Manufacturing method for image acquisition modules

Abstract

To provide a method of manufacturing an image capturing module for reducing overall thickness.SOLUTION: A manufacturing method includes the steps of: making a circuit substrate of which bottom side of a through opening is closed by a temporary carrying substrate, and the temporary carrying substrate close to each other to place the circuit substrate on the temporary carrying substrate; placing an image sensing chip so as to be stored in the through opening of the circuit substrate, on the temporary carrying substrate; forming an insulating connection structure in the through opening of the circuit substrate so as to be connected between the image sensing chip and the circuit substrate; electrically connecting the image sensing chip to the circuit substrate through a plurality of metal wires; and placing a lens assembly on the circuit substrate. The image sensing chip can still be firmly fixed in the through opening of the circuit substrate through the insulating connection structure without contacting the circuit substrate, thereby reducing the overall thickness of the image capturing module.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an image capturing module, and particularly to a method for manufacturing an image capturing module for reducing the overall thickness.

Background Art

[0002] In the existing technology, the image sensing chip of an image capturing module may be installed by wire bonding on the top of a circuit board without an opening. Also, the image sensing chip of an image capturing module may be installed by flip-chip bonding on the bottom end of a circuit board with an opening. However, there is still room for improvement in the existing image capturing modules.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to improve or solve the deficiencies of the existing technology, and to provide a method for manufacturing an image capturing module for reducing the overall thickness.

Means for Solving the Problems

[0004] To improve or solve the above problems, one of the technical means employed by the present invention is to provide a method for manufacturing an image acquisition module for reducing the overall thickness. The method includes the step of bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board. Here, the circuit board has a top surface, a bottom surface, and a through-hole connecting the top and bottom surfaces, and the bottom end of the through-hole of the circuit board is sealed by the temporary carrier board. The method further includes the step of placing an image sensing chip in the through-hole of the circuit board and placing it on the temporary carrier board. Steps (1) and (2) are performed in order or in reverse. Step (1) is to form an insulating connection structure in the through-hole of the circuit board to connect between the image sensing chip and the circuit board. Step (2) is to electrically connect the image sensing chip to the circuit board through a plurality of metal wires. The method further includes the step of placing a lens assembly on the circuit board. Here, the lens assembly includes a lens carrier placed on the circuit board and a lens module supported by the lens carrier. The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The lower surface of the image sensing chip is exposed to the outside and is not covered by an insulating connection structure. Furthermore, the manufacturing method of the image acquisition module includes mounting a filter element above the image sensing chip through the support of multiple supports or surrounding supports.

[0005] To improve or solve the above problems, another technical means employed by the present invention is to provide a method for manufacturing an image acquisition module for reducing the overall thickness. The method includes bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board. The circuit board has a top surface, a bottom surface, and a through-hole connecting the top and bottom surfaces, and the bottom end of the through-hole of the circuit board is sealed by the temporary carrier board. The method includes placing an image sensing chip in the through-hole of the circuit board and setting it on the temporary carrier board. The method further includes performing steps (1) and (2) in order or in reverse. Step (1) is to form an insulating connection structure connecting the image sensing chip and the circuit board in the through-hole of the circuit board, and step (2) is to electrically connect the image sensing chip to the circuit board through a plurality of metal wires. The method includes setting a lens assembly on the circuit board. The lens assembly includes a lens carrier set on the circuit board and a lens module supported by the lens carrier. Here, the top surface of the image sensing chip has an image sensing area corresponding to the lens module, while the bottom surface of the image sensing chip is exposed and not covered by an insulating connection structure. [Effects of the Invention]

[0006] One beneficial effect of the present invention is to provide a method for manufacturing an image acquisition module that reduces the overall thickness. This method uses the technical means of "bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board, and the circuit board having an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces" and "performing steps (1) and (2) in order or in reverse. Step (1) is to place an image sensing chip in the through-hole of the circuit board and place it on the temporary carrier board, and step (2) is to form an insulating connection structure in the through-hole of the circuit board and connect it between the image sensing chip and the circuit board" to stably fix the image sensing chip in the through-hole of the circuit board by connecting the insulating connection structure without the image sensing chip coming into contact with the circuit board, thereby reducing the overall thickness of the image acquisition module.

[0007] To better understand the features and technical content of the present invention, please refer to the following detailed description and drawings relating to the invention. However, the drawings provided are for reference and illustrative purposes only and are not intended to limit the present invention. [Brief explanation of the drawing]

