Mounting device and mounting method

Abstract

To provide a compact mounting device capable of separating a substrate from a heat source when the substrate should not be heated.SOLUTION: A mounting device 1 being a mounting device for mounting electronic components CH11, CH12... onto substrates SB1, SB2... includes a lower die 10 configured to hold the substrates SB1, SB2... on which the electronic components CH11, CH12... are placed, and an upper die 20 arranged so as to be opposed to the lower die 10. The lower die 10 includes a cavity plate 11A facing a space between the lower die 10 and the upper die 20, a heater 14 configured to heat the cavity plate 11A, lifter pins 12A, 12B... configured to hold the substrates SB1, SB2... and a set pin 16 that is pressed by the upper die 20. The lifter pins 12A, 12B... are configured to be able to change a distance d between the substrates SB1, SB2... and the cavity plate 11A by the pressing force applied to the set pin 16 from the upper die 20.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method using the device.

Background Art

[0002] There is a bonding technique in which a bonding material or bumps disposed between a substrate and an electronic component are heated while being pressurized. For example, sintering bonding is performed by heating a bonding material disposed between a substrate and an electronic component while applying pressure to sinter the bonding material. Bump bonding is performed by heating bumps disposed between a substrate and an electronic component while applying pressure to melt the bumps. In such bonding techniques, heating the bonding material or bumps without applying pressure causes a decrease in the adhesive strength between the substrate and the electronic component.

[0003] In order to prevent the bonding material or bumps from being heated at an undesired timing, a device has been proposed in which a float mechanism for lifting the substrate is provided in a mold and the substrate is separated from a heat source until a desired timing. For example, Patent Document 1 discloses a bonding device including a movable support pin that can protrude from a heated clamp surface, and a work in which metal bumps such as solder bumps are temporarily bonded onto a substrate with an adhesive layer is lifted by the movable support pin and separated from the clamp surface until the timing of main bonding.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The bonding apparatus disclosed in Patent Document 1 moves a movable support pin up and down using a lifting mechanism (not shown). Adding a servo motor or the like as part of the lifting mechanism increases the number of parts and makes the apparatus larger. The present invention has been made in view of these problems and aims to provide a compact mounting apparatus that can separate the substrate from a heat source when it is not desired to heat the substrate. [Means for solving the problem]

[0006] A mounting apparatus according to one aspect of the present invention is a mounting apparatus for mounting at least one electronic component on at least one substrate, comprising: a first mold configured to hold at least one substrate on which at least one electronic component is mounted; and a second mold disposed opposite to the first mold. The first mold comprises: a heating plate facing the space between the first mold and the second mold; a heater for heating the heating plate; at least one holding member for holding at least one substrate; and at least one pressing member pressed by the second mold. The at least one holding member is configured to change the distance between at least one substrate and the heating plate by a pressing force applied from the second mold to at least one pressing member.

[0007] Another embodiment of the present invention relates to a mounting method for mounting at least one electronic component on at least one substrate, comprising: providing a first mold configured to hold at least one substrate on which at least one electronic component is mounted; and providing a second mold positioned opposite the first mold. The first mold comprises a heating plate facing the space between the first mold and the second mold; a heater for heating the heating plate; at least one holding member for holding at least one substrate; and at least one pressing member pressed by the second mold, and the mounting method further comprises the pressing force applied from the second mold to at least one pressing member causing at least one holding member to change the distance between at least one substrate on which at least one electronic component is mounted and the heating plate. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a technology relating to a compact mounting device that can separate a substrate from a heat source when it is not desired to heat the substrate. [Brief explanation of the drawing]

[0009] [Figure 1] This is a cross-sectional view showing an example of an assembly device according to one embodiment of the present invention. [Figure 2] Figure 1 is a cross-sectional view showing an example of a gas supply port. [Figure 3] This flowchart shows an example of a mounting method using the mounting device of one embodiment of the present invention. [Figure 4] This flowchart shows an example of a mounting method using the mounting device of one embodiment of the present invention, as shown in Figure 3. [Figure 5] Figures 3 and 4 show the temperature profiles of the implementation methods. [Figure 6] This is a cross-sectional view showing the state in which the mold is closed to the second position, the degassing chamber is closed, and inert gas is supplied while degassing is performed. [Figure 7] This is a cross-sectional view showing the state in which the mold is closed to the third position, reducing the distance between the substrate and the heating plate. [Figure 8] This is a cross-sectional view showing the state in which the mold is closed to the fourth position and heated by the heating plate while being pressurized by the movable piece. [Figure 9] This is a cross-sectional view showing the state in which the mold has been opened to the second position, increasing the distance between the substrate and the heating plate. [Modes for carrying out the invention]

[0010] A preferred embodiment of the present invention will be described with reference to the attached drawings. In each figure, components with the same reference numerals have the same or similar configuration. In the following description, "up" and "down" are defined with respect to gravity. Figure 1 is a cross-sectional view showing an example of a mounting apparatus 1 of one embodiment of the present invention. The mounting apparatus 1 is a mounting apparatus for mounting at least one electronic component on each of at least one substrates.

[0011] In the illustrated example, mounting device 1 is configured as a sintering device that sinters bonding materials SN11 and SN12, placed between the substrate SB1 and the electronic components CH11 and CH12, by heating and pressurizing them to bond the substrate SB1 and the electronic components CH11 and CH12. The number of electronic components and bonding materials on a single substrate are not limited to the two shown in the illustration; three or more electronic components may be arranged in a matrix on a single substrate, or one electronic component may be placed on a single substrate. Also, in the illustrated example, two substrates are set on the left and right sides from the operator's perspective, but multiple substrates may be set in front of and behind the operator from the operator's perspective. Furthermore, mounting device 1 is not limited to a sintering device; it may be a flip-chip bonder that heats solder bumps, etc., placed between the electronic component SB1 and the substrate CH11 and CH12 while applying pressure, or it may be any other type of mounting device.

[0012] In the following description, the substrate SB1, electronic components CH11 and CH12, and bonding materials SN11 and SN12 are collectively referred to as workpiece W1. The mounting apparatus 1 may perform the mounting process of multiple workpieces in a single heating and pressurizing cycle. In the illustrated example, the mounting process of two workpieces W1 and W2 is performed in a single heating and pressurizing cycle. The other workpiece W2 contains the same substrate SB2, electronic components CH21 and CH22, and bonding materials SN21 and SN22 as the first workpiece W1. The number of electronic components for each substrate is at least one and not limited to two. There may be one or three or more.

