Piezoelectric vibrators and oscillators

Abstract

To provide a piezoelectric transducer capable of securing a measurement accuracy of an oscillatory frequency and an oscillator.SOLUTION: A piezoelectric transducer 10 comprises: a package 2 having a chip mounting region 40; and a piezoelectric vibration piece. The chip mounting region 40 has a shape having a long direction L and a short direction W. In the chip mounting region 40, motor terminals 41 and 42, chip electrodes 61 to 66, and connection wirings 71 to 76 are formed. Each of the monitor terminals 41 and 42 is provided so that a position is different to the long direction L. Each of side edges 41a and 42a of the monitor terminals 41 and 42 is opposite to each connection wiring. When comparing a first half region 40A and a second half region 40B which become a center shaft o1 of the chip mounting region 40, a total area of the chip electrode in the first half region 40A and each connection wiring is smaller than a total area of the chip electrode in the second half region 40B and each connection wiring. A center of gravity of at least one of the monitor terminals 41 and 42 is in the first half region 40A.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a piezoelectric vibrator and an oscillator.

Background Art

[0002] For example, in electronic devices such as mobile phones, an oscillator equipped with a piezoelectric vibrator using quartz is used. The piezoelectric vibrator includes a piezoelectric vibrating piece and a package that hermetically seals the piezoelectric vibrating piece. An integrated circuit chip that performs arithmetic processing on a signal from the piezoelectric vibrator is mounted on the lower surface (chip mounting surface) of the package.

[0003] A monitor terminal for measuring the oscillation frequency and other wirings are formed on the chip mounting surface (for example, see Patent Documents 1 and 2). When manufacturing the piezoelectric vibrator, the contact probe pin (measurement terminal) of the measuring device is brought into contact with the monitor terminal, and the piezoelectric vibrating piece is vibrated to measure the frequency.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, miniaturization of piezoelectric vibrators has been demanded. Along with the miniaturization of the piezoelectric vibrator, the area of the chip mounting surface has become narrower. Therefore, the distance between the monitor terminal and other wirings may become small. When the contact probe pin is brought into contact with the monitor terminal for measuring the oscillation frequency, the contact probe pin may accidentally contact the wiring. In that case, it may affect the measurement accuracy of the oscillation frequency.

[0006] One aspect of this disclosure aims to provide a piezoelectric vibrator and oscillator that can ensure measurement accuracy of the oscillation frequency. [Means for solving the problem]

[0007] To solve the above problems, the piezoelectric vibrator and oscillator of this disclosure employ the following configuration.

[0008] [1] A piezoelectric vibrator according to one aspect of the present disclosure comprises a vibrator package having a chip mounting area on which an integrated circuit chip is mounted, and a piezoelectric vibrator mounted on the vibrator package, wherein the chip mounting area has a shape having a longitudinal direction and a transverse direction in a plan view, and the chip mounting area is formed with a pair of monitor terminals for measuring the oscillation frequency of the piezoelectric vibrator, a plurality of chip electrodes to which terminals of the integrated circuit chip are connected, and a plurality of connection wires connected to the chip electrodes. ,before Comparing the first half region on one side and the second half region on the other side, with the central axis along the longitudinal direction of the chip mounting area as the boundary, the first half region multiple Electrodes for the chip and the above multiple The total area of ​​the connecting wiring is the same as the second half region. multiple Electrodes for the chip and the above multiple The area is smaller than the total area of ​​the connecting wires, and at least one of the pair of monitor terminals has its center of gravity in the first half region. Furthermore, when each of the pair of monitor terminals is designated as the first monitor terminal and the second monitor terminal, and each of the plurality of connection wires is designated as the first connection wire, the second connection wire, the third connection wire, the fourth connection wire, the fifth connection wire, and the sixth connection wire, in the short direction, when the distance from one side edge of the first monitor terminal to the first connection wire is S1, the distance from the other side edge of the first monitor terminal to the third connection wire is S2, the distance from one side edge of the second monitor terminal to the second connection wire is S3, and the distance from the other side edge of the second monitor terminal to the sixth connection wire is S4, then S1 ≥ 50 μm, S2 ≥ 50 μm, S3 ≥ 50 μm, and S4 ≥ 50 μm.

[0009] In this embodiment of the piezoelectric vibrator, the center of gravity of the monitor terminal is located in the first half-region where the total area of ​​the chip electrode and connecting wiring is small, making it easy to maintain a distance between the monitor terminal and the conductive part (chip electrode and connecting wiring). Therefore, even if the contact probe pin of the measuring device is misaligned when it is brought into contact with the monitor terminal, the contact probe pin is less likely to come into contact with the connecting wiring. Thus, highly accurate measurement of the oscillation frequency is possible. Furthermore, even if the contact probe pin of the measuring device becomes misaligned when it is brought into contact with the monitor terminal, it becomes less likely for the contact probe pin to come into contact with the connecting wiring.

[0010] [2] The embodiment of [1] above Piezoelectric vibrator In, In the aforementioned short direction, it is preferable that S1 and S2 are equal, and that S3 and S4 are equal.

