance and is difficult to break. For example, By using a metal material or an alloy material, a light-emitting device that is lightweight and resistant to breakage can be realized. For the same reason, a highly tough material is used for the substrate that constitutes the light-emitting panel 101. It is preferable.

[0045] The protective layer 102 and the housing located on the light-emitting surface side do not overlap with the light-emitting area of ​​the light-emitting panel 101. In this case, the light-transmitting property is not an issue. If the light emitting area overlaps with the light emitting area of ​​the light emitting panel 101, a material that transmits light emitted from the light emitting panel 101 should be used. The protective layer 102 and the housing located on the opposite side of the light-emitting surface may or may not be transparent. .

[0046] When any two of the protective layer 102, the housing, and the light-emitting panel 101 are bonded together, various adhesives are used. For example, a curable resin that hardens at room temperature, such as a two-component mixed resin, or a photo-curable resin can be used. Resins such as hardening resins and thermosetting resins can be used. In addition, two or more of the protective layer 102, the housing, and the light-emitting panel 101 may be Each component of the light emitting device is fixed using penetrating screws, pins that hold them, clips, etc. It may be determined.

[0047] The light-emitting device according to one embodiment of the present invention includes a light-emitting panel 101 (a light-emitting region) that is folded. The folded part can be used as a boundary to separate into two or more parts. For example, by folding it, a hidden area can be created. It is also possible to configure the area to be non-luminous and only the exposed area to be luminous. This reduces the power consumed by areas that are not recognized.

[0048] In the light-emitting device of one embodiment of the present invention, the light-emitting panel 101 located between the housings is curved or For example, a switch, a MEMS pressure sensor, etc. may be provided to determine whether the The sensor may be configured using a pressure sensor or the like.

[0049] The light-emitting device of one embodiment of the present invention includes a flexible touch sensor that is overlapped with the light-emitting panel 101. Preferably, the detection surface of the touch sensor is provided on the display surface side of the light-emitting panel 101. In this case, when the light-emitting panel 101 is bent, The detection surface of the touch sensor is curved along the curved surface of the display surface of the light-emitting panel 101. It is preferable to do so.

[0050] It should be noted that a touch panel having a function as a touch sensor is used as the light-emitting panel 101. That's fine.

[0051] The light emitting device 100 can be folded from the unfolded state shown in FIG. 1(A) to the unfolded state shown in FIG. It can be reversibly transformed into the folded shape shown in Figure 1(C) via the shape shown in Figure 1(B). At this time, the relative positions of the housings 111 and 112 are fixed by magnetic force. Similarly, the relative positions of the housings 112 and 113 are also changed by the magnetic force. It is fixed.

[0052] [Method of fixing the housing using magnetic force] Next, when the light emitting device is folded, the relative positions of the housings are fixed by magnetic force. An example of the law will be explained.

[0053] FIG. 3(A1) is a top view of the light emitting device, and FIG. 3(A2) is a rear view of the light emitting device. Also, Fig. 3(B1) shows the side view in the range AB when viewed from the direction of the arrow in Fig. 3(A1). 3(A1) is a schematic cross-sectional view taken along the cutting line CD in FIG. 3(A1). 3(C) shows the direction of the arrow in FIG. 3(A1) when the light emitting device is folded. 3(B2) is a schematic side view of the range AB as seen from the front. Therefore, the thickness of light-emitting panel 101 is shown as thick.

[0054] The light emitting device shown in Figure 3 includes housings 111, 112, and 113 whose surfaces are magnetized. The body has ferromagnetic bodies on the upper and lower surfaces of the housing, and the ferromagnetic bodies are attached to the upper and lower surfaces of the housing. The ferromagnetic material is magnetized so that the magnetic poles face in opposite directions. The top surfaces of the two adjacent enclosures are magnetized so that their magnetic poles face in opposite directions. The undersides of the magnets are also magnetized so that their magnetic poles face in opposite directions.

[0055] In the following, the surface of the housing on the light-emitting side is referred to as the upper surface, and the surface opposite the light-emitting surface is referred to as the This will be described as the underside.

[0056] Here, as an example, the housings 111, 112, and 113 are provided with The ferromagnetic material is magnetized so that the surface becomes the north pole, and the bottom surface of the housing 111 is The ferromagnetic materials provided on the top surface of the housing 2 and the bottom surface of the housing 113 are magnetized so that the surfaces are the south poles. It goes without saying that the N and S poles are swapped. Good too.

[0057] With this configuration, when the light emitting device is folded, as shown in FIG. The bottom surfaces of the housing 111 and the housing 112 (the surfaces facing upward in FIG. 3C) are The two housings are fixed together by attracting each other because the magnetic poles are facing opposite each other. The upper surface of the housing 112 (the surface facing downward in FIG. 3C) and the upper surface of the housing 113 are also attracted to each other by the gravitational force. The two housings are fixed together.

[0058] Here, examples of ferromagnetic materials include isotropic ferrite magnets, anisotropic ferrite magnets, and magnets. Nd-Fe-B magnets, samarium-cobalt magnets (Sm-Co), alnico magnets Materials containing Fe-Al-Ni-Co can be used. There are also rubber magnets made by kneading powder magnets into rubber, and plastic magnets made by kneading powder magnets into plastic. These are also called bonded magnets.

[0059] In particular, when the surface of the housing is magnetized, the use of the above-mentioned bonded magnet reduces the weight. This is preferable because it can reduce the weight and can be easily processed into any shape. After processing using such materials, the surface of each housing is magnetically aligned so that the magnetic poles face in the above-mentioned direction. Just make it so.

[0060] In this way, two adjacent housings are fixed by two opposing ferromagnetic bodies. When the two housings are stacked, the two ferromagnetic materials are affected by each other's magnetic fields. Therefore, it may be possible to reduce demagnetization of a ferromagnetic material due to the influence of an external magnetic field.

[0061] In the above, a ferromagnetic material is provided on the top surface of the housing, and the top surface of the housing itself is magnetized. As shown in 4(A1) and (A2), inside the housing and near the top or bottom surface of the housing Here, FIG. 4(A1) is the same as FIG. 3(A1) and ( A2), and a top view and a rear view of the light emitting device are shown side by side. ) is a schematic cross-sectional view taken along the cutting line EF in FIG. 4(A1).

[0062] In Fig. 4(A2), for clarity, the north pole of the ferromagnetic material is oriented perpendicular to the surface of the housing. A ferromagnetic body with its pole facing north is represented as N, and a ferromagnetic body with its pole facing south is represented as N. The body is represented as S. As long as the magnetic poles are oriented in different directions, the same material can be used. Alternatively, different materials may be used for each.

[0063] In this case, it is preferable to use a material with low magnetic permeability for the housing.

[0064] By using this structure, the housing can be made of plastic, glass, ceramic, It is possible to use rubber or metals or alloys with low magnetic permeability, and the material of the housing This is preferable because it increases the freedom of selection.

[0065] Also, as shown in Figures 4(B1) and (B2), the ferromagnetic material is applied to only a part of the housing, not the entire housing. In this case, two or more ferromagnetic materials may be arranged on one surface of one housing. When the two housings are arranged facing each other, it is preferable to arrange them apart. The ferromagnetic materials attached to the body are attracted to each other at two or more points, and the The relative positions of the two housings in the plane are fixed, and the two-dimensional positions of these two housings The misalignment can be effectively eliminated.

[0066] In addition, if a ferromagnetic material is placed in part of the housing, the two ferromagnetic materials will be Since the area where the magnetic material faces is smaller, it is possible to reduce the size of the ferromagnetic material compared to when it is placed over the entire surface of the housing. Therefore, it is preferable to use a material with a high magnetic flux density (or residual magnetic flux density) as the ferromagnetic material.

[0067] The ferromagnetic material used is the material that faces the surface of the two ferromagnetic materials when the two housings are placed one on top of the other. The product and the distance between the two ferromagnetic bodies should be selected taking into account the magnetic flux density of the material. For example, the larger the area of ​​the two ferromagnetic bodies facing each other, or the shorter the distance between the two ferromagnetic bodies, the greater the The stronger the attractive force between the ferromagnetic materials, the lower the magnetic flux density can be used. In this case, the magnetic flux density of the ferromagnetic material may be less than 100 mT. If a ferromagnetic material with a high magnetic field is required, for example, 100 mT or more, or 200 Ferromagnetic materials with a magnetic field of 500 mT or more may also be used.

