Electronic component mounting equipment

Abstract

To provide a mounting device for an electronic component that can accurately mount an electronic component while reducing the generation of dust.SOLUTION: A mounting device 1 of an embodiment has: a mounting mechanism 3 that mounts an electronic component C on a substrate S; a substrate support mechanism 2 that supports the substrate on which the electronic component is mounted; a mounting head 31 that is provided on the mounting mechanism, and has a transmission part through which a mark on the substrate can be recognized while holding the electronic component; a first imaging unit 4 that is arranged below the substrate support mechanism at a mounting position where the mounting head mounts the electronic component on the substrate, and picks up an image of a mark on the electronic component held by the mounting head, in a state where the substrate is retreated from the mounting position; a second imaging unit 5 that is arranged above the mounting head at the mounting position, and picks up an image of the mark on the substrate through the transmission part; and a positioning mechanism (driving mechanism 22) that performs positioning of the substrate and the electronic component, on the basis of the positions of the substrate and the electronic component determined from the images of the marks picked up by the first imaging unit and the second imaging unit.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component mounting apparatus.

Background Art

[0002] In the method of mounting a semiconductor chip, which is an electronic component, on a substrate, there are face-up and face-down methods. The surface on which the semiconductor layer of the semiconductor chip is formed is called the face. The method of mounting with the face side opposite to the substrate is face-up. For example, when mounting a semiconductor chip on a lead frame or the like and wiring between the electrodes and the frame with a wire, it is a face-up mounting.

[0003] The method of mounting with the face side facing the substrate is face-down. For example, in the case of flip-chip connection where bump electrodes are provided on the surface of the semiconductor layer and the bump electrodes are pressed against the wiring of the substrate to perform fixation and electrical connection, it is a face-down mounting.

[0004] When mounting an electronic component such as a semiconductor chip on a substrate, the electronic component must be precisely positioned with respect to the substrate. To address this, for example, a camera capable of simultaneously imaging in both the up and down directions is inserted between the mounting tool that adsorbs and holds the electronic component and the substrate. Based on the image captured by this camera, the horizontal relative position between the substrate and the electronic component is recognized. Then, based on the recognized relative position, after correcting the position of the mounting tool, the electronic component is mounted on the substrate.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In recent years, 3D packaging and hybrid bonding, which increase integration density by arranging semiconductor chips in multiple layers, require bonding electrodes with extremely narrow pitches. Therefore, when mounting electronic components onto a substrate, higher precision, such as submicron-order precision, is increasingly required. Furthermore, errors caused by the movement of mounting mechanisms and dust generated by this movement can lead to bonding failures; therefore, it is desirable to minimize the distance over which these mechanisms operate.

[0007] However, when using an imaging camera that can capture images in both vertical and horizontal directions simultaneously, it is necessary to insert the camera between the substrate and the electronic component to recognize the horizontal relative position of the substrate and the electronic component, requiring a large distance between them. As a result, the distance the electronic component needs to be moved after the relative position of the two is recognized becomes longer. The longer the movement distance, the higher the risk of horizontal misalignment, making it difficult to achieve high mounting accuracy. In addition, the longer movement distance of the mechanical parts may also increase the amount of dust generated.

[0008] The present invention was proposed to solve the above-mentioned problems, and its objective is to provide an electronic component mounting device that can mount components with high precision while suppressing the amount of dust generated. [Means for solving the problem]

[0009] The present invention provides an electronic component mounting apparatus comprising: a mounting mechanism for mounting electronic components onto a substrate; a substrate support mechanism for supporting the substrate on which the electronic components are mounted; a mounting head provided on the mounting mechanism and having a transparent portion that allows the mark on the substrate to be seen and recognized while holding the electronic components; a first imaging unit positioned below the substrate support mechanism at the mounting position where the mounting head mounts the electronic components onto the substrate, and which captures the mark on the electronic component held by the mounting head when the substrate is retracted from the mounting position; and the mounting head at the mounting position The mounting head is positioned above the first imaging unit and has a second imaging unit that images the mark on the substrate through the transparent unit, and a positioning mechanism that positions the substrate and the electronic component based on the positions of the substrate and the electronic component determined from the images of the mark captured by the first imaging unit and the second imaging unit, wherein the mounting head is provided with a mark that can be imaged by the first imaging unit at a position that does not overlap with the holding position of the electronic component while the electronic component is held, and that can be imaged by the second imaging unit via the transparent unit, and the positioning mechanism is the first imaging unit The positional relationship between the mark of the electronic component and the mark of the mounting head, determined from an image obtained by simultaneously capturing the mark of the electronic component and the mark of the mounting head by the second imaging unit, the positional relationship between the mark of the substrate and the mark of the mounting head, determined from an image obtained by simultaneously capturing the mark of the substrate and the mark of the mounting head by the second imaging unit, and the amount of deviation between the position of the mark of the mounting head and the respective reference positions obtained from images obtained by the first imaging unit and the second imaging unit before the mounting head holds the electronic component. Based on this, the substrate and the electronic component are positioned. [Effects of the Invention]

[0010] The present invention provides an electronic component mounting apparatus that can mount components with high precision while suppressing the amount of dust generated. [Brief explanation of the drawing]

[0011] [Figure 1] Front view showing the schematic configuration of the implementation device of the embodiment. [Figure 2] Plan view showing electronic components and circuit board [Figure 3] Plan view of the mounting device (A), enlarged plan view of the mounting area (B) [Figure 4] Diagram illustrating the assembly procedure for the mounting device. [Figure 5] Flowchart showing the implementation procedure for the mounting device [Figure 6]Explanatory drawing showing an implementation method in an implementation device of another aspect [Figure 7] Flowchart showing the implementation procedure of the aspect of FIG. 6 [Figure 8] Explanatory drawing showing an implementation method in an implementation device of another aspect [Figure 9] Flowchart showing the implementation procedure of the aspect of FIG. 8

Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, this embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. FIG. 1 is a front view showing a schematic configuration of the mounting device 1. FIG. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, ratio of the sizes of each part to each other, etc. may be different from the actual ones.

[0013] [Electronic Component] First, examples of the electronic component C to be mounted in this embodiment include semiconductor elements such as ICs and LSIs.

[0014] In this embodiment, as shown in FIG. 2, a rectangular parallelepiped semiconductor chip is used as the electronic component C. Each semiconductor chip is a bare chip obtained by dicing a semiconductor wafer into a mesh pattern. The bare chip has bumps or bump-less electrodes provided on the exposed semiconductor, and is mounted by flip-chip connection to pads on the substrate S.

[0015] A plurality of marks m for positioning are provided on the electronic component C. In this embodiment, two marks m are provided at each of a pair of corner portions that are the diagonals of the rectangular electronic component C. The mark m is provided on the surface where the electrodes of the electronic component C are formed, that is, on the face. This embodiment is an example of a device for face-down mounting in which the face side is mounted toward the substrate S.

[0016] [Substrate] In this embodiment, the substrate S on which the above-described electronic component C is mounted is, as shown in FIG. 2, a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. The substrate S is provided with a mounting region B which is a region where the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting region B. In this embodiment, two marks M are provided at positions outside the mounting region B and corresponding to the mark m of the electronic component C. That is, they are provided one by one outside a pair of corner portions which are the diagonals of the mounting region B set to the same shape and size as the rectangular electronic component C.

