Optical module

Abstract

To provide an optical module which can be downsized, the optical module comprising a heat dissipation part.SOLUTION: An optical module comprises a module main body including a light source part which outputs light, and a heat dissipation part for dissipating heat from the module main body. The heat dissipation part includes: a heat dissipation substrate which includes a first face and a second face positioned oppositely to the first face and to which the module main body is mounted; and a plurality of heat dissipation fins provided on the first face and protruding to an opposite side of the second face. The module main body is disposed at the side of the first face of the heat dissipation substrate, and the module main body is mounted to the heat dissipation substrate in such a manner that at least a portion of a periphery of the module main body is enclosed by the plurality of heat dissipation fins.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an optical module.

Background Art

[0002] A module (module body) including a light source unit that outputs light is used in various optical devices such as a remote sensor, a drawing device, and an optical communication device. When the light source unit is driven to output light, the light source unit generates heat. In some cases, the state (such as wavelength) of the light output from the light source unit fluctuates due to the heat generated in this way. Therefore, the module body is usually mounted on a heat radiating unit (for example, a heat sink) for radiating heat. As the heat radiating unit, a heat radiating unit including a heat radiating substrate and a plurality of heat radiating fins provided on the heat radiating substrate is known (see Patent Document 1, Patent Document 2, and Patent Document 3).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] An optical module according to one embodiment comprises a module body including a light source unit that outputs light, and a heat dissipation unit for dissipating heat from the module body, wherein the heat dissipation unit has a first surface and a second surface located opposite to the first surface, and includes a heat dissipation substrate to which the module body is attached, and a plurality of heat dissipation fins provided on the first surface and protruding away from the second surface, wherein the module body is arranged on the first surface side of the heat dissipation substrate, and the module body is attached to the heat dissipation substrate such that at least a portion of the periphery of the module body is surrounded by the plurality of heat dissipation fins. [Effects of the Invention]

[0007] According to this disclosure, it is possible to provide an optical module having a heat dissipation section that can be miniaturized. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram of a detection device to which an optical module according to one embodiment is applied. [Figure 2] Figure 2 is a perspective view of an optical module according to one embodiment. [Figure 3] Figure 3 is a perspective view of the module itself. [Figure 4] Figure 4 is a perspective view of the module body shown in Figure 3 with the cover removed. [Figure 5] Figure 5 is a plan view of the module body with the cover removed, as shown in Figure 4. [Figure 6] Figure 6 is a cross-sectional view of the optical module along the line VI-VI in Figure 2. [Figure 7]Figure 7 is a diagram showing the circuit board on which the module body is mounted, viewed from the back side of the circuit board. [Figure 8] Figure 8 is a perspective view of an example of a heat dissipation section. [Figure 9] Figure 9 is a cross-sectional view of the optical module according to Modified Example 1. [Figure 10] Figure 10 is a perspective view of the module body according to Modification Example 2. [Figure 11] Figure 11 is a perspective view of the module body shown in Figure 10 with the cover removed. [Figure 12] Figure 12 is a plan view of the optical module according to modified example 3. [Figure 13] Figure 13 is a plan view of the optical module according to modified example 4. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and explained.

[0010] [1] The optical module according to the present disclosure comprises a module body including a light source unit that outputs light, and a heat dissipation unit for dissipating heat from the module body, wherein the heat dissipation unit has a first surface and a second surface located opposite to the first surface, and comprises a heat dissipation substrate to which the module body is attached, and a plurality of heat dissipation fins provided on the first surface and protruding away from the second surface, wherein the module body is arranged on the first surface side of the heat dissipation substrate, and the module body is attached to the heat dissipation substrate such that at least a portion of the periphery of the module body is surrounded by the plurality of heat dissipation fins.

[0011] In the optical module described in [1] above, a plurality of heat dissipation fins are provided on the first surface. The module body is attached to the heat dissipation substrate such that at least a part of the periphery of the module body is surrounded by the plurality of heat dissipation fins. Therefore, miniaturization of the optical module can be achieved compared to the case where the module body is attached to the second surface.

[0012] [2] In the optical module described in [1] above, the height of the module body with respect to the first surface may be not more than the height of the plurality of heat dissipation fins. In this case, further miniaturization of the optical module can be achieved, and the amount of heat dissipation with respect to the volume of the entire optical module can be made larger.

[0013] [3] In the optical module described in [1] or [2] above, the heat dissipation substrate has a first region, a second region surrounding at least a part of the periphery of the first region, and a third region provided between the first region and the second region. The first region is the region where the module body is disposed, the second region is the region where the plurality of heat dissipation fins are disposed, and the third region may be a groove portion.

[0014] In the optical module described in [3] above, the module body is disposed in the first region. The plurality of heat dissipation fins are disposed in the second region surrounding at least a part of the periphery of the first region. Therefore, at least a part of the periphery of the module body is surrounded by the plurality of heat dissipation fins. The third region is the region between the first region and the second region and is a groove portion. Therefore, even if terminals for external connection or the like project from the module body, for example, toward the heat dissipation substrate, the terminals for external connection or the like can be disposed in the groove portion. In this case, interference between the terminals for external connection or the like and the heat dissipation substrate can be prevented.

[0015] [4] In the optical module described in [3] above, the thickness of the first region may be thinner than the thickness of the second region. In this case, the module body is placed in the first region which is lower than the second region. Therefore, it is possible to make the height of the optical module with respect to the first surface lower than when the thickness of the first region is the same as the thickness of the second region.

[0016] [5] The optical module described in [3] or [4] above has an insulating heat conductive member sandwiched between the module body and the first region, and the heat conductive member may be in thermal contact with the module body and the first region. In this case, the heat generated in the module body is efficiently transferred to the first region (heat dissipation section) through the heat conductive member. As a result, the heat dissipation performance of the module body by the heat dissipation section is improved. Since the heat conductive member is insulating, insulation between the module body and the first region (heat dissipation section) can also be ensured.

[0017] [6] In the optical module described in any of [1] to [5] above, the module body may be positioned in the center relative to the periphery of the heat dissipation substrate. In this case, the module body can be surrounded by more heat dissipation fins. Therefore, the heat generated in the module body can be easily dissipated using the heat dissipation fins.

[0018] [7] In the optical module described in any of [1] to [5] above, the module body may be placed at the corner of the heat dissipation substrate. In this case, no heat dissipation fins are placed in the direction from the module body toward the two edges that constitute the corner. Therefore, heat is less likely to accumulate around the module body. Furthermore, in the configuration described in [7] above, it is also possible to cool the module body by utilizing the flow of gas (usually air) around the module body.

[0019] [8] The optical module described in any of [1] to [7] above has a module body having a housing for housing the light source, the housing having a window for allowing light from the light source to pass to the outside of the housing, and the window may be provided on a wall in the housing that is opposite to the heat dissipation substrate. In this case, light from the light source housed in the housing can be output from the window. Since the window is provided on a wall in the housing that is opposite to the heat dissipation substrate, the light is output from the housing away from the heat dissipation substrate. Therefore, even if heat dissipation fins are provided around the module body, light can be easily output to the outside of the optical module.

[0020] [9] In the optical module described in any of [1] to [8] above, the light source unit outputs detection light for detecting an object within a detection range set outside the module body, and the module body may have a light receiving unit that receives the detection light returned from the object. In this case, for example, the optical module can be applied to a sensor for detecting an object within a detection range.

[0021]

[10] The optical module described in any of [1] to [8] above further comprises a light-receiving unit attached to the heat-dissipating substrate, the light source unit outputs detection light for detecting an object within a detection range set outside the module body, the light-receiving unit is attached to the heat-dissipating substrate such that at least a portion of the area around the light-receiving unit is surrounded by the plurality of heat-dissipating fins, and the light-receiving unit may receive the detection light returned from the object. In this case, for example, the optical module can be applied to a sensor for detecting an object within a detection range. In this case, the heat generated in the light-receiving unit can also be dissipated together with the heat generated in the module body.

