Electronic components and methods for manufacturing electronic components

Abstract

To provide an electronic component capable of suppressing deterioration in mechanical strength of an element, and a manufacturing method of the same.SOLUTION: An element body 3 of an electronic component includes an end surface 3a. A plurality of internal electrodes 7 are arranged in the element body. An external electrode is electrically connected to the plurality of internal electrodes and arranged at the end surface. In the end surface 3a, a groove 11 and a groove 13 are formed. The groove 11 contains a plurality of groove parts 11a which are separated from each other. The groove 13 contains a plurality of groove parts 13a that are separated from each other and crossed to the plurality of groove parts 11a. The plurality of groove parts 11a and the plurality of groove parts 13a include a depth d1 at a plurality of positions P1 crossed each other, and include a depth d2 smaller than the depth d1 at a plurality of positions P2 which are not crossed each other. Each of the plurality of internal electrodes 7 is physically connected to the external electrode and exposed from the end surface 3a, at the corresponded position P1 of the plurality of positions P1 crossed each other.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an electronic component and a method for manufacturing an electronic component.

Background Art

[0002] A known electronic component includes a body having an end face, a plurality of internal electrodes disposed in the body, and external electrodes disposed on the end face (for example, Patent Document 1). The external electrodes are electrically connected to the plurality of internal electrodes. Each of the plurality of internal electrodes is exposed from the end face. A plurality of grooves are formed on the end face so as to be spaced apart from each other and intersect the plurality of exposed internal electrodes.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The end of the internal electrode may not be exposed on the surface of the body. In this case, it is difficult to establish an electrical connection between the internal electrode and the external electrode. Forming a groove in the body can expose the end of the internal electrode from the body. In order to surely expose the end of the internal electrode from the body, the depth of the groove may have to be increased. In a configuration where a groove is formed in the body, when stress acts on the body, the groove reduces the mechanical strength of the body. A configuration in which a groove having a large depth is formed in the body may greatly reduce the mechanical strength of the body.

[0005] One aspect of the present invention aims to provide an electronic component that suppresses a decrease in the mechanical strength of the body. Another aspect of the present invention aims to provide a method for manufacturing an electronic component that suppresses a decrease in the mechanical strength of the body. [Means for solving the problem]

[0006] An electronic component according to one embodiment comprises a body having an end face, a plurality of internal electrodes disposed within the body, and an external electrode disposed on the end face. The external electrode is electrically connected to the plurality of internal electrodes. The end face is formed with a first groove that includes a plurality of first groove portions that are spaced apart from each other, and a second groove that includes a plurality of second groove portions that are spaced apart from each other and intersect with the plurality of first groove portions. The plurality of first groove portions and the plurality of second groove portions have a first depth at each of the plurality of intersecting positions, and a second depth that is smaller than the first depth at each of the plurality of non-intersecting positions. Each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions.

[0007] In one of the above embodiments, the plurality of first groove portions and the plurality of second groove portions have a first depth greater than the second depth at each of the plurality of intersecting positions. Each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions. The first depth at the point where the first groove portion and the second groove portion intersect is greater than the second depth at the point where the first groove portion and the second groove portion do not intersect. Therefore, the internal electrode is reliably exposed from the end face at the point where the first groove portion and the second groove portion intersect. One embodiment described above reliably establishes an electrical connection between the internal electrode and the external electrode. The second depth at a position where the first groove and the second groove do not intersect is smaller than the first depth at a position where the first groove and the second groove intersect. Therefore, the position where the first groove and the second groove do not intersect is less likely to be a starting point for reducing the mechanical strength of the base material compared to the position where the first groove and the second groove intersect. In the above embodiment, the starting points for reducing the mechanical strength of the base material are extremely limited compared to a configuration where the groove depth is only the first depth. As a result, the above embodiment suppresses the reduction in the mechanical strength of the base material.

