Exposure apparatus, exposure method, and method for manufacturing a flat panel display

Abstract

This exposure apparatus comprises an illumination optical system, a spatial light modulator that is illuminated by light from the illumination optical system, a projection optical system that irradiates an object to be exposed with light emitted from the spatial light modulator, and a stage on which the object to be exposed is mounted. The object to be exposed is scanned by the light with which the object to be exposed is irradiated by the projection optical system by the stage moving the object to be exposed in a predetermined scanning direction. The spatial light modulator is provided with a plurality of mirrors, the plurality of mirrors each rotate about a tilt axis extending in a direction orthogonal to both the optical axis direction of the projection optical system and the scanning direction, and the plurality of mirrors are each provided with an angle adjustment mechanism that emits light to the projection optical system by getting into an on-state by adjusting the inclination thereof with respect to the scanning direction, thereby adjusting the inclination angle with respect to the scanning direction of the spatial light modulator.

Description

Technical Field

[0001] The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing a flat panel display. This application claims priority based on Japanese Patent Application No. 2021-111806 filed on July 5, 2021, the content of which is incorporated herein by reference.

Background Art

[0002] Conventionally, as an exposure apparatus that irradiates a substrate with illumination light through an optical system, an exposure apparatus is known that uses a spatial light modulator to modulate light and passes the modulated light through a projection optical system, and forms an image by this light on a resist applied on the substrate for exposure (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect of the present invention, there is provided an exposure apparatus including an illumination optical system, a spatial light modulator illuminated by light from the illumination optical system, a projection optical system that irradiates light emitted from the spatial light modulator onto an exposure target, and a stage on which the exposure target is placed, wherein the stage moves the exposure target in a predetermined scanning direction, so that the light irradiated onto the exposure target by the projection optical system scans over the exposure target, the spatial light modulator includes a plurality of mirrors, each of the plurality of mirrors rotates about a tilt axis extending in a direction orthogonal to both the optical axis direction of the projection optical system and the scanning direction, and each of the plurality of mirrors adjusts its inclination with respect to the scanning direction to be in an on state, thereby emitting light to the projection optical system, and the exposure apparatus includes an angle adjustment mechanism for adjusting the tilt angle of the spatial light modulator with respect to the scanning direction.

[0005] According to a second aspect of the present invention, an exposure apparatus is provided comprising: an illumination optical system; a spatial light modulator illuminated by light from the illumination optical system; a projection optical system that irradiates an exposure target with light emitted from the spatial light modulator; and a stage on which the exposure target is placed, wherein the stage moves the exposure target in a predetermined scanning direction, causing the light irradiated onto the exposure target by the projection optical system to scan over the exposure target; the spatial light modulator comprises a plurality of mirrors, each of which rotates around a tilt axis extending in a direction perpendicular to both the optical axis direction of the projection optical system and the scanning direction; the plurality of mirrors adjust their respective inclinations with respect to the scanning direction to be turned on, thereby emitting light to the projection optical system; and the spatial light modulator is inclined with respect to the scanning direction.

[0006] A third aspect of the present invention provides an exposure method for exposing an exposure target using the exposure apparatus described above, comprising: a first step of tilting the spatial light modulator with respect to the scanning direction based on the difference between the target tilt angle of at least some of the mirrors and the actual tilt angle of at least some of the mirrors when at least some of the mirrors are rotated around the tilt axis in order to turn on at least some of the mirrors; and a second step of exposing the exposure target using the exposure apparatus after the first step.

[0007] A fourth aspect of the present invention provides a method for manufacturing a flat panel display, which includes exposing the object to be exposed by the exposure method described above, and developing the exposed object.

[0008] According to a fifth aspect of the present invention, an exposure apparatus is provided comprising: an illumination optical system; a spatial light modulator illuminated by light from the illumination optical system; a projection optical system that irradiates an exposure target with light emitted from the spatial light modulator; and a stage on which the exposure target is placed, wherein the illumination optical system and the spatial light modulator are arranged side by side in the scanning direction.

[0009] According to a sixth aspect of the present invention, an exposure apparatus is provided comprising: a stage for moving an exposure target in a scanning direction; a spatial light modulator; an illumination optical system for illuminating the spatial light modulator from the scanning direction; and a projection optical system for irradiating the exposure target with light reflected by a mirror of the spatial light modulator, wherein the mirror of the spatial light modulator is tilted with respect to the scanning direction. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows an overview of the external configuration of the exposure apparatus in this embodiment. [Figure 2] This diagram shows an overview of the configuration of the lighting module and projection module in this embodiment. [Figure 3] This diagram shows an overview of the configuration of the lighting module in this embodiment. [Figure 4] This figure shows an overview of the configuration of the optical modulation unit in the first example of this embodiment. [Figure 5] This diagram shows an overview of the configuration of the optical modulation unit in the first example of this embodiment, and shows the mirror in the center of the page in the ON state. [Figure 6] This diagram shows an overview of the configuration of the optical modulation unit in the first example of this embodiment, and shows the mirror in the center of the page in the OFF state. [Figure 7] This figure illustrates the distribution of light intensity when one row of mirrors in the spatial light modulator of this embodiment is turned on. [Figure 8] This figure illustrates the distribution of light intensity when all rows of mirrors in the spatial light modulator of this embodiment are turned on. [Figure 9] This figure illustrates the distribution of light intensity when multiple mirrors in the spatial light modulator of this embodiment are turned on in alternating rows in the scanning direction. [Figure 10] This diagram shows an overview of the configuration of the optical modulation unit in the second example of this embodiment, and shows the mirror in the center of the page in the ON state. [Figure 11] This diagram shows an overview of the configuration of the optical modulation unit in the second example of this embodiment, and shows the mirror in the center of the page in the OFF state. [Figure 12] A side view showing an outline of the configuration of the optical modulation unit of the second example of the present embodiment, showing the on state of the mirror at the center of the paper and the off state of the mirrors on both ends of the paper. [Figure 13] A diagram showing the relationship between the inclination of the spatial light modulator and the inclination of the image plane of the projection module in the present embodiment. [Figure 14] A functional block diagram showing an outline of the calibration device of the present embodiment. [Figure 15] A diagram for explaining an outline of the simulation. [Figure 16] A graph showing the result of the simulation when the spatial light modulator is not tilted. [Figure 17] A graph showing the result of the simulation when the spatial light modulator is tilted by an amount equivalent to the depth of focus (DOF). [Figure 18] A graph showing the result of the simulation when the spatial light modulator is tilted by 1.5 times the amount equivalent to the DOF. [Figure 19] A diagram showing a schematic configuration of an optical measurement unit provided in a calibration reference unit CU attached to an end of a substrate holder of an exposure apparatus. [Embodiments for Carrying Out the Invention]

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following detailed description of the present invention is merely exemplary and not restrictive. The same or similar reference numerals are used throughout the drawings and the following detailed description.

