Method for manufacturing a jointed structure and method for joining objects to be joined.

Abstract

A production method according to the present invention comprises: a step in which a wet coating film (13a) is formed by coating a first joined body (11) with a joining composition containing a copper powder and an organic substance that is a liquid at 25°C; a step in which a dry coating film (13b) is obtained by removing the organic substance from the wet coating film (13a); a step in which a second joined body (12) is temporarily fixed to the dry coating film (13b) by applying pressure and a layered body in which the first joined body (11), the dry coating film (13b), and the second joined body (12) are layered in this order is obtained; and a step in which the layered body is heated under pressure and the joined bodies (11), (12) are joined. The organic substance contains a first organic substance. At least one type of the first organic substance has a boiling point of 230°C or more and less than 300°C and a viscosity of 100 mPa·s or more under conditions in which the temperature is 25°C and the shear rate is 10 s-1.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a joined structure formed by joining two objects to be joined, and a method for joining objects to be joined. [Background technology]

[0002] In recent years, semiconductor elements called power devices have been widely used as power conversion and control devices, such as inverters. Unlike integrated circuits such as memory and microprocessors, power devices are designed to control high currents, and therefore generate a great deal of heat during operation. Consequently, the solder used to mount power devices requires high heat resistance. However, lead-free solder, which is currently the most commonly used, has the disadvantage of having lower heat resistance compared to conventional lead-containing solder.

[0003] Therefore, instead of using solder, various techniques have been proposed in which a paste containing metal nanoparticles with restricted use of harmful chemicals is used, applied to the target object by various coating means, and then fired. For example, Patent Document 1 proposes a method for manufacturing a power module in which a sinterable metal bonding material, which is made by dispersing silver nanoparticles in an organic solvent, is applied to an insulating substrate, the bonding material is dried, a power semiconductor element is placed on it and temporarily fixed, and then the bonding material is sintered. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2019-186457 [Overview of the Initiative]

[0005] In the technology described in Patent Document 1, depending on the drying conditions, temporary fixing conditions, and sintering conditions, the bonding material may protrude outward from the periphery of the power semiconductor element, resulting in insufficient bonding strength or misalignment of the power semiconductor element. Therefore, the object of the present invention is to provide a method for manufacturing a bonding structure that can successfully bond objects to be bonded together without causing misalignment or detachment of the objects to be bonded.

[0006] The present invention relates to a method for manufacturing a bonded structure in which a first body to be bonded and a second body to be bonded are bonded via a bonding layer, A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C to the first object to be bonded to form a wet coating film, A step of removing the organic matter from the wet coating film to obtain a dry coating film, A step of temporarily fixing the second object to be joined to the dried coating film by pressurization to obtain a laminate in which the first object to be joined, the dried coating film, and the second object to be joined are stacked in this order, The process includes heating the laminate under pressure to sinter the copper powder in the dry coating film, and joining the first and second objects to be joined by the bonding layer formed by the sintering, The aforementioned organic substance includes a first organic substance, The first organic substance has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. -1 The present invention provides a method for manufacturing a bonded structure in which the viscosity under certain conditions is 100 mPa·s or higher.

[0007] Furthermore, the present invention relates to a method for joining a first object to be joined and a second object to be joined via a joining layer, A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C to the first object to be bonded to form a wet coating film, A step of removing the organic matter from the wet coating film to obtain a dry coating film, A step of temporarily fixing the second object to be joined to the dried coating film by pressurization to obtain a laminate in which the first object to be joined, the dried coating film, and the second object to be joined are stacked in this order, The process includes a step of pressurizing and heating the laminate to sinter the copper powder in the dried coating film, and joining the first and second objects to be joined by the bonding layer formed by sintering, The aforementioned organic substance includes a first organic substance, The first organic substance has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. -1 This invention provides a bonding method in which the viscosity under certain conditions is 100 mPa·s or higher. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a process diagram (a process diagram showing the steps up to the manufacture of a laminate) illustrating one embodiment of the method for manufacturing the bonded structure of the present invention. [Figure 2] Figure 2 is a plan view showing a portion of the outer edge of the dried coating film before and after the placement of the second object to be bonded. [Modes for carrying out the invention]

[0009] The present invention will be described below based on its preferred embodiments. The present invention relates to a method for manufacturing a bonded structure in which two bodies to be joined, namely a first body to be joined and a second body to be joined, are joined via a bonding layer. This manufacturing method is broadly divided into the following steps. (1) A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C (hereinafter also referred to as "liquid organic substance") to the first object to be bonded to form a wet coating film (wet coating film formation step). (2) A step to remove liquid organic matter from the wet coating to obtain a dry coating (dry coating formation step). (3) A step of temporarily fixing the second workpiece to the dried coating film by pressurization to obtain a laminate in which the first workpiece, the dried coating film, and the second workpiece are stacked in this order (laminated body formation step). (4) A step of heating the laminate under pressure to sinter the copper powder in the dry coating film, and joining the first to be joined and the second to be joined by the bonding layer formed by sintering (joining step). Hereinafter, each step will be described while referring to FIG. 1. FIG. 1 is a process diagram showing an embodiment of a method for manufacturing a joined structure of the present invention.

[0010] (1) Wet coating film forming step First, as shown in FIG. 1(a), the first joined body 11 is prepared, and a joining composition is applied onto one surface 11a of the first joined body 11 to form a wet coating film 13a. The joining composition contains copper powder and a liquid organic substance. The coating method of the joining composition is not particularly limited. For example, the wet coating film 13a can be formed by a screen printing method, a gravure printing method, a dispensing printing method, a reverse coating method, a doctor blade method, or the like.

[0011] From the viewpoint of ensuring sufficient joining strength, the average thickness of the wet coating film 13a is preferably 20 μm or more, more preferably 30 μm or more, and still more preferably 35 μm or more. Also, from the viewpoint of facilitating the smoothing of the coating film and preventing cracking of the coating film after drying, the average thickness of the wet coating film 13a is preferably 500 μm or less, more preferably 450 μm or less, and still more preferably 400 μm or less.

[0012] The coating area of the joining composition may be an area such that the wet coating film 13a formed by the coating extends from the periphery of the second joined body 12 described later, or the two may have the same area, or the wet coating film 13a formed by the coating may have an area smaller than the periphery of the second joined body 12 described later. In the embodiment shown in FIG. 1, the coating area of the joining composition is an area such that the wet coating film 13a formed by the coating extends from the periphery of the second joined body 12. By setting such a coating area, the first joined body 11 and the second joined body 12 can be joined more reliably.

