Chip recovery system and chip recovery method

Abstract

To provide a cutting debris collection system, etc. with which it is possible to efficiently move the cutting debris of tape members in a main duct to the exit of the main duct.SOLUTION: A cutting debris collection system 1 comprises: a subduct 312 that accommodates the cutting debris of tape members ejected from a tape feeder that a component mounting device 3 has; a main duct 31 to which the subduct is connected and which has an opening that communicates with the subduct; a first cutting debris conveyance unit that is installed in the subduct and that moves cutting debris in the subduct to the main duct; a plurality of second cutting debris conveyance units that moves, to the exist of the main duct, the cutting debris having been moved from the subduct to the inside of the main duct through an opening; and a control unit 62 that controls the operation of the first cutting debris conveyance unit and the plurality of second cutting debris conveyance units. The control unit moves the cutting debris in the subduct to the main duct by the first cutting debris conveyance unit and then controls the plurality of second cutting debris conveyance units independently of each other so as to move the cutting debris to the exit of the main duct.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a chip collection system and a chip collection method for collecting chips of a tape member discharged from a tape feeder.

Background Art

[0002] Conventionally, in a component mounting device for mounting components on a substrate, a chip collection system that automatically collects chips of a tape member discharged from a tape feeder as a component supply unit is known (for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a chip collection system and a chip collection method that can efficiently move chips of a tape member in a main duct to the outlet of the main duct.

Means for Solving the Problems

[0005] A chip recovery system according to one aspect of the present disclosure includes: a subduct for receiving chips of tape material discharged from a tape feeder of a component mounting device; a main duct to which the subduct is connected and which has an opening communicating with the subduct; a first chip transport unit installed in the subduct for moving the chips in the subduct to the main duct; a plurality of second chip transport units for moving the chips that have been moved from the subduct to the main duct through the opening to the outlet of the main duct; and a control unit for controlling the operation of the first chip transport unit and the plurality of second chip transport units, wherein the control unit moves the chips in the subduct to the main duct by the first chip transport unit, and then moves the chips to the outlet of the main duct by independently controlling each of the plurality of second chip transport units.

[0006] A chip recovery method according to one aspect of the present disclosure is a chip recovery method in a chip recovery system comprising: a subduct for receiving chips of tape material discharged from a tape feeder provided by a component mounting device; a main duct to which the subduct is connected and which has an opening communicating with the subduct; a first chip transport unit installed in the subduct for moving the chips in the subduct to the main duct; and a plurality of second chip transport units for moving the chips that have been moved from the subduct to the main duct through the opening to the outlet of the main duct, wherein the first chip transport unit moves the chips in the subduct to the main duct, and the plurality of second chip transport units are each independently controlled to move the chips to the outlet of the main duct. [Effects of the Invention]

[0007] According to the chip recovery system and chip recovery method of this disclosure, chips from the tape material inside the main duct can be efficiently moved to the outlet of the main duct. [Brief explanation of the drawing]

[0008] [Figure 1]Figure 1 is a perspective view showing the chip recovery system according to Embodiment 1 together with the work line of the component mounting device. [Figure 2] Figure 2 is a side view of the component mounting device in Embodiment 1. [Figure 3] Figure 3 is a cross-sectional view of a part of the component mounting device and a part of the chip recovery system in Embodiment 1. [Figure 4] Figure 4 is a perspective view of the chip collection system in Embodiment 1. [Figure 5] Figure 5 shows an example of a schematic plan view of the chip recovery system in Embodiment 1. [Figure 6] Figure 6 is a perspective view illustrating the configuration of the recovery unit according to this embodiment. [Figure 7] Figure 7 is a cross-sectional view illustrating the configuration of the recovery unit according to this embodiment. [Figure 8] Figure 8 is a perspective view illustrating the configuration of the cover member. [Figure 9] Figure 9 is a diagram illustrating the function of the cover member. [Figure 10] Figure 10 shows an example of a control unit and the valve it controls in Embodiment 1. [Figure 11] Figure 11 is a diagram illustrating a first example of the operation of the chip recovery system according to Embodiment 1. [Figure 12] Figure 12 is a diagram illustrating a second example of the operation of the chip recovery system according to Embodiment 1. [Figure 13] Figure 13 is a diagram illustrating a third example of the operation of the chip recovery system according to this embodiment. [Figure 14] Figure 14 is a diagram showing a portion of the side view of the chip recovery system in Embodiment 2. [Figure 15] Figure 15 shows an example of a schematic plan view of the chip recovery system in Embodiment 2. [Figure 16] Figure 16 shows an example of a control unit and the valve it controls in Embodiment 2. [Figure 17] FIG. 17 is a diagram for explaining an example of the operation of the chip collection system according to Embodiment 2.

Embodiments for Carrying Out the Invention

[0009] (Knowledge on which the present disclosure is based) In Patent Document 1, the chips of the tape member cut by the tape cutter fall by their own weight and are received by the sub-duct (reception part). Then, they are moved to the main duct (recovery path) by the air blown out from the air blower installed in the sub-duct. And they are sent to the air outlet side of the main duct by the air discharged from the air blower provided in the main duct.

[0010] In the above conventional chip collection system, one air blower is provided on the most upstream side of the main duct. And by discharging air from that air blower with a large discharge force, the chips in the main duct are sent to the air outlet all at once.

[0011] However, the force by which the chips in the main duct are moved by the air discharged from the air blower weakens as it goes toward the outlet side of the main duct. For this reason, there is a problem that there is a risk that the chips cannot be sent to the outlet of the main duct when the main duct becomes a certain length.

[0012] The chip collection system according to the first aspect of the present disclosure includes a sub-duct that receives chips of a tape member discharged from a tape feeder included in a component mounting device, a main duct to which the sub-duct is connected and that has an opening communicating with the sub-duct, a first chip conveying unit installed in the sub-duct to move the chips in the sub-duct to the main duct, a plurality of second chip conveying units to move the chips moved from the sub-duct into the main duct through the opening to the outlet of the main duct, and a control unit that controls operations of the first chip conveying unit and the plurality of second chip conveying units. The control unit moves the chips in the sub-duct to the main duct by the first chip conveying unit, and then moves the chips to the outlet of the main duct by independently controlling the plurality of second chip conveying units respectively.

[0013] According to this, since the chips collected from the sub-duct to the main duct by the first chip conveying unit are moved to the outlet of the main duct by independently controlling the plurality of second chip conveying units respectively, the chips can be efficiently moved to the outlet of the main duct.

[0014] The chip collection system according to the second aspect of the present disclosure is the chip collection system according to the first aspect, wherein the first chip conveying unit moves the chips in the sub-duct to the main duct by blowing air toward the opening, and each of the plurality of second chip conveying units moves the chips in the main duct to the outlet of the main duct by blowing air toward the outlet of the main duct.

[0015] According to this, since the chips are moved by air, the chips can be moved without using a member for moving the chips. Therefore, the internal configuration of the sub-duct and the main duct can be simplified, the chips can be prevented from being caught by members other than the ducts, and the chips can be efficiently moved.

[0016] A third aspect of the present disclosure is a chip recovery system according to the first or second aspect, wherein the main duct has a plurality of divided regions arranged in series with respect to each other, and the plurality of second chip transport units are each installed in the plurality of divided regions.

[0017] According to this, the chips are moved by being distributed among multiple second chip transport units, allowing for efficient chip movement.

[0018] A chip recovery system according to a fourth aspect of the present disclosure is a chip recovery system according to a third aspect, wherein the control unit moves the chips in the subduct to the main duct using the first chip transport unit, and then moves the chips to the outlet of the main duct by sequentially operating the plurality of second chip transport units in order from furthest from the outlet of the main duct.

