Component mounting machine and component mounting method

Abstract

To suppress the influence of an exposure method for exposing a component stored in a component storage tape on a mounting operation by a mounting head, thereby enabling the mounting operation to be performed appropriately.SOLUTION: The execution status of a mounting operation (steps S101 to S103, S107) by a mounting head 31 is monitored (steps S104 to S106, S109, S201). Then, depending on the execution status of the mounting operation, a UI 95 changes an exposure method (step S205). Therefore, it is possible to suppress the influence of the exposure method for exposing a component P on the mounting operation by the mounting head 31, and to thereby appropriately execute the mounting operation.SELECTED DRAWING: Figure 9

Description

Technical Field

[0004] , , , , ,

[0005] , , , , ,

[0001] This invention relates to a technique for exposing a component stored in a component storage tape that stores components in each of a plurality of pockets arranged in a row, and mounting the exposed component on a substrate by a mounting head.

Background Art

[0002] In Patent Documents 1 and 2, there is described an apparatus that mounts a component supplied to a component supply position by a tape feeder that conveys a component stored in a component storage tape toward a predetermined component supply position, by a mounting head on a substrate. In such an apparatus, the component is exposed as it is conveyed to the component supply position, and the mounting head picks up the component from the component supply position by adsorbing the exposed component. Also, as pointed out in Patent Document 2, there may be a case where the component cannot be accurately mounted on the substrate by the mounting head due to an adsorption error of the component by the mounting head. Therefore, in Patent Document 2, when the adsorption rate of the component by the mounting head drops below a warning value, a warning is notified and the adsorption of the component is stopped.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, as will be described in detail later, the exposure method for exposing the component stored in the component storage tape may greatly affect the mounting operation by the mounting head. In contrast, the techniques described in Patent Documents 1 and 2 were insufficient to appropriately respond to such cases.

[0005] This invention has been made in view of the above problems, and aims to suppress the influence of the exposure method for exposing components stored in a component storage tape on the mounting operation by the mounting head, thereby enabling the mounting operation to be performed appropriately. [Means for solving the problem]

[0006] The component mounting machine according to the present invention comprises a component supply unit that supplies components to predetermined component supply positions by a tape feeder that transports a component storage tape in which components are stored in a plurality of pockets arranged in a row; a mounting head that performs a mounting operation in which components are taken out of the component supply position and mounted on a substrate; a user interface that notifies the user; and a control unit that monitors the status of the mounting operation performed by the mounting head. The component supply unit supplies the exposed components to the component supply position by transporting the components to the component supply position by the tape feeder and exposing the components in a predetermined exposure method. The mounting head takes out the exposed components from the component supply position and performs a mounting operation. The control unit causes the user interface to suggest a change in the exposure method according to the status of the mounting operation.

[0007] The component mounting method according to the present invention comprises the steps of: supplying components to a predetermined component supply position by a tape feeder that transports a component storage tape in which components are stored in each of a plurality of pockets arranged in a row; supplying the exposed components to the component supply position by transporting the components to the component supply position by the tape feeder and exposing the components in a predetermined exposure method; performing a mounting operation by a mounting head to remove the exposed components from the component supply position and mount them on a substrate; monitoring the execution status of the mounting operation by the mounting head; and having a user interface suggest a change in the exposure method according to the execution status of the mounting operation.

[0008] In the present invention (component mounting apparatus and component mounting method) configured in this way, the status of the mounting operation by the mounting head is monitored. Then, the user interface suggests to the user a change in the exposure method according to the status of the mounting operation. Therefore, it is possible to suppress the influence of the exposure method for exposing components on the mounting operation by the mounting head and to perform the mounting operation appropriately.

[0009] Furthermore, the component supply unit may have a feeder mounting unit to which a tape feeder is detachably attached, and components are supplied to the component supply position by the tape feeder attached to the feeder mounting unit. Multiple types of tape feeders that expose components in different exposure methods can be attached to the feeder mounting unit, and the control unit may be configured to have the user interface suggest changing the tape feeder attached to the feeder mounting unit from one type of tape feeder to another type of tape feeder, thereby allowing the user interface to suggest a change in the exposure method. In such a configuration, the user can use a tape feeder that exposes components in an appropriate exposure method for component mounting by changing the type of tape feeder attached to the feeder mounting unit.

[0010] Furthermore, the component mounting machine may be configured such that the control unit manages the storage locations of other types of tape feeders and, when it proposes a change in the exposure method to the user interface, it notifies the user interface of the storage locations of other types of tape feeders. In such a configuration, the user can accurately grasp the storage locations of other types of tape feeders that expose components with the appropriate peeling method and easily perform the task of changing the type of tape feeder.

[0011] Furthermore, the tape feeder may have a feeder body that supports a component storage tape being transported toward a component supply position, and an exposure member mounting section to which an exposure member that exposes the components being transported toward the component supply position is detachably attached. Multiple types of exposure members that expose components in different exposure methods can be attached to the exposure member mounting section, and the control unit may be configured to have the user interface suggest a change in the exposure method, such as changing the exposure member attached to the exposure member mounting section from one type of exposure member to another type of exposure member. In such a configuration, the user can use an exposure member that exposes components in an appropriate exposure method for component mounting by changing the type of exposure member attached to the exposure member mounting section.

[0012] Furthermore, the control unit may be configured to monitor the execution status of the mounting operation after the exposure method has been changed as the "post-change execution status" and to notify the user interface of the post-change execution status. In such a configuration, the user can confirm whether the change in exposure method is appropriate.