[0011] In this embodiment of the piezoelectric vibrator, the distance between one side edge and the connecting wiring is equal to the distance between the other side edge and the connecting wiring, making it easy to ensure a sufficient distance between the monitor terminal and the connecting wiring. Therefore, the contact probe pin is less likely to come into contact with the connecting wiring. As a result, highly accurate measurement of the oscillation frequency is possible.

[0018] [ 3 An oscillator relating to one aspect of this disclosure is described above [1] or [ 2] The system comprises a piezoelectric vibrator and the integrated circuit chip mounted in the chip mounting area.

[0019] According to the oscillator of this embodiment, since it is equipped with the piezoelectric vibrator described above, it is easy to ensure a distance between the monitor terminal and the conductive part (chip electrode and connecting wiring). Therefore, even if the contact probe pin of the measuring device is misaligned when it is brought into contact with the monitor terminal, the contact probe pin is less likely to come into contact with the connecting wiring. Thus, highly accurate measurement of the oscillation frequency is possible. [Effects of the Invention]

[0020] According to one aspect of this disclosure, it is possible to provide a piezoelectric vibrator and an oscillator that can ensure the measurement accuracy of the oscillation frequency. [Brief explanation of the drawing]

[0021] [Figure 1] This is a perspective view of the oscillator in the first embodiment. [Figure 2] This is a plan view showing the oscillator in the first embodiment with the sealing plate removed. [Figure 3] This is a cross-sectional view corresponding to line II in Figure 2. [Figure 4] This is an exploded perspective view of the oscillator in the first embodiment. [Figure 5]It is a schematic bottom view of the piezoelectric vibrator in the first embodiment. [Figure 6] It is a schematic bottom view of the piezoelectric vibrator in the second embodiment. [Figure 7] It is a schematic bottom view of the piezoelectric vibrator in the third embodiment. [Figure 8] It is a schematic bottom view of the piezoelectric vibrator in the fourth embodiment.

Embodiments for Carrying Out the Invention

[0022] Hereinafter, embodiments of the package for a vibrator, the piezoelectric vibrator, and the oscillator of the present disclosure will be given, and their configurations will be described while appropriately referring to the drawings. Note that in each of the drawings used in the following description, for the sake of convenience, there are cases where the characteristic parts are shown enlarged. The dimensional ratios and the like of each component may be different from the actual ones. The materials, dimensions, etc. exemplified in the following description are just examples. The present disclosure can be appropriately modified and implemented without changing its gist.

[0023] FIG. 1 is an external perspective view of the oscillator in the first embodiment. FIG. 2 is a plan view showing a state in which the sealing plate of the oscillator in the first embodiment is removed. FIG. 3 is a cross-sectional view corresponding to the line I-I in FIG. 2. FIG. 4 is an exploded perspective view of the oscillator in the first embodiment. FIG. 5 is a schematic bottom view of the piezoelectric vibrator in the first embodiment.

[0024] In the following description, components having the same or similar functions may be given the same reference numerals, and descriptions of the parts common to those components may be omitted.

[0025] <Oscillator> As shown in FIGS. 1 to 4, the oscillator 100 includes the piezoelectric vibrator 10 of the first embodiment and the integrated circuit chip 20. The oscillator 100 can be applied, for example, to a single-function oscillator for a clock. The oscillator 100 can be applied to a timing control device that controls the operation timing. The oscillator 100 can be applied to a device that provides time, a calendar, and the like.

[0026] <Piezoelectric vibrator> (First embodiment) The piezoelectric vibrator 10 is a surface-mount vibrator of the so-called ceramic package type. The piezoelectric vibrator 10 comprises a package 2 (vibrator package) and a piezoelectric vibrating element 3.

[0027] The piezoelectric vibrator 10 has a rectangular parallelepiped shape. In this embodiment, the longitudinal direction of the piezoelectric vibrator 10 in a plan view is called the longitudinal direction L. The short direction is called the width direction W. The direction perpendicular to the longitudinal direction L and the width direction W is called the thickness direction T. A plan view means viewing from the thickness direction T.

[0028] Package 2 comprises a package body 4, a sealing plate 5, and a conductive part 6. The package body 4 comprises a first base substrate 2a, a second base substrate 2b, a third base substrate 2c, and a sealing ring 2d.

[0029] The first base substrate 2a is a ceramic substrate whose external shape is identical to that of the second base substrate 2b in a plan view. The first base substrate 2a is integrally bonded to the lower surface of the second base substrate 2b by sintering or the like. As shown in Figures 3 and 4, the first base substrate 2a has a first through-port 2e that penetrates the first base substrate 2a in the thickness direction T. The first through-port 2e has a rounded rectangular shape in a plan view.

[0030] The first through-hole 2e houses the integrated circuit chip 20. The first through-hole 2e surrounds the integrated circuit chip 20 in a plan view. The surface of the first base substrate 2a opposite to the second base substrate 2b in the thickness direction T (hereinafter referred to as the bottom surface 2a1) is the surface for forming the external connection terminals 30-33, which are part of the conductive portion 6 (terminal formation surface 34).

