Electronic component mounting system

Abstract

To provide an electronic component mounting system with which it is possible to improve accuracy of mounting positions when mounting electronic components to a board.SOLUTION: An electronic component mounting system comprises: component mounting means 2 for sequentially mounting a plurality of electronic components to prescribed mounting points on a board in a prescribed order, on the basis of production data that is created for each production item; mounting control means for controlling mounting operation by the component mounting means 2; positional deviation amount acquisition means 3 for acquiring, for each mounting point, a positional deviation amount of an electronic component mounted to the board by the component mounting means 2 from a regular mounting point; correction value calculation means for calculating, for each mounting point, a feedback correction value on the basis of the positional deviation value acquired by the positional deviation value acquisition means 3; and storage means for storing the feedback correction value calculated by the correction value calculation means in association with the production data. The mounting control means acquires from the storage means the feedback correction value associated with the production data corresponding to production items and corrects the mounting operation by the component mounting means 2 using the acquired feedback correction value.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component mounting system for mounting electronic components on a substrate. In this specification, "electronic component" is also simply referred to as "component".

Background Art

[0002] In recent years, with the miniaturization of electronic components and the increase in mounting density, the requirements for mounting position accuracy when mounting components on a substrate have also been increasing. Therefore, conventionally, in order to improve the mounting position accuracy when mounting components on a substrate, the mounting position deviation from the normal position of the components mounted on the substrate is inspected by an inspection device or the like, and the mounting operation of the component mounting device is corrected using the feedback correction value calculated based on the amount of mounting position deviation (see, for example, Patent Document 1).

[0003] That is, in the component mounting system of Patent Document 1, the amount of mounting position deviation is detected for each component mounted on the substrate by an inspection device arranged downstream of the component mounting device, and the mounting operation in the component mounting device is corrected using the feedback correction value calculated for each component. Further, in the component mounting system of Patent Document 1, the mounting position is corrected taking into account the correction value over time calculated based on the information on the change over time of the component mounting mechanism.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the prior art including Patent Document 1, although the mounting position deviation is fed back for each component mounted on the substrate and the change over time of the component mounting mechanism is also taken into account, there is still room for further improvement in order to improve the mounting position accuracy.

[0006] The problem that this invention aims to solve is to provide an electronic component mounting system that can improve the mounting position accuracy when mounting electronic components on a substrate. [Means for solving the problem]

[0007] The inventors conducted a detailed investigation into the factors causing mounting position misalignment in electronic component mounting systems, that is, factors that reduce mounting position accuracy. As a result, they found that the mounting path leading to the component mounting point significantly affects the mounting position accuracy of that component. In other words, different mounting paths cause variations in the amount of misalignment of the component mounting means in the electronic component mounting system. Therefore, simply feeding back the mounting position misalignment for each component, as in the conventional technology, has limitations in improving mounting position accuracy. Based on the idea that a correlation between the mounting point where a component is mounted and the mounting path leading to that mounting point is necessary to improve the mounting position accuracy of components, the inventors decided to reconsider the configuration of the electronic component mounting system. They focused on the fact that the mounting path for each mounting point is defined in the production data created for each production item indicating the type of substrate to be produced, and came up with a method to manage the feedback correction value for each mounting point for each production data, in other words, a method to manage the feedback correction value for each mounting point in association with the production data, thus completing the present invention.

[0008] In other words, according to one aspect of the present invention, the following electronic component mounting system is provided. A component mounting means that sequentially mounts multiple electronic components in a predetermined order at predetermined mounting points on a circuit board, based on production data created for each production item that indicates the type of circuit board to be produced, Mounting control means for controlling the mounting operation of mounting electronic components onto a substrate by the component mounting means, A positional deviation amount acquisition means for acquiring the positional deviation amount of each electronic component mounted on the substrate by the component mounting means from the regular mounting point, A correction value calculation means calculates a feedback correction value for each mounting point to correct the mounting operation of the component mounting means based on the positional deviation amount obtained by the positional deviation amount acquisition means, The system includes a storage means for storing the feedback correction value calculated by the correction value calculation means in association with the production data, The aforementioned mounting control means acquires a feedback correction value associated with production data corresponding to a product from the storage means, and uses the feedback correction value to correct the mounting operation by the component mounting means, in an electronic component mounting system. [Effects of the Invention]

