Component mounting system

Abstract

A component mounting system is provided with: a mounting machine for performing a mounting process of mounting a component on a substrate by operating a mounting process unit; an inspection machine for performing an inspection process using an image of the post-mounting-process substrate, and outputting abnormality information able to identify a defective substrate in which an abnormality has been detected in the inspection process; a camera for imaging, as a video, the operation of the unit in the mounting machine during the mounting process and storing image data in a memory; and a data output unit for cutting out, on the basis of abnormality information, image data for when a mounting process was carried out on a defective substrate, and outputting the image data to the exterior.

Description

Technical Field

[0001] This specification discloses a component mounting system.

Background Art

[0002] Conventionally, as this type of component mounting system, there has been proposed one including a mounting machine that performs a mounting process of picking up components such as electronic components and mounting them on an object such as a printed circuit board, and an inspection machine that inspects the mounting state by the mounting machine (see, for example, Patent Document 1). In this system, when an abnormality is detected in the inspection by the inspection machine, it is stored as performance information or displayed on the operator's terminal.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, when there is an abnormality in the mounting state, it is required to identify the cause of the abnormality and appropriately respond. However, when the inspection machine detects an abnormality even though the mounting machine performs the mounting process normally, there is a possibility that the mounting machine has overlooked the abnormality, so it is difficult for the operator to identify the cause of the abnormality. Also, it is conceivable to install a monitoring camera on the mounting machine and examine the cause of the abnormality from the images of the monitoring camera, but the operator has to check and analyze all the images captured during the mounting process, which requires a great deal of man-hours.

[0005] The main object of the present disclosure is to enable easy investigation of the cause of an abnormality from image data during the mounting process.

Means for Solving the Problems

[0006] This disclosure employs the following means to achieve the primary objectives described above.

[0007] The component mounting system disclosed herein is A mounting machine that performs component mounting processing on a circuit board by operating a unit for mounting processing, An inspection machine that performs an inspection process using an image of the substrate after the assembly process and outputs abnormality information that can identify a defective substrate in which an abnormality was detected during the inspection process, A camera that records video of the operation of the unit inside the mounting machine during the aforementioned mounting process and stores the image data in memory, A data output unit that extracts image data from the image data in the memory during the mounting process of the defective board and outputs it externally based on the aforementioned abnormal information, The gist of it is that it is equipped with the following features.

[0008] The component mounting system disclosed herein is equipped with a camera that captures video of the operation of units within the mounting machine during the mounting process and stores the image data in memory. When an abnormality is detected during the inspection process, the system extracts image data from the memory during the mounting process of the defective board based on the abnormality information (inspection abnormality information) output from the inspection machine and outputs it externally. This eliminates the need for operators to check all the image data in memory and search for image data from the mounting process of the defective board. Consequently, it is possible to easily investigate the cause of the abnormality from the image data during the mounting process of the defective board. [Brief explanation of the drawing]

[0009] [Figure 1] An explanatory diagram showing an example of a component mounting system 10. [Figure 2] A diagram showing an overview of the configuration of the mounting machine 20. [Figure 3] An explanatory diagram showing the electrical connection relationships between the mounting machine 20, the mounting inspection machine 30, and the control device 40. [Figure 4] An explanatory diagram showing the memory capacity 27m of the in-flight camera 27 equipped in each implementation device 20. [Figure 5] A flowchart illustrating an example of a circuit board inspection process. [Figure 6] A flowchart illustrating an example of image data output processing. [Figure 7] An explanatory diagram showing how image data is output from each of the 27 in-flight cameras. [Figure 8] An explanatory diagram showing how image data is output from each of the 27 in-flight cameras. [Modes for carrying out the invention]

[0010] Next, embodiments of the present disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram showing the configuration of the component mounting system 10, Figure 2 is a schematic diagram showing the configuration of the mounting machine 20, and Figure 3 is an explanatory diagram showing the electrical connection relationship between the mounting machine 20, the mounting inspection machine 30, and the control device 40. In Figures 1 and 2, the left-right direction is the X direction, the front-back direction is the Y direction, and the up-down direction is the Z direction.

