Component mounting equipment

Abstract

To provide a component mounting device capable of imaging a recognition mark of each of components having different external shapes.SOLUTION: A component mounting device according to the present disclosure includes: a mounting head holding a component having a recognition mark; a first imaging element provided on a side of the mounting head and imaging a first recognition mark of the component in a first field of view based on a first imaging optical path; a second imaging element provided on a side of the mounting head and imaging a second recognition mark of the component in a second field of view based on a second imaging optical path; a first reflective optics reflecting the first imaging optical path toward the first imaging element through a first through hole provided in the mounting head; a second reflective optics reflecting the second imaging optical path toward the second imaging element through a second through hole provided in the mounting head; and a control part changing, based on component information, the relative heights of the first reflective optics and the second reflective optics, and the first imaging element and the second imaging element, in order to adjust the positions of the first field of view and the second field of view.SELECTED DRAWING: Figure 5A

Description

Technical Field

[0001] The present disclosure relates to a component mounting device for mounting components on a substrate.

Background Art

[0002] As a component mounting device, for example, Patent Document 1 discloses a device for mounting components such as semiconductor elements on a substrate.

[0003] The component mounting device of Patent Document 1 includes a suction nozzle that holds a component and recognition means such as a CCD camera provided on the side of the suction nozzle. The recognition means can read a recognition mark for alignment formed on the component.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, due to the miniaturization of semiconductor elements in recent years, the recognition marks on components have also become smaller. Therefore, in order to image small recognition marks, the magnification of the lens of an imaging device such as a CCD camera is increased to enlarge and read the recognition marks. As a result, the field of view of the imaging device has become smaller compared to the conventional configuration.

[0006] Therefore, there is still room for improvement in terms of imaging the recognition marks of components having different outer shapes with a small field of view.

[0007] An object of the present disclosure is to provide a component mounting device that can image recognition marks of components having different outer shapes in order to solve the above problems.

Means for Solving the Problems

[0008] The component mounting apparatus according to this disclosure includes a mounting head for holding a component having a recognition mark for alignment; a first image sensor provided on the side of the mounting head and capturing a first recognition mark of a component in a first field of view based on a first imaging optical path passing through the mounting head; a second image sensor provided on the side of the mounting head and capturing a second recognition mark of a component in a second field of view based on a second imaging optical path passing through the mounting head; a first reflective optical system that reflects the first imaging optical path from the first field of view toward the first image sensor through a first through-hole provided in the mounting head; a second reflective optical system that reflects the second imaging optical path from the second field of view toward the second image sensor through a second through-hole provided in the mounting head; and a control unit that controls the relative height change between the first reflective optical system, the second reflective optical system, and the first and second image sensors based on component information in order to adjust the positions of the first and second fields of view. [Effects of the Invention]

[0009] According to this disclosure, recognition marks on parts having different external shapes can be imaged. [Brief explanation of the drawing]

[0010] [Figure 1A] Cross-sectional view of a component mounting device according to Embodiment 1 of this disclosure [Figure 1B] Plan view of a part [Figure 2] Schematic plan view of the mounting head in Figure 1A [Figure 3] Enlarged cross-sectional view of the area near the first reflective optical system along line AA in Figure 2. [Figure 4] Enlarged cross-sectional view of the area near the second and third reflective optical systems along line BB in Figure 2. [Figure 5A] Schematic cross-sectional view of the component mounting device after the mounting head has been raised. [Figure 5B] Plan view of a part [Figure 6] Schematic plan view of the mounting head in Figure 5A [Figure 7](a) Enlarged cross-sectional view near the first reflection optical system along the A-A line in FIG. 2, (b) Enlarged cross-sectional view near the first reflection optical system along the C-C line in FIG. 6 [Figure 8] (a) Enlarged cross-sectional view near the second and third reflection optical systems along the B-B line in FIG. 2, (b) Enlarged cross-sectional view near the second and third reflection optical systems along the D-D line in FIG. 6 [Figure 9A] Schematic cross-sectional view of the component mounting device after the mounting head descends [Figure 9B] Plan view of the component [Figure 10] Schematic plan view of the mounting head in FIG. 9A [Figure 11] (a) Enlarged cross-sectional view near the first reflection optical system along the A-A line in FIG. 2, (b) Enlarged cross-sectional view near the first reflection optical system along the E-E line in FIG. 10 [Figure 12] (a) Enlarged cross-sectional view near the second and third reflection optical systems along the B-B line in FIG. 2, (b) Enlarged cross-sectional view near the second and third reflection optical systems along the F-F line in FIG. 10 [Figure 13] Schematic plan view of the component mounting device according to Embodiment 2 of the present disclosure [Figure 14A] Schematic plan view of the mounting head in FIG. 14 [Figure 14B] Schematic plan view of the mounting head in FIG. 14 [Figure 14C] Schematic plan view of the mounting head in FIG. 14[[ID=�1]] [Figure 15] Cross-sectional view of the component mounting device according to Embodiment 3 of the present disclosure

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0012] [Embodiment 1] (Overall Configuration) FIG. 1A is a cross-sectional view of a component mounting device 100 according to Embodiment 1 of the present disclosure. FIG. 1B is a schematic plan view of a component 2. FIG. 2 is a schematic plan view of a mounting head 1 in FIG. 1A.

[0013] As shown in Figure 1A, the component mounting apparatus 100 in Embodiment 1 of the present disclosure comprises a mounting head 1, reflective optical systems 61, 62, and 63, a stage 12, a head lifting mechanism 40, a head moving mechanism 52, an imaging unit 11, and a control unit 51.

[0014] The mounting head 1 is a mechanism that holds component 2 and mounts the held component 2 onto the substrate 13 held by the stage 12.

