Electronic component manufacturing apparatus and electronic component manufacturing method

Abstract

To provide a manufacturing apparatus of an electronic component, in which a segment of a ceramic green sheet and an internal electrode paste are hardly remained onto a front surface of a lamination head.SOLUTION: A manufacturing apparatus (100) of an electronic component, comprises: a lamination head (40) that transports a ceramic green sheet (21); and a lamination stage (150) to which the ceramic green sheet (21) to be transported is laminated. In the manufacturing apparatus (100), the lamination head (40) comprises a suction surface (40a) for transporting the ceramic green sheet (21) so as to be sucked, and the suction surface (40a) is positioned at a position that is opposite to the lamination stage (150). In the suction surface (40a), a plurality of suction holes (41) is provided. A coating layer (50) is arranged to at least one part of the suction surface (40a).SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a manufacturing apparatus for electronic components and a method for manufacturing electronic components.

Background Art

[0002] As a method for manufacturing electronic components such as multilayer ceramic capacitors, a method of mass-producing a large number of small electronic components at once by laminating ceramic green sheets obtained by forming a ceramic material before firing into a sheet shape, performing pressure molding, and then firing and singulating is known.

[0003] As a manufacturing apparatus used for manufacturing such electronic components, for example, Patent Document 1 discloses a manufacturing apparatus for laminated electronic components including a table for adsorbing and holding a carrier film formed on the upper surface with a ceramic green sheet, a blade for cutting the ceramic green sheet on the carrier film into a predetermined size, and an adsorption head for adsorbing and holding the ceramic green sheet cut into a predetermined size and peeling it from the carrier film.

[0004] Among the adsorption heads, suction holes are provided on the surface that contacts the ceramic green sheet. By sucking air from the suction holes, the ceramic green sheet can be adsorbed and peeled from the carrier film.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Internal electrodes may be printed on the ceramic green sheet. When adsorbing such ceramic green sheets, if the side with the printed internal electrodes is adsorbed, the internal electrode paste adheres to the surface of the adsorption head (also called the lamination head), causing poor suction. This can lead to failure to peel the ceramic green sheet, resulting in wrinkles or lamination defects in the ceramic green sheet. Furthermore, fragments of the ceramic green sheet generated during the cutting process could adhere to the surface of the lamination head, sometimes causing suction problems or lamination failures.

[0007] The present invention was made to solve the above problems and aims to provide an electronic component manufacturing apparatus that is less likely to leave fragments of ceramic green sheets or internal electrode paste on the surface of the laminated head. [Means for solving the problem]

[0008] The present invention relates to an electronic component manufacturing apparatus comprising a lamination head for transporting ceramic green sheets and a lamination stage on which the transported ceramic green sheets are stacked, wherein the lamination head is provided with an adsorption surface for adsorbing and transporting ceramic green sheets, the adsorption surface is located opposite the lamination stage, the adsorption surface is provided with a plurality of suction holes, and a coating layer is arranged on at least a part of the adsorption surface. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an electronic component manufacturing apparatus that is less likely to leave fragments of ceramic green sheets or internal electrode paste on the surface of the lamination head. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic diagram illustrating an example of a manufacturing apparatus for electronic components according to the present invention. [Figure 2] Figure 2 is a top view showing an enlarged view of the cutting area and stacking area in the electronic component manufacturing apparatus shown in Figure 1. [Figure 3] Figure 3 is a schematic cross-sectional view showing an example of a stacking head. [Figure 4] Figure 4 is a schematic cross-sectional view showing the process of stacking ceramic green sheets on a stacking stage using a stacking head. [Figure 5] Figure 5 is an exploded perspective view schematically showing the structure of another example of a stacked head. [Figure 6] Figure 6 is a cross-sectional view of the stacking head shown in Figure 5. [Modes for carrying out the invention]

[0011] The manufacturing apparatus for electronic components of the present invention will be described below. However, the present invention is not limited to the following configuration, and can be modified and applied as appropriate without changing the essence of the invention. Furthermore, a combination of two or more of the individual desirable configurations of the present invention described below also constitutes the present invention.