[0068] For example, when two housings are placed one on top of the other, the area of ​​each ferromagnetic material facing each other and the area of ​​each The force required to separate the two enclosures is determined by the magnetic flux density of the ferromagnetic material. The force required to separate the housings (also called adhesive force) is, for example, 0.1 kgf to 2.0 kgf or less, preferably 0.2 kgf to 1.0 kgf. It is preferable to appropriately set the material (magnetic flux density) of the ferromagnetic body and the area where the two ferromagnetic bodies face each other. By setting the distance in this range, the two housings can be securely attached when the light emitting device is folded. The two housings can be easily separated while being fixed in place when deploying the light emitting device. For example, if the adhesive force between the two housings is less than 0.05 kgf, the two housings cannot be securely fastened together. On the other hand, if it is larger than the above range, the two housings may not be able to be matched. The force acting on the two housings may become so strong that it may become difficult to separate the two housings easily.

[0069] As shown in Figs. 4(C1) and 4(C2), a depression is provided on the surface of the housing, and the bottom of the depression In this way, when the two housings are stacked, the opposing Since there is no material that makes up the housing between the two ferromagnetic materials, the attractive force between the two ferromagnetic materials is strengthened. In addition, the user can visually recognize the position where the ferromagnetic material is provided. This configuration prevents, for example, the accident of inserting a material with high magnetic permeability between two ferromagnetic materials. This prevents problems such as the two housings being unable to be fixed together. The recess is filled with a material having a lower magnetic permeability than the material of the housing, or a material having a higher optical transparency. , or may be covered.

[0070] [Variation 1] In the above example, a ferromagnetic body is placed in each of the adjacent housings, and the magnetic force between the two ferromagnetic bodies Although the configuration in which the positions of the two housings are fixed has been shown, one of them may be replaced with a soft magnetic material.

[0071] That is, each of the plurality of housings is provided with a strong magnetic field so that the magnetic poles face the upper and lower surfaces of the housing. or a soft magnetic material that can be magnetized by the ferromagnetic material. In addition, the housings with ferromagnetic materials and the housings with soft magnetic materials are arranged alternately. Just do that.

[0072] 5(A1) and (A2) show the housing 11 of the configuration shown in FIG. 4(B1) and (B2). 1 and the ferromagnetic material in the housing 113 are replaced with soft magnetic material 122. At this time, the direction of the magnetic pole of the ferromagnetic body provided in the housing 112 does not matter, so the ferromagnetic body 121 are shown with the same hatching pattern as

[0073] The soft magnetic material 122 may be made of a material with high magnetic permeability, such as Fe, Materials containing soft magnetic materials such as Fe-Ni alloys, Fe-Si-Al alloys, and Fe-Co alloys It can be used.

[0074] In addition, under ideal conditions, the force of attraction between two identical ferromagnetic materials is Therefore, the force of attraction between the ferromagnetic material and the soft magnetic material is about half. As described above, by using a material with a higher magnetic flux density for the ferromagnetic body than when using a pair of ferromagnetic bodies, It is preferable that:

[0075] In addition, in Fig. 5(A1) and (A2), the housing of the configuration shown in Fig. 4(B1) and (B2) is The ferromagnetic material in the housing 111 and the housing 113 is replaced with a soft magnetic material 122. For example, as shown in FIGS. 5(B1) and 5(B2), the ferromagnetic material in the housing 112 may be The soft magnetic material 122 may be substituted. In the other configuration shown, the ferromagnetic body of one of the adjacent housings is as shown in FIG. Alternatively, the ferromagnetic material 121 and the soft magnetic material 122 may be replaced with each other. When two adjacent housings are stacked together, the soft magnetic material 122 and the ferromagnetic material 121 are mixed. The soft magnetic material 122 may be disposed so as to face each other.

[0076] In place of the soft magnetic material 122, a soft magnetic material is applied to the surface of the housing or to a part of the area near the surface. It may also be configured to use a material.

[0077] [Variation 2] The above describes a configuration in which a ferromagnetic material or a soft magnetic material is arranged along the top or bottom surface of a housing. However, these may be provided on the side of the housing.

[0078] An example of the configuration of the light-emitting device described below is shown in Figure 6. Figure 6(A) shows the light-emitting device in an unfolded state. 6(B) is a schematic cross-sectional view taken along the line GH in FIG. 6(A). FIG. 6(C) is a schematic cross-sectional view of the light emitting device in a folded state.

[0079] In the configuration shown in FIG. 6, the ferromagnetic body 121 is located inside the housing 112. They are arranged along the side surface (the surface perpendicular to the light-emitting surface of light-emitting panel 101).

[0080] The housing 111 and the housing 113 are provided with a storage case for storing the light emitting device when folded as shown in FIG. 6(C). When the soft magnetic material 122 is inserted into the housing 112, the soft magnetic material 122 is disposed at a position where the soft magnetic material 122 overlaps with the ferromagnetic material 121. do.

[0081] At least one of the ferromagnetic body 121 and the soft magnetic body 122 is exposed to the outside of each housing. It may be provided as follows.

[0082] In this case, it is preferable that the magnetic pole of the ferromagnetic material 121 is oriented in a direction perpendicular to the light emitting surface. If the magnetic pole of the ferromagnetic material 121 is oriented perpendicular to the light-emitting surface, the ferromagnetic material 12 On the other hand, the force of attraction between the ferromagnetic material 121 and the soft magnetic material 122 is increased. If the force of attraction between the ferromagnetic body 121 and the ferromagnetic body 122 is too strong, the direction of the magnetic pole of the ferromagnetic body 121 is changed to the direction of the light emitting surface. By shifting the orientation from perpendicular, this force can be controlled to weaken it.

[0083] In this way, by arranging the ferromagnetic material 121 near the side of the housing, the upper and lower surfaces of the housing The thickness of the housing can be significantly reduced compared to when two ferromagnetic bodies 121 are arranged along the In particular, the light-emitting device of one embodiment of the present invention can be used in a folded state. The reduced thickness of the folded case reduces the thickness of the device, making it easier to carry around. It can be improved.

[0084] Although the ferromagnetic body 121 is provided in the housing 112 here, the housing 111 and The ferromagnetic material 121 may be provided in the housing 113, and the soft magnetic material may be provided in the housing 112. In addition, there are magnetic poles near the sides of each of the three housings so that the magnetic poles face in opposite directions when folded. Alternatively, a ferromagnetic material 121 may be provided.

[0085] The above is a description of the modified example.

[0086] In any of the above-described light-emitting devices according to one embodiment of the present invention, a light-emitting element is disposed between two housings. Whether the optical panel 101 is bent inward or outward, the two housings are magnetically It can be fixed by force.

[0087] Therefore, for example, as shown in FIG. 7, the light emitting device is in the unfolded state, and the form X is the starting point. The area between the housings 111 and 112 is bent outward, and the area between the housings 112 and 113 is bent inward. By bending the housing 111 in each direction, the housing 111 is positioned at the top through the configuration Y1. The light emitting device can be reversibly transformed into the form Y2 in which 3 is located at the bottom. Starting from the shape X, the area between the housing 111 and the housing 112 is bent inward, and the area between the housing 112 and the housing 113 is bent inward. By bending the portions between the two in the outward bending direction, the housing 111 is positioned at the bottom through the form Z1. The light emitting device can be reversibly transformed into a form Z2 in which the housing 113 is positioned at the top. can.

[0088] In both of the configurations Y2 and Z2 shown in FIG. 7, the two adjacent housings are magnetically This realizes a state in which their relative positions are fixed.

[0089] That is, in the light-emitting device according to one embodiment of the present invention, the light-emitting panels are arranged so that adjacent housings are alternately stacked. When the panel is folded, one of the two outermost housings is is folded to be at the top, and to be at the bottom. , can be said to be a light-emitting device that can be reversibly transformed.

