Attached circuit board manufacturing system and attached circuit board manufacturing method

Abstract

To provide a mounting board manufacturing system, etc. with which it is possible to determine the symptoms of disorder of a component supply device for mounting components.SOLUTION: A mounting board manufacturing system 1 comprises: a body unit 71 in which a tape transport path W for guiding a carrier tape 14 is provided; a first carrier tape transport unit 73 that transports the carrier tape 14 in the tape transport path W to a component takeout position; a second carrier tape transport unit 90 that is disposed upstream of the first carrier tape transport unit 73 of the tape transport path W, and that transports the carrier tape 14; and a feeder control unit 78 that controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90. The feeder control unit 78 causes the second carrier tape transport unit 90 to transport the carrier tape 14 and then causes the first carrier tape transport unit 73 to transport the carrier type 14.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present disclosure relates to a mounting substrate manufacturing system and a mounting substrate manufacturing method.

Background Art

[0002] Patent Document 1 discloses a facility diagnosis system that can more appropriately diagnose malfunctions in manufacturing facilities such as tape feeders. In the facility diagnosis system, based on the operation information of the manufacturing facility, using a diagnosis model, by estimating the malfunction level of each unit constituting each of the plurality of manufacturing facilities from the operation information, it is shown that the malfunction of the manufacturing facility can be diagnosed.

[0003] Also, Patent Document 2 discloses a management device that determines that an XY robot is in an abnormal omen state before reaching an abnormal state according to the torque output from a motor provided in the XY robot.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure provides a mounting substrate manufacturing system and the like that can accurately determine an omen of a malfunction in a component supply device for component mounting.

Means for Solving the Problems

[0006] A printed circuit board manufacturing system according to one aspect of the present disclosure includes a main body provided with a tape transport path for guiding a carrier tape, a first carrier tape transport unit for transporting the carrier tape in the tape transport path to a component removal position, and a second carrier tape transport unit arranged upstream of the first carrier tape transport unit in the tape transport path for transporting the carrier tape. (i) The component mounting device receives transport instructions at multiple different timings from which it sequentially picks up multiple components on the carrier tape at the component removal position, and (ii) Each time a transport instruction is received, the carrier tape moves by a predetermined pitch. The system includes a control unit that controls the operation of the first carrier tape transport unit and the second carrier tape transport unit, wherein the control unit causes the second carrier tape transport unit to transport the carrier tape, and then causes the first carrier tape transport unit to transport the carrier tape. In the control described above, the second carrier tape transport unit is instructed to transport the carrier tape by the predetermined pitch between the time the carrier tape moves by the predetermined pitch and the next transport instruction is received. .

[0007] Furthermore, a method for manufacturing a printed circuit board according to one aspect of the present disclosure is a printed circuit board manufacturing system comprising: a main body provided with a tape transport path for guiding a carrier tape; a first carrier tape transport unit for transporting the carrier tape in the tape transport path to a component removal position; and a second carrier tape transport unit arranged upstream of the first carrier tape transport unit in the tape transport path for transporting the carrier tape. The component mounting device, which sequentially picks up multiple components on the carrier tape at the component removal position, receives transport instructions at multiple different timings, and each time a transport instruction is received, the carrier tape moves by a predetermined pitch, (i) The second carrier tape transport unit transports the tape, (ii) After transport by the second carrier tape transport unit, transport is performed by the first carrier tape transport unit. The transport of the carrier tape by the second carrier tape transport unit is performed between the time the carrier tape moves by the predetermined pitch and the time the next transport instruction is received. .

[0008] These comprehensive or specific embodiments may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, and recording medium. Furthermore, the recording medium may be a non-temporary recording medium. [Effects of the Invention]

[0009] The printed circuit board manufacturing system and other related systems disclosed herein can accurately detect signs of malfunction in component supply equipment for component mounting.

[0010] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and features described in the specification and drawings, but not all of them are necessarily provided in order to obtain one or more identical features. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 shows an example of the configuration of a printed circuit board manufacturing system including a component mounting line in an embodiment. [Figure 2] Figure 2 is an external perspective view of the component mounting device in the embodiment. [Figure 3] Figure 3 shows an example of the internal configuration of a component mounting device in an embodiment. [Figure 4] Figure 4 is a diagram that partially shows an example of the AA cross-section in Figure 3. [Figure 5] Figure 5 is a schematic diagram showing the positional relationship between the mounting head and the feeder in the embodiment. [Figure 6] Figure 6 is an external view showing the appearance of the component to be mounted in the embodiment. [Figure 7] Figure 7 is a top view showing an example of a carrier tape in the embodiment. [Figure 8] Figure 8 is a side view showing the configuration of the feeder in the embodiment. [Figure 9] Figure 9 shows an example of the functional configuration of a component mounting device in an embodiment. [Figure 10] Figure 10 is a flowchart showing an example of the feeder's transport operation in the embodiment. [Figure 11] Figure 11 is a diagram illustrating the repeated transport operation between the first carrier tape transport unit and the second carrier tape transport unit. [Modes for carrying out the invention]

[0012] (Findings underlying the present disclosure) The inventor has found that the following problems occur when monitoring the torque of the motor that constitutes the tape feeder in the above prior art to determine that the tape feeder is in an abnormal precursor state before reaching an abnormal state.

[0013] The torque of the motor of the tape feeder is affected by the factors causing abnormalities in the conveying operation of the carrier tape and also by noise factors other than the factors causing abnormalities in the conveying operation. For this reason, simply monitoring the torque of the motor may result in an incorrect determination that an abnormality has occurred in the conveying operation even when no abnormality has occurred in the conveying operation. For example, the torque of the motor is affected by the following noise factors: the difference in weight due to the amount of use of the component reel, pulling up the component reel by using up the component reel to the end, snagging in the conveying path of the carrier tape, the difference in the type of component reel, the difference due to the manufacturer of the component reel, the difference due to the difference in tape width, and the like. That is, the inventor has found an implementation substrate manufacturing system and an implementation substrate manufacturing method capable of accurately determining a sign of malfunction of a component supply device for component mounting by reducing the above noise factors.

[0014] In order to solve the above problems, an implementation substrate manufacturing system according to an aspect of the present disclosure includes a main body portion provided with a tape conveyance path for guiding a carrier tape, a first carrier tape conveyance portion that conveys the carrier tape in the tape conveyance path to a component extraction position, a second carrier tape conveyance portion that is disposed upstream of the first carrier tape conveyance portion in the tape conveyance path and conveys the carrier tape, and a control portion that controls the operations of the first carrier tape conveyance portion and the second carrier tape conveyance portion. The control portion causes the second carrier tape conveyance portion to convey the carrier tape and then causes the first carrier tape conveyance portion to convey the carrier tape.

