Plating jig

Abstract

This invention provides a plating jig that enables plating of brittle thin substrates, such as thin glass substrates and ceramic substrates, while preventing damage. [Solution] The plating jig according to this disclosure comprises a clamping body, a seal, an electrode, and a power supply lead. The clamping body has an opening facing at least one main surface of the substrate and clamps both main surfaces of the substrate. The seal is arranged annularly on the clamping body so as to double-enclose the opening and shields the peripheral region of the substrate from the plating solution around its entire circumference. The electrode is disposed in the region of the clamping body shielded from the plating solution by the seal and contacts at least one main surface of the substrate. The power supply lead supplies power to the electrode. Furthermore, the seal includes a substrate contact seal that abuts the main surface of the substrate, and the substrate contact seal is a hollow elastic seal having a cavity around its entire circumference and further having a connecting portion that connects the radially inner wall and the radially outer wall that sandwich the cavity.

Description

Technical Field

[0001] The present invention relates to a plating jig for plating a substrate while holding the substrate.

Background Art

[0002] Conventionally, resins have been used for printed boards on which electronic circuits are disposed. To plate a conductive metal, such as copper, on an insulating substrate, the main surface is thinly covered with copper by electroless plating to make it conductive, and then a copper layer for printed wiring is formed by electrolytic plating. For this reason, in a plating jig for holding a substrate in a plating solution, an opening is provided in the central portion of one or both of a pair of clamping bodies that clamp and hold the substrate, and a double annular seal is disposed around the opening (for example, Patent Documents 1 to 5).

[0003] The clamping body that clamps the substrate is immersed in the plating solution. At this time, the central portion of one or both main surfaces of the substrate touches the plating solution through the opening of the clamping body, so electrolytic plating proceeds. The negative electrode electrically connected to the substrate is protected from the intrusion of the plating solution by being disposed between the double annular seals. A negative potential is supplied to the negative electrode through a power supply lead.

[0004] However, printed boards made of resin have a drawback that they are greatly deformed by heat and are not suitable for use at high temperatures. In order to meet the need for use at such high temperatures, materials having high heat resistance such as glass and ceramic have been attracting attention as alternatives. However, the seal that abuts on the substrate to block the plating solution and the electrode that contacts the substrate to supply power apply uneven pressure to the substrate. Typically, glass substrates and ceramic substrates, which are only about 0.1 mm to 2 mm thick and are brittle, have a problem that they are easily damaged by such uneven pressure.

[0005] The use of simple hollow seals is disclosed in Patent Documents 6 to 9. The hollow tube (10) disclosed in Patent Document 10 is used as an elevator to raise and lower a wafer (Ws) placed on it by pressurizing or depressurizing air, and is different from a seal that shields the plating solution. Furthermore, the use of leaf springs arranged in the circumferential direction of the substrate as electrodes that contact the substrate is disclosed in Patent Documents 11 to 13. However, Patent Document 11 states that the electrode 5102 may have a leaf spring assembly, a coil spring assembly, etc., regarding the wafer plating jig, but does not specify what kind of leaf spring it is. The leaf springs disclosed in Patent Documents 12 and 13 differ in structure from the leaf springs of the means for solving the problem of this application in the direction in which they extend from the base end to the tip, and in the presence or absence of a folded portion in the middle. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Patent No. 5847832 [Patent Document 2] Patent No. 2704796 [Patent Document 3] Japanese Patent Application Publication No. 11-200096 [Patent Document 4] Patent No. 4037504 [Patent Document 5] Patent No. 3847434 [Patent Document 6] Japanese Patent Publication No. 2022-019235 [Patent Document 7] Re-tabled publication No. 2015 / 145688 [Patent Document 8] Patent No. 4445859 [Patent Document 9] Japanese Patent Publication No. 2002-317300 [Patent Document 10] Japanese Patent Publication No. 2000-073197 [Patent Document 11] Japanese Patent Publication No. 2007-119923 [Patent Document 12] Japanese Patent Publication No. 2002-294495 [Patent Document 13] Patent No. 3543737 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] This invention has been made in view of the above-mentioned problems, and aims to provide a plating jig that enables plating treatment of brittle thin substrates such as thin glass substrates and ceramic substrates while preventing damage. [Means for solving the problem]