[0017] [Mounting device] The mounting device 1 of this embodiment is a mounting device 1 capable of realizing mounting with a high precision, for example, a mounting precision of ±0.2 μm or less. As shown in FIGS. 1 and 3, it has a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, and a control device 6. FIG. 3(A) is a plan view of the mounting device 1, and FIG. 3(B) is a plan view showing the mark M seen through a mounting head 31 described later.

[0018] In the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is defined as the Z-axis, and two axes orthogonal to each other in a plane orthogonal to this are defined as the X-axis and the Y-axis. In this embodiment, the Z-axis is vertical, the direction following gravity is downward, the direction against gravity is upward, and the position on the Z-axis is called the height. Also, the X-axis and the Y-axis are on a horizontal plane. When viewed from the front side of FIG. 1, the X-axis is the left-right direction and the Y-axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, with reference to the substrate S or the substrate support mechanism 2, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

[0019] The substrate support mechanism 2 is a mechanism that supports the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism that mounts the electronic component C onto the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transparent portion that allows the mark M on the substrate S facing the electronic component C to be seen and recognized while holding the electronic component C.

[0020] The first imaging unit 4 is positioned below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C onto the substrate S. With the substrate S retracted from the mounting position OA by the substrate support mechanism 2, the first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 from a position opposite to the electronic component C, i.e., from below. The mounting position OA is the position on the substrate S where the electronic component C is mounted, and in the figure, it is shown by a dashed line along the Z axis passing through a point (for example, the center point) on the XY coordinate system within the area of ​​the electronic component C to be mounted. As will be described later, the mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5. The second imaging unit 5 is positioned above the mounting head 31 at the mounting position OA and images the mark M on the substrate S through the transparent part of the mounting head 31 (hereinafter, this is referred to as "image through the mounting head 31"). The control device 6 controls the operation of the mounting device 1.

[0021] The substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C determined from the images of marks M and m captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 described above is mounted on a support base 11 installed on the mounting surface. The top surface of the support base 11 is a horizontal plane. The parts will be described in detail below.

[0022] (Substrate support mechanism) As shown in Figures 1 and 3(A), the substrate support mechanism 2 is arranged on the support base 11 and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 is a two-axis moving mechanism that has, for example, a pair of guide rails 22a in the X-axis direction and a pair of guide rails 22b in the Y-axis direction, and moves the stage 21 in the horizontal plane by a belt or ball screw with a motor (not shown) as the drive source. The pair of guide rails 22a and the pair of guide rails 22b are arranged symmetrically on either side of the mounting position OA. This drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the drive mechanism 22 also includes a θ drive mechanism that rotates the stage 21 in the horizontal plane.

[0023] The drive mechanism 22 includes a movable plate 23 that moves in the Y-axis direction along the guide rail 22b. A through hole 23a is formed in this movable plate 23 so that the first imaging unit 4 can image the electronic component C.

[0024] Although not shown in the diagram, a loader / unloader for supplying / storing substrates S to / from the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right in the diagram). Therefore, with the stage 21 moved to the aforementioned moving end, the substrate support mechanism 2 receives the substrate S from the loader or passes the substrate S to the unloader.

[0025] (Implementation mechanism) The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is generally rectangular in shape and has a hollow section 31a and a holding section 31b as transparent parts. The hollow section 31a is a cylindrical through-hole formed with the Z-axis direction as its axis. The holding section 31b is a plate-like member that can transmit light for imaging and is attached to close the opening on the side of the hollow section 31a facing the substrate S. For example, a transparent glass plate can be used as the holding section 31b. The holding section 31b is a so-called mounting tool and holds the electronic component C.

[0026] As shown in Figure 3(B), an adsorption region D for adsorbing and holding an electronic component C is provided in the center of the holding portion 31b. Although not shown, adsorption holes are formed in the adsorption region D. A flow path is formed inside the holding portion 31b to connect the adsorption holes to a negative pressure source, and by generating negative pressure in the adsorption holes, the electronic component C can be adsorbed and held. The area surrounding the adsorption region D of the holding portion 31b is a transparent region T that allows imaging of the mark M on the substrate S through it, even when the electronic component C is adsorbed. In other words, the mounting head 31 has a transparent portion so that the mark M on the substrate S can be imaged by the second imaging unit 5. The holding surface (adsorption surface) of the holding portion 31b that holds the electronic component C is called the lower end surface.

[0027] The drive mechanism 32 comprises movable bodies 33, 34, and 35 and is a mechanism for driving the mounting head 31. Movable body 33 is mounted to move along a Y-axis direction guide rail 33a provided on the support base 11. Movable body 34 is mounted to move along an X-axis direction guide rail 34a provided on the top surface of movable body 33. Movable body 35 is mounted to move along a Z-axis direction guide rail 35a provided on the front surface of movable body 34. Movable body 35 is formed in a generally concave shape in plan view. These movable bodies 33, 34, and 35 are driven by a ball screw, linear motor, cylinder, or the like, which is driven by a motor.

[0028] The mounting head 31 is located at the bottom of the movable body 35, which moves in the Z-axis direction. Therefore, the movable body 35 performs the operation of mounting the electronic component C held by the holding portion 31b of the mounting head 31 onto the substrate S. Furthermore, the movable body 35 on which the mounting head 31 is located moves in the X-axis direction and the Y-axis direction due to the movement of the movable bodies 33 and 34. Therefore, the drive mechanism 32 functions as a positioning mechanism that positions the electronic component C held by the mounting head 31. Although not shown in the figure, the drive mechanism 32 includes a θ drive mechanism that rotates the mounting head 31 in the horizontal plane.

[0029] In this embodiment, it is preferable to set the amount of movement in the X-axis, Y-axis, and Z-axis directions by the drive mechanism 32 to be as short as possible from the viewpoint of preventing movement errors. For example, the amount of movement in the X-axis and Y-axis directions by the moving bodies 33 and 34 is set to a few millimeters to a dozen millimeters, respectively. Similarly, the amount of movement in the Z-axis direction by the moving body 35 is also set to a few millimeters to a dozen millimeters. In other words, the mounting head 31 is configured to receive electronic components C and image the mark m of the received electronic components C at a height position where the lower end surface of the holding part 31b is several millimeters, for example, 1 to 2 mm, relative to the upper surface of the substrate S placed on the stage 21. Therefore, regarding the amount of movement of the moving body 35 in the Z-axis direction, it is sufficient to ensure that the amount of movement is sufficient to allow the electronic components C held in the holding part 31b to be pressed onto the substrate S with a predetermined pressure from this height position.

[0030] Although not shown in the diagram, the mounting device 1 is also equipped with a wafer stage and a tray stage, which are electronic component C supply units, and a transfer mechanism that receives the electronic component C individually from the supply units and transfers the electronic component C to the mounting head 31 of the mounting mechanism 3.

[0031] (First imaging unit) The first imaging unit 4 includes a camera, lens, lens barrel, light source, etc., and is installed in a housing hole 11a provided in the support base 11. The first imaging unit 4 is positioned such that the optical axis of the camera is in a direction that allows imaging of the mark m of the electronic component C held by the mounting head 31. Specifically, it is positioned so that the optical axis is vertical. The first imaging unit 4 is installed so that the mark m of the electronic component C held by the mounting head 31 does not go out of the imaging field of view within the range in which the mark m can move to its maximum extent. There is variation in the holding position of the electronic component C that is handed over to the mounting head 31. That is, the position of the electronic component C varies with respect to the mounting position OA. Therefore, the position of the mark m of the electronic component C also varies. The maximum range of this variation is the range in which the mark m of the electronic component C can move to its maximum extent. The first imaging unit 4 is designed to capture images with sufficient magnification to ensure the necessary mounting accuracy and with the illuminance of the light source and brightness necessary for position recognition. Furthermore, the maximum range of movement of the aforementioned mark m is also taken into consideration, and the imaging field of view (field of view range) is determined from these conditions. The first imaging unit 4 is initially positioned so that the center of this imaging field of view coincides with the mounting position OA. This position remains the same whether the first imaging unit 4 is fixed or movable. In addition, the first imaging unit 4 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with their movement.

