Base component

Abstract

To provide a miniaturized base member that is mounted by using a MID, and has a shape suitable for being accommodated in an electronic apparatus.SOLUTION: A base member of the present invention is such that, when seen from a direction in which a base surface extends, the shape of each of a first hole and a second hole widens as approaching from a portion where a lower end of the first hole and an upper end of the second hole are in contact with each other to one face and the other face of the base surface, and when seen from the direction in which the base surface extends, a smaller angle 906 of the angles formed by the generating line of the first hole and the generating line of the second hole, is smaller in an area where the thickness of the base member is smaller, than an area where the thickness of the base member is larger.SELECTED DRAWING: Figure 8

Description

Technical Field

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[0001] The present invention relates to a base member using MID technology.

Background Art

[0002] In recent years, various sensors have been incorporated into electronic devices such as cameras and smartphones, and transportation devices such as automobiles, and a modularized sensor module is built in.

[0003] Among such sensor modules, those applying MID technology are known.

[0004] MID technology is a technology in which a laser is irradiated on a necessary portion of a base member, and a metal plating film is formed only on the irradiated portion. The portion where the metal plating film is formed becomes a conductive pattern.

[0005] For example, Patent Document 1 discloses a MID package in which gyro elements are mounted one by one on each of the three inclined surfaces of a substantially triangular pyramid-shaped main body where the first conical surface, the second conical surface, and the third conical surface are orthogonal to each other.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] In recent years, the demand for miniaturization of electronic devices has been increasing day by day. Along with this, the realization of a base member such as a small sensor module that is easy to accommodate in a miniaturized electronic device is desired.

[0008] In the prior art disclosed in the above patent document, each dimension of the vertical, horizontal, and thickness of the MID package has become large, which has hindered the miniaturization of the device.

[0009] Also, in the accommodation of the MID package in an electronic device, the triangular pyramid shape is likely to create dead space inside the device and is not a desirable shape.

[0010] Therefore, an object of the present invention is to provide a small base member having a shape suitable for accommodation in an electronic device.

Means for Solving the Problems

[0011] To achieve the above object, the present invention One aspect is a base member which is a shaped component on which a pattern wiring is directly formed, and is characterized by the above. The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups has a first land row in which a plurality of lands are arranged along a first direction, and a second land row in which a plurality of lands are arranged along the first direction, both arranged along a second direction which is different from the first direction. When viewed from the direction normal to the base surface of the base member, the first row of lands is positioned above the second row of lands in the second direction of the surface. The area of ​​the lands constituting the first row of lands is greater than the area of ​​the lands constituting the second row of lands. and is characterized by the above. Another aspect of the present invention is, A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups has a first land row in which a plurality of lands are arranged along a first direction, and a second land row in which a plurality of lands are arranged along the first direction, both arranged along a second direction which is different from the first direction. When viewed from the direction normal to the base surface of the base member, the first row of land rows is positioned above the second row of land rows in the second direction of the surface. The amount of solder applied to the lands constituting the first row of lands is greater than the amount of solder applied to the lands constituting the second row of lands. Another aspect of the present invention is, A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups comprises a row of lands arranged along a predetermined direction, When viewed from the direction normal to the base surface of the base member, the land is characterized in that, in a direction perpendicular to the predetermined direction, the width of the lower side of the land in the predetermined direction is smaller than the width of the upper side of the land in the predetermined direction. Another aspect of the present invention is, A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups comprises a row of lands arranged along a predetermined direction, The land is configured such that the portion that coincides with the outer edge of the mounting terminal of the electronic component in the predetermined direction is the widest, When viewed from the normal direction to the base surface of the base member, in the direction perpendicular to the predetermined direction, the width of the land decreases upward from the portion that coincides with the outer edge of the mounting terminal of the electronic component. The base member is characterized in that, when viewed from the normal direction to the base surface of the base member, in a direction G perpendicular to the predetermined direction, the width of the land decreases downward from the portion that coincides with the outer edge of the mounting terminal of the electronic component of the electronic component.

Effects of the Invention

[0012] According to the present invention, a base member mounted in MID (Middle-In-Depth) form factor can be provided that is suitable for housing in electronic devices. [Brief explanation of the drawing]

[0013] [Figure 1] Block diagram showing the configuration of the camera in the first embodiment of the present invention [Figure 2] External perspective view of the camera according to the first embodiment of the present invention [Figure 3] Exploded perspective view of the camera according to the first embodiment of the present invention [Figure 4] Perspective view showing the internal structure of the top cover unit of the first embodiment of the present invention. [Figure 5] Exploded perspective view and side view of the vibration detection unit of the first embodiment of the present invention [Figure 6] External perspective view, main section cross-sectional view, land shape plan view, via section cross-sectional perspective view, via section enlarged view of the sensor module of the first embodiment of the present invention [Figure 7] Side view of the sensor module of the first embodiment of the present invention [Figure 8] Side view, perspective view, and cross-sectional view of a via of a sensor module according to a second embodiment of the present invention. [Figure 9] Enlarged cross-sectional view, perspective cross-sectional view, and schematic diagram of the pattern wiring of a via in the third embodiment of the present invention. [Figure 10] Cross-sectional perspective view and cross-sectional view of a via in the fourth embodiment of the present invention [Figure 11] Plan view of the land shape of the fifth embodiment of the present invention [Figure 12] Plan view of the land shape of the sixth embodiment of the present invention [Figure 13] Plan view of the land shape of the seventh embodiment of the present invention [Figure 14] Side view and perspective view of the vibration detection unit of the eighth embodiment of the present invention [Modes for carrying out the invention]

[0014] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0015] MID (Molded Interconnect Device) refers to a molded resin product with pre-formed wiring and electrodes. [Examples]

[0016] A first embodiment of the present invention will be described below with reference to Figures 1 to 6.

[0017] (Block diagram showing an example configuration of digital camera 100) Figure 1 is a block diagram showing an example configuration of the digital camera (hereinafter referred to as camera) 100 of this embodiment. The camera 100 is a lens-interchangeable camera in which the lens unit 200 can be attached and detached.

[0018] Figure 2 is an external perspective view of camera 100.

