Multi-line interface for boards and circuit boards

Abstract

A device including a first board, a second board, and a coaxial cable coupled to the first board and the second board. The coaxial cable includes a multi-line coaxial cable configured to provide at least two electrical paths for a current between the first board and the second board. A first plug is coupled to the first board. A second plug is coupled to the second board. The coaxial cable includes a first receptable and a second receptable. The first receptable is configured to couple to the first plug. The second receptable is configured to couple to the second plug. The coaxial cable is configured to provide (i) a first electrical path for a first current between the first board and the second board, and (ii) a second electrical path for a second current between the first board and the second board.

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims the priority and benefit of non - provisional application No. 17 / 238,073, filed with the United States Patent and Trademark Office on April 22, 2021, the entire content of which is incorporated herein by reference for all applicable purposes as if the full text were set forth below.

[0002] Various features relate to cables and interfaces for boards and substrates.

Background Art

[0003] Electronic devices include many electronic components that are close to each other. These electronic components have signals that pass through them. These signals are sensitive to other signals and / or other electronic components. These signals may also leak. It is important to reduce signal leakage and insulate signals from other nearby signals and / or electronic components.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In electronic devices, there is a continuing need to improve signal insulation and reduce signal leakage.

Means for Solving the Problems

[0005] Various features relate to cables and interfaces for boards and substrates.

[0006] One example provides a device including a board and a multiline interface coupled to the board. The multiline interface includes a receptacle and a plug configured to couple to the receptacle. The receptacle includes a first receptive metal component configured as part of a first electrical path for a first current, and a second receptive metal component configured as part of a second electrical path for a second current. The plug includes a first plug metal component configured to couple to the first receptive metal component, a second plug metal component configured to couple to the second receptive metal component, and a plug metal frame configured as a shield around the first and second plug metal components.

[0007] Various features, properties, and advantages may become apparent from the detailed description below when read in conjunction with drawings, which are identified by similar reference numerals throughout. [Brief explanation of the drawing]

[0008] [Figure 1] This figure shows a multi-line coaxial interface with receptacles and plugs. [Figure 2] This figure shows a multi-line coaxial interface with receptacles and plugs coupled to a board. [Figure 3] This figure shows a multi-line coaxial interface with receptacles and plugs coupled to a board. [Figure 4] This diagram shows a multi-line coaxial cable connected to two boards. [Figure 5] This is a cross-sectional view of a receptacle for a multi-line coaxial interface. [Figure 6] This is a cross-sectional view of a plug for a multi-line coaxial interface. [Figure 7] This is a cross-sectional view of a receptacle and plug for a multi-line coaxial interface. [Figure 8]This figure shows a multi-line coaxial interface with receptacles and plugs. [Figure 9] This is a cross-sectional view of a receptacle for another multi-line coaxial interface. [Figure 10] This is a cross-sectional view of a plug for another multi-line coaxial interface. [Figure 11] This is a cross-sectional view of a receptacle and plug for another multi-line coaxial interface. [Figure 12] This is a cross-sectional view of a receptacle and plug for another multi-line coaxial interface. [Figure 13] This is a plan view of a portion of a board coupled to a plug for a multi-line coaxial interface. [Figure 14] This is a plan view of a portion of a board coupled to a plug for a multi-line coaxial interface. [Figure 15] This is a graph showing the insulation performance of interfaces for cables. [Figure 16] This is a graph showing the insulation performance of interfaces for multi-line coaxial cables. [Figure 17] This figure shows various electronic devices that can integrate dies, electronic circuits, integrated devices, integrated passive devices (IPDs), passive components, packages, and / or device packages as described herein. [Modes for carrying out the invention]

[0009] The following description provides specific details to enable a full understanding of the various aspects of this disclosure. However, it will be understood by those skilled in the art that these aspects can be implemented without these specific details. For example, circuits may be shown in block diagrams to avoid obscuring the aspects with unnecessary details. In other cases, well-known circuits, structures, and techniques may not be shown in detail to avoid obscuring the aspects of this disclosure.

[0010] This disclosure describes a device comprising a first board, a second board, and a coaxial cable coupled to the first and second boards. The coaxial cable includes a multiline coaxial cable configured to provide at least two electrical paths for current between the first and second boards. A first plug is coupled to the first board. A second plug is coupled to the second board. The coaxial cable includes a first receptacle and a second receptacle. The first receptacle is configured to couple to the first plug. The second receptacle is configured to couple to the second plug. The coaxial cable is configured to provide (i) a first electrical path for a first current between the first and second boards, and (ii) a second electrical path for a second current between the first and second boards. The first electrical path between the first and second boards is completely shielded (e.g., 360-degree shielding). The second electrical path between the first board and the second board is completely shielded. The first plug, first receptacle, coaxial cable, second receptacle, and second plug are shielded. A better shielded electrical path reduces current and signal leakage, improves signal isolation, and provides current and / or signals of better quality and integrity.

[0011] Exemplary multiline interface Figure 1 shows an interface 100 including a plug 102 and a receptacle 104. Interface 100 may be a multiline coaxial interface configured to provide at least two electrical paths for at least two signals, each electrical path being shielded. Interface 100 may be means for a multiline interface. The receptacle 104 is configured to be coupled to the plug 102 (e.g., mechanically coupled) and vice versa. Interface 100 may be a connector (e.g., a multiline coaxial connector). The plug 102 and the receptacle 104 may be separate components that can be coupled to and detached from each other. The plug 102 may be means for plug coupling. The receptacle 104 may be means for receptacle coupling. When the receptacle 104 and the plug 102 are coupled to each other, the receptacle 104 and the plug 102 can be configured to allow at least two currents to pass through them (in either direction). As will be further described below, at least one interface 100 may be used to provide a fully shielded electrical path between two boards and / or two substrates for at least two currents (e.g., electrical signals).