[0013] In the space between the lower mold 10 and the upper mold 20, workpiece W1 is supplied such that the substrate SB1 faces the lower mold 10 and the electronic components CH11 and CH12 face the upper mold 20, and workpiece W2 is supplied such that the substrate SB2 faces the lower mold 10 and the electronic components CH21 and CH22 face the upper mold 20. In the following description, the surface on which the electronic components CH11, 12, 21, and 22 are mounted may be referred to as the front or top surface of substrates SB1 and SB2, and the opposite surface may be referred to as the back or bottom surface of substrates SB1 and SB2.

[0014] When the mounting device 1 is a sintering device, preferred examples of substrates SB1 and SB2 are a direct-bonded copper (DBC) substrate with copper circuits, a direct-bonded aluminum (DBA) substrate with aluminum circuits, and the like. Substrate 102 is not limited to a ceramic substrate, but may be a semiconductor substrate such as a silicon substrate, a metal substrate such as a lead frame, or an insulating substrate such as a PCB (Printed Circuit Board) substrate. The thicknesses of substrates SB1 and SB2 may be different from each other or the same.

[0015] Electronic components CH11, CH12, CH21, and CH22 are, for example, semiconductor chips. Electronic components CH11, 12, 21, and 22 are not limited to semiconductor chips, but may also be passive elements such as resistors, inductors, capacitors, and crystal oscillators, or active elements such as tide diodes, transistors, thyristors, and operational amplifiers. The heights of electronic components CH11 and CH12 may be different from each other or the same. The heights of electronic components CH21 and CH22 may also be different from each other or the same.

[0016] The bonding materials SN11, SN12, SN21, and SN22 are sintering materials containing, for example, silver (Ag) nanoparticles. The mounting device 1 heats and presses the bonding materials SN11, SN12, SN21, and SN22 to sinter them. The bonding materials SN11, SN12, SN21, and SN22 are not limited to sintering materials, and may be semi-sintering materials, metal solder, organic adhesives, or inorganic adhesives. The form of the bonding material is, for example, an aggregate of powders. The form of the bonding material may be liquid, semi-solid, solid, or film-like, in addition to these.

[0017] As shown in FIG. 1, the mounting device 1 includes a pressing device 3 and a die 2 attached to the pressing device 3. In the illustrated example, the mounting device 1 further includes degassing chambers 31 and 32. The pressing device 3 includes a pair of upper and lower platens 4 and 5 connected by tie bars.

[0018] The die 2 includes an upper die base 21E fixed to the upper platen 5 and a lower die base 11F fixed to the lower platen 4. Between the upper die base 21E and the lower die base 11F, main plates (support plates 21D, 21C, upper die chase 21B, lower die chase 11B, ejector pin plate 11C, retainer plate 11D, etc.) constituting the die 2 are fixed.

[0019] In the following description, the various plates and their components fixed to the lower die base 11F are collectively referred to as the lower die 10, and the various plates and their components fixed to the upper die base 21E are collectively referred to as the upper die 20. The lower die 10 is an example of a "first die" configured to hold the workpieces W1 and W2, and the upper die 20 is an example of a "second die" arranged to face the first die.

[0020] The lower die 10 mainly includes a lower die base 11F, support pillars 11E, a retainer plate 11D, an ejector pin plate 11C, a lower die chase 11B, etc. The lower die chase 11B is fixed above the lower die base 11F via a plurality of support pillars 11E protruding columnar from the lower die base 11F.

[0021] Below the lower die chase 11B are the ejector pin plate 11C and the retainer plate 11D. The ejector pin plate 11C and the retainer plate 11D have holes through which the support pillar 11E passes. The ejector pin plate 11C and the retainer plate 11D are fixed to each other and are configured to slide vertically between the lower die chase 11B and the lower die base 11F.

[0022] Various components, including the cavity plate 11A, are fixed to the lower die chase 11B. In the illustrated example, the cavity plate 11A, the side block 18 that fixes the cavity plate 11A, the heat insulating member 15 that surrounds the bottom and sides of the cavity plate 11A, and the spring 17B and spring sleeve 17A are fixed to the lower die chase 11B.

[0023] Both the ejector pin plate 11C and the retainer plate 11D face the cavity plate 11A from the underside opposite to the upper mold 20. The ejector pin plate 11C and the retainer plate 11D are fixed to a plurality of lifter pins 12A, 12B that can protrude from and retract from the cavity plate 11A, and a set pin 16 that contacts the upper mold 20 when the mold is closed.

[0024] When both the ejector pin plate 11C and the retainer plate 11D move closer to the cavity plate 11A, the lifter pins 12A and 12B protrude from the cavity plate 11A, and when both the ejector pin plate 11C and the retainer plate 11D move away from the cavity plate 11A, the lifter pins 12A and 12B retract into the cavity plate 11A. In the following description, the ejector pin plate 11C and the retainer plate 11D may be collectively referred to as movable plates 11C and 11D.

[0025] The cavity plate 11A is formed in a block shape from a material such as alloy tool steel. The cavity plate 11A is located closest to the upper mold 20 and is in contact with the space between the lower mold 10 and the upper mold 20 when the mold is opened. A heater 14 is provided inside the cavity plate 11A. When the lower mold 10 and the upper mold 20 are closed, the heater 14 heats the substrates SB1 and SB2 via the cavity plate 11A. This heats the bonding materials SN11, SN12, SN21, and SN22. The cavity plate 11A is an example of a "heating plate" that is heated by the heater 14 facing the space between the lower mold 10 and the upper mold 20.

[0026] The heat insulating member 15 is provided between the cavity plate 11A and the lower mold chase 11B, and between the cavity plate 11A and the side block 18. The heat insulating member 15 is made of a material with high thermal resistance, such as glass wool or rock wool, and suppresses direct heat conduction from the cavity plate 11A to the lower mold chase 11B, and suppresses heat conduction from the cavity plate 11A to the lower mold chase 11B via the side block 18.

[0027] In other words, the insulating member 15 is positioned to separate the gas piping and heater 14 provided in the lower mold chase 11B, thereby suppressing the temperature rise of the nitrogen gas supplied from the gas supply port 13. Furthermore, the insulating member 15 is positioned to separate the spring 17B and heater 14, thereby suppressing the decrease in the elastic force of the spring 17B. In short, the insulating member 15 limits the target of heating to the cavity plate 11A, thereby accelerating the temperature rise by the heater 14 and making other components less susceptible to the effects of heat.