[0008] To achieve the above objective, a first aspect of the present invention provides a plating jig for holding a substrate to be plated in a plating solution for electroplating, comprising a clamping body, a seal, an electrode, and a power supply lead. The clamping body has an opening facing at least one main surface of the substrate and clamps both main surfaces of the substrate. The seal is disposed annularly on the clamping body so as to double-enclose the opening and shields the peripheral region of the substrate from the plating solution around its entire circumference. The electrode is disposed in the region of the clamping body shielded from the plating solution by the seal and contacts at least one main surface of the substrate. The power supply lead supplies power to the electrode. Furthermore, the seal includes a substrate contact seal that abuts the main surface of the substrate, and the substrate contact seal is a hollow elastic seal having a cavity around its entire circumference and further having a connecting portion that connects the radially inner wall and the radially outer wall that sandwich the cavity.

[0009] In this configuration, the plating jig is subjected to electroplating by immersing the substrate to be plated in a plating solution while it is held between the clamping bodies. At this time, the portion of the main surface of the substrate exposed to the opening of the clamping bodies comes into contact with the plating solution, and electroplating proceeds in this portion. A predetermined potential is supplied to the electrodes that are electrically connected to the substrate by contact, via power supply leads. The electrodes are protected from the ingress of the plating solution by being positioned between a double annular seal. Of the double annular seals, at least the substrate contact seal that abuts the substrate is a hollow elastic seal with a cavity extending around its entire circumference. Therefore, the substrate contact seal has high flexibility, i.e., high elastic stretchability, and the pressure applied to the substrate is kept low. Furthermore, since a radial connecting portion is formed within the cavity, the shape retention of the substrate contact seal is improved, as it attempts to maintain a certain shape. As a result, when the substrate contact seal abuts the substrate, it is suppressed from moving away from the predetermined contact surface and hindering the shielding effect of the plating solution. In other words, it becomes possible to perform plating on brittle thin substrates while preventing damage due to uneven and excessive pressure and ensuring the shielding effect of the plating solution.

[0010] A second aspect of the present invention is a plating jig according to the first aspect, wherein the substrate contact seal has a greater axial thickness than its radial thickness.

[0011] This configuration allows the pressure applied by the substrate contact seal to the substrate to be kept low, while also minimizing the contact area of ​​the seal with the substrate. In other words, it becomes possible to apply the plating treatment to a wider area of ​​the substrate.

[0012] A third aspect of the present invention is a plating jig according to the first or second aspect, wherein the substrate contact seal has a cross-sectional shape in which at least the end face that contacts the substrate has a convex, rounded shape.

[0013] According to this configuration, when the substrate contact seal contacts the substrate, it is more effectively avoided that the substrate contact seal escapes from a predetermined contact surface and hinders the shielding effect of the plating solution. That is, the shielding effect of the plating solution by the seal is further enhanced.

[0014] According to a fourth aspect of the present invention, there is provided a plating jig according to any one of the first to third aspects, wherein the substrate contact seal is disposed in a groove formed annularly in the sandwiching body. According to this configuration, the position of the substrate contact seal to be disposed is easily and stably determined at a predetermined position. In addition, since the shape retention of the substrate contact seal is improved, the shielding effect of the plating solution by the substrate contact seal is further improved.

[0015] According to a fifth aspect of the present invention, there is provided a plating jig according to any one of the first to fourth aspects, wherein the opening faces both main surfaces of the substrate, the electrodes are disposed in the region of the sandwiching body shielded from the plating solution by the seal, and contact both main surfaces of the substrate. According to this configuration, plating treatment can be performed on both main surfaces of the substrate.

