Pressurized heat storage unit, pressurizing device, and pressurizing method

Abstract

This invention provides a heat storage unit for pressurization, a pressurizing device, and a pressurizing method that can heat a workpiece with a simple configuration. [Solution] The pressurizing heat storage units 6, 6A to 6F according to the present invention are configured to be transported together with the workpiece to a pressurizing area 2 where a pressurizing process for pressurizing the workpiece W is performed, and to be pressurized together with the workpiece. The pressurizing heat storage unit has a first heating plate 61 which is positioned above or below the workpiece and configured to heat the workpiece. The pressurizing process can pressurize the pressurizing heat storage unit from at least above and below within a first temperature range. The first heating plate does not have a heat source for heating the first heating plate, but stores heat by being heated to a preheating temperature higher than the first temperature range, and is configured to function as a heat source for heating the workpiece so that the temperature of the workpiece in the pressurizing process becomes within the first temperature range by the heat stored in the first heating plate.

Description

Technical Field

[0001] The present invention relates to a pressure storage unit, a pressurizing device, and a pressurizing method.

Background Art

[0002] For example, a pressurizing device is used for pressurizing (crimping) a workpiece such as an electronic component (see, for example, Patent Documents 1 and 2). The pressurizing device disclosed in Patent Document 1 (hereinafter referred to as "first conventional device") pressurizes a workpiece by an upper and lower type having a planar press surface. The pressurizing device disclosed in Patent Document 2 (hereinafter referred to as "second conventional device") accommodates a workpiece in a pressure vessel filled with a liquid and pressurizes the workpiece by the hydrostatic pressure of the liquid.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] Among such workpieces, there are workpieces that require pressurization at high temperatures. The first conventional device does not have a structure (for example, a heater) for heating the workpiece. Therefore, when pressurizing such a workpiece, the pressurizing device itself needs to have the same structure (see, for example, Patent Document 3). The pressurizing device disclosed in Patent Document 3 can pressurize while heating a workpiece by an upper and lower type provided with a heater. However, when heating a workpiece by the first conventional device, complicated modifications such as replacement of the upper and lower types are required.

[0005] On the other hand, in the second conventional device, the use of hot water allows for the heating of the workpiece. However, the workpiece is heated only before pressurization (i.e., under atmospheric pressure). Therefore, the temperature of the hot water is below the boiling point of water at atmospheric pressure (100°C). In other words, the second conventional device cannot handle the heating of workpieces above this boiling point. Here, for example, by increasing the pressure inside the pressure vessel, the temperature of the hot water can be heated above this boiling point. In this case, the pressure vessel falls under the category of a Class 1 pressure vessel. Therefore, this pressure vessel becomes subject to various regulations, and various procedures that were not previously necessary become required. Also, for example, by using oil as the liquid, the workpiece can be heated to above 100°C. In this case, not only is a new process required to remove the oil adhering to the workpiece, but new considerations for the safety of workers handling high-temperature oil also become necessary.

[0006] The present invention aims to provide a heat storage unit for pressurization, a pressurizing device, and a pressurizing method that can heat a workpiece with a simple configuration. [Means for solving the problem]

[0008] A pressurizing device in one embodiment of the present invention is a pressurizing device that performs a pressurizing process for pressurizing a workpiece, The equipment is transported together with the workpiece to the pressurizing area where the pressurizing process is performed, and is configured to be pressurized together with the workpiece. Pressurized heat storage unit, The aforementioned pressurizing heat storage unit and the liquid are housed together, before Addition Pressure area A pressure vessel that functions as a vessel It consists of, The pressurizing heat storage unit comprises a heating plate positioned above or below the workpiece and configured to heat the workpiece, wherein the pressurizing process can pressurize the pressurizing heat storage unit from at least above and below within a first temperature range, and the heating plate does not have a heat source for heating itself, but stores heat by being heated to a preheating temperature higher than the first temperature range, and is configured to function as a heat source for heating the workpiece so that the temperature of the workpiece during the pressurizing process falls within the first temperature range, by the heat stored in the heating plate. The heat storage unit for pressurization is transported to the pressurization area together with the workpiece. In the pressure vessel, hydrostatic pressure is applied to the pressurizing heat storage unit via the liquid. .

[0009] A pressurization method in one embodiment of the present invention is a pressurization method performed by a pressurization device that performs a pressurization process for pressurizing a workpiece, comprising: a preheating process of heating a first heating plate and a second heating plate to a preheating temperature; a placement process of placing the workpiece between the first heating plate and the second heating plate after preheating; a transport process of transporting the first heating plate, the second heating plate and the workpiece to a pressurization area in which the workpiece is pressurized; and in the pressurization area, pressurizing the transported first heating plate, the second heating plate and the workpiece from at least the vertical direction within a first temperature range. The aforementioned The process includes pressurization, wherein in the preheating process, the preheating temperature is set to a temperature higher than the first temperature range, and the first heating plate and the second heating plate are heated to the preheating temperature by heat sources located outside the first heating plate and the second heating plate, respectively, in the pressurization process, The first heating plate, the second heating plate, and the workpiece are immersed in the liquid inside the pressure vessel of the pressurizing device, and hydrostatic pressure is applied to the first heating plate, the second heating plate, and the workpiece via the liquid. The workpiece is heated by the heat stored in the first heating plate and the second heating plate, respectively, so that the temperature of the workpiece falls within the first temperature range. [Effects of the Invention]

[0010] The present invention provides a heat storage unit for pressurization, a pressurizing device, and a pressurizing method that can heat a workpiece with a simple configuration. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic diagram of a pressurizing device, illustrating an embodiment of the pressurizing device according to the present invention. [Figure 2] This is a schematic side view of an embodiment of the pressurized heat storage unit according to the present invention. [Figure 3] Figure 1 is a flowchart showing the operation of the pressurizing device. [Figure 4] This flowchart shows the assembly pressurization process included in the above operation. [Figure 5] This is a schematic diagram illustrating the assembly and pressurization process described above. [Figure 6] This is a schematic diagram of the pressurizing device, showing the state in which the pressurizing process included in the above operation is being performed. [Figure 7] It is a schematic diagram showing each modification example of the heat storage unit for pressurization according to the present invention. (a) shows the unit in the first modification example, (b) shows the unit in the second modification example, (c) shows the unit in the third modification example, (d) shows the unit in the fourth modification example, (e) shows the unit in the fifth modification example, and (f) shows the unit in the sixth modification example.

Embodiments for Carrying out the Invention

[0012] Embodiments of a heat storage unit for pressurization (hereinafter referred to as "this unit") according to the present invention, a pressurization device (hereinafter referred to as "this device") according to the present invention, and a pressurization method (hereinafter referred to as "this method") according to the present invention will be described below. In the following description, each drawing is referred to as appropriate. In each drawing, the same members and elements are denoted by the same reference numerals, and duplicate explanations are omitted. Also, the dimensional ratios of each element may be exaggerated for the sake of convenience of explanation and are not limited to the ratios shown in each drawing.

[0013] In the following description, unless otherwise specified, the lower surface faces downward and is a planar surface. The upper surface faces upward and is a planar surface.

[0014] ●Pressurization Device● ●Configuration of Pressurization Device FIG. 1 is a schematic diagram of this device showing an embodiment of this device.

[0015] The apparatus 1 heats and pressurizes the workpiece W. The apparatus 1 is, for example, a hydrostatic pressure pressurization apparatus that pressurizes the workpiece W by hydrostatic pressure via a liquid Lq. The apparatus 1 includes a pressure vessel 2, an upper lid 3, a basket 4, pins 5, this unit 6, a heating and pressure boosting apparatus 7, a preliminary heating apparatus 8, and an encapsulation apparatus 9. The configurations of the pressure vessel 2, the upper lid 3, the basket 4, the pins 5, the heating and pressure boosting apparatus 7, and the encapsulation apparatus 9 are each common to the respective configurations in a known hydrostatic pressure pressurization apparatus. Therefore, in the following description, the details of these explanations are omitted.

