Component mounting equipment

Abstract

To allow an appropriate determination of the presence / absence of a component adsorption when using a nozzle with a small diameter.SOLUTION: A component mounting apparatus to which a plurality of types of nozzles each having a different size of a suction port that adsorbs a component are detached and attached, comprises: a nozzle flow channel which can supply a negative pressure from a negative pressure source to the suction port of each nozzle; a pressure sensor that detects a pressure in the nozzle flow channel; a determination part that determines the presence / absence of suction of a component on the basis of a detection value of the pressure sensor; and a flow amount change part that changes a flow amount of the negative pressure supplied from the nozzle flow channel to the suction port in accordance with a size of the suction port.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] This specification discloses a component mounting device.

Background Art

[0002] Conventionally, as a component mounting device, in a device that mounts a component adsorbed at the suction port of a nozzle by negative pressure onto a substrate, a device that detects the connection state of an air path, the presence or absence of component adsorption, etc. has been proposed. For example, in the device of Patent Document 1, an air state detection device that detects the air pressure in the air supply path is provided in the air supply path, and it is determined whether or not the detection value by the air state detection device is less than or equal to a predetermined threshold value. When the detection value is not less than or equal to the predetermined threshold value, it is determined that there is a poor connection in the air path, and when the detection value is less than or equal to the predetermined threshold value, it is determined that the connection is good.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] As in the above-described component mounting device, it is conceivable to determine the presence or absence of component adsorption based on the detection value by the air state detection device. However, when a nozzle with a relatively small diameter is used for the suction port, compared with the case where a nozzle with a large diameter is used, the pressure difference between normal adsorption and leakage becomes smaller, and there may be almost no pressure difference. Therefore, it becomes difficult to appropriately determine the presence or absence of component adsorption based on the detected value of the pressure.

[0005] The main object of the present disclosure is to enable appropriate determination of the presence or absence of component adsorption when using a nozzle with a small diameter.

Means for Solving the Problems

[0006] This disclosure employs the following means to achieve the primary objectives described above.

[0007] The component mounting apparatus of this disclosure is A component mounting device in which multiple types of nozzles with different sizes of suction openings for picking up components can be detachably attached, A nozzle channel capable of supplying negative pressure from a negative pressure source to the suction port of the nozzle, A pressure sensor for detecting the pressure in the nozzle flow path, A determination unit that determines whether or not a component is attracted based on the detected value of the pressure sensor, A flow rate changing unit that changes the flow rate of negative pressure supplied from the nozzle flow path to the adsorption port according to the size of the adsorption port, The gist of it is that it is equipped with the following features.

[0008] The component mounting apparatus of this disclosure changes the flow rate of negative pressure supplied from the nozzle channel to the suction port according to the size of the suction port. By suppressing the flow rate of negative pressure when suctioning components with a relatively small diameter nozzle, the pressure difference between normal suction and leakage can be made apparent. Therefore, when using a small diameter nozzle, it is possible to appropriately determine whether or not a component is being suctioned. [Brief explanation of the drawing]

[0009] [Figure 1] A perspective view showing the schematic configuration of the component mounting device 10. [Figure 2] A block diagram showing the electrical connection relationships of the component mounting device 10. [Figure 3] A block diagram showing the main components that supply pressure. [Figure 4] A schematic diagram showing the general configuration of the pressure supply device 70. [Figure 5] This diagram illustrates the case where negative pressure is supplied to the suction port 52a when the nozzle holding part 51 holds the large-diameter nozzle 52L as a nozzle for adsorbing parts. [Figure 6] This diagram illustrates the case where negative pressure is supplied to the suction port 52a when the nozzle holding part 51 holds the small diameter nozzle 52S as a nozzle for adsorbing parts. [Figure 7] An explanatory diagram showing the change in negative pressure during component adsorption and air leak. [Modes for carrying out the invention]