[0016] According to a sixth aspect of the present invention, there is provided a plating jig according to any one of the first to fifth aspects, wherein the electrode has a strip-shaped electrode extending along at least two opposing side edges of the substrate, and a plurality of plate spring-shaped electrodes disposed along the strip-shaped electrode. Further, the power supply lead is connected to the strip-shaped electrode. Furthermore, the plate spring-shaped electrode has a base end connected to the strip-shaped electrode, extends from the base end along the strip-shaped electrode, is folded back in the reverse direction midway, and extends to the tip, and any part from the folded-back part to the tip is in electrical contact with the substrate by pressing the substrate with an elastic restoring force.

[0017] According to this configuration, strip electrodes extend along at least two opposing edges of the substrate, and power is supplied to the substrate by a plurality of leaf spring-shaped electrodes disposed along the strip electrodes, so that the uniformity of the plating process on the main surface of the substrate is enhanced. Further, since the leaf spring-shaped electrodes extend along the strip electrodes and are folded back in the reverse direction midway, the elastic bending deformability of the leaf spring-shaped electrodes is high, and the pressure applied to the substrate is kept low. That is, it becomes possible to perform the plating process while preventing breakage due to the application of uneven and excessive pressure by the electrodes to the brittle thin substrate.

Advantages of the Invention

[0018] As described above, according to the present invention, a plating jig is realized that enables plating treatment on a brittle thin substrate such as a thin glass substrate or a ceramic substrate while preventing breakage.

Brief Description of the Drawings

[0019] [Figure 1] It is a perspective view illustrating the configuration of a plating jig according to an embodiment of the present invention. [Figure 2] It is a perspective view illustrating the configuration of the receiving-side clamping body of the plating jig of FIG. 1. [Figure 3] It is a perspective view seen from below, illustrating the configuration of the pressing-side clamping body of the plating jig of FIG. 1. [Figure 4] It is a perspective view illustrating the configuration of a power supply lead connected to the receiving-side clamping body of the plating jig of FIG. 1. [Figure 5] It is a perspective view illustrating the configuration of an electrode connected to the power supply lead of FIG. 4. [Figure 6] It is an enlarged cross-sectional perspective view illustrating the configuration of the receiving-side clamping body of FIG. 2. [Figure 7] It is an enlarged cross-sectional perspective view seen from below, illustrating the configuration of the pressing-side clamping body of FIG. 3. [Figure 8] It is an enlarged cross-sectional perspective view illustrating the configuration of the plating jig of FIG. 1. [Figure 9] It is a partial enlarged cross-sectional view illustrating an enlarged cross-sectional structure of the plating jig of FIG. 8. [Figure 10] Figure 9 is an explanatory diagram illustrating the function of the seal structure shown as an example. [Figure 11] This is a partially enlarged cross-sectional view illustrating an enlarged cross-sectional structure of a plating jig according to another embodiment of the present invention. [Figure 12] This is a schematic diagram illustrating the arrangement of electrodes in a plating jig according to yet another embodiment of the present invention. [Modes for carrying out the invention]

[0020] Figure 1 is a perspective view illustrating the configuration of a plating jig according to one embodiment of the present invention. This plating jig 101 has a pair of clamping bodies 1 and 3 (receiving clamping body 1, pressing clamping body 3) and a pair of power supply leads 5 and 7. The clamping bodies 1 and 3 clamp both main surfaces of the substrate 10 to be plated. To clearly show the configuration of the plating jig 101, the substrate 10 is represented as a transparent plate in the figure for convenience. In the illustrated example, openings 11 and 13 are provided in both the clamping bodies 1 and 3. These openings 11 and 13 face one main surface and the other main surface of the substrate 10. The clamping bodies 1 and 3 are made of, for example, an insulating resin.

[0021] The power supply leads 5 and 7 are connected to the clamping bodies 1 and 3, respectively, and supply power to electrodes (hidden in the figure) that contact the main surface of the substrate 10 clamped by the clamping bodies 1 and 3. The power supply leads 5 and 7 include a conductor such as copper or stainless steel, and an insulating coating material covering the conductor. However, the coating material is not shown in the figure.