[0008] Another embodiment of the method for manufacturing an electronic component is the method for manufacturing an electronic component according to the above embodiment. The above another embodiment includes the steps of forming a first groove and a second groove on the end face by irradiating the end face with laser light, and arranging an external electrode on the end face. The forming step includes the step of exposing each of the multiple internal electrodes from the end face at corresponding positions by forming a first groove including a plurality of first groove portions and a second groove including a plurality of second groove portions. The arranging step includes the step of forming an external electrode on the end face so as to physically connect each of the multiple internal electrodes to the external electrode at corresponding positions.

[0009] In one of the other embodiments described above, a first groove and a second groove are formed on the end face by irradiating the end face with laser light. Multiple laser beam irradiations are performed at the position where the first groove portion and the second groove portion intersect with each other. In the electronic component obtained by one of the other embodiments described above, the first depth at the position where the first groove portion and the second groove portion intersect with each other is greater than the second depth at the position where the first groove portion and the second groove portion do not intersect with each other. As a result, one of the other embodiments described above reliably obtains an electronic component that suppresses a decrease in the mechanical strength of the base material. [Effects of the Invention]

[0010] One aspect of the present invention provides an electronic component that suppresses a decrease in the mechanical strength of a base material. Another aspect of the present invention provides a method for manufacturing an electronic component that suppresses a decrease in the mechanical strength of a base material. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a perspective view showing an electronic component according to one embodiment. [Figure 2] Figure 2 shows the cross-sectional configuration of the electronic component according to this embodiment. [Figure 3] Figure 3 shows multiple internal electrodes, a first groove, and a second groove. [Figure 4] Figure 4 is a perspective view showing multiple internal electrodes, a first groove, and a second groove. [Figure 5] Figure 5 shows multiple internal electrodes, a first groove, and a second groove. [Figure 6] Figure 6 shows multiple internal electrodes, a first groove, and a second groove. [Figure 7] Figure 7 is a flowchart showing the method for manufacturing electronic components according to this embodiment. [Modes for carrying out the invention]

[0012] Embodiments of the present invention will be described in detail below with reference to the attached drawings. In this description, the same reference numerals will be used for the same element or element having the same function, and redundant explanations will be omitted.

[0013] The configuration of the electronic component according to this embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view showing the electronic component according to this embodiment. Figure 2 is a diagram showing the cross-sectional configuration of the electronic component according to this embodiment. Figure 3 is a diagram showing a plurality of internal electrodes, a first groove, and a second groove. Figure 4 is a perspective view showing a plurality of internal electrodes, a first groove, and a second groove.

[0014] As shown in Figures 1 and 2, the electronic component 1 comprises a base body 3, an external electrode 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. In this embodiment, the electronic component 1 comprises a pair of external electrodes 5. In this embodiment, the electronic component 1 is a multilayer ceramic capacitor.

[0015] The base body 3 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes, for example, the shape of a rectangular parallelepiped with chamfered corner portions and ridge line portions, and the shape of a rectangular parallelepiped with rounded corner portions and ridge line portions. The base body 3 has a pair of end faces 3a, a pair of side faces 3c, and a pair of side faces 3e. In the present embodiment, the pair of end faces 3a face each other in the first direction D1, the pair of side faces 3c face each other in the second direction D2, and the pair of side faces 3e face each other in the third direction D3. The pair of end faces 3a, the pair of side faces 3c, and the pair of side faces 3e constitute the outer surface of the base body 3. The pair of side faces 3c and the pair of side faces 3e are adjacent to the pair of end faces 3a, respectively, and extend in the first direction D1 so as to connect the pair of end faces 3a.

[0016] The first direction D1 is the length direction of the base body 3, the second direction D2 is the width direction of the base body 3, and the third direction D3 is the height direction of the base body 3. The length of the base body 3 is 0.4 mm or more and 7.5 mm or less. The width of the base body 3 is 0.2 mm or more and 6.3 mm or less. The height of the base body 3 is 0.2 mm or more and 2.8 mm or less. In the present embodiment, the length of the base body 3 is 5.7 mm, the width of the base body 3 is 5.0 mm, and the height of the base body 3 is 2.6 mm.

