Contact probe and its contact element, method for manufacturing the contact element, probe system using the contact element, method for testing an unpackaged semiconductor device, and tested semiconductor device and method for manufacturing the same.

Abstract

To provide a contacting member of a contact probe for a probe system for performing a functionality test to a measurement object.SOLUTION: A contacting member includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the measurement object when performing a functionality test to the measurement object, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the measurement object is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a contact probe used for inspecting and measuring electronic components, and particularly to a contact probe having a three-dimensional tip (3D tip), a contact thereof, a method for manufacturing the contact, a probe system using the contact, a method for testing an unpackaged semiconductor device, and a tested semiconductor device and a method for manufacturing the same.

Background Art

[0002] The contacts of current contact probes having three-dimensional tips are made by microelectromechanical technology, and a three-dimensional tip structure is constructed. Alternatively, a three-dimensional tip structure is formed by bending a planar contact. The contacts made by these methods have problems in accuracy and structural strength.

[0003] Specifically, the contacts made by microelectromechanical technology are formed by stacking materials layer by layer. Particularly, in the case of the contact tip portion of the contact directly formed in this way, this stacking process is difficult to accurately align between each layer. Therefore, problems occur in the accuracy of the tip (that is, the contact tip portion). To explain more clearly, it can be ensured that the final structure is accurately formed by accurately aligning each layer with the previous layer. Any inaccurate alignment will lead to a decrease in accuracy. However, the stacking process of the microelectromechanical manufacturing process is difficult to accurately align between each layer. Therefore, it causes a decrease in the accuracy of the final product.

[0004] In addition, the manufacturing method of forming a three-dimensional tip structure by bending a planar contact has significant folds and curves (bonding wires and minute slits) in the bent portion, resulting in stress concentration in the material, a decrease in the structural integrity of the contact, a decrease in the structural strength of the contact, and a short lifespan.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present invention was made to solve the above-mentioned problems and aims to provide a contact element for a contact probe and a method for manufacturing the same, which eliminates the need for micro-electromechanical technology or bending of the contact element, and which has good accuracy, high structural strength, and a relatively long lifespan. [Means for solving the problem]

[0006] To achieve the above-mentioned objectives, the contact element of the contact probe according to the present invention is used in a probe system for performing functional tests on an object to be measured. The contactor comprises a main body, a contact tip, and a tip transition section located between the main body and the contact tip, wherein the contact tip has a contact end used to contact the object to be measured. The contactor has a top side and a bottom side, and when the contactor performs a functional test on the object to be measured, the bottom side of the contactor faces the object to be measured. The bottom side of the contactor includes a lower surface located on the main body, a tip bottom surface located on the contact tip, and a tip transition surface located on the tip transition section. The contact end is located in front of the tip bottom surface, has a step between the rear of the tip bottom surface and the lower surface, and the tip transition surface has a gradually changing height and extends from the lower surface to the rear of the tip bottom surface.

[0007] As a result, the bottom side of the contactor of the present invention (i.e., the side facing the object being measured) has a step between the contact tip and the main body. That is, it has a so-called three-dimensional needle-tip structure, which is advantageous for the contact end of the contact tip to contact the contact pad of the object being measured, thereby improving the accuracy and reliability of the test. Furthermore, there is a tip transition section between the contact tip and the main body, and the height of this tip transition surface changes gradually, extending from the lower surface to the tip bottom surface. That is, the tip transition surface does not have a vertical surface or other abrupt transition, but smoothly connects the lower surface with a step to the tip bottom surface. Such a contactor cannot be formed by stacking layers or bending using micro-electromechanical technology, and must be formed by other processing methods. Therefore, problems such as poor accuracy, stress concentration, poor structural strength, and short lifespan that occur with micro-electromechanical technology or bending can be avoided. In addition, the smooth tip transition surface described above reduces stress concentration, improves structural integrity, and further improves the durability and reliability of the contactor.

[0008] Preferably, the contact is formed by cutting the substrate having the step. That is, the step of the contact is an inherent step of the substrate, and not a step of the contact formed by stacking layers by micro-electromechanical technology. Such a contact is integrally molded and does not need to be bent, and the shape of the contact can be defined by the cutting process. Therefore, stress concentration is reduced, structural integrity is improved, and it has high structural strength and a long lifespan. The cutting process can be laser cutting, electrical discharge cutting, etc., and can accurately cut the desired shape of the contact. In particular, the positional accuracy of the contact end of the contact tip is good. That is, it can be accurately aligned with the contact pad of the object being measured, which is advantageous for conducting tests.

[0009] Preferably, the tip transition surface includes a gradually changing transition surface and / or an inclined plane.

[0010] As a result, the gradual transition surface can achieve a smooth step without abrupt changes in curvature, as the radius of curvature gradually changes according to the length being stretched. An inclined surface can also achieve a certain degree of smooth step formation. Both reduce stress concentration, improve structural integrity, and further enhance the structural strength of the contact. Depending on the manufacturing process, the tip transition surface may be a gradual transition surface, an inclined plane, or may include both a gradual transition surface and an inclined plane simultaneously.

[0011] Preferably, the surface roughness of the lower surface and the tip transition surface is different from the surface roughness of the tip bottom surface.

[0012] Thus, the step can be formed by performing a surface sedimentation process on a single plane. For example, if the contact is formed from a substrate having the step through a cutting process, the substrate is formed from a single flat plate through a surface sedimentation process. As a result, a relatively low surface and a transition surface with gradually changing height are formed. The surface sedimentation process can be chemical etching, laser etching, etc., and is performed so that the surface roughness of the relatively low surface and the transition surface differs from the surface roughness of the original flat plate. After the substrate is processed into a contact through the cutting process, the relatively low surface and the transition surface become the lower surface and the tip transition surface of the contact, respectively. This facilitates the manufacture of a substrate with the desired step and transition surface, and improves the accuracy and structural strength of the created contact.

[0013] Preferably, the main body includes a thin-walled section, a thick-walled section, and a main body transition section located between the thin-walled section and the thick-walled section. The lower surface is located in the thin-walled section. The bottom side of the contactor further includes a main body bottom surface located in the thick-walled section of the main body, and a main body transition surface located in the main body transition section. There is a step between the main body bottom surface and the lower surface. The main body transition surface has a gradually changing height and extends from the lower surface to the main body bottom surface.