[0022] The clamping bodies 1 and 3 are detachably fastened to each other by fastening members 15 positioned along their peripheries. In the illustrated example, the fastening member 15 is a combination of a bolt and a nut. The figure shows a wing nut, and the bolt is hidden.

[0023] Figure 2 is a perspective view illustrating the configuration of the receiving clamping body 1 of the plating jig 101. The clamping body 1 has seals 17 and 19 arranged in an annular shape so as to completely surround the opening 11. The inner seal 17 abuts against the main surface of the substrate 10, and the outer seal 19 abuts against the lower surface of the pressing clamping body 3 (Figure 1).

[0024] The clamping body 1 is further equipped with an electrode 21 that contacts the main surface of the substrate 10 to supply power. The electrode 21 is positioned in the region sandwiched between the double seals 17 and 19. The electrode 21 is electrically connected to the power supply lead 5, thereby receiving a negative potential current through the power supply lead 5. Figure 2 shows a bolt among the fastening members 15.

[0025] Figure 3 is a perspective view of the pressing clamping body 3 of the plating jig 101, viewed from below, to illustrate its configuration. The pressing clamping body 3 has a symmetrical structure to its counterpart, the receiving clamping body 1. A seal 23 is arranged in an annular shape on the clamping body 3 so as to surround the opening 13. When the clamping bodies 1 and 3 are fastened together, the seal 23 is positioned opposite the inner seal 17 (Figure 2) and contacts the main surface of the substrate 10. The outer seal 19 (Figure 2) contacts the lower surface of the clamping body 3. In this way, the seals 17, 19, and 23 function to shield the entire peripheral region of the substrate 10 from the plating solution.

[0026] The clamping body 3 is further equipped with an electrode 25 that contacts the main surface of the substrate 10 to supply power. The electrode 25 is located opposite the electrode 21 (Figure 2) and is positioned in the region sandwiched between the seal 23 and the seal 19. The electrode 25 is electrically connected to the power supply lead 7, thereby receiving negative potential power through the power supply lead 7. Holes 27 for inserting bolts that constitute the fastening member 15 are arranged in the region along the periphery of the clamping body 3.

[0027] As described above, electrodes 21 and 25 are both positioned in the region sandwiched between the inner seals 17 and 23 and the outer seal 19, that is, in a region shielded from the plating solution. Therefore, it is prevented that the electrodes 21 and 25 themselves, and the portion of the substrate 10 that touches electrodes 21 and 25, come into contact with the plating solution, thereby preventing the plating from progressing.

[0028] Figure 4 is a perspective view illustrating the configuration of a power supply lead 5 connected to the receiving clamping body 1 of the plating jig 101. In the illustrated example, the power supply lead 5 is strip-shaped. The power supply lead 5 has a portion 29 that extends along the edge of the clamping body 1, and in the illustrated example, this portion 29 is annular. Protruding pins 31 are arranged on the main surface of the portion 29. These pins 31 are inserted into pin through holes (not shown) provided in the clamping body 1 and connected to electrodes 21 (Figure 2). The power supply lead 5 has extended legs 33 to hold the plating jig 101 in a predetermined position in the plating solution tank. The power supply lead 7 connected to the pressing clamping body 3 of the plating jig 101 is configured similarly to the power supply lead 5, except that it does not have legs 33 (see Figure 3).

[0029] Figure 5 is a perspective view illustrating the configuration of the electrode 21 connected to the power supply lead 5. The electrode 25 connected to the power supply lead 7 (see Figure 3) is configured similarly. The electrode 21 has a strip-shaped electrode 35 and a leaf-spring-shaped electrode 37. The strip-shaped electrode 35 is arranged on the clamping body 1 so as to extend along the edge of the substrate 10. In the illustrated example, four strip-shaped electrodes 35 are arranged along the four sides of the substrate 10 so as to surround the opening 11 (Figure 2) of the clamping body 1. The strip-shaped electrode 35 is positioned opposite the annular portion 29 of the power supply lead 5 and is fastened to the pin 31 of the power supply lead 5 by a screw 39, thereby electrically connecting them. An O-ring (not shown) is inserted between the pin through-hole (not shown) of the clamping body 1 into which the pin 31 is inserted and the pin 31, thereby preventing the plating solution from entering through the pin through-hole (this will be explained again later with reference to Figure 9).