[0090] However, one aspect of the embodiment of the present invention is not limited to this. For example, in FIG. 3(C), An example in which multiple housings are fixed so that the display panel is bent inward is shown in FIG. 16(A). As shown in (B), the polarity of the ferromagnetic material changes depending on whether it is bent inward or outward. The fittings match, so they can be fixed properly.

[0091] When the display device is not used (when not displayed), as shown in FIG. It is preferable to fix all the display panels in an inward bending manner. Since the display surface is not exposed to the outside, the display device can be protected from scratches. It can be stored compactly even when stored in a storage compartment. In this case, by fixing it as shown in Figure 3(C), the surface can be maintained even when folded. However, one aspect of the embodiment of the present invention is not limited to this.

[0092] In the above, we have taken the example of a light emitting device that has three housings and can be folded into three. The number of housings is not limited to this. For example, a two-housing system including two housings 110 as shown in FIG. 8(A) may be used. The foldable light-emitting device is a light-emitting device that can be folded into four and has four housings 110 as shown in FIG. The present invention also relates to a light emitting device and a light emitting device having five housings 110 and capable of being folded into five, as shown in FIG. This is one aspect of the invention, and the configuration may include six or more housings 110.

[0093] In the above description, the two housings are connected by the protective layer 102. Alternatively, the two housings may be mechanically connected using a hinge. This limits the relative movement range between the two housings, preventing damage to the light-emitting panel 101. It can be stopped.

[0094] The housing of the light-emitting device of one embodiment of the present invention may include a battery, a computing device, a driver circuit, and the like. Printed circuit boards with various ICs mounted, wireless receivers, wireless transmitters, wireless power receivers, acceleration sensors By appropriately incorporating various electronic components including sensors, It can function as an electronic device such as a portable image reproducing device or a portable lighting device. In this case, the electronic components may be integrated into one of the plurality of housings, or may be integrated into one of the plurality of housings. Wiring that is distributed in the housing and sandwiched between the protective layer 102 or wiring that is provided inside the protective layer 102 The electronic components in the multiple housings may be electrically connected by wiring or the like. The housing of the light emitting device also contains a camera, a speaker, various input / output terminals including a power supply terminal, Various sensors including optical sensors, operation buttons, etc. may be incorporated.

[0095] In addition, in the drawings exemplified above, the thicknesses of the multiple housings are shown to be approximately the same. However, the thickness of each housing may be different. If the thickness of all the housings is the same, the horizontality of the light-emitting surface when the light-emitting device is unfolded is In addition, it is preferable that all of the various electronic components are housed in one of the multiple housings. A part or most of the components are integrated into the housing, and the housing is used as a relatively thick main body, and the thickness of the other housings is It is also possible to reduce the thickness and use it simply as a member for supporting the light-emitting panel 101.

[0096] Although an example in which a light-emitting element is used as a display element has been shown, One embodiment of the form is not limited to this.

[0097] For example, in this specification, a display element, a display device which is a device having a display element, a light-emitting device, A light-emitting device, which is a device having an element and a light-emitting element, can be used in various forms or in various Examples of a display element, a display device, a light-emitting element, or a light-emitting device include is an EL (electroluminescence) element (EL element including organic and inorganic materials, organic EL EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc. etc.), transistors (transistors that emit light according to the current), electron-emitting elements, liquid crystal elements, Electronic ink, electrophoretic element, grating light valve (GLV), plasma display PDP (Photodiode), MEMS (Micro-Electro-Mechanical Systems), Digital Micromirror Device (DMD), DMS (Digital Micro Shutter) , IMOD (Interference Modulation) element, Electrowetting Magnetic devices, piezoelectric ceramic displays, carbon nanotubes, etc. Some display media have display characteristics such as contrast, brightness, reflectance, and transmittance that change depending on the display. An example of a display device using an EL element is an EL display. An example of a display device using electrons is a field emission display (FED) or is a SED (Surface-conduction E) flat panel display. LCD displays include liquid crystal displays. An example of the device is a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display). LCD, reflective LCD, direct view LCD, projection LCD) An example of a display device using electronic ink or electrophoretic elements is electronic paper. - and more.

[0098] For example, in this specification, an active matrix type having active elements in pixels, or Alternatively, a passive matrix system in which pixels do not have active elements can be used.

[0099] In the active matrix system, the active element (active element, nonlinear element) is a transistor. By using not only transistors but also various active elements (active elements, nonlinear elements), For example, MIM (Metal Insulator Metal) or T It is also possible to use FD (Thin Film Diode) and other elements. Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size. This makes it possible to achieve low power consumption and high brightness.

[0100] Other than the active matrix type, active elements (active elements, nonlinear elements) It is also possible to use a passive matrix type that does not use active elements (active elements). Since it does not use any nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. Alternatively, active elements (active elements, non-linear elements) can be used. Since the aperture ratio is not increased, it is possible to achieve low power consumption or high brightness. This can be done.

[0101] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0102] (Embodiment 2) In this embodiment mode, a light-emitting panel will be described with reference to the drawings.

[0103] [Example 1] FIG. 9A is a plan view of light-emitting panel 101 exemplified in Embodiment 1. An example of a cross-sectional view taken along the dashed dotted line A1-A2 in FIG. 9(B) is shown.

[0104] The light-emitting panel shown in FIG. 9B includes an element layer 501 , an adhesive layer 505 , and a substrate 503 . The device layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive film. layer 557, insulating layer 207, insulating layer 209, a plurality of light-emitting elements, insulating layer 211, and sealing layer 213 , an insulating layer 261 , a coloring layer 259 , a light-shielding layer 257 , and an insulating layer 255 .

[0105] The conductive layer 557 is electrically connected to the FPC 508 via the connector 215 .

[0106] The light emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The outer electrode 231 is electrically connected to the source electrode or the drain electrode of the transistor 240. The end of the lower electrode 231 is covered with an insulating layer 211. The light emitting element 230 is a top emitter. The upper electrode 235 has a light-transmitting property and transmits the light emitted from the EL layer 233. do.

[0107] A colored layer 259 is provided at a position overlapping the light emitting element 230, and a colored layer 259 is provided at a position overlapping the insulating layer 211. The colored layer 259 and the light-shielding layer 257 are covered with an insulating layer 261. The space between the light emitting element 230 and the insulating layer 261 is filled with a sealing layer 213.

[0108] The light-emitting panel has a plurality of transistors in the light extraction section 504 and the drive circuit section 506. The transistor 240 is provided on the insulating layer 205. The insulating layer 205 and the substrate 2 01 is bonded to the substrate 503 by the adhesive layer 203. Also, the insulating layer 255 and the substrate 503 are bonded to each other. The insulating layer 205 and the insulating layer 255 are bonded together by a low water permeability film. By using the above, it is possible to prevent impurities such as water from entering the light emitting element 230 and the transistor 240. This is preferable because it can improve the reliability of the light-emitting panel. Various materials can be used.

[0109] In Example 1, the insulating layer 205, the transistor 240, and the light-emitting element 240 are formed on a substrate having high heat resistance. The substrate is peeled off, and an insulating layer 2 is formed on the substrate 201 using an adhesive layer 203. 2 shows a light-emitting panel that can be fabricated by transposing the transistor 240 and the light-emitting element 230. In addition, in Example 1, the insulating layer 255 and the colored layer 259 are formed on a substrate having high heat resistance. and a light-shielding layer 257 is formed, the substrate on which the layer is formed is peeled off, and the layer is then attached to the substrate 503 using an adhesive layer 505. A light-emitting panel can be produced by transposing the insulating layer 255, the colored layer 259, and the light-shielding layer 257. It shows.

[0110] When using a material with high water permeability and low heat resistance (such as resin) for the substrate, Since high temperatures cannot be applied, the conditions for fabricating transistors and insulating films on the substrate are limited. In the manufacturing method of this embodiment, transistors and the like are formed on a manufacturing substrate having high heat resistance. This allows for the formation of highly reliable transistors and insulating films with sufficiently low water permeability. By transferring these to the substrate 503 or the substrate 201, a highly reliable Thus, in one embodiment of the present invention, a light-emitting panel can be manufactured. A highly reliable light-emitting device can be realized. The manufacturing method will be described in detail later.

