Chip recovery device and chip recovery method

Abstract

To provide a chip collection device capable of preventing chips of a tape member inside a main duct from flowing back into a subduct, and a chip collection method.SOLUTION: The chip collection device includes: a subduct 32 that receives chips KZ of a carrier tape from a chip receiving opening 32K; a main duct 31 that communicates with the subduct 32 through a chip entering opening 41K; an air blower 51 that is placed in the subduct 32 for blowing air Air toward the chip entering opening 41K to move the chips KZ in the subduct 32 to the main duct 31; and a shutter 53 that is located in a closing position to close the chip entering opening 41K when the air blower 51 is not blowing out the air Air, and is located in an opening position to open the chip entering opening 41K being pushed by the air Air blowing out by the air blower 51 when the air blower 51 is blowing out the air Air. The shutter 53 swings in a vertical plane to open / close the chip entering opening 41K.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a chip collection device and a chip collection method for collecting chips of a tape member discharged from a tape feeder.

Background Art

[0002] Conventionally, in a component mounting device for mounting components on a substrate, a chip collection device that automatically collects chips of a tape member discharged from a tape feeder as a component supply unit is known (for example, Patent Document 1 below). In Patent Document 1, chips of a tape member cut by a tape cutter fall by their own weight and are received in a sub-duct (reception unit), and then are moved to a main duct (collection path) by air blown from an air blower installed in the sub-duct. Then, they are sent to the air outlet side of the main duct by air discharged from an air ejector provided on the most upstream side of the main duct.

[0003] In the above conventional chip collection device, between the main duct and the sub-duct, there is a shutter that is pushed open by air blown from an air blower in the sub-duct to open a chip entry opening, and is closed by air discharged from an air ejector to close the chip entry opening. Therefore, when the air ejector sends chips to the air outlet side of the main duct, the chips in the main duct are prevented from flowing back from the chip entry opening to the sub-duct side.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the above-described chip collection device, the shutter was configured to swing in a horizontal plane to open and close the chip entry opening. Therefore, if the chips from the tape material were clumped together, or if the chips had a three-dimensional shape, such as when embossed tape was cut, the chips could get stuck between the shutter, which was in the position to open the chip entry opening, and the bottom surface of the main duct. This could cause the shutter to lock, leaving the chip entry opening open. As a result, there was a problem in that the chips KZ in the main duct could flow back into the sub-duct, potentially leading to insufficient chip collection.

[0006] Therefore, the present invention aims to provide a chip collection device and chip collection method that can prevent chips from tape material in the main duct from flowing back into the sub-duct. [Means for solving the problem]

[0007] The present invention provides a chip collection device comprising: a sub-duct that receives chips of tape material discharged from a tape feeder of a component mounting device through a chip receiving opening; a main duct connected to the sub-duct through a chip entry opening; an air blower installed in the sub-duct that moves the chips in the sub-duct to the main duct by blowing air toward the chip entry opening; and a shutter that is in a closed position that closes the chip entry opening when the air blower is not blowing air, and is in an open position that opens the chip entry opening when the air blower is blowing air, and the shutter It shakes Move to open and close the chip entry opening. Furthermore, the shutter's upper edge is supported by the main duct, and it is movable between the closed position, where it hangs down under its own weight, and the open position, where it swings due to being pushed by the air blown out by the air blower. .

[0008] The present invention relates to a chip collection method using a chip collection device for collecting chips of tape material discharged from a tape feeder provided by a component mounting device, wherein the chip collection device comprises: a sub-duct that receives the chips discharged from the tape feeder through a chip receiving opening; a main duct connected to the sub-duct through a chip entry opening; an air blower installed in the sub-duct that moves the chips in the sub-duct to the main duct by blowing air toward the chip entry opening; and a shutter that is in a closed position that closes the chip entry opening when the air blower is not blowing air, and in an open position that opens the chip entry opening when the air blower is blowing air, wherein the shutter It shakes By moving, it moves between the closed position and the open position, opening and closing the chip entry opening. Furthermore, the shutter's upper edge is supported by the main duct, and it is movable between the closed position, where it hangs down under its own weight, and the open position, where it swings due to being pushed by the air blown out by the air blower. . [Effects of the Invention]

[0009] According to the present invention, it is possible to prevent the tape material chips in the main duct from flowing back into the sub-duct. [Brief explanation of the drawing]

[0010] [Figure 1] A perspective view showing a chip recovery device in one embodiment of the present invention, along with the work line of a parts mounting device. [Figure 2] Side view of a component mounting device in one embodiment of the present invention [Figure 3] Cross-sectional view of a part of a component mounting device and a part of a chip recovery device in one embodiment of the present invention. [Figure 4] Perspective view of a chip recovery device according to one embodiment of the present invention. [Figure 5] A schematic plan view of a chip recovery device in one embodiment of the present invention. [Figure 6] Partial perspective view of a chip recovery device in one embodiment of the present invention. [Figure 7] Partial plan view of a chip recovery device in one embodiment of the present invention. [Figure 8](a)(b)Operation explanatory diagram of the air blower included in the chip collection device in one embodiment of the present invention [Figure 9] (a)(b)(c)Diagram for explaining the assembly procedure of the main duct of the chip collection device in one embodiment of the present invention [Figure 10] (a)(b)(c)Diagram for explaining the assembly procedure of the main duct of the chip collection device in one embodiment of the present invention [Figure 11] (a)(b)(c)Diagram for explaining the assembly procedure of the main duct of the chip collection device in one embodiment of the present invention [Figure 12] (a)(b)Perspective view of the second duct piece connected to the first duct piece included in the main duct of the chip collection device in one embodiment of the present invention [Figure 13] (a)(b)Operation explanatory diagram of the air ejector and check valve included in the chip collection device in one embodiment of the present invention [Figure 14] Perspective view (a) and side view (b) of the housing included in the chip collection device in one embodiment of the present invention [Figure 15] (a)(b)(c)Operation explanatory diagram of the chip collection device in one embodiment of the present invention [Figure 16] (a)(b)(c)Operation explanatory diagram of the chip collection device in one embodiment of the present invention [Figure 17] Perspective view showing another example of the shutter included in the chip collection device in one embodiment of the present invention [Figure 18] Plan view of another example of the shutter included in the chip collection device in one embodiment of the present invention [Figure 19] (a)(b)(c)Operation explanatory diagram of the housing included in the chip collection device in one embodiment of the present invention [Figure 20] (a)(b)(c)Diagram for explaining the installation procedure of the chip collection device in one embodiment of the present invention [Figure 21] (a)(b)(c)Diagram for explaining the installation procedure of the chip collection device in one embodiment of the present invention [Figure 22] Schematic plan view of the chip collection device in a modification of one embodiment of the present invention [Figure 23] (a)(b)(c)Explanation diagram of another example of the operation of the chip collection device in one embodiment of the present invention [Figure 24] (a)(b)(c)Explanation diagram of another example of the operation of the chip collection device in one embodiment of the present invention