[0016] The "workpiece W" is the object to be pressurized by the apparatus 1, and is, for example, a rectangular sheet-like base material, a flat substrate on which electronic components, circuits, etc. are mounted, and the like. Specifically, the workpiece W is, for example, a laminate of ceramic green sheets used in the manufacture of multilayer ceramic electronic components having a multilayer structure (for example, multilayer ceramic capacitors (MLCC: Multilayer Ceramic Capacitors), chip inductors, low temperature co-fired ceramics (LTCC: Low Temperature Co-fired Ceramics), etc.). The workpiece W includes an upper surface Wa and a lower surface Wb (both are shown in FIG. 2. The same applies hereinafter).

[0017] In the present invention, the shape of the workpiece W only needs to be a shape that allows the workpiece W to be incorporated into this unit 6 and pressurized, and is not limited to a sheet shape or a flat shape. The shapes of the upper surface Wa and the lower surface Wb of the workpiece W are preferably planar.

[0018] The "liquid Lq" is, for example, water. In the present embodiment, when the workpiece W is pressurized, warm water heated to the pressurization temperature is used as the liquid Lq. The "pressurization temperature" is a temperature below the boiling point (for example, 80°C to 90°C).

[0019] The pressure vessel 2 contains the liquid Lq, basket 4, main unit 6, and workpiece W when the workpiece W is pressurized. The shape of the pressure vessel 2 is, for example, a bottomed cylindrical shape. The pressure vessel 2 is provided with two pin insertion holes 2a, an inlet hole 2b, and an upper opening 2c. The pressure vessel 2 functions as the pressurized area in the present invention.

[0020] The pin insertion holes 2a are through-holes into which the pin 5 is inserted when the pressure vessel 2 is closed. The pin insertion holes 2a penetrate horizontally through the top of the pressure vessel 2. The two pin insertion holes 2a are arranged coaxially.

[0021] The inlet hole 2b is a through-hole through which liquid Lq is introduced into the interior of the pressure vessel 2. The inlet hole 2b penetrates the bottom of the pressure vessel 2 in the vertical direction.

[0022] The upper opening 2c is an opening in the pressure vessel 2 that is oriented upward. The upper opening 2c is located at the upper end of the pressure vessel 2.

[0023] The top cover 3 is a lid that opens and closes the upper opening 2c of the pressure vessel 2. The shape of the top cover 3 is, for example, a cylindrical shape that is flattened in the vertical direction. The top cover 3 is provided with a pin insertion hole 3a, an outlet hole 3b, a discharge valve 3c, and a bottom surface 3d.

[0024] The pin insertion hole 3a is a through-hole into which the pin 5 is inserted when the pressure vessel 2 is closed. The pin insertion hole 3a penetrates horizontally through the central part of the top cover 3 in the vertical direction.

[0025] The outlet hole 3b is a through-hole for draining liquid Lq from inside the pressure vessel 2 when the top cover 3 is positioned in the upper opening 2c. The outlet hole 3b penetrates the lower part of the top cover 3 in the vertical direction. The outlet hole 3b communicates with the pin insertion hole 3a.

[0026] The discharge valve 3c is a valve that opens and closes the outlet hole 3b. The discharge valve 3c is located at the upper end of the outlet hole 3b. When the pin 5 is inserted into the pin insertion hole 3a, the discharge valve 3c closes the outlet hole 3b. When the pin 5 is not inserted into the pin insertion hole 3a, the discharge valve 3c opens the outlet hole 3b.

[0027] Basket 4 houses the work assembly 10 (described later). Basket 4 is made of, for example, mesh or perforated metal, and liquid Lq can freely flow in and out. Basket 4 is detachably attached to the lower surface 3d of the top lid 3.

[0028] Pin 5 secures the top cover 3 to the pressure vessel 2. The shape of pin 5 is, for example, cylindrical. Pin 5 is movable in the horizontal direction.

[0029] Figure 2 is a schematic side view of the unit 6, showing an embodiment of the unit 6. In the following description, Figure 1 will be referred to together with Figure 2 as appropriate.

[0030] This unit 6 is used for transporting the workpiece W and also functions as a heat source and pressurizer for the workpiece W. This unit 6 comprises a first heating plate 61, a second heating plate 62, a first insulating plate 63, a second insulating plate 64, a first metal plate 65, a second metal plate 66, and a plurality of protective sheets (not shown; the same applies hereinafter).

[0031] The first heating plate 61 heats the workpiece W. The first heating plate 61 is made of a known insulating material (e.g., glass fiber) having a low thermal conductivity (e.g., 0.05 W / m·K or less). In other words, the first heating plate 61 is made only of an insulating material capable of storing a predetermined amount of heat (described later) during the processing time (described later). That is, the first heating plate 61 does not have a heat source (e.g., a heater) to heat the first heating plate 61 itself. The shape of the first heating plate 61 is, for example, a rectangular plate. In a vertical view, the first heating plate 61 is larger than the workpiece W. The first heating plate 61 has an upper surface 61a and a lower surface 61b. The first heating plate 61 is an example of a heating plate in the present invention.

[0032] "Processing time" is the time from the completion of the preheating treatment (ST11: see Figure 4) until at least the completion of the pressurization treatment of the workpiece W (ST3: see Figure 3; the same applies hereinafter).

[0033] The "predetermined amount of heat" is the amount of heat (thermal energy) that can be used to heat the workpiece W so that its temperature falls within the first temperature range (described later) after the assembly process (ST12: see Figure 4) has been completed and while the pressurization process (ST3) is being performed.

[0034] The "first temperature range" is a recommended temperature range for pressurized treatment (ST3) of the workpiece W. The first temperature range should be any temperature range that does not adversely affect the workpiece W (e.g., underheating, overheating, etc.), and is set appropriately according to the workpiece W. Preferably, the first temperature range is above the boiling point of water at atmospheric pressure, for example, 110°C to 150°C.

[0035] The second heating plate 62 heats the workpiece W. The second heating plate 62 is made of a known insulating material (e.g., glass fiber) having a low thermal conductivity (e.g., 0.05 W / m·K or less). In other words, the second heating plate 62 is made only of an insulating material capable of storing a predetermined amount of heat during the processing time. That is, the second heating plate 62 does not have a heat source (e.g., a heater) to heat the second heating plate 62 itself. The shape of the second heating plate 62 is, for example, a rectangular plate. The second heating plate 62 has an upper surface 62a and a lower surface 62b. In this embodiment, the material and shape of the second heating plate 62 are the same as the material and shape of the first heating plate 61. The second heating plate 62 is an example of a heating plate in the present invention.

[0036] In this invention, the material and shape of the second heating plate 62 may differ from those of the first heating plate 61.

[0037] The first insulating plate 63 suppresses the cooling of the first heating plate 61 (heat dissipation from the first heating plate 61). The first insulating plate 63 is made of a known insulating material (e.g., glass fiber) having a low thermal conductivity (e.g., 0.05 W / m·K or less). The shape of the first insulating plate 63 is, for example, a rectangular plate. In a vertical view, the first insulating plate 63 is larger than the first heating plate 61. The first insulating plate 63 has an upper surface 63a and a lower surface 63b. The outer edge of the lower surface 63b is, for example, rounded. The first insulating plate 63 is an example of an insulating plate in the present invention.

[0038] In this invention, the material of the first heat insulating plate 63 may be the same as or different from the material of the first heating plate 61. Furthermore, the thermal conductivity of the first heat insulating plate 63 is preferably less than or equal to the thermal conductivity of the first heating plate 61, and more preferably less than the thermal conductivity of the first heating plate 61.