[0012] [Configuration of Exposure Apparatus] FIG. 1 is a diagram showing an overview of the external configuration of the exposure apparatus 1 of the present embodiment. The exposure apparatus 1 is an apparatus that irradiates a modulation light to an object to be exposed. In a specific embodiment, the exposure apparatus 1 is a step-and-scan type projection exposure apparatus, a so-called scanner, which uses a rectangular (square) glass substrate used for a liquid crystal display device (flat panel display) or the like as an object to be exposed. The glass substrate as the object to be exposed has a length of at least one side or a diagonal length of 500 mm or more, and may be a substrate for a flat panel display. The object to be exposed (for example, a substrate for a flat panel display) exposed by the exposure apparatus 1 is subjected to development and then used as a product. The apparatus main body of the exposure apparatus 1 is configured in the same manner as the apparatus main body disclosed in, for example, U.S. Patent Application Publication No. 2008 / 0030702. The exposure apparatus 1 exposes an exposure pattern determined based on the input recipe to the object to be exposed.

[0013] The exposure apparatus 1 includes a base 11, a vibration isolation table 12, a main column 13, a stage, 14 an optical table 15, an illumination module 16, a projection module 17 (projection optical system), a light source unit 18, an optical fiber 19, and a light modulation unit 20 (not shown in FIG. 1). Hereinafter, a three-dimensional orthogonal coordinate system will be used for explanation as needed, in which a direction parallel to the optical axis direction of the projection module 17 that irradiates the object to be exposed with the light modulated by the light modulation unit 20 is defined as the Z-axis direction, a direction of a predetermined plane orthogonal to the Z-axis is defined as the X-axis direction, and a direction of the Y-axis direction. The X-axis direction and the Y-axis direction are orthogonal (intersecting) to each other.

[0014] The base 11 is a base of the exposure apparatus 1 and is installed on the vibration isolation table 12. The base 11 supports the stage 14 on which the object to be exposed is placed so as to be movable in the X-axis direction and the Y-axis direction.

[0015] Stage 14 supports the object to be exposed and, in scanning exposure, is used to precisely position the object with respect to multiple partial images of the circuit pattern projected via the projection module 17. It drives the object to be exposed in six degrees of freedom directions (the X, Y, and Z axis directions and the rotational directions θx, θy, and θz directions relative to each axis). Stage 14 is moved in the X axis direction during scanning exposure and in the Y axis direction when changing the exposure area on the object to be exposed. Multiple exposure areas are formed on the object to be exposed. The exposure apparatus 1 is capable of exposing multiple exposure areas on a single object to be exposed. The configuration of Stage 14 is not particularly limited, but a so-called coarse-fine movement stage apparatus can be used, which includes a gantry-type two-dimensional coarse-movement stage and a fine-movement stage that is driven by the two-dimensional coarse-movement stage, as disclosed in U.S. Patent Application Publication No. 2012 / 0057140, etc. In this case, the coarse-movement stage allows the object to be exposed to move in three directions of freedom within the horizontal plane, and the fine-movement stage allows the object to be finely moved in six directions of freedom.

[0016] The main column 13 supports the optical base plate 15 at the top of the stage 14 (in the positive direction of the Z axis). The optical base plate 15 supports the illumination module 16, the projection module 17, and the light modulation unit 20.

[0017] Figure 2 shows an overview of the configuration of the lighting module 16, projection module 17, and light modulation unit 20 in this embodiment. The lighting module 16 is positioned on top of the optical base plate 15 and connected to the light source unit 18 via an optical fiber 19. In one example of this embodiment, the lighting module 16 includes a first lighting module 16A, a second lighting module 16B, a third lighting module 16C, and a fourth lighting module 16D. In the following description, when the first lighting module 16A to the fourth lighting module 16D are not distinguished, they will be collectively referred to as the lighting module 16. Each of the first to fourth illumination modules 16A to 16D guides the light emitted from the light source unit 18 via the fiber 19 to the first light modulation unit 20A, the second light modulation unit 20B, the third light modulation unit 20C, and the fourth light modulation unit 20D, respectively. Illumination module 16 illuminates the light modulation unit 20. The first illumination module 16A and the first light modulation unit 20A are arranged side by side in the scanning direction. The second illumination module 16B and the second light modulation unit 20B are arranged side by side in the scanning direction. The third illumination module 16C and the third light modulation unit 20C are arranged side by side in the scanning direction. The fourth illumination module 16D and the fourth light modulation unit 20D are arranged side by side in the scanning direction.

[0018] The light modulation unit 20, as will be described in more detail later, is controlled based on a circuit pattern to be transferred to the object to be exposed, and modulates the illumination light from the illumination module 16. The modulated light modulated by the light modulation unit 20 is guided to the projection module 17. The first light modulation unit 20A to the fourth light modulation unit 20D are arranged at different positions on the XY plane. In the following description, when the first light modulation unit 20A to the fourth light modulation unit 20D are not distinguished, they will be collectively referred to as the light modulation unit 20.

[0019] The projection module 17 is positioned below the optical platen 15 and irradiates the object to be exposed, placed on the stage 14, with modulated light modulated by the spatial light modulator 201. The projection module 17 images the light modulated by the light modulation unit 20 onto the object to be exposed, thereby exposing the object. In other words, the projection module 17 projects the pattern on the light modulation unit 20 onto the object to be exposed. A plane containing the optical axis of the illumination light illuminating the light modulation unit 20 and the optical axis of the projection module 17 is provided parallel to the scanning direction (X-axis direction). In one example of this embodiment, the projection module 17 includes the first projection modules 17A to 4th projection modules 17D, which correspond to the first illumination modules 16A to 4th illumination modules 16D and the first light modulation units 20A to 4th light modulation units 20D described above. In the following description, when the first projection modules 17A to 4th projection modules 17D are not distinguished, they are collectively referred to as the projection module 17.

[0020] The unit comprising the first illumination module 16A, the first light modulation unit 20A, and the first projection module 17A is called the first exposure module. Similarly, the unit comprising the second illumination module 16B, the second light modulation unit 20B, and the second projection module 17B is called the second exposure module. Each exposure module is positioned at different locations on the XY plane, and can expose patterns at different locations on the object to be exposed placed on the stage 14. By moving the stage 14 relative to the exposure modules in the X-axis direction, which is the scanning direction, the entire surface of the object to be exposed or the entire area of ​​the object to be exposed can be scanned and exposed.