[0008] [Figure 1] This is a flowchart of a manufacturing method for an image acquisition module provided by the present invention, which reduces the overall thickness. [Figure 2] This is a schematic diagram of step S100 in a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a first embodiment of the present invention. [Figure 3] This is a schematic diagram of steps S102 and S104 relating to a method for manufacturing an image acquisition module to reduce the overall thickness, as provided by a first embodiment of the present invention. [Figure 4] This is a schematic diagram of step S106 in a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a first embodiment of the present invention. [Figure 5] This is a schematic diagram of step S108 of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a first embodiment of the present invention. [Figure 6] This is a schematic diagram of an image acquisition module for reducing overall thickness, provided by a first embodiment of the present invention. [Figure 7] This is a schematic diagram of one executable embodiment of a method for manufacturing an image acquisition module to reduce overall thickness, provided by a first embodiment of the present invention (the step of electrically connecting an image sensing chip to a circuit board and then removing the temporary carrier board from the circuit board). [Figure 8] This is a schematic diagram of another executable embodiment of a manufacturing method for an image acquisition module to reduce overall thickness, provided by the first embodiment of the present invention (the step of removing the temporary carrier substrate from the circuit board after the lens assembly has been placed on the circuit board). [Figure 9] This is a schematic diagram of an executable embodiment of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a second embodiment of the present invention. [Figure 10] This is a schematic diagram of an image acquisition module for reducing overall thickness, provided by a second embodiment of the present invention. [Figure 11] This is a schematic diagram of an image acquisition module for reducing overall thickness, provided by a third embodiment of the present invention. [Figure 12] This is a schematic diagram of steps S200 and S202 relating to a method for manufacturing an image acquisition module to reduce the overall thickness, as provided by a fourth embodiment of the present invention. [Figure 13] This is a schematic diagram of step S204 of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a fourth embodiment of the present invention. [Figure 14] This is a schematic diagram of step S206 in a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a fourth embodiment of the present invention. [Figure 15] This is a functional block diagram of a portable electronic device using an image acquisition module, provided by a fifth embodiment of the present invention. [Modes for carrying out the invention]

[0009] The following describes embodiments of the "Method for Manufacturing an Image Acquisition Module" disclosed in the present invention with specific examples. Those skilled in the art will be able to understand the merits and effects of the present invention from the published content of this specification. The present invention can be carried out or applied by other different embodiments. Each section in this specification can also be modified and altered in equal measure, based on various viewpoints or applications, as long as it does not deviate from the spirit of the invention. Furthermore, the drawings of the present invention are for simple and schematic purposes only and do not show actual dimensions. Further technical details of the present invention will be described in the following embodiments, but the published content does not limit the present invention. Furthermore, the term "or" used in this specification may include any one or more combinations of the relevant items, depending on the actual situation.

[0010] [First Embodiment] As shown in Figures 1 to 6, a first embodiment of the present invention provides a method for manufacturing an image acquisition module that reduces the overall thickness. The method comprises several steps as follows. First, in step 100, as shown in Figures 1 and 2, the circuit board 1 and the temporary carrier board C (also called a movable board, separable board, or removable board) are brought closer together to position the circuit board 1 on the temporary carrier board C (or until the circuit board 1 and the temporary carrier board C are in complete contact). Here, the circuit board 1 has an upper surface 1001, a lower surface 1002, and a through-hole 1003 (or a through-hole 1003 that penetrates the circuit board 1) connected between the upper surface 1001 and the lower surface 1002, and the bottom end of the through-hole 1003 of the circuit board 1 is sealed by the temporary carrier board C (step S100).

[0011] Next, in step 102, the image sensing chip 2 is placed on the temporary carrier substrate C so that it is housed in the through-hole 1003 of the circuit board 1, as shown in Figures 1 and 3 (step S102). Then, in step 104, an insulating connection structure 3 is formed in the through-hole 1003 of the circuit board 1 to connect the image sensing chip 2 and the circuit board 1 (step S104). Subsequently, in step 106, the temporary carrier substrate C is removed from the circuit board 1, as shown in Figures 1 and 4 (step S106). Then, in step 108, the image sensing chip 2 is electrically connected to the circuit board 1 using multiple metal wires W (any conductive metal material can be used, such as gold, silver, or copper), as shown in Figures 1 and 5 (step S108). Finally, in step 110, the lens assembly 4 is placed on the circuit board 1, as shown in Figures 1 and 6. Here, the lens assembly 4 includes a lens carrier 41 mounted on the circuit board 1 and a lens module 42 supported by the lens carrier 41 (step S110). However, the above example is merely one possible embodiment and does not limit the present invention.

[0012] For example, as shown in Figures 1 and 2, in step S100, in which the circuit board 1 is brought close to the temporary carrier board C and the circuit board 1 is placed on the temporary carrier board C, the present invention can be carried out by operating a processing machine to bring the circuit board 1 close to the temporary carrier board C, or to bring the temporary carrier board C close to the circuit board 1, until the two are in complete contact. In other words, any method for achieving "bringing the circuit board 1 and the temporary carrier board C close together and placing the circuit board 1 on the temporary carrier board C" is applicable to the method for manufacturing an image acquisition module that reduces the overall thickness, as provided in the first embodiment of the present invention. However, the above example is merely one feasible embodiment and does not limit the present invention.

[0013] For example, as shown in FIGS. 1 and 3, in step S102 of disposing the image sensing chip 2 within the through-hole 1003 of the circuit board 1 and installing it on the temporary carrier substrate C, the present invention first uses an image capturing module (not shown) to confirm the position of the through-hole 1003 of the circuit board 1, and then accurately disposes the image sensing chip 2 within the through-hole 1003 of the circuit board 1 and installs it on the temporary carrier substrate C, thereby improving the accuracy of the optical alignment of the image sensing chip 2. It should be noted that the image sensing chip 2 can be directly installed on the temporary carrier substrate C without any medium, or the image sensing chip 2 can also be installed on the temporary carrier substrate C through an adhesive layer with low adhesiveness. However, the above example is only one feasible embodiment and does not limit the present invention.

