Antenna module and communication device equipped with it

The antenna module addresses the limitation of dielectric resonator antennas by positioning the dielectric block opposite a flat ground electrode and using power supply wiring to radiate waves in diverse directions, enhancing directional control and polarization, and potentially miniaturizing the device.

JP7852743B2Active Publication Date: 2026-04-28MURATA MFG CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
MURATA MFG CO LTD
Filing Date
2023-08-24
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Dielectric resonator antennas in mobile communication devices are limited to radiating radio waves only in the direction normal to the substrate, lacking flexibility in directional control and polarization.

Method used

The antenna module includes a dielectric block positioned opposite a flat ground electrode intersecting the substrate, with power supply wiring arranged to transmit high-frequency signals to the dielectric block from different positions, enabling radiation in directions other than normal to the substrate and allowing dual-polarization capabilities.

Benefits of technology

Enables radio waves to be emitted in directions different from the normal direction of the substrate, improving directional control and polarization characteristics, including cross-polarization discrimination ratio, while potentially miniaturizing the antenna module.

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Abstract

This antenna module (100) comprises a dielectric board (130), dielectric blocks (121), a tabular ground electrode (GND1), and electric power supply wiring (140, 145). The dielectric blocks (121) have mutually perpendicular surfaces (122, 123) and are positioned so that the surfaces (122) face a mounting surface of the dielectric board (130). The ground electrode (GND1) is positioned so as to be perpendicular to the dielectric board (130) and to face the surfaces (123) of the dielectric blocks (121). The electric power supply wiring (140, 145) is positioned on the dielectric board (130) and transmits high-frequency signals to the dielectric blocks (121). When seen in plan view from the direction normal to the dielectric board (130), end portions of the electric power supply wiring (140, 145) are positioned at positions that overlap the dielectric blocks (121).
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Description

Technical Field

[0001] The present disclosure relates to an antenna module and a communication device equipped with the same, and more particularly to a configuration for adjusting the radiation direction of a dielectric resonator antenna.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2000-209020 (Patent Document 1) discloses a dielectric resonator antenna (DRA) that supplies a high-frequency signal to a rectangular parallelepiped (dielectric block) of a dielectric material disposed on a flat substrate to radiate radio waves.

[0003] In the dielectric resonator antenna disclosed in Patent Document 1, the supplied high-frequency signal (electric field) resonates within the dielectric block, and radio waves are radiated in a direction opposite to the ground electrode disposed on the substrate, that is, in the normal direction of the substrate. The frequency characteristics of the radio waves radiated from the dielectric resonator antenna are determined by the shape, dimensions, and dielectric constant of the dielectric block. Further, in the dielectric resonator antenna of Patent Document 1, since there is one supply path for the high-frequency signal to the dielectric block, radio waves are radiated from the dielectric block only in a specific one polarization direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The antenna devices described above are sometimes used in mobile communication devices such as mobile phones or smartphones. In mobile communication devices, in order to ensure reliable communication with other devices such as base stations or routers, a configuration is used in which multiple antennas are arranged within the device and radio waves are emitted in different directions.

[0006] When applying the dielectric resonator antenna disclosed in Patent Document 1 to such a communication device, radio waves can only be emitted in the direction normal to the substrate on which the dielectric block is placed.

[0007] This disclosure was made to solve these problems, and its purpose is to provide a dielectric resonator antenna capable of radiating radio waves in a direction different from the normal direction of the substrate. [Means for solving the problem]

[0008] The antenna module according to this disclosure comprises a substrate, a dielectric block, a flat-plate-shaped first ground electrode, and a power supply wiring. The dielectric block has a first surface and a second surface that intersect each other, and the first surface is positioned opposite the mounting surface of the substrate. The first ground electrode intersects the substrate and is positioned opposite the second surface of the dielectric block. The power supply wiring is arranged on the substrate and transmits a high-frequency signal to the dielectric block. When viewed from a plan view in the direction normal to the substrate, the end of the power supply wiring is positioned to overlap with the dielectric block. [Effects of the Invention]

[0009] According to the antenna module of this disclosure, a flat ground electrode is provided in a direction intersecting the substrate, and a dielectric block is positioned opposite the mounting surface of the substrate, with a surface different from the surface facing the substrate facing the ground electrode. By positioning the dielectric block in this manner, when a high-frequency signal is supplied to the dielectric block, radio waves can be emitted in the direction normal to the ground electrode. Therefore, radio waves can be emitted in a direction different from the normal direction of the substrate on which the dielectric block is positioned. [Brief explanation of the drawing]

[0010] [Figure 1] This is a block diagram of a communication device to which the antenna module according to Embodiment 1 is applied. [Figure 2] Figure 1 is a perspective view of the antenna module. [Figure 3] Figure 1 is a side perspective view of the antenna module. [Figure 4] This diagram illustrates two modified examples of the arrangement of power supply wiring in a dielectric block. [Figure 5] These figures illustrate modified examples 3 and 4 of the coupling state between the dielectric block and the power supply wiring. [Figure 6] This is a side perspective view of the antenna module in modified example 5. [Figure 7] This is a side perspective view of the antenna module in modified example 6. [Figure 8] This is a block diagram of a communication device to which the antenna module according to Embodiment 2 is applied. [Figure 9] Figure 8 is a perspective view of the antenna module. [Figure 10] Figure 8 is a side perspective view of the antenna module. [Figure 11] This is a side perspective view of the antenna module in modified example 7. [Figure 12] This is a side perspective view of the antenna module in modified example 8. [Figure 13] This is a partial side perspective view of a communication device according to Embodiment 3. [Figure 14] Figure 13 is a partial plan view of the communication device as seen from the positive X-axis direction. [Modes for carrying out the invention]

[0011] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

[0012] [Embodiment 1] (Basic Configuration of Communication Device) FIG. 1 is a block diagram of a communication device 10 to which an antenna module 100 according to this embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, a smartphone or a tablet, or a personal computer equipped with a communication function. An example of the frequency band of the radio wave used for the antenna module 100 according to this embodiment is a radio wave in the millimeter wave band centered on, for example, 28 GHz, 39 GHz, and 60 GHz, but radio waves in frequency bands other than the above are also applicable.

