Bonding apparatus, bonding method, and bonding control program

Abstract

A bonding apparatus 1 comprises: a bonding head 2 including a pressure tool PT that pressurizes an electronic component 9 and a heater 22 that heats the pressure tool PT, the pressure tool PT being configured so as to be detachable from the heater 22; a storage unit 5 that stores temperature control data indicating temporal changes in the set temperature of the heater 22; and a control unit 4 that controls the set temperature of the heater 22 on the basis of the temperature control data. The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component 9 to a substrate 8. The control unit 4 reads one of the one or more temperature control patterns according to the bonding conditions and controls the set temperature of the heater 22.

Description

Technical Field

[0001] The present invention relates to a bonding apparatus, a bonding method, and a bonding control program.

Background Art

[0002] In the technology of bonding electronic components onto a substrate, when performing bonding on an electronic component mounted on the substrate, it is important to control the tip temperature of the bonding head according to the bonding conditions. This is because the temperature control of the bonding head during bonding execution varies depending on the bonding conditions when mounting the electronic component on the substrate, such as the thickness of the electronic component, the form of the electrode or bonding material, the orientation of the electronic component (such as whether the surface on which the integrated circuit pattern is formed faces the substrate), etc. At this time, the electronic component and the substrate dissolve the solder or adhesive, and then by cooling the bonding head, the solder or adhesive is also cooled and fixed, and the bonding between the electronic component and the substrate is completed. For example, in Patent Document 1, a bonding apparatus having a cooling structure for controlling the tip temperature of the bonding head when pressing the substrate against the electronic component is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, with the technology described in Patent Document 1, it was not possible to perform highly accurate bonding associated with the bonding conditions of the electronic components to be mounted on the substrate.

[0005] Therefore, the present invention aims to provide a bonding apparatus, a bonding method, and a bonding control program that enable high-precision bonding associated with bonding conditions of electronic components. [Means for solving the problem]

[0006] A bonding apparatus in a first aspect of the present invention is a bonding apparatus for bonding an electronic component to a substrate, comprising a pressing tool for pressing the electronic component and a heater for heating the pressing tool, wherein the pressing tool is configured to be detachably attached to the heater, a bonding head, a storage unit for storing temperature control data indicating the time change of the heater's set temperature, and a control unit for controlling the heater's set temperature based on the temperature control data, wherein the temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate, and the control unit reads one of the one or more temperature control patterns according to the bonding conditions and controls the heater's set temperature.

[0007] Furthermore, a bonding method in a second aspect of the present invention includes a bonding head configured to be detachable from the heater, comprising: preparing a bonding head comprising a pressurizing tool for pressurizing an electronic component and a heater for heating the pressurizing tool, the pressurizing tool being configured to be detachable from the heater, pressurizing the electronic component toward a substrate with the pressurizing tool, and reading temperature control data indicating the time change of the heater's set temperature from a storage unit, and controlling the heater's set temperature based on the temperature control data by a control unit, wherein the temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate, and controlling the heater's set temperature comprises reading one of the one or more temperature control patterns according to the bonding conditions and controlling the heater's set temperature.

[0008] Furthermore, a bonding control program in a third aspect of the present invention is a bonding control program for controlling a bonding apparatus comprising a bonding head, a storage unit for storing temperature control data indicating the time change of the set temperature of the heater, and a control unit for controlling the set temperature of the heater based on the temperature control data, wherein the temperature control data has one or more temperature control patterns associated with bonding conditions for bonding electronic components to a substrate, and the computer of the control unit is instructed to read one of the one or more temperature control patterns according to the bonding conditions, and to control the set temperature of the heater from the read temperature control pattern. [Effects of the Invention]

[0009] The present invention provides a bonding apparatus, a bonding method, and a bonding control program that enable high-precision bonding associated with bonding conditions. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows an example of the configuration of a bonding apparatus 1 according to one embodiment of the present disclosure. [Figure 2] This figure shows an example of the configuration of a bonding apparatus 1 according to one embodiment of the present disclosure. [Figure 3] This is a flowchart illustrating a heater temperature control method according to one exemplary embodiment. [Figure 4] This flowchart shows bonding according to one exemplary embodiment. [Figure 5A] This figure shows a temperature control signal output to a heater according to one exemplary embodiment. [Figure 5B] This figure shows a comparative example of a process window and a measurement pattern according to one exemplary embodiment. [Figure 6A]This figure shows a temperature control signal output to a heater according to another exemplary embodiment. [Figure 6B] This figure shows a comparative example of a process window and measurement pattern according to another exemplary embodiment. [Modes for carrying out the invention]

[0011] The present invention will be described below through embodiments, but the claims are not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential for solving the problem.