[0013] (2) Dry coating film forming step Next, as shown in FIG. 1(b), the liquid organic matter is removed from the wet coating film 13a to obtain a dry coating film 13b. By removing the liquid organic matter from the wet coating film 13a, the shape retention of the dry coating film 13b is enhanced.

[0014] In the process shown in FIG. 1(b), from the viewpoint of successfully performing the temporary fixation of the second adherend 12, which will be described later, to the dry coating film 13b, it is preferable to remove the liquid organic matter so that the average thickness of the dry coating film 13b is 20 μm or more. A more preferable average thickness is 25 μm or more, and even more preferably 30 μm or more. On the other hand, from the viewpoint of facilitating the formation of a smooth coating film and preventing cracking of the dried coating film, in the drying process, it is preferable to remove the liquid organic matter so that the average thickness of the dry coating film 13b is 400 μm or less. A more preferable average thickness is 350 μm or less, and even more preferably 300 μm or less.

[0015] If an excess amount of liquid organic matter remains in the dried coating 13b, the dried coating 13b may soften, potentially reducing the temporary fixing strength of the second workpiece 12 to the dried coating 13b, and potentially reducing the bonding strength of the first workpiece 11 and the second workpiece 12 after sintering. Furthermore, when joining the first workpiece 11 and the second workpiece 12, the dried coating 13b may protrude outside the first workpiece 11 and the second workpiece 12 in a plan view. From the viewpoint of effectively suppressing these problems, in the process shown in Figure 1(b), it is preferable to sufficiently increase the amount of volatilization of liquid organic matter contained in the wet coating 13a to reduce the amount of liquid organic matter remaining in the dried coating 13b. In this process, it is preferable to remove the liquid organic matter from the wet coating 13a to the extent that the dried coating 13b no longer has fluidity. The presence or absence of fluidity of the dried coating 13b is determined as follows. For example, if the dried coating film 13b is rectangular or approximately rectangular in shape with dimensions x[mm]×y[mm] in a plan view (where x and y are numbers satisfying x≧y), then at 25°C, a second object to be bonded 12 with dimensions of 5x / 6[mm]×5y / 6[mm] in a plan view is placed on the dried coating film 13b. If an excess amount of liquid organic matter remains in the dried coating film 13b and the dried coating film 13b is fluid, then when the second object to be bonded 12 is placed under the above conditions, the dried coating film 13b will deform, causing a displacement from its original position (the position before the second object to be bonded 12 was placed). Therefore, after the second object to be bonded 12 is placed, if the dried coating film 13b is displaced by x / 5[mm] or more from its original position, it is determined that it is fluid, and if it is displaced by less than x / 5[mm], it is determined that it is not fluid. The displacement of the dried coating 13b after the placement of the second object to be joined 12 is defined as follows. Specifically, as shown in Figure 2, let C1 be the outer edge of the dried coating 13b before the placement of the second object to be joined 12, and let L be the normal to C1 at any point P on C1. Let Q be the intersection of the normal L and the outer edge C2 of the dried coating 13b after the placement of the second object to be joined 12. However, if there are multiple intersection points between the normal L and the outer edge C2, Q is determined to be the intersection point that is the shortest distance from point P. The distance PQ of the dried coating 13b is defined as the displacement of the dried coating 13b when point P on C1 is selected such that the distance PQ between point P and point Q is maximized.

[0016] However, from the viewpoint of increasing the temporary fixing strength of the second joined body 12 to the dried coating film 13b, and from the viewpoint of increasing the bonding strength of the first joined body 11 and the second joined body 12 in the target bonded structure, it is preferable that a small amount of liquid organic matter remains in the dried coating film 13b.

[0017] From the viewpoint of sufficiently removing liquid organic matter contained in the wet coating film 13a, in the process shown in Figure 1(b), it is preferable to dry the wet coating film 13a so that its mass decreases by 15% by mass or more, more preferably by 16% by mass or more, even more preferably by 17% by mass or more, and particularly preferably by 18% by mass or more. On the other hand, from the viewpoint of increasing the temporary fixing strength of the second workpiece 12 to the dried coating film 13b, and from the viewpoint of increasing the bonding strength of the first workpiece 11 and the second workpiece 12 in the target bonding structure, in the dried coating film formation step, it is preferable to dry the wet coating film so that the mass of the wet coating film 13a decreases by 30% by mass or less, more preferably by 29% by mass or less, and even more preferably by 28% by mass or less, thereby removing liquid organic matter from the wet coating film 13a. The method for measuring the percentage of mass loss of the wet coating film 13a will be explained in the examples described later.

[0018] From the viewpoint of increasing the temporary fixing strength of the second workpiece 12 to the dried coating film 13b, and from the viewpoint of increasing the bonding strength between the first workpiece 11 and the second workpiece 12 after sintering, it is preferable to remove the liquid organic matter from the wet coating film 13a such that, when the liquid organic matter content in the wet coating film 13a is 100 parts by mass, the liquid organic matter content in the dried coating film 13b is 25 parts by mass or less, more preferably 24 parts by mass or less, and even more preferably 23 parts by mass or less. Furthermore, as described above, it is preferable that a small amount of liquid organic matter remains in the dried coating film 13b. Therefore, when the liquid organic matter content in the wet coating film 13a is 100 parts by mass, it is preferable to remove the liquid organic matter from the wet coating film 13a so that the liquid organic matter content in the dried coating film 13b is 5 parts by mass or more, more preferably 6 parts by mass or more, and even more preferably 7 parts by mass or more.

[0019] From the viewpoint of sufficiently reducing the liquid organic matter remaining on the dried coating film 13b, it is preferable to heat the wet coating film 13a to 100°C or higher in this step, more preferably to 105°C or higher, and even more preferably to 110°C or higher. Furthermore, from the viewpoint of keeping the amount of liquid organic matter remaining in the dried coating film 13b within the above range, it is preferable to heat the wet coating film 13a to 200°C or below, more preferably to 190°C or below, even more preferably to 180°C or below, and particularly preferably to 160°C or below. From a similar viewpoint, the heating time for the wet coating film 13a is preferably 10 minutes or more, more preferably 15 minutes or more, even more preferably 20 minutes or more, and preferably 60 minutes or less, more preferably 50 minutes or less, and even more preferably 40 minutes or less, when the drying process is carried out under atmospheric pressure.

[0020] The formation of a dry coating film 13b by heating the wet coating film 13a can be carried out under an inert gas atmosphere such as nitrogen gas and argon gas, or under an atmospheric atmosphere. Heating may also be carried out under reduced pressure. There are no particular restrictions on the heating method. For example, heating methods such as blowing hot air, irradiating with infrared rays, or heating in a heating furnace can be employed.

