Easy-to-assemble high-current composite circuit board and method for manufacturing the same

Abstract

To provide a large-current composite circuit board which includes a bottom plate assembly composed of an outer shell body, an insulating plate, a composite circuit board, and an insulating sealing layer in order from top to bottom, and is easy to assemble.SOLUTION: The composite circuit board is provided with an insulating groove and a mounting hole for conduction, and the housing and the insulating plate are provided with a through hole corresponding to the position of the mounting hole. In the present disclosure, the structure is simple, the base plate assembly made of the composite circuit board has a better load-bearing effect, the conductive column is connected to the composite circuit board by riveting, and the connecting wire is screwed and fixed to the upper end of the conductive column by the conductive screw, so that the component is electrically connected to the composite circuit board. With this structure, the assembly process is simplified, the assembly efficiency is improved, and the test can be performed after the conductive pillars are riveted, thereby effectively avoiding the situation that the base plate assembly is found to be defective after the components are assembled, reducing the occurrence of defective products and the rework rate, ensuring the qualification rate of the finished product, and reducing the production cost.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the technical field of electrical control equipment, and particularly to a large-current composite circuit board that is easy to assemble and a manufacturing method thereof.

Background Art

[0002] In the manufacturing process of a conventional control box currently available on the market, electrical components are manually fixed to the control box, and then wiring and connection are performed based on an electrical circuit diagram. The entire installation process requires workers to manually perform wiring and connection to complete production and assembly. Such a manual assembly method not only has low production efficiency but also increases the labor intensity of workers. In long-term operations, wiring errors are likely to occur, leading to installation errors, resulting in increased consumption of raw materials, higher labor costs, and the use of connecting wires for wiring, resulting in the formation of multiple harnesses inside, increasing the volume of the product and making miniaturization difficult.

[0003]

[0004] ​Currently, some commercially available electrical components use PCB boards for connection instead of conventional wiring methods. The electrical components and PCB boards are connected by wires, simplifying the wiring process. Soldering the wires to the PCB board reduces the need for internal harnesses, enabling miniaturization. However, this assembly and production method requires the assistance of another worker when soldering the connections between the wires and the PCB board. One worker positions and holds the electrical component at the front while the other performs the soldering at the back. While this structure improves production and assembly efficiency, it results in high labor costs. Furthermore, product testing is required after soldering is complete. If the product fails testing, disassembly and reassembly become extremely complicated, potentially leading to material waste. Additionally, with high-current circuit boards, soldering is prone to defects, resulting in insufficient connection stability and low reliability.

[0005] Therefore, it was necessary to research new technological means to solve the above problems. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] Therefore, the main objective of the present invention is to provide a high-current composite circuit board that is easy to assemble and a method for manufacturing the same, taking into account the shortcomings of the prior art. [Means for solving the problem]

[0007] To achieve the above objective, the present invention employs the following technical means.

[0008] This is a high-current composite circuit board that is easy to assemble, comprising a bottom plate assembly consisting of an outer shell, an insulating plate, a composite circuit board, and an insulating sealing layer, in that order from top to bottom, wherein insulating grooves and conductive mounting holes are drilled in the composite circuit board, and through holes corresponding to the positions of the mounting holes are provided in the outer shell and insulating plate.

[0009] In a preferred embodiment, the composite circuit board is formed by laminating a metal layer, an adhesive layer, and a polymer material insulating layer in sequence, and insulating grooves and mounting holes are formed in the metal layer by milling.

[0010] In a preferred embodiment, a sealant layer for insulating protection is filled into the insulating groove, and the sealant layer is composed of a sealing sheet pre-formed from an insulating material or formed by flow filling of a liquid insulating material.

[0011] In a preferred embodiment, the insulating board, insulating sealing layer, and sealant layer are made from epoxy resin material, and the polymer insulating layer is made from epoxy resin, glass fiber board, bakelite board, silicone rubber board, or plastic board.

[0012] In a preferred embodiment, the metal layer is made of a tough pitch copper plate, an alloy copper plate, or an aluminum alloy plate, the material used for the adhesive layer is a prepreg, the thickness of the metal layer is in the range of 0.2 mm to 3 mm, the thickness of the polymer material insulating layer is in the range of 0.5 mm to 5 mm, and the total thickness of the composite circuit board is 0.9 mm to 8.2 mm.