[0028] The side block 18 is located outside the cavity plate 11A when viewed from above from the upper mold 20. The side block 18 contacts the upper mold 20 when the lower mold 10 and upper mold 20 are closed. In the illustrated example, a gas supply port 13 is provided in the area outside the heater 14 to supply a gas such as nitrogen (N2) gas to the cavity plate 11A. The gas supply port 13 will be explained in detail later with reference to Figure 2.

[0029] The spring 17B is an example of a "biasing member" and biases the ejector pin plate 11C and retainer plate 11D, which are examples of the aforementioned "movable plates," upward toward the lower die chase 11B. The base end, i.e., the upper end, of the spring sleeve 17A is a stepped bolt and is fixed to the lower surface of the lower die chase 11B. The base end of the spring sleeve 17A may be a combination of a washer, a sleeve, and a bolt. A flange is provided at the tip, i.e., the lower end, of the spring sleeve 17A.

[0030] The retainer plate 11D has a through hole that is larger than the tip of the spring sleeve 17A. The ejector pin plate 11C has a counterbore the same diameter as the through hole and a through hole in the center of the counterbore through which the base end of the spring sleeve 17A is inserted. The spring sleeve 17A is inserted through the through hole in the retainer plate 11D and the through hole in the ejector pin plate 11C.

[0031] The spring 17B is spirally positioned around the spring sleeve 17A between the flange of the spring sleeve 17A and the counterbore of the ejector pin plate 11C. In other words, the spring sleeve 17A is inserted into the spiral spring 17B. The spring 17B acts as an elastic force that separates the ejector pin plate 11C and the flange at the tip of the spring sleeve 17A from each other.

[0032] In other words, the spring 17B constantly biases the ejector pin plate 11C and retainer plate 11D toward the lower die chase 11B via the spring sleeve 17A, that is, it presses them in a direction that moves them upward. The spring 17B is not limited to a coil spring, but may be a leaf spring or the like.

[0033] The lifter pins 12A and 12B are inserted into through holes that penetrate the cavity plate 11A, the lower die chase 11B, the ejector pin plate 11C, and the heat insulating member 15. The lifter pins 12A and 12B are the same length, and three or more pins are used to hold a single workpiece W1 in parallel. The upper die 20 side is the tip, and the lower die base 11F side is the base. The base ends of the lifter pin 12B and the set pin 16 are sandwiched between the ejector pin plate 11C and the retainer plate 11D and secured with screws. The lifter pin 12B and the set pin 16 move up and down in conjunction with the ejector pin plate 11C and the retainer plate 11D.

[0034] Lifter pin 12A supports substrate SB1 by contacting its tip with the back surface of substrate SB1, and lifter pin 12B supports substrate SB2 by contacting its tip with the back surface of substrate SB2. Lifter pins 12A and 12B are configured to move up and down, bringing substrates SB1 and SB2 and cavity plate 11A into and out of contact.

[0035] Specifically, the lifter pins 12A and 12B are configured to move forward and backward relative to the upper mold 20 from the cavity plate 11A. When the lifter pins 12A and 12B are advanced into the space between the lower mold 10 and the upper mold 20, i.e., during mold opening, the workpieces W1 and W2 supported by the lifter pins 12A and 12B move away from the cavity plate 11A. When the lifter pins 12A and 12B are retracted from the space between the lower mold 10 and the upper mold 20, i.e., during mold closing, the workpieces W1 and W2 are supported in contact with the cavity plate 11A.

[0036] When the ejector pin plate 11C and retainer plate 11D move towards (upward from) the cavity plate 11A, the tips of the lifter pins 12A and 12B protrude from the cavity plate 11A. That is, the tips of the lifter pins 12A and 12B advance into the space between the lower mold 10 and the upper mold 20.

[0037] When the ejector pin plate 11C and retainer plate 11D move away from (downward from) the cavity plate 11A, the tips of the lifter pins 12A and 12B are retracted into the cavity plate 11A, and the surfaces of the ends of the lifter pins 12A and 12B become flush with the surface of the cavity plate 11A. In other words, the lifter pins 12A and 12B are exiting the space between the lower mold 10 and the upper mold 20.

[0038] Each of the lifter pins 12A and 12B is formed in a rod shape. The lifter pins 12A and 12B are examples of "holding members" that hold the substrates SB1 and SB2. Note that the holding member is not limited to lifter pins. The holding member may also be an elongated plate-shaped member that holds the end of the workpiece.

[0039] The substrates SB1 and SB2 are supported by the tips (upper ends) of the lifter pins 12A and 12B. Each of the lifter pins 12A and 12B is inserted into a through-hole that penetrates the cavity plate 11A and fixed to the movable plates, the ejector pin plate 11C and the retainer plate 11D.

[0040] The set pin 16 is inserted through a through hole that penetrates the side block 18, the lower mold chase 11B, and the ejector pin plate 11C. The set pin 16 has its tip end on the upper mold 20 side and its base end on the lower mold base 11F side. The base end of the set pin 16 is sandwiched between the ejector pin plate 11C and the retainer plate 11D. The tip of the set pin 16 faces the side block 28 of the upper mold 20.

[0041] When the lower mold 10 and upper mold 20 are closed, the set pins 16 are pressed against the side block 28, pushing down the ejector pin plate 11C and the retainer plate 11D. By pushing down the ejector pin plate 11C and the retainer plate 11D, the lifter pins 12B are pushed down in conjunction, causing the substrates SB1 and SB2 on the lifter pins 12B to move downward. Furthermore, in order to push down the ejector pin plate 11C and the retainer plate 11D in parallel, it is preferable to position the set pins 16 at the four corners of the substrate SB1.

[0042] One of the features of the mounting apparatus 1 of this embodiment is that it is equipped with a float mechanism that lifts substrates SB1 and SB2 so that they are separated from the cavity plate 11A. In the illustrated example, the float mechanism consists of lifter pins 12A and 12B that can contact the back surfaces of substrates SB1 and SB2 which are inserted through holes in the cavity plate 11A, a movable ejector pin plate 11C to which the base ends (lower ends) of the lifter pins 12A and 12B are fixed, a movable retainer plate 11D, a coil spring 17B that biases the movable ejector pin plate 11C and movable retainer plate 11D toward the cavity plate 11A, and a set pin 16 that, when pressed from the upper die 20, pushes down the movable ejector pin plate 11C and movable retainer plate 11D against the biasing force of the coil spring 17B.