[0013] Furthermore, the component mounting machine may be configured to include a charge amount measuring unit for measuring the charge amount of the components, and the control unit, based on the execution status of the mounting operation and the charge amount measured by the charge amount measuring unit, may, when it determines that the charging of the components is affecting the execution status of the mounting operation, prompt the user interface to suggest a change in the exposure method. In such a configuration, if the charging of components due to component exposure is affecting the mounting operation, the user can be suggested to change to an exposure method that suppresses the charging of components.

[0014] Furthermore, the component storage tape includes a carrier tape having multiple pockets and a top tape attached to the carrier tape to close the multiple pockets. The component supply unit can perform either a peeling method, which exposes the component by peeling the top tape from the carrier tape, or a cutting method, which exposes the component by cutting open the top tape. The control unit monitors the execution status of mounting operations performed on components exposed by the peeling method, and the component mounting machine may be configured to suggest a change in the exposure method from the peeling method to the cutting method via the user interface, depending on the execution status of the mounting operations. In such a configuration, if the charging of components due to component exposure affects the mounting operation, the user can be offered a change from the peeling method, which easily charges components, to the cutting method, which makes components less likely to charge. [Effects of the Invention]

[0015] As described above, according to the present invention, the influence of the exposure method for exposing components stored in the component storage tape on the mounting operation by the mounting head is suppressed, making it possible to perform the mounting operation appropriately. [Brief explanation of the drawing]

[0016] [Figure 1] A schematic partial plan view showing a component mounting machine according to the present invention. [Figure 2] A schematic perspective view showing an example of a parts storage tape. [Figure 3A] A schematic diagram showing the configuration of a tape feeder. [Figure 3B] A schematic diagram showing the configuration of a tape feeder. [Figure 4] A block diagram showing the electrical configuration of the component mounting machine in Figure 1. [Figure 5] A schematic diagram illustrating an example of feeder storage data in a table format. [Figure 6] A flowchart illustrating an example of PCB production performed by a component mounting machine. [Figure 7]A diagram schematically showing an example of adsorption success / failure data created in connection with the execution of substrate production in FIG. 6 in tabular form. [Figure 8] A flowchart showing a first example of exposure method management. [Figure 9] A diagram schematically showing an example of a proposal screen for proposing a cutting method. [Figure 10] A flowchart showing a second example of exposure method management. [Figure 11] A flowchart showing a third example of exposure method management. [Figure 12] An example of a flowchart for monitoring the change result of the exposure method. [Figure 13A] A diagram schematically showing the configuration of a modified example of a tape feeder. [Figure 13B] A diagram schematically showing the configuration of a modified example of a tape feeder.

Embodiments for Carrying Out the Invention

[0017] FIG. 1 is a partial plan view schematically showing a component mounting machine according to the present invention. In FIG. 1, the X direction which is the horizontal direction, the Y direction which is the horizontal direction orthogonal to the X direction, and the Z direction which is the vertical direction are appropriately shown. This component mounting machine 1 mounts the component P on the substrate B carried into the mounting processing position (the position of the substrate B in FIG. 1) from the upstream side in the X direction, and discharges the substrate B (component-mounted substrate B) on which the mounting of the component P is completed from the mounting processing position to the downstream side in the X direction.

[0018] As shown in FIG. 1, the component mounting machine 1 has a substrate conveyance unit 12 that conveys the substrate in the X direction, and the substrate conveyance unit 12 has a pair of conveyors 121 arranged in parallel in the X direction. The pair of conveyors 121 supports both ends of the substrate B in the Y direction and drives the substrate B in the X direction to carry the substrate B into the mounting processing position and discharge the substrate B from the mounting processing position.

[0019] Furthermore, the component mounting machine 1 is provided with a pair of Y-axis rails 21, 21 that are perpendicular to the X direction and parallel to the Y direction, a Y-axis ball screw 22 that is parallel to the Y direction, and a Y-axis motor My (servo motor) that rotates the Y-axis ball screw 22. An X-axis rail 23, which is parallel to the X direction, is fixed to the nut of the Y-axis ball screw 22 while being supported by the pair of Y-axis rails 21, 21 so as to be movable in the Y direction. An X-axis ball screw 24 that is parallel to the X direction and an X-axis motor Mx (servo motor) that rotates the X-axis ball screw 24 are attached to the X-axis rail 23, and the head unit 3 is fixed to the nut of the X-axis ball screw 24 while being supported by the X-axis rail 23 so as to be movable in the X direction. Therefore, the Y-axis motor My can rotate the Y-axis ball screw 22 to move the head unit 3 in the Y direction, and the X-axis motor Mx can rotate the X-axis ball screw 24 to move the head unit 3 in the X direction.

[0020] As shown in Figure 1, on each of the two conveyors 12, 12 in the Y direction, two parts supply units 4 are arranged in the X direction. Each parts supply unit 4 has multiple feeder mounting units 41 arranged in the X direction, and a tape feeder 5 is detachably attached to each feeder mounting unit 41.

[0021] The tape feeder 5 extends in the Y direction and has a component supply position 50 at its tip on the substrate transport unit 12 side in the Y direction. A component storage tape 6 (Figure 2), which contains small pieces of components P such as integrated circuits, transistors, and capacitors at predetermined intervals, is loaded into the tape feeder 5. The tape feeder 5 intermittently feeds the component storage tape 6 in the Y direction toward the substrate transport unit 12. As a result, the components P in the component storage tape 6 are fed in the Y direction (feed direction) and supplied sequentially to the component supply position 50 of the tape feeder 5.