[0021] (3) Laminate formation process Once the dried coating 13b is formed, the second object to be joined 12 is placed on the dried coating 13b as shown in Figure 1(c). Preferably, the second object to be joined 12 is placed on the dried coating 13b such that the dried coating 13b extends from the periphery of the second object to be joined 12. However, the second object to be joined 12 may be placed so that its periphery coincides with the periphery of the dried coating 13b, or it may be placed so that the second object to be joined 12 extends from the periphery of the dried coating 13b.

[0022] In this embodiment, prior to placing the second object to be bonded 12 on the dried coating 13b, a temporary fixing agent may or may not be applied between the dried coating 13b and the second object to be bonded 12. As will be described later, the bonding composition used in the production of the dried coating 13b contains a small amount of a first organic substance with high viscosity, so the second object to be bonded 12 can be temporarily fixed on the dried coating 13b without the use of a temporary fixing agent. Thus, according to the manufacturing method of this embodiment, the step of applying a temporary fixing agent can be omitted, thereby simplifying the manufacturing process and shortening the manufacturing time. In this invention, it is not necessary to use a temporary fixing agent, but there is no prejudice to using one. Examples of temporary fixing agents include monoalcohols, polyhydric alcohols, polyhydric alcohol alkyl ethers, polyhydric alcohol aryl ethers, esters, heterocyclic compounds, amides, amines, saturated hydrocarbons, cyclic terpene alcohols and their derivatives, ketones, carboxylic acids, and the like.

[0023] At least a portion of the high-viscosity first organic substance (details will be described later) contained in the bonding composition remains in the dried coating film 13b. Therefore, by applying pressure to the second object to be bonded 12 placed on the dried coating film 13b (i.e., by pushing the second object to be bonded 12 into the dried coating film 13b), the second object to be bonded 12 can be temporarily fixed to the dried coating film 13b. This results in a laminate 14 composed in order of the first object to be bonded 11, the dried coating film 13b, and the second object to be bonded 12. The second object to be bonded 12 can be directly pushed into the dried coating film 13b using a jig (not shown) used when placing the second object to be bonded 12. In this specification, "temporary fixing" means a state in which the first joined body 11 and the second joined body 12 are temporarily fixed together, and the state of fixing changes when a large external force is applied, but the state of fixing does not change when a small external force is applied (for example, a force such that when a laminate of the first joined body 11 and the second joined body 12 is placed with the joint surfaces of both joined bodies 11 and 12 facing vertically, either the first joined body 11 or the second joined body 12 falls due to its own weight).

[0024] The pressure applied when pressing the second workpiece 12 into the dried coating 13b is preferably 0.1 MPa or higher, more preferably 0.2 MPa or higher, and even more preferably 0.3 MPa or higher, from the viewpoint of properly temporarily fixing the second workpiece 12 with the dried coating 13b and sufficiently increasing the bonding strength between the first workpiece 11 and the second workpiece 12 in the subsequent bonding process.

[0025] The time for maintaining the pressure after reaching the target pressure is preferably 0.01 seconds or more, and more preferably 0.1 seconds or more, from the viewpoint of properly temporarily fixing the second body to be joined 12 with the dried coating film 13b, and from the viewpoint of sufficiently increasing the bonding strength between the first body to be joined 11 and the second body to be joined 12 in the subsequent joining process. Furthermore, the duration for maintaining the target pressure after it has been reached is not particularly limited, as long as it does not significantly reduce productivity; for example, it can be 5 seconds or less.

[0026] During temporary fixing, the second object to be joined 12 and / or the dried coating film 13b may be at room temperature or heated. From the viewpoint of properly temporarily fixing the second object to be joined 12 with the dried coating film 13b, it is preferable to heat the second object to be joined 12 and / or the dried coating film 13b when pressing the second object to be joined 12 into the dried coating film 13b. In other words, it is preferable to temporarily fix the second object to be joined 12 to the dried coating film 13b by pressurization and heating. Specifically, the heating temperature of the second body to be joined 12 is preferably 15°C or higher, more preferably 18°C ​​or higher, even more preferably 20°C or higher, and preferably 300°C or lower, more preferably 270°C or lower, and even more preferably 250°C or lower. Furthermore, the heating temperature for the dried coating film 13b is preferably 15°C or higher, more preferably 18°C ​​or higher, even more preferably 20°C or higher, and preferably 230°C or lower, more preferably 220°C or lower, and even more preferably 210°C or lower. By keeping the heating temperature within the above-mentioned range, it is possible to appropriately temporarily fix the second object to be joined 12 while suppressing an excessive decrease in the amount of liquid organic matter remaining in the dried coating film 13b.

[0027] When temporarily fixing the second workpiece 12 by applying pressure while heating the second workpiece 12 and / or the dry coating film 13b, it is not necessary to sinter the copper powder in the wet coating film 13a through this heating and pressurizing treatment. This is because, as will be described later, the dry coating film 13b contains a small amount of a first highly viscous organic substance (details will be described later), so the temporary fixing strength of the second workpiece 12 can be sufficiently increased without sintering the copper powder. In this way, by carrying out the laminate formation process under conditions where the copper powder in the wet coating film 13a is not sintered, the sintering of the copper powder can be sufficiently advanced in the subsequent bonding process, thereby increasing the bonding strength and bonding reliability of the resulting bonded structure. Conditions under which the copper powder does not sinter include, for example, setting the heating temperature of the second workpiece 12 and the dried coating film 13b to 250°C or lower, and the heating time to less than 50 seconds.

[0028] Once the second object to be joined 12 is temporarily fixed, the position of the second object to be joined 12 relative to the first object to be joined 11 becomes less likely to shift even when an external force is applied to the laminate 14. Therefore, when the laminate 14 is transported to the firing furnace for the next process, for example the joining process described below, it becomes possible to maintain a stable positional relationship between the first object to be joined 11 and the second object to be joined 12.

[0029] (4)Joining process The laminate 14, in which the second object to be joined 12 is temporarily fixed by the dried coating film 13b, is then subjected to a joining process. In the joining process, the laminate 14 is heated under pressure to sinter the copper powder in the dried coating film 13b, and the first object to be joined 11 and the second object to be joined 12 are joined by the joining layer formed by the sintering. Since the joining process is performed in a different location from the laminate formation process described above, the laminate 14 is moved to a heating device. During the move, the laminate 14 may be subjected to external forces such as vibration, but since the second object to be joined 12 is properly temporarily fixed to the dried coating film 13b by the laminate formation process described above, displacement and detachment of the second object to be joined 12 are suppressed. If the heating device described above also serves as the device for placing the second object to be joined 12, the laminate 14 may be heated in place without being moved.

