PCB work equipment

Abstract

To suppress the occurrence of tact loss resulting from an imaging operation of a board recognition mark as much as possible.SOLUTION: A component mounting device 1 includes a main control portion 74 that controls the movement of a board recognition camera 5 and a head unit 4. The main control portion 74 performs heat correction control that calibrates positional deviations due to thermal deformation of XY movement axes, movement correction control that sequentially images an FID mark FM attached to the board and calculates the movement correction amount of a head 4H, and estimation control that estimates the next work area on the board in which the head 4H can perform work on the board between the current heat correction control and the next heat correction control before the movement correction control. In the movement correction control, while the board recognition camera 5 is caused to image all of the FID marks FM included in the next work area, and imaging of at least some of the FID marks FM included in an unworked area other than the next work area is omitted.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a substrate working apparatus that performs predetermined operations such as component mounting on a substrate.

Background Art

[0002] A component mounting apparatus for mounting components on a substrate includes a head unit having a head for mounting components and a head moving mechanism for moving the head unit along XY movement axes. The mounting position of a component on the substrate is specified in an axis coordinate system calibrated by imaging a fiducial mark for substrate recognition (hereinafter referred to as a FID mark) attached to the substrate carried into the mounting stage of the apparatus with a camera mounted on the head unit and recognizing the relative positional relationship between the substrate and the head.

[0003] A plurality of FID marks are attached to the substrate. For example, in a multi-sided board, a plurality of FID marks are attached in units of sub-boards that are planned to be separated or in units of mounting areas where components are mounted in one mounting operation of the head unit. Therefore, when viewing a multi-sided board as a single board at the time of component mounting, a considerable number of FID marks exist. Since movement of the head unit is required for imaging the FID marks, it affects the tact time. Patent Document 1 discloses a technique for reducing the tact time by imaging all the FID marks attached to the substrate collectively prior to component mounting.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Incidentally, the XY movement axes of the head unit expand and contract due to the heat generated by the operation of the device. For this reason, it is necessary to periodically perform thermal correction of the axial coordinate system to correspond to the thermal displacement of the XY movement axes. When this thermal correction is performed, the axial coordinate system that was previously used as the reference changes, so the FID marks must be imaged and recognized again. For this reason, even if the FID marks have been imaged all at once beforehand, when the thermal correction intervenes, the FID marks attached to the unmounted areas of the components must be imaged again, resulting in cycle loss.

[0006] The object of the present invention is to provide a substrate handling apparatus that can suppress the occurrence of cycle loss originating from the imaging operation of substrate recognition marks as much as possible. [Means for solving the problem]

[0007] A substrate work apparatus according to one aspect of the present invention comprises a head unit equipped with a work head that performs predetermined work on a substrate having substrate recognition marks, a head movement mechanism that moves the head unit horizontally along a movement axis set on a base, a camera mounted on the head unit that can capture images of the substrate recognition marks, and a control unit that controls the imaging operation of the camera and controls the movement of the head unit along the movement axis, wherein the control unit performs thermal correction control at predetermined intervals to calibrate the positional deviation due to thermal deformation of the movement axis, movement correction control that causes the camera to sequentially capture a plurality of the substrate recognition marks and recognizes the relative positional relationship between the substrate and the work head to determine the amount of movement correction of the work head, and estimation control before the movement correction control that estimates the next work area on the substrate in which the work head can perform work on the substrate between the current thermal correction control and the next thermal correction control, wherein in the movement correction control, the camera captures all of the substrate recognition marks included in the next work area, while omitting the capture of at least some of the substrate recognition marks included in unworked areas other than the next work area.

[0008] With this substrate handling device, the next work area in which work can be performed is estimated during the thermal compensation control interval, and all substrate recognition marks included in that next work area are imaged, while at least a portion of the imaging of unworked areas is omitted. In other words, all substrate recognition marks in the next work area that are estimated to be workable before the next thermal compensation control are imaged, so movement compensation control to determine the amount of movement compensation for the work head can be accurately performed. On the other hand, since at least a portion of the imaging of substrate recognition marks in unworked areas is omitted, the number of substrate recognition marks that need to be re-imaged after the next thermal compensation control can be reduced. Therefore, cycle loss can be suppressed.

[0009] In the above-described substrate handling apparatus, it is desirable that the control unit omits imaging of more than half of the substrate recognition marks included in the unworked area during the movement correction control. This embodiment significantly reduces cycle loss.

[0010] In the above-described substrate work apparatus, it is desirable that the control unit omits imaging all of the substrate recognition marks included in the unworked area in the movement correction control.

[0011] In this configuration, only the substrate recognition marks included in the next work area are imaged. Therefore, it becomes possible to eliminate the number of substrate recognition marks that require re-image, which can significantly contribute to improving the cycle time.

[0012] In the above-described substrate work apparatus, the control unit may, in the movement correction control, perform imaging of a number of substrate recognition marks corresponding to a predetermined margin selected from the unworked area, in addition to imaging all of the substrate recognition marks included in the next work area.

[0013] In some cases, the work on the next work area may be completed earlier than scheduled. In this case, some buffer time may be created before the next thermal compensation control. According to the above embodiment, since the substrate recognition marks of the unworked area are imaged for a predetermined buffer period, if such buffer time is created, it is possible to have the work head perform work on a portion of the unworked area.

[0014] In the above-described substrate work apparatus, the control unit can estimate the next work area based on past work performance of the same type of work or similar work performance by the work head in the estimation control.

[0015] According to this embodiment, the next work area is estimated based on past work performance. Therefore, the work area that can be performed during the thermal compensation control interval can be estimated more accurately.

[0016] In the above-described substrate work apparatus, if the work of the work head on the next work area identified by the estimation control is completed early, the control unit may change the predetermined cycle and execute the next thermal compensation control.

[0017] According to this embodiment, if the work in the next work area is completed earlier than scheduled, the next thermal compensation control will be executed earlier than scheduled. In this way, by flexibly changing the timing of the thermal compensation control instead of fixing it, the cycle time can be improved.

[0018] In the above-described substrate handling apparatus, the base is provided with a reference mark for calibrating thermal deformation, and the control unit may be configured to measure the amount of thermal deformation of the moving axis by having the camera capture an image of the reference mark during the thermal correction control. According to this embodiment, the thermal deformation of the moving axis can be easily and accurately grasped.

[0019] In the above-described circuit board processing apparatus, it is preferable that the processing head is a mounting head for mounting components onto the circuit board.

[0020] According to this aspect, in a component mounting apparatus for mounting components on a substrate, it is possible to improve the tact time of the component mounting operation on the substrate with a substrate recognition mark carried into the mounting stage.