[0015] According to this, after the conveyance by the second carrier tape conveyance unit arranged on the upstream side, the conveyance by the first carrier tape conveyance unit on the downstream side is performed. Therefore, the conveyance by the first carrier tape conveyance unit can be performed in a state where there is as little influence as possible from factors other than the malfunction of the first carrier tape conveyance unit such as the influence caused by the component reel. That is, the conveyance by the first carrier tape conveyance unit can be performed in a state where noise factors that affect the conveyance by the first carrier tape conveyance unit are reduced. As a result, the torque value of the motor provided in the first carrier tape conveyance unit can be obtained in a state with little noise, and the sign of malfunction of the component supply device can be accurately determined.

[0016] Also, when there is a malfunction caused by the component reel, an error is likely to occur in the second carrier tape conveyance unit. Therefore, a malfunction caused by the component reel can be detected before operating the first carrier tape conveyance unit.

[0017] Further, the control unit receives conveyance instructions from a component mounting device that sequentially adsorbs a plurality of components on the carrier tape at the component take-out position at different timings. Each time a conveyance instruction is received, the control unit controls the operations of the first carrier tape conveyance unit and the second carrier tape conveyance unit so that the carrier tape moves by a predetermined pitch. In this control, after the carrier tape moves by the predetermined pitch and before receiving the next conveyance instruction, the second carrier tape conveyance unit may convey the carrier tape by the predetermined pitch.

[0018] According to this, when the next conveyance instruction is received, the conveyance by the first carrier tape conveyance unit can be executed. Therefore, after the conveyance by the second carrier tape conveyance unit, the conveyance by the first carrier tape conveyance unit can be executed.

[0019] Further, the control unit may perform the control so as to maintain the state in which the carrier tape is deflected.

[0020] According to this, since the carrier tape is kept in a slack state when transported by the first carrier tape transport unit, transport by the first carrier tape transport unit can be performed while reducing noise factors that affect transport by the first carrier tape transport unit.

[0021] Furthermore, the control unit may include an error detection unit for detecting transport errors in the second carrier tape transport unit, and if the error detection unit does not detect a transport error after transport by the second carrier tape transport unit in the control, the control unit may start transport by the first carrier tape transport unit.

[0022] Therefore, if no transport error is detected, transport by the first carrier tape transport unit can be performed. In other words, transport by the first carrier tape transport unit can be performed while reducing noise factors that affect transport by the first carrier tape transport unit.

[0023] Furthermore, the control unit may notify the component mounting device that the transport error has been detected when the error detection unit detects the transport error.

[0024] Therefore, if the error detection unit detects a transport error, it can be controlled, for example, to exclude the component mounting device from the object to be picked up.

[0025] Furthermore, if the component mounting device receives notification that a transport error has been detected, it may exclude the carrier tape being transported by the second carrier tape transport unit in which the transport error was detected from the object to be picked up.

[0026] Therefore, the operation to pick up the component of the carrier tape that has an error can be omitted, thus reducing operational losses.

[0027] Furthermore, the second carrier tape transport unit includes a sprocket for transporting the carrier tape and a motor for rotating the sprocket, and the error detection unit may detect the transport error if the torque value of the motor is outside the normal range.

[0028] Therefore, transport errors by the second carrier tape transport unit can be detected before transport by the first carrier tape transport unit.

[0029] Furthermore, the system may also include a predictive maintenance unit for determining signs of malfunction in the carrier tape transport, wherein the predictive maintenance unit determines signs of malfunction in the carrier tape transport by inputting data related to the operation of the motor into an inference model that has been previously learned using data related to the operation of the motor of the first carrier tape transport unit.

[0030] Therefore, based on the torque value of the motor in the low-noise first carrier tape transport unit, it is possible to determine signs of malfunction in carrier tape transport. Thus, it is possible to accurately determine signs of malfunction in the component supply device.

[0031] Furthermore, the second carrier tape transport unit may include a sprocket for transporting the carrier tape, a motor for rotationally driving the sprocket, and a ratchet mechanism for restricting the rotational direction of the sprocket to the forward rotational direction.

[0032] Therefore, even without alternating between transport by the second carrier tape transport unit and transport by the first carrier tape transport unit, transport by the first carrier tape transport unit can be performed while reducing noise factors that affect transport by the first carrier tape transport unit.

[0033] Furthermore, a method for manufacturing a printed circuit board according to one aspect of the present disclosure is a method for manufacturing a printed circuit board using a printed circuit board manufacturing system comprising: a main body provided with a tape transport path for guiding a carrier tape; a first carrier tape transport unit that transports the carrier tape in the tape transport path to a component removal position; and a second carrier tape transport unit that is arranged upstream of the first carrier tape transport unit in the tape transport path and transports the carrier tape, wherein transport is performed by the second carrier tape transport unit, and after transport by the second carrier tape transport unit, transport is performed by the first carrier tape transport unit.

[0034] According to this, since the second carrier tape transport unit located upstream performs transport first, followed by the first carrier tape transport unit located downstream, the first carrier tape transport unit can perform transport with minimal influence from factors other than malfunctions in the first carrier tape transport unit, such as those caused by component reels. In other words, the first carrier tape transport unit can perform transport with reduced noise factors affecting transport. As a result, the torque value of the motor equipped in the first carrier tape transport unit can be obtained with less noise, and signs of malfunction in the component supply device can be accurately detected.

[0035] Furthermore, if there is a malfunction caused by the parts reel, errors are more likely to occur in the second carrier tape transport unit, so the malfunction caused by the parts reel can be detected before operating the first carrier tape transport unit.

[0036] The embodiments will be described in detail below with reference to the drawings.

[0037] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, among the components in the following embodiments, those not described in the independent claim representing the highest-level concept will be described as optional components.

[0038] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same component is denoted by the same reference numeral in each figure.

[0039] (Embodiment) [Manufacturer of printed circuit boards] Figure 1 shows an example of the configuration of a printed circuit board manufacturing system, including a component mounting line.

[0040] This printed circuit board manufacturing system 1 includes a component mounting line L1 and an information processing terminal 200.

[0041] The component mounting line L1 is an example of production equipment for mounted circuit boards. It produces mounted circuit boards by mounting at least one component P onto a circuit board B that is brought in from the upstream side, and then delivers the produced mounted circuit boards to the downstream side. In this embodiment, the transport direction of the circuit board is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction is referred to as the Y-axis direction. The X-axis direction and the Y-axis direction are directions along the horizontal plane. Furthermore, the direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. The positive and negative sides of the X-axis direction are the downstream and upstream sides in the transport direction of the circuit board B, respectively, and the positive and negative sides of the Y-axis direction are the rear (or far side) and front (or near side) in the front-to-back direction, respectively. The positive and negative sides of the Z-axis direction are the upper and lower sides in the vertical direction, respectively. Figure 1 shows the top surface of the component mounting line L1.