[0021] The lighting module 16 is also referred to as the lighting system. The lighting module 16 (lighting system) illuminates the spatial light modulator 201 (spatial light modulation element) of the light modulation unit 20, which will be described later. The projection module 17 is also called the projection unit. The projection module 17 (projection unit) may be a 1:1 magnification system that projects the image of the pattern on the light modulation unit 20 at 1:1 magnification, or it may be an enlargement system or a reduction system. Furthermore, it is preferable that the projection module 17 is composed of one or two types of glass materials (particularly quartz or fluorite).

[0022] As shown in Figure 1, the light source unit 18 is provided in a pair (light source unit 18R, light source unit 18L). The light source unit 18 can be a light source unit that uses a highly coherent laser as the light source, a light source unit that uses a light source such as a semiconductor laser type UV-LD, or a light source unit that uses a lens relay type retarder. The light source 18a provided in the light source unit 18 can be a lamp or laser diode that emits wavelengths such as 405 nm or 365 nm.

[0023] In addition to the parts described above, the exposure apparatus 1 is equipped with a position measuring unit (not shown) consisting of an interferometer and an encoder, which measures the relative position of the stage 14 with respect to the optical table 15. In addition to the parts described above, the exposure apparatus 1 includes an AF (Auto Focus) unit (not shown) that measures the position of the stage 14 or the object to be exposed on the stage 14 in the Z-axis direction. Furthermore, the exposure apparatus 1 includes an alignment unit (not shown) that measures the relative positions of each pattern when superimposing another pattern onto a pattern already exposed on the object to be exposed. The AF unit and / or the alignment unit may be configured as a TTL (Through the lens) unit that measures via the projection module 17.

[0024] Figure 3 shows an overview of the configuration of the exposure module in this embodiment. Using the first exposure module as an example, a specific example of the configuration of the illumination module 16, the light modulation unit 20, and the projection module 17 will be described.

[0025] The lighting module 16 includes a module shutter 161 and an illumination optical system 162. The module shutter 161 switches whether or not to guide the pulsed light supplied from the optical fiber 19 to the illumination optical system 162.

[0026] The illumination optical system 162 illuminates the optical modulation unit 20 almost uniformly by emitting pulsed light supplied from the optical fiber 19 to the optical modulation unit 20 via a collimator lens, a fly-eye lens, a condenser lens, and the like. The fly-eye lens wavefront-splits the pulsed light incident on it, and the condenser lens superimposes the wavefront-split light onto the optical modulation unit. The illumination optical system 162 may also include a rod integrator instead of a fly-eye lens. The illumination optical system 162 and the optical modulation unit 20 are arranged side by side in the scanning direction.

[0027] The light modulation unit 20 includes a mask. The mask is a spatial light modulator (SLM).

[0028] The light modulation unit 20 comprises a spatial light modulator 201 and an off-light absorbing plate 202. The spatial light modulator 201 is a digital mirror device (digital micromirror device, DMD). The spatial light modulator 201 can modulate illumination light spatially and temporally.

[0029] Figure 4 is a diagram illustrating the configuration of the spatial light modulator 201 of this embodiment. In this figure, a three-dimensional Cartesian coordinate system of the Xm axis, Ym axis, and Zm axis will be used for explanation. The spatial light modulator 201 comprises a plurality of micromirrors 203 (mirrors) arranged in the XmYm plane. The micromirrors 203 constitute the elements (pixels) of the spatial light modulator 201. The tilt angle of the spatial light modulator 201 can be changed around the Xm axis and around the Ym axis, respectively. The spatial light modulator 201 is turned on by tilting around the Ym axis, for example, as shown in Figure 5, and turned off by tilting around the Xm axis, as shown in Figure 6.

[0030] The spatial light modulator 201 controls the direction in which incident light is reflected for each element by switching the tilt direction of each micromirror 203. For example, the digital micromirror device of the spatial light modulator 201 has a pixel count of about 4 megapixels and can switch the on and off states of the micromirrors 203 with a period of about 10 kHz. The spatial light modulator 201 has multiple elements that are individually controlled at predetermined time intervals. If the spatial light modulator 201 is a DMD, the elements are micromirrors 203, and the predetermined time interval is the period during which the on and off states of the micromirrors 203 are switched (for example, a period of 10 kHz).

[0031] Returning to Figure 3, the off-light absorbing plate 202 absorbs the light (off-light) emitted (reflected) from the elements of the spatial light modulator 201 that are in the off state. The light emitted from the elements of the spatial light modulator 201 that are in the on state is guided to the projection module 17.

[0032] The projection module 17 projects light emitted from the element of the spatial light modulator 201 that is turned on onto the object to be exposed. The projection module 17 includes a magnification adjustment unit 171 and a focus adjustment unit 172. Modulated light (modulated light) from the spatial light modulator 201 is incident on the magnification adjustment unit 171. The magnification adjustment unit 171 adjusts the magnification of the image at the focal plane 163 of the modulated light emitted from the spatial light modulator 201, that is, on the surface of the object being exposed, by driving some of the lenses in the optical axis direction. The focus adjustment unit 172 drives the entire lens group in the optical axis direction to adjust the imaging position, or focus, so that the modulated light emitted from the spatial light modulator 201 is imaged on the surface of the object to be exposed, as measured by the AF unit described above. The projection module 17 projects only the image of light emitted from the ON-state elements of the spatial light modulator 201 onto the surface of the object to be exposed. Therefore, the projection module 17 can project an image of the pattern formed by the ON-state elements of the spatial light modulator 201 onto the surface of the object to be exposed. In other words, the projection module 17 can form spatially modulated light on the surface of the object to be exposed. Furthermore, as mentioned above, the spatial light modulator 201 can switch the ON and OFF states of the micromirror 203 at a predetermined period (frequency), so the projection module 17 can form temporally modulated light on the surface of the object to be exposed. In other words, the exposure device 1 performs exposure by changing the actual state of the pupil at any exposure position.

[0033] [Tilt of micromirrors in a spatial light modulator] Figures 7 to 9 illustrate the relationship between the state of the spatial light modulator 201 and the distribution of light intensity. Each of these figures includes three sections: an upper, middle, and lower section. The upper section of each figure shows the position of the micromirror 203 that is in the ON state of the spatial light modulator 201. The middle and lower sections of each figure show the distribution of light intensity on the image plane. The positions of these upper, middle, and lower sections are adjusted in the left-right direction of the paper with respect to the optical axis of the projection module 17.

