Electronic components and their manufacturing methods

Abstract

To reduce stray capacitance between a pair of terminal electrodes in an electronic component having a structure in which a conductor pattern, such as a coil, is embedded in an element.SOLUTION: An electronic component 100 includes: an element 2; a coil C1 embedded in the element 2; terminal electrodes 11 and 12 provided to cover areas A1 and A2 of mounting face A, respectively; and an insulation resin layer 20 provided between terminal electrodes 11 and 12 and the mounting face A. In an area A3 of the mounting face A, the element 2 is exposed without being covered by the insulation resin layer 20. Since the element 2 is exposed in the area A3 without being covered by the insulation resin layer 20, stray capacitance between the terminal electrodes 11 and 12 can be reduced.SELECTED DRAWING: Figure 1

Description

Technical Field

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[0001] The present invention relates to an electronic component and a method for manufacturing the same, and more particularly to an electronic component having a structure in which a conductor pattern is embedded in a body and a method for manufacturing the same.

Background Art

[0002] Patent Document 1 discloses a coil component having a structure in which a coil is embedded in a magnetic body. In the coil component disclosed in Patent Document 1, since an insulating resin layer is interposed between the body and the terminal electrodes, even when the dielectric constant of the body is high, the stray capacitance generated in the terminal electrodes is reduced.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in Patent Document 1, since almost the entire mounting surface of the body is covered with the insulating resin layer, there is a problem that stray capacitance occurs between a pair of terminal electrodes through the insulating resin layer.

[0005] Therefore, an object of the present invention is to reduce the stray capacitance generated between a pair of terminal electrodes in an electronic component having a structure in which a conductor pattern is embedded in a body. Another object of the present invention is to provide a method for manufacturing such an electronic component.

Means for Solving the Problems

[0006] The electronic component according to the present invention comprises a base body having a mounting surface, a conductor pattern in which at least a portion is embedded in the base body, first and second terminal electrodes provided so as to cover first and second regions of the mounting surface, respectively, and connected to one end and the other end of the conductor pattern, respectively, and an insulating resin layer provided between the first and second terminal electrodes and the mounting surface, wherein the mounting surface has a third region located between the first region and the second region, and at least a portion of the third region is exposed without being covered by the insulating resin layer.

[0007] According to the present invention, in at least a portion of the third region located between the first region where the first terminal electrode is provided and the second region where the second terminal electrode is provided, the base material is exposed without being covered by an insulating resin layer, thereby making it possible to reduce the stray capacitance generated between the first and second terminal electrodes.

[0008] In the present invention, the first and second terminal electrodes are arranged in a first direction, and the width of the insulating resin layer in the first direction may be wider than the width of the first and second terminal electrodes in the first direction. This makes it possible to prevent an increase in stray capacitance due to contact between the first and second terminal electrodes and the substrate.

[0009] In the present invention, the conductor pattern may constitute the first coil. This makes it possible to provide a coil component in which the stray capacitance generated between the first and second terminal electrodes is reduced.

[0010] The electronic component according to the present invention further comprises a second coil embedded in a base body, and third and fourth terminal electrodes provided to cover fourth and fifth regions of the mounting surface, respectively, and connected to one end and the other end of the second coil, respectively. An insulating resin layer is further provided between the third and fourth terminal electrodes and the mounting surface, and the mounting surface has a sixth region located between the fourth and fifth regions, the base body of which may be exposed without being covered by the insulating resin layer in the sixth region. This makes it possible to provide an array product containing two coils.

[0011] The method for manufacturing an electronic component according to the present invention is characterized by comprising the steps of: embedding at least a portion of a conductor pattern in a base body such that one end and the other end of the conductor pattern are exposed on the mounting surface of the base body; covering the first and second regions with an insulating resin layer without covering at least a portion of the third region sandwiched between the first and second regions of the mounting surface; and forming first and second terminal electrodes on the insulating resin layer so as to be connected to one end and the other end of the conductor pattern, respectively.

[0012] According to the present invention, it is possible to manufacture electronic components with small stray capacitance between a pair of terminal electrodes. [Effects of the Invention]