[0043] The upper mold 20 mainly includes the upper mold base 21E, upper support plate 21D, lower support plate 21C, upper mold chase 21B, pressure regulating mechanism 9, etc. The upper and lower support plates 21D and 21C are fixed to the upper mold base 21E. The upper mold chase 21B is fixed to the upper mold base 21E via the upper support plate 21D and the lower support plate 21C.

[0044] Various components, including the cavity plate 21A, are fixed to the upper chase 21B. In the illustrated example, the upper chase 21B is provided with the cavity plate 21A, side blocks 28 for fixing the cavity plate 21A, heat insulating members 25 arranged to surround the top and sides of the cavity plate 21A, and a part of the pressure regulating mechanism 9. The pressure regulating mechanism 9 will be explained in detail later.

[0045] The cavity plate 21A is located closest to the lower mold 10. A heater 24 is provided inside the cavity plate 21A. The heater 24 heats the movable pieces 22Ab, 22Bb, 22Cb, and 22Db, which will be described later, via the cavity plate 21A.

[0046] When the lower mold 10 and upper mold 20 are closed, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 via the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the film F. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0047] The side block 28 is located on the side of the upper mold chase 21B that faces the lower mold 10. When viewed from above from the upper mold 20, the side block 28 is located on the outside of the cavity plate 21A. The side block 28 is the part of the upper mold 20 that contacts the lower mold 10 when the lower mold 10 and the upper mold 20 are closed. The side block 28, fixed to the upper mold chase 21B, faces the side block 18, fixed to the lower mold chase 11B, in the vertical direction.

[0048] The aforementioned set pin 16 is an example of a "pressing member" that is pressed against the upper mold 20, which is the second mold. When the lower mold 10 and the upper mold 20 are closed, the side block 28 of the upper mold 20 contacts and presses against the set pin 16. When the lower mold 10 and the upper mold 20 are closed, the side block 28 may be spaced apart from the set pin 16.

[0049] The heat insulating member 25 is provided between the cavity plate 21A and the upper mold chase 21B, and between the cavity plate 21A and the side block 28. The heat insulating member 25 suppresses direct heat conduction from the cavity plate 21A to the upper mold chase 21B, and suppresses heat conduction from the cavity plate 21A to the upper mold chase 21B via the side block 28.

[0050] The insulating member 25 partitions the heater 24 from the internal space 23, thereby suppressing thermal degradation of the springs 23A, 23B, 23C, and 23D. In other words, the insulating member 25 limits the heating target to the cavity plate 21A, thereby accelerating the temperature rise by the heater 24 and making other components less susceptible to the effects of heat.

[0051] During the assembly process, a film F is stretched across the surface of the cavity plate 21A facing the lower mold 10. A suction hole (not shown) is provided on the lower surface of the cavity plate to attract the film F. The suction hole is connected to an external vacuum pump.

[0052] Examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), fluorine-impregnated glass cloth, PP (polypropylene), and PVDC (polyvinyl chloride).

[0053] Film F prevents powder and gas generated from the bonding materials SN11, SN12, SN21, and SN22 from entering the gaps in the upper mold 20, thereby suppressing malfunctions of the upper mold 20. In addition, film F functions as a buffer between the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the electronic components CH11, CH12, CH21, and CH22, and has the effect of suppressing damage to the electronic components CH11, CH12, CH21, and CH22 when pressurized.

[0054] The upper mold 20 is equipped with a pressure adjustment mechanism 9 that adjusts the pressure applied to each of the electronic components CH11, CH12, CH21, and CH22 to prevent mounting defects from occurring due to insufficient or excessive pressure on the bonding material SN11, SN12, SN21, and SN22 caused by differences in the dimensions of the substrates SB1, SB2 and the electronic components CH11, CH12, CH21, and CH22.

[0055] In the illustrated example, the pressure regulating mechanism 9 is composed of movable mechanisms 22A, 22B, 22C, 22D, springs 23A, 23B, 23C, 23D, etc. The movable mechanisms 22A, 22B, 22C, 22D are connected to the springs 23A, 23B, 23C, 23D and are configured to move up and down.

[0056] The pressure adjustment mechanism 9 absorbs the differences in thickness between substrates SB1 and SB2, the differences in height between electronic components CH11, CH12, CH21, and CH22, and the differences in thickness between bonding materials SN11, SN12, SN21, and SN22, and pressurizes the bonding materials SN11, SN12, SN21, and SN22 with approximately equal pressure. Springs 23A, 23B, 23C, and 23D with different spring constants may be selected to configure the system so that the pressure applied to each of the electronic components CH11, CH12, CH21, and CH22 is different from that of the others.

[0057] The configuration of the pressure regulating mechanism 9 is not limited to the illustrated example. For example, the configuration of the pressure regulating mechanism 9 may include a viscous member such as silicone oil sealed in a closed space within the upper mold 20, a plunger that pressurizes the viscous member to adjust the internal pressure, and a plurality of pistons that move up and down due to the internal pressure of the viscous member, with movable mechanisms 22A, 22B, 22C, and 22D connected to each of the plurality of pistons.

[0058] In this configuration, a pressure equal to the internal pressure of the viscous material is applied to all pistons, thus absorbing the differences in thickness of substrates SB1 and SB2, the differences in height of electronic components CH11, CH12, CH21, and CH22, and the differences in thickness of bonding materials SN11, SN12, SN21, and SN22, and allowing bonding materials SN11, SN12, SN21, and SN22 to be pressurized with uniform pressure.

[0059] For the rod-shaped members such as the movable mechanisms 22A, 22B, 22C, and 22D in the upper mold 20, the base end is on the base block 21E side and the tip is on the lower mold 10 side. The base end of the movable mechanism 22A receives the elastic force of the spring 23A, and the tip of the movable mechanism 22A pressurizes the electronic component CH11 based on the elastic force of the spring 23A. As a result, the bonding material SN11 is pressurized by the movable mechanism 22A via the electronic component CH11.

[0060] Similarly, the movable mechanism 22B pressurizes the electronic component CH12 based on the elastic force of the spring 23B, and the bonding material SN12 is pressurized by the movable mechanism 22B via the electronic component CH12. The movable mechanism 22C pressurizes the electronic component CH21 based on the elastic force of the spring 23C, and the bonding material SN21 is pressurized by the movable mechanism 22C via the electronic component CH21. The movable mechanism 22D pressurizes the electronic component CH22 based on the elastic force of the spring 23D, and the bonding material SN22 is pressurized by the movable mechanism 22D via the electronic component CH22.