[0012] In this specification, terms indicating relationships between elements (e.g., "opposite," "orthogonal," etc.) and terms indicating the shape of elements (e.g., "cuboid," etc.) do not represent only strict meanings, but also include a substantially equal range, such as differences of a few percent.

[0013] The drawings shown below are schematic representations, and their dimensions, aspect ratios, and other scales may differ from those of the actual product.

[0014] [Manufacturing equipment for electronic components] The present invention relates to an electronic component manufacturing apparatus comprising a lamination head for transporting ceramic green sheets and a lamination stage on which the transported ceramic green sheets are stacked, wherein the lamination head is provided with an adsorption surface for adsorbing and transporting ceramic green sheets, the adsorption surface is located opposite the lamination stage, the adsorption surface is provided with a plurality of suction holes, and a coating layer is arranged on at least a part of the adsorption surface.

[0015] FIG. 1 is a diagram schematically showing an example of an apparatus for manufacturing an electronic component according to the present invention. In the manufacturing apparatus 100 for electronic components shown in FIG. 1, a raw material sheet 30 is unwound from an unwinding mechanism 110 and wound by a winding mechanism 120 to be conveyed. In FIG. 1, the arrow from the unwinding mechanism 110 toward the winding mechanism 120 represents the direction in which the raw material sheet 30 is conveyed.

[0016] The raw material sheet 30 passes through a cutting area C and a lamination area L while being conveyed from the unwinding mechanism 110 to the winding mechanism 120. There may be a tension control mechanism such as a suction roll in the middle.

[0017] FIG. 2 is a top view showing an enlarged view of the cutting area and the lamination area in the manufacturing apparatus for electronic components shown in FIG. 1. The raw material sheet 30 is composed of a ceramic green sheet 20 laminated on a resin film 10 serving as a support, and is conveyed so as to pass through the cutting area C and the lamination area L. A cutting stage 130 is disposed in the cutting area C, and a peeling stage 140 and a lamination stage 150 are disposed in the lamination area L. Therefore, the raw material sheet 30 is conveyed so as to pass over the cutting stage 130 and over the peeling stage 140.

[0018] When passing over the cutting stage 130 and over the peeling stage 140, the resin film 10 constituting the raw material sheet 30 is arranged to contact the cutting stage 130 and the peeling stage 140, and the ceramic green sheet 20 is arranged not to contact the cutting stage 130 and the peeling stage 140. Therefore, it can be said that the ceramic green sheet 20 is exposed on the upper surface of the raw material sheet 30.

[0019] A cutting stage 130 is provided in the cutting area C. On the cutting stage 130, the ceramic green sheet 20 is cut into a predetermined shape (a rectangular shape indicated by a dashed-dotted line).

[0020] The method for cutting the ceramic green sheet 20 is not particularly limited, but one example is to press a cutting blade against the surface of the ceramic green sheet 20. Alternatively, the ceramic green sheet 20 may be cut by rotating a roll-shaped blade. Alternatively, the ceramic green sheet may be cut using a laser or similar tool instead of a blade. Furthermore, when cutting the ceramic green sheet 20, it is preferable not to completely cut the resin film 10 that serves as the support.

[0021] Furthermore, the cutting of the ceramic green sheet 20 in cutting area C may be performed with the transport of the raw material sheet 30 stopped, or with the raw material sheet 30 being transported.

[0022] The ceramic green sheet 21, cut into a predetermined shape in the cutting area C, is transported together with the support resin film 10 as a raw material sheet 30 to the lamination area L, which will be described later, by the action of the unwinding mechanism 110 and the winding mechanism 120. At the same time, a new raw material sheet 30 is supplied to the cutting area C from the unwinding mechanism 110 side. The ceramic green sheet 20 that makes up the new raw material sheet 30 is the ceramic green sheet that has not yet been cut.

[0023] The lamination area L is a region having a peeling stage 140 and a lamination stage 150. In the peeling stage 140, the ceramic green sheet 21 cut in the cutting area C is peeled from the resin film 10 by a lamination head (not shown).

[0024] At this time, the resin film 10 constituting the raw material sheet 30 may be adsorbed onto the surface of the peeling stage 140 facing the raw material sheet 30. By adsorbing the resin film 10 onto the peeling stage 140, it becomes easier to prevent peeling defects in which the support resin film 10 lifts up at the same time as the cut ceramic green sheet 21 is peeled from the raw material sheet 30.