[0031] The second base substrate 2b is a ceramic substrate that has a rectangular shape when viewed from above. The upper surface 2b1 of the second base substrate 2b forms the bottom of the cavity C.

[0032] The third base substrate 2c is a ceramic substrate whose plan view outline is the same as that of the second base substrate 2b. The third base substrate 2c is superimposed on the upper surface of the second base substrate 2b. The third base substrate 2c is integrally bonded to the upper surface of the second base substrate 2b by sintering or the like. As shown in Figures 2 to 4, the third base substrate 2c has a second through-port 2f that penetrates the third base substrate 2c in the thickness direction T. The second through-port 2f has a rounded rectangular shape in plan view.

[0033] On the inner surface of the second penetration portion 2f, mounting portions (mounting portion 2g and mounting portion 2h) are formed on both sides in the width direction W, projecting inward in the width direction W. A first electrode pad 51 and a second electrode pad 52, which are part of the conductive part 6, are formed on the mounting portion 2g and the mounting portion 2h. The first electrode pad 51 is formed on the mounting portion 2g. The second electrode pad 52 is formed on the mounting portion 2h. A piezoelectric vibrator 3 is bonded to the first electrode pad 51 and the second electrode pad 52.

[0034] Examples of ceramic materials used for the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c include alumina-based HTCC (High Temperature Co-Fired Ceramic) and glass ceramic-based LTCC (Low Temperature Co-Fired Ceramic). Notches 2i are formed at the four corners of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c.

[0035] As shown in Figure 3, an integrated circuit chip 20 is placed on the lower side (first base substrate 2a side) of the second base substrate 2b. A piezoelectric vibrator 3 is placed on the upper side (third base substrate 2c side) of the second base substrate 2b. Note that "up" and "down" on the lower surface 2a1, upper surface 2b1, lower surface 2b2, and upper surface 2c1 indicate directions for the sake of explanation and do not limit the orientation of the oscillator 100 during use.

[0036] The seal ring 2d is a conductive frame-shaped member smaller than the outer dimensions of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c. The seal ring 2d is bonded to the upper surface of the third base substrate 2c. The inner surface of the seal ring 2d, together with the inner surface of the third base substrate 2c (second through-port 2f), constitutes the inner surface of the cavity C. Examples of materials for the seal ring 2d include nickel-based alloys.

[0037] The sealing plate 5 is a conductive substrate. The sealing plate 5 is bonded to the upper surface of the seal ring 2d. The sealing plate 5 hermetically seals the opening of the seal ring 2d. The cavity C is a space partitioned by the seal ring 2d, the sealing plate 5, the second base substrate 2b, and the third base substrate 2c. The cavity C is a hermetically sealed space.

[0038] As shown in Figures 2 to 4, the piezoelectric vibrator 3 is housed in a cavity C of a hermetically sealed package 2. The piezoelectric vibrator 3 comprises a piezoelectric plate 3a formed of, for example, quartz. The piezoelectric plate 3a has a pair of vibrating arms (first vibrating arm 3b and second vibrating arm 3c) and a pair of support arms (first support arm 3d and second support arm 3e). The piezoelectric vibrator 3 is mounted in the package 2 by the support arms 3d and 3e being supported by mounting sections 2g and 2h. The support arms 3d and 3e are bonded to electrode pads 51 and 52 with conductive adhesive. The piezoelectric vibrator 3 is supported such that the first vibrating arm 3b and the second vibrating arm 3c are suspended from the second base substrate 2b. The outer surfaces of the first vibrating arm 3b and the second vibrating arm 3c are provided with two sets of excitation electrodes (not shown) that vibrate the pair of first vibrating arm 3b and second vibrating arm 3c when a predetermined voltage is applied. The piezoelectric plate is not limited to quartz; it may also be made of other materials such as aluminum nitride (AlN) or lead zirconate titanate (PZT).

[0039] As shown in Figure 5, the area of ​​the lower surface 2b2 of the second base substrate 2b that is surrounded by the first base substrate 2a in a plan view is the chip mounting area 40, which includes the area where the integrated circuit chip 20 is mounted. The chip mounting area 40 is rectangular in shape, having a pair of long sides 40a and 40b (first long side 40a and second long side 40b) and a pair of short sides 40c and 40d (first short side 40c and second short side 40d). The length of the long sides 40a and 40b is greater than (longer than) the length of the short sides 40c and 40d. The long sides 40a and 40b and the short sides 40c and 40d are defined by the inner periphery of the first base substrate 2a.

[0040] The long sides 40a and 40b are aligned with the longitudinal direction L. The longitudinal direction L is the longitudinal direction of the chip mounting area 40. The short sides 40c and 40d are aligned with the width direction W. The width direction W is the short direction of the chip mounting area 40. The first long side 40a and the second long side 40b are parallel and of the same length. The first short side 40c and the second short side 40d are parallel and of the same length.