[0022]

[11] In the optical module described in any of [1] to

[10] above, the module body may have a temperature controller for adjusting the temperature of the light source. In this case, the temperature of the light source is adjusted by the temperature controller. Therefore, it is easier to output stable light from the light source.

[0023]

[12] In the optical module described in any of [1] to

[11] above, the module body may have a scanning unit that scans the light output from the light source unit. In this case, the optical module can output the light scanned by the scanning unit. Therefore, the optical module can be applied to sensors, drawing devices, etc., that require scanning of light.

[0024]

[13] The optical module described in any of [1] to

[12] above further comprises a circuit board on which the module body is mounted, and the module body may be attached to the heat dissipation substrate while mounted on the circuit board. In this case, the module body can be connected to an external source using the circuit board.

[0025]

[14] In the optical module described in any of [1] to

[13] above, the light source unit may include a plurality of light-emitting elements and a wave-combining unit that combines the light from the plurality of light-emitting elements. In this case, it is possible to output light including multiple wavelengths or light with higher output.

[0026] [Details of the embodiments of this disclosure] Specific examples of embodiments of this disclosure will be described below with reference to the drawings. The present invention is not limited to these examples, and is intended to include all modifications within the meaning and scope of the claims, as defined by the claims. In the description of the drawings, identical elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0027] Figure 1 is a schematic diagram of a detection device to which an optical module according to one embodiment is applied. The detection device 1 comprises an optical module 4. The detection device 1 is a remote sensor that detects any object 3 within the detection target range 2 outside the detection device 1 (outside the optical module 4). An example of the detection device 1 is LiDAR (Light Detection and Ranging, or Laser Imaging Detection and Ranging). The object 3 is not limited. Examples of object 3 include people, automobiles, signs, etc. The detection device 1 can be mounted on, for example, automobiles, drones, etc.

[0028] The optical module 4 outputs detection light L1 for detecting the object 3. The optical module 4 outputs the detection light L1 while scanning two-dimensionally to scan within the detection target range 2. The optical module 4 receives reflected light L2 from within the detection target range 2. The reflected light L2 is the detection light L1 that has been reflected or scattered by the object 3. The detection device 1 includes a control device (not shown) that controls the output timing and scanning range of the detection light L1 output from the optical module 4, and analyzes the reflected light L2.

[0029] In this embodiment, the optical module 4 applied to the detection device 1 will be described in detail. For the sake of explanation, the optical module 4 may also be described using mutually orthogonal X, Y, and Z axes as shown in Figure 2. The Z-axis direction is along the thickness direction of the heat dissipation substrate 31 of the heat dissipation unit 30. In this embodiment, unless otherwise specified, the Z-axis direction is from the second surface 31b to the first surface 31a of the heat dissipation substrate 31.

[0030] Figure 2 is a perspective view of an optical module 4 according to one embodiment. The optical module 4 comprises a module body 10 and a heat dissipation unit 30. As shown in Figure 2, the optical module 4 may also include a circuit board 40. When the optical module 4 includes a circuit board 40, the circuit board 40 on which the module body 10 is mounted is attached to the heat dissipation unit 30. The optical module 4 equipped with a circuit board 40 will be described below.

[0031] The module body 10 will be explained using Figures 3 to 6. Figure 3 is a perspective view of the module body 10. Figure 4 is a perspective view of the module body 10 shown in Figure 3 with the cover 142 removed. Figure 5 is a plan view of the module body 10 with the cover 142 removed. Figure 6 is a cross-sectional view along the line VI-VI in Figure 2.

[0032] The module body 10 comprises a light source unit 11, a MEMS (Micro Electro Mechanical Systems) 12, and a light receiving unit 13. The module body 10 further comprises a housing unit 14 that houses the light source unit 11, the MEMS 12, and the light receiving unit 13.

[0033] In this embodiment, the light source unit 11, the MEMS (scanning unit) 12, and the light receiving unit 13 are mounted on a Peltier element (thermoelectric cooling element) 15, which is an example of a temperature controller. The Peltier element 15 is also called a TEC (ThermoElectric Cooler). The Peltier element 15 has a heat absorption plate 151, a heat sink plate 152, and a plurality of semiconductor columns 153. The plurality of semiconductor columns 153 connect the heat absorption plate 151 and the heat sink plate 152. The plurality of semiconductor columns 153 are spaced apart from each other.

[0034] The light source unit 11, MEMS 12, and light receiving unit 13 are mounted on a heat absorption plate 151. A first base 16 is fixed to the heat absorption plate 151. The first base 16 is fixed to the heat absorption plate 151, for example, by adhesive. Examples of materials for the first base 16 include aluminum nitride (AlN) and Kovar (Kv). The first base 16 has a substrate 161, a first element mounting section 162, and a second element mounting section 163. Examples of the shapes of the first element mounting section 162 and the second element mounting section 163 are a rectangular parallelepiped or a cube. The first element mounting section 162 and the second element mounting section 163 are fixed to the substrate 161, for example, by adhesive. The first base 16 may also be formed by processing a single base member formed from the same material as the first base 16.

[0035] The light source unit 11 outputs detection light L1. The light source unit 11 has at least one light-emitting element. In this embodiment, unless otherwise specified, an example of a configuration in which the light source unit 11 has a light-emitting element 111a and a light-emitting element 111b is described. The light source unit 11 has a light-emitting element 111a, a light-emitting element 111b, a waveplate 112, a lens 113a, a lens 113b, and a multiplexer 114.

[0036] The light-emitting element 111a outputs laser light La. An example of the light-emitting element 111a is a semiconductor light-emitting element. In this embodiment, the light-emitting element 111a is a laser diode (LD). The light-emitting element 111a may be an LD chip. The laser light La is light having a wavelength used in remote sensors. In this embodiment, the laser light La is near-infrared light (light with a wavelength of 800 nm or more and a wavelength of 2500 nm or less). The wavelength of the laser light La may be, for example, 830 nm, 850 nm, 905 nm, 940 nm, 1310 nm, or 1550 nm. The laser light La may be pulsed light or CW (Continuous Wave) light. In this embodiment, the laser light La output from the light-emitting element 111a is first-polarized light. The first polarization is TE mode or TM mode (in other words, p-polarization or s-polarization).

[0037] The light-emitting element 111a is mounted on the first element mounting section 162. Specifically, the second base 17a is fixed to the first element mounting section 162. The light-emitting element 111a is mounted on the second base 17a. Examples of materials for the second base 17a include AlN and silicon carbide (SiC). The second base 17a is fixed to the first element mounting section 162, for example, by an adhesive. The light-emitting element 111a is fixed to the second base 17a, for example, by a conductive adhesive. Examples of conductive adhesives include silver paste, carbon paste, or copper paste.

[0038] In the configurations shown in Figures 4 and 5, the light-emitting element 111a is positioned to emit laser light La in the X-axis direction. The height of the optical axis of the light-emitting element 111a is adjusted by the thickness of the first element mounting section 162 and the second base 17a. The height of the optical axis of the light-emitting element 111a is the height of the optical axis relative to the surface on the substrate 161 closest to the light-emitting element 111a.

[0039] The light-emitting element 111b outputs laser light Lb. An example of the light-emitting element 111b is a semiconductor light-emitting element. In this embodiment, the light-emitting element 111b is an LD. The light-emitting element 111b may be an LD chip. The laser light Lb is light having a wavelength used for remote sensors or light having a visible light wavelength to indicate the region to be remotely sensed. In this embodiment, the laser light Lb is near-infrared light or visible light. The laser light Lb may be pulsed light or CW light. Unless otherwise specified, the wavelength of the laser light Lb is the same as the wavelength of the laser light La. In this embodiment, the laser light Lb output from the light-emitting element 111b is first-polarized light.

