Adhesive sheet, and method for manufacturing an adhesive sheet

Abstract

To provide an adhesive sheet which suppresses poor appearance due to the occurrence of flotation.SOLUTION: There is provided an adhesive sheet (100) which comprises a base material (10), an adhesive layer (20) provided on one surface of the base material (10) and a release film (30) provided on a surface of the adhesive layer (20) opposite to the base material (10). The adhesive sheet (100) satisfies the following mathematical expression (number 1) in the cross sectional view along the width direction. tanθ=W / T>0.01 (number 1) (In the expression, θ is an angle between a virtual line A (a virtual line extending in a direction perpendicular to a surface (32) of the release film (30) from an endmost position (EB) of the base material) and a virtual line B (a virtual line connecting the endmost position (EB) of the base material and an endmost position (ES) of the release film), T represents a distance from the endmost position (EB) of the base material to an intersecting point (PI), and W represents a distance from the intersecting point (PI) to the endmost position (ES) of the release film.)SELECTED DRAWING: Figure 1

Description

Technical Field

[0005]

[0001] The present invention relates to an adhesive sheet and a method for manufacturing the adhesive sheet.

Background Art

[0002] An adhesive sheet may include a base material, an adhesive layer provided on the base material, and a release film provided on the adhesive layer. The release film is provided, for example, to protect the surface (hereinafter sometimes referred to as the adhesive surface) of the adhesive layer that does not contact the base material until the adhesive sheet is used. When using the adhesive sheet, the release film is peeled off.

[0003] Conventionally, adhesive sheets have been widely used in many fields. For example, adhesive sheets may be used for processing workpieces such as semiconductor members (semiconductor wafers and semiconductor packages), and transparent members (glass substrates, glass plates, etc.). When an adhesive sheet is used for processing a workpiece, various processes are performed while the workpiece is attached to the adhesive layer of the adhesive sheet.

[0004] Patent Document 1 describes an adhesive sheet with a separator, which includes a base material layer, an adhesive layer, and a separator in this order. The material for forming the adhesive layer and the material for forming the base material layer are co-extruded, and at least the material for forming the co-extruded adhesive layer is bonded to the separator in a molten state. The adhesive sheet with a separator described in Patent Document 1 has a separator containing a release agent layer, and the content ratio of polyfunctional silicone in the silicone contained in the release agent layer is 10% or more. And the adhesive sheet described in Patent Document 1 is said to be preferably used for semiconductor wafer processing.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] When an adhesive sheet comprising a base material, an adhesive layer, and a release film is cut, the cut adhesive sheet may exhibit a defect in appearance due to lifting between the release film and the adhesive layer at the edges.

[0007] For example, in the adhesive sheet described in Patent Document 1, it is stated that if the separator, which is a release film, has a peeling force of 4.0 N / 50 mm or less after being pressed at 140°C, then excellent peelability can be obtained. However, when an adhesive sheet, such as the adhesive sheet described in Patent Document 1, is cut, the cut adhesive sheet tends to be more prone to lifting between the separator and the adhesive layer at its edges.

[0008] The object of the present invention is to provide an adhesive sheet that suppresses appearance defects caused by lifting at the edges of the adhesive sheet, and a method for manufacturing the adhesive sheet. [Means for solving the problem]

[0009] According to one aspect of the present invention, an adhesive sheet is provided comprising a base material, an adhesive layer provided on one side of the base material, and a release film provided on the side of the adhesive layer opposite to the base material, wherein the adhesive sheet has a longitudinal direction and a width direction perpendicular to the longitudinal direction, and in a cross-sectional view along the width direction, the outermost position of the release film on the outer surface of the release film opposite to the adhesive layer extends outward from the outermost position of the base material on the outer surface of the base material opposite to the adhesive layer, and when a virtual line extending from the outermost position of the base material in a direction perpendicular to the surface of the release film is virtual line A, a virtual line connecting the outermost position of the base material and the outermost position of the release film is virtual line B, the angle between virtual line A and virtual line B is θ, the distance from the outermost position of the base material to the intersection point of virtual line A and the surface of the release film is T, and the distance from the intersection point to the outermost position of the release film is W, the adhesive sheet is provided that satisfies the following formula (Equation 1). tanθ = W / T > 0.01 ... (Math 1)

[0010] In an adhesive sheet according to one aspect of this embodiment, it is preferable that the peeling force between the adhesive layer and the release film is 1000 mN / 100 mm or less.

[0011] In one aspect of this embodiment, the adhesive sheet is preferably an adhesive sheet for workpiece processing.

[0012] In an adhesive sheet according to one aspect of this embodiment, it is preferable that the adhesive layer contains an energy ray curable compound.

[0013] According to one aspect of the present invention, a method for manufacturing an adhesive sheet according to one aspect of this embodiment, comprising: a step of preparing a roll of adhesive sheet material; and a cutting step of cutting the roll of adhesive sheet material along the longitudinal direction by cutting from the substrate side of the roll of adhesive sheet material; A method for manufacturing an adhesive sheet is provided, which has the following characteristics. [Effects of the Invention]

[0014] According to the present invention, an adhesive sheet in which appearance defects caused by lifting at the edges of the adhesive sheet are suppressed, and a method for manufacturing the adhesive sheet can be provided. [Brief explanation of the drawing]

[0015] [Figure 1] A schematic cross-sectional view showing an example of an adhesive sheet according to this embodiment. [Figure 2] This is a schematic diagram illustrating an example of a method for manufacturing an adhesive sheet according to this embodiment. [Modes for carrying out the invention]

[0016] The following describes an example of a preferred embodiment of the present invention. The present invention is not limited to the content of the embodiments.

[0017] [Adhesive sheet] The adhesive sheet according to this embodiment comprises a base material, an adhesive layer provided on one side of the base material, and a release film provided on the side of the adhesive layer opposite to the base material. The adhesive sheet has a longitudinal direction and a width direction perpendicular to the longitudinal direction, and in a cross-sectional view along the width direction, the outermost position of the release film on the outer surface opposite to the adhesive layer of the release film extends further outward than the outermost position of the substrate on the outer surface opposite to the adhesive layer of the substrate. Furthermore, the adhesive sheet satisfies the following equation (Equation 1), where virtual line A is a virtual line extending perpendicularly from the outermost position of the substrate to the surface of the release film, virtual line B is a virtual line connecting the outermost position of the substrate and the outermost position of the release film, θ is the angle between virtual line A and virtual line B, T is the distance from the outermost position of the substrate to the intersection point of virtual line A and the surface of the release film, and W is the distance from the intersection point to the outermost position of the release film. tanθ = W / T > 0.01 ... (Math 1)

[0018] By having the above configuration, the adhesive sheet according to the present embodiment can suppress the occurrence of lifting at the end of the adhesive sheet even when, for example, the peeling force of the peeling film with respect to the adhesive layer is reduced. Therefore, according to the adhesive sheet according to the present embodiment, appearance defects caused by lifting occurring at the end of the adhesive sheet can be suppressed.

[0019] Here, the adhesive sheet according to the present embodiment will be described with reference to the drawings. In the drawings, for ease of explanation, there are portions shown enlarged or reduced. FIG. 1 is a diagram schematically showing a cross section cut in the width direction (the direction along the Y-axis shown in FIG. 1) perpendicular to the longitudinal direction (the direction along the X-axis shown in FIG. 1) of the adhesive sheet according to the present embodiment. Specifically, the cross-sectional view shown in FIG. 1 represents an outline of one end in the width direction when the adhesive sheet according to the present embodiment is viewed in cross section along the width direction.