[0030] The heating temperature in the joining process is preferably 180°C or higher, more preferably 200°C or higher, more preferably 450°C or lower, and even more preferably 400°C or lower, from the viewpoint of ensuring that the copper particles in the dried coating film 13b are sintered and that the bonding strength between the first body to be joined 11 and the second body to be joined 12 is reliably increased. From a similar viewpoint, the heating time in the joining process is preferably 1 minute or more, more preferably 2 minutes or more, and preferably 30 minutes or less, and even more preferably 25 minutes or less.

[0031] From the viewpoint of properly fixing the second body to be joined 12 with the dried coating film 13b, the pressure applied in the joining process is preferably 1 MPa or more, more preferably 2 MPa or more, even more preferably 3 MPa, and preferably 35 MPa or less, even more preferably 32 MPa or less, and even more preferably 30 MPa or less. The atmosphere used during the joining process can be, for example, an air atmosphere, an inert gas atmosphere, or a reducing atmosphere. Among these, an inert gas atmosphere or a reducing atmosphere is preferred.

[0032] In the joining process, it is preferable to appropriately select firing conditions such as temperature, time, and pressure when sintering the copper powder so that the joining strength between the first body to be joined 11 and the second body to be joined 12 is 32 MPa or higher. Furthermore, the joining strength between the first body to be joined 11 and the second body to be joined 12 is more preferably 35 MPa or higher, and even more preferably 40 MPa or higher. The method for measuring the bonding strength between the first body to be joined 11 and the second body to be joined 12 will be explained in the examples described later.

[0033] In a jointed structure obtained by a sintering process, it is preferable that the void ratio of the jointing layer joining the first to be joined 11 and the second to be joined 12 is low. More specifically, the void ratio of the jointing layer is preferably 30% or less, more preferably 20% or less, and even more preferably 15% or less. The void ratio of the jointing layer is the ratio of the volume of voids (spaces not occupied by the constituent materials of the jointing layer) in the jointing layer to the apparent volume of the jointing layer. For convenience in measuring the void ratio, instead of the above volume ratio, the area ratio of voids on one surface of the jointing layer may be calculated and considered as the void ratio. The void ratio of the bonded layer can be measured, for example, as follows: First, using an ultrasonic imaging device (Hitachi High-Tech FineSAT FS300 III) with a 50 MHz probe, the bonding interface between the second workpiece and the copper powder sintered body is analyzed by reflection in the horizontal direction at a pitch of 30 μm vertically and horizontally to obtain an ultrasonic flaw detection image (SAT image). When observing the delamination state of the bonded layer, the gain value is set to 25-35 dB, and the delay and width of the S gate are adjusted so that the peak position of the S gate is on the surface of the first workpiece. The delay of the F gate is adjusted to specify the observation range of the bonded layer, and the width is set to an appropriate peak width. The Z-axis coordinate of the probe is adjusted so that the amplitude of the observation peak is maximized, and observation is performed. The contrast of the observation image is adjusted using the auto function. Of the obtained SAT image, the bonding region of the second workpiece is binarized using image processing software (Image J), ​​and the area ratio of black in the observed area (bonding ratio; %) is calculated. Specifically, after launching Image-J, select Analyze-Set measurement and check Area, Area fraction, and Limit to Threshold. Then, select File-Open to open the image data for which you want to calculate the joint ratio, and specify the area (A) of the second object to be joined in the image. Next, select Edit-Copy to system to copy the specified area (A), and then select File-New-System clipboard to paste the image of the specified area (A). After that, to clarify the joint area, select Image-Type-8bit to convert the image, and then select Image-Adjust-Threshold to adjust the image threshold to 100. Then, specify the black area (B) that exists within the area (A) of the second object to be joined in the adjusted image. The black area (B) is an area with a threshold of 100 or less and can be considered the joint area of ​​the second object to be joined. The joint ratio (%) is calculated as Area of ​​(B) / Area of ​​(A) × 100. The void ratio (%) can be calculated as 100 - Joint ratio (%).

[0034] It is more preferable that any two of the temperature, pressure, and time used to sinter the copper powder in the joining process are higher or longer than any two of the temperature, pressure, and time used to temporarily fix the second body to be joined 12 to the dry coating 13b in the laminate formation process. Furthermore, it is even more preferable that all of the temperature, pressure, and time used to sinter the copper powder in the joining process are higher and longer than the temperature, pressure, and time used to temporarily fix the second body to be joined 12 to the dry coating 13b in the laminate formation process. By performing the lamination and joining processes under these conditions, the thermal energy required during temporary fixing can be suppressed, and good joint strength can be obtained during heated and pressurized joining.

[0035] By employing this fixing method, the desired jointed structure (not shown) can be obtained. In this jointed structure, the first object to be joined 11 and the second object to be joined 12 are joined via a joining layer made of a sintered body of copper particles.

[0036] Next, the joining composition used in the temporary fixing joining method described above, as well as the first joined body 11 and the second joined body 12, will be explained.

[0037] The bonding composition used in the present invention comprises copper powder and liquid organic matter as described above. The bonding composition may further contain various modifiers.

[0038] The copper particles that make up the copper powder contained in the bonding composition are not particularly limited in shape, and both spherical and non-spherical particles can be used. A copper particle is considered spherical if its circularity coefficient is 0.85 or greater. The circularity coefficient is calculated by taking a scanning electron microscope image of a copper particle, where S is the area of ​​the two-dimensional projection image of the primary particle and L is its perimeter, and the coefficient is 4πS / L. 2 It is calculated from the formula. Copper particles are considered non-spherical if their circularity coefficient is less than 0.85.

[0039] Specific examples of non-spherical shapes include flattened, polyhedral shapes such as hexahedrons and octahedrons, fusiform shapes, and irregular shapes. A flattened shape is a shape having a pair of plate faces that form the main surface of the particle, and sides that intersect these plate faces. The plate faces and sides can each be independently flat, curved, or uneven.

[0040] The copper powder may contain copper particles having two or more different shapes. In particular, it is preferable for the copper powder to contain flattened copper particles and spherical copper particles from the viewpoint of obtaining a bonded structure with high bonding strength. It may also contain copper particles that have the same shape but different particle sizes, or multiple copper particles that have different shapes and particle sizes.