[0042] The component mounting line L1 comprises a solder printing device M1, a printing inspection device M2, component mounting devices M3-M6, a mounting inspection device M7, and a reflow device M8. These devices are arranged in series from upstream to downstream in the transport direction: solder printing device M1, printing inspection device M2, component mounting devices M3-M6, mounting inspection device M7, and reflow device M8.

[0043] The solder printing device M1, the printing inspection device M2, the component mounting devices M3-M6, the mounting inspection device M7, and the reflow device M8 are connected to the information processing terminal 200 via the communication network 2. The solder printing device M1 prints solder onto the substrate B that is fed in from the upstream side. The printing inspection device M2 inspects the condition of the solder printed on the substrate B using a solder inspection camera.

[0044] Component mounting devices M3 to M6 perform component mounting work, which involves mounting components P onto circuit board B. Although component mounting line L1 is equipped with four component mounting devices M3 to M6, the number is not limited to four; it may be one to three, or five or more.

[0045] The mounting inspection device M7 inspects the condition of the components P mounted on the substrate B using a component inspection camera. The reflow device M8 heats the substrate B that has been brought into the device to harden the solder on the substrate B and join the electrodes of the substrate B to the components P.

[0046] The information processing terminal 200 is located, for example, in the same building as the component mounting line L1 and communicates with the solder printing machine M1, printing inspection machine M2, component mounting machines M3-M6, mounting inspection machine M7, and reflow machine M8 included in the component mounting line L1. The information processing terminal 200 may communicate with these devices wirelessly or via wired connections. Wireless communication may be Wi-Fi®, Bluetooth®, ZigBee, or low-power radio. The information processing terminal 200 may also acquire information from each device included in the component mounting line L1, such as the operating rate of that device, and manage each device based on that information. Such an information processing terminal 200 may also be configured as a personal computer, tablet terminal, or smartphone.

[0047] [Component mounting equipment] Figure 2 is an external perspective view of component mounting device M3. Component mounting devices M4 to M6 may have a similar appearance to component mounting device M3.

[0048] The component mounting device M3 includes, for example, two component supply units 6, a display unit 17, and two opening / closing covers 16. In Figure 2, one of the two component supply units 6 is shown, while the other is hidden at the back (i.e., on the positive side of the Y-axis).

[0049] Multiple feeders 7 are arranged in parallel along the X-axis in the parts supply unit 6. The feeders 7 supply the parts P by pitching a carrier tape containing the parts P in the tape feeding direction.

[0050] The display unit 17 provides information to the operator of the component mounting device M3. For example, the display unit 17 provides information by displaying the content to be displayed. Specifically, the display unit 17 is configured as a liquid crystal display or an organic EL (electro-luminescence) display.

[0051] Each of the two opening / closing covers 16 is designed to open and close freely, and when closed, it covers the mounting head described later. In other words, when each of the two opening / closing covers 16 is closed, it covers and conceals the inside of the component mounting device M3. Therefore, when each of the two opening / closing covers 16 is closed, the operator cannot reach inside the component mounting device M3 and cannot touch the mounting head.

[0052] Figure 3 shows an example of the internal configuration of component mounting device M3. Note that component mounting devices M4 to M6 may have the same internal configuration as component mounting device M3. Also, the configuration of component mounting device M3 shown in Figure 3 is a view of the inside of component mounting device M3 from the positive Z-axis side, and the two opening / closing covers 16 are not shown.

[0053] In addition to the two component supply units 6 mentioned above, the component mounting device M3 also includes a base 4, a substrate transport mechanism 5, two X-axis beams 9, a Y-axis beam 8, two mounting heads 10, two cameras 12, and a stage 11.

[0054] The two component supply units 6 are positioned so as to sandwich the substrate transport mechanism 5 in the Y-axis direction.

[0055] The substrate transport mechanism 5 is equipped with two rails aligned in the X-axis direction and is positioned in the center of the base 4. The substrate transport mechanism 5 transports the substrate B brought in from the upstream side and positions and holds the substrate B in a position for performing component mounting work.

[0056] The Y-axis beam 8 is positioned along the Y-axis direction at one end of the X-axis direction on the upper surface of the base 4 (the right side in the example shown in Figure 3).

[0057] The two X-axis beams 9 are coupled to the Y-axis beam 8 so as to be movable in the Y-axis direction while remaining along the X-axis direction.

[0058] The mounting head 10 is mounted on each of the two X-axis beams 9 so as to be movable in the X-axis direction. The mounting head 10 is equipped with a plurality of suction units 10a that can attract, hold, and raise / lower parts P. A nozzle 10b is detachably attached to the tip of each suction unit 10a (see Figure 4).

[0059] Each of the two mounting heads 10 moves in the X-axis and Y-axis directions by a drive mechanism including a Y-axis beam 8 and an X-axis beam 9. As a result, each of the two mounting heads 10 picks up a component P from the component picking position of the feeder 7 located in the component supply unit 6 corresponding to the mounting head 10 using a nozzle 10b, and mounts it to the mounting point on the substrate B positioned by the substrate transport mechanism 5.

[0060] Each of the two cameras 12 is attached to the mounting head 10 corresponding to that camera 12. The camera 12 images the substrate B in order to recognize the position and type of the substrate B positioned in the substrate transport mechanism 5. The camera 12 also images the component P in order to recognize the type of component P that is picked up by the nozzle 10b of the mounting head 10. Furthermore, the camera 12 images the component P at the time of pickup in order to recognize the position of the component P when the mounting head 10 picks it up. In addition, the camera 12 images the nozzle 10b in order to read information from the nozzle 10b.

[0061] Stage 11, also called a nozzle changer, has at least one nozzle 10b mounted on it. This at least one nozzle 10b mounted on stage 11 is used to replace the nozzle 10b mounted on the suction unit 10a of the mounting head 10. For example, each of the at least one nozzle 10b mounted on stage 11 has different attributes from the nozzle 10b mounted on the suction unit 10a of the mounting head 10. Also, each of the at least one nozzle 10b mounted on stage 11 has different attributes from each other. Therefore, for the production of a mounted substrate, a nozzle 10b with attributes suitable for the component P to be mounted on the substrate B is selected and mounted on the suction unit 10a of the mounting head 10.

[0062] Figure 4 is a diagram that partially shows an example of the AA cross-section in Figure 3.

