electronic machinery

Abstract

An electronic device (1) comprises: a housing (11); a plurality of first heat dissipation members (12); a first air guide member (13); a blower (15); and a second air guide member (16). The first heat dissipation members (12) are attached to an attachment surface (11a) of the housing (11) at positions separated from each other, and dissipate heat transmitted from the housing (11) to the surrounding air. The first air guide member (13) and the attachment surface (11a) form a first gap (14) therebetween. The blower (15) generates a flow of air along the first heat dissipation members (12) in the first gap (14) between the attachment surface (11a) and the first air guide member (13). A portion of the first air guide member (13) faces a second gap (17) formed between the second air guide member (16) and a side surface (11b) of the housing (11).

Description

Technical Field

[0001] The present disclosure relates to an electronic device.

Background Art

[0002] An electronic device, for example, a power conversion device, cools electronic components by dissipating heat generated by the electronic components housed inside the housing to the air around the heat dissipation member through the housing and the heat dissipation member. An example of the heat dissipation member provided in this type of electronic device is disclosed in Patent Document 1. The heat sink with a fan disclosed in Patent Document 1 includes a heat sink body fixed to a high heat generating element, a lid covering the upper surface of the heat sink body, and a cooling fan incorporated in the central portion of the heat sink body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the heat sink with a fan disclosed in Patent Document 1, the air sucked in from the introduction hole of the lid passes between the heat dissipation fins and is exhausted from the side of the heat sink body. In order to cool the electronic components housed in the housing of the electronic device, if a heat sink with a fan disclosed in Patent Document 1 is provided on the upper surface of the housing, the upper surface of the housing is cooled, but the side surface and the bottom surface are not cooled. Therefore, depending on the position, heat generation amount, etc. of the electronic components inside the housing of the electronic device, the cooling by the heat sink may not be sufficient, the temperature inside the housing may rise, and the electronic components may not be sufficiently cooled.

[0005] The present disclosure has been made in view of the above circumstances, and an object thereof is to provide an electronic device with high cooling performance for electronic components.

Means for Solving the Problems

[0006] To achieve the above objective, the electronic device of this disclosure comprises a housing, a plurality of first heat dissipation members, a first air guide member, a blower, and at least one second air guide member. The housing houses electronic components that generate heat when energized. The plurality of first heat dissipation members intersect the housing in the vertical direction. outside The first air guide members are mounted on a surface, which is a mounting surface, at positions separated from each other, and dissipate heat transferred from the housing into the surrounding air. The first air guide members form a first gap between themselves and the mounting surface, in which at least a portion of the first heat dissipation members is located. The blower generates an airflow along the first heat dissipation members in the first gap. The second air guide members are aligned in the vertical direction of the housing. outside A second void is formed between the surface (side) and the first air guide member. A portion of the first air guide member faces the second void. [Effects of the Invention]

[0007] The blower in the electronic device according to this disclosure generates an airflow along the first heat dissipation member in the first gap between the first air guide member and the mounting surface of the housing, which in turn generates an airflow in the second gap between the second air guide member and the side surface of the housing, causing air to flow along the mounting surface and side surface of the housing. As a result, an electronic device with high cooling performance for electronic components can be obtained. [Brief explanation of the drawing]

[0008] [Figure 1] Front view of the electronic device according to Embodiment 1 [Figure 2] Top view of the electronic device according to Embodiment 1 [Figure 3] Cross-sectional view of the electronic device according to Embodiment 1, taken along the line III-III in Figure 1. [Figure 4] A diagram showing the airflow in the electronic device according to Embodiment 1. [Figure 5] Diagram showing the airflow in the electronic device according to Embodiment 1. [Figure 6] Front view of the electronic device according to Embodiment 2 [Figure 7] Top view of the electronic device according to Embodiment 2 [Figure 8] Cross-sectional view taken along line VIII-VIII in FIG. 6 of the electronic device according to Embodiment 2, as viewed from the arrow direction [Figure 9] Diagram showing the air flow in the electronic device according to Embodiment 2 [Figure 10] Diagram showing the air flow in the electronic device according to Embodiment 2 [Figure 11] Front view of the electronic device according to Embodiment 3 [Figure 12] Top view of the electronic device according to Embodiment 3 [Figure 13] Cross-sectional view taken along line XIII-XIII in FIG. 11 of the electronic device according to Embodiment 3, as viewed from the arrow direction [Figure 14] Diagram showing the air flow in the electronic device according to Embodiment 3 [Figure 15] Diagram showing the air flow in the electronic device according to Embodiment 3 [Figure 16] Front view of the first modification of the electronic device according to the embodiment [Figure 17] Diagram showing the air flow in the first modification of the electronic device according to the embodiment [Figure 18] Front view of the second modification of the electronic device according to the embodiment [Figure 19] Diagram showing the air flow in the second modification of the electronic device according to the embodiment [Figure 20] Diagram showing the top surface of the housing included in the third modification of the electronic device according to the embodiment [Figure 21] Front view of the fourth modification of the electronic device according to the embodiment [Figure 22] Diagram showing the top surface of the housing included in the fourth modification of the electronic device according to the embodiment [Figure 23] Diagram showing the top surface of the housing included in the fifth modification of the electronic device according to the embodiment [Figure 24] Front view of the sixth modification of the electronic device according to the embodiment

Modes for Carrying Out the Invention

[0009] Hereinafter, the electronic devices according to the embodiments of this disclosure will be described in detail with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals.