[0021] In the above substrate working apparatus, in the predictive control, it is desirable that the control unit calculates the number of components that can be mounted on the substrate within the time from the current thermal correction control to the next thermal correction control by referring to the production capacity history data of the component mounting substrate by the mounting head, and thereby estimates the next working area.

[0022] According to this aspect, the next working area is estimated based on the production capacity history data of the past mounting head. Therefore, it is possible to more accurately estimate the working area where component mounting is possible within the interval of the thermal correction control.

[0023] In this case, the control unit may refer to the current production variety history data, which is the history of the currently produced substrate variety, as the production capacity history data. According to this aspect, since the current variety history data is used, the next working area can be estimated more accurately.

[0024] Further, when the current production variety history data does not exist, the control unit may refer to the common history data obtained from the history of all varieties produced in the past as the production capacity history data. According to this aspect, even if the current variety history data does not exist, the next working area can be accurately estimated based on the common history data.

Effect of the Invention

[0025] According to the present invention, it is possible to provide a substrate working apparatus that can suppress the occurrence of tact loss derived from the imaging operation of the substrate recognition mark as much as possible.

Brief Description of the Drawings

[0026] [Figure 1] FIG. 1 is a plan view schematically showing the configuration of a component mounting apparatus, which is an embodiment of the substrate working apparatus of the present invention. [Figure 2] Figure 2 is a front view of the head unit of the component mounting device. [Figure 3] Figure 3 is a block diagram showing the electrical configuration of the component mounting device. [Figure 4] Figure 4 is a schematic diagram showing the component mounting status by the head unit on a multi-sided substrate. [Figure 5] Figure 5 is a flowchart showing the component mounting process for Comparative Example 1. [Figure 6] Figure 6 is a schematic diagram showing the component mounting status after processing in Comparative Example 1. [Figure 7] Figure 7 is a schematic diagram showing the component mounting status after processing in Comparative Example 2. [Figure 8] Figure 8 is a schematic diagram showing the component mounting status after processing in Comparative Example 2. [Figure 9] Figure 9 is a graph showing the relationship between thermal expansion of the XY movement axis and the movement correction amount. [Figure 10] Figure 10 is a schematic diagram showing the component mounting status after processing according to an embodiment of the present invention. [Figure 11] Figure 11 is a schematic diagram showing the component mounting status after processing according to an embodiment of the present invention. [Figure 12] Figure 12 is a flowchart showing the component mounting process in the embodiment. [Figure 13] Figure 13 is a flowchart showing the component mounting process in the embodiment. [Modes for carrying out the invention]

[0027] Embodiments of the present invention will be described in detail below with reference to the drawings. In this embodiment, a component mounting apparatus for mounting electronic components on a printed circuit board is given as an example of the circuit board work apparatus of the present invention. Electronic components include, for example, chip components such as chip resistors and chip capacitors, ball bump components, and packaged components such as ICs. The circuit board work apparatus according to the present invention may also be an apparatus that performs operations other than component mounting on a circuit board, such as printing, inspection, and measurement.

[0028] <Overall structure of a component mounting device> Figure 1 is a plan view showing the schematic configuration of the component mounting apparatus 1, and Figure 2 is a front view showing the schematic configuration of the head unit portion of the component mounting apparatus 1. The component mounting apparatus 1 is a device that produces mounted substrates by mounting various electronic components onto a substrate P. The component mounting apparatus 1 includes a base 10, a substrate transport unit 2, a component supply unit 3, a head unit 4, a substrate recognition camera 5 (camera), and a multi-camera 11. In Figures 1 and 2, XYZ direction indicators are provided. In the following description, the X direction may refer to the left-right direction, which is the direction of movement of the substrate P, the Y direction may refer to the front-back direction, and the Z direction may refer to the up-down direction.

[0029] The base 10 is rectangular in shape in plan view and has a flat top surface, to which the substrate transport unit 2 and the component supply unit 3 are assembled. The substrate transport unit 2 transports the substrate P on which electronic components are mounted. The substrate transport unit 2 has a pair of conveyors 21 and 22 on the base 10 that transport the substrate P in the left-right direction (X direction). The conveyors 21 and 22 bring the substrate P into the component mounting device 1 from the right side and transport it to the left to a predetermined work position, in this case the position of the substrate P shown in Figure 1, where it is temporarily stopped. At this work position, electronic components are mounted on the substrate P. After the mounting work, the conveyors 21 and 22 transport the substrate P to the left and transport it out of the component mounting device 1.

[0030] The component supply unit 3 supplies electronic components 6 to be mounted on the circuit board P. The component supply units 3 are each arranged in the front-to-back direction (Y direction) of the circuit board transport unit 2. Each component supply unit 3 is equipped with a plurality of tape feeders 31 arranged in the left-to-right direction. Each tape feeder 31 holds a reel on which tape containing electronic components such as chip components at predetermined intervals is wound. The tape feeder 31 intermittently unwinds the tape from the reel and supplies chip components to the component supply position at the tip of the feeder.

[0031] The head unit 4 takes electronic components from the component supply unit 3 and mounts them onto the circuit board P. The head unit 4 is positioned to move along the XY horizontal movement axis set on the base 10, and at the component supply position it takes electronic components from the tape feeder 31 and at the work position it mounts the electronic components to a predetermined position on the circuit board P. Above the base 10, a support beam 23 extending in the X direction is installed. The head unit 4 is supported to move with respect to the X-axis fixed rail 24 (movement axis) fixed to the support beam 23.

[0032] The support beam 23 is supported by a Y-axis fixed rail 25 extending in the Y direction, and is movable in the Y direction along this Y-axis fixed rail 25 (moving axis). An X-axis servo motor 26 and a ball screw shaft 27 are arranged on the X-axis fixed rail 24 as a head movement mechanism in the X direction. A Y-axis servo motor 28 and a ball screw shaft 29 are arranged on the Y-axis fixed rail 25 as a head movement mechanism in the Y direction. In this way, the head unit 4 is movable in the horizontal direction of XY. That is, the head unit 4 moves in the X direction by rotational drive of the ball screw shaft 27 by the X-axis servo motor 26, and moves in the Y direction by rotational drive of the ball screw shaft 29 by the Y-axis servo motor 28.

[0033] The head unit 4 is equipped with multiple mounting heads 4H as work heads for mounting components onto the substrate P. In other words, in this embodiment, the predetermined operation performed on the substrate P is component mounting. Each head 4H includes a shaft 41 extending in the Z direction and a suction nozzle 42 attached to the lower end of the shaft 41. The shaft 41 is movable up and down relative to the head unit 4 and is also rotatable around the nozzle's central axis (R axis). The suction nozzle 42 attracts and holds electronic components and mounts them on the surface of the substrate P.