[0009] According to the electronic component mounting system of the present invention, the mounting position accuracy when mounting electronic components on a substrate can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] A block diagram showing the configuration of an electronic component mounting system, which is one embodiment of the present invention. [Figure 2] A perspective view showing an example of a mounting head. [Figure 3] A conceptual diagram showing an example of the data structure of feedback correction values ​​stored by a memory device. [Modes for carrying out the invention]

[0011] Figure 1 shows a block diagram of the configuration of an electronic component mounting system, which is one embodiment of the present invention. The electronic component mounting system 1 shown in Figure 1 includes two component mounting devices 2A and 2B as component mounting means, and a component position inspection device 3 as a means for acquiring positional deviation. These devices are connected to a management computer 5 via a communication network 4. Note that the component mounting devices 2A and 2B in the electronic component mounting system 1 are not limited to two, but may be one or three or more. Also, in this embodiment, the two component mounting devices 2A and 2B have substantially the same configuration. Therefore, in the following description, they will not be distinguished and will simply be referred to as "component mounting device 2".

[0012] The component mounting apparatus 2 includes a mounting head having a plurality of component pickers. As such a mounting head, for example, a rotary head type mounting head disclosed in Japanese Patent Application Publication No. 2016-86095 can be used. Figure 2 shows the mounting head 10 disclosed in Japanese Patent Application Publication No. 2016-86095. The mounting head 10 shown in the figure is a rotary head type mounting head, in which a rotary head 30 is mounted on a fixedly positioned head body 20 so as to be rotatable in the R direction around a vertical axis. Multiple spindles 31 are arranged on the rotary head 30 at equal intervals along its circumferential direction, and a nozzle 32 is attached to the lower end of each spindle 31 as a component suction device for holding components by suction. The rotary head 30 rotates in the R direction by the drive of the R servo motor 21 installed on the head body 20. Each spindle 31 rotates in the T direction around its axis by the drive of the T servo motor 22 installed on the head body 20. Furthermore, the head body 20 is equipped with a Z servo motor 23 as a first lifting means for raising and lowering a spindle 31a (nozzle 32) at a specific position in the Z direction along the axis. This mounting head 10 is movable in the XY direction by an XY movement mechanism (not shown).

[0013] The component mounting device 2 sequentially mounts multiple electronic components at predetermined mounting points on a circuit board in a predetermined order, based on production data created for each production item that indicates the type of circuit board to be produced. The mounting operation by the component mounting device 2 to mount electronic components on the circuit board is controlled by the mounting control means included in the management computer 5. In other words, the mounting control means stores production data corresponding to each production item, and the mounting control means sequentially mounts multiple electronic components at predetermined mounting points on the circuit board in a predetermined order, based on the production data corresponding to the production item to be produced. Each piece of production data includes information such as the coordinates of each mounting point on the circuit board, the type of component to be mounted at each mounting point, the mounting order, and the mounting height and mounting direction (angle) of the components during mounting.

[0014] A component position inspection device 3 is installed downstream of the component mounting device 2. The component position inspection device 3 detects the position of components mounted on the substrate and calculates and acquires the amount of positional deviation from the correct mounting point for each component. Specifically, as disclosed in Patent Document 1 above, for example, the substrate is imaged by a camera and image recognition is performed to detect the XY coordinate position (X position, Y position) on the substrate plane for each component, and the amount of positional deviation from the correct mounting point for each component is calculated and acquired. In this embodiment, in addition to the XY coordinate position (X position, Y position), the Z position representing the mounting height of the component during mounting and the angle θ representing the mounting direction of the component are also detected, and the amount of positional deviation from the correct Z position and angle θ for each component is also calculated and acquired for each mounting point. Information regarding the correct mounting point of the component (X position, Y position, Z position, angle θ) is obtained from production data stored in the mounting control means described above. The calculation and acquisition of the positional deviation amount for each mounting point described above may be performed in cooperation with the management computer 5. In this case, the part position inspection device 3 and the management computer 5 constitute the means for acquiring the amount of positional deviation, but in this embodiment, the part position inspection device 3 alone constitutes the means for acquiring the amount of positional deviation.