[0032] In this embodiment, the first imaging unit 4 is immovable with respect to the mounting position OA of the electronic component C. That is, in this embodiment, the first imaging unit 4 is positioned facing upward within the housing hole 11a of the support base 11, which is located below the substrate support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 in a size and positional relationship such that even if the electronic component C moves to its maximum extent for positioning, the two marks m will not move out of the imaging field of view. The imaging field of view of the first imaging unit 4 is set considering the range in which the two marks m of the electronic component C can move to their maximum extent for positioning, with the optical axis (center of the imaging field of view) fixed aligned with the mounting position OA.

[0033] (Second imaging unit) The second imaging unit 5 includes a camera, lens, lens barrel, light source, etc., and is mounted on the support base 11 above the support base 11, more specifically above the mounting head 31, supported by a frame (not shown) or the like. The second imaging unit 5 is positioned such that the optical axis of the camera passes through the holding portion 31b of the mounting head 31, enabling imaging of the marks M around the mounting area B of the substrate S. Specifically, it is positioned so that the optical axis is vertical. The second imaging unit 5 is positioned so that the marks M do not move out of the imaging field of view within the range in which the marks M on the substrate S can move to their maximum extent by passing through the holding portion 31b. There is variation in the support position of the substrate S placed on the stage 21. That is, the position of the substrate S varies with respect to the mounting position OA. Therefore, the position of the marks M on the substrate S also varies. The range of maximum variation is the range in which the marks M on the substrate S can move to their maximum extent. The second imaging unit 5 is designed to capture images with sufficient magnification to ensure the required mounting accuracy and with the illuminance from the light source and the brightness necessary for position recognition. Furthermore, it takes into account the maximum range in which the aforementioned mark M can move, and has an imaging field of view (field of view range) determined by these conditions. The second imaging unit 5 is initially positioned so that the center of this imaging field of view coincides with the mounting position OA. This position remains the same whether the second imaging unit 5 is fixed or movable. In addition, the second imaging unit 5 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with their movement.

[0034] In this embodiment, the second imaging unit 5 is positioned directly above the mounting head 31, facing downwards, with the optical axis of the camera (center of the imaging field of view) aligned with the mounting position OA, as described above. The second imaging unit 5, like the first imaging unit 4, is immovable with respect to the mounting position OA of the electronic component C. In other words, the imaging field of view of the second imaging unit 5 is set considering the range in which the two marks M placed on the mounting area B of the substrate S can move to the maximum extent for positioning. For this reason, the size of the transparent portion of the mounting head 31 is set to match the imaging field of view of the second imaging unit 5.

[0035] Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 in this embodiment will be described. As described above, the first imaging unit 4 and the second imaging unit 5 are arranged independently of the mounting head 31 and the stage 21 so as not to interfere with their movement. In other words, the first imaging unit 4 and the second imaging unit 5 are each independently provided on the support base 11. Therefore, when imaging marks m and M, or during positioning, the first imaging unit 4 and the second imaging unit 5 do not move together with the mounting head 31 and the stage 21.

[0036] For example, the first imaging unit 4 and the second imaging unit 5 are each independently fixed to the support base 11. Alternatively, the first imaging unit 4 and the second imaging unit 5 are equipped with drive devices in the X and Y axis directions (horizontal direction) and the Z axis direction (vertical direction), and are arranged to be movable in the horizontal and vertical directions. This movement is performed to adjust the horizontal and vertical positions of the imaging units 4 and 5 (first imaging unit 4 and second imaging unit 5) as preparation work for operating the device, or to move between marks when imaging multiple marks m and M, as described later.

[0037] As described above, the first imaging unit 4 and the second imaging unit 5 are each provided to move independently of the mounting head 31 and the stage 21. Therefore, being immobile with respect to the mounting position OA means that when imaging or positioning marks m and M, the first imaging unit 4 and the second imaging unit 5 do not move together with the mounting head 31 and the stage 21. For example, if the imaging units 4 and 5 are provided to move independently of the mounting head 31 and the stage 21, adjusting the horizontal position or vertical position of the imaging units 4 and 5 as preparation work for operating the device is also included in being immobile with respect to the mounting position OA. Alternatively, if the first imaging unit 4 and the second imaging unit 5 move between marks in order to image multiple marks m and M, this is also included in being immobile with respect to the mounting position OA.

[0038] Furthermore, it is preferable that the mounting device 1 of this embodiment achieves a mounting accuracy of 0.2 μm or less. To achieve this, the first imaging unit 4 and the second imaging unit 5 must have the performance to perform high-magnification, high-resolution imaging commensurate with that accuracy.

[0039] It is generally known that in order to capture high-resolution images, the imaging unit needs to be positioned close to the electronic component C or substrate S that is to be imaged. Therefore, it is preferable to position the first imaging unit 4 and the second imaging unit 5 as close as possible to the electronic component C or substrate S, that is, to shorten the imaging distance.

[0040] However, in the mounting apparatus 1 of this embodiment, in order to minimize the downward movement of the electronic component C during mounting, the electronic component C is positioned close to the height of the upper surface of the substrate S, and imaging of the mark m on the electronic component C and the mark M on the substrate S is performed with the electronic component C positioned close to the height of the upper surface of the substrate S. For this reason, a stage 21 and a moving plate 23 of the drive mechanism 22 are located between the first imaging unit 4 and the electronic component C, and a mounting head 31 is located between the second imaging unit 5 and the substrate S. Therefore, in order to avoid interference with the moving plate 23 and the mounting head 31, there are limits to how much the distance between the first imaging unit 4 and the electronic component C can be shortened, and how much the distance between the second imaging unit 5 and the substrate S can be shortened.

[0041] Therefore, the inventors of the present invention investigated the maximum possible imaging distance (so-called work distance) at which an image capable of achieving the above-mentioned mounting accuracy can be captured. As a result, they determined that it is approximately 100 mm. Based on this result, in this embodiment, the first imaging unit 4 is fixedly positioned at a height position such that the imaging distance from the electronic component C is within 100 mm, and the second imaging unit 5 is fixedly positioned at a height position such that the imaging distance from the substrate S is within 100 mm.

[0042] The mounting head 31, located between the second imaging unit 5 and the substrate S, is a relatively large component in terms of height (Z-axis dimension) for reasons such as ensuring rigidity. Therefore, interference is likely to occur in a normal configuration. As a result of diligent study, the inventors of this application succeeded in minimizing the height dimension while maintaining the required functions and rigidity of the mounting head 31. Specifically, the height dimension of the mounting head 31 (dimension from the lower end of the holding part 31b to the upper opening of the hollow part 31a) was set to approximately 70 mm. This made it possible to position the second imaging unit 5 at a height of 100 mm or less relative to the substrate S.