[0012] <Example of bonding equipment configuration> The following describes an example of the configuration of a bonding apparatus with reference to Figures 1 and 2. Figures 1 and 2 show an example of the configuration of a bonding apparatus 1 according to one embodiment of the present disclosure.

[0013] In one embodiment of the present invention, as shown in Figure 1, the temperature of the heater 22 is pre-adjusted in accordance with the bonding conditions (e.g., the type of electronic component 9), and as shown in Figure 2, bonding of the electronic component 9 to the substrate 8 is performed. The electronic component 9 is, for example, a semiconductor die. In this case, the semiconductor die has a certain thickness and has a surface on which an integrated circuit pattern is formed and a back surface opposite to that surface. Note that semiconductor dies differ in external dimensions, thickness, electrode configuration, etc., depending on their type, and the temperature and pressure changes required for bonding also differ. Therefore, in order to achieve suitable bonding, it is necessary to perform temperature adjustment and bonding in accordance with the bonding conditions. The bonding apparatus 1 described below can provide a bonding apparatus 1 that enables high-precision bonding corresponding to the type of electronic component 9 to be mounted on the substrate 8, for example.

[0014] The bonding apparatus 1 according to this disclosure comprises a bonding head 2, an input unit 3, a control unit 4, a storage unit 5, and a display unit 6.

[0015] The bonding head 2 is composed of an actuator 21, a heater 22, an adjustment tool AT or a pressure tool PT. The bonding head 2 can move in the z-axis direction (the vertical direction in FIGS. 1 and 2) and can be rotated around the z-axis. Further, the bonding head 2 may be attached to an XY mechanism that moves it in two axes in the x-axis direction (the left-right direction in FIG. 1) and the y-axis direction (the front-back depth direction in FIGS. 1 and 2), which are not shown, and may be rotated about each axis or pivoted about each axis.

[0016] The actuator 21 moves the bonding head 2 in the z-axis direction. As shown in FIGS. 1 and 2, the actuator 21 is attached with a heater 22 and an adjustment tool AT or a pressure tool PT, and is capable of driving the entire bonding head 2.

[0017] The heater 22 is heated or cooled based on temperature control from the control unit 4, and heats or dissipates heat from the adjustment tool AT or the pressure tool PT. The adjustment tool AT or the pressure tool PT is configured to be detachable from the tip of the heater 22. The heater 22 is heated or cooled by receiving a temperature control signal from the control unit 4. The heater 22 may include a heater circuit. For example, in the heater 22, it may be heated by receiving a temperature control signal in the heater circuit, or may be cooled by dissipating heat into the atmosphere. Note that the heater 22 may be attached to the actuator 21 via a heat insulating material.

[0018] The adjustment tool AT is heated or cooled by the heater 22. The adjustment tool AT may incorporate a temperature sensor. For example, the temperature of the adjustment tool AT is measured by the temperature sensor. Note that the temperature sensor (not shown) may be provided separately on the surface of the adjustment tool AT. Also, since the way of applying temperature or pressure varies depending on the type of the electronic component 9, a plurality of types of adjustment tools AT are prepared for each electronic component 9. That is, temperature control associated with the type of the electronic component 9 is performed using the adjustment tool AT selected from among the plurality of types of adjustment tools AT. Note that when it is possible to perform common temperature control for each type with respect to the plurality of types of electronic components 9, a common adjustment tool AT may be used, or different adjustment tools AT may be used respectively.

[0019] The pressurization tool PT is heated or cooled by the heater 22. The pressurization tool PT performs bonding of the electronic component 9 to the base material 8 in accordance with the drive of the bonding head 2. For example, the pressurization tool PT has a pressurization surface pf, and the pressurization surface pf performs pressurization and heating for a predetermined time while pressing the main surface 10 of the electronic component 9. Also, since the way of applying temperature or pressure varies depending on the type of the electronic component 9, a plurality of types of pressurization tools PT are prepared for each electronic component 9. That is, temperature control and pressure control associated with the type of the electronic component 9 are performed using the pressurization tool PT selected from among the plurality of types of pressurization tools PT. Note that when it is possible to perform common temperature control for each type with respect to the plurality of types of electronic components 9, a common pressurization tool PT may be used, or different pressurization tools PT may be used respectively.

