Cutting device

The cutting apparatus addresses the issue of liquid splatter by using a trough on the partition plate to collect and direct liquid away from the workpiece, ensuring minimal contamination and damage during cutting operations.

JP7839057B2Active Publication Date: 2026-04-01DISCO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-08-30
Publication Date
2026-04-01

AI Technical Summary

Technical Problem

Liquid containing cutting chips may splatter onto the workpiece held by the holding table during the cutting process, potentially damaging the workpiece and adhering cutting chips when dried.

Method used

A cutting apparatus with a partition plate featuring a trough on the cutting area side, positioned to avoid overlapping with the holding table, collects and directs liquid away from the workpiece, reducing the likelihood of liquid dripping onto the workpiece during movement between cutting and loading/unloading areas.

Benefits of technology

The apparatus effectively reduces the probability of liquid containing cutting chips dripping onto the workpiece, minimizing damage and chip adherence during the cutting process.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a cutting device that can reduce a probability that liquid including chips may drop on a work-piece held on a holding table from a partition plate.SOLUTION: In a cutting device, a tub, which is positioned so that one end and the other end thereof do not overlap with a holding table in a planar view, when moving the holding table between a cutting area and a carry-in / out area and is formed to collect liquid and then drop the liquid through at least either of the one end and the other end, is provided on a surface near the cutting area of a partition plate. When a work-piece is cut in the cutting area of the cutting device, liquid including chips is scattered to adhere to the partition plate. Most of the liquid adhering to the partition plate flows along the partition plate to the tub. Further the liquid flowing to the tub flows toward the at least either of the one end and the other end of the tub and then is dropped. This can reduce a probability that the liquid including chips may drop on the work-piece held on the holding table from the partition plate.SELECTED DRAWING: Figure 4
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Description

Technical Field

[0001] The present invention relates to a cutting device for cutting a workpiece.

Background Art

[0002] Chips of devices such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, by dividing a workpiece such as a wafer having a large number of devices formed on its surface into regions each including an individual device. As a method for dividing the workpiece, for example, cutting in a cutting device can be mentioned.

[0003] The cutting device includes a holding table for holding a workpiece and a cutting unit having a spindle with an annular cutting blade attached to its tip for cutting the workpiece held by the holding table. In the cutting device, the workpiece is cut by bringing the cutting blade into contact with the workpiece held on the chuck table while rotating the cutting blade together with the spindle.

[0004] Here, if the loading of the workpiece onto the holding table and the unloading from the holding table are performed in a region close to the cutting blade, the workpiece may come into contact with the cutting blade and be damaged. Therefore, in the cutting device, generally, a space for cutting the workpiece (cutting region) and a space for loading and unloading the workpiece (loading / unloading region) are provided separately so as to be adjacent to each other, and the holding table is movable between the cutting region and the loading / unloading region.

[0005] In addition, in the cutting device, an operator may manually load and unload the workpiece. In this case, there is a risk that the operator may come into contact with the cutting blade and be damaged. In view of this point, it has been proposed to provide a partition plate between the cutting region and the loading / unloading region (see, for example, Patent Document 1).

Prior Art Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2012-178511 [Overview of the project] [Problems that the invention aims to solve]

[0007] As described above, when a workpiece is cut, chips (cutting debris) are generated, and the workpiece and cutting blade are heated by frictional heat. Therefore, cutting of a workpiece is often performed with a liquid supplied to the contact interface (cutting point) between the workpiece and the cutting blade to clean and cool both the workpiece and the cutting blade.

[0008] However, in this case, the liquid containing cutting chips may splatter into the surrounding area and adhere to the partition plate installed between the cutting area and the loading / unloading area. This liquid may then drip from the partition plate onto the workpiece held by the holding table while the holding table is moving between the cutting area and the loading / unloading area.

[0009] Furthermore, when the workpiece to which this liquid has been dripped is dried, there is a risk that cutting chips will adhere to the workpiece. In view of this, an object of the present invention is to provide a cutting apparatus that can reduce the probability that liquid containing cutting chips will drip from the partition plate onto the workpiece held by the holding table. [Means for solving the problem]

[0010] In the present invention, a cutting apparatus for cutting a workpiece comprises a holding table for holding the workpiece, a cutting unit having a spindle with an annular cutting blade attached to its tip for cutting the workpiece held by the holding table, a liquid supply unit for supplying liquid to the contact interface between the workpiece and the cutting blade when the workpiece held by the holding table is cut by the cutting blade, and a cutting region in which the cutting of the workpiece held by the holding table is performed by the cutting blade, and the loading of the workpiece onto the holding table. A cutting apparatus is provided, comprising a moving mechanism for moving the holding table between the holding table and an loading / unloading area where the liquid is discharged from the holding table, and a partition plate provided above the moving mechanism to separate the cutting area from the loading / unloading area, wherein the side of the partition plate facing the cutting area is provided with a trough that is positioned so that, in a plan view, when the holding table is moved between the cutting area and the loading / unloading area by the moving mechanism, one end and the other end do not overlap the holding table, and that is shaped to collect the liquid and drip it from at least one of the one or the other end.