[0043] (Control device) The control device 6 controls the positioning mechanism so that the substrate S and the electronic component C are positioned based on the marks m and M captured by the first imaging unit 4 and the second imaging unit 5. The coordinates of each imaging unit 4 and 5 are adjusted to match the coordinates of the mounting device 1. Specifically, the coordinates of the control device 6 are the design XY coordinates of the mounting device 1, and their origin can be the mounting position OA. The coordinates of each imaging unit 4 and 5 are set so that, for example, the imaging center is the origin of the XY coordinates and matches the mounting position OA as mechanically or computationally achievable information. Therefore, in this case, the reference position on the XY coordinates in the mounting device 1 is the mounting position OA, and the imaging centers of each imaging unit 4 and 5 are also the same reference position.

[0044] It should be noted that the coordinates of each imaging unit 4 and 5, which are adjusted to match the coordinates of the mounting device 1, actually include assembly errors in each part of the device. In addition, information regarding the shapes of marks m and M, design information indicating the positional relationship between electronic component C and mark m, and design information indicating the positional relationship between the mounting area B of the substrate S and mark M are stored in advance by the control device 6. Each imaging unit 4 and 5 has an image recognition unit. The image recognition unit recognizes marks m and M, which are stored in advance by the control device 6, from the captured image using a well-known image recognition process, and calculates the position on the reference coordinates of the mounting device 1. That is, the image recognition unit of the first imaging unit 4 calculates the position information (X, Y, θ) of the electronic component C held by the mounting head 31 from the recognized mark m on the adjusted coordinates. Similarly, the image recognition unit of the second imaging unit 5 calculates the position information (X, Y, θ) of the mounting area B of the substrate S placed on the stage 21 for mark M. This calculation of positional information is performed based on information indicating the positional relationship between the electronic component C and mark m, and information indicating the positional relationship between the mounting area B and mark M, which are stored in advance by the control device 6 as described above.

[0045] The control device 6 determines the amount of deviation between the position information of the electronic component C and the mounting area B calculated in this manner, the reference position (the coordinate origin of each imaging unit 4 and 5), and the XY axis direction, and controls the positioning mechanism (drive mechanism 22 and drive mechanism 32) so that the electronic component C or the substrate S moves in a direction and by an amount of movement in which the deviation is corrected and the electronic component C and the mounting area B coincide.

[0046] [Operation] The operation of this embodiment described above will be explained with reference to the explanatory diagram in Figure 4 and the flowchart in Figure 5. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but it is moved away from the position facing the mounting head 31, that is, from the mounting position OA.

[0047] First, the holding portion 31b of the mounting head 31 in the mounting mechanism 3 has its center located directly below the second imaging unit 5. That is, the center of the holding portion 31b is located on the mounting position OA. In this state, the transfer mechanism receives the electronic component C from the supply unit (neither of which is shown) and transfers it to the mounting head 31 (step S101). As shown in Figure 4(A), the holding portion 31b of the mounting head 31 receives the electronic component C from the transfer mechanism and holds it by suction using negative pressure (step S102). Since the transfer of the electronic component C to the holding portion 31b by the transfer mechanism takes place at the mounting position OA, the stage 21 remains retracted during the transfer to avoid interference with the transfer mechanism.

[0048] The first imaging unit 4 captures a mark m on the electronic component C held by the mounting head 31 (step S103). At this time, the stage 21 is retracted from the mounting position OA, and a through hole 23a provided in the movable plate 23 is positioned directly above the first imaging unit 4. The first imaging unit 4 captures the mark m through this through hole 23a. The image recognition unit of the first imaging unit 4 recognizes the mark m from the image captured by the first imaging unit 4 and calculates the position information of the electronic component C. The control device 6 obtains the position information of the electronic component C and the amount of deviation from the reference position and the XY axis direction, and positions the electronic component C by operating the drive mechanism 32 so that the deviation is eliminated (step S104).

[0049] Next, as shown in Figure 4(B), the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (in this case, the mounting area B on which the electronic component C will be mounted) is facing the electronic component C held by the mounting head 31, that is, the center of the mounting area B is at the mounting position OA (step S105). Then, as shown in Figure 3(B), the second imaging unit 5 captures the mark M of the substrate S visible in the transparent area T around the electronic component C through the mounting head 31 (step S106). The image recognition unit of the second imaging unit 5 recognizes the mark M from the image captured by the second imaging unit 5 and calculates the position information of the mounting area B.

[0050] In step S106, the second imaging unit 5 may image the mark M on the substrate S while the mounting head 31 holding the electronic component C remains at the height position where the electronic component C was received, or it may be moved to a predetermined height position closer to the substrate S before imaging. When imaging is performed at a closer height position, the amount of downward movement required for mounting after imaging can be reduced, thus further suppressing movement errors.

[0051] The control device 6 determines the position information of the mounting area B and the amount of deviation from the reference position and the XY axis direction, and positions the substrate S by operating the drive mechanism 22 so that the deviation is eliminated (step S107). Furthermore, as shown in Figure 4(C), the drive mechanism 32 drives the mounting head 31 toward the substrate S, and the electronic component C held by the mounting head 31 is mounted onto the substrate S (step S108).

[0052] In this way, by repeating the operations of transferring electronic components C, positioning the electronic components C and the substrate S, and mounting, electronic components C are sequentially mounted in each mounting area B of the substrate S. Once a predetermined number of electronic components C have been mounted on the substrate S, it is transported by the substrate support mechanism 2 and stored in the unloader.

[0053] [Effects and Effects] The mounting apparatus 1 of this embodiment includes a mounting mechanism 3 for mounting electronic components C onto a substrate S, a substrate support mechanism 2 for supporting the substrate S on which the electronic components C are mounted, and a mounting head 31 provided on the mounting mechanism 3, which has a transparent portion that allows the mark M on the substrate S to be seen through while holding the electronic components C.

[0054] Furthermore, the mounting apparatus 1 includes a first imaging unit 4 positioned below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C onto the substrate S, and which images the mark m of the electronic component C held by the mounting head 31 when the substrate S is retracted from the mounting position OA; a second imaging unit 5 positioned above the mounting head 31 at the mounting position OA and which images the mark M of the substrate S through a transparent unit; and a positioning mechanism that positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C determined from the images of the marks m and M captured by the first imaging unit 4 and the second imaging unit 5.

[0055] According to this embodiment, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4, which is positioned below the substrate support mechanism 2 at the mounting position OA, with the substrate S retracted from the mounting position OA. The substrate S supported by the substrate support mechanism 2 is imaged by the second imaging unit 5, which is positioned above the mounting head 31 at the mounting position OA, through the transparent portion of the mounting head 31. This makes it possible to image the mark m of the electronic component C and the mark M of the substrate S while keeping the electronic component C and the substrate S as close together as possible.

[0056] Therefore, the amount of movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) when imaging marks m and M, and the relative amount of movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) after imaging marks m and M can be minimized. Consequently, the increase in errors caused by moving the mounting head 31 or the substrate support mechanism 2 over long distances can be suppressed. In addition, the longer the movement distance of the mechanism, the more dust is generated, but in this embodiment, the movement distance can be minimized, so it is possible to prevent the cleanliness from decreasing due to dust and causing bonding defects. In particular, when the substrate S is positioned on the mounting position OA, the amount of movement of the mounting head 31 and the second imaging unit 5 located on the substrate S can be minimized, so it is possible to suppress dust from falling and adhering to the substrate S. Note that when the mounting head 31 moves to transfer the electronic component C to the supply unit, dust will fall underneath it. However, in this embodiment, the mounting head 31 does not move for receiving. Furthermore, when the mounting head 31 transfers the electronic component C to the transfer mechanism, the substrate S is retracted. Therefore, dust does not fall onto and adhere to the substrate S.