[0013] Thus, according to the present invention, in an electronic component having a structure in which a conductor pattern is embedded in a base body, it is possible to reduce the stray capacitance generated between a pair of terminal electrodes. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 is a schematic perspective view showing the external appearance of an electronic component 100 according to a first embodiment of the present invention. [Figure 2] Figure 2 is a schematic cross-sectional view along line aa shown in Figure 1. [Figure 3] Figure 3 is a schematic cross-sectional view along the line bb shown in Figure 1. [Figure 4] Figure 4 is a schematic cross-sectional view along the cc line shown in Figure 1. [Figure 5] Figure 5 is a schematic cross-sectional view along the line dd shown in Figure 1. [Figure 6] Figure 6 is a graph showing the frequency characteristics of the impedance. [Figure 7] Figure 7 is a process diagram illustrating the manufacturing method of the electronic component 100. [Figure 8] Figure 8 is a process diagram illustrating the manufacturing method of the electronic component 100. [Figure 9]FIG. 9 is a schematic diagram for explaining the relationship between the connection pattern 31, the terminal electrode 11, and the insulating resin layer 20. [Figure 10] FIG. 10 is a schematic perspective view showing the appearance of the electronic component 200 according to the second embodiment of the present invention. [Figure 11] FIG. 11 is a schematic perspective view of the electronic component 200. [Figure 12] FIG. 12 is a schematic exploded perspective view for explaining the configuration of a circuit board including the electronic component 200. [Figure 13] FIG. 13 is an equivalent circuit diagram of a circuit board including the electronic component 200. MODE FOR CARRYING OUT THE INVENTION

[0015] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0016] FIG. 1 is a schematic perspective view showing the appearance of the electronic component 100 according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along the line a-a shown in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along the line b-b shown in FIG. 1, FIG. 4 is a schematic cross-sectional view taken along the line c-c shown in FIG. 1, and FIG. 5 is a schematic cross-sectional view taken along the line d-d shown in FIG. 1.

[0017] As shown in FIGS. 1 to 5, the electronic component 100 according to the first embodiment is a coil component including a magnetic element 2 and a coil C1 embedded therein. The coil C1 has a structure in which six layers of coil patterns C11 to C16 are connected in series, and its axial direction is the Y direction. The element 2 is a composite magnetic member including a metal magnetic filler made of a magnetic material such as iron (Fe) or permalloy and a resin binder, and constitutes a magnetic path of magnetic flux generated by flowing a current through the coil C1. As the resin binder, it is preferable to use a liquid or powder epoxy resin. An insulating resin layer 4 is provided between the coil C1 and the element 2, thereby preventing direct contact between the coil C1 and the element 2.

[0018] The base body 2 has a mounting surface A that constitutes the XY plane. A pair of terminal electrodes 11 and 12 are provided on the mounting surface A, arranged in the X direction and with the Y direction as the longitudinal direction. Terminal electrode 11 is connected to one end of coil C1, which is made up of coil pattern C11, via a connection pattern 31. Terminal electrode 12 is connected to the other end of coil C1, which is made up of coil pattern C16, via a connection pattern 32. Each connection pattern 31 is provided in the same layer as coil patterns C11 to C16 and is connected to each other via vias (not shown) provided in the insulating resin layer 4. Each connection pattern 32 is provided in the same layer as coil patterns C11 to C16 and is connected to each other via vias (not shown) provided in the insulating resin layer 4.

[0019] As shown in Figure 1, the mounting surface A of the base body 2 has regions A1 to A3. Region A1 is covered by terminal electrode 11, and region A2 is covered by terminal electrode 12. The terminal electrodes 11 and 12 do not directly cover the mounting surface A of the base body 2, but rather cover the mounting surface A via an insulating resin layer 20. The insulating resin layer 20 is made of a material with a dielectric constant lower than that of the base body 2, and by being interposed between the terminal electrodes 11 and 12 and the base body 2, it plays a role in reducing the stray capacitance that occurs between the terminal electrodes 11 and 12 and the base body 2. The insulating resin layer 20 may be made of the same material as the insulating resin layer 4, but it is more preferable to use a material with a lower dielectric constant than that of the insulating resin layer 4.

[0020] The insulating resin layer 20 is not provided over the entire surface of the mounting surface A, but is not provided in region A3, which is located between region A1 and region A2. In other words, region A3 is not covered by the insulating resin layer 20, and the base body 2 is exposed. In this way, because region A3, located between region A1 and region A2, is not covered by the insulating resin layer 20 and the base body 2 is exposed, the stray capacitance between the terminal electrodes 11 and 12 can be reduced. That is, if region A3 is covered with the insulating resin layer 20, stray capacitance will be generated between the terminal electrodes 11 and 12 with the insulating resin layer 20 acting as a dielectric. However, in this embodiment, since the insulating resin layer 20 is not provided in region A3, the dielectric present between the terminal electrodes 11 and 12 becomes an air layer, and as a result, the stray capacitance between the terminal electrodes 11 and 12 is reduced.

[0021] Figure 6 is a graph showing the frequency characteristics of the impedance. The solid line represents the characteristics of the electronic component 100 according to this embodiment, and the dashed line represents the characteristics when the insulating resin layer 20 is removed from the electronic component 100. As shown in Figure 6, it can be seen that the electronic component 100 according to this embodiment provides sufficient impedance in the high-frequency range. This is thought to be a result of the reduction of stray capacitance generated at the terminal electrodes 11 and 12 by providing the insulating resin layer 20.