[0025] Furthermore, the separation of the cut ceramic green sheet 21 from the raw material sheet 30 may be performed with the transport of the raw material sheet 30 stopped, or with the raw material sheet 30 still being transported.

[0026] The cut ceramic green sheets 21, peeled off from the resin film 10 by the lamination head, are transported onto the lamination stage 150 and then laminated.

[0027] The lamination stage 150 may be equipped with a heating mechanism. In this case, the heating temperature is preferably 50°C or higher and 80°C or lower. It is sufficient that the temperature is above the softening point of the binder contained in the ceramic green sheet 21, and heating the cut ceramic green sheet 21 to the above temperature range makes it easier to laminate the cut ceramic green sheet 21.

[0028] When stacking the cut ceramic green sheets 21 on the stacking stage 150, pressure is applied to the cut ceramic green sheets 21 by the stacking head. By applying pressure to the cut ceramic green sheets 21 during stacking, misalignment of the cut ceramic green sheets 21 can be prevented.

[0029] The cut ceramic green sheets 21 may be laminated directly onto the lamination stage 150, or they may be laminated on a plate-shaped jig or the like placed on the lamination stage 150.

[0030] After the cut ceramic green sheet 21 is transported from the peeling stage 140 to the lamination stage 150, a portion of the resin film 10 is formed on the peeling stage 140 as a trace of the peeled ceramic green sheet. In this state, the unwinding mechanism 110 and the winding mechanism 120 work to transport the raw material sheet 30, so that the exposed portion of the resin film 10 is transported towards the winding mechanism 120, and a new raw material sheet 30 consisting of a ceramic green sheet 21 cut into a predetermined shape in the cutting area C and a resin film 10 supporting it is transported onto the peeling stage 140.

[0031] The cutting of the ceramic green sheet 20 in the cutting area C and the peeling, transporting, and lamination of the cut ceramic green sheet 21 in the lamination area L may be performed simultaneously. Then, when both the cutting of the ceramic green sheet 20 in the cutting area C and the lamination of the cut ceramic green sheet 21 in the lamination area L are completed, the unwinding mechanism 110 and the winding mechanism 120 transport the raw material sheet 30, supplying the ceramic green sheet 21 cut in the cutting area C onto the peeling stage 140, and supplying a new, uncut ceramic green sheet 20 onto the cutting stage.

[0032] By repeating the above operation, the cut ceramic green sheets 21 are stacked on the stacking stage 150.

[0033] [Stacked head] Next, I will explain the stacked head. Figure 3 is a schematic cross-sectional view showing an example of a stacking head. As shown in Figure 3, the lamination head 40 has a substantially plate-like shape with a first main surface 40a and a second main surface 40b facing each other in the thickness direction. Multiple suction holes 41 are formed on the surface of the first main surface 40a. All of the multiple suction holes 41 are connected to the decompression chamber 42. By reducing the pressure in the depressurization chamber 42, air is drawn in through the suction hole 41, allowing the ceramic green sheet to be adsorbed. Therefore, the first main surface 40a is also called the adsorption surface. The depressurization chamber 42 is also called the suction mechanism. The vacuum chamber 42, which is a suction mechanism, is located on the second main surface 40b side of the stacked head 40.

[0034] The depressurization chamber 42 is connected to a vacuum pump (not shown) installed outside the stacking head 40, for example, and by sucking air from the depressurization chamber 42 with the vacuum pump, air is drawn in through each suction hole 41.

[0035] A single stacked head may have multiple decompression chambers. In this case, it is possible to switch whether or not to draw in air for each group of suction holes connected to each decompression chamber.

[0036] Figure 4 is a schematic cross-sectional view showing the process of stacking ceramic green sheets on a stacking stage using a stacking head. Figure 4 shows a state where one ceramic green sheet 21 has already been laminated on the lamination stage 150, and another ceramic green sheet 21 is being laminated on the surface of the first ceramic green sheet 21. However, the other ceramic green sheet 21 is an internal electrode sheet 25 with an internal electrode pattern 23 printed on its surface.