[0019] The lens unit 200 shown in Figure 1 is fixed to the camera 100 by a lens mount 201 provided on the lens unit 200 and a lens mount 101 provided on the camera 100.

[0020] The lens unit 200 and the camera 100 are configured to communicate with each other via a connector 202 on the lens unit 200 and a connector 102 on the camera 100.

[0021] Specifically, the system control unit 307 and the lens drive control unit 203 communicate with each other.

[0022] Then, based on the signal from the system control unit 307, the lens drive control unit 203 controls the lens drive unit 204, which drives the aperture 211 and the lens 210.

[0023] The lens 210 is used to form an optical image from the subject onto the image sensor 302.

[0024] The shutter 301 is positioned between the image sensor 302 and the lens 210, and in the non-shooting state, it blocks light from the lens 210 to the image sensor 302.

[0025] During shooting, the shutter 301 is opened under the control of the system control unit 307 to enable the optical image from the lens 210 to be formed on the image sensor 302.

[0026] The image sensor 302 is an image sensor composed of a CCD or CMOS element, which converts an optical image into an electrical signal.

[0027] The A / D converter 304 converts analog signals into digital signals. The A / D converter 304 is used to convert analog signals output from the image sensor 302 into digital signals.

[0028] The image processing unit 305 performs resizing and color conversion processing, such as predetermined pixel interpolation and reduction, on the data from the A / D converter 304 or the data from the memory control unit 306.

[0029] Furthermore, the image processing unit 305 performs predetermined calculations using the captured image data, and the system control unit 307 performs exposure control and distance measurement control based on the obtained calculation results.

[0030] This enables TTL (Through-the-Lens) AF (Autofocus), AE (Automatic Exposure), and EF (Flash Pre-flash) processing.

[0031] The image processing unit 305 further performs predetermined calculations using the captured image data and also performs TTL-type AWB (auto white balance) processing based on the obtained calculation results.

[0032] The output data from the A / D converter 304 is written to the memory 308 via the image processing unit 305 and the memory control unit 306, or directly via the memory control unit 306.

[0033] The memory 308 stores image data for display on the display unit 105 or display unit 106, which has been converted into digital data by the A / D converter 304.

[0034] Additionally, memory 308 also serves as memory for image display (video memory).

[0035] The D / A converter 309 converts the image display data stored in the memory 308 into an analog signal and supplies it to the display unit 105 or the display unit 106.

[0036] In this way, the display image data written to the memory 308 is displayed by the display unit 105 or 106 via the D / A converter 309.

[0037] Display units 105 and 106 display information on an LCD or other display device according to the analog signal from the D / A converter 309.

[0038] The digital signal, which has been converted to digital by the A / D converter 304 and stored in the memory 308, is then converted to analog by the D / A converter 309.

[0039] Then, by sequentially transferring and displaying the images on the display unit 105 or the display unit 106, through-image display (live view display) can be performed.

[0040] The non-volatile memory 310 is a memory that can be electrically erased and recorded on, such as an EEPROM.

[0041] The non-volatile memory 310 stores constants, programs, and other information for the operation of the system control unit 307.

[0042] The system control unit 307 is a control unit having at least one processor, and controls the entire camera 100 and the lens unit 200.

[0043] RAM is used for the system memory 311. The system memory 311 stores constants and variables for the operation of the system control unit 307, as well as programs read from the non-volatile memory 310.

[0044] Furthermore, the system control unit 307 also performs display control by controlling the memory 308, D / A converter 309, display units 105 and 106, etc.

[0045] The system timer 312 is a timekeeping unit that measures the time used for various controls and the time of the built-in clock.

[0046] The first shutter switch 104a turns ON during the operation of the shutter button 104 on the camera 100, specifically when it is half-pressed (indicating preparation for shooting), and generates the first shutter switch signal SW1.

[0047] The first shutter switch signal SW1 initiates operations such as AF (autofocus), AE (automatic exposure), AWB (auto white balance), and EF (flash pre-flash).

[0048] The second shutter switch 104b turns ON when the shutter button 104 is fully pressed (instructing the camera to take a picture), generating the second shutter switch signal SW2.

[0049] The system control unit 307 drives the shutter blades 301a of the shutter 301 in response to the second shutter switch signal SW2.

[0050] Then, the system starts a series of shooting processes, from reading the signal from the image sensor 302 to writing the image data to the recording medium 330.

[0051] The shutter blades 301a move at high speed inside the shutter 301 in a direction perpendicular to the optical axis of the lens 210, and instantly stop moving when they collide with a stopper member (not shown) inside the shutter 301.

[0052] Each operating element of the control unit 108 is assigned a function as appropriate for each situation by selecting various function icons displayed on the display units 105 and 106, and acts as a function button.

[0053] Function buttons include, for example, an exit button, a back button, an image advance button, a jump button, a filter button, and an attribute change button.

[0054] For example, when the menu button is pressed, various configurable menu screens are displayed on the display unit 105 or the display unit 106.

[0055] The power is turned ON / OFF by the power switch 103.

[0056] The power control unit 313 consists of a battery detection circuit, a DC-DC converter, a switch circuit for switching which blocks are energized, and other components, and detects whether a battery is installed, its type, and its remaining charge.

[0057] Furthermore, the power control unit 313 controls the DC-DC converter based on its detection results and instructions from the system control unit 307, supplying the necessary voltage to each part, including the recording medium 330, for the required period of time.

[0058] The power supply unit 314 consists of primary batteries such as alkaline batteries and lithium batteries, secondary batteries such as NiCd batteries, NiMH batteries and Li batteries, and an AC adapter.

[0059] The recording medium I / F315 is an interface with recording media 330 such as memory cards and hard disks.

[0060] The recording medium 330 is a recording medium such as a memory card for recording captured images, and is composed of semiconductor memory, optical disks, magnetic disks, etc.

[0061] The communication unit 316 is connected wirelessly or via a wired cable and transmits and receives video signals, audio signals, and the like.

[0062] The communication unit 316 can also connect to a wireless LAN (Local Area Network) or the internet.

[0063] The communication unit 316 can transmit images captured by the image sensor 302 (including through images) and images recorded on the recording medium 330, and can also receive image data and other various information from external devices.