[0011] As shown in Figure 1, the component mounting system 10 comprises a printer 12, a print inspection machine 14, multiple mounting machines 20, a mounting inspection machine 30, and a management device 40, all connected to a LAN 18 network. The printer 12 prints onto the substrate S (see Figure 2) by pushing solder into pattern holes formed in a screen mask. The print inspection machine 14 inspects the condition of the solder printed by the printer 12. The mounting machines 20 are arranged along the transport direction (X direction) of the substrate S and sequentially receive the substrate S and perform component mounting processing on the substrate S. The mounting inspection machine 30 inspects the mounting status of the components mounted on the substrate S by each mounting machine 20. The management device 40 manages the entire component mounting system 10. The printer 12, the print inspection machine 14, the multiple mounting machines 20, and the mounting inspection machine 30 are arranged in this order along the transport direction of the substrate S to form a production line. In addition to these, the production line is equipped with a reflow machine for reflow processing of circuit boards S on which components are mounted. For example, the reflow machine is located downstream of the mounting inspection machine 30. A reflow inspection machine may also be located downstream of the reflow machine.

[0012] As shown in Figures 2 and 3, the mounting machine 20 comprises a substrate transport unit 21, a component supply unit 22, and a mounting unit 23. The substrate transport unit 21 has two pairs of conveyor belts spaced apart at the front and back of Figure 2 and stretched in the left-right direction, and each conveyor belt transports the substrate S from left to right in the figure. The component supply unit 22 is a tape feeder that supplies components, for example, by feeding out a tape on which components are contained at a predetermined pitch, and multiple units are set in the mounting machine 20 to enable the supply of multiple types of components. The mounting unit 23 comprises a head 23a on which a nozzle for picking up components is arranged to move up and down, and a head moving unit 23b that moves the head 23a in the XY direction.

[0013] In addition, the mounting machine 20 is equipped with a mark camera 25, a parts camera 26, an in-machine camera 27, a storage device 28, and a mounting control device 29 that controls the entire mounting machine 20. The mark camera 25 is attached to the head 23a and moves in the XY direction together with the head 23a by the head moving unit 23b. The mark camera 25 photographs targets such as marks on the substrate S, parts supplied by the parts supply unit 22, and parts mounted on the substrate S from above to generate images (still images) and outputs the generated images to the mounting control device 29. The parts camera 26 is installed between the parts supply unit 22 and the substrate transport unit 21 and photographs parts held (suctioned) by the nozzle from below to generate images (still images) and outputs the generated images to the mounting control device 29. The storage device 28 is a device such as an HDD that stores information such as processing programs, information on the mounting position of parts, and mounting history.

[0014] The in-machine camera 27 is installed in each mounting machine 20 to capture an overhead view of the inside of each mounting machine 20, and includes a built-in ring buffer memory 27m (hereinafter referred to as memory 27m) for storing the captured image data, and a control unit 27c for controlling the shooting process and the storage process of the image data. This in-machine camera 27 captures the operating status of each unit, such as the substrate transport unit 21, the component supply unit 22, and the mounting unit 23, in video, and stores the image data in memory 27m. In this embodiment, there are two in-machine cameras 27: an in-machine camera 27f located on the front side of the mounting machine 20, and an in-machine camera 27r located on the rear side of the mounting machine 20. The in-machine cameras 27f and 27r capture, for example, the transport operation of the substrate S by the substrate transport unit 21, the supply operation of components by the component supply unit 22, the picking operation of components by the mounting unit 23, the movement operation of the head 23a, and the mounting operation of components onto the substrate S. Memory 27m is configured, for example, as a ring buffer having multiple memory areas, and continuously stores frame images constituting a video in these multiple memory areas at a predetermined frame rate. After storing frame images in all memory areas, memory 27m sequentially stores frame images, overwriting the oldest frame image with a new frame image.

