Semiconductor switch device and power supply system with terminal cover

Abstract

To provide a semiconductor switch device with a terminal cover capable of securing a predetermined creepage distance between lead terminals, and a power supply system employing the same.SOLUTION: A semiconductor switch device 1 with a terminal cover comprises: a package 10 in which first to third lead terminals 20-40 extrude from a side face 12 of a package main body 11; and an insulative terminal cover 50 which is mounted near a root of the second lead terminal 30. The terminal cover 50 has one end in contact with the side face 12 of the package main body 11, and the other end having a lead-out port where the second lead terminal 30 is led out. The first lead terminal 20 and / or the third lead terminal 40 are / is bent toward a circuit board in a location corresponding to a middle position in the terminal cover 50 extending from the side face 12 of the package main body 11, and a predetermined creepage distance is secured between a part of the second lead terminal 30 led out of the lead-out port, and the first lead terminal 20 or the third lead terminal 40.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] One aspect of the present invention relates to a semiconductor switch device with a terminal cover and a power supply system using the same.

Background Art

[0002] In the FET (Field Effect Transistor) mounting structure disclosed in Patent Document 1, a resin plate attached to the surface of a circuit board has guide holes for inserting the lead terminals of each FET.

[0003] When stress is applied to the root portion of the lead terminal close to the package body of the semiconductor switch device, the moisture resistance of the package body due to the mold resin decreases. Therefore, when bending (forming) the lead terminal, it is recommended to bend the lead terminal at a location that is a certain distance away from the package body.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a semiconductor switch device, the distance between the roots of three lead terminals is determined according to the package size. For example, in a TO-247 package, the distance between the root of the gate terminal and the root of the drain terminal, and the distance between the root of the drain terminal and the root of the source terminal are each 3 millimeters [mm] or less.

[0006] Components used in power supply systems that input and output high-voltage power, such as power conditioners for renewable energy (e.g., solar power generation), are required by law to have a specified insulation distance (clearance, creepage distance) to ensure electrical insulation. The higher the input and output voltage, the longer the creepage distance required.

[0007] In recent years, semiconductor switch devices (e.g., SiC-FETs) have shown remarkable performance improvements and offer sufficient durability for high-voltage applications. However, as mentioned above, the distance between the three lead terminals is determined by the package size, so small semiconductor switch devices may not be able to secure the creepage distance required for power supply system applications. As a result, semiconductor switch devices that are superior in both performance and cost cannot be used in power supply systems.

[0008] One aspect of the present invention provides a semiconductor switch device with a terminal cover that can secure a predetermined creepage distance between lead terminals, and a power supply system using the same. [Means for solving the problem]

[0009] A semiconductor switch device with a terminal cover according to one aspect of the present invention comprises a package from which a first lead terminal, a second lead terminal, and a third lead terminal protrude from the side of the package body, and an insulating terminal cover attached near the base of the second lead terminal. The terminal cover has one end that contacts the side of the package body and the other end that has an outlet for leading out the second lead terminal. At a point corresponding to an intermediate position on the terminal cover extending from the side of the package body, the first lead terminal and / or the third lead terminal are bent toward the circuit board. A predetermined creepage distance is ensured between the portion of the second lead terminal leading out from the outlet and the first lead terminal or the third lead terminal. [Effects of the Invention]

[0010] According to the above embodiment, a semiconductor switch device can be provided that can secure a predetermined creepage distance between lead terminals. [Brief explanation of the drawing]

[0011] [Figure 1] This is a perspective view of a semiconductor switch device with a terminal cover. [Figure 2] This is a perspective view of the terminal cover. [Figure 3] This diagram illustrates the creepage distance in a semiconductor switch device with a terminal cover and the creepage distance in a semiconductor switch device without a terminal cover. [Figure 4] This is a diagram illustrating an example of power conditioner installation. [Figure 5] This diagram illustrates the circuit board and heatsink built into the power conditioner, with (A) being a side view and (B) being a top view. [Modes for carrying out the invention]

[0012] The semiconductor switch device with a terminal cover comprises a package from which a first lead terminal, a second lead terminal, and a third lead terminal protrude from the side of the package body, and an insulating terminal cover attached near the base of the second lead terminal. The terminal cover has one end that contacts the side of the package body and the other end that has an outlet for leading out the second lead terminal. At a point corresponding to an intermediate position on the terminal cover extending from the side of the package body, the first lead terminal and / or the third lead terminal are bent toward the circuit board. A predetermined creepage distance is ensured between the portion of the second lead terminal leading out from the outlet and the first lead terminal or the third lead terminal.