[0061] Movable mechanism 22A has a rod 22Aa and a movable piece 22Ab. Similarly, each of the movable mechanisms 22B, 22C, and 22D has a rod 22Ba, 22Ca, 22Da and movable pieces 22Bb, 22Cb, and 22Db. Each of the movable pieces 22Ab, 22Bb, 22Cb, and 22Db presses against the corresponding electronic components CH11, CH12, CH21, and CH22.

[0062] In the illustrated example, there is a one-to-one correspondence between the electronic components CH11, CH12, CH21, CH22 and the same number of movable pieces 22Ab, 22Bb, 22Cb, and 22Db. The number of movable pieces 22Ab, 22Bb, 22Cb, and 22Db may be less than the number of electronic components CH11, CH12, CH21, CH22. In that case, one movable piece (for example, movable piece 22Ab) may press against multiple electronic components (for example, electronic components CH11, CH12).

[0063] Springs 23A, 23B, 23C, and 23D, when compressed in the vertical direction, generate an elastic force that pushes down the movable mechanisms 22A, 22B, 22C, and 22D. Springs 23A, 23B, 23C, and 23D are, for example, coil springs made of metal material. Note that springs 23A, 23B, 23C, and 23D are not limited to coil springs, but may also be leaf springs or the like.

[0064] During the mounting process, the sides of rods 22Ab, 22Bb, 22Cb, and 22Db that come into contact with electronic components CH11, CH12, CH21, and CH22 are covered with a continuous film F. The film F prevents dust generated from the bonding materials SN11, SN12, SN21, SN22, etc., from adhering to and contaminating the upper mold 20.

[0065] The heater 24 heats the rods 22Ab, 22Bb, 22Cb, and 22Db via the cavity plate 21A. When the lower mold 10 and the upper mold 20 are assembled, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 via the rods 22Ab, 22Bb, 22Cb, and 22Db. This heats the bonding materials SN11, SN12, SN21, and SN22. The heater 24 is located inside the block section 21A. The heater 24 is, for example, a sheathed heater.

[0066] The degassing chambers 31 and 32 are openable and closable annular vacuum chambers surrounding the lower mold 10 and the upper mold 20, and consist of a lower chamber 31 and an upper chamber 32. The lower chamber 31 is erected on the lower mold base 11F of the lower mold 10. When viewed from above from the upper mold 20, the lower chamber 31 is located outside the side block 18. A degassing path 33 is provided between the lower chamber 31 and the lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, support pillar 11E, and side block 18, through which the degassing gas passes.

[0067] The upper chamber 32 is erected facing downwards on the upper mold base 21E of the upper mold 20. When viewed from above from the lower mold 10, the upper chamber 32 is located outside the side block 28. A degassing path 34 is provided between the upper chamber 32 and the upper mold chase 21B, lower support plate 21C, upper support plate 21D, and side block 28 through which degassing gas passes.

[0068] The degassing path 34 is connected to a degassing path 27 provided in the upper mold base 21E. The degassing path 27 is connected to a degassing port 29 provided in the upper mold base 21E. The degassing port 29 is connected to a vacuum pump outside the mold. The atmosphere inside the degassing chamber, which is composed of the lower chamber 31 and the upper chamber 32, is degassed by the degassing port 29.

[0069] Figure 2 is a cross-sectional view showing an example of the gas supply port 13 shown in Figure 1. As shown in Figure 2, the gas supply port 13 faces the end faces of the substrates SB1 and SB2 and supplies gas so that it flows along the front and back surfaces of the substrates SB1 and SB2. In the illustrated example, the lower mold 10 is provided with a plurality of gas supply ports 13. The upper mold 20 may be provided with gas supply ports 13, or both the lower mold 10 and the upper mold 20 may be provided with gas supply ports 13.

[0070] The gas supply port 13 supplies gas such as nitrogen (N2) to the substrates SB1, SB2 and the electronic components CH11, CH12, CH21, CH22. The gas supply port 13 is located on the surface of the cavity plate 11A facing the upper mold 20 and opens toward the upper mold 20. Therefore, the gas supply port 13 quickly removes oxidizing gases from around the workpieces W1, W2 during heating, and places the workpieces W1, W2 in a nitrogen atmosphere.

[0071] Furthermore, the gas supply port 13 cools the workpieces W1 and W2 by applying nitrogen gas to them during cooling. When viewed from above from the upper mold 20, multiple gas supply ports 13 are provided on the outside of the workpieces W1 and W2. The gas piping that passes the nitrogen gas supplied by the gas supply ports 13 is provided in the lower mold chase 11B. The gas supply port 13 supplies inert gas to the space between the lower mold 10 and the upper mold 20.

[0072] The aforementioned gas supply port 13 may be reused as a gas supply port for supplying inert gas into the degassed chambers 31 and 32 under reduced pressure. Alternatively, a separate gas supply port 13 may be provided for supplying inert gas into the degassed chambers 31 and 32 and for cooling substrates SB1, SB2, etc.

[0073] The inert gas supplied by the gas supply port 13 is not limited to nitrogen gas; it may also be carbon gas, fluorocarbons, or noble gases. The gas supply port 13 may directly or indirectly blow the inert gas onto the substrates SB1, SB2, electronic components CH11, CH12, CH21, CH22, bonding materials SN11, SN12, SN21, SN22, etc. The gas supply port 13 may be provided on the cavity plate 11A of the lower mold 10, or on the cavity plates 11A, 21A of both the lower mold 10 and the upper mold 20. The gas supply port 13 may be provided on at least one of the side blocks 18, 28 of the lower mold 10 and the upper mold 20, or on the degassing chambers 31, 32 described above.

[0074] Next, a mounting method using the mounting apparatus 1 according to this embodiment will be described with reference to Figures 3 to 9. Figures 3 and 4 are flowcharts showing an example of a mounting method using the mounting apparatus 1 of one embodiment of the present invention, for mounting a plurality of electronic components CH11, CH12, CH21, CH22 on at least one substrate SB1, SB2. Figure 5 is a graph showing the temperature profile of the mounting method according to one embodiment of the present invention. In the graph of Figure 4, the horizontal axis represents time, and the vertical axis represents the temperature of the workpieces W1, W2.

[0075] The mounting method shown in Figures 3 and 4 includes preparing a lower mold 10 and an upper mold 20, closing the lower mold 10 and the upper mold 20, pressing the movable plates 11C and 11D with a set pin 16 which is a pressing member against the biasing force of a coil spring 17B which is a biasing member, and changing the distance d (shown in Figure 1) between the substrates SB1 and SB2 and the heating plate 11A by having the lifter pins 12A and 12B which are holding members immerse themselves in the cavity plate 11A.