[0041] The direction from the first short side 40c towards the second short side 40d (to the right in Figure 5) is the "+L direction". The direction opposite to the +L direction is the "-L direction". The direction from the second long side 40b towards the first long side 40a (up in Figure 5) is the "+W direction". The direction opposite to the +W direction is the "-W direction".

[0042] A central axis (first central axis) O1 is set along the longitudinal direction L. The central axis O1 passes through the center of the width direction W of the chip mounting area 40. The chip mounting area 40 can be divided into a first semi-region 40A on the +W direction side (one side) and a second semi-region 40B on the -W direction side (the other side), with the central axis O1 as the boundary. The chip mounting area 40 has a symmetrical shape with the central axis O1 as the axis of symmetry. The area of ​​the first semi-region 40A is equal to the area of ​​the second semi-region 40B. In addition, a central axis (second central axis) O2 is set along the width direction W. The central axis O2 passes through the center of the longitudinal direction L of the chip mounting area 40.

[0043] The conductive portion 6 serves as a conduction path for power and signals in the package 2. The conductive portion 6 is formed, for example, by sputtering, vapor deposition, etc. The conductive portion 6 may be a single layer film made of a single metal, or a multilayer film made of different metals stacked on top of each other.

[0044] The conductive portion 6 includes not only the electrode pads 51, 52 and external connection terminals 30-33 mentioned above, but also terminals and wiring formed on the lower surface 2b2 of the second base substrate 2b. The terminals and wiring formed on the lower surface 2b2 will be described below.

[0045] The chip mounting area 40 has a pair of monitor terminals 41, 42 (first monitor terminal 41 and second monitor terminal 42), first to sixth chip electrodes 61 to 66, first to sixth connection wirings 71 to 76, and monitor connection wirings 81, 82 (first monitor connection wiring 81 and second monitor connection wiring 82) formed therein.

[0046] Chip electrodes 61-66 are examples of "multiple chip electrodes". The number of chip electrodes may be any number of two or more. Connection wires 71-76 are examples of "multiple connection wires". The number of connection wires may be any number of two or more.

[0047] The first monitor terminal 41 is connected to the first electrode pad 51, for example, via a first monitor connection wire 81 and other connection wires (not shown). The second monitor terminal 42 is electrically connected to the second electrode pad 52, for example, via a second monitor connection wire 82 and other connection wires (not shown).

[0048] The first monitor terminal 41 is rectangular in shape, having a pair of side edges 41a and a pair of end edges 41b. The pair of side edges 41a are both side edges in the width direction W of the first monitor terminal 41. The side edges 41a are aligned along the longitudinal direction L. The pair of end edges 41b are both end edges in the longitudinal direction L of the first monitor terminal 41. The end edges 41b are aligned along the width direction W.

[0049] A portion of the side edge 41a on the -W direction side is a chamfered portion 41c. The chamfered portion 41c is formed at the corner of the first monitor terminal 41, which is formed by the side edge 41a on the -W direction side and the end edge 41b on the +L direction side. The chamfered portion 41c is inclined with respect to the longitudinal direction L and the width direction W. The chamfered portion 41c is a straight line that is inclined to transition from the +L direction to the +W direction. The chamfered portion 41c has a C-shaped chamfer.

[0050] Of the four corners of the first monitor terminal 41, a chamfered portion 41d is also formed on the corner diagonally opposite to the corner where the chamfered portion 41c is formed. In the illustrated example of the first monitor terminal 41, chamfered portions 41c and 41d are formed on two of the four corners, but the number of chamfered portions is not particularly limited. There may be no chamfered portions, or they may be formed on one or more of the four corners. The side edge 41a on the +W direction side of the first monitor terminal 41 is an example of "one side edge". The side edge 41a on the -W direction side of the first monitor terminal 41 is an example of "the other side edge".

[0051] The second monitor terminal 42 is rectangular in shape, having a pair of side edges 42a and a pair of end edges 42b. Both side edges 42a of the second monitor terminal 42 in the width direction W are aligned with the longitudinal direction L. The end edge 42b is aligned with the width direction W. A portion of the side edge 42a on the +W direction side is chamfered 42c. In the illustrated example of the second monitor terminal 42, a chamfered portion 42c is formed on one of the four corners, but the chamfered portion may be omitted, or it may be formed on one or more of the four corners. The side edge 42a on the +W direction side of the second monitor terminal 42 is an example of "one side edge". The side edge 42a on the -W direction side of the second monitor terminal 42 is an example of "the other side edge".

[0052] The longitudinal dimension L of the first monitor terminal 41 is the same (or approximately the same) as the longitudinal dimension L of the second monitor terminal 42. The width dimension W of the first monitor terminal 41 is the same (or approximately the same) as the width dimension W of the second monitor terminal 42. Therefore, the area of ​​the first monitor terminal 41 and the area of ​​the second monitor terminal 42 are approximately equal.