[0013] The semiconductor switch device may be a SiC (silicon carbide) FET, but is not limited to it. The creepage distance may be the distance (spatial distance) along a virtual straight line connecting the point derived from the terminal cover of the second lead terminal and the first lead terminal in the shortest possible time, or it may be the distance (spatial distance) along a virtual straight line connecting the point derived from the terminal cover of the second lead terminal and the third lead terminal in the shortest possible time. The terminal cover may be retrofitted to the package, but is not limited thereto.

[0014] In the semiconductor switch device with a terminal cover having the above configuration, a predetermined creepage distance can be secured between the lead terminals by bending the first lead terminal and / or the third lead terminal at a position corresponding to the middle of the terminal cover. Therefore, the semiconductor switch device with a terminal cover can be suitably used for high-voltage applications such as power systems. By retrofitting the terminal cover to secure the creepage distance, existing devices that could not be applied so far due to the inability to secure the creepage distance can be applied to the power system.

[0015] The terminal cover may be provided on the front wall and have an opening for filling an insulating filler that extends from one end to the other end of the terminal cover.

[0016] The filler may be an adhesive that is introduced into the terminal cover with fluidity and then solidifies, but is not limited thereto, and may be other encapsulating resins. According to the above configuration, the operation of attaching the terminal cover to the second lead terminal can be easily performed. The resin molding of the terminal cover can also be easily performed. By filling the terminal cover covering the vicinity of the root of the second lead terminal with a filler, it is possible to prevent tracking (a phenomenon in which dust containing moisture adheres between the lead terminals and causes a short circuit) from occurring between the lead terminals.

[0017] The terminal cover may cover the root portion of the second lead terminal and a part of the deformable portion connected to the root portion, and expose the other part of the deformable portion to the outside of the terminal cover.

[0018] According to the above configuration, by covering the terminal cover from the root portion of the second lead terminal to a part of the deformable portion (covering a certain range of the second lead terminal), a predetermined creepage distance can be secured between the lead terminals. The deformable portion may have a smaller width dimension and thickness dimension than the root portion in order to facilitate forming.

[0019] The outer surface of the side wall of the terminal cover may face the base portion and a part of the deformable portion of the first lead terminal, or the base portion and a part of the deformable portion of the third lead terminal.

[0020] According to the above configuration, a terminal cover that does not cover adjacent first lead terminals or third lead terminals but only covers the second lead terminal is used to block the space between the portion led out from the terminal cover of the second lead terminal and the first lead terminal or the third lead terminal. Since the terminal cover only covers the second lead terminal, the attachment work is easy, the terminal cover can be miniaturized, and the additional cost can be reduced.

[0021] The deformable portion of the second lead terminal exposed from the terminal cover is bent toward the circuit board, and the outer surface of the rear wall of the terminal cover may face the circuit board.

[0022] According to the above configuration, the space between the conductor on the circuit board and the second lead terminal can be blocked by the rear wall of the terminal cover. When attaching the terminal cover, by inserting a jig between the inner corner portion of the bent portion of the second lead terminal and the rear wall of the terminal cover and then putting a filler into the terminal cover, the vicinity of the base of the second lead terminal can be insulated without gaps.

[0023] The second lead terminal may be a terminal (for example, a main circuit terminal) that has a higher voltage than the first lead terminal and the third lead terminal.

[0024] According to the above configuration, the terminal with the highest voltage can be kept away from the low-voltage signal terminals and ground terminals, ensuring a physical creepage distance and improving reliability.

[0025] The rear wall may have a convex portion that catches on the circuit board.

[0026] According to the above configuration, by hooking the terminal cover on the circuit board, accidental dropping of the terminal cover can be prevented. Even if the filler (adhesive) deteriorates over time, dropping of the terminal cover can be prevented.

[0027] Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments.

[0028] As shown in Figure 1, the semiconductor switch device 1 with a terminal cover comprises a TO-247 package 10 and an insulating terminal cover 50. The package 10 may be a semiconductor switch device such as a SiC-FET.

[0029] The package 10 has a package body 11 that is approximately rectangular in shape when viewed from above, and a first lead terminal 20, a second lead terminal 30, and a third lead terminal 40 that protrude from one side 12 of the package body 11. The first lead terminal 20, the second lead terminal 30, and the third lead terminal 40 protrude parallel to the side 12 when viewed from above.