[0037] As shown in Figure 4, an internal electrode sheet 25, on which an internal electrode pattern 23 is printed on the surface of a cut ceramic green sheet 21, is adsorbed onto the first main surface 40a of the lamination head 40. From the position shown in Figure 4, the lamination head 40 is moved further downward, and the ceramic green sheets 21 constituting the internal electrode sheet 25 are laminated on top of the ceramic green sheets 21 laminated on the lamination stage 150. After that, the adsorption of the internal electrode sheet 25 by the lamination head 40 is released, and the lamination head 40 is moved upward. When the lamination head 40 moves upward, the internal electrode sheet 25 is no longer adsorbed to the lamination head 40 and remains laminated on the lamination stage 150. Through the above process, the ceramic green sheet 21 or the internal electrode sheet 25 can be laminated onto the lamination stage 150 using the lamination head 40. At this time, if necessary, the lamination head 40 may be pressed against the lamination stage 150 to press the internal electrode sheet 25 against the ceramic green sheet 21. The first main surface 40a of the lamination head 40 is the surface facing the lamination stage 150. Therefore, the first main surface 40a of the lamination head 40 is the suction surface.

[0038] As shown in Figure 4, the cut ceramic green sheet 21 may have an internal electrode pattern 23 printed on it as needed. In this case, the lamination head 40 may directly adsorb the surface of the cut ceramic green sheet 21 (i.e., the portion where the internal electrode pattern 23 is not formed) or it may adsorb the surface of the internal electrode pattern 23.

[0039] Multiple suction holes 41 are formed in the first main surface 40a, which is the adsorption surface. A coating layer 50 is provided on at least a portion of the first main surface 40a, which is the adsorption surface. The coating layer 50 may be provided on only a portion of the first main surface 40a, or on the entire surface.

[0040] When a coating layer 50 is placed on at least a portion of the first main surface 40a, which is the adsorption surface, it becomes less likely for pieces of the ceramic green sheet or internal electrode paste to remain on the adsorption surface of the lamination head. Therefore, poor adsorption and lamination defects can be suppressed.

[0041] It is preferable that a coating layer 50 is further disposed on at least a portion of the surface of the wall surface 41a that constitutes the suction hole 41. If a coating layer 50 is placed on at least a portion of the surface of the wall surface 41a that constitutes the suction hole 41, it is possible to prevent the ceramic green sheet or internal electrode paste from remaining near the suction hole 41, thereby further suppressing poor adsorption and lamination defects. Furthermore, even if ceramic green sheets or internal electrode paste remain near the suction holes, they can be easily removed by blowing air through the suction holes.

[0042] The shape of the suction hole 41 is preferably a tapered shape in which the hole diameter gradually decreases from the first main surface 40a to the second main surface 40b. Preferably, the thickness of the coating layer 50 formed on the surface of the wall surface 41a constituting the suction hole 41 is thicker closer to the first main surface 40a and thinner closer to the second main surface 40b. If the shape of the suction hole is the tapered shape described above, and the thickness of the coating layer is thicker closer to the first main surface and thinner closer to the second main surface, then it is possible to suppress the blockage of the suction hole due to the formation of the coating layer.

[0043] Furthermore, the wall surface 41a constituting the suction hole 41 shall include all surfaces that are not parallel to the first main surface 40a among the surfaces exposed to the first main surface 40a.

[0044] The thickness of the coating layer on the adsorption surface is not particularly limited, but is preferably 1 μm or less, more preferably 0.1 μm or more and 1 μm or less, and even more preferably 0.1 μm or more and 0.5 μm or less.

[0045] The coating layer is preferably formed over an area of ​​95% to 100% of the first main surface. However, the area of ​​the wall surface of the suction hole is not included in the calculation of the above area.

[0046] The coating layer preferably comprises a first coating layer containing carbon as an element.

[0047] The coating layer may be a single layer or two or more layers.

[0048] The coating layer preferably comprises a second coating layer having fluorine and silicon as elements.

[0049] It is preferable that a first coating layer containing carbon as an element and a second coating layer containing fluorine and silicon as elements are laminated in this order from the adsorption surface. Alternatively, instead of a second coating layer containing fluorine and silicon as elements, a second coating layer containing iron and carbon as elements may be formed.