[0013] Referring to FIG. 1, the communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110, which is an example of a power supply device, and an antenna device 120. The communication device 10 up-converts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 into a high frequency signal and radiates it from the antenna device 120, and down-converts a high frequency signal received by the antenna device 120 into an intermediate frequency signal and processes the signal with the BBIC 200.

[0014] The antenna device 120 includes a flat dielectric substrate 130 having a substantially rectangular shape and a plurality of dielectric blocks 121 disposed on the dielectric substrate 130. In FIG. 1, an example of an array configuration in which four dielectric blocks 121 are arranged in a row on the dielectric substrate 130 is shown, but the number of dielectric blocks 121 is not limited to this. A single dielectric block 121 may be disposed on the dielectric substrate 130, or a configuration in which a plurality of dielectric blocks 121 other than four are disposed may be used. Also, an array configuration in which the dielectric blocks 121 are two-dimensionally arranged may be used. When the dielectric blocks 121 are arranged in a one-dimensional array configuration, if the free space wavelength of the radio wave radiated from the dielectric blocks 121 is λ, it is desirable that the center-to-center distance between adjacent dielectric blocks be set to approximately λ / 2.

[0015] The dielectric block 121 has a substantially rectangular parallelepiped shape. When a high-frequency signal in a predetermined frequency band is supplied to the dielectric block 121, an electric field resonates inside the dielectric block 121, and a radio wave corresponding to the resonance frequency is radiated from the dielectric block 121 to the outside. That is, the antenna module 100 is a dielectric resonator antenna (DRA). The resonance frequency of the resonance occurring in the dielectric block 121 is determined by the shape and dimensions of the dielectric block 121 and the dielectric constant of the dielectric constituting the block. The dielectric constant of the dielectric block 121 is set higher than the dielectric constant of the dielectric substrate 130. The relative dielectric constant of the dielectric block 121 is, for example, 10 or more, preferably 15 to 20. By setting the dielectric constant of the dielectric block 121 higher than the dielectric constant of the dielectric substrate 130, the wavelength of the electric field resonating in the dielectric block 121 can be shortened, so that the size of the dielectric block 121 can be reduced.

[0016] In the antenna module 100 of Embodiment 1, a high-frequency signal is supplied to each dielectric block 121 by two power supply wirings. As will be described later with reference to FIG. 2 and the like, the polarization direction of the radiated radio wave differs depending on the power supply position of the high-frequency signal to the dielectric block 121. That is, the antenna module 100 is a so-called dual-polarization type antenna module capable of radiating radio waves in two different polarization directions.

[0017] The RFIC 110 includes two power supply circuits 110A and 110B. The power supply circuit 110A is a circuit for supplying a high-frequency signal for the first polarization direction. The power supply circuit 110B is a circuit for supplying a high-frequency signal for the second polarization direction. Since the internal configurations of the power supply circuits 110B are the same, in FIG. 1, for the sake of simplicity of explanation, only the detailed configuration of the power supply circuit 110A is described, and the configuration of the power supply circuit 110B is omitted. Hereinafter, the function of the power supply circuit 110A will be described as a representative.

[0018] The power supply circuit 110A includes switches 111A~111D, 113A~113D, 117, power amplifiers 112AT~112DT, low-noise amplifiers 112AR~112DR, attenuators 114A~114D, phase shifters 115A~115D, signal combiner / distributor 116, mixer 118, and amplification circuit 119.

[0019] When transmitting a high-frequency signal, switches 111A~111D and 113A~113D are switched to the power amplifier 112AT~112DT side, and switch 117 is connected to the transmitting amplifier of the amplification circuit 119. When receiving a high-frequency signal, switches 111A~111D and 113A~113D are switched to the low-noise amplifier 112AR~112DR side, and switch 117 is connected to the receiving amplifier of the amplification circuit 119.

[0020] The intermediate frequency signal transmitted from the BBIC200 is amplified by the amplification circuit 119 and upconverted by the mixer 118. The upconverted high-frequency signal, which is the transmit signal, is demultiplexed into four parts by the signal combiner / distributor 116 and passes through the corresponding signal paths to supply power to different dielectric blocks 121. The phase shift of the phase shifters 115A to 115D located in each signal path can be individually adjusted to adjust the directivity of the radio waves output from the dielectric block 121. Attenuators 114A to 114D adjust the strength of the transmit signal.

[0021] The received signals, which are high-frequency signals received by each dielectric block 121, are transmitted to the power supply circuit 110A of the RFIC 110 and combined in the signal combiner / distributor 116 via four different signal paths. The combined received signals are down-converted to an intermediate frequency signal by the mixer 118, further amplified by the amplification circuit 119, and transmitted to the BBIC 200.