[0017] The base body 3 is formed by laminating a plurality of dielectric layers. Each dielectric layer is laminated in the third direction D3. The base body 3 includes a plurality of laminated dielectric layers. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material is, for example, a dielectric ceramic of the BaTiO3 system, the Ba(Ti,Zr)O3 system, the (Ba,Ca)TiO3 system, the CaZrO3 system, or the (Ca,Sr)ZrO3 system. Each dielectric layer is integrated to such an extent that the boundary between each dielectric layer is not visible.

[0018] As shown in FIG. 2, the internal electrode 7 and the internal electrode 9 are arranged at different positions in the third direction D3. The internal electrode 7 and the internal electrode 9 are alternately arranged so as to face each other with a gap in the third direction D3 within the base body 3. The plurality of internal electrodes 7, 9 face each other in the third direction D3. The internal electrode 7 and the internal electrode 9 have different polarities from each other. The internal electrode 7 has one end 7a exposed on one of the pair of end faces 3a. The internal electrode 9 has one end 9a exposed on the other of the pair of end faces 3a. One end 7a of the internal electrode 7 is exposed on one of the pair of end faces 3a. One end 9a of the internal electrode 9 is exposed on the other of the pair of end faces 3a. The internal electrodes 7, 9 contain a conductive material. The conductive material contains, for example, Cu, Ni, or Pt. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste containing the above conductive material.

[0019] As shown in FIGS. 1 and 2, the pair of external electrodes 5 are arranged on the surface of the base body 3. The pair of external electrodes 5 are spaced apart from each other in the first direction D1. The external electrode 5 is arranged on the end face 3a. In the present embodiment, the external electrode 5 is also arranged on a part of each of the pair of side faces 3c and the pair of side faces 3e. The external electrode 5 may be arranged only on the end face 3a. The external electrode 5 may be arranged on the end face 3a and at least one of the pair of side faces 3c and the pair of side faces 3e. The portion of the external electrode 5 arranged on the end face 3a is arranged so as to cover the one ends 7a, 9a exposed on the end face 3a of the corresponding internal electrodes 7, 9. The external electrode 5 is electrically connected to the corresponding internal electrodes 7, 9.

[0020] The external electrode 5 has an electrode layer E, as shown in Figure 2. The electrode layer E includes a sintered metal layer. The sintered metal layer is formed by baking an electrode coating film, which is obtained by drying a conductive paste applied to the surface of the base body 3. In this embodiment, the sintered metal layer is made of Cu. The sintered metal layer may be made of Ni or Ag. The conductive paste includes, for example, metal powder made of Cu, Ni, or Ag, glass, resin, and an organic solvent. The electrode layer E may include a plating layer formed on the sintered metal layer. The electrode layer E may also include a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer.

[0021] As shown in Figures 3 and 4, grooves 11 and 13 are formed on each end face 3a. Groove 11 is formed on the end face 3a so as to include a plurality of groove portions 11a. The plurality of groove portions 11a are spaced apart from each other. Groove 13 is formed on the end face 3a so as to include a plurality of groove portions 13a. The plurality of groove portions 13a are spaced apart from each other. Each of the plurality of groove portions 13a intersects with the plurality of groove portions 11a. In this embodiment, groove 11 consists only of the plurality of groove portions 11a, and groove 13 consists only of the plurality of groove portions 13a. Groove 11 may include groove portions different from the plurality of groove portions 11a. Groove 13 may include groove portions different from the plurality of groove portions 13a. For example, if groove 11 constitutes a first groove, groove 13 constitutes a second groove. For example, if the plurality of groove portions 11a constitute a plurality of first groove portions, the plurality of groove portions 13a constitute a plurality of second groove portions.