[0053] The first monitor terminal 41 and the second monitor terminal 42 are formed at different positions in the longitudinal direction L. The first monitor terminal 41 and the second monitor terminal 42 are separated in the longitudinal direction L. The first monitor terminal 41 is located on the -L side of the central axis O2 (the left half of the region in Figure 5). The second monitor terminal 42 is located on the +L side of the central axis O2 (the right half of the region in Figure 5).

[0054] The centroid G1 of the first monitor terminal 41 and the centroid G2 of the second monitor terminal 42 in a plan view are located in the first semi-region 40A. The position of the centroid G1 of the first monitor terminal 41 in the width direction W is the same as the position of the centroid G2 of the second monitor terminal 42 in the width direction W. The distance from the central axis O1 to the centroid G1 is equal to the distance from the central axis O1 to the centroid G2. The centroid position line GL, which passes through the centroids G1 and G2, is parallel to the longitudinal direction L. The centroid position line GL is located on the +W side of the central axis O1.

[0055] In the manufacturing process of the piezoelectric vibrator 10, to confirm the oscillation frequency of the piezoelectric vibrator 3, the two contact probe pins (measuring terminals) of the measuring device are brought into contact with the monitor terminals 41 and 42, and the piezoelectric vibrator 3 is vibrated to measure the oscillation frequency.

[0056] The oscillation frequency can be adjusted based on the measured value. To adjust the oscillation frequency, for example, a weight metal film for frequency adjustment is formed on the vibrating arms 3b and 3c by vapor deposition, and the weight metal film is trimmed by laser processing.

[0057] The electrodes 61-66 for the first to sixth chips are, for example, electrodes for external power supply, electrodes for signal output, electrodes for the first vibrator, electrodes for the second vibrator, electrodes for ground connection, electrodes for switching, etc. The external power supply electrode is the electrode to which the power input terminal of the integrated circuit chip 20 is connected. The signal output electrode is the electrode to which the signal output terminal of the integrated circuit chip 20 is connected. The first vibrator electrode is the electrode to which the terminal of the integrated circuit chip 20, which is electrically connected to the piezoelectric vibrator 3 via the first electrode pad 51, is connected. The second vibrator electrode is the electrode to which the terminal of the integrated circuit chip 20, which is electrically connected to the piezoelectric vibrator 3 via the second electrode pad 52, is connected. The ground connection electrode is the electrode to which the ground terminal of the integrated circuit chip 20 is connected. The switch electrode is the electrode to which the switch signal input terminal of the integrated circuit chip 20 is connected. The electrodes 61-66 for the first to sixth chips are connected to the integrated circuit chip 20 via, for example, flip-chip bonding or bonding wires.

[0058] The first chip electrode 61 is positioned opposite the edge 41b on the +L side of the first monitor terminal 41. The first chip electrode 61 is located away from the edge 41b on the +L side of the first monitor terminal 41 in the +L direction. The second chip electrode 62 is positioned opposite the edge 41b on the -L side of the second monitor terminal 42. The second chip electrode 62 is located away from the edge 41b on the -L side of the second monitor terminal 42 in the -L direction. The first chip electrode 61 and the second chip electrode 62 are located in the first half-region 40A.

[0059] The third chip electrode 63 is located opposite the edge 41b on the +L side of the first monitor terminal 41. The first chip electrode 61 is located away from the edge 41b on the +L side of the first monitor terminal 41 in the +L direction. The third chip electrode 63 is located away from the first chip electrode 61 in the -W direction. A portion of the third chip electrode 63 is in the first half-region 40A. The other portion of the third chip electrode 63 is in the second half-region 40B.

[0060] The fourth chip electrode 64, the fifth chip electrode 65, and the sixth chip electrode 66 are located in the second half-region 40B. The fourth chip electrode 64, the fifth chip electrode 65, and the sixth chip electrode 66 are formed at different positions in the longitudinal direction L. The fifth chip electrode 65 is separated from the fourth chip electrode 64 in the +L direction. The sixth chip electrode 66 is separated from the fifth chip electrode 65 in the +L direction.

[0061] The first to sixth connection wires 71 to 76 are connected to the first to sixth chip electrodes 61 to 66, respectively. The first connecting wire 71 is L-shaped and has a first extension 71A and a second extension 71B. The first extension 71A extends in the +W direction from the first chip electrode 61. The second extension 71B extends in the -L direction from the tip of the first extension 71A. A portion of the length of the second extension 71B faces the side edge 41a on the +W side of the first monitor terminal 41. Conversely, the side edge 41a on the +W side of the first monitor terminal 41 faces the second extension 71B. The second extension 71B is parallel to the side edge 41a on the +W side of the first monitor terminal 41. The second extension 71B is spaced away from the first monitor terminal 41 in the +W direction.

[0062] The second connecting wire 72 is L-shaped and has a first extension 72A and a second extension 72B. The first extension 72A extends in the +W direction from the second chip electrode 62. The second extension 72B extends in the +L direction from the tip of the first extension 72A. A portion of the length of the second extension 72B faces the side edge 42a of the second monitor terminal 42 on the +W direction side. Conversely, the side edge 42a of the second monitor terminal 42 on the +W direction side faces the second extension 72B. The second extension 72B is parallel to the side edge 42a of the second monitor terminal 42 on the +W direction side. The second extension 72B is spaced away from the second monitor terminal 42 in the +W direction.