[0010] (Embodiment 1) The electronic device 1 according to Embodiment 1 will be described using an electronic device that is mounted on a moving object such as an aircraft, railway vehicle, or ship, and which houses electronic components that generate heat when energized inside a casing.

[0011] The electronic device 1 shown in Figures 1, 2, and Figure 3 (a cross-sectional view taken along line III-III in Figure 1) is, for example, a power converter mounted on an aircraft that converts power supplied from a power source into power for supplying to other aircraft-mounted equipment, and then supplies the converted power to the aircraft-mounted equipment.

[0012] The electronic device 1 comprises a housing 11 that houses electronic components that generate heat when energized, such as switching elements and diodes; a plurality of first heat dissipation members 12 that are attached to the mounting surface 11a of the housing 11 at positions separated from each other; a first air guide member 13 that forms a first air gap 14 between itself and the mounting surface 11a; a blower 15 that generates an airflow along the first heat dissipation members 12; and a second air guide member 16 that forms a second air gap 17 between itself and the side surface 11b of the housing 11.

[0013] In Figures 1 to 3, the Z-axis represents the vertical direction. The X-axis and Y-axis are defined as mutually orthogonal axes contained within the horizontal plane. The X-axis, Y-axis, and Z-axis are mutually orthogonal.

[0014] The housing 11 has a mounting surface 11a and a bottom surface 11c, which are surfaces that intersect the Z-axis, and a side surface 11b, which is a surface that lies along the Z-axis. The side surface 11b of the housing 11 is located parallel to the XZ plane or the YZ plane. In Embodiment 1, among the surfaces of the housing 11 that intersect the Z-axis, the top surface, specifically the outer surface of the housing 11 facing in the positive Z-axis direction, is the mounting surface 11a. Among the surfaces of the housing 11 that intersect the Z-axis, the outer surface of the housing 11 facing in the negative Z-axis direction is the bottom surface 11c. Electronic components are mounted on the surface opposite to the mounting surface 11a, that is, on the upper vertical surface of the inner surface of the housing 11.

[0015] The housing 11 has sufficient rigidity and strength to not deform even when subjected to the expected maximum vibration of the moving body. For example, the housing 11 is made of a metal material such as iron or aluminum. The housing 11 has a box-like shape with an opening at the top in the vertical direction, and accommodates any number of electronic components inside. The opening is closed by a plate-shaped heat receiving block on which the electronic components are attached to the main surface facing the inside of the housing. In this case, the surface of the heat receiving block facing the outside of the housing 11 forms the mounting surface 11a. The heat receiving block is made of a material with high thermal conductivity, such as a metal material such as iron or aluminum, fine ceramics, or graphite.

[0016] Multiple first heat dissipation members 12 are mounted on the mounting surface 11a at positions separated from each other. In Embodiment 1, the first heat dissipation members 12 are arranged in a radial direction perpendicular to the central axis AX1 of the blower 15. The first heat dissipation members 12 have a fin shape that extends radially. The first heat dissipation members 12 are made of a material with high thermal conductivity, such as a metal material such as iron or aluminum, fine ceramics, or graphite.

[0017] The first heat dissipation member 12 is attached to the mounting surface 11a by a mounting method such as welding or soldering. The first heat dissipation member 12 dissipates heat transferred from the electronic components housed inside the housing 11 through the mounting surface 11a of the housing 11 to the surrounding air.

[0018] The first air guide member 13 is provided with its main surface facing the mounting surface 11a, forming a first gap 14 between it and the mounting surface 11a. A portion of the first air guide member 13 faces the second gap 17. More specifically, the end of the first air guide member 13 on the negative Y-axis side is located vertically above the second gap 17.

[0019] In Embodiment 1, the first air guide member 13 is a flat plate-shaped member. The first air guide member 13 is attached to at least one of the plurality of first heat dissipation members 12. For example, the first air guide member 13 is attached to the first heat dissipation member 12 that serves as a support member among the plurality of first heat dissipation members 12. In detail, the first air guide member 13 is attached to the first heat dissipation member 12 by attachment methods such as bonding with adhesive, fitting, fastening with fastening members, or welding.

[0020] As shown in Figure 2, the first air guide member 13 has a ventilation hole 13a that allows air from outside the electronic device 1 to flow into the first gap 14. In Embodiment 1, a circular ventilation hole 13a is formed in the center of the first air guide member 13.

[0021] At least a portion of the first heat dissipation member 12 is located in the first gap 14. In Embodiment 1, a plurality of first heat dissipation members 12 are located in the first gap 14, separated from each other.

[0022] The blower 15 is a centrifugal blower that draws air in from the ventilation hole 13a of the first air guide member 13 and discharges the drawn-in air along the mounting surface 11a in the first gap 14. The blower 15 is attached to the first air guide member 13.

[0023] The second air guide member 16 is provided with its main surface facing the side surface 11b, forming a second gap 17 between it and the side surface 11b. In Embodiment 1, the second air guide member 16 is a flat plate-shaped member. The second air guide member 16 is attached to the side surface 11b by a pair of mounting members 18. The mounting members 18 are attached to the side surface 11b by mounting methods such as adhesive bonding, fitting, fastening with fastening members, or welding. The second air guide member 16 is attached to the mounting members 18 by mounting methods such as adhesive bonding, fitting, fastening with fastening members, or welding.