[0019] According to this design, the chips are relayed through multiple second chip transport units within the main duct, allowing for efficient chip movement.

[0020] A fifth aspect of the present disclosure is a chip recovery system according to a third or fourth aspect, wherein the control unit controls the operation of the plurality of second chip transport units such that the periods of operation of at least two second chip transport units, which are installed in at least two adjacent divided regions, overlap.

[0021] According to this, the two second chip transport units are controlled to operate simultaneously, so that the chips do not get stuck in the main duct and are moved, thereby shortening the chip movement time. Therefore, the chips in the main duct can be efficiently relayed and moved by multiple second chip transport units.

[0022] A chip recovery system according to a sixth aspect of the present disclosure is a chip recovery system according to any one of the first to fifth aspects, wherein the control unit controls the operation of the first chip transport unit and the plurality of second chip transport units such that the periods of operation in which the first chip transport unit and at least one of the plurality of second chip transport units move the chips overlap.

[0023] According to this, the first chip transport unit and one second chip transport unit are controlled to operate simultaneously, so that the chips do not get stuck near the connection point between the sub-duct and the main duct, and the chip transport time can be shortened. Therefore, the chips near the connection point between the sub-duct and the main duct can be efficiently relayed and moved by the first chip transport unit and the one second chip transport unit.

[0024] A seventh aspect of the present disclosure is a chip recovery system according to any one of the first to sixth aspects, further comprising a transport path for transporting the chips in the component mounting device, the transport path being connected to the subduct, and a third chip transport unit installed in the transport path for moving the chips in the transport path to the subduct, wherein the control unit controls the operation of the first chip transport unit and the third chip transport unit such that the periods of operation in which the first chip transport unit and the third chip transport unit move the chips overlap.

[0025] According to this, the third chip transport unit and the first chip transport unit are controlled to operate simultaneously, so that the chips do not get stuck near the connection point between the transport path and the subduct, and the chip transport time can be shortened. Therefore, the chips near the connection point between the transport path and the subduct can be efficiently relayed and moved by the third chip transport unit and the first chip transport unit.

[0026] An eighth aspect of the present disclosure is a chip recovery system according to a seventh aspect, wherein the third chip transport unit moves the chips in the transport path to the subduct by blowing air toward the outlet of the transport path.

[0027] Therefore, since the chips are moved by air, the chips can be moved without using any components specifically for moving the chips. As a result, the internal structure of the transport path can be simplified, preventing the chips from getting caught on components other than the transport path, and allowing the chips to be moved efficiently.

[0028] A chip recovery system according to a ninth aspect of the present disclosure is a chip recovery system according to any one of the first to eighth aspects, further comprising a recovery unit that receives the chips discharged from the outlet of the main duct, the recovery unit comprising a chip collection path and a fourth chip transport unit installed in the chip collection path and moving the chips to a container, the control unit operating the fourth chip transport unit during periods when the first chip transport unit and the plurality of second chip transport units are not operating.

[0029] Therefore, the chips collected in the collection unit can be moved to the container all at once, even when no new chips are being discharged into the collection unit. This makes it easy to control the amount of chips moved to the container.

[0030] A chip recovery system according to a tenth aspect of the present disclosure is a chip recovery system according to a ninth aspect, wherein the fourth chip transport unit moves the chips in the chip collection path to the container by blowing air toward the outlet of the chip collection path.

[0031] According to this method, since the chips are moved by air, the chips can be moved without using any components specifically for moving the chips. Therefore, the internal structure of the chip collection path can be simplified, preventing the chips from getting caught on components other than the chip collection path, and allowing the chips to be moved efficiently.

[0032] A chip recovery system according to an eleventh aspect of the present disclosure is a chip recovery system according to a second aspect, wherein the first chip transport unit and the plurality of second chip transport units receive air from a common supply source, and the control unit controls the operation of the first chip transport unit and the plurality of second chip transport units so that the number of the first chip transport unit and the plurality of second chip transport units operating simultaneously does not exceed a predetermined number.

[0033] Therefore, it is possible to prevent the air pressure from the supply source from dropping below a predetermined pressure. In other words, the air pressure can be kept above a certain level, allowing for efficient movement of the chips.

[0034] A chip recovery method according to a twelfth aspect of the present disclosure is a chip recovery method in a chip recovery system comprising: a subduct for receiving chips of tape material discharged from a tape feeder provided by a component mounting device; a main duct to which the subduct is connected and which has an opening communicating with the subduct; a first chip transport unit installed in the subduct for moving the chips in the subduct to the main duct; and a plurality of second chip transport units for moving the chips that have been moved from the subduct to the main duct through the opening to the outlet of the main duct, wherein the first chip transport unit moves the chips in the subduct to the main duct, and the plurality of second chip transport units are each independently controlled to move the chips to the outlet of the main duct.

[0035] According to this system, the chips collected from the sub-duct to the main duct by the first chip transport unit are moved to the outlet of the main duct by independently controlling multiple second chip transport units, thus efficiently moving the chips to the outlet of the main duct.

[0036] (Embodiment 1) Embodiments of the present invention will be described below with reference to the drawings.

[0037] Figure 1 shows a work line 2 in which the chip collection system 1 in this embodiment is installed. Work line 2 has a configuration in which multiple (in this case, three) component mounting devices 3a to 3c (hereinafter, each of the component mounting devices 3a to 3c will also be referred to as component mounting device 3) are arranged in one direction, and adjacent component mounting devices 3 pass the circuit board KB to each other and mount components on the circuit board KB. In this embodiment, the direction in which the circuit board KB is passed in work line 2 (left-right direction, in the direction in which the component mounting devices 3a to 3c are lined up) is the X direction, the horizontal direction (front-back direction) perpendicular to the X direction is the Y direction, and the up-down direction is the Z direction.

[0038] In Figure 2, the component mounting device 3 has a base 11 and a cover member 12 that covers the top of the base 11. Above the base 11, a workspace 13 is formed, which is covered by the cover member 12. A substrate transport unit 14 is installed on the upper surface of the base 11, extending in the X direction through the workspace 13. The substrate transport unit 14 consists of a pair of conveyor mechanisms aligned in the Y direction. The substrate transport unit 14 transports the substrate KB in the X direction and positions the substrate KB at a predetermined working position within the workspace 13.

[0039] In Figure 2, feeder trolleys 15 are attached to the front and rear ends of the base 11. Multiple tape feeders 16 are mounted on each feeder trolley 15 in a row in the X direction (see also Figure 1). Each tape feeder 16 takes in a carrier tape 18, which is a tape material unwound from a tape reel 17 held on the feeder trolley 15, and transports it in the Y direction (towards the substrate transport section 14), supplying the components BH stored on the carrier tape 18 to the component supply position 16K.

[0040] In Figure 2, two mounting heads 21 are provided above the base 11, movable by a head movement mechanism 22. Each mounting head 21 is equipped with a nozzle 21N extending downward. The head movement mechanism 22 consists of, for example, a Cartesian coordinate robot, which moves the two mounting heads 21 independently in a horizontal plane. Each mounting head 21 picks up the parts BH supplied by the tape feeder 16 to the part supply position 16K by attracting them to the lower end of the nozzle 21N (Figure 2).

[0041] In Figure 2, the component mounting device 3 is equipped with a control device 23. The control device 23 controls the operation of each component, such as the substrate transport unit 14, tape feeder 16, mounting head 21, and head movement mechanism 22.