[0040] The light-emitting element 111b is mounted on the first element mounting section 162. Specifically, the second base 17b is fixed to the first element mounting section 162. The light-emitting element 111b is mounted on the second base 17b. Examples of materials for the second base 17b include AlN and SiC. The material of the second base 17b may be the same as the material of the second base 17a. The second base 17b is fixed to the first element mounting section 162, for example, by an adhesive. The light-emitting element 111b is fixed to the second base 17b, for example, by a conductive adhesive. Examples of conductive adhesives are as described above.

[0041] In the configurations shown in Figures 4 and 5, the light-emitting element 111b is positioned to output laser light Lb in the X-axis direction. Therefore, the optical axis of the light-emitting element 111b (the direction in which the laser light Lb is output) is parallel to the optical axis of the light-emitting element 111a (the direction in which the laser light La is output). The height of the optical axis of the light-emitting element 111b is adjusted by the thickness of the first element mounting section 162 and the second base 17b. The height of the optical axis of the light-emitting element 111b is the height of the optical axis relative to the surface on the substrate 161 closest to the light-emitting element 111b. The height of the optical axis of the light-emitting element 111b coincides with the height of the optical axis of the light-emitting element 111a.

[0042] The waveplate 112 is positioned in the optical path of the laser light Lb output from the light-emitting element 111b. In the configurations shown in Figures 4 and 5, the waveplate 112 is positioned between the light-emitting element 111b and the mirror 114b, which will be described later. The waveplate 112 changes the polarization direction of the laser light Lb. Therefore, the waveplate 112 outputs laser light Lb with a second polarization that is different from the first polarization. In this embodiment, the waveplate 112 is a half-waveplate. In this case, the waveplate 112 rotates the polarization direction of the laser light Lb by 90°. That is, the polarization direction of the second polarization is 90° different from the polarization direction of the first polarization.

[0043] The lens 113a is positioned in the optical path of the laser beam La output from the light-emitting element 111a. The lens 113a focuses the laser beam La. In this embodiment, the lens 113a functions as a collimating lens that collimates the laser beam La. The lens 113a may be a resin lens.

[0044] Lens 113b is positioned in the optical path of the laser beam Lb output from the light-emitting element 111b. Lens 113b focuses the laser beam Lb. In this embodiment, lens 113b functions as a collimating lens that collimates the laser beam Lb. Lens 113b may be a resin lens.

[0045] The multiplexer 114 combines the laser light La and the laser light Lb. An example of the multiplexer 114 will be described based on the embodiment illustrated in Figures 4 and 5. The multiplexer 114 has mirrors 114a and 114b.

[0046] Mirror 114a is positioned in the optical path of the laser beam La output from lens 113a. Mirror 114a reflects the laser beam La toward mirror 114b. In the configurations shown in Figures 4 and 5, mirror 114a reflects the laser beam La in the Y-axis direction.

[0047] Mirror 114b is positioned in the optical path of the laser beam Lb output from lens 113b. Mirror 114b is a polarization-selective mirror. Mirror 114b functions as a polarization beam splitter. Mirror 114b transmits first-polarized light and reflects second-polarized light. Therefore, mirror 114b transmits the laser beam La reflected by mirror 114a. The polarization of the laser beam Lb reaching mirror 114b has been changed from first-polarized to second-polarized by waveplate 112. Therefore, mirror 114b reflects the laser beam Lb. Specifically, mirror 114b reflects the laser beam Lb toward MEMS 12. In the configurations shown in Figures 4 and 5, mirror 114b allows the laser beam La to pass through in the Y-axis direction and reflects the laser beam Lb toward the Y-axis direction.

[0048] In the above configuration of the light source unit 11, the laser light La output from the light-emitting element 111a and the laser light Lb output from the light-emitting element 111b are combined by the wave-combining unit 114. As a result, detection light L1, which is the combined light of the laser light La and the laser light Lb, is output from the light source unit 11.

[0049] The lenses 113a, 113b, waveplate 112, mirrors 114a and 114b may be fixed to the substrate 161 by an active energy ray curing resin. An example of an active energy ray curing resin is an ultraviolet curing resin. When fixing the lenses 113a, 113b, etc. to the substrate 161 using an active energy ray curing resin, after fixing the positions of the light-emitting elements 111a and 111b, the optical axis of the optical components such as the lens 113a of the light source unit 11 can be adjusted while outputting laser light La and laser light Lb from the light-emitting elements 111a and 111b.

[0050] As mentioned above, mirror 114b is a polarization-selective mirror. Therefore, in order to combine the laser light La and the laser light Lb, the polarization state of the laser light Lb needs to be changed from the first polarization to the second polarization by the waveplate 112. In other words, the waveplate 112 also contributes to the combination of the laser light La and the laser light Lb. Therefore, the waveplate 112 may also be part of the combination section 114. The waveplate 112 may be placed between the lens 113b and the mirror 114b. The light source section 11 may have a cube-shaped polarization beam splitter instead of the mirror 114b. Also, if the polarization directions of the laser light La and the laser light Lb are 90° different by mounting either the light-emitting element 111a or the light-emitting element 111b on the first element mounting section 162 in a state rotated by 90°, the waveplate 112 is unnecessary.

[0051] The MEMS 12 is positioned in the optical path of the detection light L1 output from the light source unit 11. The MEMS 12 scans the detection light L1. The MEMS 12 may be a MEMS chip. The MEMS 12 is fixed to a support 18. The material of the support 18 may be Kv, AlN, etc. The support 18 is fixed to the heat absorption plate 151, for example, by adhesive. The surface 18a on the support 18 to which the MEMS 12 is fixed is inclined with respect to the Z-axis direction. The angle between surface 18a and the Z-axis direction is, for example, 45°. The MEMS 12 is fixed to the support 18, for example, by adhesive.

[0052] The MEMS 12 comprises a MEMS mirror 121 and a drive unit 122. The MEMS mirror 121 reflects the detection light L1 in the direction opposite to the Peltier element 15. In one embodiment, the MEMS 12 is arranged such that when the MEMS mirror 121 is not driven by the drive unit 122, the MEMS mirror 121 reflects the detection light L1 in the Z-axis direction. The drive unit 122 drives the MEMS mirror 121 two-dimensionally. As a result, the detection light L1 is scanned secondarily while being reflected by the MEMS mirror 121.

[0053] The light-receiving unit 13 receives reflected light L2. An example of the light-receiving unit 13 is a semiconductor photodetector. In this embodiment, the light-receiving unit 13 is a photodiode (PD). The light-receiving unit 13 may be a PD chip. The light-receiving unit 13 is fixed to the second element mounting unit 163, for example, by a conductive adhesive. An example of a conductive adhesive is as described above.

[0054] A thermistor 19 may be provided on the first base 16. The thermistor 19 is positioned, for example, near the light-emitting elements 111a and 111b.

[0055] As shown in Figures 3 and 6, the housing 14 has a support substrate 141 and a cover 142. The housing 14 is a package that houses the light source 11, MEMS 12, and light receiving unit 13. The cover 142 is fixed to the support substrate 141. This forms a housing space for housing the light source 11, MEMS 12, and light receiving unit 13. In this embodiment, the housing space is hermetically sealed by the support substrate 141 and the cover 142.

[0056] The support substrate 141 is a plate-shaped member on which the light source unit 11, MEMS 12, and light receiving unit 13 are mounted. The support substrate 141 is, for example, a stem. In this embodiment, as shown in Figure 4, the Peltier element 15 on which the light source unit 11 and the like are mounted is fixed to the support substrate 141. Specifically, the heat sink 152 of the Peltier element 15 is fixed to the support substrate 141, for example, by adhesive. By fixing the Peltier element 15 to the support substrate 141 in this way, the light source unit 11, MEMS 12, and light receiving unit 13 are mounted on the support substrate 141.

