Resin molding apparatus and method for manufacturing resin molded products

Abstract

To provide a resin molding device capable of preventing a molding object from falling even if the molding object is warped.SOLUTION: In a resin molding device that places a molding object between upper and lower molds and performs compression molding, the upper mold includes: a plurality of suction holes formed in a lower surface of the upper mold so as to open thereto, for suctioning the molding object; a first suction mechanism capable of sucking air from at least one first suction hole among the plurality of suction holes; and a second suction mechanism capable of sucking air through at least one second suction hole among the plurality of suction holes and capable of sucking air through the second suction hole independently of the first suction mechanism.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the technology of resin molding devices and methods for manufacturing resin molded products.

Background Art

[0002] Patent Document 1 discloses a resin molding device that performs compression molding on a workpiece. In the resin molding device described in Patent Document 1, a suction device is connected to a suction passage formed in the upper mold. The suction passage is opened at multiple locations on the lower surface (mold surface) of the upper mold. By operating the suction device and sucking air through the suction passage, the workpiece can be adsorbed and held on the upper mold.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, for workpieces such as those described in Patent Document 1, deformation (warpage) may occur due to electronic components fixed to the workpiece or the influence of the molded resin. In a resin molding device such as that described in Patent Document 1, if the workpiece adsorbed on the upper mold is deformed so as to separate from the upper mold and even a part of the suction passage is opened, the air pressure in the entire suction passage and the air pressure in the space below the workpiece will be the same, and the workpiece cannot be adsorbed, and there is a risk that the workpiece will fall from the upper mold.

[0005] The present invention has been made in view of the above situation, and the problem to be solved is to provide a resin molding device and a method for manufacturing a resin molded product capable of preventing the molded object from falling even when warpage occurs in the molded object.

Means for Solving the Problems

[0006] The problems that the present invention aims to solve are as described above, and in order to solve these problems, the resin molding apparatus according to the present invention is a resin molding apparatus that places a workpiece to be molded between an upper mold and a lower mold and performs compression molding, wherein the upper mold has a plurality of adsorption holes formed to open on the lower surface of the upper mold and for adsorbing the workpiece to be molded, and among the plurality of adsorption holes, multiple A first adsorption mechanism capable of drawing air from the first adsorption hole, and among the plurality of adsorption holes, multiple The device comprises a second adsorption mechanism capable of drawing air through the second adsorption hole, and capable of drawing air through the second adsorption hole independently of the first adsorption mechanism. Furthermore, the plurality of second suction holes are formed on the lower surface of the upper mold around the group composed of the plurality of first suction holes, and the first and second suction mechanisms draw in air, causing the object to be molded to be adsorbed into the plurality of suction holes formed on the lower surface of the upper mold, and when the object to be molded is adsorbed into the plurality of suction holes, and the outer circumference of the object to be molded bends downward and the second suction holes separate from the object to be molded, the first suction mechanism continues to adsorb the object to be molded by the first suction holes. It is what it is.

[0007] Furthermore, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes an adsorption step of adsorbing the object to be molded onto the lower surface of the upper mold, and a mold clamping step of clamping the upper mold and the lower mold. [Effects of the Invention]

[0008] According to the present invention, even if warping occurs in the object to be molded, it is possible to prevent the object from falling. [Brief explanation of the drawing]

[0009] [Figure 1] A front cross-sectional view showing the configuration of a resin molding apparatus according to the first embodiment. [Figure 2] (a) Front cross-sectional view showing the upper mold holder and upper mold. (b) Bottom view showing the upper mold. [Figure 3] A flowchart illustrating the manufacturing method of a resin molded product. [Figure 4] A front cross-sectional view showing a resin molding apparatus with the mold housing space sealed. [Figure 5] A front cross-sectional view showing a resin molding machine with the mold opened. [Figure 6] A front cross-sectional view showing the configuration of a resin molding apparatus according to the second embodiment. [Figure 7]A front cross-sectional view showing the configuration of a resin molding apparatus according to the third embodiment. [Figure 8] (a) Front cross-sectional view showing the upper mold holder and upper mold according to the modified example. (b) Bottom view showing the upper mold according to the modified example. [Modes for carrying out the invention]

[0010] <Resin molding apparatus 100 (first embodiment)> First, the resin molding apparatus 100 according to the first embodiment will be described using Figure 1.

[0011] The resin molding apparatus 100 shown in Figure 1 is capable of resin molding by compression molding. The resin molding apparatus 100 according to this embodiment can encapsulate electronic elements such as semiconductor chips fixed to a substrate W, which is the object to be molded, in resin to produce a resin molded product. The substrate W can be a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate. The substrate W may or may not have wiring. In each embodiment described below, a circular substrate W will be used. The resin molding apparatus 100 mainly comprises a lower mold holder 110, an upper mold holder 120, a sealing member 130, a lower mold 140, an upper mold 150, a pressure reducing pump 160, a central suction pump 170, an outer suction pump 180, and a mold clamping mechanism 190, etc.

[0012] The lower mold holder 110 supports the lower mold 140. The lower mold holder 110 comprises a bottom portion 110a that supports the lower mold 140 from below, and a side portion 110b formed to surround the lower mold 140 from the side.