[0011] Preferably, the gutter is integrated with the partition plate. [Effects of the Invention]

[0012] In the cutting apparatus of the present invention, when the holding table is moved between the cutting area and the loading / unloading area by a moving mechanism, a trough is provided on the cutting area side surface of the partition plate, which is positioned so that in a plan view, one end and the other end do not overlap with the holding table, and which has a shape that collects liquid and drips it from at least one of the one or the other end.

[0013] When a workpiece is cut in the cutting area of ​​this cutting device, the liquid containing cutting chips is scattered and adheres to the partition plate. Much of the liquid that adheres to the partition plate then flows down the partition plate and reaches the trough. The liquid that reaches the trough then flows and drips down towards at least one end of the trough.

[0014] Therefore, in the cutting apparatus of the present invention, it is possible to reduce the probability that liquid containing cutting chips will drip from the partition plate onto the workpiece held by the holding table while the holding table is being moved between the cutting area and the loading / unloading area. [Brief explanation of the drawing]

[0015] [Figure 1] Figure 1 is a schematic perspective view showing an example of a cutting apparatus for cutting a workpiece. [Figure 2] Figure 2 is a schematic perspective view showing the components located inside a pair of doors attached to the housing of a cutting machine. [Figure 3] Figure 3 is a schematic front view showing the components located inside a pair of doors attached to the housing of the cutting machine. [Figure 4] Figure 4 is a schematic side view showing the components located inside a pair of doors attached to the housing of the cutting machine. [Modes for carrying out the invention]

[0016] Embodiments of the present invention will be described with reference to the attached drawings. Figure 1 is a schematic perspective view showing an example of a cutting apparatus for cutting a workpiece. Note that the X-axis direction (left-right direction, machining feed direction) and the Y-axis direction (front-back direction, indexing feed direction) shown in Figure 1 are mutually orthogonal directions on the horizontal plane, and the Z-axis direction (up-down direction, cutting feed direction) is perpendicular to the X-axis direction and the Y-axis direction (vertical direction).

[0017] The cutting device 2 shown in Figure 1 has a housing 4 that is shaped like a rectangular parallelepiped with one side of the front upper part recessed. A pair of adjacent doors 6 and 8 are attached to the recessed part of the housing 4. A pair of handles 10 and 12 are provided on each of the doors 6 and 8.

[0018] The door 6 is opened and closed according to the pushing and pulling of the handle 10. Also, the door 8 is opened and closed by sliding along the X-axis direction of the handle 12, and at least a part of it is housed in a part located on the side of the recessed part of the housing 4. Further, when the door 6 is opened, for example, access to a space (loading / unloading area) for loading and unloading the workpiece becomes possible. Also, when the door 8 is opened, for example, access to a space (cutting area) for cutting the workpiece becomes possible.

[0019] Furthermore, above the door 6, a touch panel 14 that functions as a user interface is provided. This touch panel 14 is composed of, for example, an input unit such as a touch sensor using a capacitance method or a resistive film method, and a display unit such as a liquid crystal display or an organic EL (Electro Luminescence) display.

[0020] FIG. 2 is a perspective view schematically showing the components located inside the pair of doors 6 and 8, FIG. 3 is a front view schematically showing the components located inside the pair of doors 6 and 8, and FIG. 4 is a side view schematically showing the components located inside the pair of doors 6 and 8.

[0021] In FIG. 2, for the sake of convenience, the sides of the surfaces of the pair of closed doors 6 and 8 are shown by a two-dot chain line, and the workpiece 11 described later is omitted. Also, in FIG. 3, for the sake of convenience, the dust and splash-proof cover 20 described later is omitted. Further, in FIG. 4, for the sake of convenience, the dust and splash-proof cover 20, the cutting unit 30, and the liquid supply unit 36 described later are omitted.

[0022] Inside the pair of doors 6 and 8, there are respectively a cutting area A and a loading / unloading area B adjacent in the X-axis direction. Below the cutting area A and the loading / unloading area B, a flat plate-shaped base 16 extending along the X-axis direction is provided.