[0022] Figure 2 is a schematic perspective view showing an example of a parts storage tape. The parts storage tape 6 has a carrier tape 61 and a top tape 62 attached to the carrier tape 61. The carrier tape 61 has a plurality of pockets 611 (parts storage sections) arranged in a row, and parts P are stored in each pocket 611. Each pocket 611 opens towards the top tape 62, and the top tape 62 attached to the carrier tape 61 covers the plurality of pockets 611, thereby closing them. In addition, a plurality of engagement holes 613 arranged in a row pass through the edge 612 of the carrier tape 61. When the parts storage tape 6 is loaded into the tape feeder 5, the plurality of pockets 611 are aligned in the Y direction, and the plurality of engagement holes 613 are aligned in the Y direction.

[0023] Figures 3A and 3B schematically show the configuration of a tape feeder. Figure 3A shows a case where components are exposed by a peeling method while being supplied by a tape feeder, and Figure 3B shows a case where components are exposed by a cutting method while being supplied by a tape feeder.

[0024] As shown in Figure 3A, the tape feeder 5 has a feeder body 51, and an opening provided on the upper surface of the feeder body 51 functions as the component supply position 50. The feeder body 51 also has two sprockets 511 and 512 that engage with the engagement holes 613 of the component storage tape 6, and the component storage tape 6 is transported in the Y direction (transport direction) as the sprockets 511 and 512 rotate. As a result, each component P stored in the component storage tape 6 is supplied sequentially to the component supply position 50. The feeder body 51 is provided with an exposed member mounting section 513 upstream of the component supply position 50 in the transport direction Y of the component storage tape 6.

[0025] In Figure 3A, a tape release member 52 is detachably mounted on the exposed member mounting section 513. This tape release member 52 has a slit 521, and by folding back the top tape 62 being transported in the transport direction Y from the upstream side of the transport direction Y of the component storage tape 6 with a folding edge 522 adjacent to the slit 521, the top tape 62 is peeled off from the carrier tape 61. As a mechanism for peeling off the top tape 62 in this way, a configuration shown in, for example, Japanese Patent Application Publication No. 2013-073948 or Japanese Patent Application Publication No. 2015-050227 can be adopted. The tape feeder 5 also has a tape recovery section 53 located at the point where the top tape 62 is folded back by the tape release member 52, and the tape recovery section 53 recovers the top tape 62 by winding up the top tape 62 that has been peeled off from the carrier tape 61 by the tape release member 52. Therefore, the component P is exposed by the tape release member 52 before being supplied to the component supply position 50. In other words, the part supply position 50 is supplied with the part P that has been exposed by the tape release member 52.

[0026] The difference between the example shown in Figure 3B and the example shown in Figure 3A is that a tape cutting member 54 is detachably attached to the exposed member mounting portion 513 instead of the tape release member 52. Therefore, components common to the example in Figure 3A are denoted by corresponding reference numerals and their explanations are omitted as appropriate, and the explanation will focus on the components that differ from those in Figure 3A.

[0027] The tape cutting member 54 has a tape cutter 541 that contacts the top tape 62 of the parts storage tape 6 being conveyed in the Y direction from above, and the tape cutter 541 cuts open the top tape 62. As a mechanism for cutting open the top tape 62 in this way, for example, the configuration shown in Japanese Patent Application Publication No. 2011-216793 can be adopted. Therefore, the parts P are exposed by the tape cutting member 54 before being supplied to the parts supply position 50. In other words, the parts P exposed by the tape cutting member 54 are supplied to the parts supply position 50.

[0028] As shown in Figure 1, the head unit 3 is a so-called modular head unit 3. The head unit 3 has a plurality of mounting heads 31 arranged in the X direction, and a nozzle 32 is attached to the lower end of each of the plurality of mounting heads 31. In other words, the head unit 3 has a plurality of nozzles 32 arranged in the X direction. Each mounting head 31 then picks up and mounts components P using the nozzle 32. Specifically, the mounting head 31 moves above the tape feeder 5 and picks up (captures) the components P supplied to the component supply position 50 by the tape feeder 5 using the nozzle 32. With the components P thus held, the mounting head 31 moves above the substrate B at the mounting processing position and mounts the components P onto the substrate B. In this way, the mounting operation of taking the components P supplied to the component supply position 50 from the component supply position 50 and mounting them onto the substrate B is performed by the mounting head 31.

[0029] The component mounting machine 1 is equipped with a charge amount measuring device 39 attached to the head unit 3. This charge amount measuring device 39 is a non-contact type surface potential system that measures the surface potential of the object to be measured as the charge amount, and has a configuration and function similar to, for example, the charge amount measuring unit shown in Japanese Patent Application Publication No. 2018-186186. The charge amount measuring device 39 is movable in the X and Y directions together with the head unit 3, and measures the charge amount of the components supplied to the component supply position 50, as will be described later.

[0030] Furthermore, the component mounting machine 1 is equipped with a component recognition camera 71 attached to the head unit 3. This component recognition camera 71 captures images of the component P supplied to the component supply position 50 by the tape feeder 5 from above.

[0031] Furthermore, in the component mounting machine 1, a component recognition camera 72, positioned facing upwards, is located between the component supply unit 4 and the conveyor 12 in the Y direction. The component recognition camera 72 acquires a recognition image by capturing a picture of the nozzle 32 from below as it moves from the component supply position 50 to the substrate B for the mounting operation. As will be described later, based on this recognition image, the success or failure of the component P being picked up by the mounting head 31 during the mounting operation is determined.

[0032] Figure 4 is a block diagram showing the electrical configuration of the component mounting machine shown in Figure 1. The component mounting machine 1 comprises a processing unit 91, a storage unit 93, and a UI (User Interface) 95. The processing unit 91 is a processor such as a CPU (Central Processing Unit), and the storage unit 93 is a storage device such as an SSD (Solid State Drive). The UI 95 has an input function that accepts user input operations and an output function to the user via a screen or sound, and is configured, for example, as a touch panel display.