[0034] As in this embodiment, a spatial light modulator 201 in which each micromirror 203, such as a DMD, is tilted is treated as a blazed diffraction grating. As shown in the upper part of Figure 7, when only one row of micromirrors 203 of the DMD is turned on, the spatial light modulator 201 reflects light in the same way as if it were a single mirror. In this case, the light intensity is sinc, as shown in the middle and lower parts of Figure 7. 2 This is determined by the function. 2 The function's peak position is determined by the specular reflection of light, which is determined by the tilt angle of the micromirror 203.

[0035] On the other hand, as shown in the upper part of Figure 8, when all the micromirrors 203 of the DMD are turned on, or as shown in the upper part of Figure 9, when the micromirrors 203 are turned on one row at a time in the DMD (i.e., a pattern like L / S (line and space)), the light intensity becomes discrete, as shown in the middle and lower parts of Figure 8 and the middle and lower parts of Figure 9, respectively. The light intensity of the diffracted light generated at this time is locally increased at the diffraction angle determined by the pitch p of the micromirrors 203. The distribution of the discrete diffracted light intensity shown in Figures 8 and 9 is determined based on the specularly reflected zero-order light and the pitch p of the micromirrors 203.

[0036] Here, the light intensity of the diffraction light is shown in sinc 2 The peak position of the function depends on the tilt angle of the micromirrors 203. If the tilt of each micromirror 203 is shifted by δ relative to the target angle, the reflected light will be incident on the projection module 17 with a shift of 2δ relative to the target angle. Thus, if each micromirror 203 of the spatial light modulator 201 has a tilt error, one possible way to compensate for this error is to tilt the illumination module 16 (incident light). However, if the tilt error of the micromirrors 203 is large, the range in which the illumination system can be adjusted becomes finite. Therefore, in some cases, problems may occur, such as the components of multiple illumination modules 16 interfering with each other and becoming misaligned. To overcome these inconveniences, in this embodiment, the micromirror 203 itself is tilted in the X-axis direction, which is the scanning direction, and the spatial light modulator 201 itself is also tilted in the scanning direction. The tilt error of the micromirror 203 can be measured, for example, by shining light on one mirror and observing the angle of the reflected light before mounting it in the exposure apparatus 1.

[0037] [Configuration of the optical modulation section] To realize the configuration according to this embodiment as described above, in the first example of the spatial light modulator 201A shown in Figures 4 to 6, the Xm axis is approximately parallel to the X axis, and the Ym axis is approximately parallel to the Y axis. As a result, the ON-state micromirror 203 (micromirror 203 tilted around the Ym axis) is tilted with respect to the X-axis direction, which is the scanning direction. Note that the Xm axis being approximately parallel to the X axis includes the case where the Xm axis is rotated by approximately ±5 degrees around the Zm axis with respect to the X axis. Similarly, the Ym axis being approximately parallel to the Y axis includes the case where the Ym axis is rotated by approximately ±5 degrees around the Zm axis with respect to the Y axis. With such an arrangement, the resolution of the spatial light modulator 201A can be increased. However, the Xm axis may be perfectly parallel to the X axis, and the Ym axis may also be perfectly parallel to the Y axis.

[0038] Hereafter, the Ym axis will also be referred to as the first tilt axis T1. In the first example of the spatial light modulator 201A, multiple micromirrors 203 each rotate around the first tilt axis T1 (Ym axis), and the multiple micromirrors 203 adjust their tilt relative to the scanning direction to turn on, thereby emitting light to the projection module 17. In this first example of the spatial light modulator 201A, multiple micromirrors 203 are arranged linearly in the scanning direction, and multiple micromirrors 203 are also arranged in the direction of the first tilt axis T1.

[0039] On the other hand, instead of the first example spatial light modulator 201A shown in Figures 4 to 6, the second example spatial light modulator 201B shown in Figures 10 to 12 can also be used as the spatial light modulator 201. In the second example, the spatial light modulator 201B, the micromirror 203 is rotatable around a first tilt axis T1 that extends diagonally across the micromirror 203. When the micromirror 203 rotates to the first side (e.g., the + side) around the first tilt axis T1, the micromirror 203 is turned on. When the micromirror 203 rotates to the second side (e.g., the - side) around the first tilt axis T1, the micromirror 203 is turned off.

[0040] In this case, because the first tilt axis T1 is approximately parallel to the Y axis, the ON-state micromirror 203 (the micromirror 203 tilted around the first tilt axis T1) is tilted with respect to the X axis direction, which is the scanning direction. Note that the first tilt axis T1 being approximately parallel to the Y axis includes the case where the first tilt axis T1 is rotated by approximately ±5 degrees around the Z axis with respect to the Y axis. With this arrangement, the resolution of the spatial light modulator 201B can be increased. However, the first tilt axis T1 may also be perfectly parallel to the Y axis. In the second example of the spatial light modulator 201B described above, multiple micromirrors 203 each rotate around the first tilt axis T1, and the multiple micromirrors 203 adjust their inclination relative to the scanning direction to become ON, thereby emitting light to the projection module 17. Moreover, in this case, the ON state and OFF state can be switched by the rotation of each of the multiple micromirrors 203 around the first tilt axis T1.

[0041] In this second example of the spatial light modulator 201B, multiple micro-mirrors are arranged linearly in two directions, each tilted 45° with respect to both the scanning direction and the first tilt axis T1 direction. In other words, the micro-mirrors 203 of the second example of the spatial light modulator 201B are positioned rotated approximately 45° around the Z-axis relative to the micro-mirrors 203 of the first example of the spatial light modulator 201A. It can also be said that in the second example of the spatial light modulator 201B, multiple micro-mirrors 203 are arranged in the scanning direction. In the following, when the spatial light modulator 201A of the first example and the spatial light modulator 201B of the second example are not distinguished, they will be collectively referred to as spatial light modulator 201.

[0042] In this embodiment, as shown in Figure 3, the light modulation unit 20 further includes an angle adjustment mechanism 204. As shown in Figure 13, The angle adjustment mechanism 204 adjusts the tilt angle Δ of the spatial light modulator 201 with respect to the scanning direction. For example, the angle adjustment mechanism 204 may have the following configuration: The angle adjustment mechanism 204 includes a stage 14 for the spatial light modulator 201 (not shown), and the stage 14 for the spatial light modulator 201 supports the spatial light modulator 201 so that it can rotate around a second tilt axis T2. The second tilt axis T2 extends in the Y-axis direction (direction of the first tilt axis T1). The stage 14 for the spatial light modulator 201 may, for example, support the spatial light modulator 201 so that it can move around the X-axis, Y-axis, and Z-axis (θZ direction).

[0043] As shown in Figure 13, the spatial light modulator 201 is tilted with respect to the scanning direction. The spatial light modulator 201 is tilted with respect to the XY plane. In a side view of the exposure apparatus 1, viewed from the Y-axis direction (direction of the first tilt axis T1), the spatial light modulator 201 is tilted with respect to the scanning direction.