[0013] In a preferred embodiment, the conductive column further comprises an upper end and a lower end, the diameter of which is smaller than that of the upper end, and the lower end of the conductive column is fixed to the bottom plate assembly by passing through through holes in the outer shell and insulating plate and mounting holes for the composite circuit board in sequence, and an internal screw hole extending from top to bottom is provided on the upper end surface of the upper end of the conductive column.

[0014] In a preferred embodiment, the conductive column is fixed to the base plate assembly by riveting technology, and the lower end of the conductive column is fixed to the lower end surface of the composite circuit board by riveting.

[0015] In a preferred embodiment, the assembly further comprises a component fixed to the base plate assembly and a connecting wire provided between the component and a conductive column, wherein one end of the connecting wire is connected and fixed to the component, and the other end is attached by screwing it into a female threaded hole of the conductive column using a conductive screw, thereby achieving electrical conductivity.

[0016] A method for manufacturing a high-current composite circuit board that is easy to assemble, having the following configuration: S1: A material preparation step in which a composite circuit board is laminated and formed into a single sheet by laminating a metal layer, an adhesive layer, and a polymer material insulating layer with a laminator. S2: A composite circuit board processing step in which the metal plate of the composite circuit board is milled using a numerically controlled milling machine to form insulating grooves and mounting holes. S3: Step of filling the insulating grooves on the composite circuit board with sealant (the sealant layer is either prepared in advance or injected into the insulating grooves using a fluid method). S4: The outer shell is laser-cut using a laser processing machine, and then shaped using a sheet metal processing machine. S5: Step of printing circuit identification marks and related information on the molded outer shell, S6: A step to install a conductive column in which conductivity is obtained by riveting the conductive column to the composite circuit board using a riveting machine along pre-drilled mounting holes, and fixing the lower end of the conductive column to the composite circuit board by riveting it. S7: Assembly step of the bottom plate assembly, in which an insulating plate and a composite circuit board with conductive pillars riveted together are sequentially placed inside the outer shell and stacked, and then adhesive material for bonding and fixing is applied to the connection part between the composite circuit board and the inner end face of the outer shell. S8: A preliminary test and inspection step to conduct an electrical test on the base plate assembly with the conductive pillars attached, and to check for any abnormalities such as short circuits. S9: After the preliminary test is completed, apply adhesive to the rivet joints of the approved base plate assemblies to provide insulating protection. S10: A step to promote heat dissipation by attaching components according to pre-drilled hole positions and maintaining a certain distance between adjacent components. S11: A step to install a connecting wire, in which one end of the connecting wire is connected to a component, the two ends are secured together, the other end is placed on a conductive column, a conductive screw is passed through it and screwed into the conductive column to secure it, thereby forming a state of complete electrical conductivity. S12: A finished product testing step in which assembled products are retested to identify defective products. S13: Packing and boxing step.

[0017] In a preferred embodiment, the bottom plate assembly from step S9 can be used for assembly immediately after manufacturing, or it can be stored in a warehouse for later use. [Effects of the Invention]

[0018] Compared to the prior art, the present invention has clear advantages and beneficial effects, and specifically, the following can be seen from the above technical means: This invention features a simple structure, convenient and quick use, and a base plate assembly made of a composite circuit board that offers superior load-bearing capacity. Conductive columns are riveted to the composite circuit board using riveting technology, and then connecting wires are screwed into the upper ends of the conductive columns using conductive screws, thereby electrically connecting the components and the composite circuit board. This structure simplifies the assembly process, improves assembly efficiency, and provides good safety and reliability. Furthermore, since testing can be performed after riveting the conductive columns, it effectively avoids situations where defects in the base plate assembly are discovered after component assembly, reducing the occurrence of defective products and the rate of rework and repair, ensuring the acceptance rate of finished products, and reducing the company's production costs.

[0019] 1. By adopting a composite substrate instead of the conventional PCB substrate, the load-bearing capacity of the bottom plate assembly is improved, enabling it to withstand the weight and current of more components. Additionally, by creating grooves and holes in the composite circuit board, a circuit conduction effect is achieved in the composite circuit board. The grooves are filled with an insulating material to play a role in insulation protection and prevent the occurrence of short circuits. The bottom plate assembly is composed of a four-layer structure including an outer shell, an insulating board, a composite circuit board, and an insulating sealing layer. By printing information patterns such as electrical symbols, component names, and numbers on the upper end face of the outer shell, subsequent assembly can be facilitated and efficiency can be improved. Also, by pre-assembling the bottom plate assembly and transporting it to the assembly work site when needed, the overall assembly time can be shortened and the production assembly efficiency can be further enhanced.