[0014] For example, as shown in FIGS. 1 and FIGS. 3, in step S104 of forming an insulating connection structure 3 within the through-hole 1003 of the circuit board 1 and connecting between the image sensing chip 2 and the circuit board 1, the present invention uses an image sensing module (not shown) to first confirm the empty space located between the image sensing chip 2 and the circuit board 1 (that is, the space in the through-hole 1003 not occupied by the image sensing chip 2). Thereafter, an insulating material (such as silicone gel or epoxy resin) is filled into the through-hole 1003, and then the insulating material is cured by using a heating module (not shown) (or naturally cured at room temperature), thereby completing the production of the insulating connection structure 3. However, the above example is only one feasible embodiment and does not limit the present invention.

[0015] For example, as shown in Figures 1 and 4, in step S106, in which the temporary carrier substrate C is removed from the circuit board 1, the circuit board 1 can be fixed in place beforehand, so that the temporary carrier substrate C moves directly downward relative to the circuit board 1, thereby allowing the temporary carrier substrate C to be directly detached from the circuit board 1. In other embodiments, the bonding or adhesive force between the insulating connection structure 3 and the temporary carrier substrate C can be weakened or reduced by direct irradiation with laser light (heat source) generated by a laser generator (not shown) or indirect heating by a heat source generated by a heater (not shown), thereby allowing the temporary carrier substrate C to be detached from the circuit board 1 in a more labor-saving manner, and making the placement position (or optical alignment) of the image sensing chip 2 less affected by the detachment of the temporary carrier substrate C. Of particular note is that when the temporary carrier substrate C moves directly downward and detaches from the circuit board 1, the lower surrounding surface 3000 of the insulating connection structure 3 generates a gel detachment trace T1 that is formed "after separation from the temporary carrier substrate C". Furthermore, when the temporary carrier substrate C detaches from the circuit board 1 due to direct irradiation with laser light generated by the laser generator or indirect heating by a heat source generated by the heater, the lower surrounding surface 3000 of the insulating connection structure 3 generates gel deformation marks (not shown) that are formed "after heating by a heat source generated by the laser generator or heater." However, the above example is merely one feasible embodiment and does not limit the present invention.

[0016] For example, as shown in FIGS. 1, 3, and 5, in step S108 of electrically connecting the image sensing chip 2 to the circuit board 1 via a plurality of metal wires W, there are a plurality of board conductive pads 10P on the upper surface 1001 of the circuit board 1, and a plurality of chip conductive pads 20P on the upper surface 2001 of the image sensing chip 2. The plurality of chip conductive pads 20P of the image sensing chip 2 can be electrically connected to the plurality of board conductive pads 10P of the circuit board 1 via a plurality of metal wires W (for example, cross-linked metal lead wires as shown in FIG. 5, or continuous metal traces formed simultaneously on the surface of the image sensing chip 2, the surface of the insulating connection structure 3, and the surface of the circuit board 1). However, the above example is merely one embodiment and does not limit the present invention.

[0017] For example, as shown in FIG. 5, the method for manufacturing an imaging module for reducing the overall thickness provided by the first embodiment of the present invention further includes installing a filter element 5 above the image sensing chip 2 supported by a plurality of supports (not numbered) or surrounding supports (not numbered). That is, in step S108 of electrically connecting the image sensing chip 2 to the circuit board 1 via a plurality of metal wires W, the filter element 5 can be supported by a plurality of supports (not numbered) or surrounding supports (not numbered) and installed at a predetermined position above the image sensing chip 2. However, the above example is merely one embodiment and does not limit the present invention.

[0018] It should be noted that, for example, as shown in Figure 7, in one embodiment, after step S104 in which the insulating connection structure 3 is formed inside the through-hole 1003 of the circuit board 1, it is not necessary to immediately remove the temporary carrier board C from the circuit board 1. Instead, as shown in Figure 7, the temporary carrier board C can be removed from the circuit board 1 after the step of electrically connecting the image sensing chip 2 to the circuit board 1 via a plurality of metal wires W (or after the step of installing the filter element 5 above the image sensing chip 2 via a plurality of supports or surrounding supports). Also, as shown in Figure 8, in one embodiment, after step S104 in which the insulating connection structure 3 is formed inside the through-hole 1003 of the circuit board 1, it is not necessary to immediately remove the temporary carrier board C from the circuit board 1. Instead, as shown in Figure 8, the temporary carrier board C can be removed from the circuit board 1 after the step of installing the lens assembly 4 on the circuit board 1. In other words, depending on different processing needs, the temporary carrier substrate C can be removed from the circuit board 1 after the step of "forming the insulating connection structure 3 within the through-hole 1003 of the circuit board 1," or after the step of "electrically connecting the image sensing chip 2 to the circuit board 1 via a plurality of metal wires W," or after the step of "installing the lens assembly 4 on the circuit board 1." However, the above example is merely one embodiment and does not limit the present invention.

[0019] Furthermore, as shown in Figures 2 to 6, the first embodiment of the present invention provides an image acquisition module M (or image sensing module, image capture module) for reducing the overall thickness, the image acquisition module M including a circuit board 1, an image sensing chip 2, an insulating connection structure 3, and a lens assembly 4.