[0076] First, the lower mold 10 and upper mold 20 are prepared (S11), and preheating of the lower mold 10 and upper mold 20 is started (S12). As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is room temperature (RT). Next, the workpieces W1 and W2 are placed on the lifter pins 12A and 12B (S13). Then, the degassing chambers 31 and 32 are closed to start degassing (S14), and the supply of nitrogen gas is started (S15). By degassing the bonding materials SN11, SN12, SN21, and SN22 before raising them to the sintering temperature and creating a nitrogen gas atmosphere, oxidation of the bonding materials SN11, SN12, SN21, and SN22 is suppressed.

[0077] Figure 6 is a cross-sectional view showing the state in which the mold 2 is closed to the second position h2 and the degassing chambers 31 and 32 are closed and inert gas is supplied while degassing. As shown in Figure 6, when the mold 2 is closed from the first position h1 shown in Figure 1 to the second position h2 shown in Figure 6 and the degassing chambers 31 and 32 are sealed, the tip of the set pin 16 contacts the side block 28 of the upper mold 20. However, when the mold is closed to the second position h2, the pressing force of the side block 28 of the upper mold 20 does not push down the movable plates 11C and 11D via the set pin 16.

[0078] Therefore, the lifter pins 12A and 12B fixed to the movable plates 11C and 11D protrude upward from the cavity plate 11A. A distance d (shown in Figure 1) is maintained between the substrates SB1 and SB2 and the cavity plate 11A of the lower mold 10. The electronic components CH11, CH12, CH21, and CH22 are gradually heated by thermal radiation. At this time, the temperature of the workpieces W1 and W2 is approximately 100°C to 150°C, as shown in Figure 5.

[0079] Next, the mold 2 is further closed to the third position h3, and the lifter pins 12A and 12B are hardened by the pressing force applied to the set pins 16 from the upper mold 20 (S16). Figure 7 is a cross-sectional view showing the state in which the mold 2 is closed to the third position H3, reducing the distance d (shown in Figure 1) between the substrates SB1 and SB2 and the cavity plate 11A. As shown in Figure 7, as the lower mold 10 and the upper mold 20 move closer to each other, the tips of the set pins 16 come into contact with the side blocks 28 of the upper mold 20, and the set pins 16 are pushed down.

[0080] The depressed set pin 16 pushes down the ejector pin plate 11C and retainer plate 11D, which are connected to the base end of the set pin 16, and pushes down the lifter pins 12A and 12B, whose base ends are connected to the ejector pin plate 11C and retainer plate 11D. As a result, the workpieces W1 and W2 come into contact with the cavity plate 11A.

[0081] The substrates SB1 and SB2 are heated by heat conduction from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation, although they do not come into contact with the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering temperature of 250°C to 300°C.

[0082] Next, the mold 2 is closed to the fourth position h4, and the movable mechanisms 22A, 22B, 22C, and 22D are brought into contact with the electronic components CH11, CH12, CH21, and CH22 (S21). Figure 8 shows the state in which the mold is closed to the fourth position h4 and heated by the cavity plate 11A while pressurizing with the movable piece. As shown in Figure 8, the side blocks 18 and 28 of the lower mold 10 and the upper mold 20 come into contact with each other, and when the mold closing is complete, the set pin 16 is pushed down to its maximum extent.

[0083] The movable piece 22Ab of the movable mechanism 22A comes into contact with the electronic component CH11 via the film, and the rod 22Aa of the movable mechanism 22A is pushed up. Similarly, the movable pieces 22Bb, 22Cb, and 22Db of the movable mechanisms 22B, 22C, and 22D come into contact with the electronic components CH12, CH21, and CH22 via the film, and the rods 22Ba, 22Ca, and 22D of the movable mechanisms 22B, 22C, and 22D are pushed up.

[0084] The dimensional differences between the substrates SB1, SB2, the bonding materials SN11, SN12, SN21, SN22, and the electronic components CH11, CH12, CH21, CH22 are absorbed by the penetration depth of the rods 22Aa, 22Ba, 22Ca, 22Da into the internal space 23. At this time, the temperature of the workpieces W1, W2 is raised from the preheating temperature of 100°C to 150°C to the sintering temperature of 250°C to 300°C, as shown in Figure 5.

[0085] Next, the mold is opened to the second position h2 to release the pressing force applied to the set pin 16 from the upper mold 20. Figure 9 is a cross-sectional view showing the state in which the mold is opened to the second position h2 to increase the distance d between the substrates SB1, SB2 and the cavity plate 11A. As shown in Figure 9, when the pressing force applied to the set pin 16 is released, the movable plates 11C, 11D are raised by the biasing force of the spring 17B, and the lifter pins 12A, 12B fixed to the movable plates 11C, 11D are raised (S22).

[0086] Next, the supply of an inert gas such as nitrogen gas is stopped, and degassing is stopped (S23). Then, as shown in Figure 1, molds 2 and 3 are opened to the first position H1, and the lifter pins 12A and 12B are raised, and substrates SB1 and SB2 are removed from mold 2 (S24).

[0087] As described above, with the mounting apparatus 1 and mounting method using this mounting apparatus 1, the lifter pins 12A and 12B, which change the distance d between the substrates SB1 and SB2 and the cavity plate 11A heated by the heater 14, can be driven by the pressing force applied from the upper die 20 to the set pin 16.

[0088] Therefore, when it is not desirable to heat substrates SB1 and SB2, the substrates SB1 and SB2 can be separated from the cavity plate 11A, preventing the sintering bonding materials SN11, SN12, SN21, SN22 and solder bumps of solder joints from heating up in an unpressurized state, thereby preventing a decrease in bonding strength. Furthermore, once the electronic components CH11, CH12, CH21, CH22 are mounted, the substrates SB1 and SB2 can be quickly separated from the cavity plate 11A to cool them efficiently.

[0089] Since the sliding motion, such as multi-stage motion, input to the lower mold 10 or upper mold 20 from a servo motor can be converted into the movement of the holding members, the lifter pins 12A and 12B, by the pressing member, the set pin 16, there is no need to place additional servo motors inside the lower mold 10 or upper mold 20 to move the lifter pins 12A and 12B. This allows for the construction of a compact mounting device 1.