Embodiments for Carrying out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a work line 2 where a chip collection device 1 in one embodiment of the present invention is installed. The work line 2 has a configuration in which a plurality (here, three) of component mounting devices 3 for mounting components on a substrate KB are arranged in one direction, and the substrate KB is transferred between adjacent component mounting devices 3 and components are mounted on the substrate KB. In the present embodiment, the direction in which the substrate KB is transferred in the work line 2 (the left-right direction, the direction in which the component mounting devices 3 are arranged) is the X direction, the horizontal direction (front-back direction) orthogonal to the X direction is the Y direction, and the up-down direction is the Z direction.

[0012] In FIG. 2, the component mounting device 3 has a base 11 and a cover member 12 that covers the upper part of the base 11. An operation space 13 covered by the cover member 12 is formed above the base 11. On the upper surface of the base 11, a substrate transfer unit 14 extending in the X direction is installed in the operation space 13. The substrate transfer unit 14 is composed of a pair of conveyor mechanisms arranged in the Y direction. The substrate transfer unit 14 transfers the substrate KB in the X direction and positions the substrate KB at a predetermined operation position within the operation space 13.

[0013] In FIG. 2, feeder trolleys 15 are attached to the front and rear ends of the base 11 respectively. A plurality of tape feeders 16 are attached side by side in the X direction to each feeder trolley 15 (see also FIG. 1). Each tape feeder 16 takes in a carrier tape 18 as a tape member fed out from a tape reel 17 held by the feeder trolley 15 and conveys it in the Y direction (the direction toward the substrate transfer unit 14), and supplies the component BH stored in the carrier tape 18 to the component supply position 16K.

[0014] In Figure 2, two mounting heads 21 are provided above the base 11, movable by a head movement mechanism 22. Each mounting head 21 is equipped with a nozzle 21N extending downward. The head movement mechanism 22 consists of, for example, a Cartesian coordinate robot, which moves the two mounting heads 21 independently in a horizontal plane. Each mounting head 21 picks up the parts BH supplied by the tape feeder 16 to the part supply position 16K by attracting them to the lower end of the nozzle 21N (Figure 2).

[0015] In Figure 2, the component mounting device 3 is equipped with a control device 23. The control device 23 controls the operation of each component, including the substrate transport unit 14, tape feeder 16, mounting head 21, and head movement mechanism 22.

[0016] When the component mounting device 3 performs component mounting work, it first operates the substrate transport unit 14 to receive the substrate KB from the upstream device and positions it at the work position. Once the component mounting device 3 has positioned the substrate KB at the work position, it operates the tape feeder 16 to supply components BH to the component supply position 16K, while simultaneously operating the head movement mechanism 22 to repeatedly perform component transfer operations on the mounting head 21. In the component transfer operation, the mounting head 21 picks up the component BH supplied by the tape feeder 16 and then mounts the component BH onto the substrate KB.

[0017] Each component mounting device 3 repeatedly performs component transfer operations using the mounting head 21 to mount the component BH to be mounted on the substrate KB. Once the component BH is mounted, the substrate transport unit 14 is activated to transport the substrate KB downstream. As a result, each of the three component mounting devices 3 mounts the component BH to the substrate KB, and once the component mounting device 3 located furthest downstream has transported the substrate KB, the component mounting operation on that substrate KB by the work line 2 is complete.

[0018] Next, the chip collection device 1 will be described. First, the cutting of the carrier tape 18 will be described. As shown in Figure 2, the feeder trolley 15 provided by each component mounting device 3 has a tape cutter 24 and a chute 25. The tape cutter 24 is located below the tape feeder 16 and cuts the carrier tape 18 after the tape feeder 16 has finished supplying the components BH. The chute 25 is located below the tape cutter 24, as also shown in Figure 3 (enlarged view of area RY in Figure 2). The chute 25 guides the chips KZ of the carrier tape 18 that fall by their own weight after being cut by the tape cutter 24, and discharges them to the outside of the feeder trolley 15 through the discharge opening 25K at the lower end.

[0019] As described above, chips KZ of the carrier tape 18 are generated from each component mounting device 3 that makes up the work line 2, and the total amount of chips KZ of the carrier tape 18 generated from the entire work line 2 is enormous. The chip collection device 1 in this embodiment facilitates the disposal of the chips KZ by automatically collecting the large amount of chips KZ of the carrier tape 18 generated from the work line 2 without manual labor.

[0020] In Figures 1, 4, and 5, the chip collection device 1 comprises a main duct 31, a plurality of sub-ducts 32, and a storage section 33. The main duct 31 extends in the direction of the extension of the work line 2 (X direction) below the work line 2 (more specifically below each of the plurality of component mounting devices 3) and has openings on both the upstream side (one end) and the downstream side (the other end). Hereinafter, the air outlet in the main duct 31 will be referred to as the "air outlet 31D".

[0021] In Figures 4 and 5, the main duct 31 is made up of multiple duct pieces 41 connected in one direction (the direction in which the component mounting device 3 is arranged, which is the X direction). As shown in Figures 3 and 6, the duct piece 41 has a hollow shape with a rectangular cross-section and is equipped with an upper wall 41a, a lower wall 41b, and two side walls 41c facing each other in the Y direction.