[0039] The second insulation plate 64 suppresses the cooling of the second heating plate 62 (heat dissipation from the first heating plate 61). The second insulation plate 64 is made of a known insulating material (e.g., glass fiber) having a low thermal conductivity (e.g., 0.05 W / m·K or less). The shape of the second insulation plate 64 is, for example, a rectangular plate. In a vertical view, the second insulation plate 64 is larger than the second heating plate 62. The second insulation plate 64 has an upper surface 64a and a lower surface 64b. The outer edge of the upper surface 64a is, for example, rounded. In this embodiment, the material and shape of the second insulation plate 64 are the same as those of the first insulation plate 63. The second insulation plate 64 is an example of an insulating plate in the present invention.

[0040] In this invention, the materials of the first insulating plate 63 and the second insulating plate 64 may be the same as or different from the material of the first heating plate 61.

[0041] Furthermore, in the present invention, the thermal conductivity of the first insulating plate 63 and the second insulating plate 64 is preferably less than or equal to the thermal conductivity of the first heating plate 61, and more preferably less than the thermal conductivity of the first heating plate 61.

[0042] Furthermore, in the present invention, the material and shape of the second insulation board 64 may differ from those of the first insulation board 63.

[0043] The first metal plate 65 equalizes the heat conduction from the first heating plate 61 to the workpiece W. The first metal plate 65 is made of a metal material with high thermal conductivity (e.g., copper, stainless steel, etc.). The thermal conductivity of the first metal plate 65 is sufficiently (e.g., several to tens of times) greater than that of the first heating plate 61. The shape of the first metal plate 65 is, for example, a rectangular plate. In a vertical view, the first metal plate 65 has the same shape (size) as the first heating plate 61. The first metal plate 65 has an upper surface 65a and a lower surface 65b.

[0044] The second metal plate 66 equalizes the heat conduction from the second heating plate 62 to the workpiece W. The second metal plate 66 is made of a metal material with high thermal conductivity (e.g., copper, stainless steel, etc.). The thermal conductivity of the second metal plate 66 is sufficiently (e.g., several to tens of times) greater than that of the second heating plate 62. The shape of the second metal plate 66 is, for example, a rectangular plate. In a vertical view, the second metal plate 66 has the same shape (size) as the second heating plate 62. The second metal plate 66 has an upper surface 66a and a lower surface 66b. In this embodiment, the material and shape of the second metal plate 66 are the same as those of the first metal plate 65.

[0045] In this invention, the material and shape of the second metal plate 66 may differ from those of the first metal plate 65.

[0046] The protective sheet protects the first heating plate 61, the second heating plate 62, the first insulation plate 63, the second insulation plate 64, the first metal plate 65, and the second metal plate 66. The protective sheet prevents the components that are positioned to sandwich the protective sheet from sticking together. The protective sheet is made of, for example, a known resin material (e.g., silicone).

[0047] Here, when the workpiece W is brought into the apparatus 1 (pressure vessel 2), the workpiece W has already been incorporated into the unit 6 and constitutes the workpiece assembly 10.

[0048] The drawing most frequently referenced in the following description is Figure 1. The heating and pressurizing device 7 heats and pressurizes the liquid Lq. The heating and pressurizing device 7 comprises a constant temperature bath 71, a first flow path L1, a second flow path L2, a third flow path L3, a fourth flow path L4, a first valve V1, a second valve V2, a circulation pump P1, a pressurizing pump P2, and a heater H.

[0049] The constant temperature bath 71 heats the liquid Lq and also maintains the temperature of the liquid Lq and the pressure vessel 2. A predetermined amount of liquid Lq is stored in the constant temperature bath 71. The pressure vessel 2 is immersed in the liquid Lq stored in the constant temperature bath 71. As a result, the pressure vessel 2 is kept warm by the liquid Lq.

[0050] The first to fourth flow paths L1 to L4 are the flow paths for the liquid Lq. The first valve V1 is a known three-way valve that switches between the connection between the second flow path L2 and the inlet hole 2b, and between the connection between the fourth flow path L4 and the inlet hole 2b. The second valve V2 is a known on-off valve that opens and closes the second flow path L2. The circulation pump P1 is a known pump that circulates the liquid Lq in the first to third flow paths L1 to L3 and the constant temperature bath 71. The booster pump P2 is a known pump that increases the pressure of the liquid Lq. The first valve V1 is connected to the third flow path L3. The second valve V2 is connected to the second flow path L2. The first flow path L1 is connected to the constant temperature bath 71 and the circulation pump P1. The second flow path L2 is connected to the circulation pump P1 and the constant temperature bath 71. The third flow path L3 is connected to the section of the second flow path L2 between the circulation pump P1 and the second valve V2, and to the inlet hole 2b. The fourth flow path L4 is connected to the booster pump P2 and the first valve V1.

[0051] Heater H heats the liquid Lq. Heater H is attached to the constant temperature bath 71 and is capable of heating the liquid Lq.

[0052] The preheating device 8 heats the components of the unit 6 that require preheating treatment (ST11) (for example, the first heating plate 61 and the second heating plate 62) to the preheating temperature (described later). The preheating device 8 is, for example, a known heating device (for example, an oven, a hot plate, etc.). The preheating device 8 is located outside the pressure vessel 2. That is, the preheating device 8 is located outside the first heating plate 61 and the second heating plate 62. The preheating device 8 is an example of a heat source in the present invention.

[0053] The "preheating temperature" is the temperature at which the first heating plate 61 and the second heating plate 62 can store a predetermined amount of heat during the processing time. The preheating temperature is set to a temperature higher than the first temperature range (for example, 200°C).

[0054] The sealing device 9 vacuums the inside of the bag 11 containing the workpiece assembly 10 and seals the bag 11. The sealing device 9 is, for example, a known vacuum sealing device. The sealing device 9 is located outside the pressure vessel 2. The bag 11 is, for example, a known vacuum packing bag.

[0055] ●Operation of this device Next, the operation of this device 1 will be described below. Figures 1 and 2 will be referred to as appropriate in the following description.

[0056] Figure 3 is a flowchart showing the operation of this device 1.

[0057] First, the assembly heat treatment (ST1) is performed.

[0058] "Assembly Heat Treatment (ST1)" is a process in which the workpiece assembly 10 is assembled and the heating of the workpiece W begins. Assembly Heat Treatment (ST1) is an example of this method.

[0059] Figure 4 is a flowchart of the assembly heat treatment (ST1). Figure 5 is a schematic diagram illustrating the assembly heat treatment (ST1).

[0060] First, the first heating plate 61 and the second heating plate 62 are heated to the preheating temperature by the preheating device 8 (ST11: preheating treatment).

[0061] In addition, in the present invention, the preheating treatment (ST11) may also be performed on the first metal plate 65 and the second metal plate 66.

[0062] Furthermore, in the present invention, the preheating treatment (ST11) may also be performed on the workpiece W. In this case, for example, the workpiece W may be heated together with the first heating plate 61 and the second heating plate 62 while sandwiched between them.

[0063] Next, the workpiece assembly 10 is assembled (ST12: assembly process). Specifically, the first insulation plate 63 is placed on a protective sheet, another protective sheet is placed on the first insulation plate 63, the first heating plate 61 after preheating is placed on the protective sheet, another protective sheet is placed on the first heating plate 61, the first metal plate 65 after preheating is placed on the protective sheet, another protective sheet is placed on the first metal plate 65, and the workpiece W is placed on the protective sheet. Next, another protective sheet is placed on the workpiece W, the second metal plate 66 after preheating is placed on the protective sheet, another protective sheet is placed on the second metal plate 66, the second heating plate 62 after preheating is placed on the protective sheet, another protective sheet is placed on the second heating plate 62, the second insulation plate 64 is placed on the protective sheet, and another protective sheet is placed on the second insulation plate 64. As a result, the workpiece W is positioned between the first heating plate 61 and the second heating plate 62. At this time, heating of the workpiece W is started. The assembly process (ST12) is an example of the placement process in the present invention.