[0022] The RFIC110 may be formed, for example, as a single-chip integrated circuit component including the above circuit configuration. Alternatively, each power supply circuit may be formed as a separate integrated circuit component. Furthermore, for each dielectric block corresponding to a device (switch, power amplifier, low-noise amplifier, attenuator, phase shifter), each corresponding dielectric block may be formed as a single-chip integrated circuit component.

[0023] (Antenna module structure) Next, the configuration of the antenna module 100 in Embodiment 1 will be described in detail using Figures 2 and 3. Figure 2 is a perspective view of the antenna module 100 according to Embodiment 1. Figure 3 is a side view of the antenna module 100 as seen from the Y-axis direction in Figure 2. In the following description, the normal direction of the flat dielectric substrate 130 will be defined as the Z-axis direction, the direction along the short side of the dielectric substrate 130 will be defined as the X-axis direction, and the direction along the long side of the dielectric substrate 130 will be defined as the X-axis direction. In each figure, the positive Z-axis direction may be referred to as the upward side, and the negative Z-axis direction as the downward side.

[0024] In addition to the RFIC 110, dielectric block 121, and dielectric substrate 130, the antenna module 100 further comprises ground electrodes GND1, GND2 and power supply wiring 140, 145.

[0025] The dielectric substrate 130 is, for example, a low-temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of epoxy, polyimide, or other resins, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluororesin, a multilayer resin substrate formed by laminating multiple resin layers made of PET (polyethylene terephthalate), or a ceramic multilayer substrate other than LTCC. Note that the dielectric substrate 130 does not necessarily have to be a multilayer structure and may be a single-layer substrate.

[0026] The dielectric substrate 130 has an upper surface 131 and a lower surface 132. A ground electrode GND2 is arranged in the internal layer of the dielectric substrate 130, extending across its entire surface. Additionally, a flat ground electrode GND1 is positioned on the positive X-axis end of the dielectric substrate 130, intersecting the substrate 130. In the example of the antenna module 100, the ground electrode GND1 has a flat shape, extending from the upper surface 131 of the dielectric substrate 130 in the positive Z-axis direction and positioned parallel to the YZ plane. Both ground electrodes GND1 and GND2 are electrically connected to a ground terminal on a mounting board (not shown). Ground electrodes GND1 and GND2 may be connected to each other.

[0027] The dielectric blocks 121 are arranged on the dielectric substrate 130 at the end further in the positive X-axis direction than the ground electrode GND1, spaced apart from each other along the Y-axis direction. The dielectric blocks 121 have a roughly rectangular lower surface 122 that faces the upper surface 131 of the dielectric substrate 130, and are arranged to protrude further in the X-axis direction from the end surface of the dielectric substrate 130 in the positive X-axis direction. The negative X-axis surface 123 of the dielectric block 121 is positioned opposite the main surface of the ground electrode GND1. The surface 123 of the dielectric block 121 has a roughly square shape. The dielectric blocks 121 may be in contact with the ground electrode GND1 or spaced apart from it.

[0028] A System In Package (SiP) module 105 is positioned on the upper surface 131 of the dielectric substrate 130. The SiP module 105 is a control device that incorporates a circuit on which an RFIC 110, a power module IC for power supply (not shown), and a power inductor are mounted on the substrate. As shown in Figure 3, this circuit is sealed with resin 106 and mounted on the dielectric substrate 130 by connecting members such as solder bumps 160. Note that the SiP module 105 is omitted in Figure 2.

[0029] Furthermore, power supply wiring 140 and 145 for transmitting high-frequency signals from the RFIC 110 to the dielectric block 121 is arranged on the upper surface 131 of the dielectric substrate 130.

[0030] The power supply wiring 140 includes a solder bump 160 connecting the SiP module 105 to the dielectric substrate 130, a wiring electrode 141 connected to the dielectric block 121, and a stub 142 branching off from the wiring electrode 141. The wiring electrode 141 extends along the upper surface 131 of the dielectric substrate 130 in the X-axis direction, passes through the opening OP1 of the ground electrode GND1, and connects to the negative Y-axis end of the lower surface 122 of the dielectric block 121. The stub 142 branches off from the middle of the wiring electrode 141 in the negative Y-axis direction on the dielectric substrate 130.

[0031] Similarly, the power supply wiring 145 includes a wiring electrode 146 connected to the solder bump 160 and the dielectric block 121, and a stub 147 branching off from the wiring electrode 146. The wiring electrode 146 extends along the upper surface 131 of the dielectric substrate 130 in the X-axis direction, passes through the opening OP2 of the ground electrode GND1, and connects to the positive Y-axis end of the lower surface 122 of the dielectric block 121. The stub 147 branches off from the middle of the wiring electrode 146 in the positive Y-axis direction on the dielectric substrate 130.

[0032] The wiring electrodes 141 and 146 are spaced apart from each other in a direction parallel to the surface 123 of the dielectric block 121 (Y-axis direction). The wiring electrodes 141 and 146 are positioned opposite the ground electrode GND2 of the dielectric substrate 130 and function as a strip line.

[0033] Stubs 142 and 147 are provided for impedance matching with the dielectric block 121. However, stubs 142 and 147 are not essential components; they can be omitted if impedance matching with the dielectric block 121 can be achieved.