[0042] When the component mounting device 3 performs component mounting work, it first operates the substrate transport unit 14 to receive the substrate KB from the upstream device and positions it at the work position. Once the component mounting device 3 has positioned the substrate KB at the work position, it operates the tape feeder 16 to supply components BH to the component supply position 16K, while simultaneously operating the head movement mechanism 22 to repeatedly perform component transfer operations on the mounting head 21. In the component transfer operation, the mounting head 21 picks up the component BH supplied by the tape feeder 16 and then mounts the component BH onto the substrate KB.

[0043] Each component mounting device 3 repeatedly performs component transfer operations using the mounting head 21 to mount the component BH to be mounted on the substrate KB. Once the component BH is mounted, the substrate transport unit 14 is activated to transport the substrate KB downstream. As a result, each of the three component mounting devices 3 mounts the component BH to the substrate KB, and once the component mounting device 3 located furthest downstream has transported the substrate KB, the component mounting operation on that substrate KB by the work line 2 is complete.

[0044] Next, the chip collection system 1 will be described. First, the cutting of the carrier tape 18 will be described. As shown in Figure 2, the feeder trolley 15 provided by each component mounting device 3 has a tape cutter 24 and a chute 25. The tape cutter 24 is located below the tape feeder 16 and cuts the carrier tape 18 after the tape feeder 16 has finished supplying the components BH. The chute 25 is located below the tape cutter 24, as also shown in Figure 3 (enlarged view of area RY in Figure 2). The chute 25 guides the chips KZ of the carrier tape 18 that fall by its own weight after being cut by the tape cutter 24, and discharges them to the outside of the feeder trolley 15 through the discharge opening 25K at its lower end.

[0045] As described above, chips KZ of the carrier tape 18 are generated from each component mounting device 3 that makes up the work line 2, and the total amount of chips KZ of the carrier tape 18 generated from the entire work line 2 is enormous. The chip collection system 1 in this embodiment facilitates the disposal of the chips KZ by automatically collecting the large amount of chips KZ of the carrier tape 18 generated from the work line 2 without manual labor.

[0046] In Figures 1, 4, and 5, the chip collection system 1 comprises two rows of main ducts 31, a number of sub-ducts 32, and a storage section 33. Each of the two rows of main ducts 31 extends in the direction of the extension of the work line 2 (X direction) below the work line 2 (more specifically below each of the multiple component mounting devices 3) and has an opening on the upstream side (one end) and the downstream side (the other end). Hereinafter, the air outlet in the main duct 31 will be referred to as outlet 31D.

[0047] In Figures 4 and 5, the main duct 31 is made up of multiple duct pieces 41 connected in series in one direction (the direction in which the component mounting device 3 is arranged, which is the X direction). As shown in Figure 3, the duct piece 41 has a hollow shape with a rectangular cross-section and is equipped with two pairs of walls facing each other in the Y direction and the Z direction.

[0048] In Figure 4, the main duct 31 is composed of two types of duct pieces 41: a main duct piece 41M and a sub-duct piece 41S, which is a duct piece for distance adjustment (adjustment duct piece). The main duct piece 41M has an opening 41K formed in one of two walls corresponding to the Y direction. Since the main duct 31 has multiple main duct pieces 41M, the main duct 31 has multiple openings 41K in the direction in which the main duct 31 extends (X direction).

[0049] In Figures 1, 2, and 4, the multiple subducts 32 are each installed on the floor surface FL below the feeder trolley 15, and each subduct 32 is connected to each of the two opposing walls (in the front and rear directions, Y direction) of the two rows of main ducts 31, so as to cover the opening 41K (see also Figure 5). The multiple subducts 32 consist of multiple subducts 32 facing the main duct 31 of the front row of the two rows of main ducts 31, and multiple subducts 32 facing the main duct 31 of the rear row. The multiple subducts 32 facing the main duct 31 of the front row are connected in a manner that communicates with the opening 41K provided in the front wall of the main duct 31 of the front row. Similarly, the multiple subducts 32 facing the main duct 31 of the rear row are connected in a manner that communicates with the opening 41K provided in the rear wall of the main duct 31 of the rear row.

[0050] As shown in Figure 5, the chips KZ discharged from the component mounting device 3a are received by four subducts 32a and moved to the main duct 31a to which the four subducts 32a are connected. Two of the four subducts 32a located on the front side receive the chips KZ discharged from one of the front feeder trolleys 15 of the component mounting device 3a. Two of the four subducts 32a located on the rear side receive the chips KZ discharged from one of the front feeder trolleys 15 of the component mounting device 3a. The four subducts 32a are subducts located below the component mounting device 3a, among a plurality of subducts 32. The main duct 31a is a part of the main duct 31, located below the component mounting device 3a. In other words, the main duct 31a is one of the multiple divided regions that make up the main duct 31, and is the divided region that corresponds to the region below the component mounting device 3a, among the multiple divided regions that are arranged in series with respect to each other.

[0051] Similarly, the chips KZ discharged from the component mounting device 3b are received by four subducts 32b located below the component mounting device 3b, which are part of the multiple subducts 32, and moved to the main duct 31b to which the four subducts 32b are connected. Two of the four subducts 32b located on the front side receive the chips KZ discharged from one of the front feeder trolleys 15 of the component mounting device 3b. Two of the four subducts 32b located on the rear side receive the chips KZ discharged from one of the front feeder trolleys 15 of the component mounting device 3b. The four subducts 32b are subducts located below the component mounting device 3b, which are part of the multiple subducts 32. The main duct 31b is part of the main duct 31, which is located below the component mounting device 3b. In other words, the main duct 31b is one of the multiple divided regions that make up the main duct 31, and is the divided region that corresponds to the region below the component mounting device 3b among the multiple divided regions that are arranged in series with respect to each other.

[0052] Similarly, the chips KZ discharged from the component mounting device 3c are received by four subducts 32c located below the component mounting device 3c, which are part of the multiple subducts 32, and moved to the main duct 31c to which the four subducts 32c are connected. Two of the four subducts 32c located on the front side receive the chips KZ discharged from one of the front feeder trolleys 15 of the component mounting device 3c. Two of the four subducts 32c located on the rear side receive the chips KZ discharged from one of the front feeder trolleys 15 of the component mounting device 3c. The four subducts 32c are subducts located below the component mounting device 3c, which are part of the multiple subducts 32. The main duct 31c is part of the main duct 31, which is located below the component mounting device 3c. In other words, the main duct 31c is one of the multiple divided regions that make up the main duct 31, and is the divided region that corresponds to the region below the component mounting device 3c among the multiple divided regions that are arranged in series with respect to each other.

[0053] Furthermore, as shown in Figure 3, the upper wall of each subduct 32 is provided with an opening 32K that opens upward (towards the tape feeder 16). The subduct 32 receives the chips KZ of the carrier tape 18 (i.e., chips KZ discharged from the tape feeder 16) that fall by their own weight through the corresponding chute 25 located directly above it, via the opening 32K.

[0054] In Figures 3 and 5, an air blower 51 is provided inside each sub-duct 32. The air blower 51 consists of, for example, a pipe-shaped member extending in the X direction and has a plurality of air outlets 51N arranged in the X direction. As shown in Figure 3, each air outlet 51N opens toward the opening 41K of the main duct 31. As a result, each air blower 51 can blow air toward the opening 41K of the main duct 31, thereby moving the chips inside the sub-duct 32 into the main duct 31. The air blower 51 is an example of a first chip transport unit.

[0055] Each of the multiple subducts 32 is equipped with one air blower 51. Each of the four subducts 32a located at the bottom of the component mounting device 3a is equipped with four air blowers 51a. Each of the four subducts 32b located at the bottom of the component mounting device 3b is equipped with four air blowers 51b. Each of the four subducts 32c located at the bottom of the component mounting device 3c is equipped with four air blowers 51c.