[0020] To explain in more detail, as shown in Figures 5 and 6, the circuit board 1 has an upper surface 1001, a lower surface 1002, and a through-hole 1003 connecting the upper surface 1001 and the lower surface 1002. The image sensing chip 2 is installed in the through-hole 1003 of the circuit board 1 and is electrically connected to the circuit board 1 via multiple metal wires W. For example, the upper surface 1001 of the circuit board 1 has multiple substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 has multiple chip conductive pads 20P. Each of the multiple chip conductive pads 20P of the image sensing chip 2 is electrically connected to the multiple substrate conductive pads 10P of the circuit board 1 via multiple metal wires W. Also, depending on different usage needs, the image sensing chip 2 can be... Charge coupling geometry It can be a Charge Coupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS). However, the above examples are merely one embodiment and do not limit the present invention.

[0021] More specifically, as shown in Figures 5 and 6, the insulating connection structure 3 is installed within the through-hole 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1. Furthermore, the lens assembly 4 includes a lens carrier 41 installed on the circuit board 1 and a lens module 42 (e.g., composed of multiple optical lenses) held by the lens carrier 41, and the upper surface 2001 of the image sensing chip 2 has an image sensing area 20S corresponding to the lens module 42. It is noteworthy that the lower surface 2002 of the image sensing chip 2 is exposed to the outside and is not covered by the insulating connection structure 3. The insulating connection structure 3 has an exposed lower enclosure 3000, and this lower enclosure 3000, the lower surface 1002 of the circuit board 1, and the lower surface 2002 of the image sensing chip 2 can be aligned to the same height completely or almost (substantially). However, the above example is merely one embodiment and does not limit the present invention.

[0022] For example, as shown in Figures 5 and 6, the thickness of the insulating connection structure 3 can be "less than or equal to the thickness of the image sensing chip 2" and "less than or equal to the thickness of the circuit board 1", and the insulating connection structure 3 can be closely connected between the outer surface 2000 of the image sensing chip 2 and the inner surface 1004 of the through-hole 1003 of the circuit board 1. In a particular embodiment, the inner surface 1004 of the through-hole 1003 of the circuit board 1 is Roughened surrounding surface When configured as, Roughened surrounding surface This is used to increase the adhesive force or contact area between the insulating connection structure 3 and the circuit board 1. In certain embodiments, all or part of the outer surface 2000 of the image sensing chip 2 is covered by the insulating connection structure 3, thereby adjusting the adhesive force or contact area between the insulating connection structure 3 and the image sensing chip 2 (i.e., the larger the area of ​​the outer surface 2000 of the image sensing chip 2 covered by the insulating connection structure 3, the greater the adhesive force or contact area between the insulating connection structure 3 and the image sensing chip 2). However, the above example is only one embodiment and does not limit the present invention.

[0023] For example, as shown in Figures 4 and 6, the lower surface 3000 of the insulating connection structure 3 has a gel detachment trace T1 that occurs after separation from the temporary carrier substrate C. In one embodiment, when the temporary carrier substrate C is peeled from the circuit board 1 by "direct irradiation of laser light generated by a laser generator" or "indirect heating of a heat source generated by a heater", a gel deformation trace (not shown) is formed on the lower surface 3000 of the insulating connection structure 3 "after being heated by a laser generator or heater". However, the above example is only one example of a possible embodiment and does not limit the present invention.

[0024] For example, as shown in Figures 5 and 6, the image acquisition module M further includes a filter element 5. The filter element 5 is supported by a plurality of supports (not numbered) or surrounding supports (not numbered) and is mounted above the image sensing chip 2. The filter element 5 is also surrounded by a plurality of metal wires W, and its height may be higher or lower than the height of the plurality of metal wires W relative to the image sensing chip 2. However, the above example is merely one possible embodiment and does not limit the present invention.

[0025] For example, in one embodiment, the insulating connection structure 3 may have an extended connection portion (not shown) that extends onto the upper surface 1001 of the circuit board 1. This can increase the adhesive force or contact area between the insulating connection structure 3 and the circuit board 1. That is, since the insulating connection structure 3 is positioned to overlap the upper surface 1001 of the circuit board 1 through the extension of the extended connection portion, the contact area between the insulating connection structure 3 and the circuit board 1 is increased (or the insulating connection structure 3 receives more support from the circuit board 1). As a result, the insulating connection structure 3 will not easily detach from the through-hole 1003 of the circuit board 1 due to external forces (for example, external forces that occur when removing the temporary carrier substrate C from the circuit board 1, as shown in Figure 4). However, the above example is merely one possible embodiment and does not limit the present invention.

[0026] [Second Embodiment] As shown in Figures 1, 9, and 10, a second embodiment of the present invention provides a method for manufacturing an image imaging module M with reduced overall thickness and an image imaging module thereof. A comparison of Figure 9 and Figure 3, and a comparison of Figure 10 and Figure 6, shows that the main difference between the second embodiment and the first embodiment of the present invention is that, after step S100, in which the circuit board 1 and the temporary carrier board C are brought close to each other and the circuit board 1 is placed on the temporary carrier board C, the method for manufacturing an image imaging module with reduced overall thickness further includes the following steps: In step S104(A), a bottom-edge surrounding insulating layer 31 is formed in the through-hole 1003 of the circuit board 1 so as to connect between the image sensing chip 2 and the circuit board 1. In step S104(B), a top-edge surrounding insulating layer 32 is formed in the through-hole 1003 of the circuit board 1 so as to connect between the image sensing chip 2 and the circuit board 1.