[0111] It is preferable that the substrate 503 and the substrate 201 are made of a highly tough material. This makes it possible to realize a display device that is highly impact resistant and less susceptible to breakage. The substrate 201 is made of an organic resin, and the substrate 202 is made of a thin metal material or alloy material. This allows for a light-emitting panel that is lighter and less susceptible to breakage than a glass substrate. It can be achieved.

[0112] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0113] Furthermore, if a material with high thermal emissivity is used for the substrate 201, the surface temperature of the light-emitting panel will increase. This can prevent the light-emitting panel from being damaged or its reliability from being reduced. A metal substrate and a layer with high thermal emissivity (e.g., metal oxide or ceramic material) can be used. It may also have a laminated structure.

[0114] [Example 2] FIG. 10(A) shows another example of a light extraction section 504 in a light-emitting panel. The light-emitting panel is a light-emitting panel that can be touched. The description of the same configuration as in Example 1 will be omitted.

[0115] The light-emitting panel shown in FIG. 10(A) has an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 206, and a semiconductor device. An edge layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, and a sealing layer 21 3, an insulating layer 261, a colored layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 281, a conductive The insulating layer 283 includes an insulating layer 291 , an insulating layer 293 , an insulating layer 295 , and an insulating layer 255 .

[0116] In Example 2, an insulating layer 217 is provided on the insulating layer 211. By providing the insulating layer 217, , the distance between the substrate 503 and the substrate 201 can be adjusted.

[0117] FIG. 10A shows an example in which a light-receiving element is provided between the insulating layer 255 and the sealing layer 213. The non-light-emitting region on the substrate 201 side (for example, the region where the transistor 240 and wiring are provided) is overlapped. Since the light receiving element can be arranged in the same position, the aperture ratio of the pixel (light emitting element) is not reduced. <A touch sensor can be provided on the light-emitting panel.

[0118] The light receiving element of the light emitting panel may be, for example, a pn-type or pin-type photodiode. In this embodiment, a p-type semiconductor layer 271, an i-type semiconductor layer A pin type photodiode having a conductor layer 273 and an n-type semiconductor layer 275 is used.

[0119] The i-type semiconductor layer 273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1 x 10 20 atoms / cm 3 The concentration is less than or equal to the photoconductivity The i-type semiconductor layer 273 contains a group 13 or 15 element of the periodic table. In other words, i-type semiconductors are those that have valence electron control. When the desired impurity element is not intentionally added, it exhibits weak n-type electrical conductivity. The p-type semiconductor layer 273 is formed by intentionally or after the deposition of an impurity element that imparts p-type conductivity. This category includes substances that are added unintentionally.

[0120] The light-shielding layer 257 overlaps the light-receiving element on the side closer to the substrate 503. The light-shielding layer 257 located between the light-emitting element 230 and the light-receiving element prevents light emitted by the light-emitting element 230 from being irradiated onto the light-receiving element. This can prevent the risk of this happening.

[0121] The conductive layer 281 and the conductive layer 283 are electrically connected to the light receiving element. It is preferable that the conductive layer 283 is a layer that transmits light incident on the light receiving element. It is preferable to use a conductive layer that blocks light incident on the light receiving element.

[0122] When the optical touch sensor is provided between the substrate 503 and the sealing layer 213, the light emitting element 230 emits light. This is preferable because it is less susceptible to the effects of light and can improve the S / N ratio.

[0123] [Example 3] FIG. 10(B) shows another example of the light extraction section 504 in the light-emitting panel. The light-emitting panel is a touch-operable light-emitting panel.

[0124] The light-emitting panel shown in FIG. 10(B) has an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 206, and a semiconductor device. An edge layer 207, an insulating layer 209a, an insulating layer 209b, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, a coloring layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 280, It includes a conductive layer 281 and an insulating layer 255 .

[0125] FIG. 10B shows an example in which a light-receiving element is provided between the insulating layer 205 and the sealing layer 213. The light-receiving element is provided between the insulating layer 205 and the sealing layer 213, thereby forming a transistor 240. The conductive layer and semiconductor layer are made of the same material and in the same process as the conductive layer and semiconductor layer that are electrically connected to the light receiving element. Therefore, the number of manufacturing steps is greatly increased. Therefore, a light-emitting panel that can be touched can be manufactured without any trouble.

[0126] [Example 4] Another example of a light-emitting panel is shown in FIG. 11(A). The light-emitting panel in FIG. 11(A) is a touch panel. It is a light-emitting panel that can

[0127] The light-emitting panel shown in FIG. 11(A) has an element layer 501, an adhesive layer 505, and a substrate 503. The device layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive film. a conductive layer 556, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 21 1, insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, conductive layer 294 and conductive layer 296. Has.

[0128] In FIG. 11(A), a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. .

[0129] The conductive layer 556 and the conductive layer 557 are electrically connected to the FPC 508 via the connector 215. The conductive layer 294 and the conductive layer 296 are electrically connected to the conductive layer 274 via the conductive particles 292. Therefore, the capacitive touch sensor is driven via the FPC508. It is possible.

[0130] [Example 5] Another example of a light-emitting panel is shown in FIG. 11(B). The light-emitting panel in FIG. 11(B) is a touch panel. It is a light-emitting panel that can

[0131] The light-emitting panel shown in FIG. 11(B) has an element layer 501, an adhesive layer 505, and a substrate 503. The device layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive film. a conductive layer 556, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 21 1, insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 270, conductive layer 272, conductive layer 274, insulating layer 276, and insulating layer 278.

[0132] In FIG. 11B, a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. .

[0133] The conductive layer 556 and the conductive layer 557 are electrically connected to the FPC 508a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 508b via the connecting body 215b. Therefore, the light emitting element 230 and the transistor 240 are driven via the FPC 508a. A capacitive touch sensor can be driven via FPC508b.

[0134] [Example 6] FIG. 12(A) shows another example of the light extraction section 504 in the light-emitting panel.

[0135] The light extraction portion 504 shown in FIG. 12(A) includes a substrate 503, an adhesive layer 505, a substrate 202, An insulating layer 205, a plurality of transistors, an insulating layer 207, a conductive layer 208, an insulating layer 209a, an insulating layer 209b, an insulating layer 209c, an insulating layer 209d, an insulating layer 209e, an insulating layer 209f, an insulating layer 209g, an insulating layer 209h ... The light-emitting element includes an edge layer 209b, a plurality of light-emitting elements, an insulating layer 211, a sealing layer 213, and a coloring layer 259. do.

[0136] The light emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The outer electrode 231 is connected to the source electrode or drain electrode of the transistor 240 via the conductive layer 208. The end of the lower electrode 231 is covered with an insulating layer 211. The element 230 has a bottom emission structure. The lower electrode 231 is transparent, and the EL layer 23 It transmits the light emitted by 3.

[0137] A colored layer 259 is provided at a position overlapping the light emitting element 230, and the light emitted by the light emitting element 230 is The light emitting element 230 and the substrate 202 are extracted to the substrate 503 side through the colored layer 259. The gap is filled with a sealing layer 213. The substrate 202 is made of the same material as the substrate 201 described above. It can be made by

[0138] The touch sensor may be provided on a substrate other than the substrate 503 or the substrate 201. As an example, a touch panel 999 is provided on the substrate 503 as shown in FIG. 19(B) shows an example in which a touch panel 999 is provided under the substrate 201. The touch panel 999 has a plurality of electrodes formed thereon and operates as a capacitive touch sensor. It can be made to work.

[0139] [Example 7] FIG. 12B shows another example of a light-emitting panel.

[0140] The light-emitting panel shown in FIG. 12(B) has an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 202, an insulating layer 205, a conductive layer 310a, a conductive layer 310b, and a plurality of The light-emitting element includes an insulating layer 211 , a conductive layer 212 , and a sealing layer 213 .

[0141] The conductive layer 310a and the conductive layer 310b are external connection electrodes of the light-emitting panel, and are connected to an FPC or the like. Electrical connection can be made.