[0020] As shown in FIG. 1, the adhesive sheet 100 includes a base material 10, an adhesive layer 20, and a peeling film 30. In the adhesive sheet 100, the adhesive layer 20 is directly laminated on the surface of the base material 10 opposite to the outer surface 12, and the peeling film 30 is directly laminated on the surface of the adhesive layer 20 opposite to the base material 10 side. That is, in the adhesive sheet 100, the adhesive layer 20 and the peeling film 30 are provided on one side of the base material 10, and the base material 10, the adhesive layer 20, and the peeling film 30 are laminated in this order in the thickness direction (the direction along the Z-axis shown in FIG. 1) from the outer surface 12 of the base material 10 toward the outer surface 32 of the peeling film 30. In the adhesive sheet 100, the peeling film 30 is laminated, for example, on the adhesive surface (the surface opposite to the base material 10 side) of the adhesive layer 20 until the adhesive sheet 100 is used.

[0021] The end of the adhesive sheet 100 includes a base material outermost end position EB located at the edge of the outer surface 12 of the base material 10 and a release film outermost end position ES located at the edge of the outer surface 32 of the release film 30. The end of the adhesive sheet 100 has an inclined surface that slopes from the base material outermost end position EB toward the release film outermost end position ES, and the release film outermost end position ES protrudes outward beyond the base material outermost end position EB. That is, the release film outermost end position ES extends outward beyond the base material outermost end position EB. When the adhesive sheet 100 is viewed in cross-section along the width direction, the shape of the inclined surface is linear or nearly linear.

[0022] The virtual line A shown in FIG. 1 represents a virtual line that extends in a direction perpendicular to the outer surface 32 of the release film 30 (the direction along the Z axis shown in FIG. 1) from the base material outermost end position EB. The virtual line B represents a virtual line connecting the base material outermost end position EB and the release film outermost end position ES. The intersection point PI shown in FIG. 1 represents the intersection of the virtual line A and the outer surface 32 of the release film 30. The distance T shown in FIG. 1 represents the shortest distance from the base material outermost end position EB to the intersection point PI. That is, the distance T corresponds to the thickness of the adhesive sheet 100. The distance W shown in FIG. 1 represents the distance from the intersection point PI to the release film outermost end position ES. That is, the distance W corresponds to the distance of the portion where the release film outermost end position ES extends (protrudes) outward beyond the base material outermost end position EB.

[0023] The adhesive sheet 100 satisfies the following relational expression (Expression 1). tanθ = W / T > 0.01 ···(Expression 1) In Expression (Expression 1), θ represents the angle formed by the virtual line A and the virtual line B. In Expression (Expression 1), T and W are as described above.

[0024] In the adhesive sheet 100 according to this embodiment, tanθ (i.e., the value of W / T) is preferably 0.012 or higher, more preferably 0.015 or higher, even more preferably 0.02 or higher, and even more preferably 0.03 or higher, from the viewpoint of making it easier to suppress appearance defects caused by lifting at the edges of the adhesive sheet 100. The upper limit of tanθ is not particularly limited, as long as it is possible to manufacture the adhesive sheet 100 according to this embodiment. From the viewpoint of suppressing crushing at the edges of the adhesive sheet 100, tanθ is preferably less than 0.5, more preferably 0.45 or less, and even more preferably 0.4 or less.

[0025] In the adhesive sheet 100 according to this embodiment, the distance T is preferably 16 μm or more, more preferably 20 μm or more, even more preferably 30 μm or more, even more preferably 50 μm or more, and still more preferably 70 μm or more. The distance T is preferably 850 μm or less, more preferably 800 μm or less, even more preferably 600 μm or less, even more preferably 500 μm or less, even more preferably 400 μm or less, and still most preferably 300 μm or less.

[0026] In the adhesive sheet 100 according to this embodiment, the distance W can be adjusted in relation to the aforementioned tanθ and the distance T.

[0027] The method for adjusting the above formula (Equation 1) is not particularly limited. Preferably, the method for adjusting the above formula (Equation 1) is the method described later in the section on the manufacturing method of the adhesive sheet.

[0028] Although the present invention has been described above with reference to the drawings, it is not limited to the embodiment shown in Figure 1. For example, in the adhesive sheet 100 according to this embodiment, a layer other than the adhesive layer 20 may be provided between the base material 10 and the adhesive layer 20. In the adhesive sheet 100 shown in Figure 1, the aforementioned inclined surface has a straight or nearly straight shape, but is not limited to this shape, and may have a curved portion or not have a curved portion.

[0029] Figure 1 shows one end of the adhesive sheet 100. However, it is preferable that the adhesive sheet 100 has the inclined surface described above not only at one end but also at the other end. In other words, at both ends (not shown) in the width direction (direction along the Y-axis shown in Figure 1) of the adhesive sheet according to this embodiment, it is preferable that the outermost position of the release film extends outward from the outermost position of the base material.

[0030] Although not shown in the figures, the width dimension of the adhesive sheet 100 (the distance between the two ends of the adhesive sheet 100) is preferably 200 mm or more, more preferably 220 mm or more, and even more preferably 240 mm or more. The width dimension of the adhesive sheet 100 is preferably 500 mm or less, more preferably 400 mm or less, and even more preferably 360 mm or less. The width dimension of the adhesive sheet 100 represents the distance from the outermost release film position ES at one end to the outermost release film position at the other end (not shown).

[0031] The following describes specific examples of each layer constituting the adhesive sheet according to this embodiment. In the following description, reference numerals are omitted.

[0032] <Base material> The base material is not particularly limited, but is preferably composed of a resin, and more preferably a resin film.

[0033] Examples of resins constituting the base material include polyester resins (polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, etc.), polyolefin resins (polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, ethylene-norbornene copolymer, norbornene resin, and ethylene copolymers (ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, and ethylene-(meth)acrylic acid ester copolymer, etc.)), polyvinyl chloride resins (polyvinyl chloride and vinyl chloride copolymer, etc.), (meth)acrylic acid ester copolymers, polyurethane, polyamide, polyimide, polystyrene, polycarbonate, fluororesin, and ionomer. The base material may be a single-layer film of the above resins, or a laminated film with two or more layers. If the base material is a laminated film, the resins in each layer may be the same type of resin or different types of resins.

[0034] In terms of more effectively suppressing appearance defects caused by lifting at the edges of the adhesive sheet, the base material is preferably at least one ethylene copolymer selected from the group consisting of polyethylene terephthalate, polypropylene, polyvinyl chloride, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, and ethylene-(meth)acrylic acid ester copolymer, and more preferably at least one ethylene copolymer selected from the group consisting of ethylene-(meth)acrylic acid copolymer and ethylene-(meth)acrylic acid ester copolymer.

[0035] In this specification, "(meth)acrylic" means both acrylic and methacrylic. The same applies to other similar terms.

[0036] At least one surface of the substrate may be treated with an easy-adhesion treatment, such as corona treatment, plasma treatment, flame treatment, primer treatment, and anchor coating treatment. If the surface of the substrate that is in contact with other layers (for example, the surface in contact with the adhesive layer) is treated with an easy-adhesion treatment, the adhesion with the other layer (for example, the adhesive layer) is improved.

[0037] The substrate may contain various additives as needed, such as colorants, flame retardants, plasticizers, antistatic agents, lubricants, and fillers. Furthermore, if the adhesive layer contains an energy ray curable compound as described later, it is preferable that the substrate be permeable to energy rays.

[0038] The thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, even more preferably 30 μm or more, and even more preferably 50 μm or more. The thickness of the substrate is preferably 500 μm or less, more preferably 450 μm or less, even more preferably 300 μm or less, even more preferably 250 μm or less, and still most preferably 200 μm or less.