[0027] More specifically, as shown in Figures 9 and 10, both the bottom-edge insulating layer 31 and the top-edge insulating layer 32 can be connected to each other, and the bottom-edge insulating layer 31 and the top-edge insulating layer 32 can be housed within the through-hole 1003 of the circuit board 1, and can be tightly connected between the image sensing chip 2 and the circuit board 1. It is noteworthy that the bottom-edge insulating layer 31 of the insulating connection structure 3 is exposed and has an uncovered bottom enclosure 3000. Furthermore, the bottom enclosure 3000 of the bottom-edge insulating layer 31 of the insulating connection structure 3, the bottom surface 1002 of the circuit board 1, and the bottom surface 2002 of the image sensing chip 2 can be aligned to the same height completely or almost (substantially). However, the above example is merely one embodiment and does not limit the present invention.

[0028] For example, as shown in Figures 9 and 10, in one embodiment, the thickness of the bottom-edge insulating layer 31 can be made thinner than the thickness of the top-edge insulating layer 32. Alternatively, the viscosity of the bottom-edge insulating layer 31 can be made lower than that of the top-edge insulating layer 32. Alternatively, the melting point of the bottom-edge insulating layer 31 can be made lower than that of the top-edge insulating layer 32. As a result, the adhesive force between the bottom-edge insulating layer 31 and the image sensing chip 2 becomes weaker than the adhesive force between the top-edge insulating layer 32 and the image sensing chip 2. Also, the adhesive force between the bottom-edge insulating layer 31 and the circuit board 1 becomes weaker than the adhesive force between the top-edge insulating layer 32 and the circuit board 1. In this way, the temporary carrier substrate C can be detached from the circuit board 1 more easily. However, the above examples are merely one embodiment and do not limit the present invention.

[0029] For example, as shown in Figures 9 and 10, in one embodiment, the inner surrounding surface 1004 of the through-hole 1003 of the circuit board 1 teeth Top edge surrounding insulating layer 3 2 To make contact As a roughened enclosure When positioned, the roughened surrounding surface can be used to increase the adhesive strength or contact area between the top-edge surrounding insulating layer 32 and the circuit board 1. However, the above example is merely one embodiment and does not limit the present invention.

[0030] For example, as shown in Figures 9 and 10, when the temporary carrier substrate C detaches from the circuit board 1 by "direct irradiation of laser light generated by a laser generator (or the bottom edge surrounding insulating layer 31 by direct irradiation of laser light generated by a laser generator)" or "indirect heating of a heat source generated by a heater (or the bottom edge surrounding insulating layer 31 by indirect heating of a heat source generated by a heater)", the lower surface 3000 of the bottom edge surrounding insulating layer 31 of the insulating connection structure 3 generates a gel deformation trace T2 that is formed "after being heated by a heat source generated by a heating module L (e.g., a laser generator or heater)". In one embodiment, when the temporary carrier substrate C moves directly downward and detaches from the circuit board 1, the lower surface 3000 of the bottom edge surrounding insulating layer 31 of the insulating connection structure 3 generates a gel separation trace (not shown in the figure) that is formed "after being separated from the temporary carrier substrate C". However, the above examples are merely one embodiment and do not limit the present invention.

[0031] For example, in one embodiment, the top-surrounding insulating layer 32 of the insulating connection structure 3 has an extended connecting portion (not shown in the figures) that extends to the upper surface 1001 of the circuit board 1, thereby increasing the adhesive force or contact area between the top-surrounding insulating layer 32 of the insulating connection structure 3 and the circuit board 1. That is, because the top-surrounding insulating layer 32 of the insulating connection structure 3 overlaps with the upper surface 1001 of the circuit board 1 due to the extension of the extended connecting portion, a larger contact area is created between the top-surrounding insulating layer 32 of the insulating connection structure 3 and the circuit board 1 (or the top-surrounding insulating layer 32 of the insulating connection structure 3 can receive more support from the circuit board 1). As a result, the insulating connection structure 3 becomes less likely to detach from the through-hole 1003 of the circuit board 1 due to external forces (for example, the external force generated when removing the temporary carrier substrate C from the circuit board 1, as shown in Figure 4). However, the above example is merely one embodiment and does not limit the present invention.

[0032] [Third Embodiment] As shown in Figure 11, a third embodiment of the present invention provides an image acquisition module M for reducing the overall thickness. As is clear from a comparison of Figure 11 and Figure 10, the main differences between the third embodiment and the second embodiment of the present invention are as follows: The top-surrounding insulating layer 32 of the insulating connection structure 3 is exposed to the outside and has an uncovered lower enclosure surface 3000, and a predetermined vertical height is provided between the lower enclosure surface 3000 of the top-surrounding insulating layer 32 of the insulating connection structure 3 and the lower surface 1002 of the circuit board 1. This allows a surrounding empty space S to be formed between the circuit board 1, the image sensing chip 2 and the insulating connection structure 3.