[0064] In the workpiece assembly 10, the first heating plate 61 is positioned below the workpiece W so as to cover the workpiece W when viewed from below (heating plate positioning process). The first heat insulating plate 63 is positioned below the first heating plate 61, that is, in the opposite direction to the direction in which the workpiece W is positioned relative to the first heating plate 61, so as to cover the first heating plate 61 when viewed from below (heat insulating plate positioning process). The first metal plate 65 is positioned between the workpiece W and the first heating plate 61 (metal plate positioning process). The second heating plate 62 is positioned above the workpiece W so as to cover the workpiece W when viewed from above (heating plate positioning process). The second heat insulating plate 64 is positioned above the second heating plate 62, that is, in the opposite direction to the direction in which the workpiece W is positioned relative to the second heating plate 62, so as to cover the second heating plate 62 when viewed from above (heat insulating plate positioning process). The second metal plate 66 is positioned between the workpiece W and the second heating plate 62 (metal plate positioning process). Each protective sheet is positioned between the workpiece W and the first metal plate 65, between the first metal plate 65 and the first heating plate 61, between the first heating plate 61 and the first insulation plate 63, between the workpiece W and the second metal plate 66, between the second metal plate 66 and the second heating plate 62, between the second heating plate 62 and the second insulation plate 64, below the first insulation plate 63, and above the second insulation plate 64.

[0065] In this invention, the protective sheet may be placed as needed, and may be placed only in some of the positions described above.

[0066] Thus, the workpiece assembly 10 is composed of this unit 6 and the workpiece W. As a result, a portion of the heat stored in the first heating plate 61 is conducted to the first metal plate 65, homogenized in the first metal plate 65, and then conducted to the workpiece W. Similarly, a portion of the heat stored in the second heating plate 62 is also conducted to the workpiece W. As a result, the workpiece W is heated to a temperature above the first temperature range (at least the lower limit temperature) and below the preheating temperature.

[0067] As described above, the first insulating plate 63 is positioned below the first heating plate 61 so as to cover it when viewed from below. The second insulating plate 64 is positioned above the second heating plate 62 so as to cover it when viewed from above. Therefore, the first insulating plate 63 suppresses the release of heat from the first heating plate 61 to the atmosphere, and the second insulating plate 64 suppresses the release of heat from the second heating plate 62 to the atmosphere. As a result, even if the first heating plate 61 does not have a heat source to heat itself, the decrease in the temperature of the first heating plate 61 is suppressed. The same applies to the second heating plate 62.

[0068] Next, the workpiece assembly 10 is vacuum-sealed into the bag 11 (ST13: sealing process). Since vacuum sealing is also performed using known hydrostatic pressurizing devices, a detailed explanation of that process is omitted.

[0069] The drawings primarily referenced in the following explanation are Figures 1 to 3. Next, the workpiece assembly 10 is transported (loaded) into the pressure vessel 2 (ST2: transport process). Specifically, the sealed workpiece assembly 10 is placed in the basket 4 and the basket 4 is transported downwards towards the top lid 3. That is, this unit 6 is transported together with the workpiece W and the basket 4. Next, the basket 4 is attached to the lower surface 3d of the top lid 3.

[0070] At this time, the first valve V1 connects the second flow path L2 and the inlet hole 2b. The second valve V2 is closed. The circulation pump P1 circulates the liquid Lq in the following order, for example: circulation pump P1, second flow path L2, third flow path L3, inside the pressure vessel 2, inside the constant temperature bath 71, first flow path L1, circulation pump P1. The heater H heats the liquid Lq inside the constant temperature bath 71. As a result, the temperature of the liquid Lq inside the pressure vessel 2 is maintained at the pressurization temperature.

[0071] Next, the top cover 3 is transported to the pressure vessel 2 so as to close the upper opening 2c of the pressure vessel 2. At this time, the pin insertion hole 3a is in communication with the pin insertion hole 2a, and the discharge valve 3c is open. Therefore, the liquid Lq inside the pressure vessel 2 is discharged to the constant temperature bath 71 through the outlet hole 3b and the pin insertion holes 2a and 3a. The basket 4 and the enclosed work assembly 10 are immersed in the liquid Lq inside the pressure vessel 2.

[0072] Next, pin 5 is inserted into pin insertion holes 2a and 3a. As a result, the discharge valve 3c is closed. The top cover 3 is then fixed to the pressure vessel 2.

[0073] Next, the first valve V1 connects the fourth flow path L4 to the inlet hole 2b. At this time, the inside of the pressure vessel 2 is filled with liquid Lq. Next, the second valve V2 is opened. At this time, the circulation pump P1 circulates the liquid Lq in the following order, for example: circulation pump P1, second flow path L2, inside the constant temperature bath 71, first flow path L1, circulation pump P1.

[0074] Figure 6 is a schematic diagram of the apparatus 1 showing the state in which pressurization (ST3) is being performed. In the following description, Figures 1 to 3 will be referred to as appropriate along with Figure 6.

[0075] Next, the workpiece W is pressurized (ST3: pressurization process). Specifically, the booster pump P2 pumps liquid Lq into the pressure vessel 2, thereby increasing the pressure of the liquid Lq inside the pressure vessel 2 to a pressurized pressure (e.g., 200 MPa). At this time, hydrostatic pressure is applied to the workpiece assembly 10 (this unit 6 and workpiece W) via the liquid Lq. That is, this unit 6 is pressurized together with the workpiece W. In other words, the pressure vessel 2 functions as a pressurized area where the pressurization process (ST3) is performed. Furthermore, the workpiece W is sandwiched between the first metal plate 65 and the second metal plate 66 via a protective sheet, and its upper surface 65a and lower surface 66b are planar. That is, when the workpiece W is pressurized, it is pressurized while in contact with a planar rigid body. Therefore, pressurization of the workpiece W in a curved or bent state is prevented. The pressurization process (ST3) begins when the pressure reaches the pressurized pressure and ends after a predetermined time (e.g., 5 mins). When the pressurization process is complete, the operation (pressurization) of the booster pump P2 is stopped, and the liquid Lq is reduced in volume.

[0076] During the pressurization process (ST3), the temperatures of the first heating plate 61 and the second heating plate 62 decrease from the preheating temperature but are maintained above the first temperature range (at least above the lower limit temperature). Similarly, the temperature of the workpiece W decreases from the temperature immediately after the assembly process (ST1), but remains within the first temperature range. Thus, the preheating temperature is predetermined so that during the heating process (ST3), the temperatures of the first heating plate 61 and the second heating plate 62 remain above the lower limit temperature, and the temperature of the workpiece W remains within the first temperature range. In other words, the first heating plate 61 and the second heating plate 62 function as heat sources to heat the workpiece W so that its temperature during the pressurization process (ST3) remains within the first temperature range. Furthermore, during the pressurization process (ST3), the workpiece assembly 10 (this unit 6) is pressurized from all directions (isotropic pressurization) by liquid Lq. The workpiece W is mainly pressurized from a uniaxial direction (up and down direction) by this unit 6.