[0142] The light emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The end of the bottom electrode 231 is covered with an insulating layer 211. The light emitting element 230 is a bottom emitting element. The lower electrode 231 is translucent and transmits light emitted from the EL layer 233. The conductive layer 212 is electrically connected to the lower electrode 231 .

[0143] The substrate 503 has a light extraction structure, which includes a hemispherical lens, a microlens array, and a concave-convex structure. For example, the resin substrate may have a film on which the above-mentioned The lens or film is attached to the substrate or to a bonding agent having a refractive index similar to that of the lens or film. By bonding with an adhesive or the like, a light extraction structure can be formed.

[0144] The conductive layer 212 is not necessarily provided, but it is necessary to reduce the voltage drop due to the resistance of the lower electrode 231. For the same purpose, the upper electrode 235 and the electrode A conductive layer for electrical connection may be provided on the insulating layer 211 .

[0145] The conductive layer 212 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as their main components The conductive layer 212 can be formed as a single layer or a stacked layer using an alloy material. It can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.5 μm or less. Below.

[0146] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 235. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 233 to completely cover the conductive layer, and This is preferable because it becomes easier to electrically connect the conductive layer to the conductive layer.

[0147] [Example of materials] Next, materials that can be used for the light-emitting panel will be described. The description of the configuration explained above will be omitted.

[0148] The element layer 501 has at least a light-emitting element. The category includes elements whose brightness is controlled by current or voltage. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. It is possible.

[0149] The element layer 501 further includes transistors for driving light-emitting elements, touch sensors, etc. It may have.

[0150] The structure of the transistors included in the light-emitting panel is not particularly limited. The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top-gate or bottom-gate structure. The semiconductor material is not particularly limited, and examples thereof include silicon and germanium. , In-Ga-Zn-based metal oxides, etc. An oxide semiconductor including one of these may be used.

[0151] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0152] The light-emitting element of the light-emitting panel has a pair of electrodes (a lower electrode 231 and an upper electrode 235) and The light-emitting device has an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes is an anode. One acts as a cathode and the other acts as a cathode.

[0153] The light emitting element is available in top emission structure, bottom emission structure, and dual emission structure. The electrode on the light extraction side is provided with a conductive film that transmits visible light. In addition, a conductive film that reflects visible light can be used for the electrode on the side where light is not extracted. preferable.

[0154] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide containing gold, silver, platinum, magnesium, etc. , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. Also, a laminated film of the above materials can be used as the conductive layer. For example, a laminated film of silver and magnesium It is preferable to use a laminated film of an alloy of ITO and a rubber material, as this can increase the electrical conductivity. Graphene or the like may also be used.

[0155] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO can be used.

[0156] The electrodes may be formed by vapor deposition or sputtering. Forming using ejection methods such as ink jet printing, printing methods such as screen printing, or plating methods It can be achieved.

[0157] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 231 and the upper electrode 235. When this occurs, holes are injected into the EL layer 233 from the anode side, and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 233, and the luminescent material contained in the EL layer 233 emits light. It glows.

[0158] The EL layer 233 has at least a light-emitting layer. The EL layer 233 includes the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties Highly electron-injecting or bipolar material (highly electron-transporting and hole-transporting properties) The layer may further include a layer containing a material.

[0159] The EL layer 233 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 233 may be formed by evaporation (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0160] In the element layer 501, the light-emitting element is provided between a pair of insulating films with low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, and This can prevent the reliability of the device from decreasing.

[0161] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon nitride oxide film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0162] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / m 2 ·day] or later Below, preferably 1 x 10 -6 [g / m 2 ·day] or less, preferably 1×10 -7 [ g / m 2 ·day] or less, more preferably 1 × 10 -8 [g / m 2 ·day] or less do.

[0163] The substrate 503 has a light-transmitting property and transmits at least the light emitted by the light-emitting element included in the element layer 501. The substrate 503 may be flexible. The refractive index of the substrate 503 is set to be equal to that of the atmosphere. higher than the refractive index.

[0164] Since organic resin is lighter than glass, if organic resin is used as the substrate 503, This is preferable because it allows the light-emitting device to be made lighter than when glass is used.

[0165] Examples of materials that are flexible and transparent to visible light include: Thickness of glass, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resins, polyimide resins, polymers methyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE S) Resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide imide In particular, materials with a low thermal expansion coefficient are used. For example, polyamide-imide resin, polyimide resin, PET, etc. are preferably used. In addition, a substrate in which glass fiber is impregnated with organic resin or an inorganic filler is impregnated with organic resin can be used. It is also possible to use a substrate with a lower thermal expansion coefficient by mixing with

[0166] The substrate 503 is made of a layer of the above material, which serves as a protective layer for protecting the surface of the light-emitting device from scratches. Hard coat layer (e.g., silicon nitride layer) or layer of material that can disperse pressure (e.g., The light-emitting element may be laminated with a layer of a luminescent material such as an aramid resin layer. In order to prevent a decrease in the lifespan of the element, the above-mentioned insulating film with low water permeability may be provided.

[0167] The adhesive layer 505 has a light-transmitting property and transmits at least the light emitted by the light-emitting element included in the element layer 501. In addition, the refractive index of the adhesive layer 505 is higher than the refractive index of the air.

[0168] The adhesive layer 505 may be a curable resin that hardens at room temperature, such as a two-component mixed resin, or a photo-curable resin. For example, epoxy resin, acrylic resin, or the like can be used. Examples include grease, silicone resin, and phenolic resin. In particular, epoxy resins and other resins with high moisture permeability are Low-temperature materials are preferred.

[0169] The resin may also contain a desiccant. For example, an alkaline earth metal oxide (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture may be absorbed by the light emitting element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light emitting device.

[0170] In addition, by mixing a filler with a high refractive index (such as titanium oxide) into the resin, light emission This is preferable because it can improve the light extraction efficiency from the element.

[0171] The adhesive layer 505 may also have a scattering member that scatters light. The layer 505 may be made of a mixture of the above resin and particles having a refractive index different from that of the above resin. The particles function as light scattering materials.

[0172] The difference in refractive index between the resin and the particles having a different refractive index from that of the resin is preferably 0.1 or more. More preferably, the ratio is 0.3 or more. Specifically, the resin may be an epoxy resin, an acrylic resin, or the like. The particles may be titanium oxide particles, imide resin particles, silicone particles, etc. Examples of usable materials include fluorine, barium oxide, and zeolite.

[0173] Titanium oxide and barium oxide particles are preferred because they have a strong light scattering property. By using fluorite, it is possible to adsorb water contained in resins, etc., improving the reliability of light-emitting devices. It can be done.

[0174] The insulating layer 205 and the insulating layer 255 can be made of an inorganic insulating material. It is preferable to use an insulating film with low water permeability, since this allows for a highly reliable light-emitting panel to be realized.

[0175] The insulating layer 207 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 207 may be a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like. An inorganic insulating film such as a film can be used.

[0176] The insulating layer 209, the insulating layer 209a, and the insulating layer 209b are each a transistor. It is preferable to select an insulating film having a planarizing function in order to reduce surface irregularities caused by, for example, For example, organic materials such as polyimide, acrylic, and benzocyclobutene resins can be used. In addition to the organic materials, low-dielectric-constant materials (low-k materials) can also be used. It is also possible to laminate a plurality of insulating films or inorganic insulating films made of these materials. stomach.

[0177] The insulating layer 211 is provided to cover the end of the lower electrode 231. In order to improve the coverage of the EL layer 233 and the upper electrode 235 formed on the insulating layer 2 It is preferable that the side wall 11 is an inclined surface formed with a continuous curvature.

[0178] The insulating layer 211 may be made of a resin or an inorganic insulating material. Examples of suitable resins include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, the insulating layer 211 can be easily produced. Therefore, it is preferable to use a negative photosensitive resin or a positive photosensitive resin. stomach.

[0179] The method for forming the insulating layer 211 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , evaporation method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) It is best to use a printing press, etc.