[0010] Next, embodiments of the present disclosure will be described with reference to the drawings. Figure 1 is a perspective view showing an outline of the configuration of the component mounting apparatus 10. Figure 2 is a block diagram showing the electrical connection relationships of the component mounting apparatus 10. In this embodiment, the left-right direction in Figure 1 is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] As shown in Figure 1, the component mounting device 10 includes a component supply device 20, a substrate transport device 30, a moving device 40, a head unit 50, a part camera 62, a mark camera 64, a nozzle stocker 66, a pressure supply device 70 (see Figure 2), and a control device 90 (see Figure 2). The component supply device 20 is provided at the front of the base 12 of the component mounting device 10 and is a tape feeder equipped with, for example, a reel 22 containing components on tape at predetermined intervals, and pulls the tape from the reel 22 to supply components to the supply position by the drive of a motor (not shown). The substrate transport device 30 includes, for example, a pair of conveyor belts 32 provided on the base 12 with a gap in the front-to-back direction (Y-axis direction) and stretched across in the left-to-right direction, and transports the substrate S from left to right in Figure 1 by driving the conveyor belts 32 by the drive of a motor (not shown). The moving device 40 includes a guide rail 46 provided along the Y-axis direction, a Y-axis slider 48 that moves along the guide rail 46, a guide rail 42 provided on the Y-axis slider 48 along the X-axis direction, and an X-axis slider 44 that moves along the guide rail 42. The head unit 50 is attached to the X-axis slider 44. The moving device 40 moves the head unit 50 in the XY direction by moving the X-axis slider 44 and the Y-axis slider 48.

[0012] The head unit 50 is configured as a single nozzle head, for example, with one nozzle 52 mounted on its axis, and includes an R-axis actuator 54 and a Z-axis actuator 56 (see Figure 2). The head unit 50 rotates the nozzle 52 around its axis by driving the R-axis actuator 54. The head unit 50 also raises and lowers a Z-axis slider 57 (see Figure 2) in the Z-axis direction by driving the Z-axis actuator 56. The Z-axis slider 57 has a nozzle holding part 51 (see Figure 2) at its lower end that holds the nozzle 52, and the Z-axis actuator 56 raises and lowers the nozzle 52 in the Z-axis direction. The nozzle 52 attracts parts to its tip by negative pressure and releases the parts by positive pressure. The nozzle 52 is held by the nozzle holding part 51 by negative pressure. The pressure supply device 70 supplies negative and positive pressure to the nozzle holding part 51 and the nozzle 52, and its details will be described later.

[0013] The parts camera 62 is installed between the parts supply device 20 and the substrate transport device 30. The parts camera 62 has an imaging range above it and generates an image by imaging objects such as parts that are attracted to the nozzle 52 from below.

[0014] The mark camera 64 is located on the underside of the X-axis slider 44. The mark camera 64 captures an image of the target object from above and generates an image. Examples of targets for the mark camera 64 include parts supplied from the tape feeder of the parts supply device 20, marks on the circuit board S, and marks on the nozzles 52 in the nozzle stocker 66.

[0015] The nozzle stocker 66 is configured to accommodate multiple types of nozzles 52 of different sizes and shapes in each of its storage compartments. The nozzles 52 stocked in the nozzle stocker 66 can be automatically replaced by the head unit 50. Furthermore, while the component mounting device 10 is stopped, the operator can remove the types of nozzles 52 that are not needed for the mounting process from the nozzle stocker 66 and store the types of nozzles 52 that are needed for the mounting process.

[0016] As shown in FIG. 2, the control device 90 is configured as a microprocessor centered on the CPU 91. In addition to the CPU 91, it includes a ROM 92, an HDD 93, a RAM 94, an input / output interface (I / F) 95, and the like. These are connected via a bus 96. The control device 90 controls the component mounting device 10 to perform component mounting processing based on the production job of the substrate S acquired from a management device (not shown) or the like. The production job is data that determines which components are to be mounted on the substrate S in what order and how many substrates S with components mounted in that way are to be produced. Further, the control device 90 automatically exchanges the nozzle 52 attached to the head unit 50 with a nozzle 52 having a size (diameter) and shape suitable for component mounting, and acquires information on the size and shape of the attached nozzle 52.

[0017] In addition, the control device 90 inputs image signals from the component camera 62 and the mark camera 64 via the input / output interface 95. Position sensors (not shown) are provided for the X-axis slider 44, the Y-axis slider 48, and the Z-axis slider 57, respectively, and the control device 90 also inputs position information from those position sensors. Further, the control device 90 outputs drive signals to the component supply device 20, the substrate transfer device 30, the X-axis actuator 45 that moves the X-axis slider 44, the Y-axis actuator 49 that moves the Y-axis slider 48, the Z-axis actuator 56 that moves the Z-axis slider 57, and the pressure supply device 70 via the input / output interface 95.