[0039] If the substrate thickness is 5 μm or more, it tends to have adequate strength. For example, if an adhesive sheet is used as an adhesive sheet for processing a workpiece, it will have a suitable thickness for processing the workpiece, making it easier to support the workpiece. Furthermore, when an adhesive sheet is used as an adhesive sheet for processing a workpiece, if the thickness of the substrate is 5 μm or more, for example, it becomes easier to dic the workpiece, and if the thickness of the substrate is 500 μm or less, for example, it becomes easier to expand. Hereinafter, adhesive sheets used for processing workpieces may be referred to as workpiece processing adhesive sheets.

[0040] The substrate can be obtained by known methods. For example, the substrate can be produced by molding a resin composition containing a resin and additives as needed, using methods such as casting, calendering, T-die extrusion, and inflation.

[0041] <Adhesive layer> The adhesive layer is not particularly limited and is formed from an adhesive composition containing various types of adhesives. Examples of adhesives include acrylic, rubber, silicone, urethane, polyester, and polyvinyl ether adhesives. The adhesive is preferably selected depending on the application. From the viewpoint of more easily suppressing appearance defects caused by lifting at the edges of the adhesive sheet, an acrylic adhesive is preferred. Furthermore, when the adhesive sheet according to this embodiment is applied as an adhesive sheet for workpiece processing, the adhesive is selected considering the type of workpiece to which it is attached. From the viewpoint of easily exhibiting adhesive strength to the workpiece, an acrylic adhesive is preferred.

[0042] The adhesive may be a non-energy-ray curable adhesive that does not possess energy-ray curability, or it may be an energy-ray curable adhesive. Examples of energy rays include ultraviolet rays and electron beams.

[0043] If the adhesive is energy-ray curable, irradiation with energy rays will form a hardened adhesive layer. The formation of this hardened adhesive layer reduces its tackiness. Therefore, when an adhesive sheet is used as an adhesive sheet for workpiece processing, the adhesive force of the workpiece processing adhesive sheet to the workpiece can be reduced. From this viewpoint, the adhesive is preferably an energy-ray curable adhesive, and more preferably an ultraviolet-curable adhesive.

[0044] (Energy ray curing adhesive) When an adhesive composition is energy-ray curable, the adhesive composition may contain the components exemplified in (I) to (III) below, and is preferably any one of (I), (II), or (III). Hereinafter, the components exemplified in (I) to (III) above that are included in an energy-ray curable adhesive composition may be collectively referred to as an adhesive resin.

[0045] (I): A component containing a non-energy ray curable polymer and an energy ray curable compound. (II): A component that does not contain an energy ray curable compound, but contains an energy ray curable polymer in which an unsaturated group has been introduced into the side chain of a non-energy ray curable polymer. (III): A component containing an energy ray-curable polymer and an energy ray-curable polymer in which an unsaturated group is introduced into the side chain of a non-energy ray-curable polymer.

[0046] In adhesive resins, the non-energy ray curable polymer is preferably a (meth)acrylic copolymer. The adhesive composition preferably contains an energy ray curable compound.

[0047] [Energy ray curable compounds] Energy-ray curable compounds have energy-ray curable double bonds within their molecules. Energy-ray curable compounds are compounds that polymerize and harden when irradiated with energy rays (e.g., ultraviolet light).

[0048] The energy-ray curable compound is preferably a (meth)acrylic compound. The energy-ray curable compound is preferably an ultraviolet-curable compound. The energy-ray curable compound is more preferably an ultraviolet-curable (meth)acrylic compound.

[0049] Examples of energy-ray curable compounds include low molecular weight compounds having energy-ray polymerizable groups (monofunctional monomers, polyfunctional monomers, monofunctional oligomers, and polyfunctional oligomers). Specifically, energy-ray curable compounds include acrylates such as trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, and 1,6-hexanediol diacrylate; cyclic aliphatic skeleton-containing acrylates such as dicyclopentadiene dimethoxydiacrylate and isobornyl acrylate; and acrylate compounds such as polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy-modified acrylate, polyether acrylate, and itaconic acid oligomer. Energy ray curable compounds may be used individually or in combination of two or more.

[0050] The molecular weight of the energy ray-curable compound is usually between 100 and 50,000, and preferably between 300 and 10,000.

[0051] [(meth)acrylic copolymer] The adhesive may also preferably further contain a (meth)acrylic copolymer. The (meth)acrylic copolymer is different from the energy ray curable compound described above.

[0052] The (meth)acrylic copolymer preferably has an energy-curable carbon-carbon double bond. That is, the adhesive preferably contains an energy-curable compound and an energy-curable (meth)acrylic copolymer.

[0053] The adhesive preferably contains an energy-ray curable compound in an amount of 10 parts by mass or more, more preferably 20 parts by mass or more, and even more preferably 25 parts by mass or more, per 100 parts by mass of (meth)acrylic copolymer. The adhesive preferably contains an energy-ray curable compound in an amount of 200 parts by mass or less, more preferably 160 parts by mass or less, and even more preferably 120 parts by mass or less, per 100 parts by mass of (meth)acrylic copolymer.

[0054] The weight-average molecular weight (Mw) of the (meth)acrylic copolymer is preferably 50,000 or more, more preferably 100,000 or more, and even more preferably 300,000 or more. The weight-average molecular weight (Mw) of the (meth)acrylic copolymer is preferably 2,000,000 (2 million) or less, and more preferably 1,500,000 (1.5 million) or less. In this specification, the weight-average molecular weight (Mw) is the value on a standard polystyrene basis, measured by gel permeation chromatography (GPC).

[0055] The (meth)acrylic copolymer is preferably a (meth)acrylic acid ester polymer (hereinafter sometimes referred to as "energy-ray curable polymer") in which an energy-ray curable functional group (energy-ray curable group) is introduced into the side chain.

[0056] • Energy-curable polymer The energy-ray curable polymer is preferably a copolymer obtained by reacting a (meth)acrylic copolymer having a functional group-containing monomer unit with an unsaturated group-containing compound having a functional group that bonds to the functional group of the (meth)acrylic copolymer.

[0057] The (meth)acrylic copolymer preferably contains structural units derived from functional group-containing monomers and structural units derived from (meth)acrylic acid ester monomers or derivatives of (meth)acrylic acid ester monomers.

[0058] The functional group-containing monomer used as a constituent unit of the (meth)acrylic copolymer is preferably a monomer having a polymerizable double bond and a functional group within its molecule. The functional group is preferably at least one of the functional groups selected from the group consisting of a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group.

[0059] Examples of hydroxyl group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Hydroxyl group-containing monomers may be used individually or in combination of two or more.

[0060] Examples of carboxyl group-containing monomers include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. Carboxyl group-containing monomers may be used individually or in combination of two or more.

[0061] Examples of amino group-containing monomers or substituted amino group-containing monomers include aminoethyl (meth)acrylate and n-butylaminoethyl (meth)acrylate. The amino group-containing monomer or substituted amino group-containing monomer may be used individually or in combination of two or more types.

[0062] As the (meth)acrylic acid ester monomers constituting the (meth)acrylic copolymer, alkyl (meth)acrylates having 1 to 20 carbon atoms in the alkyl group are preferred, as well as monomers having an alicyclic structure in the molecule (alicyclic structure-containing monomers).

[0063] As the alkyl (meth)acrylate, alkyl (meth)acrylates in which the number of carbon atoms in the alkyl group is 1 or more and 18 or less are preferred. More preferred alkyl (meth)acrylates include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Alkyl (meth)acrylates may be used individually or in combination of two or more.

[0064] Preferred monomers containing alicyclic structures include, for example, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, adamantyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentenyloxyethyl (meth)acrylate. The alicyclic structure-containing monomers may be used individually or in combination of two or more.