[0056] In Figure 4, the multiple air blowers 51 located in front of the main duct 31 and arranged in the X direction are each connected to a first air supply passage 52A that extends in the X direction in front of the main duct 31. Furthermore, the multiple air blowers 51 located in rear of the main duct 31 and arranged in the X direction are each connected to a second air supply passage 52B that extends in the X direction behind the main duct 31.

[0057] In Figures 3 and 5, a shutter 53 is provided on the wall of the main duct piece 41M that constitutes the main duct 31, for opening and closing an opening 41K. The shutter 53 is made up of a rectangular flat plate-shaped member, and its upper edge is supported by the main duct 31. Specifically, the upper edge of the shutter 53 is attached to the upper wall of the main duct 31 by a hinge whose axis is oriented in the X direction (left-right direction). As a result, the shutter 53 can swing freely in the vertical plane (YZ plane) with the hinge as the pivot point.

[0058] In Figure 4, the first air supply passage 52A located in front of the main duct 31 and the second air supply passage 52B located behind the main duct 31 are each connected to a control valve 61. The control valve 61 is connected to an air source (supply source) which is not shown.

[0059] The operation of the control valve 61 is controlled by the control unit 62 (Figure 4), which supplies air generated by the air source to the first air supply passage 52A or the second air supply passage 52B. When air is supplied to the first air supply passage 52A by the control valve 61, air is blown out from each of the air blowers 51 located in the sub-ducts 32 that are located on the front side of the multiple sub-ducts 32. When air is supplied to the second air supply passage 52B by the control valve 61, air is blown out from each of the air blowers 51 located in the sub-ducts 32 that are located on the rear side of the multiple sub-ducts 32.

[0060] Furthermore, each of the multiple air blowers 51 is provided with a valve 63 (for example, a solenoid valve or an electric valve) that controls the on / off switching of air blowing from the air blower 51 by opening and closing it. As shown in Figure 10, the opening and closing of the multiple valves 63 corresponding to each of the multiple air blowers 51 is controlled by the control unit 62.

[0061] The control unit 62 may consist, for example, a processor that executes a program and a memory (non-volatile memory) that stores the program. The control unit 62 may also consist, for example, a dedicated circuit.

[0062] When no air is being blown from the air blower 51, the shutter 53 hangs down due to its own weight and is in the closed position. When air is blown from the air blower 51 from this state, the shutter 53 is pushed by the air to the open position, and the chips KZ in the sub-duct 32 move from the opening 41K into the main duct 31. When the air blower 51 stops blowing air, the shutter 53 returns to its hanging position due to its own weight and returns to the closed position.

[0063] In this embodiment, the shutter 53 is provided to swing freely in a vertical plane (in this case, in the YZ plane), and is in a closed position that closes the opening 41K when the air blower 51 is not blowing air, and is in an open position that opens the opening 41K when the air blower 51 is blowing air, pushed by the air blown by the air blower 51.

[0064] In Figures 4 and 5, multiple air blowers 71 are provided inside the main duct 31. These multiple air blowers 71 are arranged in series in the direction in which the main duct 31 extends. Furthermore, a shutter 72, having the same configuration as the shutter 53, is provided downstream of each of the multiple air blowers 71 in the main duct 31. In this embodiment, the air blowers 71 are provided inside the sub-duct piece 41S (i.e., between the two main duct units). The multiple air blowers 71 move the chips KZ that have been moved from each sub-duct 32 into the main duct 31 through the opening 41K to the outlet 31D of the main duct 31. Specifically, each of the multiple air blowers 71 moves the chips KZ inside the main duct to the outlet 31D of the main duct 31 by blowing air toward the outlet 31D of the main duct 31. The multiple air blowers 71 are an example of multiple second chip transport units.

[0065] In this embodiment, the air blowers 71 are provided in positions that divide each main duct unit, that is, in pairs (one or more) of openings 41K (Figure 5). In other words, each of the multiple air blowers 71 is installed in a plurality of divided regions of the main duct 31, with one air blower 71 placed in each of the plurality of divided regions. For example, an air blower 71a is placed in the main duct 31a located below the component mounting device 3a of the main duct 31, an air blower 71b is placed in the main duct 31b located below the component mounting device 3b of the main duct 31, and an air blower 71c is placed in the main duct 31c located below the component mounting device 3c of the main duct 31.

[0066] In Figure 4, multiple air blowers 71 are connected to an air supply pipe 71T (Figure 4) extending in the X direction, and the air supply pipe 71T is connected to a control valve 61. When the control unit 62 controls the control valve 61 and supplies air to each air blower 71 through the air supply pipe 71T, air is blown out from that air blower 71.

[0067] Furthermore, each of the multiple air blowers 71 is provided with a valve 64 (solenoid valve or motorized valve) that controls the on / off switching of air blowing from the air blower 71 by opening and closing it. As shown in Figure 10, the opening and closing of the multiple valves 64 corresponding to each of the multiple air blowers 71 is controlled by the control unit 62.

[0068] The outlet 31D of the main duct 31 is connected to the recovery unit 80. The recovery unit 80 receives the chips KZ discharged from the outlet 31D of the main duct 31.

[0069] Figure 6 is a perspective view illustrating the configuration of the recovery unit according to this embodiment. Figure 7 is a cross-sectional view illustrating the configuration of the recovery unit according to this embodiment. Figure 7 is a cross-sectional view obtained by cutting the recovery unit near its center in the X direction in the YZ plane.

[0070] The collection unit 80 includes a chip collection path 81, a chute 82, a container 83, and a cover member 84.

[0071] The chip collection path 81 collects chips KZ from the outlet 31D of the main duct 31 and forms a space for dropping the chips KZ that have moved in the direction of travel. The chip collection path 81 extends in a direction (Y direction) that intersects the direction (X direction) in which the main duct 31 extends. The chip collection path 81 has a passage section 81a located on the upstream side of the direction in which the chips KZ move, and a chip rising and dropping section 81b located on the downstream side. The passage section 81a has openings 81Ka and 81Kb connected to the main duct 31 and has a hollow shape with a rectangular cross-section. The passage section 81a extends in the Y direction (horizontal direction). The main duct 31 is connected in a state of communication with the openings 81Ka and 81Kb provided in the wall of the passage section 81a. The main duct 31 is connected to the passage section 81a so as to cover the openings 81Ka and 81Kb. The chip lifting and dropping section 81b, located downstream of the passage section 81a, is positioned to extend diagonally upward along the Y direction. The chip lifting and dropping section 81b is the part that lifts and drops the chips KZ collected in the passage section 81a. The chip lifting and dropping section 81b is connected to the chute 82 in a continuous state. Specifically, the opening 81Kc provided on the lower surface of the downstream end of the chip lifting and dropping section 81b is connected to the opening 82Ka of the chute 82 so as to face it.

[0072] Here, multiple air blowers 91 are arranged in the chip collection path 81 along the direction of travel of the chips KZ. The multiple air blowers 91 are positioned within the chip collection path 81 and move the chips KZ to the container 83. The multiple air blowers 91 move the chips in the chip collection path 81 to the container 83 by blowing air toward the outlet of the chip collection path 81. In other words, the multiple air blowers 91 move the chips KZ in the chip collection path in the direction of travel using air. One of the multiple air blowers 91, the air blower 91a positioned in the passage section 81a, moves the chips KZ received from the main duct 31 in the passage section 81a to the chip rising and dropping section 81b. Furthermore, one of the multiple air blowers 91, located in the chip lifting and dropping section 81b, moves the chips KZ that have been moved to the chip lifting and dropping section 81b to the opening 81Kc and drops them from the opening 81Kc toward the chute 82. The multiple air blowers 91 are an example of the fourth chip transport section.