[0014] As a result, the main body of the contactor also has a step, and its thin-walled section is located close to the contact tip. Therefore, it is still possible to form a so-called three-dimensional needle tip structure. The contact tip is advantageous for contacting the contact pad of the object being measured. Therefore, the accuracy and reliability of the test can be improved. The body of the contactor is formed to be relatively thick in the section away from the contact tip, which increases the structural strength of the body of the contactor and is advantageous for constructing a contact probe by fixing the body of the contactor to other members. In addition, the step in the body of the contactor arises from the step inherent in the substrate. Such a method of manufacturing contactors does not require micro-electromechanical technology or bending of the contactor, and the contactor has good accuracy, high structural strength and a relatively long lifespan. The body has a body transition section between the thin-walled section and the thick-walled section, and the height of the body transition surface changes gradually, smoothly connecting the stepped lower surface and the bottom surface of the body, reducing stress concentration, improving structural integrity, and further improving the durability and reliability of the contactor.

[0015] Preferably, the transition surface of the main body includes a gradually changing transition surface and / or an inclined plane.

[0016] This allows the transition surface of the main body to achieve a smooth step, reducing stress concentration, improving structural integrity, and further enhancing the structural strength of the contact. Depending on the manufacturing process, the transition surface of the main body may be a gradually changing transition surface, an inclined plane, or may include both a gradually changing transition surface and an inclined plane simultaneously.

[0017] Preferably, the surface roughness of the lower surface, the tip transition surface, and the main body transition surface is different from the surface roughness of the bottom surface of the main body.

[0018] As a result, the step between the contact tip and the main body, and the step within the main body itself, can be formed by performing a surface settling process on a single plane. For example, if the contact is formed from a substrate having the step through a cutting process, the substrate is similarly formed from a single flat plate through a surface settling process. Thus, a relatively low surface and two transition surfaces located on opposite sides of it, with gradually changing heights, are formed, and the surface roughness of the relatively low surface and the transition surfaces differs from the surface roughness of the original flat plate. After the substrate is processed into a contact through the cutting process, the relatively low surface and the transition surfaces become the lower surface, the tip transition surface, and the main body transition surface of the contact, respectively. This facilitates the manufacture of substrates with the desired step and transition surfaces, and results in good accuracy and structural strength of the created contact.

[0019] Preferably, the device further comprises an extension section located between the main body and the tip transition section. The main body has a width wider than the width of the extension section, the tip transition section, and the contact tip. A portion of the lower surface is located in the extension section.

[0020] This means that the tip transition section is not limited to direct connection to the main body. An extension section may exist between the two. Part of the lower surface is located in the extension section. That is, at the bottom of the contactor, the extension section and the main body share the same plane. However, the extension section is narrower than the main body. Such an extension section provides greater elasticity when the contact tip contacts the contact pad of the object being measured, which is advantageous for the progress of the test.

[0021] Preferably, the lower surface is flat.

[0022] As described above, the step can be formed by performing a surface sedimentation process on a single plane. The surface sedimentation process can form the relatively low surface. The relatively low surface is used to form the lower surface of the contactor. By making the relatively low surface flat, the lower surface of the contactor can be made flat. This is not only easy to manufacture but also has good structural integrity and structural strength.

[0023] Preferably, the top side of the contactor has an upper surface located on the main body and a tip top surface located on the contact tip. The tip top surface extends from the upper surface to the contact end so as to be inclined with respect to the upper surface.

[0024] As a result, the top surface of the contact is originally flat, and then the tip surface is formed by, for example, polishing. For example, if the contact is formed from a substrate having a step through a cutting process, the top surface of the contact is formed by the flat surface of the substrate. After the shape of the contact is defined by the cutting process, the tip surface can be formed on the top surface of the contact by, for example, polishing. This allows the shape of the contact tip to be adjusted so that the contact end is positioned in a desirable location, allowing it to be accurately aligned with the contact pad of the object being measured, which is advantageous for conducting tests.

[0025] Furthermore, the contact probe according to the present invention is used in a probe system for performing a functional test on a measurement object, and includes a coaxial cable and a plurality of the above-described contacts. The coaxial cable includes an inner electrical conductor, an outer electrical conductor, and a dielectric provided between the inner electrical conductor and the outer electrical conductor. Among the plurality of contacts, the top side of each contact has an upper surface located on the main body portion. By fixing a part of the upper surface of each contact to the coaxial cable, the main body portion of each contact extends from the position fixed to the coaxial cable, passes through the end of the coaxial cable, and each contact includes a cantilever segment extending from the end of the coaxial cable. The contact tip of each contact is located at the end of the cantilever segment. The bottom surfaces of the tips of the plurality of contacts are flush with each other. Among the plurality of contacts, one first contact and at least one second contact are included. The upper surface of the first contact is electrically connected and fixed to the inner electrical conductor of the coaxial cable. The upper surface of the second contact is electrically connected and fixed to the outer electrical conductor of the coaxial cable.

[0026] Thereby, the coaxial cable transmits test signals and ground signals through the inner electrical conductor and the outer electrical conductor, so that the first contact and the second contact electrically connected to the inner electrical conductor and the outer electrical conductor achieve good impedance matching. Such a contact probe can be used for high-frequency tests. In addition, since the contacts have good accuracy and high structural strength, they have a long lifespan, and the accuracy and reliability of the test are improved.

[0027] Furthermore, the contact probe according to the present invention is used in a probe system for performing a functional test on a measurement object, and includes a circuit board and a plurality of the aforementioned contacts. The circuit board includes a plurality of electrical conduction circuits. Among the plurality of contacts, the top side of each contact has an upper surface located on the main body portion. A part of the upper surface of each contact is electrically connected and fixed to the electrical conduction circuit of the circuit board, so that the main body portion of each contact extends from the position fixed to the circuit board, passes through the end of the circuit board, and each contact includes a cantilever segment extending from the end of the circuit board. The contact tip of each contact is located at the end of the cantilever segment. The bottom surfaces of the tips of the plurality of contacts are flush with each other.

[0028] Thereby, the circuit board transmits test signals and ground signals via different electrical conduction circuits, so that the first contact and the second contact electrically connected to the electrical conduction circuit achieve good impedance matching. Such a contact probe can be used for high-frequency tests. In addition, the contacts are accurate and have high structural strength, so they have a long lifespan and improve the accuracy and reliability of the test.

[0029] Furthermore, the method for manufacturing the contact according to the present invention includes the following steps 1 and 2. The contact is used in a contact probe for performing a functional test on a measurement object.

[0030] Step 1: Provide a substrate. The substrate is made of an electrically conductive material and includes a thin block, at least one thick block, and at least one transition block extending with a gradually increasing thickness from the thin block to the thick block. The upper side of the substrate includes a first surface located on the thin block, at least one second surface located on the thick block, and at least one transition surface located on the transition block. The second surface is higher than the first surface. The transition surface extends with a gradually changing height from the first surface to the second surface.

[0031] Step 2: Define the multiple contacts by removing some of the material from the substrate. The step of defining a plurality of contacts includes the step of defining the contact tip portion of each contact in the thick block of the substrate, the step of defining the body portion of each contact in the thin block of the substrate, and the step of cutting the substrate based on the external contours of the plurality of contacts.