[0034] The multi-camera 11 is integrated into the base. The multi-camera 11 is a camera whose imaging field of view is above the base 10. The main role of the multi-camera 11 is to image the electronic components held by the suction nozzle 42 from the bottom side in order to image the state of suction of the electronic components by the suction nozzle 42.

[0035] The circuit board recognition camera 5 is mounted on the left side of the head unit 4. The circuit board recognition camera 5 is a camera that images the upper surface of the base 10 from above, and captures various marks present on the upper surface of the base 10. In Figure 1, examples of the marks include the FID mark FM (circuit board recognition mark) attached to the surface of the circuit board P and the thermal expansion calibration reference marks M1 to M3 installed on the upper surface of the base 10.

[0036] The FID mark FM is a mark used to detect the amount of positional deviation of the receiving substrate P relative to the origin coordinates of the work position. The position of the FID mark FM is identified in the image data obtained by the substrate recognition camera 5, and the amount of positional deviation relative to the origin coordinates is determined. This amount of positional deviation is referenced during component mounting, and electronic components are mounted on the substrate P in a way that prevents positional deviation.

[0037] Reference marks M1 to M3 are calibration marks attached to the base 10, or the conveyors 21 and 22 installed on the base 10, where the effects of thermal expansion and contraction can be substantially ignored, and are used to measure the degree of thermal displacement of the XY movement axis. In this embodiment, an example is shown in which two reference marks M1 and M2 are arranged spaced apart in the X direction on the front side of the substrate transport unit 2, and one reference mark M3 is arranged on the rear side of the substrate transport unit 2.

[0038] The XY movement axes, namely the X-axis fixed rail 24, the Y-axis fixed rail 25, and their ball screw shafts 27, 29, etc., expand due to heat generated during the operation of the component mounting device 1, such as frictional heat generated when the head unit 4 moves. When the XY movement axes expand due to heat, errors occur in the positional accuracy of the head unit 4, and the accuracy of component mounting decreases. By imaging the reference marks M1 to M3, which do not experience thermal displacement, with the substrate recognition camera 5 mounted on the head unit 4, which moves along the XY movement axes where thermal displacement occurs, the thermal displacement error can be calculated. By controlling the movement of the head unit 4 to eliminate the obtained thermal displacement error, the decrease in component mounting accuracy can be suppressed.

[0039] <Electrical configuration of component mounting equipment> Next, the control configuration of the component mounting device 1 will be described. Figure 3 is a block diagram showing the electrical configuration of the component mounting device 1. The component mounting device 1 includes a control device 7 located inside or outside the base 10. The control device 7 controls the operation of each part of the component mounting device 1 by executing a predetermined program. Note that the block diagram in Figure 3 includes the Z-axis servo motor 43 and the R-axis servo motor 44, which were omitted from Figures 1 and 2.

[0040] The Z-axis servo motor 43 and the R-axis servo motor 44 are motors incorporated into the head unit 4. The Z-axis servo motor 43 is a drive source that raises and lowers the head 4H (shaft 41) along the Z-axis when picking up or mounting electronic components. The R-axis servo motor 44 is a drive source that rotates the shaft 41 around the R-axis.

[0041] The control device 7 functionally comprises an imaging control unit 71, an image processing unit 72, an axis control unit 73, a main control unit 74 (control unit), and a storage unit 75. The imaging control unit 71 controls the imaging operations of the substrate recognition camera 5 and the multi-camera 11, as well as various other cameras provided in the component mounting device 1. For example, the imaging control unit 71 provides a control signal that specifies the timing for the substrate recognition camera 5 to capture images of reference marks M1 to M3 and FID marks such as FM.

[0042] Under the control of the main control unit 74, the imaging control unit 71 may cause the substrate recognition camera 5 to perform multiple imaging operations of reference marks M1 to M3 during the process of mounting components onto a single substrate P, if the mounting process takes a considerable amount of time. This is to accommodate the fact that changes in the thermal displacement of the XY movement axes may occur during component mounting onto a single substrate P that has been brought into the component mounting apparatus 1 and fixed in a predetermined work position. As will be described in detail later, in this embodiment, during the interval of thermal correction control based on recognition of reference marks M1 to M3, the next work area on the substrate P in which component mounting work can be performed is estimated, and the occurrence of cycle loss is suppressed by only imaging the FID marks FM that are present in that next work area.

[0043] The image processing unit 72 applies image processing techniques such as edge detection and pattern recognition with feature extraction to the image data acquired by the substrate recognition camera 5 and the multi-camera 11 to extract various information from the image. Specifically, the image processing unit 72 performs processing to identify the positions of the FID mark FM and reference marks M1 to M3 based on the image data acquired by the substrate recognition camera 5. In addition, the image processing unit 72 performs processing to identify the shape, position, etc., of the electronic components held by the suction nozzle 42 based on the image data acquired by the multi-camera 11.

[0044] The axis control unit 73 controls the movement of the head unit 4 in the XY direction by controlling the X-axis servo motor 26 and the Y-axis servo motor 28. The axis control unit 73 also controls the lifting, lowering, and rotational movements of the mounting head 4H by controlling the Z-axis servo motor 43 and the R-axis servo motor 44 of the head unit 4.

[0045] The main control unit 74 comprehensively controls various operations of the component mounting device 1. For example, the main control unit 74 provides control signals to the imaging control unit 71, the image processing unit 72, and the axis control unit 73, etc., to perform operations such as causing the cameras 5 and 11 to capture images, performing image processing on the image data, moving the head unit 4 along the movement axis, and driving the head 4H.

[0046] The memory unit 75 stores various information about the substrate P and electronic components, various setting values ​​and parameters related to the component mounting device 1, control data, operation programs, etc. In addition, the memory unit 75 stores production capacity history data, which is a record of the actual production time required for component mounting. As shown in Figure 13, the production capacity history data includes current production type history data D1, which shows the number of components mounted per unit time for individual substrate types, and all-type common history data D2, which shows the number of components mounted per unit time for all substrate types mounted in the past. These data D1 and D2 are used to estimate the work area that can be executed during the interval of thermal compensation control.