[0033] For example, the surrounding empty space S is formed by removing a portion of the bottom-end material of the insulating connection structure 3 (for example, this can be done using a laser generator or heater). As a result, the lower surrounding surface 3000 of the top-end surrounding insulating layer 32 of the insulating connection structure 3, a portion of the inner surrounding surface 1004 of the through-hole 1003 of the circuit board 1, and a portion of the outer surrounding surface 2000 of the image sensing chip 2 can be exposed from the bottom end of the through-hole 1003 of the circuit board 1. However, the above example is merely one embodiment and does not limit the present invention.

[0034] [Fourth Embodiment] As shown in Figures 1 and 12 to 14, a fourth embodiment of the present invention provides a method for manufacturing an image acquisition module to reduce the overall thickness. The method includes the following steps. First, as shown in Figures 1 and 12, a circuit board 1 and a temporary carrier board C (or a movable board, separable board, or removable board) are brought close to each other so that the circuit board 1 is placed on the temporary carrier board C (or until the circuit board 1 and the temporary carrier board C are in complete contact). The circuit board 1 has an upper surface 1001, a lower surface 1002, and a through-hole 1003 (or a through-hole 1003 penetrating the circuit board 1) connecting the upper surface 1001 and the lower surface 1002, and the bottom end of the through-hole 1003 of the circuit board 1 is closed by the temporary carrier board C (step S200). Next, as shown in Figures 1 and 12, the image sensing chip 2 is housed in the through-hole 1003 of the circuit board 1 via an adhesive gel layer C100 (e.g., double-sided tape or any type of adhesive layer) and placed on the temporary carrier substrate C (step S202). Then, as shown in Figures 1 and 13, the image sensing chip 2 is electrically connected to the circuit board 1 via a plurality of metal wires W (composed of any conductive metal material, e.g., gold, silver, or copper) (or, the filter element 5 may be placed above the image sensing chip 2 via a plurality of supports or surrounding supports) (step S204). Next, as shown in Figures 1 and 14, an insulating connection structure 3 is formed in the through-hole 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1 (step S206). Then, as shown in Figure 1, the temporary carrier substrate C is removed from the circuit board 1 (step S208). Next, as shown in Figure 1, the lens assembly 4 is placed on the circuit board 1. The lens assembly 4 includes a lens carrier 41 mounted on the circuit board 1, and a lens module 42 supported by the lens carrier 41 (step S210). Note that, depending on different requirements, steps S208 and S210 can also be performed in reverse order. For example, in one embodiment, the adhesive gel layer C100 may be placed only between the image sensing chip 2 and the temporary carrier substrate C.In another embodiment, the adhesive gel layer C100 may be distributed across the entire temporary carrier substrate C, so that the adhesive gel layer C100 is also installed between the circuit board 1 and the temporary carrier substrate C, and also between the insulating connection structure 3 and the temporary carrier substrate C. However, the above examples are merely one embodiment and do not limit the present invention.

[0035] In other words, as shown in Figures 3, 5, 12, 13, and 14, the "wire-drilling step (or chip electrical connection step)" in which the image sensing chip 2 is electrically connected to the circuit board 1 via multiple metal wires W, and the "filling step (chip limiting step)" in which an insulating connection structure 3 is formed inside the through-hole 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1, can be two steps executed in sequence (as shown in Figures 3 and 5, the filling step is executed first, followed by the wire-drilling step) or two steps executed in reverse order (as shown in Figures 12, 13, and 14, the wire-drilling step is executed first, followed by the filling step).

[0036] [Fifth Embodiment] As shown in Figure 15, a fifth embodiment of the present invention provides a portable electronic device P. The portable electronic device P can be configured to use an image acquisition module M provided in any of the first to third embodiments. For example, the portable electronic device P can be a smartphone, a desktop computer, a laptop computer, a tablet computer, or any type of electronic device. However, the above examples are merely embodiments and do not limit the present invention.

[0037] One beneficial effect of the present invention lies in the image acquisition module M provided by the present invention for reducing the overall thickness. This module is provided through a technical solution in which "the circuit board 1 has an upper surface 1001, a lower surface 1002, and a through-hole 1003 connecting the upper surface 1001 and the lower surface 1002", "the image sensing chip 2 is placed inside the through-hole 1003 of the circuit board 1 and electrically connected to the circuit board 1 via a plurality of metal wires W", and "an insulating connection structure 3 is placed inside the through-hole 1003 of the circuit board 1 and connected between the image sensing chip 2 and the circuit board 1", so that the image sensing chip 2 does not come into contact with the circuit board 1 and the image sensing chip 2 is securely fixed inside the through-hole 1003 of the circuit board 1 via the connection of the insulating connection structure 3. This makes it possible to reduce the overall thickness of the image acquisition module M.

[0038] Another beneficial effect of the present invention lies in the method for manufacturing an image acquisition module to reduce the overall thickness provided by the present invention. This method, through a technical solution that "places a circuit board 1 and a temporary carrier board C in close proximity to each other, with the circuit board 1 being placed on the temporary carrier board C, the circuit board 1 having an upper surface 1001, a lower surface 1002, and a through-hole 1003 connecting the upper surface 1001 and the lower surface 1002," and "performs (1) and (2) in order or in reverse. Step (1) is to place the image sensing chip 2 in the through-hole 1003 of the circuit board 1 and install it on the temporary carrier board C, and step (2) is to form an insulating connection structure 3 in the through-hole 1003 of the circuit board 1 and connect it between the image sensing chip 2 and the circuit board 1," allows the image sensing chip 2 to be securely fixed in the through-hole 1003 of the circuit board 1 via the connection of the insulating connection structure 3 without the image sensing chip 2 coming into contact with the circuit board 1. This makes it possible to reduce the overall thickness of the image acquisition module M.