[0032] Thus, the aforementioned manufacturing method is used to manufacture the aforementioned contacts provided by the present invention. As a result, the contacts have high precision and structural strength, leading to a longer lifespan and improved test accuracy and reliability.

[0033] Preferably, the method for manufacturing a contactor further includes the steps of shaping the contact tip of each contactor and forming a tip top surface, a tip bottom surface, and a contact end located where the tip top surface and the tip bottom surface intersect and used to contact the object to be measured.

[0034] This allows the shape of the contact element to be defined, after which the tip top and tip bottom surfaces of the contact member are formed, for example, by polishing. Thus, the shape of the contact tip is refined, the contact end is positioned in the desired location, the accuracy of the contact end is improved, and it can be accurately aligned with the contact pad of the object being measured, thus facilitating testing.

[0035] Preferably, the substrate includes two transition blocks located on opposite sides of the thin block, and two thick blocks connected to the two transition blocks, respectively. The upward side of the substrate includes two second surfaces located on the two thick blocks, and two transition surfaces located on the two transition blocks, respectively. The step of defining the plurality of contacts includes defining the contact tip of each contact on one of the two thick blocks, and defining the body of each contact on the thin block and the other of the two thick blocks.

[0036] In other words, the upward side of the substrate has two relatively high second surfaces and one relatively low first surface located between the two second surfaces. Between the two second surfaces and the one first surface, there are transition surfaces whose height gradually decreases. Of these, the contact tip of each contact defined by the thick block can form a so-called three-dimensional needle-tip structure, which is advantageous for the contact end of the contact tip to contact the contact pad of the object being measured, thereby improving the accuracy and reliability of the test. By defining the body of each contact with the thin block and the other of the two thick blocks, the body of the contact is formed to be relatively thick in the section away from the contact tip, which can increase the structural strength of the body of the contact, and is advantageous for constructing a contact probe by fixing the body of the contact to other members.

[0037] Preferably, the substrate is formed from a single flat plate through a surface sedimentation process. The first surface and the transition surface are formed by the surface sedimentation process, and the surface roughness of the first surface and the transition surface differs from the surface roughness of the second surface. The surface sedimentation process is performed prior to the step of defining the plurality of contacts by removing a portion of the substrate material.

[0038] As a result, the surface deposition process can include chemical etching, laser etching, etc., and the surface roughness of the generated first surface and transition surface differs from the surface roughness of the original second surface of the plate. Such a method can easily manufacture a substrate having the desired steps and transition surface, and can improve the accuracy and structural strength of the resulting contacts.

[0039] Furthermore, the probe system according to the present invention is used to perform a functional test on an object to be measured formed on a substrate. The object to be measured includes a plurality of contact pads. The probe system comprises a mounting base and a contact probe. The mounting base is positioned to support the substrate. The contact probe includes a plurality of the contacts described in claim 1, and the contact ends of the contacts contact the contact pads of the object to be measured, thereby electrically connecting the contact probe and the object to be measured, and is used to perform a functional test on the object to be measured.

[0040] As a result, the aforementioned probe system employs the aforementioned contacts provided by the present invention, which offer good accuracy, high structural strength, and a long service life, thereby improving the accuracy and reliability of the probe system's testing.

[0041] Furthermore, the test method according to the present invention is a test method for unpackaged semiconductor devices and includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe. The contact probe includes multiple of the aforementioned contactors. Step 2: The contactor is brought into mechanical and electrical contact with multiple contact pads of an unpackaged semiconductor device. Step 3: Test the unpackaged semiconductor device using at least one of the contact probes.

[0042] As a result, the contact probe used in the aforementioned test method includes the contactor according to the present invention, which has good accuracy, high structural strength, and a long service life, and can improve the accuracy and reliability of testing unpackaged semiconductor devices.

[0043] Furthermore, the tested method for manufacturing a semiconductor device according to the present invention includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe. The contact probe includes multiple of the aforementioned contactors. Step 2: The multiple contacts are brought into mechanical and electrical contact with multiple contact pads of an unpackaged semiconductor device. Step 3: Test the unpackaged semiconductor device using at least one of the contact probes.

[0044] As a result, semiconductor devices manufactured by the aforementioned manufacturing method are tested. The testing utilizes the contacts according to the present invention, which offer good accuracy, high structural strength, and a long service life, improving the accuracy and reliability of the test results for semiconductor devices.

[0045] Furthermore, the tested semiconductor device according to the present invention comprises a plurality of contact pads, and a test process is performed by mechanical and electrical contact with at least one contact probe. The contact probe includes a plurality of the aforementioned contacts. The test process is performed by the contact ends of the plurality of contacts contacting the plurality of contacts with the plurality of contact pads.

[0046] As a result, the aforementioned semiconductor device has been tested. The test utilizes the contacts according to the present invention, which offer good accuracy, high structural strength, and a long service life, improving the accuracy and reliability of the test results for the semiconductor device.

[0047] The contact probe and its contactor, the method for manufacturing the contactor, the probe system using the contactor, the method for testing an unpackaged semiconductor device, and the detailed structure, features, assembly, or use of the tested semiconductor device and the method for manufacturing the same will be described in the description of embodiments for carrying out the invention below. However, those with general skill in the art of the present invention should understand that such detailed descriptions and the specific embodiments listed for carrying out the invention are merely illustrative of the invention and not intended to limit the scope of the claims of the present invention. [Brief explanation of the drawing]

[0048] [Figure 1] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 2] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 3] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 4] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 5] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 6] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 7] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 8] This is a schematic diagram showing a side view of a probe system according to the first embodiment of the present invention. [Figure 9] This is a schematic diagram showing the bottom surface of the coaxial cable of the contact probe of the probe system according to the first embodiment of the present invention. [Figure 10] This is a schematic diagram showing a contact element and a local part of the object to be measured according to the first embodiment of the present invention. [Figure 11] This is a schematic diagram showing a side view of a probe system according to a second embodiment of the present invention. [Figure 12] This is a schematic diagram showing the bottom surface of the circuit board of the contact probe of the probe system according to the second embodiment of the present invention. [Figure 13] This is a schematic diagram showing a method for manufacturing a contactor according to a third embodiment of the present invention. [Figure 14] This is a schematic diagram showing a method for manufacturing a contactor according to a third embodiment of the present invention. [Figure 15] This is a schematic diagram showing a method for manufacturing a contactor according to a third embodiment of the present invention. [Figure 16] This is a schematic diagram showing a contact element and a local part of the object to be measured according to a third embodiment of the present invention. [Figure 17] This is a schematic three-dimensional view showing a local portion of a contactor according to the fourth embodiment of the present invention. [Modes for carrying out the invention]

[0049] The applicant hereby states that in the embodiments and drawings described below, the same reference numerals represent the same or similar components or their structural features. It should be noted that the components and structures in the drawings are not illustrated based on actual proportions and quantities for illustrative purposes, and that features of different embodiments may be interchangeable where applicable. Furthermore, when referring to one component being mounted on another, it means either that the aforementioned component is directly mounted on the other component, or that the aforementioned component is indirectly mounted on the other component, i.e., one or more other components are located between the two components. When a component is "directly" mounted on another component, it means that no other components are located between the two components.