[0020] 2. The conductive column is made of copper material, has excellent conductivity, and is fixed to the composite circuit board by a riveting technique. Since an internal thread is also provided at the upper inner end of the conductive column, a conductive screw with a locking function can quickly screw and fix the connecting wire to the conductive column, achieving conduction and featuring excellent reliability and stability.

[0021] 3. The components used are connected to the conductive columns by several connecting wires. By realizing the electrical connection state, the components can be quickly removed and installed, improving the assembly efficiency. At the same time, removal and installation without damage can be achieved, reducing the waste of components.

[0022] 4. In the assembly process, protection is provided by a multi-layer insulating layer, effectively protecting the stability and safety of the connection between the internal composite circuit board and components. It also has excellent effects such as dust prevention, waterproofing, moisture-proofing, corrosion resistance, anti-aging, and preventing displacement due to vibration.

[0023] 5. The composite circuit board used is composed of a tough pitch copper plate, an alloy copper plate, or an aluminum alloy plate, all of which can withstand the operation of high currents. Therefore, the bottom plate assembly has more selectivity and applicability and can meet the usage needs and scenarios of various customers.

[0024] 6. The total thickness of the selected composite circuit boards ranges from 0.9 mm to 8.2 mm, with the metal layer thickness ranging from 0.2 mm to 3 mm and the polymer insulating layer thickness ranging from 0.5 mm to 5 mm. By combining different thicknesses, the needs of various usage scenarios can be met.

[0025] Hereinafter, the accompanying drawings that may be used to describe embodiments or the prior art will be briefly described in order to clearly explain the technical means in the embodiments of this application. The accompanying drawings described below are only some embodiments of this application, and other drawings can be obtained based on these accompanying drawings, assuming no creative activity is required on the part of a person skilled in the art. [Brief explanation of the drawing]

[0026] [Figure 1] This is a schematic overall diagram of the base plate assembly of the present invention. [Figure 2] This is a schematic top view of the base plate assembly of the present invention. [Figure 3] This is a partial cross-sectional view of the base plate assembly of the present invention. [Figure 4] This is a schematic top view of the composite circuit board of the present invention. [Figure 5] This is a schematic exploded view of the composite circuit board of the present invention. [Figure 6] This is a schematic assembly diagram of the electrical components of the present invention. [Figure 7] This is a schematic exploded view of the electrical component of the present invention. [Modes for carrying out the invention]

[0027] To further clarify the technical problems, technical means, and advantageous effects that this application aims to solve, this application will be described in detail with reference to the attached drawings and embodiments. It will be understood that the specific embodiments described herein are solely for the purpose of clarifying the technical content of this application and are not intended to limit this application.

[0028] When an element is referred to as "fixed" to another element, it may be directly on top of the other element or have an intervening element. Note that when an element is referred to as "linked" to another element, it may be directly linked to the other element or have an intervening element.

[0029] The directions or positional relationships indicated by terms such as "length," "width," "top," "bottom," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," and "outside" are based on the directions or positional relationships shown in the drawings and are merely for the purpose of simplifying the explanation of this application. They do not indicate or suggest that the shown devices or components necessarily have a specific direction, or are configured and operated in a specific direction, and should not be understood as limitations to this application.

[0030] Furthermore, the terms "first" and "second" are used merely to describe the purpose and should not be understood as indicating or suggesting relative importance, or implicitly indicating the number of technical features shown. Thus, "first" and "second" indicate or imply that a feature being limited includes one or more such features. Moreover, in this application, unless otherwise specifically stated, "multiple" means two or more.

[0031] To further clarify the object, technical means, and advantages of the present invention, the present invention will be specifically described with reference to the accompanying drawings and embodiments.

[0032] Please refer to Figures 1 to 3. This is an easy-to-assemble high-current composite circuit board, comprising a bottom plate assembly 100 consisting of an outer shell 110, an insulating plate 120, a composite circuit board 130, and an insulating sealing layer 140, in that order from top to bottom. The composite circuit board 130 has insulating grooves 134 and conductive mounting holes 135, and the outer shell 110 and insulating plate 120 are provided with through holes 150 corresponding to the positions of the mounting holes 135.