[0064] (Shake detection unit 320 / Gyro sensor) The vibration detection unit 320 is, for example, a gyro sensor that detects the amount of vibration of the camera.

[0065] The vibration detection unit 320 detects the vibration and amount of vibration in the camera 100 in three axial directions: pitch, yaw, and roll.

[0066] In the camera 100 shown in Figure 1, the image sensor drive unit 303 controls the movement of the image sensor 302 according to the amount of shake detected by the shake detection unit 320 to perform optical shake correction.

[0067] Furthermore, the image processing unit 305 electronically corrects the image for shake according to the amount of shake detected by the shake detection unit 320 under the control of the system control unit 307.

[0068] (Expanded perspective view of Camera 100) Figure 3 is an exploded perspective view of camera 100 with the front, rear, and bottom cover members removed.

[0069] The base plate 120 is a structural element that provides the strength for the camera 100, and the shutter 301, image sensor 302, image sensor drive unit 303, and system control unit 307 are fastened to the base plate 120 with screws (not shown).

[0070] The top cover unit 110 is fastened to the base plate 120 with screws (not shown).

[0071] (External perspective view of top cover unit 110) Figure 4(a) is an external perspective view of the top cover unit 110, and Figure 4(b) is an exploded perspective view of the top cover unit 110.

[0072] The top cover unit 110 consists of a top cover member 111 that covers the top surface of the camera 100, a power switch 103, a shutter button 104, and the like.

[0073] As shown in Figure 4(b), the vibration detection unit 320 is fastened to the center of the top cover member 111 with a screw 401.

[0074] (Expanded perspective view of the vibration detection unit 320) Figure 5(a) is an exploded perspective view of the vibration detection unit 320, and Figures 5(b) and (c) are external perspective views of the vibration detection unit 320.

[0075] The vibration detection unit 320 consists of plates 505 and 506, a buffer member 504, a sensor module 508, and a flexible substrate 502F.

[0076] The sensor module 508 includes gyro sensors 501P, 501R, and 501Y for measuring angular velocity, and an accelerometer 502A for detecting acceleration.

[0077] The sensor module 508 further includes three gyro sensors 501P, 501R, and 501Y, and a passive element 502R (see Figure 6) such as a resistor or capacitor for driving the accelerometer 502A.

[0078] The flexible substrate 502F has terminal portions 502D and 502E.

[0079] The terminal section 502D is connected to the connector 502C (see Figure 6) of the sensor module 508.

[0080] The terminal section 502E is electrically connected to a connector (not shown) that forms part of the path to the system control unit 307.

[0081] This configuration allows the sensor module 508 and the system control unit 307 to communicate with each other via the flexible substrate 502F.

[0082] Through this communication, the system control unit 307 can acquire the detected values ​​from the gyro sensors 501P, 501R, 501Y, and the acceleration sensor 502A.

[0083] The cushioning member 504 is made of an elastic material that absorbs vibrations, such as a sponge.

[0084] The vibration detection unit 320 has two cushioning members 504.

[0085] Furthermore, each of the two buffer members 504 is positioned on a different surface facing the sensor module 508, and is arranged to sandwich the sensor module 508.

[0086] In this embodiment, the gyro sensor 501Y is positioned on a surface substantially parallel to the main surface 503Y, which is the surface on which the gyro sensor 501Y is positioned.

[0087] Plates 505 and 506 have surfaces that are substantially parallel to the main surface 503Y, and plate 505 and plate 506 sandwich the sensor module 508 and the buffer member 504.

[0088] Furthermore, one cushioning member 504 is compressed by the plate 505 and the sensor module 508, and the other cushioning member 504 is compressed by the plate 506 and the sensor module 508.

[0089] Therefore, plates 505 and 506 are configured so as not to come into contact with the sensor module 508.

[0090] The vibration detection unit 320 is completed when plate 505 and plate 506 are fastened together with screws 507.

[0091] (Perspective view of sensor module 508) Figures 6(a) and (b) are external perspective views of the sensor module 508, and Figure 6(c) is a cross-sectional view of the main part of the sensor module 508.

[0092] The base member 503 shown in Figure 6 is a member for holding the gyro sensors 501P, 501R, and 501Y in predetermined positions, and is molded from a material such as plastic or LCP (liquid crystal polymer).

[0093] The base member 503 includes a first side wall 503P that is substantially perpendicular to the rotation axis in the pitch direction, a second side wall 503R that is substantially perpendicular to the rotation axis in the roll direction, and a main surface 503Y that is substantially perpendicular to the rotation axis in the yaw direction.

[0094] In other words, the first side wall 503P is perpendicular to the main surface 503Y, and the second side wall 503R is perpendicular to both the main surface 503Y and the first side wall 503P.

[0095] The gyro sensor 501P is mounted on the first side wall 503P, the gyro sensor 501R is mounted on the second side wall 503R, and the gyro sensor 501Y is mounted on the main surface 503Y.

[0096] The gyro sensors 501P, 501R, and 501Y are directly soldered to the land portions of the pattern wiring 500 on the base member 503.

[0097] The sensor module 508 is configured as described above.

[0098] Therefore, the gyro sensor 501P detects vibrations and vibration amounts in the pitch direction of the camera 100, the gyro sensor 501R detects vibrations and vibration amounts in the roll direction, and the gyro sensor 501Y detects vibrations and vibration amounts in the yaw direction.

[0099] Connector 502C is mounted on the side of the main surface 503Y opposite to the side on which the gyro sensor 501Y is mounted.

[0100] Here, the side of the main surface 503Y on which the gyro sensor 501Y is mounted is called the first surface 509, and the side of the main surface 503Y on which the connector 502C is mounted is called the second surface 510.

[0101] Furthermore, the acceleration sensor 502A is mounted on the second side wall 503R.

[0102] As shown in Figures 6(a) and (b), the pattern wiring 500 is directly wired to the base member 503.

[0103] Pattern wiring 500 is formed using MID technology.

[0104] MID technology is a technique that forms patterns by irradiating specific areas of a base material with a laser and applying metal plating only to the laser-irradiated areas.

[0105] This section describes the gyro sensors 501P, 501R, and 501Y that detect vibration, the accelerometer 502A, and the various passive elements 502R used to drive them.