[0024] In Embodiment 1, the electronic device 1 includes a second air guide member 16 facing the side surface 11b in the negative Y-axis direction, and a second air guide member 16 facing the side surface 11b in the positive Y-axis direction. The upper vertical end 16a of the second air guide member 16 is positioned away from the first air guide member 13. The lower vertical end 16b of the second air guide member 16 is positioned vertically above the bottom surface 11c of the housing 11.

[0025] The cooling of the electronic components of the electronic device 1 having the above configuration will be described below. When the blower 15 is operating, as shown by the black arrow in Figure 4, the blower 15 draws in air located vertically above the first air guide member 13 in the negative Z-axis direction. As shown in Figure 5, the blower 15 discharges the drawn-in air radially. With the first air guide member 13 provided, the air discharged by the blower 15 flows through the first air gap 14 sandwiched between the first air guide member 13 and the mounting surface 11a of the housing 11, along the mounting surface 11a, between the first heat dissipation members 12, and out to the outside of the electronic device 1. As a result, the heat generated by the electronic components housed inside the housing 11 is transferred to the air flowing between the first heat dissipation members 12 in the first air gap 14 via the mounting surface 11a of the housing 11 and the first heat dissipation members 12. This cools the electronic components.

[0026] As shown by the black arrows in Figure 4, an airflow occurs, resulting in negative pressure at the end of the first gap 14, which is located vertically above the second gap 17. As a result, as shown by the white arrows, air moves vertically upward in the second gap 17 formed between the second air guide member 16 and the side surface 11b. 13The end of the second air guide member 16 faces the end face of the second air guide member 16 that is close to the mounting surface 11a, specifically the upper vertical end 16a. In other words, the second air guide member 16 is positioned so that its upper vertical end 16a is away from the first air guide member 13. This allows the second air guide member 16 to allow air that has moved vertically upward along the side surface 11b of the housing 11 to flow between its upper vertical end 16a and the first air guide member 13. As a result, as shown by the white arrow, the air that has moved vertically upward through the second gap 17 moves along the first air guide member 13 and flows out to the outside of the electronic device 1 through the space between the upper vertical end 16a of the second air guide member 16 and the first air guide member 13.

[0027] The second air guide member 16 is positioned so that its vertical lower end 16b is located vertically above the bottom surface 11c of the housing 11. This allows the second air guide member 16 to allow outside air to flow into the second air gap 17 from the gap vertically below, specifically, the gap between the vertical lower end 16b of the second air guide member 16 and the mounting surface of the electronic device 1. As a result, as indicated by the white arrows, outside air flows into the second air gap 17 and moves vertically upward as described above. The operation of the blower 15 promotes natural convection in the second air gap 17 as described above. Consequently, the heat generated by the electronic components housed inside the housing 11 is transferred to the air flowing through the second air gap 17 via the side surface 11b of the housing 11. This cools the electronic components.

[0028] As described above, the electronic device 1 according to Embodiment 1 includes a first air guide member 13 and a second air guide member 16. When the blower 15 operates, an airflow along the mounting surface 11a and an airflow along the side surface 11b are generated. As a result, more air flows along the housing 11, resulting in an electronic device 1 with high cooling performance for the electronic components housed inside the housing 11.

[0029] Improved cooling performance of electronic components suppresses temperature rise, extends the lifespan of electronic components, and reduces their failure rate. Improved cooling performance of electronic components also enables miniaturization of electronic devices, and, if electronic device 1 is a power converter, allows for increased power capacity.

[0030] (Embodiment 2) The configuration of the electronic device is not limited to the examples described above; any configuration that allows for cooling of the electronic components housed inside the housing 11 by flowing air along the mounting surface 11a and the side surface 11b is acceptable. An electronic device 2 with a different configuration from the electronic device 1 according to Embodiment 1 will be described in Embodiment 2, focusing on the differences from Embodiment 1.

[0031] The electronic device 2 shown in Figures 6, 7, and Figure 8, which is a cross-sectional view taken along the line VIII-VIII in Figure 6, comprises a plurality of first heat dissipation members 19 having a fin shape whose main surface is parallel to the YZ plane, a first air guide member 20 that forms a first gap 14 between itself and the mounting surface 11a, a blower 21 provided adjacent to one end of the mounting surface 11a and blowing air toward the other end of the mounting surface 11a, and a plurality of second heat dissipation members 22 provided in the second gap 17.

[0032] Multiple first heat dissipation members 19 are mounted on the mounting surface 11a at positions separated from each other. As shown in Figure 8, which omits the description of the first air guide member 20 from Figures 6 and 7, the first heat dissipation members 19 have a fin shape that extends in the airflow direction of the blower 21. In Embodiment 2, multiple first heat dissipation members 19 are arranged at intervals in the X-axis direction. The first heat dissipation members 19 are made of a material with high thermal conductivity, such as a metal material such as iron or aluminum, fine ceramics, or graphite.

[0033] The first heat dissipation member 19 is attached to the mounting surface 11a by a mounting method such as welding or soldering. The first heat dissipation member 19 dissipates heat transferred from the electronic components housed inside the housing 11 through the mounting surface 11a of the housing 11 to the surrounding air.