[0180] The insulating layer 217 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, organic insulating materials include negative and positive photosensitive resins, non-photosensitive resins, As the metal material, titanium, aluminum, etc. can be used. A conductive material is used for the insulating layer 217, and the insulating layer 217 and the upper electrode 235 are electrically connected. By adopting a configuration in which the upper electrode 235 is electrically connected, it is possible to suppress a potential drop caused by the resistance of the upper electrode 235. Furthermore, the insulating layer 217 may have a forward tapered shape or an inverse tapered shape.

[0181] The insulating layer 276, the insulating layer 278, the insulating layer 291, the insulating layer 293, and the insulating layer 295 are The insulating layer 278 and the insulating layer 29 can be formed using an inorganic insulating material or an organic insulating material. 5 uses an insulating layer having a planarizing function to reduce surface irregularities caused by the sensor element. It is preferable that:

[0182] The sealing layer 213 may be made of a curable resin that hardens at room temperature, such as a two-component mixed resin, or a photo-curable resin. For example, a resin such as a thermosetting resin can be used. ide) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB ( Polyvinyl butyral resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 213 may contain a desiccant. When the light from the optical element 230 is extracted to the outside of the light-emitting panel, a high refractive index is applied to the sealing layer 213. It is preferable that the ink contains a filler or a scattering material. The same materials as those that can be used for adhesive layer 505 can be used.

[0183] The conductive layer 556, the conductive layer 557, the conductive layer 294, and the conductive layer 296 are transistors, respectively. The conductive layer can be formed using the same material and process as the conductive layer constituting the transistor or light-emitting element. The conductive layer 280 can be formed using the same material and process as the conductive layers that constitute the transistors.

[0184] For example, the conductive layers may be made of molybdenum, titanium, chromium, tantalum, or tungsten. Metallic materials such as zinc, aluminum, copper, neodymium, scandium, etc., or containing these elements The conductive layer can be formed of a single layer or a stacked layer using an alloy material. Each of the conductive metal oxides may be used. Indium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, Indium zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide It is possible to use a material containing kon.

[0185] In addition, the conductive layer 208, the conductive layer 212, the conductive layer 310a, and the conductive layer 310b are also The insulating film 10 can be formed using the above-mentioned metal materials, alloy materials, conductive metal oxides, or the like.

[0186] The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting. For example, indium oxide, ITO, indium zinc oxide, zinc oxide The conductive layer 270 may be made of zinc oxide doped with lead or gallium. It can be formed using the same material and process as 272.

[0187] The conductive particles 292 are particles of organic resin or silica coated with a metal material. Nickel or gold is preferable as the metal material because it can reduce contact resistance. In addition, particles coated with two or more metal materials in layers, such as nickel coated with gold, are also available. It is preferable to use a child.

[0188] The connector 215 is made of a thermosetting resin containing metal particles or particles similar to the conductive particles described above. A paste or sheet-like material containing a mixture of electrons is used, and anisotropic conductivity is achieved by thermocompression bonding. As the metal particles, for example, nickel particles coated with gold can be used. It is preferable to use particles in which two or more types of metals are layered, such as those

[0189] The colored layer 259 is a colored layer that transmits light in a specific wavelength band. For example, the red wavelength band A red (R) color filter transmits light in the red wavelength band, and a green (G) color filter transmits light in the green wavelength band. and blue (B) color filters that transmit light in the blue wavelength band. Each color layer can be formed by using various materials and by printing, inkjet printing, photolithography, etc. They are formed at desired positions by etching using lithography or the like.

[0190] In addition, a light-shielding layer 257 is provided between adjacent colored layers 259. The light-shielding layer 257 is It blocks light that is coming around from adjacent light emitting elements, thereby suppressing color mixing between adjacent pixels. The end of the colored layer 259 is provided so as to overlap the light-shielding layer 257, thereby suppressing light leakage. The light-shielding layer 257 can be made of a material that blocks light emitted from the light-emitting element. The insulating layer 11 can be formed using a metal material or a resin material containing a pigment or dye. As shown in (A), the light-shielding layer 257 is formed on the driving circuit section 506 and other parts other than the light extraction section 504. It is preferable to provide the light emitting element in the region, since this can suppress unintended light leakage due to guided light or the like.

[0191] Furthermore, when an insulating layer 261 is provided to cover the colored layer 259 and the light-shielding layer 257, the colored layer 259 and the light-shielding layer 257 can be easily This is preferable because it can prevent impurities such as pigments contained in the optical layer 257 from diffusing into the light emitting elements, etc. It is preferable that the insulating layer 261 is made of a light-transmitting material, and that an inorganic insulating material or an organic insulating material is used. The insulating layer 261 may be made of the above-mentioned insulating film with low water permeability.

[0192] The above is an explanation of an example of the material.

[0193] [Example of manufacturing method] Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 13 and 14. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 9(B)) as an example.

[0194] First, a peeling layer 303 is formed on a substrate 301, and an insulating layer 205 is formed on the peeling layer 303. Next, a plurality of transistors, a conductive layer 557, an insulating layer 207, and an insulating layer 558 are formed on the insulating layer 205. The edge layer 209, the plurality of light-emitting elements, and the insulating layer 211 are formed. Note that the conductive layer 557 is exposed. In this manner, openings are formed in the insulating layer 211, the insulating layer 209, and the insulating layer 207 (FIG. 13(A)). ).

[0195] In addition, a peeling layer 307 is formed on the formation substrate 305, and an insulating layer 255 is formed on the peeling layer 307. Next, a light-shielding layer 257, a colored layer 259, and an insulating layer 261 are formed on the insulating layer 255. (Figure 13(B)).

[0196] The substrates 301 and 305 are made of glass, quartz, and surface treatment. A fiber substrate, a ceramic substrate, a metal substrate, or the like can be used.

[0197] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0198] When a glass substrate is used as the substrate for fabrication, a silicon oxide film, an acid film, or the like is formed between the substrate for fabrication and the peeling layer. When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon nitride oxide film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0199] The peeling layer 303 and the peeling layer 307 are made of tungsten, molybdenum, and titanium, respectively. Niobium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of palladium, osmium, iridium, and silicon; It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0200] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

[0201] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0202] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer made of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0203] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 100° C. or lower, a dense membrane with extremely low water permeability can be obtained.

[0204] Thereafter, the surface of the production substrate 305 on which the colored layer 259 and the like are provided or the light-emitting element of the production substrate 301 is A material for the sealing layer 213 is applied to the surface on which the element 230 and the like are provided, and the sealing layer 213 is then applied to the surface on which the element 230 and the like are provided. The surfaces are glued together (Figure 13(C)).

[0205] Then, the fabricated substrate 301 is peeled off, and the exposed insulating layer 205 and substrate 201 are bonded to the adhesive layer 20 3. Also, the manufacturing substrate 305 is peeled off, and the exposed insulating layer 255 and the substrate 14(A), the substrate 503 is attached to the conductive layer 505. Although the conductive layer 557 does not overlap with the substrate 503, the conductive layer 557 may overlap with the substrate 503.

[0206] For example, a peeling layer may be formed by a method using a film made of a material such as a resin. When a layer containing a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the film. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, laser light The amorphous silicon film is removed by irradiation or etching, and the layer to be peeled is separated from the substrate. The peeling layer can be peeled off from the peeled layer. The metal oxide film is weakened by crystallization, and a part of the peeling layer is then dissolved in a solution or NF. 3. After removal by etching using fluoride gases such as BrF3 and ClF3, the weakened It can be peeled off from the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (for example, amorphous silicon film containing hydrogen, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by releasing the peeled layer may also be used. The substrate is mechanically removed or etched with a solution or fluorinated gas such as NF3, BrF3, or ClF3. In this case, the peeling layer can be removed without providing a peeling layer. good.

[0207] Furthermore, by combining a plurality of the above peeling methods, the peeling process can be carried out more easily. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the peeled layer easier to peel off. Alternatively, the peeling can be performed by physical force (using a machine, etc.).

[0208] In addition, a liquid is allowed to penetrate into the interface between the peeling layer and the layer to be peeled, and the layer to be peeled is peeled from the substrate. Furthermore, the peeling may be performed while pouring a liquid such as water on the film.