[0015] Figure 4 is an explanatory diagram showing the capacity of the memory 27m of the in-machine camera 27 equipped in each mounting machine 20. Here, for example, the processing times for mounting machines 20(1),(2),(3),(4) arranged in order along the transport direction to mount the necessary components to the substrate S are T1, T2, T3, and T4, respectively, and the processing time for the mounting inspection machine 30 to inspect the substrate S is T5. In this embodiment, the purpose is to allow the operator to check the image data of the substrate S during the mounting process if an inspection abnormality is found by outputting it externally after the inspection process of the substrate S. For this reason, it is necessary that, at the time the inspection process of the substrate S is completed, the image data of the substrate S during the mounting process in the memory 27m has not been overwritten by other image data. For example, if the memory 27m of the in-flight camera 27 stores (holds) the image in the ring buffer for a period of time, then the storage time Tr1 of the first mounting machine 20(1) should be at least the sum of the processing times T1 to T5 plus a small margin α (T1+T2+T3+T4+T5+α). The margin α is determined by considering the time required for the mounting inspection machine 30 to output a notification of an inspection abnormality to each mounting machine 20, and the time required for the mounting control device 29 and the control unit 27c of the in-flight camera 27 to output the image data externally. Similarly, the storage time Tr2 of the second mounting machine 20(2) should be at least the time (T2+T3+T4+T5+α). The storage time Tr3 of the third mounting machine 20(3) should be at least the time (T3+T4+T5+α). The memory time Tr4 of the fourth implementation unit 20(4) only needs to be (T4 + T5 + α) or longer. Thus, the memory times Tr1 to Tr4 are longer for implementation units 20 that are processed earlier in the sequence. In addition, the memory capacity Mc of the memory 27m of each in-flight camera 27 in each implementation unit 20(1) to (4) is determined to ensure that memory times Tr1 to Tr4 are secured. In this embodiment, the memory 27m of each in-flight camera 27 has a memory capacity Mc corresponding to the memory times Tr1 to Tr4. Therefore, the memory capacity Mc of the memory 27m of the in-flight camera 27 is in descending order from largest to smallest for implementation units 20(1), (2), (3), and (4). In other words, the memory capacity Mc of the memory 27m of the in-flight camera 27 tends to be smaller for implementation units 20 that are processed later in the sequence.

[0016] The mounting control device 29 is composed of well-known components such as a CPU, ROM, and RAM. The mounting control device 29 outputs drive signals to the substrate transfer unit 21, component supply unit 22, mounting unit 23, etc. Images from the mark camera 25 and parts camera 26 are input to the mounting control device 29. The mounting control device 29 processes the image of the substrate S taken by the mark camera 25, recognizes various marks attached to the substrate S, and thereby recognizes identification information (substrate ID) such as the serial number of the substrate S. Also, the mounting control device 29 determines whether a component is adsorbed to the nozzle or determines the adsorption posture of the component based on the image taken by the parts camera 26. In addition, an image from the in-machine camera 27 is input to the mounting control device 29 as necessary. The mounting control device 29 can store the image from the in-machine camera 27 in the storage device 28 or output it to the management device

[0017]

[0017] As shown in Fig. 3, the mounting inspection machine 30 includes a substrate transfer unit 32, an inspection camera 34, a camera moving device 36, a storage device 38, and an inspection control device 39. The substrate transfer unit 32 has the same configuration as the substrate transfer unit 21 of the mounting machine 20. The inspection camera 34 takes an inspection image from above the substrate S on which components are mounted. The camera moving device 36 moves the inspection camera 34 in the XY directions and has the same configuration as the head moving unit 23b of the mounting machine 20. The storage device 38 is a device such as an HDD that stores information such as processing programs and inspection results.