[0063] As shown in Figure 4, the parts supply unit 6 comprises a feeder base 13a, a plurality of feeders 7 mounted on the feeder base 13a, and a trolley 13 that supports the feeder base 13a.

[0064] The trolley 13 is configured to be detachably attached to the base 4 and is further equipped with a cassette holder 15. The cassette holder 15 is configured to hold multiple component reels C. Each component reel C stores the carrier tape 14 in a wound state. Each of the multiple component reels C is held in the upper holding position Hu or the lower holding position Hd of the cassette holder 15. The carrier tape 14 pulled out from the component reels C held by the cassette holder 15 is mounted on the feeder 7.

[0065] Camera 12 takes images from an oblique angle so that the field of view includes the side of the nozzle 10b. This allows camera 12 to image not only the nozzle 10b mounted on the mounting head 10 corresponding to camera 12, but also, for example, the component P that is attracted to the nozzle 10b and the substrate mark on the substrate B that is positioned by the substrate transport mechanism 5. The component mounting device M3 detects the relative position of the component P to the nozzle 10b when the nozzle 10b attracts the component P based on the images taken by camera 12. The detected relative position is output (transmitted) to the abnormality determination device 110, which will be described later. Here, the nozzle 10b is an example of an attraction part.

[0066] Camera 18 captures an image from below so that the field of view includes the lower end of the nozzle 10b. Camera 18 is fixed to the base 4 of the component mounting device M3 or below the component mounting device M3. In other words, the positional relationship between camera 18 and base 4 is fixed. As a result, the component mounting device M3 detects the position of the nozzle 10b relative to the reference position of the base 4 by imaging with camera 18. Therefore, the component mounting device M3 can detect the suction position where the nozzle 10b stopped when a component P was picked up. The detected suction position is output (transmitted) to the abnormality detection device 110. The component mounting device M3 uses the detected suction position, for example, to predict the supply position of the next supplied component P.

[0067] Figure 5 is a schematic diagram showing the positional relationship between the mounting head 10 and the feeder 7. Figure 6 is an external view showing the appearance of the component P to be mounted. Figure 7 is a top view showing an example of the carrier tape 14. Figure 8 is a side view showing the configuration of the feeder 7.

[0068] The mounting head 10 can be fitted with up to 10 nozzles 10b, for example, as shown in Figure 5. The mounting head 10 fitted with 10 nozzles 10b can simultaneously pick up parts P from each of up to 10 feeders 7 (in a single up-and-down motion).

[0069] The feeder 7 feeds the carrier tape 14 in a pitch direction, supplying multiple components P stored on the carrier tape 14 sequentially to the component pick-up position 7a. The mounting head 10 uses its nozzle 10b to pick up the components P supplied to the component pick-up position 7a, moves them, and mounts the components P to the mounting points on the substrate B. The feeder 7 is an example of a component supply device.

[0070] The components P are chip-type electronic components P1 to P4, such as those shown in Figures 6(a) to 6(d). Multiple such components P are stored in a carrier tape 14 at regular intervals, as shown in Figure 7. The carrier tape 14 has multiple pockets 14a, each containing a component P, and multiple feed holes 14b that engage with the carrier tape 14 for the sprocket of the feeder 7 to feed the carrier tape 14. The pockets 14a are examples of containers for storing components P, and the size of the pockets 14a is larger than the size of the components P. The feeder 7 feeds the carrier tape 14 in the tape feeding direction by rotating the sprocket in predetermined rotational angle units. The carrier tape 14 also has cover tapes that cover the openings of the pockets 14a containing components P, but these are omitted in Figure 7.

[0071] A parts reel C is mounted on the feeder 7. A carrier tape 14, as shown in Figure 7, with parts stored at equal pitches, is wound around the parts reel C. The feeder 7 has the function of feeding the carrier tape 14 from inside the main body 71 shown in Figure 8, and feeding the parts P stored at equal pitches on the carrier tape 14 to the supply port 72 at the same pitch. A tape transport path W for guiding the carrier tape 14 is provided inside the main body 71 of the feeder 7.

[0072] A first carrier tape transport section 73 is provided downstream of the tape transport path W within the main body section 71. The first carrier tape transport section 73 includes a sprocket 74 with pins formed on its outer circumference that engage with feed holes 14b formed at equal pitch in the feeding direction of the carrier tape 14. The first carrier tape transport section 73 also includes a drive motor 75, which is a means for rotating the sprocket 74, and a transmission mechanism that transmits the rotational drive of the drive motor 75 to the sprocket 74.

[0073] When the drive motor 75 is controlled to rotate intermittently in accordance with the storage pitch of the components P, the sprocket 74 performs index rotation, and the carrier tape conveyed by the second carrier tape transport unit 90 (described later) is fed to the leading edge. As a result, the components P stored in the carrier tape 14 are sequentially supplied to the supply port 72, which is the position where they are to be picked up, i.e., the component removal position.

[0074] The supply port 72 is formed by opening into a part of the tape guide 76, which is mounted on the upper part of the main body 71 and guides the feeding of the carrier tape 14. Part of the tape guide 76 is the folded portion of the cover tape 14c that has been peeled off from the surface of the carrier tape 14, and the cover tape peeling mechanism 77 peels the cover tape 14c from the surface of the carrier tape 14. As a result, the carrier tape 14 is supplied to the supply port 72 with the component P exposed, and is picked up by the nozzle 10b which is positioned above the supply port 72.

[0075] The gear unit 80 is composed of a gear train including a drive gear 81, a first transmission gear 82, a second transmission gear 83, a third transmission gear 84, and a final gear 85. The drive gear 81 is mounted on the output shaft of the drive motor 75. The first transmission gear 82 meshes with the drive gear 81. The second transmission gear 83 is fixed coaxially to the first transmission gear 82, and this second transmission gear 83 meshes with the third transmission gear 84. The third transmission gear 84, which meshes with the second transmission gear 83, also meshes with the final gear 85, which is fixed to the rotating shaft of the sprocket 74. Note that the configuration of a transmission mechanism like the gear unit 80 is not limited to this, and the number of gears in the gear unit 80 is not limited to five; it may be fewer than five or more than five.

[0076] Furthermore, a second carrier tape transport section 90 is provided upstream of the first carrier tape transport section 73 in the tape transport path W within the main body section 71. Similar to the first carrier tape transport section 73, the second carrier tape transport section 90 includes a sprocket 91 with pins formed on its outer circumference that engage with feed holes 14b formed at equal pitch in the feeding direction of the carrier tape 14. The second carrier tape transport section 90 also includes a drive motor 92, which is a means for rotating the sprocket 91, and a transmission mechanism that transmits the rotational drive of the drive motor 92 to the sprocket 91.