[0034] In the antenna module 100 of Embodiment 1, an example is shown in which the power supply wiring 140 and 145 are arranged on the upper surface 131 of the dielectric substrate 130. However, the power supply wiring 140 and 145 may also be arranged in the inner layers of the dielectric substrate 130.

[0035] In an antenna module 100 with this configuration, when a high-frequency signal is supplied to the power supply wiring 140, radio waves are radiated in the positive direction of the X-axis (direction of arrow AR3 in Figure 3), with the polarization direction being the direction of arrow AR1 in Figure 2, that is, the direction of one diagonal of the approximately square end face 123. Also, when a high-frequency signal is supplied to the power supply wiring 145, radio waves are radiated in the positive direction of the X-axis, with the polarization direction being the direction of arrow AR2 in Figure 2, that is, the direction of the other diagonal of the approximately square end face 123.

[0036] In this way, by supplying high-frequency signals to different positions in the cross-section of the dielectric block 121, two radio waves with different polarization directions can be radiated. That is, the antenna module 100 is a dual-polarization type antenna module. In the antenna module 100, since the surface 123 of the dielectric block 121 is approximately square, the polarization directions of the two radiated radio waves are orthogonal to each other.

[0037] As described above, in the antenna module 100 of Embodiment 1, by arranging the dielectric block 121 opposite the main surface of the ground electrode GND1 which is arranged intersecting the dielectric substrate 130, radio waves can be radiated in a direction different from the normal direction of the dielectric substrate 130. Furthermore, by supplying high-frequency signals to different positions on the surface of the dielectric block 121 that faces the ground electrode GND1, a dual-polarization type antenna module can be created. Note that by making the polarization directions of the two radio waves radiated from the dielectric block 121 orthogonal to each other, the cross-polarization discrimination ratio (XPD) can be improved.

[0038] In the example of the antenna module 100, the ground electrode GND1 for the dielectric block 121 was positioned perpendicular to the dielectric substrate 130, that is, the angle between the ground electrode GND1 and the dielectric substrate 130 was 90°. However, the angle between the ground electrode GND1 and the dielectric substrate 130 does not necessarily have to be 90°.

[0039] In Embodiment 1, "ground electrode GND1" and "ground electrode GND2" correspond to "first ground electrode" and "second ground electrode" in this disclosure, respectively. In Embodiment 1, "wiring electrode 141" and "wiring electrode 146" correspond to "first wiring" and "second wiring" in this disclosure, respectively. In Embodiment 1, "bottom surface 122" and "surface 123" of the dielectric block 121 correspond to "first surface" and "second surface" in this disclosure, respectively.

[0040] (Variations 1, 2) In Modifications 1 and 2, variations in the power supply location in the dielectric block 121 will be described. Figure 4 is a diagram illustrating Modifications 1 and 2 of the arrangement of power supply wiring 140 and 145 in the dielectric block 121.

[0041] As described in Embodiment 1, by arranging the feed lines 140 and 145 spaced apart in a direction parallel to the surface 123 facing the ground electrode GND1 in the dielectric block 121, two radio waves with different polarization directions can be radiated from the dielectric block 121. In the antenna module 100 of Embodiment 1, the feed line 145 was connected to the positive Y-axis end of the lower surface 122 of the dielectric block 121, and the feed line 140 was connected to the negative Y-axis end.

[0042] In the modified antenna module 100A of the first modification, the connection points of the feed lines 140A and 145A to the dielectric block 121 have a roughly L-shaped cross-section when viewed from the X-axis direction. Specifically, the feed line 140A extends from the bottom surface 122 to the side surface 125 at the negative Y-axis end of the bottom surface 122 of the dielectric block 121. The feed line 145A extends from the bottom surface 122 to the side surface 124 at the positive Y-axis end of the bottom surface 122 of the dielectric block 121. By adopting a configuration like that of the first modification, the symmetry of the electric field in the diagonal direction of the dielectric block 121 is stabilized, thereby improving the polarization characteristics of the two radio waves.

[0043] In the modified example 2, the feed lines 140B and 145B of the antenna module 100B have the same cross-sectional shape as the feed lines 140 and 145 in Embodiment 1, but are connected to the dielectric block 121 at a position slightly offset inward from the Y-axis end on the lower surface 122.

[0044] Even when a high-frequency signal is supplied to the power supply location as in the modified examples 1 and 2, it is possible to radiate two radio waves with different polarization directions.

[0045] (Modifications 3, 4) In modified examples 3 and 4, variations in the coupling state between the dielectric block 121 and the power supply wiring 140 and 145 will be described. Figure 5 is a diagram illustrating modified examples 3 and 4 of the coupling state between the dielectric block 121 and the power supply wiring 140 and 145.

[0046] In the antenna module 100 of Embodiment 1, a configuration was described in which the dielectric block 121 and the feed lines 140 and 145 are directly connected. In the antenna module 100C of Modification 3 (left diagram in Figure 5), a small gap is provided between the lower surface 122 of the dielectric block 121 and the feed lines 140 and 145, so that the dielectric block 121 and the feed lines 140 and 145 are not in contact. If the attenuation of the high-frequency signal due to this gap is less than a predetermined amount, the high-frequency signal can be transmitted to the dielectric block 121 even in a non-contact state, and radio waves can be emitted from the dielectric block 121. Furthermore, the impedance can be adjusted by adjusting the amount of the gap between the dielectric block 121 and the feed lines 140 and 145. Note that if the free-space wavelength of the radio waves emitted from the dielectric block 121 is λ, the amount of the gap between the dielectric block 121 and the feed lines 140 and 145 is set to within λ / 10.