[0033] The calculation unit 91 includes a main control unit 911, a UI control unit 912, an imaging control unit 913, and a charge amount acquisition unit 914. The main control unit 911 comprehensively controls each part of the component mounting machine 1. The UI control unit 912 has the function of controlling the UI 95, for example, acquiring information input to the UI 95 and displaying images on the UI 95's display. The imaging control unit 913 acquires images captured by the component recognition camera 71 or component recognition camera 72. The charge amount acquisition unit 914 acquires the charge amount measured by the charge amount measuring instrument 39. The storage unit 93 also stores feeder storage data Df and adsorption success / failure data Ds, which will be described later.

[0034] Figure 5 is a schematic diagram illustrating an example of feeder storage data in table format. In other words, a storage cabinet for storing tape feeders 5 is provided separately from the component mounting machine 1, and the feeder storage data Df indicates the storage location of the tape feeder 5 in the storage cabinet. Specifically, the feeder storage data Df associates the model name F of a peel-type tape feeder 5, the model name f of a cut-type tape feeder 5 that can be mounted on the same feeder mounting section 41 as the tape feeder 5 of model name F (in other words, interchangeable with the tape feeder 5 of model name F), and the storage location S of the tape feeder 5 of model name f, and shows this for each of the multiple peel-type feeder model names F(A), F(B), F(C), ... For example, the cut-type tape feeders 5 that can be interchangeable with the peel-type tape feeder 5 of model name F(A) are shown as tape feeder 5 of model name f(a1) and tape feeder 5 of model name f(a2). Furthermore, the storage location S(a1) for the cut-type tape feeder 5 of model name f(a1) and the storage location S(a2) for the cut-type tape feeder 5 of model name f(a) are shown.

[0035] Figure 6 is a flowchart showing an example of substrate production performed by a component mounting machine, and Figure 7 is a schematic diagram in table format showing an example of adsorption success / failure data created in conjunction with the execution of substrate production in Figure 6. In the substrate production of Figure 6, a substrate B with components P already mounted is produced by mounting components P supplied by the tape feeder 5 to predetermined component mounting positions (e.g., lands) provided on the substrate B. As mentioned above, there are two types of tape feeders 5 that can be used in substrate production: a peel-type tape feeder 5 and a cut-type tape feeder 5. Here, the peel-type tape feeder 5 has the advantage of being cheaper than the cut-type tape feeder 5, but it has the disadvantage that static electricity generated when the top tape 62 is peeled off makes it easier for components P to become charged. When components P become charged in this way, the orientation of components P fluctuates within the pocket 611, increasing the likelihood of failure of adsorption of components P by the nozzle 32. In other words, the cut-type tape feeder 5 has the advantage of being less likely to generate static charge on the component P compared to the peel-type tape feeder 5, resulting in a more stable orientation of the component P within the pocket 611 and a higher probability of successful component attraction, but it also has the disadvantage of being more expensive.

[0036] In this example, at the start of substrate production, the advantage of the peel-off type tape feeder 5, which is inexpensive, is prioritized, and it is assumed that peel-off type tape feeders 5 are installed in each feeder mounting section 41. However, an automatic loading type tape feeder, such as the one shown in Japanese Patent Application Publication No. 2019-192817, which can accommodate two component storage tapes and automatically loads the other component storage tape when one is used up, can only expose components P by a cutting method. Therefore, the automatic loading type tape feeder used at the start of production exposes components P by a cutting method, not a peel-off method.

[0037] The substrate production shown in Figure 6 is performed under the control of the main control unit 911. In step S101, the nozzle 32 faces the component supply position 50 from above, and in step S102, the nozzle 32 descends toward the component P supplied to the component supply position 50. When the nozzle 32 contacts the component P, the head unit 3 generates negative pressure on the nozzle 32 to attract the component P to the nozzle 32 (step S103). Subsequently, the nozzle 32 moves upward toward the component recognition camera 72 and faces the component recognition camera 72 from above, at which point the component recognition camera 72 images the nozzle 32 and acquires a recognition image (step S104).

[0038] This recognized image is transmitted from the component recognition camera 72 to the imaging control unit 913, and the main control unit 911 determines whether the nozzle 32 has successfully attracted the component P based on the recognized image received by the imaging control unit 913 (step S105). For example, if the orientation of the component P to be attracted to the nozzle 32 is correct, it is determined that the component P has been successfully attracted ("YES" in step S105). On the other hand, if the orientation of the component P to be attracted to the nozzle 32 is incorrect, or if the component P to be attracted to the nozzle 32 cannot be confirmed, it is determined that the component P has not been attracted ("NO" in step S105). As a specific method for determining whether the orientation of the component P is correct, various image processing techniques used for component P recognition in the field of component mounting technology can be used.

[0039] If it is determined that the component P has been successfully picked up (if the answer is "YES" in step S105), the main control unit 911 records the successful pick-up in the pick-up success / failure data Ds (step S106). Specifically, as shown in Figure 7, the recording date and time, the success / failure result (whether the pick-up was successful or not), and the model name of the tape feeder 5 that supplied the successfully picked-up component P are associated and recorded in the pick-up success / failure data Ds. In step S107, the nozzle 32 mounts the successfully picked-up component P to the component mounting position on the substrate B. The main control unit 911 then determines whether the component P has been placed at all component mounting positions on the substrate B (step S108). If it has been completed (if the answer is "YES" in step S108), the substrate production shown in Figure 6 is terminated; otherwise, the process returns to step S101.