[0023] Above the base 16, there is a flat table cover 18 and a pair of bellows-shaped dustproof and waterproof covers 20 connected to the table cover 18 so as to sandwich it in the X-axis direction. A holding table 22 is also provided above the table cover 18.

[0024] The holding table 22 has a disc-shaped frame 22a. The frame 22a has a disc-shaped bottom wall and cylindrical side walls that rise from this bottom wall. A disc-shaped porous plate 22b, for example, made of porous ceramics, is fixed to the recess defined by the bottom wall and side walls of the frame 22a.

[0025] The porous plate 22b has a diameter approximately equal to the inner diameter of the side wall of the frame 22a. Furthermore, the porous plate 22b communicates with a suction source (not shown), such as an ejector, through through holes formed in the bottom wall of the frame 22a. In addition, the upper surface of the side wall of the frame 22a and the upper surface (holding surface) of the porous plate 22b are generally flat surfaces perpendicular to the Z-axis direction.

[0026] The workpiece 11, such as a wafer, is then held on the holding surface of the holding table 22. Specifically, when the workpiece 11 is placed on the holding surface of the holding table 22 and the suction source communicating with the porous plate 22b is activated, a suction force acts on the workpiece 11, causing it to be held by the holding table 22.

[0027] Furthermore, the upper end of a cylindrical support shaft 24, which extends along the Z-axis direction, is connected to the lower central part of the holding table 22. The lower end of this support shaft 24 is connected to a rotational drive source (not shown), such as a motor, which is located inside the base 16. When this rotational drive source is operated, the holding table 22 and the support shaft 24 rotate with a rotation axis that passes through the center of the upper surface of the porous plate 22b and along the Z-axis direction.

[0028] Furthermore, the holding table 22, support shaft 24, and rotational drive source are connected to a ball screw type holding table moving mechanism (not shown) located inside the base 16. When this holding table moving mechanism is operated, the holding table 22, support shaft 24, and rotational drive source move along the X-axis between the cutting area A and the loading / unloading area B. In addition, the table cover 18 moves along with these movements, and the dustproof and waterproof cover 20 expands and contracts.

[0029] Furthermore, a partition plate 26 is provided at the boundary between the cutting area A and the loading / unloading area B. A rectangular opening 26a is formed at the bottom of this partition plate 26. When the holding table 22 that holds the workpiece 11 moves between the cutting area A and the loading / unloading area B, the holding table 22 and the workpiece 11 move through this opening 26a.

[0030] Furthermore, a trough 28 is provided on the surface 26b of the partition plate 26 on the cutting area A side. This trough 28 is integrated with the partition plate 26 and includes a horizontal portion 28a that extends laterally from the surface 26b and a vertical portion 28b that extends upright from the tip of the horizontal portion 28a (see Figure 3). In addition, the vertical cross-section of the trough 28 (cross-section parallel to the X-axis and Z-axis directions) has an L-shape.

[0031] Furthermore, the trough 28 has a length along the Y-axis that is longer than the holding table 22 (see Figure 4). In other words, one end 28c and the other end 28d of the trough 28 in the Y-axis direction are positioned so that they do not overlap with the holding table 22 in a plan view when the holding table 22 is moved between the cutting area A and the loading / unloading area B. In addition, the trough 28 is inclined such that one end 28c is higher than the other end 28d in the Y-axis direction.

[0032] Furthermore, a cutting unit 30 and a liquid supply unit 36 ​​are provided in the cutting area A (see Figure 3). The cutting unit 30 has a spindle 32 to which a servo motor is connected at its base end. An annular cutting blade 34 is mounted on the tip of this spindle 32.

[0033] The liquid supply unit 36 ​​has a pair of L-shaped nozzles 38 positioned to sandwich the lower end of the cutting blade 34 in the Y-axis direction, and a nozzle 40 positioned adjacent to the cutting blade 34 in the X-axis direction. These nozzles 38 and 40 are connected to the cutting unit 30 and communicate with a liquid supply source (not shown) via valves (not shown) and piping (not shown), etc.

[0034] Furthermore, the cutting unit 30 is connected to a ball screw type cutting unit movement mechanism (not shown). When this cutting unit movement mechanism is operated, the spindle 32, cutting blade 34, and nozzles 38, 40 move along the Y-axis and / or Z-axis.