[0030] The leaf spring-shaped electrodes 37 are arranged so as to be aligned along the strip-shaped electrodes 35. In the illustrated example, the leaf spring-shaped electrodes 37 are arranged at multiple locations on each side of the substrate 10. The base end of the leaf spring-shaped electrode 37 is connected to the strip-shaped electrode 35, and it extends from the base end along the strip-shaped electrode 35, then folds back in the opposite direction and extends to the tip. The leaf spring-shaped electrode 37 makes electrical contact with the substrate 10 by pressing the edge portion of the main surface of the substrate 10 with an elastic restoring force at one of the portions from the folded portion to the tip. Because the leaf spring-shaped electrode 37 extends along the strip-shaped electrode 35 and folds back in the opposite direction in the middle, the elastic bending deformability of the leaf spring-shaped electrode 37 is high, and the pressure applied to the substrate 10 is kept low.

[0031] Figures 6 to 9 illustrate the cross-sectional structures of the clamping bodies 1 and 3 more clearly. Specifically, Figure 6 is an enlarged cross-sectional perspective view illustrating the configuration of the receiving clamping body 1. Figure 7 is an enlarged cross-sectional perspective view of the pressing clamping body 3 viewed from below to illustrate its configuration. Figure 8 is an enlarged cross-sectional perspective view illustrating the configuration of the plating jig 101. And Figure 9 is a partially enlarged cross-sectional view illustrating the cross-sectional structure of the plating jig 101 in an enlarged manner.

[0032] These figures, particularly Figure 9, clearly illustrate how the substrate 10 is held between the clamping bodies 1 and 3, with the main surface of the substrate 10 sandwiched between the inner seals 17 and 23. The outer seal 19 is sandwiched between the clamping bodies 1 and 3 without the substrate 10 being interposed. The space between these inner seals 17 and 23 and the outer seal 19 is shielded from the plating solution. Electrodes 21 and 25 are positioned within this shielded space. The leaf spring-shaped electrodes 37 of electrodes 21 and 25 contact the peripheral region of the main surface of the substrate 10. Therefore, electrodes 21 and 25 and the peripheral region of the substrate 10 facing electrodes 21 and 25 are protected from the intrusion of the plating solution.

[0033] The power supply lead 5 that supplies power to the electrode 21 has a plate-shaped conductor 51 disposed on the outside of the clamping body 1, a pin 31 fitted into a hole in the plate-shaped conductor 51, a screw 39 that electrically connects the strip electrode 35 to the plate-shaped conductor 51 through the pin 31 by screwing it onto the pin 31, and an insulating film 55 which is an insulating covering material. Both the pin 31 and the screw 39 are conductors. An O-ring 53 is disposed between the insertion hole of the clamping body 1 through which the pin 31 is inserted and the pin 31, thereby preventing the plating solution from entering the insertion hole. The plate-shaped conductor 51 and the pin 31 exposed on the outside of the clamping body 1 are covered with the applied insulating film 55, thereby protecting them from the plating solution. The power supply lead 7 that supplies power to the electrode 25 is configured in a similar manner. Note that the power supply leads 5 and 7 shown in Figures 1 to 5 illustrate the form before the insulating film 55 is applied.