[0018] The following is a description of the pressure supply device 70 for supplying negative and positive pressure to the nozzle holding section 51 and the nozzle 52. Figure 3 is a block diagram showing the main configuration for supplying pressure. Figure 4 is a schematic configuration diagram showing the configuration of the pressure supply device 70. In this embodiment, as shown in Figure 3, negative pressure from a vacuum pump as a negative pressure source 71A is supplied to the nozzle 52 via a switching valve 81 from a relatively large flow rate channel (large flow rate channel 74) and also via a switching valve 83 from a relatively small flow rate channel (small flow rate channel 75). The nozzle 52 is configured to attract components by supplying at least one of the large flow rate negative pressure and the small flow rate negative pressure to the nozzle 52. The vacuum pump as the negative pressure source 71A is provided by the component mounting device 10. Furthermore, positive pressure from factory air, which acts as a positive pressure source 71B, is supplied to the ejector 88 via a switching valve 84. The negative pressure generated by the ejector 88 using this positive pressure is supplied to the nozzle holding unit 51, thereby causing the nozzle holding unit 51 to attract the nozzle 52.

[0019] Here, as shown in FIG. 4, the nozzle 52 adsorbs a component at the suction port 52a at the tip (lower end) of the cylindrical shaft portion, and a flange portion 52b is formed so as to project radially from the upper end of the shaft portion. Further, the nozzle holding portion 51 is provided at the lower end of the Z-axis slider 57, and has a central hole 51a penetrating vertically through the central portion, an annular recess 51b provided on the lower surface (holding surface) on which the nozzle 52 is held, and a communication hole 51c penetrating vertically so as to communicate from the upper surface to the bottom surface of the recess 51b. The recess 51b of the nozzle holding portion 51 forms a negative pressure chamber by being covered by the upper surface of the flange portion 52b of the attached nozzle 52. The nozzle holding portion 51 can adsorb and hold the nozzle 52 by supplying negative pressure to the negative pressure chamber (inside the recess 51b) through the communication hole 51c. Further, the nozzle 52 can adsorb and hold a component at the suction port 52a by supplying negative pressure to the suction port 52a through the central hole 51a of the nozzle holding portion 51 and the central hole of the shaft portion. Although not shown, a permanent magnet is embedded in a part of the bottom surface of the recess 51b. Also, a metal plate is embedded at a position of the upper surface (held surface) of the flange portion 52b of the nozzle 52 that faces the permanent magnet of the recess 51b. Therefore, the nozzle 52 is held by the nozzle holding portion 51 by the suction force due to negative pressure and the suction force of the magnet.

[0020] The pressure supply device 70 includes multiple flow paths through which positive or negative pressure air flows, multiple switching valves 81-87 for switching the communication state of each flow path, an ejector 88, and a pressure reducing valve 89. The main flow paths of the pressure supply device 70 include a negative pressure flow path 72, a positive pressure flow path 73, a high flow rate flow path 74, a low flow rate flow path 75, a connecting flow path 76, an ejector flow path 77, a nozzle holding flow path 78, and a pressure reducing flow path 79. In addition, the pressure supply device 70 includes a pressure sensor 74a for detecting the pressure (negative pressure) in the high flow rate flow path 74 and the low flow rate flow path 75, and a pressure sensor 78a for detecting the pressure (negative pressure) in the nozzle holding flow path 78, and outputs the detected pressure to the control device 90. In this embodiment, the pressure supply device 70 (multiple switching valves 81-87, the ejector 88, and the pressure reducing valve 89) is installed inside the head body 50a of the head unit 50, and each operates based on a drive signal from the control device 90. Furthermore, parts of the flow path, such as the high-flow flow path 74, the low-flow flow path 75, and a portion of the nozzle-holding flow path 78, are configured to supply pressure to the nozzle-holding section 51 and the nozzle 52 via the Z-axis slider 57.

[0021] The negative pressure passage 72 is a passage that communicates with the negative pressure source 71A. The positive pressure passage 73 is a passage that communicates with the positive pressure source 71B. The high-flow passage 74 communicates with the central hole 51a of the nozzle holding part 51 and supplies a large flow rate of negative pressure to the suction port 52a of the nozzle 52 via the central hole 51a. The low-flow passage 75 communicates with the high-flow passage 74 (central hole 51a of the nozzle holding part 51) and supplies a smaller flow rate of negative pressure than the high-flow passage 74 to the suction port 52a of the nozzle 52. The high-flow passage 74 and the low-flow passage 75 function as negative pressure supply passages for component suction, supplying negative pressure for the nozzle 52 to suction components. The low-flow passage 75 is configured as a passage with a smaller diameter than the high-flow passage 74, for example, with an inner diameter of about 1 / 3 to 1 / 2 of that of the high-flow passage 74. The ejector passage 77 is a passage that supplies positive pressure to flow through the ejector 88. The nozzle holding passage 78 communicates with the communication hole 51c of the nozzle holding section 51 and is a passage that supplies the negative pressure generated by the ejector 88 into the recess 51b via the communication hole 51c. In other words, it functions as a negative pressure supply passage for nozzle holding, supplying the negative pressure necessary for the nozzle holding section 51 to hold (adsorb) the nozzle 52. The depressurization passage 79 is a passage through which air, whose positive pressure in the positive pressure passage 73 has been reduced by the depressurization valve 89, flows.