[0065] Furthermore, the (meth)acrylic copolymer preferably contains the constituent units derived from the above-mentioned functional group-containing monomers in a proportion of 1% by mass or more, more preferably 5% by mass or more, and even more preferably 10% by mass or more. The (meth)acrylic copolymer preferably contains the constituent units derived from the above-mentioned functional group-containing monomer in an amount of 35% by mass or less, more preferably 30% by mass or less, and even more preferably 25% by mass or less.

[0066] Furthermore, the (meth)acrylic copolymer preferably contains structural units derived from (meth)acrylic acid ester monomers or their derivatives in a proportion of 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. The (meth)acrylic copolymer preferably contains constituent units derived from (meth)acrylic acid ester monomers or derivatives thereof in a proportion of 99% by mass or less, more preferably 95% by mass or less, and even more preferably 90% by mass or less.

[0067] (Meth)acrylic copolymers can be obtained by copolymerizing a functional group-containing monomer as described above with a (meth)acrylic acid ester monomer or a derivative thereof using a conventional method. In addition to the monomers mentioned above, the (meth)acrylic copolymer may also contain at least one constituent unit selected from the group consisting of dimethylacrylamide, vinyl formate, vinyl acetate, and styrene.

[0068] By reacting a (meth)acrylic copolymer having the above-mentioned functional group-containing monomer units with an unsaturated group-containing compound having a functional group bonded to that functional group, an energy-ray curable polymer can be obtained.

[0069] The functional group of the unsaturated group-containing compound can be appropriately selected according to the type of functional group of the functional group-containing monomer unit of the (meth)acrylic copolymer. For example, if the functional group of the (meth)acrylic copolymer is a hydroxyl group, an amino group, or a substituted amino group, the functional group of the unsaturated group-containing compound is preferably an isocyanate group or an epoxy group. If the functional group of the (meth)acrylic copolymer is an epoxy group, the functional group of the unsaturated group-containing compound is preferably an amino group, a carboxyl group, or an aziridinyl group.

[0070] The unsaturated group-containing compound contains at least one energy-ray polymerizable carbon-carbon double bond per molecule, preferably one to six, and more preferably one to four.

[0071] Examples of unsaturated group-containing compounds include 2-methacryloyloxyethyl isocyanate (2-isocyanatoethyl methacrylate), meta-isopropenyl-α,α-dimethylbenzyl isocyanate, methacryloyl isocyanate, and allyl isocyanate, 1,1-(bisacryloyloxymethyl)ethyl isocyanate; acryloyl monoisocyanate compounds obtained by the reaction of a diisocyanate compound or polyisocyanate compound with hydroxyethyl (meth)acrylate; acryloyl monoisocyanate compounds obtained by the reaction of a diisocyanate compound or polyisocyanate compound with a polyol compound and hydroxyethyl (meth)acrylate; glycidyl (meth)acrylate; (meth)acrylic acid, 2-(1-azilidinyl)ethyl (meth)acrylate, 2-vinyl-2-oxazoline, and 2-isopropenyl-2-oxazoline.

[0072] The unsaturated group-containing compound is preferably used in a proportion (addition rate) of 50 mol% or more, more preferably 60 mol% or more, and even more preferably 70 mol% or more, relative to the number of moles of the functional group-containing monomer of the (meth)acrylic copolymer. The unsaturated group-containing compound is preferably used in a proportion (addition rate) of 95 mol% or less, more preferably 93 mol% or less, and even more preferably 90 mol% or less, relative to the number of moles of the functional group-containing monomer of the (meth)acrylic copolymer.

[0073] In the reaction between a (meth)acrylic copolymer and an unsaturated group-containing compound, the reaction temperature, pressure, solvent, time, presence or absence of a catalyst, and type of catalyst can be appropriately selected depending on the combination of functional groups of the (meth)acrylic copolymer and the unsaturated group-containing compound. As a result, the functional groups of the (meth)acrylic copolymer and the functional groups of the unsaturated group-containing compound react, introducing unsaturated groups into the side chains of the (meth)acrylic copolymer, and yielding an energy-ray curable polymer.

[0074] The weight-average molecular weight (Mw) of the energy-ray curable polymer is preferably 50,000 or more, more preferably 100,000 or more, and even more preferably 300,000 or more. The weight-average molecular weight (Mw) of the energy-ray curable polymer is preferably 2,000,000 (2 million) or less, and more preferably 1,500,000 (1.5 million) or less.

[0075] [Photopolymerization initiator] If the adhesive composition contains a photocurable compound, specifically an ultraviolet-curable compound (e.g., an ultraviolet-curable resin), it is preferable that the adhesive composition also contains a photopolymerization initiator. By including a photopolymerization initiator in the adhesive composition, the polymerization curing time and the amount of light irradiation can be reduced.

[0076] Specific examples of photopolymerization initiators include, for example, benzoin compounds, acetophenone compounds, acyl phosphinoxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds. Furthermore, photosensitizers such as amines or quinones can also be used as photopolymerization initiators.

[0077] More specific examples of photopolymerization initiators include, for example, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzylphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyrolnitrile, dibenzyl, diacetyl, 8-chloranthraquinone, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide. Photopolymerization initiators may be used individually or in combination of two or more.

[0078] The photopolymerization initiator is preferably used in an amount of 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, and even more preferably 0.05 parts by mass or more, per 100 parts by mass of the adhesive resin which is in any of the embodiments of (I), (II), or (III) above. The photopolymerization initiator is preferably used in an amount of 10 parts by mass or less, and more preferably in an amount of 5 parts by mass or less, per 100 parts by mass of the adhesive resin which is any of the embodiments described in (I), (II), or (III) above.

[0079] When the photopolymerization initiator contains a (meth)acrylic copolymer and an energy ray curable compound as the adhesive resin, it is preferable to use an amount of 0.1 parts by mass or more, and more preferably 0.5 parts by mass or more, per 100 parts by mass of the energy ray curable compound. When the photopolymerization initiator contains a (meth)acrylic copolymer and an energy ray curable compound as the adhesive resin, it is preferable that it is used in an amount of 10 parts by mass or less, and more preferably 6 parts by mass or less, per 100 parts by mass of the energy ray curable compound.

[0080] [Crosslinking agent] The adhesive composition may contain a crosslinking agent. As the crosslinking agent, a polyfunctional compound that has reactivity with functional groups of (meth)acrylic copolymers, etc., can be used. Examples of polyfunctional compounds in the adhesive composition include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts, and reactive phenolic resins.

[0081] In the case of the adhesive resin according to the embodiment of (I) above, the amount of crosslinking agent is preferably 0.01 parts by mass or more, and more preferably 0.1 parts by mass or more, per 100 parts by mass of (meth)acrylic copolymer. In the case of the adhesive resin according to the embodiment of (I) above, the amount of crosslinking agent is preferably 30 parts by mass or less, and more preferably 20 parts by mass or less, per 100 parts by mass of (meth)acrylic copolymer.

[0082] In the case of the adhesive resin according to the embodiment of (II) above, the amount of crosslinking agent is preferably 0.01 parts by mass or more, and more preferably 0.1 parts by mass or more, per 100 parts by mass of the polymer in which unsaturated groups have been introduced into the side chains of the non-energy ray curable polymer. In the case of the adhesive resin according to the embodiment (II) above, the amount of crosslinking agent is preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of the polymer in which unsaturated groups have been introduced into the side chains of the non-energy ray curable polymer.