[0022] In Figure 4, the main duct 31 is composed of two types of duct pieces 41: a main duct piece 41M and a sub-duct piece 41S, which is a duct piece for distance adjustment (adjustment duct piece). The main duct piece 41M has chip entry openings 41K formed in each of its two side walls 41c corresponding to the Y direction. Therefore, multiple chip entry openings 41K are provided in the direction in which the main duct 31 extends (X direction).

[0023] In Figures 1, 2, and 4, the multiple subducts 32 are each installed on the floor surface FL below the feeder trolley 15, and each subduct 32 is connected to the two opposing side walls 41c of the main duct 31, in the front and rear (Y direction), so as to cover the chip entry opening 41K (see also Figure 5). Hereinafter, the subduct 32 located in front of the main duct 31 will be referred to as the "first subduct 32A," and the subduct 32 located behind the main duct 31 will be referred to as the "second subduct 32B" (Figure 5).

[0024] In this embodiment, two adjacent first subducts 32A in the X direction correspond to one front feeder trolley 15 of one component mounting device 3, and two adjacent second subducts 32B in the X direction correspond to one rear feeder trolley 15 of one component mounting device 3 (Figure 5). Each subduct 32 has a box shape that opens towards the main duct 31 (Figures 6, 7, and 8(a),(b)).

[0025] In Figures 3, 6, and 8(a),(b), the upper wall of each subduct 32 is provided with a chip receiving opening 32K that opens upward (towards the tape feeder 16). The subduct 32 receives chips KZ from the carrier tape 18 (i.e., chips KZ discharged from the tape feeder 16) that fall by their own weight through the corresponding chute 25 located directly above it, via the chip receiving opening 32K.

[0026] In Figures 1 and 4, the end of the main duct 31 on the air outlet 31D side extends diagonally upward toward the downstream side, and the end of this diagonally upward extension is a horizontal section. The air outlet 31D is provided opening on the lower surface of this horizontal section.

[0027] Two adjacent main duct pieces 41M constituting the above-mentioned main duct unit are connected using an L-shaped connector 42 with their respective ends abutted together (Figure 9(a) → Figure 9(b)). As shown in Figures 9(b) and (c), the L-shaped connector 42 has a horizontal portion 42a and a vertical portion 42b extending downward from one end of the horizontal portion 42a, and has an overall L-shape. The horizontal portion 42a is the part that contacts the upper surface (upper surface of the upper wall 41a) of each of the two adjacent main duct pieces 41M, and the vertical portion 42b is the part that contacts the side surface (outer surface of one side wall 41c) of each of the two adjacent main duct pieces 41M.

[0028] In Figure 9(b), the horizontal portion 42a of the L-shaped connector 42 is provided with two notched grooves 42K extending toward the end on the side where the vertical portion 42b is formed, at the end opposite to the side where the vertical portion 42b is formed. In addition, the vertical portion 42b of the L-shaped connector 42 is provided with screw insertion holes 42H arranged in the X direction, penetrating the vertical portion 42b in the thickness direction.

[0029] In Figures 9(a), (b), and (c), bolts are provided as projections 43 extending upward from the upper surface (upper surface of the upper wall 41a) of each main duct piece 41M. In addition, multiple screw holes 41H are provided on the upper and lower sides of the side wall 41c of each main duct piece 41M (Figure 9(a)). When two main duct pieces 41M are butted together at their ends, the distance in the X direction between two adjacent projections 43 matches the distance between two notched grooves 42K provided in the L-shaped connector 42, and the distance in the X direction between two adjacent screw holes 41H matches the distance between two screw insertion holes 42H provided in the L-shaped connector 42.

[0030] When connecting two main duct pieces 41M with their ends butted together using an L-shaped connector 42, the L-shaped connector 42 is brought closer to the two main duct pieces 41M from a position where the two notched grooves 42K of the L-shaped connector 42 are facing the two protrusions 43 of the two main duct pieces 41M in the horizontal direction (Y direction) (Figure 9(b) → Figure 9(c)). Then, the two notched grooves 42K formed on the L-shaped connector 42 are engaged with the two protrusions 43 of the two main duct pieces 41M from the side direction (Y direction), and the vertical part 42b of the L-shaped connector 42 is brought into contact with the side surface (outer surface of the side wall 41c) of the two main duct pieces 41M.

[0031] Once the vertical section 42b abuts against the sides of the two main duct pieces 41M, two screws 44 are inserted through two screw insertion holes 42H provided in the vertical section 42b and screwed into the screw holes 41H provided in the side walls 41c of the two main duct pieces 41M. This fixes the L-shaped connector 42 to the two main duct pieces 41M, and the two main duct pieces 41M are connected by the L-shaped connector 42 (Figure 9(c)).

[0032] As mentioned above, two main duct pieces 41M connected in the X direction correspond to one component mounting device 3, and the sub-duct piece 41S is located between the two connected main duct pieces 41M (referred to as "main duct units" for convenience).

[0033] In Figures 10(a) and 10(b), the sub-duct piece 41S has an extension 41E at one end. The other end of the sub-duct piece 41S is the same as the end of the main duct piece 41M, and can be connected to the main duct piece 41M by the aforementioned L-shaped connector 42 and screw 44 (Figure 10(b) → Figure 10(c)).

[0034] In this embodiment, the L-shaped connector 42 connects two adjacent duct pieces 41 (either two main duct pieces 41M or one main duct piece 41M and one sub-duct piece 41S) with their ends abutting against each other. More specifically, the L-shaped connector 42 connects the two duct pieces 41 while in contact with the top and side surfaces of each of the two duct pieces 41.

[0035] In this embodiment, the L-shaped connector 42 has two notched grooves 42K formed in the horizontal portion 42a that contacts the upper surfaces of the two duct pieces 41, which engage laterally with projections 43 that protrude upward from the upper surfaces of the two duct pieces 41. The vertical portion 42b of the L-shaped connector 42 is fastened to the sides of the two duct pieces 41 by screws 44 which act as fasteners.