[0073] Furthermore, each of the multiple air blowers 91 is provided with a valve 65 (solenoid valve or motorized valve) that controls the on / off switching of air blowing from the air blower 91 by opening and closing it. As shown in Figure 10, the opening and closing of the multiple valves 65 corresponding to each of the multiple air blowers 91 is controlled by the control unit 62.

[0074] The chute 82 is a cylindrical member with a rectangular cross-section that allows chips KZ falling from the chip collection path 81 (i.e., moving in the Z direction) to pass through. The chute 82 is positioned along the Z direction. In other words, the chute 82 has a space that penetrates in the Z direction.

[0075] The container 83 is positioned below the chute 82 and contains the chips KZ that have passed through the chute 82. For example, the container 83 is a box-shaped member with an open top. The container 83 may be provided with wheels 83a to facilitate its movement on the floor surface FL.

[0076] The cover member 84 is positioned to extend the exit of the chute 82 and is flexible. The cover member 84 is, for example, a sheet-like material. As shown in Figure 8, the cover member 84 is positioned around the periphery of the exit of the chute 82. The cover member 84 is positioned on all four sides of the exit of the chute 82, which has a rectangular cross-section. The cover member 84 also has a slit 84a extending in the Z direction (vertical direction). It may also consist of four sheet-like materials positioned on each side of the exit of the chute 82. Figure 8 is a perspective view illustrating the configuration of the cover member.

[0077] Figure 9 is a diagram illustrating the function of the cover member.

[0078] As shown in Figure 9(a), when collecting chips KZ, the container 83 is positioned directly below the chute 82. At this time, the lower end of the cover member 84 is positioned inside the container 83. This prevents the chips KZ that have fallen down the chute 82 from moving out of the container 83 through the gap between the chute 82 and the container 83.

[0079] Furthermore, when the collection of chips KZ is stopped, the container 83 is moved on the floor surface FL to collect the chips KZ accumulated in the container 83. At this time, since the cover member 84 is flexible, it does not hinder the movement of the container 83 as shown in Figure 9(b). The same applies when returning the container 83 to its original position on the chute 82, as shown in Figure 9(c). In other words, it is possible to achieve both the movement of the container 83 and the suppression of chips KZ that have fallen from the chute 82 moving out of the container 83 from between the chute 82 and the container 83.

[0080] Figure 10 shows an example of a control unit and the valve it controls in this embodiment.

[0081] As described above, the control unit 62 controls the on / off operation of the air blower 51 corresponding to each valve 63 by controlling the opening and closing of each valve 63. The control unit 62 also controls the on / off operation of the air blower 71 corresponding to each valve 64 by controlling the opening and closing of each valve 64. In other words, the control unit 62 controls the operation of the air blowers 51 and 71. Furthermore, the control unit 62 may control the on / off operation of the air blower 91 corresponding to each valve 65 by controlling the opening and closing of each valve 65. In other words, the control unit 62 further controls the operation of the air blower 91.

[0082] The control unit 62 moves the chips KZ in the sub-duct 32 to the main duct 31 using multiple air blowers 51, and then moves the chips KZ to the outlet 31D of the main duct 31 by independently controlling each of the multiple air blowers 71. Specifically, the operation of each of the multiple air blowers 71 is independently controlled so that the amount of chips KZ moved per unit time by each of the multiple air blowers 71 does not exceed a predetermined amount. This suppresses the difficulty of moving the chips KZ within the main duct 31 and allows for efficient movement of the chips KZ.

[0083] Figure 11 is a diagram illustrating a first example of the operation of the chip recovery system according to this embodiment.

[0084] First, the control unit 62 operates the multiple air blowers 51 over periods P1 and P2. In other words, the control unit 62 turns on the air blowers 51 (multiple air blowers 51a to 51c) during periods P1 and P2 to move the chips KZ in the multiple sub-ducts 32 to the main duct 31.

[0085] Next, the control unit 62 moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating the multiple air blowers 71 in the main duct 31 in order from furthest from the outlet 31D of the main duct 31. Specifically, the control unit 62 operates the air blower 71a located in the main duct 31a over periods P3 and P4. In other words, the control unit 62 turns on the air blower 71a during periods P3 and P4 to move the chips KZ in the main duct 31a to the main duct 31b.

[0086] Furthermore, the control unit 62 operates the air blower 71b over periods P4 and P5. In other words, the control unit 62 turns on the air blower 71b during periods P4 and P5 to move the chips KZ in the main duct 31b to the main duct 31c. The air blower 71b operates simultaneously with the air blower 71a during period P4, which overlaps with that of the air blower 71a. In this way, the air blowers 71a and 71b, installed in the two adjacent divided regions of the main ducts 31a and 31b, are controlled by the control unit 62 so that the periods of operation for moving the chips KZ overlap.

[0087] Furthermore, the control unit 62 operates the air blower 71c over periods P5 and P6. In other words, the control unit 62 turns on the air blower 71c during periods P5 and P6 to move the chips KZ in the main duct 31c to the outlet 31D of the main duct 31. The air blower 71c operates simultaneously with the air blower 71b during period P5, which overlaps with that of the air blower 71b. In this way, the air blowers 71b and 71c, installed in the two adjacent divided regions of the main ducts 31b and 31c, are controlled by the control unit 62 so that the periods of operation for moving the chips KZ overlap.

[0088] Furthermore, the control unit 62 operates the air blower 91a over periods P6 and P7. In other words, the control unit 62 turns on the air blower 91a during periods P6 and P7 to move the chips KZ in the passage section 81a to the chip lifting and dropping section 81b. The air blower 91a operates simultaneously with the air blower 71c during period P6, which overlaps with that of the air blower 71c. In this way, the air blowers 71b and 71c, installed in the two adjacent divided sections of the main ducts 31b and 31c, are controlled by the control unit 62 so that the periods of operation for moving the chips KZ overlap.

[0089] Figure 12 is a diagram illustrating a second example of the operation of the chip recovery system according to this embodiment.

[0090] In comparison with the first example, the second example differs in that the control unit 62 controls the air blower 71a to operate simultaneously with the multiple air blowers 51 during the overlapping period P2. Also, as a result of advancing the timing of operation of the air blower 71a to operate during period P2 as described above, the operating period of air blowers 71a-71c, 91a, and 91b extends from period P2 to period P7. Other operations are the same as in the first example.

[0091] Figure 13 is a diagram illustrating a third example of the operation of the chip recovery system according to this embodiment.

[0092] In comparison with the first example, the third example differs in that the control unit 62 operates the air blowers 91a and 91b during the period P7 to P9 when the multiple air blowers 51a to 51c and the multiple air blowers 71a to 71c are not operating. In other words, the control unit 62 operates the air blower 91a during the period P7 to P9 when the multiple air blowers 51a to 51c and the multiple air blowers 71a to 71c are not operating.