[0013] The upper mold holder 120 supports the upper mold 150. The upper mold holder 120 includes an upper surface portion 120a that supports the upper mold 150 from above, and a side surface portion 120b formed so as to surround the upper mold 150 from the side. The lower mold holder 110 and the upper mold holder 120 form a space (accommodation space) for accommodating the mold (lower mold 140 and upper mold 150) during resin molding. Further, a decompression path 121, a central suction path 122, and an outer suction path 123 are formed in the upper mold holder 120.

[0014] The decompression path 121 is an air suction path for sucking air when decompressing the accommodation space of the mold. The decompression path 121 is formed so as to connect the inside of the upper mold holder 120 (accommodation space of the mold) and the outside. The decompression path 121 is formed to open at a position on the lower surface of the upper surface portion 120a that does not overlap with the upper mold 150 (around the upper mold 150).

[0015] The central suction path 122 is an air suction path for sucking air when sucking the substrate W through the central suction hole 151a formed in the upper mold 150. The central suction path 122 is formed so as to connect the inside of the upper mold holder 120 (accommodation space of the mold) and the outside. The central suction path 122 is formed to open at a position on the lower surface of the upper surface portion 120a that overlaps with the central suction hole 151a of the upper mold 150.

[0016] The outer suction path 123 is an air suction path for sucking air when sucking the substrate W through the outer suction hole 151b formed in the upper mold 150. The outer suction path 123 is formed so as to connect the inside of the upper mold holder 120 (accommodation space of the mold) and the outside. The outer suction path 123 is formed to open at a position on the lower surface of the upper surface portion 120a that overlaps with the outer suction hole 151b of the upper mold 150.

[0017] The decompression path 121, the central suction path 122, and the outer suction path 123 are formed independently of each other (so as not to be connected to each other).

[0018] Note that Fig. 1 etc. are schematic diagrams, and the specific shapes of the decompression path 121, the central suction path 122, and the outer suction path 123 are not particularly limited. That is, each path can be appropriately bent or branched as needed.

[0019] The seal member 130 is for sealing the gap between the lower mold holder 110 and the upper mold holder 120. The seal member 130 has a rectangular annular shape and is formed of an elastic material. The seal member 130 is disposed, for example, on the bottom surface of the side surface portion 120b of the upper mold holder 120 (the portion facing the side surface portion 110b of the lower mold holder 110). When the lower mold holder 110 and the upper mold holder 120 approach each other, the seal member 130 is sandwiched between the lower mold holder 110 and the upper mold holder 120, thereby sealing the gap between the lower mold holder 110 and the upper mold holder 120.

[0020] In the illustrated example, an example in which the seal member 130 is provided on the upper mold holder 120 is shown. However, for example, the seal member 130 may be provided on the lower mold holder 110, or the seal member 130 may be provided on both the lower mold holder 110 and the upper mold holder 120. Also, a plurality of seal members 130 can be provided. As a first example, another seal member 130 different from the seal member 130 disposed between the upper mold holder 120 and the lower mold holder 110 may be disposed at an intermediate portion of the side surface portion 120b of the upper mold holder 120. In this case, the other seal member 130 is sandwiched by the two side surface portions 120b. As a second example, another seal member 130 different from the seal member 130 disposed between the upper mold holder 120 and the lower mold holder 110 may be disposed at an intermediate portion of the side surface portion 110b of the lower mold holder 110. In this case, the other seal member 130 is sandwiched by the two side surface portions 110b. Also, the shape of the seal member 130 is not limited to a rectangular annular shape, and for example, a circular annular shape may be used.

[0021] The lower mold 140 forms the lower part of the molding die. The lower mold 140 mainly includes a bottom surface member 141, a side surface member 142, an elastic member 143, etc.

[0022] The bottom member 141 forms the bottom surface of the cavity C. The bottom member 141 is formed in a circular shape when viewed from above. The bottom member 141 is formed to have an appropriate vertical width. The bottom member 141 is positioned on the central part of the bottom surface portion 110a of the lower mold holder 110.

[0023] The side member 142 surrounds the bottom member 141 from the side. The side member 142 is frame-shaped and formed to have an appropriate vertical width. The side member 142 has a hollow portion that penetrates vertically through its center. The hollow portion of the side member 142 is formed to have a shape that, in plan view, roughly matches the outer shape of the bottom member 141.

[0024] Thus, the side member 142 is formed in a circular frame shape in plan view. The bottom member 141 is positioned in the hollow portion of the side member 142. The side member 142 is positioned on the bottom portion 110a of the lower mold holder 110 via an elastic member 143. The upper surface of the side member 142 is positioned above the upper surface of the bottom member 141. The side member 142, the bottom member 141, and the upper mold 150 define the cavity C for resin molding.

[0025] The elastic member 143 is positioned between the side member 142 and the bottom surface 110a of the lower mold holder 110. The elastic member 143 is formed, for example, by a compression coil spring that can expand and contract vertically.

[0026] Furthermore, adsorption holes (not shown) for adsorbing and holding a release film (not shown) are appropriately formed on the upper surface of the lower mold 140 (bottom member 141 and side member 142). By creating negative pressure in these adsorption holes using a pump or the like (not shown), the release film can be adsorbed and held.

[0027] The upper mold 150 forms the upper part of the molding die. The upper mold 150 is formed in a circular shape when viewed from the bottom. The upper mold 150 is formed to have an appropriate vertical width. The upper mold 150 is fixed to the central part of the lower surface of the upper surface portion 120a of the upper mold holder 120. Adsorption holes 151 are formed in the upper mold 150.