[0034] The first air guide member 20 is provided with its main surface facing the mounting surface 11a, forming a first gap 14 between it and the mounting surface 11a. One end of the first air guide member 20 in the Y-axis direction is located adjacent to the blower 21. The other end of the first air guide member 20 in the Y-axis direction faces the second gap 17. More specifically, the end of the first air guide member 20 on the negative Y-axis side is located vertically above the second gap 17.

[0035] In Embodiment 2, the first air guide member 20 is a flat plate-shaped member. The first air guide member 20 is attached to at least one of the plurality of first heat dissipation members 19. For example, the first air guide member 20 is attached to the first heat dissipation member 19 that serves as a support member among the plurality of first heat dissipation members 19. In detail, the first air guide member 20 is attached to the first heat dissipation member 19 by attachment methods such as bonding with adhesive, fitting, fastening with fastening members, or welding.

[0036] At least a portion of the first heat dissipation member 19 is located in the first gap 14. In Embodiment 2, multiple first heat dissipation members 19 are located in the first gap 14, separated from each other.

[0037] The blower 21 is an axial flow blower that is positioned adjacent to one end of the mounting surface 11a in the Y-axis direction and blows air toward the other end of the mounting surface 11a in the Y-axis direction. In Embodiment 2, the two blowers 21 provided by the electronic device 2 are spaced apart in the X-axis direction. Each blower 21 is provided at the end of the mounting surface 11a on the positive Y-axis side and blows air in the negative Y-axis direction.

[0038] Multiple second heat dissipation members 22 are located in the second gap 17 and attached to the side surface 11b. In Embodiment 2, the second heat dissipation members 22 are located in the second gap 17 and arranged in the X-axis direction. The second heat dissipation members 22 have a fin shape that extends vertically. The second heat dissipation members 22 are made of a material with high thermal conductivity, such as a metal material such as iron or aluminum, fine ceramics, or graphite.

[0039] The second heat dissipation member 22 is attached to the side surface 11b by a mounting method such as welding or soldering. The second heat dissipation member 22 dissipates heat transferred from the electronic components housed inside the housing 11 through the side surface 11b of the housing 11 to the surrounding air.

[0040] In Embodiment 2, the second air guide member 16 is a flat plate-shaped member. The second air guide member 16 is attached to at least one of the plurality of second heat dissipation members 22. For example, the second air guide member 16 is attached to the second heat dissipation member 22 that serves as a support member among the plurality of second heat dissipation members 22. In detail, the second air guide member 16 is attached to at least some of the second heat dissipation members 22 by attachment methods such as bonding with adhesive, fitting, fastening with fastening members, or welding.

[0041] The cooling of the electronic components of the electronic device 2 having the above configuration will be described below. When the blower 21 is operating, the blower 21 blows air in the negative Y-axis direction, as shown by the black arrows in Figures 9 and 10. With the provision of the first air guide member 20, the air discharged by the blower 21 flows along the mounting surface 11a and between the first heat dissipation members 19 in the first gap 14 sandwiched between the first air guide member 20 and the mounting surface 11a of the housing 11, and flows out to the outside of the electronic device 2. As a result, the heat generated by the electronic components housed inside the housing 11 is transferred to the air flowing between the first heat dissipation members 19 in the first gap 14 via the mounting surface 11a of the housing 11 and the first heat dissipation members 19. This cools the electronic components.

[0042] As shown by the black arrows in Figures 9 and 10, an airflow occurs, resulting in negative pressure at the end of the first gap 14, which is located vertically above the second gap 17. As a result, as shown by the white arrows, air moves vertically upward in the second gap 17 formed between the second air guide member 16 and the side surface 11b. Since the upper vertical end 16a of the second air guide member 16 is positioned away from the first air guide member 20, it allows the air that has moved vertically upward along the side surface 11b of the housing 11 to flow between the upper vertical end 16a and the first air guide member 20. Therefore, as shown by the white arrows, the air that has moved vertically upward in the second gap 17 moves along the first air guide member 20 and flows out to the outside of the electronic device 2 through the space between the upper vertical end 16a of the second air guide member 16 and the first air guide member 20.

[0043] The second air guide member 16 is positioned so that its vertical lower end 16b is located vertically above the bottom surface 11c of the housing 11. This allows the second air guide member 16 to allow outside air to flow into the second air gap 17 from the gap vertically below, specifically, the gap between the vertical lower end 16b of the second air guide member 16 and the mounting surface of the electronic device 2. As a result, as indicated by the white arrows, outside air flows into the second air gap 17 and moves vertically upward as described above. The operation of the blower 21 promotes natural convection in the second air gap 17 as described above. As a result, the heat generated by the electronic components housed inside the housing 11 is transferred to the air flowing through the second air gap 17 via the side surface 11b of the housing 11. This cools the electronic components.

[0044] As described above, the electronic device 2 according to Embodiment 2 includes a first air guide member 20 and a second air guide member 16. When the blower 21 operates, an airflow along the mounting surface 11a and an airflow along the side surface 11b are generated. As a result, more air flows along the housing 11, resulting in an electronic device 2 with high cooling performance for the electronic components housed inside the housing 11.

[0045] Since the electronic device 2 is equipped with a second heat dissipation member 22 located in the second air gap 17, heat is efficiently transferred from the electronic components housed inside the housing 11 to the air located in the second air gap 17 via the side surface 11b and the second heat dissipation member 22. As a result, an electronic device 2 with high cooling performance for the electronic components housed inside the housing 11 is obtained.