[0039] The information disclosed herein is merely a preferred and implementable embodiment of the present invention and does not thereby limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made based on the description and accompanying drawings of the present invention shall be included within the scope of the claims of the present invention. [Explanation of Symbols]

[0040] P Portable Electronic Devices M Image Acquisition Module 1 Circuit board 1001 Top surface 1002 Bottom surface 1003 Through-hole 1004 Inner surface 10P Conductive Pads for Circuit Boards 2 Image sensing chip 2000 Outer surface 2001 Top 2002 Bottom 20P Tip Conductive Pad 20S Image detection area 3. Insulating connection structure 31. Bottom edge surrounding insulating layer 32. Top edge surrounding insulating layer 3000 Lower enclosure 4 Lens Assembly 41 Lens Carrier 42 Lens Modules 5 filter elements T1 Gel detachment trace T2 Gel deformation traces S Surrounding empty space W Metal wire C Temporary carrier substrate C100 Adhesive Gel Layer L Heating Module

Claims

1. A step of bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board, wherein the circuit board has an upper surface, a lower surface and a through-hole connecting the upper surface and the lower surface, and the bottom end of the through-hole of the circuit board is sealed by the temporary carrier board, The steps include: installing the image sensing chip on the temporary carrier board so as to house it within the through-hole of the circuit board; A step of performing steps (1) and (2) in order or in reverse, wherein step (1) is to form an insulating connection structure within the through-hole of the circuit board to connect the image sensing chip and the circuit board, and step (2) is to electrically connect the image sensing chip to the circuit board through a plurality of metal wires. A method for manufacturing an image imaging module to reduce the overall thickness, comprising the step of installing a lens assembly on the circuit board, The lens assembly includes a lens carrier installed on the circuit board and a lens module supported by the lens carrier. The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connection structure. The method for manufacturing the image acquisition module further includes mounting a filter element above the image sensing chip with the support of a plurality of supports or surrounding supports. A method for manufacturing an image acquisition module, characterized by the above.

2. The upper surface of the circuit board has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and each of the plurality of chip conductive pads of the image sensing chip is electrically connected to each of the plurality of substrate conductive pads of the circuit board via a plurality of metal wires. The insulating connection structure is tightly connected to the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board. The inner surface of the through-hole in the circuit board is arranged as a roughened surface, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. The entire or a portion of the outer surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesive force or contact area between the insulating connection structure and the image sensing chip. The thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other. The lower enclosure surface of the insulating connection structure has gel detachment traces generated after separation from the temporary carrier substrate. The lower enclosure surface of the insulating connection structure has gel deformation traces generated after heating by the heat source generated by the heating module. The insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image acquisition module according to claim 1, further comprising the steps of: forming the insulating connection structure within the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board through a plurality of metal wires; or installing the lens assembly on the circuit board; heating the insulating connection structure using a heat source generated by the heating module, thereby removing the temporary carrier board from the circuit board.

3. The step of forming the insulating connection structure within the through-hole of the circuit board further includes: The steps include forming a bottom-edge surrounding insulating layer within the through-hole of the circuit board so as to connect the image sensing chip and the circuit board, The steps include forming a top-edge surrounding insulating layer within the through-hole of the circuit board so as to connect the image sensing chip and the circuit board, Includes, The bottom-edge insulating layer and the top-edge insulating layer are connected to each other, and both the bottom-edge insulating layer and the top-edge insulating layer are positioned within the through-hole of the circuit board and connected between the image sensing chip and the circuit board. The thickness of the bottom-surrounding insulating layer is thinner than the thickness of the top-surrounding insulating layer, the viscosity of the bottom-surrounding insulating layer is lower than the viscosity of the top-surrounding insulating layer, and the melting point of the bottom-surrounding insulating layer is lower than the melting point of the top-surrounding insulating layer. The adhesive force between the bottom edge insulating layer and the image sensing chip is weaker than the adhesive force between the top edge insulating layer and the image sensing chip, and the adhesive force between the bottom edge insulating layer and the circuit board is weaker than the adhesive force between the top edge insulating layer and the circuit board. The inner surface of the through-hole of the circuit board is arranged as a roughened surface so as to contact the top-edge surrounding insulating layer, thereby increasing the adhesive force or contact area between the top-edge surrounding insulating layer and the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other. The lower surface of the bottom-edge insulating layer has traces of gel separation generated after separation from the temporary carrier substrate. The lower surface of the bottom-edge insulating layer has gel deformation traces that were formed after heating with a heat source generated by the heating module. The top-surrounding insulating layer of the insulating connection structure has an extended connecting portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image imaging module according to claim 1, further comprising the steps of: forming the insulating connection structure in the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; or arranging the lens assembly on the circuit board; heating the bottom edge surrounding insulating layer using a heat source generated by the heating module, thereby removing the temporary carrier substrate from the circuit board.