[0022] The switching valve 81 switches between a state in which the negative pressure passage 72 and the high-flow passage 74 are connected and the high-flow passage 74 is blocked from the connecting passage 76, and a state in which the negative pressure passage 72 and the high-flow passage 74 are blocked and the high-flow passage 74 is connected to the connecting passage 76. By setting the switching valve 81 to a state in which the negative pressure passage 72 and the high-flow passage 74 are connected, negative pressure from the negative pressure source 71A can be supplied to the high-flow passage 74, thereby supplying negative pressure to the suction port 52a of the nozzle 52. The switching valve 82 switches between a state in which the connecting passage 76 is open to the atmosphere and a state in which the connecting passage 76 is blocked from the atmosphere. By setting the switching valve 81 to a state in which the high-flow passage 74 and the connecting passage 76 are connected, and setting the switching valve 82 to a state in which the connecting passage 76 is open to the atmosphere, atmospheric pressure can be supplied to the high-flow passage 74, thereby supplying atmospheric pressure to the suction port 52a of the nozzle 52.

[0023] The switching valve 83 switches between a state in which the negative pressure passage 72 and the small flow passage 75 are connected, and a state in which the negative pressure passage 72 and the small flow passage 75 are blocked. By setting the switching valve 83 to a state in which the negative pressure passage 72 and the small flow passage 75 are connected, negative pressure from the negative pressure source 71A can be supplied to the small flow passage 75, thereby supplying negative pressure to the suction port 52a of the nozzle 52. As will be described later, the small flow passage 75 is connected to the switching valves 85 and 86. Therefore, in order to supply negative pressure to the nozzle 52 by the small flow passage 75, it is necessary to set the switching valves 85 and 86 to a state in which the connection between the small flow passage 75 and the other passages is blocked.

[0024] The switching valve 84 switches between a state in which the ejector passage 77 is connected to the positive pressure passage 73 and a state in which the ejector passage 77 is open to the atmosphere. The ejector 88 operates to allow the positive pressure air supplied from the ejector passage 77 to flow at high speed, thereby drawing in the air in the nozzle holding passage 78. This supplies negative pressure to the nozzle holding passage 78, and thus allows negative pressure to be supplied into the recess 51b through the communication hole 51c of the nozzle holding part 51.

[0025] The switching valve 85 switches between a state in which the pressure-reducing passage 79 and the low-flow passage 75 are connected, and a state in which the pressure-reducing passage 79 and the low-flow passage 75 are blocked. The switching valve 86 switches between a state in which the positive-pressure passage 73 and the low-flow passage 75 are connected, and a state in which the positive-pressure passage 73 and the low-flow passage 75 are blocked. As described above, when the switching valve 83 is in a state in which the negative-pressure passage 72 and the low-flow passage 75 are connected, the switching valve 85 is set to a state in which the pressure-reducing passage 79 and the low-flow passage 75 are blocked, and the switching valve 86 is set to a state in which the positive-pressure passage 73 and the low-flow passage 75 are blocked. By setting the switching valve 83 to block the negative pressure passage 72 and the low flow passage 75, setting the switching valve 85 to connect the depressurization passage 79 and the low flow passage 75, and setting the switching valve 86 to block the positive pressure passage 73 and the low flow passage 75, reduced positive pressure is supplied from the low flow passage 75 to the suction port 52a of the nozzle 52. This releases the suction of the component that the nozzle 52 was adsorbing, allowing the component to be mounted on the substrate S. Furthermore, by setting the switching valve 83 to block the negative pressure passage 72 and the low flow passage 75, setting the switching valve 85 to block the depressurization passage 79 and the low flow passage 75, and setting the switching valve 86 to connect the positive pressure passage 73 and the low flow passage 75, positive pressure from the positive pressure source 71B can be supplied from the low flow passage 75 to the suction port 52a of the nozzle 52. This supplies relatively high positive pressure to the nozzle 52, which can resolve clogging of the nozzle 52.