[0093] The chip recovery system 1 according to this embodiment comprises a sub-duct 32, a main duct 31, an air blower 51 (first chip transport unit), a plurality of air blowers 71 (second chip transport unit), and a control unit 62. The sub-duct 32 receives chips KZ of the carrier tape 18 (tape member) discharged from the tape feeder 16 of the component mounting device 3. The main duct 31 is connected to the sub-duct 32 and has an opening 31K that communicates with the sub-duct 32. The air blower 51 is installed inside the sub-duct 32 and moves the chips KZ inside the sub-duct 32 into the main duct 31. The plurality of air blowers 71 move the chips KZ that have been moved from the sub-duct 32 into the main duct 31 through the opening 31K to the outlet 31D of the main duct 31. The control unit 62 controls the operation of the air blower 51 and the plurality of air blowers 71. The control unit 62 moves the chips KZ in the sub-duct 32 to the main duct 31 using the air blower 51, and then moves the chips KZ to the outlet of the main duct 31 by independently controlling each of the multiple air blowers 71.

[0094] According to this, the chips KZ collected from the sub-duct 32 to the main duct 31 by the air blower 51 are moved to the outlet of the main duct 31 by independently controlling each of the multiple air blowers 71, thus efficiently moving the chips KZ to the outlet 31D of the main duct 31.

[0095] Furthermore, in the chip recovery system 1 according to this embodiment, the air blower 51 blows air toward the opening 31K to move the chips KZ in the sub-duct 32 to the main duct 31. Each of the multiple air blowers 51 blows air toward the outlet 31D of the main duct 31 to move the chips KZ in the main duct 31 to the outlet 31D of the main duct 31.

[0096] According to this, since the chips KZ are moved by air, the chips KZ can be moved without using any components to move the chips KZ. Therefore, the internal configuration of the subduct 32 and the main duct 31 can be simplified, preventing the chips KZ from getting caught on components other than the ducts, and allowing the chips KZ to be moved efficiently.

[0097] Furthermore, in the chip recovery system 1 according to this embodiment, the main duct 31 has a plurality of divided regions arranged in series with respect to each other. The plurality of air blowers 71 are each installed in the plurality of divided regions. As a result, the chips KZ are moved by being shared among the plurality of air blowers 71, so the chips KZ can be moved efficiently.

[0098] Furthermore, in the chip recovery system 1 according to this embodiment, the control unit 62 moves the chips KZ in the sub-duct 32 to the main duct 31 using the air blower 51, and then moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating a plurality of air blowers 71 in order from furthest from the outlet 31D of the main duct 31. As a result, the chips KZ are moved through the main duct 31 by relaying them with a plurality of air blowers 71, so the chips KZ can be moved efficiently.

[0099] Furthermore, in the chip recovery system 1 according to this embodiment, the control unit 62 controls the operation of the multiple air blowers 71 such that the periods of operation in which at least two air blowers 71 (for example, air blowers 71a and 71b, or air blowers 71b and 71c) that are installed in at least two adjacent divided regions move the chips KZ overlap.

[0100] According to this, by controlling the two air blowers 71 (for example, air blowers 71a and 71b, or air blowers 71b and 71c) to operate simultaneously, the chips KZ can be moved without getting stuck in the main duct 31, and the travel time of the chips KZ can be shortened. Therefore, the chips KZ in the main duct 31 can be efficiently relayed and moved by multiple air blowers 71.

[0101] Furthermore, in the chip recovery system 1 according to this embodiment, the control unit 62 controls the operation of the air blower 51 and the multiple air blowers 71 such that the periods in which the air blower 51 and at least one of the multiple air blowers 71 move the chips KZ overlap.

[0102] According to this, the air blower 51 and one air blower 71a are controlled to operate simultaneously, so that the chips KZ can be moved without getting stuck near the connection point between the subduct 32a and the main duct 31a, and the travel time of the chips KZ can be shortened. Therefore, the chips KZ near the connection point between the subduct 32a and the main duct 31a can be efficiently relayed and moved by the air blower 51 and the one air blower 71a.

[0103] Furthermore, the chip recovery system 1 according to this embodiment further includes a recovery unit 80. The recovery unit 80 receives chips KZ discharged from the outlet 31D of the main duct 31. The recovery unit 80 has a chip collection path 81 and an air blower 91 (fourth chip transport unit) installed in the chip collection path 81 that moves the chips KZ to a container 83. The control unit 62 operates the air blower 91 when the air blower 51 and the multiple air blowers 71 are not operating. Therefore, even when there are no new chips KZ discharged to the recovery unit 80, the chips KZ collected in the recovery unit 80 can be moved to the container 83 all at once. Thus, it is possible to easily control the amount of chips moved to the container 83.

[0104] Furthermore, in the chip collection system 1 according to this embodiment, the air blower 91 blows air toward the outlet of the chip collection passage 81, thereby moving the chips KZ in the chip collection passage 81 to the container 83. As a result, since the chips KZ are moved by air, the chips KZ can be moved without using any components to move the chips KZ. Therefore, the internal structure of the chip collection passage 81 can be simplified, preventing the chips KZ from getting caught on components other than the chip collection passage, and allowing the chips KZ to be moved efficiently.

[0105] Furthermore, in the chip recovery system 1 according to this embodiment, the air blowers 51, 71, and 91 receive air from a common supply source. The control unit 62 controls the operation of the air blowers 51, 71, and 91 so that the number of air blowers operating simultaneously does not exceed a predetermined number. This prevents the air pressure from the supply source from falling below a predetermined pressure. In other words, the air pressure can be kept above a certain level, allowing the chips KZ to be moved efficiently.

[0106] The chip collection system 1 according to this embodiment comprises a chip collection path 81, a chute 82, and a container 83. The chip collection path 81 collects chips KZ from the carrier tape 18 (tape member) discharged from the tape feeder 16 of the component mounting device 3, and drops the chips KZ that have been moved in the direction of travel. The chute 82 allows the chips KZ that have fallen from the chip collection path 81 to pass through. The container 83 is installed below the chute 82 and contains the chips KZ that have passed through the chute 82. The chip collection path 81 has an air blower 91 that moves the chips KZ in the direction of travel using air.

[0107] According to this, in the chip collection path 81, the chips KZ are moved to the chute 82 by air, so that the chips KZ do not become resistance to the power source (air blower 91 in this embodiment) for moving the chips KZ. Therefore, the chips KZ of the carrier tape 18 can be efficiently collected into the container 83 that holds the chips KZ.

[0108] Furthermore, in the chip recovery system 1 according to this embodiment, the chip collection path 81 has a chip lifting and dropping section 81b that lifts the collected chips KZ before dropping them.

[0109] According to this, in the chip collection path 81, the chips KZ are raised by air to the entrance of the chute 82 and then dropped at the exit of the chip collection path 81, thus suppressing the chips KZ from becoming a resistance to the power source for moving the chips KZ. Therefore, the chips KZ from the carrier tape 18 can be efficiently collected into the container 83 that holds the chips KZ.

[0110] Furthermore, the chip recovery system 1 according to this embodiment also includes a cover member 84. The cover member 84 is positioned to extend the outlet of the chute 82 and is flexible.

[0111] Therefore, the cover member 84 can prevent the chips KZ discharged from the outlet of the chute 82 from moving out of the container 83 from between the chute 82 and the container 83. In other words, the cover member 84 can guide the chips KZ into the container 83. The chips KZ from the carrier tape 18 can be efficiently collected into the container 83 that contains the chips KZ. Furthermore, because the cover member 84 is flexible, even if the container 83 is moved horizontally and interferes with the cover member 84, the cover member 84 will flex to avoid the container 83, allowing the container 83 to be moved easily. In other words, it is possible to achieve both the movement of the container 83 and the suppression of chips that have fallen from the chute 82 moving out of the container 83 from between the chute 82 and the container 83.

[0112] Furthermore, in the chip recovery system 1 according to this embodiment, the cover member 84 is positioned around the periphery of the exit of the chute 82. Therefore, the cover member 84 can prevent the chips KZ that have fallen through the chute 82 from moving out of the container 83 from between the chute 82 and the container 83.