[0044] [Calibration of spatial light modulators] As shown in Figure 14, in this embodiment, the optical modulation unit 20 further includes a calibration device 50. The calibration device 50 calibrates the tilt angle Δ of the spatial optical modulator 201. The calibration device 50 comprises a device body 60 and a sensor 70. The main body of the apparatus 60 is implemented by, for example, a personal computer, a server, or an industrial computer. The main body of the apparatus 60 may also be used as the control device for the exposure apparatus 1, which controls the entire exposure apparatus 1.

[0045] The main unit 60 of the device comprises a processor such as a CPU (Central Processing Unit) connected by a bus, and memory, and executes programs. Through program execution, the main unit 60 functions as a device comprising a control unit 61, a communication unit 62, an input unit 63, and a storage unit 64.

[0046] More specifically, the main unit 60 of the device reads a program stored in the memory unit 64 by the processor and stores the read program in memory. By the processor executing the program stored in memory, the main unit 60 of the device functions as a device comprising a control unit 61, a communication unit 62, an input unit 63, and a memory unit 64.

[0047] The control unit 61 controls the operation of the spatial light modulator 201 and the angle adjustment mechanism 204. The control unit 61 is composed of, for example, a processor and memory. The control unit 61 functions as a first control unit 65, a calculation unit 66, and a second control unit 67. The first control unit 65 controls the operation of the spatial light modulator 201. The first control unit 65 transmits an operation variable to the micromirror 203 to tilt the micromirror 203 to set it to a target angle. The target angle is the target tilt angle of the micromirror 203 when the micromirror 203 is turned on. The number of micromirrors 203 controlled by the first control unit 65 may be a part of a plurality of micromirrors 203, or it may be all of a plurality of micromirrors 203.

[0048] The calculation unit 66 calculates the difference between the target angle of the micromirror 203 and the actual tilt angle of the micromirror 203. The actual tilt angle of the micromirror 203 is the actual tilt angle of the micromirror 203 when it is turned on. The actual tilt angle of the micromirror 203 is detected by the sensor 70. The second control unit 67 controls the operation of the angle adjustment mechanism 204. The second control unit 67 controls the operation of the angle adjustment mechanism 204 based on the difference calculated by the calculation unit 66. The second control unit 67 controls the angle adjustment mechanism 204 to tilt the spatial light modulator 201 in order to correct the deviation (error) of the actual tilt angle of the micromirror 203 from the target angle.

[0049] Furthermore, when the first control unit 65 controls multiple micromirrors 203, the calculation unit 66 can calculate the difference for each micromirror 203. On the other hand, since the angle adjustment mechanism 204 tilts the entire spatial light modulator 201, only one operation amount needs to be transmitted from the second control unit 67 to the angle adjustment mechanism 204. Therefore, when the first control unit 65 controls multiple micromirrors 203, the second control unit 67 can control the angle adjustment mechanism 204 using a representative value of the multiple differences calculated by the calculation unit 66. The representative value may be, for example, the average value of the multiple differences, or the median value of the multiple differences.

[0050] The communication unit 62 includes a communication interface for connecting the main unit 60 to an external device. The communication unit 62 communicates with the external device via wired or wireless means. The external device is, for example, a spatial light modulator 201, an angle adjustment mechanism 204, and a sensor 70. The input unit 63 includes input devices such as a mouse, keyboard, and touch panel. The input unit 63 may be configured as an interface for connecting these input devices to the main unit 60 of the device. The input unit 63 receives various types of information input to the main unit 60 of the device. For example, the input unit 63 receives an instruction from the operator to start calibration.

[0051] The storage unit 64 is configured using a computer-readable storage medium device such as a magnetic hard disk drive or a semiconductor storage device. The storage unit 64 stores various information related to the calibration device 50. The storage unit 64 stores information input via, for example, the communication unit 62 or the input unit 63. The storage unit 64 stores various information generated by, for example, the execution of processing by the control unit 61. The storage unit 64 stores, for example, the detection results detected by the sensor 70. The storage unit 64 stores, for example, the target angle of the micromirror 203 when the micromirror 203 is turned on.

[0052] Sensor 70 detects the tilt angle of the micromirror 203. Sensor 70 detects the tilt angle of the micromirror 203 controlled by the first control unit 65. A known configuration can be used for sensor 70.

[0053] The calibration device 50 described above performs calibration of the object to be exposed before exposure. During calibration, for example, first, the input unit 63 receives input from the operator to start calibration. Then, the first control unit 65 sends an operation amount to the micromirror 203 to tilt it to the target angle. At this time, the sensor 70 detects the actual tilt angle of the micromirror 203. Then, the calculation unit 66 calculates the difference between the target angle of the micromirror 203 and the actual tilt angle of the micromirror 203 based on the target angle stored in the storage unit 64 and the detection result of the sensor 70. The second control unit 67 controls the angle adjustment mechanism 204 based on the difference calculated by the calculation unit 66.

[0054] Furthermore, all or part of the functions of the calibration device 50 may be implemented using hardware such as ASICs (Application Specific Integrated Circuits), PLDs (Programmable Logic Devices), or FPGAs (Field Programmable Gate Arrays). The program may be recorded on a computer-readable recording medium. Computer-readable recording media include, for example, portable media such as flexible disks, magneto-optical disks, ROMs, and CD-ROMs, and storage devices such as hard disks built into computer systems. The program may also be transmitted via a telecommunications line. However, some or all of the above calibration device 50 may be omitted. For example, the operator of the exposure device 1 can also calibrate the tilt angle Δ of the spatial light modulator 201.

[0055] In the exposure method using the exposure apparatus 1 described above, calibration (first step) is performed, and then the object to be exposed is exposed using the exposure apparatus 1 (second step). It is preferable to perform calibration again after performing multiple exposures. Calibration may also be performed periodically after a certain number of exposures. Calibration may also be performed periodically after a certain amount of time has elapsed. This ensures that even if the micromirror 203 undergoes aging and the difference (error) between the actual tilt angle of the micromirror 203 and the target angle changes, that difference is appropriately corrected.

[0056] As shown in Figure 13, the spatial light modulator 201, which is tilted in the scanning direction, forms an image such that it satisfies equation (1) below, due to the so-called Scheinproof relationship. tanΔ' = β·tanΔ … (1) Δ: Tilt angle of spatial light modulator 201 β: Magnification of projection module 17 Δ': tilt angle of the image plane

[0057] In other words, the image plane is tilted in the scanning direction. In this case, the image plane of the projection module 17 is tilted with respect to the scanning direction so as to include the best focus on the surface of the object to be exposed parallel to the scanning direction. When the image plane is tilted in this way, a portion of the image plane becomes defocused on the surface of the object to be exposed. However, this tilt of the image plane is not tilted in the Y-axis direction, for example, but tilted in the scanning direction (X-axis direction). Therefore, the image is averaged across the exposure width by scanning exposure, and the effect of defocusing is mitigated.