[0012] The plug 102 may be a multiline coaxial plug. The plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a first region 123, a second support component 124, and a second region 125. The plug 102 is coupled to (or is part of) the cable 106. The cable 106 may be a multiline coaxial cable. The cable 106 may include a flexible cable. The cable 106 includes a cover 160. As will be further described below, the plug 102 and / or the cable 106 may include other components.

[0013] The metal frame 120 may be a plug metal frame. The metal frame 120 may be configured to be coupled to a ground (e.g., an electrical ground). The metal frame 120 may be configured as a shield (e.g., an electromagnetic interference (EMI) shield). The first support component 122 and the second support component 124 may be surrounded by the metal frame 120. More specifically, the first support component 122 and the second support component 124 may be installed in the chamber 121. The chamber 121 may be defined by the metal frame 120. The first support component 122 and / or the second support component 124 may include a non-metallic material (e.g., a plastic material). The first support component 122 and / or the second support component 124 may be flexible. The first support component 122 may have a rectangular cross-section (e.g., a square cross-section). The first region 123 may be defined by the first support component 122. The second support component 124 may have a rectangular cross-section (e.g., a square cross-section). The second region 125 may be defined by the second support component 124. As will be further described below, the plug 102 may include a first plug metal component and a second plug metal component.

[0014] The receptacle 104 may be a multi-line coaxial receptacle. The receptacle 104 includes a metal frame 140, a first metal component 142, a second metal component 144, a first region 143, and a second region 145. The first metal component 142 may be a first receptacle metal component. The second metal component 144 may be a second receptacle metal component. As will be further described below, the receptacle 104 may include other components. The receptacle 104 may be configured to be coupled to a board (e.g., a printed circuit board, a first board, a second board) or a substrate. Different mounting configurations may couple the receptacle 104 to the board or substrate differently. For example, solder may be used to couple the receptacle 104 to the board or substrate.

[0015] The metal frame 140 may be a receptive metal frame. The metal frame 140 may be configured as a shield (e.g., an electromagnetic interference (EMI) shield). The metal frame 140 may be configured to couple to a ground (e.g., an electrical ground). The first metal component 142 (e.g., the first receptive metal component) and the second metal component 144 (e.g., the second receptive metal component) may be surrounded by the metal frame 140. The first metal component 142 may be installed in the first region 143. The second metal component 144 may be installed in the second region 145. A portion of the metal frame 140 may separate the first region 143 and the second region 145. The same portion of the metal frame 140 may be installed between the first metal component 142 and the second metal component 144. The metal frame 140 may be configured as a shield for (i) a first current passing through the first metal component 142 and (ii) a second current passing through the second metal component 144. The metal frame 140 may be configured to provide 360-degree shielding for (i) a first current passing through the first metal component 142 and (ii) a second current passing through the second metal component 144. The metal frame 140 may be configured to insulate the current passing through the first metal component 142 from the current passing through the second metal component 144, and vice versa. The metal frame 140 may be configured to reduce current leakage through the first metal component 142 and / or the second metal component 144. The first current may include a first radio frequency (RF) signal and / or a first intermediate frequency (IF) signal. The second current may include a second radio frequency (RF) signal and / or a second intermediate frequency (IF) signal. Examples of signal frequencies include millimeter wave frequencies. Examples of signal frequencies include frequencies up to 50 GHz (e.g., from 1 GHz to 50 GHz) that may pass with improved insulation and reduced signal leakage. The improvement in signal insulation will be further described below, at least in FIGS. 15 and 16.

[0016] The plug 102 is configured to be coupled to the receptacle 104, and vice versa. When the plug 102 is coupled to the receptacle 104, the metal frame 140 may be placed inside the chamber 121 of the plug 102. The metal frame 140 may be coupled to the metal frame 120 (for example, mechanically or electrically). The first metal component 142 may be placed inside the first region 123 of the plug 102. The second metal component 144 may be placed inside the second region 125 of the plug 102. Tension and pressure between the plug 102 and the receptacle 104 may be used to ensure a secure coupling between the plug 102 and the receptacle 104.

[0017] Figure 2 shows a profile diagram of the receptable coupled to the board in a BB cross-section. Figure 2 also shows a profile diagram of the plug in a BB cross-section. As shown in Figure 2, the receptable 104 is coupled to the board 202 (e.g., a printed circuit board). Different mounting configurations may involve different couplings of the receptable 104 to the board. For example, solder may be used to couple the receptable 104 to the board 202. Note that the receptable 104 may be coupled to the substrate. The board 202 includes at least one dielectric layer 210, a plurality of interconnects 212, and a metal layer 214. The metal layer 214 may be placed on at least one surface of at least one dielectric layer 210. The metal layer 214 is placed on the outer surface of the board 202. The receptable 104 is coupled to a first surface (e.g., the top surface) of the board 202. The metal frame 140 is coupled to the metal layer 214 of the board 202. Different mounting configurations may differently couple the metal frame 140 to the metal layer 214. The first metal component 142 is coupled to a first plurality of interconnects from a plurality of interconnects 212 of the board 202. The first plurality of interconnects from a plurality of interconnects 212 of the board 202 may include interconnects located in at least one dielectric layer 210. Although not shown, the second metal component 144 may be coupled to a second plurality of interconnects from a plurality of interconnects 212 of the board 202. The second plurality of interconnects from a plurality of interconnects 212 of the board 202 may include interconnects located in at least one dielectric layer 210. The metal frame 140 and the metal layer 214 are configured to be coupled to earth (e.g., electrical ground). The metal frame 140 and metal layer 214 are configured as a shield (for example, an electromagnetic interference (EMI) shield).