[0047] The main control unit 74 functionally includes a recognition control unit 76, a movement correction unit 77, a thermal correction unit 78, and an estimation processing unit 79 for controlling the movement of the head unit 4 in conjunction with the imaging of the FID mark FM and reference marks M1 to M3. The recognition control unit 76 provides instruction signals to the axis control unit 73 and the imaging control unit 71 to control the movement of the head unit 4 for the recognition of the FID mark FM and reference marks M1 to M3, as well as the imaging operation of the substrate recognition camera 5. Furthermore, the recognition control unit 76 causes the image processing unit 72 to perform a process to identify the position of each mark based on the acquired image.

[0048] The movement correction unit 77 performs movement correction control to determine the amount of movement correction for the head 4H. Specifically, the movement correction unit 77 recognizes the relative positional relationship between the substrate P, which has been brought into the component mounting device 1 and fixed at a predetermined work position, and the head 4H based on the recognition result of the FID mark FM. In other words, the amount of positional deviation of the substrate P with respect to the origin coordinates of the work position is determined. Furthermore, the movement correction unit 77 determines the amount of movement correction for the head 4H to eliminate the amount of positional deviation. That is, it identifies the position corresponding to the predetermined component mounting position on the substrate P to be mounted, based on an axial coordinate system with respect to the FID mark FM.

[0049] The thermal compensation unit 78 performs thermal compensation control at a predetermined period to calibrate the positional deviation caused by thermal deformation of the fixed rails 24 and 25 and the ball screw shafts 27 and 29, which are the XY movement axes. Specifically, the thermal compensation unit 78 measures the amount of thermal deformation of the XY movement axes based on the recognition results of the reference marks M1 to M3 and performs a process to determine a correction value for the amount of movement of the head unit 4. The deformation is solely due to thermal expansion caused by the temperature rise of the XY movement axes, and the thermal compensation control is a thermal expansion compensation control that constitutes this thermal expansion.

[0050] The estimation processing unit 79 performs estimation control to estimate the work area on the substrate P in which component mounting work can be performed during the interval of thermal correction control by the thermal correction unit 78. Before the movement correction control that recognizes the FID mark FM, the estimation processing unit 79 performs processing to estimate the next work area on the substrate P in which the head 4H can perform work on the substrate P, between the current thermal correction control and the next thermal correction control.

[0051] When the next work area is estimated, the recognition control unit 76, in the movement correction control of the head 4H, causes the substrate recognition camera 5 to image all FID marks FM included in the next work area. On the other hand, the recognition control unit 76 omits imaging of at least some of the FID marks FM included in the unworked areas other than the next work area. As will be described in detail later with reference to Figure 9, when thermal correction control is performed, the axis coordinate system that serves as the basis for the correction changes, so the movement correction control based on the recognition results of the previously performed FID marks FM must be reset. In other words, the recognition results of the FID marks FM can be used for the next work area where component mounting is estimated to be possible by the next thermal correction control, but for other unworked areas, the recognition results of the FID marks FM cannot be used because thermal correction control is involved. For this reason, it is necessary to re-image the FID marks FM after thermal correction control. Accordingly, by omitting imaging of at least some of the FID marks FM present in the unworked areas, cycle loss can be suppressed.

[0052] The recognition control unit 76 preferably omits imaging of more than half, preferably more than two-thirds, of the FID mark FMs included in the unworked area. This significantly reduces the number of FID mark FMs to be imaged by the substrate recognition camera 5, resulting in a remarkable reduction in cycle loss.

[0053] In a more desirable embodiment, the recognition control unit 76 omits imaging all FID mark FMs included in the unworked area. The embodiment described later adopts this complete omission embodiment. According to this embodiment, only the FID mark FMs included in the next work area are imaged. Therefore, it becomes possible to eliminate the number of FID mark FMs that require re-imaging, which can greatly contribute to improving the cycle time.

[0054] [Example of component mounting work on a multi-sided circuit board] Figure 4 is a schematic diagram showing the component mounting status of a multi-sided substrate PA by the head unit 4. The multi-sided substrate PA is a single substrate consisting of multiple sub-sub

[0055] The number of unit mounting areas 62 on the chamfered substrate PA is determined according to the number of heads 4H that the head unit 4 has. Figure 4 shows an example of a head unit 4 in which 10 heads 4H are arranged in a row. That is, the number of parts that the group of heads 4H of the head unit 4 can hold in one part pick-up operation at the part supply unit 3 is 10. Since 2 parts are mounted on each sub-substrate 61, the unit mounting area 62 is the area of ​​5 sub-substrates 61 arranged in the X direction. In the example in Figure 4, the group of unit mounting areas 62 arranged in 6 rows in the Y direction is arranged in 3 columns in the X direction. In other words, there are 18 unit mounting areas 62.

[0056] Multiple FID marks FM are attached to each unit mounting area 62. Here, we show an example where the first FID mark FM1 is attached to the -X and -Y corners of each unit mounting area 62, and the second FID mark FM2 is attached to the +X and +Y corners. Under the control of the recognition control unit 76, the substrate recognition camera 5 captures images of the FID marks FM1 and FM2, and the positions of these marks are recognized. Then, the movement correction unit 77 determines the movement correction amount for each head 4H. The same procedure is followed for the other unit mounting areas 62. After that, the components that have been attracted to each head 4H are mounted to the component mounting positions 63 assigned to each head 4H.

[0057] [Comparative Example] Next, for comparison with embodiments of the present invention, a conventional component mounting procedure in the case where multiple sets of FID marks FM exist on a single substrate will be described as a comparative example. Here, the mounting procedure performed on the multi-chamfered substrate PA illustrated in Figure 4 is shown.

[0058] <Comparative Example 1> Figure 5 is a flowchart of the component mounting process for Comparative Example 1. Comparative Example 1 is an example in which the FID mark FM of one unit mounting area 62 is recognized each time the head unit 4 performs a component pick-up operation. When the component mounting process on a single substrate PA is started, first the component supply unit 3 picks up components onto each of the 10 heads 4H of the head unit 4 (step S1). Subsequently, the head unit 4 is moved so as to pass over the multi-camera 11, and the components picked up on each head 4H are recognized (step S2).

[0059] Next, the head unit 4 is moved to the first unit mounting area 62 in the mounting order, and the board recognition camera 5 sequentially recognizes the first FID mark FM1 (step S3) and the second FID mark FM2 (step S4). Based on the recognition results of FID marks FM1 and FM2, the movement correction amount for each head 4H is determined, and the suction components are mounted to the component mounting positions 63 assigned to each of the 10 heads 4H (step S5). After that, it is checked whether all components have been mounted on one board PA (step S6), and if component mounting is complete (YES in step S6), the process ends. On the other hand, if it is not complete (NO in step S6), the process returns to step S1 and is repeated for the next unit mounting area 62.