[0020] The input unit 3 generates various input information in response to the input operation of the user, and transmits the generated input information to the control unit 4. The input unit 3 generates, for example, information for driving the bonding head 2 or information for temperature control of the heater 22. Also, the input unit 3 receives the input operation of data from the user, and may include, for example, various buttons, a mouse, a keyboard, and a touch panel.

[0021] The control unit 4 controls the bonding head 2. The control unit 4 is also communicated with the input unit 3, the storage unit 5, and the display unit 6. The control unit 4 performs different operation flows during heater temperature adjustment and during bonding execution. Details of each flow will be described later using Figures 3 and 4. The control unit 4 includes a drive control unit 41, a temperature control unit 42, and a temperature measuring unit 43.

[0022] The drive control unit 41 controls the overall drive of the bonding head 2, including its movement, position, and orientation. For example, the drive control unit 41 drives the bonding head 2 to move up and down when bonding is performed.

[0023] The temperature control unit 42 controls the temperature of the heater 22 and generates a temperature control pattern, which will be described later. When adjusting the heater temperature, the temperature control unit 42 compares the process window obtained from the memory unit 5 with the measurement pattern obtained from the temperature measurement unit 43 to generate a temperature control pattern. At this time, the measurement pattern obtained from the temperature measurement unit 43 is the feedback value obtained from the adjustment tool AT when the temperature control unit 42 controls the temperature of the heater 22. The generated temperature control pattern is stored in the memory unit 5, and when bonding is performed, the temperature control unit 42 retrieves this temperature control pattern from the memory unit 5 and controls the temperature of the heater 22 based on it.

[0024] The temperature measurement unit 43 generates a measurement pattern from the adjustment tool AT. As described above, the measurement pattern is a feedback value obtained from the adjustment tool AT by the temperature control unit 42 controlling the temperature of the heater 22, and may be, for example, data on the temperature change of the adjustment tool AT over a predetermined time. The temperature measurement unit 43 then supplies the generated measurement pattern to the temperature control unit 42.

[0025] The memory unit 5 stores multiple process windows and one or more temperature control patterns. The multiple process windows are data associated with each of the multiple types of electronic components 9 that have been pre-stored in the memory unit 5, and may be, for example, multiple data sets with defined time ranges and temperature ranges. The one or more temperature control patterns are data generated by the temperature control unit 42 for each of the multiple types of electronic components 9.

[0026] The display unit 6 receives and displays information obtained from the control unit 4 based on various input information entered in the input unit 3. For example, the display unit 6 displays information such as the position information of the tip of the bonding head 2, the process window, and the measurement pattern.

[0027] Figure 3 is a flowchart of a heater temperature adjustment method (hereinafter also referred to as "this adjustment method") according to one exemplary embodiment. This adjustment method shows an example of storing one or more temperature control patterns associated with bonding conditions for bonding an electronic component 9 to a substrate 8 in a storage unit 5. As shown in Figure 3, this adjustment method includes a step st11 for controlling the heater temperature, a step st12 for generating a measurement pattern, a step st13 for determining whether it is within the process window, a step st14 for generating a temperature control pattern, and a step st15 for storing the temperature control pattern. By repeatedly executing this adjustment method multiple times, multiple temperature control patterns associated with multiple types of pressure tools are generated. The processing in each step may be performed by the bonding apparatus 1 shown in Figure 1. The following explanation will use the case where this adjustment method is executed by the bonding apparatus 1 shown in Figure 1 as an example. Note that the type of pressure tool is an example of bonding conditions, and bonding conditions include differences in the chips and substrates that make up the electronic component, differences in other equipment configurations, differences in adhesives and solders used to join the chips and substrates, differences in joining conditions for joining the chips and substrates, etc.

[0028] <Bonding device for heater temperature adjustment> (Process st11: Heater temperature control) In step st11, the temperature control unit 42 controls the temperature of the heater 22 and heats or dissipates heat from the adjustment tool AT attached to the heater 22.