[0018] Figure 2 also shows a plug coupled to the cable. As shown in Figure 2, the plug 102 is coupled to the cable 106. In some implementations, the plug 102 may be considered part of the cable 106. The plug 102 includes a metal frame 120 and a first metal component 222. The first metal component 222 (e.g., the first plug metal component) may be installed within the first region 123 of the plug 102. Although not shown, the plug 102 may also include a second metal component (e.g., the second plug metal component). The cable 106 includes a cover 160, a dielectric layer 242, a first metal layer 245, and a metal layer 247. The cable 106 may also include a second metal layer (not shown). The metal frame 120 is coupled to the metal layer 247. The metal layer 247 may radially surround the first metal layer 245 and / or the second metal layer (not shown, and configured as a second electrical path for a second current). The first metal component 222 is coupled to the first metal layer 245. The second metal component of the plug 102 (not shown) may be coupled to the second metal layer of the cable 106. The second metal component may be similar to the first metal component 222. The second metal component may be a second plug metal component. The second metal component may be located within the second region 125 of the plug 102. In some implementations, the second metal component (not shown in Figure 2) may be represented as the second metal component 224 and / or the second metal component 824, which will be further described below in at least Figures 6 and 10.

[0019] Figure 3 shows a profile diagram of a plug coupled to a receptacle in a BB cross section. As shown in Figure 3, the plug 102 is coupled to the receptacle 104 (for example, mechanically and electrically), and vice versa. The tension and / or pressure between the plug 102 and the receptacle 104 ensures that they are securely coupled. The metal frame 120 of the plug 102 is coupled to the metal frame 140 of the receptacle 104. The first metal component 142 is coupled to the first metal component 222 of the plug 102. The first metal component 222 may be the first plug metal component. When the plug 102 is coupled to the receptacle 104, there may be at least two electrical paths extending from the cable 106, the plug 102, the receptacle 104, and the board 202. For example, a first electrical path may be defined by a first metal layer 245, a first metal component 222, a first metal component 142, and / or a first plurality of interconnects from a plurality of interconnects 212. A second electrical path (and any additional electrical paths) may be defined in a similar manner to the first electrical path. Furthermore, the first and second electrical paths are completely shielded by a metal layer 247, a metal frame 120, a metal frame 140, at least one interconnect from the plurality of interconnects 212, and / or a metal layer 214. For example, interconnects from a plurality of interconnects 212, which may include interconnects installed in the board 202 (for example, installed in at least one dielectric layer 210), can be shielded by the metal layer 214 of the board 202.

[0020] Figure 4 shows how a multiline coaxial cable with a multiline coaxial interface can be used to connect two boards. Figure 4 shows a first board 202a, a second board 202b, and a cable 106. The first board 202a is connected to the second board 202b through the cable 106 (e.g., mechanically connected, electrically connected). The cable 106 includes a first plug 102a and a second plug 102b. Note that in some implementations, the first plug 102a and / or the second plug 102b may be considered separate components from the cable 106. The first receptacle 104a is connected to the first board 202a. The second receptacle 104b is connected to the second board 202b.

[0021] The first electrical path between the first board 202a and the second board 202b may include (i) a first plurality of interconnectors from a plurality of interconnectors 212a of the first board 202a, (ii) a first metal component 142a from the first receptable 104a, (iii) a first metal component 222a from the first plug 102a, (iv) a first metal layer 245 from the cable 106, (v) a first metal component 222b from the second plug 102b, (vi) a first metal component 142b from the second receptable 104b, and (vii) a first plurality of interconnectors from a plurality of interconnectors 212b of the second board 202b. The first electrical path may be for a first current (for example, a first electrical signal).

[0022] The second electrical path between the first board 202a and the second board 202b may include a path similar to that described above for the first electrical path. The second electrical path may be for a second current (e.g., a second electrical signal). The first electrical path (and any other electrical paths) between the first board 202a and the second board 202b may be completely shielded (e.g., 360-degree shielding). Complete shielding provides better isolation between signals, reduces current and / or signal leakage, which can lead to better signal integrity and quality. Examples of how completely shielding one or more electrical paths can improve signal performance are further shown in at least Figures 15 and 16 and described below.

[0023] Shielding of currents traveling through the electrical path between the first board 202a and the second board 202b may be provided by (i) the metal layer 214a of board 202a, (ii) the metal frame 140a of the first receptacle 104a, (iii) the metal frame 120a of the first plug 102a, (iv) the metal layer 247 of cable 106, (v) the metal frame 120b of the second plug 102b, (vi) the metal frame 140b of the second receptacle 104b, and / or (vii) the metal layer 214b of the second board 202b. The metal layer 214a of board 202a, the metal frame 140a of the first receptable 104a, the metal frame 120a of the first plug 102a, the metal layer 247 of cable 106, the metal frame 120b of the second plug 102b, the metal frame 140b of the second receptable 104b, and / or the metal layer 214b of the second board 202b may be coupled to ground (e.g., electrical ground). Note that instead of boards, a multiline coaxial cable with the multiline coaxial interface shown in Figure 4 may be used to couple two boards, and / or combinations of boards and boards.

[0024] Figure 5 shows an exemplary AA cross-sectional view of the receptable. As shown in Figure 5, the receptable 104 includes a metal frame 140, a first metal component 142, and a second metal component 144. The first metal component 142 is located within a first region 143 of the receptable 104. The second metal component 144 is located within a second region 145 of the receptable 104. The metal frame 140 is configured to provide 360-degree shielding (e.g., 360-degree EMI shielding) for currents traveling through the first metal component 142 and the second metal component 144. In addition, a portion of the metal frame 140 helps to isolate and isolate the current traveling through the first metal component 142 from the current traveling through the second metal component 144. The metal frame 140 is configured to be coupled to earth.

[0025] Figure 6 shows an exemplary AA cross-sectional view of the plug. As shown in Figure 6, the plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a second support component 124, a first metal component 222 (e.g., the first plug metal component), and a second metal component 224 (e.g., the second plug metal component). The first support component 122 and the second support component 124 are installed within the chamber 121. A first region 123 may be defined by the first support component 122. A second region 125 may be defined by the second support component 124. The first support component 122 and the second support component 124 may each be flexible components. The first metal component 222 may be installed within the first region 123. The second metal component 224 may be installed within the second region 125.