[0040] On the other hand, if it is determined that the suction of component P has failed (if the answer is "NO" in step S105), the main control unit 911 records the suction failure in the suction success / failure data Ds (step S109). Specifically, as shown in Figure 7, the recording date and time, the success / failure result, and the model name of the tape feeder 5 that supplied the component P that failed to be suctioned are associated and recorded in the suction success / failure data Ds. Then, the process returns to step S101.

[0041] In this way, the success or failure of component P adsorption is monitored in parallel with substrate production, and adsorption success / failure data Ds is created. Based on this adsorption success / failure data Ds, the main control unit 911 manages the exposure method of component P by the tape feeder 5. Next, this exposure method management will be explained.

[0042] Figure 8 is a flowchart showing the first example of exposure method management. The flowchart in Figure 8 is executed by the control of the main control unit 911. In step S201, it is determined whether or not the failure of the nozzle 32 to adsorb the component P has been recorded in the adsorption success / failure data Ds. That is, if the failure of the component P to adsorb is recorded in the adsorption success / failure data Ds in step S109 of the substrate production in Figure 6, it is determined that the adsorption failure has been recorded ("YES" in step S201), and step S202 is executed.

[0043] In step S202, the main control unit 911 calculates the adsorption rate and determines whether the adsorption rate is less than a predetermined threshold (threshold rate). Specifically, for the target tape feeder 5 that supplied the component P that failed to adsorb in step S201, the adsorption rate of the component P supplied by the target tape feeder 5 in the most recent predetermined period is calculated. Here, the adsorption rate Rs is given by the following equation: Rs = Ns / (Ns + Nf) Ns: Number of times the target tape feeder 5 successfully picked up component P supplied over a predetermined period. Nf: Number of times the target tape feeder 5 failed to pick up component P during a predetermined period. It is given by.

[0044] Then, if the adsorption rate Rs is greater than or equal to the threshold rate (if the result is "NO" in step S202), the process returns to step S201. On the other hand, if the adsorption success / failure data Ds is less than the threshold rate (if the result is "YES" in step S202), the process proceeds to step S203.

[0045] In step S203, the main control unit 911 determines whether the charge amount of the component P supplied by the target tape feeder 5 is equal to or greater than a predetermined threshold. Specifically, the main control unit 911 places the charge amount measuring device 39 opposite the component P supplied by the target tape feeder 5 to the component supply position 50 from above, and has the charge amount measuring device 39 measure the charge amount of the component P. If the charge amount of the component P is less than the threshold (if "NO" is the result in step S203), the process returns to step S201. On the other hand, if the charge amount of the component P is equal to or greater than the threshold (if "YES" is the result in step S203), the process proceeds to step S204.

[0046] In step S204, the main control unit 911 determines whether the exposure method of the target tape feeder 5 is the peel method. If the exposure method is the cut method and not the peel method (if "NO" is found in step S204), the process returns to step S201. On the other hand, if the exposure method is the peel method (if "YES" is found in step S204), the main control unit 911 commands the UI control unit 912 to display a suggestion screen G (Figure 9) that proposes a cut method. The UI control unit 912 receives this command and displays the suggestion screen G on the UI 95 display.

[0047] Figure 9 is a schematic diagram showing an example of a proposal screen that suggests a cutting method. As shown in Figure 9, the proposal screen G indicates the lane and mounting position (feeder mounting section 41) on which the target tape feeder 5 is installed, and proposes changing the exposure method of the target tape feeder 5 to a cutting method. Here, the proposal screen G in Figure 9 is based on the premise that circuit board production is performed using a component mounting machine 1 on each of the multiple lanes, and one lane on which the target tape feeder 5 is installed is specified in the proposal screen G.

[0048] Furthermore, the suggestion screen G proposes two methods for changing the exposure method to the cut method: (1) replacing the feeder and (2) replacing the feeder's tip component. In (1) replacing the feeder, the models of replaceable tape feeders 5 and the storage location of those tape feeders 5 are displayed based on the feeder storage data Df. In (2) replacing the feeder's tip component, it is suggested to change the tape peeling member 52 attached to the exposure component mounting section 513 to a tape cutting member 54. Therefore, by checking the suggestion screen G, the user can change the exposure method of the target tape feeder 5 to the cut method by executing either method (1) or (2).

[0049] In the embodiment described above, the execution status of the mounting operation by the mounting head 31 (steps S101 to S103, S107) is monitored (steps S104 to S106, S109, S201). Then, depending on the execution status of the mounting operation, the UI 95 proposes a change in the exposure method to the user (step S205). Therefore, it is possible to suppress the influence of the exposure method for exposing the component P on the mounting operation by the mounting head 31 and to execute the mounting operation appropriately.

[0050] Furthermore, the component supply unit 4 has a feeder mounting unit 41 to which a tape feeder 5 is detachably attached, and the tape feeder 5 attached to the feeder mounting unit 41 supplies components P to the component supply position 50. Two types of tape feeders 5, each exposing components P using a different exposure method (peel method / cut method), can be attached to this feeder mounting unit 41. In response to this, the calculation unit 91 causes the UI 95 to propose changing the tape feeder 5 attached to the feeder mounting unit 41 from one type (peel method) to the other type (cut method). With this configuration, the user can use a tape feeder 5 that exposes components P using an appropriate exposure method for component mounting by changing the type of tape feeder 5 attached to the feeder mounting unit 41.