[0018] The inspection control device 39 is composed of well-known components such as a CPU, ROM, and RAM and controls the entire mounting inspection machine 30. The inspection control device 39 outputs drive signals to the substrate transfer unit 32 and the camera moving device 36 and a shooting signal to the inspection camera 34. Also, the inspection control device 39 receives the inspection image from the inspection camera 34, processes the image, and inspects the mounting state of the components. Further, the inspection control device 39 is communicably connected to the management control device 42 of the mounting control device 29 and the management device 40 via the LAN 18 and can output information regarding the inspection situation and inspection results, inspection images, etc.

[0019] As shown in FIG. 3, the management device 40 includes a management control device 42, a storage device 44, an input device 46, and a display 48. The management control device 42 is composed of well-known components such as a CPU, ROM, and RAM. The storage device 44 is a device such as an HDD that stores various information such as processing programs. The input device 46 includes a keyboard and a mouse through which an operator inputs various commands. The display 48 is a liquid crystal display device that displays various information. Further, a production program is stored in the storage device 44. In the production program, the component type, mounting order, mounting position of each component to be mounted on the substrate S, information on the component supply unit 22 that supplies each component, information on the nozzle that adsorbs each component, information on which mounting machine 20 each component is to be mounted on, information on the number of substrates S to be produced, and the like are defined. The management control device 42 is communicably connected to the mounting control device 29 via the LAN 18, receives information regarding the mounting status from the mounting control device 29, and transmits the production program to the mounting control device 29. Also, the management control device 42 is communicably connected to the inspection control device 39 via the LAN 18, receives information output from the inspection control device 39, and transmits information on the substrate S to be inspected to the inspection control device 39. In addition, the management control device 42 is communicably connected to each control device (not shown) of the printing machine 12 and the printing inspection machine 14 via the LAN 18, receives information regarding the working status from each device, and transmits a work instruction.

[0020] The following describes the operation of the component mounting system 10 configured in this way, specifically the process of mounting components onto the substrate S and the inspection process of the substrate S with the components mounted. In the mounting process, the mounting control device 29 first transports the substrate S to a predetermined position using the substrate transport unit 21 and holds it there. Next, the mounting control device 29 has the component supply unit 22 supply components to the component supply position, and the mounting unit 23 moves the head 23a above the component supply position to pick up the components with the nozzle. Subsequently, the mounting control device 29 moves the head 23a above the part camera 26 using the mounting unit 23, and has the part camera 26 photograph the components that have been picked up with the nozzle. The mounting control device 29 processes the captured image to correct the target mounting position of the component so that any misalignment of the component is eliminated, and then the mounting unit 23 moves the head 23a above the substrate S to mount the component to the target mounting position. When the mounting of the necessary components is complete, the mounting control device 29 releases the substrate S using the substrate transport unit 21 and transports it out of the machine. The mounting control device 29 stores information such as the identification information of the substrate S, the date and time of delivery and removal of the substrate S, the types and number of mounted components, and the mounting positions of the components in the storage device 28 as mounting history information. The mounting control device 29 may also receive mounting history information from the mounting control device 29 of the upstream mounting machine 20 and store information on the components already mounted on the delivered substrate S.

[0021] Furthermore, the in-machine camera 27 records video of the operation status of each unit during the mounting process and stores the image data in memory 27m. For example, the in-machine camera 27 starts recording when the first circuit board S, which is instructed to be produced by the production program, is brought in, and stops recording when the last circuit board S is unloaded. The control unit 27c adds date and time information to the recorded image data and stores it in memory 27m. Once the circuit board S with the components mounted in this way is brought into the mounting inspection machine 30, the mounting inspection machine 30 performs the inspection process. Figure 5 is a flowchart showing an example of the circuit board inspection process.