[0035] In the cutting device 2, the cutting blade 34 is rotated together with the spindle 32, and while supplying liquid near the lower end of the cutting blade 34, the holding table 22 and / or cutting unit 30 that holds the workpiece 11 is moved so that the lower end of the cutting blade 34 and the workpiece 11 come into contact in the cutting area A, thereby cutting the workpiece 11.

[0036] At this time, as liquid is supplied to the contact interface (machining point) between the rotating cutting blade 34 and the workpiece 11, chips (cutting chips) are generated from the workpiece 11. As a result, the liquid containing the cutting chips is scattered into the surrounding area. Some of this liquid then adheres to the surface 26b of the partition plate 26 on the cutting area A side.

[0037] Then, much of the liquid adhering to this surface 26b flows down the partition plate 26 and reaches the trough 28. The liquid that reaches the trough 28 flows from one end 28c to the other end 28d and drips out from the other end 28d.

[0038] Therefore, in the cutting device 2, it is possible to reduce the probability that liquid containing cutting chips will drip from the partition plate 26 onto the workpiece 11 held by the holding table 22 while the holding table 22 is being moved between the cutting area A and the loading / unloading area B.

[0039] Note that the cutting device 2 is one embodiment of the present invention, and the present invention is not limited to the cutting device 2. For example, the trough 28 may not be integrated with the partition plate 26, but may be fixed to the partition plate 26 using an adhesive or the like.

[0040] Furthermore, the trough 28 can have any shape as long as it can collect the liquid adhering to the surface 26b of the partition plate 26 on the cutting area A side and guide it so as not to drip onto the workpiece 11 held by the holding table 22.

[0041] For example, the trough 28 may have a shape such that one end 28c in the Y-axis direction is lower than the other end 28d. That is, in the trough 28, the liquid may flow from the other end 28d towards the first end 28c, rather than from the first end 28c towards the other end 28d.

[0042] Alternatively, the trough 28 may have a shape such that its center in the Y-axis direction is higher than one end 28c and the other end 28d. That is, in the trough 28, the liquid may flow from near the center toward both the one end 28c and the other end 28d.

[0043] Furthermore, the gutter 28 may be curved without being inclined. Alternatively, part of the gutter 28 may be inclined and the rest of it may be curved. Alternatively, part or all of the gutter 28 may be stepped.

[0044] Furthermore, the partition plate 26 may be provided with a curtain section that can be raised and lowered. This curtain section may have an opening that extends along the Z-axis direction, and the curtain section is fixed to the partition plate 26 by screwing a bolt that passes through this opening into a screw hole formed in the partition plate 26. In this case, the gutter 28 may be provided on the side of the curtain section facing the cutting area A.

[0045] Furthermore, a water curtain for washing the workpiece 11 to which the liquid containing cutting fluid has adhered and / or an air curtain for drying the workpiece 11 may be provided on the cutting area A side of the partition plate 26. In this case, a gutter 28 may be provided directly above the water curtain and / or air curtain to prevent the liquid containing cutting chips from adhering to the water curtain and / or air curtain.

[0046] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of Symbols]

[0047] 2:Cutting device 4: Cabinet 6,8: Door 10,12: Handle 14: Touch panel 16: Bass 18: Table cover 20: Dustproof and splashproof cover 22: Holding table (22a: Frame, 22b: Porous plate) 24: Support shaft 26: Partition plate (26a: Opening, 26b: Surface) 28: Gutter (28a: horizontal section, 28b: vertical section, 28c: one end, 28d: other end) 30: Cutting Unit 32: Spindle 34: Cutting blade 36: Liquid supply unit 38,40: Nozzle

Claims

1. A cutting device for cutting a workpiece, A holding table for holding the workpiece, A cutting unit having a spindle with an annular cutting blade attached to its tip for cutting the workpiece held by the holding table, A liquid supply unit that supplies liquid to the contact interface between the workpiece and the cutting blade when the workpiece held by the holding table is cut by the cutting blade, A moving mechanism for moving the holding table between a cutting area where the workpiece held by the holding table is cut by the cutting blade and an loading / unloading area where the workpiece is loaded into and unloaded from the holding table, The device comprises a partition plate provided above the moving mechanism to separate the cutting area from the loading / unloading area, A cutting device provided on the side of the partition plate facing the cutting area, the trough is positioned such that, in a plan view, when the holding table is moved between the cutting area and the loading / unloading area by the moving mechanism, one end and the other end do not overlap the holding table, and the trough is shaped to collect the liquid and drip it from at least one of the one or the other end.

2. The cutting apparatus according to claim 1, wherein the trough is integrated with the partition plate.

Citation Information

Patent Citations

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