[0022] Multiple groove portions 11a and multiple groove portions 13a are orthogonal to each other. Each of the multiple groove portions 11a extends along a third direction D3. Each groove portion 11a extends substantially straight along the end face 3a in the third direction D3. In this embodiment, the multiple groove portions 11a extend between a pair of side surfaces 3e on the end face 3a. The multiple groove portions 11a are aligned in a second direction D2 on the end face 3a. Each of the multiple groove portions 13a extends along a second direction D2. Each groove portion 13a extends substantially straight along the end face 3a in the second direction D2. In this embodiment, the multiple groove portions 13a extend between a pair of side surfaces 3c on the end face 3a. The multiple groove portions 13a are aligned in a third direction D3 on the end face 3a. Each groove portion 11a, 13a consists of a continuous groove. Each groove portion 11a, 13a may consist of multiple intermittent grooves.

[0023] Each of the multiple groove portions 11a includes multiple positions P1 that intersect with the multiple groove portions 13a and multiple positions P2 that do not intersect with the multiple groove portions 13a. Each of the multiple groove portions 13a also includes multiple positions P1 that intersect with the multiple groove portions 11a and multiple positions P2 that do not intersect with the multiple groove portions 11a. Each groove portion 11a, 13a has a depth d1 at each position P1 and a depth d2 at each position P2. Depths d1 and d2 are different from each other. Depth d1 is greater than depth d2. The depth d1 of groove portion 11a and the depth d1 of groove portion 13a may be the same or different. The depth d2 of groove portion 11a and the depth d2 of groove portion 13a may be the same or different. If depth d1 constitutes a first depth, then depth d2 constitutes a second depth. The depth d1 is, for example, 0.1 μm or more and 3 μm or less. The depth d2 is, for example, 0.2 μm or more and 6 μm or less. In this embodiment, the depth d1 is 1.5 μm and the depth d2 is 3 μm. The width of the multiple groove portions 11a is 10 μm or more and 500 μm or less. The width of the multiple groove portions 13a is 10 μm or more and 500 μm or less. In this embodiment, the width of the multiple groove portions 11a is 30 μm and the width of the multiple groove portions 13a is 30 μm.

[0024] Each of the multiple internal electrodes 7 is exposed from one end face 3a at a corresponding position P1 among the multiple positions P1, as shown in Figure 3. One end 7a of the internal electrode 7 is exposed from one end face 3a at the corresponding position P1 described above. In this embodiment, one end 7a includes a portion exposed from one end face 3a and a portion not exposed from one end face 3a. One end 7a may include a portion exposed from one end face 3a without the formation of grooves 11, 13. Each internal electrode 7 is directly connected to the corresponding external electrode 5 at the portion included in one end 7a and exposed from one end face 3a. Each internal electrode 7 is physically connected to the corresponding external electrode 5 at the corresponding position P1 described above. Each of the multiple internal electrodes 9, although not shown in the illustration, is exposed from the other end face 3a at a corresponding position P1 among the multiple positions P1, similar to the internal electrode 7. One end 9a of the internal electrode 9 is exposed from the other end face 3a at the corresponding position P1 described above. In this embodiment, one end 9a includes a portion exposed from the other end face 3a and a portion not exposed from the other end face 3a. One end 9a may also include a portion exposed from the other end face 3a without the formation of grooves 11, 13. Each internal electrode 9 is directly connected to the corresponding external electrode 5 at the portion included in one end 9a and exposed from the other end face 3a. Each internal electrode 9 is physically connected to the corresponding external electrode 5 at the corresponding position P1 described above.