[0041] The particle size of copper particles, when spherical, shall be determined by the following method: Using a scanning electron microscope at a magnification of 10,000x to 150,000x, at least 50 primary copper particles with clearly defined outlines are selected, and the Heywood diameter of each particle is measured. Then, from the obtained Heywood diameters, the volume assuming the particle is a perfect sphere is calculated, and the cumulative volume particle size at 50% of the cumulative volume is taken as the particle size of the copper particle.

[0042] When the copper particles constituting the copper powder are spherical, their particle size is preferably greater than 0.10 μm, more preferably 0.11 μm or greater, and even more preferably 0.12 μm or greater. On the other hand, the particle size of the copper particles is preferably 0.55 μm or less, and more preferably 0.5 μm or less. When the particle size of the copper particles is greater than 0.1 μm, shrinkage cracks are less likely to occur when the dried coating film 13b is fired to form a sintered body (bonding layer). On the other hand, by setting the particle size of the copper particles to 0.55 μm or less, the sintering of the copper particles present in the dried coating film 13b can be made sufficient.

[0043] The particle size of flattened copper particles shall be determined by the following method. Specifically, a clear image of the copper particles with a defined outline is obtained using a scanning electron microscope at a magnification of 500x to 50,000x, and this image is then analyzed. More precisely, while rotating the flattened copper particle plate surface 360 ​​degrees in a direction horizontal to the surface, a virtual circumscribing rectangle is considered in each two-dimensional projection image. The longest side of the circumscribing rectangle with the longest side length is then defined as the major axis. At least 50 of these particles are randomly selected, their major axes are measured, and the arithmetic mean of these measurements is calculated and defined as the particle size. For image analysis, for example, Mac-view, an image analysis particle size distribution software from Mountec Co., Ltd., is used.

[0044] When the copper particles are flattened, the particle size is preferably 0.3 μm or larger, more preferably 0.5 μm or larger, even more preferably 1 μm or larger, and preferably 50 μm or smaller, more preferably 40 μm or smaller, and even more preferably 20 μm or smaller. By having the particle size within this range, when combined with spherical copper particles, the sintering properties of the dried coating 13b are improved while preventing cracking of the sintered body due to excessive volume shrinkage of the dried coating 13b.

[0045] From the viewpoint of enhancing the packing properties of the copper powder in the bonding composition and achieving sufficient bonding strength, the copper powder content is preferably 50% by mass or more, more preferably 60% by mass or more, and preferably 95% by mass or less, and more preferably 90% by mass or less.

[0046] The copper particles may or may not be surface-treated. Using surface-treated copper particles can suppress excessive aggregation of the copper particles themselves.

[0047] The bonding composition contains a liquid organic substance. The content of the liquid organic substance in the bonding composition is preferably 10% by mass or more, more preferably 11% by mass or more, even more preferably 12% by mass or more, and preferably 30% by mass or less, more preferably 29% by mass or less, and even more preferably 28% by mass or less. By including 10% by mass or more of liquid organic matter in the bonding composition, it becomes possible to achieve both good dispersibility and printability. Furthermore, by including 30% by mass or less of liquid organic matter in the bonding composition, the bonding strength of the bonded body obtained after the bonding process can be further increased.

[0048] The liquid organic material contained in the bonding composition has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. -1 The composition includes an organic substance (hereinafter also referred to as the "first organic substance") having a viscosity of 100 mPa·s or more under the specified conditions. Since the first organic substance has the boiling point and viscosity described above, it can remain stably in trace amounts even after the drying coating film formation process is completed, and as a result, it is possible to temporarily fix the second workpiece 12 to the dried coating film 13b. From this viewpoint, the boiling point of the first organic substance is preferably 230°C or higher, and more preferably 235°C or higher. Furthermore, from the viewpoint of improving the reliability of the bonding composition after bonding, it is preferably 290°C or lower, and even more preferably 280°C or lower.

[0049] From the viewpoint of successfully temporarily fixing the second joined body 12 to the dried coating film 13b, the following conditions were met: 25°C, shear rate 10s -1 The viscosity of the first organic substance under these conditions is 100 mPa·s or more, preferably 110 mPa·s or more, more preferably 120 mPa·s or more, and particularly preferably 140 mPa·s or more. Furthermore, from the viewpoint of ease of handling during paste preparation, the temperature is 25°C and the shear rate is 10s. -1 Under these conditions, the viscosity of the first organic substance is preferably 5000 mPa·s or less, more preferably 4000 mPa·s or less, even more preferably 3000 mPa·s or less, even more preferably 2000 mPa·s or less, even more preferably 1000 mPa·s or less, and particularly preferably 500 mPa·s or less. The viscosity of the first organic substance can be measured using a rheometer (for example, a MARS III rheometer manufactured by Thermo Scientific). The measurement conditions for the viscosity of the first organic substance are as follows: Measurement mode: Shear rate dependence measurement Sensor: Parallel type (Φ60mm) Measurement temperature: 25℃ Gap: 0.300mm Shear rate: 0.05~120.01s -1 Measurement time: 2 minutes

[0050] From the viewpoint of promoting the sintering of copper powder in the joining process, the first organic substance is preferably a compound having multiple hydroxyl groups.

[0051] Examples of the first organic substances include 2-ethyl-1,3-hexanediol (hereinafter also referred to as "octylene glycol"), 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5-pentanediol, and 1,5-pentanediol.

[0052] The bonding composition may contain organic substances other than the first organic substance (hereinafter also referred to as the "second organic substance"). There are no restrictions on the type of the second organic substance. The second organic substance may have a boiling point of less than 230°C or 300°C or higher, and a melting point of 230°C or higher but less than 300°C. Furthermore, the second organic substance may have a boiling point of less than 230°C and a shear rate of 10s at 25°C. -1 The viscosity under these conditions may be less than 100 mPa·s or 100 mPa·s or more.

[0053] From the viewpoint of properly temporarily fixing the second body to be joined 12 with the dried coating film 13b, and from the viewpoint of sufficiently increasing the bonding strength between the first body to be joined 11 and the second body to be joined 12 in the joining process, the content of the first organic substance in the joining composition is preferably 10% by mass or more, more preferably 11% by mass or more, even more preferably 12% by mass or more, and preferably 30% by mass or less, more preferably 29% by mass or less, and even more preferably 28% by mass or less. From a similar viewpoint, the bonding composition preferably contains 15 parts by mass or more of the first organic substance per 100 parts by mass of copper powder, more preferably 16 parts by mass or more, and even more preferably 17 parts by mass or more. Furthermore, the bonding composition preferably contains 45 parts by mass or less of the first organic substance per 100 parts by mass of copper powder, more preferably 40 parts by mass or less, and even more preferably 35 parts by mass or less. From the viewpoint of printability, dispersibility, and temporary fixation of the bonding composition, the content of the second organic substance in the bonding composition is preferably 2% by mass or more, more preferably 3% by mass or more, even more preferably 4% by mass or more, and preferably 20% by mass or less, more preferably 18% by mass or less, and even more preferably 17% by mass or less.