[0060] Figure 6 is a schematic diagram showing the component mounting status after processing in Comparative Example 1, illustrating the operations performed in the flowchart of Figure 5. The head unit 4 moves from the component suction position in step S1, passes over the multi-camera 11 where component recognition takes place in step S2, and then moves towards the area above the first unit mounting area 62a on the multi-chamfered substrate PA. Subsequently, the head unit 4 moves to a position where the first FID mark FM1 is within the field of view of the substrate recognition camera 5, and imaging of the first FID mark FM1 takes place in step S3.

[0061] Next, the head unit 4 is moved to a position where the second FID mark FM2 is within the field of view of the board recognition camera 5, and the second FID mark FM2 is imaged in step S4. In the unit mounting area 62a, the first FID mark FM1 is attached to the sub-board 61a on the -X side, and the second FID mark FM2 is attached to the sub-board 61b on the +X side. Therefore, the amount of movement of the head unit 4 from step S3 to step S4 is long. In other words, a relatively long axial movement of the head unit 4 is required solely for the recognition of FID marks FM1 and FM2.

[0062] Subsequently, component mounting in step S5 takes place. In a typical sequence, components attached to the head 4H are mounted in order from the -X-side sub-board 61a, and finally components are mounted to the +X-side sub-board 61b. At this time, the head unit 4 requires a relatively long axial movement from the position of the second FID mark FM2 to the sub-board 61a. After that, the next set of components is attached to the 10 heads 4H of the head unit 4. Then, for the second-in-order unit mounting area 62b, FID marks FM1 and FM2 are recognized and components are mounted in the same manner as described above.

[0063] In the process of Comparative Example 1 described above, the number of times the head unit 4 is moved axially by a relatively long distance is increased. In the example in Figure 6, there are 18 unit mounting areas 62. Therefore, in the process of Comparative Example 1, 18 long-distance movements are required from the first FID mark FM1 to the second FID mark FM2 shown in the upper part of Figure 6, and 18 long-distance movements are required from the second FID mark FM2 to the sub-board 61a at the first mounting position shown in the lower part of Figure 6. Consequently, the process of Comparative Example 1 results in a high cycle loss.

[0064] <Comparative Example 2> Comparative Example 2 is an example in which all FID marks FM attached to a multi-sided substrate PA are captured together prior to component mounting on the substrate PA. Figures 7 and 8 are schematic diagrams showing the component mounting status after processing in Comparative Example 2. In Figures 7 and 8, the movement of the head unit 4 is indicated by arrows at each step S11 to S16 of the processing in Comparative Example 2.

[0065] Step S11, shown in the upper part of Figure 7, is a batch recognition step that recognizes all of the FID marks FM on the multi-chamfered substrate PA at once. Starting with the first FID mark FM1 of the first unit mounting area 62a in the component mounting order, imaging and recognition of the FID marks in 18 unit mounting areas 62 are performed. In a pair of adjacent group rows of unit mounting areas 62 in the X direction, the second FID mark FM2 of the group row on the -X side and the first FID mark FM1 of the group row on the +X side are located in close proximity. Therefore, these FID marks FM2 and FM1 can be imaged in a single imaging operation. For this reason, by moving the head unit 4 alternately in the Y and X directions in a meandering trajectory, all FID marks FM can be imaged. With this process, the long-distance movement of the head unit 4 between the first FID mark FM1 and the second FID mark FM2 is only required once for each group row of unit mounting areas 62 arranged in three columns, significantly reducing cycle loss.

[0066] Step S12, shown in the lower part of Figure 7, represents the component mounting step. The head unit 4 is moved from the component suction position for the current component set to above the chamfered substrate PA. Since the FID marks FM1 and FM2 have already been recognized, the components are mounted in the order of the first unit mounting area 62a, the second unit mounting area 62b, and so on. In each unit mounting area 62, components are mounted at their respective component mounting positions 63, starting from the sub-sub

[0067] Assume that at step S13, the timing for executing thermal compensation control by the thermal compensation unit 78 has arrived. As previously described, the fixed rails 24 and 25 and the ball screw shafts 27 and 29, which are the XY movement axes, undergo thermal deformation. This thermal deformation is solely due to the thermal expansion of the XY movement axes caused by the heat generated during the operation of the component mounting device 1. In the case of a board with many component mounting locations, such as a multi-chamfered board PA, the timing for executing thermal compensation control may arrive while components are being mounted on a single board. In this case, the component mounting work is interrupted and thermal compensation control is executed.

[0068] Step S14 in Figure 8 shows the state in which image capture of reference marks M1 to M3 attached to the base 10 is being performed for thermal expansion correction. The head unit 4 is moved from the third unit mounting area 62c to the position of the first reference mark M1. The head unit 4 is then sequentially moved to the position of the second reference mark M2 and the position of the third reference mark M3, and image capture and recognition processing of these reference marks M1 to M3 are performed.

[0069] Step 15 in Figure 8 shows the re-recognition operation of the FID mark. Due to thermal expansion of the XY movement axis, the axial coordinate system used to move the head unit 4 changes. In other words, when thermal expansion correction is performed, the recognition result of the previously performed FID mark FM becomes inaccurate. Therefore, it is necessary to re-recognize the FID marks FM1 and FM2 for the unit mounting areas (unworked areas) excluding the 1st to 3rd unit mounting areas 62a to 62c where component mounting has been completed. Specifically, as shown in step 15, the imaging of FID marks FM1 and FM2 from the 4th unit mounting area 62d onwards must be redone.

[0070] Subsequently, as shown in step S16, the component mounting process is resumed. That is, components are mounted in the order of the fourth unit mounting area 62d, the fifth unit mounting area 62e, the sixth unit mounting area 62f, and so on. After this, when the next thermal compensation control is performed, it will be necessary to perform the FID mark FM1 and FM2 recognition operation again for the unworked unit mounting areas.

[0071] The reason why re-recognition of the FID mark is necessary after thermal expansion correction will be explained based on Figure 9. Figure 9 is a graph showing the relationship between thermal expansion of the XY movement axis and the amount of movement correction of the head 4H. Figure 9 shows a curve indicating the amount of thermal expansion ha of the XY movement axis. The amount of thermal expansion ha increases as the operating time of the component mounting device 1 progresses, but a large amount of thermal expansion occurs in the initial period of operation, and thereafter the amount of expansion tends to gradually decrease. The notations 1st to 4th in Figure 9 indicate the timing of component suction by the head unit 4, in other words, the timing of component mounting to the 1st to 4th unit mounting area 62.