[0015] Here, component 2 is a die, i.e., an IC chip, which is a thin, rectangular plate-like member made of an opaque material such as silicone, gallium nitride, or silicone carbide. Recognition marks 3a and 3b for alignment are formed on one surface 2a of component 2 (the top surface in Figure 1A). As shown in Figure 1B, the recognition marks 3a and 3b are, for example, small squares and are formed at at least one pair of diagonal positions on the rectangular component 2. An adhesive layer (not shown) for bonding to the substrate 13 is formed on the other surface 2b of component 2 (the bottom surface in Figure 1A). The adhesive layer is composed of, for example, a thermosetting adhesive such as epoxy resin, acrylic resin, or silicone resin, a thermoplastic adhesive, a conductive adhesive, or solder paste.

[0016] The substrate 13 on which component 2 is mounted is made of, for example, silicone, glass, stainless steel, or a resin substrate, and its planar shape is circular or rectangular.

[0017] The reflective optical systems 61, 62, and 63 are located inside the mounting head 1. The first reflective optical system 61 is an optical system for guiding light from the recognition mark 3a of the component 2 through the mounting head 1 to the imaging unit 11. The second reflective optical system 62 and the third reflective optical system 63 are optical systems for guiding light from the recognition mark 3b of the component 2 through the mounting head 1 to the imaging unit 11.

[0018] Stage 12 is a component that supports the substrate 13 so as to face the mounting head 1. Under the control of the control unit 51, Stage 12 is movable in the XY direction, which is orthogonal to the vertical direction (Z direction), and in the θ direction around the Z direction.

[0019] The head lifting mechanism 40 drives the mounting head 1 in a direction perpendicular to the plane of the stage 12 (for example, in the Z direction).

[0020] The head movement mechanism 52 drives the mounting head 1 in a lateral direction (e.g., XY direction) that is perpendicular to the vertical direction (e.g., up and down direction) of the mounting head 1 by the head lifting mechanism 40.

[0021] The imaging unit 11 is positioned to the side of the mounting head 1 and is a mechanism that images the recognition marks 3a and 3b of the component 2 via the reflective optical systems 61, 62, and 63.

[0022] The imaging unit 11 is configured by fixing two imaging units 11a and 11b to a single imaging stage 11c. The imaging units 11a and 11b are, for example, CCD cameras.

[0023] The first imaging unit 11a has a first image sensor 15a and captures the first recognition mark 3a in the first field of view 64a (Figure 2). The second imaging unit 11b has a second image sensor 15b and captures the second recognition mark 3b in the second field of view 64b (Figure 2).

[0024] The optical path extending from the first field of view 64a to the first image sensor 15a is designated as the first imaging optical path 65, and the optical path extending from the second field of view 64b to the second image sensor 15b is designated as the second imaging optical path 66.

[0025] The imaging stage 11c is connected to the mounting head 1 by a connecting part 14. The connecting part 14 can fix the imaging stage 11c and the mounting head 1 to each other, and can also connect the imaging stage 11c and the mounting head 1 so that they can move relative to each other. In Embodiment 1, the connecting part 14 connects the imaging stage 11c and the mounting head 1 so that the mounting head 1 can move vertically relative to the imaging stage 11c when recognizing fields 64a and 64b.

[0026] The control unit 51 controls each part of the component mounting device 100. The control unit 51 drives and controls the mounting head 1, the head lifting mechanism 40, the head moving mechanism 52, the imaging unit 11, and the stage 12, respectively. The control unit 51 includes a general-purpose processor such as a CPU or MPU that realizes predetermined functions by executing a program. The control unit 51 is not limited to realizing predetermined functions through the cooperation of hardware and software, but may also be a hardware circuit specifically designed to realize predetermined functions.

[0027] The control unit 51 includes a storage unit 31, an image processing device 42, and a position calculation unit 50.

[0028] The memory unit 31 is a recording medium that stores various types of information. The memory unit 31 can be implemented as, for example, a flash memory, an SSD (Solid State Device), a hard disk, other storage devices, or a combination thereof as appropriate. The memory unit 31 stores, for example, a production program executed by the control unit 51. The production program includes component information, specifically information regarding the type of component 2 to be mounted, its mounting position, aspect ratio, external dimensions, the position of recognition marks 3a and 3b, etc.

[0029] The image processing device 42 is connected to two imaging units 11a and 11b, and the image processing device 42 and the imaging units 11a and 11b function as an example of an image recognition device. The image processing device 42 can read the position information of the recognition marks 3a and 3b of the component 2 by performing known image processing, such as background subtraction, on the image information captured by the imaging units 11a and 11b.

[0030] The position calculation unit 50 is connected to the image processing device 42. The position calculation unit 50 calculates the relative coordinates of the component 2 with respect to the coordinates of the center of gravity of the mounting head 1 from the position information of the recognition marks 3a and 3b obtained by the image processing device 42. That is, the position calculation unit 50 calculates the amount of positional displacement of the component 2 with respect to the coordinates of the center of gravity of the mounting head 1. Based on the amount of positional displacement calculated by the position calculation unit 50, the control unit 51 can mount the component while aligning the position of the component 2 by controlling the head lifting mechanism 40 and the head moving mechanism 52.

[0031] (Configuration of the mounting head) Here, the configuration of the mounting head 1 will be described in more detail. The mounting head 1 has a head body portion 1a and a holding member 5.

[0032] The head body portion 1a is a component that forms the outer casing of the mounting head 1. The head body portion 1a has a rectangular parallelepiped-shaped heater block 67, a rectangular parallelepiped-shaped cooling block 68, and a rectangular parallelepiped-shaped prism block 71. The cooling block 68 is fixed to the upper surface of the heater block 67, and the prism block 71 is fixed to the upper surface of the cooling block 68. The retaining member 5 is fixed to the lower surface of the heater block 67.

[0033] The holding member 5 is a member that holds the part 2. The holding member 5 is, for example, a suction nozzle connected to a vacuum pump 41 that holds the part 2 by vacuum suction. The holding member 5 may hold the part 2 in other ways.