[0057] Furthermore, for example, when simultaneously recognizing the positions of an electronic component C on the mounting position OA and the mounting area B on the substrate S using an imaging camera capable of simultaneously capturing images in the vertical direction, it is necessary to insert the camera between the electronic component C and the substrate S during imaging. Therefore, the electronic component C and the substrate S must be kept apart to avoid interference with the camera. Consequently, the distance that the electronic component C must travel to the substrate S during mounting becomes longer. Also, during mounting, the camera must be retracted to a position where it does not interfere with the mounting head 31. With the mounting apparatus 1 of this embodiment, since the camera is not inserted between the electronic component C and the substrate S, imaging can be performed with the electronic component C and the substrate S as close together as possible. Consequently, the distance that the electronic component C must travel to the substrate S during mounting after imaging can be shortened. Also, the camera does not need to be moved significantly on the substrate S before and after imaging. Therefore, errors and dust generation associated with these movements can be suppressed.

[0058] Furthermore, as described above, the first imaging unit 4 and the second imaging unit 5 are positioned independently of the mounting head 31 and the stage 21, respectively, so as not to interfere with their movement. Therefore, when positioning the electronic component C and the mounting area B of the substrate S, only the mounting head 31, only the stage 21, or both move, but since they are independent of the imaging units 4 and 5, the moving parts can be made lighter and movement errors can be reduced compared to a case where they are not independent of the imaging units 4 and 5.

[0059] In contrast to this embodiment, for example, when imaging a mark on a substrate S using an imaging unit integrally provided with the mounting head 31, first, the imaging unit is positioned on the mounting position OA and imaging is performed. Based on the imaging result, the position of the substrate S is recognized, and the electronic component C held by the mounting head 31 is positioned at a location that aligns with the separately recognized position of the electronic component C and mounted. In this case, when imaging the substrate S and mounting it, the integrated imaging unit and mounting head 31 move relative to the mounting position OA, which can lead to increased errors and dust generation. In the mounting apparatus 1 of this embodiment, the mounting head 31, the mounting area B of the substrate S, the first imaging unit 4, and the second imaging unit 5 are independently arranged on the mounting position OA, so only slight movement is required for positioning, and the electronic component C and substrate S do not need to be moved together with the camera each time imaging is performed by the imaging units 4 and 5. Therefore, mounting can be performed with high precision, and dust generation can be suppressed.

[0060] Furthermore, achieving the required high accuracy necessitates the use of a high-magnification camera. In this embodiment, instead of positioning the second imaging unit 5 above the mounting head 31 and imaging the mark M through the mounting head 31—that is, instead of imaging the mark M through the transparent holding unit 31b—it is practically impossible to achieve the required high accuracy by imaging with a camera provided on the mounting head 31 adjacent to the mounting head 31. First, the outer shape of the mounting head 31 is inevitably larger than the electronic component C to be mounted. Then, the area on the substrate S where the mark M is applied is only a few millimeters larger than the area where the electronic component C is mounted. Therefore, the area where the mark M is applied is closer to the center of the mounting head 31 than the outer shape of the mounting head 31. For this reason, even if the camera barrel is positioned adjacent to the mounting head 31, when the mounting head 31 is positioned at the mounting position OA, the mark M does not fall within the camera's field of view, and the mark M cannot be imaged by the camera. Therefore, the mounting head 31 must be shifted from the mounting position OA so that the mark M is within the camera's field of view when imaging is performed.

[0061] Generally, the higher the magnification of the objective lens, the darker the image. Image brightness is proportional to the square of the numerical aperture (NA) and inversely proportional to the square of the overall magnification (M). In other words, the larger the numerical aperture, the brighter the image, and the higher the magnification, the darker the image. Therefore, when high magnification is required, it is necessary to increase the numerical aperture and use an objective lens with a large diameter. For example, the lens barrel including the objective lens of a high-magnification camera that requires high-precision positioning usually requires an aperture of 10 mm or more. If the optimal image is obtained at the center of the lens, a camera placed adjacent to the mounting head 31 will be viewing a location more than 5 mm away from the edge of the mounting head 31. As a result, imaging can only be performed at locations far from the mounting head 31. For this reason, whether using a single camera or multiple cameras, it is not possible to image the mark M on the substrate S when the center of the mounting head 31 is positioned at the mounting position OA. Therefore, in order to image, the camera needs to be positioned on the mark M on the substrate S.

[0062] In other words, in order to capture the mark M on the substrate S within the field of view, it is necessary to move the mounting head 31 to position the camera directly above the mark M, and errors will occur during this movement. For example, if the mark m on the electronic component C is recognized and positional information is obtained for positioning, then the mark M on the substrate S must be recognized, and the camera must be moved together with the mounting head 31 to recognize the mark M. Even if it is then returned to its original position, errors due to this movement may cause a shift in the position of the electronic component C. There is also a possibility that dust generation will increase.

[0063] Furthermore, if only one of the multiple (two) marks M on the substrate S is within the imaging field of view, the camera needs to be moved between the marks M to image both marks M on the substrate S. In other words, if the camera is mounted on the mounting head 31 adjacent to the mounting head 31, the camera (mounting head 31) needs to be moved a greater distance than the distance between the two marks M, which may lead to even larger errors and increased dust generation.

[0064] This remains true whether there is one or multiple cameras. Even if two cameras are positioned adjacent to the mounting head 31 to correspond to two marks M, the field of view can only cover areas further away than the distance between the two diagonally positioned marks M. Therefore, the cameras must be moved along with the mounting head 31, resulting in a similar misalignment.

[0065] Furthermore, for example, if the mark M on the substrate S is recognized first, and then the mark m on the electronic component C is recognized, the camera that captures the mark m on the electronic component C held by the mounting head 31 located at the mounting position OA cannot recognize its position because the electronic component C is hidden when the substrate S is in the mounting position (mounting position OA). Therefore, after obtaining positional information for positioning, the substrate S must be moved to capture the mark m and then returned to its original position, and this movement causes a displacement of the substrate S. In addition, dust generation also increases.

[0066] Alternatively, one could prepare a template with a mark corresponding to mark M on the circuit board S at a different location than where the component should be mounted, and position the component based on the relative position of the mark on the template and the mark M on the circuit board S. However, in this case, the mounting head 31 and camera must be moved each time an electronic component C is mounted in order to recognize the mark on the template. This would increase the time required for recognizing the mark on the template and for positioning, thus reducing productivity. Furthermore, the increased movement distance of the mechanism would increase the amount of dust generated and the errors associated with the movement.

[0067] In this embodiment, after imaging marks m and M, the movement distance of the electronic component C and the substrate S can be reduced, thereby suppressing positional misalignment, decreased productivity, and dust generation.

[0068] The transparent portion has a transparent plate-like member. Therefore, it is possible to ensure the holding of the electronic component C and transparent imaging of the mark M on the substrate S in a narrow area corresponding to the size of a minute electronic component C.

[0069] The first imaging unit 4 and the second imaging unit 5 are fixedly mounted relative to the mounting position OA. Therefore, there is no misalignment between the imaging area of ​​the first imaging unit 4 and the imaging area of ​​the second imaging unit 5, and dust generation due to movement can also be prevented.

[0070] The stage 21 has a drive mechanism 22 that functions as a positioning mechanism, and the drive mechanism 22 has a two-axis movement mechanism that moves the stage 21 in a horizontal plane, and the two-axis movement mechanism has a pair of guide rails 22a and a pair of guide rails 22b that are perpendicular to the same, and the pair of guide rails 22a and the pair of guide rails 22b are arranged symmetrically with respect to the mounting position OA. As a result, when mounting electronic components C onto a substrate S positioned at the mounting position OA, deformation of the stage 21 is suppressed, and high-precision mounting becomes possible. Of course, deformation can be suppressed by arranging the pair of guide rails 22a and 22b with respect to the mounting position OA, so they are not necessarily limited to being arranged symmetrically with respect to the mounting position OA.