[0077] As described above, the first insulating plate 63 is positioned below the first heating plate 61 so as to cover the first heating plate 61 when viewed from below. The second insulating plate 64 is positioned above the second heating plate 62 so as to cover the second heating plate 62 when viewed from above. Therefore, the first insulating plate 63 suppresses heat transfer from the first heating plate 61 to the liquid Lq, and the second insulating plate 64 suppresses heat transfer from the second heating plate 62 to the liquid Lq. As a result, even if the first heating plate 61 does not have a heat source to heat the first heating plate 61 itself, the decrease in the temperature of the first heating plate 61 is suppressed. The same applies to the second heating plate 62. In addition, because the first insulating plate 63 and the second insulating plate 64 are positioned, the bag 11 does not come into contact with the first heating plate 61 and the second heating plate 62 which are heated to high temperatures. Therefore, damage such as melting of the bag 11 is prevented.

[0078] As mentioned above, the first metal plate 65 is positioned between the workpiece W and the first heating plate 61, and the second metal plate 66 is positioned between the workpiece W and the second heating plate 62. The thermal conductivity of the first metal plate 65 and the second metal plate 66 is sufficiently greater than that of the first heating plate 61 and the second heating plate 62. Therefore, the heat from the first heating plate 61 is conducted relatively evenly through the first metal plate 65 and then to the workpiece W. The same applies to the second metal plate 66.

[0079] Furthermore, as described above, in the present invention, the workpiece W is heated only by the components (first heating plate 61 and second heating plate 62) that have undergone preheating treatment (ST11). Therefore, in the present invention, unlike known hydrostatic pressurizing devices, there is no waiting time required from the time the workpiece W is immersed in liquid Lq until the temperatures of the workpiece W and liquid Lq stabilize. Similarly, in the present invention, the liquid Lq does not need to be heated to the pressurizing temperature, and the pressurizing temperature may be low (for example, room temperature). Thus, in the present invention, the power and time required for heating and stabilizing the temperature of liquid Lq, which are necessary in known hydrostatic pressurizing devices, are not particularly necessary.

[0080] Next, the workpiece assembly 10 is unloaded from the pressure vessel 2 (ST4: unloading process). Specifically, the pressure of the liquid Lq inside the pressure vessel 2 is reduced to atmospheric pressure, and the operation (circulation) of the circulation pump P1 is stopped. Next, the pin 5 is pulled out from the pin insertion holes 2a and 3a, and the top cover 3 is removed from the pressure vessel 2 (the top opening 2c is opened). Next, the basket 4 is removed from the top cover 3 and unloaded together with the workpiece assembly 10.

[0081] With this configuration, the unit 6 can heat the workpiece W to a high temperature of 100°C or higher during the pressurized process (ST3) without using a liquid Lq of 100°C or higher (meaning the pressure vessel 2 does not qualify as a Class 1 pressure vessel), even without a heat source to heat the unit 6 itself. Furthermore, with a simple configuration in which the unit 6 is attached to the workpiece W (the workpiece assembly 10 is assembled), the workpiece W is heated to a high temperature of 100°C or higher during the pressurized process (ST3). Therefore, the unit 6 can be easily applied to known (i.e., existing) hydrostatic pressurizing devices without requiring any modification of the device.

[0082] ●Variations● Next, a modified version of Unit 6 will be described below, focusing on the parts that differ from the embodiment described above (hereinafter referred to as the "First Embodiment"). In the following description of the modified version, elements that are the same as those in the First Embodiment and elements that have common functions are denoted by the same reference numerals as in the First Embodiment for the sake of convenience, and their descriptions will be omitted. Figures 1 and 2 will be referred to as appropriate in the following description.

[0083] ●Differences 1 to 6 Figure 7 is a schematic diagram showing various modifications of the unit 6, where (a) shows the unit 6A in the first modification, (b) shows the unit 6B in the second modification, (c) shows the unit 6C in the third modification, (d) shows the unit 6D in the fourth modification, (e) shows the unit 6E in the fifth modification, and (f) shows the unit 6F in the sixth modification. Figure 7(d) shows a schematic cross-section of the unit 6D.

[0084] As shown in Figure 7(a), this unit 6A does not include the first metal plate 65 and the second metal plate 66. In this configuration, the uniformity of heat conducted to the workpiece W is slightly reduced compared to the first embodiment. However, this unit 6A has the same effect as this unit 6, except for this point.

[0085] As shown in Figure 7(b), this unit 6B does not include a second heating plate 62 and a second metal plate 66. The second insulating plate 64 is positioned upwards toward the workpiece W, that is, in the opposite direction to the direction toward the workpiece W toward the first heating plate 61. In this configuration, the workpiece W is heated only by the first heating plate 61. Therefore, compared to the first embodiment and the first modified example, the heat conducted to the workpiece W is reduced. However, this unit 6B has the same effect as this unit 6A, except for this point.

[0086] As shown in Figure 7(c), the unit 6C does not have a second heating plate 62 and a second metal plate 66, but it does have a pressure pad 67. When the workpiece W is pressed, the pressure pad 67 deforms to conform to the shape of the surface of the workpiece W, thereby evenly pressing the workpiece W. The pressure pad 67 is made of, for example, a known fibrous material having high flexibility and low thermal conductivity. That is, the pressure pad 67 also functions as an insulating material. The pressure pad 67 is an example of an insulating plate and a second insulating plate in the present invention. In this configuration, when the workpiece W is pressed, the workpiece W is pseudo-isotropically pressed from almost all directions (multi-directions) by the first metal plate 65 and the pressure pad 67.

[0087] As shown in Figure 7(d), this unit 6D does not include the first insulation plate 63, the second insulation plate 64, the first metal plate 65, and the second metal plate 66, but does include the first heating plate 61, the second heating plate 62, the first insulation plate 68, and the second insulation plate 69.

[0088] The material of the first insulation plate 68 is the same as the material of the first insulation plate 63. The first insulation plate 68 has an upper surface 68a, a lower surface 68b, a recess 68c, and a protrusion 68d. Of the upper surface 68a, the portion excluding the outer edge (the central part) is recessed in a rectangular shape downwards, forming the recess 68c. Of the upper surface 68a, the outer edge portion that does not form the recess 68c forms a protrusion 68d that surrounds the entire circumference of the recess 68c in a rectangular frame shape when viewed from above. That is, the protrusion 68d is arranged around the entire circumference of the outer edge of the upper surface 68a. When viewed from above, the shape of the recess 68c is approximately the same as the shape of the first heating plate 61. In the vertical direction, the length (depth) of the recess 68c is the same as, or slightly less than, the length (thickness) of the first heating plate 61. The first heating plate 61 is positioned (fitted) into the recess 68c. The first insulation board 68 is an example of an insulation board in the present invention.

[0089] The material of the second insulation plate 69 is the same as the material of the second insulation plate 64. The second insulation plate 69 has an upper surface 69a, a lower surface 69b, a recess 69c, and a protrusion 69d. Of the lower surface 69b, the portion excluding the outer edge (the central part) is recessed in a rectangular shape upwards, forming the recess 69c. Of the lower surface 69b, the outer edge portion that does not form the recess 69c forms a protrusion 69d that surrounds the entire circumference of the recess 69c in a rectangular frame shape when viewed from below. That is, the protrusion 69d is arranged around the entire circumference of the outer edge of the lower surface 69b. When viewed from below, the shape of the recess 69c is approximately the same as the shape of the second heating plate 62. In the vertical direction, the length (depth) of the recess 69c is the same as, or slightly less than, the length (thickness) of the second heating plate 62. The second heating plate 62 is positioned (fitted) into the recess 69c. The second insulation board 69 is an example of an insulation board in the present invention.

[0090] In this configuration, the first heating plate 61 is enclosed in the first insulating plate 68, except for its upper surface 61a. The second heating plate 62 is enclosed in the second insulating plate 69, except for its lower surface 62b. Therefore, compared to the first embodiment, the temperature drop of the first heating plate 61 and the second heating plate 62 is suppressed.