[0034] Since the holding member 5 is optically transmittable for imaging, light passes through the holding member 5, allowing the imaging units 11a and 11b to image the component 2. The holding member 5 is made of, for example, a transparent material. The holding member 5 is made of, for example, sapphire, quartz, glass, or heat-resistant plastic.

[0035] The heater block 67 incorporates a heater 6 that can heat the component 2 via the holding member 5. Heating by the heater 6 can soften the adhesive layer on the lower surface 2b of the component 2, or melt the bonding material such as solder.

[0036] The cooling block 68 is equipped with cooling passages (not shown) through which cooling water or the like circulates. The prism block 71 is cooled by the circulation of the cooling water. This configuration can suppress the excessive temperature rise of the prism block 71 caused by heating from the heater block 67.

[0037] The prism block 71 houses the reflective optical systems 61, 62, and 63.

[0038] As shown in Figure 1A, the cooling block 68 and the heater block 67 form two through holes 69a and 69b so that light can reach the reflective optical systems 61 and 62 from the component 2. The first through hole 69a communicates vertically from the holding member 5 to the first reflective optical system 61, and the second through hole 69b communicates vertically from the holding member 5 to the second reflective optical system 62.

[0039] Furthermore, as shown in Figure 2, when the mounting head 1 is viewed from above, the first through-hole 69a and the second through-hole 69b each have an elongated shape such as an oval, and are both elongated holes. The first through-hole 69a and the second through-hole 69b share a common longitudinal direction K and a short-range direction L. The first through-hole 69a and the second through-hole 69b are also arranged side by side in the longitudinal direction K with a gap between them. The first through-hole 69a and the second through-hole 69b may also share a common centerline J extending in the longitudinal direction K.

[0040] The longitudinal direction K may be aligned with the direction in which the diagonal of the holding member 5 extends. Also, the direction in which the diagonal of the part 2 held by the holding member 5 is assumed to extend, or the direction in which the first recognition mark 3a and the second recognition mark 3b are assumed to be aligned, may be aligned with the longitudinal direction K.

[0041] The shape of the first through-hole 69a may be the same as the shape of the second through-hole 69b. Also, in a plan view, the outer dimensions of the first through-hole 69a may be smaller than those of the first reflective optical system 61, and the outer dimensions of the second through-hole 69b may be smaller than those of the second reflective optical system 62. With this configuration, the reflective optical systems 61 and 62 can be stably arranged on the cooling block 68.

[0042] (Configuration of the reflective optical system) Referring to Figures 1A and 2-4, the configurations of the reflective optical systems 61, 62, and 63 will be described in more detail. Figure 3 is an enlarged cross-sectional view of the area around the first reflective optical system 61 along line AA in Figure 2. Figure 4 is an enlarged cross-sectional view of the area around the second reflective optical system 62 and the third reflective optical system 63 along line BB in Figure 2.

[0043] As shown in Figures 1A and 2, the first reflective optical system 61 is positioned above the first through-hole 69a, and the second reflective optical system 62 is positioned above the second through-hole 69b, side by side in the longitudinal direction K. The first reflective optical system 61 and the second reflective optical system 62 may be formed integrally. The third reflective optical system 63 is positioned at a distance from the second reflective optical system 62 in the short direction L.

[0044] The first reflective optical system 61 is, for example, a reflective prism or a reflective mirror. As shown in Figures 1A and 2, the first reflective optical system 61 receives the first imaging optical path 65 passing through the first through-hole 69a from the first field of view 64a on the component 2 and reflects it toward the first image sensor 15a. The first imaging optical path 65 reflected by the first reflective optical system 61 propagates in the short-side direction L.

[0045] The second reflective optical system 62 is, for example, a reflective prism or a reflective mirror, and may be similar to the first reflective optical system 61. As shown in Figures 1A and 2, the second reflective optical system 62 receives the second imaging optical path 66 passing through the second through-hole 69b from the second field of view 64b on component 2 and reflects it toward the third reflective optical system 63. The second imaging optical path 66 reflected by the second reflective optical system 62 propagates in the short-side direction L, in the opposite direction to the propagation direction of the first imaging optical path 65 reflected by the first reflective optical system 61.

[0046] As shown in Figure 3, the first reflective optical system 61 has a first reflective surface 61a extending in the longitudinal direction K. The first reflective surface 61a is inclined at a certain angle α with respect to the vertical direction (the vertical direction of the mounting head 1). The angle α is, for example, 45°. With this structure, the first imaging optical path 65 can be bent by 90° from the vertical direction to the horizontal direction by reflection in the first reflective optical system 61.

[0047] As shown in Figure 4, the second reflective optical system 62 has a second reflective surface 62a extending in the longitudinal direction K. The second reflective surface 62a is inclined at a certain angle β with respect to the vertical direction, in the opposite direction to the first reflective surface 61a (Figure 3). The angle β is, for example, 45°. With this structure, the reflection in the second reflective optical system 62 can bend the second imaging optical path 66 by 90° from the vertical direction to the lateral direction, in the opposite direction to the first imaging optical path 65.

[0048] As shown in Figure 2, the third reflective optical system 63 is, for example, a triangular plate-shaped prism. In this embodiment, the third reflective optical system 63 is a right-angled triangular plate-shaped prism, and is positioned such that the hypotenuse extends in the longitudinal direction K. The third reflective optical system 63 forms a third reflective surface 63a and a fourth reflective surface 63b by two sides that form a right angle. The second imaging optical path 66 reflected by the second reflective optical system 62 is reflected by the third reflective surface 63a and then directed toward the fourth reflective surface 63b, and then directed toward the second image sensor 15b. By reflecting the second imaging optical path 66 reflected by the second reflective optical system 62 twice by the third reflective surface 63a and the fourth reflective surface 63b, the propagation direction of the second imaging optical path 66 can be reversed compared to the propagation direction before it enters the third reflective optical system 63. As a result, the second imaging optical path 66 reflected by the third reflective optical system 63 propagates in the same direction as the first imaging optical path 65 reflected by the first reflective optical system 61.