[0051] Furthermore, the calculation unit 91 manages the storage locations of other types (cutting methods) of tape feeders 5 using feeder storage data Df, and when it wants the UI 95 to propose a change in exposure method, it notifies the UI 95 of the storage locations of the other types of tape feeders 5 indicated by the feeder storage data Df (step S205, proposal screen G). With this configuration, the user can accurately grasp the storage locations of other types of tape feeders 5 that expose components P using the appropriate peeling method, and easily perform the operation of changing the type of tape feeder 5.

[0052] Furthermore, the tape feeder 5 includes a feeder body 51 that supports and transports the component storage tape 6, and an exposure member mounting section 513 to which exposure members (tape peeling member 52 / tape cutting member 54) that expose the component P transported to the component supply position 50 by the feeder body 51 are detachably attached. Two types of exposure members (tape peeling member 52 / tape cutting member 54) that expose the component P in different exposure methods can be attached to the exposure member mounting section 513. In response to this, the calculation unit 91 causes the UI 95 to propose changing the exposure member attached to the exposure member mounting section 513 from one type of exposure member (tape peeling member 52) to the other type of exposure member (tape cutting member 54) (step S205, proposal screen G). In this configuration, the user can use an exposed member that exposes the component P in an appropriate exposure manner for component mounting by changing the type of exposed member attached to the exposed member mounting section 513.

[0053] Furthermore, a charge meter 39 is provided to measure the amount of charge on component P. The calculation unit 91 determines, based on the execution status of the mounting operation and the amount of charge measured by the charge meter 39, that the charging of component P is affecting the execution status of the mounting operation (determined as "YES" in steps S202 and S203), and prompts the UI 95 to suggest a change in the exposure method (step S205, suggestion screen G). In this configuration, if the charging of component P due to its exposure is affecting the mounting operation, the user can be offered a change to an exposure method that suppresses the charging of component P.

[0054] Furthermore, the component storage tape 6 includes a carrier tape 61 having multiple pockets 611, and a top tape 62 that is attached to the carrier tape 61 and closes the multiple pockets 611. The component supply unit 4 can also perform two exposure methods: a peeling method in which the component P is exposed by peeling the top tape 62 from the carrier tape 61, and a cutting method in which the component P is exposed by cutting open the top tape 62. In response, the calculation unit 91 monitors the execution status of the mounting operation (steps S101 to S103, S107) performed on the component P exposed by the peeling method (steps S104 to S106, S109, S201), and, depending on the execution status of the mounting operation, prompts the UI 95 to suggest a change in the exposure method from the peeling method to the cutting method (step S205, suggestion screen G). In this configuration, if the charging of component P due to its exposure affects the mounting operation, the user can be offered a change from the peeling method, which makes component P prone to charging, to the cutting method, which makes component P less prone to charging.

[0055] As described above, in this embodiment, the component mounting machine 1 corresponds to an example of the "component mounting machine" of the present invention, the mounting head 31 corresponds to an example of the "mounting head" of the present invention, the charge amount measuring instrument 39 corresponds to an example of the "charge amount measuring unit" of the present invention, the component supply unit 4 corresponds to an example of the "component supply unit" of the present invention, the feeder mounting unit 41 corresponds to an example of the "feeder mounting unit" of the present invention, the tape feeder 5 corresponds to an example of the "tape feeder" of the present invention, the component supply position 50 corresponds to an example of the "component supply position" of the present invention, the feeder body 51 corresponds to an example of the "feeder body" of the present invention, and the exposed member mounting unit 513 corresponds to the "exposed member mounting unit" of the present invention. The tape peeling member 52 and the tape cutting member 54 each correspond to an example of an "exposed member" of the present invention, the component storage tape 6 corresponds to an example of a "component storage tape" of the present invention, the carrier tape 61 corresponds to an example of a "carrier tape" of the present invention, the pocket 611 corresponds to an example of a "pocket" of the present invention, the top tape 62 corresponds to an example of a "top tape" of the present invention, the calculation unit 91 corresponds to an example of a "control unit" of the present invention, the UI 95 corresponds to an example of a "user interface" of the present invention, the substrate B corresponds to an example of a "substrate" of the present invention, and the component P corresponds to an example of a "component" of the present invention.

[0056] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention. For example, the exposure method management in Figure 8 may be modified as follows.

[0057] Figure 10 is a flowchart of the second example of exposure method management. The flowchart in Figure 10 is executed by the control of the main control unit 911. The difference from the first example in Figure 8 is that step S206 is executed instead of step S203, which determines whether the charge amount is above a threshold amount, but otherwise it is the same as the first example in Figure 8.

[0058] In other words, in the second example, if it is determined that the adsorption rate is below the threshold ("YES" in step S202), the main control unit 911 determines whether the orientation of the component P supplied by the target tape feeder 5 to the component supply position 50 is abnormal (step S206). Specifically, the main control unit 911 positions the component recognition camera 71 facing the component P supplied by the target tape feeder 5 to the component supply position 50 from above, and obtains an orientation image by having the component recognition camera 71 image the component P. If the orientation of the component P shown in the orientation image is normal ("NO" in step S206), the process returns to step S201. However, if the orientation of the component P shown in the orientation image is abnormal ("YES" in step S206), the process proceeds to step S204. As a technique for determining the orientation of the component P shown in the orientation image, for example, the technique for determining the orientation of component P in component recognition can be adapted.

[0059] Figure 11 is a flowchart of the third example of exposure method management. The flowchart in Figure 11 is executed by the control of the main control unit 911. The difference from the first example in Figure 8 is that a step S206 for determining the orientation of the part is performed between step S203 for determining whether the charge amount is above a threshold amount and step S204 for determining whether it is a peeling method, and in other respects it is the same as the first example in Figure 8.