[0091] As shown in Figure 7(e), this unit 6E does not include the first insulating plate 63, the second insulating plate 64, the first metal plate 65, and the second metal plate 66. In this configuration, the time for which the first heating plate 61 and the second heating plate 62 can store heat is shorter compared to the first embodiment. However, if the time is shorter and the temperature is lower than in the first embodiment, this unit 6E can heat the workpiece W in the same way as this unit 6. Compared to the first embodiment, the first heating plate 61 and the second heating plate 62 are configured to have larger volumes (heat capacities).

[0092] As shown in Figure 7(f), the unit 6F does not include the second heating plate 62, the second insulating plate 64, and the second metal plate 66. In this configuration, the workpiece W always releases heat. However, for a shorter time and at a lower temperature than in the first embodiment and the fifth modified example, the unit 6F can heat the workpiece W in the same way as the unit 6.

[0093] ●Summary According to the above description, the units 6, 6A to 6F are configured to be transported together with the workpiece W to the pressure vessel 2 where the pressurization process (ST3) is performed, and to be pressurized together with the workpiece W. Unit 6 includes a first heating plate 61 positioned below the workpiece W and configured to heat the workpiece W. The pressurization process (ST3) can pressurize the unit 6 from at least the top and bottom directions within a first temperature range. The first heating plate 61 does not have a heat source to heat itself. The first heating plate 61 stores heat by being heated to a preheating temperature, and functions as a heat source to heat the workpiece W so that the temperature of the workpiece W in the pressurization process (ST3) falls within the first temperature range. With this configuration, the units 6, 6A to 6F can heat the workpiece W in a simple configuration by pressurizing the workpiece W with the heat stored in the preheated first heating plate 61. Therefore, even without a heat source to heat the units 6, 6A to 6F themselves, the workpiece W can be heated to a high temperature of 100°C or higher during the pressurized process (ST3) without using a liquid Lq of 100°C or higher (the pressure vessel 2 does not fall under the category of a Class 1 pressure vessel). In other words, with a simple configuration in which the units 6, 6A to 6F are attached to the workpiece W (the workpiece assembly 10 is assembled), the workpiece W is heated to a high temperature of 100°C or higher during the pressurized process (ST3). As a result, the units 6, 6A to 6F can be easily applied to known hydrostatic pressurizing devices without modifying the device.

[0094] According to the above explanation, the first heating plate 61 is made of an insulating material. With this configuration, the first heating plate 61 can store heat for a relatively long period of time. As a result, the temperature drop of the first heating plate 61 is suppressed.

[0095] As described above, the units 6, 6A to 6D, and 6F are equipped with first insulating plates 63 and 68 configured to be positioned in the opposite direction (downward) to the direction (upward) in which the workpiece W is positioned relative to the first heating plate 61. The first insulating plates 63 and 68 are made of insulating material. The thermal conductivity of the first insulating plates 63 and 68 is less than or equal to the thermal conductivity of the first heating plate 61. With this configuration, the first insulating plates 63 and 68 suppress the transfer of heat from the first heating plate 61 to the liquid Lq. As a result, even if the first heating plate 61 does not have a heat source to heat the first heating plate 61 itself, the decrease in the temperature of the first heating plate 61 is further suppressed.

[0096] According to the above description, the first heat insulating plate 68 is provided with a recess 68c and a protrusion 68d. The first heating plate 61 is positioned in the recess 68c. With this configuration, the temperature drop of the first heating plate 61 is further suppressed.

[0097] According to the above explanation, the units 6, 6A to 6D are equipped with second insulating plates 64 and 69 that are positioned in the opposite direction (upward) to the direction (downward) in which the first heating plate 61 is positioned relative to the workpiece W. With this configuration, heat dissipation from the workpiece W is suppressed.

[0098] As described above, the pressure pad 67, which functions as the second heat insulating plate in the present invention, is made of an elastic material that can conform to the shape of the surface of the workpiece W. With this configuration, when the workpiece W is pressed, the workpiece W is pseudo-isotropically pressed from almost all directions (multiple directions) by the first metal plate 65 and the pressure pad 67.

[0099] According to the above description, the units 6, 6A, 6D, and 6E are equipped with a second heating plate 62 positioned above the workpiece W and configured to heat the workpiece W. The second heating plate 62 does not have a heat source to heat itself. The second heating plate 62 stores heat by being heated to a preheating temperature, and this heat functions as a heat source to heat the workpiece W so that the temperature of the workpiece W during the pressurized process (ST3) falls within a first temperature range. With this configuration, the heating performance of the workpiece W by the units 6, 6A to 6E is improved. In addition, the decrease in the temperature of the workpiece W is suppressed.

[0100] According to the above explanation, the second heating plate 62 is made of an insulating material. With this configuration, the second heating plate 62 can store heat for a relatively long period of time. As a result, the temperature drop of the second heating plate 62 is suppressed.

[0101] According to the above description, the units 6, 6A to 6D are equipped with second insulating plates 64 and 69 configured to be positioned in the opposite direction (upward) to the direction in which the workpiece W is positioned (downward) relative to the second heating plate 62. The second insulating plate 64 is made of an elastic material. The thermal conductivity of the second insulating plate 64 is less than or equal to the thermal conductivity of the second heating plate 62. With this configuration, the temperature drop of the second heating plate 62 is further suppressed.

[0102] According to the above description, the second insulating plate 69 is provided with a recess 69c and a protrusion 69d. The second heating plate 62 is positioned in the recess 69c. With this configuration, the temperature drop of the second heating plate 62 is further suppressed.

[0103] According to the above description, the unit 6 comprises a first metal plate 65 and a second metal plate 66. The first metal plate 65 is placed between the workpiece W and the first heating plate 61. The second metal plate 66 is placed between the workpiece W and the second heating plate 62. The thermal conductivity of the first metal plate 65 and the second metal plate 66 is greater than that of the first heating plate 61 and the second heating plate 62. With this configuration, heat from the first heating plate 61 is conducted relatively evenly through the first metal plate 65 and then to the workpiece W. The same applies to the second metal plate 66.

[0104] According to the above description, the apparatus 1 comprises the units 6, 6A to 6F and a pressure vessel 2. In the pressure vessel 2, hydrostatic pressure is applied to the workpiece assembly 10 via liquid Lq. With this configuration, even if the units 6, 6A to 6F do not have a heat source to heat the units 6, 6A to 6F themselves, the workpiece W can be heated to a high temperature of 100°C or higher in the pressurized process (ST3) without using liquid Lq of 100°C or higher. Furthermore, in a simple configuration in which the units 6, 6A to 6F are attached to the workpiece W (the workpiece assembly 10 is assembled), the workpiece W is heated to a high temperature of 100°C or higher in the pressurized process (ST3).

[0105] ●Other embodiments In the present invention, the apparatus 1 is not limited to a hydrostatic pressurizing apparatus. That is, for example, the apparatus 1 may be a pressurizing apparatus that pressurizes a workpiece W with a mold having a planar press surface. In this case, the space adjacent to the press surface (located in the vertical direction of the press surface) functions as the pressurizing area in the present invention. Even with this configuration, the units 6, 6A to 6F can be applied to the pressurizing apparatus without requiring any modification of the pressurizing apparatus.

[0106] In the present invention, the units 6, 6A, and 6E do not necessarily have to be equipped with the first heating plate 61 or the second heating plate 62.

[0107] In the present invention, the units 6, 6A to 6C, 6F do not necessarily have to be equipped with the first insulation plate 63 and / or the second insulation plate 64.

[0108] In the present invention, the units 6, 6B, 6C, and 6F do not necessarily have to include the first metal plate 65 and / or the second metal plate 66.

[0109] In the present invention, the first heating plate 61 may function as a second heating plate 62, and the second heating plate 62 may function as a first heating plate 61. That is, for example, the first heating plate 61 may be positioned above the workpiece W, and the second heating plate 62 may be positioned below the workpiece W.