[0057] An example of the material for the support substrate 141 is an iron alloy. Nickel plating or gold plating may be applied to the support substrate 141. In this embodiment, the plan view shape (shape viewed from the Z-axis direction) of the support substrate 141 is rectangular. In this case, an example of the length of the long side is 10 mm or more and 30 mm or less, and an example of the length of the short side is 8 mm or more and 25 mm or less. In one embodiment, the length of the long side is 24 mm and the length of the short side is 19 mm. The plan view shape of the support substrate 141 may be a square, a polygon other than a quadrilateral, or a circle.

[0058] The support substrate 141 is provided with a plurality of conductive members 20. The conductive members 20 are, for example, rod-shaped members. An example of a conductive member 20 is a lead pin. The first end of each conductive member 20 protrudes into the housing 14. The second end of each conductive member 20 protrudes outside the housing 14. The second end is the end of the conductive member 20 opposite to the first end. The plurality of conductive members 20 function as terminals for connecting electronic components (for example, the light source unit 11, MEMS 12, light receiving unit 13, and Peltier element 15, etc.) inside the housing 14 to the outside. In Figures 4 and 5, the wiring between the light source unit 11, MEMS 12, light receiving unit 13, and Peltier element 15 and the plurality of conductive members 20 is not shown.

[0059] In this embodiment, as shown in Figures 4 and 5, a plurality of conductive members 20 are arranged around the Peltier element 15. The support substrate 141 is passed through a plurality of through holes 141a (see Figure 6) formed in the plurality of conductive members 20. An insulating member 21 (for example, a cured insulating resin) is provided between the conductive members 20 and the through holes 141a. In this way, each conductive member 20 is insulated from the support substrate 141.

[0060] As shown in Figures 3 and 6, the cover 142 has a hollow body portion 1421 and a top wall portion 1422. An example of the cover 142 is a cap. The body portion 1421 is fixed to the support base plate 141, for example by welding. The top wall portion 1422 closes the opening in the body portion 1421 that is located opposite the support base plate 141. The top wall portion 1422 is the wall portion facing the support base plate 141. Examples of materials for the body portion 1421 and the top wall portion 1422 include Kv and stainless steel (SUS). The body portion 1421 and the top wall portion 1422 are integrated. When the cover 142 is fixed to the support base plate 141, an example of the length between the surface of the top wall portion 1422 (the surface opposite the housing space) and the back surface of the support base plate 141 (the surface opposite the housing space) is 6 mm or more and 12 mm or less. In one embodiment, the distance between the surface of the top wall portion 1422 and the back surface of the support substrate 141 is 10 mm.

[0061] As shown in Figure 3, the storage section 14 has a first window section 22 and a second window section 23.

[0062] The first window section 22 is the part that outputs the detection light L1 to the outside of the housing section 14. The first window section 22 is provided in the top wall section 1422. The first window section 22 is positioned in the optical path of the detection light L1 reflected by the MEMS 12. The first window section 22 has a size that allows the detection light L1 scanned by the MEMS 12 at its maximum scanning range to pass through. The first window section 22 is, for example, a glass plate or a transparent resin plate. The first window section 22 is fitted into an opening 1422a formed in the top wall section 1422.

[0063] The second window portion 23 is the portion that allows the reflected light L2 to pass towards the light-receiving portion 13. The second window portion 23 is provided in the top wall portion 1422. The second window portion 23 is positioned on the optical axis of the light-receiving portion 13. In this embodiment, the second window portion 23 is a lens that focuses the reflected light L2 towards the light-receiving portion 13. The second window portion 23 is fitted into an opening 1422b formed in the top wall portion 1422.

[0064] As shown in Figure 2, the module body 10 is mounted on the circuit board 40. The circuit board 40 is, for example, a flexible printed circuit board. The circuit board 40 extends in one direction. The module body 10 is mounted on the end of the circuit board 40 in the direction of extension. The module body 10 is mounted on the surface 41 of the circuit board 40. Each conductive member 20 of the module body 10 penetrates the circuit board 40.

[0065] As shown in Figures 6 and 7, the ends (second ends) of each conductive member 20 that protrude from the back surface 42 of the circuit board 40 are joined to the circuit board 40 by solder 43. This fixes the module body 10 to the circuit board 40. The back surface 42 of the circuit board 40 is provided with wiring patterns (not shown) that are electrically connected to each conductive member 20. The light source unit 11, MEMS 12, light receiving unit 13, and Peltier element 15 within the housing unit 14 are externally connected using these wiring patterns and the multiple conductive members 20. A conductive bonding material may be used instead of solder 43.

[0066] The circuit board 40 has an opening 40a in a part of the area where the module body 10 is placed. As a result, the support substrate 141 is exposed, as shown in Figure 6. The shape of the opening 40a may be a rectangle, a polygon other than a rectangle, or a circle.

[0067] [Heat dissipation part] The heat dissipation section 30 is a component that dissipates heat generated in the module body 10. The heat dissipation section 30 functions as a heat sink. Figure 8 is a perspective view of an example of the heat dissipation section 30. The heat dissipation section 30 has a heat dissipation substrate 31 and a plurality of heat dissipation fins 32. Examples of materials for the heat dissipation substrate 31 and heat dissipation fins 32 include copper, aluminum (Al), and copper molybdenum (CuMo).

[0068] The heat dissipation substrate 31 has a first surface 31a and a second surface 31b. The second surface 31b is the surface opposite to the first surface 31a. The heat dissipation substrate 31 has a heat dissipation function and also functions as a support member for the multiple heat dissipation fins 32. The plan view shape of the heat dissipation substrate 31 is a rectangle (for example, a square or rectangular shape). If the plan view shape of the heat dissipation substrate 31 is a rectangle, an example of the length of the long side is 50 mm or more and 100 mm or less, and an example of the length of the short side is 50 mm or more and 100 mm or less. The plan view shape of the heat dissipation substrate 31 may be a polygon other than a rectangle, or it may be circular. An example of the thickness of the heat dissipation substrate 31 is 2 mm or more and 5 mm or less. In one embodiment, the thickness of the heat dissipation substrate 31 is 2 mm.

[0069] In this embodiment, unless otherwise specified, the plan view shape of the heat dissipation substrate 31 is square. The peripheral edge 311 of the heat dissipation substrate 31 is composed of edge portions 311a, 311b, 311c, and 311d. Edge portions 311a and 311c are opposite each other. Edge portions 311b and 311d are opposite each other.

[0070] When the heat dissipation substrate 31 is viewed from the Z-axis direction, the heat dissipation substrate 31 has a first region 312 and a second region 313. The heat dissipation substrate 31 has a third region 314 between the first region 312 and the second region 313.

[0071] The first region 312 is the region where the module body 10 is placed. The first region 312 functions as a base on which the module body 10 is placed. The first region 312 is located in the center of the heat dissipation substrate 31. As a result, the module body 10 is also located in the center of the heat dissipation substrate 31 (see Figure 2). The placement of the module body 10 in the center means that three of the four sides of the module body 10 are surrounded by the heat dissipation fins 32. This will be explained in detail based on the configuration illustrated in Figure 2. In this case, the placement of the module body 10 in the center means that, of the four sides of the module body 10, when viewed from the Z-axis direction, three sides other than the side on which the circuit board 40 extends from the module body 10 are surrounded by the heat dissipation fins 32. The first region 312 and the module body 10 may be located closer to the center than to the periphery 311. The planar shape of the first region 312 is, for example, a rectangle (for example, a square or rectangular shape). The plan view shape of the first region 312 may be a polygon other than a quadrilateral, or it may be circular. The thickness of the first region 312 may be the same as the thickness of the second region 313, or it may be thinner. In this embodiment, the thickness of the first region 312 is thinner than the thickness of the second region 313. When the first region 312 is viewed from above, one example of its size is that it may be less than or equal to the size of the area surrounded by the multiple conductive members 20. In this case, the conductive members 20 protruding from the back surface 42 of the circuit board 40 do not interfere with the first region 312. When the first region 312 is viewed from above, its size may be the same as the size of the Peltier element 15.