[0054] From the viewpoint of improving the applicability or printability of the bonding composition and successfully performing temporary fixing, the content of organic matter in the bonding composition is preferably 9% by mass or more, more preferably 10% by mass or more, and even more preferably 11% by mass or more. Furthermore, the content of organic matter in the bonding composition is preferably 35% by mass or less, more preferably 33% by mass or less, and even more preferably 30% by mass or less.

[0055] From the viewpoint of promoting the sintering of copper powder in the joining process, it is preferable that the joining composition contains at least one reducing substance. The reducing substance may be a first organic substance, a second organic substance, or an inorganic substance. Examples of reducing substances include monoalcohols, aminoalcohols, polyhydric alcohols, citric acid, oxalic acid, formic acid, ascorbic acid, aldehydes, hydrazines and their derivatives, hydroxylamines and their derivatives, dithiothreitol, phosphites, hydrophosphites, phosphorous acid and its derivatives, and the like. Among these, the bonding composition preferably contains aminoalcohols and / or polyhydric alcohols as reducing substances. As for the amino alcohol included in the bonding composition, from the viewpoint of enhancing its reducing power, it is preferable to use one that has two or more hydroxyl groups, more preferably three or more, even more preferably four or more, and particularly preferably five or more. From the viewpoint of sufficiently promoting the sintering of copper powder in the joining process and ensuring a sufficient content of components other than amino alcohol, if the joining composition contains amino alcohol, the content of amino alcohol in the joining composition is preferably 0.0001% by mass or more, more preferably 0.0002% by mass or more, and even more preferably 0.0003% by mass or more. Furthermore, the content of amino alcohol in the joining composition is preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3.5% by mass or less.

[0056] Examples of polyhydric alcohols included in the bonding composition include glycerin, 1,2,6-hexanetriol, polytetramethylene glycol, polypropylene glycol, and polyethylene glycol. From the viewpoint of promoting the sintering of copper powder in the bonding process, polyhydric alcohols with a number average molecular weight of 20 or more are preferably used in the bonding composition, more preferably with a number average molecular weight of 50 or more, even more preferably with a number average molecular weight of 100 or more, preferably with a number average molecular weight of 10,000 or less, more preferably with a number average molecular weight of 5,000 or less, and even more preferably with a number average molecular weight of 4,000 or less. When the bonding composition contains a polyhydric alcohol, from the viewpoint of sufficiently promoting the sintering of copper powder in the bonding process and ensuring a sufficient content of components other than polyhydric alcohols, the content of polyhydric alcohol in the bonding composition is preferably 0.1% by mass or more, more preferably 0.15% by mass or more, even more preferably 0.2% by mass or more, preferably 10% by mass or less, more preferably 9% by mass or less, and even more preferably 8% by mass or less.

[0057] From the viewpoints of more reliably temporarily fixing the dried coating film 13b of the second adherend 12 and promoting the sintering of the copper powder in the bonding process, the bonding composition preferably contains a first organic substance and one or more substances having reducing properties and different from the first organic substance. More preferably, it contains the first organic substance and an amino alcohol or polyethylene glycol. Still more preferably, it contains the first organic substance and polyethylene glycol. Particularly preferably, it contains the first organic substance, polyethylene glycol, and an amino alcohol.

[0058] The bonding composition may contain components other than the above-described components. Examples of such components include a viscosity modifier and a surface tension modifier. As the viscosity modifier, those that can adjust the viscosity of the bonding composition to preferably be within the viscosity range described later are suitable. Examples include ketones, esters, alcohols, glycols, hydrocarbons, polymers, and the like. As the surface tension modifier, those that can adjust the surface tension of the wet coating film 13a are suitable. Examples include acrylic surfactants, silicone surfactants, alkyl polyoxyethylene ethers, polymers such as fatty acid glycerol esters, and monomers such as alcohol-based, hydrocarbon-based, ester-based, and glycol-based substances.

[0059] From the viewpoint of enhancing the coating property or printability of the bonding composition, the viscosity of the bonding composition at 25°C and a shear rate of 10 s -1 is preferably 5 Pa·s or more, more preferably 7 Pa·s or more, and preferably 100 Pa·s or less, more preferably 80 Pa·s or less. The viscosity of the bonding composition can be measured by the same method as the method for measuring the viscosity of the first organic substance described above.

[0060] There are no particular restrictions on the types of the first and second objects to be joined 11 and 12. Generally, it is preferable that both the first and second objects to be joined 11 and 12 have metal on their joining surfaces. For example, at least one of the first and second objects to be joined 11 can be a member having a metal surface. "Metal" refers to metal itself that does not form compounds with other elements, or an alloy of two or more metals. Examples of such metals include copper, silver, gold, aluminum, palladium, or nickel, or alloys made of two or more of these.

[0061] If at least one of the first to be joined 11 and the second to be joined 12 is a member having a surface made of metal, the metal surface is generally preferably flat, but may be curved in some cases.

[0062] Specific examples of the first to be bonded body 11 and the second to be bonded body 12 include, independently, spacers, heat sinks, semiconductor elements made of the aforementioned metals, and substrates having at least one of the aforementioned metals on their surface. As the substrate, for example, an insulating substrate having a metal layer such as copper on the surface of a ceramic or aluminum nitride plate can be used. When semiconductor elements are used as the first bonded body 11 and / or the second bonded body 12, the semiconductor elements contain one or more elements such as Si, Ga, Ge, C, N, and As.

[0063] The first object to be bonded 11 is preferably a substrate. The second object to be bonded 12 is preferably a spacer, a heat sink, or a semiconductor element.

[0064] A dried bonding composition containing metal fine particles and organic matter can also be used as at least one of the first to be bonded body 11 and the second to be bonded body 12. Specifically, a member having a metal surface can be used as the first to be bonded body 11, and a dried bonding composition containing metal fine particles and organic matter can be used as the second to be bonded body 12. When using a dried bonding composition, it is preferable to coat a support substrate made of metal such as copper with the bonding composition and dry it to obtain the dried bonding composition.