[0072] In the movement correction control performed by the movement correction unit 77, the FM correction amount, which indicates the amount of movement correction for the head 4H, is the sum of the theoretical deviation Δf and the thermal expansion Δh. The theoretical deviation Δf is the amount of positional deviation of the substrate P with respect to the origin coordinates of the working position of the component mounting device 1. Since different FID marks are used for the 1st to 4th timings, the theoretical deviation Δf will also be a different value, but for simplicity, it is assumed to be the same value here.

[0073] Assume that the nth thermal expansion correction is performed at the first timing. Since the thermal expansion Δh is eliminated by this correction, the FM correction amount at the first timing becomes the theoretical deviation Δf. On the other hand, at the second timing, which is performed between the (n+1)th thermal expansion correction, as the amount of thermal expansion ha increases, the FM correction amount becomes = theoretical deviation Δf + thermal expansion Δh1. Furthermore, at the third timing, the FM correction amount becomes = theoretical deviation Δf + thermal expansion Δh2 (h2>h1). In reality, thermal expansion Δh1 and Δh2 are not measured at both the second and third timings, so these thermal expansion amounts become errors. In contrast, at the fourth timing, when the (n+1)th thermal expansion correction is performed, the thermal expansion Δh is eliminated.

[0074] In Comparative Example 2, all FID marks on the multi-chamfered substrate PA are recognized at the first timing of the nth thermal expansion correction. This recognition of all FID marks is based on the axial coordinate system calibrated during the nth thermal expansion correction. After this, when the (n+1)th thermal expansion correction is performed, the axial coordinate system will be calibrated again. In this case, if the component mounting operation after the (n+1)th thermal expansion correction is performed based on the FID mark recognition results from the nth thermal expansion correction, the positioning control of the head 4H will be performed with multiple thermal expansion amounts included, resulting in a decrease in component mounting accuracy. Therefore, when the (n+1)th thermal expansion correction is performed, the previously performed FID mark recognition results must be reset and the FID marks must be recognized anew.

[0075] Thus, while the processing in Comparative Example 2 can suppress the long-distance movement of the head unit 4 for FID mark recognition compared to Comparative Example 1, it requires the FID mark to be re-recognized each time thermal expansion compensation (thermal compensation control) is performed. As a result, unnecessary FID mark recognition is performed, causing cycle loss.

[0076] [Examples] In view of the problems of Comparative Examples 1 and 2 described above, in the embodiment of the present invention, between the current thermal compensation control and the next thermal compensation control, the head 4H estimates the next working area on the chamfered substrate PA in which it can perform work, and only recognizes the FID mark FM present in that next working area. Figures 10 and 11 are schematic diagrams showing the basic operation of component mounting by the processing of the embodiment of the present invention. Figures 10 and 11 show the movement state of the head unit 4 with arrows for each step S21 to S27 of the processing of the embodiment.

[0077] Step S21 in Figure 10 is the next work area estimation step. It is assumed that the nth thermal expansion control (thermal compensation control) has been performed immediately before step S21. In step S21, the estimation processing unit 79 performs the process of estimating the first next work area WA1 on the substrate PA. The next work area WA1 is the area on the substrate P in which the head 4H can perform component mounting work from the nth thermal expansion control performed immediately before to the next (n+1)th thermal expansion control. The next work area WA1 can be estimated, for example, based on the head 4H's past mounting work performance on the same type of substrate or on a similar substrate. In Figure 10, an example is shown in which the next work area WA1 is the range of the 1st, 2nd, and 3rd unit mounting areas 62a, 62b, and 62c in the component mounting order.

[0078] Step S22 is the FID mark FM recognition step. The recognition control unit 76 causes the board recognition camera 5 mounted on the head unit 4 to image all of the FID marks FM1 and FM2 included in the next work area WA1. Here, the three first FID marks FM1 and the three second FID marks FM2 located in the unit mounting areas 62a, 62b, and 62c are the targets of imaging. The recognition control unit 76 omits imaging of any other FID marks. In the recognition step of step S22, the head unit 4 is moved axially by a relatively long distance only once, between imaging the first FID mark FM1 in the third unit mounting area 62c and imaging the second FID mark FM2.

[0079] Step S23 is a component mounting step. The main control unit 74 controls the head unit 4 via the shaft control unit 73 to mount components to the component mounting positions 63 in the next work area WA1. That is, in units of the first, second, and third unit mounting areas 62a, 62b, and 62c, the operations of component suction to the 10 heads 4H, recognition of suctioned components, and component mounting are performed, and the required components are sequentially mounted in each area.

[0080] Step S24 is a thermal expansion correction step. The thermal expansion correction here is the (n+1)th thermal expansion correction that occurs when the mounting work in the next work area WA1 is completed. The thermal correction unit 78 causes the substrate recognition camera 5 to sequentially image the reference marks M1 to M3 and measures the amount of thermal deformation of the XY movement axis. In this embodiment, only FID marks FM1 and FM2 located in the next work area WA1 where the mounting work was just completed are imaged, so there is no recognition data for FID marks that should be reset as in Comparative Example 2. If there is recognition data for FID marks FM1 and FM2 located downstream of the mounting work from FID marks FM1 and FM2 in the next work area WA1, this data will be reset.

[0081] Step S25 in Figure 11 is the estimation step for the second next work area WA2. The next work area WA2 is the area on the substrate P in which the head 4H can perform component mounting operations between the (n+1)th thermal expansion control performed immediately before and the (n+2)th thermal expansion control. Figure 11 shows an example where the range of the 4th, 5th, and 6th unit mounting areas 62d, 62e, and 62f in the component mounting order is the second next work area WA2.

[0082] Step S26 is the second FID mark FM recognition step. The recognition control unit 76 causes the substrate recognition camera 5 to image the three first FID marks FM1 and the three second FID marks FM2 that are located in the unit mounting areas 62d, 62e, and 62f included in the next work area WA2.

[0083] Step S27 is the component mounting step. The main control unit 74 performs the operations of picking up components onto the 10 heads 4H, recognizing the picked-up components, and mounting components in units of the 4th, 5th, and 6th unit mounting areas 62d, 62e, and 62f, and sequentially mounting the required components in each area. After that, the (n+2)th thermal expansion control is performed. Subsequently, the next work area estimation step, FID mark recognition step, component mounting step, and thermal expansion correction step are repeated in the same manner as above for the remaining unit mounting areas 62.