[0026] Figure 7 shows an exemplary AA cross-sectional view of a plug 102 and a receptable 104 coupled to each other. As shown in Figure 7, the receptable 104 may be at least partially installed inside the plug 102. The receptable 104 may be installed inside the chamber 121 of the plug 102. The first metal component 142 of the receptable 104 may be installed inside the first region 123 of the plug 102. The first metal component 142 (e.g., the first receptable metal component) may be coupled to the first metal component 222 (e.g., the first plug metal component). The second metal component 144 of the receptable 104 may be installed inside the second region 125 of the plug 102. The second metal component 144 (e.g., the second receptable metal component) may be coupled to the second metal component 224 (e.g., the second plug metal component). The metal frame 140 of the receptacle 104 may be in contact with the metal frame 120 of the plug 102. In some mounting configurations, the combined cross-sectional size of the plug 102 and the receptacle 104 may be approximately 3.6 mm (L) × 2.4 mm (W), or less.

[0027] It should be noted that the location, size, and / or shape of the various components of the receptacle 104 and plug 102 may vary in different implementation configurations. Furthermore, the various components may be coupled to each other in various ways, and are not limited to those shown and described in this disclosure. For example, Figure 7 shows that the side of the first metal component 142 is coupled to the side of the first metal component 222. However, the first metal component 142 may be coupled to the first metal component 222 through other parts. As mentioned above, the receptacle and / or plug may contain more components than those mentioned above. Figures 8 to 10 show exemplary receptacles and exemplary plugs with additional components. In some implementation configurations, the receptacles and plugs of Figures 8 to 10 provide a more robust and secure coupling.

[0028] Figure 8 shows an interface 800 including a plug 102 and a receptacle 104. Interface 800 may be a multiline coaxial interface configured to provide at least two electrical paths for at least two signals, where each electrical path is shielded (EMI shielded). The receptacle 104 is configured to couple to the plug 102 (e.g., mechanically coupled, electrically coupled) and vice versa. Interface 800 may be a means for a multiline interface. The plug 102 may be a means for plug coupling. The receptacle 104 may be a means for receptacle coupling. Interface 800 is similar to interface 100 in Figure 1, except that interface 800 may include different configurations of components and / or additional components. As shown in Figure 8, the receptacle 104 includes a metal frame 140, a first metal component 142, a second metal component 144, at least one first support component 842, and at least one second support component 844. Figure 8 shows that the plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a second support component 124, at least one first metal component 822, at least one first metal grounding component 862, at least one second metal component 824, and at least one second metal grounding component 864.

[0029] Figure 9 shows an exemplary AA cross-sectional view of the receptable 104 of Figure 8. As shown in Figure 9, the receptable 104 includes a metal frame 140, a first metal component 142, a second metal component 144, at least one first support component 842, and at least one second support component 844. The first metal component 142 and the first support component 842 are installed in a first region 143 of the receptable 104. The second metal component 144 and the second support component 844 are installed in a second region 145 of the receptable 104. The first support component 842 and / or the second support component 844 may include a non-metallic material (e.g., a plastic material). The first support component 842 and / or the second support component 844 may each be flexible. The first support component 842 is coupled to the first metal component 142. The second support component 844 may be coupled to the second metal component 144. As will be further described below, at least one first support component 842 and / or at least one second support component 844 may help provide a more secure coupling between the receptacle and the plug.

[0030] Figure 10 shows an exemplary cross-sectional view AA of the plug 102 of Figure 8. As shown in Figure 10, the plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a second support component 124, at least one first metal component 822, at least one first metal grounding component 862, at least one second metal component 824, and at least one second metal grounding component 864. The first metal component 822 may be a first plug metal component. The second metal component 824 may be a second plug metal component. In some implementations, the first metal component 822 may be represented as a first metal component 222. The metal frame 120 may include one or more protrusions 920. The protrusions may include ridges in the metal frame 120.

[0031] Figure 11 shows an exemplary AA cross-sectional view of the plug 102 and receptable 104 of Figure 8 coupled together. As shown in Figure 11, the receptable 104 may be at least partially installed inside the plug 102. The receptable 104 may be installed inside the chamber 121 of the plug 102. The metal frame 120 of the plug 102 may be coupled to the metal frame 140 of the receptable 104. For example, the projection 920 of the metal frame 120 may be coupled to the metal frame 140 of the receptable 104. The first metal component 822 of the plug 102 (e.g., the first plug metal component) may be coupled to the first metal component 142 of the receptable 104 (e.g., the first receptable metal component). The first metal grounding component 862 of the plug 102 may be coupled to the metal frame 140 of the receptable 104. A second metal component 824 of the plug 102 (for example, a second plug metal component) may be coupled to a second metal component 144 of the receptable 104 (for example, a second receptable metal component). A second metal grounding component 864 of the plug 102 may be coupled to the metal frame 140 of the receptable 104. In some implementations, the first support component 122 may bend and / or flex to accommodate and / or connect various components with one another. Similarly, the second support component 124 may bend and / or flex to accommodate and / or connect various components with one another. In some implementations, the first support component 842 may be in contact with the first support component 122. In some implementations, the second support component 844 may be in contact with the second support component 124.

[0032] In some implementations, the presence of projections 920, metal grounding components (e.g., 862, 864), metal components (e.g., 822, 824), and / or support components (e.g., 122, 124, 842, 844) helps provide a safer and more secure coupling between the receptacle and the plug by giving appropriate flexibility, tension, and pressure between the receptacle and the plug. Note that interface 800 may have a different number of projections 920, metal grounding components (e.g., 862, 864), metal components (e.g., 822, 824), and / or support components (e.g., 122, 124, 842, 844). The interface 800 may have projections 920, metal grounding components (e.g., 862, 864), metal components (e.g., 822, 824), and / or support components (e.g., 122, 124, 842, 844) installed in different locations. The interface 800 may have different shapes, configurations, and / or designs for the metal frame 120, metal frame 140, projections 920, metal grounding components (e.g., 862, 864), metal components (e.g., 822, 824), and / or support components (e.g., 122, 124, 842, 844).