[0058] In this embodiment, the exposure apparatus 1 comprises multiple exposure modules. In this embodiment, each of these multiple exposure modules is equipped with the angle adjustment mechanism 204 and calibration device 50 described above. In this case, it is preferable that the tilt angle Δ of the spatial light modulator 201 in each exposure module is adjusted so that the average position of the image planes in the scanning direction of the multiple projection modules 17 is approximately the same. Furthermore, one projection module 17 (for example, the first projection module 17A) and another projection module 17 (for example, the second projection module 17B) may perform sequential exposure. In addition, one projection module 17 itself may perform sequential exposure by scanning exposure with a different position in the Y-axis direction. By taking an average image plane in the scanning direction in this way, abrupt contrast changes can be suppressed, and the contrast change in the sequential exposure area can also be made smoother.

[0059] The exposure apparatus 1 may also be capable of adjusting the tilt angle of the spatial light modulator 201 for each exposure pattern. In the exposure method described above, the tilt angle of the spatial light modulator 201 may be adjusted for each exposure pattern. Such adjustment of the tilt angle may be performed, for example, by the calibration device 50 controlling the angle adjustment mechanism 204, or by the control device of the exposure apparatus 1, which controls the entire exposure apparatus 1, controlling the angle adjustment mechanism 204. This makes it possible to correct so-called telecentric misalignment. Figures 7, 8, and 9 show sinc 2The description mentions the case where the comb-shaped functions, which are discretely generated at the vertices of the function, coincide due to the diffraction pitch. However, if an angular shift (error) actually occurs in the micromirror 203, that angular shift must be accounted for by sinc. 2 The position of the function's vertex and the position of the comb function are misaligned. This misalignment causes telecentral shift. The angle adjustment mechanism 204 adjusts the tilt angle to compensate for this shift. Furthermore, since the direction of the diffracted light emitted from the spatial light modulator 201 differs for each recipe (each exposure pattern), the amount of shift also changes for each exposure pattern. In other words, there is a difference in the amount of shift between the angular shift that occurs with an isolated mirror as shown in Figure 7 and the angular shift that occurs with L / S as shown in Figure 9. As the amount of shift differs depending on the exposure pattern, it is preferable for the exposure apparatus 1 to change the amount of adjustment of the tilt angle of the spatial light modulator 201 for each pattern. In other words, it is preferable to set and adjust the tilt angle of the spatial light modulator 201 for each recipe in order to compensate for telecentral shift for important exposure patterns.

[0060] [simulation] Figures 16 to 18 show the results of a simulation regarding the relationship between the tilt of the spatial light modulator 201 and the optical spatial image.

[0061] Figures 16 to 18 show the simulation results for three cases: (1) when the spatial light modulator 201 is not tilted, (2) when the spatial light modulator 201 is tilted so that the image plane is tilted by an amount equivalent to the depth of focus (DOF) of the projection module 17, as shown in Figure 15, and (3) when the spatial light modulator 201 is tilted so that the image plane is tilted by an amount equivalent to 1.5 times the DOF. Furthermore, the simulation shows that in each of the above cases (1) to (3), defocusing <1> 0, <2> equivalent to DOF, <3> The study was conducted for three cases where the DOF was equivalent to 1.5 times. In other words, the simulation was conducted for a total of nine cases.

[0062] The simulation assumptions are as follows: • Numerical aperture of projection module 17: NA = 0.243 Numerical aperture of illumination optical system 162 / Numerical aperture of projection module 17: σ = 0.7 • Wavelength of light: λ = 405 nm • Line and space pattern: 1 μmL / S (k=0.6) • Size (side length) of each micromirror 203 in the spatial light modulator 201: 5 μm • Exposure width in the scanning direction: 10mm • Projection magnification of projection module 17: 1 / 5 • Depth of focus of projection module 17: DOF = ±3.43 μm

[0063] In the case of (2) above, if the size of the micromirror 203, optical magnification, etc. are as described in the above preconditions, the simulation on the DMD will be equivalent to an inclination angle of approximately 1 degree. In this case, the inclination angle Δ' of the image plane will be 3.43 mrad, and the inclination angle Δ of the spatial light modulator 201 will be 17.15 mrad, which is five times the inclination angle Δ' of the image plane. 17.15 mrad is approximately 0.98°.

[0064] Figure 16 shows the results of (1) above. Figure 17 shows the results of (2) above. Figure 18 shows the results of (3) above. In each graph, if the defocus is different (as above) <1> ~ <3> Each case) is shown with a solid line ( <1> ), dashed line ( <2> ), dash-dotted line ( <3> It is represented as ).

[0065] These results show that imaging can be achieved without a decrease in contrast even with defocusing equivalent to or greater than DOF. Furthermore, it can be seen that the image change becomes significantly smaller as the tilt angle Δ of the spatial light modulator 201 increases. In general, when forming a large image using scan exposure, splicing exposure often results in noticeable unevenness if the contrast change in the image at the splicing point is large. In contrast, the exposure apparatus 1 according to this embodiment can reduce the contrast change in the image when performing splicing exposure with multiple exposure modules or when performing splicing exposure with a single exposure module, compared to normal exposure. Therefore, it offers a significant advantage in reducing the aforementioned unevenness.

[0066] Furthermore, all disclosures of the published U.S. patent applications and U.S. patent specifications relating to the exposure apparatus and the like cited in the above embodiments are incorporated herein by reference as part of this specification.

[0067] As described above, the illumination apparatus and exposure apparatus of the present invention are suitable for irradiating an object with illumination light and exposing it in the lithography process. Furthermore, the flat panel display manufacturing method of the present invention is suitable for the production of flat panel displays.

[0068] The sensor 70 may be, for example, an illuminance sensor. In such a configuration, there may be a pinhole above the illuminance sensor. When the micromirror 203 is at the correct angle, the illuminance will be at a normal value. However, if the tilt angle of the micromirror 203 is off, some of the reflected light from the micromirror 203 will be blocked by the pinhole (not pass through the pinhole), and the detected illuminance will decrease. From this decrease, the difference between the target angle of the micromirror 203 and the actual tilt angle can be calculated. When such an illuminance sensor is used as the sensor 70, the installation location for the sensor 70 may be, for example, the stage 14.