[0050] (First Embodiment) As shown in Figures 1 to 8, the method for manufacturing a contact according to the first embodiment of the present invention is used to manufacture contacts 40A and 40B of a contact probe 30 (see Figure 5). The manufacturing method includes the following steps a) to c).

[0051] Step a): As shown in Figures 1 to 3, a single substrate 50 is provided. The substrate 50 is made of an electrically conductive material. The substrate 50 includes a thin-walled block 51, a thick-walled block 52, and a transition block 53 that extends from the thin-walled block 51 to the thick-walled block 52 with gradually increasing thickness. One upward side 54 of the substrate 51 includes a first surface 541 located in the thin-walled block 51, a second surface 542 located in the thick-walled block 52, and a transition surface 543 located in the transition block 53. The second surface 542 is higher than the first surface 541. The transition surface 543 extends from the first surface 541 to the second surface 542 with gradually changing height.

[0052] Furthermore, the substrate 50 provided in this step is shown in Figures 2 and 3. The substrate 50 is formed from a single flat plate 61 as shown in Figure 1 through a surface sedimentation process. The surface sedimentation process includes chemical etching, laser etching, etc., and is used to reduce the local thickness of the flat plate 61, so that a local surface of a plane 611 facing upwards on the flat plate 61 is sedimented, forming the first surface 541 and the transition surface 543 of the substrate 50. The portion of the plane 611 of the flat plate 61 that has not been sedimented forms the second surface 542 of the substrate 50. Therefore, the surface roughness of the first surface 541 and the transition surface 543 formed through the surface sedimentation process is different from the surface roughness of the second surface 542 obtained from the original plane 611 of the flat plate 61. This surface sedimentation process allows for the rapid and easy manufacture of the desired substrate 50. The first surface 541 and the second surface 542 have a predetermined step difference, and the transition surface 543 smoothly connects the first surface 541 and the second surface 542. for example, The thin-walled block 51 has a thickness of 60 microns, the thick-walled block 52 has a thickness of 80 microns, and the step height d is 20 microns. Surface roughness is the step height (roughness) of the surface contour. Specifically, the absolute deviation of the actual surface contour is the average value (Ra) relative to the mean line. Therefore, differences in the surface of objects can be clearly seen under a microscope. For example, differences in gloss and brightness. Furthermore, differences in surface roughness include differences in the surface of objects that are clearly visible under a microscope (for example, differences in gloss and brightness) even after undergoing a surface coating process (for example, after undergoing a plating process).

[0053] Step b): As shown in Figures 4 and 5, multiple contacts 40A and 40B are defined by removing some of the material from the substrate 50. The steps for defining the contacts 40A and 40B include defining the contact tip portion 41 of each contact 40A and 40B in a thick block 52 of the substrate 50, defining the body portion 42 of each contact 40A and 40B in a thin block 51 of the substrate 50, and cutting the substrate 50 based on one external contour C of the contacts 40A and 40B.

[0054] As shown in Figures 4 and 5, the manufacturing method according to this embodiment simultaneously manufactures three contacts 40A and 40B. In this step, cutting is performed based on the external contour C jointly formed by the three contacts 40A and 40B, and each contact 40A and 40B is cut based on a desired shape. In the cutting step, the position of the contact tip 41 relative to the main body 42 can be adjusted as needed, and it is not necessarily required that the contact tip 41 be positioned in the center of one end face of the main body 42. As shown in Figure 5, the three contacts 40A and 40B include one relatively short contact 40A (also referred to as the first contact in this invention) and two relatively long contacts 40B (also referred to as the second contacts in this invention), with contact 40A located between contacts 40B. In this step, the contact tips 41 of the three contacts 40A and 40B are connected by one connecting portion 62, and the main body 42 of contact 40B is connected by one connecting portion 63. When the manufacturing of contacts 40A and 40B is complete, the connection portion 62 is removed or separated by the shaping step of the contact tip portion described later, and the contact tip portions 41 of contacts 40A and 40B are spaced apart from each other. The three contacts 40A and 40B shown in Figure 5 constitute a single probe having three probe tips. Depending on the test requirements, the probe may contain any appropriate number of probe tips. For example, it may contain one probe tip, two probe tips, three probe tips, or three or more probe tips. Generally, when it contains two probe tips, it includes one signal probe tip and one ground probe tip, and is also called a GS (ground-signal) probe tip configuration. Generally, when it contains three probe tips (as shown in Figure 5), it includes a signal probe tip located in the center (i.e., contact 40A) and a pair of ground probe tips located on either side of it (i.e., two contacts 40B), and is also called a GSG (ground-signal-ground) probe tip configuration. Figure 4 illustrates a single GSG probe on substrate 50 having an external contour C jointly formed by three contacts 40A and 40B, but is not limited to this. For example, multiple probes having the same and / or different external contours C can be defined on substrate 50.

[0055] When step b) is completed, the contacts 40A and 40B have the side shape shown in Figure 6. Each contact 40A and 40B includes a contact tip portion 41 formed by a thick block 52 of the substrate 50, a body portion 42 formed by a thin block 51 of the substrate 50, and a tip transition section 43 formed by a transition block 53 of the substrate 50 and located between the body portion 42 and the contact tip portion 41.

[0056] Step c): As shown in Figures 6 and 7, the step of sharpening the contact tips 41 of the contactors 40A and 40B includes, for example, polishing them with an abrasive cloth (lapping), which forms a tip top surface 411, a tip bottom surface 412, and a contact end 413 located where the tip top surface 411 and the tip bottom surface 412 intersect on each contact tip 41. The contact end 413 is used to contact one contact pad 231 (see Figure 10) of one object to be measured 23.

[0057] Here, the orientation of the contacts 40A and 40B in the manufacturing process and the orientation of their actual use, as shown in Figure 7, are as shown in Figure 10. More specifically, the contacts 40A and 40B have one top side 44 and one bottom side 45. Figure 7 shows the bottom side 45 facing upwards. When the contacts 40A and 40B perform a functional test on the object to be measured 23, the bottom side 45 of the contacts 40A and 40B faces the object to be measured 23, as shown in Figure 10.