[0084] According to the embodiment described above, the next work areas WA1 and WA2 in which mounting work can be performed are estimated during the thermal expansion correction control interval, and all FID marks FM1 and FM2 included in these next work areas are imaged, while FID marks in unworked areas are not imaged. In other words, all FID marks FM1 and FM2 in the next work areas WA1 and WA2 that are estimated to be able to be worked on before the next thermal expansion correction are imaged, so the movement correction control that determines the movement correction amount of the head 4H can be accurately executed. On the other hand, since FID marks FM1 and FM2 in unworked areas are not imaged, it is possible to make the number of FID marks that need to be re-imaged after the next thermal correction control zero. Therefore, cycle loss can be suppressed.

[0085] [Specific examples of component mounting processes] Figures 12 and 13 are flowcharts illustrating specific examples of component mounting processes according to the present invention. This example shows how to estimate the next work area from production capacity history data obtained by recording the production capacity of component mounting boards by head 4H, i.e., the actual production time of the mounting boards.

[0086] When processing starts, the main control unit 74 determines whether or not it is the period for thermal expansion correction (step S31). Thermal expansion correction is performed periodically at predetermined intervals after the component mounting device 1 has started operating. Alternatively, the execution interval for thermal expansion correction may be set variably according to the operating time of the component mounting device 1, etc.

[0087] If it is time to perform thermal expansion correction (YES in step S31), the thermal correction unit 78 performs the nth thermal expansion correction, as illustrated in step S26 of Figure 11, by sequentially imaging the reference marks M1 to M3 with the substrate recognition camera 5 and measuring the amount of thermal deformation of the XY movement axis (step S32). Once thermal expansion correction is performed, the movement correction unit 77 initializes the data of the movement correction amount of the head 4H (FM correction amount) based on the recognition results of the FID mark FM acquired up to that point (step S33). On the other hand, if it is not time to perform thermal expansion correction (NO in step S31), steps S32 and S33 are skipped.

[0088] Next, the estimation processing unit 79 extracts the FID marks FM that need to be recognized by the (n+1)th thermal expansion correction (step S34). In other words, it performs a process to estimate the next work area in which component mounting work can be performed on the substrate PA, and identifies the FID marks FM included in that next work area. In estimating this next work area, the estimation processing unit 79 refers to production capacity history data such as the current production type history data D1 or the history data common to all types D2 (Figure 13). The current production type history data D1 is data on the past production history of the substrate type currently in production. In other words, it is production history data for each substrate type. The history data common to all types D2 is production capacity history data obtained from the history of all substrate types produced in the past.

[0089] The estimation processing unit 79 calculates the number of components that can be mounted per unit time based on the current production variety history data D1 or the history data D2 common to all varieties shown above. Furthermore, the estimation processing unit 79 calculates the number of components that can be mounted on the multi-sided substrate PA within the time between the nth thermal expansion correction and the (n+1)th thermal expansion correction. The area that can be filled with this number of components is designated as the next work area on the substrate PA.

[0090] Once the FID mark FMs that need to be recognized are identified, the recognition control unit 76 searches for a path to recognize these FID mark FMs (step S35). Step S22 in Figure 10 is an example of setting a recognition path for FID mark FMs. Once the recognition path is set, the recognition control unit 76 gives instruction signals to the axis control unit 73 and the imaging control unit 71, and controls the movement of the head unit 4 and the imaging operation of the substrate recognition camera 5 to sequentially perform the recognition operation of FID mark FMs along the recognition path.

[0091] In other words, the recognition control unit 76 determines whether or not there are unrecognized FID marks FM (step S36), and if there are unrecognized FID marks FM (YES in step S36), it moves the head unit 4 to the next FID mark FM and performs the recognition operation (step S37). On the other hand, if there are no unrecognized FID marks FM (NO in step S36), the estimation processing unit 79 starts recording the production time in order to accumulate production capacity history data for the current component mounting work area (step S38).

[0092] Next, it is checked whether the timing for performing thermal expansion correction has arrived (step S40). If it is not the timing for performing thermal expansion correction (NO in step S41), it is determined whether the FID mark FM required for component mounting has not been recognized (step S41). This step S41 is a step to determine whether the component mounting to the next work area, which was estimated in the previous step S34, has been completed. In other words, if the component mounting to the planned work area has been completed, the recognition of the FID mark FM will be required again for component mounting to the next work area.

[0093] If there is no new FID mark FM to be recognized (NO in step S41), the component mounting work is performed in units of unit mounting area 62. First, a component is attached to each of the 10 heads 4H of the head unit 4 (step S42). Next, the head unit 4 is moved so that it passes over the multi-camera 11, and the components attached to each head 4H are recognized (step S43). Then, based on the recognition results of the FID marks FM1 and FM2 attached to the unit mounting area 62 where mounting is to be performed, the movement correction amount for each head 4H is determined, and the components attached to each head 4H are mounted in the unit mounting area 62 (step S44).

[0094] Next, it is determined in step S34 whether the mounting of components to the next work area, i.e., all planned unit mounting areas 62, has been completed (step S45). If component mounting is not completed (NO in step S45), the process returns to step S40 and is repeated. On the other hand, if component mounting is completed (YES in step S45), a record of the production time during the current thermal expansion correction interval is registered (step S46). The registration destination is a production capacity history database, which includes the current production product history data D1 and the history data D2 common to all product types. This database is held, for example, in the storage unit 75 of the control device 7 or on an external server.

[0095] On the other hand, if the timing for performing thermal expansion correction arrives in step S40 (YES in step S40), the recording of production time, which started in step S38, is stopped (step S47). The relationship between the number of components mounted and the production time at this point may be recorded in the production capacity history database. After that, thermal expansion correction is performed (step S32). A YES determination in step S40 means that the timing for the next thermal expansion correction has arrived before component mounting is completed in all of the estimated next work areas. The recognition result of the FID mark FM for the unit mounting area 62 where component mounting could not be performed will be reset by the execution of step S33.

[0096] Furthermore, in step S41, if recognition of a new FID mark FM is required (YES in step S41), it is determined whether or not current production history data D1 exists for the substrate type that was produced immediately before (step S48). If current production history data D1 does not exist (YES in step S48), that is, if it is a substrate type that is being produced for the first time, a database of current production history data D1 for that substrate type is created (step S49). From there, this database is updated. After that, the recording of production time is stopped (step S47), and the process returns to step S32 to perform thermal expansion correction.

[0097] Thus, after a YES determination in step S41, the process proceeds to step S32. This flow means that if the component mounting work for the unit mounting area 62 identified as the next work area is completed early, the predetermined period of thermal expansion correction is changed and the next thermal expansion correction is executed. As shown in this embodiment, the cycle time can be improved by flexibly changing the timing of the thermal expansion correction control instead of fixing it. The fact that the component mounting work was completed early is reflected in the current production variety history data D1 and is used in the estimation process of the next work area performed by the estimation processing unit 79.