[0046] Improved cooling performance of electronic components suppresses temperature rise, extends the lifespan of electronic components, and reduces their failure rate. Improved cooling performance of electronic components also enables miniaturization of electronic device 2, and, if electronic device 2 is a power converter, allows for increased power capacity.

[0047] (Embodiment 3) The configuration of the electronic device is not limited to the examples described above; any configuration that allows for cooling of the electronic components housed inside the housing 11 by flowing air along the mounting surface 11a and the side surface 11b is acceptable. An electronic device 3 with a different configuration from the electronic device 1 according to Embodiment 1 will be described in Embodiment 3, focusing on the differences from Embodiment 1.

[0048] The electronic device 3 shown in Figures 11, 12, and Figure 13, which is a cross-sectional view taken along the line XIII-XIII in Figure 11, comprises a second air guide member 23 that forms a second gap 24 with the side surface 11b, a first support member 25 that supports the first air guide member 13, and a second support member 26 that supports the second air guide member 23.

[0049] As shown in Figure 12, the first air guide member 13 is supported by four first support members 25. The first air guide member 13 is attached to the four first support members 25 by methods such as adhesive bonding, fitting, fastening with fastening members, or welding.

[0050] As shown in Figures 11 to 13, the second air guide member 23 is provided with a portion facing the side surface 11b, forming a second gap 24 between it and the side surface 11b. The second air guide member 23 has a portion facing the side surface 11b and a portion facing the ground surface of the electronic device 3. For example, the second air guide member 23 is formed by bending a flat plate-shaped member at a right angle.

[0051] In Embodiment 3, the electronic device 3 includes a second air guide member 23, part of which faces the side surface 11b in the negative Y-axis direction, and a second air guide member 23, part of which faces the side surface 11b in the positive Y-axis direction. The upper vertical end 23a of the second air guide member 23 is positioned away from the first air guide member 13. The lower vertical end 23b of the second air guide member 23 is positioned vertically above the bottom surface 11c of the housing 11.

[0052] As shown in Figure 13, each second air guide member 23 is supported by four second support members 26. The second air guide members 23 are attached to the four second support members 26 by methods such as adhesive bonding, fitting, fastening with fastening members, or welding.

[0053] The first support member 25 and the second support member 26 are fixed to the ground surface of the electronic device 3.

[0054] The cooling of the electronic components of the electronic device 3 having the above configuration will be described below. When the blower 15 is operating, as shown by the black arrow in Figure 14, the blower 15 draws in air located vertically above the first air guide member 13 in the negative Z-axis direction. As shown in Figure 15, the blower 15 discharges the drawn-in air radially. With the first air guide member 13 provided, the air discharged by the blower 15 flows along the mounting surface 11a and between the first heat dissipation members 12 in the first gap 14 sandwiched between the first air guide member 13 and the mounting surface 11a of the housing 11, and flows out to the outside of the electronic device 3. As a result, the heat generated by the electronic components housed inside the housing 11 is transferred to the air flowing between the first heat dissipation members 12 in the first gap 14 via the mounting surface 11a of the housing 11 and the first heat dissipation members 12. This cools the electronic components.

[0055] As shown by the black arrows in Figure 14, an airflow occurs, resulting in negative pressure at the end of the first gap 14, which is located vertically above the second gap 24. As a result, as shown by the white arrows, air moves vertically upward in the second gap 24 formed between the second air guide member 23 and the side surface 11b. Since the upper vertical end 23a of the second air guide member 23 is positioned away from the first air guide member 13, it allows the air that has moved vertically upward along the side surface 11b of the housing 11 to flow between the upper vertical end 23a and the first air guide member 13. Therefore, as shown by the white arrows, the air that has moved vertically upward in the second gap 24 moves along the first air guide member 13 and flows out to the outside of the electronic device 3 through the space between the upper vertical end 23a of the second air guide member 23 and the first air guide member 13.

[0056] The second air guide member 23 is positioned so that its vertical lower end 23b is located vertically above the bottom surface 11c of the housing 11. This allows the second air guide member 23 to allow outside air to flow into the second air gap 24 from the gap vertically below, specifically, the gap between the vertical lower end 23b of the second air guide member 23 and the mounting surface of the electronic device 3. As a result, as indicated by the white arrows, outside air flows into the second air gap 24 and moves vertically upward as described above. The operation of the blower 15 promotes natural convection in the second air gap 24 as described above. Consequently, the heat generated by the electronic components housed inside the housing 11 is transferred to the air flowing through the second air gap 24 via the side surface 11b of the housing 11. This cools the electronic components.

[0057] As described above, the electronic device 3 according to Embodiment 3 includes a first air guide member 13 and a second air guide member 23. When the blower 15 operates, an airflow along the mounting surface 11a and an airflow along the side surface 11b are generated. As a result, more air flows along the housing 11, resulting in an electronic device 3 with high cooling performance for the electronic components housed inside the housing 11.

[0058] Improved cooling performance of electronic components suppresses temperature rise, extends the lifespan of electronic components, and reduces their failure rate. Improved cooling performance of electronic components also enables miniaturization of electronic devices 3, and, if electronic device 3 is a power converter, allows for increased power capacity.