[0069] Figure 19 shows a schematic configuration of the optical measurement unit provided in the calibration reference unit CU attached to the end of the substrate holder of the exposure apparatus 1. In Figure 19, it is assumed that the reflected light (imaging beam) Sa from the spatial light modulator 201 is imaged onto the best focus surface (best imaging surface) IPo through the lens groups G4 and G5 on the image plane side of the projection unit PLU (17), and that the principal ray La of the reflected light Sa is parallel to the optical axis AXa. The first optical measurement unit consists of a quartz plate 320 attached to the upper surface of the calibration reference unit CU, an imaging system 322 (objective lens 322a and lens group 322b) that magnifies and images the pattern image from the spatial light modulator 201 projected from the projection unit PLU via the quartz plate 320, a reflective mirror 324, and an image sensor 326 made of CCDD or CMOS that captures the magnified pattern image. The surface of the quartz plate 320 and the imaging surface of the image sensor 326 are conjugate.

[0070] The second optical measurement unit consists of a pinhole plate 340 attached to the upper surface of the calibration reference unit CU, an objective lens 342 that receives reflected light (imaging beam) Sa from the spatial light modulator 201 projected from the projection unit PLU through the pinhole plate 340 to form an image of the pupil Ep of the projection unit PLU (intensity distribution of the imaging beam and light source image within the pupil Ep), and an image sensor 344 made of CCDD or CMOS that captures the image of the pupil Ep. In other words, the imaging surface of the image sensor 344 of the second optical measurement unit is conjugate to the position of the pupil Ep of the projection unit PLU.

[0071] Since the substrate holder (calibration reference unit CU) can be moved in two dimensions within the XY plane by the stage 14, the quartz plate 320 of the first optical measurement unit or the pinhole plate 340 of the second optical measurement unit is placed directly beneath one of the projection units PLU to be measured, and the spatial light modulator 201 generates reflected light Sa corresponding to various test patterns for measurement. In the measurement by the first optical measurement unit, the substrate holder (calibration reference unit CU) or the entire projection unit PLU or lens groups G4, G5 is moved up and down so that the surface of the quartz plate 320 is defocused by a certain amount in both the +Z and -Z directions relative to the best focus plane IPo.

[0072] Then, based on the amount of lateral displacement of the test pattern image captured by the image sensor 326 during +Z direction defocus and -Z direction defocus, and the amount of defocus (±Z fine movement range), the difference between the target angle and the actual tilt angle of the micromirror 203 can be calculated. Since the image sensor 326 of the first optical measurement unit is imaging the mirror surface of the spatial light modulator 201 via the projection unit PLU, it can also be used to identify a malfunctioning micromirror 203 among the many micromirrors 203 of the spatial light modulator 201. Furthermore, in the measurement by the second optical measurement unit, the eccentricity of the intensity distribution of the imaging light beam (Sa) formed in the pupil Ep of the projection unit PLU during projection of the test pattern is measured by the image sensor 344. In this case, the difference between the target angle and the actual tilt angle of the micromirror 203 can be calculated based on the amount of eccentricity of the intensity distribution in the pupil Ep and the focal length on the image plane side of the projection unit PLU. In addition, by turning on only a specific single micromirror 203 out of the many micromirrors 203 of the spatial light modulator 201, the positional relationship between the centroid of the intensity distribution formed in the pupil Ep and the optical axis AXa is measured by the image sensor 344 of the second optical measurement unit. If there is a deviation in this positional relationship, it can be seen that the tilt angle θd of the specific turned-on micromirror 203a has an error from the standard value (e.g., 17.5°). Although it takes time to measure, by turning on each of the micromirrors 203 of the spatial light modulator 201 one by one and measuring with the image sensor 344, it is possible to determine the error (driving error) of the tilt angle θd of each micromirror 203.

[0073] Although one embodiment of this invention has been described in detail above with reference to the drawings, the specific configuration is not limited to that described above, and various design changes can be made without departing from the spirit of this invention.

[0074] In one embodiment, the exposure apparatus (1) includes an illumination optical system (16, 162), a spatial light modulator (201) illuminated by light from the illumination optical system (16, 162), a projection optical system (17) that irradiates the object to be exposed with light emitted from the spatial light modulator (201), and a stage (14) on which the object to be exposed is placed. As the stage (14) moves the object to be exposed in a predetermined scanning direction, the light irradiated onto the object by the projection optical system (17) scans over the object to be exposed. The spatial light modulator (201) includes a plurality of mirrors (203). Each of the plurality of mirrors (203) rotates around a tilt axis extending in a direction perpendicular to both the optical axis direction and the scanning direction of the projection optical system (17). The plurality of mirrors (203) adjust their respective inclinations with respect to the scanning direction to be turned on, thereby emitting light to the projection optical system (17). The system also includes an angle adjustment mechanism (204) that adjusts the inclination angle of the spatial light modulator (201) with respect to the scanning direction.

[0075] In one example, the exposure apparatus (1) further includes a calibration apparatus (50) for calibrating the tilt angle of the spatial light modulator (201). The calibration apparatus (50) includes a storage unit (64) that stores the target angles of at least some of the mirrors when at least some of the mirrors among the plurality of mirrors (203) are turned on; a first control unit (65) that transmits an operation amount to the at least some of the mirrors to tilt them to the target angle; a sensor (70) that detects the tilt angle of the at least some of the mirrors; a calculation unit (66) that calculates the difference between the target angle of the at least some of the mirrors and the actual tilt angle of the at least some of the mirrors based on the target angle stored in the storage unit (64) and the detection result of the sensor; and a second control unit (67) that controls the angle adjustment mechanism (204) based on the difference calculated by the calculation unit (66).

[0076] In one embodiment, the exposure apparatus (1) includes an illumination optical system (16, 162), a spatial light modulator (201) illuminated by light from the illumination optical system (16, 162), a projection optical system (17) that irradiates an exposure target with light emitted from the spatial light modulator (201), and a stage (14) on which the exposure target is placed. The stage (14) moves the exposure target in a predetermined scanning direction, causing the light irradiated onto the exposure target by the projection optical system (17) to scan over the exposure target. The spatial light modulator (201) includes a plurality of mirrors (203). Each of the plurality of mirrors (203) rotates about a tilt axis extending in a direction perpendicular to both the optical axis direction and the scanning direction of the projection optical system (17), and the plurality of mirrors (203) adjust their respective inclinations with respect to the scanning direction to turn on, thereby emitting light to the projection optical system (17). The spatial light modulator (201) is tilted with respect to the scanning direction.

[0077] In one example, the image plane of the projection optical system (17) is tilted with respect to the scanning direction so as to include the best focus on the surface of the object to be exposed.

[0078] In one example, the tilt angle of the spatial light modulator (201) can be adjusted for each exposure recipe.