[0034] Seals 17, 19, and 23 are elastic seals, and are made of resin, for example. Therefore, seals 17, 19, and 23 adhere tightly to the clamping bodies 1 and 3 and the substrate 10 with elastic restoring force, thereby preventing the intrusion of the plating solution. In particular, seals 17, 19, and 23 are hollow elastic seals with a cavity extending around their entire circumference. Therefore, seals 17, 19, and 23 have high flexibility, i.e., high elastic stretchability, and the pressure applied to the substrate 10 by the seals 17 and 23 that come into contact with the substrate 10 (substrate contact seals) is kept low. Furthermore, seals 17, 19, and 23 have radial connecting portions formed within the cavity. Therefore, the shape retention of seals 17, 19, and 23 is improved, as they attempt to maintain a certain shape. In the illustrated example, the connecting portion is formed in the axial direction (central axis direction, which is the vertical direction in Figure 9) of seals 17, 19, and 23.

[0035] Seals 17 and 19 are positioned by being inserted into annular grooves 61 and 65 formed on the seal placement surface of the clamping body 1, respectively. Similarly, seal 23 is positioned by being inserted into annular groove 63 formed on the seal placement surface of the clamping body 3. As a result, the positions of the positioned seals 17, 19, and 23 can be easily and stably determined to their predetermined positions.

[0036] Figure 10 is an explanatory diagram illustrating the functions of seals 17 and 23. For convenience, only the portion of the substrate 10 that contacts seals 17 and 23 is shown as an example. With the substrate 10 positioned in a predetermined location on the receiving clamping body 1, the fastening member 15 (see Figure 1 or Figure 8) is operated to fasten the clamping bodies 1 and 3, causing seals 17 and 23 to deform into the shapes exemplified in (1) to (4) in the figure. If there is no connecting portion within the cavity, in the completed fastening state (4), as exemplified by the dotted line, seals 17 and 23 may deform freely and may not exhibit a sufficient sealing effect. In contrast, if there is a connecting portion within the cavity, shape retention is improved and free deformation is suppressed, resulting in a sufficient sealing effect. As shown in the illustrated example, when seals 17 and 23 are positioned in annular grooves formed in the clamping bodies 1 and 3, shape retention is further improved, and a sufficient sealing effect is more reliably achieved.

[0037] Returning to Figure 9, the seals 17, 19, and 23 have a greater axial (vertical) thickness than their radial thickness. That is, their cross-sectional shape is elongated vertically in Figure 9. As a result, the seals 17, 19, and 23 can accommodate substrates 10 of a wide range of thicknesses. Furthermore, for the seals 17 and 23 that contact the substrate 10 (substrate contact seals), the contact area of ​​the seals 17 and 23 with the substrate 10 can be kept small while keeping the pressure applied to the substrate 10 low. In other words, it becomes possible to apply the plating treatment to a wider area of ​​the substrate 10.

[0038] Furthermore, the seals 17, 19, and 23 have a cross-sectional shape with a convex, rounded end face in the axial direction. Therefore, when the seals 17 and 23 come into contact with the substrate 10, it is more effectively prevented that the seals 17 and 23 will move away from the predetermined contact surface and hinder the shielding effect of the plating solution. In other words, the shielding effect of the plating solution by the seals 17 and 23 is further enhanced. This effect is similarly exhibited for seal 19, which does not come into contact with the substrate 10.

[0039] Figure 11 is a partially enlarged cross-sectional view illustrating an enlarged cross-sectional structure of a plating jig according to another embodiment of the present invention. This plating jig 102 differs from the plating jig 101 in that it uses a pair of outer seals 41 and 43 instead of the outer seal 19 (Figure 9). The seals 41 and 43 are disposed by being inserted into annular grooves 67 and 69 formed on the seal placement surfaces of the clamping bodies 1 and 3, respectively, similar to the seals 17 and 23. The seals 41 and 43, similar to the seals 17 and 23, contact the substrate 10 and, by pressing with elastic restoring force, shield the peripheral region of the substrate 10 from the plating solution. Although the plating process will proceed in a narrow area of ​​the main surface of the substrate 10 located outside the seals 41 and 43, this does not impair the practicality of the substrate 10.