[0049] (Movement of the mounting head) In the configuration described above, an example of the operation of the component mounting device 100 will now be explained.

[0050] The control unit 51 acquires part information for part 2. The control unit 51 acquires part information for part 2 by referring to a production program, for example. The part information includes information related to the mounting of part 2, such as the mounting position of part 2, the positions of recognition marks 3a and 3b, and the height of the mounting head 1 when imaging the recognition marks 3a and 3b (hereinafter referred to as the imaging height H). In addition, the part information may include the aspect ratio of part 2 and the positions of the recognition marks 3a and 3b predicted based on the aspect ratio, instead of the positions of the recognition marks 3a and 3b. The imaging height H is the relative height between the reflective optical systems 61, 62, and 63 and the image sensors 15a and 15b. In Embodiment 1, since the imaging unit 11 is fixed, the imaging height H is the height of the mounting head 1 relative to an arbitrary reference height.

[0051] Based on the component information, the control unit 51 moves the mounting head 1 above the transfer stage (not shown) on which the component 2 is mounted before mounting. Specifically, the control unit 51 moves the mounting head 1 by controlling the head movement mechanism 52, which moves the mounting head 1 horizontally, and the head lifting mechanism 40, which moves the mounting head 1 vertically.

[0052] Next, the control unit 51 acquires the recognition marks 3a and 3b of the component 2 mounted on the transfer stage and the position information of the mounting head 1. Specifically, a camera for the transfer stage (not shown) mounted on the transfer stage reads the recognition marks 3a and 3b of the component 2 and the position information of the mounting head 1, and transmits it to the control unit 51.

[0053] Next, the control unit 51 aligns the mounting head 1 with respect to the component 2 mounted on the transfer stage, based on the recognition marks 3a and 3b of the component 2 and the position information of the mounting head 1. Specifically, the control unit 51 aligns the mounting head 1 with respect to the component 2 in the X, Y, and θ directions (rotational direction around the Z direction) by driving the head movement mechanism 52.

[0054] Next, the control unit 51 lowers the mounting head 1, which has been aligned with the component 2, using the head lifting mechanism 40 to hold the component 2. When the mounting head 1 is lowered, the holding member 5 of the mounting head 1 comes into contact with the component 2, and the component 2 is held by vacuum suction of the holding member 5. Here, in order to shorten the mounting time, the mounting head 1 may be preheated by the heater 6.

[0055] Next, the control unit 51 moves the mounting head 1, which is holding the component 2, to above the component mounting position on the substrate 13, based on the component information.

[0056] Next, the control unit 51 adjusts the imaging height H of the mounting head 1 based on the component information. The control unit 51 adjusts the imaging height H of the mounting head 1 to, for example, imaging height H0 by driving the head lifting mechanism 40. The imaging height H0 is the height required to move the fields of view 64a and 64b to the positions where the recognition marks 3a and 3b of the held component 2 are assumed to be located.

[0057] Next, the control unit 51 uses the imaging unit 11 to capture images of the component recognition marks 3a and 3b.

[0058] Next, the control unit 51 performs image processing on the captured image using the image processing device 42, and based on the image processing, recognizes the recognition marks 3a and 3b of the component 2 held by the mounting head 1. Based on the image recognition results, the position calculation unit 50 calculates the coordinates of the component 2.

[0059] Next, the control unit 51 corrects the misalignment of the component 2, i.e., the mounting head 1, based on the calculation results from the position calculation unit 50. More specifically, the control unit 51 moves the mounting head 1 or the stage 12 in the X, Y, and θ directions using the head moving mechanism 52.

[0060] Next, the control unit 51 uses the head lifting mechanism 40 to lower the mounting head 1, which has corrected for misalignment, and mounts the component 2 onto the substrate 13 while applying pressure to it. More specifically, at this point, heat from the heater 6 is transferred to the adhesive layer on the back of the component 2 via the holding member 5 of the mounting head 1, and the adhesive layer, softened by the heat, is pressed against the substrate 13 and bonded.

[0061] After performing the above operations, the operation when mounting components with different aspect ratios will be described next. If the aspect ratio of component 2 is different, the positions of the first recognition mark 3a and the second recognition mark 3b in the shorter direction L will also be different. For example, the case of mounting a horizontally elongated component 102 that is longer horizontally and shorter vertically than component 2 will be described.

[0062] The operation of mounting the horizontally elongated component 102 will be explained in more detail with reference to Figures 5A-8. Figure 5A is a schematic cross-sectional view of the component mounting apparatus 100 after the mounting head 1 has been raised. Figure 5B is a plan view of the component 102. Figure 6 is a schematic plan view of the mounting head 1 in Figure 5A. Figure 7(a) is an enlarged cross-sectional view of the vicinity of the first reflective optical system 61 along line AA in Figure 2, similar to Figure 3. Figure 7(b) is an enlarged cross-sectional view of the vicinity of the first reflective optical system 61 along line CC in Figure 6. Figure 8(a) is an enlarged cross-sectional view of the vicinity of the second reflective optical system 62 and the third reflective optical system 63 along line BB in Figure 2, similar to Figure 4. Figure 8(b) is an enlarged cross-sectional view of the vicinity of the second reflective optical system 62 and the third reflective optical system 63 along line DD in Figure 6.

[0063] The control unit 51 acquires component information for the horizontally elongated component 102. The component information includes the imaging height H1 of the mounting head 1 when imaging the recognition marks 103a and 103b of the component 102.

[0064] As shown in Figure 5A, the mounting head 1 holds the component 102 in a position aligned with the component 102 mounted on the transfer stage. While holding the component 102, the mounting head 1 moves to above the component mounting position on the substrate 13. As shown in Figure 5B, the component 102 has a horizontally elongated shape relative to a square, and the recognition marks 103a and 103b are offset from the center line J.