[0036] A sub-duct piece 41S, with one end connected to a main duct piece 41M, is attached by spigot fitting its other end extension 41E to another main duct piece 41M (Figure 11(a) → Figure 11(b)). Because the sub-duct piece 41S is spigot-fitted to the main duct piece 41M, the sub-duct piece 41S is slidable in the X direction relative to the main duct piece 41M. Therefore, the distance between the two main duct pieces 41M located at both ends of the sub-duct piece 41S can be changed to adjust the distance.

[0037] The spigot-fitted sub-duct piece 41S and main duct piece 41M are connected using a flat plate connector 45 as shown in Figures 11(b) and (c). The flat plate connector 45 is fastened to the sides of the two adjacent duct pieces 41 (main duct piece 41M and sub-duct piece 41S) by screws 44, which act as fasteners.

[0038] As shown in Figure 11(b), the flat plate connector 45 has two screw insertion holes 45H arranged vertically and two elongated holes 45N arranged vertically and extending in the X direction. By screwing the screws 44 inserted from the two screw insertion holes 45H and the screws 44 inserted from the two elongated holes 45N into the screw holes 41H provided on the side surface of the main duct piece 41M, the sub-duct piece 41S and the main duct piece 41M can be fixed together, thereby connecting the sub-duct piece 41S and the main duct piece 41M (Figure 11(c)).

[0039] In this embodiment, the connectors (L-shaped connector 42 and flat plate connector 45) that connect two adjacent duct pieces 41 are configured to connect the two duct pieces 41 while being in contact with the upper or side surfaces of each of the two adjacent duct pieces 41.

[0040] In Figures 3, 4, 5, and 6, an air blower 51 is provided inside each subduct 32. The air blower 51 consists of, for example, a pipe-shaped member extending in the X direction and is equipped with a plurality of air outlets 51N arranged in the X direction.

[0041] In Figures 6 and 8(a) and 8(b), each air outlet 51N is opened facing the chip entry opening 41K of the main duct 31. Hereinafter, the air blower 51 installed in the first sub-duct 32A on the front side of the main duct 31 will be referred to as the "first air blower 51A," and the air blower 51 installed in the second sub-duct 32B on the rear side of the main duct 31 will be referred to as the "second air blower 51B" (Figure 5).

[0042] In Figure 4, each of the multiple first air blowers 51A located in front of the main duct 31 and arranged in the X direction is connected to a first air supply passage 52A that extends in the X direction in front of the main duct 31. Similarly, each of the multiple second air blowers 51B located in rear of the main duct 31 and arranged in the X direction is connected to a second air supply passage 52B that extends in the X direction behind the main duct 31.

[0043] In Figures 3, 5, 6, and 8(a),(b), a shutter 53 is provided on the side wall 41c of the main duct piece 41M that constitutes the main duct 31, for opening and closing the chip entry opening 41K. The shutter 53 is made up of a rectangular flat plate-shaped member, and its upper edge is supported by the main duct 31. Specifically, the upper edge of the shutter 53 is attached to the ceiling surface (lower surface of the upper wall 41a) of the main duct 31 by a hinge (shutter hinge 54) whose axis is oriented in the X direction (left-right direction) (see also Figure 7). As a result, the shutter 53 is able to swing freely in the vertical plane (YZ plane) with the shutter hinge 54 as the pivot point.

[0044] Both ends of each shutter 53 in the X direction are bent toward the side wall 41c of the main duct piece 41M (i.e., the main duct 31). As a result, both ends of the shutter 53 become air receiving sections 53T that receive air discharged from the air discharger 71, which will be described later (Figures 6, 7, and 8(a),(b).

[0045] The shutters 53 are provided in accordance with the chip entry openings 41K formed in each of the two side walls 41c of the main duct 31 that are opposite each other in the Y direction. As a result, within the main duct 31, there are two shutters 53 located at the front and two shutters 53 located at the rear, both facing each other in the Y direction. Hereinafter, the shutter 53 located at the front of the main duct 31 and corresponding to the first sub-duct 32A will be referred to as the "first shutter 53A," and the shutter 53 located at the rear of the main duct 31 and corresponding to the second sub-duct 32B will be referred to as the "second shutter 53B" (Figure 5).

[0046] As described above, the chip recovery device 1 in this embodiment has a subduct 32 which has a first subduct 32A and a second subduct 32B positioned opposite each other on either side of the main duct 31, and an air blower 51 which has a first air blower 51A that moves the chips KZ received in the first subduct 32A into the main duct 31 and a second air blower 51B that moves the chips KZ received in the second subduct 32B into the main duct 31. Furthermore, the shutter 53 has a first shutter 53A that opens and closes the chip entry opening 41K corresponding to the first subduct 32A and a second shutter 53B that opens and closes the chip entry opening 41K corresponding to the second subduct 32B.

[0047] Each shutter 53 is pivotable around a shutter hinge 54 and moves between a closed position (Figures 6, 7, and 8(a)) where it hangs down under its own weight and closes the chip entry opening 41K, and an open position (Figure 8(b)) where it is pushed towards the main duct 31 by air blown from the air blower 51 and opens the chip entry opening 41K. When the shutter 53 is in the closed position, both ends of the shutter 53 (ends of the air receiving portion 53T) are in contact with the inner surface of the main duct 31 (Figures 6 and 7).

[0048] In Figure 4, the first air supply passage 52A located in front of the main duct 31 and the second air blower 51B located behind the main duct 31 are both connected to the control valve 61 via the air supply passage 52. The control valve 61 is connected to an air source (not shown).

[0049] The operation of the control valve 61 is controlled by the control device 62 (Figure 4), which supplies air generated by the air source to the first air supply passage 52A or the second air supply passage 52B. When air is supplied to the first air supply passage 52A by the control valve 61, air is blown out from each of the multiple first air blowers 51A, and when air is supplied to the second air supply passage 52B by the control valve 61, air is blown out from each of the multiple second air blowers 51B.