[0028] The adsorption holes 151 shown in Figure 2 are for adsorbing the substrate W. The adsorption holes 151 are formed to penetrate the upper mold 150 vertically. As shown in Figure 2(b), multiple adsorption holes 151 are formed throughout the entire area (circular area) facing the substrate W to be adsorbed. In this embodiment, the multiple adsorption holes 151 are classified into central adsorption holes 151a and outer adsorption holes 151b. Multiple central adsorption holes 151a and multiple outer adsorption holes 151b are provided.

[0029] The central suction hole 151a is a suction hole 151 formed in a predetermined range that includes the center (geometric center) of the shape (circular) of the substrate W when viewed from the bottom. A group composed of multiple central suction holes 151a is formed in a predetermined range. In this embodiment, the suction holes 151 inside the region L (the region shown by the dashed line in Figure 2(b)) which is set concentrically with the substrate W are set as the central suction holes 151a. The predetermined range corresponds to region L. The predetermined range may also include the center (geometric center) of the region that adsorbs the substrate W.

[0030] The outer adsorption holes 151b are adsorption holes 151 formed around the central adsorption hole 151a. In this embodiment, the adsorption holes 151 outside of region L (the region surrounding region L) are set as the outer adsorption holes 151b. The central adsorption hole 151a and the outer adsorption holes 151b in this embodiment are, respectively, embodiments of the first adsorption hole and the second adsorption hole according to the present invention.

[0031] When the upper mold 150 is attached to the upper mold holder 120, the central suction hole 151a is connected to the central suction path 122 of the upper mold holder 120. The outer suction hole 151b is connected to the outer suction path 123 of the upper mold holder 120.

[0032] The depressurization pump 160 is for drawing air from the depressurization path 121. The depressurization pump 160 is connected to the depressurization path 121 of the upper mold holder 120 via a depressurization connection path 161, which is made up of a suitable hose or the like. When the depressurization pump 160 is operated with the lower mold holder 110 and the upper mold holder 120 in close contact via the sealing member 130, the housing space of the mold is depressurized via the depressurization path 121. This suppresses the generation of voids in the resin molded product. The depressurization pump 160 in this embodiment is one embodiment of the depressurization mechanism according to the present invention.

[0033] The central suction pump 170 is for drawing air from the central suction path 122. The central suction pump 170 is connected to the central suction path 122 of the upper mold holder 120 via a connection path 171, which is made up of a suitable hose or the like. When the central suction pump 170 is activated, air is drawn in through the central suction path 122 from the central suction hole 151a of the upper mold 150. This allows the substrate W to be adsorbed and held in the central suction hole 151a.

[0034] The external suction pump 180 is for drawing air from the external suction path 123. The external suction pump 180 is connected to the external suction path 123 of the upper mold holder 120 via a connection path 181, which is made up of a suitable hose or the like. When the external suction pump 180 is activated, air is drawn in from the external suction hole 151b of the upper mold 150 via the external suction path 123. This allows the substrate W to be adsorbed and held in the external suction hole 151b. The central suction pump 170 and the external suction pump 180 are embodiments of the first and second pumps according to the present invention, respectively.

[0035] In this way, in the first embodiment, a central adsorption mechanism A for drawing air from the central adsorption hole 151a and an outer adsorption mechanism B for drawing air from the outer adsorption hole 151b are provided independently. The central adsorption mechanism A includes a central adsorption pump 170, a connection path 171, and a central adsorption path 122. The outer adsorption mechanism B includes an outer adsorption pump 180, a connection path 181, and an outer adsorption path 123. The central adsorption mechanism A and the outer adsorption mechanism B enable independent drawing of air from the central adsorption hole 151a and the outer adsorption hole 151b, respectively. The central adsorption mechanism A and the outer adsorption mechanism B in this embodiment are, respectively, embodiments of the first adsorption mechanism and the second adsorption mechanism according to the present invention.

[0036] The mold clamping mechanism 190 raises and lowers the lower mold 140 to perform mold clamping and mold opening. The mold clamping mechanism 190 can utilize a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. The mold clamping mechanism 190 is positioned below the lower mold holder 110, and the lower mold 140 can be raised and lowered via the lower mold holder 110.

[0037] The operation of each part of the resin molding apparatus 100 described above is appropriately controlled by a control device (not shown).

[0038] <Method for manufacturing resin molded products> Next, an example of a method for manufacturing a resin molded product using the resin molding apparatus 100 will be described.

[0039] As shown in Figure 3, the method for manufacturing a resin molded product according to this embodiment mainly includes a film placement step S10, a loading step S20, a depressurization step S30, a mold clamping step S40, a resin molding step S50, a mold opening step S60, and a removal step S70. These steps will be described in order below.

[0040] The film placement process S10 is the process of placing a release film (not shown) on the lower mold 140.

[0041] Specifically, in the film placement process S10, the release film is transported into the mold by a predetermined transport device. The release film is adsorbed onto the upper surface of the lower mold 140 and held in place so as to conform to the shape of the upper surface of the lower mold 140.

[0042] By providing a release film on the lower mold 140, it is possible to prevent the resin material R from adhering to the surface of the lower mold 140. Furthermore, if foreign matter adheres to the surface of the lower mold 140 (release film), the foreign matter can be easily removed by replacing the release film. Note that in the film placement step S10, the release film may be placed not only on the lower mold 140 but also on the upper mold 150.