[0030] The first lead terminal 20, the second lead terminal 30, and the third lead terminal 40 each have a base portion and a variable portion that is smaller in width than the base portion.

[0031] In a SiC-FET, the first lead terminal 20 is the gate terminal (low-voltage signal terminal), the second lead terminal 30 is the drain terminal (high-voltage main circuit terminal), and the third lead terminal 40 is the source terminal (ground terminal).

[0032] The terminal cover 50 is attached to the second lead terminal 30. The terminal cover 50 is made of resin and has one end that contacts the side surface 12 of the package body 11, the other end that has an outlet for leading out the second lead terminal 30, and an opening provided between the one end and the other for inserting adhesive 60.

[0033] As shown in Figure 2, the terminal cover 50 has a roughly rectangular parallelepiped shape and has a front wall 54, side walls 51 and 52, and a rear wall 53 that surround the second lead terminal 30 (see Figure 1). The front wall 54, side walls 51 and 52, and rear wall 53 define an internal space for housing the base of the second lead terminal 30. The internal space is in communication with an outlet 56 for leading out the second lead terminal 30.

[0034] The front wall 54 is provided with an opening 57 that extends from one end (upper end) to the other end (lower end). In this embodiment, the opening 57 is a straight slit and communicates with the outlet 56. The opening 57 is also used to remove the mold core when resin molding the terminal cover 50.

[0035] The side walls 51 and 52 have thickened portions 51a and 52a on the lower side (opposite the package body 11) in Figure 2, where the inner surface bulges outwards toward the internal space. This configuration allows the second lead terminal to be led out from the outlet 56 while preventing the adhesive 60 (see Figure 1) introduced from the opening 57 from overflowing downwards in Figure 2. The front wall 54 and the rear wall 53 may also have such thickened portions.

[0036] The rear wall 53 has a stepped portion 57 formed on its upper inner surface (a thin-walled portion is formed), which expands the internal space. This configuration makes it easier for the adhesive 60 (see Figure 1) introduced from the opening 57 to flow upward towards the package body 11 in Figure 2, and also prevents the adhesive 60 from overflowing from the internal space. The side walls 51, 52 and the front wall 54 may also have such thin-walled portions.

[0037] The rear wall 53 has a protrusion 53a at one end (upper end) of its outer surface that hooks onto the circuit board described later.

[0038] As shown in Figure 1, the terminal cover 50 covers the base of the second lead terminal 30 and a portion of the variable-shaped part connected to the base, while the remaining portion of the variable-shaped part (the part closer to the tip) is exposed to the outside from the terminal cover 50.

[0039] The second lead terminal 30 has a variable portion exposed to the outside from the terminal cover 50, which is bent toward the circuit board 110 shown by the dashed line in Figure 1.

[0040] The outer surface of the rear wall 53 (see Figure 2) of the terminal cover 50 faces the circuit board 110.

[0041] The terminal cover 50 has one side wall 51 whose outer surface faces the base and a portion of the variable part of the first lead terminal 20. The terminal cover 50 has the other side wall 52 whose outer surface faces the base and a portion of the variable part of the third lead terminal 40.

[0042] In Figure 1, the variable portion of the first lead terminal 20 is bent toward the circuit board 110 at a point corresponding to an intermediate position on the terminal cover 50 extending from the side surface 12 of the package body 11. In a direction parallel to the side surface 12 of the package body 11, the outer surface of the side wall 51 of the terminal cover 50 faces the bent portion of the first lead terminal 20. Similarly, the variable portion of the third lead terminal 40 is also bent toward the circuit board 110. The outer surface of the side wall 52 of the terminal cover 50 faces the bent portion of the third lead terminal 40. As a result, the first lead terminal 20 and the third lead terminal 40 are not located to the side (in a direction parallel to the side surface 12 of the package body 11) of the second lead terminal 30 that is led out from the outlet 56 of the terminal cover 50 (see Figure 2).

[0043] If the first lead terminal 20 and the third lead terminal 40 are located to the side of the second lead terminal 30, the creepage distance (space distance) D2 will be short, corresponding to the package size, similar to the case in Figure 3(B) where there is no terminal cover.

[0044] In contrast, in this embodiment, as schematically shown in Figure 3(A), a terminal cover 50 is attached to the second lead terminal 30, and the first lead terminal 20, the second lead terminal 30, and the third lead terminal 40 are bent in the same direction at the dashed line in Figure 3(A). As a result, the creepage distance D1 becomes longer than that D2 in Figure 3(B). Note that the adhesive is not shown in Figure 3(A).