[0022] In the board inspection process, the inspection control device 39 acquires identification information and an inspection image of the board S (S100). The inspection control device 39 acquires an image of the board S captured by the inspection camera 34 as the inspection image. Alternatively, the inspection control device 39 may acquire the identification information of the board S by communication from an adjacent mounting control device 29 or management device 40 upstream, or it may acquire the identification information recognized from the image of the board S captured by the inspection camera 34. Next, the inspection control device 39 recognizes components from the inspection image and inspects the mounting state (S110), and registers the identification information of the board S and the inspection result in the storage device 38 (S120). In S110, the inspection control device 39 measures, for example, the deviation of the mounting position and mounting angle of components, and checks whether the measured deviation amount (position deviation and angle deviation) is within the reference value, and also checks for the presence of missing components or missing components. In S120, the inspection control device 39 registers the measurement result and a statement indicating that the inspection was normal if there is no inspection abnormality, and registers the measurement result, a statement indicating that there is an inspection abnormality, and an error code indicating the type of abnormality if there is an inspection abnormality. The inspection control device 39 may also register an inspection image if there is an inspection abnormality, or it may register an inspection image regardless of whether there is an inspection abnormality or not. Alternatively, the inspection control device 39 may only register whether or not there is an inspection abnormality as an inspection result.

[0023] Next, the inspection control device 39 determines whether or not there is an inspection abnormality in the board S that was inspected (S130). If there is no inspection abnormality, the board inspection process is terminated. On the other hand, if the inspection control device 39 determines that there is an inspection abnormality in the board S that was inspected, that is, that the board S that was inspected is a defective board with a faulty component among the mounted components, it outputs inspection abnormality information that includes information that can identify the defective board and the faulty component (S140), and terminates the board inspection process. The inspection abnormality information includes identification information of the defective board, the type and mounting location of the faulty component, and the error code. The inspection abnormality information is output to each mounting machine 20 and the management device 40 via the LAN 18. The inspection abnormality information may also be output from the management device 40 to each mounting machine 20.

[0024] Next, we will describe the process of outputting image data from the memory 27m of the in-flight camera 27 provided in each implementation device 20. Figure 6 is a flowchart showing an example of the image data output process. The image data output process is performed, for example, by the implementation control device 29.

[0025] In the image data output processing, the mounting control device 29 determines whether or not it has received inspection abnormality information output from the mounting inspection machine 30 (S200). If it determines that it has not received the information, it terminates the image data output processing. On the other hand, if the mounting control device 29 determines that it has received inspection abnormality information, it obtains the mounting history information of the board S stored in the storage device 28 based on the identification information of the defective board included in the inspection abnormality information (S210). Based on this mounting history information, it identifies the mounting date and time information, such as the date and time the board S was brought in and the date and time it was brought out, and the information of the components mounted by the device (such as component type and mounting position) (S220). Next, the mounting control device 29 determines whether or not it mounted the defective component by the device (S230) and whether or not it performed the mounting process of other components on the defective board after another device mounted the defective component (S240), based on the component type and mounting position of the defective component included in the inspection abnormality information and the component information identified in S220. If the mounting control device 29 has stored information about the components already mounted on the incoming circuit board S in its storage device 28, it makes the determination in S240 based on whether or not there were any defective components among the components already mounted when the circuit board S (defective circuit board) was brought into the device. Alternatively, if the production program includes information on which mounting machine 20 each component should be mounted on, the mounting control device 29 may make the determination in S240 based on that information.

[0026] When the mounting control device 29 determines that a defective component has been mounted on its own machine, or that it has performed the mounting process on its own machine after a defective component has been mounted on another machine, it outputs an instruction to the machine's in-machine camera 27 to extract image data corresponding to the mounting date and time identified in S210 from the memory 27m (S250). The control unit 27c, upon receiving the instruction, extracts image data corresponding to the specified date and time from the memory 27m based on the date and time information attached to the image data. Once the image data has been extracted from the memory 27m, the mounting control device 29 outputs the image data to the external device, associating it with inspection anomaly information and mounting history information acquired in S210 (S260), and terminates the image data output process. The mounting control device 29 outputs the extracted image data, inspection anomaly information, and mounting history information to, for example, the management device 40, which stores them in the storage device 44. As a result, the operator can view a video of the mounting process of the defective board on the display 48 and investigate whether there are any anomalies during the mounting process and the causes of those anomalies.