[0029] In step st11, the temperature control unit 42 in Figure 1 performs temperature control on the heater 22. The temperature control of the heater 22 may be performed, for example, by raising or lowering the temperature based on user input operations at the input unit 3.

[0030] (Step st12: Generate measurement pattern) In step st12, the temperature measurement unit 43 generates a measurement pattern from the time-dependent changes in temperature obtained from the adjustment tool AT.

[0031] In step st12, the temperature measurement unit 43 in Figure 1 generates a measurement pattern as a feedback value obtained from the adjustment tool AT by the temperature control unit 42 controlling the temperature of the heater 22. The measurement pattern is generated, for example, by dividing the time-dependent temperature changes obtained from the adjustment tool AT into predetermined time intervals in the temperature measurement unit 43.

[0032] (Step st13: Check if it fits within the process window) In step st13, the temperature control unit 42 determines whether the measurement pattern fits within the process window. Specifically, the temperature control unit 42 obtains the process window associated with the type of electronic component 9 from the storage unit 5 and determines whether the measurement pattern obtained from the temperature measurement unit 43 fits within that process window. If the measurement pattern does not fit within the process window, the process may be repeated from step st11. Steps st11 to st13 may be repeated multiple times until the measurement pattern fits within the process window. If the measurement pattern fits within the process window, the process proceeds to step st14.

[0033] In step st13, the temperature control unit 42 in Figure 1 obtains a process window associated with the type of electronic component 9 from the storage unit 5 and determines whether the measurement pattern obtained from the temperature measurement unit 43 falls within the process window. The determination of whether the measurement pattern falls within the process window may be displayed on the display unit 6. For example, if at least a portion of the measurement pattern does not fall within the temperature range of the process window, the user may input information in the input unit 3 to bring at least a portion of the measurement pattern within the temperature range of the process window and then execute the process again from step st11. Note that if a common temperature control can be applied, a common process window may be used for multiple types of electronic components 9.

[0034] (Step st14: Generate temperature control pattern) In step st14, the temperature control unit 42 generates a temperature control pattern based on the measurement pattern contained within the process window. That is, the temperature control unit 42 generates a temperature control pattern associated with the type of electronic component 9. If a common process window is used to generate temperature control patterns for multiple types of electronic components 9, a common temperature control pattern may be generated for all multiple types of electronic components 9.

[0035] (Process st15: Store temperature control pattern) In step st15, the temperature control pattern generated by the temperature control unit 42 is stored in the memory unit 5. The temperature control pattern is generated in association with the type of electronic component 9 and stored in the memory unit 6 in association with identification information that identifies the type of pressurizing tool PT, which will be described later. Note that a common temperature control pattern may be associated with multiple types of pressurizing tools PT.

[0036] From the above steps st11 to st15, a temperature control pattern associated with the type of electronic component 9 is generated and stored in the memory unit 5 in association with the pressurizing tool PT. This processing method is repeated multiple times to store the temperature control patterns associated with multiple types of electronic components 9 in the memory unit 5 in advance, and then the bonding process is initiated.

[0037] Figure 4 is a flowchart illustrating bonding according to one exemplary embodiment. The control unit 4 reads one of the temperature control patterns stored in the memory unit 5 according to the bonding conditions and performs bonding as shown in one example. As shown in Figure 4, bonding includes a step st21 for determining the type of pressurizing tool, a step st22 for reading the temperature control pattern, and a step st23 for performing bonding. One of the one or more temperature control patterns generated by this adjustment method is selected and bonding is performed. The processing in each step may be performed by the bonding apparatus 1 shown in Figure 2. The following explanation will use the case where bonding is performed by the bonding apparatus 1 shown in Figure 2 as an example. Note that the type of pressurizing tool is an example of bonding conditions, and bonding conditions include differences in the type of chip and substrate constituting the electronic component, differences in other device configurations, differences in adhesives and solders used to join the chip and substrate, and differences in joining conditions for joining the chip and substrate.

[0038] <Bonding equipment used during bonding> (Step st21: Determination of the type of pressurizing tool) In step st21, the temperature control unit 42 determines the type of pressurizing tool PT. Since the pressurizing tool PT is associated with the type of electronic component 9, determining the type of pressurizing tool PT makes it possible to determine the temperature control or pressure control suitable for the electronic component 9 to be mounted. In this case, the control unit 4 may determine the type of pressurizing tool PT by acquiring identification information of the pressurizing tool PT, or the user may visually confirm the type of electronic component 9 or pressurizing rule PT and input it as input information to the input unit 3 to determine the type of pressurizing tool PT attached to the bonding head 2.