[0071] The drive mechanism 22 includes a movable plate 23 that moves along a guide rail 22b, and the movable plate 23 has a through hole 23a formed therein so that the first imaging unit 4 can image the electronic component C. Therefore, the first imaging unit 4 can image the electronic component C without being obstructed by the mechanism for positioning the substrate S. In addition, a light-transmitting member may be fitted into the through hole 23a as long as the substrate S can be imaged, and part or all of the movable plate 23 may be made of a light-transmitting member.

[0072] [Differentiation] (1) The mounting head 31 only needs to be configured such that the second imaging unit 5 can image the mark M on the substrate S. For this reason, even if the transparent portion of the mounting head 31 is not made of a transparent material, a through hole may be formed at the location corresponding to the mark M. More specifically, the holding portion 31b may be made of an opaque material and a through hole may be formed at the location corresponding to the mark M, or the hollow portion 31a may not exist and the holding portion 31b may be made of an opaque material and a through hole may be formed at the location of the mounting head 31 and the holding portion 31b corresponding to the mark M. In other words, such a through hole is also a transparent portion of the mounting head 31.

[0073] (2) The following configurations are possible for the imaging fields of the first imaging unit 4 and the second imaging unit 5. (A) Unified imaging field The simultaneous imaging field of view is the field of view range in which multiple marks m or multiple marks M can be imaged simultaneously. For example, the position of an electronic component C when it is passed to the mounting head 31 varies within a certain range. Therefore, if the imaging field of view is large enough to image even if the positions of the two marks m of the electronic component C vary, there is no need to move the first imaging unit 4 to image the two marks m. Similarly, if the second imaging unit 5 also has a simultaneous imaging field of view, there is no need to move it to image the two marks M.

[0074] (B) Individual imaging field An individual imaging field of view is an imaging field of view that captures multiple marks m or multiple marks M individually, that is, a field of view range in which one mark m or one mark M can be captured.

[0075] In the above embodiment, we described a case where the first imaging unit 4 and the second imaging unit 5 can image the mounting area B of the electronic component C and the substrate S within a single imaging field, while enabling the image of the mark M through the mounting head 31. However, depending on the required mounting accuracy, a higher magnification may be necessary. In such a case, there is a risk that the mounting area B of the electronic component C and the substrate S cannot be imaged within a single imaging field. In other words, the first imaging unit 4 and the second imaging unit 5 may only have individual imaging fields. In this case, as described above, it is necessary to move the imaging field between multiple marks to image the marks.

[0076] This movement between marks in the imaging field of view is, for example, by moving the mounting head 31 between two marks m located diagonally opposite each other at the corners of an electronic component C, relative to the first imaging unit 4 that images the electronic component C. Since the mounting head 31 is capable of XY movement, it can be applied directly. Even when such movement between marks in the imaging field of view is necessary, only the mounting head 31 is moved, and its movement distance is limited to the size of the electronic component C, resulting in a short movement distance and thus suppressing errors and dust generation.

[0077] Alternatively, movement between marks m in the imaging field may be performed by moving the first imaging unit 4. In other words, the first imaging unit 4 may be movably provided at the position where the electronic component C is mounted (mounting position OA). If the first imaging unit 4 is movable, a moving device for moving it is provided, and the first imaging unit 4 is fixed to the moving device. In this case, only the first imaging unit 4 moves, and the mounting head 31 does not move. Furthermore, the distance of movement is limited to the size of the electronic component C, and only a short distance is required. Therefore, errors and dust generation can be suppressed. In addition, since the first imaging unit 4 is positioned below the substrate S, even if dust is generated, the adhesion of dust to the surface of the substrate S can be suppressed.

[0078] Similarly, for example, to image two marks M located diagonally at the corners of a rectangular area near the mounting area B of a substrate S, the imaging field is moved between the marks M. In this case, the stage 21 is moved between the marks M relative to the second imaging unit 5 that images the substrate S. Since the stage 21 can move in the XY direction, it can be applied as is. Even in this case, only the stage 21 is moved, and the distance it moves is limited to the size of the area near the mounting area B of the substrate S, requiring only a short movement distance, thus suppressing errors and dust generation. Since the drive mechanism 22 of the stage 21 is located below the substrate S, even if dust is generated, the dust will not adhere to the surface of the substrate S.

[0079] Alternatively, movement between marks M may be performed by moving the second imaging unit 5. In other words, the second imaging unit 5 may be movably provided at the position where the electronic component C is mounted (mounting position OA). If the second imaging unit 5 is movable, a moving device for moving it is provided, and the second imaging unit 5 is fixed to the moving device. In this case, only the second imaging unit 5 moves, and the mounting head 31 and stage 21 do not move. Furthermore, the movement distance is limited to the vicinity of the mounting area B of the substrate S, and only a short movement distance is required. Therefore, errors and dust generation can be suppressed.

[0080] (3) In the above embodiment, the calculated position of the electronic component C and the position of the mounting area B on the substrate S were positioned to align with the reference position, but the invention is not limited to this, and the positioning may be such that the position of the mounting area B is aligned with the position of the electronic component C, or the position of the electronic component C is aligned with the position of the mounting area B. In short, it is sufficient to align the position of the mounting area B on the substrate S with the position of the electronic component C.

[0081] (4) In the above embodiment, the control device 6 controls the movement of the substrate S in order to position the electronic component C and the substrate S. However, it is not necessary to move the substrate S for positioning, i.e., alignment correction. In this case, the mounting head 31 moves the electronic component C. As shown in Figure 2, the substrate S often has multiple electronic components C mounted on it. In such a substrate S, the movement range of the stage 21 for positioning each mounting area B at the mounting position OA becomes large. In this case, the positioning error often differs depending on the location within the movable range of the stage 21, and there is a risk that the recognition result of the substrate position by the camera (second imaging unit 5) that images the substrate S may not be accurately reflected. Therefore, by positioning the substrate position (mounting position OA = position of mark M) with respect to the reference position by moving the mounting head 31, the electronic component C and the substrate S can be positioned more accurately. Furthermore, by moving the smaller and lighter mounting head 31 instead of the large and heavy stage 21, movement errors can be suppressed even further. In this case, the substrate positioning in step S107 in Figure 5 is performed by operating the drive mechanism 32.

[0082] (5) The transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S should be moved away from the mounting position OA before the first imaging unit 4 images the mark m of the electronic component C.

[0083] (6) In the above embodiment, face-down mounting was performed. That is, in face-down mounting, individual electronic components C before being separated from the wafer have the side (face) on which the semiconductor layer is formed facing upward, i.e., face-up. The picked-up electronic component C is inverted and faces downward, i.e., face-down. The transfer mechanism that receives this passes it to the mounting head 31 in the downward position, so the mounting head 31 holds the electronic component C facing downward. The face (including mark m) of the electronic component C is imaged from below the mounting head 31 by the first imaging unit 4. The substrate S moves below the mounting head 31. The face (including mark M) of the substrate S is imaged from above the mounting head 31 through the transmission unit by the second imaging unit 5. The mounting head 31 positions the electronic component C and the substrate S it holds and performs mounting.