[0063] The third connecting wire 73 has a first extension 73A, a second extension 73B, and a third extension 73C. The first extension 73A extends from the third chip electrode 63 with an inclination that transitions from the -L direction to the -W direction. The first extension 73A faces the chamfered portion 41c of the first monitor terminal 41. The first extension 73A is parallel to the chamfered portion 41c. The first extension 73A is separated from the chamfered portion 41c.

[0064] The second extension portion 73B extends in the -L direction from the tip of the first extension portion 73A. The second extension portion 73B faces the side edge 41a of the first monitor terminal 41 on the -W direction side. The second extension portion 73B is parallel to the side edge 41a of the first monitor terminal 41 on the -W direction side. The third extension portion 73C extends inclined from the tip of the second extension portion 73B, transitioning from the -L direction to the -W direction.

[0065] The first extension portion 73A, the second extension portion 73B, and the third extension portion 73C face the side edge 41a of the first monitor terminal 41 on the -W side. The first extension portion 73A, the second extension portion 73B, and the third extension portion 73C are separated in the -W direction from the side edge 41a of the first monitor terminal 41 on the -W side.

[0066] The fourth connection wiring 74 extends inclined from the fourth chip electrode 64, transitioning from the -L direction to the -W direction. The fifth connection wiring 75 extends from the fifth chip electrode 65 in the -W direction. The width of the fifth connection wiring 75 increases in the direction of extension.

[0067] The sixth connection wiring 76 has a first extension 76A and a second extension 76B. The first extension 76A extends from the sixth chip electrode 66 at an angle, transitioning from the +L direction to the -W direction. The second extension 76B extends from the tip of the first extension 76A in the +L direction. The second extension 76B is parallel to the side edge 42a on the -W direction side of the second monitor terminal 42. The sixth connection wiring 76 faces the side edge 42a on the -W direction side of the second monitor terminal 42. The sixth connection wiring 76 is separated from the side edge 42a on the -W direction side of the second monitor terminal 42 in the -W direction.

[0068] The total area of ​​the chip electrodes and connecting wiring in the first half-region 40A, viewed from the plan, is smaller than the total area of ​​the chip electrodes and connecting wiring in the second half-region 40B, viewed from the plan. Therefore, comparing the first half-region 40A and the second half-region 40B, it can be said that the conductive parts (chip electrodes and connecting wiring) in the second half-region 40B are densely formed compared to the conductive parts in the first half-region 40A.

[0069] The total area of ​​the chip electrodes and connecting wiring in the first half-region 40A is the sum of the area of ​​the first chip electrode 61, the first connecting wiring 71, the second chip electrode 62, the second connecting wiring 72, and a portion of the third chip electrode 63. The total area of ​​the chip electrodes and connecting wiring in the second half-region 40B is the sum of the area of ​​the other part of the third chip electrode 63, the third connecting wiring 73, the fourth chip electrode 64, the fourth connecting wiring 74, the fifth chip electrode 65, the fifth connecting wiring 75, the sixth chip electrode 66, and the sixth connecting wiring 76.

[0070] It is desirable that the side edges 41a and 42a of the monitor terminals 41 and 42 and the connecting wiring opposite them have a distance of 50 μm or more between them. This makes it less likely for the contact probe pin of the measuring device to come into contact with the connecting wiring even if the contact probe pin is misaligned when it is brought into contact with the monitor terminals 41 and 42. It is desirable that the side edges 41a and 42a of the monitor terminals 41 and 42 and the connecting wiring opposite them have a distance of, for example, 500 μm or less from each other.

[0071] The monitor connection wires 81 and 82 are connected to monitor terminals 41 and 42, respectively. The first monitor connection wire 81 extends from the first monitor terminal 41 in the -L direction. The second monitor connection wire 82 extends from the second monitor terminal 42 in the +L direction.

[0072] The integrated circuit chip 20 generates and outputs an output signal containing frequency components by performing various calculations on the electrical signal input from the piezoelectric vibrator 10 (see Figures 3 to 5). The integrated circuit chip 20 is mounted in the chip mounting area 40.

[0073] Although not shown in the drawing, conductive section 6 includes connecting wiring that connects external connection terminals 30-33 to connection wiring 71-76. Conductive section 6 also includes connecting wiring that connects electrode pads 51, 52 to connection wiring 71-76. Conductive section 6 also includes connecting wiring that connects monitor terminals 41, 42 to electrode pads 51, 52.