[0040] Figure 12 is a schematic diagram illustrating the arrangement of electrodes in a plating jig according to yet another embodiment of the present invention. In the plating jig 101, electrodes 21 and 25 are arranged along the four perimeters of the substrate 10. This allows for a uniform supply of current to the entire main surface of the substrate 10, resulting in a uniform thickness of the formed plating layer. Alternatively, as illustrated in Figure 12(a), electrodes 21 and 25 may be arranged along only a pair of opposite sides of a rectangular substrate 10. This configuration also allows for a reasonably uniform current supply. Furthermore, as illustrated in Figure 12(b), even if the substrate 10 is not rectangular, electrodes 21 and 25 can be arranged along two opposing edges.

[0041] (Other embodiments) (1) In the plating jig 101, openings 11 and 13 are provided in the clamping bodies 1 and 3, respectively, which made it possible to apply plating to both main surfaces of the substrate 10. Alternatively, by providing an opening 11 only in one of the clamping bodies 1 and 3, for example in clamping body 1, it is also possible to apply plating to only one main surface of the substrate 10. In this case, electrodes 21 and 25 and power supply leads 5 and 7 only need to be on the side with the opening 11, for example, electrode 21 and power supply lead 5.

[0042] (2) In the plating jig 101, seals 17, 19, and 23 were all hollow seals. In contrast, in order to soften the contact with the substrate 10, only the seals that come into contact with the substrate 10 (substrate contact seals) 17 and 23 may be hollow seals.

[0043] (3) In the example shown in Figure 9, the radial connecting portion provided within the cavities of seals 17, 19, and 23 was formed in the axial (vertical in Figure 9) central part of seals 17, 19, and 23. In contrast, the connecting portion may be divided into multiple parts in the vertical direction. [Explanation of Symbols]

[0044] 1,3 Clamping body, 5,7 Power supply lead, 10 Substrate, 11,13 Opening, 15 Fastening member, 17 Seal (substrate contact seal), 19 Seal, 21 Electrode, 23 Seal (substrate contact seal), 25 Electrode, 27 Hole, 29 Part, 31 Pin, 33 Leg, 35 Strip electrode, 37 Leaf spring electrode, 39 Screw, 41,43 Seal (substrate contact seal), 51 Plate conductor, 53 O-ring, 55 Insulating film, 61,63,65,67,69 Groove, 101,102 Plating jig.

Claims

1. A plating jig for holding a substrate to be plated in a plating solution for electroplating, A clamping body having an opening facing at least one main surface of the substrate and clamping both main surfaces of the substrate, A seal is arranged in an annular manner on the clamping body so as to double-enclose the opening, and shields the entire peripheral region of the substrate from the plating solution. An electrode is disposed in the region of the clamping body that is shielded from the plating solution by the seal, and which contacts at least one main surface of the substrate, The system includes a power supply lead that supplies power to the electrode, The seal includes a substrate contact seal that contacts the main surface of the substrate, A plating jig in which the substrate contact seal is a hollow elastic seal having a cavity extending around its entire circumference and further having a connecting portion that connects the radially inner wall and the radially outer wall that sandwich the cavity.

2. The plating jig according to claim 1, wherein the substrate contact seal has a greater axial thickness than its radial thickness.

3. The plating jig according to claim 1 or 2, wherein at least the end face that contacts the substrate has a convex, rounded cross-sectional shape.

4. The plating jig according to claim 1 or 2, wherein the substrate contact seal is disposed in a groove formed in an annular shape on the clamping body.

5. The openings face both main surfaces of the substrate, The plating jig according to claim 1, wherein the electrode is disposed in the region of the clamping body shielded from the plating solution by the seal and in contact with both main surfaces of the substrate.

6. The electrode is A strip-shaped electrode extending along at least two opposing edges of the substrate, It has a plurality of plate spring-shaped electrodes arranged along the strip-shaped electrode, The power supply lead is connected to the strip electrode, The plate spring electrode is connected at its base end to the strip electrode, extends from the base end along the strip electrode, is folded back in the opposite direction midway, and extends to the tip, and any portion from the folded portion to the tip makes electrical contact with the substrate by pressing the substrate with an elastic restoring force, as described in claim 1.

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