[0106] The gyro sensors 501P, 501R, and 501Y, the acceleration sensor 502A, and the passive element 502R are mounted directly to the mounting land portion provided by the pattern wiring 500 on the base member 503 by soldering or the like.

[0107] Furthermore, the pattern wiring 500 allows for the necessary electrical connections between the gyro sensors 501P, 501R, 501Y, the accelerometer 502A, the passive element 502R, and the connector 502C.

[0108] Figure 6(c) is a cross-sectional view of the main part of the sensor module 508.

[0109] Here, if Z is the thickness of the main surface 503Y, and W is the shorter of the lengths of the first side wall 503P and the second side wall 503R in the direction perpendicular to the main surface 503Y, then W is greater than Z.

[0110] In addition, let A be the height of the higher side wall between the height of the first side wall 503P and the height of the second side wall 503R from the first surface 509, and let B be the height of the higher side wall between the first side wall 503P and the second side wall 503R from the second surface 510.

[0111] Furthermore, let C be the height from the first surface 509 to the top surface of the gyro sensor 501Y, and let D be the height from the second surface 510 to the top surface of the connector 502C.

[0112] In this case, A is greater than or equal to C, and B is greater than or equal to D.

[0113] In this embodiment, the configuration is as described above.

[0114] Therefore, the gyro sensor 501Y and the connector 502C do not protrude in a direction perpendicular to the main surface 503Y from the higher of the two side walls, the first side wall 503P and the second side wall 503R.

[0115] Therefore, the height of the sensor module 508 in the direction perpendicular to the main surface 503Y can be reduced.

[0116] Figure 6(d) shows an enlarged view of the land 522 formed on the first side wall 503P for mounting the gyro sensor 501P.

[0117] The gyro sensor 501P is mounted to the first side wall 503P by reflow soldering.

[0118] In Figure 6(d), the direction of gravity G is shown when melting the solder paste during reflow mounting of the gyro sensor 501P to the first side wall 503P.

[0119] Furthermore, H is perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0120] In typical reflow soldering onto a flat substrate, gravity always acts perpendicularly to the surface on which the component is mounted.

[0121] However, in the case of the vibration detection unit 320 of this embodiment, gyro sensors 501P, 501R, and 501Y are mounted on each of the three orthogonal surfaces.

[0122] Therefore, gravity acts on at least one of the gyro sensors 501P, 501R, and 501Y in a direction parallel to the surface on which it is mounted during reflow soldering.

[0123] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P with gravity acting in the direction of arrow G.

[0124] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G, causing it to shift from the desired mounting position in the direction of arrow G.

[0125] Therefore, of the two land rows A and B, each consisting of five lands, the amount of solder applied to the lower land row B in Figure 6(d) is made less than the amount of solder applied to the other land row A.

[0126] As a result, the surface tension caused by the solder applied to land row A becomes greater than the surface tension caused by the solder applied to land row B.

[0127] By doing so, the force acting on the gyro sensor 501P due to the surface tension of the solder is directed in the opposite direction to arrow G, canceling out the gravitational force acting on the gyro sensor 501P in the direction of arrow G, thereby preventing mounting misalignment due to gravity during reflow soldering.

[0128] As shown in Figures 6(a) and 6(b), the base member 503 is provided with multiple vias 510 for electrically connecting one surface of the main surface 503Y to the other surface.

[0129] Figure 6(e) is an enlarged cross-sectional perspective view of the base member 503 in the via 510 arrangement area, and Figure 6(f) is an enlarged cross-sectional view of the base member 503 in the via 510 arrangement area.

[0130] The structure of the mold for forming the base member is such that, since the main surface 503Y is the largest plane, the mold is configured to punch out in a direction perpendicular to the main surface 503Y, resulting in better productivity.

[0131] Therefore, in this embodiment, by arranging the vias 510 only on the main surface 503Y, the direction of the holes 512 in the vias 510 is made to coincide with the mold removal direction, thereby simplifying the mold structure.

[0132] In this embodiment, as shown in Figures 6(e) and (f), the via 510 has holes 512 shaped like two mortars stacked on top of each other, formed symmetrically with respect to the center in the thickness direction of the main surface 503Y.

[0133] The mortar has a shape in which the diameter is smallest at the center of the thickness direction of the main surface 503Y, and the diameter increases as it moves away from the center in the thickness direction.

[0134] If the diameter of the circle at the via apex 515 is the via diameter 514, the hole 512 opens up to the surface of the base member, with the diameter increasing at a constant via angle 513 starting from the via apex 515, and penetrates the base member 511.

[0135] A pattern is directly routed by MID on the inner wall of hole 512, spanning from one side of the main surface 503Y to the other.

[0136] Therefore, the patterns wired to one side and the other side of the base member 511 are electrically connected via the via 510.

[0137] The reason why the hole 512 in this embodiment is not a simple cylindrical hole penetrating the main surface Y, but has the shape described above, is to facilitate the irradiation of the inner wall of the hole 512 with a laser for pattern formation.

[0138] (Side view of sensor module 508) Figure 7 is a side view of the sensor module 508, where Figure 7(a) shows the first side wall 503P and Figure 7(b) shows the second side wall 503R.

[0139] In this embodiment, the gyro sensors 501Y, 501R, and 501P are approximately rectangular when viewed from a direction perpendicular to the surface on which they are mounted.

[0140] Therefore, the gyro sensor 501R has a long side 501Ra and a short side 501Rb, and the gyro sensor 501P has a long side 501Pa and a short side 501Pb.

[0141] In this embodiment, the gyro sensor 501R and the gyro sensor 501P are attached to the base member 503 such that the short sides 501Rb and 501Pb are parallel to the direction perpendicular to the main surface 503Y.

[0142] Therefore, the height of the first side wall 503P and the second side wall 503R in the direction perpendicular to the main surface 503Y can be reduced. [Examples]

[0143] The definition of a frustum in this invention is shown below.

[0144] A frustum is a three-dimensional figure obtained by removing a similar, scaled-down version of a cone that shares the same vertex. In other words, it is a three-dimensional figure enclosed by the cone's surface and two parallel planes.