[0072] The second region 313 is the region where multiple heat dissipation fins 32 are arranged. The second region 313 surrounds at least a portion of the periphery of the first region 312. In this embodiment, the second region 313 surrounds the first region 312 in the directions (three directions) facing the edges 311a, 311c, and 311d.

[0073] The third region 314 is the region between the first region 312 and the second region 313. The third region 314 surrounds the first region 312. The third region 314 is a groove. The thickness of the third region 314 is thinner than the thickness of the first region 312 and the second region 313. Therefore, in this embodiment, the third region 314 is a groove with respect to both the first region 312 and the second region 313.

[0074] The length of the third region 314 in the X-axis direction is longer than the length of the region on the circuit board 40 on which the module body 10 is mounted in the X-axis direction. The third region 314 extends from the edge 311b to the edge 311d of the heat dissipation substrate 31. Figure 8 illustrates a configuration in which the third region 314 extends from the edge 311b of the heat dissipation substrate 31 to near the center of the heat dissipation substrate 31. With the above configuration, the module body 10 can be placed in the first region 312 while preventing interference between the circuit board 40 and the heat dissipation substrate 31.

[0075] Multiple heat dissipation fins 32 are provided in the second region 313. The multiple heat dissipation fins 32 are arranged with spacing between them. The heat dissipation fins 32 are protruding structures provided on the heat dissipation substrate 31 to increase the heat dissipation area. An example of a heat dissipation fin 32 is a rod-shaped member or columnar member as shown in Figure 8. The heat dissipation fin 32 may also be a plate-shaped member. The height T1 of the heat dissipation fin 32 is, for example, 5 mm or more and 15 mm or less. In one embodiment, the height T1 is 10 mm. The height T1 is the length of the heat dissipation fin 32 relative to the first surface 31a (length in the Z-axis direction).

[0076] The heat dissipation section 30 may be manufactured, for example, by molding technology using a mold. The heat dissipation section 30 may also be manufactured by processing a commercially available heat dissipation section (heat sink) that has a heat dissipation substrate and a plurality of heat dissipation fins. That is, the heat dissipation section 30 may be manufactured by, for example, machining the commercially available heat dissipation section to form the first region and the third region.

[0077] Next, an example of the connection structure between the module body 10 and the heat dissipation section 30 will be explained using Figure 6.

[0078] As shown in Figure 6, the module body 10 is mounted on the circuit board 40 and attached to the heat dissipation unit 30. Specifically, the circuit board 40 on which the module body 10 is mounted is positioned relative to the heat dissipation substrate 31 such that the opening 40a of the circuit board 40 is located on the first region 312.

[0079] In this embodiment, an insulating heat dissipation sheet (thermal conductive member) 51 is provided between the first region 312 and the circuit board 40. The heat dissipation sheet 51 is a sheet that has both thermal conductivity and insulating properties. The material of the heat dissipation sheet 51 is silicone, urethane rubber, etc. An example of the heat dissipation sheet 51 is a sheet using αGEL (registered trademark).

[0080] The circuit board 40 is held in place against the heat sink substrate 31 by a retaining plate 60. The retaining plate 60 can be made of materials such as stainless steel (SUS) or aluminum (Al). The retaining plate 60 has a through-hole 60a through which the module body 10 passes. The retaining plate 60 is fixed to the heat sink substrate 31 while holding the circuit board 40 in place. The fixing method is, for example, screw fastening.

[0081] As a result, the circuit board 40 is sandwiched between the retaining plate 60 and the heat dissipation sheet 51 (or the first region 312). Consequently, the circuit board 40 is fixed to the heat dissipation board 31. In other words, the module body 10 mounted on the circuit board 40 is attached to the heat dissipation board 31.

[0082] When the module body 10 is attached to the heat dissipation section 30 as described above, the thickness of the first region 312 and the thickness of the heat dissipation sheet 51 may be such that the module body 10 can be sandwiched between the retaining plate 60 and the heat dissipation sheet 51.

[0083] The support substrate 141 is exposed through the opening 40a of the circuit board 40. Therefore, the heat dissipation sheet 51 and the support substrate 141 (module body 10) are in thermal contact. As a result, heat from the support substrate 141 is easily transferred to the first region 312 through the heat dissipation sheet 51, and the heat from the module body 10 is efficiently dissipated. The heat dissipation sheet 51 may be elastic. In this case, the support substrate 141 exposed through the opening 40a and the heat dissipation sheet 51 will be in closer contact. Therefore, heat from the support substrate 141 is even more easily transferred to the first region 312 through the heat dissipation sheet 51.

[0084] The optical module 4 comprises a module body 10. The module body 10 has a light source unit 11 that outputs detection light L1 and a MEMS 12 that scans the detection light L1. Therefore, the module body 10 can output the detection light L1 scanned by the MEMS 12. The scanning range of the detection light L1 by the MEMS 12 corresponds to the detection target range 2 shown in Figure 1. The module body 10 has a light receiving unit 13. Therefore, the module body 10 can receive reflected light L2 from the object 3. Thus, the optical module 4 comprising the above module body 10 can be effectively applied to a remote sensor.

[0085] The optical module 4 includes a heat dissipation section 30 for dissipating heat generated in the module body 10. The heat dissipation section 30 has a heat dissipation substrate 31 and a plurality of heat dissipation fins 32. The plurality of heat dissipation fins 32 are provided on the first surface 31a of the heat dissipation substrate 31. The module body 10 is positioned on the first surface 31a side of the heat dissipation substrate 31. The module body 10 is attached to the heat dissipation substrate 31 such that a portion of its periphery is surrounded by the plurality of heat dissipation fins 32. In other words, in the optical module 4, the module body 10 is embedded between the plurality of heat dissipation fins 32. Therefore, the length of the optical module 4 along the Z-axis is shorter than when the module body 10 is attached to the second surface 31b. In this case, the total volume of the optical module 4 is smaller than when the module body 10 is attached to the second surface 31b. Thus, the optical module 4 can be miniaturized while still having a heat dissipation section 30 for dissipating heat from the module body 10.

[0086] In this embodiment, the optical module 4 is applied to the detection device 1 as shown in Figure 1. To make effective use of the installation area of ​​the detection device 1, there is a growing demand for smaller detection devices 1. In this case, the optical module 4 also needs to be miniaturized. On the other hand, there is also a growing demand for higher output of the detection light L1 from the viewpoint of improving detection accuracy. To increase the output of the detection light L1, one could increase the output of the light-emitting elements 111a and 111b of the light source unit 11, or increase the number of light-emitting elements of the light source unit 11.

[0087] When the output of the detection light L1 is increased by increasing the output of the light-emitting elements 111a and 111b or by increasing the number of light-emitting elements, the heat generated in the light source unit 11 also increases. As shown in Figure 2, the temperature of the light source unit 11 can be adjusted by adjusting the temperature of the light source unit 11 using the Peltier element 15. However, the inventors have found that when the ambient temperature of the light source unit 11 rises above a certain temperature (for example, 75°C), the temperature adjustment of the Peltier element 15 may not be sufficient to adjust the temperature of the light source unit 11.

[0088] Therefore, in order to increase the output of the detection light L1 and to operate the module body 10 stably over a wide temperature range, it is necessary to dissipate the heat from the module body 10, which is equipped with a light source unit 11, using the heat dissipation unit 30. The heat dissipation performance of the heat dissipation unit 30 depends on the number and size of the heat dissipation fins 32, so in order to ensure heat dissipation performance, the heat dissipation unit 30 must be of a certain size. If the module body 10 is attached to the second surface 31b, the module body 10 will protrude from the second surface 31b in the direction from the first surface 31a to the second surface 31b. Therefore, even if the module body 10 is miniaturized, the miniaturization of the optical module as a whole is limited. In contrast, in the optical module 4, the module body 10 is located on the first surface 31a side, not the second surface 31b, and is attached to the heat dissipation substrate 31 between a plurality of heat dissipation fins 32 provided on the first surface 31a. Therefore, the optical module 4 can be made smaller than when the module body 10 is attached to the second surface 31b. The optical module 4 is equipped with a heat dissipation section 30, which is effective when the module body 10 is used to form a higher-output detection light L1.