[0065] The bonded structures obtained by this manufacturing method are suitable for use in devices that handle high currents, such as automotive electronic circuits and electronic circuits on which power devices are mounted.

[0066] Although the manufacturing method of the present invention has been described above based on its preferred embodiments, the present invention is not limited to the above embodiments. For example, if the wet coating contains organic matter that is solid at 25°C, in the drying coating process, some or all of the organic matter that is solid at 25°C may be removed from the wet coating in addition to the liquid organic matter.

[0067] The above embodiments of the present invention encompass the following technical concepts. [1] A method for manufacturing a bonded structure in which a first body to be bonded and a second body to be bonded are bonded together via a bonding layer, A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C to the first object to be bonded to form a wet coating film, A step of removing the organic matter from the wet coating film to obtain a dry coating film, A step of temporarily fixing the second object to be joined to the dried coating film by pressurization to obtain a laminate in which the first object to be joined, the dried coating film, and the second object to be joined are stacked in this order, The process includes heating the laminate under pressure to sinter the copper powder in the dry coating film, and joining the first and second objects to be joined by the bonding layer formed by the sintering, The aforementioned organic substance includes a first organic substance, The first organic substance has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. -1 A method for manufacturing a bonded structure, wherein the viscosity under the specified conditions is 100 mPa·s or more. [2] The manufacturing method according to [1], wherein any two of the temperature, pressure, and time used to sinter the copper powder are higher or longer than any two of the temperature, pressure, and time used to temporarily fix the second workpiece to the dry coating film. [3] The manufacturing method according to [1] or [2], wherein the organic matter is removed from the wet coating film to obtain the dry coating film which does not have fluidity. [4] The manufacturing method according to [3], wherein the organic matter is removed from the wet coating film such that the mass of the wet coating film decreases by 15% by mass or more and 30% by mass or less. [5] When the content of the organic substance in the wet coating film is 100 parts by mass, The manufacturing method according to any one of [1] to [4], wherein the organic matter is removed from the wet coating film so that the content of the organic matter in the dry coating film is 25 parts by mass or less. [6] The manufacturing method according to any one of [1] to [5], wherein the wet coating film is heated in an air atmosphere or an inert gas atmosphere at 100°C to 200°C for 10 minutes or more to remove the organic matter and obtain the dry coating film. [7] The manufacturing method according to any one of [1] to [6], wherein the bonding composition comprises at least one substance having reducing properties. [8] The method for producing the substance according to [7], wherein at least one of the substances is an amino alcohol compound. [9] The bonding composition comprises 15 to 45 parts by mass of the first organic substance per 100 parts by mass of copper powder, as described in any one of [1] to [8].

[10] The manufacturing method according to any one of [1] to [9], wherein the second object to be joined is temporarily fixed to the dry coating film by pressurizing and heating.

[11] The method for producing the first organic substance according to any one of [1] to

[10] , wherein at least one of the first organic substances is a compound having multiple hydroxyl groups.

[12] The manufacturing method according to any one of [1] to

[11] , wherein the copper powder in the wet coating film does not sinter, and the second body to be joined is temporarily fixed to the dry coating film to obtain the laminate.

[13] The manufacturing method according to any one of [1] to

[12] , wherein the copper powder is sintered such that the bonding strength between the first body to be joined and the second body to be joined in the joining structure is 30 MPa or more.

[14] A method for joining a first object to be joined and a second object to be joined via a joining layer, A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C to the first object to be bonded to form a wet coating film, A step of removing the organic matter from the wet coating film to obtain a dry coating film, A step of temporarily fixing the second object to be joined to the dried coating film by pressurization to obtain a laminate in which the first object to be joined, the dried coating film, and the second object to be joined are stacked in this order, The process includes a step of pressurizing and heating the laminate to sinter the copper powder in the dried coating film, and joining the first and second objects to be joined by the bonding layer formed by sintering, The aforementioned organic substance includes a first organic substance, The first organic substance has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. -1 A bonding method in which the viscosity under the specified conditions is 100 mPa·s or more. [Examples]

[0068] The present invention will be described in more detail below with reference to examples. However, the scope of the present invention is not limited to these examples. Unless otherwise specified, "%" means "mass%".

[0069] [Examples 1 to 4 and Comparative Examples 1 and 2] (1) Preparation of bonding composition The bonding composition was prepared by mixing copper powder consisting of spherical copper particles with a particle size of 0.1 to 0.2 μm and flattened copper particles with a particle size of 4.5 μm, and organic matter in the mass ratio shown in Table 2. PEG-300 refers to polyethylene glycol with a number average molecular weight of 300, and Bis-tris refers to bis(2-hydroxyethyl)iminotris(hydroxymethyl)methane (an amino alcohol with five hydroxyl groups). Both PEG-300 and Bis-tris are reducing agents. Table 1 shows the boiling point and shear rate (shear rate 10s) of the organic matter used in each example and comparative example, which is in a liquid state at 25°C. -1 The viscosity under these conditions is shown. In Table 1, "-" indicates unknown. As is clear from Table 1, octylene glycol and 3-methyl-1,5-pentanediol belong to the first category of organic substances, while hexylene glycol, diethylene glycol, and PEG-300 belong to the second category of organic substances. Note that the Bis-tris used in each example and comparative example is solid at 25°C.

[0070] (2) Application of the bonding composition to the first object to be bonded A substrate (20 mm × 20 mm, 2 mm thick) made by laminating copper and ceramics in the thickness direction was used as the first workpiece. A bonding composition was printed onto the copper side of this substrate using a metal mask (6 mm × 6 mm, 100 μm thick) to form a rectangular wet coating. The wet coating film was dried at 120°C for 30 minutes under the atmosphere described in Table 2 to remove liquid organic matter and obtain a dry coating film. The percentage of mass reduction of the wet coating film due to the removal of liquid organic matter is shown in Table 2. The content of liquid organic matter in the dry film is also shown in the same table, when the content of liquid organic matter in the wet coating film is assumed to be 100 parts by mass. The content of liquid organic matter in the dry film was calculated assuming that components other than liquid organic matter were not removed from the wet coating film when the liquid organic matter was removed to form the dry coating film. In all examples and comparative examples, the dry coating film did not have fluidity.