[0027] Furthermore, if the mounting control device 29 determines in S230 and S240 that the defective component has not been mounted by the device itself and has not performed mounting processing on the device itself after the defective component has been mounted by another device, that is, that mounting processing on the defective board was performed before the defective component was mounted, it skips S250 and S260 and terminates the image data output processing. In this embodiment, image data is output not only when the defective component is mounted by the device itself, but also when the mounting processing is performed on the device itself after the defective component has been mounted by another device. This is because when the device performs mounting processing, the component to be mounted may come into contact with a component already mounted by another device, or a large impact may be applied when transporting, holding, or releasing the board S, causing misalignment or detachment of components already mounted by another device, resulting in defects. This is to allow for investigation of the cause of such defects.

[0028] Figures 7 and 8 are explanatory diagrams showing how image data is output from each in-machine camera 27. Figure 7 illustrates the case where the mounting process of a defective component onto a defective substrate is performed by the first mounting machine 20(1). In this case, upon receiving inspection anomaly information, mounting machine 20(1) determines that it has mounted the defective component, while mounting machines 20(2) to (4) determine that they performed the mounting process after the defective component had been mounted by another machine. Therefore, mounting machines 20(1) to (4) each extract image data from memory 27m during the mounting process of the defective substrate, associate the image data with the inspection anomaly information and mounting history information, and output it externally to the management device 40.

[0029] On the other hand, Figure 8 illustrates a case where the mounting process of defective components onto a defective substrate is performed by the third mounting machine 20(3). In this case, upon receiving inspection anomaly information, mounting machines 20(1) and (2) determine that the mounting process on the defective substrate was performed before the mounting of the defective components, mounting machine 20(3) determines that it mounted the defective components, and mounting machine 20(4) determines that the mounting process was performed after the defective components were mounted by another machine. For this reason, mounting machines 20(3) and (4) extract image data from memory 27m during the mounting process of the defective substrate, associate the image data with the inspection anomaly information and mounting history information, and output it externally to the management device 40. However, mounting machines 20(1) and (2) do not extract or output image data externally, thus preventing unnecessary image data from being output externally for investigating the cause of the defect.

[0030] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. In this embodiment, the substrate transport unit 21, the component supply unit 22, and the mounting unit 23 correspond to mounting processing units, the mounting machine 20 corresponds to a mounting machine, the mounting inspection machine 30 corresponds to an inspection machine, the in-machine camera 27 corresponds to a camera, the memory 27m corresponds to a memory, and the mounting control device 29 and the control unit 27c correspond to a data output unit.

[0031] In the component mounting system 10 of this embodiment described above, the in-machine camera 27 captures video footage of the operation of the board transport unit 21, component supply unit 22, and mounting unit 23 inside the mounting machine 20 during the mounting process, and stores the image data in memory 27m. Then, based on the inspection anomaly information output from the mounting inspection machine 30, the in-machine camera 27 extracts image data from the image data in memory 27m that shows the mounting process of a defective board and outputs it externally. This eliminates the need for operators to search for image data from memory that shows the mounting process of a defective board. Furthermore, operators can investigate the cause while checking the operation status of each unit in video. Therefore, operators can easily investigate the cause of an anomaly.

[0032] Furthermore, the inspection anomaly information includes error codes and information about defective parts detected during the inspection process, and the inspection anomaly information is output in association with image data, making it easier for operators to investigate the cause of the anomaly by referring to the inspection anomaly information. In addition, the mounting machine 20 does not output image data from the memory 27m before the defective parts are mounted, thus preventing operators from investigating unnecessary image data.