[0083] In the case of the adhesive resin according to the above embodiment (III), the amount of crosslinking agent is preferably 0.01 parts by mass or more, and more preferably 0.1 parts by mass or more, per 100 parts by mass of the polymer in which unsaturated groups have been introduced into the side chains of the non-energy ray curable polymer. In the case of the adhesive resin according to the embodiment of (III) above, the amount of crosslinking agent is preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of the polymer in which unsaturated groups have been introduced into the side chains of the non-energy ray curable polymer.

[0084] The adhesive composition may also contain other components besides those listed above, such as antistatic agents, antioxidants, plasticizers, fillers, rust inhibitors, pigments, and dyes.

[0085] The thickness of the adhesive layer is preferably, for example, 1 μm or more, more preferably 3 μm or more, and even more preferably 5 μm or more. The thickness of the adhesive layer is preferably 100 μm or less, more preferably 70 μm or less, even more preferably 60 μm or less, even more preferably 50 μm or less, and still more preferably 30 μm or less.

[0086] <Release film> The release film is not particularly limited as long as it can be peeled off the adhesive layer after being attached to it. Preferably, the release film comprises, for example, a release substrate and a release agent layer provided on the release substrate. When the release film comprises a release agent layer provided on the release substrate, the side of the release agent layer opposite to the release substrate side (i.e., the release treatment surface of the release film) is the surface that contacts the adhesive surface of the adhesive layer.

[0087] The release substrate preferably contains a resin. Examples of resins included in the release substrate include polyolefin resins (polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, ethylene-norbornene copolymer, norbornene resin, and ethylene copolymers (ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, and ethylene-(meth)acrylic acid ester copolymer, etc.)), polyester resins (polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate, etc.), polyvinyl chloride resins (polyvinyl chloride and vinyl chloride copolymer, etc.), polyurethane, polystyrene, polycarbonate, polyamide, polyimide, and fluororesin. Among these, the resin constituting the release substrate is preferably a polyester resin such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate, and more preferably polyethylene terephthalate, from the viewpoint of more easily suppressing appearance defects caused by lifting at the edges of the adhesive sheet. Furthermore, from the viewpoint of heat resistance, the resin constituting the release substrate is preferably a polyester resin such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate, and more preferably polyethylene terephthalate.

[0088] In addition to the resin, the release agent may contain various additives as needed, such as antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, inorganic or organic fillers, and plasticizers.

[0089] The release substrate can be obtained by known methods. For example, the release substrate can be produced by molding a resin composition containing a resin and additives as needed using methods such as casting, calendering, T-die extrusion, or inflation. Specifically, for example, the release substrate can be produced by melt-extruding a resin composition containing a resin to form an unstretched film, and then obtaining the formed unstretched film by sequential biaxial stretching or simultaneous biaxial stretching.

[0090] Examples of release agents included in the release agent layer include silicone resins, alkyd resins, acrylic resins, long-chain alkyl resins, unsaturated polyester resins, polyolefin resins, and waxes. Among these, it is preferable to use a silicone resin as the release agent in the release agent layer. Examples of silicone resins include silicone resins with a dimethylpolysiloxane basic skeleton. Examples of silicone resins include addition reaction type, condensation reaction type, ultraviolet curing type, and electron beam curing type. When using an addition reaction type silicone resin as the release agent, it is preferable to use a crosslinking agent and a catalyst in combination. Examples of crosslinking agents include organopolysiloxanes having hydrogen atoms bonded to at least two silicon atoms in one molecule. Examples of catalysts include metal compounds of platinum, palladium, and rhodium.

[0091] The paint stripper composition containing the paint stripper may optionally contain various additives such as antioxidants, UV absorbers, inorganic or organic fillers, antistatic agents, and surfactants.

[0092] The release film can be obtained, for example, by preparing a coating solution by mixing an organic solvent such as toluene, ethyl acetate, methyl ethyl ketone, hexane, and heptane with a release agent composition, applying the coating solution to the release substrate using a known coating method, and then drying and heating it.

[0093] The thickness of the release film is not particularly limited. For example, the thickness of the release film is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 25 μm or more. The thickness of the release film is preferably 250 μm or less, more preferably 200 μm or less, and even more preferably 150 μm or less.

[0094] <Peeling force> In the adhesive sheet according to this embodiment, it is preferable that the peeling force between the adhesive layer and the release film (the peeling force of the release film relative to the adhesive layer) is 1000 mN / 100 mm or less. If the peeling force between the adhesive layer and the release film is 1000 mN / 100 mm or less, the occurrence of peeling defects when peeling the release film from the adhesive layer is less likely to occur. However, if the peeling force between the adhesive layer and the release film is 1000 mN / 100 mm or less, the possibility of lifting at the edges of the adhesive sheet increases. However, with the adhesive sheet according to this embodiment, the occurrence of lifting at the edges of the adhesive sheet can be suppressed.

[0095] The peeling force between the adhesive layer and the release film is more preferably 950 mN / 100 mm or less, even more preferably 900 mN / 100 mm or less, and even more preferably 850 mN / 100 mm or less. The lower limit of the peeling force between the adhesive layer and the release film is not particularly limited, as long as unintended peeling is suppressed. The lower limit of the peeling force between the adhesive layer and the release film is preferably 10 mN / 100 mm or more, more preferably 15 mN / 100 mm or more, even more preferably 20 mN / 100 mm or more, even more preferably 25 mN / 100 mm or more, and even more preferably 30 mN / 100 mm or more.

[0096] The peeling force between the adhesive layer and the release film can be measured using an adhesive sheet measuring 100 mm x 100 mm, pulled at a 90° angle at a tensile speed of 300 mm / min. Specifically, the release film on the adhesive sheet is fixed to a rigid support provided by the tensile testing machine, and the measurement is performed by peeling the release film from the adhesive layer only in the portion of the adhesive sheet containing the base material and adhesive layer, at a 90° angle at a tensile speed of 300 mm / min.

[0097] [How to use adhesive sheets] The shape of the adhesive sheet according to this embodiment is not particularly limited, as long as it comprises a base material, an adhesive layer provided on the surface of the base material, and a release film provided on the side of the adhesive layer opposite to the base material. The adhesive sheet can take any shape, such as tape or label. The adhesive sheet according to this embodiment is preferably applied as an adhesive sheet for workpiece processing. Specific examples of when the adhesive sheet according to this embodiment is applied as an adhesive sheet for workpiece processing will be described below.

[0098] Examples of workpieces include semiconductor wafers and semiconductor packages, as well as transparent materials such as glass substrates and glass plates. Semiconductor wafers may be, for example, silicon wafers or compound semiconductor wafers such as gallium arsenide. Transparent materials are not limited to glass and include transparent materials that transmit light, such as transparent materials exhibiting a visible light transmittance of 50% or more. When the workpiece is a transparent material, it is preferable that the workpiece is glass (glass substrates, glass plates, etc.).

[0099] The method of using the workpiece processing adhesive sheet in this embodiment includes, for example, the steps of: attaching a workpiece to the adhesive layer of the workpiece processing adhesive sheet; performing various processes on the workpiece while it is attached to the adhesive layer; and peeling the workpiece that has undergone various processes (processed workpiece) from the workpiece processing adhesive sheet.

[0100] The adhesive sheet for workpiece processing obtained by the manufacturing method according to this embodiment is specifically applied as at least one selected from the group consisting of, for example, a backgrind sheet, a dicing sheet, an expanded sheet, and a pickup sheet. The adhesive sheet for workpiece processing is preferably used in a process in which, for example, a workpiece is attached to an adhesive layer after peeling off a release film, the workpiece is diced while attached to the adhesive layer to be individualized, and the individualized workpiece is peeled off from the adhesive layer. Among these, the adhesive sheet for workpiece processing is preferably a dicing sheet, for example.