[0113] Furthermore, in the chip collection system 1 according to this embodiment, the cover member 84 has a slit extending along the vertical direction. Therefore, even if the container 83 is moved horizontally and interferes with the cover member, the cover member can bend more easily to avoid the container, making it easier to move the container.

[0114] Furthermore, the chip collection system 1 according to this embodiment further comprises a subduct 32, a main duct 31, an air blower 51 (first air blower), and an air blower 71 (second air blower). The subduct 32 receives the chips KZ discharged from the tape feeder 16. The main duct 31 is connected to the subduct 32 and has an opening 31K that communicates with the subduct 32. The air blower 51 is installed inside the subduct 32 and blows air toward the opening 31K to move the chips KZ inside the subduct 32 into the main duct 31. The air blower 71 blows air toward the outlet 31D of the main duct 31 to move the chips KZ that have been moved from the subduct 32 into the main duct 31 through the opening 31K to the outlet 31D of the main duct 31. The chip collection path 81 collects the chips KZ discharged from the outlet 31D of the main duct 31.

[0115] According to this, since the chips KZ are moved by air in the subduct 32 and main duct 31 up to the chip collection path 81, the chips KZ can be efficiently collected up to the chip collection path 81. Therefore, the chips KZ from the carrier tape 18 can be efficiently collected into the container 83 that holds the chips KZ.

[0116] Furthermore, in the chip collection system 1 according to this embodiment, the chip collection path 81 extends in a direction intersecting the direction in which the main duct 31 extends. Therefore, multiple main ducts 31 can be easily connected to the chip collection path 81, and chips KZ can be efficiently collected into the chip collection path 81.

[0117] (Embodiment 2) Figure 14 is a diagram showing a portion of the side view of the chip recovery system in Embodiment 2.

[0118] The chip recovery system 1A according to Embodiment 2 may further include a transport path 100 for further recovering chips KZ (i.e., chips KZ of the cover tape of the carrier tape 18) from the component mounting device 3, as shown in Figure 14. The transport path 100 is provided with a trolley-side duct 101 that further communicates with the upstream side of the subduct 32. A trolley-side duct 101 is provided for each tape feeder 16. Therefore, a trolley-side duct 101 is provided for each of the multiple subducts 32. The trolley-side duct 101 is provided with an air blower 110 that moves the chips KZ of the cover tape contained in the trolley-side duct 101 to the subduct 32. The air blower 110 is an example of a third chip transport unit.

[0119] Figure 15 shows an example of a schematic plan view of the chip recovery system in Embodiment 2.

[0120] As shown in Figure 15, the chips KZ of the cover tape discharged from the component mounting device 3a are received by the four trolley-side ducts 101a and moved to the four sub-ducts 32a. In addition, the chips KZ moved from the four trolley-side ducts 101a by the air blower 110a, and the chips KZ of the carrier tape 18 discharged from the component mounting device 3a are received by the four sub-ducts 32a and moved to the main duct 31a to which the four sub-ducts 32a are connected.

[0121] Similarly, the chips KZ of the cover tape discharged from the component mounting device 3b are received by the four trolley-side ducts 101b and moved to the four sub-ducts 32b. In addition, the chips KZ moved from the four trolley-side ducts 101b by the air blower 110b, and the chips KZ of the carrier tape 18 discharged from the component mounting device 3b are received by the four sub-ducts 32b and moved to the main duct 31b to which the four sub-ducts 32b are connected.

[0122] Similarly, the chips KZ of the cover tape discharged from the component mounting device 3c are received by the four trolley-side ducts 101c and moved to the four sub-ducts 32c. In addition, the chips KZ moved from the four trolley-side ducts 101c by the air blower 110c, and the chips KZ of the carrier tape 18 discharged from the component mounting device 3c are received by the four sub-ducts 32c and moved to the main duct 31c to which the four sub-ducts 32c are connected.

[0123] Figure 16 shows an example of a control unit and the valve it controls in Embodiment 2.

[0124] Each of the multiple air blowers 110 is provided with a valve 66 (solenoid valve or motorized valve) that controls the on / off switching of air blowing from the air blower 110 by opening and closing it. As shown in Figure 16, the opening and closing of the multiple valves 66 corresponding to each of the multiple air blowers 110 is controlled by the control unit 62.

[0125] As described above, the control unit 62 further controls the on / off switching of the air blower 110 corresponding to each valve 66 by controlling the opening and closing of each valve 66. In other words, the control unit 62 further controls the operation of the air blower 110.

[0126] Figure 17 is a diagram illustrating an example of the operation of the chip recovery system according to Embodiment 2.

[0127] First, the control unit 62 operates the air blower 110a over periods P1 and P2. In other words, the control unit 62 turns on the air blower 110a during periods P1 and P2 to move the chips KZ in the trolley-side duct 101a to the sub-duct 32a.

[0128] Furthermore, the control unit 62 operates the air blower 51a over periods P2 and P3. In other words, the control unit 62 turns on the air blower 51a during periods P2 and P3 to move the chips KZ in the sub-duct 32a to the main duct 31a. The control unit 62 controls the operation of the air blower 51a and the air blower 110a so that the periods during which the air blower 51a and the air blower 110a move the chips KZ overlap during period P2.

[0129] Furthermore, the control unit 62 moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating the air blowers 71 in order from furthest away from the outlet 31D of the main duct 31. Specifically, the control unit 62 operates the air blower 71a located in the main duct 31a over periods P3 and P4, the air blower 71b located in the main duct 31b over periods P4 and P5, and the air blower 71c located in the main duct 31c over periods P5 and P6.

[0130] Furthermore, the control unit 62 operates the air blower 91a over periods P7 and P8. In other words, the control unit 62 turns on the air blower 91a during periods P7 and P8 to move the chips KZ in the passage section 81a to the chip lifting and dropping section 81b. The control unit 62 also operates the air blower 91b over periods P8 and P9.

[0131] In this case, the control unit 62 operates the air blower 110b over periods P7 and P8. That is, the control unit 62 turns on the air blower 110b during periods P7 and P8 to move the chips KZ in the trolley-side duct 101b to the sub-duct 32b. Thus, the control unit 62 may operate the air blower 110b during the period when the air blower 91 is operating.

[0132] Furthermore, the control unit 62 operates the air blower 51b over periods P8 and P9. In other words, the control unit 62 turns on the air blower 51b during periods P8 and P9 to move the chips KZ in the subduct 32b to the main duct 31b. The control unit 62 controls the operation of the air blower 51b and the air blower 110b so that the periods during which the air blower 51b and the air blower 110b move the chips KZ overlap during period P8.

[0133] Furthermore, the control unit 62 moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating the air blowers 71 in order from furthest away from the outlet 31D of the main duct 31. In this case, since the chips KZ generated from the component mounting device 3a were transported during periods P1 to P8, the air blowers 71b are operated sequentially starting from 71b. Specifically, the control unit 62 operates the air blower 71b located in the main duct 31b over periods P9 and P10, and operates the air blower 71c located in the main duct 31c over periods P10 and P11.

[0134] Furthermore, the control unit 62 operates the air blower 91a over periods P12 and P13. In other words, the control unit 62 turns on the air blower 91a during periods P12 and P13 to move the chips KZ in the passage section 81a to the chip lifting and dropping section 81b. The control unit 62 also operates the air blower 91b over periods P13 and P14.