[0077] When the drive motor 92 is controlled to rotate intermittently in accordance with the storage pitch of the components P, the sprocket 91 performs index rotation, and the carrier tape 14 wound on the component reel C is pulled into the main body 71 from the rear end and fed pitch towards the first carrier tape transport section 73.

[0078] The gear unit 93 has a configuration similar to, for example, the gear unit 80. Specifically, the gear unit 93 is composed of a gear train including a drive gear 94, a first transmission gear 95, a second transmission gear 96, a third transmission gear 97, and a final gear 98. The drive gear 94 is mounted on the output shaft of the drive motor 92. The first transmission gear 95 meshes with the drive gear 94. The second transmission gear 96 is fixed coaxially to the first transmission gear 95, and this second transmission gear 96 meshes with the third transmission gear 97. The third transmission gear 97, which meshes with the second transmission gear 96, also meshes with the final gear 98, which is fixed to the rotating shaft of the sprocket 91. Note that the configuration of the transmission mechanism such as the gear unit 93 is not limited to this, and the number of gears in the gear unit 93 is not limited to five; it may be less than five or more than five. Furthermore, the gear unit 93 may have a different configuration from the gear unit 80.

[0079] The feeder 7 includes a feeder control unit 78 that controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90. Specifically, the feeder control unit 78 controls the rotational drive of the drive motor 75 and the rotational drive of the drive motor 92. When the feeder control unit 78 controls the pitch feeding of the carrier tape 14, it causes the second carrier tape transport unit 90 to transport the carrier tape 14, and then causes the first carrier tape transport unit 73 to transport the carrier tape 14.

[0080] Furthermore, the feeder 7 includes an error detection unit 99 that detects transport errors in the first carrier tape transport unit 73 and the second carrier tape transport unit 90. The error detection unit 99 acquires the torque value of the drive motor 75 of the first carrier tape transport unit 73, and if the torque value is outside a predetermined normal range, it detects that a transport error has occurred in the first carrier tape transport unit 73. The error detection unit 99 also acquires the torque value of the drive motor 92 of the second carrier tape transport unit 90, and if the torque value is outside a predetermined normal range, it detects that a transport error has occurred in the second carrier tape transport unit 90.

[0081] The causes of malfunction in the component mounting device M3, configured as described above, include, for example, the following: dirt in the supply port 72, wear and looseness at the tip of the sprocket 74, wear and misalignment of the drive motor 75, as well as looseness, misalignment of the feeder 7, and deterioration of the motor torque, etc.

[0082] [Component mounting equipment] Figure 9 is a block diagram showing an example of the functional configuration of the component mounting device M3.

[0083] In addition to the aforementioned mounting head 10, camera 12, Y-axis beam 8, X-axis beam 9, substrate transport mechanism 5, stage 11, camera 18, and component supply unit 6, the component mounting device control unit 100 is also included.

[0084] The component mounting device control unit 100 is a processing unit that controls the operation of the component mounting device M3. The component mounting device control unit 100 comprises a component mounting operation processing unit 101, a screen display I / F processing unit 102, a main memory unit 103, and a predictive error determination unit 104.

[0085] The component mounting operation processing unit 101 is a processing unit that controls the operation of each component of the component mounting device M3, including the mounting head 10, camera 12, Y-axis beam 8, X-axis beam 9, substrate transport mechanism 5, stage 11, camera 18, and component supply unit 6. The component mounting operation processing unit 101 executes a program stored in the main memory unit 103, acquires the operating status of each component of the component mounting device M3, and controls the operation of each component of the component mounting device M3 according to the operating status. For example, each time the mounting head 10 picks up a component P from the feeder 7, the component mounting operation processing unit 101 outputs a transport instruction to the feeder 7 to supply the next component P. In other words, the component mounting operation processing unit 101 outputs transport instructions at multiple different timings.

[0086] The screen display interface processing unit 102 displays the control status of the component mounting operation processing unit 101. The screen display interface processing unit 102 also accepts input from the operator to change the type of control of the component mounting device M3 or to change the settings of that control (for example, the settings of control parameters).

[0087] The main memory unit 103 stores programs and control parameters for controlling the component mounting device M3, as well as operating information for the component mounting device M3.

[0088] The predictive detection unit 104 determines for each feeder 7 whether there is a malfunction in the transport of the carrier tape 14 by the feeder 7. The predictive detection unit 104 determines whether there is a malfunction in the transport of the carrier tape 14 by inputting data on the operation of the drive motor 75 into an inference model that has been previously learned using data on the operation of the drive motor 75 of the first carrier tape transport unit 73. The data on the operation of the drive motor 75 includes, for example, the torque value of the drive motor 75, the rotational speed of the drive motor 75, and the deviation of the rotation amount of the drive motor 75. The torque value may be the PWM value of the drive motor 75. The data on the operation of the drive motor 75 is data acquired in time series. The inference model is a learned model generated based on normal data obtained when no abnormality occurs and abnormal data obtained when an abnormality occurs, while the feeder control unit 78 controls the pitch feed by the first carrier tape transport unit 73 and the second carrier tape transport unit 90.

[0089] The processing unit and abnormality detection device 110 included in the component mounting device control unit 100 are implemented by a processor such as a DSP, but may also be implemented by a microcomputer or dedicated circuitry, or by a combination of two or more of the processor, microcomputer, and dedicated circuitry. Furthermore, the main memory unit 103 and the storage unit 115 may be implemented by non-volatile memory and storage.

[0090] Here, we will describe a specific example of how the feeder control unit 78 controls the pitch feeding of the carrier tape 14.

[0091] The feeder control unit 78 receives transport instructions from the component mounting device control unit 100 at multiple different timings. Each time the feeder control unit 78 receives a transport instruction, it controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90, i.e., performs pitch feeding, so that the carrier tape 14 moves by a predetermined pitch. In pitch feeding, the feeder control unit 78 causes the second carrier tape transport unit 90 to transport the carrier tape 14 by a predetermined pitch between the time the carrier tape 14 moves by a predetermined pitch and the next transport instruction is received. Since the second carrier tape transport unit 90 transports the carrier tape before the first carrier tape transport unit 73 transports it, the feeder control unit 78 controls the pitch feeding so that the carrier tape 14 maintains a sagging state.

[0092] Furthermore, the feeder control unit 78 may control the transport so as to maintain the carrier tape 14 in a sagging state by controlling the transport so that the cumulative amount transported by the second carrier tape transport unit 90 is equal to or greater than the cumulative amount transported by the first carrier tape transport unit 73, after starting pitch feed control. In other words, the feeder control unit 78 may control the rotation amounts of the drive motors 75 and 92 so that the cumulative amount of movement of the outer circumference of the sprocket 91 of the second carrier tape transport unit 90 is equal to or greater than the cumulative amount of movement of the outer circumference of the sprocket 74 of the first carrier tape transport unit 73, after starting pitch feed control.