[0090] Compared to bump joining, which melts solder bumps, sintering joining, which sinters the joining materials SN11, SN12, SN21, and SN22, involves high temperatures. Spring steel, which is the material for coil springs, is prone to deterioration at high temperatures. In the mounting apparatus 1 of this embodiment, the upper die 20 does not directly press the lifter pins 12A and 12B that hold the workpieces W1 and W2 to immerse them, but rather indirectly immerses the lifter pins 12A and 12B by pressing the set pin 16, so that the biasing member, such as the spring 17B, is less likely to become hot.

[0091] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments.

[0092] For example, the pressing member may be configured as a plunger that compresses a fluid such as hydraulic oil when pressed against the upper mold 20, and the pressing member and the lifter pins 12A and 12B may be connected by a fluid passage. In that case, when the fluid is compressed by the pressing force applied to the pressing member from the upper mold 20, the lifter pins 12A and 12B, which are retaining members, protrude from the cavity plate 11A.

[0093] In the above modified example, movable plates 11C and 11D may be positioned to act as counterweights for the pressing member, and the pressing member may be returned to its initial position by the weight of the movable plates 11C and 11D when the pressing force from the upper mold 20 is removed. When the pressing member returns to its initial position, the lifter pins 12A and 12B retract into the cavity plate 11A.

[0094] [Note 1] The mounting apparatus 1 is a mounting apparatus for mounting at least one electronic component CH11, CH12, CH21, CH22 onto at least one substrate SB1, SB2, and comprises a first mold 10 configured to hold at least one substrate SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is placed, and a second mold 20 positioned opposite the first mold 10. The first mold 10 comprises a heating plate 11A facing the space between the first mold 10 and the second mold 20, a heater 14 for heating the heating plate 11A, at least one holding member 12A, 12B for holding at least one substrate SB1, SB2, and at least one pressing member 16 pressed by the second mold 20. The at least one holding member 12A, 12B is configured to change the distance d between the at least one substrate SB1, SB2 and the heating plate 11A by the pressing force applied from the second mold 20 to at least one pressing member 16.

[0095] [Note 10] The mounting method is a mounting method for mounting at least one electronic component CH11, CH12, CH21, CH22 on at least one substrate SB1, SB2, and includes preparing a first mold 10 configured to hold at least one substrate SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is mounted, and preparing a second mold 20 positioned opposite the first mold 10. The first mold 10 includes a heating plate 11A facing the space between the first mold 10 and the second mold 20, a heater 14 for heating the heating plate 11A, at least one holding member 12A, 12B for holding at least one substrate SB1, SB2, and at least one pressing member 16 pressed by the second mold 20. The mounting method further includes the fact that at least one holding member 12A, 12B changes the distance d between the heating plate 11A and at least one substrate SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is placed or mounted, by the pressing force applied from the second mold 20 to at least one pressing member 16.

[0096] According to the above notes 1 and 10, the pressing force applied from the second mold 20 to the pressing member 16 moves the holding members 12A and 12B, which change the distance d between the substrates SB1 and SB2 and the heating plate 11A heated by the heater 14, allowing the substrates SB1 and SB2 to be separated from the heating plate 11A, which is the heat source, when heating of the substrates SB1 and SB2 is not desired. Therefore, for example, it is possible to prevent the bonding materials SN11, SN12, SN21, SN22 for sintering joints and solder bumps for solder joints from being heated when no pressure is applied, thereby preventing a decrease in bonding strength. For example, once electronic components CH11, CH12, CH21, CH22 are mounted, the substrates SB1 and SB2 can be quickly separated from the heating plate 11A to efficiently cool them. Since there is no need to add motors or the like to move the holding members 12A and 12B inside the mold 2, a compact mounting device 1 can be provided.

[0097] [Note 2] In the above appendix 1, the first mold 10 further comprises movable plates 11C and 11D facing the heating plate 11A from the opposite side from the second mold 20, and at least one biasing member 12 that biases the movable plates 11C and 11D toward the heating plate 11A, and at least one holding member 12A and 12B is fixed to the movable plates 11C and 11D while inserted into a through hole that penetrates the heating plate 11A, and when the movable plates 11C and 11D approach the heating plate 11A due to the biasing force of at least one biasing member 17B, at least one holding member 1 The configuration may be such that when 2A and 12B protrude from the heating plate 11A, the distance d between the heating plate 11A and the at least one substrate SB1, SB2 supported by at least one holding member 12A, 12B increases, and when the pressing member 16 presses the movable plates 11C, 11D against the biasing force of at least one biasing member 12, the at least one holding member 12A and 12B retracts into the heating plate 11A, and the distance d between the heating plate 11A and the at least one substrate SB1, SB2 supported by at least one holding member 12A, 12B decreases.

[0098] According to the above appendix 2, the mounting device 1, which changes the distance d between the substrates SB1 and SB2 and the heating plate 11A by the pressing force from the second mold 20, can be configured compactly.

[0099] [Note 3] In the above appendix 2, a heat insulating member 15 may be placed between the heater 14 and the heating plate 11A and the biasing member 17B.

[0100] According to the above note 3, since the temperature rise of the biasing member 17B can be suppressed, spring steel, which is prone to deterioration at high temperatures, can be used as the material for the biasing member 17B.

[0101] [Note 4] In any one of the above appendices 1 to 3, at least one retaining member 12A, 12B is a plurality of retaining members 12A, 12B, each of the plurality of retaining members 12A, 12B is formed in a rod shape, and at least one substrate SB1, SB2 may be supported at the tip of the plurality of retaining members 12A, 12B.

[0102] According to the above note 4, since the contact area between the retaining members 12A and 12B, which are lifter pins, and the substrates SB1 and SB2 is small, heat transfer from the retaining members 12A and 12B is small. Substrates SB1 and SB2 can be cooled quickly.

[0103] [Note 5] In any one of the above appendices 1 to 4, at least one of the first mold 10 and the second mold 20 may further include a gas supply port 13 for supplying gas to at least one substrate SB1, SB2 and at least one electronic component CH11, CH12, CH21, CH22.

[0104] According to the above note 5, the substrates SB1 and SB2 can be quickly cooled by supplying gas from the gas supply port 13.

[0105] [Note 6] In the above appendix 5, the gas supply port 13 may supply gas so as to flow along the upper and lower surfaces of at least one substrate SB1, SB2.

[0106] According to the above appendix 6, the upper and lower surfaces of substrates SB1 and SB2 can be cooled simultaneously, allowing for rapid cooling of substrates SB1 and SB2.

[0107] [Note 7] In the above appendix 5 or 6, the gas supplied from the gas supply port 13 may be an inert gas.