[0089] When the light-emitting elements 111a and 111b are semiconductor light-emitting elements (e.g., LDs), the state of the light emitted from the semiconductor light-emitting elements is affected by the ambient temperature. Therefore, the optical module 4 is even more effective when the light-emitting elements in the light source unit 11 are semiconductor light-emitting elements.

[0090] Multiple heat dissipation fins 32 are arranged around at least a portion of the module body 10. This improves the heat dissipation efficiency from the module body 10.

[0091] In a configuration where the module body 10 has a Peltier element 15, the light source unit 11 is mounted on the Peltier element 15. Therefore, since the temperature of the light source unit 11 can be adjusted by the Peltier element 15, the detection light L1 can be stably output from the light source unit 11. For example, the Peltier element 15 can control the temperature of the light-emitting elements 111a and 111b within a certain temperature range, so the wavelength of the laser light La output from the light-emitting element 111a and the wavelength of the laser light Lb output from the light-emitting element 111b are stabilized. When the optical components included in the light source unit 11 are made of resin, such as when lenses 113a and 113b are made of resin, the temperature adjustment by the Peltier element 15 suppresses deformation of the optical components due to heat. Therefore, the laser light La and laser light Lb are combined more appropriately. For example, the optical axes of the laser light La and laser light Lb can be aligned with higher precision. When the laser light La and laser light Lb are pulsed light, the pulse conditions can be relaxed by the temperature adjustment by the Peltier element 15.

[0092] In the configuration shown in Figure 4, the light-receiving unit 13 is also mounted on the Peltier element 15. Therefore, changes in the performance of the light-receiving unit 13 due to changes in the ambient temperature of the light-receiving unit 13 can be suppressed. Similarly, in the configuration shown in Figure 4, the MEMS 12 is also mounted on the Peltier element 15. Therefore, changes in the performance of the MEMS 12 due to changes in the ambient temperature of the MEMS 12 can also be suppressed.

[0093] As shown in Figure 2, in the configuration where the module body 10 is positioned in the center of the heat dissipation substrate 31, the module body 10 can be surrounded by more heat dissipation fins 32. Therefore, the heat dissipation efficiency from the module body 10 is improved.

[0094] In the configuration shown in Figure 3, the module body 10 has a housing section 14. The housing section 14 has a first window section 22 for outputting detection light L1. As shown in Figure 3, when the first window section 22 is located in the housing section 14 opposite to the heat dissipation substrate 31, the detection light L1 is output from the module body 10 in the opposite direction to the heat dissipation substrate 31. Therefore, even if the module body 10 is surrounded by multiple heat dissipation fins 32, it is easy to output detection light L1 from the optical module 4.

[0095] As shown in Figure 6, in one embodiment, the height T2 of the module body 10 relative to the first surface 31a may be less than or equal to the height T1 of the heat dissipation fins 32 relative to the first surface 31a, or it may be less than the height T1. In this case, the amount of heat dissipated relative to the total volume of the optical module 4 increases, further improving the heat dissipation efficiency. When the height T2 is less than or equal to the height T1 (or less than the height T1), it is possible to further miniaturize the optical module 4.

[0096] In a configuration where the heat dissipation substrate 31 has a first region 312, a second region 313, and a third region 134, the second region 313 surrounds at least a portion of the periphery of the first region 312. The module body 10 is placed in the first region 312, and a plurality of heat dissipation fins 32 are placed in the second region 313. Therefore, in a configuration where the heat dissipation substrate 31 has a first region 312, a second region 313, and a third region 134, a portion of the periphery of the module body 10 is reliably surrounded by the plurality of heat dissipation fins 32. The third region 314 is a groove. Therefore, for example, if a conductive member 20 protrudes toward the heat dissipation substrate 31 in the module body 10, it is possible to place the conductive member 20 in the third region 134 (groove). By placing the conductive member 20 in the third region 134 (groove), interference between the conductive member 20 and the heat dissipation substrate 31 can be prevented.

[0097] In the configuration where the thickness of the first region 312 is thinner than the thickness of the second region 313, the height T2 shown in Figure 6 can be shortened. Therefore, the optical module 4 can be further miniaturized. Since the height T2 can be shortened, it is easier to achieve the condition that the height T2 is less than or equal to the height T1 (or less than the height T1). In this case, as mentioned above, the heat dissipation efficiency can be further improved. Therefore, in the configuration where the thickness of the first region 312 is thinner than the thickness of the second region 313, the heat generated in the module body 10 is easily dissipated efficiently.

[0098] As shown in Figure 6, in the configuration in which a heat dissipation sheet 51 is sandwiched between the first region 312 and the module body 10, the heat generated in the module body 10 is efficiently transferred to the heat dissipation substrate 31 by the heat dissipation sheet 51. As a result, the heat dissipation efficiency can be further improved. Since the heat dissipation sheet 51 has insulating properties, insulation can be ensured between the module body 10 and the first region 312 (heat dissipation substrate 31). In the configuration with the heat dissipation sheet 51, the combined thickness of the first region 312 and the heat dissipation sheet 51 may be thinner than the thickness of the second region 313.

[0099] (Variation 1) Figure 9 is a diagram showing the cross-sectional configuration of an optical module according to Modification 1. As shown in the optical module 4A in Figure 9, an insulating resin cured product (heat conductive member) 52 may be used instead of the heat dissipation sheet 51. The material examples for the insulating resin cured product (heat conductive member) 52 are the same as the material examples for the heat dissipation sheet 51. The insulating resin cured product 52 is the portion that has been cured after a paste-like or gel-like insulating resin has been supplied to the third region 314 so as to fill at least the first region 312. In the optical module 4A, the circuit board 40 on which the module body 10 is mounted is placed on the insulating resin before the paste-like or gel-like insulating resin is cured. As a result, the insulating resin cured product 52 is sandwiched between the module body 10 and the first region 312.

[0100] Since the insulating resin is fluid before curing, it fills the opening 40a of the circuit board 40. As a result, the adhesion between the support substrate 141 of the module body 10 and the cured insulating resin 52 is improved. Therefore, the heat generated in the module body 10 can be efficiently transferred to the first region 312 through the cured insulating resin 52. Consequently, the heat dissipation of the heat generated in the module body 10 is improved.

[0101] After placing the circuit board 40 on the paste-like or gel-like insulating resin supplied to the third region 314, the insulating resin is cured to form an insulating resin cured product (heat conductive member) 52. In this case, the back surface 42 of the circuit board 40 is also covered by the insulating resin cured product 52. Therefore, the wiring pattern and solder 43 (see Figures 7 and 8) formed on the back surface 42 are also covered by the insulating resin cured product 52, thus reliably preventing short circuits between the wiring pattern and solder 43 and the heat dissipation substrate 31. Because the circuit board 40 and the insulating resin cured product 52 are in contact over a wider area, the heat generated in the module body 10 is also transferred to the heat dissipation substrate 31 through the circuit board 40 and the insulating resin cured product 52. As a result, the heat dissipation performance of the heat generated in the module body 10 is improved.

[0102] As shown in Figure 9, in the configuration in which the circuit board 40 is embedded in the insulating resin curing material 52, the circuit board 40 is also fixed to the heat dissipation substrate 31 by the insulating resin curing material 52.

[0103] When using the insulating resin cured product 52, the first region 312 does not need to be provided.

[0104] (Modification 2) Figure 10 is a perspective view of the module body 10B according to the modified example 2. Figure 11 is a perspective view of the module body 10B shown in Figure 10 with the cover 142A removed. The module body 10B differs from the module body 10 in that it takes in the returning light L2 into the module body 10B through the first window portion 22. The module body 10B will be explained focusing on the above differences.