[0050] When the coating layer consists of multiple layers, the total thickness of the coating layers is preferably 0.1 μm or more and 1 μm or less. If the total thickness of the coating layers is less than 0.1 μm, the effect of preventing fragments of the ceramic green sheet and internal electrode paste from remaining on the surface of the laminated head may not be fully realized. Also, if the total thickness of the coating layers exceeds 1 μm, the transfer of static electricity from the coating layer to the laminated head body becomes less likely, which may cause static electricity to accumulate in the coating layer.

[0051] The average thickness of the coating layer placed on the surface of the wall constituting the suction hole is not particularly limited, but is preferably 1 μm or less, more preferably 0.1 μm or more and 1 μm or less, and even more preferably 0.1 μm or more and 0.5 μm or less.

[0052] The average thickness of the coating layer placed on the surface of the wall that makes up the suction hole can be determined by the following method. First, determine the length of the coating layer formed on the wall surface constituting the suction hole in the thickness direction of the stacking head. Next, identify the point that divides the coating layer in the thickness direction of the stacking head, i.e., the midpoint of the coating layer distributed in the thickness direction. Finally, draw a perpendicular line from the wall surface constituting the suction hole to the coating layer at this midpoint, and define the length of this perpendicular line until it reaches the surface of the coating layer as the average thickness of the coating layer.

[0053] The coating layer can be formed, for example, by placing the lamination head in an atmosphere containing the components that will form the coating layer. As time passes, the components that will form the coating layer penetrate into the suction holes, so the coating layer can be made thinner in the deeper parts of the suction holes, and the thickness of the coating layer becomes thicker closer to the first main surface and thinner closer to the second main surface.

[0054] The shape of the stacking head is not particularly limited as long as it has a flat surface that serves as an adsorption surface, but an example of such a shape is a plate-like shape having a first main surface that serves as an adsorption surface and a second main surface that faces the first main surface.

[0055] The material used to construct the stacked head is not particularly limited, but it is preferably a metal.

[0056] The lamination head is preferably a metal plate with a thickness of 0.5 mm or less, having a first main surface and a second main surface facing each other in the thickness direction. In this case, it is preferable that the first main surface is the adsorption surface and the second main surface side is equipped with a suction mechanism.

[0057] The length of the suction hole is not particularly limited. Furthermore, the number of suction holes and the spacing between them are not particularly limited.

[0058] The lamination head may be equipped with a heating mechanism. Preferably, the heating mechanism is capable of heating the temperature of the first main surface of the lamination head to 50°C or higher and 80°C or lower. Heating the ceramic green sheets to a temperature between 50°C and 80°C makes them easier to laminate.

[0059] Figure 5 is an exploded perspective view schematically showing the structure of another example of a stacked head. The stacked head 240 shown in Figure 5 has a suction mechanism and suction holes 211, and an adsorption plate 230 is arranged on the surface 210a of the head body 210 via a mesh 220.

[0060] The suction mechanism consists of a suction tube 213 that extends from the side of the head body 210, and a decompression chamber (not shown) formed inside the head body 210 and connected to a suction hole 211 inside the head body 210. This configuration is also an example in which the suction mechanism is provided on the second main surface side of the laminated head. The first and second main surfaces of the laminated head will be described later.

[0061] Suction holes 231 are provided on the first main surface 230a of the suction plate 230. Therefore, the first main surface 230a of the suction plate 230, on which the suction holes 231 are provided, is the first main surface and suction surface of the lamination head 240. The suction plate 230 has a first main surface 230a with suction holes 231 and a bent portion 235 without suction holes 231, and is fixed to the head body 210 by the bent portion 235. The suction hole 231 provided on the first main surface 230a of the suction plate 230 is also called the first suction hole to distinguish it from the suction hole 211 provided on the surface 210a of the head body 210. The suction hole 211 provided on the surface 210a of the head body 210 is also called the second suction hole.

[0062] When air in the decompression chamber is drawn in through the suction tube 213, air is drawn in through the second suction hole 211 and the first suction hole 231, allowing the ceramic green sheet to be adsorbed on the first main surface 230a of the adsorption plate 230 (the adsorption surface of the lamination head 240).