[0045] Refer to Figure 1 for a more detailed explanation. In a plan view, the lower end of the terminal cover 50 (lower end of the side wall 51) is located between the second lead terminal 30 near the outlet 56 of the terminal cover 50 (see Figure 2) and the bent portion of the first lead terminal 20, thus blocking the space between them. Similarly, the lower end of the terminal cover 50 (lower end of the side wall 52) is located between the second lead terminal 30 near the outlet 56 of the terminal cover 50 and the bent portion of the third lead terminal 40, thus blocking the space between them.

[0046] As a result, as shown in Figure 3(A), the creepage distance D1 (a virtual straight line that connects the second lead terminal 30 to the first lead terminal 20 or the third lead terminal 40 in the shortest possible distance so as not to interfere with the lower end of the terminal cover 50 in a plan view) is made longer.

[0047] As shown in Figure 1, the tips of the first, second, and third lead terminals 20, 30, and 40, which are bent toward the circuit board 110, are inserted into (or joined to) three through-holes formed in the circuit board 110. If the centers of each of these through-holes (or lands) are connected by an imaginary straight line, an inverted triangle is formed whose base is approximately parallel to the edge 110a of the circuit board 110. The hypotenuses S1 and S2 of this inverted triangle are blocked by the side walls 51 and 52 of the terminal cover 50.

[0048] In this way, a predetermined creepage distance D1 (for example, 7 mm) is ensured between the point where the second lead terminal 30 is led out from the outlet 56 and the first lead terminal 20 or the third lead terminal 40. This makes it possible to use a small semiconductor switch device in a power conditioner that inputs and outputs high voltage (for example, 1000 volts) power.

[0049] The method for attaching the terminal cover 50 to the second lead terminal 30 will be explained. The terminal cover 50 is retrofitted to the existing package 10 (semiconductor switch device) using the following procedure.

[0050] First, the variable parts of the first lead terminal 20, the second lead terminal 30, and the third lead terminal 40 of package 10 are bent in the same direction along the dashed lines in Figure 3(A).

[0051] Next, place the terminal cover 50 on the work surface in the orientation shown in Figure 1, with the opening for introducing the adhesive 60 facing upwards.

[0052] Next, the package 10 is placed on the work surface so that the base of the second lead terminal 30 is housed in the internal space of the terminal cover 50 through the opening 57 (see Figure 2). The variable portions of the first lead terminal 20, the second lead terminal 30, and the third lead terminal 40 are pre-bent as described above.

[0053] Next, as shown in Figure 1, adhesive 60 is introduced into the internal space of the terminal cover 50 through the opening 57 of the terminal cover 50 (see Figure 2), and the internal space is almost completely filled with adhesive 60. With a jig (not shown) inserted between the inner corner portion of the bent part of the second lead terminal 30 and the terminal cover 50 (with the terminal cover 50 pressed against the package body 11), the adhesive 60 is introduced into the terminal cover 50, thereby completely insulating the area near the base of the second lead terminal 30 with adhesive 60.

[0054] As a result, the package 10 and the terminal cover 50 are fixed together with adhesive 60, and the area near the base of the second lead terminal 30 is sealed with adhesive 60, ensuring a sufficient creepage distance between the lead terminals 20, 30, and 40.

[0055] Figure 4 illustrates an example of the installation of the power conditioner 100. As shown in Figure 4, the power conditioner 100 is supported by a structure including multiple support columns 310, which is installed, for example, in a commercial or public facility. The solar panel A is also supported by this structure. The power conditioner 100 is electrically connected to the solar panel A, and to the energy storage device B and load C installed outside the structure.

[0056] The power conditioner 100 converts DC power from solar panel A or energy storage device B into AC power and supplies it to load C. The power conditioner 100 is also electrically connected to a commercial power grid (not shown), and can sell the AC power converted from DC power from solar panel A to the commercial power grid. A semiconductor switch device is used for power conversion.