[0033] This disclosure describes an interface that allows two currents (e.g., electrical signals) to travel through shielded electrical paths. However, the interface is not limited to just two shielded electrical paths. Some implementations may have more than two shielded electrical paths.

[0034] Figure 12 shows an interface 1200 comprising several receptacles (e.g., 104a, 104b, 104c, 104d) and several plugs (e.g., 102a, 102b, 102c, 102d) configured to provide eight shielded electrical paths. Interface 1200 (which may be a multiline coaxial interface) is arranged in a 2x4 array for a total of eight shielded electrical paths. However, it should be noted that different implementations may have different numbers of receptacles and / or plugs and / or combinations thereof. For example, the array may be a 2x2 array or a 1x4 array. Interface 1200 may be a single interface or several interfaces combined into one.

[0035] Figure 13 shows a plan view of a portion of board 202. The portion of board 202 shown may be the portion through which the receptable 104 is coupled when the receptable 104 is coupled to board 202. Figure 13 shows board 202 including a first interconnection portion 1342, a second interconnection portion 1344, a dielectric layer 210, and an interconnection portion 1312. The interconnection portion 1312 forms a rectangular shape within board 202. The first interconnection portion 1342 may be configured to couple with a first metal component 142 of the receptable 104. The second interconnection portion 1344 may be configured to couple with a second metal component 144 of the receptable 104. The first interconnection portion 1342 and the second interconnection portion 1344 may be part of a plurality of interconnection portions 212. The interconnection portion 1312 may be configured to be coupled to the metal frame 140 of the receptable 104. The interconnection portion 1312 may also be part of a plurality of interconnection portions 212 and / or metal layers 214.

[0036] Figure 14 shows a plan view of a portion of board 202. Figure 14 shows a design of the interconnects of board 202 that differs from the design shown in Figure 13. Figure 14 shows board 202 including a first interconnect 1442, a second interconnect 1444, a dielectric layer 210, an interconnect 1412, and an interconnect 1414. The first interconnect 1442 may be configured to be coupled to a first metal component 142 of the receptable 104. The second interconnect 1444 may be configured to be coupled to a second metal component 144 of the receptable 104. The first interconnect 1442 and the second interconnect 1444 may be part of a plurality of interconnects 212. The interconnect 1412 and / or interconnect 1414 may have a planar circular ring shape. The interconnection portions 1412 and / or 1414 may be configured to be coupled to the metal frame 140 of the receptable 104. The interconnection portions 1412 and / or 1414 may be part of a plurality of interconnection portions 212 and / or metal layers 214. In some mounting configurations, an encapsulation layer (e.g., mold, resin, epoxy resin) may be used instead of, or together with, the dielectric layer. The configurations shown in Figures 13 and 14 may be applicable to a substrate.

[0037] Note that this disclosure describes the receptable 104 as being coupled to the board 202 and the plug 102 as being coupled to (or considered as part of) the cable 106. However, in some implementations, the plug 102 may be coupled to the board 202, and the receptable 104 may be coupled to (or considered as part of) the cable. In some implementations, the cable 106 may (i) have one end coupled to the receptable 104 (or have the receptable 104 at one end), and (ii) have the other end coupled to the plug 102 (or have the plug 102 at the other end). Such a cable 106 may be used to couple a board containing a receptable to another board containing a plug. Note that the use of the terms “metallic component” and / or “metallic grounding component” in this disclosure may mean a component comprising metallic material and / or electrically conductive material. Metallic components may include other nonmetallic materials. Similarly, the use of the term “metallic frame” in this disclosure may mean components including metallic materials and / or electrically conductive materials. Metallic frames may include other nonmetallic materials. Coaxial interfaces and / or coaxial cables used in this disclosure may be interfaces and / or cables that provide 360-degree shielding (e.g., 260-degree EMI shielding) across the cross-section of the electrical path for electrical signals. Note that instead of a board, the multiline interfaces described in this disclosure may be coupled to a substrate including at least one dielectric layer and a plurality of interconnects. Examples of substrates include embedded trace substrates (ETS), coreless substrates, and cored substrates. Different mounting configurations may result in the substrate being manufactured differently.

[0038] Figures 15 and 16 show graphs illustrating exemplary signal performance using different interfaces. Figure 15 shows graph 1500, which illustrates the isolation performance of a non-multiline coaxial interface. Graph 1500 shows the isolation performance for reference profile 1510 and interface profile 1520. As shown in Figure 15, the isolation values ​​for interface profile 1520 may include lower values ​​than those for reference profile 1510. Reference profile 1510 may represent the minimum specification requirements for a device. Higher isolation (dB) values ​​are better. As shown in Figure 15, the interface associated with interface profile 1520 does not meet the requirements shown for reference profile 1510.

[0039] Figure 16 shows Graph 1600 illustrating the exemplary isolation performance of a multiline coaxial interface (e.g., 100, 800). Graph 1600 shows the isolation performance for reference profile 1510 and multiline coaxial interface profile 1620. As shown in Figure 16, the isolation values ​​for multiline coaxial interface profile 1620 are higher than those for reference profile 1510 along all frequencies shown in Graph 1600. Furthermore, multiline coaxial interface profile 1620 is higher than interface profile 1520 in Figure 15. As mentioned above, higher isolation (dB) values ​​are better. Figure 16 shows that a multiline coaxial interface provides higher signal isolation (for the same frequencies) than the non-multiline interface in Figure 15, and as a result, signal quality and integrity for signals traveling through multiline coaxial cables between boards and / or substrates can be improved. The results shown for the multiline coaxial interface in Figure 16 may be applicable to signals with frequencies up to 50 GHz. For example, a multiline interface (e.g., 100, 800, 1200) can provide at least 70 dB of isolation for all signals having frequencies up to 10 GHz traveling through the multiline interface (e.g., between two boards coupled to the multiline interface via a multiline cable, or between two circuit boards coupled to the multiline interface via a multiline cable).