[0065] Next, the control unit 51 adjusts the imaging height H of the mounting head 1 based on the component information. The head lifting mechanism 40 raises the mounting head 1 from imaging height H0 to imaging height H1.

[0066] As shown in Figure 5A, as the mounting head 1 rises, the first imaging optical path 165 and the second imaging optical path 166 pass through the mounting head 1 at a relative height lower than the first imaging optical path 65 and the second imaging optical path 66.

[0067] As shown in Figure 7(b), when the mounting head 1 rises relative to the mounting head 1 in Figure 7(a) (arrow A3), the first imaging unit 11a descends relative to the mounting head 1. Therefore, at the first reflective surface 61a, the reflection position of the first imaging optical path 165 toward the first image sensor 15a becomes lower than the reflection position of the first imaging optical path 65 (arrow A4). Consequently, as shown in Figures 6 and 7(b), the first imaging optical path 165 extending in the vertical direction is shifted laterally (short side direction L) relative to the first imaging optical path 65 (arrow A1). Note that in Figure 7(b), in order to clearly show that the first imaging unit 11a descends relative to the mounting head 1, the height Z1 of the first imaging unit 11a is shown to be the same in Figures 7(a) and 7(b).

[0068] Furthermore, as shown in Figure 8(b), as the mounting head 1 rises relative to the mounting head 1 in Figure 8(a) (arrow A3), the second imaging unit 11b (not shown in Figure 8(b)) descends relative to the mounting head 1. As a result, at the second reflective surface 62a, the reflection position of the second imaging optical path 166 toward the third reflective optical system 63 becomes lower than the reflection position of the second imaging optical path 66 (arrow A4). Consequently, as shown in Figures 6 and 8(b), the second imaging optical path 166 extending in the vertical direction is shifted laterally (short-side direction L) relative to the second imaging optical path 66 (arrow A2). Note that in Figure 8(b), in order to clearly show that the second imaging unit 11b descends relative to the mounting head 1, the height Z2 of the second imaging unit 11b is shown as the same in Figures 8(a) and 8(b).

[0069] Comparing Figure 7(b) and Figure 8(b), the direction in which the first imaging optical path 165 shifts (arrow A1) and the direction in which the second imaging optical path 166 shifts (arrow A2) are opposite. As a result, as shown in Figure 6, the first field of view 164a and the second field of view 164b move symmetrically with respect to the midpoint P between the first reflective optical system 61 and the second reflective optical system 62 on the center line J.

[0070] As the fields of view 164a and 164b are moved in this manner, the recognition marks 103a and 103b enter their respective fields of view 164a and 164b, and the imaging units 11a and 11b can capture images of the recognition marks 103a and 103b. Based on the captured images, the position of the mounting head 1 is corrected, and the component 102 is mounted on the substrate 13.

[0071] Furthermore, we will explain the case where a vertically elongated component 202, which is shorter horizontally and longer vertically than component 2, is implemented.

[0072] The operation for mounting the elongated component 202 will be explained in more detail with reference to Figures 9A-12. Figure 9A is a schematic cross-sectional view of the component mounting apparatus 100 after the mounting head 1 has been lowered. Figure 9B is a plan view of component 202. Figure 10 is a schematic plan view of the mounting head 1 in Figure 9A. Figure 11(a) is an enlarged cross-sectional view of the vicinity of the first reflective optical system 61 along line AA in Figure 2, similar to Figure 3. Figure 11(b) is an enlarged cross-sectional view of the vicinity of the first reflective optical system 61 along line EE in Figure 10. Figure 12(a) is an enlarged cross-sectional view of the vicinity of the second reflective optical system 62 and the third reflective optical system 63 along line BB in Figure 2, similar to Figure 4. Figure 12(b) is an enlarged cross-sectional view of the vicinity of the second reflective optical system 62 and the third reflective optical system 63 along line FF in Figure 10.

[0073] The control unit 51 acquires part information of the elongated part 202. The part information includes the imaging height H2 of the mounting head 1 when imaging the recognition marks 203a and 203b of the part 202.

[0074] As shown in Figure 9A, the mounting head 1 holds the component 202 in an aligned position relative to the component 202 mounted on the transfer stage. While holding the component 202, the mounting head 1 moves to above the component mounting position on the substrate 13. As shown in Figure 9B, the component 202 has a vertically elongated shape relative to a square, and the recognition marks 203a and 203b are offset from the center line J.

[0075] Next, the control unit 51 adjusts the imaging height H of the mounting head 1 based on the component information. The head lifting mechanism 40 lowers the mounting head 1 from imaging height H0 to imaging height H2.

[0076] As shown in Figure 9A, as the mounting head 1 descends, the first imaging optical path 265 and the second imaging optical path 266 pass through the mounting head 1 at a relative height higher than the first imaging optical path 65 and the second imaging optical path 66.

[0077] As shown in Figure 11(b), the mounting head 1 descends relative to the mounting head 1 in Figure 11(a) (arrow B3), causing the first imaging unit 11a to rise relative to the mounting head 1. Therefore, at the first reflective surface 61a, the reflection position of the first imaging optical path 265 toward the first image sensor 15a becomes higher than the reflection position of the first imaging optical path 65 (arrow B4). Consequently, as shown in Figures 10 and 11(b), the first imaging optical path 265 extending in the vertical direction is shifted laterally (short side direction L) relative to the first imaging optical path 65 (arrow B1). Note that in Figure 11(b), the height Z1 of the first imaging unit 11a is shown to be the same in Figures 11(a) and 11(b) to clearly show that the first imaging unit 11a is rising relative to the mounting head 1.