[0043] After the release film is adsorbed onto the lower mold 140, the process moves from the film placement process S10 to the film loading process S20.

[0044] The loading process S20 is the process of loading the resin material R and the substrate W into the molding die.

[0045] Specifically, in the loading process S20, the resin material R is loaded into the mold by a predetermined conveying device. As shown in Figure 1, the resin material R is housed inside the lower mold 140 (inside the side member 142). The resin material R can be in various states, such as solid powdered resin (including granular resin) or liquid resin.

[0046] Furthermore, in the loading process S20, the substrate W is loaded into the mold by a predetermined transport device. As shown in Figure 1, the central suction pump 170 of the central suction mechanism A and the outer suction pump 180 of the outer suction mechanism B are activated, causing the substrate W to be adsorbed into the suction holes 151 (central suction hole 151a and outer suction holes 151b) of the upper mold 150.

[0047] In this case, the substrate W may be warped due to the influence of fixed electronic components, etc. (differences in the coefficient of thermal expansion). However, by adsorbing the substrate W along the lower surface of the upper mold 150 using the adsorption holes 151 (central adsorption hole 151a and outer adsorption holes 151b), the substrate W can be held in a state in which the warping has been corrected.

[0048] In addition, during the loading process S20, the substrate W can also be held in place by a mechanical clamp (not shown) provided on the upper mold 150, in addition to suction by the suction holes 151. This prevents the substrate W from falling even if a malfunction occurs in the suction by the suction holes 151.

[0049] Furthermore, the order in which the resin material R and the substrate W are introduced is not particularly limited. Either the resin material R or the substrate W may be introduced into the mold first, or the resin material R and the substrate W may be introduced into the mold simultaneously. Note that the introduction step S20 according to this embodiment is one form of implementing the adsorption step according to the present invention.

[0050] After the loading of the resin material R and substrate W is complete, the process moves from loading process S20 to depressurization process S30.

[0051] The depressurization process S30 is a process of reducing the pressure in the housing space of the mold.

[0052] Specifically, when the mold clamping mechanism 190 is driven, the lower mold holder 110 rises toward the upper mold holder 120. When the lower mold holder 110 rises to a predetermined position, the upper surface of the side portion 110b comes into contact with the lower surface of the side portion 120b of the upper mold holder 120 via the sealing member 130. This seals the housing space for the molding mold (lower mold 140 and upper mold 150) (see Figure 4). Note that in this state, the lower mold 140 and the upper mold 150 are not yet in contact.

[0053] In this state, the depressurization pump 160 is activated, which depressurizes (vacuums) the containment space of the mold. This removes air or gas from the resin material R, suppressing the formation of voids in the molded resin product.

[0054] Furthermore, when the substrate W is held by a mechanical clamp, the clamp releases before the lower mold 140 and the upper mold 150 come into contact (while there is a gap between the lower mold 140 and the upper mold 150). By releasing the clamp while there is a gap between the lower mold 140 and the upper mold 150 in this way, it becomes unnecessary to form a recess in the lower mold 140 to avoid contact between the clamp and the lower mold 140. This allows the use of a side member 142 with a smaller frame thickness. In this case, a wider cavity C can be secured.

[0055] When the depressurization pump 160 is activated and the containment space is depressurized, the pressure difference between the top and bottom of the substrate W adsorbed to the upper mold 150 decreases. Specifically, the difference between the pressure inside the adsorption hole 151 that adsorbs the substrate W and the pressure below the substrate W (containment space) becomes smaller. If the pressure inside the adsorption hole 151 is lower than the pressure below the substrate W, the substrate W is pushed from below to above, and the substrate W is adsorbed to the upper mold 150. The adsorption force that adsorbs the substrate W is greater the greater the pressure difference between the pressure inside the adsorption hole 151 and the pressure below the substrate W. If the pressure difference between the adsorption hole 151 and the containment space decreases, and if the substrate W has warped as described above, the adsorption force of the adsorption hole 151, which has decreased due to the decrease in pressure difference, may not be able to correct the warping of the substrate W, and the substrate W may separate from the upper mold 150.

[0056] Figure 4 shows an example in which the outer periphery of the substrate W is bent downwards (warped) so that it separates from the upper mold 150. When such deformation occurs, the outermost of the multiple suction holes 151, the outermost suction hole 151b, separates from the substrate W and connects to the containment space. In this state, even if the outer suction pump 180 is operating, the pressure difference between the air pressure at the outer suction hole 151b and the air pressure at the containment space disappears, making it impossible to adsorb the substrate W with the outer suction hole 151b.

[0057] However, in this embodiment, the substrate W is adsorbed from the central adsorption hole 151a via a path independent of the outer adsorption hole 151b. Therefore, even if the outer adsorption hole 151b and the containment space are connected, a certain degree of pressure difference between the air pressure at the central adsorption hole 151a and the air pressure at the containment space can be secured, and the substrate W can be adsorbed by the central adsorption hole 151a. In this way, by adsorbing the substrate W through multiple independent paths, the substrate W can be prevented from falling.

[0058] After the containment space is depressurized, the process moves from depressurization step S30 to mold clamping step S40.