[0063] The length of the first suction hole 231 is not particularly limited, but it is preferably 0.1 mm or more and 0.5 mm or less.

[0064] A coating layer may be formed on at least a portion of the surface 210a of the head body 210 in which the second suction hole 211 is formed. Furthermore, a coating layer may also be formed on the inner wall surface of the opening of the second suction hole 211. Furthermore, the shape of the second suction hole 211 may be a tapered shape in which the hole diameter gradually decreases from the surface 210a toward the opposite side in the thickness direction.

[0065] The mesh 220 is a mesh-like structure that can homogenize the air flowing between the first suction hole 231 and the second suction hole 211. Therefore, even if the diameter of the second suction hole 211 is larger than the diameter of the first suction hole 231, or if the number of holes in the second suction hole 211 is greater than the number of holes in the first suction hole 231, the mesh 220 can equalize the airflow, allowing for uniform suction by the first suction hole 231.

[0066] For mesh 220, for example, metal can be used.

[0067] Figure 6 is a cross-sectional view of the stacking head shown in Figure 5. As shown in Figure 6, the first main surface 230a of the suction plate 230 constituting the stacking head 240 is provided with a coating layer 50 and a first suction hole 231. The first main surface 230a of the suction plate 230 is also the suction surface of the lamination head 240.

[0068] Preferably, the spacing between the second suction holes 211 provided in the head body 210 is longer than the spacing between the first suction holes 231 provided in the first main surface 230a of the suction plate 230. Furthermore, it is preferable that the diameter of the second suction hole 211 provided in the head body 210 is larger than the diameter of the first suction hole 231 provided in the first main surface 230a of the suction plate 230.

[0069] The suction plate 230 is removable. Therefore, in accordance with the characteristics of the ceramic green sheet being transported, it is possible to replace the suction plate 230 with another suction plate whose hole diameter, number, and arrangement pattern of suction holes 231 provided on the first main surface 230a of the suction plate 230 are optimized to match the ceramic green sheet being transported.

[0070] A ceramic green sheet is formed, for example, by coating a slurry containing ceramic particles made of Ba and Ti, a binder, a dispersant, etc., onto a resin film and drying it.

[0071] The coating method is not particularly limited, and various coating methods such as gravure coating and die coating can be used.

[0072] The thickness of the ceramic green sheet is not particularly limited, but is generally between 0.2 μm and 3.0 μm.

[0073] An internal electrode pattern may be printed on the surface of the ceramic green sheet, if necessary. A ceramic green sheet with an internal electrode pattern printed on it is also called an internal electrode sheet.

[0074] The internal electrode pattern can be formed by printing an internal electrode paste, which is a mixture of metal particles, a binder, an organic solvent, and a dispersant, onto a ceramic green sheet.

[0075] The printing method is not particularly limited, and various printing methods such as screen printing and gravure printing can be used.

[0076] The thickness of the internal electrode pattern is not particularly limited, but is generally between 0.1 μm and 3.0 μm.

[0077] The ceramic green sheet may be handled in a state where it is laminated on a support resin film (raw material sheet) and wound into a roll.

[0078] In this case, the film is unwound by the unwinding mechanism, cut into a predetermined shape in or near the peeling area, peeled from the surface of the resin film by the crimping head, and laminated onto the lamination stage.

[0079] [Manufacturing methods for electronic components] The present invention provides a method for manufacturing electronic components, characterized by laminating ceramic green sheets using the electronic component manufacturing apparatus of the present invention.

[0080] The electronic component manufacturing apparatus of the present invention allows for the lamination of ceramic green sheets on a lamination stage. At this time, fragments of the ceramic green sheet and internal electrode paste are less likely to remain on the surface of the lamination head, thus reducing the likelihood of suction failures and lamination defects. Therefore, the method for manufacturing electronic components of the present invention using the electronic component manufacturing apparatus of the present invention can suppress defects in electronic components caused by poor suction or poor lamination.