[0079] In one embodiment, the exposure method involves exposing the object to be exposed using the exposure apparatus (1) described above. The exposure method includes a first step of tilting the spatial light modulator (201) with respect to the scanning direction based on the difference between the target tilt angle of at least some of the mirrors and the actual tilt angle of at least some of the mirrors when at least some of the mirrors are rotated around the tilt axis in order to turn on at least some of the mirrors among the plurality of mirrors (203); and a second step of exposing the object to be exposed using the exposure apparatus (1) after the first step.

[0080] In one example, the second step is performed multiple times, and then the first step is performed again.

[0081] In one embodiment, a method for manufacturing a flat panel display includes exposing the object to be exposed by the exposure method described above, and developing the exposed object.

[0082] In one embodiment, the exposure apparatus (1) exposes the object to be exposed while moving the object to be exposed in the scanning direction. The exposure apparatus (1) includes an illumination optical system (16, 162), a spatial light modulator (201) illuminated by light from the illumination optical system (16, 162), a projection optical system (17) that irradiates the object to be exposed with light emitted from the spatial light modulator (201), and a stage (14) on which the object to be exposed is placed and which moves in the scanning direction. The illumination optical system (16, 162) and the spatial light modulator (201) are arranged side by side in the scanning direction.

[0083] In one embodiment, the exposure apparatus (1) includes a stage (14) for moving the object to be exposed in the scanning direction, a spatial light modulator (201), an illumination optical system (16, 162) for illuminating the spatial light modulator (201), and a projection optical system (17) for irradiating the object to be exposed with light reflected by a mirror (203) of the spatial light modulator (201), wherein a plane including the optical axis of the illumination light illuminating the spatial light modulator (201) and the optical axis of the projection optical system (17) is provided parallel to the scanning direction.

[0084] In one example, the mirror (203) of the spatial light modulator (201) is tilted with respect to the scanning direction. [Explanation of symbols]

[0085] 1. Exposure apparatus 14 stages 17. Projection Module (Projection Optical System) 50 Calibration device 61 Control Unit 64 Storage section 65 First Control Unit 66 Calculation Section 67 Second Control Unit 70 sensors 162 Illumination optical system 201, 201A, 201B Spatial Light Modulators 203 Micromirror (Mirror) 204 Angle adjustment mechanism

Claims

1. Illumination optics and, A spatial light modulator illuminated by light from the aforementioned illumination optical system, A projection optical system that irradiates the object to be exposed with light emitted from the spatial light modulator, The system comprises a stage on which the object to be exposed is placed, As the stage moves the exposure target in the scanning direction, the light irradiated onto the exposure target by the projection optical system scans over the exposure target. The spatial light modulator comprises a plurality of mirrors, Each of the aforementioned mirrors rotates around a tilt axis extending in a direction perpendicular to both the optical axis direction and the scanning direction of the projection optical system, and each of the aforementioned mirrors adjusts its inclination with respect to a plane perpendicular to the optical axis direction to become ON, thereby emitting light into the projection optical system. An exposure apparatus comprising an angle adjustment mechanism for adjusting the inclination angle of the surfaces supporting the plurality of mirrors with respect to the plane, in the spatial light modulator.

2. The system further includes a calibration device for calibrating the tilt angle of the spatial light modulator, The aforementioned calibration device is A storage unit that stores the target angles of at least some of the mirrors when at least some of the mirrors among the plurality of mirrors are turned on, A first control unit that transmits an operation amount to at least some of the mirrors to set the target angle of at least some of the mirrors, thereby tilting at least some of the mirrors, A sensor for detecting the tilt angle of at least some of the mirrors, A calculation unit calculates the difference between the target angle of at least some of the mirrors and the actual tilt angle of at least some of the mirrors, based on the target angle stored in the storage unit and the detection result of the sensor. The exposure apparatus according to claim 1, further comprising: a second control unit that controls the angle adjustment mechanism based on the difference calculated by the calculation unit.

3. Illumination optics and, A spatial light modulator illuminated by light from the aforementioned illumination optical system, A projection optical system that irradiates the object to be exposed with light emitted from the spatial light modulator, The system comprises a stage on which the object to be exposed is placed, As the stage moves the exposure target in the scanning direction, the light irradiated onto the exposure target by the projection optical system scans over the exposure target. The spatial light modulator comprises a plurality of mirrors, Each of the aforementioned mirrors rotates around a tilt axis extending in a direction perpendicular to both the optical axis direction and the scanning direction of the projection optical system, and each of the aforementioned mirrors adjusts its inclination with respect to a plane perpendicular to the optical axis direction to become ON, thereby emitting light into the projection optical system. An exposure apparatus in which the surface on which the plurality of mirrors are supported in the spatial light modulator is inclined with respect to the plane.

4. The exposure apparatus according to any one of claims 1 to 3, wherein the image plane of the projection optical system is inclined with respect to the scanning direction so as to include the best focus on the surface of the object to be exposed.

5. The exposure apparatus according to any one of claims 1 to 3, wherein the tilt angle of the spatial light modulator can be adjusted for each exposure recipe.

6. A method for exposing an object to be exposed using an exposure apparatus according to any one of claims 1 to 3, A first step of tilting the spatial light modulator with respect to the scanning direction based on the difference between the target tilt angle of at least some of the mirrors and the actual tilt angle of at least some of the mirrors when at least some of the mirrors are rotated around the tilt axis in order to turn on at least some of the mirrors, After the first step, a second step is performed in which the object to be exposed is exposed using the exposure apparatus, An exposure method including [details omitted].

7. The exposure method according to claim 6, wherein the second step is performed multiple times, and then the first step is performed again.

8. Exposing the object to be exposed by the exposure method described in claim 6, Developing the exposed object, A method for manufacturing a flat panel display, including the method described above.

9. A stage that moves the object to be exposed in the scanning direction, A spatial light modulator equipped with multiple mirrors, An illumination optical system for illuminating the aforementioned spatial light modulator, The system comprises a projection optical system that illuminates the object to be exposed with light reflected by the mirror of the spatial light modulator, In the spatial light modulator comprising multiple mirrors, the surface on which the multiple mirrors are supported is inclined with respect to a plane perpendicular to the optical axis direction of the projection optical system, A plane including the optical axis of the illumination light that illuminates the spatial light modulator and the optical axis of the projection optical system is provided parallel to the scanning direction. Exposure apparatus.

10. The mirror of the spatial light modulator is inclined with respect to the plane. The exposure apparatus according to claim 9.

11. The illumination optical system and the spatial light modulator are arranged side by side in the scanning direction. The exposure apparatus according to claim 9.

Images