[0093] Furthermore, the feeder control unit 78 may start transporting by the first carrier tape transport unit 73 if the error detection unit 99 does not detect a transport error after transport by the second carrier tape transport unit 90. Also, if the error detection unit 99 detects a transport error, the feeder control unit 78 may notify the component mounting device control unit 100 that an error has been detected. In this case, the component mounting device control unit 100 excludes the component P on the carrier tape 14 being transported by the second carrier tape transport unit 90 where the transport error was detected from being picked up. In other words, the component mounting device control unit 100 excludes the feeder 7 where the transport error was detected from being picked up among the multiple feeders 7.

[0094] [Operation] Next, the transport operation of the carrier tape 14 by the feeder control unit 78 of the feeder 7 will be described. Figure 10 is a flowchart showing an example of the transport operation of the feeder 7.

[0095] The feeder 7 performs a pre-transport operation (S11). Specifically, the feeder 7 causes the second carrier tape transport unit 90 to transport the carrier tape 14 by a predetermined pitch.

[0096] Next, the feeder 7 determines whether or not a transport error has occurred in the second carrier tape transport unit 90, as detected by the error detection unit 99 (S12).

[0097] If the error detection unit 99 determines that a transport error has occurred in the second carrier tape transport unit 90 (Yes in S12), the feeder 7 executes step S13. If the error detection unit 99 determines that no transport error has occurred in the second carrier tape transport unit 90 (No in S12), the feeder 7 executes step S15.

[0098] In step S13, the feeder 7 notifies the component mounting device control unit 100 that a transport error has been detected. The component mounting device control unit 100 then excludes the feeder 7 in which the transport error was detected from the collection targets (S14).

[0099] In step S15, the feeder 7 receives a transport command from the component mounting device control unit 100.

[0100] Then, the feeder 7 performs a transport operation (S16). Specifically, the feeder 7 causes the first carrier tape transport unit 73 to transport the carrier tape 14 by a predetermined pitch. Once step S16 is executed, steps S17 and S20 are executed.

[0101] In step S17, the feeder 7 determines whether or not a transport error has occurred in the first carrier tape transport unit 73, as detected by the error detection unit 99.

[0102] If the error detection unit 99 determines that a transport error has occurred in the first carrier tape transport unit 73 (Yes in S17), the feeder 7 executes step S18. If the error detection unit 99 determines that no transport error has occurred in the first carrier tape transport unit 73 (No in S17), the feeder 7 returns to step S11. In other words, if no transport error has occurred, the feeder 7 alternately repeats the pre-transport operation by the second carrier tape transport unit 90 in step S11 and the transport operation by the first carrier tape transport unit 73 in step S16.

[0103] Figure 11 is a diagram illustrating the repeated transport operation between the first carrier tape transport unit and the second carrier tape transport unit. In Figure 11, the relationship between the sprocket 74 of the first carrier tape transport unit 73, the sprocket 91 of the second carrier tape transport unit 90, and the carrier tape 14 is shown in a simplified manner.

[0104] Figure 11(a) shows the state before the start of transport. Before the start of transport, for example, the carrier tape 14 has little deflection between the sprocket 91 and the sprocket 74.

[0105] Figure 11(b) shows the state after the pre-transport operation by the second carrier tape transport unit 90 has been performed and the sprocket 91 has rotated by one pitch. At this time, the carrier tape 14 is pushed out by one pitch from the upstream side, so the deflection between the sprocket 91 and the sprocket 74 is greater than before the transport started.

[0106] Figure 11(c) shows the state after the transport operation by the first carrier tape transport unit 73 has been performed and the sprocket 74 has rotated by one pitch. At this time, the carrier tape 14 is pulled by moving downstream by one pitch, so the deflection between the sprocket 91 and the sprocket 74 is less than when the pre-transport operation was performed.

[0107] Subsequently, if the pre-transport operation by the second carrier tape transport unit 90 in step S11 and the transport operation by the first carrier tape transport unit 73 in step S16 are repeated alternately, then Figures 11(b) and 11(c) will be repeated.

[0108] Returning to Figure 10, in step S18, the feeder 7 notifies the component mounting device control unit 100 that a transport error has been detected. The component mounting device control unit 100 then excludes the feeder 7 in which the transport error was detected from the collection targets (S19).

[0109] In step S20, the predictive maintenance unit 104 acquires data on the drive motor 75 of the first carrier tape transport unit 73. The data on the drive motor 75 includes, for example, the torque value of the drive motor 75, the rotational speed of the drive motor 75, and the deviation of the rotational amount of the drive motor 75. The predictive maintenance unit 104 also acquires time-series data of the drive motor 75.

[0110] Next, the predictive maintenance unit 104 extracts features from the data of the drive motor 75 and stores the extracted features (S21). For example, the predictive maintenance unit 104 extracts features from the data detected while the sprocket 74 completes one rotation and stores the extracted features.

[0111] Next, the predictive detection unit 104 determines a potential malfunction in carrier tape transport based on a pre-generated inference model and stored feature quantities (S22).

[0112] Next, if the malfunction detection unit 104 determines that there is a malfunction (Yes in S23), it notifies that there is a malfunction (S24). For example, the malfunction detection unit 104 may notify the screen display interface 102 that there is a malfunction, and the screen display interface 102 may notify the display unit 17 that there is a malfunction in the first carrier tape transport unit 73 of the feeder 7. The notification may also be made to terminals owned by the user that have been registered in advance.

[0113] Next, if the indicator determination unit 104 determines that there are no signs of malfunction (No in S23), it returns to step S11.

[0114] [Effects, etc.] The printed circuit board manufacturing system 1 according to this embodiment comprises a main body 71, a first carrier tape transport unit 73, a second carrier tape transport unit 90, and a feeder control unit 78. The main body 71 is provided with a tape transport path W that guides the carrier tape 14. The first carrier tape transport unit 73 transports the carrier tape 14 along the tape transport path W to the component removal position. The second carrier tape transport unit 90 is located upstream of the first carrier tape transport unit 73 in the tape transport path W and transports the carrier tape 14. The feeder control unit 78 controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90. After the second carrier tape transport unit 90 transports the carrier tape 14, the feeder control unit 78 transports the carrier tape 14 to the first carrier tape transport unit 73.