[0025] As explained above, in electronic component 1, the multiple groove portions 11a and 13a each have a depth d1 greater than the depth d2 at each of the multiple positions P1. Each of the multiple internal electrodes 7 and 9 is exposed from the end face 3a at the corresponding position P1 and is physically connected to the external electrode 5. The depth d1 is greater than the depth d2. Therefore, each internal electrode 7 and 9 is reliably exposed from the corresponding end face 3a of the pair of end faces 3a at the position P1 where the groove portions 11a and 13a intersect each other. As a result, electronic component 1 reliably establishes an electrical connection between each internal electrode 7 and 9 and the corresponding external electrode 5. In electronic component 1, the depth d2 at position P2 where grooves 11a and 13a do not intersect is smaller than the depth d1 at position P1 where grooves 11a and 13a intersect. Therefore, position P2 where grooves 11a and 13a do not intersect is less likely to be a starting point for reducing the mechanical strength of the base body 3 compared to position P1 where grooves 11a and 13a intersect. In electronic component 1, compared to a configuration where the groove depth is only depth d1, the starting points for reducing the mechanical strength of the base body 3 are extremely limited. As a result, electronic component 1 suppresses the reduction in the mechanical strength of the base body 3.

[0026] In electronic component 1, the multiple groove portions 11a and the multiple groove portions 13a are perpendicular to each other. In electronic component 1, when viewed from the first direction D1, multiple positions P1 are balanced with respect to each of the multiple internal electrodes 7 and 9. As a result, electronic component 1 improves the uniformity of the connection between each of the multiple internal electrodes 7 and 9 and the external electrode 5.

[0027] Next, with reference to Figure 5, the configuration of a modified example of the electronic component 1 according to this embodiment will be described. Figure 5 shows a plurality of internal electrodes, a first groove, and a second groove. In this modified example, the configuration of grooves 11 and 13 differs from the embodiment described above. The differences between the embodiment described above and this modified example will be mainly described below.

[0028] As shown in Figure 5, the groove portion 11a extends along the fourth direction D4, and the groove portion 13a extends along the fifth direction D5, which is perpendicular to the fourth direction D4. The fourth direction D4 and the fifth direction D5 intersect the second direction D2 and the third direction D3. Each groove portion 11a and each groove portion 13a intersects the plurality of internal electrodes 7 at an angle when viewed from the first direction D1 with one end face 3a. Although not shown in the figure, each groove portion 11a and each groove portion 13a intersects the plurality of internal electrodes 9 at an angle when viewed from the first direction D1 with the other end face 3a. The angle between the third direction D3 and the fourth direction D4 is 22.5 degrees. The angle between the third direction D3 and the fifth direction D5 is 67.5 degrees. The angle between the third direction D3 and the fourth direction D4 may be 67.5 degrees, and the angle between the third direction D3 and the fifth direction D5 may be 22.5 degrees.

[0029] In this modified example, where the angle between the third direction D3 and the fourth direction D4 is 22.5 degrees, multiple positions P1 are more evenly balanced relative to each of the multiple internal electrodes 7 and 9 when viewed from the first direction D1. As a result, this modified example further improves the uniformity of the connection between each of the multiple internal electrodes 7 and 9 and the external electrode 5.

[0030] Furthermore, with reference to Figure 6, the configuration of another modified example of the electronic component 1 according to this embodiment will be described. Figure 6 shows a plurality of internal electrodes, a first groove, and a second groove. In this modified example, the configuration of grooves 11 and 13 differs from the embodiment and modified example described above. The differences between the embodiment and modified example described above and this modified example will be mainly described below.

[0031] As shown in Figure 6, each of the multiple groove portions 11a and 13a exhibits a wave shape when viewed from the first direction D1. The wave shape includes a shape in which the amplitude and period of the wave are repeated regularly or a shape in which the amplitude and period of the wave are repeated irregularly. The wave shape includes, for example, a sinusoidal wave or a triangular wave. In this modified example, the multiple groove portions 11a and 13a extend collectively in the second direction D2 while exhibiting a wave shape. The multiple groove portions 11a and 13a may extend collectively in different directions from each other. The multiple groove portions 11a and 13a are formed offset from each other in the second direction D2. In this modified example, the multiple groove portions 11a and 13a are formed offset from each other by half a period in the second direction D2.