[0081] This specification contains the following information:

[0082] This disclosure (1) is an electronic component manufacturing apparatus comprising a lamination head for transporting ceramic green sheets and a lamination stage for stacking the transported ceramic green sheets, The lamination head is equipped with an adsorption surface for adsorbing and transporting ceramic green sheets, and the adsorption surface is located opposite the lamination stage. The aforementioned suction surface is provided with a plurality of suction holes, The present invention relates to an electronic component manufacturing apparatus characterized in that a coating layer is disposed on at least a portion of the adsorption surface.

[0083] Disclosure (2) is an electronic component manufacturing apparatus according to Disclosure (1), wherein the coating layer is further disposed on at least a portion of the surface of the wall surface constituting the suction hole.

[0084] (3) of this disclosure is an apparatus for manufacturing an electronic component according to (1) or (2) of this disclosure, wherein the coating layer comprises a first coating layer containing carbon as an element.

[0085] (4) of this disclosure further comprises a second coating layer containing fluorine and silicon as elements, The manufacturing apparatus for electronic components according to disclosure (3) is configured such that the first coating layer and the second coating layer are arranged in that order from the adsorption surface.

[0086] (5) The lamination head is a metal plate with a thickness of 0.5 mm or less, having a first main surface and a second main surface facing each other in the thickness direction. The first main surface of the metal plate is the adsorption surface, The present invention provides an electronic component manufacturing apparatus according to any one of (1) to (4), wherein a suction mechanism is provided on the second main surface side of the metal plate.

[0087] Disclosure (6) is a manufacturing apparatus for electronic components according to any of Disclosures (1) to (5), wherein the thickness of the coating layer on the adsorption surface is 0.1 μm or more and 1 μm or less.

[0088] Disclosure (7) is a method for manufacturing an electronic component, characterized by laminating ceramic green sheets using an electronic component manufacturing apparatus described in any of Disclosures (1) to (6). [Explanation of symbols]

[0089] 10 Resin film 20 Ceramic Green Sheets 21 Cut ceramic green sheets 23 Printed internal electrode paste (internal electrode pattern) 25 Internal electrode sheet 30 Raw material sheets 40 stacked heads 40a First main surface (adsorption surface) of the stacked head 40b Second main surface of the stacked head 41 Suction hole 41a Wall surface of the suction hole 42. Decompression chamber (suction mechanism) 50 coating layers 100 Electronic component manufacturing equipment 110 Unwinding mechanism 120 Winding mechanism 130 Cutting Stages 140 Peeling Stage 150 stacking stage 210 Head Body 210a Surface of the head body 211 Suction hole (second suction hole) 213 Suction tube 220 mesh 230 Adsorption plate 230a First main surface of the suction plate 231 Suction hole (first suction hole) 235 Folded section 240 stacked heads C Cutting Area L Lamination Area

Claims

1. An electronic component manufacturing apparatus comprising a lamination head for transporting ceramic green sheets and a lamination stage for stacking the transported ceramic green sheets, The lamination head is equipped with an adsorption surface for adsorbing and transporting ceramic green sheets, and the adsorption surface is located opposite the lamination stage. The aforementioned suction surface is provided with a plurality of suction holes, A coating layer is disposed on at least a portion of the adsorption surface. An apparatus for manufacturing electronic components, characterized in that the coating layer comprises a first coating layer containing carbon as an element.

2. The apparatus for manufacturing electronic components according to claim 1, wherein the coating layer is further disposed on at least a portion of the surface of the wall constituting the suction hole.

3. The coating layer further comprises a second coating layer containing fluorine and silicon as elements. The apparatus for manufacturing electronic components according to claim 1 or 2, wherein the first coating layer and the second coating layer are arranged in that order from the adsorption surface.

4. The lamination head is a metal plate with a thickness of 0.5 mm or less, having a first main surface and a second main surface facing each other in the thickness direction. The first main surface of the metal plate is the adsorption surface, The apparatus for manufacturing electronic components according to claim 1 or 2, wherein the metal plate is provided with a suction mechanism on the second main surface side.

5. The apparatus for manufacturing electronic components according to claim 1 or 2, wherein the thickness of the coating layer on the adsorption surface is 0.1 μm or more and 1 μm or less.

6. A method for manufacturing an electronic component, characterized by laminating ceramic green sheets using the electronic component manufacturing apparatus described in claim 1.

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