[0050] When no air is being blown from the air blower 51, the shutter 53 is in a hanging position due to its own weight and is in the closed position (Figure 8(a)). When air is blown from the air blower 51 from this state, the shutter 53 is pushed by the air and moves to the open position (Figure 8(a) → Figure 8(b)), and the chips KZ in the sub-duct 32 move into the main duct 31 through the chip entry opening 41K (Figure 8(b)). When the air blower 51 stops blowing air, the shutter 53 returns to the hanging position due to its own weight and returns to the closed position (Figure 8(b) → Figure 8(a)).

[0051] In this embodiment, the shutter 53 is provided to swing freely in a vertical plane (in this case, in the YZ plane), and is in a closed position that closes the chip entry opening 41K when the air blower 51 is not blowing air, and is in an open position that opens the chip entry opening 41K when the air blower 51 is blowing air, pushed by the air blown by the air blower 51.

[0052] In Figures 4 and 5, multiple air dischargers 71 are provided within the main duct 31. These multiple air dischargers 71 are arranged in series in the direction in which the main duct 31 extends. In this embodiment, the air dischargers 71 are provided within the sub-duct piece 41S (i.e., between the two main duct units) (Figures 12(a), (b)).

[0053] In this embodiment, the air discharger 71 is provided at a position that separates each main duct unit, that is, two (or more) chip entry openings 41K at a time (Figure 5).

[0054] In Figures 12(a) and (b), the air discharger 71 consists of, for example, a pipe-shaped member extending in the Y direction and is equipped with a plurality of air outlets 71N arranged in the Y direction. The air discharger 71 is located near the ceiling within the sub-duct piece 41S, and its air outlets 71N are directed diagonally downward toward the air outlet 31D (see also Figures 13(a) and (b)).

[0055] In Figure 4, multiple air dischargers 71 are connected to an air supply pipe 71T (Figure 4) extending in the X direction, and the air supply pipe 71T is connected to a control valve 61. When the control device 62 controls the control valve 61 and supplies air to each air discharger 71 through the air supply pipe 71T, air is discharged from that air discharger 71.

[0056] The control device 62 controls multiple air dischargers 71 so that air is discharged sequentially starting from the air discharger 71 located on the upstream side. As a result, air flows sequentially through the main duct 31 from the upstream side to the downstream side (towards the air outlet 31D), and the chips KZ that have been moved from the sub-duct 32 into the main duct 31 are sent downstream (towards the air outlet 31D) in a relay manner (sequentially).

[0057] As described above, in the chip recovery device 1 of this embodiment, a plurality of air dischargers 71 that discharge air into the main duct 31 are arranged in series in the direction in which the main duct 31 extends. These air dischargers 71 sequentially discharge air, thereby sequentially sending the chips KZ that have entered the main duct 31 from the sub-duct 32 to the air outlet 31D. For this reason, the air discharge force required for each air discharger 71 only needs to be large enough to send the chips KZ to the nearest downstream air discharger 71, and there is no need for the discharge force required to send the chips KZ all the way from the upstream end to the downstream end (air outlet 31D) of the main duct 31 in one go, as in the conventional method, thus reducing operating costs.

[0058] In Figures 12(a), (b) and 13(a), (b), a number of check valves 72 are provided inside the main duct 31. As will be described later, the check valves 72 have the function of preventing the movement of chips KZ in the direction opposite to the direction of air discharge by the air discharger 71 inside the main duct 31 (from downstream to upstream).

[0059] Each check valve 72 is provided at the downstream end of each sub-duct piece 41S (Figures 12(a), (b) and 13(a), (b)). As described above, the sub-duct pieces 41S are provided between two main duct units aligned in the X direction, and the check valves 72 are located between two adjacent component mounting devices 3. Therefore, in this embodiment, the check valves 72 are provided at positions that separate each main duct unit, i.e., two (or more) chip entry openings 41K (Figure 5).

[0060] In Figures 10(a) and 12(a) and (b), the check valve 72 is attached to the ceiling surface (lower surface of the upper wall 41a) of the downstream end of the sub-duct piece 41S via a hinge (valve hinge 72H). As a result, the check valve 72 is pivotable in the vertical plane (XZ plane) and can move between a closed position where it hangs down due to its own weight and an open position where it pivots in a direction that moves its lower end downstream (towards the air outlet 31D).

[0061] Even if one attempts to swing the check valve 72 from its closed position in a direction that moves its lower end upstream (opposite side of the air outlet 31D), it cannot move because it abuts against the stopper 41P (Figure 12(b)) provided on the inner wall of the sub-duct piece 41S (it maintains its closed position). Thus, the check valve 72 is configured to swing only in a direction that moves its lower end downstream.

[0062] The check valve 72 is located downstream of the air discharger 71 on the sub-duct piece 41S to which the check valve 72 is attached. When air is discharged from the nearest upstream air discharger 71, the check valve 72 is pushed downstream by the air, causing it to swing from the closed position to the open position, thereby opening that position in the main duct 31 (the position where the check valve 72 is installed) (Figure 13(a) → Figure 13(b)). The chips KZ located inside the sub-duct piece 41S are then moved downstream by the air discharged by the air discharger 71, passing through the check valve 72 (Figure 13(b)).

[0063] In contrast, the check valve 72 maintains its closed position when the air discharger 71 located immediately upstream is not discharging air, and air blown out by the air blower 51 in the sub-duct 32 located immediately downstream flows upstream through the chip entry opening 41K corresponding to the sub-duct 32. Therefore, the chips KZ that have moved from the sub-duct 32 to the main duct 31 due to the air blower 51 located downstream will not move upstream through the check valve 72.

[0064] In this embodiment, when the check valve 72 is in the open position, it allows the chips KZ in the main duct 31 to pass downstream due to the air discharged by the air discharger 71, and prevents the movement of the chips KZ in the main duct 31 in a direction opposite to the direction of air discharge by the air discharger 71.

[0065] In Figures 14(a) and (b), the storage section 33 has a belt conveyor 91. The belt conveyor 91 is composed of a pair of frames 92 arranged opposite each other in the X direction, a plurality of pulleys (drive pulley 93K and a plurality of driven pulleys 93J) rotatably supported by the pair of frames 92, and a conveyor belt 94 stretched across these pulleys. Partition members 95 extending in the width direction of the conveyor belt 94 are formed on the surface of the conveyor belt 94 at regular intervals.