[0074] <Effects of the piezoelectric vibrator and oscillator of the first embodiment> The piezoelectric vibrator 10 has its center of gravity G1 and G2 of the monitor terminals 41 and 42 located in the first half-region 40A, where the total area of ​​the chip electrodes and connecting wiring is small. This makes it easy to maintain a safe distance between the monitor terminals 41 and 42 and the conductive parts (chip electrodes and connecting wiring). Therefore, even if the contact probe pin of the measuring device shifts position when it is brought into contact with the monitor terminals 41 and 42, the contact probe pin is less likely to come into contact with the connecting wiring. As a result, highly accurate measurement of the oscillation frequency is possible.

[0075] For example, if a contact probe pin is mistakenly connected to a ground connection wire, it may become difficult to detect oscillations. If a contact probe pin is mistakenly connected to other wires, stray capacitance may cause a shift in the detected frequency.

[0076] The side edge 41a on the +W direction side of the first monitor terminal 41 is parallel to the second extension 71B of the first connection wiring 71. The side edge 41a on the -W direction side of the first monitor terminal 41 is parallel to the second extension 73B of the third connection wiring 73. The side edge 42a on the +W direction side of the second monitor terminal 42 is parallel to the second extension 72B of the second connection wiring 72. The side edge 42a on the -W direction side of the second monitor terminal 42 is parallel to the second extension 76B of the sixth connection wiring 76. In this way, at least a portion of the side edges 41a and 42a of the monitor terminals 41 and 42 is parallel to the opposing connection wiring. Therefore, it is easy to ensure a distance between the monitor terminals 41 and 42 and the connection wiring. Thus, it is possible to make it less likely for the contact probe pin to come into contact with the connection wiring, and to increase the area of ​​the monitor terminals 41 and 42.

[0077] In the piezoelectric vibrator 10, a chamfered portion 41c is formed on a part of the side edge 41a of the first monitor terminal 41, and the first extension portion 73A of the third connecting wiring 73 is parallel to the chamfered portion 41c. Therefore, it is easy to ensure a distance between the first monitor terminal 41 and the third connecting wiring 73. Thus, it is possible to make it difficult for the contact probe pin to come into contact with the third connecting wiring 73, and to increase the area of ​​the monitor terminals 41 and 42.

[0078] Since the oscillator 100 is equipped with a piezoelectric vibrator 10, it produces the same effect as the piezoelectric vibrator 10.

[0079] <Piezoelectric vibrator> (Second embodiment) A piezoelectric vibrator of a second embodiment will be described. In the piezoelectric vibrator 10 of the first embodiment shown in Figure 5, the centers of gravity G1 and G2 of the two monitor terminals 41 and 42 are both in the first half-region 40A. However, the centers of gravity G1 and G2 of either monitor terminal 41 or 42 may be in the first half-region 40A. Therefore, it is sufficient that the center of gravity of at least one of the monitor terminals 41 or 42 is in the first half-region 40A.

[0080] Figure 6 is a schematic bottom view of the piezoelectric vibrator 110 in the second embodiment. In Figure 6, the monitor connection wiring 81 and 82 is omitted from the illustration. As shown in Figure 6, the piezoelectric vibrator 110 differs from the piezoelectric vibrator 10 of the first embodiment (see Figure 5) in that it is equipped with a second monitor terminal 142 instead of the second monitor terminal 42. The second monitor terminal 142 has a larger width dimension W compared to the first monitor terminal 41. The center of gravity G102 of the second monitor terminal 142 lies on the central axis O1. Therefore, in the piezoelectric vibrator 110, of the center of gravity G1 and G102 of the two monitor terminals 41 and 142, only the center of gravity G1 of the first monitor terminal 41 is located in the first semi-region 40A.

[0081] In the piezoelectric vibrator 110, similar to the first embodiment, it is easy to ensure a sufficient distance between the monitor terminal 41 and the conductive part (chip electrode and connecting wiring). Therefore, when the contact probe pin of the measuring device is brought into contact with the monitor terminal 41, the contact probe pin is less likely to come into contact with the connecting wiring. Thus, highly accurate measurement of the oscillation frequency is possible.

[0082] <Piezoelectric vibrator> (Third embodiment) A piezoelectric vibrator of a third embodiment will now be described. In the piezoelectric vibrator 10 of the first embodiment shown in Figure 5, the positions of the centroids G1 and G2 of the two monitor terminals 41 and 42 in the width direction W are the same, but the positions of the centroids G1 and G2 of the two monitor terminals 41 and 42 in the width direction W may be different.

[0083] Figure 7 is a schematic bottom view of the piezoelectric vibrator 210 in the third embodiment. In Figure 7, the monitor connection wiring 81 and 82 is omitted from the illustration. As shown in Figure 7, the piezoelectric vibrator 210 differs from the piezoelectric vibrator 10 of the first embodiment (see Figure 5) in that it is equipped with a second monitor terminal 242 instead of the second monitor terminal 42. The second monitor terminal 242 has a larger width (W) dimension compared to the first monitor terminal 41. The centroid G202 of the second monitor terminal 142 is located in the first semi-region 40A, but is closer to the central axis O1 than the centroid G1 of the first monitor terminal 41.