[0033] Furthermore, the memory 27m, which acts as a ring buffer, is configured such that its storage time is longer than the processing time required from the start of the initial mounting process of substrate S to the end of the inspection process. This allows necessary image data to be appropriately output externally before the image data stored in memory 27m is overwritten. Additionally, the memory capacity Mc of memory 27m decreases for mounting machines 20 that are processed later in the order, so the memory capacity Mc can be optimized to prevent the accumulation of unnecessary image data and reduce costs.

[0034] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0035] For example, in the embodiment described above, the memory capacity Mc of the in-cabin camera 27's memory 27m is made smaller for later-processing machines 20, but the invention is not limited to this, and the memory capacity Mc of each machine 20 may be the same. Also, although the memory 27m is a ring buffer, the invention is not limited to this, and a buffer other than a ring buffer may be used. Furthermore, although the in-cabin camera 27 stores image data in its built-in memory 27m, the invention is not limited to this, and image data may be stored in memory other than memory 27m. In any case, the image data can be extracted from the memory and output externally based on inspection abnormality information.

[0036] In the above-described embodiment, two in-flight cameras 27f and 27r were exemplified as the in-flight camera 27, but the invention is not limited to this, and each implementation device 20 may be equipped with three or more in-flight cameras 27, or with only one. Furthermore, although the image data extracted from the memory 27m of the in-flight camera 27 was output externally to the management device 40 (storage device 44), the invention is not limited to this, and the image data may also be output externally to a cloud server or the like via a network.

[0037] In the embodiment described above, the image data extracted from memory 27m was output externally in association with inspection anomaly information and implementation history information, but it is not limited to this, and may be output externally in association with other information, or the image data may be output externally in association only with inspection anomaly information. Alternatively, the image data may be output externally in association with the inspection image used by the implementation inspection machine 30, or in association with the inspection anomaly method and the inspection image. Or, the extracted image data may be output externally without being associated with other information. Furthermore, the device that receives the externally outputted image data (e.g., management device 40) may save it in association with other information or inspection images.

[0038] In the embodiment described above, image data was output externally from the memory 27m to the mounting machine 20 on which the defective parts were mounted and to the mounting machines 20 downstream of it. However, the embodiment is not limited to this, and image data may be output externally from the memory 27m to all mounting machines 20.

[0039] In the embodiment described above, the component mounting system 10 is equipped with multiple mounting machines 20 and a mounting inspection machine 30, but it is not limited to this, and may be equipped with one mounting machine 20 and a mounting inspection machine 30. Also, although a dedicated mounting inspection machine 30 is given as an example of an inspection machine, it is not limited to this, and the mounting machine 20 may also serve as an inspection machine. For example, the downstream mounting machine 20 may perform inspection processing using an image of the substrate S captured by the mark camera 25 when receiving the substrate S, and then perform mounting processing, and output abnormality information if an abnormality is detected during the inspection process. The upstream mounting machine 20 may then extract image data based on that abnormality information and output it externally.

[0040] Herein, the component mounting system of the present disclosure may be configured as follows. For example, in the component mounting system of the present disclosure, the abnormality information may include information regarding the content of the abnormality detected in the inspection process, and the data output unit may output the extracted image data in association with at least one of the image of the substrate used in the inspection process and the abnormality information. In this way, the cause investigation can be performed using image data from the mounting process of the defective substrate while referring to at least one of the image of the substrate used in the inspection process and the information regarding the content of the abnormality, making the cause investigation easier.

[0041] In the component mounting system of this disclosure, a plurality of mounting machines are provided to sequentially receive the substrates and perform the mounting process, the abnormality information includes information that can identify the defective component in which an abnormality was detected among the defective substrates, and the data output unit may extract and output the image data from the memory targeting the mounting machine that performed the mounting process on the defective substrate and the mounting machine that performed the mounting process on the defective substrate after the mounting machine. This makes it possible to investigate the cause of the abnormality when the defective component was mounted and the cause of the abnormality when the defective substrate was mounted after the defective component was mounted. Furthermore, since image data is not output from the memory of the camera that takes pictures inside mounting machines other than the target, it is possible to prevent workers from investigating unnecessary image data.