[0026] The switching valve 87 switches between a state in which the positive pressure passage 73 and the nozzle holding passage 78 are in communication, and a state in which the positive pressure passage 73 and the nozzle holding passage 78 are blocked. By setting the switching valve 87 to a state in which the positive pressure passage 73 and the nozzle holding passage 78 are in communication, positive pressure can be supplied to the nozzle holding passage 78, and positive pressure can be supplied into the recess 51b through the communication hole 51c of the nozzle holding part 51. This releases the suction of the nozzle 52 that was being held by the nozzle holding part 51.

[0027] In the pressure supply device 70 of this embodiment, the positive pressure generated by the ejector 88 using the positive pressure from the positive pressure source 71B through the positive pressure flow path 73 is supplied to the nozzle holding section 51 from the nozzle holding flow path 78 to hold the nozzle 52. The pressure supply device 70 also supplies negative pressure generated by the negative pressure source 71A (negative pressure pump) to the nozzle 52 from at least one of the high-flow flow path 74 and the low-flow flow path 75 via the negative pressure flow path 72 to hold the component. When a component is attracted by the nozzle 52, if the suction port 52a and the component are in close contact, air leakage will not be a problem. However, in reality, depending on the shape of the component and the condition of the top surface, if the suction port 52a is not in close contact, air leakage is likely to occur. For example, with components such as LED components, which have a hemispherical top surface, the gap with the spherical surface becomes larger depending on the suction position, making leakage more likely. Also, with components such as switch components, which have an operating part on the top surface, if the suction port 52a overlaps with the step between the operating part and its surroundings, leakage is more likely. Furthermore, in a configuration where the negative pressure source and supply channel used for the suction of the nozzle 52 and the suction of the component are shared, the effect of air leakage due to component suction may extend to the suction of the nozzle 52, reducing the suction force (holding force) and potentially causing the nozzle 52 to fall. In the pressure supply device 70 of this embodiment, the negative pressure source and supply channel used for the suction of the nozzle 52 and the suction of the component are configured separately, thus preventing the effect of leakage from extending to the suction of the nozzle 52.

[0028] Furthermore, as mentioned above, during component suction (holding), there is a possibility of air leakage depending on the type of component, and a stable supply of negative pressure is necessary to properly hold the component while tolerating leakage. Here, although the ejector 88 is generally more compact and less expensive than a vacuum pump, the vacuum pump provides a more stable negative pressure. For this reason, in order for the ejector 88 to supply the required negative pressure flow rate at the same level as the vacuum pump, a larger ejector 88 would be required, making it difficult to mount on the head unit 50 (head body 50a). In addition, the positive pressure flow rate supplied to the ejector 88 would increase, increasing the flow rate consumed by the component mounting device 10. Therefore, in the pressure supply device 70 of this embodiment, by using negative pressure from the vacuum pump for component suction, these problems can be prevented and component suction can be performed stably. As a result, even with components that are prone to leakage, the orientation of the component during suction can be stabilized, and the component can be properly mounted.

[0029] On the other hand, when holding the nozzle 52 compared to holding the components, the negative pressure chamber formed by the nozzle holding portion 51 (recess 51b) of the head unit 50 and the upper surface of the flange portion 52b of the nozzle 52 is sealed, so there is almost no leakage. For this reason, the nozzle 52 can be held with a small flow rate, and it is possible to select a smaller ejector 88 compared to when the ejector 88 is used to hold the components. In the pressure supply device 70 of this embodiment, since the negative pressure generated by the ejector 88 is used to adsorb (hold) the nozzle 52, the device can be made more compact and the cost reduced compared to a system in which vacuum pumps are provided for both component adsorption and nozzle adsorption. Furthermore, since the ejector 88 is provided on the head body 50a of the head unit 50, it is possible to prevent the nozzle holding passage 78 from becoming longer compared to a configuration in which it is provided elsewhere, such as on the base 12 of the component mounting device 10. Therefore, negative pressure can be appropriately applied from the ejector 88 to the nozzle holding section 51 via the nozzle holding channel 78, thereby stabilizing the suction of the nozzle 52. Furthermore, the magnetic attraction force is also used for the suction of the nozzle 52 (flange section 52b). For these reasons, the negative pressure generated by the ejector 88 does not cause any problems with the suction of the nozzle 52.