[0078] Furthermore, as shown in Figure 12(b), as the mounting head 1 descends relative to the mounting head 1 in Figure 12(a) (arrow B3), the second imaging unit 11b (not shown in Figure 8(b)) rises relative to the mounting head 1. As a result, at the second reflective surface 62a, the reflection position of the second imaging optical path 266 toward the third reflective optical system 63 becomes higher than the reflection position of the second imaging optical path 66 (arrow B4). Consequently, as shown in Figures 10 and 12, the second imaging optical path 266 extending in the vertical direction is shifted laterally (short-side direction L) relative to the second imaging optical path 66 (arrow B2). Note that in Figure 12(b), in order to clearly show that the second imaging unit 11b rises relative to the mounting head 1, the height Z2 of the second imaging unit 11b is shown to be the same in Figure 12(a) and Figure 12(b).

[0079] Comparing Figure 11(b) and Figure 12(b), the direction in which the first imaging optical path 265 shifts (arrow B1) and the direction in which the second imaging optical path 266 shifts (arrow B2) are opposite. As a result, as shown in Figure 10, the first field of view 264a and the second field of view 264b move symmetrically with respect to the midpoint P.

[0080] As the fields of view 264a and 264b are moved in this manner, the recognition marks 203a and 203b enter their respective fields of view 264a and 264b, and the imaging units 11a and 11b can capture images of the recognition marks 203a and 203b. Based on the captured images, the position of the mounting head 1 is corrected, and the component 202 is mounted on the substrate 13.

[0081] Furthermore, comparing Figure 7(b) and Figure 11(b), the direction in which the first imaging optical path 165 and the first imaging optical path 265 are misaligned is opposite, and comparing Figure 8(b) and Figure 12(b), the direction in which the second imaging optical path 166 and the second imaging optical path 266 are misaligned is opposite.

[0082] In this way, by raising and lowering the mounting head 1, the positions of the fields of view 64a and 64b can be changed symmetrically in the short-side direction L using the same two imaging units 11a and 11b. Therefore, recognition marks can be captured on parts 2, 102, and 202 having different aspect ratios.

[0083] (effect) The component mounting apparatus 100 according to Embodiment 1 can achieve the following effects.

[0084] As described above, the component mounting apparatus 100 of Embodiment 1 comprises a mounting head 1, a first image sensor 15a, a second image sensor 15b, a first reflective optical system 61, a second reflective optical system 62, and a control unit 51. The mounting head 1 holds a component 2 having alignment recognition marks 3a and 3b. The first image sensor 15a is located to the side of the mounting head 1 and captures the first recognition mark 3a of the component 2 in a first field of view 64a based on a first imaging optical path 65 passing through the mounting head 1. The second image sensor 15b is located to the side of the mounting head 1 and captures the second recognition mark 3b of the component 2 in a second field of view 64b based on a second imaging optical path 66 passing through the mounting head 1. The first reflective optical system 61 reflects the first imaging optical path 65 from the first field of view 64a toward the first image sensor 15a through a first through-hole 69a provided in the mounting head 1. The second reflective optical system 62 reflects the second imaging optical path 66 from the second field of view 64b toward the second image sensor 15b through the second through-hole 69b provided in the mounting head 1. The control unit 51 controls the relative height changes between the first reflective optical system 61 and the second reflective optical system 62 and the first image sensor 15a and the second image sensor 15b, based on component information, in order to adjust the positions of the first field of view 64a and the second field of view 64b in a plan view.

[0085] This configuration allows the positions of the first field of view 64a and the second field of view 64b to be adjusted by changing their relative height. Therefore, even with a small field of view, recognition marks 3a and 3b of parts 2 with different external dimensions can be captured.

[0086] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the control unit 51 controls the relative height change by controlling the raising and lowering of the mounting head 1.

[0087] With this configuration, the height of the mounting head 1 relative to the first image sensor 15a and the second image sensor 15b can be changed by the existing head lifting mechanism 40 of the mounting head 1.

[0088] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the heights of the first image sensor 15a and the second image sensor 15b are fixed.

[0089] With this configuration, the height of the mounting head 1 relative to the first image sensor 15a and the second image sensor 15b can be changed without adding a lifting mechanism to the first image sensor 15a and the second image sensor 15b.

[0090] Furthermore, in the component mounting apparatus 100 of Embodiment 1, in a plan view, the direction in which the first reflective optical system 61 reflects the first imaging optical path 65 and the direction in which the second reflective optical system 62 reflects the second imaging optical path 66 are opposite. When the control unit 51 changes the relative height, the first field of view 64a and the second field of view 64b move in opposite directions.

[0091] With this configuration, by moving the first field of view 64a and the second field of view 64b, recognition marks 3a and 3b of parts 2 having different aspect ratios can be captured.

[0092] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the first through-hole 69a and the second through-hole 69b have a horizontally elongated shape in a plan view. When the control unit 51 changes the relative height, the first field of view 64a moves in the short-side direction L of the first through-hole 69a, and the second field of view 64b moves in the short-side direction L of the second through-hole 69b.

[0093] With this configuration, by moving the first field of view 64a and the second field of view 64b in the short-side direction L, recognition marks 3a and 3b of parts 2 having different aspect ratios can be imaged.

[0094] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the component information includes the aspect ratio of component 2.

[0095] With this configuration, by changing the relative height based on the aspect ratio of part 2, recognition marks 3a and 3b of part 2 having different aspect ratios can be captured.

[0096] In Embodiment 1, an example was described in which the mounting head 1 forms separate first through-holes 69a and second through-holes 69b, but the invention is not limited to this. The first through-holes 69a and second through-holes 69b may communicate with each other. Such a configuration makes the structure of the mounting head 1 simpler.

[0097] Although an example has been described in which the component mounting device 100 has the first reflective optical system 61 and the second reflective optical system 62 as an integrated unit, it is not limited to this. For example, the first reflective optical system 61 and the second reflective optical system 62 do not have to be formed integrally.

[0098] [Embodiment 2] A component mounting apparatus 300 according to Embodiment 2 of this disclosure will now be described. In Embodiment 2, components that are the same as or equivalent to those in Embodiment 1 will be denoted by the same reference numerals. In addition, in Embodiment 2, descriptions that overlap with those in Embodiment 1 will be omitted.