[0047] The gap described above may be an air layer, or it may be a configuration in which another dielectric, such as a resist, is placed within the gap.

[0048] In the modified antenna module 100D (right diagram in Figure 5), the power supply wiring 140 is connected to a flat electrode 150 located on the lower surface 122 of the dielectric block 121 via a solder bump 155. Although not shown, the power supply wiring 145 is similarly connected to a flat electrode located on the dielectric block 121 via a solder bump.

[0049] As with the antenna module 100D, the connection strength between the power supply wiring 140, 145 and the dielectric block 121 can be increased by using solder bumps.

[0050] (Variation 5) In Modification 5, variations in the arrangement of the dielectric substrate and dielectric block will be described. Figure 6 is a side perspective view of the antenna module 100E of Modification 5. In the antenna module 100E, the dielectric substrate 130 in the antenna module 100 of Embodiment 1 shown in Figure 3 is replaced with a dielectric substrate 130A. The other components of the antenna module 100E are the same as those of the antenna module 100, and the explanation of elements that overlap with Figure 3 will not be repeated.

[0051] Referring to Figure 6, the dielectric substrate 130A in the antenna module 100E is longer in the X-axis direction than the dielectric substrate 130 of the antenna module 100. As a result, the dielectric block 121 is positioned such that the positive X-axis end of the dielectric block 121 is approximately at the same position as the positive X-axis end of the dielectric substrate 130.

[0052] On the other hand, the ground electrode GND2, which is placed on the dielectric substrate 130A, is only placed up to around the location where the power supply wirings 140 and 145 are placed. In other words, the ground electrode GND2 is not placed near the positive X-axis end of the dielectric substrate 130A. Therefore, when viewed from a plan view in the direction normal to the dielectric substrate 130A, at least a portion of the region where the dielectric substrate 130A and the dielectric block 121 overlap does not overlap with the ground electrode GND2.

[0053] With this configuration, the electric field leaking from the dielectric block 121 can cause resonance in the region of the dielectric substrate 130A that lacks the ground electrode GND2, potentially improving the gain. Alternatively, the antenna module can be miniaturized by reducing the size of the dielectric block 121 while maintaining the gain.

[0054] Furthermore, the connection between the dielectric block 121 and the dielectric substrate 130A can be stabilized by placing resin or double-sided tape between the dielectric block 121 and the dielectric substrate 130A to support the dielectric block 121.

[0055] (Experimental variation 6) In Modification 6, a configuration is described in which the metal package of the SiP module is used as the ground electrode for the dielectric block. Figure 7 is a side perspective view of the antenna module 100F of Modification 6. In the antenna module 100F, the SiP module 105 in the antenna module 100 of Embodiment 1 is replaced with SiP module 105A, and the ground electrode GND1 is also omitted. In Figure 7, explanations of elements that overlap with Figure 3 will not be repeated.

[0056] Referring to Figure 7, a conductive shielding member 107, configured to block electromagnetic waves, is placed around the outer periphery of the SiP module 105A in the antenna module 100F. The shielding member 107 is made of a metal material such as copper, aluminum, or iron, and is electrically connected to the ground potential. This shielding member 107 prevents electromagnetic waves generated in the internal circuitry of the SiP module 105A from leaking to the outside, thereby suppressing the impact on external equipment. In addition, the shielding member 107 also prevents electromagnetic noise from entering the internal circuitry of the SiP module 105A from the outside.

[0057] Furthermore, the dielectric block 121 has its negative X-axis surface 123 facing the shielding member 107 on the side of the SiP module 105A. This configuration reduces the number of ground electrodes GND1, thereby lowering manufacturing costs and contributing to the miniaturization of the antenna module.

[0058] In Modification Example 6, the "shielding member 107" corresponds to the "conductive member" in this disclosure.

[0059] [Embodiment 2] (Basic configuration of communication equipment) In Embodiment 2, a configuration is described in which, in addition to a dielectric block, a flat-plate-shaped patch antenna is provided as a radio wave radiating element, enabling the radiation of radio waves in different directions.

[0060] Figure 8 is a block diagram of a communication device to which the antenna module 100G according to Embodiment 2 is applied. In the antenna module 100G of Figure 8, the RFIC 110 in the antenna module 100 of Figure 1 is replaced with an RFIC 110X, and a flat plate-shaped radiating element 127 is added to the dielectric substrate 130. Note that Figure 8 shows an example in which four radiating elements 127 are arranged on the dielectric substrate 130.

[0061] Referring to Figure 8, the radiating element 127 has a substantially square shape when viewed from the normal direction of the dielectric substrate 130. The radiating element 127 has two feed points SP1 and SP2, which are offset from the center of the element in different directions, and a high-frequency signal is supplied to each of these feed points SP1 and SP2.

[0062] The RFIC110X further includes feed circuits 110C and 110D in addition to feed circuits 110A and 110B. Feed circuits 110A and 110B are circuits for supplying high-frequency signals to the dielectric block 121, similar to the antenna module 100 of Embodiment 1. Feed circuit 110C is a circuit for supplying high-frequency signals to the feed point SP1 of the radiating element 127. Feed circuit 110D is a circuit for supplying high-frequency signals to the feed point SP2 of the radiating element 127. The internal configuration of feed circuits 110B to 110D is the same as that of feed circuit 110A, and in Figure 8, only the detailed configuration of feed circuit 110A is shown.