[0059] The mold clamping process S40 is the process of closing (clamping) the molding molds (lower mold 140 and upper mold 150).

[0060] Specifically, in the mold clamping process S40, the resin material R contained in the cavity C is first heated by a heating mechanism (not shown) provided in the lower mold 140. A thermosetting resin material is used as the resin material R. When the temperature of a thermosetting resin material is increased, the viscosity of the resin material decreases temporarily, and then the resin material hardens. When the resin material R is heated, the viscosity of the resin material R decreases. If the resin material R is a solid resin material, the resin material R is melted by heating.

[0061] Next, the clamping mechanism 190 is driven, causing the lower mold holder 110 to rise while compressing the sealing member 130 vertically. Consequently, the lower mold 140 rises toward the upper mold 150. When the lower mold 140 reaches a predetermined position, the upper surface of the side member 142 contacts the lower surface of the upper mold 150 via the substrate W, and the lower mold 140 (the space containing the resin material R) is closed from above by the upper mold 150. In this embodiment, the lower mold 140 and the upper mold 150 are shown in contact via the substrate W; however, for example, the substrate W may be formed to a size that fits inside the cavity C, allowing the lower mold 140 and the upper mold 150 to make direct contact.

[0062] Furthermore, when the clamping mechanism 190 is driven, the bottom member 141 of the lower mold 140 rises further toward the upper mold 150. At this time, the side member 142 does not rise because it is in contact with the upper mold 150. In other words, the bottom member 141 rises relative to the side member 142. When the bottom member 141 rises, the resin material R contained in the lower mold 140 is pressurized. When the bottom member 141 has risen to a certain extent, the clamping is completed.

[0063] After the mold clamping is complete, the process moves from the mold clamping process S40 to the resin molding process S50.

[0064] The resin molding process S50 is a process in which the resin material R is cured and resin molding is performed.

[0065] Specifically, in the resin molding process S50, the resin material R is held under pressure for a predetermined time. This causes the temperature of the thermosetting resin material R to rise further, and the resin material R hardens. As a result, resin molding can be performed on the substrate W.

[0066] After the resin material R has cured, the process moves from the resin molding process S50 to the mold opening process S60.

[0067] The mold opening process S60 is the process of opening (opening) the molding molds (lower mold 140 and upper mold 150).

[0068] Specifically, as shown in Figure 5, in the mold opening process S60, the mold clamping mechanism 190 is driven, causing the lower mold 140 to descend so that it separates from the upper mold 150. As a result, the lower mold 140 separates from the lower surface of the upper mold 150.

[0069] Here, due to the difference in thermal shrinkage rates between the substrate W and the resin material R when cooled by mold opening, deformation (warping) may occur in the resin-molded substrate W (resin molded product). For example, Figure 5 shows an example in which the outer periphery of the resin-molded substrate W is bent downwards. When such deformation occurs, the outer suction holes 151b, which are formed on the outside of the multiple suction holes 151, separate from the substrate W and connect to the containment space. In this state, even if the outer suction pump 180 is operating, the pressure difference between the air pressure at the outer suction holes 151b and the air pressure at the containment space disappears, so the suction force decreases and the substrate W can no longer be adsorbed by the outer suction holes 151b.

[0070] However, in this embodiment, the substrate W is adsorbed from the central adsorption hole 151a via a path independent of the outer adsorption hole 151b. Therefore, even if the outer adsorption hole 151b and the containment space are connected, a certain degree of pressure difference between the air pressure at the central adsorption hole 151a and the air pressure at the containment space can be secured, and the substrate W can be adsorbed by the central adsorption hole 151a. In this way, by adsorbing the substrate W through multiple independent paths, the substrate W can be prevented from falling.

[0071] After the mold opening is complete, the process moves from the mold opening process S60 to the unloading process S70.

[0072] The unloading process S70 is the process of unloading the resin molded product from the mold. In the unloading process S70, the resin molded product is unloaded from the mold by a predetermined conveying device.

[0073] In this way, in this embodiment, even if deformation occurs in the substrate W (resin molded product) that is adsorbed onto the upper mold 150 before or after resin molding, it is possible to prevent the substrate W from falling.

[0074] Figure 5 shows an example where the central portion of the underside of the substrate W is sealed with resin. However, for example, a method (overmolding) may also be used in which not only the central portion of the underside of the substrate W but also the edges of the substrate W are sealed with resin.

[0075] <Resin molding apparatus 200 (second embodiment)> In the following section, the resin molding apparatus 200 according to the second embodiment will be described with reference to Figure 6.

[0076] The difference between the resin molding apparatus 200 according to the second embodiment and the resin molding apparatus 100 according to the first embodiment is that it can independently draw air from the central suction hole 151a and the outer suction hole 151b using two valves (central suction valve 220 and outer suction valve 230). Therefore, the following will mainly describe this difference, and the same configuration as in the first embodiment will not be described.

[0077] The resin molding apparatus 200 according to the second embodiment includes an adsorption pump 210, a central adsorption valve 220, and an outer adsorption valve 230.