[0039] (Process st22: Temperature control pattern reading) In step st22, the temperature control unit 42 reads a temperature control pattern from the storage unit 5. Specifically, the temperature control unit 42 reads one of the temperature control patterns associated with the pressurizing tool PT from one or more temperature control patterns associated with each type of pressurizing tool PT.

[0040] (Process st23: Bonding execution) In process st23, the control unit 4 controls the bonding head 2 to perform bonding.

[0041] Specifically, in process st23, the temperature control unit 42 in Figure 2 outputs a temperature control pattern read from the storage unit 5 to the heater 22 to perform temperature control. The temperature control unit 42 may perform temperature control of the heater 22 in response to the pressurization accompanying the raising and lowering movement of the bonding head 2. For example, the temperature control unit 42 may output a temperature control pattern to perform temperature control in synchronization with the drive control unit 41 driving the bonding head 2.

[0042] Furthermore, process st23 is performed with the electronic components 9 placed on the main surface of the substrate 8 which is positioned on the stage 7.

[0043] In step st23, the drive control unit 41 in Figure 2 drives the bonding head 2 down until the electronic component 9 is pressed against the substrate 8, and applies pressure and heat to the bonding head 2 for a predetermined time while the electronic component 9 is pressed against the substrate 8. At this time, for example, by applying pressure and heat for a predetermined time while the bonding head 2 is pressing the electronic component 9 against the substrate 8, the solder on the electronic component 9 melts, and the substrate 8 and the electronic component 9 are joined together.

[0044] Through the above steps st21 to st23, one or more temperature control patterns associated with the pressurizing tool PT are read from the storage unit 5, and bonding is performed in the bonding apparatus 1.

[0045] Figure 5A shows a temperature control signal output to a heater according to one exemplary embodiment. Figure 5B shows a comparative example of a process window and a measurement pattern according to one exemplary embodiment. The temperature control signal, measurement pattern, and process window shown in Figures 5A and 5B may be generated in the bonding apparatus 1 shown in Figure 1, respectively. Below, the operation of the bonding apparatus 1 in this adjustment method and each waveform will be explained with reference to Figures 1 and 3. The temperature control signal is a control waveform used by the temperature control unit 42 to control the temperature of the heater 22, and may be generated, for example, based on information input from the input unit 3.

[0046] Figure 5A shows the temperature control signal generated by the temperature control unit 42 in process st11. As shown in Figure 5A, the temperature control signal increases at a constant rate from time t10 to t11, increases again at a constant rate from time t12 to t13 after a constant current holding period from time t11 to t12, maintains a constant current value from time t13 to t14, and decreases at a constant rate from time t14 onward.

[0047] The temperature control signal shown in Figure 5A is generated by the temperature control unit 42 and supplied to the heater 22. The temperature control signal shown in Figure 5A may be generated by the temperature control unit 42 based on information input at the input unit 3, for example.

[0048] Figure 5B is a comparative example in which it is determined whether the measurement pattern generated in process st12 falls within the process window in process st13. As shown in Figure 5B, the measurement pattern falls within the process window. That is, the measurement pattern falls between the lower threshold temperature Tmpl and the upper threshold temperature Tmpu during the period from time t101 to t102.

[0049] The comparison between the measurement pattern shown in Figure 5B and the process window may be performed by the temperature control unit 42. For example, the comparison between the measurement pattern shown in Figure 5B and the process window may be performed by inputting the temperature control signal shown in Figure 5A to the heater 22, generating a feedback value as a measurement pattern in the temperature measurement unit 43, and displaying the comparison result with the process window acquired from the storage unit 5 on the display unit 6.

[0050] Based on the measurement pattern shown in Figure 5B, a temperature control pattern is generated in the temperature control unit 42 in process st14 and stored in the memory unit 5 in process st15.

[0051] Figure 6A shows a temperature control signal output to a heater according to another exemplary embodiment. Figure 6B shows a comparative example of a process window and measurement pattern according to another exemplary embodiment. The temperature control signal, measurement pattern, and process window shown in Figures 6A and 6B may be generated in the bonding apparatus 1 shown in Figure 1, respectively. Below, the operation of the bonding apparatus 1 in this adjustment method and each waveform will be explained with reference to Figures 1 and 3.