[0032] Next, the method for manufacturing the electronic component 1 in this embodiment will be described with reference to Figure 7. Figure 7 is a flowchart showing the method for manufacturing the electronic component in this embodiment.

[0033] In step S1, a base body 3 is prepared, in which multiple internal electrodes 7 and 9 are arranged inside. The base body 3 may be newly created in step S1, or an already created base body 3 may be prepared. In the base body 3 prepared in step S1, grooves 11 and 13 are not formed on the end face 3a. In the base body 3 prepared in step S1, one end 7a and 9a of the multiple internal electrodes 7 and 9 are covered by the dielectric material that constitutes the base body 3. In this manufacturing method, in the base body 3 prepared in step S1, for example, all of the multiple internal electrodes 7 and 9 are covered by the dielectric layer.

[0034] In step S2, grooves 11 and 13 are formed on the end face 3a by irradiating the end face 3a with laser light. In this manufacturing method, grooves 11 containing multiple groove portions 11a and grooves 13 containing multiple groove portions 13a are formed on the end face 3a by irradiating the end face 3a with laser light. In step S2, by forming grooves 11 containing groove portions 11a and grooves 13 containing groove portions 13a on the end face 3a, each of the multiple internal electrodes 7 and 9 is exposed from the end face 3a at the corresponding position P1 among the multiple positions P1. That is, by irradiating the end face 3a with laser light, each of the multiple internal electrodes 7 and 9 is exposed from the end face 3a at the corresponding position P1.

[0035] The laser beam is irradiated onto the end face 3a while scanning along the direction in which the multiple groove portions 11a and multiple groove portions 13a extend. In this manufacturing method, when forming a groove 11 including multiple groove portions 11a, the laser beam is scanned along a third direction D3, and when forming a groove 13 including multiple groove portions 13a, the laser beam is scanned along a second direction D2.

[0036] The laser that irradiates the end face 3a is, for example, a rare-earth fiber laser. For example, the laser is a mode-locked pulsed laser, and the laser light is pulsed laser light. The wavelength of the laser light irradiated onto the end face 3a is, for example, between 250 nm and 1600 nm. The pulse duration of the laser light irradiated onto the end face 3a is, for example, 10 ps or less. The pulse energy of the laser light irradiated onto the end face 3a is, for example, between 5 μJ and 200 μJ.

[0037] In this manufacturing method, grooves 11 and 13 are formed on the end face 3a by irradiating it with laser light. At position P1 where grooves 11a and 13a intersect, multiple laser beam irradiations are performed. In the electronic component obtained by this manufacturing method, the depth d1 at position P1 where grooves 11a and 13a intersect is greater than the depth d2 at position P2 where grooves 11a and 13a do not intersect.

[0038] In step S3, an external electrode 5 is placed on the end face 3a. In this manufacturing method, the external electrode 5 is formed on the end face 3a so as to physically connect each of the multiple internal electrodes 7, 9 to the external electrode 5. Each of the multiple internal electrodes 7, 9 and the external electrode 5 are physically connected at the corresponding position P1 among the multiple positions P1. The placement of the external electrode 5 includes, for example, the following process: First, a conductive paste is applied to the surface of the base body 3. Next, the applied conductive paste is baked onto the base body 3. This forms the electrode layer E. The conductive paste is applied, for example, by a dipping method, a printing method, or a transfer method. In this manufacturing method, the conductive paste is applied to five surfaces: one end face 3a, a pair of side surfaces 3c, and a pair of side surfaces 3c. The electrode layer E may be formed, for example, by a physical vapor deposition (PVD) method or a chemical vapor deposition (CVD) method.