[0058] As shown in Figures 7 and 10, the bottom side 45 of the contacts 40A and 40B includes a lower surface 421 located on the main body 42, a tip bottom surface 412 located on the contact tip 41, and a tip transition surface 431 located on the tip transition section 43. The contact end 413 is located on one front side 412a of the tip bottom surface 412. There is a step d between one rear side 412b of the tip bottom surface 412 and the lower surface 421. The tip transition surface has a gradually changing height and extends from the lower surface 421 to the rear side 412b of the tip bottom surface 412. The top side 44 of the contacts 40A and 40B has an upper surface 422 located on the main body 42, and a tip top surface 411 located on the contact tip 41. The tip top surface 411 extends from the upper surface 422 to the contact end 413 so as to be inclined with respect to the upper surface 422. The lower surface 421 of the main body 42 and the tip transition surface 431 of the tip transition section 43 are formed by the first surface 541 and the transition surface 543 of the substrate 50 shown in Figure 3, respectively. Therefore, the surface roughness of the lower surface 421 and the tip transition surface 431 differs from the surface roughness of the tip bottom surface 412, the tip top surface 411, or the upper surface 422. Furthermore, in the step of shaping the contact tip as described above, polishing is performed on the contact tip 41 of the contacts 40A and 40B along the imaginary lines 415 and 416 shown in Figure 6. First, polishing is performed along the imaginary line 415 to align the contact tips 413 of the contacts 40A and 40B. Then, polishing is performed along the imaginary line 416 so that the tip bottom surfaces 412 of the contacts 40A and 40B have similar flatness.

[0059] Step c) is performed after the shapes of the contacts 40A and 40B are defined in step b) in order to further refine the shape of the contact tip 41. This allows the contact end 413 to easily contact the contact pad 231 of the object to be measured 23, further adjusting the position of the contact end 413 so that it is precisely positioned in the desired location, further improving the accuracy of the contact end 413, allowing it to be precisely aligned with the contact pad 231 of the object to be measured 23, which is advantageous for testing. The tip bottom surface 412 formed in step c) does not have to be connected to the tip transition surface 431, and a portion of the plane 414 of the contact tip 41 shown in Figure 6 is retained so that the tip bottom surface includes the surface and a portion of the plane 414 formed in step c). Alternatively, the method for manufacturing the contacts of the present invention may not include step c). The contacts 40A and 40B that have not undergone the shaping step c) are as shown in Figure 6. Such contacts 40A and 40B can still contact the contact pad 231 of the object to be measured 23 with their contact ends at a right angle as shown in the upper right of Figure 6. In this case, the plane 414 is the bottom surface of the tip. As shown in Figure 10, when the front side 412a of the bottom surface 412 of the tip contacts the contact pad 231 of the object to be measured 23, the tip top surface 411 of the far end of each contact tip 41 is inclined backward from the vertical at a predetermined angle 450. Therefore, as shown in Figure 10, the tip top surface 411 extends inward at an obtuse angle 460 greater than 90 degrees relative to the upper surface 422 of the main body 42. For this reason, when an operator observes the contact tip 41 from above downwards through a microscope or video camera, they can observe the relative positional relationship between the contact end 413 and the contact pad 231, determine the relative position of each contact tip 41 with respect to the contact pad 231, and perform alignment.

[0060] As shown in Figure 8, the probe system 11 according to this embodiment comprises one mounting base 21 and one contact probe 30. The contact probe 30 comprises one base portion 31, one coaxial coupling 32 fixed to the base portion 31, a coaxial cable 33 electrically connected to the base portion 31 and the coaxial coupling 32, and the three contacts 40A and 40B described above. The three contacts 40A and 40B are arranged in parallel, and of these, only one contact 40B is shown in Figure 8, while the other two contacts 40A and 40B are shielded by contact 40B and are not visible in Figure 8.

[0061] Furthermore, the coaxial cable 33 is cut to have an oblique cut surface 331, so that the internal structure of the coaxial cable 33 is exposed over a relatively large area on the oblique cut surface 331. As shown in Figure 9, the coaxial cable 33 includes one inner electrical conductor 332, one outer electrical conductor 333, and a dielectric 334 provided between the inner electrical conductor 332 and the outer electrical conductor 333. The upper surfaces 422 of the contacts 40A and 40B are each partially fixed to the oblique cut surface 331 of the coaxial cable 33. For example, the oblique cut surface 331 of the coaxial cable 33 is at a 45-degree angle with respect to the horizontal plane, so that the mounting angle when the contacts 40A and 40B are fixed to the coaxial cable 33 is 45 degrees. That is, the upper surfaces 422 of the contacts 40A and 40B are at a 45-degree angle with respect to the horizontal plane. To explain more clearly, the upper surface 422 of contactor 40A (first contactor) is electrically connected to and fixed to the inner electrical conductor 332. The upper surfaces 422 of the two contactors 40B (second contactors) are electrically connected to and fixed to the outer electrical conductor 333, and are located in the two opposing blocks 333a and 333b of the inner electrical conductor 332, respectively. The main body portions 42 of the three contactors 40A and 40B all extend from a position fixed to the obliquely cut surface 331 to the left side of Figure 9, passing through the end 335 of the coaxial cable 33, so that each contactor 40A and 40B includes a cantilever segment 46 extending from the end 335 of the coaxial cable 33 (see Figure 8). The cantilever segment 46 includes part of the main body portion 42, as well as the entire tip transition section 43 and contact tip 41. The contact tip 41 is located at one end 461 of the cantilever segment 46. The bottom surfaces 412 of the tips of the three contacts 40A and 40B are flush with each other. The manufacturing method described above allows for the simultaneous manufacturing of the three contacts 40A and 40B, thus easily achieving the flushness of the contacts 40A and 40B.

[0062] As shown in Figure 8, the probe system 11 is used to perform functional tests on an object under test 23 (see Figure 10) formed on a single substrate 22. The substrate 22 is supported by the mounting stage 21 of the probe system 11. For example, the substrate 22 is a single wafer, and the object under test 23 is an unpackaged semiconductor device on the wafer. Since the object under test 23 is actually very small, it is not shown in Figure 8, but is schematically illustrated in Figure 10. The object under test 23 has multiple contact pads 231, and only one of these contact pads 231 is schematically shown in Figure 10. The contact probe 30 is electrically connected to the object under test 23 by the contact of the contact pad 231 of the object under test 23 with the bottom surface 412 of the tip of the contacts 40A and 40B. At this time, the bottom surfaces 412 of the tip portions 40A and 40B are inclined slightly upward (for example, at an angle of less than 7 degrees) relative to the surface of the contact pad 231 of the object under test 23 (see Figure 10). When the coaxial coupling 32 of the contact probe 30 is electrically connected to a test device (not shown) via another coaxial cable (not shown), the contacts 40A and 40B make contact with the contact pad 231 of the object under test 23, thereby enabling a functional test of the object under test 23. In the coaxial cable 33, the inner electrical conductor 332 is used to transmit the test signal, and the outer electrical conductor 333 is used to transmit the ground signal, so that contact 40A transmits the test signal and contact 40B transmits the ground signal. By arranging contacts 40B, which transmit the ground signal, parallel and spaced apart on both sides of contact 40A, which transmits the test signal, a transmission line with a desirable impedance matching effect can be formed, a good impedance matching effect can be obtained, and the contact probe 30 can be used for high-frequency testing.