[0059] This disclosure is not limited to the embodiments described above. The embodiments described above can be combined in any way. For example, the electronic device 2 may include a second air guide member 16 or a second air guide member 23 corresponding to the side surface 11b facing in the positive Y-axis direction. In this case, the Y-axis end of the first air guide member 20 may be located vertically above the second air guide member 23. Furthermore, the vertical upper end 16a of the second air guide member 16 or the vertical upper end 23a of the second air guide member 23 may abut against the first air guide member 20.

[0060] As another example, electronic device 3 may include the first heat dissipation member 19, the first air guide member 20, and the blower 21 provided by electronic device 2. In this case, the first air guide member 20 may be supported by the first support member 25.

[0061] The mounting surface is not limited to the top surface of the housing 11 in the vertical direction. For example, the bottom surface of the housing 11 in the vertical direction may also be the mounting surface. The bottom surface 11c of the housing 11 of the electronic device 4 shown in Figure 16 serves as a mounting surface to which multiple first heat dissipation members 12 are attached. The configuration of the electronic device 4 is the same as that of the electronic device 1.

[0062] The second air guide member 16 is positioned so that its vertical lower end 16b is adjacent to the first air guide member 13, and guides the air flowing through the first gap 14 to the second gap 17. The vertical lower end 16b of the second air guide member 16 is adjacent to the first air guide member 13 to such an extent that it can prevent the air discharged from the blower 15 and passing between the first heat dissipation members 12 from flowing out horizontally. It is preferable that the vertical lower end 16b of the second air guide member 16 is in contact with the first air guide member 13.

[0063] When the blower 15 operates, as shown by the black arrow in Figure 17, the blower 15 draws in air located vertically below the first air guide member 13 in the positive Z-axis direction. The blower 15 then discharges the drawn-in air radially. With the first air guide member 13 in place, the air discharged by the blower 15 flows between the first heat dissipation members 12 along the mounting surface 11a in the first gap 14 sandwiched between the first air guide member 13 and the mounting surface 11a of the housing 11. With the second air guide member 16 positioned so that its vertical lower end 16b is adjacent to the first air guide member 13, the air that has passed between the first heat dissipation members 12 is guided into the second gap 17 and moves vertically upward through the second gap 17.

[0064] The air that moves vertically upward through the second gap 17 flows out to the outside of the electronic device 4. Due to the aforementioned airflow, heat is transferred from the electronic components housed inside the housing 11 to the air flowing through the first gap 14 and the second gap 17 via the bottom surface 11c and side surface 11b of the housing 11, thereby cooling the electronic components. In the examples of Figures 16 and 17, it is preferable that the electronic components are located inside the housing 11 near the bottom surface 11c.

[0065] The electronic device 4 may be equipped with an axial flow fan that blows air in the negative Z-axis direction instead of the blower 15. In this case, the air flows in the opposite direction to the airflow shown in Figure 17. That is, the second air guide member 16 guides the air flowing through the second gap 17 to the first gap 14. In this case as well, the airflow transfers heat from the electronic components housed inside the housing 11 to the air flowing through the first gap 14 and the second gap 17 via the bottom surface 11c and side surface 11b of the housing 11, thereby cooling the electronic components.

[0066] The direction of airflow from the blower is not limited to the examples described above. As an example, the electronic device 5 shown in Figure 18 includes a blower 27 which is an axial flow blower that blows air in the positive Z-axis direction. The blower 27 is attached to the first air guide member 13 with a portion of it located in the ventilation hole 13a of the first air guide member 13.

[0067] The second air guide member 16 is positioned so that its vertical upper end 16a is adjacent to the first air guide member 13, and guides the air flowing through the second gap 17 to the first gap 14. The vertical upper end 16a of the second air guide member 16 is attracted to the blower 27 that blows air in the positive Z-axis direction, and is adjacent to the first air guide member 13 to such an extent that it can prevent the air that has moved vertically upward through the second gap 17 from flowing out horizontally. It is preferable that the vertical upper end 16a of the second air guide member 16 is in contact with the first air guide member 13.

[0068] When the blower 27 operates, as shown by the black arrows in Figure 19, the blower 27 draws in air from the first gap 14, blows the drawn-in air in the positive Z-axis direction, and discharges it from the ventilation holes 13a of the first air guide member 13. As a result, in the first gap 14, the air flows through the space between the first heat dissipation members 12 toward the blower 27. With the first air guide member 13 in place, the air drawn into the blower 27 flows along the mounting surface 11a between the mounting surface 11a of the housing 11 and the first gap 14, which is sandwiched between the first air guide member 13 and the mounting surface 11a of the housing 11, and between the first heat dissipation members 12. As the air flows toward the blower 27, the air pressure in the first gap 14, which is located vertically above the second gap 17, becomes negative. As a result, as shown by the white arrows, the air in the second gap 17 is vertically phased upward.

[0069] The second air guide member 16 is positioned so that its upper vertical end 16a abuts against the first air guide member 13. As a result, the second air guide member 16 guides the air that has moved vertically upward through the second gap 17 to the first gap 14. The air guided into the first gap 14 passes between the first heat dissipation members 12 in the first gap 14 and heads toward the blower 27. Due to the above airflow, heat is transferred from the electronic components housed inside the housing 11 to the air flowing through the first gap 14 and the second gap 17 via the mounting surface 11a and side surface 11b of the housing 11, thereby cooling the electronic components.