[0033] Please refer to Figures 4 and 5. In this embodiment, the composite circuit board 130 is formed by laminating a metal layer 131, an adhesive layer 132, and a polymer material insulating layer 133 in order. The metal layer 131 has insulating grooves 134 and mounting holes 135 formed by milling, so that the metal layer 131 has a thin-walled region and a usable region, and the thin-walled region becomes the processed insulating groove 134.

[0034] Furthermore, a sealant layer 136 for insulating protection is filled into the insulating groove 134. The sealant layer 136 is composed of a sealing sheet pre-formed from insulating material or formed by fluid filling of liquid insulating material. By preparing the sealing sheet in advance, after processing the insulating groove 134, the sealing sheet can be placed into the insulating groove 134 to provide insulating protection, or liquid insulating material can be injected into the insulating groove 134 to uniformly fill the insulating groove 134 with insulating material, forming the sealant layer 136 and providing insulating protection.

[0035] In this embodiment, the insulating plate 120, insulating sealing layer 140, and sealant layer 136 are made of epoxy resin material and have a good insulating protective effect, and the polymer material insulating layer 133 is made of epoxy resin, glass fiber board, bakelite board, silicone rubber board, or plastic board and exhibits an insulating effect that separates the upper and lower layers, preventing short circuits and other malfunctions from occurring due to electrical conductivity between them.

[0036] In this embodiment, the metal layer 131 is made of a tough pitch copper plate, an alloy copper plate, or an aluminum alloy plate, the material used for the adhesive layer 132 is a prepreg, the thickness of the metal layer 131 is in the range of 0.2 mm to 3 mm, the thickness of the polymer material insulating layer 133 is in the range of 0.5 mm to 5 mm, and the total thickness of the composite circuit board 130 is 0.9 mm to 8.2 mm.

[0037] Specifically, the composite circuit board 130 allows for the selection of a board material of appropriate thickness according to the application needs. For example, a thin composite circuit board 130 can be assembled using a 0.2 mm thick metal layer 131 and a 0.5 mm thick polymer insulating layer 133, resulting in an overall thickness of 0.9 mm, making it suitable for products with limited space. Alternatively, by selecting a composite circuit board 130 of a conventional thickness, such as a 1 mm thick metal layer 131 and a 2 mm thick polymer insulating layer 133, the composite circuit board 130 can be used for everyday applications. When mounting more components 300 with higher currents, selecting a relatively thicker composite circuit board 130, such as a 3 mm thick metal layer 131 and a 5 mm thick polymer insulating layer 133, allows for the mounting of more components 300 that are heavier and have higher currents, while also improving the insulation protection effect accordingly.

[0038] In this embodiment, a conductive column 200 is further provided, consisting of an upper end portion 210 and a lower end portion 220, wherein the diameter of the lower end portion 220 is smaller than that of the upper end portion 210, and the lower end portion 220 of the conductive column 200 is fixed to the bottom plate assembly 100 by passing through through holes 150 in the outer shell 110 and insulating plate 120 and mounting holes 135 in the composite circuit board 130 in order, and a female screw hole 211 extending from top to bottom is provided on the upper end surface of the upper end portion 210 of the conductive column 200.

[0039] In this embodiment, the conductive column 200 is fixed to the base plate assembly 100 by riveting technology, and the lower end portion 220 of the conductive column 200 is fixed to the lower end surface of the composite circuit board 130 by riveting.

[0040] Please refer to Figures 6 and 7. In this embodiment, the base plate assembly 100 further comprises a component fixed to it and a connecting wire 400 provided between the component 300 and the conductive column 200. One end of the connecting wire 400 is connected and fixed to the component 300, and the other end is attached by screwing it into the female screw hole 211 of the conductive column 200 using a conductive screw, thereby achieving electrical conductivity.

[0041] Specifically, the components 300 used include electronic components 300 and electrical components 300, selected according to the usage needs of various scenarios, and addressing a wide range of customer needs.

[0042] Furthermore, this invention is suitable for mounting and use in control boxes or electrical cabinets, replaces conventional wiring methods, and makes assembly and use more convenient and faster, while also being able to withstand larger currents.