[0078] The adsorption pump 210 is for drawing air from the central adsorption path 122 and the outer adsorption path 123. The adsorption pump 210 is connected to the central adsorption path 122 and the outer adsorption path 123 of the upper mold holder 120, respectively, via a connection path 211, which is made up of a suitable hose or the like. Specifically, the connection path 211 connected to the adsorption pump 210 branches into two connection paths 211a and 211b midway. One connection path 211a is connected to the central adsorption path 122 of the upper mold holder 120. The other connection path 211b is connected to the outer adsorption path 123 of the upper mold holder 120. Note that the connection path 211b and the outer adsorption path 123 in this embodiment are one form of the suction path according to the present invention.

[0079] The central adsorption valve 220 switches the flow of air through the connection path 211a by opening and closing the connection path 211a. The central adsorption valve 220 is installed in the middle of the connection path 211a.

[0080] The external adsorption valve 230 switches the flow of air through the connection path 211b by opening and closing the connection path 211b. The external adsorption valve 230 is located in the middle of the connection path 211b. Note that the external adsorption valve 230 in this embodiment is one embodiment of the valve according to the present invention.

[0081] In this second embodiment, a central suction valve 220, connection path 211a, and central suction path 122 (hereinafter referred to as "central suction mechanism A") for drawing air from the central suction hole 151a, and an outer suction valve 230, connection path 211b, and outer suction path 123 (hereinafter referred to as "outer suction mechanism B") for drawing air from the outer suction hole 151b are provided independently. In the second embodiment, a common suction pump 210 is used to draw air from the central suction mechanism A and the outer suction mechanism B.

[0082] In the second embodiment configured as described above, when the substrate W is adsorbed onto the upper mold 150 in the loading process S20, the central adsorption valve 220 and the outer adsorption valve 230 are opened, and the adsorption pump 210 is operated. This allows the substrate W to be adsorbed into the central adsorption hole 151a and the outer adsorption hole 151b.

[0083] As mentioned above, if the outer periphery of the substrate W separates from the upper mold 150 due to warping of the substrate W during the depressurization process S30 and the mold opening process S60, etc. (see Figures 4 and 5, etc.), the outer suction valve 230 of the outer suction mechanism B is closed. In this state, the substrate W can be held by the central suction hole 151a. Furthermore, even if the outer suction hole 151b and the containment space become connected due to the warping of the substrate W, the closing of the outer suction valve 230 ensures a certain degree of pressure difference between the air pressure at the central suction hole 151a and the air pressure at the containment space, thereby preventing the substrate W from falling.

[0084] Furthermore, the trigger for opening and closing the external suction valve 230 can be arbitrarily set. For example, if the timing of warping in the substrate W is known in advance depending on the resin molded product being manufactured, the external suction valve 230 can be configured to close at that timing. It is also possible to detect the presence or absence of warping in the substrate W using various sensors and control the operation of the external suction valve 230 according to the detection result.

[0085] Furthermore, when manufacturing resin molded products with the central suction valve 220 always open (when only the outer suction valve 230 is opened and closed), it is not always necessary to provide the central suction valve 220.

[0086] <Resin molding apparatus 300 (third embodiment)> In the following section, a resin molding apparatus 300 according to the third embodiment will be described with reference to Figure 7.

[0087] The difference between the resin molding apparatus 300 according to the third embodiment and the resin molding apparatus 100 according to the first embodiment is that the external adsorption mechanism B for drawing air from the external adsorption hole 151b is further composed of multiple (two in the illustrated example) independent paths. Therefore, the following will mainly describe this difference, and the same configuration as in the first embodiment will not be described.

[0088] In the resin molding apparatus 300 according to the third embodiment, the outer suction holes 151b formed outside the central suction hole 151a are further classified into two types of suction holes 151 (first outer suction hole 151ba and second outer suction hole 151bb).

[0089] The first outer adsorption pore 151ba is formed on the inner side of the multiple outer adsorption pores 151b. The second outer adsorption pore 151bb is formed on the outer side of the first outer adsorption pore 151ba.

[0090] Furthermore, the upper mold holder 120 has a first outer adsorption path 123a connected to the first outer adsorption hole 151ba, and a second outer adsorption path 123b connected to the second outer adsorption hole 151bb.

[0091] The external adsorption mechanism B can adsorb the substrate W into the first external adsorption hole 151ba using the first external adsorption pump 180a, the first connection path 181a, and the first external adsorption path 123a. The external adsorption mechanism B can also adsorb the substrate W into the second external adsorption hole 151bb using the second external adsorption pump 180b, the second connection path 181b, and the second external adsorption path 123b. In this way, the adsorption of the substrate W by the first external adsorption hole 151ba and the second external adsorption hole 151bb can be performed independently by multiple independent paths.

[0092] By configuring the external adsorption mechanism B in this way, the substrate W can be appropriately adsorbed according to the degree of warping of the substrate W. For example, if the warping of the substrate W is relatively large and the substrate W moves away from the first external adsorption hole 151ba and the second external adsorption hole 151bb, the substrate W can be adsorbed by the central adsorption hole 151a, preventing the substrate W from falling. Also, if the warping of the substrate W is relatively small and the substrate W moves away from the second external adsorption hole 151bb (but not from the first external adsorption hole 151ba), the substrate W can be adsorbed by the central adsorption hole 151a and the first external adsorption hole 151ba, allowing the substrate W to be more firmly adsorbed and held.

[0093] In the third embodiment, an example was shown in which the external adsorption mechanism B is configured with two independent paths. However, the present invention is not limited to this, and it is also possible to configure it with three or more independent paths.