[0108] According to the above appendix 7, since an inert gas is blown in, oxidation of substrates SB1, SB2, etc. can be suppressed compared to when oxygen-containing air is blown in. Moreover, if degassing chambers 31 and 32 are further provided, the gas supply port 13 for supplying gas to cool substrates SB1 and SB2 and the gas supply port for filling the atmosphere furnace with inert gas can be made common, thereby suppressing an increase in the number of components and enabling the construction of a compact mounting device 1.

[0109] [Note 8] In any one of the above appendices 1 to 7, the system may further include openable and closable degassing chambers 31 and 32 surrounding the lower mold 10 and the second mold 20, and the oxygen concentration in the space inside the mold may be reduced by degassing through the degassing chambers 31 and 32 and supplying an inert gas.

[0110] When substrates SB1, SB2 and electronic components CH11, CH12, CH21, CH22 are heated to high temperatures for sintering bonding or the like, they oxidize in an air atmosphere. According to Appendix 8 above, electronic components CH11, CH12, CH21, CH22 can be mounted on substrates SB1, SB2 in an inert gas atmosphere with reduced oxygen concentration.

[0111] [Note 9] In any one of the above appendices 1 to 8, the mounting apparatus 1 may be a sintering apparatus that sinters a bonding material 103 placed between at least one substrate SB1, SB2 and at least one electronic component CH11, CH12, CH21, CH22 by heating and pressurizing, thereby joining at least one substrate SB1, SB2 and at least one electronic component CH11, CH12, CH21, CH22.

[0112] According to the above note 9, when the bonding materials SN11, SN12, SN21, and SN22 of the sintering joint are heated without pressure, they solidify in a brittle state. However, when it is not desired to heat the substrates SN1 and SN2, the substrates SN1 and SN2 can be separated from the heating plate 11A, which is the heat source, thus preventing a decrease in adhesive strength. For this reason, it is suitable for sintering equipment. [Explanation of Symbols]

[0113] 1... Mounting device, 2... Mold, 3... Pressing device, 4... Lower platen, 5... Upper platen, 9... Pressure adjustment mechanism, 10... Lower die (example of first die), 11A... Cavity plate (example of heating plate), 11B... Lower die chase, 11C... Ejector pin plate (example of movable plate), 11D... Retainer plate (example of movable plate), 11E... Support pillar, 11F... Lower die base, 12A, 12B... Lifter pin (example of holding member), 13... Gas supply port, 14... Heater, 15... Heat insulation member, 16... Set pin (example of pressing member), 17A... Spring sleeve, 17B... Spring, 18... Side block, 20... Upper die (example of second die), 21A... Cavity plate, 21B...Upper mold chase, 21C...Lower support plate, 21D...Upper support plate, 21E...Upper mold base, 22A,22B,22C,22D...Movable mechanism, 22Aa,22Ba,22Ca,22Da...Rod, 22Ab,22Bb,22Cb,22Db...Movable piece, 23...Internal space, 24...Heater, 25...Insulation material, 27...Degassing path, 28...Side block, 29...Degassing port, 31,32...Degassing chamber, 33,34...Degassing path, CH11,CH12,CH21,CH22...Electronic component, d...Distance between substrate and heating plate, h1,h2,h3,h4...1st to 4th position, SB1,SB2...Substrate, SN11,SN12,SN21,SN22...Bonding material, W1,W2...Workpiece.

Claims

1. A mounting device for mounting at least one electronic component onto at least one circuit board, A first mold configured to hold the at least one substrate on which the at least one electronic component is mounted, The invention comprises a second mold positioned opposite the first mold, The first mold is A heating plate facing the space between the first mold and the second mold, A heater for heating the aforementioned heating plate, At least one holding member for holding at least one substrate, The system comprises at least one pressing member that is pressed against the second mold, The at least one holding member is configured to change the distance between the at least one substrate and the heating plate by the pressing force applied from the second mold to the at least one pressing member. Mounting device.

2. The first mold is The heating plate is provided with a movable plate facing it from the opposite side of the second mold, The movable plate is further comprising at least one biasing member that biases the movable plate toward the heating plate, The at least one holding member is fixed to the movable plate while inserted into a through hole that penetrates the heating plate. When the movable plate approaches the heating plate due to the biasing force of the at least one biasing member, the at least one holding member protrudes from the heating plate, and the distance between the at least one substrate supported by the at least one holding member and the heating plate increases. When the pressing member presses the movable plate against the biasing force of the at least one biasing member, the at least one holding member is retracted into the heating plate, and the distance between the at least one substrate supported by the at least one holding member and the heating plate is reduced. The mounting device according to claim 1.

3. An insulating member is placed between the heater and the heating plate and the biasing member. The mounting device according to claim 2.

4. The aforementioned at least one retaining member is a plurality of retaining members, Each of the aforementioned plurality of holding members is formed in the shape of a rod, The at least one substrate is supported at the tip of the plurality of holding members. The mounting device according to claim 1.

5. At least one of the first mold and the second mold further comprises at least one gas supply port for supplying gas to at least one substrate and at least one electronic component, The mounting device according to claim 1.

6. The at least one gas supply port supplies gas so as to flow along the upper and lower surfaces of the at least one substrate. The mounting apparatus according to claim 5.

7. The gas supplied from the aforementioned at least one gas supply port is an inert gas. The mounting apparatus according to claim 5.

8. The system further comprises an openable and closable degassing chamber surrounding the first mold and the second mold, The system is configured to reduce the oxygen concentration in the space by depressurizing the inside of the degassing chamber and supplying an inert gas. The mounting device according to claim 1.

9. The mounting apparatus is a sintering apparatus that joins the at least one substrate and the at least one electronic component by sintering a bonding material placed between the at least one substrate and the at least one electronic component by heating and pressurizing it. The mounting device according to claim 1.

10. A mounting method for mounting at least one electronic component on at least one circuit board, To provide a first mold configured to hold the at least one substrate on which the at least one electronic component is mounted, Prepare a second mold positioned opposite the first mold. Includes, The first mold is A heating plate facing the space between the first mold and the second mold, A heater for heating the aforementioned heating plate, At least one holding member for holding at least one substrate, The system comprises at least one pressing member that is pressed against the second mold, The mounting method further includes, by means of a pressing force applied from the second mold to the at least one pressing member, the at least one holding member changing the distance between the at least one substrate on which the at least one electronic component is placed or mounted and the heating plate, Implementation method.

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