[0115] According to this, since the second carrier tape transport unit 90 located upstream performs transport, followed by the first carrier tape transport unit 73 located downstream, the first carrier tape transport unit 73 can perform transport with minimal influence from factors other than malfunctions of the first carrier tape transport unit 73, such as the influence of the parts reel C. In other words, the first carrier tape transport unit 73 can perform transport with reduced noise factors affecting transport. As a result, the torque value of the drive motor 75 can be obtained with less noise, and signs of feeder 7 malfunction can be accurately detected.

[0116] Furthermore, if there is a malfunction due to noise factors affecting transport by the first carrier tape transport unit 73, transport errors are likely to occur in the second carrier tape transport unit 90. Therefore, it is possible to detect malfunctions due to noise factors affecting transport by the first carrier tape transport unit 73 before operating the first carrier tape transport unit 73.

[0117] Furthermore, the feeder control unit 78 receives transport instructions at multiple different timings from the component mounting device control unit 100 of the component mounting device M3, which sequentially picks up multiple components P on the carrier tape 14 at component removal positions. Each time the feeder control unit 78 receives a transport instruction, it controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90 so that the carrier tape 14 moves by a predetermined pitch. In the above control, the feeder control unit 78 causes the second carrier tape transport unit 90 to transport the carrier tape 14 by a predetermined pitch between the time the carrier tape 14 moves by a predetermined pitch and the next transport instruction is received.

[0118] According to this, when the feeder control unit 78 receives the next transport instruction, it will execute transport by the first carrier tape transport unit 73, and therefore, after transport by the second carrier tape transport unit 90, it will execute transport by the first carrier tape transport unit 73.

[0119] Furthermore, the feeder control unit 78 controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90 so that the carrier tape 14 remains in a slack state.

[0120] According to this, since the carrier tape 14 is kept in a sagging state when transported by the first carrier tape transport unit 73, transport by the first carrier tape transport unit 73 can be performed while reducing noise factors that affect transport by the first carrier tape transport unit 73.

[0121] Furthermore, the mounted substrate manufacturing system 1 also includes an error detection unit 99 that detects transport errors in the second carrier tape transport unit 90. The feeder control unit 78 controls the operation of the first carrier tape transport unit 73 and the second carrier tape transport unit 90, and if the error detection unit 99 does not detect a transport error after transport by the second carrier tape transport unit 90, it starts transport by the first carrier tape transport unit 73.

[0122] Therefore, if no transport error is detected, transport by the first carrier tape transport unit 73 can be performed. In other words, transport by the first carrier tape transport unit 73 can be performed while reducing noise factors that affect transport by the first carrier tape transport unit 73.

[0123] Furthermore, when the error detection unit 99 detects a transport error in the second carrier tape transport unit 90, the feeder control unit 78 notifies the component mounting device control unit 100 that a transport error has been detected in the second carrier tape transport unit 90. Therefore, when the error detection unit 99 detects a transport error in the second carrier tape transport unit 90, the component mounting device M3 can be controlled, for example, to exclude the tape from being picked up.

[0124] Furthermore, when the component mounting device control unit 100 receives notification of a transport error, it excludes the carrier tape 14 being transported by the second carrier tape transport unit 90, where the transport error was detected, from being picked up. This eliminates the need to attempt to pick up the component P on the carrier tape 14 where the error occurred, thereby reducing operational losses.

[0125] Furthermore, the second carrier tape transport unit 90 includes a sprocket 91 for transporting the carrier tape 14 and a drive motor 92 for rotating the sprocket 91. The error detection unit 99 detects a transport error if the torque value of the drive motor 92 is outside the normal range. Therefore, a transport error by the second carrier tape transport unit 90 can be detected before transport by the first carrier tape transport unit 73.

[0126] Furthermore, the mounted substrate manufacturing system 1 is equipped with a predictive maintenance unit 104 that determines signs of malfunction in the transport of the carrier tape 14. The predictive maintenance unit 104 determines signs of malfunction in the transport of the carrier tape 14 by inputting data on the operation of the drive motor 75 of the first carrier tape transport unit 73 into an inference model that has been previously learned using data on the operation of the drive motor 75 of the first carrier tape transport unit 73. As a result, signs of malfunction in the transport of the carrier tape 14 can be determined based on a torque value with low noise and based on the torque value of the motor of the first carrier tape transport unit 73. Thus, signs of malfunction in the feeder 7 can be determined with high accuracy.

[0127] [Differentiation] (1) In the above embodiment, the second carrier tape transport unit 90 may have a ratchet mechanism that restricts the rotation direction of the sprocket 91 to the forward rotation direction. This prevents the carrier tape 14 from moving in the opposite direction to the feed direction by the second carrier tape transport unit 90. Therefore, even if the operation of the second carrier tape transport unit 90 is not synchronized with the operation of the first carrier tape transport unit 73, it is easy to transport the carrier tape 14 while maintaining a sagging state.

[0128] (2) Although not shown, the feeder 7 may further include a splicing tape detection unit that detects when a splicing tape, provided at the connection point between one carrier tape 14 and another carrier tape 14, is passing through the tape transport path W. The detection result from the splicing tape detection unit may be output to the component mounting device control unit 100. The predictive determination unit of the component mounting device control unit 100 may, based on the detection result, exclude the drive motor 75 data detected during the period when the splicing tape is detected from the acquired drive motor 75 data. When the connection point where the splicing tape is provided passes through the tape transport path W, the frictional force between the carrier tape 14 and the tape transport path W increases, making it easier for the torque value of the drive motor 75 to increase. Therefore, there is a risk of a false determination that the first carrier tape transport unit 73 is malfunctioning when it is not. In the modified example 2, based on the detection result, the drive motor 75 data detected during the period when the splicing tape is detected is excluded from the acquired drive motor 75 data, thus reducing false determinations.

[0129] (3) In the above embodiment, the second carrier tape transport unit 90 transports the carrier tape 14 by one pitch, and then the first carrier tape transport unit 73 transports the carrier tape 14 by one pitch. However, the embodiment is not limited to this. The second carrier tape transport unit 90 may transport the carrier tape 14 by two pitches, and then the first carrier tape transport unit 73 may transport it by one pitch. This operation may be repeated twice. In other words, the transport can be carried in any way as long as the cumulative amount transported by the second carrier tape transport unit 90 remains equal to or greater than the cumulative amount transported by the first carrier tape transport unit 73 after the pitch feed control has started.

[0130] Furthermore, although the first carrier tape transport unit 73 and the second carrier tape transport unit 90 are described as transporting the carrier tape 14 in a pitch feed manner, they do not necessarily have to transport it in a pitch feed manner, and may transport it continuously.

[0131] (4) In the above embodiment, the predictive maintenance unit 104 is provided in the component mounting device control unit 100, but it is not limited to this. The predictive maintenance unit 104 may be provided in the feeder 7 or in the information processing terminal 200.