[0094] Furthermore, in the third embodiment, an example was shown in which the substrate W is adsorbed independently from three types of adsorption holes 151 (central adsorption hole 151a, first outer adsorption hole 151ba, and second outer adsorption hole 151bb) using three pumps (central adsorption pump 170, first outer adsorption pump 180a, and second outer adsorption pump 180b), but the present invention is not limited to this. For example, as in the second embodiment (see Figure 6), it is also possible to configure the system to adsorb the substrate W independently from three types of adsorption holes 151 using a valve. It is also possible to configure the system to adsorb the substrate W independently from multiple types of adsorption holes 151 by appropriately combining multiple pumps and valves.

[0095] <Modified arrangement of adsorption pores 151> Below, we will describe a modified arrangement of the adsorption pores 151 using Figure 8.

[0096] In the first to third embodiments, an example was shown in which the adsorption holes 151 were formed in a region (circular region) facing the circular substrate W, assuming the use of a circular substrate W (see Figure 2(b)). However, the present invention is not limited to this, and the adsorption holes 151 can be formed in any region depending on the shape of the substrate W.

[0097] For example, Figure 8 shows an example (modified) of the arrangement of the adsorption holes 151 when a rectangular (square) substrate W is used. In the example shown in Figure 8, the adsorption holes 151 are formed over the entire area facing the rectangular substrate W (the rectangular area).

[0098] In the example shown in Figure 8, the suction holes 151 formed in a predetermined range (region L) that includes the center (geometric center) of the shape (rectangle) of the substrate W in a bottom view are set as the central suction holes 151a.

[0099] It should be noted that the arrangement of the first adsorption hole (central adsorption hole 151a) and the second adsorption hole (outer adsorption hole 151b) according to the present invention is not limited to the example shown in the above embodiment, and can be set arbitrarily. That is, as long as the first adsorption hole and the second adsorption hole according to the present invention can independently draw in air (adsorb the substrate W), their arrangement can be set arbitrarily. Generally, it is assumed that the outer peripheral portion of the substrate W deforms (bends) away from the upper mold 150, so it is preferable to set the second adsorption hole so as to surround the first adsorption hole, and furthermore, it is preferable to set the range including the center of the substrate W as the first adsorption hole.

[0100] In addition, if the curvature of the substrate W is known in advance, the first and second suction holes may be set at positions corresponding to the curvature of the substrate W. For example, when using a long substrate W (such as a rectangular substrate W), if it is known in advance that both ends in the longitudinal direction will be curved, the suction holes 151 that adsorb both ends in the longitudinal direction of the substrate W may be set as the second suction holes, and the suction holes 151 that adsorb the central part in the longitudinal direction of the substrate W may be set as the first suction holes.

[0101] Although embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate modifications can be made within the scope of the technical idea of ​​the invention as described in the claims.

[0102] For example, the above embodiment mainly shows an example using a circular substrate W (see Figure 2), but the shape of the substrate W is not limited to this, and it is possible to use a substrate W of any shape. In addition, depending on the shape of the substrate W (circular, rectangular, etc.), the shape of each part of the resin molding apparatus 100 (lower mold 140, upper mold 150, etc.) can be arbitrarily changed to a circular shape, a rectangular shape in plan view, etc.

[0103] Furthermore, the manufacturing method of the resin molded product shown in each of the above embodiments (see Figure 3) is just an example and can be modified as appropriate. For example, in each of the above embodiments, an example was shown in which the mold clamping process S40 is performed after the depressurization process S30 in which the containment space is depressurized, but it is also possible to perform the depressurization process S30 and the mold clamping process S40 in parallel. Also, in each of the above embodiments, an example was shown in which the release film is placed in the mold in the film placement process S10 and then the resin material R is loaded in the loading process S20, but for example, it is also possible to place the resin material R on the release film to be placed in the lower mold 140 and then place the release film in the lower mold 140 together with the resin material R.

[0104] Furthermore, although the above embodiments show examples in which a thermosetting resin material is used as the resin material R, the present invention is not limited to this, and a thermoplastic resin material may also be used. In addition, the above embodiments show examples in which the number of central adsorption holes 151a and outer adsorption holes 151b is 2 or more. However, the number of central adsorption holes 151a and outer adsorption holes 151b may be 1.

[0105] <Note> The resin molding apparatus 100, 200, and 300 of the first aspect of this disclosure are, A resin molding apparatus 100, 200, and 300 that places the object to be molded (substrate W) between an upper mold 150 and a lower mold 140 and performs compression molding, The upper mold 150 has a plurality of suction holes 151 formed to open on the lower surface of the upper mold 150 and for adsorbing the object to be molded. A first adsorption mechanism (central adsorption mechanism A) capable of drawing air from at least one first adsorption hole (central adsorption hole 151a) among the plurality of adsorption holes 151, A second adsorption mechanism (outer adsorption mechanism B) is capable of drawing in air from at least one second adsorption hole (outer adsorption hole 151b) among the plurality of adsorption holes 151, and is capable of drawing in air through the second adsorption hole independently of the first adsorption mechanism, It is equipped with. According to the resin molding apparatus 100, 200, and 300 of the first aspect of this disclosure, even if the object to be molded (substrate W) warps, it is possible to prevent the object from falling. That is, by adsorbing the object to be molded with a first suction mechanism and a second suction mechanism that are independent of each other, even if adsorption by one suction mechanism becomes impossible due to the warping of the object to be molded, the object to be molded can still be adsorbed and held by the other suction mechanism.