[0099] Figure 13 is a schematic plan view of the imaging unit 311 according to Embodiment 2 of the present disclosure.

[0100] Embodiment 2 differs from Embodiment 1 in that it includes an imaging unit 311 instead of the imaging unit 11. More specifically, it differs from Embodiment 1 in that the imaging unit 311 is movable in the longitudinal direction K relative to the mounting head 1. In Embodiment 2, the component mounting apparatus 300 is the same as the component mounting apparatus 100 of Embodiment 1 unless otherwise specified.

[0101] As shown in Figure 13, the imaging unit 311 further includes a movement adjustment device 70. The movement adjustment device 70 can move the imaging stage 11c, to which the imaging units 11a and 11b are fixed, along the longitudinal direction K. An example of the movement adjustment device 70 is a linear actuator such as an air cylinder, or a linear motion device composed of a motor, a linear guide, and a ball screw that can move back and forth linearly.

[0102] The control unit 51 controls the operation of the movement adjustment device 70 according to the part information of part 2, specifically the external dimensions of part 2. If the external dimensions of part 2 are different, the positions of the first recognition mark 3a and the second recognition mark 3b will also be different.

[0103] The operation of moving the imaging unit 311 using the movement adjustment device 70 will be explained in more detail with reference to Figures 14A and 14B. Figures 14A and 14B are schematic plan views of the mounting head 1 in Figure 13.

[0104] The control unit 51 acquires component information, and if the next component to be mounted, 302, is smaller than the mounted component 2, or if the next component to be mounted, 402, is larger, the control unit 51 moves the imaging unit 311 by operating the movement adjustment device 70. The size of component 302 is, for example, 1 mm x 1 mm. The size of component 402 is, for example, 12 mm x 12 mm.

[0105] As shown in Figure 14A, when the control unit 51 acquires component information of component 302 and the mounting head 1 holds component 302, the imaging unit 311, i.e., the imaging units 11a and 11b, move parallel to the longitudinal direction K with respect to the mounting head 1 toward the second through-hole side K2.

[0106] As the imaging unit 11a, i.e., the image sensor 15a, moves, the reflection position in the first reflective optical system 61 moves to the second through-hole side K2, and therefore the first field of view 64a moves to the second through-hole side K2 (arrow C1). As the imaging unit 11b, i.e., the image sensor 15b, moves, the reflection position on the fourth reflective surface 63b moves to the second through-hole side K2, and the reflection position on the third reflective surface 63a moves to the first through-hole side K1. Therefore, the second imaging optical path 66 and the second field of view 64b reflected from the second reflective optical system 62 move to the first through-hole side K1 (arrow C2). Thus, the first field of view 64a and the second field of view 64b are brought closer to each other, and the recognition mark of the component 302 can be imaged.

[0107] Furthermore, as shown in Figure 14B, when the control unit 51 acquires component information for component 402 and the mounting head 1 holds component 402, the imaging unit 311 moves parallel to the longitudinal direction K with respect to the mounting head 1 toward the first through-hole side K1.

[0108] As the imaging unit 311 moves, the reflection positions of the imaging optical paths 65 and 66 move in the opposite direction to when the component 302 is mounted. Therefore, the first field of view 64a and the second field of view 64b move away from each other (arrows D1 and D2), allowing the recognition mark of the component 402 to be imaged.

[0109] Furthermore, the imaging height H of the mounting head 1 can be changed with respect to the imaging unit 311 which has a movement adjustment device 70. With this configuration, the fields of view 64a and 64b can be moved in the short direction L in addition to the long direction K.

[0110] The control unit 51 acquires component information and compares it with the mounted component 2. If the next component to be mounted, 502, has a different external size and a different aspect ratio, the control unit 51 moves the imaging unit 311 and the mounting head 1.

[0111] Figure 14C is a schematic plan view of the mounting head 1 in Figure 13. Figure 14C shows an example where the mounting head 1 is raised and the imaging unit 311 moves to the first through-hole side K1. As shown in Figure 14C, the movement of the mounting head 1 and the imaging unit 311 causes the first field of view 64a to move by combining movement in the short-side direction L (arrow A1) and movement toward the first through-hole side K1 (arrow D1). The second field of view 64b also moves by combining movement in the short-side direction L (arrow A2) and movement toward the second through-hole side K2 (arrow D2).

[0112] By combining movement along the longitudinal direction K and movement along the short direction L, the first field of view 64a and the second field of view 64b can be moved symmetrically with respect to the midpoint P. Therefore, for example, it is possible to image the recognition mark of a part 502 that has an aspect ratio different from a square and an external size different from that of part 2.

[0113] (effect) The component mounting apparatus 300 according to Embodiment 2 can achieve the following effects.

[0114] As described above, the component mounting apparatus 300 of the second embodiment further includes a movement adjustment device 70 that moves the first image sensor 15a and the second image sensor 15b laterally relative to the mounting head 1.

[0115] With this configuration, the first field of view 64a and the second field of view 64b can be moved along the longitudinal direction K, in addition to the short direction L. Therefore, even if the size of the part 2 changes, in addition to the aspect ratio of the part 2, the first recognition mark 3a and the second recognition mark 3b of the part 2 can be captured.

[0116] Furthermore, in the component mounting apparatus 300 of Embodiment 2, the component information includes the aspect ratio and external dimensions of component 2.

[0117] With this configuration, the fields of view 64a and 64b are moved according to the aspect ratio and external dimensions of parts 302 and 402, and recognition marks 3a and 3b of parts with different aspect ratios and external dimensions can be captured.

[0118] In Embodiment 2, an example was described in which the movement adjustment device 70 moves the imaging stage 11c along the longitudinal direction K, but the invention is not limited to this. For example, in addition to or instead of moving in the longitudinal direction K, the movement adjustment device 70 may raise or lower the imaging stage 11c in the vertical direction. With such a configuration, the height of the imaging unit 311 relative to the mounting head 1 can be changed by the operation of the movement adjustment device 70 while the height of the mounting head 1 is fixed.