[0084] On the other hand, the mounting apparatus 1 in the above embodiment can also perform face-up mounting. In the case of face-up mounting, the first imaging unit 4 is not used because it cannot image the face of the electronic component C, and the face of the electronic component C is imaged by the second imaging unit 5. That is, the electronic component C picked up from the wafer is upright without being inverted. The transfer mechanism that receives it passes it to the mounting head 31 in an upright state, so the mounting head 31 holds the electronic component C upright. From above the mounting head 31, the face (including mark m) of the upright electronic component C is imaged by the second imaging unit 5 through the transparent unit. The substrate S moves below the mounting head 31. From above the mounting head 31, the face (including mark M) of the substrate S is imaged by the second imaging unit 5 through the transparent unit. The mounting head 31 positions the electronic component C and the substrate S and performs mounting.

[0085] When performing face-up mounting in this manner, the positioning of the mounting head 31 relative to the electronic component C may be performed based on the imaging result of the mark m of the electronic component C, prior to positioning the electronic component C and the substrate S. If the deviation of the electronic component C held by the mounting head 31 from the reference position is large, the mark M on the substrate S may be hidden by the electronic component C, but this positioning can avoid such a situation. This is similar to the first-order correction when the cameras of the first imaging unit 4 and the second imaging unit 5, described later, are infrared cameras. As a result, this mounting apparatus 1 can be applied to face-up mounting while exhibiting the same effects as the above embodiment.

[0086] (7) The second imaging unit 5 can be a camera capable of transparently imaging the mark m of the electronic component C. For example, the camera of the second imaging unit 5 that images the mark M of the substrate S can be an infrared camera. This allows the second imaging unit 5 to image the mark m of the electronic component C held in the holding unit 31b by passing through the electronic component C via the holding unit 31b. The positioning mechanism positions the substrate S and the electronic component C based on the mark M of the substrate S and the mark m of the electronic component C imaged by the second imaging unit 5. Prior to this, the positioning mechanism positions the electronic component C based on the position of the electronic component C determined from the image of the mark m of the electronic component C imaged by the first imaging unit 4.

[0087] In other words, as described above, after the first imaging unit 4 captures the mark m of the electronic component C, the electronic component C is positioned at a reference position (first-order correction). Then, the mounting head 31 is moved to bring the electronic component C close to the substrate S, and the second imaging unit 5 simultaneously captures the mark M on the substrate S and the electronic component C transparently, positioning the substrate S (second-order correction), and mounting the electronic component C onto the substrate S. After imaging by the second imaging unit 5, the mounting head 31 only needs to move downward over a very short distance for mounting, so positional misalignment is further suppressed.

[0088] This positioning operation will be explained in detail with reference to the explanatory diagram in Figure 6 and the flowchart in Figure 7. The upper part of Figures 6(A) to (C) is a side view showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, while the lower part is a plan view showing the positions of the electronic component C and mark m to be imaged, and the mark M on the substrate S.

[0089] The operation from the transfer of the electronic component C to the movement of the substrate S is the same as in S101 to S105 above (S201 to S205). That is, as shown in Figure 6(A), the electronic component C is held in the holding part 31b of the electronic component C with the face on mark m facing the first imaging unit 4. In this state, the first imaging unit 4 captures an image of mark m, recognizes its position, and performs a primary correction to align the electronic component C to the reference position.

[0090] Then, as shown in Figure 6(B), the retracted stage 21 moves to the mounting position OA, that is, below the second imaging unit 5 (step S205), and the mounting head 31 descends relative to the substrate S on which it is placed, positioning the electronic component C and the substrate S so that there is a gap of approximately 10 μm between them (step S206).

[0091] In this state, the second imaging unit 5 images the mark M on the substrate S through the transparent portion of the holding unit 31b (step S207). Simultaneously, the second imaging unit 5 images the mark m of the electronic component C held by the holding unit 31b, passing through the transparent portion of the holding unit 31b and the electronic component C. As shown in Figure 6(C), the second imaging unit 5 recognizes the positions of mark m and mark M by imaging them, positions the electronic component C and the substrate S (secondary correction) (step S208), lowers the mounting head 31, and mounts the electronic component C onto the substrate S (step S209).

[0092] As described above, since the positions of the electronic component C and the substrate S are recognized simultaneously by the same imaging unit while the substrate S and the electronic component C are in close proximity, there are no positional errors between imaging units that would occur when using position recognition results from multiple imaging units. Therefore, the positioning accuracy of the electronic component C and the substrate S can be improved compared to the above embodiment. In addition, because the downward distance after positioning the electronic component C and the substrate S is small, positional displacement due to downward movement is suppressed, and positioning accuracy is further improved.

[0093] Furthermore, when the second imaging unit 5 simultaneously recognizes the positions of the electronic component C and the substrate S, it is sufficient for the second imaging unit 5 to capture images of the mark m on the electronic component C and the mark M on the substrate S with sufficient recognition accuracy; it is not necessarily required to bring the electronic component C and the substrate S closer together in step S206. In this case, the downward movement of the electronic component C is not performed in separate steps, thus shortening the processing time.

[0094] If the electronic component C held by the mounting head 31 is significantly misaligned from its reference position, the mark M on the substrate S may be obscured by the electronic component C. However, prior to the second imaging unit 5 recognizing the positions of mark m and mark M by imaging them, the first imaging unit 4 images and recognizes the position of mark m, and performs a primary correction to align the electronic component C to its reference position, thereby avoiding such a situation. Note that if the misalignment of the electronic component C when it is transferred to the mounting head 31 is within an acceptable range, the primary correction may not be necessary.

[0095] Furthermore, this type of primary correction can also be applied to face-up mounting if a camera capable of transparent imaging is used as the first imaging unit 4. In other words, the first imaging unit 4 may have a camera capable of transparently imaging the mark m of the electronic component C, and the positioning mechanism may position the electronic component C based on the position of the electronic component C determined from the image of the mark m of the electronic component C captured by the first imaging unit 4, and then position the substrate S and the electronic component C based on the mark M of the substrate S and the mark m of the electronic component C captured by the second imaging unit 5. In this case, the second imaging unit 5 does not necessarily have to be a camera capable of transparently imaging the mark m of the electronic component C.

[0096] (8) Furthermore, a reference mark can be provided on the mounting head 31, which is a tool for mounting. The mark provided on the mounting head 31 is provided so that it can be captured from either the first imaging unit 4 or the second imaging unit 5. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C determined from the images of the mark m of the electronic component C, the mark M of the substrate S, and the mark on the mounting head 31 captured by the first imaging unit 4 and the second imaging unit 5. In this case, the mark on the mounting head 31 is captured in advance by both the first imaging unit 4 and the second imaging unit 5, and the positioning (reference alignment) of the cameras of the first imaging unit 4 and the second imaging unit 5 is performed based on the mark on the mounting head 31. This suppresses the misalignment of the position detection results between the cameras, and further suppresses misalignment of the mounting position. It also suppresses misalignment due to changes in the position of each camera over time.

[0097] For example, aligning the two cameras could be done using a jig prepared separately from the mounting head 31. However, such a jig would need to be attached to the device when adjustment of the camera alignment is required and removed when imaging is complete. Thus, the jig needs to be set up each time adjustment is needed, resulting in poor maintainability and productivity. Furthermore, the installation and removal of the jig increases dust generation. It is also difficult to track changes over time in real time. In this embodiment, there is no need to install or remove the jig. Adjustments over time can be made in real time while the device is in operation, achieving high mounting accuracy and suppressing dust generation.