[0084] In the piezoelectric vibrator 210, similar to the first embodiment, it is easy to ensure a sufficient distance between the monitor terminals 41 and 242 and the conductive parts (chip electrodes and connecting wiring). Therefore, when the contact probe pin of the measuring device is brought into contact with the monitor terminals 41 and 242, the contact probe pin is less likely to come into contact with the connecting wiring. Thus, highly accurate measurement of the oscillation frequency is possible.

[0085] <Piezoelectric vibrator> (Fourth embodiment) A piezoelectric vibrator of a fourth embodiment will be described. Figure 8 is a schematic bottom view of the piezoelectric vibrator 310 in the fourth embodiment. In Figure 8, the monitor connection wiring 81 and 82 is omitted from the illustration. As shown in Figure 8, the distance between the side edge 41a on the +W direction side of the first monitor terminal 41 and the opposing first connection wiring 71 is called "S1". The distance between the side edge 41a on the -W direction side of the first monitor terminal 41 and the opposing third connection wiring 73 is called "S2". Distance S1 and distance S2 are equal.

[0086] The distance between the side edge 342a on the +W direction side of the second monitor terminal 342 and the opposing second connection wiring 72 is called "S3". The distance between the side edge 342a on the -W direction side of the second monitor terminal 342 and the opposing sixth connection wiring 76 is called "S4". Distance S3 and distance S4 are equal.

[0087] In the piezoelectric vibrator 310, the distance between one side edge and the connecting wiring of the monitor terminals 41 and 342 is equal to the distance between the other side edge and the connecting wiring, so there is no bias in the distance from the connecting wiring of the two side edges. Therefore, it is easy to ensure a safe distance between the monitor terminals 41 and 342 and the connecting wiring. Consequently, the contact probe pins are less likely to come into contact with the connecting wiring. Thus, highly accurate measurement of the oscillation frequency is possible.

[0088] <Other forms of this disclosure> While preferred embodiments of this disclosure have been described in detail above, this disclosure is not limited to such specific embodiments, and various modifications, substitutions, and changes are possible within the scope of the gist of this disclosure as described in the claims. [Industrial applicability]

[0089] As described above, the piezoelectric vibrator of this disclosure can ensure measurement accuracy of the oscillation frequency. Therefore, an oscillator equipped with this piezoelectric vibrator is suitable as a device used in electronic devices such as mobile phones and personal information terminals, as well as a timing source such as a time source or control signal source, a reference signal source, etc. [Explanation of Symbols]

[0090] 2…Package (package for oscillator), 3…Piezoelectric vibrator, 10, 110, 210, 310…Piezoelectric oscillator, 20…Integrated circuit chip, 40…Chip mounting area, 40A…First half-area, 40B…Second half-area, 41…First monitor terminal (monitor terminal), 41a…Side edge, 41c…Chamfered part, 42, 142, 242, 342…Second monitor terminal (monitor terminal), 42a, 342a…Side edge, 61~66…Chip electrodes, 71~76…Connection wiring, 100…Oscillator, G1, G2, G102, G202…Center of gravity, L…Longest direction, O1…Central axis, W…Width direction (shortest direction)

Claims

1. A package for an oscillator having a chip mounting area on which an integrated circuit chip is mounted, The package for the vibrator includes a piezoelectric vibrator mounted on the aforementioned package, The chip mounting area has a shape with a longitudinal direction and a transverse direction in a plan view. In the aforementioned chip mounting area, A pair of monitor terminals for measuring the oscillation frequency of the piezoelectric vibrator, Multiple chip electrodes to which the terminals of the aforementioned integrated circuit chip are connected, Multiple connection wires connected to the electrode for the chip are formed, Comparing the first half-region on one side and the second half-region on the other side, with the central axis along the longitudinal direction of the chip mounting region as the boundary, the total area of ​​the plurality of chip electrodes and the plurality of connection wirings in the first half-region is smaller than the total area of ​​the plurality of chip electrodes and the plurality of connection wirings in the second half-region. At least one of the pair of monitor terminals has its center of gravity in the first half region. Each of the pair of monitor terminals is designated as the first monitor terminal and the second monitor terminal. When each of the aforementioned plurality of connection wires is designated as the first connection wire, second connection wire, third connection wire, fourth connection wire, fifth connection wire, and sixth connection wire, In the aforementioned shorter direction, Let S1 be the distance from one side edge of the first monitor terminal to the first connection wiring. Let S2 be the distance from the other side edge of the first monitor terminal to the third connecting wiring. Let S3 be the distance from one side edge of the second monitor terminal to the second connection wiring. When S4 is the distance from the other side edge of the second monitor terminal to the sixth connection wiring, S1 ≥ 50 μm, S2 ≥ 50 μm, S3 ≥ 50 μm, S4 ≥ 50 μm A piezoelectric vibrator characterized by the following:

2. In the shorter direction, The above S1 and the above S2 are equal, If S3 and S4 are equal, The piezoelectric vibrator according to claim 1.

3. A piezoelectric vibrator according to claim 1 or 2, The integrated circuit chip mounted in the chip mounting area, An oscillator equipped with the following features.

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