[0101] When a workpiece processing adhesive sheet is used, for example, as a dicing sheet, the workpiece (e.g., a semiconductor wafer, semiconductor package, glass substrate, or glass plate) is held in the adhesive layer of the workpiece processing adhesive sheet, and dicing is performed. In dicing, the workpiece is cut into predetermined shapes and dimensions, and multiple chip-shaped processed workpieces are obtained. The processed workpieces that have undergone dicing are picked up from the adhesive layer of the workpiece processing adhesive sheet. If the adhesive layer contains an energy-ray curable adhesive, the adhesive layer of the workpiece processing adhesive sheet attached to the processed workpiece may be cured by irradiating it with energy rays (e.g., ultraviolet light), and then the processed workpieces may be picked up from the cured adhesive layer.

[0102] [Method for manufacturing adhesive sheets] The adhesive sheet according to this embodiment is not particularly limited in its manufacturing method, as long as it satisfies the aforementioned formula (Equation 1). The adhesive sheet according to this embodiment is preferably manufactured by the manufacturing method described below.

[0103] An example of a preferred manufacturing method for the adhesive sheet according to this embodiment will be described. The manufacturing method for the adhesive sheet according to this embodiment includes a step of preparing a roll of adhesive sheet (hereinafter sometimes referred to as step S1) and a cutting step (hereinafter sometimes referred to as step S2) of cutting the roll of adhesive sheet along its longitudinal direction by cutting from the substrate side of the roll of adhesive sheet. In the manufacturing method for the adhesive sheet according to this embodiment, "cutting from the substrate side" means that when cutting the roll of adhesive sheet with a pair of cutting blades, an upper blade and a lower blade, the upper blade of the pair of cutting blades is brought into contact with the substrate side of the roll of adhesive sheet, and the roll of adhesive sheet is cut by inserting the upper blade from the outer surface of the substrate. In other words, in this case, step S2 may be, for example, a step of cutting the raw material of the adhesive sheet with a pair of cutting blades, an upper blade and a lower blade, wherein the upper blade is brought into contact with the base material side of the raw material of the adhesive sheet, and the raw material of the adhesive sheet is cut along the longitudinal direction by cutting from the base material side of the raw material of the adhesive sheet. The pair of cutting blades, the upper blade and the lower blade, may have an angle at the tip of the upper blade that is smaller than the angle at the tip of the lower blade.

[0104] <Process S1> Step S1 is a step of preparing a raw material for an adhesive sheet, which comprises a base material, an adhesive layer provided on the surface of the base material, and a release film provided on the side of the adhesive layer opposite to the base material.

[0105] The raw material for the adhesive sheet is obtained, for example, by going through the steps of: preparing a base material, an adhesive composition, and a release film (hereinafter sometimes referred to as step S1-A); applying the adhesive composition to the release surface (release treatment surface) of the release film to provide an adhesive layer formed from the adhesive composition (hereinafter sometimes referred to as step S1-B); and laminating the base material to the side of the adhesive layer opposite to the release film side (hereinafter sometimes referred to as step S1-C).

[0106] Specific examples of the substrate, adhesive composition, and release film have already been described. In step S1-A, the substrate, adhesive composition, and release film can be selected and prepared from the specific examples already described.

[0107] In step S1-B, the method for applying the adhesive composition to the release surface of the release film is not particularly limited. For example, a coating solution containing the prepared adhesive composition and, if necessary, a solvent or dispersion medium is prepared, and this coating solution is applied to the release surface of the release film. The coating method is not particularly limited and includes, for example, spin coating, spray coating, bar coating, knife coating, roll coating, roll knife coating, blade coating, die coating, and gravure coating.

[0108] Examples of the solvents or dispersion media mentioned above include aromatic hydrocarbon solvents (benzene, toluene, etc.), ester solvents (ethyl acetate, butyl acetate, etc.), ketone solvents (acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), aliphatic hydrocarbon solvents (n-pentane, n-hexane, n-heptane, etc.), and alicyclic hydrocarbon solvents (cyclopentane, cyclohexane, etc.). These solvents or dispersion media may be used individually or in combination of two or more.

[0109] The adhesive layer can be formed by applying a coating solution containing an adhesive composition to form a coating film, and then heating and drying the coating film.

[0110] In step S1-C, after an adhesive layer is formed on the release film, the substrate is laminated to the side of the adhesive layer opposite to the release film side. The method of laminating the substrate is not particularly limited, and any known method may be used.

[0111] Step S1 is not limited to the step of preparing a raw material for an adhesive sheet by going through each of the steps S1-A to S1-C described above. Another step may be, for example, the step of preparing a base material, an adhesive composition, and a release film; the step of applying the adhesive composition onto the base material to form an adhesive layer made from the adhesive composition; and the step of laminating the release surface (release surface) of the release film onto the side of the adhesive layer opposite to the base material side to prepare a raw material for an adhesive sheet.

[0112] If the adhesive composition contains a crosslinking agent, it is preferable to form a crosslinked structure in the adhesive layer by, for example, changing the drying conditions (temperature, time, etc.) of the coating film to which the coating liquid containing the adhesive composition has been applied, or by providing a heat treatment other than drying. The process may also include a step of seasoning the adhesive sheet obtained by the above steps. Examples of seasoning conditions include leaving the sheet undisturbed for a period of 3 to 14 days (for example, 7 days) in an environment with a temperature of 20°C or higher and 50°C or lower (for example, 23°C) and a relative humidity of 20% RH or higher and 50% RH or lower (for example, 50% RH).

[0113] The form of the raw material of the adhesive sheet obtained in step S1 is not particularly limited. Preferably, the raw material of the adhesive sheet is in the form of a roll. Hereinafter, the raw material of the adhesive sheet in the form of a roll will be referred to as a raw material roll.

[0114] <Process S2> The adhesive sheet according to this embodiment is obtained by cutting the raw material of the adhesive sheet obtained in step S1 along the longitudinal direction from the substrate side. The method of cutting the raw material of the adhesive sheet is not particularly limited as long as an adhesive sheet that satisfies the above formula (Equation 1) is obtained. If the raw material obtained in step S1 is a roll of raw material, the roll of raw material can be cut using a roll-to-roll method.

[0115] The following describes a method for cutting a roll of adhesive sheets unwound from a roll of raw material using a roll-to-roll method. In the following description, the roll of raw adhesive sheets will be referred to as the raw material roll, and the roll of cut adhesive sheets will be referred to as the adhesive sheet roll, to distinguish between the two types of rolls.

[0116] In a roll-to-roll cutting method, for example, a cutting device is used that includes a feeding unit for feeding out a roll of adhesive sheets from a roll of raw materials, a cutting unit located downstream of the feeding unit for cutting the roll of adhesive sheets along its longitudinal direction from the base material side, and a winding unit located downstream of the cutting unit for winding the adhesive sheets cut by the cutting unit into an adhesive sheet roll.

[0117] The cutting method in the cutting section is not particularly limited. Examples of cutting methods include shear cutting, laser cutting, and score cutting. In the adhesive sheet manufacturing method according to this embodiment, it is preferable to use a shear cutting method because it makes it easier to obtain the desired tanθ.

[0118] The shear-cut cutting method is a method in which the material to be cut is cut by passing it between a pair of cutting blades, an upper blade and a lower blade, and shearing it. In the manufacturing method according to this embodiment, the material to be cut is a roll of adhesive sheets unwound from a roll of raw materials. The upper blade contacts the base material side of the roll of adhesive sheets, and the lower blade contacts the release film side of the roll of adhesive sheets, and the material is cut by shearing it along the longitudinal direction of the roll of adhesive sheets. In step S2, by adjusting the angle at which the upper blade is pressed against the base material side of the roll of adhesive sheets, it becomes easy to adjust the value of tanθ, and an adhesive sheet that satisfies the above formula (Equation 1) can be obtained.