[0209] As for other peeling methods, if the peeling layer is made of tungsten, ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0210] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and an organic resin such as polyimide is formed in contact with the glass. Then, insulating films, transistors, etc. are formed on the organic resin. In this case, the organic resin is heated. This allows separation at the interface between the substrate and the organic resin. A metal layer is placed between the resin and the organic resin, and an electric current is passed through the metal layer to heat the metal layer. Peeling may occur at the interface of the oil.

[0211] Finally, the insulating layer 255 and the sealing layer 213 are opened to expose the conductive layer 557. (FIG. 14B). In the case where the substrate 503 overlaps with the conductive layer 557, The adhesive layer 505 is also opened (FIG. 14(C)). Laser ablation, etching, ion beam sputtering, etc. In addition, a sharp blade or the like is used to make a cut in the film on the conductive layer 557, and the film is cut by physical force. You can also tear off a portion of it.

[0212] In this manner, a light-emitting panel can be manufactured.

[0213] As described above, the light-emitting panel of this embodiment is made up of the substrate 503 and the substrate 201 or the substrate The touch sensor is also included in the configuration. By minimizing the number of substrates, the light extraction efficiency and This facilitates clarity of display.

[0214] [Variations] A light-emitting panel that is partially different from the above will be described below with reference to FIG.

[0215] The light-emitting panel shown in FIG. 15 includes a substrate 401, a transistor 240, a light-emitting element 230, an insulating layer 207, insulating layer 209, insulating layer 211, insulating layer 217, space 405, insulating layer 261, The light-receiving layer 257, the colored layer 259, the light-receiving element (p-type semiconductor layer 271, i-type semiconductor layer 273, and n-type semiconductor layer 275), conductive layer 281, conductive layer 283, insulating layer 291, insulating layer 2 93, an insulating layer 295, and a substrate 403.

[0216] The light-emitting panel includes a light-emitting element 230 and a light-receiving element between a substrate 401 and a substrate 403. The adhesive layer (not shown) is arranged in a frame shape so as to enclose the substrate 401 and the substrate. The light emitting element 230 is sealed by the plate 403 .

[0217] In the light-emitting panel of this embodiment, the substrate 403 has a light-transmitting property. The light emitted passes through the colored layer 259, the substrate 403, and the like and is extracted into the atmosphere.

[0218] The light-emitting panel of this embodiment is a touch-operable light-emitting panel. The proximity or contact of an object to the surface of the substrate 403 can be detected using an optical element.

[0219] Optical touch sensors have no effect on detection accuracy even if the surface that the object to be detected comes into contact with is scratched. Optical touch sensors are also preferable because they are non-contact sensing devices. It is possible to apply it to a display device without reducing the clarity of the image, and it is possible to apply it to a large light-emitting panel or a display. It also has the advantage of being applicable to display devices.

[0220] When the optical touch sensor is provided between the substrate 403 and the space 405, the light emitted by the light emitting element 230 This is preferable because it is less susceptible to the influence of the above and can improve the S / N ratio.

[0221] The light-shielding layer 257 overlaps the light-receiving element on the side closer to the substrate 403. This can prevent the light emitted by the light emitting element 230 from being irradiated onto the light receiving element.

[0222] There is no particular limitation on the materials used for the substrate 401 and the substrate 403. The substrate on the other side is made of a material that transmits light. For example, thin glass that is flexible is used. Materials such as quartz, ceramic, sapphire, and organic resin can be used. The substrate on the side not exposed does not need to be light-transmitting, so in addition to the substrates listed above, A metal substrate made of a metal material or an alloy material may also be used. The plate 403 can also be made of the substrate materials exemplified in the previous embodiments.

[0223] The sealing method of the light-emitting panel is not limited, and may be, for example, solid sealing or hollow sealing. For example, glass materials such as glass frit and two-component resins that harden at room temperature are suitable. Resin materials such as photocurable resin, photocurable resin, and thermosetting resin can be used. The space 405 may be filled with an inert gas such as nitrogen or argon, and the sealing layer 21 It may be filled with the same resin as in 3. In addition, the resin may contain the above-mentioned desiccant, a high refractive index Fillers or scattering materials may also be included.

[0224] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0225] (Embodiment 3) In this embodiment, examples of electronic devices and lighting devices to which the display device of one embodiment of the present invention is applied will be described. This will be described with reference to the drawings.

[0226] As an example of an electronic device that uses a display device having a flexible shape, a television televisions or television receivers, computer monitors, Digital cameras, digital video cameras, digital photo frames, mobile phones (mobile phones , also known as mobile phone devices), portable game machines, personal digital assistants, sound reproduction devices, pachinko machines Examples include large game consoles such as:

[0227] In addition, lighting devices and display devices may be installed on the interior or exterior walls of houses or buildings, or on the interior or exterior of automobiles. It is also possible to incorporate it along the curved surface of the equipment.

[0228] 17(A) and 17(B) illustrate a foldable tablet terminal 9600. Here, we have shown an example of folding in half, but you can also fold in three or four, etc. FIG. 17A shows a tablet terminal 9600 opened. The tablet terminal 9600 is in a state where a housing 9630, a display unit 9631, a display mode Switch 9626, power switch 9627, power saving mode switch 96 25, fastener 9629, and operating switch 9628.

[0229] The housing 9630 includes a housing 9630a and a housing 9630b. 30b are connected by a hinge portion 9639. The housing 9630 is also connected by a hinge portion 9639. 639 allows it to be folded in half.

[0230] The display unit 9631 is made up of a housing 9630a, a housing 9630b, and a hinge unit 9639. By using the display device disclosed in this specification for the display portion 9631, This allows the display unit 9631 to be bent, making it possible to provide a highly reliable tablet terminal. become.

[0231] A part of the display unit 9631 can be used as a touch panel area 9632. Data can be input by touching the operation keys 9638. For example, half of the area may have a display function only, and the other half may be used as a touch panel. The entire area of ​​the display portion 9631 can be configured to have touch panel functions. For example, the entire surface of the display portion 9631 may be provided with a keyboard. It can also be used as a data entry terminal by displaying a button.

[0232] A display mode changeover switch 9626 changes the display orientation, such as portrait or landscape. You can switch between black and white and color display. The 9625 uses a built-in light sensor in the tablet device to detect external light during use. The tablet device can optimize the display brightness according to the amount of light in the room. In addition to sensors, other detection devices such as gyros and acceleration sensors that detect tilt are also included. It may be built-in.

[0233] FIG. 17(B) shows the tablet terminal 9600 in a closed state. The device 600 includes a housing 9630, a solar cell 9633, and a charge / discharge control circuit 9634. In FIG. 17(B), a battery 9635 and a DC / DC converter are used as an example of the charge / discharge control circuit 9634. 96 shows a configuration having an inverter 9636.

[0234] By using the display device disclosed in this specification for the display portion 9631, For example, the tablet terminal 9600 can be folded in half, The housing 9630 can be closed when not in use. This protects the display unit 9631, making it highly durable and portable, and suitable for long-term use. This makes it possible to create a highly reliable tablet terminal.

[0235] In addition, the tablet terminals shown in Figs. 17(A) and 17(B) can be used in various Functions that display information (still images, videos, text images, etc.), calendars, dates, or times The function to display information on the display unit, and the function to input or edit the information displayed on the display unit. It has input functions, functions to control processing using various software (programs), etc. It is possible.

[0236] The solar cell 9633 attached to the surface of the tablet terminal supplies power to the touch panel. The solar cell 9633 can be supplied to a display unit, a video signal processor, or the like. The battery 9635 is configured to be charged by the battery 9635 provided on one or two surfaces of the housing 9630. The battery 9635 is preferably a lithium-ion battery. This has the advantage of enabling miniaturization.

[0237] The configuration and operation of the charge / discharge control circuit 9634 shown in FIG. 17(B) are shown in FIG. A block diagram is shown in Fig. 17(C) and will be explained. 635, DC-DC converter 9636, converter 9637, switches SW1 to SW3 , the display unit 9631, the battery 9635, the DC-DC converter 963 6. The converter 9637 and the switches SW1 to SW3 are configured to perform the charge / discharge control shown in FIG. 17(B). This corresponds to the circuit 9634.