[0040] Exemplary electronic device Figure 17 shows various electronic devices that may be integrated with any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, package-on-package (PoP), system-in-package (SiP), or system-on-chip (SoC). For example, a mobile phone device 1702, a laptop computer device 1704, a fixed-location terminal device 1706, a wearable device 1708, or an automated vehicle 1710 may include a device 1700 as described herein. Device 1700 may be, for example, any of the devices and / or integrated circuit (IC) packages described herein. Devices 1702, 1704, 1706, and 1708 and vehicle 1710 shown in Figure 17 are examples only. Other electronic devices may also feature device 1700, and other electronic devices include, but are not limited to, portable data units such as mobile devices, handheld personal communication system (PCS) units, personal digital assistants, GPS-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, stationary data units such as meter reading devices, communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in autonomous vehicles (e.g., self-driving vehicles), or any other devices that store or retrieve data or computer instructions, or any combination thereof, including devices (e.g., electronic devices).

[0041] One or more of the components, processes, features, and / or functions shown in Figures 1 to 14 and / or Figure 17 may be rearranged and / or combined into a single component, process, feature, or function, or incorporated into several components, processes, or functions. Additional elements, components, processes, and / or functions may be added without departing from this disclosure. Note that Figures 1 to 14 and / or Figure 17 and their corresponding descriptions in this disclosure are not limited to dies and / or ICs. In some implementations, Figures 1 to 14 and / or Figure 17 and their corresponding descriptions may be used to fabricate, create, provide, and / or produce devices and / or integrated devices. In some implementations, a device may include a die, an integrated device, an integrated passive device (IPD), a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat dissipation device, and / or an interposer.

[0042] It should be noted that the figures in this disclosure may represent actual and / or conceptual representations of various components, elements, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some examples, the figures may not be to scale. In some examples, not all elements and / or components may be shown for the sake of simplicity. In some examples, the position, location, size, and / or shape of various components and / or elements in the figures may be illustrative. In some implementations, the various components and / or components in the figures may be arbitrary.

[0043] The term “exemplary” is used herein to mean “to serve as an example, case, or illustration.” Any implementation or aspect described herein as “exemplary” should not necessarily be construed as being preferable or advantageous to other aspects of the Disclosure. Similarly, the term “aspect” does not require that all aspects of the Disclosure include the described features, advantages, or modes of operation. The term “coupled” is used herein to mean a direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A is in physical contact with object B, and object B is in contact with object C, objects A and C may still be considered coupled to each other, even if they are not in direct physical contact with each other. The term “electrically coupled” may mean that two objects are directly or indirectly coupled together so that an electric current (e.g., signal, power, ground) can travel between the two objects. Two electrically coupled objects may or may not have an electric current traveling between them. The use of the terms “first,” “second,” “third,” and “fourth” (and / or beyond the fourth) is arbitrary. Any of the described components may be the first, second, third, or fourth component. For example, a component referred to as the second component may be the first, second, third, or fourth component. The term “encapsulate” means that an object may partially or completely encapsulate another object. The terms “top” and “bottom” are arbitrary. A component placed on top may be placed on top of a component placed on the bottom. A top component may be considered a bottom component, and vice versa. As described in this disclosure, a first component placed “on top” of a second component may mean that the first component is placed above or below the second component, depending on how the bottom or top is arbitrarily defined.In another example, the first component may be mounted over (e.g., above) the first face of the second component, and the third component may be mounted over (e.g., below) the second face of the second component, with the second face facing the first face. It should be further noted that the term “over” as used in this application in the context of one component being mounted over another may be used to mean a component that is on and / or inside another component (e.g., on the surface of the component or embedded in the component). Thus, for example, a first component over a second component may mean that (1) the first component is on the second component but not in direct contact with the second component, (2) the first component is on the second component (e.g., on the surface of the second component), and / or (3) the first component is inside the second component (e.g., embedded in the second component). A first component that is placed "in" a second component may be placed partially or entirely within the second component. As used in this disclosure, the terms "about 'value X'" or "approximately 'value X'" mean within 10 percent of 'value X'. For example, about 1 or approximately 1 means a value within the range of 0.9 to 1.1.

[0044] In some implementations, an interconnect is an element or component of a device or package that enables or facilitates an electrical connection between two points, elements, and / or components. In some implementations, an interconnect may include traces, vias, pads, pillars, metallization layers, redistribution layers, and / or underbump metallization (UBM) layers / interconnectors. In some implementations, an interconnect may include conductive material that may be configured to provide electrical paths for signals (e.g., data signals), ground, and / or power. An interconnect may include two or more elements or components. An interconnect may be defined by one or more interconnects. An interconnect may include one or more metal layers. An interconnect may be part of a circuit. Various implementations may use different processes and / or sequences to form the interconnect. In some implementations, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, spray coating, and / or plating processes may be used to form interconnects.

[0045] Furthermore, note that various disclosures contained herein may be described as processes shown as flowcharts, flow diagrams, structural diagrams, or block diagrams. While flowcharts may describe operations as sequential processes, many operations can be performed in parallel or simultaneously. In addition, the order of operations may be rearranged. A process terminates when its operations are completed.

[0046] Further examples are provided below to facilitate understanding of this disclosure.