[0106] In the resin molding apparatus 100, 200, and 300 of the second side following the first side, Multiple first adsorption holes (central adsorption hole 151a) and multiple second adsorption holes (outer adsorption holes 151b) are provided, The plurality of second adsorption holes are formed on the lower surface of the upper mold 150 around the group composed of the plurality of first adsorption holes. According to the resin molding apparatus 100, 200, and 300 of the second aspect of this disclosure, even if warping occurs in the outer peripheral portion of the object to be molded (substrate W), the object to be molded can be properly held in the upper mold 150.

[0107] In a resin molding apparatus 100 having a third side corresponding to the first or second side, The first adsorption mechanism (central adsorption mechanism A) is equipped with a first pump (central adsorption pump 170) that draws air from the first adsorption hole (central adsorption hole 151a), The second adsorption mechanism (external adsorption mechanism B) is equipped with a second pump (external adsorption pump 180) that draws air from the second adsorption hole (external adsorption hole 151b). According to the resin molding apparatus 100 of the third aspect of this disclosure, it is possible to prevent the molded object from falling without performing complex control such as opening and closing valves.

[0108] In a resin molding apparatus 200 having a fourth side that follows any one of the first to third sides, The second adsorption mechanism (external adsorption mechanism B) is, A suction path (connection path 211b, outer adsorption path 123) is connected to the second adsorption hole (outer adsorption hole 151b) and guides the air drawn in from the second adsorption hole, A valve (external adsorption valve 230) capable of switching the flow of air in the aforementioned suction path, It is equipped with. According to the resin molding apparatus 200 of the fourth aspect of this disclosure, it is possible to prevent the object to be molded from falling, even while using a common pump (adsorption pump 210) for the first adsorption mechanism and the second adsorption mechanism.

[0109] The resin molding apparatus 100, 200, and 300, which have a fifth side following any one of the first to fourth sides, The system further includes a depressurization mechanism (depressurization pump 160) capable of reducing the pressure in the space (housing space) in which the upper mold 150 and the lower mold 140 are arranged. According to the resin molding apparatus 100, 200, and 300 of the fifth aspect of this disclosure, it is possible to suppress the occurrence of voids in the resin molded product by reducing the pressure of the containment space, and to prevent the molded object from falling when the pressure is reduced.

[0110] The manufacturing method for the sixth side of the resin molded product is as follows: A method for manufacturing a resin molded product using resin molding apparatus 100, 200, or 300 that conforms to any one of the first to fifth sides, The process includes an adsorption step (loading step S20) in which the object to be molded (substrate W) is adsorbed onto the lower surface of the upper mold 150, A mold clamping process S40 is performed to clamp the upper mold 150 and the lower mold 140, Includes. According to the method for manufacturing a resin molded product described in the sixth aspect of this disclosure, even if warping occurs in the object to be molded (substrate W), it is possible to prevent the object from falling. [Explanation of symbols]

[0111] 100 Resin molding equipment 140 Lower mold 150 upper mold 151 Adsorption hole 151a Central suction hole 151b Outside suction hole 170 Central Adsorption Pump 180 External adsorption pump 210 Adsorption pump 220 Central suction valve 230 External suction valve A Central suction mechanism B Outside suction mechanism W board

Claims

1. A resin molding apparatus that places the object to be molded between an upper mold and a lower mold and performs compression molding, The upper mold has a plurality of suction holes formed to open on the lower surface of the upper mold, for adsorbing the object to be molded. A first adsorption mechanism capable of drawing air from multiple first adsorption holes among a plurality of adsorption holes, A second adsorption mechanism capable of drawing air from multiple second adsorption holes among the multiple adsorption holes, and capable of drawing air through the second adsorption holes independently of the first adsorption mechanism, It is equipped with, The plurality of second adsorption holes are formed on the lower surface of the upper mold around the group composed of the plurality of first adsorption holes. The first adsorption mechanism and the second adsorption mechanism draw in air, causing the object to be molded to be adsorbed into the plurality of adsorption holes formed on the lower surface of the upper mold. A resin molding apparatus in which, when the object to be molded is adsorbed by a plurality of adsorption holes, the first adsorption mechanism continues to adsorb the object to be molded by the first adsorption hole when the outer peripheral portion of the object to be molded bends downward and the second adsorption hole separates from the object to be molded.

2. The first adsorption mechanism comprises a first pump that draws air from the first adsorption hole, The second adsorption mechanism comprises a second pump that draws air from the second adsorption hole. The resin molding apparatus according to claim 1.

3. The second adsorption mechanism is, A suction path connected to the second adsorption hole and guiding the air drawn in from the second adsorption hole, A valve capable of switching the flow of air in the aforementioned suction path on or off, Equipped with, The resin molding apparatus according to claim 1.

4. The system further comprises a depressurization mechanism capable of reducing the pressure in the space in which the upper and lower molds are arranged. The resin molding apparatus according to claim 1.

5. A method for manufacturing a resin molded product using a resin molding apparatus according to any one of claims 1 to 4, A suction step of adsorbing the object to be molded onto the lower surface of the upper mold, A mold clamping step in which the upper mold and the lower mold are clamped together, A method for manufacturing resin molded products containing [a specific component].

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