[0030] Furthermore, the pressure supply device 70 has two flow paths for supplying negative pressure for component suction: a high-flow path 74 and a low-flow path 75. Here, Figure 5 is an explanatory diagram of the case where negative pressure is supplied to the suction port 52a when the nozzle holding part 51 holds a large-diameter nozzle 52L as a nozzle for suctioning components. Here, φL, which is the size (opening diameter) of the suction port 52a of the large-diameter nozzle 52L, is larger than a predetermined size (predetermined diameter). Figure 6 is an explanatory diagram of the case where negative pressure is supplied to the suction port 52a when the nozzle holding part 51 holds a small-diameter nozzle 52S as a nozzle for suctioning components. Here, φS, which is the size (opening diameter) of the suction port 52a of the small-diameter nozzle 52S, is smaller than a predetermined size (predetermined diameter). As shown in Figure 5, when a part is picked up with the large-diameter nozzle 52L, the control device 90 sets the switching valve 81 to a state where the negative pressure passage 72 and the high-flow passage 74 are connected (open state), and the switching valve 83 to a state where the negative pressure passage 72 and the low-flow passage 75 are connected (open state). This allows negative pressure to be supplied to the large-diameter nozzle 52L from two supply passages, the high-flow passage 74 and the low-flow passage 75. Therefore, a larger flow rate (maximum flow rate) of negative pressure can be supplied to the large-diameter nozzle 52L compared to when negative pressure is supplied only from the high-flow passage 74. Furthermore, when a part is picked up with the small-diameter nozzle 52S, the control device 90 sets the switching valve 81 to a state where the negative pressure passage 72 and the high-flow passage 74 are blocked and the high-flow passage 74 is connected to the connecting passage 76 (closed state), and the switching valve 83 to a state where the negative pressure passage 72 and the low-flow passage 75 are connected (open state). Furthermore, the switching valve 82 is configured to isolate the connecting passage 76 from the atmosphere. This allows a small flow rate of negative pressure to be supplied from the small flow passage 75 to the small diameter nozzle 52S.

[0031] Here, Figure 7 is an explanatory diagram showing the change in negative pressure during component adsorption and air leakage. In Figure 7, the vertical axis represents negative pressure, and the horizontal axis represents component adsorption (no air leak) and air leakage. If the nozzle 52 is adsorbing the component normally, the negative pressure will increase to the negative side and fall below the threshold Pref, and if air leakage occurs, the negative pressure will exceed the threshold Pref. As shown in the figure, when a negative pressure of "large flow rate + small flow rate" is supplied to the large-diameter nozzle 52L from the large-flow channel 74 and the small-flow channel 75 (dotted line), the negative pressure exceeds the threshold Pref during air leakage. Therefore, the control device 90 can determine an abnormality in adsorption based on the detected value of the pressure sensor 74a. That is, because the pressure (negative pressure) change during air leakage is large, the presence or absence of adsorbed components can be appropriately detected. On the other hand, unlike this embodiment, when a negative pressure of "large flow rate + small flow rate" is supplied to the small-diameter nozzle 52S from the large-flow channel 74 and the small-flow channel 75 (dotted line), the negative pressure remains below the threshold Pref during air leakage. Therefore, the control device 90 cannot determine an abnormality in adsorption based on the detected value of the pressure sensor 74a. That is, because the pressure change during air leakage is small, it is not possible to properly detect the presence or absence of adsorption components. In this embodiment, a small negative pressure is supplied from the small flow path 75 to the small diameter nozzle 52S (solid line), so that the negative pressure exceeds the threshold Pref during air leakage. As a result, the control device 90 can determine an abnormality in adsorption based on the detected value of the pressure sensor 74a. That is, the pressure change during air leakage is increased, and the presence or absence of adsorption components can be properly detected. Furthermore, when using the large diameter nozzle 52L, supplying negative pressure from two supply paths, the large flow path 74 and the small flow path 75, allows the system to reach the required negative pressure more quickly, ensuring reliable and rapid adsorption of components.

[0032] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. In this embodiment, the high-flow channel 74 and the low-flow channel 75 correspond to the nozzle channels of the present disclosure, the pressure sensor 74a corresponds to the pressure sensor, the control device 90 corresponds to the determination unit, and the switching valves 81, 83 and the control device 90 correspond to the flow rate changing unit. Furthermore, the high-flow channel 74 corresponds to the first channel, and the low-flow channel 75 corresponds to the second channel.