[0057] Inside the casing of the power conditioner 100, the circuit board 110 shown in Figures 5(A) and 5(B) is held in a position extending almost vertically. Multiple (12 in this embodiment) semiconductor switch devices 1 with terminal covers are mounted on the circuit board 110, and a drive circuit 120 for driving these switch devices 1, multiple electrolytic capacitors 130, and the like are also provided. Electrolytic capacitors 130 that are subjected to high voltage (high-voltage system) and require a long creepage distance are located near the semiconductor switch devices 1 with terminal covers. The drive circuit 120 for low-voltage system, which does not require a long creepage distance, is located away from the semiconductor switch devices 1 with terminal covers, with the electrolytic capacitors 130 sandwiched between it and the semiconductor switch devices 1 with terminal covers.

[0058] In Figures 5(A) and 5(B), the terminal cover 50 shown in Figures 1 to 3 is omitted, but the protrusion 53a of the terminal cover 50 shown in Figure 2 catches on the upper edge (top side) 110a of the circuit board 110 shown in Figure 5(B).

[0059] As shown in Figure 5(A), the package body of the semiconductor switch device 1 with multiple terminal covers protrudes from the edge (upper end) 110a of the circuit board 110 and is supported by a single heat sink 150 located on the back side of the package body instead of the circuit board 110. The heat sink 150 is located on the back side of the circuit board 110 and has a thickened portion where the part that protrudes from the circuit board 110 and supports the package body (upper part) is almost flush with the circuit board 110. In other words, the part of the heat sink 150 that protrudes from the edge (upper end) of the circuit board 110 has a thickened portion. As shown in Figure 5(B), the thickened portion of the single heat sink 150 that extends horizontally may directly support the multiple package bodies, or it may be supported via an insulating sheet such as a thermal conductive sheet.

[0060] The heatsink 150 has a plate shape overall, although it is equipped with heat dissipation fins (not shown) on its back. The heatsink 150 forms part of the housing of the power conditioner 100 (see Figure 4) (for example, the back wall of the housing), and the heat dissipation fins (not shown) are exposed to the outside air.

[0061] As shown in Figure 5(A), the tips of the first lead terminal, second lead terminal, and third lead terminal, which are bent toward the circuit board 110, are soldered to the circuit board 110. When the three through-holes formed in the circuit board 110 are connected by a virtual straight line, an inverted triangle is formed (see Figure 1). The first and third lead terminals are soldered to the two upper through-holes, and the second lead terminal is soldered to the through-hole at the lower vertex. The hypotenuses S1 and S2 of this inverted triangle are blocked by the side walls 51 and 52 of the terminal cover 50.

[0062] The semiconductor switch device 1 with terminal cover described above can be suitably used in a power supply system including a power conditioner because the terminal cover 50 ensures a predetermined creepage distance between the lead terminals 20, 30, and 40.

[0063] A power conditioner 100, which has a semiconductor switch device 1 with a terminal cover attached near the upper end of a circuit board 110 held in an almost vertical position, with the variable parts of the first, second, and third lead terminals bent toward the circuit board 110, also provides the following effects. (1) High efficiency of the power conditioner 100 can be achieved by using small, high-performance SiC-FETs (existing devices, commercially available devices). (2) By hooking the protrusion 53a of the terminal cover 50 onto the upper end 110a of the circuit board 110, the terminal cover 50 can be prevented from falling unintentionally. (3) By bending the lead terminals so that the back of the package body is almost parallel to the circuit board 110 and protrudes from the edge of the circuit board 110, and then soldering them to the circuit board 110, the structure of the heat sink 150 for cooling the package is simplified. Since the heat-generating package body is located above the circuit board 110, the thermal impact on other components mounted on the circuit board 110 and located below it can be reduced. (4) As shown in Figure 1, the opening 57 of the terminal cover 50 is located on the opposite side from the circuit board 110 and is accessible, so adhesive 60 can be added to the terminal cover 50 after the semiconductor switch device has been soldered.

[0064] The present invention is not limited to the embodiments described above and can be modified as appropriate. The semiconductor switch device is not limited to SiC elements, but may also use GaN or Si elements. The package may be of a type other than TO247, such as TO220 or TO3P.

[0065] An example has been described in which the first lead terminal 20, the second lead terminal 30, and the third lead terminal 40 are bent in the same direction; however, they may be bent in different directions.

[0066] An example was described in which the terminal cover 50 is brought into direct contact with the side 12 of the package body 11 and the terminal cover 50 and the package body 11 are fixed together with adhesive 60. Alternatively, the terminal cover 50 and the package body 11 may be fixed together using another component such as adhesive tape.

[0067] The power supply system may be an uninterruptible power supply (UPS) instead of a power conditioner, an inverter for a cogeneration system, a rectifier, or a DC power supply. The power conditioner is not limited to solar power generation; it may also be for wind power generation.