[0066] In Figures 14(a) and (b), a drive motor 96 is attached to one frame 92 of the belt conveyor 91. When the drive motor 96 rotates the drive pulley 93K via the drive belt 97, the conveyor belt 94 moves. A pair of belt guides 98 are provided on the frame 92, and the conveyor belt 94 travels along a predetermined path as both ends are guided by this pair of belt guides 98. The operation of the drive motor 96 is controlled by a control device 62.

[0067] As shown in Figure 14(b), the conveying area of ​​the belt conveyor 91 consists of a discharge area R1 that extends almost horizontally in the front-rear direction, an upward-sloping area R2 that is connected to the discharge area R1 and extends diagonally upward, and a disposal area R3 that is connected to the upward-sloping area R2 and extends almost horizontally along the Y direction. When the drive pulley 93K is rotated by the drive motor 96, the conveying belt 94 moves through these three areas in this order (discharge area R1 → upward-sloping area R2 → disposal area R3).

[0068] In Figure 4, the belt conveyor 91 is installed such that the discharge area R1 of the conveyor belt 94 is located directly below the air outlet 31D. As shown in Figures 4 and 14(a) and (b), a chip passage 99 is provided below the disposal area R3 of the conveyor belt 94, and a storage box 100 is installed below the chip passage 99. The storage box 100 is made up of a box-shaped member that opens upwards.

[0069] Next, the chip collection operation of the chip collection device 1 will be described. As mentioned above, the chips KZ of the carrier tape 18 discharged by the feeder trolley 15 of each component mounting device 3 are discharged downward through the chute 25. The chips KZ discharged downward through the chute 25 are received into the subduct 32 through the chip receiving opening 32K formed in the subduct 32 (Figures 3 and 8(a)).

[0070] While the parts mounting device 3, which constitutes the work line 2, is performing parts mounting work, the chip recovery device 1 performs a chip recovery operation KZ at regular intervals. In the recovery operation, first, the control device 62 activates the control valve 61, causing air to be blown out from all the first air blowers 51A for a certain period of time (several seconds) (Figure 8(b)). As a result, all the first shutters 53A swing from the closed position to the open position, and the chips KZ in the first sub-duct 32A move into the main duct 31 through the corresponding front chip entry opening 41K (Figure 15(a)). When the first air blowers 51A have finished blowing out the air, the first shutters 53A return to the closed position by their own weight.

[0071] When the first shutter 53A is in the closed position, the control device 62 then blows air from all the second air blowers 51B for a certain period of time (Figure 15(b)). As a result, all the second shutters 53B swing from the closed position to the open position, and the chips KZ in the second sub-duct 32B move into the main duct 31 through the corresponding rear chip entry opening 41K (Figure 15(b)). When the second air blowers 51B finish blowing air, the second shutters 53B return to the closed position by their own weight.

[0072] Here, the shutters 53 (first shutter 53A and second shutter 53B) that open and close the chip entry opening 41K have their upper edges attached to the main duct 31 and are pivotable in the vertical plane (YZ plane). When pushed to the open position by the air blown from the air blower 51, their lower edges move away from the bottom surface inside the main duct 31 (the upper surface of the lower wall 41b of the duct piece 41) (upwards). As a result, the shutter 53 that has moved to the open position will not get caught in the chips KZ between its lower edge and the bottom surface inside the main duct 31, thus preventing the shutter 53 from becoming unable to open or close due to being caught in the chips KZ.

[0073] When the second shutter 53B is in the closed position, the control device 62 then discharges air from each of the multiple air dischargers 71 through the air supply pipe 71T. At this time, the multiple air dischargers 71 installed in series in the main duct 31 discharge air sequentially for a certain amount of time toward the downstream side (air outlet 31D side) (Figure 15(c) → Figure 16(a) → Figure 16(b) → Figure 16(c)). As a result, an airflow toward the air outlet 31D is formed in the main duct 31, and the chips KZ that have moved from each sub-duct 32 into the main duct 31 are sent downstream (to the air outlet 31D side) in a relay manner by this airflow (pressure) (Figure 16(c)).

[0074] While each component mounting device 3 constituting the work line 2 is performing component mounting work, the control device 62 repeatedly performs the above operation (Figure 15(a) → Figure 15(b) → ... Figure 16(c)). As a result, the chips KZ that fall from the tape feeder 16 of each component mounting device 3 into the subduct 32 are moved to the main duct 31 at regular intervals, then moved to the downstream side of the main duct 31, and discharged to the outside of the main duct 31 from the air outlet 31D.

[0075] In the chip collection device 1 of this embodiment, each shutter 53 hangs down by its own weight and is in the closed position when the corresponding air blower 51 is not blowing air (Figures 6, 7, and 8(a)). Therefore, when one air discharger 71 is discharging air, all shutters 53 located downstream of that air discharger 71 are in the closed position. However, when the air blown from the air blower 51 hits the air receiving portions 53T formed at both ends of the shutter 53, a biasing force acts on the shutter 53 toward the closed position (arrow P shown in Figure 7), and the shutter 53 is reliably positioned in the closed position. As a result, while air is being discharged from the air discharger 71, each chip entry opening 41K can be reliably closed by the shutter 53, preventing chips KZ in the main duct 31 from flowing back into the sub-duct 32.

[0076] In this example, the bent portions at both ends of the shutter 53 served as air receiving portions 53T. However, as shown in other examples in Figures 17 and 18, a mountain-shaped overhanging member 53H having a pair of slanted portions that intersect diagonally in the X direction may be provided on the surface of the flat shutter 53 (the surface on the main duct 31 side), and the slanted portions of this overhanging member 53H may function as air receiving portions 53T. Even with such a configuration, when the air blown from the air blower 51 hits the air receiving portions 53T, a biasing force acts on the shutter 53 toward the closed position (arrow P shown in Figure 18). As a result, while air is being discharged from the air discharger 71, each chip entry opening 41K is reliably closed by the shutter 53, and the same effect can be obtained.