[0063] (Antenna module structure) Next, the antenna module 100G will be described in detail using Figures 9 and 10. Figure 9 is a perspective view of the antenna module 100G shown in Figure 8, and Figure 110 is a side perspective view of the antenna module 100G viewed from a direction other than the Y-axis. Note that the SiP module 105 is omitted in Figure 9.

[0064] Referring to Figures 9 and 10, in the antenna module 100G, four dielectric blocks 121 are arranged on the positive X-axis end of the dielectric substrate 130, spaced apart from each other along the Y-axis. If the wavelength of the radio waves radiated from the dielectric block 121 is λ1, then adjacent dielectric blocks 121 are arranged at a pitch of λ1 / 2.

[0065] Furthermore, four radiating elements 127 are arranged on the lower surface 132 side of the dielectric substrate 130, spaced apart from each other along the Y-axis. If the wavelength of the radio waves emitted from the radiating elements 127 is λ2, then adjacent radiating elements 127 are arranged at a pitch of λ2 / 2. The frequency band of the radio waves emitted from the radiating elements 127 may be the same as or different from the frequency band of the radio waves emitted from the dielectric block 121.

[0066] The radiating element 127 is positioned on the lower surface 132 side of the ground electrode GND2 located on the dielectric substrate 130, and facing the ground electrode GND2. The radiating element 127 may be positioned so as to be exposed on the lower surface 122 of the dielectric substrate 130, as shown in Figure 10, or it may be positioned in an inner layer between the ground electrode GND2 and the lower surface 132.

[0067] High-frequency signals are transmitted to the radiating element 127 from the RFIC 110A via power supply wires 151 and 152. Power supply wire 151 passes through the solder bump 160 and the ground electrode GND2 and is connected to the power supply point SP1 of the radiating element 127. Power supply wire 152 also passes through the solder bump 160 and the ground electrode GND2 and is connected to the power supply point SP2 of the radiating element 127.

[0068] The feed point SP1 is positioned offset in the Y-axis direction from the center of the radiating element 127. When a high-frequency signal is supplied to the feed point SP1, radio waves with polarization in the Y-axis direction are radiated in the negative Z-axis direction (direction of arrow AR4 in Figure 10). The feed point SP2 is positioned offset in the negative X-axis direction from the center of the radiating element 127. When a high-frequency signal is supplied to the feed point SP2, radio waves with polarization in the X-axis direction are radiated in the negative Z-axis direction.

[0069] The configuration of the dielectric block 121 is the same as that of the antenna module 100 in Embodiment 1, so its explanation will not be repeated.

[0070] Thus, by equipping the dielectric substrate with a patch antenna in addition to the dielectric block, it becomes possible to radiate radio waves in two different directions.

[0071] (Example 7) Figure 11 is a side perspective view of the antenna module 100H of Modification 7. The antenna module 100H has a configuration in which a flat patch antenna is provided on the dielectric substrate 130 in the configuration of Modification 6 described in Figure 7. In Figure 11, explanations of elements that overlap with those in Figure 7 will not be repeated.

[0072] Referring to Figure 11, in the antenna module 100H, similar to the antenna module 100G of Embodiment 2, a flat radiating element 127 is arranged on the lower surface 132 of the dielectric substrate 130. High-frequency signals are supplied from the RFIC 110 to the feed points SP1 and SP2 of the radiating element 127, respectively, via feed lines 151 and 152.

[0073] By using the 100H antenna module configuration, the ground electrode GND1 can be reduced, thereby lowering manufacturing costs and miniaturizing the antenna module, while also enabling the emission of radio waves in two different directions.

[0074] (Variation 8) Figure 12 is a side perspective view of the antenna module 100I of the modified example 8. Antenna module 100I is an example of a further miniaturization of the antenna module 100H shown in Figure 11.

[0075] Specifically, in antenna module 100I, the dimensions of the dielectric substrate 130 and SiP module 105A in the X-axis direction are smaller compared to antenna module 100H. Furthermore, the radiating element 127 is positioned close to the positive X-axis end of the dielectric substrate 130. In other words, when viewed from a plan view from the normal direction of the dielectric substrate 130, at least a portion of the radiating element 127 overlaps with the dielectric block 121.

[0076] By using a configuration like that of antenna module 100I, further miniaturization of the antenna module can be achieved.

[0077] [Embodiment 3] Embodiment 3 describes an example of the arrangement of antenna modules in a communication device.

[0078] Figure 13 is a partial side perspective view of the communication device 10 according to Embodiment 3. In Figure 13, the antenna module 100 described in Figure 3 of Embodiment 1 will be used for explanation. Figure 14 is a partial plan view of the communication device in Figure 13 as seen from the positive direction of the X-axis. In the following explanation, the explanation of each element of the antenna module 100 that overlaps with Figure 3 will not be repeated.

[0079] The communication device 10 includes a housing 20 for housing internal equipment, including an antenna module 100. The housing 20 includes a first part 21 made of a metal-containing material and a second part 22 made of a dielectric material such as resin that does not contain metal. The second part 22 is located inside a through hole 23 formed in the metal first part 21.