[0145] A frustum formed from a cone is called a frustum of a cone, a frustum formed from a pyramidal pyramid is called a frustum of a pyramidal pyramid, and a frustum formed from an n-pyramid is called an n-pyramid of a pyramidal pyramid. n can be a pyramidal pyramid of 3, 4, 6, 8, etc.

[0146] In the following embodiment, a more preferred frustocone will be used as an example for explanation.

[0147] A second embodiment of the present invention will be described below with reference to Figure 8.

[0148] Figure 8(a) is a side view of the sensor module 900.

[0149] Figure 8(b) is an external perspective view of the sensor module 900.

[0150] Figure 8(c) is a cross-sectional view of a via located in the second portion 903 of the main surface 901 of the base member 904 of the sensor module 900.

[0151] The sensor module 900 is constructed by mounting a gyro sensor on a base member 904.

[0152] The thickness of the first portion 902 of the main surface 901 of the base member 904 is the same as the main surface 503Y of the base member 503 in Example 1.

[0153] The thickness of the second portion 903 of the main surface 901 is greater than the thickness of the main surface 503Y of the base member 503 in Example 1. Because of this configuration, the base member 904 in this embodiment has improved strength compared to the base member 503 in Example 1.

[0154] Note that in Figure 8, pattern wiring and passive components such as resistors and capacitors are omitted for ease of understanding.

[0155] The main surface 901 of the base member 904 is provided with a plurality of vias 510 of a first shape and a plurality of vias 905 of a second shape for electrically connecting one surface to the other surface.

[0156] Here, the first via 510 is formed in the first portion 902, and the second via 905 is formed in the second portion 903.

[0157] The first via 510 has the same shape as described in Example 1, so its description is omitted here.

[0158] The hole 908 of the second via 905 is the same shape as the first via 510 in that it resembles two mortars stacked on top of each other, but it differs in that its angle 906 is larger than the angle 513 of the first via 510.

[0159] A pattern is directly routed by MID on the inner wall of hole 908, spanning from one side of the main surface 901 to the other.

[0160] Therefore, the patterns wired to one side and the other side of the base member 904 are electrically connected via the via 905.

[0161] When the sensor module 900 is mounted on the camera 100 and in operation, the temperature of the sensor module 900 rises when in operation and decreases when it stops operating.

[0162] Due to these temperature fluctuations, the base member 904 of the sensor module 900 undergoes repeated thermal expansion and contraction.

[0163] The expansion and contraction of this base member 904 applies stress to the pattern formed on the inner wall of the hole 908.

[0164] In particular, stress concentration at via vertex 909 can cause significant stress, leading to pattern breakage.

[0165] A larger thickness of the main surface 901 results in greater stress on the pattern at the via vertex 909. Conversely, a larger via angle 906 results in less stress on the pattern at the via vertex 909.

[0166] In this embodiment, we consider the case where the via 510 of the first shape is placed in the second portion 903 which has a greater thickness.

[0167] In that case, compared to when it is placed in the first section 902, a larger stress is applied to the pattern at the via vertex 515, and there is a risk of pattern breakage on the inner wall of the via.

[0168] Therefore, the second section 903 is equipped with vias 905 of a second shape, which are expected to reduce the stress at the via vertex 909 compared to vias 510 of the first shape.

[0169] Furthermore, changing the via angle 906 to an obtuse angle may make it difficult to irradiate the inner wall of hole 908 with a laser for pattern formation.

[0170] Therefore, to facilitate laser irradiation of the inner wall of hole 908, it is advisable to increase the via diameter 907.

[0171] The following outlines the invention of this embodiment.

[0172] The base member 503 is a molded part on which pattern wiring is directly formed.

[0173] The base member 503 has vias 905 for electrically connecting one surface of the base surface 503Y that constitutes the base member 503 to the other surface opposite to that surface.

[0174] Via 905 has the same shape at the lower end of the first frustum-shaped hole and the same shape at the upper end of the second frustum-shaped hole.

[0175] Via 905 has a structure in which a pattern is formed on the inner wall of a hole 908 that overlaps so that the lower end of the first hole and the upper end of the second hole are in contact with each other, and this pattern is formed across one surface and the other surface of the base surface 503Y.

[0176] The shape of the first hole and the second hole widens as they approach one side and the other side of the base surface (503Y), starting from the point where the lower end of the first hole and the upper end of the second hole meet.

[0177] The smaller of the angles between the generatrix of the first hole and the generatrix of the second hole (twice the angle of 513, 906) is smaller in the region where the base member 503 is thinner than in the region where the base member 503 is thicker.

[0178] The base member 503 has vias (905) for electrically connecting one surface of the base surface 503Y that constitutes the base member 503 to the other surface opposite to the said surface.

[0179] Via 905 has identical shapes at the lower end of the first pyramidal hole and the upper end of the second pyramidal hole.

[0180] Via 905 has a structure in which a pattern is formed on the inner wall of a hole 908 that overlaps so that the lower end of the first hole and the upper end of the second hole are in contact with each other, and this pattern is formed across one surface and the other surface of the base surface 503Y.

[0181] The shape of the first hole and the second hole widens as they approach one side and the other side of the base surface (503Y), starting from the point where the lower end of the first hole and the upper end of the second hole meet.

[0182] The smaller of the angles formed by the side surface of the first hole and the side surface of the second hole that is in contact with the side surface of the first hole (twice the angle of 513, 906) is smaller in the region where the base member (503) is thinner than in the region where the base member (503) is thicker. [Examples]

[0183] A third embodiment of the present invention will be described below with reference to Figure 9.

[0184] Example 5 explained that making the via angle 906 obtuse is effective in preventing pattern breakage when the via formation surface is thick.

[0185] In this embodiment, we will describe an example in which a concave shape is provided around the hole 1002 that constitutes a via 1000 formed in the base member 1001 that constitutes the vibration detection unit.

[0186] Figure 9(a) is a cross-sectional view of a via 1000 formed on the base member 1001, and Figures 9(b) and 9(c) are cross-sectional perspective views of a via 1000 formed on the base member 1001.

[0187] Figure 9(d) is a schematic diagram of the pattern wiring around via 1000.