[0119] The raw material of the adhesive sheet unwound from the raw material roll is cut to obtain adhesive sheets cut to a predetermined width (width dimension), and these are wound up in the winding section as one or more adhesive sheet rolls. Specifically, both ends of the raw material roll may be cut and wound up as a single adhesive sheet roll, or the raw material roll may be cut to a predetermined width and wound up as multiple divided adhesive sheet rolls.

[0120] The width of the adhesive sheet after cutting is preferably 200 mm or more, more preferably 220 mm or more, and even more preferably 240 mm or more. The width of the adhesive sheet after cutting is preferably 500 mm or less, more preferably 400 mm or less, and even more preferably 360 mm or less. The length of the adhesive sheet in the longitudinal direction (longitudinal direction) after cutting can be any length that corresponds to the desired length.

[0121] Now, let's explain process S2 with reference to Figure 2. Figure 2 shows a schematic representation of the state of the adhesive sheet after cutting, viewed in cross-section along the width direction. Specifically, it shows the state after the raw material roll 102 of the adhesive sheet has been cut using the shear cut method.

[0122] The upper blade UB shown in Figure 2 is located on the outer circumference of a roller (not shown), and the lower blade LB is located on the outer circumference of a roller (not shown). The upper blade UB is a single-edged blade. The cutting edge of the upper blade UB has a flat portion UB1 and an inclined portion UB2 opposite to the flat portion UB1, and becomes sharper towards the tip of the cutting edge. At the cutting edge of the upper blade UB, the angle between the flat portion UB1 and the inclined portion UB2 is, for example, in the range of 30° or more and 60° or less. Specifically, the angle of the cutting edge of the upper blade UB (i.e., the angle between the flat portion UB1 and the inclined portion UB2) is, for example, about 45°. The cutting edge of the lower blade LB comprises an upper part LB2 positioned on the upper blade UB side, and a side part LB1 which is the side of the lower blade LB facing the flat part UB1 of the upper blade UB when cutting the adhesive sheet raw material 102. The angle between the upper part LB2 and the side part LB1 of the lower blade LB at the cutting edge of the lower blade LB is, for example, in the range of 80° or more and 90° or less. Specifically, the angle of the cutting edge of the lower blade LB (i.e., the angle between the upper part LB2 and the side part LB1 of the lower blade LB) is, for example, about 90°.

[0123] By rotating the upper blade UB and lower blade LB while bringing them into contact with each other, the adhesive sheet roll 102 can be cut along its longitudinal direction. The adhesive sheet roll 102 is cut by bringing the upper blade UB into contact with the outer surface 12 of the base material 10 and the lower blade LB into contact with the outer surface 32 of the release film 30, with the upper blade UB pressing against the base material 10 from the base material 10 side. The adhesive sheet roll 102 is then cut by shearing between the upper blade UB and the lower blade LB. By adjusting the angle α between the outer surface 12 of the base material 10 and the flat part UB1 of the upper blade UB when pressing the upper blade UB against the base material 10 side, an adhesive sheet 100 with the desired tanθ can be obtained.

[0124] Although the present invention has been described above with reference to the drawings, it is not limited to the embodiment shown in Figure 2. For example, Figure 2 shows an embodiment in which the upper blade UB is single-edged, but the upper blade UB is not limited to being single-edged, and may be double-edged. Also, the cutting method is not limited to the shear-cut method, and other cutting methods may be adopted. Furthermore, Figure 2 shows one end of the adhesive sheet 100. However, it is not limited to this, and in the adhesive sheet 100, it is preferable that both ends in the width direction of the adhesive sheet 100 (the direction along the Y-axis shown in Figure 2) are cut such that the outermost position of the release film extends outward from the outermost position of the base material.

[0125] [Variations of the Embodiment] The present invention is not limited in any way to the embodiments described above. The present invention includes modified forms of the embodiments described above, to the extent that the object of the present invention can be achieved. [Examples]

[0126] The present invention will be described in more detail below with reference to examples. The present invention is not limited in any way to these examples.

[0127] The measurements or evaluations in the following examples and comparative examples were performed by the methods described below.

[0128] [Exterior evaluation] The degree of lifting at the end of the cut roll obtained in the examples and comparative examples was confirmed by cutting out the portion corresponding to the end of the cut roll and observing it using a Keyence digital microscope (VHX-7000), and evaluated according to the evaluation criteria below.

[0129] <Evaluation Criteria> A(〇): No floating is observed. Or, floating is observed, but the floating size is 10 μm or less. F(×): Floating was observed, and the floating state was greater than 10 μm.

[0130] [Measurement of tanθ] In the examples and comparative examples, the cut rolls (adhesive sheet rolls) were cut in the width direction perpendicular to the longitudinal direction of the adhesive sheet. One end of the cut surface was cut out, and the cross-section along the width direction of the adhesive sheet was observed using a Keyence digital microscope (VHX-7000). Tanθ was determined by analyzing the digital microscope images.

[0131] [Example 1] <Preparation of adhesive composition A1> An acrylic ester polymer was obtained by polymerizing 38 parts by mass of 2-ethylhexyl acrylate, 37 parts by mass of vinyl acetate, and 25 parts by mass of 2-hydroxyethyl acrylate using a solution polymerization method. This acrylic ester polymer was reacted with 30 parts by mass of methacryloyloxyethyl isocyanate (MOI) per 100 parts by mass of the acrylic ester polymer (corresponding to 80 mol% of 2-hydroxyethyl acrylate) to obtain an acrylic polymer in which energy-ray curable groups were introduced into the side chains. The weight-average molecular weight (Mw) of this acrylic polymer was measured to be 600,000. The weight-average molecular weight (Mw) is the weight-average molecular weight on a standard polystyrene basis, measured using gel permeation chromatography (GPC) under the following conditions (GPC measurement). The measurement conditions are as follows.

[0132] <Measurement conditions> Measuring device: Tosoh Corporation, HLC-8320 GPC column (passes through in the following order): Manufactured by Tosoh Corporation TSKgelsuperH-H TSKgelsuperHM-H TSKgelsuperH2000 Measurement solvent: tetrahydrofuran Measurement temperature: 40℃

[0133] The acrylic polymer obtained above, with energy-ray curable groups introduced into its side chains, was mixed in a solvent with 100 parts by mass (based on solid content; the same applies hereafter) and 7 parts by mass of 1-hydroxycyclohexylphenyl ketone (manufactured by IGM Resins, product name "Omnirad 184") as a photopolymerization initiator and 0.2 parts by mass of trimethylolpropane-modified tolylene diisocyanate (manufactured by Tosoh Corporation, product name "Coronate L") as a crosslinking agent to obtain a coating solution for the adhesive composition.

[0134] <Making adhesive sheets> A release film (Lintec Corporation, SP-PET3801) was prepared by treating one side of a 380 mm wide polyethylene terephthalate (PET) film (thickness: 38 μm) with a light-release silicone resin. Additionally, a 380 mm wide ethylene-methacrylic acid copolymer resin film (thickness: 80 μm) was prepared. In Table 1, the prepared release film is denoted as "a," and the prepared substrate is denoted as "EMAA1."

[0135] The adhesive composition solution obtained above was applied to the release surface of a light-peel type release film using a comma coater (registered trademark), and dried at 90°C for 1 minute to form an adhesive layer with a thickness of 10 μm. An ethylene-methacrylic acid copolymer resin film, which is the base material, was laminated to the surface of this adhesive layer to produce a roll of adhesive sheet material (raw material roll). In Table 1, the adhesive layer formed with adhesive composition A1 is denoted as "A1".