[0070] As another example, the electronic device 2 may include a fan 21 which is an axial flow fan located at the end on the positive Y-axis side and blowing air in the negative Y-axis direction, and another fan 21 which is an axial flow fan located at the end on the negative Y-axis side and blowing air in the positive Y-axis direction.

[0071] The number of second air guide members 16 is not limited to the example described above. The electronic device 6 shown in Figure 20 has four second air guide members 16 corresponding to each of the four sides 11b. Each second air guide member 16 forms a second gap 17 between itself and the corresponding side 11b. By providing a second air guide member 16 facing each side 11b, an airflow is generated along each side 11b. As a result, the electronic components inside the housing 11 are cooled more effectively.

[0072] The number, arrangement, and shape of the first and second heat dissipation members are not limited to the examples described above. As an example, the electronic device 7 shown in Figures 21 and 22 includes a plurality of second heat dissipation members 22 arranged vertically and horizontally, each having a fin shape.

[0073] As another example, the electronic device 8 shown in Figure 23 includes a plurality of first heat dissipation members 19 arranged in the direction of airflow from the blower 21 and in directions perpendicular to the direction of airflow from the blower 21.

[0074] As another example, the first heat dissipation members 12 and 19 may have curved surfaces. Similarly, the second heat dissipation member 22 may have curved surfaces.

[0075] As another example, the first heat dissipation members 12 and 19 may be formed integrally with the housing 11. Similarly, the second heat dissipation member 22 may be formed integrally with the housing 11.

[0076] The structures of the first and second heat dissipation members are not limited to the examples described above. As an example, the electronic device 9 shown in Figure 24 includes a plurality of first heat dissipation members 28 which are heat pipes. The first heat dissipation member 28 has a main pipe 28a that extends in the Y-axis direction and is attached to the mounting surface 11a, and a branch pipe 28b that communicates with the main pipe 28a and extends in the vertical direction. The electronic device 9 further includes a plurality of heat dissipation fins 29 attached to the first heat dissipation member 28. The heat dissipation fins 29 located at the lower vertical end serve as first air guide members.

[0077] The shapes of the first support member 25 and the second support member 26 are not limited to the examples described above. For example, the first support member 25 and the second support member 26 may have a plate-like shape.

[0078] Electronic devices 1-9 are not limited to aircraft and can be mounted on any mobile device. Furthermore, electronic devices 1-9 can be installed at any location on ground equipment. For example, electronic device 1 may be mounted under the floor of a railway vehicle. In this case, if there is space vertically below electronic device 1, the vertical lower end 16b of the second air guide member 16 may be located vertically below the bottom surface 11c of the housing 11. The various aspects of this disclosure are summarized below as an appendix. (Note 1) A housing that contains electronic components that generate heat when powered on, Multiple first heat dissipation members are attached to the mounting surface, which is a surface intersecting the vertical direction of the housing, at positions far apart from each other, and dissipate heat transferred from the housing into the surrounding air. A first air guide member forms a first gap between itself and the mounting surface, in which at least a portion of the first heat dissipation member is located. A blower that generates an airflow along the first heat dissipation member in the first gap, The housing comprises at least one second air guide member that forms a second gap between itself and the side surface which is a surface along the vertical direction of the housing, A portion of the first air guide member faces the second gap, electronic equipment. (Note 2) The end of the first air guide member faces the end face of the second air guide member, which is closer to the mounting surface. Electronic equipment as described in Appendix 1. (Note 3) Ventilation holes are formed in the first air guide member. The blower is a centrifugal blower that draws air in from the ventilation hole of the first air guide member and discharges the drawn-in air along the mounting surface in the first gap. Electronic equipment as described in Appendix 1 or 2. (Note 4) Ventilation holes are formed in the first air guide member. The blower is an axial flow blower that draws in air from the first gap and discharges the drawn-in air from the ventilation hole of the first air guide member. Electronic equipment as described in Appendix 1 or 2. (Note 5) The first heat dissipation member has a fin shape that extends radially perpendicular to the central axis of the blower. Electronic devices as described in Appendix 3 or 4. (Note 6) The blower is an axial flow blower that is installed adjacent to one end of the mounting surface and blows air toward the other end of the mounting surface. Electronic equipment as described in Appendix 1 or 2. (Note 7) The first heat dissipation member has a fin shape that extends in the direction of airflow from the blower. Electronic devices as described in Appendix 6. (Note 8) The mounting surface is the upper surface of the housing in the vertical direction. Electronic devices as described in any of the appendices 1 through 7. (Note 9) The second air guide member is provided at a position where its upper vertical end is separated from the first air guide member, allowing air that has moved vertically upward along the side surface of the housing to flow between its upper vertical end and the first air guide member. Electronic devices as described in Appendix 8. (Note 10) The second air guide member is provided at a position where its upper vertical end is adjacent to the first air guide member, and guides the air flowing through the first gap to the second gap, or guides the air flowing through the second gap to the first gap. Electronic devices as described in Appendix 8. (Note 11) The second air guide member is provided at a position where its lower vertical end is located vertically above the bottom surface of the housing, allowing external air to flow into the second gap. Electronic devices as described in any of the appendices 8 to 10. (Note 12) The mounting surface is the bottom surface of the housing in the vertical direction. Electronic devices as described in any of the appendices 1 through 7. (Note 13) The second air guide member is provided at a position where its lower vertical end is adjacent to the first air guide member, and guides the air flowing through the first gap to the second gap, or guides the air flowing through the second gap to the first gap. Electronic equipment as described in Appendix 12. (Note 14) The first air guide member is attached to a plurality of the first heat dissipation members. Electronic devices as described in any of the appendices 1 to 13. (Note 15) The present invention further comprises a plurality of second heat dissipation members located in the second gap and attached to the side surface, which dissipate heat transferred from the housing into the surrounding air. Electronic devices as described in any of the appendices 1 through 14. (Note 16) The second air guide member is attached to a plurality of the second heat dissipation members. Electronic equipment as described in Appendix 15. (Note 17) The first air guide member is supported by a first support member fixed to the ground surface of the housing. Electronic devices as described in any of the appendices 1 through 16. (Note 18) The second air guide member is supported by a second support member fixed to the ground surface of the housing. Electronic devices as described in any of the appendices 1 through 17.