[0105] The module body 10B has a housing section 14A instead of the housing section 14. The configuration of the housing section 14A is the same as that of the housing section 14, except that the cover 142A does not have a second window section 23.

[0106] As mentioned above, in the module body 10B, the first window section 22 that outputs the detection light L1 functions as a window section for taking in the reflected light L2 into the module body 10B. In other words, the module body 10B detects the reflected light L2 that has returned to the module body 10B in substantially the same direction as the optical path of the detection light L1.

[0107] In order to detect the reflected light L2 that returns substantially coaxially with the optical path of the detected light L1, the module body 10B has an optical path separation unit 24 between the mirror 114b and the MEMS 12 (specifically the MEMS mirror 121), as shown in Figure 11. The optical path separation unit 24 directs the detected light L1 output from the mirror 114b toward the MEMS mirror 121 and reflects the reflected light L2 from the MEMS mirror 121 so as to separate it from the optical path of the detected light L1. In the module body 10B, the light receiving unit 13 is positioned in the optical path of the reflected light L2 reflected by the optical path separation unit 24. The module body 10B has a light concentrating unit 25 between the optical path separation unit 24 and the light receiving unit 13.

[0108] The module body 10B will be further described based on the configuration shown in Figure 11. For the sake of explanation, Figure 11 schematically shows an example of the reflected light L2 incident on the light receiving unit 13.

[0109] The optical path separation unit 24 is a mirror having an aperture 24a through which the detection light L1 passes. The optical path separation unit 24 is positioned obliquely to the optical path of the detection light L1. The reflective surface of the optical path separation unit 24 faces the MEMS mirror 121. The aperture 24a is formed in the optical path separation unit 24 so as to allow the region of the detection light L1 that is incident on the aperture 24a (near the center when viewed from the direction of propagation of the detection light L1) to pass through. Therefore, the aperture 24a has the function of shaping the detection light L1. Thus, the optical path separation unit 24 functions as an aperture that shapes the detection light L1. In the optical path separation unit 24, the area around the aperture 24a on the surface facing the MEMS mirror 121 is a reflective surface. Therefore, the reflected light L2 that has returned to the module body 10B through the first window 22, which is reflected by the MEMS mirror 121 toward the optical path separation section 24 and reaches the periphery of the aperture 24a, is reflected toward the light receiving section 13.

[0110] The light-receiving unit 13 is positioned on the optical path of the reflected light L2, which is reflected by the optical path separation unit 24, in order to receive the reflected light L2. The light-receiving unit 13 is fixed to the support 26, for example, by a conductive adhesive. The support 26 is fixed to the heat-absorbing plate 151, for example, by an adhesive.

[0111] The light-gathering unit 25 is positioned between the optical path separation unit 24 and the light-receiving unit 13. The light-gathering unit 25 focuses the reflected light L2 from the optical path separation unit 24 onto the light-receiving unit 13. An example of the light-gathering unit 25 is a condensing lens. The condensing lens may be a resin lens. The light-gathering unit 25 is fixed to the heat-absorbing plate 151, for example, by adhesive.

[0112] The optical path separation unit 24 is not limited to a mirror having an aperture 24a, as shown in Figure 11, as long as it can separate the optical path of the reflected light L2 from the optical path of the detected light L1 by passing the detected light L1 through and reflecting the reflected light L2. The optical path separation unit 24 may be a half mirror without an aperture, or a polarizing beam splitter without an aperture.

[0113] (Variation 3) Figure 12 is a plan view of the optical module 4B according to the third modification. As shown in Figure 12, the optical module 4B differs from the optical module 4 in that the module body 10 is positioned at the corner 315 when the heat dissipation substrate 31 is viewed from the Z-axis direction. The retaining plate 60 is not shown in Figure 12. Figure 12 illustrates a configuration in which the module body 10 is positioned at the corner 315 of the heat dissipation substrate 31. Specifically, the module body 10 is positioned at the corner 315, which is formed by edge 311a and edge 311b. Since the module body 10 and the circuit board 40 have predetermined sizes, positioning the module body 10 at the corner means that the module body 10 is positioned in a certain area including the connecting portion of the two edges. In terms of the positional relationship with respect to the heat dissipation fins 32, positioning the module body 10 at the corner means that of the four sides surrounding the module body 10, two sides other than two adjacent sides (or two intersecting sides) are surrounded by the heat dissipation fins. The following will be a specific explanation based on the configuration illustrated in Figure 12. In this case, the placement of the module body 10 at the corner 315 means that, of the four sides surrounding the module body 10, when viewed from the Z-axis direction, two sides other than the side on which the circuit board 40 extends from the module body 10 (corresponding to edge 311b) and the adjacent side (corresponding to edge 311a) are surrounded by the heat dissipation fins 32. In Figure 12, for the sake of illustration, the connection between edge 311a and edge 311b is shown as the corner 315. The heat dissipation substrate 31 in the optical module 4B may have a first region 312 at the corner 315, and a third region 314 around the first region 312. The module body 10 may be placed closer to the corner 315 than to the center when the heat dissipation substrate 31 is viewed from the Z-axis direction.

[0114] In the configuration where the module body 10 is positioned at the corner 315, no heat dissipation fins 32 are positioned in front of the module body 10 in the direction toward the edges 311a and 311b that constitute the corner 315, as viewed from the module body 10. In other words, in the direction toward the edges 311a and 311b that constitute the corner 315, as viewed from the module body 10, the module body 10 is open to the outside of the optical module 4B. Therefore, heat generated by the module body 10 is less likely to accumulate near the module body 10, and heat dissipation can be utilized using the surrounding gas (usually air), for example. As a result, the heat generated by the module body 10 can be efficiently dissipated in the optical module 4B as well. In the optical module 4B, the module body 10 is also positioned near the first surface 31a. Therefore, as with the optical module 4, miniaturization of the optical module 4B is achieved.

[0115] In the embodiment illustrated in Figure 12, the first window portion 22 is formed in the top wall portion 1422, similar to the case of the module body 10 shown in Figure 3. In this case, the detection light L1 is output in the opposite direction to the heat dissipation substrate 31. However, in the optical module 4B, the detection light L1 may be output to the side of the module body 10 (for example, in the direction toward the edge portion 311a). Specifically, the first window portion 22 may be formed in the side wall portion constituting the body portion 1421. In this case, the second window portion 23 should also be formed in the side wall portion of the body portion 1421 where the first window portion 22 is formed. The arrangement of the light source portion 11, MEMS 12, and light receiving portion 13 inside the module body 10 should be such that the detection light L1 can be output from the first window portion 22 and the reflected light L2 taken into the module body 10 from the second window portion 23 can be received by the light receiving portion 13.

[0116] (Modification 4) Figure 13 is a plan view of the optical module 4C according to modified example 4. The optical module 4C differs from the optical module 4 mainly in that the light-receiving unit 13A is attached to the heat-dissipating substrate 31A. The optical module 4C will be explained focusing on the differences. The optical module 4C has a module body 10C, a heat-dissipating unit 30A, and a light-receiving unit 13A.

[0117] The module body 10C differs from the module body 10 in that it has a housing section 14A instead of the housing section 14, and does not have a light-receiving section within the housing section 14A. The housing section 14A is the same as the housing section 14A described in Modification 2. That is, the housing section 14A does not have a second window section for reflected light L2 in the top wall section 1422. The internal configuration of the housing section 14A is the same as that of the module body 10, except that it does not have a light-receiving section and a second element mounting section on which the light-receiving section is mounted.

[0118] The heat dissipation section 30A has a heat dissipation substrate 31A and a plurality of heat dissipation fins 32. The heat dissipation substrate 31A differs from the heat dissipation substrate 31 in that it has a fourth region 316 at the corner 315 and a fifth region 317 between the fourth region 316 and the second region 313. The fourth region 316 is the region where the light receiving section 13A is placed. The fourth region 316 functions as a base for the light receiving section 13A, similar to the first region 312. The fifth region 317 is the region corresponding to the third region 314 with respect to the first region 312. The thickness of the fifth region 317 is thinner than the thickness of the second region 313 and the fourth region 316, similar to the case of the third region 314.