[0022] Next, a method for manufacturing the electronic component 100 according to this embodiment will be described.

[0023] First, as shown in Figure 7, the coil C1 is embedded in the base body 2 so that connection patterns 31 and 32 are exposed on the mounting surface A of the base body 2. Connection pattern 31 constitutes one end of the coil C1, and connection pattern 32 constitutes the other end of the coil C1. Next, as shown in Figure 8, regions A1 and A2 of the mounting surface A are covered with an insulating resin layer 20. At this time, the formation position of the insulating resin layer 20 is adjusted so that connection patterns 31 and 32 and region A3 are not covered by the insulating resin layer 20. Parts of connection patterns 31 and 32 may be covered by the insulating resin layer 20. Then, terminal electrodes 11 are formed on the insulating resin layer 20 formed in region A1 so as to be in contact with connection pattern 31, and terminal electrodes 12 are formed on the insulating resin layer 20 formed in region A2 so as to be in contact with connection pattern 32, thereby completing the electronic component 100 shown in Figure 1.

[0024] Here, in order to more reliably prevent contact between the terminal electrodes 11, 12 and the base body 2, the width W1 of the insulating resin layer 20 in the X direction may be designed to be wider than the width W2 of the terminal electrodes 11(12) in the X direction, as shown in the schematic diagram in Figure 9. In this case, even if there is a shift in the formation position of the terminal electrodes 11(12) in the X direction, the terminal electrodes 11(12) and the base body 2 will not come into direct contact. Furthermore, if the width W2 is designed to be wider than the width W3 of the connection pattern 31(32) in the X direction, the connection pattern 31(32) will not be exposed even if there is a shift in the formation position of the terminal electrodes 11(12) in the X direction.

[0025] Figure 10 is a schematic perspective view showing the external appearance of an electronic component 200 according to a second embodiment of the present invention. Figure 11 is a schematic perspective view of the electronic component 200.

[0026] As shown in Figures 10 and 11, the electronic component 200 according to the second embodiment comprises a base body 2 and coils C1 and C2 embedded therein. In other words, it has a structure in which another coil C2 is added to the electronic component 100 according to the first embodiment. Since the other basic configurations are the same as those of the electronic component 100 according to the first embodiment, the same reference numerals are used for the same elements, and redundant explanations are omitted. The coils C1 and C2 are arranged in the X direction, and their axial directions are both in the Y direction.

[0027] The base body 2 has a mounting surface A that constitutes the XY plane. Terminal electrodes 11 to 14 are provided on mounting surface A, arranged in the X direction and with the Y direction as the longitudinal direction. Terminal electrode 11 is connected to one end of coil C1, and terminal electrode 12 is connected to the other end of coil C1. Terminal electrode 13 is connected to one end of coil C2, and terminal electrode 14 is connected to the other end of coil C2.

[0028] The mounting surface A of the base body 2 has regions A1 to A7. Region A1 is covered by terminal electrode 11, region A2 is covered by terminal electrode 12, region A4 is covered by terminal electrode 13, and region A5 is covered by terminal electrode 14. An insulating resin layer 20 with a lower dielectric constant than the base body 2 is interposed between terminal electrodes 11 to 14 and the base body 2. The insulating resin layer 20 is not provided in region A3 located between region A1 and region A2, region A6 located between region A4 and region A5, and region A7 located between region A2 and region A4. In other words, regions A3, A6, and A7 are not covered by the insulating resin layer 20, and the base body 2 is exposed. As a result, the stray capacitance between terminal electrodes 11 to 14 is reduced compared to the case where almost the entire mounting surface A is covered by the insulating resin layer 20.

[0029] Figure 12 is a substantially exploded perspective view illustrating the configuration of a circuit board equipped with electronic components 200 according to this embodiment.

[0030] The circuit board shown in Figure 12 comprises a substrate 40 and electronic components 200 mounted thereon. A mounting area 200A for the electronic components 200 is defined on the substrate 40, and the electronic components 200 are mounted on the substrate 40 such that the mounting surface A of the electronic components 200 faces the mounting area 200A. The surface of the substrate 40 is provided with a pair of differential signal lines 41 and 42 adjacent to each other in the X direction and extending in the Y direction, and power supply pads 43 and 44. The mounting area 200A overlaps with a portion of the differential signal lines 41 and 42 and the power supply pads 43 and 44. The differential signal lines 41 and 42 are transmission lines that transmit differential signals. In addition, the power supply pad 43 is supplied with, for example, the low-side power supply potential GND (ground potential) via a power supply line, and the power supply pad 44 is supplied with, for example, the high-side power supply potential Vcc via a power supply line.