[0188] The hole 1002 of via 1000 is shaped like two mortars stacked on top of each other, which is the same as via 510 in Example 1.

[0189] However, it differs in that a concave shape is provided in the base member 1001 surrounding the via 1000.

[0190] Because of this shape, the thickness of the base member 1001 in the via arrangement area becomes locally thinner, which can alleviate the stress applied to the pattern at the via apex 1003.

[0191] The concave shape 1004 can be, but is not limited to, the shapes shown in Figure 9(b) or Figure 9(c).

[0192] Another benefit of providing the concave shape 1004 is that it reduces the diameter of the via hole 1002 on the surface of the base member 1001.

[0193] This effect allows for a wider wiring area on the surface of the base member 1001.

[0194] As shown in Figure 9(d), another signal wire 1006 can be placed near the signal 1005 that is electrically connected to the via.

[0195] The following outlines the invention of this embodiment.

[0196] The base component 503 is an injection-molded part with a patterned wiring directly formed on it. In other words, it is a MID (Mixed Injection Deposition) component.

[0197] The base member 503 has vias (1000) for electrically connecting one surface of the base surface 503Y that constitutes the base member 503 to the other surface opposite to the said surface.

[0198] Via 1000 has the same shape at the lower end of the first frustum-shaped hole and the same shape at the upper end of the second frustum-shaped hole.

[0199] The via 1000 has a structure in which a pattern is formed on the inner wall of a hole 1002 that overlaps so that the lower end of the first hole and the upper end of the second hole are in contact with each other, and the pattern is formed across one surface and the other surface of the base surface 503Y.

[0200] The shape of the first hole and the second hole widens as they approach one side and the other side of the base surface 503) from the point where the lower end of the first hole and the upper end of the second hole meet.

[0201] The thickness of the perimeter 1004 of the base member 503 where the vias 1000 are placed is thinner than the thickness of the base member 503 where the vias 1000 are not placed. [Examples]

[0202] A fourth embodiment of the present invention will be described below with reference to Figure 10.

[0203] In this embodiment, an example is described in which the hole 1100 constituting the via 1107 formed in the base member 1101 constituting the vibration detection unit does not have a mortar-shaped form with respect to the thickness center of the base member 1101.

[0204] Figure 10(a) is a cross-sectional perspective view of the base member 1101 near a via 1107 directly formed on the base member 1101, and Figure 10(b) is a cross-sectional view of the base member 1101 near the via 1107.

[0205] Here, the hole 1100 is defined as having a distance L1 to one surface of the base member 1101 and a distance L2 to the other surface of the base member 1101, with the via vertex 1106 as the reference point.

[0206] At that time, a mortar-shaped structure is formed with a via angle of 1103 that satisfies the relationship L2 > L1.

[0207] In this embodiment, the configuration allows for a shift in the position of the center of the thickness of the base member 1101, where the stress is greatest, and the position of the via vertex 1106 where the stress is concentrated, thereby mitigating the stress applied to the pattern at the vertex 1106.

[0208] Furthermore, although the via diameter 1105 on one side of the surface of the base member 1101 becomes larger, the via diameter 1104 on the other side of the surface of the base member 1101 can be made smaller.

[0209] Therefore, by placing the smaller via diameter 1104 side towards the area with a higher pattern wiring density, pattern wiring efficiency can be improved.

[0210] The following outlines the invention of this embodiment.

[0211] The base member 503 is an injection-molded part on which pattern wiring is directly formed.

[0212] The base member 503 has vias 1107 for electrically connecting one surface of the base surface 503Y that constitutes the base member 503 to the other surface opposite to the said surface.

[0213] Via 1107 has the same shape at the lower end of the first frustum-shaped hole and the same shape at the upper end of the second frustum-shaped hole.

[0214] Via 1107 has a structure in which a pattern is formed on the inner wall of hole 1100, which is shaped so that the lower end of the first hole and the upper end of the second hole are in contact with each other, and the pattern is formed across one surface and the other surface of the base surface 503Y.

[0215] The shape of the first hole and the second hole widens as they approach one side and the other side of the base surface 503Y, starting from the point where the lower end of the first hole and the upper end of the second hole meet.

[0216] The width L1 of the first hole in the direction perpendicular to the base surface 503Y is different from the width L2 of the second hole in the direction perpendicular to the base surface 503Y.

[0217] When viewed from the direction in which the base surface extends, the thickness of the perimeter 1004 of the base member 503 where the vias 1000 are placed is thinner than the thickness of the base member 503 where the vias 1000 are not placed. [Examples]

[0218] A fifth embodiment of the present invention will be described below with reference to Figure 11.

[0219] Note that in Figure 11, passive elements such as gyro sensors, resistors, and capacitors are omitted for ease of understanding.

[0220] (Enlarged view of the land 522 for mounting the gyro sensor 501P, formed on the first side wall 503P) Figure 11 shows an enlarged view of the land 522 formed on the first side wall 503P for mounting the gyro sensor 501P.

[0221] The gyro sensor 501P is mounted to the first side wall 503P by reflow soldering.

[0222] In Figure 14, the direction of gravity G is represented by the direction of gravity when melting the solder paste during reflow mounting of the gyro sensor 501P to the first side wall 503P.

[0223] Furthermore, H is perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0224] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P with gravity acting in the direction of arrow G.

[0225] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G, causing it to shift from the desired mounting position in the direction of arrow G.

[0226] Therefore, of the two land rows A and B, each consisting of five lands 522, the amount of solder applied to the lower land row B in Figure 14 is made less than the amount of solder applied to the other land row A.

[0227] As a result, the surface tension caused by the solder applied to land row A becomes greater than the surface tension caused by the solder applied to land row B.

[0228] By doing so, the force acting on the gyro sensor 501P due to the surface tension of the solder is directed in the opposite direction to arrow G, canceling out the gravitational force acting on the gyro sensor 501P in the direction of arrow G, thereby preventing mounting misalignment due to gravity during reflow soldering.

[0229] In this case, the size of each land 522 that makes up the lower land row B in Figure 11 is made smaller than the size of each land that makes up the other land row A.

[0230] Therefore, the size of the pads becomes appropriate for the amount of solder, preventing problems such as solder overflowing from the pads when solder is applied to row A, which has a large amount of solder.