[0110] In the present invention, the first insulating plate 63 may function as a second insulating plate 64, and the second insulating plate 64 may function as a first insulating plate 63. That is, for example, the first insulating plate 63 may be positioned above the second heating plate 62, and the second insulating plate 64 may be positioned below the first heating plate 61.

[0111] In the present invention, the first insulating plate 63 only needs to have a configuration in which the bag body 11 does not come into contact with the first heating plate 61, and does not need to cover the first heating plate 61 when viewed from below. That is, for example, the first insulating plate 63 may cover only the sides and ridges of the first heating plate 61. The same applies to the second insulating plate 64.

[0112] In the present invention, the first metal plate 65 may function as a second metal plate 66, and the second metal plate 66 may function as a first metal plate 65. That is, for example, the first metal plate 65 may be positioned below the second heating plate 62, and the second metal plate 66 may be positioned above the first heating plate 61.

[0113] In the present invention, the materials of the first heating plate 61 and the second heating plate 62 are not limited to insulating materials, as long as the first heating plate 61 and the second heating plate 62 are capable of storing a predetermined amount of heat. That is, for example, the materials of the first heating plate 61 and the second heating plate 62 may be metal.

[0114] In the present invention, the units 6, 6A to 6D, and 6F may be equipped with cushioning members made of an elastic material such as rubber, which are placed between each member to prevent gaps from forming between the members of the units 6, 6A to 6D, and 6F. In this case, a protective sheet may be configured as the cushioning member. Furthermore, the unit 6 may be equipped with a cushioning member made of an elastic material such as rubber that covers the boundary between the members when viewed from the side. In this configuration, no gaps in which air remains are formed during vacuum sealing, and damage to the bag body 11 that may occur due to such gaps during pressurization is prevented.

[0115] In the third modified example, the pressure pad 67 may be positioned below the workpiece W. In this case, the unit 6C may include a second heating plate 62 and a second metal plate 66 instead of the first heating plate 61 and the first metal plate 65.

[0116] In the fourth modified example, the unit 6D may be equipped with a first insulation plate 63 instead of the first insulation plate 68, or with a second insulation plate 64 instead of the second insulation plate 69.

[0117] In the fourth modified example, the unit 6D may not include either the first insulation plate 68 or the second insulation plate 69.

[0118] In the fourth modified example, the first heating plate 61 may be positioned in the recess 68c so as to abut against the protrusion 68d, or it may be positioned in the recess 68c so as to be spaced away from the protrusion 68d. Similarly, the second heating plate 62 may be positioned in the recess 69c so as to abut against the protrusion 69d, or it may be positioned in the recess 69c so as to be spaced away from the protrusion 69d.

[0119] In the present invention, the first temperature range may include temperatures below the boiling point of water (100°C) under atmospheric pressure, or it may be below the boiling point. That is, for example, this unit 6, 6A to 6F can be used not only for heating the workpiece W to 100°C or higher, but also for heating the workpiece W to below 100°C.

[0120] In the present invention, the apparatus 1 does not necessarily have to include a preheating device 8 and a sealing device 9. In this case, the preheating device 8 and the sealing device 9 are configured separately from the apparatus 1.

[0121] In the present invention, the configurations of the units 6, 6A to 6F in the first embodiment and the first to sixth modified examples may be such that the workpiece W can be heated, and may be substituted or combined as appropriate, and may be arranged so that the vertical arrangement with respect to the workpiece W is reversed.

[0122] ●Embodiments of the present invention● Next, embodiments of the present invention as understood from the embodiments described above will be described below, with reference to the terms and reference numerals described in each embodiment.

[0123] A first embodiment of the present invention is a pressurizing heat storage unit (e.g., this unit 6, 6A~6F) configured to be transported together with a workpiece (e.g., workpiece W) to a pressurizing area (e.g., pressure vessel 2) where a pressurizing process (e.g., pressurizing process (ST3)) is performed, and to be pressurized together with the workpiece, the unit having a heating plate (e.g., first heating plate 61) positioned above or below the workpiece and configured to heat the workpiece, wherein the pressurizing process can pressurize the pressurizing heat storage unit from at least above and below within a first temperature range, and the heating plate does not have a heat source for heating the heating plate, but stores heat by being heated to a preheating temperature higher than the first temperature range, and is configured to function as a heat source for heating the workpiece so that the temperature of the workpiece in the pressurizing process falls within the first temperature range by the heat stored in the heating plate. With this configuration, the unit can heat the workpiece with a simple setup.

[0124] A second embodiment of the present invention is a pressurized heat storage unit in which the heating plate is made of an insulating material, in the first embodiment. With this configuration, the temperature drop of the first heating plate is suppressed.

[0125] A third embodiment of the present invention is a pressurized heat storage unit (e.g., this unit 6, 6A~6D, 6F) comprising, in the first embodiment, an insulating plate (e.g., first insulating plate 63, 68) configured to be positioned relative to the heating plate in the direction opposite to the direction in which the workpiece is arranged, wherein the insulating plate is made of an insulating material and the thermal conductivity of the insulating plate is less than or equal to the thermal conductivity of the heating plate. With this configuration, the temperature drop of the first heating plate is further suppressed.

[0126] A fourth embodiment of the present invention is, in the third embodiment, the heat insulating plate (for example, the first heat insulating plate 68) comprises a convex portion (for example, the convex portion 68d) arranged around the entire circumference of the outer edge of the heat insulating plate and a recess (for example, the recess 68c) arranged so as to be surrounded by the first convex portion, and the heating plate is a pressurizing heat storage unit (for example, this unit 6D) arranged in the recess. With this configuration, the temperature drop of the first heating plate is further suppressed.

[0127] A fifth embodiment of the present invention is a pressurized heat storage unit (e.g., this unit 6, 6A to 6D) comprising, in any one of the first to third embodiments, a second insulating plate (e.g., second insulating plates 64, 69, pressure pad 67) configured to be positioned relative to the workpiece in the direction opposite to the direction in which the heating plate is positioned, wherein the second insulating plate is made of an insulating material and the thermal conductivity of the second insulating plate is less than or equal to the thermal conductivity of the heating plate. This configuration suppresses heat dissipation from the workpiece.

[0128] A sixth embodiment of the present invention is, in the fifth embodiment, a heat storage unit for pressurization (e.g., this unit 6C) in which the second heat insulating plate (e.g., pressurizing pad 67) is made of an elastic material that can conform to the shape of the surface of the workpiece during the pressurizing process. In this configuration, the workpiece is subjected to pseudo-isotropic pressure from almost all directions (multiple directions).

[0129] A seventh embodiment of the present invention is a pressurized heat storage unit (e.g., this unit 6, 6A, 6D, 6E) having, in any one of the first to fourth embodiments, a first heating plate (e.g., first heating plate) positioned below the workpiece and functioning as the heating plate, and a second heating plate (e.g., second heating plate 62) positioned above the workpiece and functioning as the heating plate. With this configuration, the temperature drop of the workpiece is suppressed.

[0130] An eighth embodiment of the present invention is a pressurized heat storage unit (e.g., this unit 6, 6A, 6D) in which, in the seventh embodiment relating to the third embodiment, a first insulating plate disposed below the first heating plate and functioning as an insulating plate, and a second insulating plate (e.g., second insulating plates 64, 69) disposed above the second heating plate and functioning as an insulating plate. With this configuration, the temperature drop of the second heating plate is further suppressed.

[0131] A ninth embodiment of the present invention is a pressurized heat storage unit (e.g., this unit 6) that, in the seventh embodiment, comprises a first metal plate (e.g., first metal plate 65) disposed between the first heating plate and the workpiece and having a thermal conductivity greater than that of the first heating plate, and / or a second metal plate (e.g., second metal plate 66) disposed between the second heating plate and the workpiece and having a thermal conductivity greater than that of the second heating plate. With this configuration, heat from the first heating plate and the second heating plate is conducted to the workpiece W relatively evenly.