[0047] Embodiment 1: A device comprising a board and a multiline interface coupled to the board. The multiline interface includes a receptable and a plug configured to be coupled to the receptable. The receptable includes a first receptable metal component configured as part of a first electrical path for a first current, and a second receptable metal component configured as part of a second electrical path for a second current. The plug includes a first plug metal component configured to be coupled to the first receptable metal component, a second plug metal component configured to be coupled to the second receptable metal component, and a plug metal frame configured as a shield around the first and second plug metal components.

[0048] Embodiment 2: The device of Embodiment 1, wherein the multiline interface includes a multiline coaxial interface.

[0049] Embodiment 3: The device of Embodiments 1 to 2, wherein the multiline interface is configured to provide a first electrical path for a first current through the receptacle and plug, and the multiline interface is configured to provide a second electrical path for a second current through the receptacle and plug.

[0050] Embodiment 4: The device of Embodiments 1 to 3, wherein the receptable further comprises a receptive metal frame configured to be coupled to a plug metal frame, the plug metal frame configured to surround the receptive metal frame, and the plug metal frame configured to be coupled to earth.

[0051] Embodiment 5: The device of Embodiment 4, wherein the plug further includes a first support component surrounding a first plug metal component and a second support component surrounding a second plug metal component.

[0052] Embodiment 6: The device of Embodiment 5, wherein the plug further comprises a first metal grounding component configured to be coupled to a receptable metal frame, the first metal grounding component being configured to be installed between a first support component and a receptable metal frame, and a second metal grounding component configured to be coupled to a receptable metal frame, the second metal grounding component being configured to be installed between a second support component and a receptable metal frame.

[0053] Embodiment 7: The device according to Embodiments 1 to 6, wherein the plug is coupled to a board.

[0054] Embodiment 8: The device according to Embodiments 1 to 6, wherein the receptacle is coupled to a board.

[0055] Embodiment 9: The device according to Embodiments 1 to 8, further comprising a cable coupled to a multiline interface, a second multiline interface coupled to the cable, the second multiline interface comprising a second receptacle and a second plug, the second plug being configured to be coupled to the second receptacle, and a second board coupled to the second multiline interface.

[0056] Embodiment 10: The device of Embodiment 9, wherein the multiline interface and the second multiline interface are part of the cable.

[0057] Embodiment 11: The device of Embodiment 9, wherein the second receptable comprises a third receptable metal component configured as part of a first electrical path for a first current, a fourth receptable metal component configured as part of a second electrical path for a second current, and a second receptable metal frame configured as a shield around the third and fourth receptable metal components of the second receptable.

[0058] Embodiment 12: The device of Embodiment 11, wherein the second plug comprises a third plug metal component configured to be coupled to a third receptable metal component, a fourth plug metal component configured to be coupled to a fourth receptable metal component, and a second plug metal frame configured as a shield around the third plug metal component and the fourth plug metal component.

[0059] Embodiment 13: The device of Embodiment 12, wherein a receptable is coupled to a board, and a second receptable is coupled to a second board.

[0060] Embodiment 14: The device of Embodiment 12, wherein a plug is coupled to a board and a second plug is coupled to a second board.

[0061] Embodiment 15: The device of Embodiment 12, wherein the receptacle is coupled to a board and the second plug is coupled to a second board.

[0062] Embodiment 16: The device according to Embodiments 1 to 15, wherein the plug metal frame includes at least one projection.

[0063] Embodiment 17: The device of Embodiments 1 to 16, wherein the first current and / or second current include a millimeter-wave signal, a radio frequency (RF) signal and / or an intermediate frequency (IF) signal.

[0064] Embodiment 18: The device according to Embodiments 1 to 17, wherein the board comprises at least one dielectric layer, a plurality of interconnectors, the plurality of interconnectors configured to be coupled to a first receptable metal component and a second receptable metal component, and a metal layer placed on the surface of at least one dielectric layer, the metal layer configured to be coupled to a plug metal frame, and the metal layer is configured to be part of a shield.

[0065] Embodiment 19: The device of Embodiment 18, wherein a first electrical path includes a first plurality of interconnects from a plurality of interconnects located in at least one dielectric layer, and a second electrical path includes a second plurality of interconnects from a plurality of interconnects located in at least one dielectric layer.

[0066] Embodiment 20: Devices according to Embodiments 1 to 19, wherein the device includes electronic devices selected from the group consisting of music players, video players, entertainment units, navigation devices, communication devices, mobile devices, cell phones, smartphones, personal digital assistants, stationary terminals, tablet computers, computers, wearable devices, laptop computers, servers, Internet of Things (IoT) devices, and devices in automated vehicles.

[0067] Embodiment 21: Apparatus comprising a board and means for a multiline interface. The means for the multiline interface comprises means for receptive coupling and means for plug coupling. The means for plug coupling is configured to be coupled to the means for receptive coupling. The means for the multiline interface is configured to (i) provide a first electrical path for a first current and (ii) provide a second electrical path for a second current. The means for plug coupling and the means for receptive coupling are configured to provide electromagnetic interference (EMI) shielding for the first electrical path for the first current and for the second electrical path for the second current.

[0068] Embodiment 22: Apparatus comprising a substrate and means for a multiline interface. The means for the multiline interface comprises means for receptive coupling and means for plug coupling. The means for plug coupling is configured to be coupled to the means for receptive coupling. The means for the multiline interface is configured to (i) provide a first electrical path for a first current and (ii) provide a second electrical path for a second current. The means for plug coupling and the means for receptive coupling are configured to provide electromagnetic interference (EMI) shielding for the first electrical path for the first current and for the second electrical path for the second current.

[0069] Embodiment 23: A device comprising a substrate and a multiline interface coupled to the substrate. The multiline interface includes a receptable and a plug configured to be coupled to the receptable. The receptable includes a first receptable metal component configured as part of a first electrical path for a first current, and a second receptable metal component configured as part of a second electrical path for a second current. The plug includes a first plug metal component configured to be coupled to the first receptable metal component, a second plug metal component configured to be coupled to the second receptable metal component, and a plug metal frame configured as a shield around the first and second plug metal components.