[0098] Furthermore, since the mark on the mounting head 31 is used as a reference, compared to, for example, using a mark on a template (jig) prepared separately from the mounting head 31 within the device, extra movement and time are not required for mark recognition, thus suppressing a decrease in productivity, an increase in dust generation, and errors associated with movement.

[0099] This positioning operation will be explained in detail with reference to the explanatory diagram in Figure 8 and the flowchart in Figure 9. The upper part of Figures 8(A) to (C) is a side view showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, while the lower part is a plan view showing the positions of the electronic component C and mark m, the mark M on the substrate S, and the mark ma on the mounting head 31.

[0100] First, the mark ma of the mounting head 31 is located on the lower end surface of the holding portion 31b, in a position that does not overlap with the holding position of the electronic component C, and is in a position that can be imaged through the transparent portion. For example, as shown in Figure 8(A), two marks are provided diagonally opposite each other so as to be located outside the mark m of the electronic component C. Before the mounting head 31 holds the electronic component C, the mark ma of the mounting head 31 is imaged by the first imaging unit 4 and the second imaging unit 5, and a correction value, which is the amount of displacement of the mark ma relative to the respective reference position (including the inclination in the horizontal plane), is registered (step S301). The transfer mechanism transfers the electronic component C (step S302), and the mounting head 31 holds the electronic component C (step S303).

[0101] The first imaging unit 4 simultaneously images the mark m of the electronic component C and the mark ma of the mounting head 31, and calculates the positional relationship between them (step S304). As shown in Figure 8(B), the substrate S moves to the mounting position OA (step S305), and the second imaging unit 5 simultaneously images the mark M of the substrate S and the mark ma of the mounting head 31, and calculates the positional relationship between them (step S306). The positioning mechanism positions the electronic component C and the substrate S based on the registered correction values ​​of the first imaging unit 4 and the second imaging unit 5, the positional relationship between the mark m of the electronic component C and the mark ma of the mounting head 31, and the positional relationship between the mark M of the substrate S and the mark ma of the mounting head 31, using the mark ma of the mounting head 31 as a reference (step S307). As shown in Figure 8(C), after positioning, the mounting head 31 is lowered to mount the electronic component C onto the substrate S (step S308).

[0102] As described above, the positional relationship between the first imaging unit 4 and the second imaging unit 5 can be determined using the mark ma provided on the mounting head 31 as a reference, and the positions of the electronic component C and the substrate S can be aligned. Since positional errors between multiple imaging units can be suppressed, the positioning accuracy between the electronic component C and the substrate S can be further improved compared to the above embodiment. Furthermore, even if the positional relationship between multiple imaging units changes over time, the positioning accuracy between the electronic component C and the substrate S can be maintained, thus improving positioning accuracy. In addition, in the above embodiment, assembly of the mounting device 1 takes time in order to bring the positions of the first imaging unit 4 and the second imaging unit 5 as close as possible to the reference position (design position). However, in this embodiment, high precision is not required for the positions of the first imaging unit 4 and the second imaging unit 5 relative to the reference position during assembly, thus saving labor during the manufacturing and maintenance of the device.

[0103] The mark ma provided on the mounting head 31 can be any feature point (mark) that can be imaged by the first imaging unit 4 and the second imaging unit 5. The feature point can be a printed or engraved design, a recess, or a through hole. If the holding part 31b on which the mark ma is provided is made of a transparent plate material such as glass, it is not necessary to provide the mark ma on the lower end surface of the holding part 31b; the mark ma may be provided on the surface of the holding part 31b opposite to the surface that holds the electronic component C. In this case as well, the first imaging unit 4 and the second imaging unit 5 can still image the mark ma, and errors can be suppressed. Also, if it is a through hole, even if the holding part 31b is not made of a transparent material, one hole can be imaged by the first imaging unit 4 and the second imaging unit 5, so errors can be suppressed again.

[0104] Alternatively, instead of marking the mounting head 31, the through-hole 23a formed in the movable plate 23 of the substrate support mechanism 2 can be made of a light-transmitting material such as a transparent glass plate, and the mark can be made on that light-transmitting material. The portion of the through-hole 23a is for imaging the electronic component C with the first imaging unit 4, so it does not interfere with the substrate S.

[0105] [Other embodiments] Although embodiments and modifications of the present invention have been described above, these embodiments and modifications are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the invention described in the claims. [Explanation of Symbols]

[0106] 1. Mounting device 2 Board support mechanism 3. Implementation mechanism 4. First imaging unit 5. Second imaging unit 6 Control device 11 Support stand 11a Intake 21 stages 22 Drive mechanism 22a, 22b, 33a, 34a, 35a Guide rails 23 Mobile plate 23a Through hole 31 Mounting Head 31a Hollow part 31b Holding part 32 Drive mechanism 33, 34, 35 Mobile Units C Electronic components S substrate m, M, ma marks

Claims

1. A mounting mechanism for mounting electronic components onto a circuit board, A substrate support mechanism that supports the substrate on which the aforementioned electronic components are mounted, A mounting head provided in the mounting mechanism, having a transparent portion that allows the mark on the substrate to be seen through and recognized while the electronic component is being held, The mounting head is positioned below the substrate support mechanism at the mounting position where the electronic component is mounted on the substrate, and with the substrate retracted from the mounting position, a first imaging unit captures the mark of the electronic component held by the mounting head, A second imaging unit is positioned above the mounting head at the aforementioned mounting position and captures the mark on the substrate through the transparent section, A positioning mechanism that positions the substrate and the electronic component based on the positions of the substrate and the electronic component determined from the images of marks captured by the first imaging unit and the second imaging unit, It has, The mounting head is provided with a mark that allows the first imaging unit to capture an image at a position that does not overlap with the holding position of the electronic component while the electronic component is being held, and also allows the second imaging unit to capture an image through the transparent unit. The positioning mechanism positions the substrate and the electronic component based on the positional relationship between the mark on the electronic component and the mark on the mounting head, determined from an image obtained by the first imaging unit simultaneously capturing the mark on the electronic component and the mark on the mounting head; the positional relationship between the mark on the substrate and the mark on the mounting head, determined from an image obtained by the second imaging unit simultaneously capturing the mark on the substrate and the mark on the mounting head; and the amount of deviation between the position of the mark on the mounting head and the respective reference positions, determined from the images obtained by the first and second imaging units, before the mounting head holds the electronic component. An electronic component mounting apparatus characterized by the following:

2. The mounting apparatus for electronic components according to claim 1, characterized in that the first imaging unit and the second imaging unit are fixedly mounted with respect to the mounting position.

3. The electronic component mounting apparatus according to claim 1, characterized in that the second imaging unit has a camera capable of transparently imaging the marks of the electronic components.

4. The mounting apparatus for electronic components according to claim 1, characterized in that the positioning mechanism positions the electronic component based on the position of the electronic component obtained from the image of the mark of the electronic component captured by the first imaging unit, prior to positioning the substrate and the electronic component.

5. The electronic component mounting apparatus according to claim 1, characterized in that the first imaging unit has a camera capable of transparently imaging the marks of the electronic components.

6. The electronic component mounting apparatus according to claim 1, characterized in that the transparent portion has a transparent plate-like member.

7. The electronic component mounting apparatus according to claim 1, characterized in that the positioning mechanism aligns the first imaging unit and the second imaging unit based on the mark on the mounting head.

8. The electronic component mounting apparatus according to any one of claims 1 to 7, characterized in that it has a transfer mechanism for transferring the electronic component to the mounting head at the mounting position.

Images