[0080] The antenna module 100 is positioned such that the entire surface 126 of the dielectric block 121, which is opposite to surface 123, that is, the entire surface that emits radio waves (the surface in the positive direction of the X axis), is in contact with the second part 22 of the housing 20. As shown in Figure 14, when the communication device 10 is viewed from above in the positive direction of the X axis, the entire surface 126 of the dielectric block 121 overlaps with the second part 22.

[0081] In this way, by placing a metal-free material in the housing portion in the direction of radiation of the radio waves emitted from the dielectric block 121, it is possible to prevent the emitted radio waves from being blocked or partially interfered with by the housing 20. Therefore, the degradation of the antenna gain of the antenna module 100 can be suppressed.

[0082] Furthermore, it is desirable to ensure that the dielectric block 121 is in close contact with the second portion 22 of the housing 20. If there is a space between the dielectric block 121 and the second portion 22, the dielectric constant of the radio wave radiation path changes due to the air layer in that space. As a result, reflection occurs at the interface between the dielectric block 121 and the air layer, and at the interface between the air layer and the second portion 22 of the housing 20, which can be a factor in the deterioration of antenna gain. Therefore, by ensuring that the dielectric block 121 and the second portion 22 are in close contact, the reflection of radio waves can be reduced, and the deterioration of antenna gain can be suppressed.

[0083] Furthermore, from the viewpoint of preventing reflection due to differences in dielectric constant, it is preferable to minimize the difference between the dielectric constant of the dielectric block 121 and the dielectric constant of the second portion 22.

[0084] In the above explanation, an example was described in which a part of the housing 20 (the first part 21) is formed from a material containing metal. However, as long as the strength of the housing 20 can be ensured, the entire housing 20 may be formed from a material that does not contain metal.

[0085] The "second part 22" in Embodiment 3 corresponds to the "specific part" in this disclosure. [Pattern] (Section 1) An antenna module according to one embodiment comprises a substrate, a dielectric block, a flat-plate-shaped first ground electrode, and a power supply wiring. The dielectric block has a first surface and a second surface that intersect each other, and the first surface is positioned opposite the mounting surface of the substrate. The first ground electrode intersects the substrate and is positioned opposite the second surface of the dielectric block. The power supply wiring is arranged on the substrate and transmits a high-frequency signal to the dielectric block. When viewed from the normal direction of the substrate in a plan view, the end of the power supply wiring is positioned to overlap with the dielectric block.

[0086] (Section 2) In the antenna module described in Section 1, the power supply wiring includes a first wiring and a second wiring. The first wiring and the second wiring are spaced apart from each other in a first direction parallel to the second plane.

[0087] (Section 3) In the antenna module described in Section 2, the second surface of the dielectric block has a substantially square shape. The first surface of the dielectric block has a first end and a second end that face each other in a first direction. The first wiring is located at the first end, and the second wiring is located at the second end.

[0088] (Article 4) The antenna module described in any one of Articles 1 to 3 further comprises a second ground electrode and a flat-plate shaped radiating element. The second ground electrode is positioned on the substrate opposite to the power supply wiring. The radiating element is positioned on the substrate opposite to the second ground electrode.

[0089] (Article 5) In the antenna module described in any one of paragraphs 1 to 4, the power supply wiring is arranged in contact with the dielectric block.

[0090] (Section 6) In the antenna module described in any one of Section 5, the dielectric block is positioned spaced apart from the first ground electrode.

[0091] (Section 7) In the antenna module described in any one of Sections 1 to 4, the feed wiring is arranged at a distance from the dielectric block. If the free-space wavelength of the radio waves radiated from the dielectric block is λ, then the distance between the feed wiring and the dielectric block is within λ / 10.

[0092] (Section 8) In the antenna module described in Section 7, the dielectric block is positioned in contact with the first ground electrode.

[0093] (Section 9) The antenna module described in any one of Sections 1 to 8 further comprises a second ground electrode positioned opposite the power supply wiring on the substrate. When viewed in plan from the direction normal to the substrate, at least a portion of the region where the substrate and the dielectric block overlap does not overlap with the second ground electrode.

[0094] (Item 10) In the antenna module described in any one of items 1 to 9, the relative permittivity of the dielectric block is greater than the relative permittivity of the substrate.

[0095] (Item 11) In the antenna module described in Item 10, the relative permittivity of the dielectric block is 10 or more.

[0096] (Section 12) The antenna module described in any one of Sections 1 to 3 further comprises a feeder. The feeder is located on the main surface on the substrate where the dielectric block is mounted and is configured to supply a high-frequency signal to the dielectric block. The feeder is surrounded by a conductive material. A portion of the conductive material is used as the first ground electrode.

[0097] (Section 13) The antenna module described in Section 12 further comprises a second ground electrode and a planar radiating element. The second ground electrode is positioned on the substrate opposite to the feed line. The radiating element is positioned on the substrate opposite to the second ground electrode.

[0098] (Section 14) In the antenna module described in Section 13, when viewed in a plan view from the direction normal to the substrate, at least a portion of the radiating element overlaps with the dielectric block.

[0099] (Section 15) The antenna module described in Section 4 further comprises a feeding circuit disposed on a substrate and configured to supply high-frequency signals to a dielectric block and a radiating element.

[0100] (Paragraph 16) A communication device relating to one aspect is equipped with an antenna module as described in any one of paragraphs 1 to 15.

[0101] (Section 17) The communication device described in Section 16 further comprises a housing for an antenna module. The housing includes a specific portion formed of a material that does not contain metal in at least part. When viewed from a plan view from the direction normal to the radiation surface of the dielectric block, the entire radiation surface overlaps with the specific portion.