[0039] Through the above process, electronic component 1 is obtained. As described above, electronic component 1 reliably establishes electrical connections between each of the multiple internal electrodes 7 and 9 and the corresponding external electrode 5, while suppressing a decrease in the mechanical strength of the base body 3. The above manufacturing method reliably produces electronic component 1 that suppresses a decrease in the mechanical strength of the base body 3.

[0040] Point irradiation or discrete laser scanning of a laser can achieve a configuration in which the depth at a given position is equivalent to the depth d1. In this case, it is necessary to temporarily pause the laser scanning at the given position. Therefore, point irradiation or discrete laser scanning of a laser requires time for the laser scanning. Furthermore, because the energy of each irradiation is large, the processing impact on the substrate 3 increases. According to the manufacturing method of this embodiment, there is no need to temporarily stop the laser scanning, and laser processing of the base body 3 can be performed efficiently. Furthermore, according to the manufacturing method of this embodiment, the irradiation energy per pass can be reduced, so the processing impact on the base body 3 can be minimized.

[0041] While embodiments and modifications of the present invention have been described above, the present invention is not necessarily limited to the embodiments and modifications described above, and various modifications are possible without departing from the spirit of the invention.

[0042] In electronic component 1, the multiple groove portions 11a and the multiple groove portions 13a do not have to be orthogonal to each other. Electronic component 1 in which the multiple groove portions 11a and the multiple groove portions 13a are orthogonal to each other improves the uniformity of the connection between each of the multiple internal electrodes 7, 9 and the external electrode 5, as described above. In electronic component 1, the angle between the third direction D3, in which the multiple internal electrodes 7 and 9 face each other, and the fourth direction D4, in which the multiple groove portions 11a extend, does not necessarily have to be 22.5 degrees. In electronic component 1 where the angle between the third direction D3 and the fourth direction D4 is 22.5 degrees, as described above, the uniformity of the connection between each of the multiple internal electrodes 7 and 9 and the external electrode 5 is further improved. Each of the multiple groove portions 11a and 13a does not necessarily have to exhibit a wave shape when viewed from the first direction D1. An electronic component 1 in which each of the multiple groove portions 11a and 13a exhibits a wave shape when viewed from the first direction D1 can easily realize the multiple groove portions 11a and 13a. The angle between the third direction D3 and the fourth direction D4, and the angle between the third direction D3 and the fifth direction D5, may be 45 degrees. The configuration in which the angle between the third direction D3 and the fourth direction D4 is 22.5 degrees further improves the uniformity of the connection between each of the multiple internal electrodes 7, 9 and the external electrode 5, as described above.

[0043] In this embodiment and its modifications, electronic component 1 is described as a multilayer ceramic capacitor, but the electronic components to which the present invention can be applied are not limited to multilayer ceramic capacitors. Applicable electronic components include, for example, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer solid-state batteries.

[0044] As can be seen from the above-described embodiments and modifications, this specification includes the following embodiments. (Note 1) A base body having an end face, Multiple internal electrodes arranged within the aforementioned body, The system comprises an external electrode positioned on the end face and electrically connected to the plurality of internal electrodes, The end face is formed such that the first groove includes a plurality of first groove portions that are spaced apart from each other, and the second groove includes a plurality of second groove portions that are spaced apart from each other and intersect with the plurality of first groove portions. The plurality of first groove portions and the plurality of second groove portions each have a first depth at each of the plurality of intersecting positions, and each of the plurality of non-intersecting positions has a second depth that is smaller than the first depth. An electronic component in which each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions. (Note 2) The electronic component as described in Appendix 1, wherein the plurality of first groove portions and the plurality of second groove portions are perpendicular to each other. (Note 3) The plurality of internal electrodes are arranged within the substrate so as to face each other. Each of the aforementioned plurality of first groove portions extends along the first direction, Each of the aforementioned plurality of second groove portions extends along a second direction perpendicular to the first direction, The electronic component as described in Appendix 1 or Appendix 2, wherein the angle between the direction in which the plurality of internal electrodes face each other and the first direction is 22.5 degrees. (Note 4) The electronic component as described in Appendix 1, wherein each of the plurality of first groove portions and the plurality of second groove portions exhibits a wave shape when viewed from a direction perpendicular to the end face. (Note 5) The aforementioned electronic component is a multilayer ceramic capacitor, as specified in any one of the appendices 1 to 4. (Note 6) A method for manufacturing an electronic component described in any one of the appendices 1 to 5, The process of forming the first groove and the second groove on the end face by irradiating the end face with laser light, The step includes arranging the external electrode on the end face, The forming step includes forming the first grooves, which include the plurality of first groove portions, and the second grooves, which include the plurality of second groove portions, thereby exposing each of the plurality of internal electrodes from the end face at the corresponding position. A method for manufacturing an electronic component, comprising the step of arranging, which includes the step of forming the external electrode on the end face such that each of the plurality of internal electrodes is physically connected to the external electrode at the corresponding position. [Explanation of Symbols]