[0052] Figure 6A shows the temperature control signal generated by the temperature control unit 42 in process st11. As shown in Figure 6A, the temperature control signal increases at a constant rate from time t10 to t11, decreases again at a constant rate from time t12 to t13 after a constant current holding period from time t11 to t12, increases at a constant rate from time t14 to t15 after a constant current holding period from time t13 to t14, maintains a constant current value from time t15 to t16, and decreases at a constant rate from time t16 onward.

[0053] The temperature control signal shown in Figure 6A is generated by the temperature control unit 42 and supplied to the heater 22. The temperature control signal shown in Figure 6A may be generated by the temperature control unit 42 based on information input at the input unit 3, for example.

[0054] Figure 6B is a comparative example in which it is determined whether the measurement pattern generated in process st12 falls within the process window in process st13. As shown in Figure 6B, the measurement pattern falls within the process window. That is, the measurement pattern falls between the lower threshold temperature Tmpl and the upper threshold temperature Tmpu during the period from time t101 to t102.

[0055] The comparison between the measurement pattern shown in Figure 6B and the process window may be performed by the temperature control unit 42. For example, the comparison between the measurement pattern shown in Figure 6B and the process window may be performed by inputting the temperature control signal shown in Figure 6A to the heater 22, generating a feedback value as a measurement pattern in the temperature measurement unit 43, and displaying the comparison result with the process window acquired from the storage unit 5 on the display unit 6.

[0056] Based on the measurement pattern shown in Figure 6B, a temperature control pattern is generated in the temperature control unit 42 in process st14 and stored in the memory unit 5 in process st15.

[0057] As described above, in this adjustment method, as shown in Figures 5A and 5B, it is possible to keep the measurement pattern generated based on the temperature control signal within the process window. Specifically, by providing a constant current holding period at times t11 to t12 of the temperature control signal in Figure 5A, the measurement pattern in Figure 5B can be kept within the process window without exceeding the upper threshold temperature Tmpu at its rising edge.

[0058] Furthermore, as shown in Figures 6A and 6B, this adjustment method makes it possible to keep the measurement pattern generated based on the temperature control signal within the process window. Specifically, by providing a constant current holding period at times t11 to t12 in the temperature control signal in Figure 6A, the measurement pattern in Figure 6B does not exceed the upper threshold temperature Tmpu at its rise time, and by providing a constant current holding period at times t13 to t14, the measurement pattern in Figure 6B does not fall below the lower threshold temperature Tmpl at its rise time, thus keeping it within the process window.

[0059] Figures 5A and 5B, and 6A and 6B, are examples of waveforms obtained by applying this adjustment method to different types of electronic components 9. Specifically, Figures 5A and 5B, and 6A and 6B, each have different temperature control signals and different process windows. This adjustment method is not limited to these waveforms.

[0060] <Other examples of this embodiment> Embodiments of this disclosure can be modified in various ways without departing from the scope and spirit of this disclosure. For example, in this embodiment, the bonding head 2 is controlled using a common control unit 4 during heater temperature adjustment and bonding execution, but the bonding head may be controlled using different control units for each. That is, when applying this adjustment method, the heater temperature may be adjusted using a tester that has only the functions of a temperature control unit 42 and a temperature measuring unit 43.

[0061] Alternatively, for example, pressure patterns associated with each of several types of electronic components 9 may be stored in the memory unit 5, and when bonding is performed, the drive control unit 41 may retrieve the pressure pattern associated with the type of electronic component 9 from the memory unit 5 and drive the bonding head 2.

[0062] Furthermore, although this adjustment method was described as adjusting the temperature by heating the heater 22, the temperature of the heater 22 may actually be adjusted by preparing the electronic component 9 and the substrate 8 and performing bonding to them. For example, the bonding head 2 may be driven based on various control information input to the input unit 3 to perform bonding to the electronic component 9 and the substrate 8, and the temperature of the heater 22 may be controlled by the user visually checking the degree of bonding between the electronic component 9 and the substrate 8 and correcting the input information of the input unit 3.