[0135] In this case, the control unit 62 operates the air blower 110c over periods P13 and P14. That is, the control unit 62 turns on the air blower 110c during periods P13 and P14 to move the chips KZ in the trolley-side duct 101c to the sub-duct 32c. Thus, the control unit 62 may operate the air blower 110c during the period when the air blower 91 is operating.

[0136] Furthermore, the control unit 62 operates the air blower 51c over periods P14 and P15. In other words, the control unit 62 turns on the air blower 51c during periods P14 and P15 to move the chips KZ in the sub-duct 32c to the main duct 31c. The control unit 62 controls the operation of the air blower 51c and the air blower 110c so that the periods during which the air blower 51c and the air blower 110c move the chips KZ overlap during period P14.

[0137] Furthermore, the control unit 62 moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating the air blowers 71 in order from furthest away from the outlet 31D of the main duct 31. In this case, since the chips KZ generated from the component mounting device 3b were transported during periods P7 to P14, the air blowers 71c are operated sequentially starting from 71c. Specifically, the control unit 62 operates the air blower 71c located in the main duct 31c over periods P15 and P16.

[0138] Furthermore, the control unit 62 operates the air blower 91a during periods P17 and P18. In other words, the control unit 62 turns on the air blower 91a during periods P17 and P18 to move the chips KZ in the passage section 81a to the chip lifting and dropping section 81b. The control unit 62 also operates the air blower 91b during periods P18 and P19.

[0139] In the above embodiment, the air blowers 51, 71, 91, and 110 are only required to be able to transport chips, and are not limited to transporting them by air. For example, a chip transporting device such as a conveyor may be provided instead of each of the air blowers 51, 71, 91, and 110.

[0140] In the above embodiment, each component may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the control unit 62 of the chip recovery system 1 in the above embodiment is a program that causes a computer to execute each step included in the flowchart shown in the figure.

[0141] The following cases are also included in this disclosure.

[0142] (1) Specifically, each of the above devices is a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or hard disk unit. Each device achieves its function by operating the microprocessor in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to the computer in order to achieve a predetermined function.

[0143] (2) Some or all of the components constituting each of the above devices may be made up of a single system LSI (Large Scale Integration). The system LSI is a multi-functional LSI manufactured by integrating multiple components onto a single chip, and specifically, it is a computer system that includes a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its function by operating the microprocessor in accordance with the computer program.

[0144] (3) Some or all of the components constituting each of the above devices may consist of a removable IC card or a standalone module. The IC card or module is a computer system consisting of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned multi-functional LSI. The microprocessor operates according to a computer program, thereby enabling the IC card or module to perform its function. The IC card or module may be tamper-resistant.

[0145] (4) The disclosure may also be the methods described above. Alternatively, it may be a computer program that implements these methods using a computer, or a digital signal consisting of the computer program.

[0146] Furthermore, this disclosure may also refer to the computer program or the digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray® Disc), semiconductor memory, etc. Alternatively, it may refer to the digital signal recorded on such a recording medium.

[0147] Furthermore, this disclosure may also describe transmitting the computer program or digital signal via telecommunications lines, wireless or wired communication lines, networks such as the Internet, data broadcasting, etc.

[0148] Furthermore, the present disclosure may also provide a computer system comprising a microprocessor and memory, wherein the memory stores the computer program, and the microprocessor operates in accordance with the computer program.

[0149] Furthermore, the program or digital signal may be implemented by another independent computer system by recording and transferring it on the recording medium, or by transferring the program or digital signal via the network or the like.

[0150] (5) The above embodiments and the above modifications may be combined. [Industrial applicability]

[0151] This invention provides a chip collection system and chip collection method that can efficiently move tape material chips from inside the main duct to the outlet of the main duct. [Explanation of symbols]

[0152] 1. Chip recovery system 2 Workline 3. Component mounting device 16 Tape Feeders 18. Carrier tape (tape material) 31 Main duct 31D Exit 32 Subduct 32K aperture 41K aperture 51, 71, 91, 110 Air blowers 53 Shutter 62 Control Unit KZ chips BH parts KB board

Claims

1. A sub-duct that receives tape material chips discharged from the tape feeder of the component mounting device, The main duct is connected to the aforementioned subduct and has an opening that communicates with the subduct, A first chip transport unit is installed in the sub-duct and moves the chips in the sub-duct to the main duct, A plurality of second chip transport units move the chips that have been moved from the subduct into the main duct through the opening to the outlet of the main duct, The system comprises a control unit that controls the operation of the first chip transport unit and the plurality of second chip transport units, The control unit moves the chips in the subduct to the main duct using the first chip transport unit, and then moves the chips to the outlet of the main duct by independently controlling each of the plurality of second chip transport units. Chip collection system.

2. The first chip transport unit moves the chips in the subduct to the main duct by blowing air toward the opening. Each of the plurality of second chip transport units blows air toward the outlet of the main duct, thereby moving the chips inside the main duct toward the outlet of the main duct. The chip recovery system according to claim 1.

3. The main duct has a plurality of divided regions arranged in series with respect to each other. Each of the aforementioned plurality of second chip transport units is installed in the plurality of divided regions. The chip recovery system according to claim 1 or 2.

4. The control unit moves the chips in the subduct to the main duct using the first chip transport unit, and then moves the chips to the outlet of the main duct by sequentially operating the plurality of second chip transport units in order from furthest from the outlet of the main duct. The chip recovery system according to claim 3.

5. The control unit controls the operation of the plurality of second chip transport units such that the periods of operation in which at least two second chip transport units, which are installed in at least two adjacent divided regions, move the chips overlap. The chip recovery system according to claim 3.

6. The control unit controls the operation of the first chip transport unit and the plurality of second chip transport units such that the periods during which the first chip transport unit and at least one of the plurality of second chip transport units move the chips overlap. The chip recovery system according to claim 1 or 2.

7. moreover, A transport path for transporting the chips within the component mounting device, comprising a third chip transport unit installed in the transport path communicating with the subduct, which moves the chips in the transport path to the subduct, The control unit controls the operation of the first chip transport unit and the third chip transport unit so that the periods during which the first chip transport unit and the third chip transport unit move the chips overlap. The chip recovery system according to claim 1 or 2.

8. The third chip transport unit moves the chips in the transport path to the subduct by blowing air toward the exit of the transport path. The chip recovery system according to claim 7.

9. moreover, The system includes a collection unit that receives the chips discharged from the outlet of the main duct, The aforementioned recovery unit is Chip collection path, It has a fourth chip transport unit installed in the chip collection path for moving the chips to a container, The control unit operates the fourth chip transport unit during periods when the first chip transport unit and the plurality of second chip transport units are not operating. The chip recovery system according to claim 1 or 2.

10. The fourth chip transport unit moves the chips in the chip collection path to the container by blowing air toward the outlet of the chip collection path. The chip recovery system according to claim 9.

11. The first chip transport unit and the plurality of second chip transport units receive air from a common supply source. The control unit controls the operation of the first chip transport unit and the plurality of second chip transport units so that the number of first chip transport units and the plurality of second chip transport units operating simultaneously does not exceed a predetermined number. The chip recovery system according to claim 2.

12. A sub-duct that receives tape material chips discharged from the tape feeder of the component mounting device, The main duct is connected to the aforementioned subduct and has an opening that communicates with the subduct, A first chip transport unit is installed in the sub-duct and moves the chips in the sub-duct to the main duct, A chip recovery method in a chip recovery system comprising a plurality of second chip transport units that move the chips, which have been moved from the subduct into the main duct through the opening, to the outlet of the main duct, The first chip transport unit moves the chips in the subduct to the main duct. By independently controlling each of the multiple second chip transport units, the chips are moved to the outlet of the main duct. Method for collecting chips.

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