[0136] <Cutting adhesive sheets> The 380mm wide raw material roll obtained above was cut to a width of 300mm by cutting both ends from the substrate side along the longitudinal direction of the raw material roll, thereby obtaining a roll of pre-cut adhesive sheet (adhesive sheet roll) with a length of 200m. The raw material roll was cut using a shear cut method with a blade for cutting rolls. The upper blade for cutting rolls was single-edged, and the blade tip angle was approximately 45°. The angle α (see Figure 2) at which the upper blade was applied to the surface of the substrate was set to approximately 45°, and the angle α was finely adjusted so that tanθ = 0.039. In Table 2, cutting from the substrate side is denoted as "BM".

[0137] Test specimens for peel force measurement were taken from the adhesive sheet roll obtained in Example 1, and the peel force was measured. The peel force (unit: N / 100mm) was measured using a universal tensile testing machine (Shimadzu Corporation, product name "Autograph AG-IS") by fixing the entire surface of the release film on the adhesive sheet test specimen to a rigid support provided by the universal tensile testing machine, and peeling off the portion of the adhesive sheet test specimen consisting of the substrate and adhesive layer from the release film at a peeling angle of 90° and a peeling speed of 300 mm / min. The measured peel force result for the adhesive sheet in Example 1 was 25 mN / 100mm.

[0138] [Example 2] An adhesive sheet roll was manufactured in the same manner as in Example 1, except that the angle α at which the upper blade is applied to the surface of the substrate was finely adjusted so that tanθ = 0.078.

[0139] [Example 3] An adhesive sheet roll was manufactured in the same manner as in Example 1, except that the angle α at which the upper blade is applied to the surface of the substrate was finely adjusted so that tanθ = 0.273.

[0140] [Example 4] An adhesive sheet roll was prepared in the same manner as in Example 1, except that the thickness of the substrate prepared in Example 1 was changed to 140 μm, and the angle α at which the upper blade was applied to the surface of the substrate was finely adjusted so that tanθ = 0.016. The prepared substrate is denoted as "EMAA2" in Table 1.

[0141] [Example 5] An adhesive sheet roll was prepared in the same manner as in Example 1, except that the coating solution of adhesive composition A1 prepared in Example 1 was replaced with the coating solution of adhesive composition A2 shown below, and the angle α at which the upper blade was applied to the surface of the substrate was finely adjusted so that tanθ = 0.094. In Table 1, the adhesive layer formed with adhesive composition A2 is denoted as "A2".

[0142] <Preparation of Adhesive Composition A2> 75 parts by mass of butyl acrylate and 25 parts by mass of 2-hydroxyethyl acrylate were polymerized by solution polymerization to obtain a (meth)acrylic acid ester polymer. This (meth)acrylic acid ester polymer was reacted with 30 parts by mass of methacryloyloxyethyl isocyanate (MOI) per 100 parts by mass of the (meth)acrylic acid ester polymer (corresponding to 80 mol% of 2-hydroxyethyl acrylate) to obtain an acrylic polymer in which energy-ray curable groups were introduced into the side chains. The weight-average molecular weight (Mw) of this acrylic polymer was measured to be 600,000. The weight-average molecular weight (Mw) is the weight-average molecular weight on a standard polystyrene basis, measured using gel permeation chromatography (GPC) under the following conditions (GPC measurement). The measurement conditions are as follows.

[0143] The acrylic polymer obtained above, with energy-ray curable groups introduced into its side chains, was mixed in a solvent with 100 parts by mass (based on solid content, the same applies hereafter) and 7 parts by mass of 1-hydroxycyclohexylphenyl ketone (manufactured by IGM Resins, product name "Omnirad 184") as a photopolymerization initiator and 0.2 parts by mass of trimethylolpropane-modified tolylene diisocyanate (manufactured by Tosoh Corporation, product name "Coronate L") as a crosslinking agent to obtain a coating solution for the adhesive composition.

[0144] A test piece for measuring peeling force was taken from the adhesive sheet roll obtained in Example 5, and the peeling force was measured using the same measurement method as in Example 1 described above. The measured peeling force of the adhesive sheet in Example 5 was 15 mN / 100 mm.

[0145] [Comparative Example 1] An adhesive sheet roll was manufactured in the same manner as in Example 1, except that the angle α at which the upper blade is applied to the surface of the substrate was finely adjusted so that tanθ = 0.008.

[0146] [Comparative Example 2] In Example 1, an adhesive sheet roll was prepared in the same manner as in Example 1, except that the cutting was done by cutting from the release film side. In Table 2, cutting from the release film side is denoted as "SP".

[0147] In Comparative Example 2, tanθ is shown as a negative value. At the end of the adhesive sheet in Comparative Example 2, the outermost position of the release film on the outer surface opposite to the adhesive layer of the release film was positioned inward compared to the outermost position of the substrate on the outer surface opposite to the adhesive layer of the substrate. In other words, referring to Figure 1, in Comparative Example 2, the end of the adhesive sheet did not have the shape shown in Figure 1, and the outermost position ES of the release film was positioned inward compared to the outermost position EB of the substrate. For this reason, the value of W was measured as a negative value, with the intersection PI shown in Figure 1 as the reference point.

[0148] [Table 1]

[0149] [Table 2]

[0150] Each embodiment showed better results in appearance evaluation compared to each comparative example. From the above, it can be seen that the adhesive sheet according to this embodiment suppresses appearance defects caused by lifting at the edges of the adhesive sheet. [Explanation of Symbols]

[0151] 10...Substrate, 12...Outer surface, 20...Adhesive layer, 30...Release film, 32...Outer surface, 100...Adhesive sheet, 102...Raw material, UB...Upper blade, UB1...Flat section, UB2...Inclined section, LB...Lower blade, LB1...Side section, LB2...Top section.

Claims

1. An adhesive sheet comprising a base material, an adhesive layer provided on one side of the base material, and a release film provided on the side of the adhesive layer opposite to the base material, The aforementioned adhesive sheet is It has a longitudinal direction and a width direction perpendicular to the longitudinal direction, In the cross-sectional view along the width direction, The outermost position of the release film on the outer surface opposite to the adhesive layer of the release film extends further outward than the outermost position of the substrate on the outer surface opposite to the adhesive layer of the substrate. Let virtual line A be a virtual line extending from the outermost position of the substrate in a direction perpendicular to the surface of the release film. The imaginary line connecting the outermost position of the substrate and the outermost position of the release film is called imaginary line B. Let θ be the angle between the virtual line A and the virtual line B. The distance from the outermost position of the substrate to the intersection point of the imaginary line A and the surface of the release film is denoted as T, and When the distance from the intersection to the outermost position of the release film is W, The following equation (Equation 1) is satisfied, The aforementioned adhesive sheet is an adhesive sheet for workpiece processing. Adhesive sheet. tanθ=W / T>0.01 (Math. 1)

2. In the adhesive sheet according to claim 1, The peeling force between the adhesive layer and the release film is 1000 mN / 100 mm or less. Adhesive sheet.

3. In the adhesive sheet according to claim 1 or claim 2, The adhesive layer contains an energy ray curable compound. Adhesive sheet.

4. A method for manufacturing an adhesive sheet according to any one of claims 1 to 3, The process of preparing the raw material for the adhesive sheet, A cutting step in which the raw material of the adhesive sheet is cut along the longitudinal direction by cutting from the base material side of the raw material of the adhesive sheet, Having, A method for manufacturing adhesive sheets.

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