[0119] Although an example has been described in which the imaging unit 11a and imaging unit 11b are fixed to the imaging stage 11c and move as a single unit, the system is not limited to this. For example, the imaging unit 11a and imaging unit 11b may move independently. With such a configuration, the fields of view 64a and 64b can be positioned at any desired location in the through holes 69a and 69b, respectively.

[0120] [Embodiment 3] A component mounting apparatus 600 according to Embodiment 3 of this disclosure will now be described. In Embodiment 3, components that are the same as or equivalent to those in Embodiment 1 will be denoted by the same reference numerals. In addition, in Embodiment 3, explanations that overlap with those in Embodiment 1 will be omitted.

[0121] Figure 15 is a cross-sectional view of a component mounting apparatus 600 according to Embodiment 3 of the present disclosure.

[0122] Embodiment 3 differs from Embodiment 1 in that the component mounting device 600 is a device for mounting components 2 onto a substrate 613 having recognition marks. In Embodiment 3, the component mounting device 600 is the same as the component mounting device 100 of Embodiment 1 unless otherwise specified.

[0123] The component mounting device 600 can capture images of the recognition marks 3a and 3b on the component 2, as well as the substrate recognition marks 16a and 16b on the substrate 613, and perform alignment between the component 2 and the substrate 613.

[0124] Here, the alignment operation between component 2 and substrate 613 will be described. After the imaging unit 11 captures the recognition marks 3a and 3b of component 2, the control unit 51 changes the imaging height H3 of the mounting head 1 based on the component information. The component information includes position information of the recognition marks on substrate 613 corresponding to component 2. The imaging height H3 is the height required to move the field of view 64a and 64b to the position where the substrate recognition marks 16a and 16b on substrate 613 are assumed to be located.

[0125] Next, the control unit 51 uses the imaging unit 11 to image the substrate recognition marks 16a and 16b on the substrate 513. Because the holding member 5 is transparent, the imaging unit 11 can image the substrate recognition marks 16a and 16b through the holding member 5.

[0126] Next, the control unit 51 performs image processing on the image processing device 42 based on the captured image to recognize the recognition marks 3a and 3b on the component 2 held by the mounting head 1, and the substrate recognition marks 16a and 16b on the substrate 613. Based on the image recognition results, the position calculation unit 50 calculates the coordinates of the component 2 and the substrate 513.

[0127] Next, the control unit 51 corrects the misalignment of the component 2, i.e., the mounting head 1, relative to the substrate 613 based on the calculation results from the position calculation unit 50.

[0128] Next, the control unit 51 mounts the component 2 onto the circuit board 613. With this configuration, the component 2 can be mounted at the appropriate position on the circuit board 613 as specified by the circuit board recognition marks 16a and 16b.

[0129] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims. [Industrial applicability]

[0130] The component mounting apparatus of this disclosure has the effect of mounting components to any specified position on a substrate, and is particularly useful in component mounting apparatus used when mounting components such as high-speed, high-capacity memory, application processors, and CPUs. [Explanation of Symbols]

[0131] 1. Mounting head 1a Head body 3a First Recognition Mark 3b Second Recognition Mark 5. Retaining member 6 Heaters 11 Imaging Unit 11a First imaging section 11b Second imaging section 15a First image sensor 15b Second imaging element 13 circuit boards 40 Head lifting mechanism 42 Image Processing Devices 50 Position calculation section 51 Control Unit 52 Head movement mechanism 61 1st reflection optical system 61a 1st reflective surface 62 Second reflective optical system 62a 2nd reflective surface 63 Third reflective optical system 63a Third reflective surface 63b 4th reflective surface 65 First imaging optical path 66 Second imaging optical path 67 Heater Block 68 Cooling Block 69a 1st through hole 69b 2nd through hole 71 Prism Blocks

Claims

1. A mounting head that holds a component having a recognition mark for alignment, A first image sensor is provided on the side of the mounting head and captures a first recognition mark of the component in a first field of view based on a first imaging optical path passing through the mounting head, A second image sensor is provided to the side of the mounting head and captures a second recognition mark of the component in a second field of view based on a second imaging optical path that passes through the mounting head. A first reflective optical system that reflects the first imaging optical path from the first field of view toward the first image sensor through a first through-hole provided in the mounting head, A second reflective optical system that reflects the second imaging optical path from the second field of view toward the second image sensor through a second through-hole provided in the mounting head, A component mounting apparatus comprising, for adjusting the relative positions of the first and second fields of view, a first reflective optical system and a second reflective optical system, and a control unit that controls the change in the relative height between the first image sensor and the second image sensor based on component information.

2. The component mounting apparatus according to claim 1, wherein the control unit controls the raising and lowering of the mounting head to control the change in the relative height.

3. The component mounting apparatus according to claim 1 or 2, wherein the heights of the first image sensor and the second image sensor are fixed.

4. In a plan view, the direction in which the first reflective optical system reflects the first imaging light path and the direction in which the second reflective optical system reflects the second imaging light path are opposite. The component mounting apparatus according to any one of claims 1 to 3, wherein when the control unit changes the relative height, the first field of view and the second field of view move in opposite directions.

5. In a plan view, the first through-hole and the second through-hole have a horizontally elongated shape. The component mounting apparatus according to any one of claims 1 to 4, wherein when the control unit changes the relative height, the first field of view moves in the short direction of the first through hole, and the second field of view moves in the short direction of the second through hole.

6. The component mounting apparatus according to any one of claims 1 to 5, wherein the component information includes the aspect ratio of the component.

7. The component mounting apparatus according to any one of claims 1 to 6, further comprising a movement adjustment device for moving the first image sensor and the second image sensor laterally relative to the mounting head.

8. The component mounting apparatus according to claim 7, wherein the component information includes the aspect ratio and external dimensions of the component.

Images