[0063] As a result, the bottom side 45 of the contactor 40A, 40B of the present invention (i.e., the side facing the object to be measured 23) has a step d between the contact tip 41 and the main body 42. That is, it has a so-called three-dimensional needle-tip structure, which is advantageous for the contact end 413 of the contact tip 41 to contact the contact pad 231 of the object to be measured 23, thereby improving the accuracy and reliability of the test. Furthermore, there is a tip transition section 43 between the contact tip 41 and the main body 42, and the tip transition surface 431 has a gradually changing height and extends from the lower surface 421 of the main body 42 to the tip bottom surface 412. That is, the tip transition surface 431 does not have a vertical surface or other abrupt transition, but smoothly connects the lower surface 421 with the step d and the tip bottom surface 412. Thus, stress concentration is reduced, structural integrity is improved, and the contactor 40A, 40B have good structural strength, good durability, and good reliability.

[0064] Furthermore, the contacts 40A and 40B are formed from a substrate 50 having a step d through a cutting process. That is, in the contacts 40A and 40B, the step d between the contact tip 41 and the main body 42 is the inherent step of the substrate 50, and not a step of the contact formed by stacking layers by layer using micro-electromechanical technology. Such contacts 40A and 40B are integrally molded and do not need to be bent, and the shape of the contacts 40A and 40B can be defined by a cutting process. This reduces stress concentration, improves structural integrity, and ensures that the contacts 40A and 40B have high structural strength and a long lifespan. In addition, the cutting process (e.g., laser cutting, electrical discharge cutting) can accurately cut the desired shape of the contacts 40A and 40B. In particular, the positional accuracy of the contact end 413 of the contact tip 41 is good. That is, it can be accurately aligned with the contact pad 231 of the object to be measured 23, which is advantageous for conducting tests.

[0065] As shown in Figure 10, in this embodiment, the tip transition surfaces 431 of the contacts 40A and 40B include one gradually changing transition surface 432 and one inclined plane 433. The gradually changing transition surface 432 is directly connected to the lower surface 421 of the main body 42 and extends toward the rear side 412b of the tip bottom surface 412. The radius of curvature of the gradually changing transition surface 432 changes gradually according to the length it extends, and a step can be smoothly realized without abrupt changes in curvature. The inclined plane 433 is connected between the gradually changing transition surface 432 and the rear side 412b of the tip bottom surface 412 and has the effect of realizing a step to a certain extent smoothly. In other words, the gradually changing transition surface 432 has a relatively smooth effect in realizing a step and is more effective than the inclined plane 433 in reducing stress concentration. Both the gradually changing transition surface 432 and the inclined plane 433 reduce stress concentration, improve structural integrity, and further enhance the structural strength of the contacts 40A and 40B. Depending on the manufacturing process, the tip transition surface 431 may be a gradually changing transition surface 432 (e.g., generated by chemical etching), an inclined plane 433, or it may include both a gradually changing transition surface 432 and an inclined plane 433 simultaneously, as shown in this embodiment.

[0066] Furthermore, in this embodiment, the step d between the contact tip portion 41 and the main body portion 42 of the contacts 40A and 40B is formed by performing a surface sedimentation process on the flat surface 611 of the plate 61 as shown in Figure 1. This surface sedimentation process forms a planar first surface 541 (see Figure 3). Subsequently, the lower surfaces 421 of the contacts 40A and 40B are formed by the first surface 541. Therefore, the lower surfaces 421 of each contact 40A and 40B are a single plane. By making the first surface 541 planar, the lower surfaces 421 of the contacts 40A and 40B can be made planar. This manufacturing method is easy and ensures that the main body portions 42 of the contacts 40A and 40B have good structural integrity and structural strength.

[0067] (Second embodiment) The contacts 40A and 40B according to the present invention are not limited to application in the probe system 11 shown in Figure 8. For example, they can also be applied in the probe system 12 according to the second embodiment shown in Figure 11. The probe system 12 is similar to the probe system 11, the difference being that a different type of contact probe 70 is used. The contact probe 70 comprises a base portion 71, a coaxial coupling 72 fixed to the base portion 71, a circuit board 73 electrically connected to the base portion 71 and the coaxial coupling 72, and three contacts 40A and 40B similar to those in the first embodiment. The three contacts 40A and 40B are arranged parallel to one bottom surface 731 of the circuit board 73, of which only one contact 40B is shown in Figure 11, while the other two contacts 40A and 40B are shielded by the contact 40B and are not visible in Figure 11.

[0068] Furthermore, as shown in Figure 12, the bottom surface 731 of the circuit board 73 is provided with one electrical conduction circuit 732 and two electrical conduction circuits 733 located on opposite sides of the electrical conduction circuit 732. The upper surface 422 of the contact 40A (first contact) is electrically connected to and partially fixed to the electrical conduction circuit 732. The upper surfaces 422 of the two contacts 40B (second contacts) are each electrically connected to and partially fixed to the electrical conduction circuit 733. The main body portions 42 of the three contacts 40A and 40B all extend from their fixed position on the circuit board 73 to the left side in Figure 12, passing through the end 735 of the circuit board 73, so that each contact 40A and 40B includes a cantilever segment 46 extending from the end 735 of the circuit board 73 (see Figure 11). The cantilever segment 46 includes part of the main body portion 42, as well as the entire tip transition section 43 and contact tip portion 41. The contact tip 41 is located at one end 461 of the cantilever segment 46. The bottom surfaces 412 of the tips of the three contacts 40A and 40B are flush with each other.

[0069] In other words, the main difference between the contact probe 70 of this embodiment and the contact probe 30 of the first embodiment is that the coaxial cable 33 has been replaced with a circuit board 73. Such a contact probe 70 can also perform functional tests on the object under test 23. On the circuit board 73, the electrical conduction circuit 732 is used to transmit the test signal, and the electrical conduction circuit 733 is used to transmit the ground signal, with contactor 40A transmitting the test signal and contactor 40B transmitting the ground signal. By arranging contactor 40B, which transmits the ground signal, in parallel and spaced apart on both sides of contactor 40A, which transmits the test signal, a transmission line with a desirable impedance matching effect can be formed, a good impedance matching effect can be obtained, and the contact probe 70 can be used for high-frequency testing.