[0068] The power supply system may have the following configurations (1) to (6) in order to simplify the cooling structure while achieving high cooling efficiency. (1) Circuit board and, A semiconductor switch device having a package body and first, second, and third lead terminals, wherein the lead terminals are bent and soldered to the circuit board such that the back surface of the package body is substantially parallel to the circuit board and protrudes from the edge of the circuit board, The circuit board comprises a plate-shaped heat sink positioned on the back side, The heat sink has a thickened portion that protrudes from the edge of the circuit board and supports the semiconductor switch device from the rear side, in a power supply system.

[0069] (2) The power supply system according to (1) above, wherein the lead terminals of a plurality of semiconductor switch devices are soldered to the circuit board such that their package bodies protrude from the upper end of the circuit board, and the thick portion of the heat sink extends horizontally to directly or indirectly support the backs of the package bodies.

[0070] (3) The power supply system according to (1) or (2) above, wherein the heat sink constitutes part of the housing of the power supply system.

[0071] (4) The power supply system according to any one of (1) to (3) above, wherein the circuit board has three through-holes or lands to which the first, second, and third lead terminals are joined, and the base of the inverted triangle formed by connecting them is substantially parallel to the edge of the circuit board.

[0072] (5) The power supply system according to any one of (1) to (4) above, wherein a terminal cover is attached between the bent portion of the second lead terminal and the package body to ensure a predetermined creepage distance between the lead terminals.

[0073] (6) The terminal cover is retrofitted to the semiconductor switch device, the power supply system as described in (5) above.

[0074] (7) The power supply system according to (5) or (6) above, wherein the terminal cover is attached to the second lead terminal so as to provide access to an opening for filling material. [Explanation of symbols]

[0075] 1. Semiconductor switch device with terminal cover 10 Packages (Semiconductor Switch Devices) 11. Package body 12 Side view 20 Gate terminal (1st lead terminal) 30 Drain terminal (2nd lead terminal) 40 Source terminal (3rd lead terminal) 50 Terminal Cover 60 Adhesives (fillers) 100 Power Conditioners (Power Supply Systems)

Claims

1. A package in which the first lead terminal, the second lead terminal, and the third lead terminal protrude from the side of the package body, It comprises an insulating terminal cover attached near the base of the second lead terminal, The terminal cover has one end that contacts the side of the package body and the other end that has an outlet for leading out the second lead terminal. At a point corresponding to an intermediate position on the terminal cover extending from the side of the package body, the first lead terminal and / or the third lead terminal are bent toward the circuit board. The terminal cover has an opening in its front wall that extends from one end to the other of the terminal cover, for inserting an insulating filler. Semiconductor switch device with terminal cover.

2. The semiconductor switch device with a terminal cover according to claim 1, wherein the terminal cover covers the base of the second lead terminal and a part of the variable-shaped portion connected to the base, and the other part of the variable-shaped portion is exposed to the outside from the terminal cover.

3. The semiconductor switch device with a terminal cover according to claim 2, wherein the outer surface of the side wall of the terminal cover faces the base and part of the variable portion of the first lead terminal, or the base and part of the variable portion of the third lead terminal.

4. The variable portion of the second lead terminal exposed from the terminal cover is bent toward the circuit board. The semiconductor switch device with a terminal cover according to claim 2 or claim 3, wherein the outer surface of the back wall of the terminal cover faces the circuit board.

5. The semiconductor switch device with a terminal cover according to any one of claims 1 to 4, wherein the second lead terminal has a higher voltage than the first lead terminal and the third lead terminal.

6. A package in which the first lead terminal, the second lead terminal, and the third lead terminal protrude from the side of the package body, It comprises an insulating terminal cover attached near the base of the second lead terminal, The terminal cover has one end that contacts the side of the package body and the other end that has an outlet for leading out the second lead terminal. At a point corresponding to an intermediate position on the terminal cover extending from the side of the package body, the first lead terminal and / or the third lead terminal are bent toward the circuit board. A semiconductor switch device with a terminal cover, wherein the rear wall of the terminal cover has a protrusion that engages with the circuit board.

7. A semiconductor switch device with a terminal cover according to any one of claims 1 to 6, Circuit board and The circuit board includes a heat sink that supports the package body of the semiconductor switch device with terminal cover, which protrudes from the edge of the circuit board, from the rear side. Power supply system.

Images