[0079] This disclosure allows for various embodiments and modifications without departing from the broad spirit and scope of this disclosure. Furthermore, the embodiments described above are for illustrative purposes only and do not limit the scope of this disclosure. In other words, the scope of this disclosure is indicated by the claims, not by the embodiments. Various modifications made within the scope of the claims and the equivalent significance of the disclosure are considered to be within the scope of this disclosure. [Explanation of symbols]

[0080] 1,2,3,4,5,6,7,8,9 Electronic equipment, 11 Housing, 11a Mounting surface, 11b Side surface, 11c Bottom surface, 12,19,28 First heat dissipation member, 13,20 First air guide member, 13a Ventilation hole, 14 First air gap, 15,21,27 Blower, 16,23 Second air guide member, 16a,23a Upper vertical end, 16b,23b Lower vertical end, 17,24 Second air gap, 18 Mounting member, 22 Second heat dissipation member, 25 First support member, 26 Second support member, 28a Main pipe, 28b Branch pipe, 29 Heat dissipation fin, AX1 Central axis.

Claims

1. A housing that contains electronic components that generate heat when powered on, A plurality of first heat dissipation members are attached at a distance from each other to a mounting surface which is the outer surface of the housing intersecting in the vertical direction, and which dissipate heat transferred from the housing into the surrounding air. A first air guide member forms a first gap between itself and the mounting surface, in which at least a portion of the first heat dissipation member is located. A blower that generates an airflow along the first heat dissipation member in the first gap, The housing comprises at least one second air guide member that forms a second gap between itself and the side surface which is the outer surface of the housing along the vertical direction, A portion of the first air guide member faces the second gap, electronic equipment.

2. The end of the first air guide member faces the end face of the second air guide member, which is closer to the mounting surface. The electronic device according to claim 1.

3. Ventilation holes are formed in the first air guide member. The blower is a centrifugal blower that draws air in from the ventilation hole of the first air guide member and discharges the drawn-in air along the mounting surface in the first gap. The electronic device according to claim 1 or 2.

4. Ventilation holes are formed in the first air guide member. The blower is an axial flow blower that sucks in air from the first gap and discharges the sucked-in air from the ventilation hole of the first air guide member. The electronic device according to claim 1 or 2.

5. The first heat dissipation member has a fin shape that extends radially perpendicular to the central axis of the blower. The electronic device according to claim 3.

6. The blower is an axial flow blower that is installed adjacent to one end of the mounting surface and blows air toward the other end of the mounting surface. The electronic device according to claim 1 or 2.

7. The first heat dissipation member has a fin shape that extends in the direction of airflow from the blower. The electronic device according to claim 6.

8. The mounting surface is the upper surface of the housing in the vertical direction. The electronic device according to claim 1 or 2.

9. The second air guide member is provided at a position where its upper vertical end is separated from the first air guide member, allowing air that has moved vertically upward along the side surface of the housing to flow between its upper vertical end and the first air guide member. The electronic device according to claim 8.

10. The second air guide member is provided at a position where its upper vertical end is adjacent to the first air guide member, and guides the air flowing through the first gap to the second gap, or guides the air flowing through the second gap to the first gap. The electronic device according to claim 8.

11. The second air guide member is provided at a position where its lower vertical end is located vertically above the bottom surface of the housing, allowing external air to flow into the second gap. The electronic device according to claim 8.

12. The mounting surface is the bottom surface of the housing in the vertical direction. The electronic device according to claim 1 or 2.

13. The second air guide member is provided at a position where its lower vertical end is adjacent to the first air guide member, and guides the air flowing through the first gap to the second gap, or guides the air flowing through the second gap to the first gap. The electronic device according to claim 12.

14. The first air guide member is attached to a plurality of the first heat dissipation members. The electronic device according to claim 1 or 2.

15. The present invention further comprises a plurality of second heat dissipation members located in the second gap and attached to the side surface, which dissipate heat transferred from the housing into the surrounding air. The electronic device according to claim 1 or 2.

16. The second air guide member is attached to a plurality of the second heat dissipation members. The electronic device according to claim 15.

17. The first air guide member is supported by a first support member fixed to the ground surface of the housing. The electronic device according to claim 1 or 2.

18. The second air guide member is supported by a second support member fixed to the ground surface of the housing. The electronic device according to claim 1 or 2.

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