[0063] For example, in this adjustment method, the temperature control unit 42 was described as generating a temperature control pattern by acquiring a process window from the storage unit 5 and a measurement pattern from the temperature measurement unit 43. However, the temperature control unit 42 may generate the temperature control pattern by acquiring the process window and measurement pattern from the storage unit 5. For example, the temperature measurement unit 43 may generate multiple measurement patterns and store them in the storage unit 5, and the temperature control unit 42 may acquire multiple measurement patterns and one selected from multiple process windows from the storage unit 5 to generate a temperature control pattern. [Explanation of symbols]

[0064] 1...Bonding device, 2...Bonding head, 21...Actuator, 22...Heater, 3...Input unit, 4...Control unit, 41...Control drive unit, 42...Temperature control unit, 43...Temperature measurement unit, 5...Storage unit, 6...Display unit, 7...Stage, 8...Substrate, 9...Electronic component, AT...Adjustment tool, PT...Pressure tool

Claims

1. A bonding apparatus for bonding electronic components to a substrate, A bonding head comprising a pressing tool for pressurizing the electronic component and a heater for heating the pressing tool, wherein the pressing tool is configured to be detachably attached to the heater, A storage unit that stores temperature control data showing the time change of the set temperature of the heater, A control unit that controls the set temperature of the heater based on the temperature control data, An adjustment tool that is interchangeable with the aforementioned pressurizing tool and is configured to be detachably attached to the heater, A temperature sensor for measuring the temperature of the adjustment tool and Equipped with, The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate. The control unit reads one of the one or more temperature control patterns according to the bonding conditions and controls the set temperature of the heater. The temperature control pattern is generated based on a measurement pattern showing the time change of the measured value from the temperature sensor when the control unit controls the set temperature of the heater. Bonding equipment.

2. (delete)

3. The bonding apparatus according to claim 1, wherein the storage unit stores the measurement pattern in association with the temperature control pattern.

4. The bonding apparatus according to claim 1, wherein the measurement pattern has temperature characteristics within a process window when bonding the electronic component to the substrate.

5. The bonding conditions include the type of pressure tool, The bonding apparatus according to claim 1, wherein, depending on the type of pressurizing tool, one of the one or more temperature control patterns is read out to control the set temperature of the heater.

6. The aforementioned electronic component is a semiconductor chip having a bump-forming surface with a plurality of bumps, The bonding apparatus according to any one of claims 1 to 4, wherein the pressurizing tool pressurizes the electronic component in a direction in which the bump-forming surface of the semiconductor chip faces the substrate.

7. A bonding head is provided, which includes a pressurizing tool for pressurizing electronic components and a heater for heating the pressurizing tool, wherein the pressurizing tool is configured to be detachable from the heater. Pressurizing the electronic component toward the substrate using the aforementioned pressurizing tool, The control unit reads temperature control data from the storage unit that shows the time change of the set temperature of the heater, and controls the set temperature of the heater based on the temperature control data, and Generating a temperature control pattern Includes, The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate. Controlling the set temperature of the heater includes reading one of the one or more temperature control patterns according to the bonding conditions and controlling the set temperature of the heater. Generating the aforementioned temperature control pattern is A replacement adjustment tool for the aforementioned pressurizing tool is attached to the heater. The temperature of the adjustment tool attached to the heater is measured by a temperature sensor. The control unit controls the set temperature of the heater to acquire a measurement pattern showing the time change of the measured value from the temperature sensor, and To generate the temperature control pattern based on the measurement pattern. Bonding methods including

8. (delete)

9. A bonding head comprising a pressurizing tool for pressurizing electronic components and a heater for heating the pressurizing tool, wherein the pressurizing tool is configured to be detachably attached to the heater, A storage unit that stores temperature control data showing the time change of the set temperature of the heater, A control unit that controls the set temperature of the heater based on the temperature control data, An adjustment tool that is interchangeable with the aforementioned pressurizing tool and is configured to be detachably attached to the heater, A temperature sensor for measuring the temperature of the adjustment tool and A bonding control program for controlling a bonding apparatus equipped with, The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate. The computer of the control unit, Depending on the bonding conditions, read out one of the one or more temperature control patterns. Controlling the set temperature of the heater from the temperature control pattern read out, and The temperature control pattern is generated based on a measurement pattern showing the time change of the measured value from the temperature sensor when the control unit controls the set temperature of the heater. A bonding control program that executes this.

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