[0071] The mass loss rate of the wet coating film was measured by the following method. The mass of a substrate made of laminated copper and ceramics was measured using an electronic balance. Then, the mass of the substrate containing the wet coating film after printing the bonding composition was measured using an electronic balance. The mass of the wet coating film obtained by printing was calculated by subtracting the mass of the substrate before printing from the mass of the substrate containing the wet coating film. After drying the substrate containing the wet coating film for a predetermined time, the mass of the substrate containing the dried coating film was measured using an electronic balance. The mass of the wet coating film reduced by drying was calculated by subtracting the mass of the substrate containing the dried coating film from the mass of the substrate containing the wet coating film. The percentage of mass reduction of the wet coating film was calculated by dividing the mass of the wet coating film reduced by drying by the mass of the wet coating film obtained by printing and multiplying by 100.

[0072] (3) Placing the second object to be joined onto the dried coating film As the second substrate to be bonded, a model component of a semiconductor power device was assumed, and an Ag-plated SiC chip was prepared (5mm x 5mm x 1.92mm, weight: 0.016g). The Ag-plated surface of the SiC chip was placed in the center of the dry coating using a chip mounter.

[0073] (4) Formation of a laminate After heating the SiC chip to 170°C, a pressure of 2.4 MPa was applied for 0.4 seconds from the side opposite to the Ag-plated surface of the SiC chip to press it into the dry coating, temporarily fixing the SiC chip and forming a laminate.

[0074] (5) Firing of the laminate The laminate was moved to a firing furnace, pressurized to 25 MPa under a nitrogen atmosphere, heated to 300°C, and held for 5 minutes to bake the coating film into a bonding layer, thereby obtaining a bonded structure.

[0075] [Rating 1] In the examples and comparative examples, the laminate obtained in "(4) Formation of the laminate" was inverted upside down over 1 second, and the presence or absence of detachment of the SiC chip was visually observed. The results are shown in Table 2.

[0076] [Rating 2] In Examples 1 and 2, where no SiC chip detachment was observed in "Evaluation 1," the shear strength of the bonded structure obtained in "(5) Firing of the Laminate" was measured using the following method to confirm the bonding strength. Shear strength is a value defined as "breaking load / bottom area of ​​SiC chip." The results are shown in Table 2. In Table 2, "-" indicates that measurement was not performed. • Measurement device name: Condor Sigma (manufactured by XYZTEC) • Load cell: 200 kgf • Shear tool: width 6.0 mm, thickness 2.0 mm, shaft 1 / 4 inch (model number: T0S663060) • Shear speed: 50 μm / s • Shear height: 0.02 mm (zero point was the top of the printed coating, which was 6 mm square)

[0077] [Table 1]

[0078] [Table 2]

[0079] As is clear from Table 2, in Examples 1 to 4, where octylene glycol or 3-methyl-1,5-pentanediol with appropriate viscosity was used, the first and second joined parts were successfully joined together without the second joined part falling off, even without the use of a temporary fixing agent. Furthermore, the joint strength of the joined structures produced in these examples was sufficiently high. [Industrial applicability]

[0080] According to the present invention, a method for manufacturing a joining structure and a joining method are provided that enable joining of objects to be joined using a joining material without causing misalignment or detachment of the objects to be joined.

Claims

1. A method for manufacturing a bonded structure in which a first body to be bonded and a second body to be bonded are bonded together via a bonding layer, A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C to the first object to be bonded to form a wet coating film, A step of removing the organic matter from the wet coating film to obtain a dry coating film, A step of temporarily fixing the second object to be joined to the dried coating film by pressurization to obtain a laminate in which the first object to be joined, the dried coating film, and the second object to be joined are stacked in this order, The process includes heating the laminate under pressure to sinter the copper powder in the dry coating film, and joining the first and second objects to be joined by the bonding layer formed by the sintering, The aforementioned organic substance includes a first organic substance, The first organic substance has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. －１ A method for manufacturing a bonded structure, wherein the viscosity under the specified conditions is 100 mPa·s or more and 1000 mPa·s or less.

2. The manufacturing method according to claim 1, wherein any two of the temperature, pressure, and time used when sintering the copper powder are higher or longer than any two of the temperature, pressure, and time used when temporarily fixing the second workpiece to the dry coating film.

3. The manufacturing method according to claim 1 or 2, wherein the organic matter is removed from the wet coating film to obtain a dry coating film that does not have fluidity.

4. The manufacturing method according to claim 3, wherein the organic substance is removed from the wet coating film such that the mass of the wet coating film decreases by 15% by mass or more and 30% by mass or less.

5. When the content of the organic substance in the wet coating film is 100 parts by mass, The manufacturing method according to claim 1 or 2, wherein the organic matter is removed from the wet coating film such that the content of the organic matter in the dry coating film is 25 parts by mass or less.

6. The manufacturing method according to claim 1 or 2, wherein the wet coating film is heated in an atmospheric or inert gas atmosphere at 100°C to 200°C for 10 minutes or more to remove the organic matter and obtain the dry coating film.

7. The manufacturing method according to claim 1 or 2, wherein the bonding composition comprises at least one substance having reducing properties.

8. The method for producing the substance according to claim 7, wherein at least one of the substances is an amino alcohol compound.

9. The manufacturing method according to claim 1 or 2, wherein the bonding composition contains 15 to 45 parts by mass of the first organic substance per 100 parts by mass of the copper powder.

10. The manufacturing method according to claim 1 or 2, wherein the second object to be joined is temporarily fixed to the dried coating film by pressurization and heating.

11. The method for producing organic matter according to claim 1 or 2, wherein the first organic substance is a compound having a plurality of hydroxyl groups.

12. The manufacturing method according to claim 1 or 2, wherein the copper powder in the wet coating film does not sinter, and the second body to be joined is temporarily fixed to the dry coating film to obtain the laminate.

13. The manufacturing method according to claim 1 or 2, wherein the copper powder is sintered such that the bonding strength between the first to be joined and the second to be joined in the joining structure is 30 MPa or more.

14. A method for joining a first object to be joined and a second object to be joined via a joining layer, A step of applying a bonding composition containing copper powder and an organic substance that is liquid at 25°C to the first object to be bonded to form a wet coating film, A step of removing the organic matter from the wet coating film to obtain a dry coating film, A step of temporarily fixing the second object to be joined to the dried coating film by pressurization to obtain a laminate in which the first object to be joined, the dried coating film, and the second object to be joined are stacked in this order, The process includes a step of pressurizing and heating the laminate to sinter the copper powder in the dried coating film, and joining the first and second objects to be joined by the bonding layer formed by the sintering, The aforementioned organic substance includes a first organic substance, The first organic substance has a boiling point of 230°C or higher and less than 300°C, and a shear rate of 10s at 25°C. －１ A bonding method wherein the viscosity under the specified conditions is 100 mPa·s or more and 1000 mPa·s or less.

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