[0043] A method for manufacturing a high-current composite circuit board that is easy to assemble, having the following configuration: S1: A material preparation step in which a metal layer 131, an adhesive layer 132, and a polymer material insulating layer 133 are laminated with a laminator to form a single composite circuit board 130. S2: Processing step for the composite circuit board 130, in which the metal plate of the composite circuit board 130 is milled using a numerically controlled milling machine to form insulating grooves 134 and mounting holes 135. S3: Step of placing a sealant layer 136 into the insulating groove 134 on the composite circuit board 130 (the sealant layer 136 is either prepared in advance or injected into the insulating groove 134 using a fluid method). S4: The outer shell 110 is laser-cut using a laser processing machine, and after processing through holes 150 in the outer shell 110, the outer shell 110 is shaped using a sheet metal processing machine. S5: Step of printing circuit identification marks and related information on the upper end surface of the molded outer shell 110. S6: A step to install a conductive column 200, in which the conductive column 200 is riveted to the composite circuit board 130 along pre-drilled mounting holes 135 using a riveting machine, and the lower end of the conductive column 200 is riveted to the composite circuit board 130 to fix it in place, thereby achieving conductivity. S7: Assembles the bottom plate assembly by sequentially placing the insulating board 120 and the composite circuit board 130, which has conductive pillars 200 riveted together, into the outer shell 110 and stacking them, and then providing adhesive material for bonding and fixing at the connection between the composite circuit board 130 and the inner end face of the outer shell 110, so that when placed inside the outer shell 110, the two can be firmly bonded together by the adhesive material (the adhesive material includes glue made of adhesive or adhesive paper with adhesive backing). S8: A preliminary test and inspection step to perform an electrical test on the base plate assembly 100 to which the conductive column 200 is attached, and to check for any abnormalities such as short circuits. S9: After the preliminary test is completed, adhesive is applied to the rivet joint surface of the approved bottom plate assembly 100 to form an insulating sealing layer 140 and to provide insulating protection. S10: A step to promote heat dissipation by attaching the parts 300 according to the pre-drilled hole positions and maintaining a certain distance between adjacent parts 300. S11: Installation step of the connecting wire 400, which involves connecting one end of the connecting wire 400 to the component 300, securing the connection between the two, then placing the other end on the conductive column 200, passing a conductive screw through it and screwing it into the conductive column 200 to secure it, thereby forming a state of complete electrical conductivity. S12: A finished product testing step in which defective products are sorted out and prevented from being shipped by retesting the assembled finished products. S13: Packing and boxing step.

[0044] In this embodiment, the bottom plate assembly 100 from step S9 can be used for assembly immediately after manufacturing, or it can be stored in a warehouse and used later.

[0045] The foregoing describes only preferred embodiments of the present invention and merely provides a concrete description of the technical principles of the present invention. These descriptions are for illustrative purposes only and should not be interpreted as limiting the scope of protection of the present invention in any way. Based on this interpretation, any modifications, substitutions or improvements by equivalents, and other specific embodiments of the present invention that can be conceived by a person skilled in the art without creative activity, made within the spirit and principles of the present invention, should be included within the scope of protection of the present invention. [Explanation of Symbols]

[0046] 100 Bottom plate assembly 110 Outer shell 120 Insulating board 130 Composite Circuit Board 131 Metal layer 132 Adhesive layer 133 Polymer material insulating layer 134 Insulation groove 135 mounting holes 136 Sealant layer 140 Insulation sealing layer 150 through holes 200 conductive poles 210 Upper end 211 Female threaded hole 220 Lower end 300 parts 400 connecting wires