[0132] In the above embodiment, each component may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the component mounting device M3, etc. in the above embodiment is a program that causes a computer to execute each step included in the flowchart shown in the figure.

[0133] The following cases are also included in this disclosure.

[0134] (1) Specifically, each of the above devices is a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or hard disk unit. Each device achieves its function by operating the microprocessor in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to the computer in order to achieve a predetermined function.

[0135] (2) Some or all of the components constituting each of the above devices may be made up of a single system LSI (Large Scale Integration). The system LSI is a multi-functional LSI manufactured by integrating multiple components onto a single chip, and specifically, it is a computer system that includes a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its function by operating the microprocessor in accordance with the computer program.

[0136] (3) Some or all of the components constituting each of the above devices may consist of a removable IC card or a standalone module. The IC card or module is a computer system consisting of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned multi-functional LSI. The microprocessor operates according to a computer program, thereby enabling the IC card or module to perform its function. The IC card or module may be tamper-resistant.

[0137] (4) The disclosure may also be the methods described above. Alternatively, it may be a computer program that implements these methods using a computer, or a digital signal consisting of the computer program.

[0138] Furthermore, this disclosure may also refer to the computer program or the digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray® Disc), semiconductor memory, etc. Alternatively, it may refer to the digital signal recorded on such a recording medium.

[0139] Furthermore, this disclosure may also describe transmitting the computer program or digital signal via telecommunications lines, wireless or wired communication lines, networks such as the Internet, data broadcasting, etc.

[0140] Furthermore, the present disclosure may also provide a computer system comprising a microprocessor and memory, wherein the memory stores the computer program, and the microprocessor operates in accordance with the computer program.

[0141] Furthermore, the program or digital signal may be implemented by another independent computer system by recording and transferring it on the recording medium, or by transferring the program or digital signal via the network or the like.

[0142] (5) The above embodiments and the above modifications may be combined. [Industrial applicability]

[0143] This disclosure can be used for component mounting equipment for mounting components onto a substrate, and for production systems including such component mounting equipment. [Explanation of symbols]

[0144] 2. Communication Network 4 bases 5. Substrate transport mechanism 6. Parts Supply Department 7 feeders 7a Component removal position 8 Y-axis beam 9 X-axis beam 10 Mounting Head 10a Adsorption Unit 10b Nozzle 11 stages 12 cameras 13 bogies 13a Feeder base 14 Carrier Tape 14a Pocket 14b Feed hole 14c Cover Tape 15 Cassette Holder 16 Opening and closing cover 17 Presentation section 18 Cameras 71 Main body 72 supply ports 73. First Carrier Tape Transport Section 74, 91 sprocket 75, 92 Drive motor 76 Tape Guide 77 Cover tape peeling mechanism 78 Feeder Control Unit 80, 93 Gear Unit 81, 94 drive gears 82, 95 transmission gears 83, 96 transmission gears 84, 97 Transmission gears 85, 98 Final gear 90 Second Carrier Tape Transport Section 99 Error detection unit 100 Component mounting device control unit 101 Component mounting operation processing unit 102 Screen Display I / F Processing Unit 103 Main memory 104 Precursor Determination Unit

Claims

1. The main body is provided with a tape transport path for guiding the carrier tape, A first carrier tape transport unit transports the carrier tape in the tape transport path to the parts removal position, A second carrier tape transport unit is located upstream of the first carrier tape transport unit in the tape transport path and transports the carrier tape, (i) A component mounting device that sequentially picks up a plurality of components on the carrier tape at the component removal position, and receives transport instructions at multiple different timings; and (ii) A control unit that controls the operation of the first carrier tape transport unit and the second carrier tape transport unit so that the carrier tape moves by a predetermined pitch each time a transport instruction is received, The control unit, after causing the carrier tape to be transported by the second carrier tape transport unit, then causes the carrier tape to be transported by the first carrier tape transport unit. In the control described above, the carrier tape is transported by the predetermined pitch to the second carrier tape transport unit between the time the carrier tape moves by the predetermined pitch and the next transport instruction is received. Implemented circuit board manufacturing system.

2. The control unit performs the control to maintain the carrier tape in a sagging state. A mounting substrate manufacturing system according to claim 1.

3. moreover, The second carrier tape transport unit is equipped with an error detection unit that detects transport errors, The control unit, in the control, starts transporting by the first carrier tape transport unit if the error detection unit does not detect a transport error after transport by the second carrier tape transport unit. A mounting substrate manufacturing system according to claim 1 or 2.

4. The control unit notifies the component mounting device that a transport error has been detected when the error detection unit detects the transport error. The mounting substrate manufacturing system according to claim 3.

5. When the component mounting apparatus receives notification that a transport error has been detected, it removes the carrier tape being transported by the second carrier tape transport unit in which the transport error was detected from the object to be picked up. The mounting substrate manufacturing system according to claim 4.

6. The second carrier tape transport unit includes a sprocket for transporting the carrier tape and a motor for rotating the sprocket. The error detection unit detects the transport error if the torque value of the motor is outside the normal range. The mounting substrate manufacturing system according to claim 3.

7. moreover, The system includes a predictive detection unit that determines signs of malfunction in the transport of the carrier tape, The predictive maintenance unit determines a potential malfunction in the carrier tape transport by inputting data related to the operation of the motor of the first carrier tape transport unit into an inference model that has been previously learned using data related to the operation of the motor. A mounting substrate manufacturing system according to claim 1 or 2.

8. The second carrier tape transport unit includes a sprocket for transporting the carrier tape, a motor for rotationally driving the sprocket, and a ratchet mechanism for restricting the rotation direction of the sprocket to the forward rotation direction. A mounting substrate manufacturing system according to claim 1 or 2.

9. The main body is provided with a tape transport path for guiding the carrier tape, A first carrier tape transport unit transports the carrier tape in the tape transport path to the parts removal position, A method for manufacturing a printed circuit board using a printed circuit board manufacturing system comprising a second carrier tape transport unit, which is located upstream of the first carrier tape transport unit in the tape transport path and transports the carrier tape, The component mounting device, which sequentially picks up multiple components on the carrier tape at the component removal position, receives transport instructions at multiple different timings. Each time a transport instruction is received, the carrier tape is transported by the second carrier tape transport unit, (i) transport is performed by the second carrier tape transport unit, and (ii) after the transport by the second carrier tape transport unit, the first carrier tape transport unit transports the tape. The transport of the carrier tape by the second carrier tape transport unit is performed between the time the carrier tape moves by the predetermined pitch and the time the next transport instruction is received. Method for manufacturing printed circuit boards.

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