[0070] Various features of the Disclosure described herein can be implemented in various systems without departing from the Disclosure. It should be noted that the above-described aspects of the Disclosure are illustrative and should not be construed as limiting the Disclosure. The descriptions of the aspects of the Disclosure are intended to be illustrative and not to limit the claims. Therefore, the teachings can be readily applied to other types of devices, and many substitutions, modifications, and variations will be apparent to those skilled in the art. [Explanation of symbols]

[0071] 100 Interfaces 102 plug 102a First plug 102b Second plug 102c plug 102d plug 104 Receptable 104a First receptacle 104b Second receptacle 104c Receptable 104d Receptable 106 Cable 120 Metal Frame 120a Metal Frame 120b Metal frame 121 Chamber 122 First support component 123 The first area 124 Second support component 125 Second Domain 140 Metal Frame 140a Metal frame 140b Metal frame 142 First Metal Component 142a First metal component 142b First Metal Component 143 The first area 144 Second Metal Component 145 Second Domain 160 Cover 202 board 202a First board 202b Second board 210 Dielectric layer 212 Interconnection section 212a Interconnection section 212b Interconnection section 214 Metal layer 214a Metal layer 214b Metal layer 222 First Metal Component 222a First metal component 222b First metallic component 224 Second Metallic Component 242 Dielectric layer 245 First metal layer 247 Metal layer 800 Interface 822 First Metal Component 824 Second metallic component 842 First support component 844 Second support component 862 Metallic Grounding Components 864 Metallic Grounding Components 920 Protrusion 1200 Interface 1312 Interconnection section 1342 First interconnection 1344 Second interconnection 1412 Interconnection section 1414 Interconnection section 1442 First interconnection 1444 Second interconnection section 1700 devices 1702 Mobile phone devices, devices 1704 Laptop computer devices, devices 1706 Fixed-position terminal device, device 1708 Wearable devices, devices 1710 Automobile vehicles, vehicles

Claims

1. A device comprising a multi-line interface, wherein the multi-line interface is (i) Receptive, A first receptive metal component configured as part of a first electrical path for a first current, and A receptacle comprising a second receptable metal component configured as part of a second electrical path for a second current, (ii) A plug configured to be coupled to the receptacle, A first plug metal component configured to be coupled to the first receptable metal component, A second plug metal component configured to be coupled to the second receptable metal component, and A plug comprising a plug metal frame configured as a shield around the first plug metal component and the second plug metal component, A board coupled to the multi-line interface, wherein the board is At least one dielectric layer, A plurality of interconnecting parts, wherein the plurality of interconnecting parts are configured to be coupled to the first receptable metal component and the second receptable metal component, The system comprises a metal layer placed on the surface of at least one dielectric layer, The metal layer is configured to be bonded to the plug metal frame, The device wherein the metal layer is configured to be part of the shield.

2. The aforementioned multiline interface includes a multiline coaxial interface, or The multi-line interface is configured to provide the first electrical path for the first current passing through the receptacle and the plug, The device according to claim 1, wherein the multiline interface is configured to provide the second electrical path for the second current through the receptacle and the plug.

3. The receptable further comprises a receptive metal frame configured to be coupled to the plug metal frame, The plug metal frame is configured to surround the receptable metal frame, The device according to claim 1, wherein the plug metal frame is configured to be connected to ground.

4. The aforementioned plug is A first support component surrounding the first plug metal component, The device according to claim 3, further comprising a second support component surrounding the second plug metal component.

5. The aforementioned plug is A first metal grounding component configured to be coupled to the receptable metal frame, wherein the first metal grounding component is configured to be installed between the first support component and the receptable metal frame, The device according to claim 4, further comprising a second metal grounding component configured to be coupled to the receptable metal frame, the second metal grounding component configured to be installed between the second support component and the receptable metal frame.

6. The plug is connected to the board, or The device according to claim 1, wherein the receptacle is coupled to the board.

7. A cable connected to the multi-line interface, A second multiline interface coupled to the cable, the second multiline interface comprising a second receptacle and a second plug, the second plug configured to be coupled to the second receptacle, The device according to claim 1, further comprising a second board coupled to the second multi-line interface.

8. The device according to claim 7, wherein the multi-line interface and the second multi-line interface are part of the cable.

9. The second receptacle is, A third receptive metal component configured as part of the first electrical path for the first current, A fourth receptable metal component configured as part of the second electrical path for the second current, The device according to claim 7, comprising a second receptive metal frame configured as a shield around the third receptive metal component and the fourth receptive metal component of the second receptable.

10. The second plug is, A third plug metal component configured to be coupled to the third receptable metal component, A fourth plug metal component configured to be coupled to the fourth receptable metal component, The device according to claim 9, further comprising a second plug metal frame configured as a shield around the third plug metal component and the fourth plug metal component.

11. The receptacle is coupled to the board, The device according to claim 10, wherein the second receptacle is coupled to the second board.

12. The plug is connected to the board. The second plug is connected to the second board, or The receptacle is coupled to the board, The device according to claim 10, wherein the second plug is coupled to the second board.

13. The plug metal frame includes at least one protrusion, or The device according to claim 1, wherein the first current and / or the second current include millimeter-wave signals.

14. The first electrical path includes a plurality of first interconnections from the plurality of interconnections, which are installed in the at least one dielectric layer. The device according to claim 1, wherein the second electrical path includes a second plurality of interconnections from the plurality of interconnections, which are located within the at least one dielectric layer.

15. The device according to claim 1, wherein the device includes an electronic device selected from the group consisting of music players, video players, entertainment units, navigation devices, communication devices, mobile devices, mobile phones, smartphones, personal digital assistants, stationary terminals, tablet computers, computers, wearable devices, laptop computers, servers, Internet of Things (IoT) devices, and devices in an automated vehicle.

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