[0231] The following outlines the invention of this embodiment.

[0232] The base member 503 is a molded part on which pattern wiring is directly formed.

[0233] The two non-parallel surfaces 503Y and 503P of the base member 503 each have a group of lands formed therein for soldering electronic components 501Y and 501P, respectively.

[0234] At least one of the land groups consists of a first land row A, in which multiple lands 522 are arranged along a first direction H, and a second land row B, in which multiple lands 522 are arranged along the first direction H, both arranged along a second direction G, which is different from the first direction.

[0235] When viewed from the direction normal to the base surface of the base member, the first row of land A is positioned above the second row of land B in the second direction of the surface.

[0236] The area of ​​the 522 lands that make up the first land row A is larger than the area of ​​the 522 lands that make up the second land row B.

[0237] When viewed from the direction normal to the base surface of the base member, the first row of lands A is positioned above the second row of lands B in the second direction of the surface.

[0238] The amount of solder applied to land 522, which constitutes the first land row A, is greater than the amount of solder applied to land 522, which constitutes the second land row B.

[0239] In Figure 11, the amount of solder applied to areas with a large area of ​​lands 522 constituting the first land row A is greater than the amount of solder applied to areas with a small area of ​​lands 522 constituting the second land row B.

[0240] As a variation of Figure 11, it can also be adapted to a configuration where the area of ​​the lands constituting the third land row in the upper section is the same as the area of ​​the lands constituting the fourth land row in the lower section.

[0241] In that case, the amount of solder applied to the lands constituting the third row of lands in the upper section is greater than the amount of solder applied to land 522 constituting the fourth row of lands.

[0242] The effects and benefits shown in Figure 11 can be obtained.

[0243] The second direction G is perpendicular to the first direction.

[0244] The two non-parallel surfaces 503Y and 503P of the base member 503 each have a group of lands formed on them for soldering electronic components 501Y and 501P by reflow soldering.

[0245] The second direction is the direction of gravity G during solder melting in reflow soldering. [Examples]

[0246] A sixth embodiment of the present invention will be described below with reference to Figure 12.

[0247] (Enlarged view of the land 1302 for mounting the gyro sensor 501P, formed on the first side wall 503P) Note that in Figure 12, passive elements such as gyro sensors, resistors, and capacitors are omitted for ease of understanding.

[0248] Figure 12 shows an enlarged view of the land 1302 formed on the first side wall 503P for mounting the gyro sensor 501P.

[0249] The gyro sensor 501P is mounted to the first side wall 503P by reflow soldering.

[0250] In Figure 12, the direction of gravity G is represented by the direction of gravity when melting the solder paste during reflow mounting of the gyro sensor 501P to the first side wall 503P.

[0251] Furthermore, H is perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0252] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P with gravity acting in the direction of arrow G.

[0253] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G, causing it to shift from the desired mounting position in the direction of arrow G.

[0254] In this embodiment, the width of the 10 lands 1302 is varied along the direction of arrow G.

[0255] More specifically, the shape is designed so that the width of land 1302 decreases in accordance with the direction of gravity G.

[0256] As the width of the land increases, the force acting on the gyro sensor 501P due to the surface tension of the solder increases.

[0257] Therefore, by forming the land into the above shape, the force acting on the gyro sensor 501P due to the surface tension of the solder is made in the direction opposite to the arrow G.

[0258] And, it is possible to cancel the gravity in the direction of the arrow G acting on the gyro sensor 501P and prevent the mounting deviation due to gravity during the reflow mounting.

[0259] The outline of the invention of this embodiment is shown below.

[0260] The base member 503 is a molded part on which pattern wiring is directly formed.

[0261] On the different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, land groups for solder-mounting the electronic components 501Y and 501P are formed respectively.

[0262] When viewed from the normal direction of the base surface of the base member, at least one of the land groups includes a land row in which a plurality of lands are arranged along a predetermined direction H.

[0263] When viewed from the normal direction of the base surface of the base member, the land 1302 is characterized in that, in a direction orthogonal to the predetermined direction, the width of the lower side of the land in the predetermined direction of the land is smaller than the width of the upper side of the land in the predetermined direction of the land.

[0264] On the different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, land groups for solder-mounting the electronic components 501Y and 501P by reflow mounting are formed.

[0265] The direction orthogonal to the predetermined direction is the direction of gravity during the melting of the solder in the reflow mounting.

Embodiment

[0266] Hereinafter, an embodiment of the seventh aspect of the present invention will be described with reference to Figure 13.

[0267] Note that in Figure 13, passive elements such as gyro sensors, resistors, and capacitors are omitted for ease of understanding.

[0268] (Enlarged view of the land 1402 for mounting the gyro sensor 501P, formed on the first side wall 503P) Figure 13 shows an enlarged view of the land 1402 formed on the first side wall 503P for mounting the gyro sensor 501P.

[0269] The gyro sensor 501P is mounted to the first side wall 503P by reflow soldering.

[0270] In Figure 13, the shape of the gyro sensor 501P is schematically represented by a dashed line.

[0271] The mounting terminal 1403 is a connection terminal for mounting the gyro sensor 501P onto land 1402.

[0272] In Figure 13, the position and shape of terminal 1403 are schematically represented by a dashed line.

[0273] In Figure 13, the direction of gravity G is represented by the direction of gravity when melting the solder paste during reflow mounting of the gyro sensor 501P to the first side wall 503P.

[0274] Furthermore, H is perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0275] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P with gravity acting in the direction of arrow G.

[0276] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G, causing it to shift from the desired mounting position in the direction of arrow G.

[0277] In this embodiment, the widths of a total of 10 lands are changed along the direction of arrow G.

[0278] More specifically, the width of the land at the position that coincides with the end located outside the gyro sensor 501P of the mounting terminal 1403 in the direction of arrow G is made the widest according to the direction of gravity G.

[0279] And it is shaped such that the width of the land decreases as it moves away along the direction of arrow G from the position that coincides with the end of the mounting terminal 1403.

[0280] The place where the width of the land is the largest is the place where the force acting on the gyro sensor 501P due to the surface tension of the solder is the largest.