[0132] A tenth embodiment of the present invention is a pressurizing device (e.g., this device 1) that performs a pressurizing process (e.g., pressurizing process (ST3)) on a workpiece (e.g., workpiece W), comprising a pressurizing heat storage unit (e.g., this unit 6, 6A~6F) described in claim 1, and a pressurizing area (e.g., pressure vessel 2) on which the pressurizing process is performed, wherein the pressurizing heat storage unit is transported to the pressurizing area together with the workpiece. With this configuration, the workpiece is heated to a high temperature of 100°C or higher during the pressurized process, using a simple setup.

[0133] An eleventh embodiment of the present invention is a pressurizing device comprising the pressurizing heat storage unit and a pressure vessel (e.g., pressure vessel 2) that houses a liquid (e.g., liquid Lq) and functions as a pressurizing area, wherein hydrostatic pressure is applied to the pressurizing heat storage unit via the liquid in the pressure vessel. With this configuration, the workpiece is heated to a high temperature of 100°C or higher during the pressurized process, using a simple setup.

[0134] A twelfth embodiment of the present invention is a pressurizing method performed by a pressurizing device (e.g., this device 1) that performs a pressurizing process (e.g., pressurizing process (ST3)) on a workpiece (e.g., workpiece W), comprising: a preheating process (e.g., preheating process (ST11)) for heating a first heating plate (e.g., first heating plate 61) and a second heating plate (e.g., second heating plate 62) to a preheating temperature; a placement process (e.g., assembly process (ST12)) for placing the workpiece between the first heating plate and the second heating plate after preheating; a transport process (e.g., transport process (ST2)) for transporting the first heating plate, the second heating plate and the workpiece to a pressurizing area where the workpiece is pressed; and the pressurizing process The method includes, at the rear, a pressurizing process (e.g., pressurizing process (ST3)) in which the conveyed first heating plate, the second heating plate, and the workpiece are pressurized from at least the vertical direction within a first temperature range, wherein in the preheating process, the preheating temperature is set to a temperature higher than the first temperature range, the first heating plate and the second heating plate are heated to the preheating temperature by heat sources (e.g., preheating device 8) placed outside the first heating plate and the second heating plate respectively, and in the pressurizing process, the workpiece is heated by the heat stored in the first heating plate and the second heating plate respectively so that the temperature of the workpiece falls within the first temperature range. With this configuration, during the pressurized process, the workpiece is heated to a high temperature of 100°C or higher without using a liquid above 100°C. [Explanation of Symbols]

[0135] 1. Main device (pressurizing device) 2. Pressure vessel (pressurized area) 6 units (pressurized heat storage units) 6A~6F Main unit (pressurized heat storage unit) 61 1st heating plate (heating plate) 62 2nd heating plate (heating plate) 63. First insulation board (insulation board) 64. Second insulation board (insulation board) 67. Pressure pads (insulation board, second insulation board) 68. First insulation board (insulation board) 68c recess 68d convex part 69. Second insulation board (insulation board) 69c recess 69d convex part 8. Preheating device (heat source) Double job

Claims

1. A pressurizing device for performing a pressurizing process to pressurize a workpiece, A heat storage unit for pressurization is provided, which is transported together with the workpiece to the pressurization area where the pressurization process is performed, and is configured to be pressurized together with the workpiece. The aforementioned heat storage unit for pressurization, the liquid, and a pressure vessel that houses them and functions as the pressurized area, It has, The aforementioned pressurizing heat storage unit is A heating plate positioned above or below the workpiece and configured to heat the workpiece, Equipped with, The pressurization process allows the pressurizing heat storage unit to be pressurized from at least the vertical direction within a first temperature range. The aforementioned heating plate is The aforementioned heating plate does not have a heat source for heating it. The heating plate is configured to store heat by being heated to a preheating temperature higher than the first temperature range, and to function as a heat source for heating the workpiece so that the temperature of the workpiece during the pressurizing process falls within the first temperature range, The heat storage unit for pressurization is transported to the pressurization area together with the workpiece. In the pressure vessel, hydrostatic pressure is applied to the pressurizing heat storage unit via the liquid. Pressurizing device.

2. The heating plate is made of an insulating material. The pressurizing device according to claim 1.

3. The pressurizing heat storage unit is A heat insulating plate is configured to be positioned relative to the heating plate in a direction opposite to the direction in which the workpiece is placed. Equipped with, The aforementioned insulation board is made of an insulating material, The thermal conductivity of the insulating plate is less than or equal to the thermal conductivity of the heating plate. The pressurizing device according to claim 1.

4. The heat insulating board is The convex portion is arranged around the entire circumference of the outer edge of the aforementioned insulating plate, A recess is arranged so as to be surrounded by the aforementioned protrusions, Equipped with, The heating plate is positioned in the recess. The pressurizing device according to claim 3.

5. The pressurizing heat storage unit is A second insulating plate is configured to be positioned relative to the workpiece in a direction opposite to the direction in which the heating plate is positioned. Equipped with, The aforementioned second insulation board is made of an insulating material, The thermal conductivity of the second insulating plate is less than or equal to the thermal conductivity of the heating plate. The pressurizing device according to any one of claims 1 to 3.

6. The second heat insulating plate is made of an elastic material that can conform to the shape of the surface of the workpiece during the pressurizing process. The pressurizing device according to claim 5.

7. The pressurizing heat storage unit is A first heating plate positioned below the workpiece and functioning as the heating plate, A second heating plate, positioned above the workpiece and functioning as the heating plate, Equipped with, The pressurizing device according to any one of claims 1 to 4.

8. The pressurizing heat storage unit is A first heating plate positioned below the workpiece and functioning as a heating plate, A second heating plate, positioned above the workpiece and functioning as the heating plate, A first insulating plate positioned below the first heating plate, A second insulating plate positioned above the second heating plate, Equipped with, The first insulation board and the second insulation board are made of an insulating material. The thermal conductivity of the first insulating plate is less than or equal to the thermal conductivity of the first heating plate. The thermal conductivity of the second insulating plate is less than or equal to the thermal conductivity of the second heating plate. The pressurizing device according to claim 1.

9. The pressurizing heat storage unit is A first metal plate is disposed between the first heating plate and the workpiece and has a thermal conductivity greater than that of the first heating plate, and / or A second metal plate is disposed between the second heating plate and the workpiece and has a thermal conductivity greater than that of the second heating plate. Equipped with, The pressurizing device according to claim 7.

10. A pressurizing method performed by a pressurizing device that performs a pressurizing process to pressurize a workpiece, A preheating process in which the first heating plate and the second heating plate are heated to a preheating temperature, A placement process in which the workpiece is placed between the first heating plate and the second heating plate after preheating, A transport process is performed to transport the first heating plate, the second heating plate, and the workpiece to a pressurized area where the workpiece is pressurized. In the pressurized area, the pressurized process involves pressurizing the conveyed first heating plate, the second heating plate, and the workpiece from at least the vertical direction within a first temperature range. Includes, In the aforementioned preheating treatment, The preheating temperature is set to a temperature higher than the aforementioned temperature range 1. The first heating plate and the second heating plate are heated to the preheating temperature by heat sources located outside the first heating plate and the second heating plate, respectively. In the aforementioned pressurization process, The first heating plate, the second heating plate, and the workpiece are immersed in the liquid inside the pressure vessel of the pressurizing device. A hydrostatic pressure is applied to the first heating plate, the second heating plate, and the workpiece via the liquid. The workpiece is heated by the heat stored in the first heating plate and the second heating plate, respectively, so that the temperature of the workpiece falls within a first temperature range. Pressurization method.

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