[0098] As a variation of the above flow, in addition to all the FID mark FMs included in the next work area estimated by the estimation processing unit 79, additional FID mark FMs in unworked areas other than the next work area may be imaged. The additional FID mark FMs to be imaged are those corresponding to a predetermined margin selected from the unworked areas of the substrate PA. These marginal FID mark FMs may also be extracted as marks to be recognized in step S34.

[0099] As explained in step S41 above, the component mounting work for the next work area may be completed earlier than scheduled. In this case, there may be some buffer time before the next thermal expansion correction. The above flow shows an example where the next thermal expansion correction is performed earlier if the component mounting work is completed early. Alternatively, if the buffer FID mark FM is recognized in advance, the head 4H can be made to perform work on a portion of the unworked area if the buffer time arises. However, if the buffer time does not arise, the recognition result of the buffer FID mark FM will be reset, so it is desirable not to recognize an excessive amount of buffer. [Explanation of symbols]

[0100] 1. Component mounting equipment (PCB work equipment) 10 bases 24 X-axis fixed rail (moving axis) 25 Y-axis fixed rail (moving axis) 26 X-axis servo motor (head movement mechanism) 27. Ball screw shaft (moving shaft) 28. Y-axis servo motor (head movement mechanism) 29. Ball screw shaft (moving shaft) 4 Head Units 4H head (working head / mounting head) 5. Circuit board recognition camera (camera) 62 Unit Implementation Area 7 Control device 71 Imaging control unit 74 Main Control Unit (Control Unit) 76 Recognition Control Unit 77 Movement Correction Unit 78 Thermal compensation section 79 Estimation Processing Unit FM FID mark (circuit board recognition mark) M1, M2, M3 reference marks P board PA multi-beveled substrate WA1, WA2 Next work area

Claims

1. A head unit equipped with a work head that performs predetermined operations on a circuit board having a circuit board recognition mark, A head movement mechanism that moves the head unit horizontally along a movement axis set on a base, A camera mounted on the head unit and capable of capturing the circuit board recognition mark, The system includes a control unit that controls the imaging operation of the camera and controls the movement of the head unit along the movement axis, The control unit, Thermal compensation control that calibrates the positional displacement due to thermal deformation of the moving axis at a predetermined period, The camera is used to sequentially capture images of multiple substrate recognition marks, and the relative positional relationship between the substrate and the work head is recognized, thereby determining the amount of movement correction for the work head. Prior to the aforementioned movement correction control, between the current thermal correction control and the next thermal correction control, an estimation control is performed to estimate the next work area on the substrate in which the work head can perform work on the substrate. In the aforementioned movement correction control, the camera is instructed to capture all of the substrate recognition marks included in the next work area, while at least some of the substrate recognition marks included in the unworked areas other than the next work area are omitted from being captured in the substrate work apparatus, The control unit, in the movement correction control, causes the device to capture images of all the substrate recognition marks included in the next work area, as well as a number of substrate recognition marks corresponding to a predetermined margin selected from the unworked area.

2. In the substrate processing apparatus according to claim 1, The control unit omits imaging of more than half of the substrate recognition marks included in the unworked area in the movement correction control, substrate work apparatus.

3. In the substrate processing apparatus according to claim 1, A substrate work apparatus in which the control unit omits imaging of all substrate recognition marks included in the unworked area in the movement correction control.

4. In the substrate processing apparatus according to claim 1, A substrate work apparatus in which the control unit estimates the next work area based on past work performance of the same type of work or similar work performance by the work head in the estimation control.

5. A head unit equipped with a work head that performs a predetermined operation on a substrate having a substrate recognition mark, A head movement mechanism that moves the head unit horizontally along a movement axis set on a base, A camera mounted on the head unit and capable of capturing the circuit board recognition mark, The system includes a control unit that controls the imaging operation of the camera and controls the movement of the head unit along the movement axis, The control unit, Thermal compensation control that calibrates the positional displacement due to thermal deformation of the moving axis at a predetermined period, The camera is used to sequentially capture images of multiple substrate recognition marks, and the relative positional relationship between the substrate and the work head is recognized, thereby determining the amount of movement correction for the work head. Prior to the aforementioned movement correction control, between the current thermal correction control and the next thermal correction control, an estimation control is performed to estimate the next work area on the substrate in which the work head can perform work on the substrate. In the aforementioned movement correction control, the camera is instructed to capture all of the substrate recognition marks included in the next work area, while at least some of the substrate recognition marks included in the unworked areas other than the next work area are omitted from being captured in the substrate work apparatus, The control unit, when the work of the work head on the next work area identified by the estimation control is completed early, changes the predetermined cycle and executes the next thermal compensation control, in a substrate work apparatus.

6. In the substrate processing apparatus according to claim 1, The base is fitted with reference marks for calibrating thermal deformation. The control unit measures the amount of thermal deformation of the moving axis in the thermal compensation control by having the camera capture an image of the reference mark, in a substrate work apparatus.

7. A head unit equipped with a mounting head for mounting components onto a substrate having a substrate recognition mark, A head movement mechanism that moves the head unit horizontally along a movement axis set on a base, A camera mounted on the head unit and capable of capturing the circuit board recognition mark, The system includes a control unit that controls the imaging operation of the camera and controls the movement of the head unit along the movement axis, The control unit, Thermal compensation control that calibrates the positional displacement due to thermal deformation of the moving axis at a predetermined period, The camera is used to sequentially capture images of multiple substrate recognition marks, and the relative positional relationship between the substrate and the mounting head is recognized to determine the amount of movement correction for the mounting head, thereby enabling movement correction control. Prior to the aforementioned movement correction control, between the current thermal correction control and the next thermal correction control, an estimation control is performed to estimate the next working area on the substrate in which the mounting head can perform component mounting on the substrate. In the aforementioned movement correction control, the camera is instructed to capture all of the substrate recognition marks included in the next work area, while at least some of the substrate recognition marks included in the unworked areas other than the next work area are omitted from being captured in the substrate work apparatus, The control unit, In the estimation control described above, the next work area is estimated by referring to the production capacity history data of the component mounting board by the mounting head and calculating the number of components that can be mounted on the board within the time between the current thermal compensation control and the next thermal compensation control. As the aforementioned production capacity history data, the current production variety history data, which is the history of the currently produced substrate varieties, is referred to. A circuit board processing apparatus that, if the aforementioned current production variety history data does not exist, refers to common history data obtained from the history of all varieties produced in the past as the production capacity history data.

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