[0033] In the component mounting apparatus 10 of the embodiment described above, when a component is picked up with a small-diameter nozzle 52S whose suction port 52a is less than a predetermined size (predetermined diameter), a smaller flow rate of negative pressure is supplied to the suction port 52a than when a component is picked up with a large-diameter nozzle 52L whose suction port 52a is greater than or equal to a predetermined size. By suppressing the flow rate of negative pressure when a component is picked up with the small-diameter nozzle 52S, the pressure difference between normal suction and leakage can be made apparent, making it possible to appropriately detect whether or not a component is picked up when using the small-diameter nozzle 52S.

[0034] Furthermore, the system is equipped with a high-flow channel 74 and a low-flow channel 75 as negative pressure supply channels (nozzle channels) for component adsorption. By switching the presence or absence of negative pressure supply (negative pressure supply state) of the high-flow channel 74 and the low-flow channel 75 using switching valves 81 and 83, the flow rate of negative pressure supplied to the nozzle 52 is changed. Therefore, a relatively simple configuration can be used to appropriately detect the presence or absence of components when using a small-diameter nozzle 52S.

[0035] Furthermore, when using the large-diameter nozzle 52L to adsorb parts, negative pressure is supplied from both the high-flow channel 74 and the low-flow channel 75. Therefore, even when the system is divided into two channels to appropriately detect the presence or absence of parts, the negative pressure from the high-flow channel can be quickly brought up to the required level. As a result, the adsorption of parts using the large-diameter nozzle 52L can be performed quickly and stably.

[0036] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0037] For example, in the embodiment described above, when a part is adsorbed by a nozzle 52 of a predetermined size or larger, negative pressure is supplied from both the high-flow channel 74 and the low-flow channel 75. However, the embodiment is not limited to this, and negative pressure may be supplied only from the high-flow channel 74.

[0038] In the embodiment described above, a large-flow channel 74 and a small-flow channel 75 are provided, and the negative pressure flow rate is changed in two stages by switching the presence or absence of negative pressure supply to the large-flow channel 74 and the small-flow channel 75. However, the embodiment is not limited to this, and it may be possible to change it in three or more stages depending on the size of the suction port 52a of the nozzle 52. In this case, multiple channels that supply the same flow rate may be provided, and the negative pressure flow rate supplied to the suction port 52a of the nozzle 52 may be changed by changing the number of switching valves that are opened. Alternatively, the negative pressure flow rate may be changed by changing the driving state of the vacuum pump, such as the rotation speed of the vacuum pump as the negative pressure source 71A. That is, when the small-diameter nozzle 52S is used to adsorb a part, the control device 90 should drive the vacuum pump at a low rotation speed to supply a small flow rate of negative pressure, and when the large-diameter nozzle 52L is used to adsorb a part, it should drive the vacuum pump at a high rotation speed to supply a large flow rate of negative pressure. Alternatively, the control device 90 may continuously change the negative pressure flow rate by continuously changing the rotation speed of the vacuum pump according to the size of the suction port 52a of the nozzle 52. In these cases, as in the embodiment, it is possible to appropriately detect whether or not a part is being adsorbed when using a small-diameter nozzle. Furthermore, when changing the negative pressure flow rate by changing the drive state of the vacuum pump, a single flow path may be provided as the negative pressure supply flow path (nozzle flow path) for part adsorption.

[0039] In this embodiment, the positive pressure from the positive pressure channel 73 is used for releasing the component from suction and releasing the nozzle 52 from suction, and for generating negative pressure by the ejector 88, but it is not limited to this. Channels may be provided to supply the positive pressure used for releasing the component from suction and releasing the nozzle 52 from suction, and the positive pressure used for generating negative pressure by the ejector 88, separately.

[0040] In this embodiment, the head unit 50 is equipped with (houses) a pressure supply device 70, but it is not limited to this, and some of the components of the pressure supply device 70 (switching valves 81-87, ejector 88, and part of the pressure reducing valve 89) may be housed in the X-axis slider 44, the Y-axis slider 48, the base 12 of the component mounting device 10, etc. However, it is preferable to have the ejector 88 acting as in this embodiment in order to ensure that negative pressure is applied more reliably.

[0041] In this embodiment, the negative pressure generated by the ejector 88 using the positive pressure from the positive pressure flow path 73 was used for the suction of the nozzle 52. However, the system is not limited to this, and negative pressure generated by a vacuum pump may also be used for the suction of the nozzle 52. In order to prevent the effects of leakage during component suction, it is preferable to have a separate vacuum pump for nozzle suction in addition to the vacuum pump for component suction.