4. The insulating connection structure has an exposed and unshielded lower enclosure, and there is a predetermined vertical height between the lower enclosure of the insulating connection structure and the lower surface of the circuit board, thereby forming an enclosed space between the circuit board, the image sensing chip and the insulating connection structure. The insulating connection structure is tightly connected between the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board, and the lower surface of the insulating connection structure, a portion of the inner surface of the through-hole of the circuit board, and a portion of the outer surface of the image sensing chip are exposed from the bottom edge of the through-hole of the circuit board. The method for manufacturing an image acquisition module according to claim 1, wherein the insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board.

5. A method for manufacturing an image acquisition module according to claim 1, further comprising the steps of: forming the insulating connection structure in the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; arranging the lens assembly on the circuit board; and removing the temporary carrier board from the circuit board.

6. A step of bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board, wherein the circuit board has an upper surface, a lower surface, and a through-hole connecting the upper surface and the lower surface, and the bottom end of the through-hole of the circuit board is sealed by the temporary carrier board. The steps include: placing the image sensing chip in the through-hole of the circuit board and installing it on the temporary carrier board; A step of performing steps (1) and (2) in order or in reverse order, wherein step (1) is to form an insulating connection structure within the through-hole of the circuit board and connect it between the image sensing chip and the circuit board, and step (2) is to electrically connect the image sensing chip to the circuit board through a plurality of metal wires, A method for manufacturing an image imaging module to reduce the overall thickness, comprising the steps of: installing a lens assembly on a circuit board, wherein the lens assembly includes a lens carrier on which the lens assembly is installed on the circuit board, and a lens module mounted on the lens carrier, The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. A method for manufacturing an image acquisition module, characterized in that the lower surface of the image sensing chip is exposed and not covered by the insulating connection structure.

7. The upper surface of the circuit board has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and each of the plurality of chip conductive pads of the image sensing chip is electrically connected to each of the plurality of substrate conductive pads of the circuit board via a plurality of metal wires. The insulating connection structure is tightly connected between the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board. The inner surface of the through-hole of the circuit board is configured as a roughened surface, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. The entire or a portion of the outer surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesive force or contact area between the insulating connection structure and the image sensing chip. The thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip coincide with each other. The lower enclosure surface of the insulating connection structure has traces of gel detachment that occurred after separation from the temporary carrier substrate. The lower enclosure of the insulating connection structure has gel deformation traces that occur after being heated by a heat source generated by the heating module. The insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image acquisition module according to claim 6, further comprising the steps of: forming the insulating connection structure within the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board through a plurality of metal wires; or installing the lens assembly on the circuit board; and then heating the insulating connection structure using a heat source generated by the heating module, thereby removing the temporary carrier board from the circuit board.

8. The step of forming the insulating connection structure within the through-hole of the circuit board further includes the step of forming a bottom-edge surrounding insulating layer within the through-hole of the circuit board to connect between the image sensing chip and the circuit board, The steps include forming a top-edge surrounding insulating layer within the through-hole of the circuit board so as to connect the image sensing chip and the circuit board, Includes, The bottom edge insulating layer and the top edge insulating layer are connected to each other, and the bottom edge insulating layer and the top edge insulating layer are installed within the through-hole of the circuit board and connected between the image sensing chip and the circuit board. The thickness of the bottom-surrounding insulating layer is smaller than the thickness of the top-surrounding insulating layer, the viscosity of the bottom-surrounding insulating layer is smaller than the viscosity of the top-surrounding insulating layer, and the melting point of the bottom-surrounding insulating layer is lower than the melting point of the top-surrounding insulating layer. The adhesive force between the bottom edge surrounding insulating layer and the image sensing chip is smaller than the adhesive force between the top edge surrounding insulating layer and the image sensing chip, and the adhesive force between the bottom edge surrounding insulating layer and the circuit board is smaller than the adhesive force between the top edge surrounding insulating layer and the circuit board. The inner surface of the through-hole of the circuit board is configured as a roughened surface so as to contact the top-edge surrounding insulating layer, thereby increasing the adhesive force or contact area between the top-edge surrounding insulating layer and the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other. The lower surface of the bottom-edge insulating layer has traces of gel separation that occurred after separation from the temporary carrier substrate. The lower surface of the bottom-edge insulating layer has gel deformation traces caused by heating by the heat source generated by the heating module. The top-surrounding insulating layer of the insulating connection structure has an extended connecting portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image imaging module according to claim 6, further comprising the steps of: forming the insulating connection structure in the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; or arranging the lens assembly on the circuit board; heating the bottom edge surrounding insulating layer using a heat source generated by the heating module, thereby removing the temporary carrier substrate from the circuit board.

9. The insulating connection structure has an exposed and unshielded lower enclosure, and there is a predetermined vertical height between the lower enclosure of the insulating connection structure and the lower surface of the circuit board, thereby forming a surrounding empty space between the circuit board, the image sensing chip, and the insulating connection structure. The insulating connection structure is tightly connected between the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board, and the lower surface of the insulating connection structure, a portion of the inner surface of the through-hole of the circuit board, and a portion of the outer surface of the image sensing chip are exposed from the bottom edge of the through-hole of the circuit board. The method for manufacturing an image acquisition module according to claim 6, wherein the insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board.

10. A method for manufacturing an image acquisition module according to claim 6, further comprising the steps of: forming the insulating connection structure in the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; arranging the lens assembly on the circuit board; and removing the temporary carrier board from the circuit board.

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