[0060] In other words, in the third example, if it is determined that the adsorption rate is less than the threshold (YES in step S202), the main control unit 911 determines whether the charge amount of the component P supplied to the component supply position 50 is greater than or equal to the threshold. If the charge amount is less than the threshold (NO in step S203), the process returns to step S201, while if the charge amount is greater than or equal to the threshold (YES in step S203), the process proceeds to step S206.

[0061] In step S206, the main control unit 911 determines whether the orientation of the component P supplied by the target tape feeder 5 is abnormal. If the orientation of the component P is normal (if "NO" is found in step S206), the process returns to step S201. If the orientation of the component P is abnormal (if "YES" is found in step S206), the process proceeds to step S204.

[0062] Alternatively, in the first example, if the answer in step S202 is "YES", the first example may be modified so that step S203 is omitted and the process proceeds to step S204. According to the exposure method control examples shown above, if the component P fails to be attracted by the nozzle 32 due to the component P being charged, the exposure method for the component P is changed from the peeling method to the cutting method. Next, the control after the change in exposure method will be described.

[0063] Figure 12 is an example of a flowchart for monitoring the results of changing the exposure method. The flowchart in Figure 12 is executed under the control of the main control unit 911. In step S301, the main control unit 911 determines whether the exposure method has been changed. Specifically, when the UI 95 receives an input operation indicating a change in the exposure method, the main control unit 911 determines that the exposure method has been changed (YES in step S301). In the following step S302, the main control unit 911 determines whether the number of times the success or failure of the adsorption of the component P supplied by the tape feeder 5 that was the subject of the change has been determined has reached a predetermined number of times. When the number of success or failure determinations reaches the predetermined number (YES in step S302), the main control unit 911 calculates the adsorption rate Rs for the tape feeder 5 in the manner described above and displays the adsorption rate Rs on the UI 95's display (step S303). The adsorption rate Rs reflects whether or not the component P supplied by the tape feeder 5, which was the subject of the change after the exposure method was modified, was successfully adsorbed.

[0064] In this change result monitoring, the calculation unit 91 monitors the execution status of the implementation operation (adsorption rate Rs) after the exposure method has been changed as the post-change execution status (step S302), and notifies the UI 95 of this post-change execution status (step S303). In this configuration, the user can confirm whether the change in exposure method is appropriate.

[0065] Furthermore, the method for determining whether the nozzle 32 successfully adsorbs the part P is not limited to a method based on the recognition image captured by the part recognition camera 72. For example, the success or failure of the nozzle 32 adsorbing the part P may be determined based on whether or not a predetermined negative pressure is generated in the nozzle 32.

[0066] Furthermore, when monitoring the execution status of the mounting operation (steps S101 to S103, S107), the monitoring target is not limited to whether the nozzle 32 successfully attracts the component P. For example, the orientation of the component P shown in the image captured by the component recognition camera 72 of the component P mounted on the substrate B may also be the target of monitoring.

[0067] Furthermore, there may be reasons other than static charge on component P for changing the exposure method of component P. For example, if the bonding strength between the carrier tape 61 and the top tape 62 is strong, a strong load must be applied to the top tape 62 to separate it from the carrier tape 61. In such cases, the component P inside the carrier tape 61 may be shaken as the top tape 62 is separated, potentially resulting in an inappropriate orientation of component P. Therefore, if the measured load applied to the top tape 62 to separate it from the carrier tape 61 (separation load) is greater than a predetermined load, UI95 may be asked to propose a change from the peeling method to the cutting method.

[0068] Furthermore, depending on the type of top tape 62, scraps may be generated when the top tape 62 is cut. Therefore, for example, if the generation of scraps is detected from the image captured by the component recognition camera 71, the UI 95 may be asked to propose a change from the cutting method to the peeling method.

[0069] Furthermore, depending on the size of the component P, the tape cutter 541 used in the cutting method may damage the component P. Therefore, for example, if damage to the component P is detected from the image captured by the component recognition camera 71, the UI95 may be asked to propose a change from the cutting method to the peeling method.

[0070] Furthermore, the mechanical configuration of the component mounting machine 1 can be modified as appropriate. For example, the tape peeling member 52 or the tape cutting member 54 does not need to be detachable; the tape peeling member 52 or the tape cutting member 54 may be integrally configured with the feeder body 51.

[0071] Furthermore, the configuration of the tape feeder 5 can be modified, for example, as proposed in Japanese Patent Publication No. 2016-122753. Here, Figures 13A and 13B schematically show the configuration of modified versions of the tape feeder. Figure 13A shows a case where components are supplied by the tape feeder while being exposed by a peeling method, and Figure 13B shows a case where components are supplied by the tape feeder while being exposed by a cutting method. In the following, we will mainly explain the differences from the tape feeder 5 exemplified in Figures 3A and 3B above, and common points will be denoted by corresponding reference numerals and explanations will be omitted as appropriate.

[0072] As shown in Figures 13A and 13B, the tape feeder 5 comprises a feeder body 55 and a replacement unit 56 that is detachably attached to a unit mounting section 551 at the front end of the feeder body 55. In other words, the replacement unit 56 is located downstream of the feeder body 55 in the transport direction Y of the component storage tape 6. The feeder body 55 has the aforementioned sprocket 511 and tape retrieval section 53, and the replacement unit 56 has the aforementioned sprocket 512. Furthermore, the feeder body 55 has a motor 515 that rotates the sprocket 511, and the replacement unit 56 has a motor 516 that rotates the sprocket 512.