[0119] The light-receiving unit 13A has a light-receiving element 131 and a housing section 132. The light-receiving element 131 is housed in the housing section 132. The light-receiving element 131 is, for example, a photodiode (PD). The light-receiving element 131 may be a PD chip. The top wall of the housing section 132 has a window section 133 formed therein for allowing reflected light L2 to pass towards the light-receiving element 131. The window section 133 may also be a focusing lens for focusing reflected light L2. The light-receiving unit 13A is attached to the heat sink board 31A in the same manner as the module body 10, while being fixed to the circuit board 40A. The method of attaching the circuit board 40A to the heat sink board 31A may be the same as the method of attaching the circuit board 40 to the heat sink board 31. In Figure 13, the retaining plate for holding down the light-receiving unit 13A is not shown.

[0120] Since the optical module 4C also has a light-receiving unit 13A, it can be applied to a remote sensor in the same way as the optical module 4. In the optical module 4C, the heat generated in the light-receiving unit 13A can be dissipated by the heat dissipation unit 30A along with the heat generated in the module body 10C.

[0121] Although various embodiments and modifications relating to this disclosure have been described above, this disclosure is not limited to the embodiments and modifications illustrated.

[0122] The number of light-emitting elements in the light source section of the module body is not limited to two. The number of light-emitting elements may be one or three or more. The laser light emitted by the light-emitting elements is not limited to near-infrared light. The wavelength of the laser light emitted by the light-emitting elements may be a wavelength appropriate to the application of the optical module. The light-emitting elements and photodetectors (photodetectors) are not limited to semiconductor light-emitting elements.

[0123] If the light source unit has multiple light-emitting elements, the wavelengths of light emitted by at least two of the multiple light-emitting elements may be different. If the wavelengths of light emitted by two light-emitting elements are different, the difference between the wavelengths of the two lights is, for example, 30 nm or more.

[0124] If the light source unit has multiple light-emitting elements and a multiplexing unit, and the wavelengths of the light output from the multiple light-emitting elements are different, the multiplexing unit may use a wavelength-selective filter to combine the light output from the multiple light-emitting elements. For example, in the configuration shown in Figure 4, if the wavelengths of the laser light La and the laser light Lb are different, a wavelength-selective filter can be used instead of the mirror 114b. In this case, since the difference in polarization state is not utilized, the waveplate 112 is unnecessary.

[0125] The optical module may be applied, for example, to a drawing device. In this case, the optical module (specifically, the module itself) should output light scanned in two dimensions to draw the image (or video) to be displayed. When the optical module is applied to a drawing device as described above, there is no reflected light, so the optical module does not have a light-receiving part for receiving reflected light.

[0126] The scanning unit is not limited to MEMS, as long as it is configured to scan the light output from the light source unit. The example of a temperature controller is not limited to a Peltier element, as long as it can adjust the temperature of the elements (light-emitting elements, lenses, etc.) within the housing.

[0127] This disclosure is applicable to configurations in which heat generated in the module body is dissipated by a heat dissipation unit. In other words, the optical module can be applied to devices other than the exemplified remote sensor and drawing device. The configuration within the module body will be adapted to the application of the optical module. Therefore, the module body does not need to have at least one of the light receiving unit, scanning unit, temperature controller, and housing unit.

[0128] The various embodiments and modifications described above may be combined as appropriate without departing from the spirit of this disclosure. [Explanation of symbols]

[0129] 1...Detection device 2…Detection range 3…Object 4, 4A, 4B, 4C… Optical Modules 10, 10B, 10C… Module body 11...Light source section 111a...light-emitting element 111b...light-emitting element 112...wave plate 113a... Lens 113b... Lens 114... Gōhabu 114a...Mirror 114b...Mirror 12…MEMS (scanning unit) 121…MEMS mirror 122... Drive unit 13,13A…Light receiving part 131... Light-receiving element 132... Containment Unit 133... Window section 14,14A…Storage section 141...Support substrate 141a...Through hole 142, 142A… Cover 1421... Torso 1422... Top wall section 1422a…Aperture 15…Peltier element (temperature regulator) 151… Heat absorption plate 152...Heat sink 153… Semiconductor Pillar 16…First pedestal 161... Circuit board 162...First element mounting section 163...Second element mounting section 17a...Second pedestal 17b... Second pedestal 18...Support 18a...side 19…Thermistor 20... Conductive material 22…First Window Section 23…Second Window Section 24...Optical path separation section 24a…Aperture 25... Light-gathering section 26...Support 30,30A…heat dissipation part 31,31A… Heat dissipation board 31a…First page 31b…Second side 311... Periphery 311a...Edge 311b…Edge 311c…Edge 311d…Edge 312...First area 313…Second area 314...Third area 315... Corner 316...Fourth area 317...5th area 32… Heat dissipation fins 40, 40A… Circuit board 40a…Aperture 41…Surface 42...Back side 43... Handa 51…Heat dissipation sheet (heat conductive material) 52…Insulating resin cured material (heat conductive material) 60…Pressing plate 60a…Through hole L1...Detection light L2...Reflective light La... Laser light Lb... Laser light T1...height T2... Height

Claims

1. The module body includes a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The height of the module body relative to the first surface is less than or equal to the height of the plurality of heat dissipation fins. Optical module.

2. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The heat dissipation substrate has a first region, a second region surrounding at least a part of the periphery of the first region, and a third region provided between the first region and the second region. The first region is the region in which the module body is arranged. The second region is the region where the plurality of heat dissipation fins are arranged. The third region described above is a groove. Optical module.

3. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The module body is positioned at the corner of the heat dissipation substrate. Optical module.

4. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The light source unit outputs detection light to detect objects within the detection range set outside the module body. The module body has a light receiving unit that receives the detection light returned from the object. Optical module.

5. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The heat dissipation substrate further includes a light-receiving unit, The light source unit outputs detection light to detect objects within the detection range set outside the module body. The light-receiving unit is attached to the heat dissipation substrate such that at least a portion of the area surrounding the light-receiving unit is surrounded by the plurality of heat dissipation fins. The light receiving unit receives the detection light that has returned from the object. Optical module.

6. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The module body has a temperature controller for adjusting the temperature of the light source section. Optical module.

7. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The module body has a scanning unit that scans the light output from the light source unit. Optical module.

8. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The module body is further mounted on a circuit board, The module body is mounted on the circuit board and attached to the heat dissipation board. Optical module.

9. A module body including a light source unit that outputs light, A heat dissipation section for dissipating heat from the module body, Equipped with, The heat dissipation section is A heat dissipation substrate having a first surface and a second surface opposite to the first surface, to which the module body is attached, Multiple heat dissipation fins are provided on the first surface and protrude in the direction opposite to the second surface, It has, The module body is positioned on the first surface side of the heat dissipation substrate, The module body is attached to the heat dissipation substrate such that at least a portion of the module body is surrounded by the plurality of heat dissipation fins. The aforementioned light source unit is Multiple light-emitting elements, A wave combining unit that combines light from the plurality of light-emitting elements, Having, Optical module.

10. The module body is positioned in the center relative to the periphery of the heat dissipation substrate. The optical module according to any one of claims 1, 2, and 4 to 9.

11. The module body has a housing section for housing the light source section, The housing section has a window that allows light from the light source to pass to the outside of the housing section. The aforementioned window portion is provided in the wall portion of the housing portion that is located opposite to the heat dissipation substrate. The optical module according to any one of claims 1 to 9.

12. The thickness of the first region is thinner than the thickness of the second region. The optical module according to claim 2.

13. A heat conductive member having insulating properties is sandwiched between the module body and the first region. The heat conductive member is in thermal contact with the module body and the first region. The optical module according to claim 2 or 12.

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