[0015] The management computer 5 includes a correction value calculation means, which calculates a feedback correction value for each mounting point to correct the mounting operation of the component mounting device 2, which is a component mounting means, based on the amount of misalignment acquired by the component position inspection device 3, which is a position misalignment acquisition means.

[0016] In addition, the management computer 5 includes storage means, which stores the feedback correction value calculated by the above-described correction value calculation means in association with the production data. FIG. 3 conceptually shows an example of the data structure of the feedback correction value stored in the storage means. As shown in the figure, in the present embodiment, the feedback correction value consists of four correction values: an X position correction value, a Y position correction value, a Z position correction value, and an angle correction value. And the feedback correction value consisting of these four correction values is stored for each mounting point in association with the production data. In other words, in the present embodiment, the feedback correction value for each mounting point is managed for each production data.

[0017] <( Then, the mounting control means acquires the feedback correction value associated with the production data corresponding to the production item to be produced from the above-described storage means, and corrects the mounting operation by the component mounting device 2, which is the component mounting means, using the feedback correction value. For example, when the production item to be produced is the substrate type A, the mounting control means acquires the feedback correction value associated with the production data A corresponding to the substrate type A from the storage means, and corrects the mounting operation by the component mounting device 2 using the feedback correction value. [[ID=]] When the feedback correction value associated with the production data A corresponding to the substrate type A is not stored in the storage means, the mounting control means either does not use the feedback correction value at the start of production or uses a separately temporarily set feedback correction value to start the production of the substrate based on the production data A. And when the production of at least one substrate is completed, the feedback correction value calculated by the correction value calculation means is stored in the storage means. Thereafter, the mounting control means can correct the mounting operation by the component mounting device 2 using the feedback correction value. The feedback correction value stored in the storage means can be updated inline using a newly obtained feedback correction value sequentially obtained with the production of the substrate. Here, the update can be performed not only by simply replacing the feedback correction value but also by methods such as moving average.

[0018] Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made without departing from the technical idea of the present invention. For example, in this embodiment, the feedback correction value consists of four correction values: the X-position correction value, the Y-position correction value, the Z-position correction value, and the angle correction value. However, it is sufficient to have at least two correction values, namely the X-position correction value and the Y-position correction value.

[0019] In addition, the form of the mounting head is not limited to the rotary head type, and it may be a form of a mounting head that does not rotate in the R direction, for example, as disclosed in Patent Document 1. However, according to the tests by the present inventors, the influence of the above-described mounting path on the mounting position accuracy of the components becomes significant in a rotary head type mounting head that involves rotation in the R direction. Therefore, the electronic component mounting system of the present invention is particularly effective when it includes a rotary head type mounting head.

Explanation of Reference Numerals

[0020] 1 Electronic component mounting system 2, 2A, 2B Component mounting device (component mounting means) 3 Component position inspection device 4 Communication network 5 Management computer 10 Mounting head 20 Head body 21 R servo motor 22 T servo motor 23 Z servo motor (first lifting means) 30 Rotary head 31, 31a Spindle 32 Nozzle (component suction tool)

Claims

1. A component mounting means that sequentially mounts multiple electronic components in a predetermined order at predetermined mounting points on a circuit board, based on production data created for each production item that indicates the type of circuit board to be produced, Mounting control means for controlling the mounting operation of mounting electronic components onto a substrate by the component mounting means, A positional deviation amount acquisition means for acquiring the positional deviation amount of each electronic component mounted on the substrate by the component mounting means from the regular mounting point, A correction value calculation means calculates a feedback correction value for each mounting point to correct the mounting operation of the component mounting means based on the positional deviation amount obtained by the positional deviation amount acquisition means, The system includes a storage means for storing the feedback correction value calculated by the correction value calculation means in association with the production data, The aforementioned mounting control means acquires a feedback correction value associated with production data corresponding to a product from the storage means, and uses the feedback correction value to correct the mounting operation by the component mounting means, in an electronic component mounting system.

2. The electronic component mounting system according to claim 1, wherein the component mounting means includes a rotary head type mounting head.

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