[0238] First, an example of operation when power is generated by the solar cell 9633 using external light will be described. The power generated by the solar cell is converted to DC voltage to charge the battery 9635. The voltage is increased or decreased by a DC converter 9636. When power is being used from the solar cell 9633, switch SW1 is turned on and the converter 9 637 increases or decreases the voltage to the voltage required for the display unit 9631. When not displaying on the 631, turn SW1 off and SW2 on to charge the battery. 635 may be configured to charge.

[0239] The solar cell 9633 is shown as an example of a power generating means, but is not particularly limited thereto. Other power generation methods such as piezoelectric elements and thermoelectric conversion elements (Peltier elements) For example, the battery 9635 may be charged wirelessly (contactlessly). A wireless power transmission module that receives and charges, or a structure that combines other charging methods It may also be composed.

[0240] Note that the above-described electronic devices and lighting devices each include a display device according to one embodiment of the present invention. It goes without saying that the present invention is not particularly limited to the above.

[0241] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0242] 100 Light-emitting device 101 Light-emitting panel 102 Protective layer 110 Case 111 Cabinet 112 Case 113 Case 121 Ferromagnetic materials 122 Soft magnetic material 201 Substrate 202 Substrate 203 Adhesive layer 205 Insulation Layer 207 Insulating layer 208 Conductive Layer 209 Insulating Layer 209a Insulating layer 209b Insulating layer 211 Insulating layer 212 Conductive layer 213 Sealing layer 215 Connectors 215a Connective 215b Connector 217 Insulating Layer 230 Light-emitting element 231 Lower electrode 233 EL layer 235 Upper electrode 240 transistors 255 insulating layer 257 Light blocking layer 259 Colored layer 261 Insulating Layer 270 Conductive Layer 271 p-type semiconductor layer 272 Conductive Layer 273 i-type semiconductor layer 274 Conductive Layer 275 n-type semiconductor layer 276 Insulating Layer 278 Insulating Layer 280 Conductive Layer 281 Conductive Layer 283 Conductive Layer 291 Insulating Layer 292 Conductive particles 293 Insulating Layer 294 Conductive Layer 295 Insulating Layer 296 Conductive Layer 301 Fabricated substrate 303 Peeling layer 305 Fabrication substrate 307 Peeling layer 310a conductive layer 310b conductive layer 401 Substrate 403 Substrate 405 Space 501 Element Layer 503 PCB 504 Light extraction section 505 Adhesive layer 506 Drive circuit section 508 FPC 508a FPC 508b FPC 556 Conductive layer 557 Conductive Layer 999 touch panel 9600 tablet device 9625 Switch 9626 Switch 9627 Power Switch 9628 Operation Switch 9629 Fasteners 9630 chassis 9631 Display section 9632 area 9633 Solar Cells 9634 Charge / Discharge Control Circuit 9635 Battery 9636 DC / DC Converter 9637 Converter 9638 Operation key 9639 Hinge part 9630a housing 9630b housing

Claims

1. An inwardly bendable light-emitting panel; a first housing and a second housing arranged in parallel and supporting at least the rear surface of the light-emitting panel; a protective layer disposed between the rear surface and the first and second housings; a first ferromagnetic body disposed in the first housing; a second ferromagnetic body disposed in the second housing; the first ferromagnetic body and the second ferromagnetic body are each disposed at a position overlapping the protective layer when viewed in a thickness direction of the light-emitting panel; the first ferromagnetic body and the second ferromagnetic body are arranged at positions where they overlap each other when viewed from the thickness direction when the light-emitting panel is bent inward to cause the first housing and the second housing to face each other, the first ferromagnetic body is provided on a surface of the first housing that faces the second housing when the light-emitting panel is bent inward, the second ferromagnetic body is provided on a surface of the second housing opposite to a surface that faces the first housing when the light-emitting panel is bent inward. electronic equipment.

2. An inwardly bendable light-emitting panel; a first housing and a second housing arranged in parallel and supporting at least the rear surface of the light-emitting panel; a protective layer disposed between the rear surface and the first and second housings; a first ferromagnetic body disposed in the first housing; a second ferromagnetic body disposed in the second housing; the first ferromagnetic body and the second ferromagnetic body are each disposed at a position overlapping the protective layer when viewed in a thickness direction of the light-emitting panel; the first ferromagnetic body and the second ferromagnetic body are arranged at positions where they overlap each other when viewed from the thickness direction when the light-emitting panel is bent inward to cause the first housing and the second housing to face each other, the first ferromagnetic body is provided so as to be exposed from the first housing on a surface of the first housing that faces the second housing when the light-emitting panel is bent inward, the second ferromagnetic body is provided on a surface of the second housing opposite to a surface that faces the first housing when the light-emitting panel is bent inward, and is exposed from the second housing. electronic equipment.

3. An inwardly bendable light-emitting panel; a first housing and a second housing arranged in parallel and supporting at least the rear surface of the light-emitting panel; a protective layer disposed between the rear surface and the first and second housings; a first ferromagnetic body disposed in the first housing; a second ferromagnetic body disposed in the second housing; the first ferromagnetic body and the second ferromagnetic body are each disposed at a position overlapping the protective layer when viewed in a thickness direction of the light-emitting panel; the first ferromagnetic body and the second ferromagnetic body are arranged at positions where they overlap each other when viewed from the thickness direction when the light-emitting panel is bent inward to cause the first housing and the second housing to face each other, the first ferromagnetic material is provided inside the first housing at a position such that, when the light-emitting panel is bent inward, a distance between a surface of the first housing that faces the second housing and a portion of the first ferromagnetic material that is closest to the surface is smaller than a distance between a surface of the first housing opposite to the surface of the first housing and a portion of the first ferromagnetic material that is closest to the surface opposite to the surface; the second ferromagnetic body is provided inside the second housing at a position such that, when the light-emitting panel is bent inward, a distance between a surface of the second housing that faces the first housing and a portion of the second ferromagnetic body that is closest to the surface is greater than a distance between a surface of the second housing opposite to the surface of the first housing and a portion of the second ferromagnetic body that is closest to the surface. electronic equipment.

4. An inwardly bendable light-emitting panel; a first housing and a second housing arranged in parallel and supporting at least the rear surface of the light-emitting panel; a protective layer disposed between the rear surface and the first and second housings; a first ferromagnetic body disposed in the first housing; a second ferromagnetic body disposed in the second housing; the first ferromagnetic body and the second ferromagnetic body are each disposed at a position overlapping the protective layer when viewed in a thickness direction of the light-emitting panel; the first ferromagnetic body and the second ferromagnetic body are arranged at positions where they overlap each other when viewed from the thickness direction when the light-emitting panel is bent inward to cause the first housing and the second housing to face each other, a first recess is provided on a surface of the first housing that faces the second housing when the light-emitting panel is bent inward; a second recess is provided on a surface of the second housing opposite to a surface that faces the first housing when the light-emitting panel is bent inward; the first ferromagnetic body is provided in the first recess, the second ferromagnetic body is provided in the second recess; electronic equipment.

5. In claim 4, The magnetic head further includes a member that covers the first recess in which the first ferromagnetic material is provided. electronic equipment.

6. In any one of claims 1 to 5, At least one of the first ferromagnetic body and the second ferromagnetic body is a ferromagnetic body having a resistance of 100 mT or more. electronic equipment.

7. In any one of claims 1 to 6, the first housing and the second housing are foldably connected by a hinge; electronic equipment.

8. In any one of claims 1 to 7, The protective layer is made of a metal or an alloy. electronic equipment.

9. In any one of claims 1 to 8, At least one of the first ferromagnetic body and the second ferromagnetic body is a neodymium magnet. electronic equipment.

10. In any one of claims 1 to 9, When the light-emitting panel is bent inward to make the first housing and the second housing face each other, the first housing and the second housing attract each other by magnetic force and maintain the inward bent state. The force required to separate the first housing and the second housing from this state is 0.1 kgf or more and 2.0 kgf or less. electronic equipment.

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