[0073] Furthermore, the exposure members (tape peeling member 52 / tape cutting member 54) that expose the component P are provided on the replacement unit 56. In this configuration, the exposure method by the tape feeder 5 can be changed between the peeling method and the cutting method by replacing the replacement unit 56 attached to the unit mounting section 551 of the feeder body 55 between the replacement unit 56 having the tape peeling member 52 (Figure 13A) and the replacement unit 56 having the tape cutting member 54 (Figure 13B).

[0074] In other words, the tape feeder 5 has a feeder body 55 that supports a parts storage tape 6 that is transported toward a parts supply position 50, and a unit mounting section 551 (exposure member mounting section) to which exposure members (tape peeling member 52 / tape cutting member 54) that expose the parts P transported toward the parts supply position 50 are detachably attached. Two types of exposure members (tape peeling member 52 / tape cutting member 54) that expose the parts P in different exposure methods can be attached to the unit mounting section 551. In response to this, the calculation unit 91 (control unit) causes the UI 95 to propose changing the exposure member attached to the unit mounting section 551 from one type of exposure member to the other type of exposure member among the two types of exposure members (tape peeling member 52 / tape cutting member 54). In this configuration, the user can change the type of exposure member (tape peeling member 52 / tape cutting member 54) attached to the unit mounting section 551, thereby enabling the use of an exposure member (tape peeling member 52 / tape cutting member 54) that exposes the component P in an appropriate exposure manner for component mounting.

[0075] Furthermore, the configuration of the head unit 3 is not limited to a modular type; it may also be a rotary type in which multiple nozzles 32 are arranged in a circular pattern. [Explanation of symbols]

[0076] 1... Component mounting machine 31…Implementation Head 39…Charge amount measuring instrument (charge amount measuring unit) 4…Parts Supply Department 41...Feeder mounting section 5... Tape feeder 50... Part supply location 51...Feeder unit 55...Feeder unit 513... Exposed component mounting section 52... Tape release member (exposed member) 54… Tape cutting component (exposed component) 6… Parts storage tape 61... Carrier Tape 611... Pocket 62…Top Tape 91...Calculation unit (control unit) 95...UI (User Interface) B... Circuit board P…Parts

Claims

1. A parts supply unit that supplies parts to a predetermined parts supply position by a tape feeder that transports parts storage tape, each of which stores parts in multiple pockets arranged in a row, A mounting head that performs a mounting operation to remove components supplied to the component supply position from the component supply position and mount them onto a circuit board, A user interface that provides notifications to the user, A control unit that monitors the execution status of the mounting operation by the mounting head, Equipped with, The component supply unit supplies the exposed components to the component supply position by transporting the components to the component supply position using the tape feeder and exposing the components in a predetermined exposure manner. The mounting head takes the exposed component from the component supply position and performs the mounting operation. The control unit is a component mounting machine that causes the user interface to suggest a change in the exposure method depending on the execution status of the mounting operation.

2. The parts supply unit has a feeder mounting section to which the tape feeder is detachably mounted, and supplies parts to the parts supply position by the tape feeder mounted on the feeder mounting section. Multiple types of tape feeders, each exposing components in a different exposure method, can be mounted in the feeder mounting section. The component mounting machine according to claim 1, wherein the control unit causes the user interface to suggest changing the tape feeder mounted on the feeder mounting section from one type of tape feeder to another type of tape feeder among the plurality of types of tape feeders, thereby causing the user interface to suggest a change in the exposure method.

3. The component mounting machine according to claim 2, wherein the control unit manages the storage locations of the other types of tape feeders, and when it proposes a change in the exposure method to the user interface, it notifies the user interface of the storage locations of the other types of tape feeders.

4. The tape feeder comprises a feeder body that supports the parts storage tape being transported toward the parts supply position, and an exposure member mounting section to which an exposure member that exposes the parts being transported toward the parts supply position is detachably attached. Multiple types of exposed members, each exposing a component using a different exposure method, can be mounted on the exposed member mounting section. The component mounting machine according to claim 1, wherein the control unit causes the user interface to propose a change in the exposure method, by causing the user interface to propose a change in the exposure method, from one type of exposure member to another type of exposure member among the plurality of types of exposure members.

5. The component mounting machine according to claim 1, wherein the control unit monitors the execution status of the mounting operation after the change in the exposure method as the modified execution status, and notifies the user interface of the modified execution status.

6. It further includes a charge amount measuring unit for measuring the charge amount of a component, The component mounting machine according to claim 1, wherein the control unit determines, based on the status of the mounting operation and the charge amount measured by the charge amount measuring unit, that the charging of the component is affecting the status of the mounting operation, and then causes the user interface to suggest a change in the exposure method.

7. The component storage tape comprises a carrier tape having a plurality of pockets and a top tape attached to the carrier tape to close the plurality of pockets. The component supply unit is capable of performing, as the exposure method, a peeling method in which the component is exposed by peeling the top tape from the carrier tape, and a cutting method in which the component is exposed by cutting open the top tape. The component mounting machine according to claim 1, wherein the control unit monitors the execution status of the mounting operation performed on the component exposed by the peeling method, and, according to the execution status of the mounting operation, causes the user interface to propose a change in the exposure method from the peeling method to the cutting method.

8. A process of supplying parts to a predetermined parts supply position by a tape feeder that transports a parts storage tape in which parts are stored in multiple pockets arranged in a row, The process involves supplying the exposed parts to the parts supply position by transporting the parts to the parts supply position using the tape feeder while exposing the parts in a predetermined exposure manner, A step of performing a mounting operation by a mounting head, in which exposed components are taken from the component supply position and mounted onto the substrate, A step of monitoring the execution status of the mounting operation by the mounting head, A step of causing the user interface to suggest a change in the exposure method depending on the execution status of the aforementioned implementation operation. A component mounting method comprising the following features.

Images