[0077] In this embodiment, as described above, the first shutter 53A and the second shutter 53B, which face each other across the main duct 31, are positioned in the open position at different times. That is, the time when the first air blower 51A is blowing air and the time when the second air blower 51B is blowing air do not overlap. Therefore, interference between the two opposing shutters 53 (first shutter 53A and second shutter 53B) due to being in the open position at the same time is prevented, thus preventing damage to the shutters 53. Furthermore, it is possible to prevent the chips KZ from being returned into the sub-duct 32 by the air blown by the two opposing air blowers 51 (first air blower 51A and second air blower 51B).

[0078] Multiple air dischargers 71 move the chips KZ in a relay manner through the main duct 31 until they reach the air outlet 31D, at which point the chips KZ fall downward from the air outlet 31D. As a result, the chips KZ are discharged into the discharge area R1 on the conveyor belt 94 of the storage section 33 located below the air outlet 31D (Figure 19(a)).

[0079] When the chips KZ in the main duct 31 are discharged onto the conveyor belt 94 of the storage unit 33, the control device 62 operates the drive motor 96 of the storage unit 33 to move the conveyor belt 94. As a result, the chips KZ discharged into the discharge area R1 of the conveyor belt 94 are transported upwards in the upward area R2 (arrow H1 shown in Figure 19(b)) and carried to the disposal area R3 (arrow H2 shown in Figure 19(c)). As mentioned above, since partition members 95 extending in the width direction of the conveyor belt 94 are provided on the surface of the conveyor belt 94, the chips KZ are reliably transported to the disposal area R3 without detaching (falling) from the conveyor belt 94, even in the upward area R2.

[0080] The chips KZ transported to the disposal area R3 are then dumped downwards from the edge of the disposal area R3. The chips KZ dumped from the edge of the disposal area R3 fall through the chip passage 99 located directly below and are collected in the collection box 100. Thus, the chips KZ collected through the two main ducts 31 at the front and rear are ultimately collected in one collection box 100. Once the chips KZ are collected in the collection box 100, the worker removes the collection box 100 from the collection unit 33, disposes of the chips KZ in the designated location, and then returns the collection box 100 to its original position. This completes the series of chip collection operations.

[0081] Next, the procedure for installing the chip collection device 1 in this embodiment (installation method) will be described. When installing the chip collection device 1 below a work line 2 in which parts mounting devices 3 are arranged in one direction, first, multiple duct pieces 41 are inserted below each of the parts mounting devices 3 (work line 2) (insertion process; Figure 20(a) → Figure 20(b)). After inserting the multiple duct pieces 41 below the parts mounting devices 3, adjacent duct pieces 41 are connected to each other using connectors (L-shaped connector 42 and flat plate connector 45) (connection process).

[0082] In the connection process, first, two adjacent main duct pieces 41M are connected using an L-shaped connector 42 (Figure 20(c), Figure 10(b) → Figure 10(c)). Then, by changing the length of the fitted portion between the spigot-fitted main duct piece 41M and sub-duct piece 41S, the distance between the two main duct pieces 41M (the distance between the two main duct units) located on either side of the sub-duct piece 41S is adjusted (arrow U shown in Figure 21(a)). Finally, the spigot-fitted sub-duct piece 41S and main duct piece 41M are connected using a flat plate connector 45 (Figure 21(b), Figure 11(b) → Figure 11(c)).

[0083] In this embodiment, the installation process (installation method) of the chip collection device 1 involves adjusting the distance between two duct pieces 41 (main duct pieces 41M) that are positioned with a distance adjustment duct piece 41 (i.e., a sub-duct piece 41S) in between during the connection process, and then connecting the sub-duct piece 41S to the main duct piece 41M.

[0084] After connecting adjacent main duct pieces 41M in the above connection process, sub-ducts 32 are attached to each main duct piece 41M (sub-duct attachment process; Figure 21(c)), and a housing section 33 is installed on the air outlet 31D side of the main duct 31 (housing section installation process). This completes the installation of the chip collection device 1.

[0085] In this embodiment, when installing a main duct 31, which is made up of multiple duct pieces 41 connected in series in the direction in which the work line 2 extends (X direction), below the work line 2, after inserting each of the multiple duct pieces 41 below the component mounting device 3 (insertion step), adjacent duct pieces 41 that have been inserted below the component mounting device 3 are connected to each other using connectors (L-shaped connector 42 and flat plate connector 45) (connection step).

[0086] Therefore, as in the past, when installing the main duct 31 below the work line 2, it is not necessary to perform the large-scale operation of pre-connecting multiple duct pieces 41 corresponding to all or part of the main duct 31 and pushing them in from the upstream or downstream end of the work line 2 in the direction in which the work line 2 extends (X direction). As a result, a large workspace is not required for the installation of the main duct 31, the work can be performed by a small number of people, and the work time required for installation can be greatly reduced. In addition, since the duct piece 41 includes a distance-adjusting duct piece 41 (sub-duct piece 41S) for adjusting the distance between the other two duct pieces 41 located at both ends, the distance between adjacent duct pieces 41 (main duct piece 41M) can be easily adjusted during the connection process.

[0087] In the above-described embodiment, there was only one main duct 31. However, as shown in Figure 22, if the main duct 31 consists of two main ducts, a first main duct 31A and a second main duct 31B, which extend parallel to each other, then in the insertion step of inserting multiple duct pieces 41 below the component mounting device 3, the multiple duct pieces 41 constituting the first main duct 31A and the multiple duct pieces 41 constituting the second main duct 31B are inserted below the component mounting device 3 from both sides facing each other (facing each other in the Y direction) across the work line 2.

[0088] As described above, in the chip collection device 1 of this embodiment, the shutters 53 (first shutter 53A and second shutter 53B) that open and close the chip entry opening 41K are pivotable in the vertical plane (YZ plane), and when pushed to the open position by the air blown out from the air blower 51, their lower edges are moved away from the bottom surface inside the main duct 31 (upper surface of the lower wall 41b of the duct piece 41) (upwards). Therefore, the shutter 53 that has moved to the open position will not get caught in the chips KZ between its lower edge and the bottom surface inside the main duct 31, thus preventing the shutter 53 from becoming unable to open or close due to being caught in the chips KZ.