Claims

1. An easy-to-assemble high-current composite circuit board comprising a bottom plate assembly consisting of an outer shell, an insulating plate, a composite circuit board, and an insulating sealing layer in that order from top to bottom, wherein insulating grooves and conductive mounting holes are drilled in the composite circuit board, and through holes corresponding to the positions of the mounting holes are provided in the outer shell and the insulating plate. The composite circuit board is formed by laminating a metal layer, an adhesive layer, and a polymer material insulating layer in sequence, and the metal layer has the insulating grooves and mounting holes formed therein. The metal layer is made of tough pitch copper plate, alloy copper plate, or aluminum alloy plate, the material used for the adhesive layer is a prepreg, the thickness of the metal layer is in the range of 0.2 mm to 3 mm, the thickness of the polymer material insulating layer is in the range of 0.5 mm to 5 mm, and the total thickness of the composite circuit board is 0.9 mm to 8.2 mm. Circuit identification marks and related information are printed on the molded outer shell. A conductive column comprising an upper end and a lower end, wherein the diameter of the lower end is smaller than that of the upper end, and the lower end is fixed to the bottom plate assembly by passing sequentially through the through holes of the outer shell and the insulating plate and the mounting holes of the composite circuit board, and the upper end surface of the upper end has a female screw hole extending from top to bottom, a component fixed to the bottom plate assembly, and a connecting wire whose one end is connected and fixed to the component and whose other end is attached to the female screw hole of the conductive column using a conductive screw, The circuit board is suitable for a control box or electrical cabinet. A high-current composite circuit board that is easy to assemble, characterized by the following features.

2. The easy-to-assemble high-current composite circuit board according to claim 1, characterized in that a sealant layer for insulating protection is formed in the insulating groove using an insulating material.

3. The easy-to-assemble high-current composite circuit board according to claim 2, characterized in that the insulating plate, the insulating sealing layer, and the sealant layer are made from an epoxy resin material, and the polymer material insulating layer is made from epoxy resin, glass fiber board, bakelite board, silicone rubber board, or plastic board.

4. The conductive column is characterized in that the lower end of the conductive column is fixed to the bottom plate assembly by rivets, and the lower end of the conductive column is fixed to the lower end surface of the composite circuit board, as described in claim 1, for an easy-to-assemble high-current composite circuit board.

5. The easy-to-assemble high-current composite circuit board according to claim 1, further comprising a component fixed to a base plate assembly and a connecting wire provided between the component and the conductive column, wherein one end of the connecting wire is connected and fixed to the component, and the other end is attached by screwing it into the female screw hole of the conductive column using a conductive screw, thereby achieving conductivity.

6. A method for manufacturing an easy-to-assemble high-current composite circuit board, which includes an easy-to-assemble high-current composite circuit board according to any one of claims 1 to 5, S1: A material preparation step in which the composite circuit board is laminated and formed into a single sheet by laminating the metal layer, adhesive layer and polymer material insulating layer with a laminator. S2: A composite circuit board processing step in which the metal plate of the composite circuit board is milled using a numerically controlled milling machine to form insulating grooves and mounting holes. S3: Step of placing a sealant layer in the insulating groove on the composite circuit board (the sealant layer is either prepared in advance or injected into the insulating groove by a fluid method), S4: A step of laser cutting the outer shell with a laser processing machine and shaping the outer shell with a sheet metal processing machine. S5: Step of printing circuit identification marks and related information on the molded outer shell, S6: The conductive column mounting step involves riveting the conductive column to the composite circuit board using a riveting machine along pre-drilled mounting holes, and fixing the lower end of the conductive column to the composite circuit board by riveting it, thereby obtaining electrical conductivity. S7: Assembly step of the bottom plate assembly, in which the insulating plate and the composite circuit board with the conductive column riveted to it are sequentially placed inside the outer shell and stacked, and then adhesive material for adhesive fixing is provided at the connection between the composite circuit board and the inner end surface of the outer shell. S8: A preliminary test and inspection step in which the bottom plate assembly to which the conductive column is attached is energized to check for any abnormalities due to short circuits. S9: After the preliminary test is completed, apply adhesive to the rivet joint surface of the approved bottom plate assembly to provide insulating protection. S10: A step of attaching components according to pre-drilled hole positions and promoting heat dissipation by maintaining a certain distance between adjacent components. S11: A step of attaching a connecting wire, which involves connecting one end of the connecting wire to a component, securing the two ends together, then placing the other end on the conductive column, and securing it by screwing it into the female threaded hole of the conductive column using a conductive screw, thereby creating a state of complete electrical conductivity. S12: A finished product testing step in which the assembled finished products are retested to identify defective products, and S13: Packing and boxing step A method for manufacturing a high-current composite circuit board that is easy to assemble, characterized by having the above configuration.

7. The method for manufacturing a high-current composite circuit board that is easy to assemble, as described in claim 6, characterized in that the bottom plate assembly in step S9 can be used for assembly immediately after manufacturing or stored in a warehouse for later use.

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