[0102] (Paragraph 18) In the communication device described in paragraph 17, the radiating surface is in contact with a specific part. The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope of the claims are intended to be included. [Explanation of Symbols]

[0103] 10 Communication device, 20 Housing, 21 First part, 22 Second part, 23 Through hole, 100, 100A~100I Antenna module, 105, 105A SiP module, 106 Resin, 107 Shielding member, 110, 100X RFIC, 110A~110D Power supply circuit, 111A~111D, 113A~113D, 117 Switch, 112AR~112DR Low noise amplifier, 112AT~112DT Power amplifier, 114A~114D Attenuator, 115A~115D Phase shifter, 116 Signal combiner / distributor, 118 Mixer, 119 Amplifier circuit, 120 Antenna device, 121 Dielectric block, 122, 132 Bottom surface, 123, 126 Top surface, 124, 125 Side view: 127 Radiating element, 130, 130A Dielectric substrate, 131 Top view: 140, 140A, 140B, 145, 145A, 145B, 151, 152 Power supply wiring, 141, 146 Wiring electrodes, 142, 147 Stub, 150 Flat electrode, 155, 160 Solder bump, 200 BBIC, GND1, GND2 Grounding electrodes, OP1, OP2 Opening, SP1, SP2 Power supply point.

Claims

1. circuit board and A dielectric block having a first surface and a second surface that intersect each other, the first surface of which is positioned opposite the mounting surface of the substrate, A flat-plate-shaped first ground electrode is positioned intersecting the substrate and facing the second surface of the dielectric block, The substrate is arranged and includes power supply wiring that transmits a high-frequency signal to the dielectric block, When viewed from a plan view in the direction normal to the substrate, the end of the power supply wiring is positioned to overlap with the dielectric block. The power supply wiring includes a first wiring and a second wiring, An antenna module in which the first and second wirings are arranged spaced apart from each other in a first direction parallel to the second surface.

2. The second surface of the dielectric block has a substantially square shape, The first surface of the dielectric block has a first end and a second end that face each other in the first direction, The first wiring is located at the first end, The antenna module according to claim 1, wherein the second wiring is located at the second end.

3. In the aforementioned substrate, a second ground electrode is arranged opposite the power supply wiring, The antenna module according to claim 1 or claim 2, further comprising a flat plate-shaped radiating element disposed opposite the second ground electrode on the substrate.

4. The antenna module according to claim 1 or claim 2, wherein the power supply wiring is arranged in contact with the dielectric block.

5. The antenna module according to claim 4, wherein the dielectric block is arranged at a distance from the first ground electrode.

6. The power supply wiring is arranged at a distance from the dielectric block. The antenna module according to claim 1 or claim 2, wherein, if λ is the free-space wavelength of the radio waves radiated from the dielectric block, the distance between the power supply wiring and the dielectric block is within λ / 10.

7. The antenna module according to claim 6, wherein the dielectric block is arranged in contact with the first ground electrode.

8. The substrate further comprises a second grounding electrode arranged opposite to the power supply wiring, The antenna module according to claim 1 or claim 2, wherein, when viewed in plan from the normal direction of the substrate, at least a portion of the region where the substrate and the dielectric block overlap does not overlap with the second ground electrode.

9. The antenna module according to claim 1 or claim 2, wherein the relative permittivity of the dielectric block is greater than the relative permittivity of the substrate.

10. The antenna module according to claim 9, wherein the relative permittivity of the dielectric block is 10 or more.

11. The substrate further comprises a power supply device disposed on the main surface on which the dielectric block is mounted and configured to supply a high-frequency signal to the dielectric block, The power supply device is surrounded by a conductive material. The antenna module according to claim 1 or claim 2, wherein a part of the conductive member is used as the first ground electrode.

12. In the aforementioned substrate, a second ground electrode is arranged opposite the power supply wiring, The antenna module according to claim 11, further comprising a flat plate-shaped radiating element disposed opposite the second ground electrode on the substrate.

13. The antenna module according to claim 12, wherein, when viewed in plan from the direction normal to the substrate, at least a portion of the radiating element overlaps with the dielectric block.

14. The antenna module according to claim 3, further comprising a power supply circuit disposed on the substrate and configured to supply high-frequency signals to the dielectric block and the radiating element.

15. A communication device equipped with the antenna module described in claim 1.

16. The enclosure further comprises the aforementioned antenna module, The housing includes a specific portion formed of a material that does not contain metal in at least part of it. The communication device according to claim 15, wherein, when viewed from a plan view from the normal direction to the radio wave radiation surface in the dielectric block, the entire radiation surface overlaps with the specific portion.

17. The communication device according to claim 16, wherein the radiating surface is in contact with the specific portion.

18. A substrate and A dielectric block having a first surface and a second surface that intersect each other, the first surface of which is positioned opposite the mounting surface of the substrate, A flat-plate-shaped first ground electrode is positioned intersecting the substrate and facing the second surface of the dielectric block, Power supply wiring arranged on the substrate for transmitting high-frequency signals to the dielectric block, In the aforementioned substrate, a second ground electrode is arranged opposite the power supply wiring, The substrate comprises a flat plate-shaped radiating element positioned opposite the second ground electrode, An antenna module in which, when viewed from a plan view in the direction normal to the substrate, the end of the power supply wiring is positioned to overlap with the dielectric block.

Citation Information

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