[0042] In the component mounting system of this disclosure, the system may be provided with a plurality of mounting machines that sequentially receive the substrates and perform the mounting process, and the memory may be a ring buffer, configured such that the storage time of the image data is longer than the processing time required for one substrate from the start of the mounting process in the mounting machine that is the first in the plurality of mounting machines to perform the mounting process until the inspection process is completed. In this way, unnecessary image data is not accumulated in the memory, and image data necessary for investigating the cause of an anomaly can be output externally before the image data stored in the memory is overwritten.

[0043] In the component mounting system of this disclosure, the system may include a plurality of mounting machines that sequentially receive the substrate and perform the mounting process, and the memory may be a ring buffer, with the memory capacity tending to decrease for cameras that photograph the inside of mounting machines that are later in the processing order of the mounting process among the plurality of mounting machines. In this way, it is possible to reduce costs by optimizing the memory capacity while suppressing the accumulation of unnecessary image data in the memory. [Industrial applicability]

[0044] This disclosure can be used in technical fields such as component mounting processes. [Explanation of symbols]

[0045] 10 Component mounting system, 12 Printer, 14 Print inspection machine, 18 LAN, 20, 20(1)~(4) Mounting machine, 21, 32 Board transport unit, 22 Component supply unit, 23 Mounting unit, 23a Head, 23b Head movement unit, 25 Mark camera, 26 Parts camera, 27, 27f, 27r In-machine camera, 27c Control unit, 27m Memory (ring buffer memory), 28 Storage device, 29 Mounting control device, 30 Mount inspection machine, 32 Board transport unit, 34 Inspection camera, 36 Camera movement device, 39 Inspection control device, 40 Management device, 42 Management control device, 44 Storage device, 46 Input device, 48 Display, S Board.

Claims

1. Multiple mounting machines that sequentially receive circuit boards and perform component mounting processing on the circuit boards by operating mounting processing units, An inspection machine that performs an inspection process using an image of the substrate after the assembly process and outputs abnormality information that can identify a defective substrate in which an abnormality was detected during the inspection process, A camera that, during the aforementioned mounting process, captures video footage of the operation of the unit inside the mounting machine, adds date and time information to the image data, and stores it in memory; Based on the aforementioned abnormal information, a data output unit extracts image data from the memory during the mounting process of the defective substrate and outputs it externally. Equipped with, The aforementioned abnormal information includes information that can identify the defective component in which the abnormality was detected among the defective substrates, The identifiable information includes identification information of the defective substrate detected in the inspection process, The identification information is information that can identify the mounting history information of the defective substrate, The data output unit, based on the mounting history information of the defective board identified from the identification information, targets, among the multiple mounting machines, those that performed the mounting process on the defective board before the mounting machine that performed the mounting process on the defective board, and those that performed the mounting process on the defective board after the mounting machine that performed the mounting process on the defective board. The unit extracts from the memory the image data corresponding to the date and time information of the date and time information for the mounting date and time identified based on the mounting history information of the defective board of the targeted mounting machine and outputs it. Component mounting system.

2. A component mounting system according to claim 1, The aforementioned anomaly information includes information regarding the nature of the anomaly detected in the inspection process, The data output unit outputs an image of the substrate used in the inspection process and the abnormal information, associated with the image data extracted from the memory. Component mounting system.

3. A component mounting system according to claim 1 or 2, The memory is a ring buffer and is configured such that, for one substrate, the storage time of the image data is longer than the processing time required from the start of the mounting process in the mounting machine that is the first in the processing order of the mounting process among the multiple mounting machines until the end of the inspection process. Component mounting system.

4. A component mounting system according to any one of claims 1 to 3, The memory is a ring buffer, and is configured such that the memory capacity tends to decrease for cameras that photograph the inside of a mounting machine that is processed later in the mounting process among the multiple mounting machines. Component mounting system.

Images