[0281] Therefore, during the reflow mounting, the end of the mounting terminal 1403 of the gyro sensor 501P located outside the gyro sensor 501P is maintained at the position where the width of the land is the largest, and the mounting deviation due to gravity can be prevented.

[0282] The outline of the invention of this embodiment is shown below.

[0283] The base member 503 is a molded part on which pattern wiring is directly formed.

[0284] On different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, land groups for soldering and mounting the electronic components 501Y and 501P are respectively formed.

[0285] When viewed from the normal direction of the base surface of the base member, at least one of the land groups includes a land row A or B in which a plurality of lands 1402 are arranged along a predetermined direction H.

[0286] The land 1402 is configured such that the portion that coincides with the outer end of the electronic component 501P of the mounting terminal 1403 of the electronic component 501P is the widest in a predetermined direction.

[0287] In the direction G perpendicular to the predetermined direction, the width of the land 1402 decreases as it extends upward from the portion of the mounting terminal 1403 of the electronic component 501P that coincides with the outer edge of the electronic component 501P.

[0288] When viewed from the direction normal to the base surface of the base member, in the direction G perpendicular to a predetermined direction, the land width decreases downwards from the portion that coincides with the outer edge of the electronic component at the mounting terminal of the electronic component.

[0289] The two non-parallel surfaces 503Y and 503P of the base member 503 each have a group of lands formed on them for soldering electronic components (501Y and 501P) by reflow soldering.

[0290] The direction perpendicular to the predetermined direction is the direction of gravity G during solder melting in reflow soldering. [Examples]

[0291] An eighth embodiment of the present invention will be described below with reference to Figure 14.

[0292] (Base component 1500 for pattern wiring and mounting configuration) Figure 14 shows a base member 1500 with a pattern wiring and mounting configuration similar to that of the base member 503 described in Example 1.

[0293] Direct pattern wiring 1502 is formed on the base member 1500, and the mounted components 1501 are directly mounted on it.

[0294] In Figure 14, the direction of gravity G is represented by the direction of gravity when melting the solder paste during reflow mounting of the gyro sensor 501P to the first side wall 503P.

[0295] Furthermore, H is perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0296] Here, a vertical wall 1503 of arbitrary height is placed on the base member 1500 on the G-direction side of the mounted component 1501 so as to be in contact with the mounted component 1501 along the H-direction.

[0297] Therefore, it is possible to prevent mounted components from shifting or falling due to gravity during soldering in the mounting process.

[0298] Here, we show an embodiment in which the vertical wall 1503 is divided and provided in a way that avoids the pattern wiring 1502 that is directly wired to the base member 1500.

[0299] Alternatively, the wiring pattern 1502 may be routed so that it spans across the vertical wall 1503, without dividing the vertical wall 1503.

[0300] [Other examples] Although preferred embodiments of the present invention have been described above, the configuration of the present invention is not limited to those illustrated in the above embodiments.

[0301] The material, shape, dimensions, form, number, placement, etc., can be modified as appropriate without departing from the spirit of the present invention.

[0302] Furthermore, the present invention has been described using an internal camera of an electronic device and a smartphone as examples of these embodiments.

[0303] It can be applied to a wide variety of electronic devices, including personal computers, tablet devices, gaming consoles, drones, automobiles, and their peripherals. [Explanation of Symbols]

[0304] 500 patterns 501 Sensor 501Y First Sensor 501P Second Sensor 501R Third Sensor 503 Base component 503Y Main surface 503P First side wall 503R Second side wall 508 Sensor Module

Claims

1. A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups has a first land row in which a plurality of lands are arranged along a first direction, and a second land row in which a plurality of lands are arranged along the first direction, both arranged along a second direction which is different from the first direction. When viewed from the direction normal to the base surface of the base member, the first row of lands is positioned above the second row of lands in the second direction of the surface. A base member characterized in that the area of ​​the lands constituting the first row of lands is larger than the area of ​​the lands constituting the second row of lands.

2. A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups has a first land row in which a plurality of lands are arranged along a first direction, and a second land row in which a plurality of lands are arranged along the first direction, both arranged along a second direction which is different from the first direction. When viewed from the direction normal to the base surface of the base member, the first row of lands is positioned above the second row of lands in the second direction of the surface. A base member characterized in that the amount of solder applied to the lands constituting the first row of lands is greater than the amount of solder applied to the lands constituting the second row of lands.

3. The base member according to claim 1 or 2, wherein the second direction is perpendicular to the first direction.

4. The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components by reflow soldering. The base member according to any one of claims 1 to 3, characterized in that the second direction is the direction of gravity during solder melting in reflow soldering.

5. A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups comprises a row of lands arranged along a predetermined direction, The base member is characterized in that, when viewed from the direction normal to the base surface of the base member, the land has a lower width in the predetermined direction that is smaller than the upper width in the predetermined direction, in a direction perpendicular to the predetermined direction.

6. The base member according to claim 5, characterized in that the non-parallel surfaces of the base member each have a group of lands formed thereon for soldering electronic components by reflow soldering, and the direction perpendicular to the predetermined direction is the direction of gravity when the solder melts during reflow soldering.

7. A base member which is a molded part on which pattern wiring is directly formed, The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components. When viewed from the direction normal to the base surface of the base member, at least one of the land groups comprises a row of lands arranged along a predetermined direction, The land is configured such that the portion that coincides with the outer edge of the mounting terminal of the electronic component in the predetermined direction is the widest, When viewed from the normal direction to the base surface of the base member, in the direction perpendicular to the predetermined direction, the width of the land decreases upward from the portion that coincides with the outer edge of the mounting terminal of the electronic component. The base member is characterized in that, when viewed from the normal direction to the base surface of the base member, in a direction G perpendicular to the predetermined direction, the width of the land decreases downward from the portion that coincides with the outer edge of the mounting terminal of the electronic component of the electronic component.

8. The non-parallel surfaces of the base member each have a group of lands formed on them for soldering electronic components by reflow soldering. The base member according to claim 7, characterized in that the direction perpendicular to the predetermined direction is the direction of gravity during solder melting in reflow mounting.

9. An electronic device equipped with a base member according to any one of claims 1 to 8.

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