[0045] 1...Electronic component, 3...Element body, 3a...End face, 5...External electrode, 7,9...Internal electrode, 11,13...Groove, 11a,13a...Groove portion, d1, d2...Depth, D4...Fourth direction, D5...Fifth direction, P1, P2...Position.

Claims

1. A base body having an end face, Multiple internal electrodes arranged within the aforementioned body, The system comprises an external electrode positioned on the end face and electrically connected to the plurality of internal electrodes, The end face is formed such that the first groove includes a plurality of first groove portions that are spaced apart from each other, and the second groove includes a plurality of second groove portions that are spaced apart from each other and intersect with the plurality of first groove portions. The plurality of first groove portions and the plurality of second groove portions each have a first depth at each of the plurality of intersecting positions, and each of the plurality of non-intersecting positions has a second depth that is smaller than the first depth. The plurality of internal electrodes are arranged within the substrate so as to face each other. Each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions. Each of the aforementioned plurality of first groove portions extends along the first direction, Each of the aforementioned plurality of second groove portions extends along a second direction perpendicular to the first direction, An electronic component in which the angle between the direction in which the plurality of internal electrodes face each other and the first direction is 22.5 degrees.

2. The electronic component according to claim 1, wherein the plurality of first groove portions and the plurality of second groove portions are orthogonal to each other.

3. A base body having an end face, Multiple internal electrodes arranged within the aforementioned body, The system comprises an external electrode positioned on the end face and electrically connected to the plurality of internal electrodes, The end face is formed such that the first groove includes a plurality of first groove portions that are spaced apart from each other, and the second groove includes a plurality of second groove portions that are spaced apart from each other and intersect with the plurality of first groove portions. The plurality of first groove portions and the plurality of second groove portions each have a first depth at each of the plurality of intersecting positions, and each of the plurality of non-intersecting positions has a second depth that is smaller than the first depth. Each of the plurality of internal electrodes is exposed from the end face and physically connected to the external electrode at a corresponding position among the plurality of intersecting positions. An electronic component in which each of the plurality of first groove portions and the plurality of second groove portions exhibits a wave shape when viewed from a direction perpendicular to the end face.

4. The electronic component is a multilayer ceramic capacitor, as described in any one of claims 1 to 3.

5. A method for manufacturing an electronic component according to claim 1 or 3, The process of forming the first groove and the second groove on the end face by irradiating the end face with laser light, The step includes arranging the external electrode on the end face, The forming step includes forming the first grooves including the plurality of first groove portions and the second grooves including the plurality of second groove portions, thereby exposing each of the plurality of internal electrodes from the end face at the corresponding position. A method for manufacturing an electronic component, comprising the step of arranging, which includes the step of forming the external electrode on the end face such that each of the plurality of internal electrodes is physically connected to the external electrode at the corresponding position.

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