[0089] While embodiments of the present invention have been described above, the present invention is not limited to the above-described forms and can be modified in various ways. For example, in the above-described embodiment, the storage section 33 is configured to transport the chips KZ discharged from the outlet (air outlet 31D) of the main duct 31 by a belt conveyor 91 and discharge them into the storage box 100. However, the belt conveyor 91 may not be used, and the storage box 100 may be installed below the air outlet 31D.

[0090] Furthermore, in the above-described embodiment, the chip recovery operation of the chip recovery device 1 involved blowing air from all first air blowers 51A for a certain period of time (Figure 15(a)), then blowing air from all second air blowers 51B for a certain period of time (Figure 15(b)), and then having multiple air dischargers 71 discharge air sequentially from upstream to downstream for a certain period of time each (Figure 15(c) → Figure 16(a) → Figure 16(b) → Figure 16(c)). However, this is just one example, and the chip recovery operation may be carried out by other procedures. For example, instead of the procedure described above, "all first air blowers 51A blow air simultaneously → all second air blowers 51B blow air simultaneously → multiple air dischargers 71 blow air sequentially from upstream to downstream," a procedure consisting of "first air blower 51A blows air → the opposing second air blower 51B blows air → the air discharger 71 immediately upstream of these first air blowers 51A and second air blowers 51B blows air" could be performed sequentially from upstream to downstream (Figure 23(a) → Figure 23(b) → Figure 23(c) → Figure 24(a) → Figure 24(b) → Figure 24(c) → ...). [Industrial applicability]

[0091] The present invention provides a chip collection device and chip collection method that can prevent chips from tape material in the main duct from flowing back into the sub-duct. [Explanation of symbols]

[0092] 1. Chip recovery device 2 Workline 3. Component mounting device 16 Tape Feeders 18. Carrier tape (tape material) 31 Main duct 31A First Main Duct 31B Second Main Duct 31D Air Outlet 32 Subduct 32A First Subduct 32B Second Subduct 32K Chip receiving opening 41K Chip entry opening 51 Air blower 51A First Air Blower 51B Second Air Blower 52A First air supply line 52B Second air supply channel 53 Shutter 53A First shutter 53B Second shutter 53T Air receiving section 71 Air Discharger 72 Check valve Air KZ chips BH parts KB board

Claims

1. A sub-duct that receives tape material chips discharged from the tape feeder of the component mounting device through a chip receiving opening, A main duct connected to the subduct through a chip entry opening, An air blower installed in the sub-duct, which blows air toward the chip entry opening to move the chips in the sub-duct to the main duct, The system includes a shutter that is in a closed position that closes the chip entry opening when the air blower is not blowing air, and in an open position that opens the chip entry opening when the air blower is blowing air, pushed by the air blown by the air blower. The shutter swings to open and close the chip entry opening, A chip collection device wherein the shutter's upper edge is supported by the main duct and is movable between a closed position where it hangs down by its own weight and an open position where it is pushed and oscillated by the air blown out by the air blower.

2. The chip recovery device according to claim 1, further comprising an air discharger that discharges air into the main duct and sends the chips that have been moved from the sub-duct into the main duct through the chip entry opening to the air outlet side of the main duct.

3. The chip recovery device according to claim 2, wherein the air blower blows air when the air discharger is not discharging air into the main duct to move the chips in the sub-duct into the main duct, and the air discharger discharges air when the air blower is not discharging air to send the chips in the main duct to the air outlet side.

4. The chip collection device according to claim 3, wherein the shutter has an air receiving portion that receives air discharged from the air discharger, and the shutter is biased toward the closed position when the air discharged from the air discharger strikes the air receiving portion.

5. The chip recovery device according to claim 2, further comprising a check valve that prevents the movement of the chips in a direction reversed to the direction of air discharge by the air discharger within the main duct.

6. The chip collection device according to claim 5, wherein the check valve is swingable and movable between a closed position and an open position, and when in the open position, allows the chips in the main duct to pass downstream by the air discharged by the air discharger.

7. The chip collection device according to claim 6, wherein the check valve's upper edge is supported by the main duct and is movable between a closed position where it hangs down by its own weight and an open position where it swings due to being pushed by the air discharged by the air discharger.

8. The chip collection device according to claim 5, wherein a plurality of chip entry openings are provided in the direction in which the main duct extends, and the check valve is provided at a position that separates the plurality of chip entry openings one or more at a time.

9. The chip recovery device according to claim 8, wherein the main duct is provided below a work line in which a plurality of component mounting devices are arranged in one direction and extends along the one direction, and the check valve is located between two adjacent component mounting devices among the plurality of component mounting devices.

10. The chip recovery device according to claim 2, wherein the subduct has a first subduct and a second subduct positioned opposite each other with the main duct in between; the air blower has a first air blower for moving the chips received in the first subduct into the main duct and a second air blower for moving the chips received in the second subduct into the main duct; and the shutter has a first shutter for opening and closing the chip entry opening corresponding to the first subduct and a second shutter for opening and closing the chip entry opening corresponding to the second subduct.

11. The chip collection device according to claim 10, wherein the first shutter and the second shutter are arranged so that at least a portion of them face each other, and the time during which the first air blower is blowing air and the time during which the second air blower is blowing air do not overlap.

12. A chip collection method using a chip collection device for collecting chips of tape material discharged from a tape feeder of a component mounting device, the chip collection device comprising: a sub-duct that receives the chips discharged from the tape feeder through a chip receiving opening; a main duct connected to the sub-duct through a chip entry opening; an air blower installed in the sub-duct that moves the chips in the sub-duct to the main duct by blowing air toward the chip entry opening; and a shutter that is in a closed position that closes the chip entry opening when the air blower is not blowing air, and in an open position that opens the chip entry opening when the air blower is blowing air. The shutter moves between the closed position and the open position by swinging, thereby opening and closing the chip entry opening. A chip collection method wherein the shutter's upper edge is supported by the main duct and is movable between a closed position where it hangs down by its own weight and an open position where it is pushed and oscillated by the air blown out by the air blower.

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