[0042] In this embodiment, the component mounting device 10 is equipped with one vacuum pump as a negative pressure source 71A, but it is not limited to this, and may be equipped with two vacuum pumps. For example, the negative pressure source 71A may be equipped with two vacuum pumps: one connected to the negative pressure passage 72 to the switching valve 81, and another connected to the negative pressure passage to the switching valve 83. In this case, the negative pressure passage 72 to the switching valve 81 and the negative pressure passage to the switching valve 83 may be connected to each other or may be independent of each other.

[0043] Herein, the component mounting apparatus of the present disclosure may be configured as follows. For example, in the component mounting apparatus of the present disclosure, the nozzle flow path includes a first flow path and a second flow path having a smaller flow path diameter than the first flow path, and the flow rate changing unit is configured to supply a large flow rate of negative pressure from at least the first flow path when the size of the adsorption port is greater than or equal to a predetermined size, and to shut off the supply of negative pressure from the first flow path and supply a small flow rate of negative pressure from the second flow path when the size of the adsorption port is less than the predetermined size. In this way, a configuration that can appropriately detect the presence or absence of a component when using a small diameter nozzle can be made with a relatively simple configuration.

[0044] In the component mounting apparatus of this disclosure, the flow rate changing unit may be configured to supply a large flow rate of negative pressure from the first and second flow paths when the size of the suction port is greater than or equal to the predetermined size. In this way, even if the flow is divided into two flow paths to appropriately detect the presence or absence of components, the large flow rate of negative pressure can be quickly brought to the required negative pressure. [Industrial applicability]

[0045] This disclosure can be used in industries such as the manufacturing of component mounting equipment. [Explanation of symbols]

[0046] 10 Component mounting device, 12 Base, 20 Component supply device, 22 Reel, 30 Board transport device, 32 Conveyor belt, 40 Moving device, 42, 46 Guide rail, 44 X-axis slider, 45 X-axis actuator, 48 Y-axis slider, 49 Y-axis actuator, 50 Head unit, 50a Head body, 51 Nozzle holding part, 51a Center hole, 51b Recess, 51c Communication hole, 52 Nozzle, 52L Large diameter nozzle, 52S Small diameter nozzle, 52a Suction port, 52b Flange part, 54 R-axis actuator, 56 Z-axis actuator, 57 Z-axis slider, 62 Parts camera, 64 Mark camera, 66 Nozzle stocker, 70 Pressure supply device, 71A Negative pressure source, 71B Positive pressure source, 72 Negative pressure flow path, 73 Positive pressure flow path, 74 High flow rate flow path, 74a, 78a Pressure sensor, 75 Small flow channel, 76 Connecting channel, 77 Ejector channel, 78 Nozzle holding channel, 79 Pressure reducing channel, 81-87 Switching valve, 88 Ejector, 89 Pressure reducing valve, 90 Control unit, 91 CPU, 92 ROM, 93 HDD, 94 RAM, 95 Input / Output interface, 96 Bus, S board.

Claims

1. A component mounting device in which multiple types of nozzles with different sizes of suction openings for picking up components can be detachably attached, A nozzle channel capable of supplying negative pressure from a negative pressure source to the suction port of the nozzle, A pressure sensor for detecting the pressure in the nozzle flow path, A determination unit that determines whether or not a component is attracted based on the detected value of the pressure sensor, A flow rate changing unit that changes the flow rate of negative pressure supplied from the nozzle flow path to the adsorption port according to the size of the adsorption port, A positive pressure channel that supplies positive pressure from a positive pressure source, An ejector that generates negative pressure by the positive pressure supplied from the positive pressure channel, A channel for a holding section that supplies the negative pressure generated by the ejector to a holding section that holds the nozzle, A component mounting device equipped with the following features.

2. The nozzle flow path comprises a first flow path and a second flow path having a smaller flow path diameter than the first flow path. The flow rate changing unit modifies the supply of a large flow rate of negative pressure from at least the first flow path when the size of the adsorption port is greater than or equal to a predetermined size, and modifies the supply of negative pressure from the first flow path to a small flow rate of negative pressure when the size of the adsorption port is less than the predetermined size. The component mounting apparatus according to claim 1.

3. The flow rate changing unit, when the size of the adsorption port is greater than or equal to the predetermined size, changes the flow rate to supply a large flow rate of negative pressure from the first flow path and the second flow path. The component mounting apparatus according to claim 2.

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