[0031] When electronic components 200 are mounted on a substrate 40 having this configuration, terminal electrodes 12 and 13 are connected to differential signal lines 41 and 42, respectively, and terminal electrodes 11 and 14 are connected to power supply pads 43 and 44, respectively. As a result, as shown in the equivalent circuit diagram Figure 13, coil C1 is inserted between differential signal line 41 and the GND node of the power supply circuit 45, and coil C2 is inserted between differential signal line 42 and the Vcc node of the power supply circuit 45. Therefore, when differential signal lines 41 and 42 are used as power supply lines by superimposing a DC voltage, the differential signal components flowing through differential signal lines 41 and 42 do not flow into the power supply circuit 45.

[0032] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to the above embodiments, and various modifications are possible without departing from the spirit of the invention, and these modifications are also included within the scope of the present invention.

[0033] For example, in the above embodiment, a coil component in which a coil is embedded in a base body was described as an example, but the conductor pattern embedded in the base body is not limited to a coil, and may be other conductor patterns such as a capacitor. [Explanation of Symbols]

[0034] 2. Base body 4. Insulating resin layer 11~14 Terminal electrode 20 Insulating resin layer 31,32 Connection Patterns 40 circuit boards 41,42 Differential signal lines 43,44 Power pad 45 Power supply circuit 100,200 electronic components 200A mounting area A. Implementation side A1~A7 area C1, C2 coils C11~C16 Coil Pattern

Claims

1. A body having mounting surfaces that include first and second regions and extend in a first direction and a second direction perpendicular to the first direction, A conductor pattern, at least a portion of which is embedded in the substrate, with one end and the other end exposed in the first and second regions, A first insulating resin layer is provided between the conductor pattern and the substrate, The first and second terminal electrodes are provided so as to cover the first and second regions of the mounting surface, respectively, and are connected to one end and the other end of the conductor pattern, The device comprises a second insulating resin layer provided between the first and second terminal electrodes and the mounting surface, The first and second terminal electrodes are arranged in the first direction, and the second direction is the longitudinal direction. The first terminal electrode includes a portion that contacts one end of the conductor pattern on the first region of the mounting surface and a portion that covers the first region of the mounting surface via the second insulating resin layer. The second terminal electrode includes a portion that contacts the other end of the conductor pattern on the second region of the mounting surface and a portion that covers the second region of the mounting surface via the second insulating resin layer. The mounting surface further includes a third region sandwiched between the first region and the second region from the first direction, An electronic component characterized in that at least a portion of the third region is exposed without being covered by the second insulating resin layer.

2. The electronic component according to claim 1, characterized in that the width of the second insulating resin layer in the first direction is wider than the width of the first and second terminal electrodes in the first direction.

3. The electronic component according to claim 1, characterized in that the conductor pattern constitutes a first coil.

4. The second coil embedded in the aforementioned body, The device further comprises third and fourth terminal electrodes, which are provided so as to cover the fourth and fifth regions of the mounting surface, respectively, and which are connected to one end and the other end of the second coil, respectively. The second insulating resin layer is further provided between the third and fourth terminal electrodes and the mounting surface, The mounting surface has a sixth region located between the fourth region and the fifth region, The electronic component according to claim 3, characterized in that the sixth region is not covered by the second insulating resin layer and the base body is exposed.

5. The electronic component according to any one of claims 1 to 4, characterized in that the second insulating resin layer is made of a material having a lower dielectric constant than the first insulating resin layer.

6. A step of embedding at least a portion of the conductor pattern into a substrate via a first insulating resin layer on a mounting surface of the substrate that includes first and second regions and extends in a first direction and a second direction perpendicular to the first direction, such that one end and the other end of the conductor pattern are exposed in the first and second regions, respectively; The process involves covering the first and second regions of the mounting surface with a second insulating resin layer without covering at least a portion of the third region sandwiched between the first and second regions from the first direction, The process includes the step of forming first and second terminal electrodes on the second insulating resin layer, which are arranged in the first direction and whose longitudinal direction is the second direction, so as to be connected to one end and the other end of the conductor pattern, respectively. As a result, the method for manufacturing an electronic component is characterized in that the first terminal electrode includes a portion that contacts one end of the conductor pattern on the first region of the mounting surface and a portion that covers the first region of the mounting surface via the second insulating resin layer, and the second terminal electrode includes a portion that contacts the other end of the conductor pattern on the second region of the mounting surface and a portion that covers the second region of the mounting surface via the second insulating resin layer.

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