[0070] (Third embodiment) As shown in Figures 13 to 16, a third embodiment of the present invention provides contacts 40C and 40D in different forms (also referred to as the first contact and the second contact, respectively).

[0071] The manufacturing method for contacts 40C and 40D is similar to that for contacts 40A and 40B, and also includes steps a) to c). The main difference is that in this embodiment, the thin-walled block 51 of the substrate 50 shown in Figure 2 is replaced with a thin-walled block 55, a thick-walled block 56, and a transition block 57. As shown in Figures 13 and 14, in step a) of this embodiment, the substrate 50 provided includes one thin-walled block 55, transition blocks 53 and 57 located on opposite sides of the thin-walled block 55, and two thick-walled blocks 52 and 56 connected to the transition blocks 53 and 57, respectively. The transition blocks 53 and 57 are stretched with gradually increasing thickness from the thin-walled block 55 to the thick-walled blocks 52 and 56, respectively. Therefore, the upward side 54 of the substrate 50 includes a first surface 541 located in the thin-walled block 55, two second surfaces 542 located in the thick-walled blocks 52 and 56 respectively, and two transition surfaces 543 located in the transition blocks 53 and 57 respectively. Both second surfaces 542 are higher than the first surface 541 and have the same step difference d between them. The two transition surfaces 543 have the same shape and extend from the first surface 541 to the second surface 542 with their height gradually changing.

[0072] Furthermore, in this embodiment, the substrate 50 provided in step a) of this embodiment is similarly formed by a flat plate 61 shown in Figure 1 through a surface sedimentation process. The difference is that in this embodiment, the area of ​​the sedimented surface on the flat plate 611 is relatively small. A portion of the flat plate 61 is subjected to surface sedimentation, forming the first surface 541 and the transition surface 543 of the substrate 50. On the flat plate 611, the unsedimented surface becomes the second surface 542 of the substrate 50.

[0073] As shown in Figures 13 and 15, in step b) of this embodiment, the step of defining the contacts 40C and 40D includes the step of defining the contact tip portion 41 of each contact 40C and 40D with the thick-walled block 53, and the step of defining the main body portion 42 of each contact 40C and 40D with the thin-walled block 55, the transition block 57, and the thick-walled block 56. Then, in step c), the shape of the contact tip portion 41 of each contact 40C and 40D is adjusted so that the contacts 40C and 40D are as shown in Figure 16.

[0074] Thus, the contacts 40C and 40D according to this embodiment have a contact tip portion 41 and a tip transition section 43 similar to the contacts 40A and 40B described above. However, the main body portion 42 of the contacts 40C and 40D according to this embodiment includes a thin-walled section 423 formed by a thin-walled block 55 of the substrate 50, a thick-walled section 424 formed by a thick-walled block 56 of the substrate 50, and a main body transition section 425 formed by a transition block 57 of the substrate 50 and located between the thin-walled section 423 and the thick-walled section 424. The bottom side 45 of the contacts 40C and 40D has a tip bottom surface 412 located at the contact tip portion 41, a tip transition surface 431 located at the tip transition section 43, a lower surface 421 located at the thin-walled section 423 of the main body portion 42, a main body transition surface 426 located at the main body transition section 425, and a main body bottom surface 427 located at the thick-walled section 424 of the main body portion 42. In addition to the step d between the rear side 412b of the tip bottom surface 412 and the lower surface 421, a step d is also formed between the main body bottom surface 427 and the lower surface 421. The main body transition surface 426 extends from the lower surface 421 to the main body bottom surface 427 with its height gradually changing. Furthermore, the main body transition surface 426 has a gradually changing transition surface 428 and an inclined plane 429, which are analogous to the gradually changing transition surface 432 and inclined plane 433 of the tip transition surface 431. The tip transition surface 431, the main body transition surface 426, and the lower surface 421 are formed by the transition surface 543 and the first surface 541 shown in Figure 14, respectively, that is, they are formed by surfaces formed by a surface sedimentation process. Therefore, the surface roughness of the tip transition surface 431, the main body transition surface 426, and the lower surface 421 differs from the surface roughness of the tip bottom surface 412, the tip top surface 411, the upper surface 422, or the main body bottom surface 427.

[0075] As a result, the contacts 40C and 40D according to this embodiment have the same effects as the contacts 40A and 40B described above. Furthermore, because the thickness of the section of the main body 42 of the contacts 40C and 40D that is separated from the contact tip 41 is large (i.e., the thick section 424), the structural strength of the main body 42 of the contacts 40C and 40D is improved, which is advantageous for constructing a contact probe by fixing the main body 42 of the contacts 40C and 40D to other members. For example, the thick section 424 of the main body 42 of the contacts 40C and 40D can be fixed to the obliquely cut surface 331 of the coaxial cable 33 shown in Figure 9 to constitute the contact probe 30 shown in Figure 8. Alternatively, the thick section 424 of the main body 42 of the contacts 40C and 40D can be fixed to the circuit board 73 shown in Figure 12 to constitute the contact probe 70 shown in Figure 11. In the main body portion 42 of the contacts 40C and 40D, the step d between the thin-walled section 423 and the thick-walled section 424 is the original step d of the substrate 50. This manufacturing method of the contacts 40C and 40D does not require micro-electromechanical technology or bending of the contacts, and ensures that the contacts 40C and 40D have good precision, high structural strength, and a relatively long lifespan. Furthermore, the main body portion 42 has a main body transition section 425 between the thin-walled section 423 and the thick-walled section 424, and the main body transition surface 426 has a gradually changing height, smoothly connecting the lower surface 421 with the step d and the main body bottom surface 427, reducing stress concentration, improving structural integrity, and further improving the durability and reliability of the contacts 40C and 40D.

[0076] (Fourth embodiment) As shown in Figure 17, a fourth embodiment of the present invention provides another form of contactor 40E. Here, Figure 17 shows the case in which six contactors 40E are manufactured simultaneously. The six contactors 40E remain connected at their contact tip portions 41 to the connecting portion 62. The six contactors 40E may be two sets of contactors shown in Figure 5, or two sets of contactors shown in Figure 15. That is, the main body portion 42 of the contactor 40E is not limited to a single thickness, but may have a step d.

[0077] Compared to the contacts 40A to D according to the embodiments described above, the contactor 40E according to this embodiment differs in that it further includes an extended section 47 located between the main body 42 and the tip transition section 43. The main body 42 has a width wider than the extended section 47, the tip transition section 43, and the contact tip 41. A portion of the lower surface 421 is located in the extended section 47. In other words, on the bottom side 45 of the contactor 40E (i.e., the side facing the object to be measured 23), the extended section 47 shares the same plane as the main body 42, that is, it has a step d between it and the contact tip 41 as shown in Figure 6. However, the extended section 47 is narrower than the main body 42. The width of the extended section 47 is close to the width of the contact tip 41. Compared to the embodiment described above in which the tip transition section 43 is directly connected to the main body section 42, this embodiment has an extension section 47 between the tip transition section 43 and the main body section 42. This provides greater elasticity when the contact tip 41 of the contactor 40E contacts the contact pad of the object being measured, which is advantageous for the progress of the test.

[0078] As described above, the contacts 40A to E, contact probes 30 and 70, and probe systems 11 and 12 according to the present invention are used to perform functional tests on unpackaged semiconductor devices (objects under test 23). Therefore, the present invention further provides a method for testing unpackaged semiconductor devices, a method for manufacturing the tested semiconductor device, and the tested semiconductor device.

[0079] The testing method for unpackaged semiconductor devices includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe (e.g., contact probe 30 or contact probe 70), the contact probe comprising a plurality of the aforementioned contacts (e.g., contacts 40A, 40B or contacts 40C, 40D). Step 2: Mechanically and electrically contact the contacts with multiple contact pads of an unpackaged semiconductor device. Step 3: Test the unpackaged semiconductor device using at least one contact probe. As a result, the contact probe used in this test method includes the contactor according to the present invention described above, and has good accuracy, high structural strength, and a long service life, improving the accuracy and reliability of testing unpackaged semiconductor devices.

[0080] The tested semiconductor device manufacturing method includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe (e.g., contact probe 30 or contact probe 70). The contact probe includes multiple of the aforementioned contacts (e.g., contacts 40A, 40B or contacts 40C, 40D). Step 2: Mechanically and electrically contact the contacts with multiple contact pads of an unpackaged semiconductor device. Step 3: Test the unpackaged semiconductor device using a contact probe. Semiconductor devices manufactured using this manufacturing method have been tested. This test utilizes the contacts according to the present invention, resulting in good accuracy, high structural strength, a long service life, and improved accuracy and reliability of the test results for semiconductor devices.

[0081] The tested semiconductor device comprises multiple contact pads 231, and a test process is performed by mechanical and electrical contact using at least one contact probe (e.g., contact probe 30 or contact probe 70). The contact probe includes multiple of the aforementioned contacts (e.g., contacts 40A, 40B or contacts 40C, 40D). The test process is performed by the contact ends 431 of the contacts making contact with the contact pads 231.

[0082] As a result, the aforementioned semiconductor device has been tested. The test utilizes the contacts according to the present invention, which offer good accuracy, high structural strength, and a long service life, improving the accuracy and reliability of the test results for the semiconductor device.

[0083] Finally, it is reiterated that the components disclosed in embodiments of the present invention are for illustrative purposes only and do not limit the scope of the present invention, and substitutions or modifications of other equivalent components should be included within the scope of the claims of the present invention. [Explanation of Symbols]

[0084] 11, 12: Probe system 21: Mounting platform 22: Circuit board 23: Object to be measured 231: Contact pads 30: Contact probe 31: Base section 32: Coaxial coupling 33: Coaxial cable 331: Beveled cut surface 332: Inner electrical conductor 333: Outer electrical conductor 333a,333b: Block 334: Dielectrics 335: Terminal 40A, 40B, 40C, 40D, 40E: Contact 41: Contact tip 411:Tip top surface 412: Bottom of tip 412a: Front side 412b: Rear side 413: Contact end 414: Plane 415, 416: Virtual lines 42: Main body 421: Lower surface 422: Upper surface 423: Thin-walled section 424: Thick-meat section 425: Main body transition section 426: Body transition surface 427: Bottom of main body 428: Gradual Transition Surface 429: Inclined plane 43: Transition section at the tip 431: Tip transition surface 432: Gradual Transition Surface 433: Inclined plane 44:Top side 45: Bottom 450: Angle 46: Cantilever segment 460:Inner obtuse angle 461:Terminal 47: Extended section 50: Circuit board 51: Thin-walled block 52: Thick-walled block 53: Transition Block 54: Upward side 541: First surface 542:Second surface 543:Transition surface 55: Thin-walled block 56: Thick-walled block 57: Transition Block 61: Flat plate 611: Plane 62, 63: Connection part 70: Contact probe 71: Base section 72: Coaxial coupling 73: Circuit board 731: Bottom 732, 733: Electrical Conduction Circuits 735: Terminal C: Outer contour d: step

Claims

1. A method for manufacturing a contactor, The aforementioned contact probe is used as a contact probe for performing functional tests on an object to be measured. The method for manufacturing the contactor is as follows: The steps include providing a substrate and The step includes forming a plurality of contacts by removing a portion of the material from the substrate, The aforementioned substrate is Made of an electrically conductive material, it comprises a thin-walled block, at least one thick-walled block, and at least one transition block that extends from the thin-walled block to the thick-walled block with gradually increasing thickness. The upward side of the substrate includes a first surface located in the thin-walled block, at least one second surface located in the thick-walled block, and at least one transition surface located in the transition block. The second surface is higher than the first surface. The transition surface extends from the first surface to the second surface, with its height gradually changing. The step of forming a plurality of the aforementioned contacts is: The steps include defining the contact tip portion of each contactor in the thick block of the substrate, The steps include defining the main body portion of each contact in the thin-walled block of the substrate, The step of cutting the substrate based on the external contours of a plurality of contacts is included. A method for manufacturing a contactor, characterized by the above.

2. A method for manufacturing a contactor according to claim 1, The step further includes shaping the contact tip of each contactor, and forming a tip top surface, a tip bottom surface, and a contact end located where the tip top surface and the tip bottom surface intersect, which is used to contact the object to be measured. A method for manufacturing a contactor, characterized by the above.

3. A method for manufacturing a contactor according to claim 1, The substrate includes two transition blocks located on opposite sides of the thin block, and two thick blocks connected to the two transition blocks, respectively. The upward side of the substrate includes two second surfaces located in two of the thick blocks, and two transition surfaces located in two of the transition blocks, The step of forming a plurality of the aforementioned contacts is: The steps include defining the contact tip portion of each contactor in one of the two thick-walled blocks, The step of defining the main body portion of each contact in the thin-walled block and the other of the two thick-walled blocks, is included. A method for manufacturing a contactor, characterized by the above.

4. A method for manufacturing a contactor according to claim 1, The substrate is formed by a single flat plate through a surface deposition process by chemical etching or laser etching. The first surface and at least one of the transition surfaces are formed by the surface sedimentation process. The surface roughness of the first surface and at least one of the transition surfaces differs from the surface roughness of at least one of the second surfaces. The surface sedimentation process is performed prior to the step of forming the multiple contacts by removing a portion of the material from the substrate. A method for manufacturing a contactor, characterized by the above.

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